Substrate transfer robot and substrate processing apparatus with them

Abstract

To provide a substrate transfer robot and a substrate processing apparatus, capable of preventing a damage of a substrate.SOLUTION: A substrate transfer robot IR comprises: a hand 21; and a robot control part 27. The hand 21 comprises: four guides 33A to 33D (having guides 33A and 33C arranged to a tip end side of a hand main body 31) so as to be provided to an upper surface of the hand main body 31; a pusher 37 that is arranged to a base end side of the hand main body 31; a pusher movement part 39 that moves the pusher 37 to a horizontal movement; and a weight sensor part 35 that measures a weight of a substrate W to be mounted onto the hand 21. The guides 33A and 33C and the pusher 37 nip the substrate W while nipping the substrate W of a horizontal posture on the four guides 33A to 33D to a horizontal direction. The robot control part 27 changes a nipping force for nipping the substrate W on the four guides 33A to 33D by controlling the pusher movement part 39 in accordance with the weight to be measured by the weight sensor part 35.SELECTED DRAWING: Figure 4

Description

Technical Field

[0001] The present invention relates to a substrate transfer robot for transferring a substrate and a substrate processing apparatus including the substrate transfer robot. The substrate may be, for example, a semiconductor substrate, a substrate for FPD (Flat Panel Display), a glass substrate for a photomask, a substrate for an optical disk, a substrate for a magnetic disk, a ceramic substrate, a substrate for a solar cell, and the like. Examples of the FPD include a liquid crystal display device, an organic EL (electroluminescence) display device, and the like.

Background Art

[0002] Conventional substrate processing apparatuses include a transfer mechanism for transferring a substrate (see, for example, Patent Document 1). The transfer mechanism includes a hand and a hand driving unit. The hand supports one substrate in a horizontal posture. The hand driving unit moves the hand.

[0003] Patent Document 2 discloses a substrate transfer robot including a robot hand. The robot hand includes a Y-shaped hand body portion that is a portion on which the substrate is placed. Three tactile sensors are provided on the hand body portion for contacting and supporting the lower surface of the substrate. The sensor elements of the tactile sensors can detect the force applied from the substrate in three axial directions (X-axis direction, Y-axis direction, and Z-axis direction).

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, conventional substrate processing apparatuses have the following problems. A substrate transfer robot is provided with a hand for holding (gripping) a substrate in order to transfer the substrate. The hand includes a guide for receiving the outer edge portion of the substrate and a pusher that can contact the side surface of the substrate. The hand sandwiches the substrate in a horizontal posture in the horizontal direction with the guide and the pusher so that the substrate does not fall from the hand during the transfer of the substrate, and holds the substrate.

[0006] By the way, there are various types (shapes) of substrates. For example, substrates for manufacturing power devices include a normal circular substrate with a uniform thickness (hereinafter appropriately referred to as a "normal substrate") and a circular substrate with a thick peripheral portion and a thin inner portion (hereinafter appropriately referred to as a "thick-edge substrate"). The strength of the thick-edge substrate is relatively weak. Therefore, when the hand holds the thick-edge substrate, the thick-edge substrate may be damaged.

[0007] The present invention has been made in view of such circumstances, and an object thereof is to provide a substrate transfer robot capable of preventing damage to a substrate and a substrate processing apparatus including the same.

Means for Solving the Problem

[0008] In order to achieve such an object, the present invention has the following configuration. That is, a substrate transfer robot for transferring a substrate according to the present invention includes a hand capable of holding the substrate in a horizontal posture and a control unit. The hand includes a hand body, a plurality of guides provided on the upper surface of the hand body for receiving the outer edge portion of the substrate, the plurality of guides having tip-side guides disposed on the tip side of the hand body, a pusher disposed on the base end side of the hand body and capable of contacting the side surface of the substrate, a pusher moving unit for horizontally moving the pusher, and a weight sensor unit for measuring the weight of the substrate placed on the hand. The tip-side guide and the pusher are configured to sandwich the substrate in a horizontal posture on the plurality of guides in the horizontal direction by the pusher moving unit to hold the substrate. The control unit is characterized in that it changes the holding force for holding the substrate on the plurality of guides by controlling the pusher moving unit according to the weight measured by the weight sensor unit.

[0009] According to the substrate processing apparatus of the present invention, it includes a weight sensor unit for measuring the weight of the substrate placed on the hand. The control unit changes the holding force for holding the substrate on the plurality of guides by controlling the pusher moving unit according to the weight measured by the weight sensor unit. Thereby, it can hold with a holding force corresponding to the weight of the substrate. Therefore, breakage of the substrate can be prevented.

[0010] Further, in the above-described substrate processing apparatus, when the weight measured by the weight sensor unit is greater than the first threshold value, the control unit preferably controls the pusher moving unit to bring the substrate on the plurality of guides into a first holding state in which the substrate is held with a first holding force.

[0011] When the weight measured by the weight sensor unit is greater than the first threshold value, the pusher moving unit moves the pusher in the horizontal direction. As a result, the substrates in a horizontal posture on the plurality of guides are sandwiched in the horizontal direction, and the substrates are clamped. That is, substrates with a weight greater than the first threshold value are regarded as substrates with sufficient strength, and the hand selectively clamps the substrates. Thereby, breakage of the substrates can be prevented.

[0012] Also, in the above-described substrate processing apparatus, when the weight measured by the weight sensor unit is less than the first threshold value, the control unit controls the pusher moving unit so as not to clamp the substrates on the plurality of guides, and it is preferable to set the first non-clamping state in which the substrates are placed on the plurality of guides.

[0013] When the weight measured by the weight sensor unit is less than the first threshold value, the substrates are not clamped by the movement of the pusher by the pusher moving unit. That is, substrates with a weight less than the first threshold value are regarded as substrates with insufficient strength, and the hand does not clamp the substrates. Thereby, breakage of the substrates can be prevented.

[0014] Also, in the above-described substrate processing apparatus, the apparatus further includes a hand moving unit that moves the hand, and it is preferable that the control unit controls the hand moving unit according to the weight measured by the weight sensor unit to change the conveyance speed of the hand.

[0015] The control unit controls the hand moving unit according to the weight measured by the weight sensor unit to change the conveyance speed of the hand. Thereby, while clamping the substrates with a clamping force corresponding to the weight of the substrates, the substrates can be conveyed at a conveyance speed corresponding to the weight of the substrates. Therefore, if the conveyance speed is fixed at a low speed so that the substrates do not fall from the hand, the conveyance efficiency of the substrates decreases. However, since the conveyance speed is changed according to the weight, the conveyance efficiency of the substrates can be improved while preventing breakage of the substrates.

[0016] Further, in the substrate processing apparatus described above, it further includes a hand moving unit that moves the hand, and the control unit moves the hand in the first clamping state at a first speed by controlling the hand moving unit. The control unit preferably moves the hand in the first non-clamping state at a second speed slower than the first speed by controlling the hand moving unit.

[0017] For example, a substrate with insufficient strength is not clamped by the hand. Therefore, since there is a possibility that the substrate may fall from the hand, the substrate transfer robot must transfer the hand on which the substrate is placed at a low speed. In addition, conventional substrate transfer robots cannot distinguish between a substrate with sufficient strength and a substrate with insufficient strength. Therefore, the substrate transfer robot must transfer a substrate with sufficient strength at a low speed according to a substrate with insufficient strength. As a result, the transfer efficiency of the substrate decreases.

[0018] According to the present invention, the substrate transfer robot can distinguish between a substrate with sufficient strength and a substrate with insufficient strength. Therefore, the substrate transfer robot can transfer a substrate with sufficient strength at a first speed and transfer a substrate with insufficient strength at a second speed (low speed) slower than the first speed. Therefore, the transfer efficiency of the substrate can be improved.

