Substrate conveyance device and substrate processing device including the same

Abstract

To provide a substrate conveyance device which can efficiently treat a substrate, and a substrate processing device including the same.SOLUTION: A substrate conveyance device 1 includes an indexer robot IR which is configured to enable lower mounting of sandwiching the outer peripheral surface of a substrate W between guides 67 in a state in which a first hand 19 is positioned above the substrate W, and to enable upper molding of sandwiching the outer peripheral surface of the substrate W between the guides 67 in a state in which a second hand 21 is positioned below the substrate W. The first hand 19 is a lower mounting hand where the guides 67 are provided on the upper surface, and the second hand 21 is an upper mounting hand where the guides 67 are provided on the lower surface.SELECTED DRAWING: Figure 7

Description

Technical Field

[0001] The present invention relates to a substrate transfer device for transferring substrates such as semiconductor substrates, substrates for flat panel displays (FPD) such as liquid crystal display and organic EL (Electroluminescence) display devices, glass substrates for photomasks, and substrates for optical disks, and a substrate processing device including the same.

Background Art

[0002] Conventionally, as this type of device, there is one including a carrier that holds a plurality of substrates, a substrate transfer mechanism that unloads a substrate from the carrier and loads it into a substrate processing device, and a control unit that controls the substrate transfer mechanism. The control unit changes the height position of the hand when inserting the hand into the carrier according to the shape of the substrate (see, for example, Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, in the case of the conventional example having such a configuration, there are the following problems. That is, the conventional device includes a hand for holding a substrate in the substrate transfer mechanism. The methods for the hand to pick up the substrate include a pick-up method in which the hand approaches the place where the substrate is placed and picks up the substrate from above, and a pick-up method in which the hand picks up the substrate from below. Depending on the shape of the substrate and the size of the gap between the substrates placed on the carrier, it is difficult to hold the substrate by either one of the pick-up methods, the pick-up method or the pick-up method from below.

[0005] In addition, the processing unit for processing the substrate may be determined according to the processing unit as to whether to carry in and out the substrate by either the top-loading method or the bottom-loading method. In such a case, it is necessary to provide both the top-loading method and the bottom-loading method, both substrate transfer mechanisms, and to re-hold the substrate in the middle and carry it in and out of the processing unit. Therefore, the substrate cannot be efficiently transferred. As a result, there is a problem that the substrate cannot be efficiently processed.

[0006] The present invention has been made in view of such circumstances, and an object thereof is to provide a substrate transfer device capable of efficiently transferring a substrate and a substrate processing device including the same.

Means for Solving the Problems

[0007] In order to achieve such an object, the present invention has the following configuration. That is, the substrate transfer device according to the present invention is In a substrate transfer device for transferring a substrate, a hand for holding the substrate in a horizontal posture; a horizontal drive mechanism for driving the hand to advance and retreat in a horizontal plane in order to transfer the substrate; at least two guides provided on the hand for sandwiching an outer peripheral surface of the substrate to hold the substrate separated from the hand; and a forward and backward drive mechanism for driving at least one of the at least two guides as a movable guide to advance and retreat with respect to the substrate. The hand is a top-loading in which the hand is located above the substrate and the guide sandwiches the outer peripheral surface of the substrate in a state where the hand and the substrate are separated; a bottom-loading in which the hand is located below the substrate and the guide sandwiches the outer peripheral surface of the substrate in a state where the hand and the substrate are separated; characterized by comprising two types of forms.

[0008] According to the substrate transfer device of the present invention, among at least two guides that sandwich the outer peripheral surface of the substrate and hold the substrate separated from the hand, at least one guide is driven to advance and retreat with respect to the substrate as a movable guide. Therefore, the substrate is held in a state of being sandwiched by the guides. As a result, the substrate transfer device can perform both upward and downward picking. As a result, a substrate transfer device that can efficiently transfer the substrate can be provided.

[0009] Further, in the substrate transfer device according to the present invention, a plurality of the hands are provided, and at least one of the plurality of hands is an upward picking hand in which the guide is provided on the lower surface of the hand, and at least one of the plurality of hands is preferably a downward picking hand in which the guide is provided on the upper surface of the hand (Claim 2). Thereby, the substrate can be efficiently processed using two types of hands.

[0010] Further, in the substrate transfer device according to the present invention, it is preferable that at least one of the upward picking hand and the downward picking hand includes an inversion unit that inverts one surface on which the guide is provided and the other surface on which the guide is not provided (Claim 3). Thereby, each hand can perform both upward and downward picking.

[0011] Further, in the substrate transfer device according to the present invention, the hand is preferably a double-sided hand in which the guides are provided on both the upper surface and the lower surface of the hand (Claim 4). Thereby, one hand can perform both upward and downward picking.

[0012] Further, in the substrate transfer device according to the present invention, it is preferable that the double-sided hand includes an inversion unit that inverts the upper surface and the lower surface of the double-sided hand (Claim 5). Thereby, the guides provided on the upper surface and the lower surface are used for both upward and downward picking.

[0013] In addition, in the substrate transfer device according to the present invention, it is preferable that the hand is provided with the guide on either the upper surface or the lower surface of the hand, and includes an inversion unit that inverts the surface on which the guide is provided and the other surface on which the guide is not provided (Claim 6). Thereby, with only the guide provided on one surface of the hand, both upward picking and downward picking can be performed.

[0014] The substrate processing apparatus according to the present invention further includes a control unit that controls the substrate transfer device, a carrier placement unit on which a carrier capable of stacking and accommodating a plurality of substrates with a gap therebetween is placed, a temporary placement unit where the substrate unloaded from the carrier placement unit is temporarily placed before being loaded into the processing unit, and a processing unit that performs a predetermined process on the substrate loaded from the carrier or the temporary placement unit (Claim 7).

[0015] According to the substrate processing apparatus of the present invention, the substrate can be efficiently processed using a substrate transfer device that can handle both upward picking and downward picking.

[0016] In addition, in the substrate processing apparatus according to the present invention, it is preferable that the control unit selects either the upward picking or the downward picking with respect to the form of the hand inserted into the carrier or the temporary placement unit according to the shape of the substrate accommodated in the carrier or the temporary placement unit (Claim 8). Thereby, the substrate can be transferred in a form of a hand suitable for the shape of the substrate accommodated in the carrier or the temporary placement unit.

[0017] In addition, in the substrate processing apparatus according to the present invention, it is preferable that the control unit selects either the upward picking or the downward picking with respect to the form of the hand inserted into the carrier or the temporary placement unit according to the gap information between the substrates placed on the carrier or the temporary placement unit (Claim 9). Thereby, the substrate can be transferred in a form of a hand suitable for the gap between the substrates placed on the carrier or the temporary placement unit.

[0018] In addition, in the substrate processing apparatus according to the present invention, it is preferable that the control unit selects either the upward pick-up or the downward pick-up with respect to the form of the hand inserted into the carrier or the temporary placement unit according to the gap information formed at the uppermost part in the carrier or the temporary placement unit (Claim 10). Thereby, the substrate can be transported in a form of a hand suitable for the gap formed at the uppermost part in the carrier or the temporary placement unit.

[0019] In addition, in the substrate processing apparatus according to the present invention, the processing unit is at least two types out of a first processing unit, a second processing unit, and a third processing unit. In the first processing unit, the form of the hand for loading and unloading the substrate is the upward pick-up. In the second processing unit, the form of the hand for loading and unloading the substrate is the downward pick-up. In the third processing unit, the form of the hand for loading and unloading the substrate is both the upward pick-up and the downward pick-up. It is preferable that the control unit selects the form of the hand according to the type of the processing unit (Claim 11). Thereby, the substrate can be transported in a form of a hand suitable for the type of the processing unit.

[0020] In addition, in the substrate processing apparatus according to the present invention, the form of the hand when loading and unloading the substrate is the upward pick-up or the downward pick-up, and it is preferable that the control unit changes the form of the hand that has unloaded the substrate from the carrier or the temporary placement unit to match the form of the hand when loading the substrate into the processing unit (Claim 12). Thereby, when the form of the hand that has unloaded the substrate from the carrier or the temporary placement unit is different from the form of the hand when loading the substrate into the processing unit, the substrate can be transported in a form of a hand suitable for the processing unit.

[0021] In addition, in the substrate processing apparatus according to the present invention, in a state where the substrate unloaded from the carrier is temporarily placed on the temporary placement unit, the control unit changes the form of the hand that has unloaded the substrate from the carrier to match the form of the hand for loading the substrate into the processing unit It is preferable to do so (Claim 13). Thereby, when the form of the hand cannot be changed while holding the substrate, the substrate can be transported in a form of a hand suitable for the processing unit.

[0022] Further, in the substrate processing apparatus according to the present invention, it is preferable that the control unit changes the upper pick-up hand to the lower pick-up hand or changes the lower pick-up hand to the upper pick-up hand (Claim 14). Thereby, the substrate can be transported by a hand suitable for the processing unit among the upper pick-up hand and the lower pick-up hand.

[0023] Further, in the substrate processing apparatus according to the present invention, the control unit changes the surface for holding the substrate from the upper surface to the lower surface, or changes the surface for holding the substrate from the lower surface to the upper surface which is preferable (Claim 15). Thereby, the substrate can be transported by a surface suitable for the processing unit among the upper surface and the lower surface of the hand.

[0024] Further, in the substrate processing apparatus according to the present invention, it is preferable that the control unit changes the form of the hand that has carried out the substrate from the carrier or the temporary placement unit in a state where the hand holds the substrate to the form of the hand that carries the substrate into the processing unit (Claim 16). Thereby, the substrate can be transported in a form of a hand suitable for the processing unit while holding the substrate.

[0025] Further, in the substrate processing apparatus according to the present invention, it is preferable that the control unit changes the form of the hand by controlling an inversion unit that inverts one surface provided with the guide and the other surface not provided with the guide (Claim 17). Thereby, the substrate can be transported in a form of the hand inverted to a surface suitable for the processing unit.

[0026] Further, in the substrate processing apparatus according to the present invention, when the form of the hand that has carried out the substrate from the carrier or the temporary placement unit is the same as the form of the hand that carries the substrate into the processing unit, it is preferable that the control unit does not perform the change (Claim 18). Thereby, the substrate can be transported to the processing unit in the form of the hand that has carried out the substrate from the carrier or the temporary placement unit.

[0027] In the substrate processing apparatus according to the present invention, it is preferable that the substrate transfer device can transfer the substrate placed on the carrier to either the processing unit or the temporary placement unit (Claim 19). Thereby, whether the substrate is transferred from the carrier to the processing unit or the substrate is transferred from the carrier to the processing unit via the temporary placement unit, the substrate can be transferred in a hand form suitable for the processing unit.

[0028] In the substrate processing apparatus according to the present invention, it is preferable that the substrate transfer device carries the substrate unloaded from the carrier into the temporary placement unit (Claim 20). Thereby, when transferring the substrate from the carrier to the temporary placement unit, the substrate can be transferred in a hand form suitable for the processing unit.

