Substrate processing apparatus

Abstract

To provide a substrate processing apparatus capable of avoiding contact to a substrate.SOLUTION: A control part of a substrate processing apparatus, progresses a hand 13 that does not support a substrate W into a carrier in order to fetch the substrate W from one shelf part 11 of a plurality of shelf parts 11, causes the hand 13 to be elevated in the carrier while monitoring an output from a tactile sensor 19A, causes the hand 13 to be elevated by a previously set upper side movement amount UW from a contact height position CNP of which contact is detected when the contact with the substrate W is detected by the tactile sensor 19A, and causes the hand 13 that supports the substrate W to exit from the carrier in an elevated position DUP at which the hand is elevated by the upper side movement amount UW from the contact height position CNP.SELECTED DRAWING: Figure 10

Description

Technical Field

[0001] The present invention relates to a substrate processing apparatus for processing a substrate. Examples of the substrate include a semiconductor substrate, a substrate for a flat panel display (FPD), a glass substrate for a photomask, a substrate for an optical disk, a substrate for a magnetic disk, a ceramic substrate, and a substrate for a solar cell. Examples of the FPD include a liquid crystal display device and an organic electroluminescence (EL) display device.

Background Art

[0002] Conventional substrate processing apparatuses include a carrier mounting portion for mounting a carrier and a transfer mechanism for transferring a substrate from the carrier on the carrier mounting portion (see, for example, Patent Document 1). The carrier includes a container and a plurality of shelves. The plurality of shelves are installed inside the container and arranged side by side in the vertical direction. The transfer mechanism includes a hand that supports a single substrate in a horizontal posture. Substrates are classified into a plurality of types according to their shapes. The substrate processing apparatus changes the height position of the hand when inserting the hand between two adjacent shelves in the vertical direction of the carrier according to the shape (type) of the substrate.

[0003] Patent Document 2 discloses a substrate transfer robot including a robot hand. The robot hand includes a Y-shaped hand body portion that is a portion for placing a substrate. Three tactile sensors are provided on the hand body portion for contacting and supporting the lower surface of the substrate. The sensor elements of the tactile sensors can detect the force applied from the substrate in three axial directions (X-axis direction, Y-axis direction, and Z-axis direction).

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, conventional substrate processing apparatuses have the following problems. The substrate transfer robot (transfer mechanism) picks up the substrate in the carrier by raising the hand by an upward movement amount from the taught reference height position. Also, the substrate transfer robot places the substrate in the carrier by lowering the hand by a downward movement amount from the reference height position.

[0006] The taught reference height position is determined by the height position at which the hand contacts the lower surface of the substrate in the carrier. However, there are individual differences in carriers. Therefore, the taught reference height position and the actual contact height position often do not match. As a result, for example, when withdrawing the hand from the carrier, the substrate supported by the hand may contact and rub against the shelf portion in the carrier. Also, for example, when withdrawing the hand from the carrier, the hand after placing the substrate on the shelf portion in the carrier may contact and rub against the substrate.

[0007] This is more likely to cause contact and rubbing in the case of substrates with special shapes (thick substrates obtained by laminating multiple substrates or warped substrates).

[0008] The present invention has been made in view of such circumstances, and an object thereof is to provide a substrate processing apparatus capable of avoiding contact with the substrate.

Means for Solving the Problems

[0009] In order to achieve such an object, the present invention has the following configuration. That is, a substrate processing apparatus for processing a substrate according to the present invention includes a carrier mounting portion for mounting a carrier, a substrate transfer robot having a hand for supporting the substrate in a horizontal posture and moving the hand, and a control portion for controlling the substrate transfer robot. The carrier includes a plurality of shelf portions provided vertically within the carrier and capable of mounting the substrates in a horizontal posture. The hand includes a hand body, a guide provided on the upper surface of the hand body for receiving the substrate, and a sensor for detecting that the guide has come into contact with the substrate. The control portion causes the hand not supporting the substrate to enter the carrier in order to pick up the substrate from one of the plurality of shelf portions, raises the hand within the carrier while monitoring the output from the sensor, and when the sensor detects contact with the substrate, raises the hand by a preset upward movement amount from the contact height position at which the contact is detected, and withdraws the hand supporting the substrate from within the carrier at an upward position raised by the upward movement amount from the contact height position.

[0010] According to the substrate processing apparatus of the present invention, in order to pick up a substrate from a shelf portion, the hand is raised by an upward movement amount from the actual contact height position at which the sensor detects contact with the substrate. Further, the hand supporting the substrate is withdrawn from within the carrier at an upward position raised by the upward movement amount from the actual contact height position. Therefore, when withdrawing the hand holding the substrate from within the carrier, even if there are individual differences in the carrier or a substrate having a special shape is used, for example, it is possible to avoid the substrate supported by the hand from contacting the shelf portion.

[0011] Also, in the above-described substrate processing apparatus, in order to place the substrate on one of the plurality of shelf portions, the control unit causes the hand that supports the substrate to enter the carrier, and while monitoring the output from the sensor, lowers the hand in the carrier. When the sensor detects the separation of the hand from the substrate, the hand is lowered by a preset downward movement amount from the separation height position at which the separation is detected, and at the lowered position lowered by the downward movement amount from the separation height position, the hand that does not support the substrate is preferably withdrawn from the carrier.

[0012] In order to place the substrate on the shelf portion, the hand is lowered by the downward movement amount from the actual separation height position at which the sensor detects the separation of the hand from the substrate. Also, the hand that does not support the substrate is withdrawn from the carrier at the lowered position lowered by the downward movement amount from the actual separation height position. Therefore, when withdrawing the hand that does not support the substrate from the carrier, even if there are individual differences in the carrier or a substrate with a special shape is used, for example, it is possible to avoid the hand contacting the substrate.

[0013] Also, in the above-described substrate processing apparatus, in order to place the substrate on one of the plurality of shelf portions, it is preferable that the control unit causes the hand that supports the substrate to enter the carrier at the raised position raised by the upward movement amount from the contact height position.

[0014] In order to place the substrate on the shelf portion, the hand enters the carrier at the raised position raised by the upward movement amount from the actual contact height position detected when picking up the substrate from the shelf portion. Therefore, when the hand that supports the substrate enters the carrier, even if there are individual differences in the carrier or a substrate with a special shape is used, for example, it is possible to avoid the hand contacting the substrate.

[0015] Further, in the above-described substrate processing apparatus, it is preferable that the control unit lowers the hand in the carrier from the rising position to a lowering position lowered by a preset downward movement amount from the contact height position, and at the lowering position, withdraws the hand not supporting the substrate from within the carrier.

[0016] To place the substrate on the shelf portion, the hand is lowered from the rising position to the lowering position. The rising position and the lowering position are height positions based on the actual contact height position detected when picking up the substrate. Also, the hand not supporting the substrate is withdrawn from within the carrier at a lowering position lowered by a downward movement amount from the actual contact height position. Therefore, when withdrawing the hand from within the carrier, even if there are individual differences in the carrier or a substrate with a special shape is used, for example, it is possible to avoid the hand contacting the substrate.

[0017] Further, in the above-described substrate processing apparatus, the control unit lowers the hand in the carrier while monitoring the output from the sensor, and when the sensor detects the separation of the hand from the substrate, the hand is lowered by a preset downward movement amount from the separation height position at which the separation is detected, and at the lowering position lowered by the downward movement amount from the separation height position, the hand not supporting the substrate is withdrawn from within the carrier.