[0019] Further, in the substrate processing apparatus described above, when the weight measured by the weight sensor unit is smaller than the first threshold value, the control unit preferably brings the pusher into a second non-clamping state in which the pusher is brought close to the substrate placed on the plurality of guides by controlling the pusher moving unit.

[0020] When the weight measured by the weight sensor unit is smaller than the first threshold value, the pusher moving unit brings the pusher close to the substrate. That is, a substrate with a weight smaller than the first threshold value is regarded as a substrate with insufficient strength, and the hand does not clamp the substrate, but the pusher is brought close to the substrate. As a result, the pusher is positioned so as to follow the substrate, so that breakage of the substrate can be prevented and the substrate can be prevented from falling from the hand during substrate transfer.

[0021] Further, in the above-described substrate processing apparatus, when the weight measured by the weight sensor unit is smaller than the first threshold value, the control unit controls the pusher moving unit to place the substrate on the plurality of guides in a second clamping state in which the substrate is clamped with a second clamping force weaker than the first clamping force.

[0022] When the weight measured by the weight sensor unit is smaller than the first threshold value, the substrate is clamped with a second clamping force stronger than the first clamping force by the movement of the pusher by the pusher moving unit. That is, the clamping force is changed between a substrate with sufficient strength and a substrate with insufficient strength. Thereby, it is possible to prevent breakage of the substrate and to prevent the substrate from falling from the hand during substrate transfer.

[0023] Further, in the above-described substrate processing apparatus, when the weight measured by the weight sensor unit is larger than the second threshold value which is larger than the first threshold value, the control unit controls the pusher moving unit to place the substrate on the plurality of guides in a third clamping state in which the substrate is clamped with a third clamping force different from the first clamping force.

[0024] When the weight measured by the weight sensor unit is larger than the second threshold value (second threshold value > first threshold value), the substrate is clamped with a third clamping force different from the first clamping force by the movement of the pusher by the pusher moving unit. Thereby, by further discriminating a substrate with sufficient strength into two types of substrates, an optimal clamping force can be set for each of the two types of substrates.

[0025] Further, in the above-described substrate processing apparatus, the substrate includes a bonded substrate, and the bonded substrate is a silicon substrate made of silicon and a support substrate made of glass bonded to the lower surface of the silicon substrate, and the support substrate is formed with a diameter larger than the diameter of the silicon substrate, and the bonded substrate has a weight larger than the second threshold value, and the third clamping force is preferably set weaker than the first clamping force.

[0026] Since glass is more brittle than silicon, the support substrate may be damaged. Therefore, the bonded substrate having a weight greater than the second threshold is clamped with a third clamping force weaker than the first clamping force. This can prevent the bonded substrate from being damaged.

[0027] Also, in the above-described substrate processing apparatus, the weight sensor unit has a plurality of weight sensors, the plurality of weight sensors are respectively provided on the plurality of guides, and each of the plurality of weight sensors measures the weight of the substrate applied to the corresponding guide among the plurality of guides. When the representative value of the plurality of weights measured by the plurality of weight sensors is greater than the first threshold, the control unit preferably controls the pusher moving unit to clamp the substrate on the plurality of guides in a first clamping state with a first clamping force.

[0028] The weight sensor unit has a plurality of weight sensors, and the plurality of weight sensors are respectively provided on the plurality of guides. Thereby, the weight of the substrate can be accurately measured.

[0029] Also, in the above-described substrate processing apparatus, an example of the representative value is a total value. Also, in the above-described substrate processing apparatus, an example of the representative value is an average value.

[0030] Also, in the above-described substrate processing apparatus, the weight sensor unit has a weight sensor, the weight sensor is provided on any one of the plurality of guides, and when the weight measured by the weight sensor is greater than the first threshold, the control unit controls the pusher moving unit to clamp the substrate on the plurality of guides in the first clamping state with the first clamping force. Since it is not necessary to provide the same number of weight sensors as the number of the plurality of guides, the configuration of the hand can be simplified.

[0031] Further, the substrate processing apparatus according to the present invention is characterized by including the above-described substrate transfer robot and a processing unit that performs a preset process on the substrate transferred by the substrate transfer robot.

Effect of the Invention

[0032] According to the substrate transfer robot and the substrate processing apparatus including the same according to the present invention, breakage of the substrate can be prevented.

Brief Description of the Drawings

[0033]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Figure 12

Figure 13

Example 1

[0034] Hereinafter, Example 1 of the present invention will be described with reference to the drawings. FIG. 1 is a plan view showing a schematic configuration of a substrate processing apparatus 1 according to Example 1.

[0035] <1. Configuration of the substrate processing apparatus> Referring to FIG. 1, the substrate processing apparatus 1 processes a substrate W. The substrate processing apparatus 1 includes an index block 3 and a processing block 5. The index block 3 includes a plurality (for example, two) of carrier mounting portions 7 and a substrate transfer robot IR. The horizontal direction in which the index block 3 and the processing block 5 are arranged is the X direction. The horizontal direction in which the plurality of carrier mounting portions 7 are arranged is the Y direction (width direction). The Y direction is orthogonal to the X direction.

[0036] Each of the two carrier mounting portions 7 mounts a carrier C. As the carrier C, for example, a FOUP (Front Opening Unify Pod) is used, but it is not limited thereto. The carrier C houses a plurality of substrates W. For example, various types of substrates W may be housed in the carrier C. Here, the types of the substrate W will be described.

[0037] FIG. 2 is a plan view of the substrate W. The basic shape of the substrate W will be described. The substrate W is formed in a disk shape. The substrate W has a peripheral portion 9 and a main portion 10. The main portion 10 is a portion located inside the peripheral portion 9. In FIG. 2, the boundary between the peripheral portion 9 and the main portion 10 is indicated by a broken line.

[0038] Refer to FIGS. 3(a) to 3(d). The substrate W is classified into a plurality of types according to its shape. For example, the substrate W includes a normal substrate WA, a thick-edge substrate WB, a first bonded substrate WC, and a second bonded substrate WD. When the normal substrate WA, the thick-edge substrate WB, the first bonded substrate WC, and the second bonded substrate WD are not distinguished, they are called the substrate W.

[0039] Refer to FIG. 3(a). The normal substrate WA is a normal circular substrate with a uniform thickness. That is, the normal substrate WA is a substrate in which the thickness of the peripheral portion 9 is the same as the thickness of the main portion 10. The normal substrate WA is formed of, for example, silicon, but it may not be formed of silicon. The normal substrate WA is a substrate W conforming to the SEMI standard (Semiconductor Equipment and Materials International standards). For example, the diameter of the normal substrate WA is 300 mm (millimeters), and its thickness is 0.775 mm.

[0040] Refer to FIG. 3(b). The thick-edge substrate WB is a circular substrate in which the peripheral portion 9 is thick and its inner portion (main portion 10) is thin. The upper surface of the main portion 10 is subjected to a back grinding process. The ring width RW of the upper surface of the peripheral portion 9 is, for example, 3 mm. As shown in FIG. 3(b), a flexible resin film FM may be bonded to the lower surface of the thick-edge substrate WB, or the resin film FM may be absent. The resin film FM is bonded to the thick-edge substrate WB via an adhesive layer 11. The resin film FM is formed in a disk shape. The thickness of the resin film FM is, for example, approximately the same as the thickness of the main portion 10. Note that the lower surface of the thick-edge substrate WB is a device surface (semiconductor device surface) on which a device is formed.