[0029] In the substrate processing apparatus according to the present invention, it is preferable that the substrate transfer device transfers the substrate unloaded from the temporary placement unit to the processing unit (Claim 21). Thereby, when transferring the substrate from the temporary placement unit to the processing unit, the substrate can be transferred in a hand form suitable for the processing unit.

Effect of the Invention

[0030] According to the substrate transfer device of the present invention, since it can handle both top loading and bottom loading, the substrate can be efficiently transferred. According to the substrate processing apparatus of the present invention, the substrate can be efficiently processed by using a substrate transfer device that can handle both top loading and bottom loading. Further, since one substrate transfer device has the functions of top loading and bottom loading, the installation area, power consumption, and cost of the substrate processing apparatus can be reduced.

Brief Description of the Drawings

[0031]

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Modes for Carrying Out the Invention

[0032] The present invention will be described below with various examples.

Examples

[0033] Hereinafter, Example 1 of the present invention will be described with reference to the drawings.

[0034] FIG. 1 is a plan view showing the overall configuration of the substrate processing apparatus according to Example 1. FIG. 2 is a view of the substrate processing apparatus in FIG. 1 as seen from the rear X.

[0035] <1. Overall configuration>

[0036] The substrate processing apparatus 1 includes a loading / unloading block 3, an indexer block 5, and a processing block 7.

[0037] The substrate processing apparatus 1 processes a substrate W. The substrate processing apparatus 1 performs, for example, a cleaning process on the substrate W. The substrate processing apparatus 1 processes the substrate W in a single-wafer type in the processing block 7. The single-wafer type processes one substrate W one by one in a horizontal posture. The substrate W has, for example, a circular shape in plan view.

[0038] In this specification, for convenience, the direction in which the loading / unloading block 3, the indexer block 5, and the processing block 7 are arranged is referred to as the "front-rear direction X". The front-rear direction X is horizontal. Among the front-rear direction X, the direction from the processing block 7 toward the loading / unloading block 3 is referred to as "front". The direction opposite to the front is referred to as "rear". The horizontal direction orthogonal to the front-rear direction X is referred to as the "width direction Y". One direction of the "width direction Y" is appropriately referred to as "right". The direction opposite to the right is referred to as "left". The direction perpendicular to the horizontal direction is referred to as the "vertical direction Z". In each figure, for reference, front, rear, right, left, up, and down are appropriately shown.

[0039] <2. Loading / unloading block>

[0040] The loading / unloading block 3 includes a loading section 9 and an unloading section 11. The loading section 9 and the unloading section 11 are arranged in the width direction Y. A plurality of substrates W (for example, 25 substrates) are stacked and stored horizontally at a constant interval within one carrier C. The carrier C containing the unprocessed substrates W is placed on the loading section 9. The loading section 9 includes, for example, two mounting tables 13 on which the carrier C is placed. The carrier C has a plurality of grooves (not shown) formed therein for accommodating the substrates W one by one with the surfaces of the substrates W spaced apart from each other. The carrier C accommodates the substrates W, for example, with the surface of the substrate W facing upward. Examples of the carrier C include a FOUP (Front Opening Unify Pod). The FOUP is a sealed container. The carrier C may be an open container, regardless of the type.

[0041] The unloading section 11 is arranged on the opposite side of the loading section 9 across the central part of the substrate processing apparatus 1 in the width direction Y. The unloading section 11 is arranged to the left Y of the loading section 9. The unloading section 11 stores the processed substrates W in the carrier C and unloads the entire carrier C. The unloading section 11 that functions in this way includes, like the loading section 9, for example, two mounting tables 13 for mounting the carrier C. The loading section 9 and the unloading section 11 are also called load ports.

[0042] <3. Indexer Block>

[0043] The indexer block 5 is arranged adjacent to the rear X of the loading / unloading block 3 in the substrate processing apparatus 1. The indexer block 5 includes an indexer robot IR.

[0044] The indexer robot IR is configured to be rotatable about the vertical direction Z. The indexer robot IR is configured to be movable in the width direction Y. The indexer robot IR includes a first hand 19 and a second hand 21. In FIG. 1, only one hand is shown due to the illustration relationship. The first hand 19 and the second hand 21 hold the substrate W in a horizontal posture. The first hand 19 is a pick-up hand that adopts the pick-up format described later. The first hand 19 sandwiches the outer peripheral surface of the substrate W and holds the substrate W while separating it from the upper surface of the first hand 19. The second hand 21 is a pick-up hand that adopts the pick-up format described later. The second hand 21 sandwiches the outer peripheral surface of the substrate W and holds the substrate W while separating it from the lower surface of the second hand 21.

[0045] The first hand 19 and the second hand 21 each hold one substrate W. The first hand 19 and the second hand 21 are independently configured to be movable back and forth in the front-rear direction X. The first hand 19 and the second hand 21 are independently configured to be movable up and down in the vertical direction Z. The indexer robot IR moves in the vertical direction Z and the width direction Y and rotates about the vertical direction Z, and advances and retreats the first hand 19 and the second hand 21 in the front-rear direction X to transfer the substrate W to and from each carrier C. The indexer robot IR transfers the substrate W to and from the transfer unit 15 and the processing unit 31.

[0046] <4. Processing Block>

[0047] The processing block 7 performs various processes on the substrate W, for example. Examples of the process include a cleaning process. The cleaning process is, for example, a process liquid cleaning process performed by supplying only the cleaning liquid, or a brush cleaning process using a brush in addition to the process liquid.

[0048] As shown in FIG. 1, the processing block 7 is divided into, for example, a first row R1 and a second row R2 in the width direction Y. Specifically, the first row R1 is arranged to the left Y of the placement unit 15. The second row R2 is arranged to the right Y of the placement unit 15.

[0049] <4-1. First column>

[0050] The first column R1 of the processing block 7 includes a plurality of processing units 31. The first column R1 includes, for example, four processing units 31. The four processing units 31 of the first column R1 are stacked and arranged in the vertical direction Z. Each processing unit 31 is, for example, a cleaning unit. The cleaning unit performs a cleaning process on the substrate W. As the cleaning unit, there are a surface cleaning unit that cleans the surface of the substrate W and a back surface cleaning unit that cleans the back surface of the substrate W. In this embodiment, the back surface cleaning unit SSR is taken as an example to explain the processing unit 31 in the first column R1. The processing unit 31 in the first column R1 is provided with, for example, two processing units 31A described later and two processing units 31B described later.

[0051] <4-2. Second column>

[0052] The second column R2 of the processing block 7 includes a plurality of processing units 31. The second column R2 includes, for example, four processing units 31. The four processing units 31 of the second column R2 are stacked and arranged in the vertical direction Z. In this embodiment, the surface cleaning unit SS is taken as an example to explain the processing unit 31 in the second column R2. The processing unit 31 in the second column R2 is provided with, for example, four processing units 31C described later.

[0053] <4-3. Delivery section>

[0054] Processing block 7 is provided with a transfer section 15 between a first column R1 and a second column R2. The transfer section 15 is formed long in the vertical direction Z. The transfer section 15 includes a path section 25 and a path section 27 from the lower side to the upper side in the vertical direction Z. The path sections 25 and 27 are used to transfer the substrate W between the index block 5 and the processing block 7. The path section 25 is used, for example, to convey the substrate W from the processing block 7 to the index block 5. The path section 27 is used, for example, to convey the substrate W from the index block 5 to the processing block 7. Note that the conveyance directions of the substrate W in the path sections 25 and 27 may be opposite to each other.

[0055] <5. Mounting table>

[0056] Here, with reference to FIGS. 1 and 3, the above-described three loading / unloading blocks will be described in detail. FIGS. 3(a) to (e) are side views showing the configuration and operation of the loading / unloading blocks.

[0057] The loading / unloading block 3 includes a mounting table 13, an opening 39, and a lid opening / closing mechanism 41. The mounting table 13 is where the carrier C is placed. The mounting table 13 is provided with a mechanism (not shown) for moving the carrier C in the front-rear direction X. The mounting table 13 can move the carrier C forward and backward with respect to the opening 39. The carrier C has a loading / unloading port CT. The loading / unloading port CT is formed on one side surface of the carrier C. A plurality of substrates W stacked and accommodated in the carrier C are loaded / unloaded through the loading / unloading port CT. The carrier C includes a lid CL. The lid CL is detachably configured at the loading / unloading port CT of the carrier C. The lid CL seals the inside of the carrier C. When the lid CL is attached to the carrier C, the atmosphere inside the carrier C is blocked from the outside.

[0058] The lid opening / closing mechanism 41 includes a detachable unit 43 in the forward X direction. The detachable unit 43 removes the lid CL from the carrier C or attaches the lid CL to the carrier C. The detachable unit 43 is movable in the vertical direction Z and the front-rear direction X while holding the lid CL. The lid opening / closing mechanism 41 is movable in the front-rear direction X at the opening 39 while holding the lid CL. The lid opening / closing mechanism 41 is movable up and down in the vertical direction Z while holding the lid CL. The lid opening / closing mechanism 41 can move downward in the vertical direction Z from the opening 39 while holding the lid CL. By descending while holding the lid CL, the lid opening / closing mechanism 41 can fully open the opening 39.

[0059] First, as shown in FIG. 3(a), the carrier C is placed on the mounting table 13. The carrier C stores a plurality of substrates W stacked therein and is closed by the lid CL. At this time, the lid opening / closing mechanism 41 positions the detachable unit 43 at the opening 39. Thereby, the inside of the index block 5 is separated from the external atmosphere.

[0060] As shown in FIG. 3(b), the mounting table 13 moves the carrier C rearward in the X direction. The carrier C has the loading outlet CT and the lid CL positioned at the opening 39. At this time, the detachable unit 43 releases the lock of the lid CL and holds the lid CL. The holding is performed, for example, by the detachable unit 43 sucking the lid CL.

[0061] As shown in FIG. 3(c), the lid opening / closing mechanism 41 moves rearward in the X direction. Thereby, the lid CL is moved rearward in the X direction from the opening 39. The lid CL is moved inside the index block 5.

[0062] As shown in FIG. 3(d), the lid opening / closing mechanism 41 moves downward in the vertical direction Z. The lid opening / closing mechanism 41 lowers the detachable unit 43 to the lower part of the loading outlet CT. The lid opening / closing mechanism 41 lowers until the upper part of the detachable unit 43 is positioned at the lower part of the opening 39.

[0063] As shown in FIG. 3(e), the lid opening / closing mechanism 41 moves downward in the vertical direction Z and moves to the lowermost position where the lid opening / closing mechanism 41 can move. The lid opening / closing mechanism 41 descends to a position where the detachable unit 43 does not overlap with the opening 39 in the front-rear direction X. Thereby, the opening 39 is fully opened. A plurality of substrates W in the carrier C can face the index block 5 through the opening 39.

[0064] The above-described lid opening / closing mechanism 41 includes, for example, a substrate sensor 45 in the detachable unit 43. The substrate sensor 45 is used to detect the position of the substrate W stacked and stored in the carrier C or to collect shape information based on the outer edge of the substrate W. The shape information includes information regarding the thickness based on the outer edge of the substrate W.

