Resin composition, adhesive member, and display device including adhesive member

Abstract

To provide a resin composition which exhibits excellent coating property before curing, and has high adhesive force after curing.SOLUTION: A resin composition can contain a dihydroxy benzophenone-based ultraviolet absorber, a photoinitiator for absorbing light of a wavelength region of 400 nm or more and 450 nm or less, at least one monofunctional (meth)acrylate monomer, and at least one (meth)acrylate oligomer. The resin composition can have 180° peeling force to at least one of a glass substrate and a polymer substrate at a temperature of 25°C of 800 gf / 25 mm or more, after photocuring. Therefore, the resin composition can exhibit excellent coating property before curing, and has excellent adhesive force after curing.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present invention relates to a resin composition, an adhesive member made of the resin composition, and a display device including the adhesive member. [Background technology]

[0002] A variety of display devices have been developed for use in multimedia devices such as televisions, mobile phones, tablet computers, navigation systems, game consoles, etc. A display device includes various components constituting the display device, and an adhesive member is disposed between the components. The adhesive member may be formed from a resin composition, and the adhesive member included in the display device is required to have properties that stably bond the components of the display device and do not deteriorate the display quality. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Korean Patent Publication No. 2021-0116446 [Patent Document 2] Chinese Patent No. 113150614 [Patent Document 3] Chinese Patent No. 115215892 [Patent Document 4] Chinese Patent No. 115926685 Summary of the Invention [Problem to be solved by the invention]

[0004] An object of the present invention is to provide a resin composition that shows excellent coatability before curing and high adhesive strength after curing, an adhesive member made of the resin composition, and a display device including the adhesive member. [Means for solving the problem]

[0005] One embodiment provides a resin composition that includes a dihydroxybenzophenone-based ultraviolet absorber, a photoinitiator that absorbs light in the wavelength region of 400 nm or more and 450 nm or less, at least one monofunctional (meth)acrylate monomer, and at least one (meth)acrylate oligomer, and that, after photocuring, has a 180° peel strength of 800 gf / 25 mm or more from at least one of a glass substrate and a polymer substrate, as measured by JIS Z0237 at a temperature of 25°C.

[0006] After photocuring, the resin composition may have a transmittance of 0% or more and less than 5% for light in a first wavelength range including a wavelength of 400 nm, and after photocuring, a transmittance of 85% or more and 99% or less for light in a second wavelength range including a wavelength of 450 nm that is different from the first wavelength range.

[0007] The dihydroxybenzophenone-based ultraviolet absorber may include 2,2',4,4'-tetrahydroxybenzophenone.

[0008] The weight of the dihydroxybenzophenone-based UV absorber may be 2 wt % or more and 10 wt % or less, based on 100 wt % of the total weight of the resin composition.

[0009] The photoinitiator may include bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide.

[0010] The (meth)acrylate oligomer may have a weight average molecular weight of 5,000 or more and 40,000 or less.

[0011] The monofunctional (meth)acrylate monomer may include at least one of 4-hydroxybutyl acrylate (4-HBA), 2-ethylhexyl acrylate (2-EHA), tetrahydrofurfuryl acrylate (THF-A), and 2-ethylhexyl-diglycol acrylate (EHDG-AT).

[0012] The weight of the monofunctional (meth)acrylate monomer may be 75 wt % or more and 85 wt % or less, based on 100 wt % of the total weight of the resin composition.

[0013] The resin composition may be applied by an inkjet printing method or a dispensing method.

[0014] One embodiment provides an adhesive member that includes a polymer derived from a resin composition that includes a dihydroxybenzophenone-based ultraviolet absorber, a photoinitiator that absorbs light in the wavelength region of 400 nm or more and 450 nm or less, at least one monofunctional (meth)acrylate monomer, and at least one (meth)acrylate oligomer, and that has a 180° peel strength of 800 gf / 25 mm or more against at least one of a glass substrate and a polymer substrate, measured at a temperature of 25°C according to JIS Z0237 method.

[0015] The adhesive member may have a transmittance of 0% or more and less than 5% for light in a first wavelength range including a wavelength of 400 nm, and a transmittance of 85% or more and 99% or less for light in a second wavelength range including a wavelength of 450 nm that is different from the first wavelength range.

[0016] The dihydroxybenzophenone-based ultraviolet absorber may include 2,2',4,4'-tetrahydroxybenzophenone.

[0017] The weight of the dihydroxybenzophenone-based UV absorber may be 2 wt % or more and 10 wt % or less, based on 100 wt % of the total weight of the resin composition.

[0018] The photoinitiator may include bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide.

[0019] The (meth)acrylate oligomer may have a weight average molecular weight of 5,000 or more and 40,000 or less.

[0020] One embodiment provides a display device including a display panel, a window disposed on the display panel, and an adhesive member disposed between the display panel and the window, the adhesive member having a 180° peel strength of 800 gf / 25 mm or more against at least one of a glass substrate and a polymer substrate measured by JIS Z0237 at a temperature of 25°C, the adhesive member including a polymer derived from a resin composition including a dihydroxybenzophenone-based ultraviolet absorber, a photoinitiator that absorbs light in a wavelength range of 400 nm or more and 450 nm or less, at least one monofunctional (meth)acrylate monomer, and at least one (meth)acrylate oligomer.

[0021] The adhesive member may have a transmittance of 0% or more and less than 5% for light in a first wavelength range including a wavelength of 400 nm, and a transmittance of 85% or more and less than 99% for light in a second wavelength range including a wavelength of 450 nm.

[0022] The dihydroxybenzophenone-based ultraviolet absorber may include 2,2',4,4'-tetrahydroxybenzophenone.

[0023] The weight of the dihydroxybenzophenone-based UV absorber may be 2 wt % or more and 10 wt % or less, based on 100 wt % of the total weight of the resin composition.

[0024] The photoinitiator may include bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide.

[0025] The display device may not include a polarizer.

[0026] The display device may further include an input sensing unit disposed between the display panel and the window, and the adhesive member may be disposed between the display panel and the input sensing unit or between the input sensing unit and the window. Effect of the Invention

[0027] The resin composition of one embodiment contains a dihydroxybenzophenone-based ultraviolet absorber, a photoinitiator that absorbs light in the wavelength range of 400 nm or more and 450 nm or less, a monofunctional monomer, and an oligomer, and therefore exhibits excellent coatability before curing and higher adhesive strength after curing.

[0028] The adhesive member of the embodiment and the display device of the embodiment including the adhesive member can exhibit excellent reliability by including the polymer derived from the resin composition of the embodiment. [Brief description of the drawings]

[0029] [Figure 1] FIG. 1 is a perspective view showing a display device according to an embodiment of the present invention; [Diagram 2] FIG. 1 is an exploded perspective view showing a display device according to an embodiment of the present invention. [Diagram 3] 2 is a cross-sectional view showing a portion corresponding to line II' in FIG. [Figure 4] 1 is a cross-sectional view showing a part of a display device according to an embodiment of the present invention; [Figure 5A] 1A to 1C are diagrams illustrating a method for manufacturing an adhesive member according to an embodiment of the present invention. [Figure 5B] 1A to 1C are diagrams illustrating a method for manufacturing an adhesive member according to an embodiment of the present invention. [Figure 5C] 1A to 1C are diagrams illustrating a method for manufacturing an adhesive member according to an embodiment of the present invention. [Figure 5D] 1A to 1C are diagrams illustrating a method for manufacturing an adhesive member according to an embodiment of the present invention. [Figure 6A] 1A to 1C are diagrams illustrating a method for manufacturing an adhesive member according to an embodiment of the present invention. [Figure 6B] 1A to 1C are diagrams illustrating a method for manufacturing an adhesive member according to an embodiment of the present invention. [Figure 6C] 1A to 1C are diagrams illustrating a method for manufacturing an adhesive member according to an embodiment of the present invention. [Figure 7] FIG. 1 is a cross-sectional view showing a display device according to an embodiment of the present invention. [Figure 8] FIG. 1 is a cross-sectional view showing a display device according to an embodiment of the present invention. [Figure 9] 1 is a diagram showing a vehicle in which a display device according to an embodiment is disposed; DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0030] Since the present invention can be modified in various ways and can have various forms, specific embodiments are shown in the drawings and described in detail in the text, but it is not intended to limit the present invention to the specific disclosed forms, but it should be understood that the present invention includes all modifications, equivalents, and alternatives falling within the spirit and technical scope of the present invention.

[0031] As used herein, when a component (or region, layer, portion, etc.) is referred to as being "on" or "coupled" to another component, it means that it may be directly disposed, coupled, or connected to the other component, or that a third component may be disposed therebetween.

[0032] The same reference numerals refer to the same components. Also, in the drawings, thicknesses, ratios, and dimensions of the components are exaggerated for effective description of technical contents. "And / or" includes all combinations of one or more of the components defined by the associated components.

[0033] Terms such as "first" and "second" are used to describe various components, but the components are not limited to these terms. The terms are used only to distinguish one component from another. For example, the first component may be named the second component without departing from the scope of the present invention, and similarly, the second component may be named the first component. A singular surface includes a plural expression unless the context clearly indicates otherwise.

[0034] In addition, terms such as "under," "below," "on," and "above" are used to describe the relationship between components shown in the drawings. The terms are relative concepts and are described based on the directions shown in the drawings.

[0035] It should be understood that terms such as "comprise" or "have" specify the presence of any feature, number, step, operation, component, part, or combination thereof described hereinabove in the specification, but do not preclude the presence or additional possibility of one or more other features, number, steps, operations, components, parts, or combinations thereof.

