Substrate conveyance device and substrate processing device including the same

Abstract

To provide a substrate conveyance device capable of suppressing lowering of throughput caused by position correction in conveyance.SOLUTION: When a substrate W is held on a first hand 33, the outer peripheral surface of the substrate W is sandwiched by all guides 67, and the central position of the held substrate W is calculated as a current central position CPN, on the basis of position information obtained at this point. A control part calculates a difference DF between a reference center position CPR and a current center position CPN of the substrate W on the first hand 33, which are previously set. When the substrate W is delivered, a horizontal driving mechanism 57 is operated according to the difference DF, and the position where the first hand 33 is advanced is corrected. Therefore, when the substrate W is held on the first hand 33, the difference DF required for correcting the position when the substrate W is delivered can be calculated. As the result, lowering of throughput caused by position correction in conveyance can be suppressed.SELECTED DRAWING: Figure 19

Description

Technical Field

[0001] The present invention relates to a substrate transfer device for transferring substrates such as semiconductor substrates, substrates for flat panel displays (FPDs) such as liquid crystal display and organic EL (Electroluminescence) display devices, glass substrates for photomasks, and substrates for optical disks, and a substrate processing device including the same.

Background Art

[0002] Conventionally, as this type of device, there is one including a transfer mechanism, a measurement unit, and a control unit (see, for example, Patent Document 1).

[0003] The transfer mechanism includes a holding unit that holds a substrate and transfers the substrate. The measurement unit is disposed on the carry-in / carry-out side of the processing chamber that is the delivery destination. The measurement unit detects the outer edge of the substrate transferred by the transfer mechanism and measures the center position of the substrate. The control unit controls the transfer mechanism. The control unit corrects the target position based on the deviation amount between the center position of the substrate and the center position of the holding unit, and controls the transfer mechanism so that the reference position of the holding unit becomes the corrected target position.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, in the case of the conventional example having such a configuration, there are the following problems. That is, in the conventional apparatus, the transport mechanism needs to pass through the measurement unit in order to determine the center position of the substrate. Therefore, the center position of the substrate is calculated based on the measurement result after the transport mechanism has passed through the measurement unit, and the target position is corrected based on the calculation result before transporting the substrate. As a result, there is a problem that the throughput decreases due to the position correction during transportation.

[0006] The present invention has been made in view of such circumstances, and an object thereof is to provide a substrate transport apparatus capable of suppressing a decrease in throughput caused by position correction during transport, and a substrate processing apparatus including the same.

Means for Solving the Problems

[0007] In order to achieve such an object, the present invention has the following configuration. That is, the invention according to claim 1 is a substrate transport apparatus for transporting a substrate, including a hand that holds the substrate in a horizontal posture, a horizontal drive mechanism that drives the hand to move forward and backward in a horizontal plane for delivering the substrate, at least three guides provided on the hand that sandwich the outer peripheral surface of the substrate and hold the substrate separated from the hand, a forward and backward drive mechanism that drives the at least three guides to move forward and backward with respect to the substrate, when holding the substrate with the hand, the forward and backward drive mechanism is operated to grip the outer peripheral surface of the substrate with all the guides, and based on the position information obtained from the forward and backward drive mechanism, the center position of the held substrate is calculated as the current center position, a difference between the reference center position of the substrate on the hand set in advance and the current center position is calculated, and when delivering the substrate held by the hand, a control unit that corrects the position where the hand advances by operating the horizontal drive mechanism according to the difference.

[0008] [Function and Effect] According to the invention described in claim 1, when the control unit holds the substrate by hand, it operates the advancing and retracting drive mechanism to grip the outer peripheral surface of the substrate with all the guides. At this time, based on the position information obtained from the advancing and retracting drive mechanism, it calculates the central position of the held substrate as the current central position. The control unit calculates the difference between the reference central position of the substrate on the hand set in advance and the current central position. When the control unit transfers the substrate held by the hand, it corrects the position where the hand advances by operating the horizontal drive mechanism according to the difference. Therefore, when the substrate is held by the hand, the difference required for position correction at the time of substrate transfer can be calculated. As a result, a decrease in throughput caused by position correction during conveyance can be suppressed.

[0009] Further, in the present invention, it further includes an outer peripheral surface detector for detecting that at least three of the guides have contacted the outer peripheral surface of the substrate. It is preferable that the control unit calculates the current central position when the outer peripheral surface detector detects that each guide has contacted the outer peripheral surface of the substrate (claim 2).

[0010] The control unit can accurately determine that each guide has contacted the outer peripheral surface of the substrate by the outer peripheral surface detector. Therefore, when the outer peripheral surface detector detects the outer peripheral surface of the substrate, the control unit can calculate the current central position based on the position information obtained from the advancing and retracting drive mechanism. As a result, the current central position can be accurately calculated. Also, the distance by which each guide pushes the outer peripheral surface of the substrate to move the substrate can be minimized. As a result, rubbing of the substrate during clamping can be suppressed, so generation of particles can be suppressed.

[0011] Further, in the present invention, it is preferable that the outer peripheral surface detector is a tactile sensor having a detection surface capable of detecting the forces applied to each of the three orthogonal axes (claim 3).

[0012] Regardless of the posture when the outer peripheral surface of the substrate contacts the guide, the reaction force received by the guide from the outer peripheral surface of the substrate can be detected. Therefore, it can accurately detect that the guide has contacted the outer peripheral surface of the substrate.

[0013] Further, in the present invention, the reciprocating drive mechanism includes a motor that reciprocally drives the guide, a drive circuit that applies a drive current for driving the motor, and an encoder that detects the rotational position of the motor. The outer peripheral surface detector includes at least one of a drive current detector that detects the contact based on the drive current information of the drive circuit and a position information detector that detects the contact based on the position information output from the encoder. The control unit preferably detects the contact based on at least one of the drive current detector and the position information detector (Claim 4).

[0014] The control unit determines that the guide has come into contact with the outer peripheral surface of the substrate based on at least one of the drive current information from the drive current detector and the position information from the encoder. Therefore, it is not necessary to provide a sensor for detecting that the guide and the outer peripheral surface of the substrate are in contact. As a result, the structure can be simplified and the cost can be reduced.

[0015] Further, in the present invention, it is preferable that the outer peripheral surface detector is provided at a mounting portion of the guide to the hand (Claim 5).

[0016] Since the outer peripheral surface detector is provided at the mounting portion of the guide to the hand, the reaction force received from the substrate can be detected with high sensitivity. Therefore, it is possible to accurately detect that the guide has come into contact with the outer peripheral surface of the substrate.

[0017] Further, in the present invention, it is preferable that the guide has a cylindrical shape (Claim 6).

[0018] When the substrate has a circular shape, the cylindrical guide and the outer peripheral surface of the substrate are in point contact. Therefore, the contact area can be minimized, and mutual contamination through the guide can be suppressed.

[0019] In the present invention, it is also preferable that the substrate transfer device described above and a processing unit that performs a predetermined process on the substrate, the processing unit having a placement unit on which the substrate to be processed is placed and that exchanges the substrate with the hand, are provided (Claim 7).

[0020] When transferring the substrate between the processing unit, it is possible to quickly perform position correction when placing the substrate on the placement unit. Therefore, in the substrate processing apparatus, it is possible to accurately place the substrate on the placement unit while suppressing a decrease in throughput.