[0041] Refer to FIG. 3(c). The first bonding substrate WC has a thick-edge substrate 12 and a support substrate 14. The thick-edge substrate 12 is configured substantially the same as the thick-edge substrate WB without a resin film shown in FIG. 3(b). Devices are formed on the lower surface of the thick-edge substrate 12. The thick-edge substrate 12 is made of silicon, but may be formed of other materials than silicon. The support substrate 14 is bonded to the lower surface of the thick-edge substrate 12. The support substrate 14 is bonded to the thick-edge substrate 12 via an adhesive layer 11. The support substrate 14 is made of glass, but may be formed of other materials than glass. The support substrate 14 is formed, for example, with a diameter (e.g., 301 mm) larger than the diameter of the thick-edge substrate 12 (e.g., 300 mm).

[0042] Refer to FIG. 3(d). The second bonding substrate WD has a full-thin substrate 16 and a support substrate 14. In the full-thin substrate 16, the upper surfaces of the peripheral portion 9 and the main portion 10 are subjected to back grinding. The full-thin substrate 16 is thinner than the normal substrate WA. Also, the full-thin substrate 16 is thinner than the support substrate 14. The full-thin substrate 16 is a substrate in which the thickness of the peripheral portion 9 is the same as the thickness of the main portion 10. Devices are formed on the lower surface of the full-thin substrate 16. The full-thin substrate 16 is made of silicon, but may be formed of other materials than silicon. The support substrate 14 of the second bonding substrate WD is configured the same as the support substrate 14 of the first bonding substrate WC.

[0043] Note that the first bonding substrate WC and the second bonding substrate WD correspond to the bonding substrates of the present invention. The silicon thick-edge substrate 12 and the silicon full-thin substrate 16 correspond to the silicon substrates of the present invention.

[0044] Refer to FIGS. 1 and 4. The substrate transfer robot IR transfers the substrate W (normal substrate WA, thick-edge substrate WB, first bonding substrate WC, and second bonding substrate WD). The substrate transfer robot IR transfers the substrate W between the two carriers C of the two carrier placement portions 7 and a substrate placement portion PS described later. The substrate transfer robot IR includes a hand 21 that can hold a single substrate W in a horizontal posture, and moves the hand 21. FIG. 4 mainly shows a longitudinal section of the hand 21 viewed from the side.

[0045] The substrate transfer robot IR further includes a multi-joint arm 23 and a lifting platform 25. The multi-joint arm 23 is composed of, for example, a scalar-type robot arm. The base end portion (base end part) of the multi-joint arm 23 is attached to the lifting platform 25. Also, the tip end portion (tip end part) of the multi-joint arm 23 connects the hand 21. The multi-joint arm 23 moves the hand 21 that supports the substrate W in the horizontal direction (XY direction). The lifting platform 25 moves the hand 21 and the multi-joint arm 23 up and down in the vertical direction Z. The multi-joint arm 23 includes a plurality of electric motors, and the lifting platform 25 includes an electric motor.

[0046] The substrate transfer robot IR further includes a robot control unit 27 and a storage unit 29 (see FIG. 4). The robot control unit 27 is communicably connected to a main control unit 71 described later. The robot control unit 27 controls each component of the substrate transfer robot IR. The robot control unit 27 includes one or more processors such as, for example, a central processing unit (CPU). The storage unit 29 includes at least one of, for example, a ROM (Read-Only Memory), a RAM (Random-Access Memory), and an auxiliary storage device (e.g., a hard disk). The storage unit 29 stores computer programs necessary for controlling each component of the substrate transfer robot IR.

[0047] Note that the multi-joint arm 23 and the lifting platform 25 correspond to the hand movement part of the present invention. The robot control unit 27 corresponds to the control unit of the present invention.

[0048] Refer to FIGS. 4, 5(a), and 5(b). Next, the configuration of the hand 21 will be described. The hand 21 includes a hand body 31, a plurality (e.g., four) of guides 33A, 33B, 33C, 33D, a weight sensor unit 35, a pusher 37, and a pusher moving unit 39.

[0049] The hand body 31 is formed in a Y shape in plan view. The hand body 31 includes one palm portion 41 and two finger portions 43 and 45. The two finger portions 43 and 45 are both formed to extend from the palm portion 41 in a predetermined horizontal direction HD1. The finger portion 43 is arranged away from the finger portion 45.

[0050] Four guides 33A to 33D are provided on the upper surface of the hand body 31. Each of the four guides 33A to 33D receives the outer edge portion of the substrate W. Two guides 33A and 33B are provided on the upper surface of the finger portion 43. Two guides 33C and 33D are provided on the upper surface of the finger portion 45. The guide 33A is arranged on the tip side of the finger portion 43. The guide 33B is arranged on the palm portion 41 side rather than the guide 33A. The guide 33C is arranged on the tip side of the finger portion 45. The guide 33D is arranged on the palm portion 41 side rather than the guide 33C.

[0051] Each of the guides 33A to 33D includes a receiving portion 47 and a guide wall 48. The outer edge portion of the substrate W in a horizontal posture is placed on each of the four receiving portions 47. In each of the guides 33A to 33D, the upper surface of the guide wall 48 is formed to be higher than the upper surface of the receiving portion 47. Therefore, the four guide walls 48 surround the substrate W placed on the four receiving portions 47 and restrict the movement of the substrate W in the horizontal direction.

[0052] The weight sensor unit 35 includes four tactile sensors 35A, 35B, 35C, and 35D. The four tactile sensors 35A, 35B, 35C, and 35D are respectively provided on the four guides 33A, 33B, 33C, and 33D. Further, the tactile sensor 35A is provided between the corresponding guide 33A and the hand body 31. The tactile sensor 35D is provided between the corresponding guide 33D and the hand body 31. In other words, the tactile sensor 35A is provided on the lower side or the lower surface of the guide 33A. The tactile sensor 35D is provided on the lower side or the lower surface of the guide 33D. The tactile sensors 35B and 35C are also provided in the same manner as the tactile sensor 35A (35D). The four tactile sensors 35A to 35D are embedded in the hand body 31.

[0053] The four tactile sensors 35A to 35D share the measurement of the weight of a single substrate W placed on the hand 21 (the four guides 33A to 33D). In other words, each of the four tactile sensors 35A to 35D measures the weight of the substrate W applied to the corresponding guide among the four guides 33A to 33D. Specifically, the tactile sensor 35A measures the weight of the substrate W applied to the guide 33A (receiving portion 47). Similarly, the tactile sensor 35B measures the weight of the substrate W applied to the guide 33B. The tactile sensor 35C measures the weight of the substrate W applied to the guide 33C. The tactile sensor 35D measures the weight of the substrate W applied to the guide 33D.

[0054] The output signals (weight data JA, JB, JC, JD) of the four tactile sensors 35A to 35D are sent to the robot control unit 27. The robot control unit 27 calculates the total value as a representative value based on the four weights (weight data JA, JB, JC, JD) measured by the four tactile sensors 35A to 35D. That is, the robot control unit 27 calculates the total value of the four weight data JA, JB, JC, JD. For example, when the normal substrate WA shown in Fig. 3(a) is placed on the hand 21, the robot control unit 27 calculates 129 gf (gram weight) as the total value.

[0055] The robot control unit 27 may calculate the average value of the four weight data JA, JB, JC, JD as a representative value. For example, the four weight data JA, JB, JC, JD, as well as the calculated total value or average value, are stored in the storage unit 29.

[0056] Each of the four tactile sensors 35A to 35D is, for example, a multi-axis force sensor such as a 6-axis or 3-axis force sensor, but may also be a 1-axis (Z-axis) force sensor (load cell). A 6-axis force sensor is a sensor that can measure three-axis force (Fx, Fy, Fz) and three-axis moment (Mx, My, Mz). As the detection method of the force sensor, for example, an electric resistance type, a capacitance type, a piezoelectric type, or an optical type is used.