[0036] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those skilled in the art to which the present invention belongs. Furthermore, terms defined in commonly used dictionaries should be interpreted as having the same meaning as they have in the context of the relevant art, and should not be interpreted in an overly ideal or formal sense unless expressly defined herein.

[0037] An adhesive member and a display device including the same according to an embodiment of the present invention will be described below with reference to the drawings. Fig. 1 is a perspective view showing the display device according to the embodiment. Fig. 2 is an exploded perspective view of the display device according to the embodiment.

[0038] The display device DD of the embodiment shown in FIG 1 may be a device that is driven (activated) by an electrical signal. For example, the display device DD may be a personal computer, a notebook computer, a personal digital assistant, a game console, a portable electronic device, a television, a monitor, an external billboard, a car navigation system, or a wearable device, but the embodiment is not limited thereto. FIG 1 exemplarily shows that the display device DD is a mobile phone.

[0039] The display device DD according to an embodiment may display an image IM through a display area DA. The display area DA may include a plane defined by a first direction axis DR1 and a second direction axis DR2. The display area DA may include, for example, a curved surface curved from at least one side of the plane defined by the first direction axis DR1 and the second direction axis DR2. The display device DD according to an embodiment shown in FIG. 1 is illustrated as including two curved surfaces curved from both sides of the plane defined by the first direction axis DR1 and the second direction axis DR2. However, the shape of the display area DA is not limited thereto. For example, the display area DA may include only the plane defined by the first direction axis DR1 and the second direction axis DR2, and the display area DA may further include four curved surfaces curved from at least two or more, for example, four sides of the plane defined by the first direction axis DR1 and the second direction axis DR2.

[0040] The display device DD of an embodiment may be flexible. "Flexible" means a bendable property, and may include all structures that can be bent in various bent states, from a completely folded structure to a structure that can be bent to a few nanometers. For example, the display device DD may be a foldable display device. The display device DD may also be rigid.

[0041] The non-display area NDA may be an area adjacent to the display area DA. The non-display area NDA may surround the display area DA. As a result, the shape of the display area DA may be substantially defined by the non-display area NDA. However, this is an exemplary illustration, and the non-display area NDA may be disposed adjacent to only one side of the display area DA or may be omitted. The display area DA may be provided in various shapes and is not limited to any one embodiment.

[0042] Although the first to third directional axes DR1 to DR3 are shown in FIG. 1 and the following drawings, the directions indicated by the first to third directional axes DR1, DR2, and DR3 described herein are relative concepts and may be converted into other variations. Also, the directions supported by the first to third directional axes DR1, DR2, and DR3 may be described as the first to third directions, and the same reference numerals may be used. In this specification, the first and second directional axes DR1 and DR2 may be perpendicular to each other, and the third directional axis DR3 may be a normal direction to a plane defined by the first and second directional axes DR1 and DR2.

[0043] The thickness direction of the display device DD may be aligned with a third directional axis DR3, which is a normal direction to a surface defined by the first directional axis DR1 and the second directional axis DR2. In this specification, the front surface (or top surface, upper surface, upper side) and the back surface (or bottom surface, lower surface, lower side) of the members constituting the display device DD may be defined based on the third directional axis DR3. Also, in this specification, the direction in which the third directional axis DR3 extends is aligned with the thickness direction, and the front surface (or top surface, upper surface, upper side) means a surface (or direction) adjacent to the surface on which the image IM is displayed, and the back surface (or bottom surface, lower surface, lower side) means a surface (or direction) separated (opposed) from the surface on which the image IM is displayed. In this specification, a plane means a surface aligned with a plane defined by the first directional axis DR1 and the second directional axis DR2, and a cross section means a surface perpendicular to the plane defined by the first directional axis DR1 and the second directional axis DR2 and aligned with the third directional axis DR3.

[0044] 2, the display device DD may include a display module DM, a window WP disposed on the display module DM, and an adhesive member AP disposed between the display module DM and the window WP. The display device DD may further include a housing HAU in which the display module DM is housed.

[0045] In the display device DD shown in FIG. 1 and FIG. 2, the window WP and the housing HAU may be combined to configure the appearance of the display device DD. The housing HAU may be disposed below the display module DM. The housing HAU may include a material having a relatively high rigidity. For example, the housing HAU may include a plurality of frames and / or plates made of glass, plastic, or metal. The housing HAU may provide a predetermined storage space. The display module DM may be stored in the storage space and protected from external impact. In addition, in order to give flexible characteristics such as bending to the display area DA, the display device DD, etc., the housing HAU may be formed of a material that is strong enough to protect the display module DM from external impact, but also flexible.

[0046] In one embodiment, the adhesive member AP may include a polymer derived from a resin composition RC (FIGS. 5A and 6A). The adhesive member AP may be formed by photo-curing the resin composition RC (FIGS. 5A and 6A). The display module DM and the window WP may be bonded together by the adhesive member AP. The adhesive member AP is made of the resin composition RC (FIGS. 5A and 6A) containing an ultraviolet absorber, and may prevent damage to the display module DM caused by external light (e.g., ultraviolet light). In addition, the adhesive member AP may exhibit excellent adhesive strength while preventing damage to the display module DM.

[0047] The window WP may include a transmissive area TA and a bezel area BZA. The transmissive area TA may overlap at least a part of the active area AA-DM of the display module DM. The transmissive area TA may be an optically transparent area. An image IM (FIG. 1) may be provided to a user through the transmissive area TA. The window WP may also be made of a flexible material. Thus, each member constituting the window WP may be made of a flexible material.

[0048] The bezel region BZA may be a region having a relatively low light transmittance compared to the transmissive region TA. The bezel region BZA may define the shape of the transmissive region TA. The bezel region BZA may be adjacent to the transmissive region TA and may surround the transmissive region TA.

[0049] The bezel area BZA may have a predetermined color. The bezel area BZA may cover the peripheral area NAA-DM of the display module DM and may block the peripheral area NAA-DM from being viewed from the outside. However, the embodiment is not limited thereto, and the bezel area BZA may be disposed adjacent to only one side of the transmissive area TA, or at least a portion of the bezel area BZA may be omitted.

[0050] Fig. 3 is a cross-sectional view showing the display module DM, the adhesive member AP, and the window WP of Fig. 2. Fig. 4 may be a cross-sectional view showing a display device DD according to an embodiment.

[0051] Referring to FIG. 3, the display module DM may include a display panel DP and an input sensing unit TP disposed on the display panel DP. The display module DM may be formed of a flexible material. Thus, each member constituting the display panel DP and each member constituting the input sensing unit TP may be formed of a flexible material. The display panel DP may be configured to substantially generate an image. The display panel DP may include a base substrate BS, a circuit layer DP-CL disposed on the base substrate BS, a display element layer DP-EL disposed on the circuit layer DP-CL, and a sealing layer TFE covering the display element layer DP-EL. An adhesive member AP may be disposed between the display panel DP and the window WP. In the example of FIG. 3, an adhesive member AP is disposed between the input sensing unit TP and the window WP.

[0052] 3 and the like are merely illustrative, and the configuration of the display panel DP is not limited thereto. For example, the display panel DP may include a liquid crystal display element, in which case the sealing layer TFE may be omitted.

[0053] The base substrate BS may provide a base surface on which the circuit layers DP-CL are disposed. The base substrate BS may be a flexible substrate capable of bending, folding, rolling, etc. The base substrate BS may be a glass substrate, a metal substrate, a polymer substrate, etc. However, the embodiment is not limited thereto, and the base substrate BS may include an inorganic layer, an organic layer, or a composite material layer.

[0054] The circuit layer DP-CL may include an insulating layer, a semiconductor pattern, a conductive pattern, a signal line, etc. For example, the circuit layer DP-CL may include a switching transistor and a driving transistor for driving a light-emitting element ED (FIG. 4) of the display element layer DP-EL described later.

[0055] The display element layer DP-EL may include a light-emitting element ED (FIG. 4) that emits light. For example, the light-emitting element ED (FIG. 4) may include an organic light-emitting material, an inorganic light-emitting material, an organic-inorganic light-emitting material, a quantum dot, a quantum rod, a micro-LED, or a nano-LED.

[0056] The encapsulation layer TFE may be disposed on the display element layer DP-EL. The encapsulation layer TFE may protect the display element layer DP-EL from foreign matter such as moisture, oxygen, and / or dust particles. The encapsulation layer TFE may include at least one inorganic layer. For example, the encapsulation layer TFE may include an inorganic layer, an organic layer, and an inorganic layer that are stacked in sequence.

[0057] The input sensing unit TP may be disposed on the display panel DP. For example, the input sensing unit TP may be disposed directly on the sealing layer TFE of the display panel DP. Alternatively, an adhesive layer may be disposed between the input sensing unit TP and the display panel DP.

[0058] In this specification, when one component is directly disposed / provided on another component, it means that there is no third component formed / provided between the one component and the other component, i.e., when one component is "directly disposed / provided" on another component, it means that the one component and the other component are "in contact."

[0059] The input sensing unit TP may sense an external input, change it into a predetermined input signal, and provide the input signal to the display panel DP. For example, in the display device DD of one embodiment, the input sensing unit TP may be a touch sensing unit that senses a touch. The input sensing unit TP may recognize a direct touch by a user, an indirect touch by a user, a direct touch by an object, or an indirect touch by an object. Examples of indirect touch include a touch in a non-contact state, a touch via another member, and the like.