[0065] Note that, instead of or together with the substrate sensor 45, the index robot IR may be provided with a photographing unit. The photographing unit photographs the projection images of the substrate W and the carrier C. The photographed projection images are transmitted to the control unit CU. From the projection image of the substrate W, shape information of the substrate W such as warpage and thickness of the substrate W is acquired. By connecting a plurality of projection images of the substrate W, gap information between the substrates W placed on the carrier C is acquired. Further, from the projection image including the carrier C and the substrate W, gap information between the uppermost substrate W of the carrier C and the ceiling portion can be acquired.

[0066] The carrier C has a barcode (not shown). The barcode is an identifier for identifying the carrier C or for identifying the substrate W in the carrier C. The barcode is attached to, for example, the outer surface of the carrier C. The barcode reader 14 for reading the barcode is provided on, for example, the mounting table 13. The barcode and the barcode reader 14 are configured such that the barcode reader 14 can read the barcode in a state where the carrier C is placed on the mounting table 13.

[0067] The barcode contains, for example, information about the carrier C and processing condition information of the substrate W placed on the carrier C. The information about the carrier C is, for example, information about the number of shelves of the carrier C, the interval information between each shelf, and information for identifying the substrate W placed on each shelf. The processing condition information of the substrate W placed on the carrier C is, for example, information about which substrate W placed on which shelf of the carrier C is processed by which processing unit 31 and what kind of processing is performed.

[0068] <6. Mounting section>

[0069] Here, referring to FIGS. 4 to 6, a part of the above-described processing unit 31 will be described. FIG. 4 is a side view showing a first example of the mounting section provided in the processing unit. FIG. 5 is a side view showing a second example of the mounting section provided in the processing unit. FIG. 6 is a side view showing a third example of the mounting section provided in the processing unit.

[0070] The above-described processing unit 31 is assumed to be a surface cleaning unit SS and a back surface cleaning unit SSR. Such a surface cleaning unit SS and a back surface cleaning unit SSR are assumed to include any one of three types of mounting sections 47 (mounting sections 47A, 47B, 47C) as described below. The mounting section 47 is a place where the substrate W is placed in the surface cleaning unit SS and the back surface cleaning unit SSR. The mounting section 47 supports the lower surface of the substrate W.

[0071] As shown in FIG. 4, the mounting portion 47A includes a turntable 49 and support pins 51. The turntable 49 has a circular shape in plan view. The turntable 49 has a diameter slightly larger than that of the substrate W. There are a plurality of support pins 51. The support pins 51 are erected on the upper surface of the turntable 49. The support pins 51 are arranged on the upper surface slightly inside from the outer peripheral surface of the turntable 49. Some of the support pins 51 rotate eccentrically around the axis in the vertical direction Z. The substrate W is pressed horizontally from the outer peripheral surface by the support pins 51 that rotate in this way, and the position is fixed by the plurality of support pins 51. The support pins 51 abut against the outer peripheral surface and the lower surface of the substrate W, and support the lower surface of the substrate W while being separated from the upper surface of the turntable 49. The mounting portion 47A is a so-called mechanical chuck.

[0072] Here, the distance between the upper surface of the turntable 49 and the lower surface of the substrate W supported by the support pins 51 is referred to as a clearance CL1. In the mounting portion 47A in this first example, the clearance CL1 is relatively large. The clearance CL1 is larger than the thickness DP of the first hand 19. The thickness DP corresponds to the maximum height in the vertical direction Z when the portion of the first hand 19 that enters the position for delivering the substrate W is viewed from the side.

[0073] In the cleaning unit SSR (hereinafter referred to as the processing unit 31A) provided with such a mounting portion 47A, either the first hand 19 (lower take - hand) or the second hand 21 (upper take - hand) can access it.

[0074] As shown in FIG. 5, the placement portion 47B includes a turntable 53 and support protrusions 55. The turntable 53 has a circular shape in plan view. The turntable 53 is provided with an injection port (not shown) for supplying gas to the lower surface of the substrate W. The support protrusions 55 are formed on the upper surface of the turntable 53. There are a plurality of support protrusions 55. The support protrusions 55 are formed slightly inside the outer peripheral surface of the turntable 53. The support protrusions 55 abut against the lower surface of the substrate W and support the lower surface of the substrate W while being spaced apart from the upper surface of the turntable 55. The substrate W is supported so as to be attracted to the support protrusions 55 and the turntable 55 by the negative pressure generated by the supply of gas. Thereby, the position of the substrate W is fixed. The placement portion 47B is a so-called Bernoulli chuck.

[0075] The clearance CL2 of this placement portion 47B is relatively small. The clearance CL2 is smaller than the clearance CL1. The clearance CL2 is smaller than the thickness DP of the second hand 21. The thickness DP corresponds to the maximum height in the vertical direction Z when the portion of the second hand 21 that enters the position where the substrate W is transferred is viewed from the side.

[0076] In the cleaning unit SSR (hereinafter referred to as the processing unit 31B) provided with such a placement portion 47B, it is preferable to access with the second hand 21 (lifting hand) described later.

[0077] As shown in FIG. 6, the placement portion 47C includes a turntable 47C1 and a suction portion 47C2 that performs vacuum suction at the center of the turntable 47C1. The diameter of the turntable 47C1 is smaller than the diameter of the substrate W. The suction portion 47C2 holds the back surface of the substrate W placed on the turntable 47C1 on the turntable 47C1 by vacuum suction. The back surface of the substrate W is in contact with the upper surface of the turntable 47C1. The placement portion 47C is a so-called suction chuck.

[0078] The placement portion 47C has a device configuration that makes it difficult to insert the second hand 21 above the turntable 47C1. For example, in the placement portion 47C, a clearance sufficiently larger than the thickness DP of the second hand 21 is not ensured above the turntable 47C1.

[0079] In the surface cleaning unit SS (hereinafter referred to as the processing unit 31C) provided with such a placement unit 47C, it is preferable to access with the first hand 19 (the take-up hand) described later.

[0080] <7. Details of the Hand>

[0081] Here, with reference to FIGS. 7 to 11, the first hand 19 in the index robot IR will be described as an example. Note that the configuration of the first hand 19 is the same as that of the second hand 21.

[0082] The index robot IR is provided with a horizontal drive mechanism 57. The horizontal movement mechanism 57 drives the first hand 19 in the front-rear direction X. The horizontal movement mechanism 57 drives the first hand 19 to advance and retreat in the horizontal direction. The horizontal movement mechanism 57 drives the first hand 19 to advance and retreat with respect to the delivery destination. Specifically, the delivery destination in the index robot IR drives the first hand 19 to advance and retreat with respect to the carrier C, the delivery unit 15, or the processing unit 31.

[0083] The first hand 19 includes one palm part 59 and two finger parts 61. The palm part 59 is on the base end side of the first hand 19. The finger part 61 is on the tip end side of the first hand 19. With respect to the delivery destination, it enters from the tip end side of the first hand 19 and exits from the base end side of the first hand 19. The palm part 59 includes a mounting base end part 63 and a finger part mounting part 65. The mounting base end part 63 is mounted on the horizontal drive mechanism 57. The finger part 61 is mounted on the finger part mounting part 65. The finger part mounting parts 65 are provided at two positions spaced apart in the width direction Y. The portions where the two finger parts 61 of the finger part mounting part 65 are mounted are located outside the outer peripheral surface of the substrate W in a plan view when the first hand 19 advances to the position for delivering the substrate W. In other words, the finger part 61 has a length in the front-rear direction X longer than the diameter of the substrate W.

[0084] The first hand 19 has two finger portions 61. The two finger portions 61 extend in the front-rear direction X. The two finger portions 61 are spaced apart from each other in the width direction Y. The distance between the two finger portions 61 does not exceed the diameter of the substrate W. In other words, the width direction Y of the two finger portions 61 falls within the diameter of the substrate W. The base end side of the finger portions 61 is attached to the finger portion attachment portion 65. The tip side of the finger portions 61, which is opposite to the base end side, is in an open state. The first hand 19 has a U-shape in a plan view with the palm portion 59 and the two finger portions 61.

[0085] The first hand 19 has three guides 67. The first hand 19 has three guides 67 attached to its upper surface. The finger portion 61 has one guide 67 on the tip side. A structure in which the guides 67 are attached to the upper surface of the finger portion 61, like this first hand 19, is called a "trade-in hand." The first hand 19, which has a trade-in hand structure, holds the substrate W by scooping it up from below.

[0086] As shown in Fig. 9, the guide 67 of the finger portion 61 is attached to a guide hole 69. The guide hole 69 is long in the front-rear direction X. A moving piece 71 is disposed at the bottom of the guide hole 69. The moving piece 71 is movable only in the front-rear direction X at the bottom of the guide hole 69. A tactile sensor 73 is attached to the moving piece 71. The tactile sensor 73 is attached to the upper surface of the moving piece 71.

[0087] The tactile sensor 73 has a detection surface 75 that can detect the forces applied to each of the three mutually orthogonal axes. The tactile sensor 73 is attached to the moving piece 71 in a posture where the detection surface 75 is directed upward. A guide 67 is attached to the detection surface 75. The bottom of the guide 67 is attached to the detection surface 75. The tactile sensor 73 can detect the force applied to the guide 67 in each of the three axial directions. The tactile sensor 73 detects the forces applied in the front-rear direction X, the width direction Y, and the vertical direction Z. The tactile sensor 73 outputs an electrical signal corresponding to each of the forces detected in the three axial directions.

[0088] In the finger portion 61, a lateral hole 77 is formed in the front-rear direction X from the guide hole 69. The lateral hole 77 penetrates to the palm portion 59. A servo motor 79 is provided at a location in the palm portion 59 corresponding to the end of the lateral hole 77. The servo motor 79 includes an encoder 81. The encoder 81 detects the rotational position (rotation angle) of the rotating shaft of the servo motor 79 and outputs it as position information as an electrical signal. A ball screw 83 is inserted into the lateral hole 77. One end side of the ball screw 83 is connected to the rotating shaft of the servo motor 79. The moving piece 71 is screwed to the other end side of the ball screw 83. When the servo motor 79 is rotationally driven, the ball screw 83 is rotated, and the moving piece 71 moves in the front-rear direction X along the guide hole 69. As a result, the guide 67 moves in the front-rear direction X.

[0089] As shown in FIG. 10, the palm portion 59 includes a pusher 87. The pusher 87 includes one guide 67. The pusher 87 has the same configuration as that for driving the guide 67 of the finger portion 61, except for the pusher arm 89 and the guide hole 91.

[0090] That is, the pusher 87 includes a tactile sensor 73, a lateral hole 77, a ball screw 83, a servo motor 79, an encoder 81, and a pusher arm 89. One end side of the lateral hole 77 penetrates the side surface on the finger portion 61 side. A guide hole 91 is formed on the finger portion 61 side of the lateral hole 77. The guide hole 91 has a larger dimension in the vertical direction Z than the lateral hole 77. A part of the pusher arm 89 is inserted into the guide hole 91 so as to be movable in the front-rear direction X. The other end side of the lateral hole 77 is closed inside the palm portion 59. A servo motor 79 is disposed on the other end side of the lateral hole 77. The servo motor 79 includes an encoder 81. One end side of the ball screw 83 is connected to the rotating shaft of the servo motor 79. The pusher arm 89 is screwed to the other end side of the ball screw 83. The pusher arm 89 includes the tactile sensor 73 on the side opposite to the servo motor 79 in the front-rear direction X. A guide 67 is attached to the detection surface 75 of the tactile sensor 73.