Advantages of the Invention

[0021] According to the substrate transfer device according to the present invention, when the control unit holds the substrate with the hand, it operates the forward and backward drive mechanism to grip the outer peripheral surface of the substrate with all the guides, and calculates the center position of the held substrate as the current center position based on the position information obtained from the forward and backward drive mechanism at this time. The control unit calculates the difference between the reference center position of the substrate on the hand set in advance and the current center position. When the control unit transfers the substrate held by the hand, it corrects the position where the hand advances by operating the horizontal drive mechanism according to the difference. Therefore, at the time when the substrate is held by the hand, the difference necessary for position correction at the time of substrate transfer can be calculated. As a result, it is possible to suppress a decrease in throughput due to position correction during transfer.

Brief Description of the Drawings

[0022]

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Embodiments for Carrying Out the Invention

[0023] The present invention will be described below with reference to various examples.

Example

[0024] Hereinafter, Example 1 of the present invention will be described with reference to the drawings.

[0025] FIG. 1 is a plan view showing the overall configuration of the substrate processing apparatus according to Example 1. FIG. 2 is a view of the substrate processing apparatus in FIG. 1 as seen from the rear X.

[0026] <1. Overall Configuration>

[0027] The substrate processing apparatus 1 includes a loading / unloading block 3, an index block 5, and a processing block 7.

[0028] The substrate processing apparatus 1 processes the substrate W. The substrate processing apparatus 1 performs, for example, a cleaning process on the substrate W. The substrate processing apparatus 1 processes the substrate W in a single-wafer type in the processing block 7. The single-wafer type processes one substrate W one by one in a horizontal posture. The substrate W is, for example, circular in plan view.

[0029] In this specification, for convenience, the direction in which the loading / unloading block 3, the index block 5, and the processing block 7 are arranged in line is referred to as the "front-rear direction X". The front-rear direction X is horizontal. Among the front-rear direction X, the direction from the processing block 7 towards the loading / unloading block 3 is referred to as "front". The direction opposite to the front is referred to as "rear". The horizontal direction orthogonal to the front-rear direction X is referred to as the "width direction Y". One direction of the "width direction Y" is appropriately referred to as "right". The direction opposite to the right is referred to as "left". The direction perpendicular to the horizontal direction is referred to as the "vertical direction Z". In each figure, for reference, front, rear, right, left, top, and bottom are appropriately shown.

[0030] <2. Loading / Unloading Block>

[0031] The loading / unloading block 3 includes a loading section 9 and an unloading section 11. The loading section 9 and the unloading section 11 are arranged in the width direction Y. A plurality of substrates W (for example, 25 sheets) are stacked and stored horizontally at regular intervals within a single carrier C in a horizontal posture. The carrier C containing the unprocessed substrates W is placed on the loading section 9. The loading section 9 includes, for example, two mounting tables 13 on which the carrier C is placed. The carrier C has a plurality of grooves (not shown) formed therein for accommodating the substrates W one by one while separating the surfaces of the substrates W from each other. The carrier C accommodates, for example, with the surface of the substrate W facing upward. Examples of the carrier C include a FOUP (Front Opening Unify Pod). A FOUP is a sealed container. The carrier C may be an open container, regardless of the type.

[0032] The unloading section 11 is arranged on the opposite side of the loading section 9 across the central portion in the width direction Y in the substrate processing apparatus 1. The unloading section 11 is arranged to the left Y of the loading section 9. The unloading section 11 stores the processed substrates W in the carrier C and discharges the entire carrier C. The unloading section 11 that functions in this way includes, like the loading section 9, for example, two mounting tables 13 for mounting the carrier C. The loading section 9 and the unloading section 11 are also referred to as load ports.

[0033] <3. Index Block>

[0034] The index block 5 is arranged adjacent to the rear X of the loading / unloading block 3 in the substrate processing apparatus 1. The index block 5 includes an index robot IR and a delivery unit 15.

[0035] The index robot IR is configured to be rotatable around the vertical direction Z. The index robot IR is configured to be movable in the width direction Y. The index robot IR includes a first hand 19 and a second hand 21. In FIG. 1, only one hand is shown for the sake of illustration. The first hand 19 and the second hand 21 hold the substrate W in a horizontal posture. The first hand 19 and the second hand 21 sandwich the outer peripheral surface of the substrate W and hold the substrate W separated from the upper surfaces of the first hand 19 and the second hand 21.

[0036] The first hand 19 and the second hand 21 each hold one substrate W. The first hand 19 and the second hand 21 are each configured to be independently movable forward and backward in the front-rear direction X. The index robot IR moves in the width direction Y and rotates around the vertical direction Z, and advances and retreats the first hand 19 and the second hand 21 to transfer the substrate W to and from each carrier C. Similarly, the index robot IR transfers the substrate W to and from the delivery unit 15.

[0037] The delivery unit 15 is arranged at the boundary of the index block 5 with the processing block 7. The delivery unit 15 is arranged, for example, at the central portion in the width direction Y. As shown in FIG. 2, the delivery unit 15 is formed long in the vertical direction Z.

[0038] The delivery unit 15 includes a first inversion unit 23, a path unit 25, a path unit 27, and a second inversion unit 29 from bottom to top in the vertical direction Z.

[0039] The first inversion unit 23 inverts the top and bottom of the substrate W received from the index block 5. The first inversion unit 23 inverts the horizontal posture of the substrate W. Specifically, the first inversion unit 23 converts the substrate W with its surface facing upward into a posture with its surface facing downward. In other words, the posture of the substrate W is converted so that its back surface faces upward.

[0040] The second inversion unit 29 performs the reverse operation. That is, the second inversion unit 29 inverts the top and bottom of the substrate W received from the processing block 7. The second inversion unit 29 converts the substrate W with its surface facing downward into a posture with its surface facing upward. In other words, the posture of the substrate W is converted so that its back surface faces downward.

[0041] The inversion directions of the above-mentioned first inversion unit 23 and second inversion unit 29 may be opposite to each other. That is, the first inversion unit 23 converts the posture of the substrate W so that its surface faces upward. The second inversion unit 29 converts the posture of the substrate W so that its back surface faces upward.

[0042] The path portions 25, 27 are used to transfer the substrate W between the index block 5 and the processing block 7. The path portion 25 is used, for example, to convey the substrate W from the processing block 7 to the index block 5. The path portion 27 is used, for example, to convey the substrate W from the index block 5 to the processing block 7. Note that the conveyance directions of the substrate W in the path portions 25, 27 may be opposite to each other.

[0043] <4. Processing Block>

[0044] The processing block 7 performs various processes on the substrate W, for example. Examples of the process include a cleaning process. The cleaning process is, for example, a process liquid cleaning process that supplies only the cleaning liquid or a brush cleaning process that uses a brush in addition to the process liquid.

[0045] As shown in FIG. 1, processing block 7 is divided into, for example, a first column R1, a second column R2, and a third column R3 in the width direction Y. Specifically, the first column R1 is arranged on the left side in the Y direction. The second column R2 is arranged at the center in the width direction Y. In other words, the second column R2 is arranged on the right side in the Y direction of the first column R1. The third column R3 is arranged on the right side in the Y direction of the second column R2.

[0046] <4-1. First column>

[0047] The first column R1 of the processing block 7 includes a plurality of processing units 31. The first column R1 includes, for example, four processing units 31. The four processing units 31 of the first column R1 are arranged in a stacked manner in the vertical direction Z. Each processing unit 31 is, for example, a cleaning unit. The cleaning unit performs a cleaning process on the substrate W. As the cleaning unit, there are a surface cleaning unit that cleans the surface of the substrate W and a back surface cleaning unit that cleans the back surface of the substrate W. In this embodiment, the back surface cleaning unit SSR is taken as an example to explain the processing unit 31.