[0060] The input sensing unit TP may sense at least one of a position of an externally applied touch and a strength (pressure) of the touch. In an embodiment, the input sensing unit TP may have various structures or be made of various materials and is not limited to any one embodiment. For example, the input sensing unit TP may sense an external input in a capacitive manner. The display panel DP may receive an input signal from the input sensing unit TP and generate an image corresponding to the input signal.

[0061] The window WP may include a base layer BL and a print layer BM. Although not shown, the window WP may further include at least one functional layer (not shown) provided on the base layer BL. For example, the functional layer (not shown) may be a hard coating layer, an anti-fingerprint coating layer, etc., but the embodiment is not limited thereto.

[0062] The base layer BL may be a glass substrate. Alternatively, the base layer BL may be a plastic substrate. For example, the base layer BL may be made of polyimide, polyacrylate, polymethylmethacrylate, polycarbonate, polyethylenenaphthalate, polyvinylidene chloride, polyvinylidene fluoride, polystyrene, ethylene-vinyl alcohol copolymer, or a combination thereof.

[0063] The print layer BM may be disposed on one surface of the base layer BL. The print layer BM may be provided on a lower surface of the base layer BL adjacent to the display module DM. The print layer BM may be disposed in an edge region of the base layer BL. The print layer BM may be an ink print layer. The print layer BM may also be a layer formed containing a pigment or dye. In the window WP, the bezel area BZA may be a portion where the print layer BM is provided.

[0064] The thickness T0 of the adhesive member AP may be 50 μm or more and 200 μm or less. For example, the adhesive member AP may have a thickness T0 of 50 μm or more and 100 μm or less. However, this is merely an example, and the thickness T0 of the adhesive member AP is not limited thereto.

[0065] In one embodiment, the adhesive member AP may have a 180° peel strength of 800 gf / 25 mm or more at a temperature of 25° C. against at least one of the glass substrate and the polymer substrate after photo-curing. In this specification, the 180° peel strength means a strength measured by JIS Z0237. The temperature of 25° C. may be room temperature. An adhesive member having a 180° peel strength of less than 800 gf / 25 mm against the glass substrate and the polymer substrate has low adhesive strength, and the adhesive member AP may be peeled off from the display module DM or the window WP. In contrast, the adhesive member AP of one embodiment having a 180° peel strength of 800 gf / 25 mm or more at a temperature of 25° C. against at least one of the glass substrate and the polymer substrate after photo-curing may exhibit excellent adhesive reliability. In addition, a display device DD including the adhesive member AP of one embodiment may exhibit excellent reliability.

[0066] In one embodiment, the adhesive member AP may have a transmittance of 0% or more and less than 5% for ultraviolet light after photocuring. The ultraviolet light is light having a wavelength in a first wavelength range, and in this embodiment, the first wavelength range means light having a wavelength in a range of 100 nm or more and 400 nm or less. Preferably, the first wavelength range is 200 nm or more and 400 nm or less. In other words, the adhesive member AP may have a transmittance of 0% or more and less than 5% for light having a wavelength of 400 nm after photocuring. More specifically, the wavelength of the ultraviolet light is preferably 400 nm, and in this case, the adhesive member AP may have a transmittance of 0% or more and less than 5% for light having a wavelength of 400 nm after photocuring. The adhesive member AP having a transmittance of 0% or more and less than 5% for light having a wavelength of 400 nm in this way can prevent deterioration of the light-emitting element ED (FIG. 4) due to external light (e.g., ultraviolet light). The light in the first wavelength range including the wavelength of 400 nm may correspond to ultraviolet light. Meanwhile, the adhesive member AP may have a transmittance of 85% or more and 99% or less for visible light after photocuring. The visible light is light having a wavelength in a second wavelength range different from the first wavelength range, and in this embodiment, the second wavelength range means light having a wavelength of more than 400 nm and not more than 800 nm. Preferably, the second wavelength range is 420 nm or more and 700 nm or less. In other words, the adhesive member AP may have a transmittance of 85% or more and 99% or less for light in the second wavelength range after photocuring. More specifically, the wavelength of visible light is preferably 450 nm, and in this case, the adhesive member AP may have a transmittance of 85% or more and 99% or less for light with a wavelength of 450 nm after photocuring. In this way, the adhesive member AP having a transmittance of 85% or more and 99% or less for light in the second wavelength range including the 450 nm wavelength does not inhibit the transmission of blue light, and may transmit light emitted from the light-emitting element ED (FIG. 4). The light in the second wavelength range including the 450 nm wavelength may correspond to visible light. Also, the light in the second wavelength range including the wavelength of more than 400 nm and not more than 800 nm may correspond to visible light.The adhesive member AP of one embodiment satisfies the above-mentioned transmittance ranges in the first wavelength range including a wavelength of 400 nm and the second wavelength range including a wavelength of 450 nm after photocuring, and thus can exhibit excellent transmittance for visible light emitted from the light-emitting element ED (FIG. 4) while preventing deterioration of the light-emitting element ED (FIG. 4). The adhesive member AP of one embodiment can exhibit excellent ultraviolet blocking rate and excellent visible light transmittance.

[0067] The display device DD of the embodiment may not include a polarizing plate. A display device including a polarizing plate exhibits reduced display quality with reduced brightness and an increased thickness. A display device not including a polarizing plate has a reduced lifespan due to degradation of light-emitting elements by external light. In contrast, the display device DD of the embodiment does not include a polarizing plate, so that the display quality is maintained and the display device can be provided with a thin thickness. In addition, the display device DD of the embodiment does not include a polarizing plate, but includes an adhesive member AP that satisfies the above-mentioned transmittance range in a first wavelength range including a wavelength of 400 nm and a second wavelength range including a wavelength of 450 nm, so that the display device DD can exhibit excellent display quality and display lifespan.

[0068] Fig. 4 is a cross-sectional view specifically showing the display module DM in Fig. 3. The configuration of the display module DM shown in Fig. 4 is merely illustrative, and the embodiment is not limited thereto.

[0069] In FIG. 4, the base substrate BS may include a single layer or multiple layers. For example, the base substrate BS may include a first synthetic resin layer, a multi-layer or single-layer inorganic layer, and a second synthetic resin layer disposed on the multi-layer or single-layer inorganic layer. Each of the first synthetic resin layer and the second synthetic resin layer may include a polyimide-based resin. Also, each of the first synthetic resin layer and the second synthetic resin layer may include at least one of an acrylic resin, a methacrylic resin, a polyisoprene-based resin, a vinyl-based resin, an epoxy-based resin, a urethane-based resin, a cellulose-based resin, a siloxane-based resin, a polyamide-based resin, and a perylene-based resin. In this specification, the term "XX-based" resin means one that includes a functional group of "XX".

[0070] The display panel DP may include a transistor TR and a light-emitting element ED. The transistor TR and the light-emitting element ED may be disposed on a base substrate BS. Although one transistor TR is shown in FIG. 4, the display panel DP may actually include a plurality of transistors and at least one capacitor for driving the light-emitting element ED.

[0071] The circuit layer DP-CL may be disposed on a base substrate BS. The circuit layer DP-CL may include a shielding electrode BML, a transistor TR, a connecting electrode CNE, and a plurality of insulating layers BFL and INS1 to INS6. The plurality of insulating layers BFL and INS1 to INS6 may include a buffer layer BFL and first to sixth insulating layers INS1 to INS6. However, the stacked structure of the circuit layer DP-CL shown in FIG. 4 is merely exemplary, and the stacked structure of the circuit layer DP-CL may be changed depending on the configuration of the display panel DP and the process of the circuit layer DP-CL, etc.

[0072] The shielding electrode BML may be disposed on the base substrate BS. The shielding electrode BML may be overlapped with the transistor TR. The shielding electrode BML may protect the transistor TR by blocking light incident on the transistor TR from the lower part of the display panel DP. The shielding electrode BML may include a conductive material. When a voltage is applied to the shielding electrode BML, a threshold voltage of the transistor TR disposed on the shielding electrode BML may be maintained. However, the embodiment is not limited thereto, and the shielding electrode BML may be a floating electrode. The shielding electrode BML may be omitted.

[0073] The buffer layer BFL may be disposed on the base substrate BS to cover the shielding electrode BML. The buffer layer BFL may include an inorganic layer. The buffer layer BFL may improve the bonding strength between the semiconductor pattern or conductive pattern disposed on the buffer layer BFL and the base substrate BS.

[0074] The transistor TR may include a source S1, a channel C1, a drain D1, and a gate G1. The source S1, the channel C1, and the drain D1 of the transistor TR may be formed of a semiconductor pattern. The semiconductor pattern of the transistor TR may include polysilicon, amorphous silicon, or metal oxide, but is not limited to any one of them as long as it has semiconductor properties.

[0075] The semiconductor pattern may include a plurality of regions that are divided according to the magnitude of conductivity. A region of the semiconductor pattern that is doped with a dopant or has a reduced metal oxide has high conductivity and may substantially serve as a source electrode and a drain electrode of the transistor TR. The region of the semiconductor pattern that is high in conductivity may correspond to the source S1 and drain D1 of the transistor TR. A region of the semiconductor pattern that is not doped or is doped at a low concentration or has a non-reduced metal oxide and has low conductivity may correspond to the channel C1 (or active) of the transistor TR.

