Integrated sealing sheet, light-emitting type electronic component, and manufacturing method for the same

Abstract

To provide an integrated sealing sheet whose blackness can be increased at display off time, and a light-emitting type electronic component using the sheet and a manufacturing method for the same.SOLUTION: An integrated sealing sheet 1 that is crimped on a surface of an element-attached substrate 2, which is a substrate 20 where a plurality of light-emitting elements 21, 22, and 23 are disposed, on which the light-emitting elements 21, 22, and 23 are disposed includes at least a black curable resin layer 10 that can block light emitted from the light-emitting elements 21, 22, and 23, a transparent curable resin layer 11 with the higher light-transmitting property than the black curable resin layer, and a base material layer 12. The transparent curable resin layer 11 is disposed between the black curable resin layer 10 and the base material layer 12. The transparent curable resin layer 11 contains filler. A light-emitting type electronic component and a manufacturing method for the same are also provided.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to an integrated sealing sheet, a light-emitting electronic component, and a method for manufacturing the same.

Background Art

[0002] In recent years, displays using extremely small light-emitting diodes called mini LEDs or micro LEDs have attracted attention. As methods for using such extremely small light-emitting diodes in displays, roughly two types of methods are known. One is a method of arranging a large number of light-emitting diodes on a substrate to form a liquid crystal backlight and locally controlling the luminance of the backlight. The other is a method of emitting light-emitting diodes of each color of R (red), G (green), and B (blue) and sending light of each color to the eyes of viewers of the display in pixel units.

[0003] Light-emitting diodes such as mini LEDs or micro LEDs are generally arranged on a substrate. When arranging a plurality of light-emitting diodes (referred to as light-emitting elements) on a substrate, it is necessary to shield light between adjacent light-emitting elements. As a method of shielding light between a plurality of light-emitting elements with a resin having a light-shielding function, for example, a method using a dry film is known (see Patent Document 1). A dry film is a film obtained by applying and drying a light-shielding resin composition on a protective film.

[0004] When a dry film is pressure-bonded from above a plurality of light-emitting elements on a substrate, a light-shielding resin layer is formed not only in the gaps between the light-emitting elements but also on the upper surface (light-emitting surface) of the light-emitting elements. Under such circumstances, the resin layer may also block the light reaching the viewers of the display. To prevent this, in the above prior art, etching such as plasma treatment is performed on the light-emitting surface of the light-emitting element to remove the resin layer on the light-emitting surface, and the removed surface is covered with a light-transmissive sealing material.

Prior Art Documents

Patent Documents

[0005] Japanese Patent Document 1 Japanese Unexamined Patent Application Publication No. 2022-22562 SUMMARY OF THE INVENTION PROBLEMS TO BE SOLVED BY THE INVENTION

[0006] However, since the above prior art requires a great deal of time for the etching process, it causes an increase in manufacturing cost. In addition, it is difficult to completely remove the resin layer on the light-emitting surface of the light-emitting element. As a result, it is difficult to completely prevent the diffusion of light that should reach the viewer side of the display. In addition, since a step of laminating a film of a highly transparent sealing material is required after the etching process, there is also a problem that the manufacturing process increases.

[0007] In view of the above problems, prior to the present invention, the inventors developed an integrated sealing sheet in which one or two or more curable resin layers were formed on one surface of a film substrate. By pressing the integrated sealing sheet against the light-emitting element so that the curable resin layer side faces the light-emitting surface side of the light-emitting element and curing the curable resin layer, it was found that it is possible to reduce light diffusion between the light-emitting elements and to realize a structure that does not block the light emitted from the light-emitting element.

[0008] The integrated sealing sheet developed prior to the present invention as described above also has further points for improvement. Since the integrated sealing sheet has a structure in which a transparent layer is disposed on the top surface of the light-emitting element, external light that has passed through the transparent layer is reflected at the interface between the top surface of the light-emitting element and the light-shielding layer laminated under the transparent layer. Due to this reflection, the blackness may decrease when the display is turned off.

[0009] Therefore, an object of the present invention is to provide an integrated sealing sheet capable of enhancing blackness when the display is turned off, a light-emitting electronic component using the sheet, and a method for manufacturing the same. MEANS FOR SOLVING THE PROBLEMS

[0010] (1) An integrated sealing sheet according to an embodiment for achieving the above object is An integrated sealing sheet that is pressure-bonded to the surface of a substrate with a plurality of light-emitting elements disposed thereon, on which surface the plurality of light-emitting elements are disposed, comprising at least a black curable resin layer capable of blocking light emitted from the plurality of light-emitting elements, a transparent curable resin layer having higher light transmittance than the black curable resin layer, and a base material layer, wherein the transparent curable resin layer is disposed between the black curable resin layer and the base material layer, and the transparent curable resin layer contains a filler. (2) In the integrated sealing sheet according to another embodiment, preferably, the material of the filler is at least one of silica, acrylic resin, polyurethane resin, and / or silicone. (3) In the integrated sealing sheet according to another embodiment, preferably, the average particle diameter of the filler is 10 μm or less. (4) In the integrated sealing sheet according to another embodiment, preferably, the addition amount of the filler is 100 parts by mass or less with respect to 100 parts by mass of the total resin solid content of the transparent curable resin layer. (5) In the integrated sealing sheet according to another embodiment, preferably, the base material layer further includes a hard coat layer on the surface opposite to the surface in contact with the transparent curable resin layer. (6) In the integrated sealing sheet according to another embodiment, preferably, the total light transmittance in the cured state of the black curable resin layer is 0 to 30%, and the total light transmittance in the cured state of the transparent curable resin layer is 70 to 99%. (7) In the integrated sealing sheet according to another embodiment, preferably, the total light transmittance in the cured state of the transparent curable resin layer is 90 to 110%. (8) In the integrated sealing sheet according to another embodiment, preferably, the haze value in the cured state of the transparent curable resin layer is 80% or more. (9) In the integrated sealing sheet according to another embodiment, preferably, the haze value in the cured state of the transparent curable resin layer is 90 to 100%. (10) In the integrated sealing sheet according to another embodiment, preferably, the storage modulus at 100 ° C in the uncured state of the transparent curable resin layer is higher than the storage modulus at 100 ° C in the uncured state of the black curable resin layer. (11) In the integrated sealing sheet according to another embodiment, preferably, the ratio of the thickness of the black curable resin layer before crimping to the total thickness of the transparent curable resin layer and the black curable resin layer before crimping is 10 to 90%. (12) A light-emitting electronic component according to an embodiment for achieving the above object is a substrate with elements having a plurality of light-emitting elements arranged thereon, and an integrated sealing curable sheet crimped to the surface of the substrate with elements on which the plurality of light-emitting elements are arranged. The integrated sealing curable sheet includes at least a black resin layer capable of shielding light emitted from the plurality of light-emitting elements, a transparent resin layer having higher light transmittance than the black resin layer, and a base material layer, and from the side in contact with the substrate with elements, the black resin layer, the transparent resin layer, and the base material layer are laminated in this order. The transparent resin layer contains a filler. (13) In the light-emitting electronic component according to another embodiment, preferably, the thickness of the transparent resin layer is 0.1 to 5.0 times the height of the plurality of light-emitting elements, and the thickness of the black resin layer is 0.1 to 0.9 times the height of the plurality of light-emitting elements. (14) A method for manufacturing a light-emitting electronic component according to an embodiment for achieving the above object is a step of crimping the above integrated sealing sheet to the surface of a substrate with elements having a plurality of light-emitting elements arranged thereon, a step of filling at least a part of the black curable resin layer and the transparent curable resin layer between the plurality of light-emitting elements, and a step of curing the black curable resin layer and the transparent curable resin layer.

Advantages of the Invention

[0011] The present invention provides an integrated encapsulation sheet capable of enhancing blackness when the display is turned off, a light-emitting electronic component using the sheet, and a method for manufacturing the same.

Brief Description of the Drawings

[0012]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Embodiments for Carrying Out the Invention

[0013] Next, embodiments of the present invention will be described with reference to the drawings. Note that the embodiments described below do not limit the invention according to the claims, and not all of the elements and combinations thereof described in the embodiments are essential for the solution means of the present invention. In the present application, the "main component" means a component that occupies 50% by mass or more of the total solid content of the entire composition. In the present application, the "total resin solid content" means the total solid content mass of the resin and the elastomer, and when a curing agent is blended in addition to the elastomer, the solid content mass of the curing agent is also included. The numerical range represented by "~" means a numerical range having the numerical values before and after "~" as the lower limit value and the upper limit value, respectively.

[0014] (First Embodiment) FIG. 1 shows a cross-sectional view when the integrated sealing sheet according to one embodiment is cut in the thickness direction. FIG. 2 shows a cross-sectional view equivalent to FIG. 1 when the integrated sealing sheet of FIG. 1 is arranged such that its black curable resin layer is in contact with the top surface of the light-emitting element of the substrate with elements. FIG. 3 shows a cross-sectional view equivalent to FIG. 1 in a state where the integrated sealing sheet is pressure-bonded to the substrate with elements from the state of FIG. 2 until the black curable resin layer and the transparent curable resin layer of FIG. 1 are embedded between the light-emitting elements. FIG. 4 shows a cross-sectional view equivalent to FIG. 1 in a state after further proceeding from the state of FIG. 3, peeling off the protective sheet on the base material layer, and performing a curing treatment.

[0015] 1. Integrated Sealing Sheet The integrated sealing sheet 1 according to the present embodiment is an integrated sealing sheet for pressure-bonding to the surface of the substrate 2 with elements on which a plurality of light-emitting elements 21, 22, 23 are arranged on the substrate 20, and includes at least a black curable resin layer 10 capable of shielding light emitted from the plurality of light-emitting elements 21, 22, 23, a transparent curable resin layer 11 having higher light transmittance than the black curable resin layer 10, and a base material layer 12. The transparent curable resin layer 11 is disposed between the black curable resin layer 10 and the base material layer 12.

[0016] The integrated sealing sheet 1 is in a state before the curing process of the integrated sealing cured sheet 3 provided in the light-emitting electronic component 5 described later. The integrated sealing sheet 1 is a laminate in which at least a black curable resin layer 10, a transparent curable resin layer 11, and a base material layer 12 are laminated in this order. The integrated sealing sheet 1 is used to be pressure-bonded to the surfaces of the plurality of light-emitting elements 21, 22, 23 on the side of the black curable resin layer 10 during the pressure-bonding process described later. Also, the black curable resin layer 10 and the transparent curable resin layer 11 are in an uncured state until the curing process described later is performed. That is, the black curable resin layer 10 and the transparent curable resin layer 11 are cured by the curing process to become a black resin layer 30 and a transparent resin layer 31, respectively.

[0017] In the present application, "light transmittance" refers to the light transmittance measured by various known methods, and may be, for example, the total light transmittance described later measured in accordance with JIS K 7361-1 using a haze meter.

[0018] (L* value of the integrated sealing sheet) The L* value in the integrated sealing sheet 1 is measured from the side of the base material layer 12 in accordance with JIS Z 8781-4, with a light source D65, a field of view of 2°, a reflection method, and an SCE method. The L* value is preferably less than 30, more preferably less than 26, and even more preferably less than 20. The measurement of the L* value is performed on a standard white calibration plate. Since the light transmittance of the black curable resin layer 10 in the integrated sealing sheet 1 is low, the influence of the standard white calibration plate is almost negligible. By the L* value being less than the above upper limit value, the blackness when the display is turned off can be enhanced. The measurement of the L* value is preferably performed in a state where it is not pressure-bonded and filled to the substrate 2 with elements.