[0091] Each of the above-described guides 67 is configured to be movable by a predetermined distance in the front-rear direction X. Each of the above-described guides 67 is movable, for example, by a distance of about 5 mm in the front-rear direction X.

[0092] The first hand 19 includes three guides 67 on the upper surface. The first hand 19 holds the substrate W in a state where the lower surface of the substrate W is spaced upward from the upper surface of the finger portion 61. Specifically, the outer peripheral surface of the substrate W is sandwiched by the three guides 67, and the lower surface of the substrate W is held in a floating state from the upper surface of the finger portion 61. The first hand 19 holds the substrate W in a state of contacting only the outer peripheral surface of the substrate W. The first hand 19 moves the three guides 67 toward the outer peripheral surface of the substrate W, sandwiches the outer peripheral surface of the substrate W with the three guides 67, and holds the substrate W in a state of being separated from the upper surface of the finger portion 61.

[0093] The first hand 19 includes three guides 67 on the upper surface, while the second hand 21 is configured as shown in FIG. 11. FIG. 11 is a side view of the pick-up hand according to the embodiment.

[0094] Unlike the first hand 19, the second hand 21 has three guides 67 attached to its lower surface. Specifically, each of the two finger portions 61 has one guide 67 on its lower surface at the tip side. The palm portion 59 has one guide 67 on its lower surface at the tip side. This second hand 21 is referred to as the "lifting hand". The second hand 21, which has the structure of the lifting hand, holds the substrate W by lifting it from above upward.

[0095] The second hand 21 drives the three guides 67 with the same configuration, differing only in the attachment surface of the guide 67 from the first hand 19 described above. Therefore, a detailed description of the drive mechanism will be omitted.

[0096] Each of the above-described guides 67 is preferably made of, for example, PBI (polybenzimidazole). This is because PBI has high heat resistance, excellent chemical resistance, and toughness. However, each guide 67 may be made of other materials. Examples of other materials include fluororesins such as PTFE (polytetrafluoroethylene) and PFA (perfluoroalkoxyalkane).

[0097] <8. Control System>

[0098] Referring to FIG. 12, the control system of the substrate processing apparatus 1 described above will be described. FIG. 12 is a block diagram showing the control system.

[0099] The substrate processing apparatus 1 is comprehensively controlled by a control unit CU. The control unit CU includes a CPU and a memory. The control unit CU transports the substrate W to the processing unit 31 and performs processing based on a recipe that defines the processing procedure and conditions of the substrate W.

[0100] The shape information storage unit 93 stores the shape information for each substrate W obtained by the substrate sensor 45 in association with the substrate W. The shape information includes the thickness of the substrate W. The shape information includes the warp of the substrate W. The shape information storage unit 93 stores the warp information and thickness information of the substrate W in association with the hand form information (hereinafter referred to as the loading / unloading form information) in the carrier C. The loading / unloading form information in the carrier C is information indicating whether to use the first hand 19 (lower take-up hand) or the second hand 21 (upper take-up hand) for the substrate W. The shape information storage unit 93 is referenced for the shape information by the control unit CU.

[0101] The processing condition information storage unit 94 stores the processing condition information for each substrate W obtained by the barcode reader 14 in association with the substrate W. The processing condition information includes the name information of the processing unit 31 that processes the substrate W. The processing condition information storage unit 94 is referenced for the processing condition information by the control unit CU.

[0102] The name information of the processing unit 31 is information for identifying the processing unit 31A provided with the above-described mechanical chuck (mounting portion 47A), the processing unit 31B provided with the Bernoulli chuck (mounting portion 47B), and the processing unit 31C provided with the suction chuck (mounting portion 47C). The processing condition information storage unit 94 stores the name information of the processing unit 31 in association with the loading / unloading form information in the processing unit 31. The loading / unloading form information in the processing unit 31 is information indicating whether to use the first hand 19 (lower take-up hand) as the hand for loading and unloading the substrate W into and out of the processing unit 31, whether to use the second hand 21 (upper take-up hand), or whether both the first hand 19 and the second hand 21 can be used.

[0103] The clamping information storage unit 95 stores the center position of the substrate W corresponding to the position of the guide 67 when the substrate W is held by the first hand 19. The center position of the substrate W is acquired by the control unit CU via the clamping control unit 97 described later and written into the clamping information storage unit 95 by the control unit CU.

[0104] The holding information storage unit 95 also stores in advance the holding information according to the shape of the substrate W. The holding information is associated with each piece of shape information of the substrate W. The holding information is the biasing force applied to the guide 67. The holding information is information related to the biasing force applied to the guide 67 by the servo motor 79. The biasing force applied from the guide 67 to the substrate W and the torque applied from the servo motor 79 to the ball screw 83 are, for example, smaller as the substrate W is thinner. These biasing forces and torques are, for example, smaller as the substrate W is warped. These biasing forces and torques are, for example, larger as the substrate W is thick and has no warp.

[0105] The holding information is the biasing force and torque when the substrate W having various shapes is actually held by the first hand 19 in advance, and at that time, the substrate W and the guide 67 are not damaged and the substrate W can be held so as not to fall. The holding information may be stored in advance in a separate device (not shown) and downloaded from a host computer (not shown) via a network.

[0106] The processing unit 31 is composed of a surface cleaning unit SS, a back surface cleaning unit SSR, etc. The processing unit 31 includes the above-described placement units 47A, 47B, and 47C. The processing of the processing unit 31 is controlled by the control unit CU. The control unit CU stores in advance that the processing unit 31A includes the placement unit 47A, the processing unit 31B includes the placement unit 47B, and the processing unit 31C includes the placement unit 47C.

[0107] The index robot IR is controlled by the control unit CU. The movement of the index robot IR in the front-rear direction X, the width direction Y, and the vertical direction Z is operated by the control unit CU. The movement of the first hand 19 and the second hand 21 in the front-rear direction X is operated by the control unit CU via the horizontal movement mechanism 57.

[0108] The clamping control unit 97 independently operates the movement of each of the three guides 67. The clamping control unit 97 is operated by the control unit CU. The clamping control unit 97 operates each servo motor 79 based on an instruction from the control unit CU to independently move the three guides 67. At that time, the clamping control unit 97 operates the servo motor 79 according to the position information from the encoder 81. The clamping control unit 97 operates the drive current to the servo motor 79. The clamping control unit 97 can detect the drive current supplied to the servo motor 79.

[0109] When the clamping control unit 97 detects, by means of the tactile sensor 73, that the guide 67 has come into contact with the outer peripheral surface of the substrate W, the clamping control unit 97 adjusts the biasing force of the guide 67 against the outer peripheral surface of the substrate W according to the shape information from the shape information storage unit 93 to clamp the substrate W. At this time, the guide 67 does not necessarily move from the outer peripheral surface side to the center side of the substrate W. That is, the guide 67 may not move in the direction of the center of the substrate W as long as the torque of the servo motor 79 is increased and the biasing force against the outer peripheral surface of the substrate W is strengthened.

[0110] When the first hand 19 holds the substrate W by clamping the substrate W with the three guides 67, based on the movement distance of the guide 67 at that time, the control unit CU calculates the center position of the substrate W and stores it in the clamping information storage unit 95. Generally, the center position of the substrate W when it is clamped and stored in the clamping information storage unit 95 is deviated from the designed center position of the substrate W in the first hand 19. The clamping information, which is the center position of the substrate W stored in the clamping information storage unit 95, is referred to by the control unit CU, and the control unit CU operates the indexer robot IR to correct the center position when placing the substrate W on the delivery unit 15, and delivers the substrate W to the delivery unit 15.

[0111] <9. Operation Flow>

[0112] Referring to FIGS. 13 to 23, the transfer operation of the substrate W by the indexer robot IR in the substrate processing apparatus 1 will be described. FIG. 13 is a flowchart for explaining the operations related to transfer. FIGS. 14, 16, 18, 20, 22, and 23 are schematic diagrams for explaining the operations and are views seen from the side. FIGS. 15, 17, 19, and 21 are schematic diagrams for explaining the operations and are views seen from the top.

[0113] In the following description, the operation of unloading the substrate W from the carrier C will be taken as an example for explanation. Note that this operation flow is applicable to any of the operations of loading the substrate W into the carrier C, loading and unloading the substrate W to and from the transfer unit 15, and loading and unloading the substrate W to and from the processing unit 31.

[0114] Step S1 Obtain the shape information of the substrate W and the processing condition information of the substrate W. When the control unit CU places the carrier C on the mounting table 13, the barcode reader 14 reads the barcode attached to the carrier C to obtain the processing condition information of the substrate W. When the lid CL is removed from the carrier C by the detaching unit 43, the substrate sensor 45 obtains the shape information of each substrate W. The control unit CU stores the obtained shape information in the shape information storage unit 93 in association with each substrate W. The control unit CU stores the obtained processing condition information in the processing condition information storage unit 94 in association with each substrate W. The obtained shape information of the substrate W and the processing condition information of the substrate W are stored in the shape information storage unit 93 until the processing of the substrate W in the substrate processing apparatus 1 is completed.

[0115] Obtaining the shape information of the substrate W and the processing condition information of the substrate W also includes reading the shape information of the substrate W and the processing condition information of the substrate W stored in the shape information storage unit 93 in the operations after unloading the substrate W from the carrier C, that is, the operations of loading and unloading the substrate W to and from the transfer unit 15, loading and unloading the substrate W to and from the processing unit 31, and loading the substrate W into the carrier C.

[0116] The shape method of the substrate W is information regarding the warp and thickness of the substrate W.

[0117] The processing condition information of the substrate W is, for example, information for identifying the substrate W placed on the carrier C and information for identifying the processing recipe of the substrate W. The information for identifying the substrate W placed on the carrier C is, for example, information for identifying the shelf of the carrier C on which the substrate W is placed. The information for identifying the processing recipe of the substrate W is, for example, information for identifying the type of the processing unit 31 in which the substrate W is processed, information for identifying the order of processing, and information for identifying the content of processing.

[0118] When the indexer robot IR is provided with the imaging unit instead of or together with the substrate sensor 45, the control unit CU acquires, from the projection images of the substrate W and the carrier C captured by the imaging unit, in addition to the shape information of the substrate W, the gap information between the substrates W placed on the carrier C and the gap information between the uppermost substrate W on the carrier C and the ceiling portion.

[0119] Step S2 The control unit CU selects the loading / unloading form information and the clamping information of the substrate W according to the shape information of the substrate W. The control unit CU selects the loading / unloading form information of the substrate W according to the processing condition information of the substrate W. Specifically, for example, the control unit CU selects the loading / unloading form information and the clamping information according to the shape information of the substrate W conveyed by the indexer robot IR from among the patterns of the loading / unloading form information and the clamping information according to the shape information of the substrate W stored in advance in the shape information storage unit 93.