[0076] A first insulating layer INS1 may be disposed on the buffer layer BFL while covering the semiconductor pattern of the transistor TR. A gate G1 of the transistor TR may be disposed on the first insulating layer INS1. In a plan view, the gate G1 may overlap the channel C1 of the transistor TR. The gate G1 may function as a mask in a process of doping the semiconductor pattern of the transistor TR.

[0077] A second insulating layer INS2 may be disposed on the first insulating layer INS1 while covering the gate G1. A third insulating layer INS3 may be disposed on the second insulating layer INS2.

[0078] The connecting electrode CNE may include a first connecting electrode CNE1 and a second connecting electrode CNE2 for electrically connecting the transistor TR and the light emitting element ED. However, the configuration of the connecting electrode CNE for electrically connecting the transistor TR and the light emitting element ED is not limited thereto, and one of the first and second connecting electrodes CNE1 and CNE2 may be omitted, or an additional connecting electrode may be further included.

[0079] The first connecting electrode CNE1 may be disposed on the third insulating layer INS3. The first connecting electrode CNE1 may be connected to the drain D1 via a first contact hole CH1 penetrating the first to third insulating layers INS1 to INS3. The fourth insulating layer INS4 may be disposed on the third insulating layer INS3 while covering the first connecting electrode CNE1. The fifth insulating layer INS5 may be disposed on the fourth insulating layer INS4.

[0080] The second connecting electrode CNE2 may be disposed on the fifth insulating layer INS5. The second connecting electrode CNE2 may be connected to the first connecting electrode CNE1 through a second contact hole CH2 penetrating the fourth and fifth insulating layers INS4 and INS5. The sixth insulating layer INS6 may be disposed on the fifth insulating layer INS5 while covering the second connecting electrode CNE2.

[0081] Each of the first to sixth functional layers INS1 to INS6 may include an inorganic layer or an organic layer. For example, the inorganic layer may include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon oxynitride, zirconium oxide, and hafnium oxide. The organic layer may include at least one of acrylic resin, methacrylic resin, polyisoprene resin, vinyl resin, epoxy resin, urethane resin, cellulose resin, siloxane resin, polyamide resin, and ferrylene resin.

[0082] The display element layer DP-EL may include a pixel defining layer PDL and a light emitting element ED. The light emitting element ED may include a first electrode AE, a hole control layer HCL, an emitting layer EML, an electronic control layer TCL, and a second electrode CE.

[0083] The first electrode AE ​​may be disposed on the sixth insulating layer INS6. The first electrode AE ​​may be connected to the second connecting electrode CNE2 through a third contact hole CH3 penetrating the sixth insulating layer INS6. The first electrode AE ​​may be electrically connected to the drain D1 of the transistor TR through the first and second connecting electrodes CNE1 and CNE2.

[0084] The first electrode AE ​​may be made of a metal material, a metal alloy, or a conductive compound. The first electrode AE ​​may be an anode or a cathode. However, the embodiment is not limited thereto. The first electrode AE ​​may be a pixel electrode. The first electrode AE ​​may be a transmissive electrode, a semi-transmissive electrode, or a reflective electrode. The first electrode AE ​​may include at least one selected from Ag, Mg, Cu, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, Li, Ca, LiF, Mo, Ti, W, In, Sn, and Zn, a compound of two or more selected from these, a mixture of two or more selected from these, or an oxide thereof.

[0085] If the first electrode AE ​​is a transmissive electrode, the first electrode AE ​​may include a transparent metal oxide, for example, ITO (indium tin oxide), IZO (indium zinc oxide), ZnO (zinc oxide), ITZO (indium tin zinc oxide), etc. If the first electrode AE ​​is a semi-transmissive electrode or a reflective electrode, the first electrode AE ​​may include Ag, Mg, Cu, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, Li, Ca, LiF / Ca (a laminated structure of LiF and Ca), LiF / Al (a laminated structure of LiF and Al), Mo, Ti, W, or a compound or mixture thereof (for example, a mixture of Ag and Mg). Alternatively, the first electrode AE ​​may have a multi-layer structure including a reflective film or semi-transmissive film made of the above material, and a transparent conductive film made of ITO, IZO, ZnO, ITZO, etc. For example, the first electrode AE ​​may have a three-layer structure of ITO / Ag / ITO, but is not limited thereto. Furthermore, the embodiment is not limited to this, and the first electrode AE ​​may include the above-mentioned metal materials, a combination of two or more metal materials selected from the above-mentioned metal materials, or an oxide of the above-mentioned metal materials.

[0086] The pixel definition layer PDL may be disposed on the sixth insulating layer INS6. A light emitting opening PX_OP exposing a portion of the first electrode AE ​​may be defined in the pixel definition layer PDL. The portion of the first electrode AE ​​exposed by the light emitting opening PX_OP may be defined as a light emitting area LA.

[0087] The active area AA-DM of the display module DM may include a light emitting area LA and a light blocking area NLA. The area where the pixel defining film PDL is disposed may correspond to the light blocking area NLA. The light blocking area NLA may surround the light emitting area LA within the active area AA-DM.

[0088] The hole control layer HCL may be disposed on the first electrode AE ​​and the pixel definition layer PDL. The hole control layer HCL may be provided as a common layer overlapping the light emitting area LA and the light blocking area NLA. The hole control layer HCL may include at least one of a hole transport layer, a hole injection layer, and an electron blocking layer. The hole control layer HCL may include a known hole injection material and / or a known hole transport material.

[0089] The light-emitting layer EML may be disposed on the hole control layer HCL. The light-emitting layer EML may be disposed in a region corresponding to the light-emitting opening PX_OP. Alternatively, the light-emitting layer EML may be provided as a common layer. The light-emitting layer EML may include an organic light-emitting material and / or an inorganic light-emitting material. The light-emitting layer EML may emit any one of red, green, and blue light. For example, the light-emitting layer EML may emit blue light.

[0090] The electronic control layer TCL may be disposed on the light emitting layer EML. The electronic control layer TCL may be provided as a common layer overlapping the light emitting region LA and the light blocking region NLA. The electronic control layer TCL may include at least one of an electron transport layer, an electron injection layer, and a hole blocking layer. The electronic control layer TCL may include a known electron injection material and / or a known electron transport material.

[0091] The second electrode CE may be disposed on the electronic control layer TCL. The second electrode CE may be provided as a common layer overlapping the light emitting area LA and the light blocking area NLA.

[0092] The second electrode CE may be a common electrode. The second electrode CE may be a cathode or an anode, but the embodiment is not limited thereto. For example, if the first electrode AE ​​is an anode, the second electrode may be a cathode, and if the first electrode AE ​​is a cathode, the second electrode CE may be an anode.

[0093] The second electrode CE may be a transmissive electrode, a semi-transmissive electrode, or a reflective electrode. If the second electrode CE is a transmissive electrode, the second electrode CE may be made of a transparent metal oxide, such as ITO, IZO, ZnO, ITZO, etc.

[0094] If the second electrode CE is a semi-transmissive electrode or a reflective electrode, the second electrode CE may include Ag, Mg, Cu, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, Li, Ca, LiF / Ca, LiF / Al, Mo, Ti, Yb, W, or a compound or mixture containing these (e.g., AgMg, AgYb, or MgYb). Alternatively, the second electrode CE may have a multi-layer structure including a reflective film or semi-transmissive film made of the above material, and a transparent conductive film made of ITO, IZO, ZnO, ITZO, or the like. For example, the second electrode CE may include the above-mentioned metal materials, a combination of two or more metal materials selected from the above-mentioned metal materials, or an oxide of the above-mentioned metal materials.

[0095] The encapsulation layer TFE may be disposed on the second electrode CE to cover the light-emitting element ED. The encapsulation layer TFE may include a plurality of thin films. For example, the encapsulation layer TFE may include an inorganic film disposed on the second electrode CE and an organic film disposed between the inorganic films. The inorganic film may protect the light-emitting element ED from moisture / oxygen, and the organic film may protect the light-emitting element ED from foreign matter such as dust particles.

[0096] The input sensing unit TP may include a first sensing insulating layer IL1, a second sensing insulating layer IL2, and a third sensing insulating layer IL3. The input sensing unit TP may include at least one conductive layer disposed on the sensing insulating layer. The input sensing unit TP may include a first conductive layer CDL1 and a second conductive layer CDL2.

[0097] The first sensing insulating layer IL1 may be disposed on the sealing layer TFE. The first sensing insulating layer IL1 may include at least one inorganic insulating layer. The first sensing insulating layer IL1 may contact the sealing layer TFE. Alternatively, the first sensing insulating layer IL1 may be omitted, in which case the first conductive layer CDL1 may contact the sealing layer TFE.

[0098] The first conductive layer CDL1 may be disposed on the first sense insulating layer IL1. The first conductive layer CDL1 may include a plurality of first conductive patterns. The plurality of first conductive patterns may be disposed on the first sense insulating layer IL1. The second sense insulating layer IL2 may be disposed on the first sense insulating layer IL1 to cover at least a portion of the first conductive layer CDL1.

[0099] The second conductive layer CDL2 may be disposed on the second sensing insulating layer IL2. The second conductive layer CDL2 may include a plurality of second conductive patterns. The plurality of second conductive patterns may be disposed on the second sensing insulating layer IL2. Each of the plurality of second conductive patterns may be connected to the plurality of first conductive patterns through a contact hole formed in the second sensing insulating layer IL2.

[0100] Each of the first conductive patterns of the first conductive layer CDL1 and the second conductive patterns of the second conductive layer CDL2 may be arranged corresponding to the light-shielding region NLA. Each of the first conductive patterns of the first conductive layer CDL1 and the second conductive patterns of the second conductive layer CDL2 may correspond to a mesh pattern.