[0019] (Y value of the integrated sealing sheet) In the integrated sealing sheet 1, the Y value is an index representing the brightness of the reflected light and is the Y value in the Yxy color system defined by the International Commission on Illumination (CIE). The Y value is preferably less than 15, more preferably less than 10, and even more preferably less than 5. By the Y value being less than the above upper limit value, the blackness when the display is turned off can be enhanced. The measurement of the Y value is carried out in accordance with JIS Z 8722, from the substrate layer 12 side by a light source D65, a viewing field of 2°, a reflection method, and an SCE method. The measurement of the Y value is preferably carried out in a state where it is not pressure-bonded and filled to the substrate 2 with elements.

[0020] For the convenience of handling, the integrated sealing sheet 1 may further include a protective sheet on the outer surface of either one or both of the black curable resin layer 10 and the substrate layer 12. FIG. 1 shows an example of the integrated sealing sheet 1 including protective sheets 13 and 14 on the outer surfaces of both the black curable resin layer 10 and the substrate layer 12. More specifically, the integrated sealing sheet 1 has a structure in which the protective sheet 14, the substrate layer 12, the transparent curable resin layer 11, the black curable resin layer 10, and the protective sheet 13 are laminated in this order. Hereinafter, each layer constituting the integrated sealing sheet 1 will be described.

[0021] (1) Black curable resin layer The black curable resin layer 10 is a layer for shielding light between the light-emitting elements 21, 22, and 23. It is also a layer for improving the contrast of the display. Further, the black curable resin layer 10 sufficiently fills between the plurality of light-emitting elements 21, 22, and 23 arranged on the substrate 2 with elements in a bonding process typified by thermocompression bonding, and prevents appearance defects due to the expansion of unfilled voids in a curing process typified by thermosetting and damage to the light-emitting elements 21, 22, and 23 due to external factors in subsequent processes.

[0022] [L*a*b* value] In the black curable resin layer 10, the L*a*b* values in the cured state measured in accordance with JIS Z 8781-4, with a light source of D65, a viewing field of 2°, a reflection method, and an SCE method are preferably L*: 3 to 40, a*: -10 to 10, b*: -20 to 20, and more preferably L*: 3 to 30, a*: -5 to 5, b*: -15 to 15. The measurement of the above L*a*b* values is performed on a standard white calibration plate. Since the light transmittance of the black curable resin layer 10 is low, the influence of the standard white calibration plate is almost negligible. When the L*a*b* values in the cured state are within a preferable range, the black curable resin layer 10 can perform light shielding between the light-emitting elements 21, 22, and 23 after curing, and can further improve the contrast of the display. Note that the uncured black curable resin layer 10 also has the same indexes as described above.

[0023] [Total light transmittance] In the present application, the total light transmittance in the cured state of the black curable resin layer 10 and the transparent curable resin layer 11 described later is calculated as follows. First, in advance, in accordance with JIS K 7361-1, the total light transmittance of the substrate layer 12 alone described later is measured using a haze meter (for example, NDH5000 manufactured by Nippon Denshoku Industries Co., Ltd.). Next, a laminated sheet in which the cured black curable resin layer 10 or the transparent curable resin layer 11 (that is, the black resin layer 30 or the transparent resin layer 31) is laminated on the substrate layer 12 is prepared, and the total light transmittance is measured in the same manner. From each of the obtained measurement values, a value excluding the influence of the substrate layer 12 is calculated, and this value is taken as the total light transmittance in the cured state of the black curable resin layer 10 and the transparent curable resin layer 11.

[0024] The total light transmittance of the black curable resin layer 10 in the cured state is lower than that of the transparent curable resin layer 11 in the cured state described later. Specifically, the total light transmittance of the black curable resin layer 10 is adjusted to be 0 to 50% in its cured state. The total light transmittance of the black curable resin layer 10 in the cured state is preferably adjusted to be 0 to 40%, more preferably adjusted to be 0 to 30%. When the total light transmittance is equal to or lower than the upper limit values such as 50%, 40%, or 30%, the black curable resin layer 10 can achieve light shielding between the light-emitting elements 21, 22, and 23 after curing. The total light transmittance of the black curable resin layer 10 in the cured state can be changed mainly by the presence or absence of carbon black blending or its blending amount. Also, the total light transmittance in the cured state can be changed depending on the thickness of the black curable resin layer 10 and the type of the resin composition.

[0025] [Storage Elastic Modulus] The storage elastic modulus of the black curable resin layer 10 in the uncured state is preferably smaller than that of the transparent curable resin layer 11 in the uncured state. The storage elastic modulus of the black curable resin layer 10 in the uncured state is measured in accordance with JIS K 7244 and is preferably 1.0×10 5 Pa or less at 100°C, more preferably 1.0×10 1 Pa or more and 1.0×10 5 Pa or less, and even more preferably 1.0×10 2 Pa or more and 5.0×10 4 Pa or less. When the storage elastic modulus of the black curable resin layer 10 at 100°C in the uncured state is equal to or lower than the preferable upper limit value, the black curable resin layer 10 exhibits sufficient fluidity when pressure-bonded to the substrate 2 with elements, follows the unevenness of the substrate 2 with elements by the plurality of light-emitting elements 21, 22, and 23, and can sufficiently fill the space between the plurality of light-emitting elements 21, 22, and 23. When the storage elastic modulus of the black curable resin layer 10 at 100°C in the uncured state is equal to or higher than the preferable lower limit value, the uneven pressure during thermocompression bonding of the black curable resin layer 10 can be prevented, and a uniform appearance can be maintained. Also, the outflow of the resin outside a predetermined range can be prevented, and the film thickness after pressure bonding can be ensured.

[0026] The storage elastic modulus of the black curable resin layer 10 at 60°C after heat treatment at 120°C for 1 hour is preferably 7×10 8 Pa or more and 2×10 10 Pa or less. When the storage elastic modulus is below the preferable upper limit value, it is possible to prevent cracks from occurring in the cured black curable resin layer 10 when cutting the edge of the substrate 20. Also, when the storage elastic modulus is above the preferable lower limit value, it is possible to prevent the cured black curable resin layer 10 from deforming and expanding and the integrated sealing sheet 1 on the edge side of the substrate 20 from being distorted in a wave shape when cutting the edge of the substrate 20.

[0027] The storage elastic modulus of the black curable resin layer 10 in the uncured state is preferably 5.0×10 5 Pa or less at 150°C, more preferably 5.0×10 2 Pa to 5.0×10 5 Pa, and even more preferably 1.0×10 3 Pa to 1.0×10 5 Pa. In the uncured state, when the storage elastic modulus of the black curable resin layer 10 at 150°C is below the preferable upper limit value, it becomes difficult for cracks due to curing shrinkage to occur during thermosetting. When the storage elastic modulus of the black curable resin layer 10 at 150°C is above the preferable lower limit value, the flow during thermosetting can be suppressed, and appearance defects after curing such as repelling phenomena can be suppressed.

[0028] [Curable Resin Composition] The black curable resin layer 10 contains a curable resin composition. Examples of the curable resin composition include a curable resin composition containing at least one resin selected from epoxy resins, acrylic resins, polyester resins, polyurethane resins, and silicone resins, and a curing agent. Among the above curable resin compositions, an epoxy resin composition that can achieve curability at low temperatures and has excellent heat resistance and reliability is preferable. In this specification, the epoxy resin composition is a composition containing an epoxy resin as a main component, or a composition containing an epoxy resin and a curing agent as main components.

[0029] When the black cured resin layer 10 is composed of an epoxy resin composition, it may contain a curing agent for other epoxy resins other than a modified elastomer having a functional group capable of reacting with an epoxy group. Examples of other curing agents include known curing agents such as phenolic curing agents, acid anhydride curing agents, and amine curing agents. Two or more other curing agents may be used in combination.

[0030] (Epoxy resin) In the present application, an epoxy resin is a compound having an epoxy group in the molecule. As the epoxy resin used in the present invention, those having two or more epoxy groups in one molecule are preferable. This is because a crosslinked structure can be formed by the reaction with a modified resin having a functional group capable of reacting with an epoxy group, and high heat resistance can be exhibited in the cured product. Further, when two or more epoxy resins having two or more epoxy groups are used, the degree of crosslinking with a curing agent having a functional group capable of reacting with an epoxy group is sufficient, and sufficient heat resistance can be obtained in the cured product.

[0031] Examples of the epoxy resin include bifunctional epoxy resins having two epoxy groups in the molecule, polyfunctional epoxy resins having three or more epoxy groups in the molecule, and high molecular weight epoxy resins having a weight average molecular weight of 10,000 or more. Further, they may be hydrogenated epoxy resins. In the present application, an epoxy resin having a weight average molecular weight of 10,000 or more is classified as a high molecular weight epoxy resin regardless of the number of epoxy groups in the molecule, and is not classified as a bifunctional epoxy resin or a polyfunctional epoxy group. The weight average molecular weight of the epoxy resin is the molecular weight in terms of polystyrene measured by gel permeation chromatography.

[0032] Examples of epoxy resins include bisphenol A type epoxy resins, bisphenol F type epoxy resins, or phenoxy resins obtained by polymerizing them, bisphenol-based epoxy resins such as hydrogenated products thereof; novolak type epoxy resins such as phenol novolak epoxy resins, o-cresol novolak epoxy resins, bisphenol A novolak epoxy resins, xylene structure-containing novolak epoxy resins, naphthol novolak type epoxy resins; glycidyl ester-based epoxy resins such as diglycidyl phthalate, diglycidyl isophthalate, diglycidyl terephthalate, glycidyl p-hydroxybenzoate, diglycidyl tetrahydrophthalate, diglycidyl succinate, diglycidyl adipate, diglycidyl sebacate, triglycidyl trimellitate; glycidyl ether-based epoxy resins such as ethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, 1,4-butanediol diglycidyl ether, 1,6-hexanediol diglycidyl ether, trimethylolpropane triglycidyl ether, pentaerythritol tetraglycidyl ether, tetraphenyl glycidyl ether ethane, triphenyl glycidyl ether ethane, polyglycidyl ether of sorbitol, polyglycidyl ether of polyglycerol; glycidyl amine-based epoxy resins such as triglycidyl isocyanurate, tetraglycidyl diaminodiphenylmethane; linear aliphatic epoxy resins such as epoxidized polybutadiene, epoxidized soybean oil; special skeleton epoxy resins such as brominated bisphenol A type epoxy resins, phosphorus-containing epoxy resins, fluorine-containing epoxy resins, epoxy resins containing dicyclopentadiene skeletons, epoxy resins containing naphthalene skeletons, anthracene type epoxy resins, tertiary butyl catechol type epoxy resins, triphenylmethane type epoxy resins, tetraphenylethane type epoxy resins, biphenyl type epoxy resins, bisphenol S type epoxy resins, etc., but are not limited thereto.

[0033] As the high molecular weight epoxy resin, phenoxy resin, epoxy-modified polybutadiene, copolymer of glycidyl methacrylate and methyl methacrylate, modified polymers obtained by epoxy-modifying other resins, etc. can be used. These epoxy resins may be used alone or in combination of two or more.

[0034] Among the above epoxy resins, as the epoxy resin used in the black curable resin layer 10, from the viewpoint of increasing the crosslink density after curing, a polyfunctional epoxy resin is preferable. Among the polyfunctional epoxy resins, in particular, novolak-type epoxy resins are more preferable for the following reasons. Novolak-type epoxy resins are epoxy resins into which a moderately flexible skeleton can be introduced and whose flexibility and softening point can be adjusted. For this reason, the cured product is less likely to cause brittle fracture, the stability of the performance of the cured product of the epoxy resin composition during long-term use is improved, and the crosslink density can be increased. In addition, the heat resistance of the cured product is also improved.

[0035] Specific examples of novolak-type epoxy resins include, for example, "YX7700" manufactured by Mitsubishi Chemical Corporation, "NC7000L", "XD1000", "EOCN-1020" manufactured by Nippon Kayaku Co., Ltd., "ESN485" manufactured by Nippon Steel Chemical & Material Co., Ltd., "N-660", "N-690", "N-695", "HP-7200H" manufactured by DIC Corporation, etc.

