Light emitting device and method for manufacturing the same

Abstract

To provide a light emitting device having a reduced surface gloss, and a method for manufacturing the same.SOLUTION: A manufacturing method of a light emitting device according to the present disclosure includes a light emitting device intermediate preparation step of preparing a light emitting device intermediate including a light emitting element 10 and a base 20 having an upper surface on which the light emitting element 10 is disposed, a molding mold preparation step of preparing a molding mold M having a recess C defined by a bottom surface B and a side surface S, in which the bottom surface B includes a first bottom surface B1 and a second bottom surface B2 disposed around the first bottom surface B1, an optical member arrangement step of arranging an optical member 30 including a first optical member 31 and a second optical member 32 including granular material 30p in the recess C, and an insertion step of inserting the upper surface side of the base 20 into the optical member 30. The optical member arrangement step includes a first optical member arrangement step of arranging the first optical member 31 on the first bottom surface B1 and a second optical member arrangement step of arranging the second optical member 32 on the first optical member 31 and the second bottom surface B2.SELECTED DRAWING: Figure 1B

Description

Technical Field

[0001] The present disclosure relates to a light-emitting device and a method for manufacturing the light-emitting device.

Background Art

[0002] A light-emitting device in which the gloss of the surface of a sealing member for sealing a light-emitting element is suppressed is known.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0004] An object of the present disclosure is to provide a light-emitting device with reduced gloss on the upper surface and a method for manufacturing the light-emitting device.

Means for Solving the Problems

[0005] The method for manufacturing a light-emitting device according to the present disclosure includes: a light-emitting device intermediate preparation step of preparing a light-emitting device intermediate including a light-emitting element and a substrate having an upper surface on which the light-emitting element is disposed; a mold preparation step of preparing a mold having a recess defined by a bottom surface and a side surface, the bottom surface including a first bottom surface and a second bottom surface disposed around the first bottom surface; an optical member arrangement step of arranging an optical member including a first optical member and a second optical member including granular bodies in the recess; an insertion step of inserting the upper surface side of the substrate into the optical member; and has The optical member arranging step includes a first optical member arranging step of arranging the first optical member on the first bottom surface, and a second optical member arranging step of arranging the second optical member on the first optical member and on the second bottom surface.

[0006] Another method for manufacturing a light-emitting device according to the present disclosure includes a light-emitting device intermediate preparation step of preparing a light-emitting device intermediate including a light-emitting element and a substrate having an upper surface on which the light-emitting element is disposed. a mold preparation step of preparing a mold having a recess defined by a bottom surface and a side surface, the bottom surface including a first bottom surface and a second bottom surface disposed around the first bottom surface; an optical member arranging step of arranging an optical member including a first optical member and a second optical member including granular bodies in the recess; an insertion step of inserting the upper surface side of the substrate into the optical member; and has The optical member arranging step includes a second optical member arranging step of arranging the second optical member on the second bottom surface, and a first optical member arranging step of arranging the first optical member on the second optical member and on the first bottom surface.

[0007] The light-emitting device according to the present disclosure includes a light-emitting element, a substrate on which the light-emitting element is disposed, and an optical member covering a part of the substrate and the light-emitting element and including granular bodies. and is provided with The upper surface of the optical member has a first surface overlapping the light-emitting element in a top view and a second surface disposed around the first surface, and the second surface is a rough surface caused by the shape of the granular bodies.

Advantages of the Invention

[0008] According to the present disclosure, it is possible to provide a light-emitting device with reduced gloss on the upper surface and a method for manufacturing the light-emitting device.

Brief Description of the Drawings

[0009]

Figure 1A

Figure 1B

Figure 2

Figure 3A

Figure 3B

Figure 4A

Figure 4B

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10A

Figure 10B

Figure 10C

Figure 11

Figure 12

Figure 13

Figure 14

Figure 15

Figure 16

Figure 17

Figure 18

Figure 19

Figure 20

Figure 21

Figure 22A

Figure 22B

Modes for Carrying Out the Invention

[0010] Hereinafter, embodiments for carrying out the present disclosure will be described with reference to the drawings. Note that the light-emitting device described below is for embodying the technical idea of the present disclosure, and the present disclosure is not limited to the following unless specifically described.

[0011] In each drawing, members having the same function may be denoted by the same reference numeral. For the sake of easy explanation or understanding of the gist, the embodiments may be divided into a plurality of embodiments for convenience. Note that partial replacement or combination of the configurations shown in different embodiments is possible. In the following embodiments, descriptions of matters common to the foregoing may be omitted, and only the different points may be described. In particular, the same operational effects due to the same configuration shall not be sequentially mentioned for each embodiment. The size, positional relationship, etc. of the members shown in each drawing may be exaggerated for clarity of the explanation. In some cases, an end view showing only the cut surface may be used as a cross-sectional view. Also, each member may be given the same name even if its state, shape, etc. are different, for example, before and after curing, before and after cutting, or before and after roughening.