[0057] Note that the two guides 33A and 33C each correspond to the tip-side guide. The weight sensor unit 35 corresponds to the weight sensor unit of the present invention. Each of the tactile sensors 35A to 35D corresponds to a weight sensor.

[0058] The pusher 37 is mainly used to sandwich the substrate W. The pusher 37 is disposed on the proximal end side of the hand body 31. As shown in Fig. 5(a), the pusher 37 is formed in a C shape in plan view. The pusher 37 can contact the side surface of the substrate W at two points (two surfaces) corresponding to both ends of the C shape. Referring also to Fig. 4, the pusher 37 is configured as follows. The height H1 of the pusher 37 (contact surface 37A) is greater than the height H2 of the guide walls 48 of the guides 33A to 33D. Also, the upper end of the pusher 37 (contact surface 37A) is at a position higher than the upper surface of the guide walls 48 of the guides 33A to 33D.

[0059] The pusher moving unit 39 horizontally moves the pusher 37. The two guides 33A and 33C and the pusher 37 are configured by the pusher moving unit 39 to sandwich the substrate W in the horizontal posture on the four guides 33A to 33D in the horizontal direction to hold the substrate W. As shown in Fig. 5(a), the pusher moving unit 39 includes a rod 39A, a slider 39B, a guide rail 39C, a screw shaft 39D, an electric motor 39E, and a rotary encoder 39F.

[0060] The rod 39A extends in the horizontal direction HD1 shown in Fig. 5(a). The tip of the rod 39A is connected to the pusher 37 via the force sensor 51. The slider 39B is fixed to the proximal end side of the rod 39A. The guide rail 39C and the screw shaft 39D are arranged to extend in the horizontal direction HD1. The guide rail 39C penetrates the slider 39B. The screw shaft 39D meshes with the internal thread 39G of the slider 39B. The output shaft of the electric motor 39E is connected to one end of the screw shaft 39D.

[0061] When the electric motor 39E rotates the screw shaft 39D in the positive direction about the axis, as shown in FIG. 5(b), the slider 39B, the rod 39A, and the pusher 37 move forward. Further, when the electric motor 39E rotates the screw shaft 39D in the reverse direction about the axis, as shown in FIG. 5(a), the slider 39B, the rod 39A, and the pusher 37 move backward. The rotary encoder 39F measures the rotational movement amount (encoder value) of the output shaft of the electric motor 39E and the screw shaft 39D, thereby measuring the position of the pusher 37 in the horizontal direction HD1. Although the rotary encoder 39F is used as the position sensor, a linear encoder may be used instead of the rotary encoder 39F.

[0062] Next, the outline of the characteristic part of this embodiment will be described. As shown in FIGS. 3(a) to 3(d), as the substrate W, there are various substrates such as a normal substrate WA, a thick-edge substrate WB, a first bonded substrate WC, and a second bonded substrate WD. Among these, for example, the strength of the thick-edge substrate WB is relatively weak. Therefore, when the hand 21 clamps the thick-edge substrate WB, the thick-edge substrate WB may be damaged.

[0063] FIG. 6 is a graph showing an example of the weights of the normal substrate WA, the thick-edge substrate WB, the first bonded substrate WC, and the second bonded substrate WD and the first threshold value TH1. The weight of the normal substrate WA made of silicon is about 128 gf, and the thick-edge substrate WB is lighter than this. The support substrates 14 of the first bonded substrate WC and the second bonded substrate WD are made of glass. The specific gravity of glass is almost the same as that of silicon. Therefore, the first bonded substrate WC and the second bonded substrate WD are heavier than the normal substrate WA. Also, the strengths of the normal substrate WA, the first bonded substrate WC, and the second bonded substrate WD are relatively strong.

[0064] Therefore, when the weight (for example, the total value) measured by the weight sensor unit 35 is greater than the first threshold value TH1, the robot control unit 27 controls the pusher moving unit 39 to bring the substrate W on the four guides 33A to 33D into a first clamping state clamped with a first clamping force.

[0065] Further, when the weight (e.g., the total value) measured by the weight sensor unit 35 is less than the first threshold value TH1, the robot control unit 27 controls the pusher moving unit 39 so as not to sandwich the substrate W on the four guides 33A to 33D, and the substrate W is placed on the four guides 33A to 33D in a first non-sandwiched state. The detailed operation of the hand 21 will be described later.

[0066] In FIG. 6, for example, the thick-edge substrate WB has a weight variation (width) depending on whether it has a resin film FM or not. Also, the first bonded substrate WC and the second bonded substrate WD have weight variations depending on the allowable range of the thickness of the support substrate 14. The first threshold value TH1 is set between the weight range of the normal substrate WA and the weight range of the thick-edge substrate WB.

[0067] Returning to FIG. 1, the remaining configuration of the substrate processing apparatus 1 will be described. The processing block 5 includes a plurality of processing units 61, a center robot CR, and a substrate placement unit PS. The substrate placement unit PS is provided between the substrate transfer robot IR and the center robot CR. The substrate placement unit PS can place one or more substrates W.

[0068] The processing unit 61 performs a preset process on the substrate W. For example, each processing unit 61 includes, for example, a holding and rotating unit 63 and a nozzle 65. The holding and rotating unit 63 includes a spin chuck that holds one substrate W in a horizontal posture, and an electric motor that rotates the spin chuck around a vertical axis passing through the center of the substrate W. The nozzle 65 discharges a processing liquid (e.g., pure water such as deionized water (DIW)) onto the upper surface of the substrate W held by the holding and rotating unit 63. Note that the holding and rotating unit 63 may be a mechanical chuck including a spin base and three or more holding pins arranged at equal intervals around a vertical axis (rotation axis) passing through the center of the spin base. The three or more holding pins sandwich the substrate W in a horizontal posture while separating the substrate W from the upper surface of the spin base.

[0069] The center robot CR is configured in the same manner as the substrate transfer robot IR. Briefly described, the center robot CR includes a hand 21, an articulated arm 23, a lifting table 25, a robot control unit 27, and a storage unit 29, as shown in FIGS. 1 and 4. The center robot CR can transfer the substrate W between a plurality of processing units 61 and the substrate placement unit PS. Note that the center robot CR corresponds to the substrate transfer robot of the present invention.

[0070] The substrate processing apparatus 1 includes a main control unit 71 and a storage unit 73 that are communicably connected to the robot control unit 27. The main control unit 71 includes one or more processors such as a central processing unit (CPU). The main control unit 71 controls each component of the substrate processing apparatus 1. The storage unit 73 includes at least one of, for example, a ROM (Read-Only Memory), a RAM (Random-Access Memory), and an auxiliary storage device (e.g., a hard disk). The storage unit 73 stores computer programs necessary for controlling each component of the substrate processing apparatus 1. Note that the main control unit 71 may correspond to the control unit of the present invention.

[0071] <2. Operation of the Substrate Processing Apparatus> Next, the operation of the substrate processing apparatus 1 will be briefly described. The carrier C is placed on one of the two carrier placement units 7. The substrate transfer robot IR takes out the substrate W from the carrier C on the carrier placement unit 7 and transfers the substrate W to the substrate placement unit PS. The center robot CR takes out the substrate W from the substrate placement unit PS and transfers the substrate W to any one of the plurality of processing units 61. Each processing unit 61 performs a preset process (e.g., a cleaning process with pure water) on the substrate W transferred by the center robot CR.

[0072] The center robot CR takes out the processed substrate W on which a preset process has been performed from any one of the plurality of processing units 61 and transfers the substrate W to the substrate placement unit PS. The substrate transfer robot IR takes out the processed substrate W from the substrate placement unit PS and returns the substrate W to the carrier C on the carrier placement unit 7.