[0101] The third sensing insulating layer IL3 may be disposed on the second sensing insulating layer IL2 and cover the second conductive layer CDL2. Each of the second sensing insulating layer IL2 and the third sensing insulating layer IL3 may include an inorganic insulating layer or an organic insulating layer.

[0102] Each of the first conductive layer CDL1 and the second conductive layer CDL2 may have a single-layer structure or a multi-layer structure stacked along the third direction axis DR3. The single-layer conductive layers CDL1 and CDL2 may include a metal layer or a transparent conductive layer. The metal layer may include molybdenum, silver, titanium, copper, aluminum, or an alloy thereof. The transparent conductive layer may include a transparent conductive oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium zinc tin oxide (IZTO), etc. The transparent conductive layer may also include a conductive polymer such as PEDOT, a metal nanowire, graphene, etc.

[0103] The multi-layered conductive layers CDL1 and CDL2 may include a metal layer. The metal layer may have a three-layer structure such as titanium (Ti) / aluminum (Al) / titanium (Ti). The multi-layered conductive layers CDL1 and CDL2 may include at least one metal layer and at least one transparent conductive layer.

[0104] 5A to 5D are diagrams illustrating a method for manufacturing an adhesive member AP from a resin composition RC according to an embodiment. For example, the method for manufacturing an adhesive member AP may include the steps of providing a resin composition RC on a substrate CF, providing a first light UV-1 to the resin composition RC to form a preliminary adhesive member P-AP, and providing a second light UV-2 to the preliminary adhesive member P-AP to form the adhesive member AP. In the following description of FIGS. 5A and 5D, the same contents as those described with reference to FIGS. 1 to 4 will not be described again, and differences will be mainly described.

[0105] Referring to FIG. 5A, in one embodiment, a resin composition RC may be provided on a substrate CF. The resin composition RC may be provided on the substrate CF through a nozzle NZ. For example, the substrate CF on which the resin composition RC is provided may include polyethylene terephthalate (PET). The substrate CF is a temporary substrate used to form an adhesive member AP (FIG. 3) from the resin composition RC, and may be any substrate that can be easily removed after the resin composition RC is cured. A release treatment may be applied to one side of the substrate CF on which the resin composition RC is provided.

[0106] In one embodiment, a resin composition RC including a dihydroxybenzophenone-based ultraviolet absorber, a photoinitiator absorbing light in a wavelength range of 400 nm to 450 nm, a monofunctional (meth)acrylate monomer, and a (meth)acrylate oligomer may be provided by an inkjet printing method or a dispensing method. The liquid resin composition RC may be provided in a uniform amount and / or at a uniform speed. Although FIG. 5A shows that the resin composition RC is provided through a nozzle NZ, the device for providing the resin composition RC is not limited thereto.

[0107] In one embodiment, the resin composition RC may include a dihydroxybenzophenone-based ultraviolet absorber, a photoinitiator that absorbs light in the wavelength range of 400 nm to 450 nm, at least one monofunctional (meth)acrylate monomer, and at least one (meth)acrylate oligomer. In this specification, the (meth)acryloyl group means an acryloyl group or a methacryloyl group, and the (meth)acrylic group means an acrylic or a methacrylic.

[0108] By including an ultraviolet absorber in the resin composition RC, the adhesive member AP (FIG. 3) formed by curing the resin composition RC can satisfy the above-mentioned transmittance (0% or more and less than 5%) for light in the first wavelength range including a wavelength of 400 nm. The dihydroxybenzophenone-based ultraviolet absorber can include a dihydroxybenzophenone functional group. The dihydroxybenzophenone-based ultraviolet absorber can include 2,2',4,4'-tetrahydroxybenzophenone (CAS: 131-55-5).

[0109] The weight of the dihydroxybenzophenone-based ultraviolet absorber may be 2 wt% or more and 10 wt% or less, based on 100 wt% of the total weight of the resin composition RC. An adhesive member made of a resin composition in which the weight of the dihydroxybenzophenone-based ultraviolet absorber is less than 2 wt% based on 100 wt% of the total weight of the resin composition does not satisfy the above-mentioned transmittance for the first wavelength range including the 400 nm wavelength. This may reduce the display quality and display life of the display device. Alternatively, a resin composition in which the weight of the dihydroxybenzophenone-based ultraviolet absorber exceeds 10 wt% based on 100 wt% of the total weight of the resin composition is not easily cured, so an adhesive member cannot be formed. The resin composition is cured by providing ultraviolet light to form an adhesive member. Therefore, if the weight of the UV absorber in the resin composition is too high (i.e., if it exceeds 10 wt%), the ratio of the curable monofunctional (meth)acrylate monomer and (meth)acrylate oligomer in the resin composition becomes small, and an adhesive member cannot be formed even if the UV light provided to cure the resin composition is absorbed. In contrast, in one embodiment, a resin composition RC containing 2 wt% to 10 wt% of a dihydroxybenzophenone UV absorber based on 100 wt% of the total weight of the resin composition RC may exhibit a property of being easily cured by providing UV light. In addition, in one embodiment, a resin composition RC containing 2 wt% to 10 wt% of a dihydroxybenzophenone UV absorber based on 100 wt% of the total weight of the resin composition RC may form an adhesive member AP that satisfies the above-mentioned transmittance for the first wavelength range including the 400 nm wavelength.

[0110] The resin composition RC may include a photoinitiator that absorbs light in a wavelength range of 400 nm to 450 nm. When light in a wavelength range of 400 nm to 450 nm is provided, the photoinitiator of the resin composition RC may be activated. If the resin composition RC includes a photoinitiator that absorbs light in a wavelength range of less than 400 nm, the resin composition RC is not easily cured, and is not cured sufficiently to form an adhesive member. In contrast, if the resin composition RC includes a photoinitiator that absorbs light in a wavelength range of more than 450 nm, the adhesive member formed by curing the resin composition RC may be colored. The resin composition RC of one embodiment includes a photoinitiator that absorbs light in a wavelength range of 400 nm to 450 nm, and may have excellent adhesive strength and optically transparent properties after curing. The adhesive member AP made of the resin composition RC including a photoinitiator that absorbs light in a wavelength range of 400 nm to 450 nm may have excellent adhesive strength and optically transparent properties. In the resin composition RC, the photoinitiator may include bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide (CAS: 162881-26-7).

[0111] The resin composition RC may contain multiple photoinitiators. When the resin composition RC contains multiple photoinitiators, the different photoinitiators may be activated by ultraviolet light with different central wavelengths.

[0112] For example, the photoinitiator may further include at least one of 2,2-dimethoxy-1,2-diphenylethan-1-one, 1-hydroxy-cyclohexyl-phenyl-ketone, 2-hydroxy-2-methyl-1-phenyl-1-propanone, 2-hydroxy-1-[4-(2-hydroxyethoxy)phenyl]-2-methyl-1-propanone, and 2-hydroxy-1-{4-[4-(2-hydroxy-2-methyl-propionyl)-benzyl]phenyl}-2-methylpropan-1-one.

[0113] Also, the photoinitiator may be 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone-1, 2-dimethylamino-2-(4-methyl-benzyl)-1-(4-morpholin-4-yl-phenyl)-butan-1-one, 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, ethyl(2,4,6-trimethylbenzoyl)phenyl phosphinate, phenylbis(2,4,6-trimethylbenzoyl)-phosphine oxide, [1-(4-phenylsulfanylbenzoyl)heptylideneamino]benzoate, [1-[9-ethyl-6-(2-methylbenzoyl)carbazol-3-yl]ethylideneamino]acetate, bis(2,4-cyclopentadienyl)bis[2,6-difluoro-3-(1-pyrryl)phenyl]titanium(IV).

[0114] The resin composition RC may include at least one monofunctional (meth)acrylate monomer. In the resin composition RC, the monofunctional (meth)acrylate monomer may include at least one of 4-hydroxybutyl acrylate (4-HBA), 2-ethylhexyl acrylate (2-EHA), tetrahydrofurfuryl acrylate (THF-A), and 2-ethylhexyl-diglycol acrylate (EHDG-AT). However, this is merely an example, and the resin composition RC may further include a monofunctional (meth)acrylate monomer other than the listed monomers.

[0115] The weight of the monofunctional (meth)acrylate monomer may be 75 wt% or more and 85 wt% or less, based on 100 wt% of the total weight of the resin composition RC. The resin composition RC containing 75 wt% or more and 85 wt% or less of the monofunctional (meth)acrylate monomer, based on 100 wt% of the total weight of the resin composition RC, may exhibit properties suitable for application by an inkjet printing method or a dispensing method. In addition, the adhesive member AP made of the resin composition RC containing 75 wt% or more and 85 wt% or less of the monofunctional (meth)acrylate monomer, based on 100 wt% of the total weight of the resin composition RC, may exhibit excellent adhesive strength.

[0116] For example, the resin composition RC may contain a monofunctional (meth)acrylate monomer having a weight average molecular weight of 100 or more and 500 or less. However, this is merely an example, and the molecular weight of the monofunctional (meth)acrylate monomer contained in the resin composition RC is not limited to this.