[0048] <4-2. Second column>

[0049] The second column R2 of the processing block 7 includes a center robot CR. The center robot CR is configured to be rotatable around the vertical direction Z. The center robot CR is configured to be movable up and down in the vertical direction Z. The center robot CR includes, for example, a first hand 33 and a second hand 35. The first hand 33 and the second hand 35 each hold one substrate W. The first hand 33 and the second hand 35 are each configured to be independently movable back and forth in the front-rear direction X and the width direction Y.

[0050] The first hand 33 and the second hand 35 hold the substrate W in a horizontal posture. The first hand 33 and the second hand 35 sandwich the outer peripheral surface of the substrate W and hold the substrate W separated from the upper surfaces of the first hand 33 and the second hand 35.

[0051] <4-3. Third column>

[0052] The third column R3 of the processing block 7 has the same configuration as the first column R1. That is, the third column R3 includes a plurality of processing units 31. The third column R3 includes, for example, four processing units 31. The four processing units 31 of the third column R3 are stacked and arranged in the vertical direction Z. Each processing unit 31 of the first column R1 and each processing unit 31 of the third column R3 are arranged to face each other in the width direction Y. Thereby, the center robot CR can access each of the opposing processing units 31 of the first column R1 and the third column R3 at the same height in the vertical direction Z.

[0053] The processing block 7 is configured as described above. Here, an operation example of the center robot CR will be briefly described. The center robot CR receives the substrate W from, for example, the first inversion unit 23. The center robot CR transports the substrate W to the back surface cleaning unit SSR of either the first column R1 or the third column R3 to cause the back surface of the substrate W to be cleaned. The center robot CR receives the substrate W that has been cleaned by the back surface cleaning unit SSR of either the first column R1 or the third column R. The center robot CR transports the substrate W to the second inversion unit 29. The index robot IR receives the substrate W from the second inversion unit 29 and stores it in the carrier C.

[0054] <5. Mounting Table>

[0055] Here, with reference to FIGS. 1 and 3, the above-described three loading / unloading blocks will be described in detail. FIGS. 3(a) to (e) are side views showing the configuration and operation of the loading / unloading blocks.

[0056] The loading / unloading block 3 includes a mounting table 13, an opening 39, and a lid opening / closing mechanism 41. The mounting table 13 is where the carrier C is placed. The mounting table 13 is provided with a mechanism (not shown) for moving the carrier C in the front-rear direction X. The mounting table 13 can move the carrier C forward and backward with respect to the opening 39. The carrier C has a loading / unloading port CT. The loading / unloading port CT is formed on one side surface of the carrier C. A plurality of substrates W stacked and accommodated in the carrier C are loaded / unloaded through the loading / unloading port CT. The carrier C includes a lid CL. The lid CL is detachably configured at the loading / unloading port CT of the carrier C. The lid CL seals the inside of the carrier C. When the lid CL is attached to the carrier C, the atmosphere inside the carrier C is blocked from the outside.

[0057] The lid opening / closing mechanism 41 includes a detaching / attaching unit 43 in the forward direction X. The detaching / attaching unit 43 removes the lid CL from the carrier C or attaches the lid CL to the carrier C. The detaching / attaching unit 43 can move in the vertical direction Z and the front-rear direction X while holding the lid CL. The lid opening / closing mechanism 41 can move in the front-rear direction X at the opening 39 while holding the lid CL. The lid opening / closing mechanism 41 can move up and down in the vertical direction Z while holding the lid CL. The lid opening / closing mechanism 41 can move downward in the vertical direction Z from the opening 39 while holding the lid CL. By descending while holding the lid CL, the lid opening / closing mechanism 41 can fully open the opening 39.

[0058] First, as shown in Fig. 3(a), the carrier C is placed on the mounting table 13. The carrier C contains a plurality of substrates W stacked and is closed by the lid CL. At this time, the lid opening / closing mechanism 41 positions the detaching / attaching unit 43 at the opening 39. Thereby, the inside of the index block 5 is separated from the external atmosphere.

[0059] As shown in Fig. 3(b), the mounting table 13 moves the carrier C rearward in the X direction. The carrier C is positioned such that the loading outlet CT and the lid CL are located at the opening 39. At this time, the attachment / detachment unit 43 releases the lock of the lid CL and holds the lid CL. The holding is performed, for example, by the attachment / detachment unit 43 sucking the lid CL.

[0060] As shown in Fig. 3(c), the lid opening / closing mechanism 41 moves rearward in the X direction. As a result, the lid CL is moved rearward in the X direction from the opening 39. The lid CL is moved inside the index block 5.

[0061] As shown in Fig. 3(d), the lid opening / closing mechanism 41 moves downward in the vertical direction Z. The lid opening / closing mechanism 41 lowers the attachment / detachment unit 43 to the lower part of the loading outlet CT. The lid opening / closing mechanism 41 lowers the attachment / detachment unit 43 until the upper part of the attachment / detachment unit 43 is positioned below the lower part of the opening 39.

[0062] As shown in Fig. 3(d), the lid opening / closing mechanism 41 moves downward in the vertical direction Z. The lid opening / closing mechanism 41 lowers the attachment / detachment unit 43 to the lower part of the loading outlet CT. The lid opening / closing mechanism 41 lowers the attachment / detachment unit 43 until the upper part of the attachment / detachment unit 43 is positioned below the lower part of the opening 39.

[0063] As shown in Fig. 3(e), the lid opening / closing mechanism 41 moves downward in the vertical direction Z and moves to the lowermost position where the lid opening / closing mechanism 41 can move. The lid opening / closing mechanism 41 lowers the attachment / detachment unit 43 to a position where it does not overlap with the opening 39 in the front-rear direction X. As a result, the opening 39 is fully opened. The plurality of substrates W in the carrier C can face the index block 5 through the opening 39.

[0064] The above-described lid opening / closing mechanism 41 is provided with, for example, a substrate sensor 45 in the attachment / detachment unit 43. The substrate sensor 45 is used to detect the position of the substrate W stacked and stored in the carrier C or to collect shape information based on the outer edge of the substrate W. The shape information includes information regarding the thickness based on the outer edge of the substrate W.

[0065] <6. Mounting part>

[0066] Here, referring to FIGS. 4 and 5, a part of the above-described processing unit 31 will be described. FIG. 4 is a side view showing a first example of the mounting part provided in the processing unit. FIG. 5 is a side view showing a second example of the mounting part provided in the processing unit.

[0067] The above-described processing unit 31 is assumed to be the back surface cleaning unit SSR. Such a back surface cleaning unit SSR is provided with, for example, one of two types of mounting parts 47 (mounting parts 47A and 47B) as described below. The mounting part 47 is a place where the substrate W is mounted in the back surface cleaning unit SSR. The mounting part 47 supports the lower surface of the substrate W. In addition to such two types of mounting parts 47 (mounting parts 47A and 47B), there is also a mounting part that holds the substrate W by suction.