[0120] When the control unit CU acquires the gap information between the substrates W, the control unit CU selects the loading / unloading form information of the substrate W according to the gap information between the substrates W. When the control unit CU acquires the gap information between the uppermost substrate W of the carrier C and the ceiling portion, the control unit CU selects the loading / unloading form information of the substrate W according to the gap information. Specifically, for example, the control unit CU selects the loading / unloading form information of the substrate W according to the gap information between the substrates W conveyed by the index robot IR from among the patterns of the loading / unloading form information of the substrate W according to the gap information between the substrates W stored in the storage unit in advance. The control unit CU selects the loading / unloading form information of the substrate W according to the gap information between the uppermost substrate W of the carrier C and the ceiling portion stored in the storage unit in advance from among the patterns of the loading / unloading form information of the substrate W according to the gap information, and selects the loading / unloading form information of the substrate W according to the gap information conveyed by the index robot IR.

[0121] Step S3 The control unit CU acquires the loading / unloading form information and the clamping information selected in step S2. Specifically, for example, the control unit CU reads out the loading / unloading form information in the carrier C corresponding to the shape information of the substrate W selected in step S2 from the shape information storage unit 93. The control unit CU reads out the clamping information corresponding to the shape information of the substrate W received by the first hand 19 selected in step S2 from the clamping information storage unit 95. The control unit CU reads out the loading / unloading form information in the carrier C corresponding to the processing condition information of the substrate W selected in step S2 from the shape information storage unit 93.

[0122] Step S4 As shown in FIGS. 14 and 15, the control unit CU operates the horizontal movement mechanism 57 of the index robot IR to move the hand corresponding to the loading / unloading form information among the first hand 19 or the second hand 21 into the delivery position in the carrier C.

[0123] Here, the control unit CU shall select the first hand 19 as the loading / unloading form information in step S2 according to at least any one of the shape information of the substrate W acquired in step S1, the gap information between the substrates W, and the gap information between the uppermost substrate W of the carrier C and the ceiling portion. Specifically, for example, the control unit CU determines that the substrate W is not warped based on the shape information of the substrate W, determines that there is sufficient gap to insert the hand below the substrate W based on the gap information between the substrates W, and selects the first hand 19. Also, when the control unit CU determines that both the first hand 19 and the second hand 21 can be inserted based on the shape information of the substrate W and the gap information between the substrates W, the control unit CU may select the first hand 19 according to the loading / unloading form information of the processing unit 31 based on the processing condition information of the substrate W.

[0124] Cause the first hand 19 to enter the carrier C. Since the first hand 19 is a pick-up hand that picks up the substrate W from below, cause the first hand 19 to enter below the position where the substrate W to be picked up is placed. At this time, it is preferable that the control unit CU expands the three guides 67 of the first hand 19 to the maximum extent. In other words, move the guide 67 of the finger portion 61 to the maximum extent in the forward X direction and move the guide 67 of the pusher 87 to the maximum extent in the rearward X direction. Thereby, even if the placement position of the substrate W is greatly displaced, the substrate W can be surely picked up by the first hand 19.

[0125] Step S5 As shown in FIGS. 16 and 17, the control unit CU moves to a height at which the substrate W can be clamped by the first hand 19. Specifically, the control unit CU operates the indexer robot IR to raise the first hand 19 in the vertical direction Z so that the substrate W is positioned at a height above the upper surface of the finger portion 61 and below the upper end of the guide 67.

[0126] Step S6 As shown in FIGS. 18 and 19, the control unit CU operates the clamping control unit 97 to move the three guides 67 of the first hand 19 toward the outer peripheral surface of the substrate W.

[0127] Step S7 The control unit CU branches the process depending on whether or not each guide 67 has come into contact with the outer peripheral surface of the substrate W. Step S6 is repeated until each guide 67 comes into contact with the outer peripheral surface of the substrate W. In other words, until each guide 67 comes into contact with the outer peripheral surface of the substrate W, the movement of each guide 67 toward the outer peripheral surface of the substrate W is maintained. Whether or not it has come into contact with the outer peripheral surface of the substrate W is determined by the signal of the tactile sensor 73.

[0128] Step S8 When each guide 67 comes into contact with the outer peripheral surface of the substrate W, the following operation is performed. As shown in FIGS. 20 and 21, the control unit CU applies a biasing force (indicated by white arrows in the figures) to the guide 67 according to the clamping information.

[0129] Specifically, the control unit CU refers to the clamping information storage unit 95 and reads out the clamping information corresponding to the substrate W. The control unit CU operates the clamping control unit 97 according to the read clamping information to bias the guide 67. As a result, the substrate W is pressed against by the guide 67 on the outer peripheral surface. Since each guide 67 is biased based on the clamping information, the substrate W can be supported by each guide 67 so that the substrate W does not fall onto the finger portion 61. Further, since each guide 67 is biased based on the clamping information, damage to the substrate W and the guide 67 can be suppressed.

[0130] Step S9 As shown in FIG. 22, the control unit CU operates the indexer robot IR to move the first hand 19 in the vertical direction Z by a predetermined distance. Next, as shown in FIG. 23, the control unit CU operates the horizontal movement mechanism 57 of the indexer robot IR to retract the first hand 19 from the transfer position of the carrier C. Note that until the substrate W is delivered to the destination, the above-described biasing force (indicated by white arrows in the figure) is maintained.

[0131] <10. Conveying pattern>

[0132] Referring to FIGS. 24 to 32, the pattern of the transfer operation of the substrate W by the index robot IR in the substrate processing apparatus 1 will be described. FIG. 24 is a diagram showing four transfer patterns. FIGS. 25, 26, 27, and 28 are diagrams for explaining the operation related to the first transfer pattern PT1. FIGS. 29, 30, 31, and 32 are diagrams for explaining the operation related to the second transfer pattern PT2. Note that, for the operation explanation related to the third transfer pattern PT3, FIGS. 25 and 32 are used. For the operation explanation related to the fourth transfer pattern PT4, FIGS. 29 and 28 are used.

[0133] <Four transfer patterns> Refer to FIG. 24. Note that, from FIG. 24 onward, the delivery unit 15 is shown as a view looking inside from the width direction Y.

[0134] In the substrate processing apparatus 1 of this embodiment, a plurality of processing units 31A, 31B, and 31C having different forms of hands (hereinafter referred to as loading / unloading forms) used when loading and unloading the substrate W are mixed and mounted.

[0135] The substrate processing apparatus of this embodiment is roughly divided into two types of transfer patterns according to the loading / unloading form at the carrier C and the loading / unloading form at the processing unit 31.

[0136] The first transfer pattern is the first transfer pattern PT1 and the second transfer pattern PT2 adopted when the loading / unloading form at the carrier C and the loading / unloading form at the processing unit 31 are different. In these transfer patterns, the substrate W unloaded from the carrier C is once placed on the delivery unit 15. During the period when the substrate W is placed on the delivery unit 15, the hands are alternated. It is carried into the processing unit 31 by the alternated hands.

[0137] Specifically, for the first transfer pattern PT1, the loading / unloading form at the carrier C is the second hand 21 (upper pick-up hand), and the loading / unloading form at the processing unit 31 is the first hand 19 (lower pick-up hand). For the second transfer pattern PT2, the loading / unloading form at the carrier C is the first hand 19 (lower pick-up hand), and the loading / unloading form at the processing unit 31 is the second hand 21 (upper pick-up hand).

[0138] The second transfer pattern includes the third transfer pattern PT3 and the fourth transfer pattern PT4, which are adopted when the loading / unloading form at the carrier C and the loading / unloading form at the processing unit 31 are the same. In these transfer patterns, when the processing unit 31 can receive the substrate W at the moment when the substrate W is unloaded from the carrier C, it is directly loaded into the processing unit 31.

[0139] Specifically, for the third transfer pattern PT3, the loading / unloading form at the carrier C and the loading / unloading form at the processing unit 31 are the second hand 21 (upper pick-up hand). For the fourth transfer pattern PT4, the loading / unloading form at the carrier C and the loading / unloading form at the processing unit 31 are the first hand 19 (lower pick-up hand).

[0140] An example of how to determine the loading / unloading form at the carrier C according to the shape of the substrate W will be described. When the substrate W has a ball shape with a convex center downward, it is preferable to transfer the substrate W using the second hand 21 (upper pick-up hand). Therefore, the substrate W with a ball shape having a convex center downward is transferred using the second hand 21. When the substrate W has an umbrella shape with a convex center upward, it is preferable to transfer the substrate W using the first hand 19 (lower pick-up hand). Therefore, the substrate W with an umbrella shape having a convex center upward is transferred using the first hand 19. However, it does not mean that the first hand 19 cannot transfer the substrate W with a ball shape having a convex center downward. Nor does it mean that the second hand 21 cannot transfer the substrate W with an umbrella shape having a convex center upward.

[0141] When the substrate W is a substrate that has no warp (or has a small warp), either the first hand 19 or the second hand 21 may be used. When either the first hand 19 or the second hand 21 may be used, it is determined which of the first hand 19 and the second hand 21 to use in consideration of the gap information in the carrier C.

[0142] Based on the shape information of the substrate W and the processing condition information of the substrate W described above, the control unit CU selects the loading / unloading form in the carrier C and the processing unit 31.

[0143] In any conveyance pattern, when the processing unit 31 cannot accept the substrate W at the time of unloading the substrate W from the carrier C, the substrate W may be placed on the delivery unit 15 and waited until it can be accepted.

[0144] <First Conveyance Pattern PT1> The conveyance of the substrate W according to the first conveyance pattern PT1 will be described.

[0145] In this example, a substrate W1 with a downwardly convex center is placed on the uppermost stage of the carrier C1.

[0146] Refer to FIG. 25. A ball-shaped substrate W1 with a downwardly convex center is placed on the uppermost stage of the carrier C1. The index robot IR conveys the substrate W1. The ball shape with a downwardly convex center is the shape information of the substrate W1. Therefore, the substrate W1 is clamped by the guide 67 of the second hand 21 (upper pick-up hand).

[0147] Note that the loading / unloading form in the carrier C1 may be other than that selected based on the substrate information of the substrate W1. For example, it is the gap information between the uppermost shelf and the ceiling part of the carrier C1. The carrier C1 has a sufficiently wide vertical width of the gap from the uppermost shelf to the ceiling part with respect to the widths DP of the first hand 19 and the second hand 21. Therefore, if the warp of the substrate W1 placed on the uppermost stage of the carrier C2 is small, the second hand 21 may be selected based on the gap information of the carrier C1.

[0148] (a) As shown, the control unit CU moves the second hand 21 to the height for unloading the substrate W1 in front of the opening of the carrier C1. (b) As shown, the second hand 21 is inserted into the insertion position in the carrier C1 at this height. (c) As shown, the second hand 21 descends from this insertion position to the clamping position for clamping the substrate W1 with the guide 67, and clamps the substrate W1 with the guide 67 at this clamping position. (d) As shown, the second hand 21 lifts the substrate W1 clamped by the guide 67 to the height for unloading from the carrier C1, and unloads it from the carrier C1.