[0117] The resin composition RC may include at least one (meth)acrylate oligomer. The weight average molecular weight of the (meth)acrylate oligomer may be 5,000 or more and 40,000 or less. The (meth)acrylate oligomer having a weight average molecular weight of 5,000 or more and 40,000 or less is an oligomer having a relatively high degree of polymerization, and when included in the resin composition RC, it maintains a high degree of polymerization even after photocuring, thereby forming an adhesive member AP having excellent adhesive strength.

[0118] For example, based on the total weight of the resin composition RC being 100 wt%, the weight of the (meth)acrylate oligomer may be 10 wt% or more and 20 wt% or less, but this is merely an example and the weight of the (meth)acrylate oligomer is not limited thereto.

[0119] For example, in the resin composition RC, the (meth)acrylate oligomer may include a urethane (meth)acrylate oligomer. In the resin composition RC, the (meth)acrylate oligomer may include at least one of UF-C051 (urethane acrylate, manufactured by Kyoeisha Chemical Co., Ltd.), UF-C052 (urethane acrylate, manufactured by Kyoeisha Chemical Co., Ltd.), and UN6304 (urethane acrylate, manufactured by Negami Chemical Industrial Co., Ltd.). However, this is merely an example, and the (meth)acrylate oligomer contained in the resin composition RC is not limited thereto.

[0120] Referring to FIG. 5B, a first light UV-1 may be provided to the resin composition RC applied to a uniform thickness on the substrate CF. The liquid resin composition RC may be cured by the first light UV-1 to form a preliminary adhesive member P-AP (FIG. 5C). The first light UV-1 may be ultraviolet light. FIG. 5B shows that the resin composition RC applied to the substrate CF is directly irradiated with the first light UV-1 to form the preliminary adhesive member P-AP, but the embodiment is not limited thereto. A carrier film (not shown) may be disposed on the resin composition RC applied to a uniform thickness, and the carrier film (not shown) may be transparent to ultraviolet light.

[0121] 5C and 5D, the preliminary adhesive member P-AP formed by irradiating the resin composition RC with the first light UV-1 (FIG. 5B) may be detached from the substrate CF and provided on one side of the window WP or one side of the display module DM. One side of the preliminary adhesive member P-AP may be laminated on one side of the window WP or one side of the display module DM, and the unattached one side of the window WP or one side of the display module DM may be attached to the remaining side of the preliminary adhesive member P-AP. Next, the preliminary adhesive member P-AP may be irradiated with the second light UV-2 to form the adhesive member AP (FIG. 3). The second light UV-2 may be ultraviolet light. The second light UV-2 may be provided from the top of the window WP, and the window WP may transmit the second light UV-2. The second light UV-2 may be provided to the preliminary adhesive member P-AP by transmitting through the window WP.

[0122] The resin composition RC of one embodiment may have a 180° peel strength of 800 gf / 25 mm or more against at least one of a glass substrate and a polymer substrate at a temperature of 25° C. after being cured by UV-1 or UV-2 light. Thus, the resin composition RC of one embodiment may exhibit excellent adhesive strength after curing.

[0123] In one embodiment, the resin composition RC may have a transmittance of 0% to less than 5% for light in a first wavelength range including a wavelength of 400 nm and a transmittance of 85% to 99% for light in a second wavelength range including a wavelength of 450 nm after curing with light UV-1 and UV-2. As a result, the resin composition RC may exhibit an excellent ultraviolet blocking rate and an excellent visible light transmittance after curing.

[0124] 5A to 5D, the adhesive member AP (FIG. 3) is formed by curing the resin composition RC twice (i.e., by applying light twice), but the embodiment is not limited thereto. For example, the adhesive member AP (FIG. 3) may be formed by curing the resin composition RC once, or may be formed by curing the resin composition RC three or more times.

[0125] 6A to 6C are schematic diagrams illustrating another method for manufacturing an adhesive member AP from a resin composition RC according to an embodiment. In the following description of Fig. 6A and Fig. 6C, the same contents as those described with reference to Figs. 1 to 5D will not be described again, and differences will be mainly described.

[0126] The method for manufacturing the adhesive member AP shown in Figures 6A to 6C may include the steps of providing a resin composition RC on the display module DM, providing a first light UV-1 to the resin composition RC to form a preliminary adhesive member P-AP, and providing a second light UV-2 to the preliminary adhesive member P-AP to form an adhesive member AP. The manufacturing method shown in Figures 6A to 6C is different from the manufacturing method shown in Figures 5A to 5D in that the resin composition RC is provided on the display module DM.

[0127] The resin composition RC may be provided directly on one side of the display module DM or on one side of the window WP. In Fig. 6A, the resin composition RC is shown provided directly on one side of the display module DM.

[0128] Referring to Fig. 6B, a first light UV-1 may be applied to the evenly applied resin composition RC. By applying the first light UV-1 to the resin composition RC, a preliminary adhesive member P-AP may be formed. A window WP may be provided on the preliminary adhesive member P-AP. Referring to Fig. 6C, a second light UV-2 may be transmitted through the window WP and applied to the preliminary adhesive member P-AP. The preliminary adhesive member P-AP may be cured by the second light UV-2 to form the adhesive member AP (Fig. 3).

[0129] 7 is a cross-sectional view showing a display device according to an embodiment of the present invention. In the following description of the display device shown in FIG. 7, the same contents as those described with reference to FIGS. 1 to 6C will not be described again, and differences will be mainly described.

[0130] Compared with the display device DD described with reference to Figures 2 and 3, the display device DD-a shown in Figure 7 may further include a light control layer PP and an optical adhesive layer AP-a. The display device DD-a of one embodiment may further include a light control layer PP arranged between the adhesive member AP and the window WP, and an optical adhesive layer AP-a arranged between the light control layer PP and the window WP. The light control layer PP may not include a polarizing plate. The light control layer PP may include a color filter layer.

[0131] The optical adhesive layer AP-a may be made of a resin composition RC according to an embodiment. The optical adhesive layer AP-a including the polymer derived from the resin composition RC may have a 180° peel strength of 1000 gf / 25 mm or more with respect to at least one of a glass substrate and a polymer substrate at a temperature of 25° C. The optical adhesive layer AP-a including the polymer derived from the resin composition RC may have a transmittance of 0% or more and less than 5% for light in a first wavelength range including a wavelength of 400 nm, and a transmittance of 85% or more and 99% or less for light in a second wavelength range including a wavelength of 450 nm. Thus, the optical adhesive layer AP-a including the polymer derived from the resin composition RC may exhibit excellent adhesive strength, excellent ultraviolet blocking rate, and excellent visible light transmittance. The display device DD-a including the optical adhesive layer AP-a may exhibit excellent reliability, excellent display life, and excellent display quality.

[0132] 8 is a cross-sectional view showing a display device according to an embodiment of the present invention. In the following description of the display device according to the embodiment shown in FIG. 8, the same contents as those described with reference to FIGS. 1 to 7 will not be described again, and differences will be mainly described.

[0133] 2 and 3, the display device DD-b of an embodiment shown in Fig. 8 may further include a light control layer PP, an optical adhesive layer AP-a, and an interlayer adhesive layer PIB. The display device DD-b of an embodiment shown in Fig. 8 may further include a light control layer PP arranged between the adhesive member AP and the window WP, and an optical adhesive layer AP-a arranged between the light control layer PP and the window WP, like the display device DD-a of an embodiment shown in Fig. 7.

[0134] In the display device DD-b according to an embodiment, an adhesive member AP may be provided between the display panel DP and the input sensing unit TP. That is, the input sensing unit TP may be bonded to the display panel DP by the adhesive member AP without the input sensing unit TP being disposed directly on the display panel DP. For example, the adhesive member AP may be disposed between the sealing layer TFE (FIG. 3) of the display panel DP and the input sensing unit TP.

[0135] An interlayer adhesive layer PIB may be provided under the light control layer PP. The interlayer adhesive layer PIB may be disposed between the input sensing portion TP and the light control layer PP, and may be made of an adhesive material having excellent moisture permeability. For example, the interlayer adhesive layer PIB may be formed containing polyisobutylene. The interlayer adhesive layer PIB may be disposed on the input sensing portion TP, and may prevent corrosion of the sensing electrode of the input sensing portion TP. The display device DD-b of an embodiment includes an optical adhesive layer AP-a and an adhesive member AP made of a resin composition RC according to an embodiment, and the display device DD-b including the optical adhesive layer AP-a and the adhesive member AP may exhibit excellent reliability.

[0136] 9 is a diagram showing a vehicle AM ​​on which the first to fourth display devices DD-1, DD-2, DD-3, and DD-4 are arranged. At least one of the first to fourth display devices DD-1, DD-2, DD-3, and DD-4 may include the same configuration as any one of the display devices DD, DD-a, and DD-b of the embodiment described with reference to FIGS. 1 to 3, 7, and 8. At least one of the first to fourth display devices DD-1, DD-2, DD-3, and DD-4 may include the adhesive member AP of the embodiment described with reference to FIGS. 1 to 3, 7, and 8.

[0137] 9 shows a car as the vehicle AM, this is merely an example, and the first to fourth display devices DD-1, DD-2, DD-3, and DD-4 may be disposed on other means of transportation such as bicycles, motorcycles, trains, ships, airplanes, etc. Also, at least one of the first to fourth display devices DD-1, DD-2, DD-3, and DD-4, which also includes the configuration of any one of the display devices DD, DD-a, and DD-b of the embodiment, may be adopted in other electronic devices without departing from the concept of the present invention.