[0073] <3. Operation of Substrate Transfer Robot> Next, the operation of the substrate transfer robot IR will be described with reference to the flowchart of FIG. 7.

[0074] 〔Step S01〕Placement of Substrate on Hand The substrate transfer robot IR causes the hand 21 on which no substrate is placed to enter the carrier C. Then, while monitoring the outputs from the four tactile sensors 35A to 35D, the substrate transfer robot IR lifts the substrate from a shelf portion (not shown) within the carrier C. At this time, the substrate W is placed on the four receiving portions 47 of the four guides 33A to 33D of the hand 21.

[0075] 〔Step S02〕Measurement of Substrate Weight The four tactile sensors 35A to 35D measure the weight of the substrate W placed on the hand 21 (the four receiving portions 47). The four tactile sensors 35A to 35D each send weight data to the robot control unit 27. Four weight data JA, JB, JC, and JD are sent to the robot control unit 27 by the four tactile sensors 35A to 35D. The robot control unit 27 calculates the total value of the four weight data JA, JB, JC, and JD. Note that the robot control unit 27 may calculate the average value of the four weight data JA, JB, JC, and JD.

[0076] 〔Step S03〕Is Substrate Weight > First Threshold? The robot control unit 27 determines whether the calculated total value is greater than the first threshold value TH1. Specifically, as shown in FIG. 6, when the total value is greater than the first threshold value TH1, the robot control unit 27 determines that the substrate W placed on the hand 21 is any one of the normal substrate WA, the first bonding substrate WC, and the second bonding substrate WD. In contrast, when the total value is less than the first threshold value TH1, the robot control unit 27 determines that the substrate W placed on the hand 21 is the thick-edge substrate WB.

[0077] When the total value is greater than the first threshold value TH1, the process proceeds to step S04. When the total value is less than the first threshold value TH1, the process proceeds to step S06.

[0078] In addition, when the average value is calculated, the robot control unit 27 determines whether the average value is greater than the first threshold value TH1. In this case, the first threshold value TH1 is a value set in advance considering the determination based on the average value. That is, the first threshold value TH1 for comparison with the average value is different from the first threshold value TH1 for comparison with the total value.

[0079] 〔Step S04〕Clamping of the substrate When the total value (or average value) of the four weights measured by the four tactile sensors 35A to 35D is greater than the first threshold value TH1, the robot control unit 27 controls the pusher moving unit 39 as follows. As shown in FIG. 5(b), the pusher moving unit 39 moves the pusher 37 forward. Thereby, the substrate W on the four guides 33A to 33D is sandwiched in the horizontal direction HD1 by the two guides 33A and 33C and the pusher 37, and the substrate W is clamped.

[0080] In addition, by clamping the substrate W, the first clamping state is achieved. Thereby, for example, the substrate W is prevented from falling from above the hand 21. The substrate W is clamped with a preset first clamping force. The first clamping force is adjusted based on the load measured by the force sensor 51. In this embodiment, the substrate W to be clamped is any one of the normal substrate WA, the first bonding substrate WC, and the second bonding substrate WD.

[0081] 〔Step S05〕Transport of the substrate at a predetermined speed The robot control unit 27 moves the hand 21 in the first clamping state at the first speed by controlling the articulated arm 23 and the lifting table 25. The first speed is a preset speed. The first speed is higher than the second speed described later. Thereby, the substrate transfer robot IR can efficiently transfer the substrate W.

[0082] 〔Step S06〕Non-clamping of the substrate Also, when the total value (or average value) of the four weights measured by the four tactile sensors 35A to 35D is smaller than the first threshold value TH1, the robot control unit 27 controls the pusher moving unit 39 as follows. For example, as shown in FIG. 5(a), the pusher moving unit 39 retracts the pusher 37. That is, the pusher moving unit 39 does not move the pusher 37.

[0083] Thereby, the substrate W on the four guides 33A to 33D is not clamped, and a first non-clamped state is formed in which the substrate W is placed on the four guides 33A to 33D. The substrate W placed on the four guides 33A to 33D is a thick-edge substrate WB. The strength of the thick-edge substrate WB is relatively weak. Therefore, by clamping the thick-edge substrate WB with the hand 21, it is possible to prevent the thick-edge substrate WB from being damaged.

[0084] Note that in this step S06, when the total value (or average value) of the four weights is smaller than the first threshold value TH1, the robot control unit 27 may control the pusher moving unit 39 to bring the pusher 37 close to the substrate W placed on the four guides 33A to 33D to form a second non-clamped state. Thereby, by attaching the pusher 37 to the substrate W on the four guides 33A to 33D, it is possible to suppress the substrate W from falling when the substrate W is transported.

[0085] 〔Step S07〕Substrate transfer at low speed The robot control unit 27 controls the articulated arm 23 and the lifting table 25 to move the hand 21 in the first non-clamped state or the second non-clamped state at a second speed slower than the first speed. When the hand 21 does not clamp the substrate W, by moving the hand 21 at the second speed (low speed), it is possible to prevent the substrate W from falling from the hand 21.

[0086] According to this embodiment, it includes a weight sensor unit 35 that measures the weight of the substrate W placed on the hand 21. When the weight measured by the weight sensor unit 35 is greater than the first threshold value TH1, the pusher moving unit 39 moves the pusher 37 in the horizontal direction. As a result, the substrate W in a horizontal posture on the four guides 33A to 33D is sandwiched in the horizontal direction, and thus the substrate W is clamped. That is, the substrate W having a weight greater than the first threshold value TH1 is regarded as a substrate W with sufficient strength, and the hand 21 selectively clamps the substrate W. Thereby, breakage of the substrate W can be prevented.

[0087] When the weight measured by the weight sensor unit 35 is less than the first threshold value TH1, the substrate W is not clamped by the movement of the pusher 37 by the pusher moving unit 39. That is, the substrate W having a weight less than the first threshold value TH1 is regarded as a substrate W with insufficient strength, and the hand 21 does not clamp the substrate W. Thereby, breakage of the substrate W can be prevented.

[0088] When the weight measured by the weight sensor unit 35 is less than the first threshold value TH1, the pusher moving unit 39 brings the pusher 37 close to the substrate W. That is, the substrate W having a weight less than the first threshold value TH1 is regarded as a substrate W with insufficient strength, and the hand 21 does not clamp the substrate W, but the pusher 37 is brought close to the substrate W. Thereby, since the pusher 37 is positioned so as to fit the substrate W, breakage of the substrate W can be prevented and the substrate W can be prevented from falling from the hand 21 during substrate conveyance.

[0089] For example, a substrate W (thick-edge substrate WB) with insufficient strength is not clamped by the hand 21, or, as in a modified example described later, the substrate W (thick-edge substrate WB) is clamped with a second clamping force weaker than the first clamping force. Therefore, since the substrate W may fall from above the hand 21, the substrate transfer robot IR (center robot CR) must transfer the hand 21 on which the substrate W is placed at a low speed. In addition, a conventional substrate transfer robot cannot distinguish between a substrate W with sufficient strength (such as a normal substrate WA) and a substrate W with insufficient strength (thick-edge substrate WB). Therefore, the substrate transfer robot IR (center robot CR) must transfer a substrate W with sufficient strength (such as a normal substrate WA) at a low speed in accordance with the substrate W with insufficient strength (thick-edge substrate WB). As a result, the transfer efficiency of the substrate W decreases.