[0149] Refer to FIGS. 26 and 27. The substrate W1 is determined to be carried into the processing unit 31C based on the processing condition information.

[0150] In this example, the loading / unloading form in the carrier C1 is the second hand 21 (upper pick-up hand), and the loading / unloading form in the processing unit 31C is the first hand 19 (lower pick-up hand). Therefore, the substrate W1 held by the second hand 21 is temporarily placed on the delivery unit 15. During that time, the second hand 21 is replaced by the first hand 19. The first hand 19 holds the substrate W1 and conveys the substrate W1 to the processing unit 31.

[0151] First, as shown in FIG. 26(a), the control unit CU moves the second hand 21 to the height for loading the substrate W1 in front of the opening of the delivery unit 15. (b) As shown, the second hand 21 is inserted into the insertion position of the delivery unit 15 at this height. (c) As shown, the second hand 21 descends from this insertion position to the placement position for placing the substrate W1, and releases the guide 67 that clamps the substrate W1 at this placement position. (d) As shown, the second hand 21 with the guide 67 released is lifted to the height for unloading from the delivery unit 15 and retracted from the delivery unit 15.

[0152] Next, as shown in FIG. 27(a), the control unit CU moves the first hand 19 to a height for carrying out the substrate W1 in front of the opening of the delivery unit 15. As shown in (b), the first hand 19 is inserted into the insertion position of the delivery unit 15 at this height. As shown in (c), the first hand 19 rises from this insertion position to a clamping position for clamping the substrate W1 with the guide 67, and clamps the substrate W1 with the guide 67 at this clamping position. As shown in (d), the first hand 19 moves the substrate W1 clamped by the guide 67 to a height for carrying out from the delivery unit 15, and carries it out from the delivery unit 15.

[0153] As described above, it is preferable to convey the ball-shaped substrate W1 with a downwardly convex center using the second hand 21 (upper pick-up hand). However, the first hand 19 (lower pick-up hand) can clamp the outer peripheral surface of the substrate W1 between the guides 67 and adjust the biasing force of each guide 67 on the outer peripheral surface of the substrate W in the same manner as the second hand 21. Therefore, even when changing from the second hand 21 to the first hand 19, the substrate W1 can be appropriately held.

[0154] Next, as shown in FIG. 28(a), the control unit CU moves the first hand 19 to a height for carrying in the substrate W1 in front of the opening of the processing unit 31C. As shown in (b), the first hand 19 is inserted into the insertion position of the processing unit 31C at this height. As shown in (c), the first hand 19 is lowered downward in the vertical direction Z until the position where the substrate W1 clamped by the guide 67 contacts the placement unit 47C. The lowering of the first hand 19 is stopped, the guide 67 is opened, and the substrate W1 is transferred to the placement unit 47C. As shown in (d), the first hand 19 is withdrawn from the processing unit 31C.

[0155] <Second transfer pattern PT2> The conveyance of the substrate W according to the second transfer pattern PT2 will be described.

[0156] In this example, a substrate W2 with an upwardly convex center is placed on the uppermost stage of the carrier C2.

[0157] Refer to Fig. 29. On the uppermost stage of the carrier C2, a substrate W2 in the shape of an umbrella with a convex center upward is placed. The index robot IR conveys the substrate W2. The ball shape with a convex center upward is the shape information of the substrate W2. Therefore, the substrate W2 is clamped by the guide 67 of the first hand 19 (pick-up hand).

[0158] Note that the loading and unloading form in the carrier C2 may be other than that selected based on the substrate information of the substrate W2. The vertical width of the gap from the uppermost shelf to the ceiling part of the carrier C2 is narrower than that of the carrier C1. The vertical width is smaller than the thicknesses of the first hand 19 and the second hand 21. Therefore, even if the warp of the substrate W2 is small, the substrate W2 placed on the uppermost stage of the carrier C2 is unloaded from the carrier C2 by the first hand 19.

[0159] As shown in (a), the control unit CU moves the first hand 19 to the height for unloading the substrate W2 in front of the opening of the carrier C2. As shown in (b), the first hand 19 is inserted into the insertion position of the carrier C2 at this height. As shown in (c), the first hand 19 rises from this insertion position to the clamping position for clamping the substrate W2 with the guide 67, and clamps the substrate W2 with the guide 67 at this clamping position. As shown in (d), the first hand 19 lifts the substrate W2 clamped by the guide 67 to the height for unloading from the carrier C2, and unloads it from the carrier C2.

[0160] Refer to Figs. 30 and 31. It is determined that the substrate W2 is to be loaded into the processing unit 31B based on the processing condition information.

[0161] In this example, the loading / unloading form at carrier C2 is the first hand 19 (take-down hand), and the loading / unloading form at the processing unit 31B is the second hand 21 (take-up hand). Therefore, the substrate W2 held by the first hand 19 is temporarily placed on the delivery unit 15. During that time, the first hand 19 is replaced by the second hand 21. The second hand 21 holds the substrate W2 and conveys the substrate W2 to the processing unit 31B.

[0162] First, as shown in Fig. 30(a), the control unit CU moves the first hand 19 to a height for loading the substrate W2 in front of the opening of the delivery unit 15. As shown in (b), the first hand 19 is inserted into the insertion position of the delivery unit 15 at this height. As shown in (c), the first hand 19 descends from this insertion position to a placement position for placing the substrate W2, and releases the guide 67 that clamps the substrate W2 at this placement position. As shown in (d), the first hand 19 with the guide 67 released descends to a height for unloading from the delivery unit 15 and retracts from the delivery unit 15.

[0163] Next, as shown in Fig. 31(a), the control unit CU moves the second hand 21 to a height for unloading the substrate W2 in front of the opening of the delivery unit 15. As shown in (b), the second hand 21 is inserted into the insertion position of the delivery unit 15 at this height. As shown in (c), the second hand 21 descends from this insertion position to a clamping position for clamping the substrate W2 with the guide 67, and clamps the substrate W2 with the guide 67 at this clamping position. As shown in (d), the second hand 21 lifts the substrate W2 clamped by the guide 67 to a height for unloading from the delivery unit 15 and unloads it from the delivery unit 15.

[0164] Next, as shown in FIG. 32(a), the control unit CU moves the second hand 21 to a height for loading the substrate W2 in front of the opening of the processing unit 31B. As shown in (b), the second hand 21 is inserted into the insertion position of the processing unit 31B at this height. As shown in (c), the second hand 21 is lowered downward in the vertical direction Z until the substrate W1 held by the guide 67 contacts the support pin 55 of the placement unit 47C. When the substrate W1 held by the guide 67 contacts the support pin 55, the lowering of the second hand 21 is stopped, the guide 67 is opened, and the substrate W2 is transferred to the support pin 55. As shown in (d), the second hand 21 is withdrawn from the processing unit 31B.

[0165] In this way, regardless of whether it is the first transfer pattern PT1 or the second transfer pattern PT2, when unloading the substrate W from the carrier C, an optimal hand can be selected according to the shape information of the substrate W (the loading / unloading form in the carrier C). Also, when loading the substrate W into the processing unit 31, an optimal hand can be selected according to the loading / unloading form in the processing unit 31. Further, when the loading / unloading form in the carrier C is different from the loading / unloading form in the processing unit 31, it can be switched from the loading / unloading form in the carrier C to the loading / unloading form in the processing unit 31. Even with the switched hand, the substrate W can be appropriately transferred to the processing unit 31.

[0166] <Third Transfer Pattern PT3> The transfer of the substrate W according to the third transfer pattern PT3 will be described. The third transfer pattern PT3 is common to the descriptions with reference to FIGS. 25 and 32 in the above-described first transfer pattern PT1 and second transfer pattern PT2. That is, since the loading / unloading form in the carrier C1 is the same as the loading / unloading form in the processing unit 31B, the loading / unloading form in the carrier C1 is directly used as the loading / unloading form in the processing unit 31B to transfer the substrate W1. That is, with the second hand 21, it is possible to unload the substrate W1 from the carrier C1 and also load the substrate W1 into the processing unit 31B.

[0167] <Fourth Transfer Pattern PT4> The conveyance of the substrate W according to the fourth conveyance pattern PT4 will be described. The fourth conveyance pattern PT4 is common to the descriptions with reference to FIGS. 29 and 28 in the above-described first conveyance pattern PT1 and second conveyance pattern PT2. That is, since the loading / unloading form on the carrier C2 is the same as the loading / unloading form in the processing unit 31C, the loading / unloading form on the carrier C2 is directly used as the loading / unloading form in the processing unit 31C to convey the substrate W2. That is, with the first hand 19, it is possible to unload the substrate W2 from the carrier C2 and also load the substrate W2 into the processing unit 31C.

[0168] According to the first embodiment, when the control unit CU holds the substrate W with the first hand 19, it operates the servo motor 79 to move each guide 67 to the outer peripheral surface of the substrate W. When the tactile sensor 73 detects that each guide 67 has come into contact with the outer peripheral surface of the substrate W, the control unit CU adjusts the biasing force of each guide 67 against the outer peripheral surface of the substrate W by the servo motor 79 according to the shape of the substrate W. Therefore, the clamping force can be adjusted for each shape of the substrate W such as warpage and thickness of the substrate W. As a result, when alternating between the first hand 19 and the second hand 21, it is possible to prevent damage to the substrate W during conveyance regardless of the shape of the substrate W, no matter which hand it is alternated to. Also, damage to each guide 67 can be prevented.

[0169] Further, in the first embodiment, all of the guides 67 are movable, and the biasing force is adjusted for all three guides 67. Therefore, when clamping the substrate W, the distance by which the lower surface of the substrate W slides horizontally at the place where the substrate W is placed can be shortened. As a result, when alternating between the first hand 19 and the second hand 21, even if the center of the substrate W at the position where the substrate W is placed in the hand before and after the alternation is deviated from the center of the hand at the hand-off position where the hand has advanced, the movement of the center position of the substrate W when clamping the substrate W is minimized. Thus, particles generated due to the clamping of the substrate W can be suppressed.

[0170] The correspondence between the above-described first embodiment and the configuration of the present invention is as follows.

[0171] The indexer robot IR corresponds to the "substrate transfer device" in the present invention. The first hand 19 (lower take - hand) and the second hand 21 (upper take - hand) correspond to the "hand" in the present invention. The horizontal drive mechanism 57 corresponds to the "horizontal drive mechanism" in the present invention. Each guide 67 corresponds to the "movable guide" in the present invention. The moving piece 71, the servo motor 79, and the ball screw 83 correspond to the "advancing and retreating drive mechanism" in the present invention. The pusher arm 89, the servo motor 79, and the ball screw 83 also correspond to the "advancing and retreating drive mechanism" in the present invention. The control unit CU corresponds to the "control unit" in the present invention. The processing unit 31 composed of the processing units 31A, 31B, and 31C corresponds to the "processing unit" in the present invention.

[0172] The present invention is not limited to the above - described embodiments and can be implemented with the following modifications.

