Detection device, exposure device, and article manufacturing method

Abstract

To accurately detect the position of a substrate.SOLUTION: A detection device for detecting the position of a substrate held on a substrate stage has an illumination part for illuminating the side face of the substrate with light, a detection part for detecting the light reflected on the side face of the substrate, and a processing part for determining the position of the side face of the substrate, on the basis of the detection result by the detection part, wherein the illumination part can switch to determine whether to perform switching to illuminate a first region on the side face of the substrate or to illuminate a second region which is a region on the side face of the substrate and is different from the first region.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a detection apparatus, an exposure apparatus, and a method for manufacturing an article. [Background technology]

[0002] In the manufacture of liquid crystal panels, organic EL displays, semiconductor devices, etc., exposure apparatuses are used that expose a pattern of an original onto a substrate coated with a photosensitive material. In industrial devices such as exposure apparatuses, a method for measuring the position of the side surface (edge ​​surface) of the substrate may be used to position the substrate on the stage.

[0003] An example of a device for measuring the position of the side surface of a substrate is an optical detection device that irradiates the side surface of the substrate with light and detects the reflected light. Optical detection devices are capable of detecting the position of the side surface of a substrate with high accuracy without contact, and are therefore advantageous for detecting the position of the side surface of a substrate such as a glass plate, which is prone to deformation due to thinning.

[0004] Patent Document 1 discloses a method in which light is irradiated from the side of a substrate, and the light reflected downward from the substrate side is detected by a light receiving sensor provided on a stage that holds the substrate. In Patent Document 1, the position of the substrate side (i.e., the position of the substrate) can be determined from the peak waveform of the light amount obtained by the light receiving sensor. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] JP 2017-116868 A Summary of the Invention [Problem to be solved by the invention]

[0006] However, if there is a scratch or foreign matter on the side surface of the substrate, the peak waveform obtained by the light receiving sensor changes, and there is a risk that the position of the side surface of the substrate cannot be detected with high accuracy.

[0007] SUMMARY OF THE PRESENT EMBODIMENTS An object of the present invention is to provide a detection device that is advantageous in detecting the position of a substrate with high accuracy. [Means for solving the problem]

[0008] In order to achieve the above-mentioned object, a detection device as one aspect of the present invention is a detection device that detects the position of a substrate held on a substrate stage, and includes an illumination unit that illuminates light onto a side of the substrate, a detection unit that detects light reflected from the side of the substrate, and a processing unit that determines the position of the side of the substrate based on the detection result by the detection unit, and is characterized in that the illumination unit is switchable between illuminating a first area on the side of the substrate and illuminating a second area on the side of the substrate that is different from the first area. Effect of the Invention

[0009] According to the present invention, it is possible to provide a detection device that is advantageous in detecting the position of a substrate with high accuracy. [Brief description of the drawings]

[0010] [Figure 1] FIG. 1 is a schematic diagram showing a configuration of a detection device in a first embodiment. [Diagram 2] FIG. 2 is a side view of the detection device according to the first embodiment. [Diagram 3] FIG. 11 is a diagram for explaining a problem in the first embodiment. [Figure 4] FIG. 4 is a diagram showing a light amount distribution obtained by a light receiving sensor. [Diagram 5] 13 is a flowchart for detecting the position of a side surface of a substrate. [Figure 6] FIG. 11 is a schematic diagram showing the configuration of a detection device according to a second embodiment. [Figure 7] FIG. 11 is a side view of a detection device according to a second embodiment. [Figure 8] FIG. 1 is a schematic diagram showing a configuration of an exposure apparatus. [Figure 9] 1 is a flowchart of a method for manufacturing an article. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings. In the drawings, the same reference numerals are used to refer to the same components, and duplicated explanations will be omitted.

[0012] First Embodiment 1 is a schematic diagram showing the configuration of a detection device 7 that measures the position of a substrate side surface (edge ​​surface) in this embodiment. The detection device 7 can have illumination units 3a and 3b, a detection unit 4, and a processing unit 5. The detection device 7 is a device that detects the position of the substrate side surface of a substrate 1 held by a substrate support member 2 (substrate stage). The substrate support member 2 has an adsorption mechanism such as a vacuum chuck or electrostatic chuck on its upper surface, and can adsorb and hold the substrate 1.