[0068] As shown in FIG. 4, the mounting part 47A includes a turntable 49 and support pins 51. The turntable 49 has a circular shape in plan view. The turntable 49 has a diameter slightly larger than that of the substrate W. There are a plurality of support pins 51. The support pins 51 are erected on the upper surface of the turntable 49. The support pins 51 are arranged on the upper surface slightly inside the outer peripheral surface of the turntable 49. Some of the support pins 51 rotate eccentrically around the axis in the vertical direction Z. The substrate W is pressed horizontally from the outer peripheral surface by the support pins 51 that rotate in this way, and the position is fixed by the plurality of support pins 51. The support pins 51 abut against the outer peripheral surface and the lower surface of the substrate W, and support the lower surface of the substrate W so as to be separated from the upper surface of the turntable 49.

[0069] Here, the distance between the upper surface of the turntable 49 and the lower surface of the substrate W supported by the support pins 51 is referred to as clearance CL1. The mounting part 47A in this first example has a relatively large clearance CL1. The clearance CL1 is larger than the thickness DP of the first hand 33 and the second hand 35. The thickness DP corresponds to the maximum height in the vertical direction Z when the part that enters the position where the substrate W is transferred among the first hand 33 and the second hand 35 is viewed from the side.

[0070] In the cleaning unit SSR provided with such a mounting portion 47A, it is preferable to access it with the take-down hand described later. Note that in the mounting portion 47A, it is also possible to access it with the take-up hand described later.

[0071] The above-described mounting portion 47A has a target center position when transferring the substrate W. Here, this center position is referred to as the mounting center position RV1. The mounting center position RV1 is determined in advance by design. In FIG. 4, only the mounting center position RV1 is shown in a side view, but in a plan view, the mounting center position RV1 coincides with the position of the rotation center of the turntable 49. Ideally, the substrate W is mounted on the mounting position center RV1 so that the center position of the substrate W coincides. In the center robot CR, it is common to set the center positions of the first hand 33 and the second hand 35 to coincide with the mounting center position RV1 by teaching. Such transfer teaching is generally performed on the premise that the center position of the substrate W coincides with the center position serving as the teaching reference in the first hand 33 and the second hand 35.

[0072] Note that although the mounting center position RV1 is the center position in design, it may vary due to assembly errors or over time. Therefore, the mounting center position RV1 may be rewritten to a new value during maintenance of the substrate processing apparatus 1 or the like.

[0073] As shown in FIG. 5, the mounting portion 47B includes a turntable 53 and support protrusions 55. The turntable 53 has a circular shape in plan view. The turntable 53 is provided with an injection port (not shown) for supplying gas to the lower surface of the substrate W. The support protrusions 55 are formed on the upper surface of the turntable 53. There are a plurality of support protrusions 55. The support protrusions 55 are formed slightly inside the outer peripheral surface of the turntable 53. The support protrusions 55 abut against the lower surface of the substrate W and support the lower surface of the substrate W while being separated from the upper surface of the turntable 53. The substrate W is supported so as to be attracted to the support protrusions 55 and the turntable 53 by the negative pressure generated by the supply of gas. Thereby, the position of the substrate W is fixed. The clearance CL2 of this mounting portion 47B is relatively small. The clearance CL2 is smaller than the clearance CL1. The clearance CL2 is smaller than the thickness DP of the first hand 33 and the second hand 35.

[0074] In the cleaning unit SSR provided with such a mounting portion 47B, it is preferable to access with the pick-up hand described later.

[0075] Similar to the above-described mounting portion 47A, the above-described mounting portion 47B has a mounting center position RV2. The mounting center position RV2 is the design center position in the mounting portion 47B. In FIG. 5, only the reference center position CPR2 is shown in side view, but in plan view, it coincides with the position of the rotation center of the turntable 53. When teaching the center robot CR, the center position serving as a reference for the first hand 33 and the second hand 35 is made to coincide with the mounting center position RV2.

[0076] Note that the mounting center position RV2 may also vary in the same manner as the mounting center position RV1, and thus may be rewritten to a new value during maintenance of the substrate processing apparatus 1 or the like.

[0077] <7. Details of the Hand>

[0078] Here, with reference to FIGS. 6 to 9, the first hand 33 in the center robot CR will be described as an example. FIG. 6 is a plan view of the take-off hand according to the first embodiment. FIG. 7 is a side view of the hand according to the first embodiment. FIG. 8 is a longitudinal sectional view showing the configuration of the movable guide on the tip side. FIG. 9 is a longitudinal sectional view showing the configuration of the movable guide (pusher) on the base end side. Note that the configuration of the first hand 33 is the same as that of the second hand 35, the first hand 19 and the second hand 21 in the index robot IR.

[0079] The center robot CR includes a horizontal drive mechanism 57. The horizontal movement mechanism 57 drives the first hand 19 in the front-rear direction X. The horizontal movement mechanism 57 drives the first hand 33 to advance and retreat in a horizontal plane including the width direction Y together with the front-rear direction X. The horizontal movement mechanism 57 drives the first hand 33 to advance and retreat with respect to the delivery destination. Specifically, the delivery destinations in the center robot CR are the delivery unit 15 and the processing unit 31. Note that the horizontal movement mechanism 57 in the index robot IR drives the first hand 19 and the second hand 21 to advance and retreat with respect to the front-rear direction X.

[0080] The first hand 33 includes one palm portion 59 and two finger portions 61. The palm portion 59 is on the base end side of the first hand 19. The finger portion 61 is on the tip end side of the first hand 33. It enters from the tip end side of the first hand 33 with respect to the delivery destination and exits from the base end side of the first hand 33. The palm portion 59 includes a mounting base end portion 63 and a finger portion mounting portion 65. The mounting base end portion 63 is attached to the horizontal drive mechanism 57. The finger portion 61 is attached to the finger portion mounting portion 65. The finger portion mounting portions 65 are provided at two positions spaced apart in the width direction Y. The portions where the two finger portions 61 of the finger portion mounting portion 65 are attached are located outside the outer peripheral surface of the substrate W in a plan view when the first hand 33 advances to the position where it delivers the substrate W. In other words, the finger portion 61 has a length in the front-rear direction X that is longer than the diameter of the substrate W.

[0081] The first hand 33 has two finger portions 61. The two finger portions 61 extend in the front-rear direction X. The two finger portions 61 are spaced apart from each other in the width direction Y. The distance by which the two finger portions 61 are spaced apart from each other does not exceed the diameter of the substrate W. In other words, the width direction Y of the two finger portions 61 falls within the diameter of the substrate W. The base end side of the finger portions 61 is attached to the finger portion attachment portion 65. The tip side of the finger portions 61, which is opposite to the base end side, is in an open state. The first hand 33 has a U-shape in a plan view with the palm portion 59 and the two finger portions 61.

[0082] The first hand 33 is equipped with three guides 67. The first hand 33 has three guides 67 attached to its upper surface. The finger portion 61 is equipped with one guide 67 on the tip side. A structure in which the guide 67 is attached to the upper surface of the finger portion 61, like this first hand 33, is called a "trade-in hand." The first hand 33, which has a trade-in hand structure, holds the substrate W by scooping it up from below.

[0083] As shown in Fig. 8, the guide 67 of the finger portion 61 is attached to a guide hole 69. The guide hole 69 is long in the front-rear direction X. A moving piece 71 is disposed at the bottom of the guide hole 69. The moving piece 71 is movable only in the front-rear direction X at the bottom of the guide hole 69. A tactile sensor 73 is attached to the moving piece 71. The tactile sensor 73 is attached to the upper surface of the moving piece 71.