[0018] To place the substrate on the shelf portion, the hand is lowered by a downward movement amount from the actual separation height position at which the sensor detects the separation of the hand from the substrate. Also, the hand not supporting the substrate is withdrawn from within the carrier at a lowering position lowered by a downward movement amount from the actual separation height position. Therefore, when withdrawing the hand from within the carrier, even if there are individual differences in the carrier or a substrate with a special shape is used, for example, it is possible to avoid the hand contacting the substrate. The present invention is effective when the separation height position may be different from the contact height position.

[0019] In addition, in the above-described substrate processing apparatus, in order to pick up the substrate from one of the plurality of shelf portions, the control unit lowers the hand that is not supporting the substrate to a lower position that is lowered by a preset downward movement amount from a pre-taught teaching height position, and preferably causes the hand to enter the carrier.

[0020] The hand enters the carrier at a height position based on the teaching height position. Therefore, it is possible to relatively avoid the hand that is not supporting the substrate from contacting the substrate.

[0021] In addition, in the above-described substrate processing apparatus, the hand includes a plurality of guides including the guide, the plurality of guides are provided on the upper surface of the guide body to receive the outer edge portion of the substrate, and the sensor preferably detects that one of the plurality of guides has contacted the substrate.

[0022] The plurality of guides of the hand can receive the outer edge portion of the substrate. In addition, the sensor can detect that one of the plurality of guides has contacted the substrate.

[0023] In addition, in the above-described substrate processing apparatus, the hand includes a plurality of guides including the guide and a plurality of sensors including the sensor, the plurality of guides are provided on the upper surface of the guide body to receive the outer edge portion of the substrate, the plurality of sensors are respectively provided on the plurality of guides, each of the plurality of sensors detects that the corresponding guide of the plurality of guides has contacted the substrate, and the control unit raises the hand in the carrier while monitoring the outputs from the plurality of sensors, and when at least one of the plurality of sensors detects contact with the substrate, it is preferable to raise the hand by a preset upward movement amount from the contact height position at which the contact is detected.

[0024] A plurality of guides of the hand can receive the outer edge portion of the substrate. A plurality of sensors can each detect that the plurality of guides have come into contact with the substrate. Further, when a substrate with a special shape is placed on the hand, the substrate may not be placed on a predetermined guide depending on the shape of the substrate. By providing a plurality of sensors, even if a predetermined guide does not contact the substrate, for example, if another guide contacts the substrate, the sensor corresponding to the other guide can detect the contact with the substrate.

[0025] Further, in an example of the substrate processing apparatus described above, when one of the plurality of sensors detects the first contact with the substrate, the control unit raises the hand by a preset upward movement amount from the contact height position at which the contact was detected. Also, in the substrate processing apparatus described above, an example of the sensor is a tactile sensor.

[0026] Further, a substrate processing apparatus for processing a substrate according to the present invention includes a carrier mounting portion for mounting a carrier, a hand for supporting the substrate in a horizontal posture, a substrate transfer robot for moving the hand, and a control unit for controlling the substrate transfer robot. The carrier includes a plurality of shelf portions provided in the vertical direction within the carrier and capable of mounting the substrates in a horizontal posture. The hand includes a hand body, a guide provided on the upper surface of the hand body for receiving the substrate, and a sensor for detecting that the guide has come into contact with the substrate. The control unit enters the hand for supporting the substrate into the carrier in order to place the substrate on one of the plurality of shelf portions, lowers the hand within the carrier while monitoring the output from the sensor, and when the sensor detects the separation of the hand from the substrate, lowers the hand by a preset downward movement amount from the separation height position at which the separation was detected, and withdraws the hand not supporting the substrate from within the carrier at the lowered position lowered by the downward movement amount from the separation height position.

[0027] According to the substrate processing apparatus of the present invention, in order to place the substrate on the shelf portion, the hand is lowered by a downward movement amount from the actual separation height position at which the sensor detects the separation of the hand from the substrate. Further, the hand that does not support the substrate is withdrawn from the carrier at the lowered position lowered by the downward movement amount from the actual separation height position. Therefore, when withdrawing the hand that does not support the substrate from the carrier, even if there are individual differences in the carrier or a substrate with a special shape is used, for example, it is possible to avoid the hand from contacting the substrate.

Effect of the Invention

[0028] According to the substrate processing apparatus of the present invention, contact with the substrate can be avoided.

Brief Description of the Drawings

[0029]

Figure 1

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Example 1

[0030] Hereinafter, Example 1 of the present invention will be described with reference to the drawings. FIG. 1 is a plan view showing a schematic configuration of a substrate processing apparatus 1 according to Example 1. FIG. 2 is a cross-sectional view of a carrier C, and FIG. 3 is a front view of the carrier C. FIG. 4 is a plan view of a hand 13 of a substrate transfer robot IR, and FIG. 5 is a longitudinal sectional view of the hand 13.

[0031] <1. Configuration of Substrate Processing Apparatus> Refer to FIG. 1. The substrate processing apparatus 1 processes a substrate W. The substrate processing apparatus 1 includes an index block 3 and a processing block 5. The index block 3 includes a plurality (for example, two) of carrier placement parts 7 and a substrate transfer robot IR. Note that the horizontal direction in which the index block 3 and the processing block 5 are arranged is the X direction. The horizontal direction in which the plurality of carrier placement parts 7 are arranged is the Y direction. The Y direction is orthogonal to the X direction.

[0032] Each of the two carrier placement parts 7 places a carrier C. The carrier C houses a plurality (for example, 25) of substrates W in a horizontal posture with a predetermined interval (for example, 10 mm) therebetween. The substrate W is formed in a disc shape. The substrate W may or may not have warpage and may be a laminate of a plurality of substrates. As the carrier C, for example, a FOUP (Front Opening Unify Pod) is used, but it is not limited thereto.

[0033] Refer to FIGS. 2 and 3. The carrier C includes a container 9 that houses a plurality of substrates W and a plurality (for example, 25) of shelf parts 11. The container 9 has an outlet 9A on the front surface. The substrate W in the container 9 of the carrier C is taken out through the outlet 9A. Also, the substrate W is stored through the outlet 9A. When the carrier C is transported, a lid part (not shown) that closes the outlet 9A is attached to the container 9.

[0034] The plurality of shelf parts 11 are provided in the vertical direction Z within the carrier C (container 9). In the vertical direction Z, the plurality of shelf parts 11 are arranged at equal intervals (for example, 10 mm intervals). Each of the plurality of shelf parts 11 can place one substrate W in a horizontal posture.

[0035] The shelf part 11 includes a plurality (for example, 25) of shelves 11A and a plurality (for example, 25) of shelves 11B. The 25 shelves 11A are provided on the left inner wall 9B of the container 9, and the 25 shelves 11B are provided on the right inner wall 9C of the container 9. The 25 shelves 11A face the 25 shelves 11B respectively. One substrate W is placed on each pair of shelves 11A and 11B.

[0036] Refer to FIGS. 1, 4, and 5. The substrate transfer robot IR includes a hand 13 that supports a single substrate W in a horizontal posture and moves the hand 13. The substrate transfer robot IR transfers the substrate W between two carriers C of two carrier placement portions 7 and a substrate placement portion PS described later. As shown in FIGS. 4 and 5, the hand 13 includes a hand body 15, four guides 17A, 17B, 17C, 17D, and four tactile sensors 19A, 19B, 19C, 19D.