[0012] In the following description, terms indicating a specific direction or position (for example, "up", "down", and other terms including those terms) may be used. However, those terms are only used to indicate the relative direction or position in the referenced drawing. The positional relationship expressed as "up (or down)" in this specification includes, for example, the case where two members are in contact and the case where two members are not in contact and one member is located above (or below) the other member when assuming that there are two members.

[0013] The light-emitting device according to the embodiment includes a substrate, a light-emitting element disposed on the upper surface of the substrate, and an optical member covering the upper surface of the substrate and the light-emitting element. The optical member includes a translucent base material and granular bodies. The upper surface of the optical member has a first surface including a portion overlapping the light-emitting element in a top view, and a second surface disposed around the first surface. The granular bodies are mainly disposed on the second surface. The optical member may be one or may have a structure in which two or more are integrated. By providing the granular bodies on the second surface, the gloss (shine) of the upper surface of the optical member, that is, the upper surface of the light-emitting device can be reduced.

[0014] [First Embodiment] An example of the light-emitting device 1 according to the first embodiment is shown in FIGS. 1A and 1B. FIG. 1A is a schematic top view of the light-emitting device 1, and FIG. 1B is a schematic cross-sectional view taken along line IB-IB in FIG. 1A. The light-emitting device 1 includes a light-emitting element 10, a base 20, and an optical member 30. The light-emitting element 10 is disposed on the upper surface 21 of the base 20. The optical member 30 covers the upper surface 21 of the base 20 and the light-emitting element 10. The optical member 30 includes a translucent base material 30m and granular bodies 30p. The upper surface of the optical member 30 has a first surface P1 that overlaps the light-emitting element 10 in a top view, and a second surface P2 that is disposed around the first surface P1.

[0015] In the first embodiment, the optical member 30 includes a first optical member 31 and a second optical member 32. That is, the optical member 30 has a structure in which the first optical member 31 and the second optical member 32 are integrated. The first optical member 31 constitutes the first surface P1 of the optical member 30. The second optical member 32 constitutes the second surface P2 of the optical member 30. The first optical member 31 is disposed at a distance from the base 20. The second optical member 32 is disposed in contact with the base 20.

[0016] A method for manufacturing the light-emitting device 1 as described above will be described with reference to FIGS. 2 to 10C. The method for manufacturing the light-emitting device according to the first embodiment includes, as shown in FIG. 2, a light-emitting device intermediate preparation step, a mold preparation step, an optical member arrangement step, and an insertion step.

[0017] Specifically, the method for manufacturing the light-emitting device includes a light-emitting device intermediate preparation step of preparing a light-emitting device intermediate including a light-emitting element and a base having an upper surface on which the light-emitting element is disposed; a mold preparation step of preparing a mold having a recess defined by a bottom surface and a side surface, the bottom surface including a first bottom surface and a second bottom surface disposed around the first bottom surface; an optical member arrangement step of arranging an optical member including a first optical member and a second optical member including granular bodies in the recess; an insertion step of inserting the upper surface side of the base into the optical member; and The optical member arrangement step includes a first optical member arrangement step of arranging the first optical member on the first bottom surface, and a second optical member arrangement step of arranging the second optical member on the first optical member and on the second bottom surface. Details will be described below according to the steps.

[0018] <Light-emitting device intermediate preparation step> The light-emitting device intermediate preparation step is a step of preparing a light-emitting device intermediate 1a including a light-emitting element 10 and a substrate 20 having an upper surface 21 on which the light-emitting element 10 is arranged. In the example shown in FIG. 3A, a resin package is used as the substrate 20. The resin package includes a pair of positive and negative lead electrodes which are conductive members 23, and a resin member as a base material 25 that integrally holds the lead electrodes. When a plurality of light-emitting elements 10 are provided, the conductive member 23 can have the same number of pairs as the number of light-emitting elements 10. For example, as shown in FIG. 1A, when there are three light-emitting elements 10, the conductive member 23 can have three pairs. The resin package which is the substrate 20 has an upper surface 21 on which the light-emitting element 10 is arranged. Further, the substrate 20 shown in FIG. 3A includes a wall portion 26, and the light-emitting element 10 is arranged on the upper surface 21 of the substrate 20 surrounded by the wall portion 26.

[0019] The light-emitting element 10 is connected via a joining member (not shown) to the upper surface 21 of the substrate 20, specifically, to the upper surface of the conductive member 23 which forms a part of the substrate 20. The upper surfaces of the light-emitting element 10 and the substrate 20 are in a state of being exposed to the outside. Such a light-emitting device intermediate 1a can be prepared through a process of preparing the substrate 20 by manufacturing or purchasing etc., and arranging the light-emitting element 10 on its upper surface. Alternatively, a light-emitting device intermediate 1a with the light-emitting element 10 arranged on the upper surface 21 of the substrate 20 may be prepared by purchasing etc. Note that at this stage, the conductive member 23 of the light-emitting device intermediate 1a is integrally connected to the lead electrode 23 or the frame portion of the adjacent light-emitting device intermediate 1a. In FIG. 3A etc., one light-emitting device intermediate 1a is illustrated. Similarly, for the molding die M, a portion corresponding to a plurality of light-emitting device intermediates 1a is illustrated.