[0036] The blending amount of the polyfunctional epoxy resin in the black curable resin layer 10 is preferably 10 to 99% by mass, more preferably 40 to 95% by mass, and even more preferably 60 to 90% by mass with respect to 100% by mass of the total resin solid content of the black curable resin layer 10. When it is at least the above lower limit value, the crosslink density can be increased to impart chemical resistance and heat resistance. Also, when it is at most the above upper limit value, the storage elastic modulus during thermocompression bonding can be adjusted and the fluidity of the black curable resin layer 10 can be ensured.

[0037] The black curable resin layer 10 preferably does not contain a high molecular weight epoxy resin. This makes it easy to ensure sufficient fluidity of the black curable resin layer 10 during thermocompression bonding. When the black curable resin layer 10 contains a high molecular weight epoxy resin, the blending amount of the high molecular weight epoxy resin is preferably less than 50% by mass, more preferably less than 30% by mass, and even more preferably less than 10% by mass with respect to 100% by mass of the total resin solids of the black curable resin layer 10.

[0038] From the viewpoint of ensuring sufficient fluidity during thermocompression bonding, the black curable resin layer 10 preferably contains an epoxy resin having a softening point or melting point of 100°C or lower. From the viewpoints of handleability and heat resistance of the cured product, the black curable resin layer 10 more preferably contains an epoxy resin having a softening point or melting point of 40 to 95°C. By containing an epoxy resin having a softening point or melting point within the above range, it becomes easy to control the storage elastic modulus of the black curable resin layer 10.

[0039] The total blending amount of the epoxy resin in the black curable resin layer 10 is preferably 10 to 100% by mass, more preferably 20 to 99% by mass, and even more preferably 35 to 95% by mass with respect to 100% by mass of the total resin solids of the black curable resin layer 10. When within the above range, it becomes easy to control the storage elastic modulus of the black curable resin layer 10 and ensure appropriate fluidity during thermocompression bonding. Also, when it is at least the above lower limit value, the heat resistance of the black curable resin layer 10 after curing can be improved.

[0040] (Elastomer) The black curable resin layer 10 preferably contains an elastomer in addition to resins such as epoxy resin. By containing an elastomer, it becomes easy to control the storage elastic modulus of the black curable resin layer 10, that is, to control the fluidity.

[0041] As the elastomer, a thermosetting elastomer generally called "rubber" is preferred because excellent heat resistance can be obtained. Examples of the thermosetting elastomer include acrylonitrile-butadiene rubber (NBR) which is a random copolymer of butadiene and acrylonitrile, acrylic rubber, styrene-butadiene rubber, vinyl acetate resin, silicone resin, and the like. Among these, NBR is preferred. This is because NBR has good compatibility with the epoxy resin, which makes it easy to control the fluidity near 100°C of the black curable resin layer 10. As a result, the adhesion between the black curable resin layer 10 and the transparent curable resin layer 11 or the substrate 2 with elements becomes good.

[0042] The weight average molecular weight of the elastomer is preferably from 100,000 to 1,000,000, more preferably from 120,000 to 500,000, and even more preferably from 150,000 to 300,000. If the weight average molecular weight of the elastomer is within the above range, it is easy to control the storage elastic modulus of the black curable resin layer 10 and ensure the fluidity during thermocompression bonding. If the weight average molecular weight of the elastomer is below the above upper limit value, the compatibility between the elastomer and the epoxy resin is improved, and the flow during the thermosetting of the black curable resin layer 10 can be controlled more effectively.

[0043] In particular, when the black curable resin layer 10 is composed of an epoxy resin composition, it preferably contains a modified elastomer having a functional group capable of reacting with an epoxy group. The modified elastomer having a functional group capable of reacting with an epoxy group also acts as a curing agent for the epoxy resin. In addition, since the modified elastomer can react and bond with the epoxy resin, the heat resistance and reliability against thermal shock after curing of the black curable resin layer 10 are improved. Furthermore, the difference in polarity between the functional group capable of reacting with the epoxy resin and the resin skeleton acts favorably on the dispersibility, and good dispersibility can be obtained when the black curable resin layer 10 contains carbon black.

[0044] Examples of the functional group capable of reacting with an epoxy group include acid groups such as a carboxy group, a sulfo group, a nitro group, and a phosphoric acid group, and their acid anhydride groups, a hydroxyl group, an amino group, and the like. Among these, an acid group or an acid anhydride group is preferable because curing can be performed at a low temperature and a pot life can be ensured. For the same reason, a carboxy group or a carboxylic acid anhydride group is particularly preferable.

[0045] That is, when the black curable resin layer 10 is composed of an epoxy resin composition, it preferably contains an acid-modified elastomer having an acid group or an acid anhydride group, more preferably contains an acid-modified elastomer having a carboxy group, and even more preferably contains a modified NBR having a carboxy group.

[0046] As the modified NBR having a carboxy group, carboxylated acrylonitrile rubber into which acrylic acid, methacrylic acid, maleic anhydride, or the like is introduced is preferable. Examples of commercially available products of carboxylated acrylonitrile rubber include "NX775" and "1072CGJ" manufactured by Zeon Corporation. Two or more kinds of modified elastomers having a functional group capable of reacting with an epoxy group may be used in combination.

[0047] The blending amount of the elastomer in the black curable resin layer 10 is preferably 0.01 to 90% by mass, more preferably 1 to 80% by mass, and even more preferably 5 to 65% by mass with respect to 100% by mass of the total resin solid content of the black curable resin layer 10. When it is within the above range, it becomes easy to control the storage elastic modulus of the black curable resin layer 10, and appropriate fluidity of the black curable resin layer 10 during thermocompression bonding can be ensured. Further, when it is not less than the above lower limit value, the dispersibility of carbon black in the epoxy resin composition becomes good. Furthermore, the film-forming property of the epoxy resin composition is improved, and the distribution of the film thickness when the epoxy resin composition is applied to form a film can be narrowed.

[0048] (Curing agent) When the black curable resin layer 10 is composed of an epoxy resin composition, it may contain a curing agent for other epoxy resins other than a modified elastomer having a functional group capable of reacting with an epoxy group. Examples of other curing agents include known curing agents such as phenolic curing agents, acid anhydride curing agents, and amine curing agents. Two or more of the other curing agents may be used in combination.

[0049] (Curing catalyst) When the black curable resin layer 10 is composed of an epoxy resin composition, it may contain a curing catalyst that promotes the curing reaction of the epoxy resin. Examples of the curing catalyst include imidazole-based, tertiary amine-based, and phosphorus compound-based catalysts. Among them, imidazole-based catalysts, which have good compatibility with epoxy resins and are less likely to cause yellowing, are preferred. Among the imidazole-based curing catalysts, those having a cyanoethyl group are particularly preferred because they are easily soluble in epoxy resins. The blending amount of the curing catalyst is preferably 0.01 to 5 parts by mass, more preferably 0.05 to 4 parts by mass, and even more preferably 0.1 to 3 parts by mass with respect to 100 parts by mass of the total resin solid content of the black curable resin layer 10. When within the above range, the curing of the black curable resin layer 10 can proceed sufficiently, and the pot life of the integrated sealing sheet 1 can be ensured. Two or more curing catalysts may be used in combination.

[0050] (Black pigment or black dye such as carbon black) The black curable resin layer 10 is colored black. For coloring, it may preferably contain a black pigment or a black dye, more preferably a black pigment such as carbon black, titanium oxide, or iron oxide, and even more preferably carbon black. Since the black curable resin layer 10 is colored black, light shielding properties between the plurality of light emitting elements 21, 22, 23 of the substrate 2 with elements can be realized.

[0051] The particle size of the carbon black is preferably 10 to 500 nm, more preferably 10 to 300 nm, and even more preferably 10 to 100 nm. The particle size refers to the average particle size and can be determined by a measuring device using the dynamic light scattering method. Examples of the measuring device using the dynamic light scattering method include NANOTRAC WAVE II UT151 manufactured by Microtrac Bell Co., Ltd.

[0052] As the carbon black, one or more known carbon blacks such as gas black, channel black, furnace black, thermal black, and lamp black can be used. Also, resin-coated carbon black may be used. Further, carbon nanofibers and carbon nanotubes may be used.

[0053] Among the above carbon blacks, gas black has many surface functional groups and high dispersibility, so it is preferable in terms of exhibiting sufficient light-shielding properties with a small addition amount. Also, when the black curable resin layer 10 contains a modified elastomer having a functional group capable of reacting with an epoxy resin, the dispersibility is further enhanced by the interaction between the surface functional group of the gas black and the functional group of the modified elastomer having a functional group capable of reacting with the epoxy resin, and good light-shielding properties and coating solution stability can be ensured.

[0054] The compounding amount of the carbon black is preferably 0.05 to 15% by mass, more preferably 0.1 to 5% by mass, based on the total solid content of the black curable resin layer 10. When the compounding amount of the carbon black is equal to or more than the above lower limit value, sufficient light-shielding properties can be obtained. When the compounding amount of the carbon black is equal to or less than the above upper limit value, the thixotropy of the black curable resin layer 10 can be reduced and the fluidity of the black curable resin layer 10 during thermocompression bonding can be increased. Thereby, the black curable resin layer 10 can sufficiently fill the spaces between the plurality of light-emitting elements 21, 22, 23 of the substrate 2 with elements.

[0055] (Other components) The black curable resin layer 10 can contain an inorganic filler for improving flame retardancy, heat resistance, and adjusting the refractive index. The black curable resin layer 10 can further use, as necessary, resins other than epoxy resin and elastomer, thickeners, defoamers and / or leveling agents, adhesion promoters such as coupling agents, and flame retardants.

[0056] (2) Transparent curable resin layer The transparent curable resin layer 11 is a layer for sufficiently pushing the black curable resin layer 10 between a plurality of light-emitting elements 21, 22, and 23 disposed on the substrate 2 with elements in the subsequent crimping and filling steps. The transparent curable resin layer 11 is formed between the black curable resin layer 10 and a base material layer 12 described later.

[0057] [Filler] The transparent curable resin layer 11 contains a filler (not shown) in the curable resin composition described later. In this specification, the "filler" is not particularly limited as long as it does not prevent the light from reaching the viewer side, and among known inorganic fillers and / or organic fillers, suitable ones can be appropriately used. Preferably, it is at least one of silica, acrylic resin, polyurethane resin, and / or silicone resin, more preferably silica or acrylic resin, and even more preferably acrylic resin. When the filler is composed of these materials, the transparency of the transparent curable resin layer 11 is not excessively impaired, and a decrease in the total light transmittance can be suppressed. When used in a display, the vividness of the light emission of the light-emitting elements 21, 22, and 23 can be maintained while increasing the blackness at the time of non-light emission. In addition to or instead of the above-described preferred filler, carbon black may be used.

[0058] Since the transparent curable resin layer 11 contains a filler, external light incident from the outside to the substrate 20 side and reflected at the top surfaces of the light-emitting elements 21, 22, and 23 and the interface of the black curable resin layer 10 can be diffused. As a result, the external light is more likely to be absorbed by the black curable resin layer 10, so that the light confinement property of the integrated sealing sheet 1 is improved. Consequently, the blackness of the display at the time of non-light emission can be increased.

[0059] Also, by adding the filler, the light emitted by the light-emitting elements 21, 22, and 23 can also be diffused. As a result, even if the light-emitting elements 21, 22, and 23 are highly directional like LEDs, the light emitted from the light-emitting elements 21, 22, and 23 can be diffused, and the light can be output more uniformly. Consequently, color unevenness and brightness unevenness can be improved when used in the light-emitting electronic component 5.

[0060] The shape of the filler is not particularly limited, and fillers of any shape can be used. The shape of the filler may be, for example, amorphous particle shape, spherical shape, fibrous shape, or needle shape, and a spherical shape is particularly preferable.