[0090] According to this embodiment, the substrate transfer robot IR (center robot CR) can distinguish between a substrate W with sufficient strength (such as a normal substrate WA) and a substrate W with insufficient strength (thick-edge substrate WB). Therefore, the substrate transfer robot IR (center robot CR) can transfer a substrate W with sufficient strength (such as a normal substrate WA) at a first speed, and can transfer a substrate W with insufficient strength (thick-edge substrate WB) at a second speed (low speed) slower than the first speed. Therefore, the transfer efficiency of the substrate W can be improved.

[0091] The weight sensor unit 35 has, for example, four tactile sensors 35A to 35D, and the four tactile sensors 35A to 35D are respectively provided on the four guides 33A to 33D. Thereby, the weight of the substrate W can be accurately measured.

[0092] (1) A modified example of Example 1 will be described. In step S06, when the total value (or average value) of the weights measured by the four tactile sensors 35A to 35D is less than the first threshold value TH1, the robot control unit 27 does not sandwich the substrate W on the four guides 33A to 33D. In this regard, when the total value (or average value) is less than the first threshold value TH1, the robot control unit 27 controls the pusher moving unit 39 to place the substrate W on the four guides 33A to 33D in a second clamping state where it is clamped with a second clamping force weaker than the first clamping force.

[0093] That is, the clamping force is changed between a substrate W with sufficient strength and a substrate W with insufficient strength. Also, the hand 21 clamps a substrate W with insufficient strength, that is, a substrate W that is easily damaged (for example, the thick-edge substrate WB shown in FIG. 3(b)), with a second clamping force that is weak enough not to break it. Thereby, it is possible to prevent the substrate W from being damaged and to prevent the substrate W from falling from the hand 21. Also, it can be moved faster than the second speed.

Example 2

[0094] Next, Example 2 of the present invention will be described with reference to the drawings. Note that descriptions overlapping with Example 1 are omitted. FIG. 8 is a flowchart showing the operation of the substrate transfer robot IR according to Example 2. FIG. 9 is a graph showing an example of the weights of the respective substrates W, the first threshold value TH1, and the second threshold value TH2 according to Example 2.

[0095] In Example 1, the first threshold value TH1 was set in advance to distinguish between the thick-edge substrate WB and the normal substrate WA, etc. In Example 2, as shown in FIG. 8, in addition to the first threshold value TH1, a second threshold value TH2 may be set in advance to distinguish between the thick-edge substrate WB, the normal substrate WA, the first bonded substrate WC, etc.

[0096] Referring to FIG. 9, the second threshold value TH2 is set between the weight range of the normal substrate WA and the weight ranges of the first bonded substrate WC and the second bonded substrate WD. Thereby, the first bonded substrate WC and the second bonded substrate WD can be distinguished from the normal substrate WA. Note that the second threshold value TH2 is larger than the first threshold value TH1.

[0097] <4. Operation of Substrate Transfer Robot> Next, with reference to the flowchart of FIG. 8, the operation of the substrate transfer robot IR will be described.

[0098] The substrate transfer robot IR places the substrate W on the hand 21 (step S01). The four tactile sensors 35A to 35D measure the weight of the substrate W placed on the hand 21 (step S02). The robot control unit 27 determines whether the sum of the four weight data JA, JB, JC, and JD measured by the four tactile sensors 35A to 35D is greater than the first threshold value TH1 (step S03). If the sum is greater than the first threshold value TH1, the process proceeds to step S11. If the sum is less than the first threshold value TH1, the process proceeds to step S06.

[0099] 〔Step S11〕Weight of substrate > second threshold? The robot control unit 27 determines whether the calculated sum is greater than the second threshold value TH2. Specifically, as shown in FIG. 9, when the sum is greater than the second threshold value TH2, the robot control unit 27 determines that the substrate W placed on the hand 21 is either the first bonded substrate WC or the second bonded substrate WD. On the other hand, when the sum is less than the second threshold value TH2, the robot control unit 27 determines that the substrate W placed on the hand 21 is the normal substrate WA.

[0100] If the sum is greater than the second threshold value TH2, the process proceeds to step S12. If the sum is less than the second threshold value TH2, the process proceeds to step S04. When the average value is calculated, the robot control unit 27 determines whether the average value is greater than the second threshold value TH2. Also in this case, the second threshold value TH2 is set to a value considering the determination by the average value.

[0101] 〔Step S12〕Clamping of substrate When the total value (or average value) of the four weights measured by the four tactile sensors 35A to 35D is greater than the second threshold value TH2, the robot control unit 27 controls the pusher moving unit 39 as follows. As shown in FIG. 5(b), the pusher moving unit 39 advances the pusher 37. Thereby, the hand 21 (the two guides 33A, 33C and the pusher 37) clamps the substrate W.

[0102] Further, the hand 21 places the substrate W on the four guides 33A to 33D in a third clamping state in which the substrate W is clamped with a third clamping force different from the first clamping force. For example, assume that the thick-edge substrate 12 and the all-thin substrate 16 shown in FIGS. 3(c) and 3(d) are formed of silicon, and the support substrate 14 is formed of glass. Also assume that the diameter of the support substrate 14 is larger than the diameters of the thick-edge substrate 12 and the all-thin substrate 16. In this case, since glass is more brittle than silicon, the support substrate 14 may be damaged. Therefore, the third clamping force may be set weaker than the first clamping force. Note that the third clamping force is greater than the second clamping force (first clamping force > third clamping force > second clamping force).

[0103] 〔Step S13〕Substrate conveyance at a predetermined speed The robot control unit 27 moves the hand 21 in the second clamping state at the first speed by controlling the articulated arm 23 and the lifting table 25. The first speed is faster than the second speed. In this regard, for example, when the third clamping force is set weaker than the first clamping force, the robot control unit 27 may move the hand 21 in the second clamping state at a third speed that is slower than the first speed and faster than the second speed (first speed > third speed > second speed). Thereby, since the hand 21 is moved slower than the first speed, even if the substrate W is clamped with the third clamping force weaker than the first clamping force, it is possible to prevent the substrate W clamped by the hand 21 from falling. Also, since it is moved faster than the second speed, the substrate W can be conveyed relatively efficiently.

[0104] Further, for example, when the third clamping force is set to be stronger than the first clamping force, the robot control unit 27 may move the hand 21 in the second clamped state at a third speed that is faster than the first speed and the second speed (third speed > first speed > second speed).

[0105] Note that the operations of steps S04, S05, S06, and S07 shown in FIG. 8 are the same as those of steps S04, S05, S06, and S07 shown in FIG. 7, so the descriptions thereof are omitted.

[0106] According to this embodiment, when the weight measured by the weight sensor unit 35 is greater than the second threshold TH2 (second threshold TH2 > first threshold TH1), the substrate W is clamped with a third clamping force different from the first clamping force by the movement of the pusher 37 by the pusher moving unit 39. Thereby, by further discriminating the substrate W having sufficient strength into two types of substrates W (first bonding substrate WC and second bonding substrate WD), an optimum clamping force can be set for each of the two types of substrates W.

[0107] Further, since glass is more brittle than silicon, the support substrate 14 may be damaged. Therefore, the first bonding substrate WC and the second bonding substrate WD having a weight greater than the second threshold TH2 are clamped with a third clamping force weaker than the first clamping force. Thereby, breakage of the first bonding substrate WC and the second bonding substrate WD can be prevented.

[0108] (1) A first modification of the second embodiment will be described. In FIG. 8, after step S03 is performed, step S11 is performed. In this regard, step S03 may be performed after step S11 is performed.

[0109] (2) A second modification of the second embodiment will be described. In the example of FIG. 8, since the weight range of the first bonding substrate WC partially overlaps with the weight range of the second bonding substrate WD, the first bonding substrate WC cannot be discriminated from the second bonding substrate WD by weight. However, when the weight range of the first bonding substrate WC does not overlap with the weight range of the second bonding substrate WD, the first bonding substrate WC may be discriminated from the second bonding substrate WD by weight.