[0020] The light-emitting device intermediate body 1a may further include a wire 40 that electrically connects the conductive member 23 of the base 20 and the light-emitting element 10. Also, as shown in FIG. 3B, the light-emitting device intermediate body 1b may further include a light-transmissive member 24 that covers the light-emitting element 10 and at least a part of the upper surface 21 of the base 20. The light-transmissive member 24 can function as a protective member for the light-emitting element 10. When the wire 40 that electrically connects the light-emitting element 10 and the conductive member 23 is provided, the light-transmissive member 24 can be arranged so as to cover the light-emitting element 10 and the wire 40. Thereby, deformation of the wire 40 in the insertion process described later can be reduced. The upper surface of the light-transmissive member 24 may be any of a convex surface, a concave surface, and a flat surface. Preferably, the upper surface of the light-transmissive member 24 is a convex surface. In particular, it is preferable that the light-transmissive member 24 has a convex shape such that the height of the central portion is higher than the height of the portion located on the outer peripheral side. By making the light-transmissive member 24 have such a convex shape, at least a part of the second optical member 32 located between the light-transmissive member 24 and the first optical member 31 in the insertion process shown in FIG. 9 described later can function as a member that moves the second optical member 32 onto the second bottom surface B2. The light-transmissive member 24 can be formed by arranging a liquid light-transmissive member 24 by a potting method and then curing it by heating or the like. For example, when the wall portion 26 is provided on the upper surface 21 side of the base 20 as shown in FIG. 3A, the light-transmissive member 24 can be arranged in the recess 27 defined by the wall portion 26 and the upper surface 21. When a plurality of light-emitting elements 10 are provided, a plurality of light-transmissive members 24 may be arranged so as to cover each light-emitting element 10, or a plurality of light-emitting elements 10 may be covered by one light-transmissive member 24.

[0021] <Molding die preparation process> As shown in FIGS. 4A and 4B, the molding die preparation process is a process of preparing a molding die M having a recess C defined by a bottom surface B and a side surface S. The bottom surface B includes a first bottom surface B1 and a second bottom surface B2 disposed around the first bottom surface B1. In other words, the first bottom surface B1 is surrounded by the second bottom surface B2. In the example shown in FIG. 4B, a third bottom surface B3 is further provided outside the second bottom surface B2. The third bottom surface B3 can be omitted.

[0022] The second bottom surface B2 is a flat plane. The surface roughness Ra of the second bottom surface B2 can be, for example, 20 nm to 100 nm. Alternatively, the second bottom surface B2 can be a surface with dimples. The depth of one dimple is preferably, for example, 5 nm or more and 30 nm or less, and more preferably 10 nm or more and 25 nm or less. The dimples are 0.2 pieces / μm 2 or more and 0.6 pieces / μm 2 or less is preferable, and 0.3 pieces / μm 2 or more and 0.5 pieces / μm 2 or less is more preferable. The second bottom surface B2 can be a horizontal plane positioned on the same plane. Alternatively, it can be a surface inclined from the horizontal plane. The first bottom surface B1 is a concave surface recessed from the second bottom surface B2. Also, the first bottom surface B1 is a curved concave surface. For example, the first bottom surface B1 is a concave surface that is a part of a spherical surface such as a hemispherical surface, or a concave surface that is a part of an elliptical spherical surface such as a semi-elliptical spherical surface. The shape of the first optical member 31 described later is formed as a shape corresponding to the shape of this first bottom surface B1.

[0023] When a plurality of light emitting elements 10 are provided, a plurality of first bottom surfaces B1 and one second bottom surface B2 are provided. For example, when three light emitting elements 10 are provided, three first bottom surfaces B1 and one second bottom surface B2 are provided. The plurality of first bottom surfaces B1 may be separated from each other or may be continuous. Also, the sizes or depths of the plurality of first bottom surfaces B1 may be the same, or some or all of them may be different.

[0024] The mold preparation process may be performed before the light emitting device intermediate preparation process, or may be performed after the light emitting device intermediate preparation process.

[0025] <Optical member arrangement process> The optical member arrangement process is a process of arranging an optical member 30 including a first optical member 31 and a second optical member 32 including granular bodies 30p in the recess C. Also, the optical member arrangement process includes a first optical member arrangement process of arranging the first optical member 31 on the first bottom surface B1, and a second optical member arrangement process of arranging the second optical member 32 on the first optical member 31 and on the second bottom surface B2.