[0061] When silica is used as the filler, the type of silica is not particularly limited, and various known silicas can be used. For example, amorphous silica, crystalline silica, etc. can be mentioned, and spherical silica is particularly preferable. Also, the surface of the filler may be surface-treated with a known surface treatment agent such as a silane coupling agent having a methacryl group, vinyl group, amino group, epoxy group, mercapto group, etc. Thereby, the dispersibility of the filler in the curable resin composition can be enhanced, and the total light transmittance and diffusibility can be controlled more effectively.

[0062] In the present application, the "acrylic resin" means a resin having an acrylic skeleton and / or a methacrylic skeleton. As the acrylic resin used for the filler, various known acrylic resins can be used, and examples include polymers of acrylic monomers such as acrylic acid esters or methacrylic acid esters, and copolymers of acrylic monomers and other monomers. Among them, specifically, polymethyl methacrylate resin (PMMA resin) can be exemplified. Among these acrylic resins, a plurality of types may be used in combination.

[0063] The "polyurethane resin" in the present application means a resin having a urethane bond in the molecule. As the polyurethane resin used for the filler, in addition to the urethane bond, there are a polyether type polyurethane resin containing an ether bond in the main chain, a polyester type polyurethane resin containing an ester bond in the main chain, and a polycarbonate type polyurethane resin containing a carbonate bond in the main chain. Among these polyurethane resins, a combination of multiple types may be used.

[0064] When using a silicone resin for the filler, various known silicone materials having a siloxane bond in the main chain and excluding silicone oil can be used.

[0065] The average particle diameter of the filler in the transparent curable resin layer 11 is not particularly limited as long as it does not prevent the light from reaching the viewer side, but is preferably 10 μm or less, more preferably 1 to 10 μm, even more preferably 1.5 to 7 μm, and even more preferably 1.8 to 6.2 μm. When the average particle diameter of the filler is within the above numerical range, a decrease in the total light transmittance of the transparent curable resin layer 11 can be suppressed, and it is difficult to prevent the light emitted from the light-emitting elements 21, 22, and 23 from transmitting through or the external light from reaching the black curable resin layer 10 when used in a display. In addition, appropriate diffusibility can be ensured, and the light confinement property can be enhanced, making it easier to increase the blackness degree when the light is turned off. In the present specification, the average particle diameter of the filler means the cumulative average diameter D 50 (median diameter) in the volume-based particle size distribution obtained by the laser diffraction / scattering method. Examples of the measuring device in the laser diffraction / scattering method include MT3300EXII manufactured by Microtrac Bell Co., Ltd.

[0066] The content of the filler in the transparent hardening resin layer 11 is not particularly limited as long as it does not prevent the light from reaching the viewer side, but it is preferably 100 parts by mass or less, more preferably 10 to 100 parts by mass, even more preferably 20 to 70 parts by mass, and particularly preferably 20 to 55 parts by mass with respect to 100 parts by mass of the total resin solid content of the transparent hardening resin layer 11. Within the above numerical range, the transparency of the transparent hardening resin layer 11 is not excessively impaired, and a decrease in the total light transmittance can be suppressed. Also, it is easy to ensure appropriate diffusibility of the filler.

[0067] [Total light transmittance] The total light transmittance in the hardened state of the transparent hardening resin layer 11 is higher than that of the black hardening resin layer 10. As described above, in the present application, the total light transmittance in the hardened state of the transparent hardening resin layer 11 is a value calculated by excluding the influence of the base material layer 12 alone. The total light transmittance is preferably adjusted to be 70 to 99%, more preferably 90 to 110%, even more preferably 95 to 105%, and particularly preferably 97 to 103%. When the total light transmittance is within the above numerical range, the light from the light emitting elements 21, 22, 23 can reach the viewer side without being hindered. Also, it is difficult to prevent external light from reaching the black hardening resin layer 10.

[0068] [Haze value] In the present application, the haze value in the hardened state of the transparent hardening resin layer 11 is calculated as follows. First, in advance, in accordance with JIS K 7136, the haze value of the base material layer 12 alone, which will be described later, is measured using a haze meter (for example, NDH5000 manufactured by Nippon Denshoku Industries Co., Ltd.). Next, a laminated sheet in which the hardened transparent hardening resin layer 11 (that is, the transparent resin layer 31) is laminated on the base material layer 12 is prepared, and the total light transmittance is measured in the same manner. From each of the obtained measurement values, a value excluding the influence of the base material layer 12 is calculated, and this value is taken as the haze value of the transparent hardening resin layer 11. The haze value is preferably 80% or more, more preferably 80 to 100%, even more preferably 85 to 100%, and still more preferably 90 to 100%. When the haze value is within the above numerical range, the light confinement property can be enhanced.

[0069] [Storage Elastic Modulus] The storage elastic modulus of the transparent curable resin layer 11 in the uncured state is preferably greater than that of the black curable resin layer 10. Similarly, at 100 °C and 150 °C, the storage elastic modulus of the transparent curable resin layer 11 is preferably greater than that of the black curable resin layer 10.

[0070] The storage elastic modulus of the transparent curable resin layer 11 is preferably greater than that of the black curable resin layer 10 at 100 to 150 °C. In addition, when the storage elastic modulus of the transparent curable resin layer 11 is greater than that of the black curable resin layer 10 at 100 °C and 150 °C, usually in the entire range of 100 to 150 °C, the storage elastic modulus of the transparent curable resin layer 11 is greater than that of the black curable resin layer 10.

[0071] The storage elastic modulus of the transparent curable resin layer 11 is preferably 1.0×10 3 Pa or more and 1.0×10 7 Pa or less at 100 °C, and more preferably 5.0×10 3 Pa or more and 5.0×10 5 Pa or less.

[0072] Since the storage elastic modulus of the transparent curable resin layer 11 at 100 °C is below the preferred upper limit value, an appropriate flexibility is obtained that does not prevent the flow of the black curable resin layer 10 during pressure bonding to the substrate 2 with elements. Also, the spaces between the plurality of light-emitting elements 21, 22, 23 can be sufficiently filled.

[0073] Since the storage elastic modulus of the transparent curable resin layer 11 at 100 °C is above the preferred lower limit value, the fluidity of the transparent curable resin layer 11 is suppressed, and the surface of the transparent curable resin layer 11 can be made smoother in accordance with the light-emitting elements 21, 22, 23 after thermocompression bonding. As a result, the appearance can be improved, and it is possible to hardly generate appearance defects such as the rejection phenomenon where recesses are formed on the layer surface during thermosetting.

[0074] The storage elastic modulus of the transparent curable resin layer 11 at 150°C is preferably 1.0×10 4 Pa or more, more preferably 1.0×10 4 Pa or more and 5.0×10 7 Pa or less, and even more preferably 1.0×10 5 Pa or more and 5.0×10 6 Pa or less. When the storage elastic modulus of the transparent curable resin layer 11 at 150°C is below the preferable upper limit value, cracks due to curing shrinkage are less likely to occur during thermosetting. When the storage elastic modulus of the transparent curable resin layer 11 at 150°C is above the preferable lower limit value, the flow during thermosetting of the transparent curable resin layer 11 can be suppressed, and appearance defects after curing such as repelling phenomenon can be suppressed. Furthermore, there is less likelihood of problems even when an etching process is performed in a subsequent process.

[0075] The storage elastic modulus of the transparent curable resin layer 11 at 100°C is preferably a value 10 to 1000 times that of the storage elastic modulus of the black curable resin layer 10, more preferably a value 30 to 500 times that of the storage elastic modulus of the black curable resin layer 10. The storage elastic modulus of the transparent curable resin layer 11 at 150°C is preferably a value 5 to 10000 times that of the storage elastic modulus of the black curable resin layer 10, more preferably a value 10 to 1000 times that of the storage elastic modulus of the black curable resin layer 10. Incidentally, when the storage elastic modulus of the transparent curable resin layer 11 is greater than that of the black curable resin layer 10 at 100°C and 150°C, generally in the entire range of 100 to 150°C, the storage elastic modulus of the transparent curable resin layer 11 is greater than that of the black curable resin layer 10.

[0076] The storage elastic modulus of the transparent curable resin layer 11 at 60°C after heat treatment at 120°C for 1 hour is preferably 7×10 8 Pa or more and 2×10 10It is below Pa. By having the storage elastic modulus below the preferable upper limit value, when cutting the edge of the substrate 20, cracks can be prevented in the cured transparent curable resin layer 11. Also, by having the storage elastic modulus above the preferable lower limit value, when cutting the edge of the substrate 20, deformation, expansion and contraction of the cured transparent curable resin layer 11 can be prevented. As a result, wavy distortion of the integrated sealing sheet 1 can be prevented at the edge side of the substrate 20.

[0077] [Curable resin composition] The transparent curable resin layer 11 is composed of a curable resin composition. Examples of the curable resin composition include a curable resin composition containing at least one resin selected from epoxy resins, acrylic resins, polyester resins, polyurethane resins and silicone resins and a curing agent, similar to the black curable resin layer 10. Among them, an epoxy resin composition is preferable because curability at low temperature can be realized and it is excellent in heat resistance and reliability. Further, the above-described filler is added to the curable resin composition of the transparent curable resin layer 11.

[0078] (Epoxy resin) Examples of the epoxy resin used for the transparent curable resin layer 11 include the same types as those of the black curable resin layer 10. From the viewpoint of imparting an appropriate pressure bonding viscosity to the transparent curable resin layer 11, the transparent curable resin layer 11 preferably contains a high molecular weight epoxy resin having a weight average molecular weight of 10,000 to 100,000. Also, from the viewpoint of good compatibility with other resin components and being able to be dissolved without mixing a solvent having a high boiling point that may remain in the integrated sealing sheet 1 after drying, the transparent curable resin layer 11 more preferably contains a high molecular weight epoxy resin having a weight average molecular weight of 10,000 to 35,000.

[0079] The transparent curable resin layer 11 contains a high molecular weight epoxy resin having a weight average molecular weight of 10,000 to 100,000, and thus has an appropriate viscosity when heated. Therefore, the storage elastic modulus in the range of 100 to 150°C of the transparent curable resin layer 11 can be adjusted to a preferable range. Since the high molecular weight epoxy resin has good compatibility with other epoxy resins, it is preferably a phenoxy resin.

[0080] Among epoxy resins, the phenoxy resin has a relatively large molecular weight and has an appropriate viscosity when heated. Therefore, the storage elastic modulus in the range of 100 to 150°C of the transparent curable resin layer 11 containing the phenoxy resin can be adjusted to a preferable range. In addition, unlike other thermoplastic resins such as polyester, the phenoxy resin can be cured as an epoxy resin. Therefore, the phenoxy resin increases the crosslinking density and does not impair the heat resistance of the cured product and the reliability of the performance for long-term use. From the viewpoint of ensuring the storage elastic modulus for pushing the black curable resin layer 10 during thermocompression bonding, the glass transition temperature of the phenoxy resin used in the transparent curable resin layer 11 is preferably 100°C or higher.

[0081] Specific examples of the phenoxy resin include, for example, "1256", "YX7200", "YX8100", "YX7180" manufactured by Mitsubishi Chemical Corporation, "YP-50", "YP-50S", "YP-70" manufactured by Nippon Steel Chemical & Material Co., Ltd., "N-690", "H-157", "EXA-192" manufactured by DIC Corporation, and the like.

[0082] The blending amount of the high molecular weight epoxy resin in the transparent curable resin layer 11 is preferably 30 to 80% by mass, more preferably 40 to 70% by mass, and even more preferably 45 to 60% by mass with respect to 100% by mass of the total resin solid content of the transparent curable resin layer 11. The preferable blending amount of the phenoxy resin in the transparent curable resin layer 11 is the same.