[0084] The tactile sensor 73 has a detection surface 75 that can detect the forces applied to each of the three mutually orthogonal axes. The tactile sensor 73 is attached to the moving piece 71 in a posture where the detection surface 75 is directed upward. A guide 67 is attached to the detection surface 75. The bottom of the guide 67 is attached to the detection surface 75. The tactile sensor 73 can detect the force applied to the guide 67 in each of the three axial directions. The tactile sensor 73 detects the forces applied in the front-rear direction X, the width direction Y, and the vertical direction Z. The tactile sensor 73 outputs an electrical signal corresponding to each of the forces detected in the three axial directions.

[0085] In the finger portion 61, a lateral hole 77 is formed in the front-rear direction X from the guide hole 69. The lateral hole 77 penetrates to the palm portion 59. A servo motor 79 is provided at a location in the palm portion 59 corresponding to the end of the lateral hole 77. The servo motor 79 includes an encoder 81. The encoder 81 detects the rotational position (rotation angle) of the rotation shaft of the servo motor 79 and outputs it as position information as an electrical signal. A ball screw 83 is inserted into the lateral hole 77. One end side of the ball screw 83 is connected to the rotation shaft of the servo motor 79. The moving piece 71 is screwed to the other end side of the ball screw 83. When the servo motor 79 is rotationally driven, the ball screw 83 is rotated, and the moving piece 71 moves in the front-rear direction X along the guide hole 69. As a result, the guide 67 moves in the front-rear direction X.

[0086] As shown in FIG. 9, the palm portion 59 includes a pusher 87. The pusher 87 includes one guide 67. The pusher 87 has the same configuration as the configuration for driving the guide 67 of the finger portion 61, except for the pusher arm 89 and the guide hole 91.

[0087] That is, the pusher 87 includes a tactile sensor 73, a lateral hole 77, a ball screw 83, a servo motor 79, an encoder 81, and a pusher arm 89. One end side of the lateral hole 77 penetrates the side surface on the finger part 61 side. A guide hole 91 is formed on the finger part 61 side of the lateral hole 77. The guide hole 91 has a larger dimension in the vertical direction Z than the lateral hole 77. A part of the pusher arm 89 is inserted into the guide hole 91 so as to be movable in the front-rear direction X. The other end side of the lateral hole 77 is blocked inside the palm part 59. A servo motor 79 is arranged on the other end side of the lateral hole 77. The servo motor 79 includes an encoder 81. One end side of a ball screw 83 is connected to the rotating shaft of the servo motor 79. The pusher arm 89 is screwed to the other end side of the ball screw 83. The pusher arm 89 includes a tactile sensor 73 on the side opposite to the servo motor 79 in the front-rear direction X. A guide 67 is attached to the detection surface 75 of the tactile sensor 73.

[0088] Each of the above-described guides 67 is configured to be movable by a predetermined distance in the front-rear direction X. Each of the above-described guides 67 is movable, for example, by a distance of about 5 mm in the front-rear direction X.

[0089] The first hand 33 includes three guides 67 on the upper surface. The first hand 33 holds the substrate W in a state where the lower surface of the substrate W is spaced upward from the upper surface of the finger part 61. Specifically, the outer peripheral surface of the substrate W is clamped by the three guides 67, and the lower surface of the substrate W is held in a floating state from the upper surface of the finger part 61. The first hand 33 holds the substrate W in a state where it is in contact with only the outer peripheral surface of the substrate W. The first hand 33 moves the three guides 67 toward the outer peripheral surface of the substrate W, thereby clamping the outer peripheral surface of the substrate W with the three guides 67 and holding the substrate W in a state where it is separated from the upper surface of the finger part 61.

[0090] The first hand 33 includes three guides 67 on the upper surface, but it may be configured as shown in FIG. 10. FIG. 10 is a side view of the pick-up hand according to the embodiment.

[0091] Unlike the first hand 33, three guides 67 are attached to the lower surface of the first hand 33D. Specifically, each of the two finger portions 61 has one guide 67 on the lower surface at the tip side. The palm portion 59 has one guide 67 on the lower surface at the tip side. This first hand 33D is referred to as the "lifting hand". The first hand 33D, which has the structure of the lifting hand, holds the substrate W by entering from above and further lifting it upward.

[0092] As shown in FIGS. 6 to 8, the above-described first hand 33 has a reference center position CPR. The reference center position CPR is preset. The reference center position CPR is determined by the design dimensions of the first hand 33. The reference center position CPR serves as a reference when the first hand 33 delivers the substrate W to the placement portions 47A and 47B, which are the delivery destinations. The reference center position CPR coincides with the center of the substrate W when the substrate W is held by the first hand 33 in an ideal state without deviation with respect to the first hand 33. When the substrate W is held in an ideal state, if the first hand 33 is advanced to the placement portion 47A as in the teaching operation, the placement center position RV1 and the reference center position CPR coincide. Therefore, the substrate W can be delivered in a state where the center of the substrate W coincides with the placement center position RV1. The reference center position CPR is set for each of the first hand 33 and the second hand 35.

[0093] The first hand 33D drives the three guides 67 by the same configuration except that the mounting surface of the guide 67 is different from that of the above-described first hand 33. Therefore, a detailed description of the drive mechanism will be omitted.

[0094] Each of the above-described guides 67 is preferably made of, for example, PBI (polybenzimidazole). This is because PBI has high heat resistance, excellent chemical resistance, and toughness. However, each guide 67 may be made of other materials. Examples of other materials include fluororesins such as PTFE (polytetrafluoroethylene) and PFA (perfluoroalkoxyalkane).

[0095] <8. Control System>

[0096] Referring to FIG. 11, the control system of the substrate processing apparatus 1 described above will be described. FIG. 11 is a block diagram showing the control system.

[0097] The substrate processing apparatus 1 is comprehensively controlled by a control unit CU. The control unit CU includes a CPU and a memory. The control unit CU transports the substrate W to the processing unit 31 based on a recipe that defines the processing procedure and conditions of the substrate W and performs processing.

[0098] The processing unit 31 is composed of a back surface cleaning unit SSR and the like. The processing unit 31 includes the placement units 47A and 47B described above. The processing of the processing unit 31 is controlled by the control unit CU. The control unit CU stores in advance which processing unit 31 includes the placement unit 47A and which processing unit 31 includes the placement unit 47B.

[0099] The center robot CR is controlled by the control unit CU. The movement of the center robot CR in the front-rear direction X, the width direction Y, and the vertical direction Z is operated by the control unit CU. The movement of the first hand 33 and the second hand 35 in the front-rear direction X is operated by the control unit CU via the horizontal movement mechanism 57.

[0100] The center position storage unit 94 stores the placement center positions RV1 and RV2 for each processing unit 31. The center position storage unit 94 stores the reference center position CPR for each of the first hand 33 and the second hand 35. The placement center positions RV1, RV and the reference center position CPR may be corrected by the operator of the substrate processing apparatus 1. The center position storage unit 94 is referred to when the control unit CU performs a transfer process by the index robot IR or the center robot CR.

[0101] The differential memory unit 96 stores the difference calculated by the control unit CU. The difference is the difference DF between the current center position calculated when the first hand 33 holds the substrate W and the reference center position CPR of the first hand 33. The difference DF is a coordinate in the XY horizontal plane consisting of two values in the front-rear direction X and the width direction Y.

[0102] The clamping control unit 97 independently operates the movement of each of the three guides 67. The clamping control unit 97 is operated by the control unit CU. The clamping control unit 97 operates each servo motor 79 based on an instruction from the control unit CU to independently move the three guides 67. At that time, the clamping control unit 97 operates the servo motor 79 according to the position information from the encoder 81. The clamping control unit 97 operates the drive current to the servo motor 79. The clamping control unit 97 can detect the drive current supplied to the servo motor 79.