[0173] (1) In the above - described embodiment, the guides 67 provided on the first hand 19 and the guides 67 provided on the second hand 21 had the same shape, but they may have different shapes. (2) In the above - described Example 1, the tactile sensor 73 was adopted as the outer - peripheral - surface detector. However, the present invention is not limited to such a configuration. That is, as long as it can be detected that the guide 67 abuts on the outer - peripheral surface of the substrate W, other detectors may be adopted. For example, a proximity sensor, a reflection - type sensor, etc. may be adopted as the outer - peripheral - surface detector.

[0174] (3) In the above - described Example 1, the tactile sensor 73 was provided at the attachment portion to the finger portion 61 of the hand 67. However, the present invention is not limited to such a form. That is, the tactile sensor 73 may be provided on the side surface of the guide 67. In this case, it is preferable that the detection surface 75 is directed toward the outer - peripheral - surface side of the substrate W. This is because the detection sensitivity by the tactile sensor 73 can be increased.

[0175] (4) In the above-described Example 1, the guide 67 has a cylindrical shape, but the present invention is not limited to such a form. That is, the shape of the guide 67 does not matter.

[0176] (5) In the above-described Example 1, the indexer robot IR was configured to be able to move the first hand 19 and the second hand 21 independently in the front-rear direction X, the width direction Y, the vertical direction Z, etc., but it may also be configured such that the first hand 19 and the second hand 21 cannot be moved independently. That is, the first hand 19 and the second hand 21 share a drive unit for moving in the front-rear direction X, the width direction Y, the vertical direction Z, etc. The horizontal drive mechanism 57 and the configuration corresponding to the "forward and backward drive mechanism" in the present invention are independent.

[0177] (6) In the above-described Example 1, a configuration including three guides 67 is adopted. However, the present invention is not limited to such a configuration. That is, the present invention may have a configuration including two guides 67. In this case, in order to stably hold the substrate W, it is preferable that the guide 67 on the tip side in the front-rear direction X is formed wider along the width direction Y than the guide 67 (pusher) on the base end side.

[0178] (7) In the above-described Example 1, a configuration in which all three guides 67 are movable is adopted. However, the present invention is not limited to such a configuration. That is, the present invention may have a configuration in which at least one guide 67 is movable.

[0179] (8) In the above-described Example 1, a configuration including three guides 67 is adopted. However, the present invention is not limited to such a configuration. That is, the present invention may have a configuration including four or more guides 67.

[0180] (9) In the above-described Example 1, a reciprocating drive mechanism is configured by the moving piece 71, the servo motor 79, and the ball screw 83 to move the guide 67. However, the present invention is not limited to such a configuration. For example, a configuration including a wire having one end connected to a spring, a guide fixedly attached to a part of the wire, and a drive unit that winds up the other end of the wire to move the wire in the front-rear direction X may be adopted.

[0181] (10) In the above-described Example 1, the guide 67 was reciprocally driven in the front-rear direction X with respect to the finger part 61. However, the present invention is not limited to such a configuration. For example, the guide 67 may be fixedly attached to the finger part 61, and the finger part 61 may be attached to the finger part attachment part 65 so as to be reciprocally movable in the front-rear direction X at the finger part attachment part 65. Thereby, since the movable part can be arranged outside the outer peripheral surface of the substrate W, it is advantageous in terms of cleanliness.

[0182] (11) In the above-described Example 1, the first hand 19 was configured to include the tactile sensor 73. However, the first hand 19 may be configured not to include the tactile sensor 73. This will be described with reference to FIG. 12 above.

[0183] The clamping control unit 97 operates the servo motor 79 according to the position information from the encoder 81. The clamping control unit 97 can detect the drive current supplied to the servo motor 79 as drive current information. The clamping control unit 97 determines that the guide 67 has come into contact with the outer peripheral surface of the substrate W based on either one or both of the position information and the drive current information.

[0184] That is, when the guide 67 abuts against the outer peripheral surface of the substrate W, the movement of the guide 67 is temporarily obstructed. Therefore, the displacement of the position information from the encoder 81 temporarily stops. Further, even when the guide 67 abuts against the outer peripheral edge of the substrate, in order to further move the guide 67 toward the outer peripheral surface of the substrate W, it is necessary to increase the torque of the servo motor 79. Therefore, the drive current to the servo motor 79 increases and the drive current information is displaced. Accordingly, by monitoring either one or both of the position information and the drive current information, it is possible to accurately determine that the guide 67 has abutted against the outer peripheral surface of the substrate W. After the guide 67 abuts against the outer peripheral surface of the substrate W, the clamping control unit 97 adjusts the biasing force of the guide 67 against the outer peripheral surface of the substrate W according to the shape information from the shape information storage unit 93, and clamps the substrate W.

[0185] As described above, the control unit CU determines that the guide 67 has abutted against the outer peripheral surface of the substrate W based on at least one of the drive current information from the clamping control unit 97 and the position information from the encoder 81. Therefore, it is not necessary to provide a tactile sensor 73 or the like that detects that the guide 67 and the outer peripheral surface of the substrate W are in contact. As a result, the structure can be simplified and the cost can be reduced.

Embodiment

[0186] Next, a second embodiment of the present invention will be described with reference to FIG. 33.

[0187] FIG. 33 is a side view of a hand in a substrate processing apparatus according to the second embodiment. The configuration of the substrate processing apparatus 1 is the same as that of the first embodiment described above, except for the points described below.

[0188] In the substrate processing apparatus 1 of the first embodiment, the first hand 19 only had a take-down function, and the second hand 21 only had a take-up function. However, the substrate processing apparatus 1 may be provided with one hand having both take-down and take-up functions. The substrate processing apparatus 1 of the second embodiment includes a double-sided hand 22 in which the upper surface side of one hand has a take-down function and the lower surface side of one hand has a take-up function.

[0189] That is, the double-sided hand 22 is provided with a guide 67a on the upper surface side of one hand and a guide 67b on the lower surface side of one hand. Specifically, the guide 67a is provided on the upper surface of the moving piece 71 and the upper surface of the pusher arm 89. The guide 67b is provided on the lower surface of the moving piece 71 and the lower surface of the pusher arm 89. In this way, in the double-sided hand 22, the lower-taking guide 67a and the upper-taking guide 67b are shared by one hand.

[0190] The double-sided hand 22 shares the configuration of the moving piece 71 corresponding to the "advancing and retreating drive mechanism" of the present invention, the servo motor 79, the ball screw 83, the pusher arm 89, the servo motor 79, and the ball screw 83. The configuration of the moving piece 71, the servo motor 79, the ball screw 83, the pusher arm 89, the servo motor 79, and the ball screw 83 is shared for lower-taking and upper-taking. Also, the mechanism for moving the index robot IR in the front-rear direction X, width direction Y, up-down direction Z, etc. is also shared for lower-taking and upper-taking. That is, the guides 67a and 67b are configured to move simultaneously and in the same direction in accordance with the movement of the moving piece 71.

[0191] The force applied to the guide 67a is detected by the tactile sensor 73a provided on the upper surface of the moving piece 71. The force applied to the guide 67b is detected by the tactile sensor 73b provided on the lower surface of the moving piece 71.

[0192] In this way, the double-sided hand 22 is a single hand common to the lower-taking guide 67a and the upper-taking guide 67b. Therefore, the double-sided hand 22 can reduce the thickness of the hand compared to the configuration in which the first hand 19 (lower-taking hand) and the second hand 21 (upper-taking hand) are overlapped.

[0193] Also, by doing this, when alternating hands, the hand is retracted backward in the X direction, then the hand is moved upward or downward in the Z direction according to the surface to be used next, and the hand is advanced forward in the Z direction again, so that the hands can be alternated. That is, in Example 1, when alternating hands, it was necessary to leave a sufficient distance to avoid collision between the hands, especially between the arms supporting the hands. In this Example 2, such a necessity does not exist. Therefore, the time for alternating hands can be shortened.

Embodiment

[0194] Next, Example 3 of the present invention will be described with reference to FIG. 34.

[0195] FIG. 34 is a side view of the hand in the substrate processing apparatus according to Example 3. Note that the configuration of the substrate processing apparatus 1 is the same as that of Example 1 described above. Therefore, a detailed description of the substrate processing apparatus 1 will be omitted.

[0196] In the substrate processing apparatus 1 of Example 3, only the first hand 19 is configured on the upper surface side of one hand. However, the index servo robot IR includes a reverse drive mechanism 58 in addition to the horizontal drive mechanism 57. The reverse drive mechanism 58 is a mechanism that rotates the first hand 19 by 180 degrees. When the reverse drive mechanism 58 is provided at the attachment base end portion 63, for example, the portion from the attachment base end portion 63 to the tip of the finger portion 61 rotates by 180 degrees. That is, the guide 67 also rotates by 180 degrees. In the drawing, the guide 67 after being reversed is shown by a dashed line. The reverse drive mechanism 58 is composed of, for example, a rotating shaft portion 58A provided from the attachment base end portion 63 to the finger portion attachment portion 65, and a rotation drive portion 58B that rotates the rotating shaft portion 58A at the attachment base end portion 63. The rotating shaft portion 58A is, for example, a rotating shaft with a gear attached to the base end side. The rotation drive portion 58B is composed of, for example, a gear and a motor. The gear of the rotating shaft portion 58A meshes with the gear of the rotation drive portion 58B, and the motor rotates the gear of the rotation drive portion 58B. Thereby, the rotating shaft portion 58A rotates. In this way, with only one first hand 19, it serves as both a lower hand and an upper hand.

[0197] Thus, when alternating the hand, the hand can be retracted backward in the X direction and then inverted, thereby enabling hand alternation. That is, in Example 2, it was not necessary to avoid the buffer between the arms when alternating the hand, but it was necessary to provide two types of hands, namely the first hand 19 and the second hand 21. In contrast, in this Example 3, the same effect as in Example 2 can be achieved with only the first hand 19. Therefore, a substrate processing apparatus 1 that is more compact than Example 2 can be realized.

Example

[0198] Next, Example 4 of the present invention will be described with reference to FIGS. 35, 36, and 37.

[0199] FIG. 35 is a plan view showing a schematic configuration of a substrate processing apparatus according to Example 4. FIG. 36 is a block diagram showing a control system. FIG. 37 is a diagram for explaining the operation related to conveyance. The configuration of the substrate processing apparatus 1 is the same as that of Example 1 except for the following points. Therefore, a detailed description of the substrate processing apparatus 1 will be omitted.

[0200] The substrate processing apparatus 1 of Example 4 includes a center robot CR in addition to the index robot IR. Further, the delivery unit 15 is disposed between the index block 5 and the processing block 7. Therefore, the index robot IR conveys the substrate W between the carrier C placed on the transfer stage 13 and the delivery unit 15, and the center robot CR conveys the substrate W between the delivery unit 15 and the processing unit 31.