[0083] When the blending amount is within the above range, it becomes easy to control the storage elastic modulus. As a result, the storage elastic modulus for pushing the transparent curable resin layer 11 during thermocompression bonding can be ensured. Also, the flow during thermosetting can be suppressed, and appearance defects after curing such as repelling phenomena can be suppressed. Furthermore, even when an etching process is performed in a subsequent process, problems are less likely to occur. Also, the toughness is improved, and it becomes difficult for crack-like defects to occur during thermocompression bonding. Also, when it is below the above upper limit value, the crosslink density of the transparent curable resin layer 11 in the cured state can be increased, and the heat resistance and chemical resistance can be improved.

[0084] Furthermore, the epoxy resin used for the transparent curable resin layer 11 preferably contains a polyfunctional epoxy resin. By increasing the crosslink density, the polyfunctional epoxy resin further improves the stability of the performance of the cured product of the epoxy resin composition over long-term use and improves the heat resistance. Also, the viscosity of the polyfunctional epoxy resin is lower than that of the phenoxy resin in the range of 100 to 150°C. Therefore, by combining the polyfunctional epoxy resin and the phenoxy resin, the storage elastic modulus of the transparent curable resin layer 11 can be adjusted.

[0085] Specific examples of the polyfunctional epoxy resin include, for example, "YX7700", "157S70", "1032S60" manufactured by Mitsubishi Chemical Corporation, "NC7000L", "XD1000", "EOCN-1020" manufactured by Nippon Kayaku Co., Ltd., "ESN485" manufactured by Nippon Steel Chemical & Material Co., Ltd., "N-660", "N-690", "N-695", "HP-7200H" manufactured by DIC Corporation, and the like.

[0086] The blending amount of the polyfunctional epoxy resin in the transparent curable resin layer 11 is preferably 90% by mass or less, more preferably 10 to 80% by mass, and even more preferably 25 to 60% by mass with respect to 100% by mass of the total resin solid content of the transparent curable resin layer 11. If it is within the above range, the storage elastic modulus during thermocompression bonding of the transparent curable resin layer 11 can be controlled, and heat resistance and chemical resistance can be imparted in the cured state.

[0087] From the viewpoint of ensuring sufficient fluidity during thermocompression bonding, the transparent curable resin layer 11 preferably contains an epoxy resin having a softening point or melting point of 120°C or lower, and more preferably contains an epoxy resin having a softening point or melting point of 50 to 105°C from the viewpoints of handleability and heat resistance of the cured product. By including an epoxy resin having a softening point or melting point within the above range, it becomes possible to control the storage elastic modulus.

[0088] The blending amount of the entire epoxy resin in the transparent curable resin layer 11 is preferably 10 to 100% by mass, more preferably 30 to 99% by mass, and even more preferably 50 to 95% by mass with respect to 100% by mass of the total resin solids of the transparent curable resin layer 11. When it is within the above range, it is easy to control the storage elastic modulus. Thereby, the storage elastic modulus for pushing the black curable resin layer 10 during thermocompression bonding can be ensured. Also, when it is within the above range, the flow during thermosetting can be suppressed, and appearance defects after curing such as repulsion phenomenon can be suppressed. Furthermore, there is less likelihood of problems even when an etching process is performed in a subsequent process. Also, when it is at least the above lower limit value, the heat resistance is improved in the cured state.

[0089] (Elastomer) In addition to resins such as epoxy resin, the transparent curable resin layer 11 preferably contains an elastomer. By including an elastomer, it becomes easy to control the storage elastic modulus. Examples of the elastomer include the same types as those of the black curable resin layer 10. Among them, NBR is preferable for the following reasons. NBR has good compatibility with the epoxy resin. Also, the storage elastic modulus of the transparent curable resin layer 11 near 150°C can be increased, and as a result, the adhesion between the transparent curable resin layer 11 and the black curable resin layer 10 becomes good. The preferable weight average molecular weight of the elastomer is the same as that of the black curable resin layer 10.

[0090] In particular, when the transparent curable resin layer 11 is composed of an epoxy resin composition, it preferably contains a modified elastomer having a functional group capable of reacting with an epoxy group. The modified elastomer also acts as a curing agent for the epoxy resin. Further, since it can react and bond with the epoxy resin, it improves heat resistance and reliability against thermal shock. Furthermore, the difference in polarity between the functional group and the resin skeleton acts favorably on dispersibility. As a result, good dispersibility can be obtained when carbon black is contained in the transparent curable resin layer 11.

[0091] Examples of the functional group capable of reacting with an epoxy group include the same types as those of the black curable resin layer 10. Among them, an acid group or an acid anhydride group is preferable, and a carboxy group or a carboxylic acid anhydride group is particularly preferable because curing can be performed at a low temperature and a pot life can be ensured.

[0092] When the transparent curable resin layer 11 is composed of an epoxy resin composition, it particularly preferably contains a modified NBR having a carboxy group. Examples of the modified NBR having a carboxy group include the same types as those of the black curable resin layer 10. Two or more kinds of modified elastomers having a functional group capable of reacting with an epoxy group may be used in combination.

[0093] The blending amount of the elastomer in the transparent curable resin layer 11 is preferably 0 to 50% by mass, more preferably 1 to 50% by mass, and even more preferably 5 to 50% by mass with respect to 100% by mass of the total resin solid content of the transparent curable resin layer 11. When it is within the above range, the storage elastic modulus can be controlled. Further, when it is below the above upper limit value, a storage elastic modulus for pushing in the black curable resin layer 10 during thermocompression bonding can be ensured. Also, the flow during thermosetting can be suppressed, and appearance defects after curing such as repelling phenomena can be suppressed. Furthermore, there is little trouble even when an etching process is performed in a subsequent process. Also, when it is above the above lower limit value, the dispersibility of the filler becomes good. Furthermore, the film-forming property is improved, and the distribution of the film thickness when the epoxy resin composition is applied to form a film can be narrowed.

[0094] (Curing agent) When the transparent curable resin layer 11 is composed of an epoxy resin composition, it may contain a curing agent for other epoxy resins in addition to a modified elastomer having a functional group capable of reacting with an epoxy group. Examples of other curing agents include the same curing agents as those used for the black curable resin layer 10. Two or more other curing agents may be used in combination.

[0095] (Curing catalyst) When the transparent curable resin layer 11 is composed of an epoxy resin composition, it may contain a curing catalyst that promotes the curing reaction of the epoxy resin. Examples of the curing catalyst include the same curing catalysts as those used for the black curable resin layer 10, and the preferred embodiments are also the same.

[0096] The blending amount of the curing catalyst is preferably 0.01 to 5 parts by mass, more preferably 0.05 to 4 parts by mass, and even more preferably 0.1 to 3 parts by mass with respect to 100 parts by mass of the total resin solid content of the transparent curable resin layer 11. When within the above range, curing can proceed sufficiently and the pot life of the integrated sealing sheet 1 can be ensured. Two or more curing catalysts may be used in combination.

[0097] (Other components) The transparent curable resin layer 11 may contain a black pigment or a black dye in order to suppress light emission unevenness and color unevenness.

[0098] When the transparent curable resin layer 11 contains carbon black, the blending amount of carbon black is preferably less than 5 parts by mass, more preferably 1 part by mass or less, and even more preferably 0.1 part by mass or less with respect to 100 parts by mass of the total resin solid content. The transparent curable resin layer 11 may further contain, as necessary, resins other than epoxy resins and elastomers, thickeners, defoamers and / or leveling agents, adhesion promoters such as coupling agents, and flame retardants.

[0099] [Film thickness] The thickness of the transparent curable resin layer 11 is not particularly limited, and is preferably 10 to 250 μm, more preferably 20 to 225 μm, and even more preferably 25 to 150 μm.

[0100] (3) Substrate layer The substrate layer 12 is a layer for protecting a plurality of light-emitting elements 21, 22, and 23 from physical impacts, humidity, moisture, etc. from the outside. Further, the substrate layer 12 serves as a substrate for forming layers such as a black curable resin layer 10, a transparent curable resin layer 11, and a hard coat layer 15 described later. The substrate layer 12 is a cured layer.

[0101] [Total light transmittance] The total light transmittance of the substrate layer 12 can be measured using a haze meter or the like in accordance with JIS K 7361-1. The total light transmittance is preferably adjusted to be 30 to 99%, more preferably adjusted to be 35 to 95%, and even more preferably adjusted to be 40 to 95%. Since the total light transmittance of the substrate layer 12 is equal to or higher than the lower limit value, the arrival of light to the viewer side is not hindered.

[0102] [Storage elastic modulus] The storage elastic modulus of the substrate layer 12 at 60°C is preferably 7×10 8 Pa or more and 2×10 10 Pa or less, more preferably 1×10 9 Pa or more and 1×10 10 Pa or less, and even more preferably 2×10 9 Pa or more and 6×10 9 Pa or less. Since the storage elastic modulus of the substrate layer 12 at 60°C is equal to or lower than the preferable upper limit value, cracking of the substrate layer 12 can be reduced.

[0103] [Resin] The base material layer 12 may be composed of a thermoplastic resin or a thermosetting resin. Examples of the resin constituting the base material layer 12 include polyethylene terephthalate resin, polybutylene terephthalate resin, polyethylene 2,6-naphthalate resin, polyamide resin, polycarbonate resin, polycarbonate copolymer resin, triacetyl cellulose resin, polymethylpentene resin, phenoxy resin, syndiotactic polystyrene resin, polyimide resin, etc. From the viewpoints of heat resistance, weather resistance, availability, cost, etc., it is preferable to contain at least one resin selected from polyethylene terephthalate resin, polyethylene 2,6-naphthalate resin, polycarbonate resin, polycarbonate copolymer resin, and polyamide resin. By containing these resins, deformation during pressure bonding can be prevented. The base material layer 12 may contain a black pigment or a black dye in order to suppress light emission unevenness and color unevenness.

[0104] [Film thickness] The thickness of the base material layer 12 is preferably 10 to 250 μm, more preferably 20 to 225 μm, and even more preferably 25 to 150 μm. When the thickness of the base material layer 12 is equal to or greater than the preferable lower limit value, generation of wrinkles during thermocompression bonding the integrated sealing sheet 1 to a plurality of light emitting elements 21, 22, 23 can be suppressed, and the handleability can be improved. When the thickness of the base material layer 12 is equal to or less than the preferable upper limit value, visibility can be improved and the cost can be suppressed.

[0105] (4) Protective sheet The protective sheets 13 and 14 have the role of protecting the integrated sealing sheet 1. The protective sheet 13 can also be used as a sheet on which a coating liquid of a curable resin composition is applied when forming the integrated sealing sheet 1.

[0106] Examples of the protective sheets 13 and 14 include sheets made of thermoplastic resins such as polyethylene terephthalate and polyethylene naphthalate, polyimide, polyamideimide, polyethylene, polytetrafluoroethylene, polypropylene, and polystyrene, or surface-treated paper, etc.

[0107] Among these, from the viewpoints of heat resistance, mechanical strength, handleability, etc., a polyester sheet can be preferably used. The thickness of the protective sheets 13 and 14 is not particularly limited and is generally appropriately selected according to the application in the range of 10 to 150 μm. The surface of the protective sheet 13 on which the black curable resin layer 10 is provided may be subjected to a release treatment.

[0108] 2. Manufacturing method of the integrated sealing sheet To obtain the integrated sealing sheet 1, first, a coated and dried product (A) obtained by applying and drying a coating liquid of a curable resin composition for the black curable resin layer 10 on the protective sheet 13, and a coated and dried product (B) obtained by applying and drying a coating liquid of a curable resin composition for the transparent curable resin layer 11 containing a filler on the base material layer 12 are prepared.

[0109] Thereafter, by laminating the above (A) and (B) so that the transparent curable resin layer 11 and the black curable resin layer 10 are in contact with each other, a laminate in which the black curable resin layer 10, the transparent curable resin layer 11, and the base material layer 12 are sequentially laminated on the protective sheet 13 is obtained. A protective sheet 14 may be laminated on the outer surface of the base material layer 12 as required.