[0103] When the clamping control unit 97 detects by the tactile sensor 73 that the guide 67 has come into contact with the outer peripheral surface of the substrate W, the clamping control unit 97 adjusts the biasing force of the guide 67 on the outer peripheral surface of the substrate W to clamp the substrate W. At this time, the guide 67 does not necessarily move from the outer peripheral surface side to the center side of the substrate W. That is, the guide 67 may not move in the center direction of the substrate W only when the torque of the servo motor 79 is increased and the biasing force on the outer peripheral surface of the substrate W is strengthened.

[0104] By clamping the substrate W with the three guides 67, for example, when the first hand 33 holds the substrate W placed on the path portion 27, based on the moving distance of the guide 67 at that time, the control unit CU calculates the current center position CPN of the substrate W and stores it in the center position memory unit 94. Further, the control unit CU calculates the difference DF from the reference center position CPR and stores it in the difference memory unit 96.

[0105] In other words, when the three guides 67 of the first hand 33 come into contact with the outer peripheral surface of the substrate W, the control unit CU calculates the difference DF. Generally, the current center position CPN of the substrate W when it is clamped, which is stored in the center position storage unit 94, does not match the reference center position CPR in the first hand 33. That is, the substrate W is held by the first hand 33 in a state where the current center position CPN, which is its center position, does not match the reference center position CPR of the first hand 33. When the control unit CU transfers the substrate W to the processing unit 31, it refers to the difference DF in the difference storage unit 96 and corrects the position for the first hand 33 to advance to the processing unit 31.

[0106] The current center position CPN can be calculated, for example, as follows. First, based on the position information of the three hands 67, a triangle with the coordinates of these three points as vertices is calculated. Next, when the circumcenter of the triangle is calculated, the circumcenter becomes the current center position CPN. However, it is not limited to this calculation method, and the current center position CPN may be calculated by inputting the coordinates of the three points into the general equation of a circle.

[0107] The control system of the center robot CR described above also includes an index robot IR. That is, the control system of the index robot IR includes a clamping control unit 97. Similar to the center robot CR, when the index robot IR clamps the substrate W with three guides 67, the current center position CPN of the substrate W is calculated, the calculated current center position CPN is stored in the center position storage unit 94, and the calculated difference DF is stored in the difference storage unit 96. The control unit CU refers to the difference storage unit 96 and operates the index robot IR to transfer the substrate W between the carrier C and the delivery unit 15.

[0108] <9. Operation Flow>

[0109] Referring to FIGS. 12 to 25, the transfer operation of the substrate W by the center robot CR in the substrate processing apparatus 1 will be described. FIG. 12 is a flowchart for explaining the operation related to transfer. FIGS. 13, 15, 17, 20, 22 to 24 are schematic diagrams for explaining the operation, and are views seen from the side. FIGS. 14, 16, 18, 19, 21, 25 are schematic diagrams for explaining the operation, and are views seen from the plane.

[0110] In the following description, the operation of receiving the substrate W placed on the path portion 27 with the first hand 33 and delivering the substrate W to the processing unit 31 will be described as an example.

[0111] Step S1 As shown in FIGS. 13 and 14, the control unit CU operates the horizontal movement mechanism 57 of the center robot CR to move the first hand 33 into the transfer position within the path portion 27. Since the first hand 33 is a pick-up hand that picks up the substrate W from below, the first hand 33 is moved below the position where the substrate W is placed in the path portion 27. At this time, it is preferable that the control unit CU expands the three guides 67 of the first hand 33 to the maximum extent. In other words, the guide 67 of the finger portion 61 is moved forward X to the maximum extent, and the guide 67 of the pusher 87 is moved backward X to the maximum extent. Thereby, even if the placement position of the substrate W is greatly displaced, the substrate W can be surely received by the first hand 19.

[0112] Step S2 As shown in FIGS. 15 and 16, the control unit CU moves the first hand 33 to a height at which the substrate W can be clamped. Specifically, the control unit CU operates the center robot CR to raise the first hand 33 in the vertical direction Z so that the substrate W is positioned above the upper surface of the finger portion 61 and below the upper end of the guide 67.

[0113] Step S3 As shown in FIGS. 17 and 18, the control unit CU operates the clamping control unit 97 to move the three guides 67 of the first hand 33 toward the outer peripheral surface of the substrate W.

[0114] Step S4 The control unit CU branches the process depending on whether or not each guide 67 has come into contact with the outer peripheral surface of the substrate W. Step S3 is repeated until each guide 67 comes into contact with the outer peripheral surface of the substrate W. In other words, until each guide 67 comes into contact with the outer peripheral surface of the substrate W, the movement of each guide 67 toward the outer peripheral surface of the substrate W is maintained. Whether or not contact has been made with the outer peripheral surface of the substrate W is determined by the signal of the tactile sensor 73.

[0115] The control unit CU can detect by the tactile sensor 73 that each guide 67 has come into contact with the outer peripheral surface of the substrate W. Therefore, the control unit CU can move each guide 67 at high speed until each guide 67 comes into contact with the outer peripheral surface of the substrate W. As a result, the time until the first hand 33 holds the substrate W can be shortened.

[0116] Step S5 When each guide 67 comes into contact with the outer peripheral surface of the substrate W, the control unit CU performs the following operations.

[0117] The control unit CU calculates the current center position CPN of the substrate W based on the movement distance of the guide 67 and stores it in the center position storage unit 94. An example of the current center position CPN at this time is shown in FIG. 19. The current center position CPN (the intersection of the two-dot chain line) often does not coincide with the reference center position CPR (the intersection of the broken line) of the first hand 33. Here, as shown in FIG. 19, it is assumed that there is a deviation not only in the front-rear direction X but also in the width direction Y. The control unit CU stores the calculated current center position CPN in the center position storage unit 94.

[0118] Step S6 The control unit CU calculates the difference DF between the current center position CPN and the reference center position CPR of the first hand 33, and stores the difference DF in the difference storage unit 96.

[0119] Also, as shown in FIGS. 20 and 21, the control unit CU applies a biasing force (indicated by a white arrow in the figure) to the guide 67.

[0120] Specifically, the control unit CU operates the clamping control unit 97 to bias the guide 67. As a result, the guide 67 is pressed against the outer peripheral surface of the substrate W. Since each guide 67 is biased, the substrate W can be supported by each guide 67 so that the substrate W does not fall onto the finger portion 61. Also, at this time, it is preferable to bias each guide 67 based on the clamping information in which the biasing force is set in advance for each shape of the substrate W. Thereby, damage to the substrate W and the guide 67 can be suppressed.

[0121] Step S7 The control unit CU operates the center robot CR to correct the advancing position of the first hand 33 according to the difference DF and transfer the substrate W.

[0122] Specifically, as shown in FIG. 22, the control unit CU operates the center robot CR to raise the first hand 33 by a predetermined distance in the vertical direction Z. Next, as shown in FIG. 23, the control unit CU operates the horizontal movement mechanism 57 of the center robot CR to retract the first hand 33 from the transfer position of the pass portion 27. Note that until the substrate W is transferred to the destination, the above-described biasing force (indicated by a white arrow in the figure) is maintained.