[0110] (3) Explain the third modification example of Example 2. Refer to FIG. 10. For example, further, a third threshold value TH3, a fourth threshold value TH4, and a fifth threshold value TH5 are set in advance. Then, the robot control unit 27 may determine which type the substrate W placed on the hand 21 corresponds to based on the total value (or average value) of the four measured weight data JA, JB, JC, and JD falling within any of the three ranges RG1, RG2, and RG3.

[0111] In FIG. 10, the range RG1 is the range between the third threshold value TH3 and the fourth threshold value TH4. The range RG2 is the range between the first threshold value TH1 and the second threshold value TH2. The range RG3 is the range between the second threshold value TH2 and the fifth threshold value TH5. Note that the third threshold value TH3, the fourth threshold value TH4, the first threshold value TH1, the second threshold value TH2, and the fifth threshold value TH5 increase in this order (third threshold value TH3 < fourth threshold value TH4 < first threshold value TH1 < second threshold value TH2 < fifth threshold value TH5).

[0112] For example, when the total value is greater than the first threshold value TH1 and less than the second threshold value TH2, the total value falls within the range RG2. In this case, it can be seen that the substrate W placed on the hand 21 is the normal substrate WA. Also, when the total value is less than the first threshold value TH1 and greater than the third threshold value TH3, the total value falls within the range RG1. In this case, it can be seen that the substrate W placed on the hand 21 is the thick-edge substrate WB.

[0113] Also, when the total value is greater than the second threshold value TH2 and less than the fifth threshold value TH5, the total value falls within the range RG3. In this case, it can be seen that the substrate W placed on the hand 21 is the first bonded substrate WC and the second bonded substrate WD.

[0114] Note that, in FIG. 10, the range RG1 may be a range between the third threshold value TH3 and the first threshold value TH1. The range RG2 may be a range between the first threshold value TH1 and a sixth threshold value (not shown) smaller than the second threshold value TH2. In this case, the range RG3 remains the range between the second threshold value TH2 and the fifth threshold value TH5.

Embodiment 3

[0115] Next, Embodiment 3 of the present invention will be described with reference to the drawings. Note that descriptions overlapping with those of Embodiments 1 and 2 are omitted. FIG. 11 is a diagram for explaining the configuration and control of the substrate transfer robot IR according to Embodiment 3.

[0116] In Embodiments 1 and 2, the first clamping force and the second clamping force of the substrate W were adjusted based on the load measured by the force sensor 51 between the pusher 37 and the rod 39A. In this regard, the first clamping force and the second clamping force of the substrate W may be adjusted based on at least one of the time change rates of the torque and the encoder value of the electric motor 39E. Note that the substrate transfer robot IR shown in FIG. 11 of Embodiment 3 does not include the force sensor 51.

[0117] The robot control unit 27 is connected by wiring to the electric motor 39E and the rotary encoder 39F of the pusher moving unit 39. The electric motor 39E is, for example, a stepping motor. The robot control unit 27 controls the pusher moving unit 39 to move the pusher 37 forward. At this time, the robot control unit 27 controls the electric motor 39E according to the position information (encoder value) from the rotary encoder 39F. The robot control unit 27 can detect the drive current supplied to the electric motor 39E as drive current information using, for example, a current value sensor (not shown). The robot control unit 27 determines that the pusher 37 has abutted (contacted) the side surface of the substrate W by monitoring one or both of the position information and the drive current information.

[0118] That is, when the pusher 37 abuts against the side surface of the substrate W, the movement of the pusher 37 is temporarily obstructed. Therefore, the displacement of the position information from the rotary encoder 39F temporarily stops. Also, even when the pusher 37 abuts against the side surface of the substrate W, it is necessary to increase the torque of the electric motor 39E in order to move the pusher 37 further toward the side surface of the substrate W. Therefore, the drive current to the electric motor 39E increases, and the drive current information is displaced. Accordingly, by monitoring one or both of the position information and the drive current information, it is possible to accurately determine that the pusher 37 has abutted against the side surface of the substrate W. After the pusher 37 has abutted against the side surface of the substrate W, the robot control unit 27 adjusts the biasing force (pushing strength) of the substrate W by the pusher 37 to clamp the substrate W.

[0119] According to the present embodiment, the pusher moving unit 39 includes an electric motor 39E that drives the pusher 37 forward and backward, a drive circuit 39H that applies a drive current for driving the electric motor 39E, and a rotary encoder 39F that detects the rotational position of the electric motor 39E. The robot control unit 27 performs at least one of detecting contact based on the drive current information of the drive circuit 39H and detecting contact based on the position information (encoder value) output from the rotary encoder 39F. That is, the robot control unit 27 determines that the pusher 37 has abutted against the side surface of the substrate W based on at least one of the drive current information and the position information.

[0120] Therefore, it is not necessary to provide a force sensor 51 or the like that detects that the pusher 37 and the side surface of the substrate W are in contact. As a result, the structure can be simplified and the cost can be reduced.

[0121] The present invention is not limited to the above-described embodiment, and can be modified as follows.

[0122] (1) In each of the above-described embodiments, the weight sensor unit 35 of the hand 21 includes four tactile sensors 35A to 35D. The four tactile sensors 35A to 35D are respectively provided on the four guides 33A to 33D. In this regard, the weight sensor unit 35 may include at least one tactile sensor 35A. For example, one tactile sensor 35A may be provided on any one of the four guides 33A to 33D. Further, when the weight sensor unit 35 includes two tactile sensors 35A and 35B, the two tactile sensors 35A and 35B may be provided on any one of the four guides 33A to 33D. That is, the hand 21 may include, for example, one to three tactile sensors 35A for the four guides 33A to 33D.

[0123] For example, when the weight measured by one tactile sensor 35A is greater than the first threshold value TH1, the robot control unit 27 may control the pusher moving unit 39 to place the substrate W on the four guides 33A to 33D in a first clamping state with a first clamping force. Since it is not necessary to provide the same number of weight sensors as the four guides 33A to 33D, the configuration of the hand 21 can be simplified.

[0124] (2) In each of the above-described embodiments and modification (1), the hand 21 shown in FIGS. 4 and 5(a) includes four guides 33A to 33D. In this regard, the hand 21 shown in FIG. 4 or the like may include three or more guides. Further, in FIG. 5(a), the two guides 33B and 33D on the palm portion 41 side are provided on the finger portions 43 and 45. In this regard, the two guides 33B and 33D may be provided on the palm portion 41.

[0125] (3) In each of the above-described embodiments and each modification, the hand 21 includes four guides 33A to 33D. In this regard, as shown in FIG. 12, the hand 21 may include a linear guide body 81 and two guides 33A and 33B. The two guides 33A and 33B are provided on the upper surface of the guide body 81 along the horizontal direction HD2 in which the guide body 81 extends. In this case, for example, the hand 21 includes two tactile sensors 35A and 35B for the two guides 33A and 33B. Note that the guide 33A shown in FIG. 12 corresponds to the tip-side guide of the present invention.

[0126] Further, the rod 39A of the pusher moving unit 39 may be connected to the guide 33B shown in FIG. 12 via the force sensor 51. The pusher moving unit 39 may move the guide 33B shown in FIG. 12 forward and backward in the horizontal direction HD2. That is, the guide 33B shown in FIG. 12 may have the function of the pusher 37.