[0026] First, a first mask Z1 having an opening A on the first bottom surface B1 and covering the second bottom surface B2 is disposed. The first mask Z1 may be made of a photosensitive material capable of forming the opening A by photolithography. Thereby, as shown in FIG. 5, the second bottom surface B2 of the mold M can be covered with the first mask Z1. The first mask Z1 is preferably disposed so as to cover the entire surface of the second bottom surface B2. Further, the first mask Z1 may be disposed such that a part of the second bottom surface B2 continuous from the first bottom surface B1 is exposed. That is, a part of the first bottom surface B1 and the second bottom surface B2 may be exposed within the opening A of the first mask Z1. When the third bottom surface B3 is provided, it is preferable to dispose the first mask Z1 so as to cover the entire surface thereof.

[0027] Also, the first mask Z1 preferably uses a material having low wettability with the first optical member 31 before curing. Thereby, as shown in FIG. 6, within the opening A of the first mask Z1, it is easy to dispose the upper surface of the first optical member 31 to be convex.

[0028] Next, as shown in FIG. 6, a liquid first optical member 31 is disposed on the first bottom surface B1 exposed within the opening A. The liquid first optical member 31 can be disposed, for example, by methods such as a potting method, an air dispensing method, a jet dispensing method, or the like. The liquid first optical member 31 preferably has a convex shape in which the height of the central region is higher than the height of the outer peripheral region. The upper surface of the first optical member 31 after curing may be at a position higher than the second bottom surface B2 of the mold M. The upper surface of the first optical member 31 after curing can be arcuate in a cross-sectional view as shown in FIG. 6. Alternatively, at least a part of the upper surface of the liquid first optical member 31 may be a flat surface. As the liquid first optical member 31, for example, one having a viscosity of about 200 mPa·s or more and 1500 mPa·s or less is used. As the curing conditions for the liquid first optical member 31, for example, the heating temperature is 130°C to 160°C, and the heating time is 3 hours to 6 hours. When heating is performed to cure the second optical member 32 described later, the first optical member 31 is also heated. Therefore, at this stage, the first optical member 31 can be cured (pre-cured) to such an extent that it can maintain its shape. As the pre-curing conditions, for example, the heating temperature is 120°C to 140°C, and the heating time is 1 hour to 1.5 hours. After cooling, as shown in FIG. 7, the first mask Z1 is removed from the mold M.

[0029] Next, as shown in FIG. 8, a liquid second optical member 32 is disposed on the cured first optical member 31 or the pre-cured first optical member 31, and on the second bottom surface B2. The liquid second optical member 32 can be disposed, for example, by methods such as a potting method, an air dispensing method, a jet dispensing method, or the like.

[0030] Here, the specific gravity of the granular body 30p contained in the second optical member 32 is set to be larger than the specific gravity of the resin of the second optical member 32. Therefore, the granular body 30p can settle toward the bottom surface of the mold M. In other words, the granular body 30p can be distributed more on the first optical member 31 side and the second bottom surface B2 side.

[0031] <Insertion step> The insertion step is a step of inserting the surface (upper surface 21) on the light-emitting element side of the base body 20 into the liquid second optical member 32. As shown in FIG. 9, by inserting the base body 20 into the liquid second optical member 32, at least a part of the liquid second optical member 32 located between the upper surface 21 of the base body 20 and the first optical member 31 can be moved onto the second bottom surface B2. When the light-transmitting member 24 is disposed on the upper surface 21 of the base body 20, at least a part of the liquid second optical member 32 located between the light-transmitting member 24 and the first optical member 31 can be moved onto the second bottom surface B2. Specifically, the base material 30m and the granular bodies 30p included in the second optical member 32 can be moved onto the second bottom surface B2.

[0032] More specifically, focusing on the granular bodies 30p, the granular bodies 30p can be arranged more on the second bottom surface than on the first bottom surface B1. Thereby, it is possible to reduce the light emission from the light-emitting element 10 being blocked by the granular bodies 30p.

[0033] By providing either the convex light-transmitting member 24 disposed on the upper surface 21 of the base body 20 or the first optical member 31 whose upper surface is located at a position higher than the second bottom surface B2, the liquid second optical member 32 can be efficiently moved, and by providing both, it can be moved more efficiently.

[0034] In the insertion step, the first optical member 31 and the light-transmitting member 24 may be separated or in contact with each other. For example, as shown in FIG. 9, when the upper surface of the first optical member 31 is convex with a curved surface and the upper surface of the light-transmitting member is also convex with a curved surface, the tops of both can be in contact and the peripheral portions can be arranged to be separated. Also, when the upper surface of the first optical member 31 and / or the upper surface of the light-transmitting member is a flat surface, they can be arranged so that the flat surfaces are in contact with each other. In this way, by the first optical member 31 and the light-transmitting member 24 being in contact with each other, it is possible to make it easier to move the second optical member 32 located between them onto the second bottom surface B2. Also, when the first optical member 31 and the light-transmitting member 24 are separated, it is preferable that the distance of the closest part is smaller than the diameter of the granular bodies 30p.