[0123] Next, as shown in FIGS. 24 and 25, the control unit CU operates the horizontal drive unit 57 of the center robot CR to cause the first hand 33 to enter the processing unit 31. At that time, the control unit CU refers to the difference DF in the difference storage unit 96 and operates the horizontal drive mechanism 57 so that the current center position CPN deviated from the reference center position CPR of the first hand 33 coincides with the placement center position PV1. Next, the control unit CU operates the center robot CR to lower it by a predetermined distance in the vertical direction Z. Thereby, the substrate W is accurately placed at the center of the processing chamber 31.

[0124] According to Example 1, when the control unit CU holds the substrate W with the first hand 33, it operates the servo motor 79 to grip the outer peripheral surface of the substrate W with all the guides 67. At this time, based on the position information obtained from the encoder 81 of the servo motor 79, the control unit CU calculates the center position of the held substrate W as the current center position CPN. The control unit CU calculates the difference DF between the reference center position CPR of the substrate W on the first hand 33, which is preset, and the current center position CPN. When the control unit CU transfers the substrate W held by the first hand 33, it operates the horizontal drive mechanism 57 according to the difference DF to correct the position for advancing the first hand 33. Therefore, when the substrate W is held by the first hand 33, the difference DF necessary for position correction during the transfer of the substrate W can be calculated. As a result, a decrease in throughput due to position correction during conveyance can be suppressed.

[0125] Further, in Example 1, all of the guides 67 are movable, and the outer peripheral surface of the substrate W is sandwiched and held by the three guides 67. Therefore, when sandwiching the substrate W, the distance by which the lower surface of the substrate W slides horizontally at the place where the substrate W is placed can be shortened. As a result, when receiving the substrate W, even if the current center position CPN of the substrate W at the position where the substrate W is placed is deviated from the reference center position CPR of the first hand 33 at the delivery position where the first hand 33 has advanced, the movement of the current center position CPN of the substrate W when sandwiching the substrate W is minimized. Thus, particles generated due to the sandwiching of the substrate W can be suppressed.

[0126] The correspondence between Example 1 described above and the configuration of the present invention is as follows.

[0127] The indexer robot IR and the center robot CR correspond to the "substrate transfer device" in the present invention. The moving piece 71, the servo motor 79, and the ball screw 83 correspond to the "advancing and retreating drive mechanism" in the present invention. The tactile sensor 73 corresponds to the "outer peripheral surface detector" in the present invention. The control unit CU and the clamping control unit 97 correspond to the "control unit" in the present invention. The processing unit 31 and the back surface cleaning unit SSR correspond to the "processing unit" in the present invention.

[0128] The present invention is not limited to the above-described embodiments and can be implemented with modifications as follows.

[0129] (1) In the above-described Example 1, the tactile sensor 73 was employed as the outer peripheral surface detector. However, the present invention is not limited to such a configuration. That is, as long as it is possible to detect that the guide 67 has come into contact with the outer peripheral surface of the substrate W, other detectors may be employed. For example, a proximity sensor, a reflective sensor, or the like may be employed as the outer peripheral surface detector.

[0130] (2) In the above-described Example 1, the tactile sensor 73 is provided at the attachment portion of the hand 67 to the finger portion 61. However, the present invention is not limited to such a form. That is, the tactile sensor 73 may be provided on the side surface of the guide 67. In this case, it is preferable that the detection surface 75 is directed toward the outer peripheral surface side of the substrate W. This is because the detection sensitivity by the tactile sensor 73 can be increased.

[0131] (3) In the above-described Example 1, the guide 67 has a cylindrical shape, but the present invention is not limited to such a form. That is, the shape of the guide 67 is not limited.

[0132] (4) In the above-described Example 1, the first hand 33 of the center robot RR was taken as an example for explanation. However, the present invention can also be applied to the second hand 35 of the center robot IR and the first hand 19 and the second hand 21 of the indexer robot IR.

[0133] (5) In the above-described Example 1, a configuration including three guides 67 is employed. However, the present invention is not limited to such a configuration. That is, the present invention may be a configuration including four or more guides 67.

[0134] (6) In the above-described Example 1, the advancing and retreating drive mechanism is configured to move the guide 67 by the moving piece 71, the servo motor 79, and the ball screw 83. However, the present invention is not limited to such a configuration. For example, a configuration may be adopted that includes a wire having one end connected to a spring, a guide fixedly attached to a part of the wire, and a drive unit that winds up the other end of the wire to move the wire in the front-rear direction X.

[0135] (7) In the above-described Example 1, the guide 67 is driven to advance and retreat in the front-rear direction X with respect to the finger part 61. However, the present invention is not limited to such a configuration. For example, the guide 67 may be fixedly attached to the finger part 61, and the finger part 61 may be attached to the finger part mounting part 65 so as to be able to advance and retreat in the front-rear direction X at the finger part mounting part 65. Thereby, since the movable part can be arranged outside the outer peripheral surface of the substrate W, it is advantageous in terms of cleanliness.

[0136] (8) In the above-described Example 1, the tactile sensor 73 for detecting that the guide 67 abuts against the outer peripheral surface of the substrate W is provided. However, the present invention does not necessarily require the tactile sensor 73. That is, when the control unit CU moves the guide 67 toward the outer peripheral surface of the substrate W by the servo motor 79, the guide 67 may be moved with a weak driving force, and it may be determined that the guide 67 has abutted against the outer peripheral surface of the substrate W when the movement stops. In addition, as in the above-described Example 1, detecting the outer peripheral surface of the substrate W using the tactile sensor 73 and then adjusting the biasing force can shorten the time until the substrate W is held.

[0137] In the above-described Example 1, the differential storage unit 96 is provided, but the present invention does not necessarily require this configuration. That is, after calculating the difference DF, the control unit CU directly moves the first hand 33 to the transfer destination as it is, so correction can be performed directly using the difference DF. The differential storage unit 96 is, for example, provided with two first hands 33 and a second hand 35 as described above, and sequentially receives the substrate W with the first hand 33 and the second hand 35, and after moving, sequentially places the substrate W with the first hand 33 and the second hand 35. It is particularly useful in such cases.

Example

[0138] Next, Example 2 of the present invention will be described with reference to the drawings.

[0139] FIG. 26 is a side view of the hand in the substrate processing apparatus according to Example 2. The configuration of the substrate processing apparatus 1 is the same as that of Example 1 described above. Therefore, a detailed description of the substrate processing apparatus 1 will be omitted.

[0140] Hereinafter, similar to Example 1 described above, the configuration of the first hand 33 provided in the center robot CR will be described as an example. The configuration according to Example 2 is indicated by the first hand 33A.

[0141] <1. Details of the hand>

[0142] The first hand 33A includes two finger portions 61 and one palm portion 59. Each of the two finger portions 61 is provided with a guide 67. One palm portion 59 is provided with one guide 67. The first hand 33A is provided with three guides 67.

[0143] The three guides 67 are configured in the same manner as in Example 1 described above and move in the front-rear direction X. That is, the guide 67 is moved by the moving piece 71, the horizontal hole 77, the servo motor 79, and the ball screw 83. However, the first hand 33A in Example 2 is different from Example 1 in that it does not include a tactile sensor 73.

[0144] <2. Control System>

[0145] Referring to FIG. 27, the control system will be described. FIG. 27 is a block diagram showing the control system in the substrate processing apparatus according to Embodiment 2.

[0146] For the components common to the above-described Embodiment 1, detailed description will be omitted by assigning the same reference numerals as those in the above-described Embodiment 1.