[0013] The illumination units 3a, 3b (multiple light sources) are arranged so as to irradiate light almost perpendicularly to the side surface (end surface) of the substrate 1. As shown in Fig. 1, the illumination units 3a, 3b are arranged laterally with respect to the side surface of the substrate 1. Furthermore, it is preferable that the light irradiated from each of the illumination units 3a, 3b onto the substrate side surface is arranged so that the irradiated light does not overlap with each other on the side surface of the substrate 1. In this embodiment, the illumination unit includes multiple light sources.

[0014] Here, laser light is generally 1 / e from the maximum intensity of the light beam. 2 Considering that the width of the laser light is defined as the width of the intensity that falls to 1 / e from the maximum intensity of the light beam, 2 The above range is defined as the effective range of the light beam. In other words, in this embodiment, it is preferable that the effective ranges of the light beams irradiated from the illumination units 3a and 3b onto the side surface of the substrate 1 are arranged such that the irradiated lights do not overlap each other on the side surface of the substrate 1.

[0015] The light source of the illumination unit 3a (3b) may be, for example, an LED or LD (laser diode) with a wavelength of about 500 to 1200 nm, or a semiconductor laser with high directivity. When an LED or LD is selected, an optical lens may be used to focus the light beam or an optical element that converts the light beam into parallel light may be used. In this embodiment, the description is given on the premise that there are two illumination units, but this is not limited thereto, and there may be three or more illumination units.

[0016] The detection unit 4 can have a light guiding unit 41 and a light receiving sensor 42. The detection unit 4 is disposed so as to receive light reflected downward from the side surface of the substrate 1.

[0017] FIG. 2 is a side view of the detection device 7 in this embodiment. In FIG. 2, the irradiated light 31a (first region) indicates the effective range of light irradiated on the side surface of the substrate 1 when the illuminating unit 3a irradiates the substrate side surface. The light flux L1 indicates the light flux of the irradiated light 31a reflected downward from the substrate side surface until it reaches the light receiving sensor 42. Similarly, the irradiated light 31b (second region) indicates the effective range of light irradiated on the side surface of the substrate 1 when the illuminating unit 3b irradiates the substrate side surface. The light flux L2 indicates the light flux of the irradiated light 31b reflected downward from the substrate side surface until it reaches the light receiving sensor 42. The first region and the second region can be designed not to overlap each other.

[0018] 2, the light guide section 41 serves to collect the light that has passed through the light beams L1 and L2 so that the light can be received by the same light receiving sensor 42. Examples of the light guide section 41 include a triangular prism and a cylindrical lens of any shape. The light receiving sensor 42 is a line sensor for detecting the light reflected from the side surface of the substrate 1, and detects the light receiving distribution of the reflected light and converts it into an electrical signal. Note that although a line sensor is used in this embodiment, it may be an area sensor such as a CMOS image sensor or a SPAD sensor.

[0019] The processing unit 5 controls the light irradiation of the illumination units 3a and 3b, and controls the light reception of the light receiving sensor 42. Furthermore, the processing unit 5 receives an electrical signal output by the light receiving sensor 42, and performs processing to determine the position of the substrate side surface (i.e., the position of the substrate 1) based on the peak position of the obtained waveform (detection result). The processing unit 5 can control the illumination units 3a and 3b so that only one of them is turned on. That is, the illumination units 3a and 3b in this embodiment can switch between illuminating a first region on the substrate side surface of the substrate 1, or illuminating a second region on the substrate side surface of the substrate 1 that is different from the first region.

[0020] Fig. 3 is a diagram showing that a foreign matter X is attached near the side surface of a substrate 1. Fig. 3(a) is a side view of a detection device 7, and Fig. 3(b) is a top view of the detection device 7. When a foreign matter X (or a scratch) is present in an area on the side surface of the substrate 1 that is hit by irradiation light 31a emitted by the illumination unit 3a, the peak waveform obtained changes compared to when the foreign matter X is not present.

[0021] Fig. 4 is a diagram showing the light amount distribution obtained by the light receiving sensor 42. Fig. 4(a) is the light amount distribution when there is reflected light from a foreign object X, and Fig. 4(b) is the light amount distribution when there is no reflected light from a foreign object X as a comparative example. When there is no foreign object X, only one peak waveform due to reflected light from the side surface of the substrate 1 as shown in Fig. 4(b) is obtained. On the other hand, when there is a foreign object X, there is reflected light from the side surface of the substrate 1 and reflected light from the foreign object X, so multiple peaks as shown in Fig. 4(a) are obtained.