[0037] The hand body 15 is formed in a Y shape in plan view. The hand body 15 includes one palm portion 21 (palm part) and two finger portions 23, 24. Both of the two finger portions 23, 24 are formed to extend from the palm portion 21 in a predetermined horizontal direction HD1. The finger portion 23 is arranged away from the finger portion 24.

[0038] The four guides 17A to 17D are provided on the upper surface of the hand body 15. Each of the four guides 17A to 17D receives the outer edge portion of the substrate W. Two guides 17A, 17B are provided on the upper surface of the finger portion 23. Two guides 17C, 17D are provided on the upper surface of the finger portion 24. The guide 17A is arranged on the tip side of the finger portion 23. The guide 17B is arranged closer to the palm portion 21 than the guide 17A. The guide 17C is arranged on the tip side of the finger portion 24. The guide 17D is arranged closer to the palm portion 21 than the guide 17C.

[0039] Each of the guides 17A to 17D includes a receiving portion 27 and a guide wall 28. The outer edge portion of the substrate W in a horizontal posture is placed on each of the four receiving portions 27. In each of the guides 17A to 17D, the upper surface of the guide wall 28 is formed to be higher than the upper surface of the receiving portion 27. Therefore, the four guide walls 28 surround the substrate W placed on the four receiving portions 27 and restrict the movement of the substrate W in the horizontal direction.

[0040] The four tactile sensors 19A, 19B, 19C, and 19D are provided between the four guides 17A, 17B, 17C, and 17D and the hand body 15. In other words, the four tactile sensors 19A to 19D are respectively provided below or on the lower surface of the four guides 17A to 17D. The four tactile sensors 19A to 19D are embedded in the hand body 15.

[0041] The four tactile sensors 19A to 19D respectively detect that the four guides 17A to 17D have come into contact with the substrate W. Specifically, the tactile sensor 19A detects that the upper surface of the guide 17A (receiving portion 27) has come into contact with the substrate W. The tactile sensor 19B detects that the upper surface of the guide 17B has come into contact with the substrate W. The tactile sensor 19C detects that the upper surface of the guide 17C has come into contact with the substrate W. The tactile sensor 19D detects that the upper surface of the guide 17D has come into contact with the substrate W.

[0042] The four tactile sensors 19A to 19D are each, for example, a multi-axis force sensor such as a 6-axis or 3-axis force sensor, but may also be a 1-axis (Z-axis) force sensor (load cell). Note that a 6-axis force sensor is a sensor that can measure three-axis force (Fx, Fy, Fz) and three-axis moment (Mx, My, Mz). As the detection method of the force sensor, for example, an electric resistance type, a capacitance type, a piezoelectric type, or an optical type is used. For example, when the tactile sensor 19A detects a load equal to or greater than a preset upper threshold value in the Z-axis (vertical direction Z), it detects that the guide 17A has come into contact with the substrate W. Also, when the tactile sensor 19A detects a load less than a preset lower threshold value in the Z-axis, it detects that the guide 17A is not in contact with the substrate W or that the guide 17A has separated from the substrate W. The same applies to the three tactile sensors 19B to 19D.

[0043] FIG. 6 is a side view of the substrate transfer robot IR. The substrate transfer robot IR includes a multi-joint arm 31 and a lifting table 33 in addition to the hand 13. The multi-joint arm 31 is composed of, for example, a scalar type robot arm. The base end portion (base end part) of the multi-joint arm 31 is attached to the lifting table 33. Also, the tip end portion (tip end part) of the multi-joint arm 31 connects the hand 13. The multi-joint arm 31 moves the hand 13 that supports the substrate W in the horizontal direction. The multi-joint arm 31 is driven by a plurality of electric motors including the electric motor of the rotation drive unit 31D described later.

[0044] The multi-joint arm 31 includes, for example, a first arm 31A, a second arm 31B, a third arm 31C, and a rotation drive unit 31D. The base end portion of the first arm 31A is rotatably attached to the rotation drive unit 31D around the vertical axis AX1. The base end portion of the second arm 31B is rotatably attached to the tip end portion of the first arm 31A around the vertical axis AX2. The base end portion of the third arm 31C is rotatably attached to the tip end portion of the second arm 31B around the vertical axis AX3. Also, the tip end portion of the third arm 31C is connected to the base end portion of the hand 13. The rotation drive unit 31D includes an electric motor. The rotation drive unit 31D rotates the first arm 31A around the vertical axis AX1.

[0045] The lifting table 33 raises and lowers the hand 13 and the multi-joint arm 31. The lifting table 33 includes a slider 33A, a guide rail 33B, a screw shaft 33C, an electric motor 33D, and a rotary encoder 33E. The slider 33A is fixed to, for example, the rotation drive unit 31D of the multi-joint arm 31. The guide rail 33B and the screw shaft 33C are each arranged to extend in the vertical direction Z. The guide rail 33B penetrates the slider 33A. The screw shaft 33C meshes with the internal thread 33F of the slider 33A. The output shaft of the electric motor 33D is connected to the lower end of the screw shaft 33C.

[0046] When the electric motor 33D rotates the screw shaft 33C in the positive direction about the axis, the slider 33A, the rotary drive unit 31D, and the hand 13 are raised. Also, when the electric motor 33D rotates the screw shaft 33C in the reverse direction about the axis, the slider 33A, the rotary drive unit 31D, and the hand 13 are lowered. The rotary encoder 33E measures the rotational movement amount of the output shaft of the electric motor 33D and the screw shaft, thereby measuring the height position of the hand 13. Although the rotary encoder 33E is used as the height position sensor, a linear encoder may be used instead of the rotary encoder 33E.

[0047] Refer to FIG. 1. The processing block 5 includes a plurality of processing units 37, a center robot CR, and a substrate placement unit PS. The substrate placement unit PS is provided between the substrate transfer robot IR and the center robot CR. The substrate placement unit PS can place one or more substrates W.

[0048] The processing unit 37 performs a preset process on the substrate W. For example, each processing unit 37 includes, for example, a holding and rotating unit 39 and a nozzle 41. The holding and rotating unit 39 includes a spin chuck that holds one substrate W in a horizontal posture, and an electric motor that rotates the spin chuck about a vertical axis passing through the center of the substrate W. The nozzle 41 discharges a processing liquid onto the upper surface of the substrate W held by the holding and rotating unit 39.

[0049] The center robot CR includes a hand 43 that supports one substrate W in a horizontal posture. The center robot CR can move the hand 43. The center robot CR can transfer the substrate W between the plurality of processing units 37 and the substrate placement unit PS.

[0050] The substrate processing apparatus 1 includes a control unit 51 and a storage unit 53. The control unit 51 controls each component of the substrate processing apparatus 1. The control unit 51 includes one or more processors such as a central processing unit (CPU). The storage unit includes at least one of, for example, a ROM (Read-Only Memory), a RAM (Random-Access Memory), and an auxiliary storage device (e.g., a hard disk). The storage unit stores computer programs necessary for controlling each component of the substrate processing apparatus 1.

[0051] The four tactile sensors 19A to 19D and the rotary encoder 33E are each connected to the control unit 51 by signal lines. Therefore, the control unit 51 can control the substrate transfer robot IR based on the output signals of the four tactile sensors 19A to 19D and the rotary encoder 33E.