[0110] The coating liquid of the curable resin composition of the black curable resin layer 10 and / or the coating liquid of the curable resin composition of the transparent curable resin layer 11 preferably contains an organic solvent in an amount such that the viscosity allows for unobstructed coating. There are no particular restrictions on the organic solvent, and examples include ketones, aromatic hydrocarbons, glycol ethers, glycol ether acetates, esters, alcohols, aliphatic hydrocarbons, petroleum solvents, etc. Specifically, ketones such as methyl ethyl ketone, cyclohexanone, methyl butyl ketone, and methyl isobutyl ketone; aromatic hydrocarbons such as toluene, xylene, and tetramethylbenzene; glycol ethers such as cellosolve, methyl cellosolve, butyl cellosolve, carbitol, methyl carbitol, butyl carbitol, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monobutyl ether, propylene glycol monomethyl ether, dipropylene glycol monomethyl ether, dipropylene glycol diethyl ether, and triethylene glycol monoethyl ether; esters such as ethyl acetate, butyl acetate, isobutyl acetate, ethylene glycol monoethyl ether acetate, dipropylene glycol methyl ether acetate, propylene glycol methyl ether acetate, propylene glycol ethyl ether acetate, and propylene glycol butyl ether acetate; alcohols such as ethanol, propanol, 2-methoxypropanol, n-butanol, isobutyl alcohol, isopentyl alcohol, ethylene glycol, and propylene glycol; aliphatic hydrocarbons such as octane and decane; petroleum solvents such as petroleum ether, petroleum naphtha, hydrogenated petroleum naphtha, and solvent naphtha, as well as N,N-dimethylformamide (DMF), tetrachloroethylene, turpentine oil, etc. When adding carbon black to the coating liquid, carbon black powder may be added to the coating liquid, or a liquid in which carbon black is pre-dispersed (carbon black dispersion) may be added.

[0111] As a method for applying the above curable resin composition, for example, methods using various coaters such as a die coater, a gravure coater, a roll coater, a curtain flow coater, a spin coater, a bar coater, a reverse coater, a kiss coater, a fountain coater, a rod coater, an air doctor coater, a knife coater, a blade coater, a cast coater, and a screen coater can be mentioned. The drying temperature is preferably 60 to 160°C, more preferably 80 to 130°C, and even more preferably 90 to 120°C.

[0112] The temperature during lamination is preferably 20 to 120°C, more preferably 30 to 100°C, and even more preferably 40 to 80°C. By setting the temperature to be equal to or higher than the preferable lower limit value, an adhesive force that can be handled even when not cured can be ensured between the black curable resin layer 10 and the transparent curable resin layer 11. Also, by setting the temperature to be equal to or lower than the preferable upper limit value, entrapment of air bubbles between the black curable resin layer 10 and the transparent curable resin layer 11 and the generation of wrinkles on each of the layers 10 and 11 can be prevented. Lamination can be performed using, for example, a roll laminator, a press machine, a vacuum press machine, etc.

[0113] 3. Substrate with Elements As shown in FIG. 2, the substrate 2 with elements is one in which a plurality of light-emitting elements 21, 22, and 23 are arranged on a substrate 20. In FIG. 2 and the like, a portion where three light-emitting elements (light-emitting element 21, light-emitting element 22, and light-emitting element 23) are arranged is schematically shown.

[0114] The material of the substrate 20 is not limited, but a known printed circuit board can be preferably used. Examples of known printed circuit boards include glass epoxy substrates, fluororesin substrates, ceramic substrates, and glass substrates.

[0115] The light-emitting elements 21, 22, and 23 are typically light-emitting diodes. This embodiment is particularly suitable when the light-emitting elements 21, 22, and 23 are extremely small. For example, light-emitting diodes with a height of 1000 nm to 200 μm and a side length of 0.001 to 0.5 mm can be used. For the substrate 20 with elements for obtaining mini-LEDs or micro-LEDs, as the light-emitting elements 21, 22, and 23, light-emitting diodes of three colors, R, G, and B, or blue light-emitting diodes can be used. Also, the heights of the plurality of light-emitting elements 21, 22, and 23 on the substrate 20 are not limited to all being the same, and they may be individually different, preferably at least one place is different.

[0116] 4. Light-emitting electronic component and method for manufacturing the same The light-emitting electronic component 5 according to this embodiment includes a substrate 2 with a plurality of light-emitting elements 21, 22, and 23 disposed thereon, and an integrated sealing cured sheet 3 in a state of being pressure-bonded to the surface of the substrate 2 with the plurality of light-emitting elements 21, 22, and 23 disposed thereon.

[0117] The integrated sealing cured sheet 3 includes at least a black resin layer 30 capable of shielding light emitted from the plurality of light-emitting elements 21, 22, and 23, a transparent resin layer 31 having higher light transmittance than the black resin layer 30 and containing a filler, and a base material layer 12, and is laminated in the order of the black resin layer 30, the transparent resin layer 31, and the base material layer 12 from the side in contact with the substrate 2 with elements. The black resin layer 30 and the transparent resin layer 31 are cured layers obtained by thermally curing the black curable resin layer 10 and the transparent curable resin layer 11. That is, the integrated sealing cured sheet 3 is a sheet after curing the black curable resin layer 10 and the transparent curable resin layer 11 in the integrated sealing sheet 1.

[0118] The thickness of the transparent resin layer 31 is not particularly limited, but is preferably 0.1 to 5.0 times the height of the plurality of light-emitting elements 21, 22, and 23. The thickness of the black resin layer 30 is not particularly limited, but is preferably 0.1 to 0.9 times the height of the plurality of light-emitting elements 21, 22, and 23.

[0119] (Luminance transmittance) In this application, the "luminance transmittance" is the transmittance calculated from the luminance of the light-emitting elements 21, 22, and 23 on the substrate 2 with elements before and after the pressure bonding of the integrated sealing cured sheet 3. Specifically, the luminance transmittance is the luminance when the light-emitting elements 21, 22, and 23 on the substrate 2 with elements before the pressure bonding of the integrated sealing cured sheet 3 are lit (hereinafter also referred to as the luminance before mounting), and the luminance when the light-emitting electronic component 5 is lit (hereinafter also referred to as the luminance after mounting). Then, each measured value is substituted into the following formula (I) for calculation. That is, it is calculated by dividing the value of the luminance after mounting by the value of the luminance before mounting. The luminance transmittance is preferably 70% or more, more preferably 70 to 95%, and even more preferably 75 to 93%. Luminance transmittance (%) = (luminance after pressure bonding / luminance before pressure bonding) × 100 ··· (I)

[0120] The manufacturing method of the light-emitting electronic component according to this embodiment is a method including a step of pressure bonding the black curable resin layer 10 side of the above integrated sealing sheet 1 to the surface on which the plurality of light-emitting elements 21, 22, and 23 are arranged on the substrate 2 with elements in which the plurality of light-emitting elements 21, 22, and 23 are arranged (hereinafter referred to as the pressure bonding step), a step of filling at least a part of the black curable resin layer 10 and the transparent curable resin layer 11 between the plurality of light-emitting elements 21, 22, and 23 (hereinafter referred to as the filling step), and a step of curing the black curable resin layer 10 and the transparent curable resin layer 11 (hereinafter referred to as the curing step). Hereinafter, with reference to FIGS. 2 to 4, a manufacturing method of a light-emitting electronic component according to an embodiment (simply referred to as "manufacturing method according to an embodiment") will be described.

[0121] (i) Pressure bonding step In the manufacturing method of this embodiment, first, the protective sheet 13 is peeled off so that the black curable resin layer 10 is exposed, and as shown in FIG. 3, the pressure bonding of the integrated sealing sheet 1 with the black curable resin layer 10 in contact with the surface on which the light-emitting elements 21, 22, and 23 of the substrate 2 with elements are arranged is started.

[0122] Before pressure bonding, the thickness of the black curable resin layer 10 is preferably 10 to 95% with respect to the height of the light-emitting elements 21, 22, and 23. The above lower limit is more preferably 15% or more, and even more preferably 30% or more. Also, the above upper limit is more preferably 85% or less, and even more preferably 75% or less.

[0123] When the thickness of the black curable resin layer 10 is 10% or more with respect to the height of the light-emitting elements 21, 22, and 23, the function of blocking light between the light-emitting elements 21, 22, and 23 becomes sufficient. Also, when the storage elastic modulus of the black curable resin layer 10 is relatively low and the layer 10 is rich in fluidity, the resin can be sufficiently filled between the light-emitting elements 21, 22, and 23. When the thickness of the black curable resin layer 10 is 15% or more with respect to the height of the light-emitting elements 21, 22, and 23, even when the fluidity of the transparent curable resin layer 11 is relatively low, surface crack-like defects are less likely to occur. When the thickness of the black curable resin layer 10 is 30% or more with respect to the height of the light-emitting elements 21, 22, and 23, the black curable resin layer 10 having a light-blocking function can be appropriately filled between the light-emitting elements 21, 22, and 23.

[0124] If the thickness of the black curable resin layer 10 is 95% or less with respect to the height of the light-emitting elements 21, 22, and 23, leakage of the black curable resin layer 10 to the outside during thermocompression bonding can be prevented, and it is difficult for the light from the light-emitting elements 21, 22, and 23 to reach the viewer side. When the thickness of the black curable resin layer 10 is 85% or less with respect to the height of the light-emitting elements 21, 22, and 23, unevenness in the film thickness of the black curable resin layer 10 that has flowed after pressing is less likely to occur, and uneven blackness is less likely to occur. If the thickness of the black curable resin layer 10 is 75% or less with respect to the height of the light-emitting elements 21, 22, and 23, the black curable resin layer 10 having a light-blocking function can be appropriately filled between the light-emitting elements 21, 22, and 23.

[0125] Before pressure bonding, the thickness of the transparent curable resin layer 11 is preferably 10 to 500% with respect to the height of the light-emitting elements 21, 22, and 23. The above lower limit is more preferably 20% or more, and even more preferably 30% or more. Also, the above upper limit is more preferably 200% or less, and even more preferably 150% or less.

[0126] When the thickness of the transparent curable resin layer 11 is 10% or more with respect to the height of the light-emitting elements 21, 22, and 23, it easily functions as a sealing layer covering the light-emitting elements 21, 22, and 23. Further, when the storage elastic modulus of the transparent curable resin layer 11 is relatively high and the fluidity of the layer 11 is suppressed, during thermosetting, it is possible to suppress the transparent curable resin layer 11 from flowing together with the black curable resin layer 10, and it is difficult for appearance defects to occur on the surface. When the thickness of the transparent curable resin layer 11 is 20% or more with respect to the height of the light-emitting elements 21, 22, and 23, the range allowing the flow of the transparent curable resin layer 11 is sufficient and it is difficult for crack-like defects to occur on the surface. When the thickness of the transparent curable resin layer 11 is 30% or more with respect to the height of the light-emitting elements 21, 22, and 23, the transparent curable resin layer 11 easily functions as a sealing layer covering the light-emitting elements 21, 22, and 23. Further, when the storage elastic modulus of the transparent curable resin layer 11 is relatively high and the fluidity of the layer 11 is suppressed, the transparent curable resin layer 11 can sufficiently push in the black curable resin layer 10.

[0127] The total thickness of the black curable resin layer 10 and the transparent curable resin layer 11 before pressure bonding is preferably 110 to 550% with respect to the height of the light-emitting elements 21, 22, and 23. If the total thickness is equal to or greater than the above lower limit value with respect to the height of the light-emitting elements 21, 22, and 23, a part of the integral sealing sheet 1 can be sufficiently embedded between the light-emitting elements 21, 22, and 23. If the total thickness is equal to or less than the above upper limit value with respect to the height of the light-emitting elements 21, 22, and 23, it is difficult to generate thickness unevenness during pressure bonding, and it is difficult for appearance defects to occur on the surface.