[0035] In the insertion step, the liquid second optical member 32 can be arranged to climb up the side surface of the base 20 as shown in FIG. 9. By covering the side surface of the base 20 with the second optical member 32, the adhesion between the second optical member 32 and the base 20 can be improved. Further, when the granular bodies 30p are included in the climbing-up portion, that is, the portion covering the side surface of the base 20, the gloss can be reduced even when viewed from the side surface of the light-emitting device. The climbing-up portion may not include the granular bodies 30p.

[0036] Thereafter, the second optical member 32 can be formed by curing the liquid second optical member 32. Examples of the curing conditions include a heating temperature of 130° C. to 160° C. and a heating time of 3 hours to 6 hours. Then, by taking out the light-emitting device including the optical member from the mold M, the light-emitting device 1A as shown in FIG. 10A can be manufactured.

[0037] <Roughening step> Further, as an optional additional step, a roughening step may be further provided in which the first surface P1 of the first optical member 31 of the light-emitting device 1A shown in FIG. 10A is covered with the second mask Z2 and the second surface P2 is roughened. Thereby, the light-emitting device 1 as shown in FIG. 1B can be obtained. As the second mask Z2, for example, as shown in FIG. 10B, a metal mask or the like disposed above the first optical member 31 can be used. The second mask Z2 such as a metal mask can cover the first surface P1 and have an opening on the second surface P2.

[0038] Further, as the second mask Z2, as shown in FIG. 10C, a resist or the like may be applied on the first surface P1 and used as the second mask Z2.

[0039] As used in this specification, the roughening of the second surface P2 is intended to form irregularities by exposing the granular bodies 30p disposed on the second surface P2 to the surface, and also to have the optical member 30 (specifically, the second optical member 32) remaining thinly to such an extent that irregularities caused by the granular bodies 30p occur.

[0040] According to the roughening process, unevenness caused by the granular bodies 30p disposed on the second surface P2 can be appropriately generated, and the degree of unevenness can be improved, so that the reflection of external light can be reduced.

[0041] The roughening of the second surface P2 may include any one of blast treatment, UV treatment, or plasma treatment. Among them, UV treatment is effective because it can decompose the outermost resin by irradiating UV light.

[0042] As described above, according to the manufacturing method of the light-emitting device of the present disclosure, by reducing the gloss of the surface of the optical member, a light-emitting device capable of reducing the reflection of external light can be obtained.

[0043] Hereinafter, each member constituting the light-emitting device will be described in detail.

[0044] <Light-emitting element> The light-emitting element 10 is a semiconductor light-emitting element such as a semiconductor laser or a light-emitting diode. As an example, the light-emitting device shown in FIG. 1A has three light-emitting elements 10 arranged therein. The emission wavelength of each light-emitting element 10 can be arbitrarily selected. For example, the first light-emitting element 11 may be a red light-emitting element that emits red light, the second light-emitting element 12 may be a green light-emitting element that emits green light, and the third light-emitting element 13 may be a blue light-emitting element that emits blue light. The combination of the number of light-emitting elements, the emission color, and the peak wavelength is an example and is not limited to this example.

[0045] As the ultraviolet, blue, green, and red light-emitting elements, for example, light-emitting elements using nitride semiconductors (In X Al Y Ga 1-X-Y N, 0 ≦ X, 0 ≦ Y, X + Y ≦ 1) can be used. Also, as the red light-emitting element, semiconductors such as GaAs, AlInGaP, and AlGaAs can be used. Furthermore, semiconductor light-emitting elements made of other materials can also be used. The composition, emission color, peak wavelength, size, number, etc. of the light-emitting element can be appropriately selected according to the purpose.

[0046] In addition, as the light-emitting element, a structure including a semiconductor chip composed of a nitride-based semiconductor or the like and a phosphor that wavelength-converts light from the semiconductor chip can be used.

[0047] Specific examples of the phosphor include yttrium aluminum garnet activated with cerium, lutetium aluminum garnet activated with cerium, calcium nitrogen-containing aluminosilicate activated with europium and / or chromium (a part of calcium can be substituted with strontium), sialon activated with europium, silicate activated with europium, strontium aluminate activated with europium, potassium fluorosilicate activated with manganese, and the like. As an example, each of the first light-emitting element 11, the second light-emitting element 12, and the third light-emitting element 13 may have a semiconductor chip that emits blue light. In this case, by disposing a phosphor around the semiconductor chip in at least two of these light-emitting elements, the emission colors of the first light-emitting element 11, the second light-emitting element 12, and the third light-emitting element 13 can be made different from each other.

[0048] The first light-emitting element 11, the second light-emitting element 12, and the third light-emitting element 13 are each joined to a conductive member such as a lead electrode 23 provided on a base 20 described later by a joining member such as resin, solder, or conductive paste.