[0052] <2. Operation of the Substrate Processing Apparatus> Next, the operation of the substrate processing apparatus 1 will be described with reference to the flowchart of FIG. 7.

[0053] 〔Step S01〕Teaching Operation The substrate transfer robot IR performs an operation of picking up (obtaining) the substrate W placed on the shelf portion 11 with the hand 13 and an operation of placing the substrate W on the shelf portion 11 with the hand 13 based on the taught height position (hereinafter appropriately referred to as the "teaching height position TP"). The teaching height position TP is obtained by performing a teaching operation on the substrate transfer robot IR. The teaching operation is performed when the substrate processing apparatus 1 does not perform processing on the product substrate.

[0054] First, prepare 25 teaching substrates stored in a good carrier C. Each teaching substrate is, for example, a flat substrate with warping suppressed. Place the carrier C on one of the two carrier placement portions 7.

[0055] After that, the operator operates the substrate transfer robot IR as follows using an operation panel (not shown). First, the hand 13 of the substrate transfer robot IR is moved into the carrier C so as to be positioned below a predetermined substrate W. Then, by raising the hand 13, at least one of the four guides 17A to 17D of the hand 13 is brought into contact with the lower surface of the substrate W. Whether or not they are in contact may be visually checked by the operator, or may be detected by the tactile sensors 19A to 19D.

[0056] At this time, the rotary encoder 33E of the lift 33 of the substrate transfer robot IR measures the height position at which at least one of the four guides 17A to 17D contacts the substrate W. This height position is stored in the storage unit 53 as the teaching height position TP. Such an operation is performed on the 25 teaching substrates placed on the 25 shelf portions 11. As a result, 25 teaching height positions TP are acquired for one carrier C. Also, the teaching operation is performed for each carrier placement unit 7. After the teaching operation is performed, the substrate processing apparatus 1 processes the substrate W (product substrate).

[0057] 〔Step S02〕Operation of taking out the substrate (product substrate) in the carrier An external transfer robot (not shown) transfers the carrier C in which 25 substrates W (product substrates) are stored to one of the two carrier placement units 7. Here, the operation of taking out the substrate W in the conventional carrier C and its problems will be described. First, the operation of taking out the substrate W will be described with reference to FIG. 8.

[0058] FIG. 8 is a side view for explaining a conventional operation of taking out the substrate W from a predetermined shelf portion 11 in the carrier C. The substrate transfer robot IR moves the hand 13 to the lower position LP lowered by the downward movement amount DW from the teaching height position TP. Note that the downward movement amount DW is a preset constant value. The downward movement amount DW is also called the downward offset value.

[0059] Thereafter, the substrate transfer robot IR advances the hand 13 positioned at the lower position LP, and causes the hand 13 that does not support the substrate W to enter the carrier C so as to be positioned below the predetermined substrate W (see arrow YA1). Thereafter, the substrate transfer robot IR raises the hand 13 from the lower position LP to the upper position UP (see arrow YA2). At this time, the hand 13 picks up the predetermined substrate W from the shelf portion 11. The upper position UP is a position raised by an upward movement amount UW from the teaching height position TP. The upward movement amount UW is a preset constant value. The upward movement amount UW (absolute value) may be the same as the downward movement amount DW (absolute value), or may be different from the downward movement amount DW (absolute value). The upward movement amount UW is also referred to as an upper offset value.

[0060] Thereafter, the substrate transfer robot IR retracts the hand 13 positioned at the upper position UP, and causes the hand 13 that supports the substrate W to exit from the carrier C (see arrow YA3). By these series of operations, one substrate W is taken out from the carrier C.

[0061] Refer to FIG. 9. In FIG. 9, the solid line indicates the actual shelf portion 11, and the broken line indicates the shelf portion 11E at the time of teaching. As an example where the teaching height position TP and the actual contact height position CNP do not become the same, for example, it is assumed that due to individual differences of the carrier C, the shelf portion 11 may be at a position higher than the shelf portion 11E at the time of teaching. In this case, when the hand 13 is raised by the upward movement amount UW from the teaching height position TP, the hand 13 does not rise sufficiently with respect to the shelf portion 11 on which the substrate W was placed. That is, as shown by the circular frame MR1 in FIG. 9, the gap between the substrate W supported by the hand 13 and the shelf portion 11 is small. Therefore, when the hand 13 exits from the carrier C, there is a possibility of contact and rubbing between the lower surface of the substrate W and the upper surface of the shelf portion 11. In the case of a substrate with a special shape (for example, a thick substrate in which a plurality of substrates are bonded together or a warped substrate), the possibility of contact and rubbing becomes higher. Therefore, it operates as follows.

[0062] Refer to FIGS. 10 and 11. FIG. 10 is a side view for explaining the operation of taking the substrate W from a predetermined shelf portion 11 in the carrier C according to the first embodiment. FIG. 11 is a flowchart showing the operation of taking the substrate W.

[0063] The substrate transfer robot IR moves to the lower position LP lowered by the preset downward movement amount DW from the pre-taught teaching height position in order to take the substrate W from one of the 25 shelf portions 11 in the carrier C. Then, the substrate transfer robot IR advances the hand 13 located at the lower position LP. Thereby, the substrate transfer robot IR causes the hand 13 not supporting the substrate W to enter the carrier C (container 9) at the lower position LP (step S11).

[0064] Thereafter, the substrate transfer robot IR raises the hand 13 from the lower position LP in the carrier C while monitoring the outputs from the four tactile sensors 19A to 19D (step S12). At this time, the upward movement amount of the hand 13 is preset and may be the same amount as the upward movement amount UW or may be an amount larger than the upward movement amount UW. For example, when contact with the substrate W is detected by at least one of the four tactile sensors 19A to 19D during the upward movement of the hand 13, the control unit 51 acquires the contact height position CNP at which the contact is detected from the rotary encoder 33E (steps S13, S14).

[0065] The operation of acquiring this contact height position CNP will be specifically described. For example, when the tactile sensor 19A detects that the guide 17A has contacted the substrate W, the control unit 51 acquires the contact height position CNP1 at which the contact is detected from the rotary encoder 33E. Similarly, when the three tactile sensors 19B to 19D detect that the three guides 17B to 17D have respectively contacted the substrate W, the control unit 51 acquires the respective contact height positions CNP2, CNP3, and CNP4 from the rotary encoder 33E. For example, the contact height position CNP1 is the height position at which the guide 17A contacts the substrate W. The contact height position CNP4 is the height position at which the guide 17D contacts the substrate W.

[0066] For example, it is assumed that they are detected in the order of the contact height position CNP1, the contact height position CNP2, the contact height position CNP3, and the contact height position CNP4. That is, the contact height position CNP1 is the lowest position, and the contact height position CNP4 is the highest value. For example, the contact height position CNP1 that first makes contact may be used as the contact height position CNP (representative value). That is, the contact height position CNP1 may be replaced with the teaching height position TP. Also, the contact height position CNP4 that makes contact last may be used as the contact height position CNP. Further, the average value of the four contact height positions CNP1 to CNP4 may be used as the contact height position CNP.