[0147] The control unit CU operates the center robot CR. In particular, for the clamping operation of the substrate W by the first hand 33A, it is operated via the clamping control unit 97A.

[0148] The clamping control unit 97A is connected to the servo motor 79 and the encoder 81. The clamping control unit 97A operates the servo motor 79 based on an instruction from the control unit CU to move the three guides 67. At that time, the clamping control unit 97A operates the servo motor 79 according to the position information from the encoder 81. The clamping control unit 97A can detect the drive current supplied to the servo motor 79 as drive current information. The clamping control unit 97A determines that the guide 67 has contacted the outer peripheral surface of the substrate W based on either one or both of the position information and the drive current information.

[0149] That is, when the guide 67 contacts the outer peripheral surface of the substrate W, the movement of the guide 67 is temporarily hindered. Therefore, the displacement of the position information from the encoder 81 temporarily stops. Also, even when the guide 67 contacts the outer peripheral edge of the substrate, in order to move the guide 67 further toward the outer peripheral surface of the substrate W, it is necessary to increase the torque of the servo motor 79. Therefore, the drive current to the servo motor 79 increases and the drive current information is displaced. Therefore, by monitoring either one or both of the position information and the drive current information, it is possible to accurately determine that the guide 67 has contacted the outer peripheral surface of the substrate W. After the guide 67 has contacted the outer peripheral surface of the substrate W, the clamping control unit 97A adjusts the biasing force of the guide 67 on the outer peripheral surface of the substrate W to clamp the substrate W.

[0150] The correspondence between the above-described Example 2 and the configuration of the present invention is as follows.

[0151] The clamping control unit 97A corresponds to the "outer peripheral surface detector" in the present invention. The control unit CU and the clamping control unit 97A correspond to the "control unit" in the present invention. The servo motor 79 corresponds to the "motor" in the present invention. The clamping control unit 97A corresponds to the "drive circuit" and the "drive current detector" in the present invention. The encoder 81 corresponds to the "position information detector" in the present invention.

[0152] According to Example 2, the control unit CU determines that the guide 67 has come into contact with the outer peripheral surface of the substrate W based on at least one of the drive current information from the clamping control unit 97A and the position information from the encoder 81. Therefore, it is not necessary to provide a tactile sensor 73 or the like for detecting that the guide 67 and the outer peripheral surface of the substrate W are in contact. As a result, the structure can be simplified and the cost can be reduced.

[0153] The present invention is not limited to the above-described embodiments, and can be implemented with the following modifications.

[0154] In the above-described Example 2, (3) to (7) and (9) may be adopted, excluding (1), (2), and (8) in the modified implementation of Example 1. Also, similar to (9) in the modified implementation of Example 1, the biasing force applied to the substrate W may be adjusted without detecting that the guide 67 has come into contact with the outer peripheral surface of the substrate W.

[0155] The present invention is not limited to the above-described embodiments, and can be implemented with the following modifications.

[0156] (1) In each of the above-described Examples 1 and 2, the configuration of the substrate processing apparatus 1 was described as an example, but the present invention is not limited to a substrate processing apparatus having such a configuration.

[0157] (2) In each of the above-described Examples 1 and 2, the case of processing a circular substrate W was described as an example, but the substrate W is not limited to a circular shape.

[0158] (3) In each of the above-described first and second embodiments, a configuration in which only one of the upper pick-up hand or the lower pick-up hand is adopted is exemplified. However, for example, the center robot CR of the substrate processing apparatus 1 includes the first hand 33 and the second hand 35, and hands with different picking methods may be adopted respectively.

[0159] For example, in the center robot CR, the first hand 33 is an upper pick-up hand, and the second hand 35 is configured as a lower pick-up hand. Further, the first hand 33 and the second hand 35 may be selectively used according to the clearance CL1 of the mounting portion 47A provided in the processing unit 31 and the clearance CL2 of the mounting portion 47B.

[0160] Therefore, an appropriate hand (the first hand 33 or the second hand 35) can be selected according to the clearances CL1 and CL2 related to the transfer of the substrate W in the processing unit 31, and the substrate W can be reliably transferred.

Explanation of Reference Numerals

[0161] 1... Substrate processing apparatus W... Substrate 3... Loading / Unloading Block 5... Indexer Block 7... Processing Block C... Carrier IR... Indexer Robot 19... First Hand 21... Second Hand 31... Processing Unit SSR... Back Surface Cleaning Unit CR... Center Robot 33... First Hand 35... Second Hand 45... Substrate Sensor 47A, 47B... Mounting Portions CL1, CL2... Clearances 57... Horizontal Movement Mechanism 59... Palm Portion 61 … Finger part 63 … Mounting base end part 65 … Finger part mounting part 67 … Guide 69 … Guide hole 71 … Moving piece 73 … Tactile sensor 75 … Detection surface 79 … Servo motor 81 … Encoder 83 … Ball screw 87 … Pusher CU … Control unit 94 … Center position memory unit 96 … Difference memory unit 97 … Clamping control unit RV1, RV2 … Placing center position CPR … Reference center position CPN … Current center position DF … Difference

Claims

1. In a substrate transfer device for transferring a substrate, a hand for holding the substrate in a horizontal posture, a horizontal drive mechanism for driving the hand to move forward and backward in a horizontal plane to transfer the substrate, at least three guides provided on the hand for sandwiching the outer peripheral surface of the substrate and holding the substrate while separating it from the hand, a forward and backward drive mechanism for driving the at least three guides to move forward and backward with respect to the substrate, when holding the substrate with the hand, the forward and backward drive mechanism is operated to sandwich the outer peripheral surface of the substrate with all the guides, and based on the position information obtained from the forward and backward drive mechanism, the center position of the held substrate is calculated as the current center position, and the difference between the reference center position of the substrate on the hand set in advance and the current center position is calculated. When transferring the substrate held by the hand, a control unit that corrects the position where the hand advances by operating the horizontal drive mechanism according to the difference is provided, A substrate transfer device characterized by comprising the above.

2. In the substrate transfer device according to Claim 1, further comprising an outer peripheral surface detector for detecting that the at least three guides have contacted the outer peripheral surface of the substrate, The control unit calculates the current center position when the outer peripheral surface detector detects that each guide has contacted the outer peripheral surface of the substrate. A substrate transfer device characterized by this.

3. In the substrate transfer device according to Claim 2, The outer peripheral surface detector is a tactile sensor having a detection surface capable of detecting forces applied to each of three orthogonal axes. A substrate transfer device characterized by this.

4. In the substrate transfer device according to Claim 2, The forward and backward drive mechanism includes a motor for driving the guide to move forward and backward, a drive circuit for applying a drive current for driving the motor, and an encoder for detecting the rotational position of the motor, The outer peripheral surface detector includes at least one of a drive current detector for detecting the contact based on the drive current information of the drive circuit and a position information detector for detecting the contact based on the position information output from the encoder, The control unit detects the contact based on at least one of the drive current detector and the position information detector. A substrate transfer device characterized by this.

5. In the substrate transfer device according to Claim 2, The substrate transfer device is characterized in that the outer peripheral surface detector is provided at an attachment portion of the guide to the hand. **Claim 6** In the substrate transfer device according to claim 1, the guide is characterized by having a cylindrical shape. **Claim 7** a substrate transfer device according to any one of claims 1 to 6, a processing unit that performs a predetermined process on the substrate, the processing unit having a placement unit on which the substrate to be processed is placed and that exchanges the substrate with the hand, a substrate processing apparatus characterized by comprising the same.

Images