[0022] In this embodiment, the illumination units 3a and 3b are not irradiated at the same time, but the illumination units 3a and 3b are individually switched to irradiate, so that the light beams L1 and L2 can be detected individually by the light receiving sensor 42. The waveform of the light beam L1 passing through the side surface of the substrate where the foreign matter X is present (FIG. 4(a)) is compared with the waveform of the light beam L2 passing through the end surface of the substrate where no foreign matter is attached (FIG. 4(b)). Therefore, the processing unit 5 can compare the waveform obtained by irradiating the illumination unit 3a (FIG. 4(a)) with the waveform obtained by irradiating the illumination unit 3b (FIG. 4(b)), and determine the reproducible peak position as the end surface position of the substrate 1. As a result, it is possible to detect the end surface position of the substrate without being affected by the foreign matter X.

[0023] If a foreign object is also attached to the illumination light 31b emitted by the illumination unit 3b, multiple peaks will also be present in the waveform of the light beam L2. However, it is extremely unlikely that foreign objects of exactly the same size will be attached at the same position in the vertical direction from the end face of the substrate. Therefore, there will be variation between the peak position due to the foreign object X in the waveform of the light beam L1 and the peak position due to the foreign object in the waveform of the light beam L2. Therefore, by comparing the two waveforms, it is possible to determine that the reproducible peak position is the position of the side face of the substrate.

[0024] 5 is an example of a flow chart for detecting the position of the side surface of the substrate. Each step can be controlled by the processing unit 5 or a control unit that controls higher levels. First, the illumination unit 3a irradiates light (S10) and obtains a waveform A from the light beam L1 (S11). At this time, the number of peaks in the waveform A is determined (S12).

[0025] If there is only one peak in waveform A, the substrate edge position is determined based on the peak position of waveform A (S13), and the measurement ends. If two or more peaks are detected in waveform A, waveform A is stored (S14), and the process proceeds to the next step. Note that peaks in waveform A that are significantly smaller than the largest peak may be ignored during processing. For example, a waveform having a peak that is half the maximum peak value may be ignored.

[0026] After S14, the illumination unit 3a is turned off, light from the illumination unit 3b is emitted (S15), and waveform B from the light beam L2 is acquired (S16) and stored (S17). The stored waveforms A and B are compared, and the peak position with the highest reproducibility is determined as the position of the side surface of the substrate (S18), and the measurement is terminated.

[0027] In S18, if waveform B has one peak, the position of the substrate side surface may be determined based only on waveform B without comparing waveform A with waveform B. The repeatability when comparing waveform A with waveform B is information based on unique feature values ​​when the reflected light from the substrate side surface is detected, such as the peak value, half-width of the peak, and peak shape of the waveform. Processing unit 5 identifies the peak waveform obtained by reflection from the substrate side surface based on information on the feature values ​​of the peak waveform of waveform A and information on the feature values ​​of the peak waveform of waveform B. Processing unit 5 then determines the position of the substrate side surface based on the identified peak waveforms.

[0028] In this embodiment, when it is believed that there is no foreign object X, it is possible to detect the position of the side surface of the board without reducing the takt time by only acquiring waveform A. Also, when it is believed that there is a foreign object X, it is possible to prevent a decrease in the position detection accuracy of the side surface of the board by acquiring waveform B, which is different from waveform A.

[0029] <Second embodiment> In the first embodiment, an example in which there are multiple illumination units has been described. In this embodiment, an example in which there is only one illumination unit capable of illuminating a relatively wide range will be described. Although the configuration of the detection device 7 is partially different, the basic structure and principle are the same as in the first embodiment, and therefore description thereof will be omitted. Furthermore, matters not mentioned in this embodiment follow the first embodiment.

[0030] Fig. 6 is a schematic diagram showing the configuration of a detection device 7 in this embodiment. In Fig. 6, the detection device 7 can have an illumination unit 3c, a detection unit 4, a processing unit 5, and a slit unit 6 (light-shielding unit). It differs from the first embodiment in that there is only one illumination unit and that the detection device 7 has the slit unit 6.