[0067] For example, when one of the four tactile sensors 19A to 19D detects the first contact with the substrate W, the control unit 51 may acquire the contact height position CNP by means of the rotary encoder 33E. Also, when one of the four tactile sensors 19A to 19D detects the last contact with the substrate W, the control unit 51 may acquire the contact height position CNP by means of the rotary encoder 33E. Further, when each of the four tactile sensors 19A to 19D detects contact with the substrate W, the control unit 51 may acquire, by means of the rotary encoder 33E, the four contact height positions CNP1 to CNP4 at which those contacts are detected, and may acquire the average value (contact height position CNP) of the four contact height positions CNP1 to CNP4.

[0068] Also, the substrate transfer robot IR raises the hand 13 by the upward movement amount UW from the contact height position CNP (step S15). Thereby, the hand 13 picks up (acquires) the substrate W from the predetermined shelf portion 11. The raised position DUP is the position raised by the upward movement amount UW from the contact height position CNP. Thereafter, the substrate transfer robot IR withdraws the hand 13 that supports the substrate W from the carrier C at the raised position DUP (step S16). That is, the substrate transfer robot IR withdraws the hand 13 located at the raised position DUP backward, thereby withdrawing the hand 13 that supports the substrate W from inside the carrier C.

[0069] The substrate transfer robot IR transfers the substrate W taken out from within the carrier C to the substrate placement unit PS. Also, the remaining 24 substrates W within the carrier C are similarly taken out in order by the substrate transfer robot IR and transferred to the substrate placement unit PS.

[0070] 〔Step S03〕Substrate processing The center robot CR uses the hand 43 to transfer the substrate W from the substrate placement unit PS to any one of the plurality of processing units 37. Each processing unit 37 performs a preset process on the substrate W conveyed by the center robot CR. The center robot CR takes out the substrate W on which the preset process has been performed from one of the plurality of processing units 37 and transfers the substrate W to the substrate placement unit PS.

[0071] 〔Step S04〕Storage of substrate (product substrate) in carrier Here, the operation of placing the substrate W in the conventional carrier C and its problems will be described. First, with reference to FIG. 12, the conventional operation of placing the substrate W will be described.

[0072] FIG. 12 is a side view for explaining the conventional operation of placing the substrate W on a predetermined shelf portion 11 within the carrier C. The substrate transfer robot IR moves the hand 13 that supports the substrate W to the upper position UP raised by the upward movement amount UW from the teaching height position TP. Thereafter, the substrate transfer robot IR advances the hand 13 located at the upper position UP so that the hand 13 that supports the substrate W enters the carrier C to be located above the predetermined shelf portion 11 (see arrow YA4).

[0073] Thereafter, the substrate transfer robot IR lowers the hand 13 from the upper position UP to the lower position LP (see arrow YA5). At this time, the hand 13 places the substrate W on the upper surface of the predetermined shelf portion 11. Thereafter, the substrate transfer robot IR retreats the hand 13 located at the lower position LP to withdraw the hand 13 that does not support the substrate W from within the carrier C (see arrow YA6). By these series of operations, one substrate W is stored within the carrier C.

[0074] Refer to FIG. 13. In FIG. 13, the solid line indicates the actual shelf portion 11, and the dashed line indicates the shelf portion 11E during teaching. As an example where the teaching height position TP and the actual contact height position CNP do not coincide, for example, assume that due to individual differences in the carrier C, the shelf portion 11 may be at a position lower than the shelf portion 11E during teaching. In this case, when the hand 13 is lowered by the downward movement amount DW from the teaching height position TP, the hand 13 does not lower sufficiently with respect to the shelf portion 11 on which the substrate W is placed. That is, as shown by the round frame MR2 in FIG. 13, the gap between the hand 13 (guides 17A to 17D) and the substrate W placed on the shelf portion 11 is small. Therefore, when withdrawing the hand 13 from within the carrier C, there is a possibility of contact and rubbing between the lower surface of the substrate W and the hand 13 (guides 17A to 17D). Note that the possibility of contact and rubbing is higher in the case of a substrate W with a special shape. Therefore, it operates as follows.

[0075] Refer to FIGS. 14 and 15. FIG. 14 is a side view for explaining the operation of placing the substrate W on a predetermined shelf portion 11 within the carrier C according to the first embodiment. FIG. 15 is a flowchart showing the operation of placing the substrate W.

[0076] The substrate transfer robot IR picks up the substrate W from the substrate placement portion PS. Thereafter, the substrate transfer robot IR moves the hand 13 that supports the substrate W to the upper position UP raised by the upward movement amount UW from the teaching height position TP in order to place the substrate W on one of the 25 shelf portions 11. Thereafter, the substrate transfer robot IR advances the hand 13 at the upper position UP. Thereby, the substrate transfer robot IR causes the hand 13 that supports the substrate W to enter the carrier C (step S21).

[0077] Thereafter, while the substrate transfer robot IR monitors the outputs from the four tactile sensors 19A to 19D, it lowers the hand 13 from the upper position UP within the carrier C (step S22). For example, during the lowering of the hand 13, when at least one of the four tactile sensors 19A to 19D detects the separation of the hand 13 from the substrate W, the control unit 51 obtains, from the rotary encoder 33E, the separation height position SEP at which the separation is detected (steps S23, S24). When the separation of the hand 13 from the substrate W is detected, that is, when the separation height position SEP is obtained, the substrate W is placed on a predetermined shelf portion 11.

[0078] The operation of obtaining this separation height position SEP will be specifically described. For example, when the tactile sensor 19A detects the separation of the guide 17A from the substrate W, the control unit 51 obtains, from the rotary encoder 33E, the separation height position SEP1 at which the separation is detected. Similarly, when the three tactile sensors 19B to 19D respectively detect the separation of the three guides 17B to 17D from the substrate W, the control unit 51 obtains, from the rotary encoder 33E, the respective separation height positions SEP2, SEP3, and SEP4. For example, the separation height position SEP1 is the height position at which the guide 17A separates from the substrate W. The separation height position SEP4 is the height position at which the guide 17D separates from the substrate W.

[0079] For example, it is assumed that the separation height positions SEP1, SEP2, SEP3, and SEP4 are detected in this order. That is, the separation height position SEP1 is the highest position, and the separation height position SEP4 is the lowest value. For example, the first detected separation height position SEP1 may be used as the reference separation height position SEP (representative value). That is, the separation height position SEP1 may be replaced with the teaching height position TP. Also, the last detected separation height position SEP4 may be used as the separation height position SEP. Further, the average value of the four separation height positions SEP1 to SEP4 may be used as the separation height position SEP.

[0080] For example, the control unit 51 may operate as follows. When one of the four tactile sensors 19A to 19D detects the first separation of the hand 13 from the substrate W, the control unit 51 may acquire the separation height position SEP by means of the rotary encoder 33E. Also, when one of the four tactile sensors 19A to 19D detects the last separation of the hand 13 from the substrate W, the control unit 51 may acquire the contact height position CNP by means of the rotary encoder 33E. Further, when each of the four tactile sensors 19A to 19D detects the separation of the hand 13 from the substrate W, the control unit 51 may acquire, by means of the rotary encoder 33E, the four separation height positions SEP1 to SEP4 at which the separation was detected, and may acquire the average value (contact height position CNP) of the four separation height positions SEP1 to SEP4.