[0049] <Base> The substrate 20 includes a pair of conductive members 23 of positive and negative polarities. Further, it may include a base material 25 that integrally holds the pair of conductive members 23. For example, a resin package including a pair of lead electrodes using metal plates as the conductive members 23 and a resin member as the base material 25 that integrally holds them, as shown in FIG. 3A, can be used as the substrate 20. Examples of the resin material of the base material 25 include thermoplastic resins such as PA (polyamide), PPA (polyphthalamide), PPS (polyphenylene sulfide), or liquid crystal polymer, and thermosetting resins such as epoxy resin, silicone resin, modified epoxy resin, urethane resin, or phenol resin. Further, a colorant for coloring in a dark color system may be added to the resin material. Various dyes and pigments are used as the colorant. Specifically, as the colorant, Cr 2 O 3 , MnO 2 , Fe 2 O 3 , carbon black, etc. can be mentioned. Thereby, while reducing the gloss of the light-emitting device, a decrease in contrast can be reduced. Alternatively, a white powder for whitening the substrate may be added to the resin material. Specifically, as the white powder, TiO 2 , ZnO, etc. can be mentioned. Thereby, while reducing the gloss of the light-emitting device, the luminance can be improved.

[0050] In addition, a ceramic package having a ceramic as the base material and wiring as the conductive member can be used as the substrate. Examples of the ceramic material of the base material 25 include silicon nitride, aluminum nitride, silicon carbide, etc. Further, as the substrate, instead of ceramic, a glass epoxy substrate using glass epoxy, a BT resin substrate using bismaleimide triazine (BT resin), etc. can be used.

[0051] As shown in FIG. 1B and the like, the substrate 20 has an upper surface 21 on which the light-emitting element 10 is disposed and a lower surface 22 on the opposite side of the upper surface 21. As shown in FIG. 1B, a substrate 20 provided with a recess 27 can be used. The recess 27 is defined by the upper surface 21 of the substrate 20 and a wall portion 26 surrounding the upper surface 21. The height of the wall portion 26 can be approximately the same as the height of the light-emitting element 10. When a plurality of light-emitting elements 10 are provided, the wall portions 26 may be arranged so as to surround each light-emitting element, or may be arranged so as to surround the plurality of light-emitting elements 10 with one wall portion 26.

[0052] One pair of conductive members (lead electrodes) 23 has one end electrically connected to the light-emitting element 10. Also, the other end is exposed from the substrate 20 and is electrically connected to the wiring of the wiring substrate.

[0053] <Light-transmitting member> The light-transmitting member 24 is a member disposed on the upper surface 21 of the substrate 20 and covering the light-emitting element 10. The upper surface of the light-transmitting member 24 can be a flat surface or a curved surface. In the example shown in FIG. 1B, the upper surface of the light-transmitting member 24 is a convex curved surface with the central portion higher than the outer peripheral portion. When such a convex light-transmitting member 24 is used, the height of the central portion can be, for example, 50 μm or more and 150 μm or less than the upper surface of the wall portion 26 when the wall portion 26 is provided. When the wall portion 26 is not provided, that is, when the upper surface of the substrate 20 is a flat surface, it is preferably the height that covers the upper surface of the light-emitting element 10. Further, when a wire 40 connected to the upper surface of the light-emitting element 10 is provided, it is preferably the height that covers all of the wire 40. Examples of the material of the light-transmitting member 24 include epoxy resin, modified epoxy resin, urea resin, silicone resin, modified silicone resin, and glass.

[0054] <Optical member> The optical member 30 is a translucent member that constitutes the light-emitting surface of the light-emitting device. The upper surface of the optical member 30 has a first surface P1 including a portion overlapping the light-emitting element 10 in a top view, and a second surface P2 disposed around the first surface P1. Note that the second surface P2 is not limited to a mode adjacent to the first surface P1, and may be separated from the first surface P1 as long as it is disposed around the first surface P1.

[0055] The optical member 30 includes a first optical member 31 that constitutes the first surface P1 and a second optical member 32 that constitutes the second surface P2. The first optical member 31 and the second optical member 32 each contain a resin material, and the first optical member 31 and the second optical member 32 are integrated to form the optical member 30. More specifically, the optical member 30 includes a second optical member 32 that covers the base 20, and a first optical member 31 that is above the second optical member 32 and is disposed above the light-emitting element 10. Hereinafter, the first optical member 31 and the second optical member 32 will be described in detail. Note that the light-emitting device 1 of the present disclosure is not limited to one in which the optical member 30 described in detail below is composed of a plurality of members (the first optical member 31 and the second optical member 32), and the optical member may be composed of one member. Alternatively, the optical member may be composed of three or more members.

[0056] · The first optical member The first optical member 31 is disposed at a position overlapping the light-emitting element 10 in a top view, and includes a first surface P1 that is an outer surface (upper surface). The first surface P1 is a flat surface or a curved surface. In the example shown in FIG. 1B, the first surface P1 of the first optical member 31 is a curved convex surface that is located above the second surface P2 and convex upward. By adopting such a shape, it can act as a lens for controlling the light distribution of the light emitted from the light-emitting element 10. However, it is not limited thereto, and the first surface P1 may be flush with the second surface P2, or may be located below the second surface P2.