[0138] At least one of the first to fourth display devices DD-1, DD-2, DD-3, and DD-4 may include an adhesive member AP according to an embodiment. The adhesive member AP according to an embodiment is made of the resin composition RC according to an embodiment and may exhibit excellent adhesive strength, excellent ultraviolet blocking rate, and excellent visible light transmittance.

[0139] The adhesive member AP may have a 180° peel strength of 800 gf / 25 mm or more with respect to at least one of the glass substrate and the polymer substrate at a temperature of 25° C. The adhesive member AP may have a transmittance of 0% to less than 5% for light in a first wavelength range including a wavelength of 400 nm, and a transmittance of 85% to 99% for light in a second wavelength range including a wavelength of 450 nm. As a result, a display device including the adhesive member AP according to one embodiment among the first to fourth display devices DD-1, DD-2, DD-3, and DD-4 may exhibit excellent reliability, excellent display life, and excellent display quality.

[0140] Referring to FIG. 9, the vehicle AM ​​includes a handle HA and a gear GR for operating the vehicle AM, and a front window GL may be positioned to face the driver.

[0141] The first display device DD-1 may be disposed in a first area overlapping the steering wheel HA. For example, the first display device DD-1 may be a digital cluster displaying first information of the vehicle AM. The first information may include a first scale indicating the traveling speed of the vehicle AM, a second scale indicating the engine revolutions (i.e., RPM (revolutions per minute)), and an image indicating the fuel status. The first scale and the second scale may be displayed as digital images.

[0142] The second display device DD-2 may be disposed in a second region facing the driver's seat and overlapping with the front window GL. The driver's seat may be a seat where the steering wheel HA is disposed. For example, the second display device DD-2 may be a Head Up Display (HUD) that displays second information of the vehicle AM. The second display device DD-2 may be optically transparent. The second information may include digital numbers indicating the traveling speed of the vehicle AM, and may further include information such as the current time. Unlike the illustration, the second information of the second display device DD-2 may be projected and displayed on the front window GL.

[0143] The third display device DD-3 may be disposed in a third area adjacent to the gear GR. For example, the third display device DD-3 may be a Center Information Display (CID) disposed between the driver's seat and the passenger seat and displaying the third information. The passenger seat may be a seat separated from the driver's seat with the gear GR in between. The third information may include information regarding road conditions (e.g., navigation information), music or radio playback, dynamic video (or image) playback, temperature inside the vehicle AM, etc.

[0144] The fourth display device DD-4 may be spaced apart from the handle HA and the gear GR and disposed in a fourth region adjacent to the side of the vehicle AM. For example, the fourth display device DD-4 may be a digital side mirror that displays the fourth information. The fourth display device DD-4 may display an image of the outside of the vehicle AM ​​captured by a camera module CM disposed on the outside of the vehicle AM. The fourth information may include an image of the outside of the vehicle AM.

[0145] The above-mentioned first to fourth information are merely exemplary, and the first to fourth display devices DD-1, DD-2, DD-3, and DD-4 may further display information related to the interior and exterior of the vehicle. The first to fourth information may include different information from each other. However, the embodiment is not limited thereto, and some of the first to fourth information may include the same information.

[0146] Hereinafter, a resin composition according to an embodiment of the present invention and an adhesive member made of the resin composition will be described in detail with reference to examples and comparative examples. Note that the following examples are merely illustrative examples for aiding understanding of the present invention, and the scope of the present invention is not limited thereto.

[0147] [Example] 1. Production of resin composition The resin compositions of the examples and comparative examples were prepared with the materials listed in Table 1. The materials listed in Table 1 were provided in the respective amounts (g, gram) in a light-shielding poly container. The materials were then stirred at room temperature so as to be uniformly mixed, and the compositions of the examples and comparative examples were prepared. In Table 1, the resin compositions of Comparative Examples 6 and 7 correspond to adhesive compositions No. 1 and No. 2 in Table 1 in patent document KR 10-2021-0116446. Tinuvin 477 is a mixture, 80% of which is an ultraviolet absorber (structure undisclosed) containing hydroxyphenyl-triazine, and 20% of which is CAS 108-65-5, a solvent component.

[0148] [Table 1] JPEG2025086342000003.jpg133170

[0149] <Information on materials in Table 1> Uvinul 3050: 2,2',4,4'-Tetrahydroxybenzophenone Uvinul 3039: (2-Ethylhexyl)-2-cyano-3,3-diphenylacrylate Tinuvin 970: 2-(2H-benzotriazol-2-yl)-6-dodecyl-4-methylphenol) Omnirad 819: Bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide (IGM Resin) 4-HBA: 4-Hydroxybutyl acrylate (Osaka Organic Chemical Industry Ltd. product) 2-EHA: 2-Ethylhexyl acrylate (product of Toagosei Co., Ltd.) THF-A: Tetrahydrofurfuryl acrylate (Kyoeisha Chemical Co., Ltd. product) EHDG-AT: 2-Ethylhexyl-diglycol acrylate (Kyoeisha Chemical Co., Ltd. product) UF-C051: Urethane acrylate (weight average molecular weight 35000, manufactured by Kyoeisha Chemical Co., Ltd.) UF-C052: Urethane acrylate (weight average molecular weight 10,000, manufactured by Kyoeisha Chemical Co., Ltd.) UN6304: Urethane acrylate (weight average molecular weight 10,000, manufactured by Negami Chemical Industrial Co., Ltd.) Acrylic polymer: Acrylic polymer A1 (weight average molecular weight 1,200,000) of patent document KR 10-2021-0116446 Takenate D110N: 75% ethyl acetate solution of xylylene diisocyanate trimethylolpropane adduct (Mitsui Chemicals) APG7000: Polypropylene glycol #700 (n=12) diacrylate (functional group equivalent: 404 g / eq) MHI black#273: Carbon black pigment dispersant (manufactured by Mikuni Shikiso Co., solids content 17.6%)

[0150] Referring to Table 1, it can be seen that the photoinitiator was provided in the same substance and the same weight in the resin compositions of Examples 1 and 2 and Comparative Examples 1 to 5. In the resin compositions of Comparative Examples 6 and 7, the substance of the photoinitiator was the same as in Examples 1 and 2 and Comparative Examples 1 to 5, but the weights were different. It can be seen that the monofunctional (meth)acrylate monomers were provided in the same amounts and weights in the resin compositions of Examples 1 and 2 and Comparative Examples 1-5. No monofunctional (meth)acrylate monomers were provided in the resin compositions of Comparative Examples 6 and 7. It can be seen that the monofunctional (meth)acrylate monomers include 4-hydroxybutyl acrylate (4-HBA), 2-ethylhexyl acrylate (2-EHA), tetrahydrofurfuryl acrylate (THF-A), and 2-ethylhexyl-diglycol acrylate (EHDG-AT).

[0151] In the resin composition of Example 1, 85 g out of the total weight of 104 g of the resin composition corresponds to the monofunctional (meth)acrylate monomer, and when the total weight is converted to 100 wt%, the weight of the monofunctional (meth)acrylate monomer corresponds to about 81.7 wt%. In the resin composition of Example 2, 85 g out of the total weight of 108 g of the resin composition corresponds to the monofunctional (meth)acrylate monomer, and when the total weight is converted to 100 wt%, the weight of the monofunctional (meth)acrylate monomer corresponds to about 78.7 wt%. Therefore, it can be seen that the resin compositions of Examples 1 and 2 satisfy the weight range of the monofunctional (meth)acrylate monomer according to one embodiment (i.e., 75 wt% to 85 wt%) based on the total weight of the resin composition of 100 wt%.

[0152] Referring to Table 1, it can be seen that the (meth)acrylate oligomer was provided in the same substance and weight in the resin compositions of Examples 1 and 2 and Comparative Examples 1-5. In the resin compositions of Examples 1 and 2 and Comparative Examples 1-5, UF-C051, UF-C052, and UN6304 were provided as the (meth)acrylate oligomer. It can be seen that the resin compositions of Examples 1 and 2 and Comparative Examples 1-5 provided a (meth)acrylate oligomer having a weight average molecular weight of 5000 or more and 40000 or less. Meanwhile, in the resin compositions of Comparative Examples 6 and 7, unlike Examples 1 and 2 and Comparative Examples 1-5, an acrylic polymer was provided as the (meth)acrylate oligomer.

[0153] Referring to Table 1, it can be seen that the UV absorber was provided in different weights and / or different materials in the resin compositions of Examples 1 and 2 and Comparative Examples 1 to 5. The resin compositions of Comparative Examples 1 to 7 did not contain a dihydroxybenzophenone-based UV absorber.

[0154] It can be seen that the resin compositions of Examples 1 and 2 were prepared by providing a dihydroxybenzophenone-based UV absorber. In the resin composition of Example 1, 4 g of the total weight of the resin composition is 104 g, and the weight of the UV absorber is about 3.8 wt% when the total weight is converted to 100 wt%. In the resin composition of Example 2, 8 g of the total weight of the resin composition is 108 g, and the weight of the UV absorber is about 7.4 wt% when the total weight is converted to 100 wt%. Therefore, it can be seen that the resin compositions of Examples 1 and 2 satisfy the weight range (i.e., 2 wt% to 10 wt%) of the dihydroxybenzophenone-based UV absorber according to one embodiment based on the total weight of the resin composition being 100 wt%.

[0155] 2. Evaluation of adhesive materials The following Table 2 shows the transmittance and 180° peel strength of adhesive members made of the resin compositions of the Examples and Comparative Examples. The evaluation method is described in more detail below.