[0081] Also, the substrate transfer robot IR lowers the hand 13 by the downward movement amount DW from the separation height position SEP (step S25). The lowered position DLP1 is the position lowered by the downward movement amount DW from the separation height position SEP. Thereafter, the substrate transfer robot IR withdraws the hand 13 that does not support the substrate W from within the carrier C at the lowered position DLP1 (step S26). That is, the substrate transfer robot IR withdraws the hand 13 that does not support the substrate W from within the carrier C by retracting the hand 13 located at the lowered position DLP1.

[0082] The remaining 24 substrates W placed in order on the substrate placement unit PS are also transported in the same manner. That is, the remaining 24 substrates W are also transported as in steps S21 to S26. When the 25 processed substrates W are stored in the carrier C, an external transfer robot (not shown) transfers the carrier C from the carrier placement unit 7 to the next destination.

[0083] [Step S05] Repeat? Thereafter, when processing the substrate W, which is a product substrate to be stored in another carrier (YES case shown in FIG. 7), the process returns to step S02. Also, when performing the teaching operation of step S01 again (NO case shown in FIG. 7), the flowchart shown in FIG. 7 is terminated.

[0084] According to this embodiment, in order to pick up the substrate W from the shelf portion 11, the hand 13 is raised by an upward movement amount UW from the actual contact height position CNP at which the tactile sensors 19A to 19D detect contact with the substrate W. Further, the hand 13 that supports the substrate W is withdrawn from inside the carrier C at the raised position DUP that is raised by the upward movement amount UW from the actual contact height position CNP. Therefore, when withdrawing the hand 13 that holds the substrate W from inside the carrier C, even if there are individual differences in the carrier C or a substrate W with a special shape is used, for example, it is possible to avoid the substrate W supported by the hand 13 from contacting the shelf portion 11.

[0085] FIG. 16 is a front view for explaining the effect of the operation of picking up a substrate with a special shape. For example, in the substrate W shown in FIG. 16, the central region of the substrate W is warped so as to protrude upward. Similarly in this case, when picking up the substrate W from a predetermined shelf portion 11, even if the hand 13 is raised by the upward movement amount UW from the teaching height position TP, as shown by the round frame MR3 in FIG. 16, it cannot be sufficiently separated from the shelf portion 11. Therefore, for example, there is a possibility that the substrate W supported by the hand 13 contacts and rubs against the upper surface of the shelf portion 11. However, the hand 13 is withdrawn from inside the carrier C in a state where it is raised by the upward movement amount UW from the actual contact height position CNP. Therefore, it is possible to avoid the substrate W supported by the hand 13 from contacting and rubbing against the shelf portion 11.

[0086] In order to place the substrate W on the shelf portion 11, the hand 13 is lowered by a downward movement amount DW from the actual separation height position SEP at which the tactile sensors 19A to 19D detect the separation of the substrate W from the hand 13. Further, the hand 13 that does not support the substrate W is withdrawn from inside the carrier C at the lowered position DLP1 that is lowered by the downward movement amount DW from the actual separation height position SEP. Therefore, when withdrawing the hand 13 that does not support the substrate W from inside the carrier C, even if there are individual differences in the carrier C or a substrate W with a special shape is used, for example, it is possible to avoid the hand 13 from contacting the substrate W.

[0087] Further, the hand 13 enters the carrier C at a height position based on the teaching height position TP. Therefore, it is possible to relatively avoid the hand 13 that does not support the substrate W from contacting the substrate W.

[0088] The four guides 17A to 17D of the hand 13 can receive the outer edge portion of the substrate W. The four tactile sensors 19A to 19D can each detect that the four guides 17A to 17D have contacted the substrate W. Further, when a substrate W with a special shape is placed on the hand 13, the substrate W may not be placed on the guide 17A, for example, depending on the shape of the substrate W. By providing the four tactile sensors 19A to 19D, even if the guide 17A does not contact the substrate W, for example, if the other guides 17B to 17D contact the substrate W, the tactile sensors 19B to 19D corresponding to the other guides 17B to 17D can detect the contact with the substrate W.

Example 2

[0089] Next, Example 2 of the present invention will be described with reference to the drawings. Note that descriptions overlapping with Example 1 are omitted. FIG. 17 is a side view for explaining the operation of placing the substrate W on a predetermined shelf portion 11 in the carrier C according to Example 2. FIG. 18 is a flowchart for explaining the operation of placing the substrate W according to Example 2.

[0090] In Example 1, in step S21 shown in FIG. 15, the substrate transfer robot IR caused the hand 13 that supports the substrate W to enter at the upper position UP raised by the upward movement amount UW from the teaching height position TP. Further, in steps 23 and 24 shown in FIG. 15, when at least one of the four tactile sensors 19A to 19D detected the separation of the hand 13 from the substrate W, the substrate transfer robot IR lowered the hand 13 by the downward movement amount DW from the separation height position SEP.

[0091] In this regard, in the second embodiment, the substrate transfer robot IR may move the hand 13 that supports the substrate W to the raised position DUP raised by the upward movement amount UW from the contact height position CNP. Further, the substrate transfer robot IR may lower the hand 13 to the lowered position DLP2 lowered by the downward movement amount DW from the contact height position CNP.

[0092] In the flowchart of FIG. 11, for example, when at least any one of the four tactile sensors 19A to 19D detects the contact between the hand 13 and the substrate W, the control unit 51 acquires the contact height position CNP at which the contact is detected from the rotary encoder 33E (steps S13, S14). For example, the control unit 51 stores the difference value DF between the contact height position CNP and the teaching height position TP in the storage unit 53. That is, the control unit 51 stores 25 difference values DF corresponding to the 25 shelf portions 11 in the storage unit 53.

[0093] Refer to FIGS. 17 and 18. The flowchart of FIG. 18 omits steps S23, S24, and S25 as compared with the flowchart of FIG. 15. In the present embodiment, the 25 difference values DF stored in the storage unit 53 are used for the operation of placing the substrate W on a predetermined shelf portion 11 in the carrier C. That is, the control unit 51 reads out 25 teaching height positions TP and 25 difference values DF from the storage unit 53. Thereafter, the control unit 51 corrects each of the 25 teaching height positions TP with the 25 difference values DF. As a result, 25 height positions corresponding to the 25 contact height positions CNP are obtained. These 25 height positions will be hereinafter described as 25 contact height positions CNP. The 25 contact height positions CNP are stored in the storage unit 53, for example.

[0094] The substrate transfer robot IR moves the hand 13 that supports the substrate W to the raised position DUP raised by the upward movement amount from the contact height position CNP in order to place the substrate W on one of the 25 shelf portions 11. Thereafter, the substrate transfer robot IR causes the hand 13 that supports the substrate W at the raised position DUP to enter the carrier C (step S21).

[0095] After that, the substrate transfer robot IR lowers the hand 13 from the ascending position DUP to the descending position DLP2 within the carrier C (step S22A). At this time, the hand 13 places the substrate W on the upper surface of the predetermined shelf portion 11. The descending position DLP2 is a height position lowered by the downward movement amount DW from the contact height position CNP. After that, the substrate transfer robot IR withdraws the hand 13 that does not support the substrate W from within the carrier C at the descending position DLP2 (step S26).

[0096] According to this embodiment, in order to place the substrate W on the shelf portion 11, the hand 13 enters the carrier C at the ascending position DUP that is raised by the upward movement amount UW from the actual contact height position CNP detected when taking the substrate W on the shelf portion 11. Therefore, when the hand 13 that supports the substrate W enters the carrier C, even if there are individual differences in the carrier C or a substrate W with a special shape is used, for example, it is possible to avoid the hand 13 from contacting the substrate W.