[0128] The ratio of the thickness of the black curable resin layer 10 before pressure bonding to the total thickness of the transparent curable resin layer 11 and the black curable resin layer 10 before pressure bonding is preferably 10 to 90%, more preferably 15 to 70%. If the ratio of the thickness is equal to or greater than the above lower limit value, the blackness can be increased and the contrast of the display can be sufficiently improved. If the ratio of the thickness is equal to or less than the above upper limit value, it is difficult for the black curable resin layer 10 to remain on the light-emitting elements 21, 22, and 23 during pressure bonding, and the luminance can be sufficiently improved.

[0129] (ii) Filling process Next, continue the pressure bonding and embed at least a part of the black curable resin layer 10 and the transparent curable resin layer 11 of the integrated sealing sheet 1 between the light emitting elements 21, 22, and 23 as shown in Fig. 3. At this time, the black curable resin layer 10 and the transparent curable resin layer 11 are filled between the plurality of light emitting elements 21, 22, and 23. At this time, if the storage elastic modulus of the black curable resin layer 10 is relatively low and the fluidity of the layer 10 is ensured, the black curable resin layer 10 easily follows the unevenness caused by the light emitting elements 21, 22, and 23 and is easily filled between the light emitting elements 21, 22, and 23.

[0130] The temperature in the thermocompression bonding is preferably 80 to 120°C, more preferably 90 to 110°C. By setting the temperature to 80°C or higher, it is easy to ensure the fluidity of the black curable resin layer 10 of the integrated sealing sheet 1. Also, by setting the temperature to 120°C or lower, it is difficult to damage the light emitting elements 21, 22, and 23. By setting the temperature to 90 to 110°C, the fluidity of the black curable resin layer 10 can be controlled more precisely, and the occurrence of unevenness and crack-like defects can be suppressed.

[0131] The pressure in the thermocompression bonding is 0.05 to 5.0 MPa, preferably 0.05 to 1.0 MPa, more preferably 0.1 to 0.5 MPa. By setting the pressure to be equal to or higher than the preferable lower limit value, the black curable resin layer 10 can be sufficiently filled between the light emitting elements 21, 22, and 23. By setting the pressure to be equal to or lower than the preferable upper limit value, it is difficult to damage the light emitting elements 21, 22, and 23. The thermocompression bonding is preferably performed using a vacuum press machine capable of molding in a vacuum state. Thereby, it is easy to avoid defects caused by air being mixed into the obtained light emitting electronic component 5.

[0132] (iii) Curing process After pressure bonding, as shown in FIG. 4, after peeling off the protective sheet 14, it is thermally cured, and the black curable resin layer 10 and the transparent curable resin layer 11 of the integrated sealing sheet 1 are made into a black resin layer 30 (cured layer of the black curable resin layer 10) and a transparent resin layer 31 (cured layer of the transparent curable resin layer 11), whereby the light-emitting electronic component 5 is obtained.

[0133] The curing temperature is preferably 100 to 160°C, more preferably 110 to 150°C. By setting the curing temperature to 100°C or higher, the black curable resin layer 10 and the transparent curable resin layer 11 of the integrated sealing sheet 1 can be surely cured. By setting the curing temperature to 110°C or higher, the curing time of the black curable resin layer 10 and the transparent curable resin layer 11 can be shortened. Also, by setting the curing temperature to be equal to or lower than the above upper limit temperature, it is difficult to damage the light-emitting elements 21, 22, 23.

[0134] The curing time depends on the curing temperature, but is preferably 30 to 360 minutes, more preferably 45 to 180 minutes. At the curing temperature, when the storage elastic modulus of the transparent curable resin layer 11 is relatively high and the fluidity of the same layer 11 is suppressed, defective appearance after curing of the black curable resin layer 10 and the transparent curable resin layer 11 can be suppressed.

[0135] As described above, through the steps shown in FIGS. 2 to 4, on the surface of the element-mounted substrate 2 on which the plurality of light-emitting elements 21, 22, 23 are arranged on the substrate 20, the light-emitting electronic component 5 in which the integrated sealing curable sheet 3 is pressure-bonded is obtained. In the obtained light-emitting electronic component 5, the black curable resin layer 10 and the transparent curable resin layer 11 are cured and have become the black resin layer 30 and the transparent resin layer 31. At least a part of the black resin layer 30 and the transparent resin layer 31 is filled between the plurality of light-emitting elements 21, 22, 23.

[0136] (Second Embodiment) Next, the second embodiment will be described. For parts common to the first embodiment, the same reference numerals will be given and the description will be omitted. FIG. 5 shows a cross-sectional view equivalent to FIG. 1 of an integrated sealing sheet according to another embodiment. FIG. 6 shows a cross-sectional view equivalent to FIG. 1 of a light-emitting electronic component according to another embodiment manufactured using the integrated sealing sheet of FIG. 5.

[0137] 1. Integrated Sealing Sheet The integrated sealing sheet 1a according to another embodiment further includes a hard coat layer 15 on the surface opposite to the surface in contact with the transparent curable resin layer 11 of the base material layer 12. Hereinafter, the hard coat layer will be described.

[0138] (5) Hard Coat Layer The hard coat layer 15 is formed on the surface of the base material layer 12 opposite to the surface on which the transparent curable resin layer 11 is formed. The hard coat layer 15 has an anti-scratch effect on the base material layer 12 and is a layer for protecting the light-emitting electronic component 5 from being damaged. The hard coat layer 15 is a cured layer.

[0139] [Hardness] The pencil hardness of the surface of the hard coat layer 15 is preferably H or more, more preferably 2H or more, and even more preferably 3H or more.

[0140] [Surface Roughness] The arithmetic surface roughness (Ra) of the surface of the hard coat layer 15 is preferably 0.1 to 1 μm, more preferably 0.2 to 1 μm, and even more preferably 0.3 to 1 μm. When the Ra of the hard coat layer 15 is equal to or higher than the preferable lower limit value, the reflectance of the surface of the hard coat layer 15 can be reduced. When the Ra of the hard coat layer 15 is equal to or lower than the preferable upper limit value, the manufacturing can be facilitated.

[0141] [Total Light Transmittance] The hard coat layer 15 is preferably prepared so that the total light transmittance is 30 to 99%, more preferably 50 to 99%, and even more preferably 60 to 99%. Since the total light transmittance of the hard coat layer 15 is equal to or higher than the lower limit value, it does not prevent the light from reaching the viewer side.

[0142] [Resin] The hard coat layer 15 may be composed of either a thermoplastic resin or a thermosetting resin, and is preferably composed of a thermosetting resin. Examples of the thermosetting resin constituting the hard coat layer 15 include acrylic resins, polyurethane resins, silicone resins, melamine resins, etc., and one or more of these can be included. The hard coat layer 15 may contain a black pigment or dye.

[0143] [Fine particles] The hard coat layer 15 preferably contains fine particles. As the fine particles, one or both of inorganic fine particles and organic fine particles can be used. Examples of the inorganic fine particles include silica fine particles and titanium fine particles. Examples of the organic fine particles include polymethyl methacrylate resin (PMMA resin) and polyurethane resin. Among them, silica fine particles are preferred. By containing fine particles, the surface roughness of the hard coat layer 15 can be adjusted and the surface hardness can be improved.

[0144] [Film thickness] The thickness of the hard coat layer 15 is preferably 1 to 20 μm, more preferably 2 to 10 μm, and even more preferably 3 to 8 μm. Since the thickness of the hard coat layer 15 is equal to or higher than the preferred lower limit value, sufficient hardness can be ensured. Since the thickness of the hard coat layer 15 is equal to or lower than the preferred upper limit value, problems such as curling do not occur.

[0145] 2. Manufacturing method of the integrated sealing sheet In order to obtain the integrated sealing sheet 1a according to this embodiment, a coating liquid of a curable resin composition for the black curable resin layer 10 is applied and dried on, for example, the protective sheet 13 obtained in the same manner as in the first embodiment, and on the surface of the substrate layer 12 opposite to the hard coat layer 15, a coating liquid of a curable resin composition for the transparent curable resin layer 11 is applied and dried. Thereafter, the lamination method and the like are the same as those in the above-described first embodiment.

[0146] The one in which the hard coat layer 15 is formed on the substrate layer 12 is obtained by applying a coating agent for the hard coat layer 15 on the surface of the substrate layer 12 and curing it. Examples of the coating method of the coating agent include various coaters such as a die coater, a gravure coater, a roll coater, a curtain flow coater, a spin coater, a bar coater, a reverse coater, a kiss coater, a fountain coater, a rod coater, an air doctor coater, a knife coater, a blade coater, a cast coater, and a screen coater. Examples of the curing method of the coating agent include heat curing, ultraviolet curing, and electron beam curing.

[0147] As a result of lamination, a laminate in which the black curable resin layer 10, the transparent curable resin layer 11, the substrate layer 12, and the hard coat layer 15 are sequentially laminated is obtained on the protective sheet 13. A protective sheet 14 may be laminated on the outer surface of the hard coat layer 15 as required.

[0148] 3. Substrate with Element The substrate 2 with an element is the same as that in the above-described first embodiment.

[0149] 4. Light-Emitting Electronic Component and Method for Manufacturing the Same The light-emitting electronic component 5a according to this embodiment includes a substrate 2 with a plurality of light-emitting elements 21, 22, and 23 disposed thereon, and an integral sealing cured sheet 3a in a state of being pressure-bonded to the surface of the substrate 2 with elements where the plurality of light-emitting elements 21, 22, and 23 are disposed. The integral sealing cured sheet 3a includes at least a black resin layer 30 capable of blocking light emitted from the plurality of light-emitting elements 21, 22, and 23, a transparent resin layer 31 having higher light transmittance than the black resin layer 30 and containing a filler, a base material layer 12, and a hard coat layer 15, and is laminated in the order of the black resin layer 30, the transparent resin layer 31, the base material layer 12, and the hard coat layer 15 from the side in contact with the substrate 2 with elements.

[0150] The manufacturing method of the light-emitting electronic component 5a according to this embodiment is the same as that of the above-described first embodiment.

Example

[0151] Hereinafter, the present invention will be specifically described with reference to examples. However, the present invention is not limited to these examples.

[0152] <Raw material> Details of the raw materials used in each example and comparative example are as follows.

[0153] [Epoxy resin for curable resin layer] · HP-7200H: Manufactured by DIC Corporation, a cyclopentadiene novolak type polyfunctional epoxy resin (solid), softening point 82°C, epoxy equivalent 227 g / eq. · jER (registered trademark) YX7200B35: Manufactured by Mitsubishi Chemical Corporation, a phenoxy resin (MEK solution, solid content 35% by mass), glass transition temperature 150°C, epoxy equivalent 8781 g / eq., weight average molecular weight 30,000. · EOCN 1020-55: Manufactured by Nippon Kayaku Co., Ltd., an o-cresol novolak type epoxy resin, solid, softening point 55°C, epoxy equivalent 194 g / eq.

[0154] [Elastomer] · NX775: Manufactured by Nippon Zeon Co., Ltd., carboxy-modified nitrile rubber, weight-average molecular weight 208,000.

[0155] [Curing catalyst] · 2PZ-CN: Manufactured by Shikoku Kasei Co., Ltd., 1-cyanoethyl-2-phenylimidazole.

[0156] [Carbon black] · Special Black #4: Manufactured by ORION ENGINEERED CARBONS, gas black.

[0157] [Solvent] · MEK: Manufactured by Junsei Chemical Co., Ltd., methyl ethyl ketone. · PGM: Manufactured by Junsei Chemical Co., Ltd., propylene glycol monomethyl ether.