[0031] FIG. 7 is a side view of the detection device 7 in this embodiment. In FIG. 7, the illumination light 31c indicates the effective range of light irradiated on the side surface of the substrate 1 when the substrate side surface is irradiated by the illumination unit 3c. In this embodiment, the illumination unit 3c has a wider range of light beams compared to the first embodiment. The light beams L3 and L4 indicate the light beams that are irradiated when the illumination light 31c is reflected downward from the substrate side surface and passes through an opening provided in the slit unit 6. The illumination unit 3c is disposed so as to irradiate parallel light almost perpendicular to the side surface of the substrate 1.

[0032] The light beam L3 is light reflected from a first region, which is a side surface of the substrate 1, and the light beam L4 is light reflected from a second region, which is a side surface of the substrate 1 and is different from the first region. The first region and the second region can be designed not to overlap each other. The illumination unit 3c irradiates light onto the region of the side surface of the substrate 1, including the first region and the second region.

[0033] The slit section 6 is provided with two or more slits (openings) that can be controlled to open and close. The shape of the openings can be set to any shape, such as a rectangle or a circle. The opening and closing control of each slit is controlled by the processing section 5, and the waveform of the light beam L3 and the waveform of the light beam L4 can be obtained individually in the detection section 4. The slits may be opened and closed using, for example, an electromagnetic valve and an air cylinder, or an electric motor. In addition, multiple drive shafts may be provided so that each slit can be individually opened and closed. On the other hand, in the case of a structure in which when one slit is opened, the other slits are closed, one drive shaft may be provided. It is not necessary to provide multiple drive shafts. In this embodiment, the opening and closing of the slits can be controlled so that when one slit is opened, the other slit is closed.

[0034] Therefore, in the processing unit 5, the illumination unit 3c is irradiated, the slit of the slit unit 6 is controlled to open and close, and the waveform A passing through the light beam L3 is compared with the waveform B of the light beam L4, making it possible to determine the reproducible peak position as the side position of the substrate 1. As a result, it becomes possible to detect the position of the substrate side without being affected by the foreign matter X. The specific processing is the same as that of the first embodiment. This embodiment is advantageous over the first embodiment in that only one illumination unit is required, but the slit unit 6 is additionally required in the configuration of the first embodiment.

[0035] In addition, in Figures 6 and 7, the position of the slit portion 6 is illustrated as being between the substrate 1 and the light guiding portion 41, but this is not limited to this and may be, for example, between the light guiding portion 41 and the light receiving sensor 42 inside the detection portion 4.

[0036] <Modification> In the second embodiment, an example in which there is one illumination unit has been described, but a configuration in which a plurality of illumination units are provided and the slit unit 6 is also provided may be used. In this case, for example, when a plurality of illumination units are turned on simultaneously, the slit unit 6 allows light from only one of the illumination units to reach the light receiving sensor 42.

[0037] <Embodiments of Exposure Apparatus> In this embodiment, an example in which the above-described detection device 7 is mounted on an exposure apparatus will be described. An exposure apparatus is an apparatus used in a lithography process when manufacturing devices such as semiconductor devices and flat panel displays (FPDs), and forms a latent image pattern on a substrate by transferring a pattern of a mask (original) onto a substrate coated with resist. In this embodiment, a step-and-scan type exposure apparatus will be described, but the present invention is not limited to this, and other exposure methods such as a step-and-repeat type may also be used.

[0038] 8 is a schematic diagram showing the configuration of an exposure apparatus 20 in this embodiment. The exposure apparatus 20 has a light source 21, an illumination optical system 22, a mask stage 23, a projection optical system 24, a substrate stage 2, a main controller 25, and a detection apparatus 7. The illumination optical system 22 illuminates the mask M with light from the light source 21. The projection optical system 24 projects an image of a pattern formed on the mask M onto the substrate 1. Each part of the exposure apparatus 20 can be controlled by a main controller (not shown).

[0039] The mask stage 23 is a movable stage that holds a mask M. The substrate stage 2 is a movable stage that holds a substrate 1. The mask M and the substrate 1 are disposed at optically conjugate positions via a projection optical system 24.

[0040] The exposure apparatus 20 needs to align the substrate 1 to a desired position in order to perform the exposure process. The alignment can be performed by measuring an alignment mark formed on the substrate 1 with an alignment scope (not shown). Also, in order to place the alignment mark within the field of view of the alignment scope, the position of the side surface of the substrate 1 can be measured by the detection apparatus 7 to obtain the position of the substrate 1.