[0097] Also, in order to place the substrate W on the shelf portion 11, the hand 13 is lowered from the ascending position DUP to the descending position DLP2. The ascending position DUP and the descending position DLP2 are height positions based on the actual contact height position CNP detected when taking the substrate W. Also, the hand 13 that does not support the substrate W is withdrawn from within the carrier C at the descending position DLP2 that is lowered by the downward movement amount DW from the actual contact height position CNP. Therefore, when withdrawing the hand 13 from within the carrier C, even if there are individual differences in the carrier C or a substrate W with a special shape is used, for example, it is possible to avoid the hand 13 from contacting the substrate W.

[0098] Note that in this embodiment, the control unit 51 caused the storage unit 53 to store 25 difference values DF corresponding to the 25 shelf portions 11. In this regard, the control unit 51 may cause the storage unit 53 to store 25 contact height positions CNP corresponding to the 25 shelf portions 11. Also, the control unit 51 may store 25 ascending positions DUP corresponding to the 25 shelf portions 11. Each of the 25 ascending positions DUP is a height position raised by the upward movement amount DW from the contact height position CNP.

Example 3

[0099] Next, Example 3 of the present invention will be described with reference to the drawings. Note that descriptions overlapping with those of Examples 1 and 2 are omitted. FIG. 19 is a side view for explaining the operation of placing the substrate W on a predetermined shelf portion 11 in the carrier C according to Example 3.

[0100] In Example 1, in step S21 shown in FIG. 15, the substrate transfer robot IR advanced the hand 13 that supports the substrate W at the upper position UP raised by the upward movement amount UW from the teaching height position TP. In this regard, in Example 3, the substrate transfer robot IR may advance the hand 13 that supports the substrate W at the raised position DUP raised by the upward movement amount UW from the contact height position CNP.

[0101] In the flowchart of FIG. 11, the control unit 51 acquires the contact height position CNP (steps S13, S14). For example, the control unit 51 causes the storage unit 53 to store the difference value DF between the contact height position CNP and the teaching height position TP. That is, the control unit 51 causes the storage unit 53 to store 25 difference values DF corresponding to the 25 shelf portions 11.

[0102] Also in this embodiment, the 25 difference values DF stored in the storage unit 53 are used for the operation of placing the substrate W on a predetermined shelf portion 11 in the carrier C. That is, the control unit 51 corrects the 25 teaching height positions TP with the 25 difference values DF respectively. Thereby, 25 contact height positions CNP are acquired.

[0103] Referring to FIGS. 15 and 19. The substrate transfer robot IR advances the hand 13 that supports the substrate W into the carrier C at the raised position DUP raised by the upward movement amount UW from the contact height position CNP in order to place the substrate W on the shelf portion 11 (step S21). The control unit 51 lowers the hand in the carrier C while monitoring the outputs from the four tactile sensors 19A to 19D (step S22).

[0104] For example, when at least one of the four tactile sensors 19A to 19D detects the separation of the hand 13 from the substrate W, the control unit 51 obtains the separation height position SEP at which the separation is detected from the rotary encoder 33E (steps S23, S24). Thereafter, the substrate transfer robot IR lowers the hand 13 by the downward movement amount DW from the separation height position SEP (step S25). Thereafter, the substrate transfer robot IR withdraws the hand 13 that does not support the substrate W from within the carrier C at the lowered position DLP1 (step S26). Note that the lowered position DLP1 is a position lowered by the downward movement amount DW from the separation height position SEP.

[0105] According to the present embodiment, in order to place the substrate W on the shelf portion 11, the hand 13 enters the carrier C at the raised position DUP raised by the upward movement amount UW from the actual contact height position CNP detected when taking the substrate W on the shelf portion 11. Therefore, when the hand 13 that supports the substrate W enters the carrier C, even if there are individual differences in the carrier C or a substrate W with a special shape is used, for example, it is possible to avoid the hand 13 from contacting the substrate W.

[0106] Also, in order to place the substrate W on the shelf portion 11, the hand 13 is lowered by the downward movement amount DW from the actual separation height position SEP at which the tactile sensors 19A to 19D detect the separation of the hand 13 from the substrate W. Further, the hand 13 that does not support the substrate W is withdrawn from within the carrier C at the lowered position DLP1 lowered by the downward movement amount DW from the actual separation height position SEP. Therefore, when withdrawing the hand 13 from within the carrier C, even if there are individual differences in the carrier C or a substrate W with a special shape is used, for example, it is possible to avoid the hand 13 from contacting the substrate W. This embodiment is effective when the separation height position SEP may be different from the contact height position CNP.

[0107] The present invention is not limited to the above-described embodiment and can be modified as follows.

[0108] (1) In each of the above-described embodiments, the hand 13 is provided with four tactile sensors 19A to 19D for the four guides 17A to 17D. In this regard, the hand 13 may be provided with at least one tactile sensor for the four guides 17A to 17D. The at least one tactile sensor can detect that at least one of the four guides 17A to 17D has come into contact with the substrate W.

[0109] (2) In each of the above-described embodiments and modification (1), the hand 13 shown in FIG. 4 is provided with four guides 17A to 17D. In this regard, the hand 13 may be provided with three or more guides. Also, in FIG. 4, the two guides 17B and 17D on the palm portion 21 side are provided on the finger portions 23 and 24. In this regard, the two guides 17B and 17D may be provided on the palm portion 21.

[0110] (3) In each of the above-described embodiments and each modification, the hand 13 is provided with four guides 17A to 17D. In this regard, as shown in FIG. 20, the hand 13 may be provided with a linear guide body 61 and two guides 17A and 17B. The two guides 17A and 17B are provided on the upper surface of the guide body 61 along the horizontal direction HD2 in which the guide body 61 extends. In this case, for example, the hand 13 is provided with two tactile sensors 19A and 19B for the two guides 17A and 17B.

[0111] (4) In each of the above-described embodiments and each modification, the hand 13 is provided with four guides 17A to 17D. In this regard, as shown in FIG. 21, the hand 13 may be provided with one guide 17A provided on the upper surface of the guide body 61. The hand 13 may support the central portion of the lower surface of the substrate W with the one guide 17A. In this case, the hand 13 is provided with one tactile sensor 19A for the one guide 17A.

[0112] (5) In each of the above-described embodiments and each modification, the four tactile sensors 19A to 19D may each be a touch sensor. The touch sensor may be, for example, a mechanical switch that detects contact by pushing a button. Further, the touch sensor may be a capacitive type or a piezoelectric type.

[0113] (6) In each of the above-described embodiments and each modification, the hand 13 is provided with, for example, four tactile sensors 19A to 19D. In this regard, the hand 13 may be provided with four photoelectric sensors 63 instead of the four tactile sensors 19A to 19D. As shown in FIG. 22, the photoelectric sensors 63 are provided on the upper surface or the upper part of the hand body 15 so as not to contact the lower surface of the substrate W supported by the four guides 17A to 17D.

[0114] Each photoelectric sensor 63 has a light emitting element and a light receiving element, and detects the light emitted from the light emitting element and reflected by the lower surface of the substrate W with the light receiving element. Thereby, the photoelectric sensor 63 measures the distance from the photoelectric sensor to the lower surface of the substrate W. For example, during the teaching operation of step S01, it operates as follows. When the substrate W is placed on the four guides 17A to 17D, or when the four guides 17A to 17D are in contact with the lower surface of the substrate W, the control unit 51 uses the photoelectric sensor 63 to measure in advance the contact distance from the photoelectric sensor 63 to the lower surface of the substrate W.