[0057] The lower surface of the first optical member 31, that is, the surface facing the light-emitting element 10, is a convex surface that is convex downward in the example shown in FIG. 1B. The lower surface of the first optical member 31 is preferably located below the second surface P2. However, it is not limited to this, and the lower surface of the first optical member 31 may be flush with the second surface P2, or may be located above the second surface P2.

[0058] When there are a plurality of light-emitting elements 10, the first optical member 31 can be arranged for each light-emitting element 10. For example, when there are three light-emitting elements 10, three first optical members 31 can be arranged. Alternatively, one first optical member 31 may be arranged for a plurality of light-emitting elements 10. For example, when there are three light-emitting elements 10, it may be one first optical member 31 that overlaps the three light-emitting elements 10 in a top view, or one first optical member 31 may be arranged at a position overlapping one light-emitting element 10, and one first optical member 31 may be arranged at a position overlapping two light-emitting elements 10.

[0059] As the material of the first optical member 31, a thermosetting resin such as an epoxy resin, a modified epoxy resin, a urea resin, a silicone resin, a modified silicone resin, or glass can be used.

[0060] The first optical member 31 may be only the material serving as the base material, or may contain a colorant for coloring it in a predetermined color in the base material.

[0061] ·Second optical member The second optical member 32 includes a second surface P2 that is arranged at a position surrounding the first optical member 31 in a top view. In the first embodiment, the second optical member 32 is in contact with a part of the upper surface 21 of the base 20. When the light-transmitting member 24 is provided on the upper surface 21 of the base 20, it is in contact with the upper surface of the light-transmitting member 24. Further, the second optical member 32 also covers the side surface of the base 20. The second optical member 32 includes a light-transmitting base material 30m that transmits light from the light-emitting element 10 and granular bodies 30p. As the light-transmitting base material 30m, the same material as that of the first optical member 31 may be used, or a material different from the resin material of the first optical member 31 may be used.

[0062] The granular bodies 30p are arranged more on the second surface P2 than on the first surface P1. Thereby, the gloss of the second surface P2 can be reduced. Further, the second surface P2 can be a surface having irregularities caused by the shape of the granular bodies 30p, and thereby the gloss can be reduced.

[0063] The granular bodies 30p are preferably inorganic members having a specific gravity greater than that of the base material 30m such as resin. For example, silicon oxide, glass, aluminum oxide, barium sulfate, titanium oxide, zinc oxide, magnesium oxide, zirconium oxide, aluminum nitride, calcium carbonate, calcium silicate, ferric oxide, zinc oxide, barium titanate, etc. can be mentioned. Further, as the silicon oxide, crystalline silicon oxide or amorphous silicon oxide (fused silica) can be used. These can be used alone or in combination, and furthermore, a composite of these materials can be used. The average particle diameter of the granular bodies 30p is preferably 1 μm or more and 60 μm or less, more preferably 2 μm or more and 30 μm or less, and even more preferably 4 μm or more and 10 μm or less. The shape of the granular bodies can be spherical, crushed, fibrous, or amorphous, and these can be single or mixed, and spherical or crushed is preferable from the viewpoint of workability. The average particle diameter can be measured, for example, with a dry particle diameter measuring device using the Fisher method.

[0064] Further, as the granular bodies 30p, an inorganic member having a specific gravity smaller than that of the base material 30m may be used. In that case, for example, the viscosity of the resin serving as the base material 30m is set to a relatively high viscosity of about 100 Pa·s or more and 600 Pa·s or less, and the granular bodies 30p can be arranged on the second surface P2 side after curing by curing before the inorganic member having a small specific gravity floats up. Examples of the granular bodies 30p having a specific gravity lighter than that of the base material 30m include hollow glass. Alternatively, porous particles or resin particles such as silicone having a specific gravity lighter than that of the base material 30m can be mentioned.

[0065] The specific gravity of the granular body 30p may be set to be greater than the specific gravity of the base material of the second optical member 32. For example, the specific gravity of the granular body 30p can be set to be 2 times or more and 6 times or less than the specific gravity of the base material of the second optical member 32.

[0066] Furthermore, the granular body 30p may be a light diffusing member that diffuses the light emitted from the light emitting element 10. Since it has light diffusing properties, it is possible to improve the uniformity of the light quality and reduce the light intensity unevenness.

[0067] From the viewpoint of appropriately forming unevenness on the surface, the content of the granular body 30p is preferably contained in an amount of 20% or more and 40% or less, more preferably 25% or more and 35% or less, based on the total weight of the second optical member 32.

[0068] The granular body 30p is preferably distributed at a position close to the second surface P2. For example, the thickness of the granular body-containing layer is preferably 10 μm or more and 300 μm or less.

[0069] As described above, according to the light emitting device of the present disclosure, the optical member 30 including the granular body 30p is provided. In the optical member 30, since the second surface P2 is a rough surface caused by the shape of the granular body 30p, it is possible to reduce the gloss of the surface of the optical member 30 by arranging the granular body at a desired position.