[0158] [Filler for transparent curable resin layer] · 20SM-C6: Manufactured by Admatechs Co., Ltd., silica, average particle diameter 2.0 μm, surface-treated with a methacryl group-containing silane coupling agent. · MR-1HG: Manufactured by Soken Chemical & Engineering Co., Ltd., acrylic, average particle diameter 1.2 μm. · MZ-5HN: Manufactured by Soken Chemical & Engineering Co., Ltd., acrylic, average particle diameter 4.5 μm. · MR-7GC: Manufactured by Soken Chemical & Engineering Co., Ltd., acrylic, average particle diameter 6.1 μm. · MX-500L: Manufactured by Soken Chemical & Engineering Co., Ltd., acrylic, average particle diameter 6.3 μm.

[0159] [PET film for base material layer] · Cosmo Shine (registered trademark) A4300: Manufactured by Toyobo Co., Ltd., PET film, thickness 75 μm.

[0160] [Protective sheet] · 1-E: Manufactured by Nippa Co., Ltd., release film, thickness 50 μm.

[0161] [Preparation of coating liquid for curable resin layer] Coating liquids for the black hardenable resin layer and the transparent hardenable resin layer were prepared with the compositions described below. Specifically, the compositions described below were mixed in a solvent of MEK / PGM = 80 / 20 (volume ratio) to prepare a coating liquid for the black hardenable resin layer with a solid content concentration of 35% by mass and a coating liquid for the transparent hardenable resin layer with a solid content concentration of 40% by mass. The compositions described are in parts by mass based on the solid content of each material.

[0162] [Coating Liquid for Black Hardenable Resin Layer] · HP7200H (70 parts by mass) · NX775 (30 parts by mass) · 2PZ-CN (3 parts by mass) · Special Black #4 (4 parts by mass)

[0163] [Coating Liquid for Transparent Hardenable Resin Layer] · EOCN 1020-55 (50 parts by mass) · YX7200B35 (30 parts by mass) · NX775 (20 parts by mass) · 2PZ-CN (3 parts by mass) · Filler (see Tables 1 and 2 below.)

[0164]

Table 1

[0165]

Table 2

[0166] <Example 1> [Preparation of Transparent Hardenable Resin Layer] A coating liquid for the transparent hardenable resin layer was applied to the surface of A4300, which is a base material layer, using a film applicator with a film thickness adjustment function (manufactured by All Good Co., Ltd.) so that the dry film thickness was 30 μm. At this time, 20 parts by mass of 20SM-C6 was added to the filler in the coating liquid. It was dried at 120°C for 5 minutes to obtain a transparent layer laminated sheet in which the base material layer and the transparent hardenable resin layer were laminated in this order.

[0167] [Preparation of Black Hardening Resin Layer] On the release surface of release PET 1-E (manufactured by Nippa, 50 μm), a coating liquid for a black hardening resin layer was applied using a film applicator with a film thickness adjustment function (manufactured by All Good) so that the dry film thickness became 50 μm. It was dried at 120°C for 5 minutes to obtain a black layer laminated sheet in which the black hardening resin layer was supported by release PET.

[0168] [Fabrication of Integrated Sealing Sheet] The obtained transparent layer laminated sheet and black layer laminated sheet were overlapped so that the transparent hardening resin layer and the black hardening resin layer were in contact with each other, and laminated with a roll laminator at 60°C to obtain the integrated sealing sheet of Example 1.

[0169] [Substrate with Evaluation Element] A substrate on which a plurality of LED light-emitting elements with a size of 0.1 × 0.2 mm and a height of 65 μm were arranged on an epoxy glass substrate was used as a substrate with an evaluation element. The substrate with the evaluation element was used for the measurement of the pre-mounting luminance in the luminance transmittance described later.

[0170] [Manufacture of Light-Emitting Electronic Component] The release PET of the integrated sealing sheet of each example was peeled off, and the black hardening resin layer was arranged so as to be in contact with the LED light-emitting element of the substrate with the evaluation element. Then, between the light-emitting elements, the black hardening resin layer and the transparent hardening resin layer were filled under the conditions of a vacuum degree of 100 hPa, 100°C, 0.36 MPa, and 3 minutes using a vacuum press machine. After filling, it was heated in an oven at 120°C for 1 hour to thermally cure the black hardening resin layer and the transparent hardening resin layer to obtain a light-emitting electronic component. The light-emitting electronic component was used for the measurement of the post-mounting luminance in the luminance transmittance described later.

[0171] <Example 2> The same procedure as in Example 1 was carried out except that the filler for the transparent hardening resin layer was changed to MR-1HG (20 parts by mass).

[0172] <Example 3> The same procedure as in Example 1 was carried out except that the filler for the transparent hardening resin layer was changed to MZ-5HN (20 parts by mass).

[0173] <Example 4> The same procedure as in Example 1 was carried out, except that the filler for the transparent curable resin layer was changed to MR-7GC (20 parts by mass).

[0174] <Example 5> The same procedure as in Example 1 was carried out, except that the filler for the transparent curable resin layer was changed to MX-500L (20 parts by mass).

[0175] <Example 6> The same procedure as in Example 1 was carried out, except that the filler for the transparent curable resin layer was changed to MZ-5HN (50 parts by mass).

[0176] <Example 7> The same procedure as in Example 1 was carried out, except that the filler for the transparent curable resin layer was changed to MR-7GC (50 parts by mass).

[0177] <Example 8> The same procedure as in Example 1 was carried out, except that the filler for the transparent curable resin layer was changed to MX-500L (50 parts by mass).

[0178] <Comparative Example 1> The same procedure as in Example 1 was carried out, except that no filler was added to the transparent curable resin layer.

[0179] <Evaluation Method> [Measurement of Total Light Transmittance and Haze Value] The transparent layer laminated sheets according to each of the above Examples and Comparative Example 1 were heated in an oven at 120°C for 1 hour to obtain measurement sheets in which the transparent curable resin layer was thermally cured. Using a haze meter (manufactured by Nippon Denshoku Industries Co., Ltd., NDH5000), the total light transmittance and haze value were measured for each measurement sheet in accordance with JIS K 7361-1 and JIS K 7136. Similarly, the total light transmittance and haze value were measured for the substrate layer (A4300) alone. Values calculated by excluding the influence of the substrate layer (A4300) from the measured values of each measurement sheet are shown in Tables 3 to 4 below.

[0180] [Measurement of L* value] Regarding the integrated sealing sheets according to each of the examples and comparative examples obtained as described above, in accordance with JIS Z 8781-4, using a color difference meter CR-5 manufactured by Konica Minolta, the L* value was measured from the substrate layer side by the D65 light source, 2° field of view, reflection method, and SCE method. The measurement results are shown in Tables 3 to 4 below.

[0181] [Measurement of Y value] Regarding the integrated sealing sheets according to each of the examples and comparative examples obtained as described above, in accordance with JIS Z 8722, using a color difference meter CR-5 manufactured by Konica Minolta, the Y value in the Yxy color system was measured from the substrate layer side by the D65 light source, 2° field of view, reflection method, and SCE method. The measurement results are shown in Tables 3 to 4 below.

[0182] [Calculation of luminance transmittance] The luminance of the light-emitting element on the substrate with the evaluation element before crimping and filling the integrated sealing sheet was measured as the pre-mounting luminance using a luminance meter CA-410 manufactured by Konica Minolta. Also, the luminance of the light-emitting element of the light-emitting type electronic component was measured as the post-mounting luminance in the same manner. The luminance transmittance was calculated by the following formula (I). The calculated luminance transmittance is shown in Tables 3 to 4 below. Luminance transmittance (%) = (post-mounting luminance / pre-mounting luminance) × 100 ··· (I)

[0183] [Table 3]

[0184] [Table 4]

[0185] The integrated sealing sheet according to each embodiment had a higher haze value than that of Comparative Example 1, i.e., the sheet according to the conventional product. On the other hand, the indexes representing brightness such as the luminance transmittance, total light transmittance, L* value, and Y value were not inferior to those of the conventional product. Therefore, by adding a filler to the transparent curable resin layer, the haze value could be significantly increased while maintaining the brightness. As a result, the integrated sealing sheet according to the present application can improve the light confinement property and enhance the blackness when the display is turned off.

Industrial Applicability

[0186] The integrated sealing sheet according to the present invention can be used, for example, as a sheet for sealing from above a substrate on which a plurality of light-emitting elements are arranged.

Explanation of Reference Numerals

[0187] 1, 1a... integrated sealing sheet; 2... substrate with elements; 3, 3a... cured sheet for integrated sealing; 5, 5a... light-emitting electronic components; 10... black curable resin layer; 11... transparent curable resin layer; 12... base material layer; 13, 14... protective sheets; 15... hard coat layer; 20... substrate; 21, 22, 23... light-emitting elements; 30... black resin layer; 31... transparent resin layer.

Claims

1. An integrated sealing sheet for crimping onto the surface of a substrate with a plurality of light-emitting elements disposed thereon, on which surface the plurality of light-emitting elements are disposed, comprising: at least a black curable resin layer capable of blocking light emitted from the plurality of light-emitting elements, a transparent curable resin layer having higher light transmittance than the black curable resin layer, and a base material layer; the transparent curable resin layer is disposed between the black curable resin layer and the base material layer; the integrated sealing sheet in which the transparent curable resin layer contains a filler.

2. The integrated sealing sheet according to claim 1, wherein the material of the filler is at least one of silica, acrylic resin, polyurethane resin, and / or silicone resin.

3. The integrated sealing sheet according to claim 1, wherein the average particle diameter of the filler is 10 μm or less.

4. The integrated sealing sheet according to claim 1, wherein the addition amount of the filler is 100 parts by mass or less with respect to 100 parts by mass of the total resin solid content of the transparent curable resin layer.

5. The integrated sealing sheet according to claim 1, wherein the base material layer further comprises a hard coat layer on the surface opposite to the surface in contact with the transparent curable resin layer.

6. The integrated sealing sheet according to claim 1, wherein the total light transmittance in the cured state of the black curable resin layer is 0 to 30%, and the total light transmittance in the cured state of the transparent curable resin layer is 70 to 99%.

7. The integrated sealing sheet according to claim 6, wherein the total light transmittance in the cured state of the transparent curable resin layer is 90 to 110%.

8. The integrated sealing sheet according to claim 1, wherein the haze value in the cured state of the transparent curable resin layer is 80% or more.

9. The integrated sealing sheet according to claim 8, wherein the haze value in the cured state of the transparent curable resin layer is 90 to 100%.

10. The integrated sealing sheet according to claim 1, wherein the storage elastic modulus at 100 °C in the uncured state of the transparent curable resin layer is higher than the storage elastic modulus at 100 °C in the uncured state of the black curable resin layer.

11. The integrated sealing sheet according to claim 1, wherein the ratio of the thickness of the black curable resin layer before crimping to the total thickness of the transparent curable resin layer and the black curable resin layer before crimping is 10 to 90%.

12. A substrate with a plurality of light-emitting elements disposed thereon, and an integrated sealing cured sheet crimped onto the surface of the substrate with the plurality of light-emitting elements disposed thereon. The integrated sealing hardening sheet includes at least a black resin layer capable of shielding light emitted from the plurality of light-emitting elements, a transparent resin layer having higher light transmittance than the black resin layer, and a base material layer, and from the side in contact with the substrate with elements, they are laminated in the order of the black resin layer, the transparent resin layer, and the base material layer. The light-emitting electronic component in which the transparent resin layer contains a filler.

13. The thickness of the transparent resin layer is 0.1 to 5.0 times the height of the plurality of light-emitting elements. The light-emitting electronic component according to claim 12, wherein the thickness of the black resin layer is 0.1 to 0.9 times the height of the plurality of light-emitting elements.

14. A step of crimping the integrated sealing sheet according to any one of claims 1 to 11 onto the surface of the substrate with elements on which the plurality of light-emitting elements are arranged, of the substrate with elements on which the plurality of light-emitting elements are arranged. A step of filling at least a part of the black curable resin layer and the transparent curable resin layer between the plurality of light-emitting elements. A method for manufacturing a light-emitting electronic component, including a step of curing the black curable resin layer and the transparent curable resin layer.

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