[0156] <Transmittance of adhesive material> The prepared resin composition was placed between slide glasses S112 manufactured by Matsunami Glass Co., Ltd., which were fitted with spacers having a thickness of 100 μm. The resin composition was then irradiated with ultraviolet light to cure. The ultraviolet light was provided by UV-LED lamps having wavelength peaks of 365 nm (distribution wavelength range: 350 nm to 390 nm) and 395 nm (distribution wavelength range: 370 nm to 420 nm), with the amount of light provided being 800 mJ / cm2 for each. 2 and 400 mJ / cm 2 Next, a UV-LED lamp having a wavelength peak at 395 nm (distribution wavelength range: 370 nm to 420 nm) was used to provide light at a dose of 4000 mJ / cm. 2 The adhesive member sample was obtained by irradiating the sample with ultraviolet light so that the transmittance of the adhesive member sample was measured for light with wavelengths of 400 nm and 450 nm using a spectrophotometer V770 (UV-Visible & NIR Spectrometer, JASCO Corporation).

[0157] <180° peel strength of adhesive material> The prepared resin composition was applied to a thickness of 100 μm on a 26 mm × 76 mm soda-lime glass (manufactured by Central Glass Co., Ltd.) using an inkjet device. A DevicePrinter-CX (manufactured by MICROJET CORP.) equipped with a KM1024i (manufactured by KONICA MINOLTA, INC.) was used as the inkjet device. The applied resin composition was exposed to UV-LED lamps with peaks at 365 nm (distribution wavelength range: 350 nm to 390 nm) and 395 nm (distribution wavelength range: 370 nm to 420 nm), each with a light supply of 800 mJ / cm. 2 and 400 mJ / cm 2Next, a 20 mm x 150 mm PET film (thickness 50 μm, Toyobo Co., Ltd. product, product name A4360) was bonded at a bonding pressure of 0.15 MPa. After bonding, a UV-LED lamp with a peak at 395 nm (distribution wavelength range: 370 nm to 420 nm) was used from the PET film side to provide 4000 mJ / cm2 of light. 2 The resin composition was cured by irradiating it with ultraviolet light so as to obtain a sample.

[0158] The peel strength of the obtained sample was measured three times at a temperature of 25°C using a universal testing machine (5965 model manufactured by Instron Corporation) at a speed of 300 mm / min and a peel angle of 180°. This is in accordance with the JIS Z0237 method. The average value of approximately 50 mm peeling was calculated, and the obtained value was multiplied by 1.25 to record the peel strength for a width of 25 mm. In Table 2, the resin composition of Comparative Example 4 was not cured, so the peel strength was not measured. The resin compositions of Comparative Examples 6 and 7 were not ejected by an inkjet device, so the peel strength was not measured.

[0159] [Table 2]

[0160] Referring to Table 2, it can be seen that the adhesive members made of the resin compositions of Examples 1 and 2 have a 180° peel strength of 800 gf / 25 mm or more against at least one of a glass substrate and a polymer substrate at a temperature of 25° C. The adhesive members made of the resin compositions of Examples 1 and 2 have a transmittance of 0% or more and less than 5% for light with a wavelength of 400 nm, and a transmittance of 85% or more and 99% or less for light with a wavelength of 450 nm. The adhesive members made of the resin compositions of Examples 1 and 2 satisfy the transmittance range of light with wavelengths of 400 nm and 450 nm for the adhesive member according to one embodiment of the present invention. As a result, it can be seen that the resin composition of one embodiment, which includes a dihydroxybenzophenone-based ultraviolet absorber, a photoinitiator that absorbs light in the wavelength range of 400 nm to 450 nm, at least one monofunctional (meth)acrylate monomer, and at least one (meth)acrylate oligomer, exhibits excellent ultraviolet blocking rate and high visible light transmittance after curing. It can also be seen that the resin composition of one embodiment exhibits excellent adhesive strength after curing. From the above, it can be seen that the adhesive member made of the resin composition of one embodiment exhibits excellent ultraviolet blocking rate, excellent visible light transmittance, and excellent adhesive strength, and that the display device including the adhesive member exhibits excellent display quality and excellent reliability.

[0161] The adhesive members made of the resin compositions of Comparative Examples 1 to 3 and 5 have a 180° peel strength of 800 gf / 25 mm or more against at least one of a glass substrate and a polymer substrate at a temperature of 25° C. However, the adhesive members made of the resin compositions of Comparative Examples 1 to 3 and 5 have a transmittance of 5% or more for light with a wavelength of 450 nm, which is different from the adhesive members made of the resin compositions of Examples 1 and 2. As described above, the resin compositions of Comparative Examples 1 to 3 and 5 do not contain a dihydroxybenzophenone-based ultraviolet absorber, unlike the resin compositions of Examples 1 and 2.

[0162] The resin composition of Comparative Example 4 was not cured, and therefore the 180° peel strength was not measured. The resin compositions of Comparative Examples 6 and 7 could not be discharged using an inkjet device, and therefore the 180° peel strength was not measured. The resin compositions of Comparative Examples 6 and 7 contain an acrylic polymer with a molecular weight of 1.2 million and a solvent, and therefore cannot be provided using an inkjet device. As described above, the resin compositions of Comparative Examples 4, 6, and 7 do not contain a dihydroxybenzophenone-based ultraviolet absorber, unlike the resin compositions of Examples 1 and 2.

[0163] The resin composition of an embodiment may include a dihydroxybenzophenone-based ultraviolet absorber, a photoinitiator absorbing light in a wavelength range of 400 nm to 450 nm, at least one monofunctional (meth)acrylate monomer, and at least one (meth)acrylate oligomer. The adhesive resin of an embodiment may include a polymer derived from the resin composition of an embodiment. The display device of an embodiment may include the adhesive member of an embodiment disposed between a display panel and a window. The adhesive member of an embodiment may have a 180° peel strength of 800 gf / 25 mm or more against at least one of a glass substrate and a polymer substrate at a temperature of 25° C. Thus, the resin composition of an embodiment may exhibit excellent applicability before curing and excellent adhesive strength after curing. The adhesive member formed by curing the resin composition of an embodiment and the display device including the adhesive member may exhibit excellent reliability.

[0164] Although the present invention has been described above with reference to preferred embodiments thereof, it will be understood by those skilled in the art or those having ordinary knowledge in the art that various modifications and variations of the present invention can be made without departing from the spirit and technical scope of the present invention as set forth in the claims below.

[0165] Therefore, the technical scope of the present invention should be determined not by the contents described in the detailed description of the specification, but by the claims. [Explanation of symbols]

[0166] RC: Resin composition AP: Adhesive material DP: Display panel WP: Window DD:Display device

Claims

1. A dihydroxybenzophenone-based ultraviolet absorber, A photoinitiator that absorbs light in the wavelength range of 400 nm or more and 450 nm or less; at least one monofunctional (meth)acrylate monomer; at least one (meth)acrylate oligomer, A resin composition which, after photocuring, has a 180° peel strength from at least one of a glass substrate and a polymer substrate of 800 gf / 25 mm or more, as measured at 25° C. according to JIS Z0237 method.

2. After photocuring, the transmittance for light in a first wavelength range including a wavelength of 400 nm is 0% or more and less than 5%, The resin composition according to claim 1 , wherein after photocuring, the resin composition has a transmittance of 85% or more and 99% or less for light in a second wavelength range that is different from the first wavelength range and includes a wavelength of 450 nm.

3. 2. The resin composition according to claim 1, wherein the dihydroxybenzophenone-based ultraviolet absorber comprises 2,2',4,4'-tetrahydroxybenzophenone.

4. 2. The resin composition according to claim 1, wherein the weight of the dihydroxybenzophenone-based ultraviolet absorber is 2 wt % or more and 10 wt % or less, based on a total weight of the resin composition being 100 wt %.

5. The resin composition according to claim 1, wherein the photoinitiator comprises bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide.

6. The resin composition according to claim 1, wherein the (meth)acrylate oligomer has a weight average molecular weight of 5,000 or more and 40,000 or less.

7. The resin composition according to claim 1, wherein the monofunctional (meth)acrylate monomer comprises at least one of 4-hydroxybutyl acrylate (4-HBA), 2-ethylhexyl acrylate (2-EHA), tetrahydrofurfuryl acrylate (THF-A), and 2-ethylhexyl-diglycol acrylate (EHDG-AT).

8. The resin composition according to claim 1 , wherein the weight of the monofunctional (meth)acrylate monomer is 75 wt % or more and 85 wt % or less, based on 100 wt % of the total weight of the resin composition.

9. The resin composition according to claim 1, which is provided by an inkjet printing method or a dispensing method.

10. The resin composition according to any one of claims 1 to 9 includes a polymer derived from the resin composition, An adhesive member having a 180° peel strength of 800 gf / 25 mm or more with respect to at least one of a glass substrate and a polymer substrate, measured at a temperature of 25° C. according to JIS Z0237 method.

11. A display panel; a window disposed over the display panel; an adhesive member disposed between the display panel and the window, the adhesive member having a 180° peel strength of 800 gf / 25 mm or more with respect to at least one of a glass substrate and a polymer substrate, the peel strength being measured according to JIS Z0237 at a temperature of 25° C.; The adhesive member comprises a polymer derived from the resin composition according to claim 1 .

12. 12. The display device of claim 11, which does not include a polarizer.

13. The display device further includes an input sensing unit disposed between the display panel and the window, The display device of claim 11, wherein the adhesive member is disposed between the display panel and the input sensing unit or between the input sensing unit and the window.

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