[0041] <Embodiments of the method for manufacturing an article> The method for manufacturing an article according to an embodiment of the present invention is suitable for manufacturing articles such as flat panel displays (FPDs), semiconductor devices, sensors, and optical elements. FIG. 9 is a flow chart of the method for manufacturing an article according to this embodiment. The method for manufacturing an article according to this embodiment includes a step of forming a latent image pattern by exposure using the exposure apparatus 20 on a photosensitive material applied on a substrate to obtain an exposed substrate (exposure step, step S1). The method also includes a step of developing the substrate exposed in this step to obtain a developed substrate (development step, step S2). Furthermore, the manufacturing method includes other well-known steps (oxidation, film formation, deposition, doping, planarization, etching, resist stripping, dicing, bonding, packaging, etc.) (processing step, step S3). The method for manufacturing an article according to this embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of the article compared to conventional methods.

[0042] Although the preferred embodiments of the present invention have been described above, it goes without saying that the present invention is not limited to these embodiments, and various modifications and changes are possible within the scope of the gist of the present invention. The scope of application of the present invention may be, for example, a detection device that detects the position of a substrate in a substrate processing device such as a semiconductor manufacturing device (film forming device, sputtering device, annealing device, inspection device, etc.), an organic electroluminescence deposition device, an imprint device, or a planarization device.

[0043] The disclosure of the present specification includes at least the following detection apparatus, exposure apparatus, and article manufacturing method.

[0044] (Item 1) A detection apparatus for detecting a position of a substrate held by a substrate stage, comprising: An illumination unit that illuminates a side surface of the substrate with light; A detection unit that detects light reflected by a side surface of the substrate; a processing unit that determines a position of a side surface of the substrate based on a detection result by the detection unit; having The illumination unit includes: Illuminating a first area on a side of the substrate; Illuminating a second area on a side surface of the substrate, the second area being different from the first area; A detection device capable of switching between the above.

[0045] (Item 2) The detection device described in item 1, characterized in that the illumination unit switches from illuminating the first area to illuminating the second area when there are multiple peak waveforms in the light intensity distribution obtained by the detection unit when the first area is illuminated.

[0046] (Item 3) The detection device described in item 2, characterized in that the illumination unit does not switch from illuminating the first area to illuminating the second area when the light intensity distribution obtained by the detection unit when the first area is illuminated has one peak waveform.

[0047] (Item 4) The processing unit determines the position of the side surface of the substrate based on a light amount distribution obtained by the detection unit when the first region is illuminated and a light amount distribution obtained by the detection unit when the second region is illuminated.

[0048] (Item 5) The processing unit identifies a peak waveform obtained by reflection at a side surface of the substrate based on information regarding a characteristic amount of a peak waveform of a light amount distribution obtained by the detection unit when the first region is illuminated and information regarding a characteristic amount of a peak waveform of a light amount distribution obtained by the detection unit when the second region is illuminated, and determines a position of the side surface of the substrate based on the identified peak waveform.

[0049] (Item 6) The detection device described in item 2, characterized in that when the light quantity distribution obtained by the detection unit when the second region is illuminated has one peak waveform, the processing unit determines the position of the side of the substrate based on the light quantity distribution obtained by the detection unit when the second region is illuminated.

[0050] (Item 7) 7. The detection device according to any one of items 1 to 6, wherein the first region and the second region are regions that do not overlap with each other.

[0051] (Item 8) The illumination unit includes a plurality of light sources. The processing unit controls the lighting of the plurality of light sources. 8. The detection device according to any one of items 1 to 7,

[0052] (Item 9) The illumination unit is disposed on a side surface of the substrate, The detection unit is disposed below a side surface of the substrate. 9. The detection device according to any one of items 1 to 8,

[0053] (Item 10) 10. The detection device according to any one of items 1 to 9, wherein the detection unit is a line sensor.

[0054] (Item 11) A detection apparatus for detecting a position of a substrate held by a substrate stage, comprising: An illumination unit that illuminates a side surface of the substrate with light; a light-shielding section provided with a plurality of openings that can be opened and closed, and arranged so that light reflected at a side surface of the substrate passes through each of the plurality of openings; a detection unit that detects light that has passed through an opening in the light blocking unit; a processing unit that determines a position of a side surface of the substrate based on a detection result by the detection unit; having The light blocking portion is Passing light reflected at a first region on a side surface of the substrate; a second region on a side surface of the substrate that is different from the first region and that transmits light reflected from the second region; A detection device capable of switching between the above.