[0201] In the present Example 4, not only the indexer robot IR but also the center robot CR has the same configuration as the first hand 19 and the second hand 21. That is, the center robot CR includes a first hand 33 corresponding to the first hand 19 and a second hand 35 corresponding to the second hand 21. That is, when the center robot CR conveys the substrate W, the control unit CU selects the loading / unloading form at the delivery unit 15 based on the shape information of the substrate W placed on the delivery unit 15, and selects the loading / unloading form at the processing unit 31 based on the processing condition information of the substrate W placed on the delivery unit 15. Also when the center robot CR conveys the substrate W, the shape information of the substrate W is read from the shape information storage unit 93, and the processing condition information of the substrate W is read from the processing condition information storage unit 94.

[0202] The shape information of the substrate W and the processing condition information of the substrate W are associated with which shelf of the carrier C the taken-out substrate W is placed on which shelf of the delivery unit 15. Therefore, the control unit CU can use the shape information and the processing condition information of the substrate W conveyed by the indexer robot IR as the conveyance conditions for the center robot CR.

[0203] With such a configuration, as shown in FIG. 37, in the first conveyance pattern PT1, the indexer robot CR unloads the substrate W from the carrier C by the optimal hand (the second hand 21) according to the shape information of the substrate W, and places the substrate W on the delivery unit 15. The center robot CR unloads the substrate W from the delivery unit 15 by the optimal hand (the first hand 33) according to the processing condition information of the substrate W, and loads it into the processing unit 31C. In the second conveyance pattern PT2, the indexer robot CR unloads the substrate W from the carrier C by the optimal hand (the first hand 19) according to the shape information of the substrate W, and places the substrate W on the delivery unit 15. The center robot CR unloads the substrate W from the delivery unit 15 by the optimal hand (the second hand 35) according to the processing condition information of the substrate W, and loads it into the processing unit 31B.

[0204] Also, in the third transfer pattern PT3, the index robot CR unloads the substrate W from the carrier C using an optimal hand (the second hand 21) according to the shape information of the substrate W, and places the substrate W on the delivery unit 15. The center robot CR unloads the substrate W from the delivery unit 15 using an optimal hand (the second hand 35) according to the processing condition information of the substrate W, and loads it into the processing unit 31C. In the fourth transfer pattern PT4, the index robot CR unloads the substrate W from the carrier C using an optimal hand (the first hand 19) according to the shape information of the substrate W, and places the substrate W on the delivery unit 15. The center robot CR unloads the substrate W from the delivery unit 15 using an optimal hand (the first hand 33) according to the processing condition information of the substrate W, and loads it into the processing unit 31C.

[0205] Thereby, the substrate W can be efficiently transported by the index robot IR and the center robot CR.

[0206] Note that the index robot IR and the center robot CR correspond to the "substrate transfer device" in the present invention. It is also possible that only one of the index robot IR and the center robot CR corresponds to the "substrate transfer device" of the present invention.

[0207] The present invention is not limited to the above-described embodiments, and can be implemented with the following modifications.

[0208] (1) In each of the above-described Examples 1 to 4, the configuration of the substrate processing apparatus 1 was described as an example, but the present invention is not limited to a substrate processing apparatus having such a configuration.

[0209] (2) In each of the above-described Examples 1 to 4, the case of processing a circular substrate W was described as an example, but the substrate W is not limited to a circular shape.

[0210] (3) In the above-described Example 1, the first hand 19 and the second hand 21 were configured not to be inverted, but they may be configured to be inverted respectively. That is, even only the first hand 19 can correspond to both pick-up and pick-down. Even only the second hand 21 can correspond to both pick-up and pick-down. Thereby, different transfer operations can be performed in parallel in the substrate processing apparatus 1 by the first hand 19 and the second hand 21.

[0211] (4) In the above-described Example 2, the hand (double-sided hand 22) having the first hand 19 on the upper surface and the second hand 21 on the lower surface was configured not to be inverted, but it may be configured to be inverted. Thereby, when transporting the substrate W with the pick-down hand, the first hand 19 and the second hand 21 can be used separately. Similarly, when transporting the substrate W with the pick-up hand, the first hand 19 and the second hand 21 can be used separately.

Explanation of Reference Numerals

[0212] 1... Substrate processing apparatus W... Substrate 3... Loading / Unloading Block 5... Indexer Block 7... Processing Block C... Carrier IR... Indexer Robot 14... Barcode Reader 15... Delivery Unit 19... First Hand 21... Second Hand 22... Double-Sided Hand 31, 31A, 31B, 31C... Processing Unit SS... Surface Cleaning Unit SSR... Back Surface Cleaning Unit CR... Center Robot 33... First Hand 35... Second Hand 45... Substrate Sensor Placement parts 47A, 47B, 47C... Clearances CL1, CL2... Horizontal movement mechanism 57... Palm part 59... Finger part 61... Mounting base end part 63... Finger part mounting part 65... Guide 67... Guides 67a, 67b... Guide hole 69... Moving piece 71... Tactile sensor 73... Detection surface 75... Servo motor 79... Encoder 81... Ball screw 83... Pusher 87... Control unit CU... Shape information storage part 93... Processing condition information storage part 94... Clamping information storage part 95... Clamping control part 97...

Claims

1. In a substrate transfer device for transferring a substrate, a hand for holding the substrate in a horizontal posture, a horizontal drive mechanism for driving the hand to move forward and backward in a horizontal plane to transfer the substrate, at least two guides provided on the hand for sandwiching the outer peripheral surface of the substrate and holding the substrate while separating it from the hand, and a forward and backward drive mechanism for driving at least one of the at least two guides as a movable guide to move forward and backward with respect to the substrate. The hand, with respect to the form of the hand for holding the substrate, an upward pick-up in which the hand is located above the substrate and the guide sandwiches the outer peripheral surface of the substrate in a state where the hand and the substrate are separated, and a downward pick-up in which the hand is located below the substrate and the guide sandwiches the outer peripheral surface of the substrate in a state where the hand and the substrate are separated. The substrate transfer device is characterized by comprising two types of forms. A substrate transfer device characterized by the above.

2. In the substrate transfer device according to Claim 1, a plurality of the hands are provided, at least one of the plurality of hands is an upward pick-up hand in which the guide is provided on the lower surface of the hand, and at least one of the plurality of hands is a downward pick-up hand in which the guide is provided on the upper surface of the hand. A substrate transfer device characterized by the above.

3. In the substrate transfer device according to Claim 2, at least one of the upward pick-up hand and the downward pick-up hand is provided with a reversing portion for reversing one surface of the hand on which the guide is provided and the other surface of the hand on which the guide is not provided. A substrate transfer device characterized by the above.

4. In the substrate transfer device according to Claim 1, the hand is a double-sided hand in which the guides are provided on both the upper surface and the lower surface of the hand. A substrate transfer device characterized by the above.

5. In the substrate transfer device according to Claim 4, the double-sided hand is provided with a reversing portion for reversing the upper surface and the lower surface of the double-sided hand. A substrate transfer device characterized by the above.

6. In the substrate transfer device according to Claim 1, the guide is provided on either the upper surface or the lower surface of the hand, and the hand is provided with a reversing portion for reversing the surface on which the guide is provided and the other surface on which the guide is not provided. A substrate transfer device characterized by the above.

7. The substrate transfer device according to any one of claims 1 to 6, a control unit for controlling the substrate transfer device, a carrier placement unit for placing a carrier capable of accommodating a plurality of substrates stacked with a gap therebetween, a temporary placement unit for temporarily placing the substrate carried out from the carrier placement unit before being carried into the processing unit, a processing unit for performing a predetermined process on the substrate carried in from the carrier or the temporary placement unit, A substrate processing apparatus, characterized by comprising:

8. In the substrate processing apparatus according to claim 7, the control unit selects either the top pick-up or the bottom pick-up with respect to the form of the hand inserted into the carrier or the temporary placement unit according to the shape of the substrate accommodated in the carrier or the temporary placement unit. A substrate processing apparatus, characterized by:

9. In the substrate processing apparatus according to claim 7, the control unit selects either the top pick-up or the bottom pick-up with respect to the form of the hand inserted into the carrier or the temporary placement unit according to the gap information between the substrates placed on the carrier or the temporary placement unit. A substrate processing apparatus, characterized by:

10. In the substrate processing apparatus according to claim 9, the control unit selects either the top pick-up or the bottom pick-up with respect to the form of the hand inserted into the carrier or the temporary placement unit according to the gap information formed at the uppermost part in the carrier or the temporary placement unit. A substrate processing apparatus, characterized by:

11. In the substrate processing apparatus according to claim 7, the processing unit is at least two types of a first processing unit, a second processing unit, and a third processing unit, in the first processing unit, the form of the hand for carrying in and out the substrate is the top pick-up, in the second processing unit, the form of the hand for carrying in and out the substrate is the bottom pick-up, in the third processing unit, the form of the hand for carrying in and out the substrate is both the top pick-up and the bottom pick-up, the control unit selects the form of the hand according to the type of the processing unit. A substrate processing apparatus, characterized by:

12. In the substrate processing apparatus according to claim 7, the form of the hand when carrying in and out the substrate is the top pick-up or the bottom pick-up, the control unit changes the form of the hand that has carried out the substrate from the carrier or the temporary placement unit to match the form of the hand when carrying the substrate into the processing unit. A substrate processing apparatus, characterized by:

13. In the substrate processing apparatus according to claim 12, the control unit changes the form of the hand that has carried out the substrate from the carrier to match the form of the hand that carries the substrate into the processing unit, while temporarily placing the substrate carried out from the carrier on the temporary placement unit. A substrate processing apparatus characterized by this.

14. In the substrate processing apparatus according to claim 13, the control unit changes the pick-up hand to the pick-down hand, or changes the pick-down hand to the pick-up hand. A substrate processing apparatus characterized by this.

15. In the substrate processing apparatus according to claim 13, the control unit changes the surface for holding the substrate from the upper surface to the lower surface, or changes the surface for holding the substrate from the lower surface to the upper surface. A substrate processing apparatus characterized by this.

16. In the substrate processing apparatus according to claim 12, the control unit changes the form of the hand that has carried out the substrate from the carrier or the temporary placement unit while the hand is holding the substrate to match the form of the hand that carries the substrate into the processing unit. A substrate processing apparatus characterized by this.

17. In the substrate processing apparatus according to claim 16, the control unit changes the form of the hand by controlling an inversion unit that inverts one surface provided with the guide and the other surface not provided with the guide. A substrate processing apparatus characterized by this.

18. In the substrate processing apparatus according to claim 12, when the form of the hand that has carried out the substrate from the carrier or the temporary placement unit is the same as the form of the hand that carries the substrate into the processing unit, the control unit does not perform the change. A substrate processing apparatus characterized by this.

19. In the substrate processing apparatus according to claim 7, the substrate transfer device can transfer the substrate placed on the carrier to either the processing unit or the temporary placement unit. A substrate processing apparatus characterized by this.

20. In the substrate processing apparatus according to claim 7, the substrate transfer device transfers the substrate carried out from the carrier to the temporary placement unit. A substrate processing apparatus characterized by this.

21. In the substrate processing apparatus according to claim 7, the substrate transfer device transfers the substrate carried out from the temporary placement unit to the processing unit. A substrate processing apparatus characterized by this.

Images