[0115] Then, for example, in step S12 of FIG. 11, the control unit 51 raises the hand 13 while monitoring the outputs of the four photoelectric sensors 63 (the distances from the photoelectric sensors to the lower surface of the substrate W). In step S13, when the distance to the substrate W measured by the photoelectric sensor 63 is within a preset range including the contact distance, the control unit 51 determines that the photoelectric sensor 63 has detected the contact between the hand 13 and the substrate W. Thereby, when at least one of the four photoelectric sensors 63 detects the contact with the substrate W, the control unit 51 raises the hand 13 by the upward movement amount UW from the contact height position CNP.

[0116] (7) In each of the above-described embodiments and each modification, the substrate transfer robot IR includes an articulated arm 31 and a lifting table 33 in order to move the hand 13. In this regard, the substrate transfer robot IR may include a forward / backward movement unit and a lifting / rotation unit. The forward / backward movement unit moves the hand 13 forward and backward. The lifting / rotation unit rotates the hand and the forward / backward movement unit around a vertical axis and also raises and lowers the hand and the forward / backward movement unit.

[0117] (8) In each of the above-described embodiments and each modification, in the teaching operation, the teaching height position TP, which is the position where the hand 13 contacts the lower surface of the substrate W, is acquired. In this regard, in addition to this teaching height position TP, a second teaching height position, which is the position where the hand 13 separates from the lower surface of the substrate W, may be acquired. The second teaching height position may be used as a reference when placing the substrate W on the predetermined shelf portion 11.

Explanation of Reference Numerals

[0118] 1... Substrate processing apparatus 7... Carrier placement portion IR... Substrate transfer robot C... Carrier 11... Shelf portion 13... Hand 15, 61... Hand body 17A, 17B, 17C, 17D... Guide 19A, 19B, 19C, 19D... Tactile sensor 28... Guide wall 51... Control unit 63... Photoelectric sensor TP... Teaching height position UW... Upper movement amount DW... Lower movement amount DUP... Lifting position DLP1, DLP2... Lowering position CNP(CNP1~CNP4)... Contact height position SEP(SEP1~SEP4)... Separation height position W... Substrate

Claims

1. In a substrate processing apparatus for processing a substrate, a carrier placement unit for placing a carrier, a substrate transfer robot including a hand that supports the substrate in a horizontal posture and moves the hand, and a control unit that controls the substrate transfer robot, wherein the carrier includes a plurality of shelf portions provided vertically within the carrier and capable of placing the substrates in a horizontal posture respectively, the hand includes a hand body, a guide provided on the upper surface of the hand body for receiving the substrate, and a sensor for detecting contact between the guide and the substrate, the control unit enters the hand not supporting the substrate into the carrier in order to take the substrate from one of the plurality of shelf portions, raises the hand within the carrier while monitoring the output from the sensor, when the sensor detects contact with the substrate, raises the hand by a preset upward movement amount from the contact height position where the contact is detected, and exits the hand supporting the substrate from within the carrier at an upward position raised by the upward movement amount from the contact height position. A substrate processing apparatus characterized by this.

2. In the substrate processing apparatus according to Claim 1, the control unit enters the hand supporting the substrate into the carrier in order to place the substrate on one of the plurality of shelf portions, lowers the hand within the carrier while monitoring the output from the sensor, when the sensor detects separation of the substrate from the hand, lowers the hand by a preset downward movement amount from the separation height position where the separation is detected, and exits the hand not supporting the substrate from within the carrier at a downward position lowered by the downward movement amount from the separation height position. A substrate processing apparatus characterized by this.

3. In the substrate processing apparatus according to Claim 1, the control unit enters the hand supporting the substrate into the carrier at the upward position raised by the upward movement amount from the contact height position in order to place the substrate on one of the plurality of shelf portions. A substrate processing apparatus characterized by this.

4. In the substrate processing apparatus according to Claim 3, the control unit In the carrier, lower the hand from the raised position to a lowered position that is lowered by a preset downward movement amount from the contact height position. A substrate processing apparatus, characterized in that, at the lowered position, the hand not supporting the substrate is withdrawn from the carrier. **Claim 5** In the substrate processing apparatus according to claim 3, the control unit while monitoring the output from the sensor, lowers the hand in the carrier, when the sensor detects separation of the hand from the substrate, lowers the hand by a preset downward movement amount from the separation height position at which the separation is detected, A substrate processing apparatus, characterized in that, at the lowered position that is lowered by the downward movement amount from the separation height position, the hand not supporting the substrate is withdrawn from the carrier. **Claim 6** In the substrate processing apparatus according to any one of claims 1 to 5, the control unit, in order to pick up the substrate from one of the plurality of shelf portions, enters the hand not supporting the substrate into the carrier at a lowered position that is lowered by a preset downward movement amount from a pre-taught teaching height position. **Claim 7** In the substrate processing apparatus according to any one of claims 1 to 5, the hand includes a plurality of guides including the guide, the plurality of guides are provided on the upper surface of the guide body to receive the outer edge portion of the substrate, A substrate processing apparatus, characterized in that the sensor detects that one of the plurality of guides has contacted the substrate. **Claim 8** In the substrate processing apparatus according to any one of claims 1 to 5, the hand includes a plurality of guides including the guide and a plurality of sensors including the sensor, the plurality of guides are provided on the upper surface of the guide body to receive the outer edge portion of the substrate, the plurality of sensors are respectively provided on the plurality of guides, each of the plurality of sensors detects that the corresponding one of the plurality of guides has contacted the substrate, the control unit while monitoring the output from the plurality of sensors, raises the hand in the carrier. When at least one of the plurality of sensors detects contact with the substrate, the substrate processing apparatus is characterized in that the hand is raised by the preset upward movement amount from the contact height position at which the contact is detected.

9. In the substrate processing apparatus according to claim 8, when one of the plurality of sensors detects the first contact with the substrate, the control unit raises the hand by a preset upward movement amount from the contact height position at which the contact is detected, and the substrate processing apparatus is characterized thereby.

10. In the substrate processing apparatus according to any one of claims 1 to 5, the sensor is a tactile sensor, and the substrate processing apparatus is characterized thereby.

11. In a substrate processing apparatus for processing a substrate, a carrier placement unit for placing a carrier; a substrate transfer robot including a hand that supports the substrate in a horizontal posture and moves the hand; a control unit for controlling the substrate transfer robot, wherein the carrier includes a plurality of shelf portions provided in the vertical direction within the carrier and capable of placing the substrates in a horizontal posture respectively, the hand includes a hand body, a guide provided on the upper surface of the hand body for receiving the substrate, a sensor for detecting that the guide has come into contact with the substrate, and the control unit enters the hand that supports the substrate into the carrier in order to place the substrate on one of the plurality of shelf portions, lowers the hand within the carrier while monitoring the output from the sensor, when the sensor detects separation of the hand from the substrate, lowers the hand by a preset downward movement amount from the separation height position at which the separation is detected, and exits the hand that does not support the substrate from within the carrier at the lowered position lowered by the downward movement amount from the separation height position, and the substrate processing apparatus is characterized thereby.

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