[0055] (Item 12) An exposure apparatus that projects an image of a pattern formed on an original onto a substrate and exposes the substrate, comprising: a substrate stage for holding the substrate; A detection device according to any one of items 1 to 11, having The exposure apparatus, wherein the detection device detects the position of the substrate held by the substrate stage.

[0056] (Item 13) An exposure step of exposing a substrate using the exposure apparatus according to item 12 to obtain an exposed substrate; a developing step of developing the exposed substrate to obtain a developed substrate; Including, A method for manufacturing an article, comprising the steps of: manufacturing an article from the developed substrate. [Explanation of symbols]

[0057] 1 Board 2. Substrate stage 3a, 3b Lighting section 4. Detection section 5 Processing section 7. Detection Equipment 31a Irradiation light (first area) 31b Irradiation light (second area)

Claims

1. A detection apparatus for detecting a position of a substrate held by a substrate stage, comprising: An illumination unit that illuminates a side surface of the substrate with light; A detection unit that detects light reflected by a side surface of the substrate; a processing unit that determines a position of a side surface of the substrate based on a detection result by the detection unit; having The illumination unit includes: Illuminating a first area on a side of the substrate; Illuminating a second area on a side surface of the substrate, the second area being different from the first area; A detection device capable of switching between the above.

2. The detection device according to claim 1, characterized in that the illumination unit switches from illuminating the first area to illuminating the second area when there are multiple peak waveforms in the light quantity distribution obtained by the detection unit when the first area is illuminated.

3. The detection device according to claim 2, characterized in that the illumination unit does not switch from illuminating the first area to illuminating the second area when there is only one peak waveform of the light quantity distribution obtained by the detection unit when the first area is illuminated.

4. The detection device described in claim 2, characterized in that the processing unit determines the position of the side of the substrate based on a light amount distribution obtained by the detection unit when the first area is illuminated and a light amount distribution obtained by the detection unit when the second area is illuminated.

5. The detection device described in claim 4, characterized in that the processing unit identifies a peak waveform obtained by reflection at a side of the substrate based on information regarding characteristic amounts of a peak waveform of the light quantity distribution obtained by the detection unit when the first area is illuminated and information regarding characteristic amounts of the peak waveform of the light quantity distribution obtained by the detection unit when the second area is illuminated, and determines the position of the side of the substrate based on the identified peak waveform.

6. The detection device described in claim 2, characterized in that when there is one peak waveform of the light quantity distribution obtained by the detection unit when the second area is illuminated, the processing unit determines the position of the side of the substrate based on the light quantity distribution obtained by the detection unit when the second area is illuminated.

7. The detection device according to claim 1 , wherein the first region and the second region do not overlap each other.

8. The illumination unit includes a plurality of light sources. The processing unit controls the lighting of the plurality of light sources.

2. The detection device according to claim 1 .

9. The illumination unit is disposed on a side surface of the substrate, The detection unit is disposed below a side surface of the substrate.

2. The detection device according to claim 1 .

10. The detection device according to claim 1 , wherein the detection unit is a line sensor.

11. A detection apparatus for detecting a position of a substrate held by a substrate stage, comprising: An illumination unit that illuminates a side surface of the substrate with light; a light-shielding section provided with a plurality of openings that can be opened and closed, and arranged so that light reflected at a side surface of the substrate passes through each of the plurality of openings; a detection unit that detects light that has passed through an opening in the light blocking unit; a processing unit that determines a position of a side surface of the substrate based on a detection result by the detection unit; having The light blocking portion is Passing light reflected at a first region on a side surface of the substrate; a second region on a side surface of the substrate that is different from the first region and transmits light reflected from the second region; A detection device capable of switching between the above.

12. An exposure apparatus that projects an image of a pattern formed on an original onto a substrate and exposes the substrate, comprising: a substrate stage for holding the substrate; A detection device according to any one of claims 1 to 11, having The exposure apparatus, wherein the detection device detects the position of the substrate held by the substrate stage.

13. an exposure step of exposing a substrate using the exposure apparatus according to claim 12 to obtain an exposed substrate; a developing step of developing the exposed substrate to obtain a developed substrate; Including, A method for manufacturing an article, comprising the steps of: manufacturing an article from the developed substrate.

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