[0127] (4) In each of the above-described embodiments and each modification, the hand 21 includes a weight sensor unit 35 (four tactile sensors 35A to 35D) provided between the four guides 33A to 33D and the hand body 31 as shown in FIG. 4. In this regard, the tip of the multi-joint arm 23 may be connected to the hand 21 via a weight sensor unit 83 (see FIG. 13). The weight sensor unit 83 includes, for example, one force sensor 83A of three axes or six axes. The weight sensor unit 83 (force sensor 83A) measures the weight of the substrate W placed on the guides 33A to 33D instead of the weight sensor unit 35.

[0128] (5) In each of the above-described embodiments and each modification, the substrate transfer robot IR and the center robot CR each include an articulated arm 23 and a lift table 25 in order to move the hand 21. In this regard, the substrate transfer robot IR and the center robot CR may each include a forward / backward movement unit and a lift / rotation unit (both not shown). The forward / backward movement unit moves the hand 21 forward and backward. The lift / rotation unit raises and lowers the hand 21 and the forward / backward movement unit, and also rotates the hand 21 and the forward / backward movement unit around a vertical axis. The substrate transfer robot IR may further include a horizontal movement unit that moves the hand 21, the forward / backward movement unit, and the lift / rotation unit in the Y direction in which two carrier placement units 7 are arranged side by side. The forward / backward movement unit, the lift / rotation unit, and the horizontal movement unit each include one or more electric motors.

[0129] (6) In each of the above-described embodiments and each modification, the robot control unit 27 may control the pusher movement unit 39 according to the weight measured by the weight sensor unit 35, thereby changing, for example, the clamping force for clamping the substrate W on the four guides 33A to 33D. Thereby, it is possible to clamp with a clamping force corresponding to the weight of the substrate W. Therefore, breakage of the substrate can be prevented. Note that the clamping force to be changed includes zero. That is, there may be a case where the substrate W is not clamped corresponding to the weight of the substrate W.

[0130] (7) In each of the above-described embodiments and each modification, the robot control unit 27 may control the hand movement unit (articulated arm 23 and lift table 25) according to the weight measured by the weight sensor unit 35, thereby changing the transfer speed of the hand 21. Thereby, while clamping the substrate with a clamping force corresponding to the weight of the substrate W, the substrate W can be transferred at a transfer speed corresponding to the weight of the substrate W. Therefore, if the transfer speed is fixed at a low speed so that the substrate W does not fall from the hand 21, the transfer efficiency of the substrate W decreases. However, since the transfer speed is changed corresponding to the weight, it is possible to improve the transfer efficiency of the substrate W while preventing breakage of the substrate W.

Explanation of Reference Numerals

[0131] 1... Substrate processing apparatus IR... Substrate transfer robot 12 … Thick-edge substrate 14 … Support substrate 16 … Full-thin substrate 21 … Hand 23 … Multi-joint arm 25 … Lifting platform 27 … Robot control unit 31, 81 … Hand body 33A, 33B, 33C, 33D … Guide 35, 83 … Weight sensor unit 35A, 35B, 35C, 35D … Tactile sensor JA, JB, JC, JD … Weight data 37 … Pusher 39 … Pusher moving part TH1 … First threshold value TH2 … Second threshold value 61 … Processing unit CR … Center robot 71 … Main control unit 83A … Force sensor

Claims

1. A substrate transfer robot for transferring a substrate, comprising: a hand capable of clamping the substrate in a horizontal posture; a control unit, and is provided with, the hand includes a hand body; a plurality of guides provided on the upper surface of the hand body for receiving the outer edge portion of the substrate, the plurality of guides having tip-side guides disposed on the tip side of the hand body; a pusher disposed on the base end side of the hand body and capable of contacting the side surface of the substrate; a pusher moving unit for horizontally moving the pusher; a weight sensor unit for measuring the weight of the substrate placed on the hand, and is provided with, the tip-side guide and the pusher are configured to sandwich the substrate in a horizontal posture on the plurality of guides in the horizontal direction by the pusher moving unit to clamp the substrate; the control unit is characterized in that by controlling the pusher moving unit according to the weight measured by the weight sensor unit, the clamping force for clamping the substrate on the plurality of guides is changed. A substrate transfer robot.

2. In the substrate transfer robot according to claim 1, when the weight measured by the weight sensor unit is greater than a first threshold value, the control unit controls the pusher moving unit to clamp the substrate on the plurality of guides in a first clamping state with a first clamping force. A substrate transfer robot characterized by this.

3. In the substrate transfer robot according to claim 2, when the weight measured by the weight sensor unit is less than the first threshold value, the control unit controls the pusher moving unit so as not to clamp the substrate on the plurality of guides, and the substrate is placed on the plurality of guides. A substrate transfer robot characterized by being in a first non-clamping state.

4. In the substrate transfer robot according to any one of claims 1 to 3, further comprising a hand moving unit for moving the hand; the control unit is characterized in that by controlling the hand moving unit according to the weight measured by the weight sensor unit, the transfer speed of the hand is changed. A substrate transfer robot.

5. In the substrate transfer robot according to claim 3, further comprising a hand moving unit for moving the hand; the control unit controls the hand moving unit to move the hand in the first clamping state at a first speed. The substrate transfer robot is characterized in that the control unit controls the hand moving unit to move the hand in the first non-clamped state at a second speed slower than the first speed.

6. In the substrate transfer robot according to claim 2, when the weight measured by the weight sensor unit is smaller than the first threshold value, the control unit controls the pusher moving unit to bring the pusher close to the substrate placed on the plurality of guides to a second non-clamped state. The substrate transfer robot is characterized by this.

7. In the substrate transfer robot according to claim 2, when the weight measured by the weight sensor unit is smaller than the first threshold value, the control unit controls the pusher moving unit to clamp the substrate on the plurality of guides in a second clamped state with a second clamping force weaker than the first clamping force. The substrate transfer robot is characterized by this.

8. In the substrate transfer robot according to claim 2, when the weight measured by the weight sensor unit is larger than the second threshold value which is larger than the first threshold value, the control unit controls the pusher moving unit to clamp the substrate on the plurality of guides in a third clamped state with a third clamping force different from the first clamping force. The substrate transfer robot is characterized by this.

9. In the substrate transfer robot according to claim 8, the substrate includes a bonded substrate, the bonded substrate is a silicon substrate made of silicon and a support substrate made of glass bonded to the lower surface of the silicon substrate, the support substrate being formed with a diameter larger than the diameter of the silicon substrate, and has the bonded substrate has a weight larger than the second threshold value, the third clamping force is set weaker than the first clamping force. The substrate transfer robot is characterized by this.

10. In the substrate transfer robot according to claim 2, the weight sensor unit has a plurality of weight sensors, the plurality of weight sensors are respectively provided on the plurality of guides, each of the plurality of weight sensors measures the weight of the substrate applied to the corresponding guide among the plurality of guides. When the representative value of the plurality of weights measured by the plurality of weight sensors is greater than the first threshold value, the control unit controls the pusher moving unit to clamp the substrate on the plurality of guides in a first clamping state with the first clamping force. The substrate transfer robot is characterized by this.

11. In the substrate transfer robot according to claim 10, The substrate transfer robot is characterized in that the representative value is the total value.

12. In the substrate transfer robot according to claim 10, The substrate transfer robot is characterized in that the representative value is the average value.

13. In the substrate transfer robot according to claim 2, The weight sensor unit has a weight sensor, The weight sensor is provided on any one of the plurality of guides, When the weight measured by the weight sensor is greater than the first threshold value, the control unit controls the pusher moving unit to clamp the substrate on the plurality of guides in the first clamping state with the first clamping force. The substrate transfer robot is characterized by this.

14. A substrate transfer robot according to any one of claims 1 to 3, A processing unit that performs a preset process on the substrate transported by the substrate transfer robot, A substrate processing apparatus characterized by comprising the above.

Images