[0070] [Second Embodiment] An example of a light-emitting device according to the second embodiment is shown in FIG. 11. FIG. 11 is a schematic cross-sectional view of the light-emitting device 2. The light-emitting device 2 differs from the light-emitting device 1 of the first embodiment in the structure of the optical member. In the second embodiment, the optical member 30 is the same as that in the first embodiment in that it includes a first optical member 31 constituting the first surface P1 of the optical member 30 and a second optical member 32 constituting the second surface P2. That is, in the second embodiment, as in the first embodiment, the first optical member 31 and the second optical member 32 each contain a resin material, and the first optical member 31 and the second optical member 32 are integrated to form the optical member 30. The second embodiment is different from the first embodiment in that the first optical member 31 is arranged in contact with the base 20 and the second optical member 32 is arranged at a distance from the base 20. The materials constituting the first optical member 31 and the second optical member 32 are the same as those in the first embodiment. Also, regarding other configurations, they are basically the same as those of the light-emitting device 1 according to the first embodiment. Hereinafter, this different configuration will be described.

[0071] <Optical member> ·First optical member The upper surface of the first optical member 31 includes a first surface P1 that serves as an outer surface and a portion disposed around the first surface P1 in a top view. A part of the upper surface located around the first surface P1 of the first optical member 31 is covered by the second optical member 32.

[0072] The shape of the first surface P1 is the same as that in the first embodiment. The upper surface located around the first surface P1 is a flat surface in the example shown in FIG. 11. However, it is not limited to this, and it can be a concave surface or a convex surface. Also, the upper surface of the first optical member 31 has a portion that is further exposed to the outside around the portion covered by the second optical member 32.

[0073] The first optical member 31 is in contact with the base 20. In the example shown in FIG. 11, the first optical member 31 is also in contact with the side surface of the base 20. Further, the first optical member 31 is also in contact with the light-transmitting member 24.

[0074] ·Second optical member The second optical member 32 is disposed on the first optical member 31. Specifically, as shown in FIG. 11, it is disposed on the upper surface of the first optical member 31 located around the first surface P1 that overlaps with the light-emitting element 10 in a top view. The configuration of the second surface P2, which is the upper surface of the second optical member 32, is the same as that of the first embodiment. The lower surface of the second optical member 32 is in contact with the upper surface of the first optical member 31. In the second embodiment, as the granular material 30p, in addition to the materials listed in the first embodiment, black granular materials 30p such as carbon black and titanium black can also be used.

[0075] The manufacturing method of the light-emitting device 2 as described above will be described with reference to FIGS. 12 to 16. As shown in FIG. 12, the manufacturing method of the light-emitting device according to the second embodiment is different from the manufacturing method of the light-emitting device according to the first embodiment in the aspect of the optical member arrangement step. Regarding other configurations, it is basically the same as the manufacturing method of the light-emitting device according to the first embodiment of the present disclosure described above.

[0076] The manufacturing method of the light-emitting device according to the second embodiment is a light-emitting device intermediate preparation step of preparing a light-emitting device intermediate including a light-emitting element and a substrate having an upper surface on which the light-emitting element is disposed, a mold preparation step of preparing a mold having a recess defined by a bottom surface and a side surface, the bottom surface including a first bottom surface and a second bottom surface disposed around the first bottom surface, an optical member arrangement step of arranging an optical member including a first optical member and a second optical member including a granular material in the recess, an insertion step of inserting the upper surface side of the substrate into the optical member, and has The optical member arrangement step includes a second optical member arrangement step of arranging the second optical member on the second bottom surface and a first optical member arrangement step of arranging the first optical member on the second optical member and the first bottom surface. Hereinafter, this different configuration will be described.

[0077] <Optical member arrangement step> The optical member placement process of the second embodiment includes a second optical member placement process of placing the second optical member 32 on the second bottom surface B2 of the mold M, and a first optical member placement process of placing the first optical member 31 on the second optical member 32 and the first bottom surface B1. That is, it is different from the manufacturing method of the light-emitting device of the first embodiment in that the second optical member placement process is performed first, and then the first optical member placement process is performed. Note that, similar to the manufacturing method of the light-emitting device of the first embodiment described above, the first bottom surface B1 and the second bottom surface B2 will be described by taking the case where the second bottom surface B2 is a flat plane and the first bottom surface B1 is a concave surface recessed from the second bottom surface B2 as an example.

[0078] As the second optical member placement process, first, as shown in FIG. 13, a third mask Z3 that covers the first bottom surface B1 of the mold M and exposes the second bottom surface B2 is arranged. When the third bottom surface B3 is provided, it is preferable to arrange the third mask Z3 so as to cover the entire surface. The third mask Z3 can be made of the same material as the first mask Z1.

[0079] Next, as shown in FIG. 14, a liquid second optical member 32 containing granular bodies 30p that constitute the second optical member 32 is arranged on the second bottom surface B2. Then, by curing the liquid second optical member 32, the cured second optical member 32 can be arranged on the second bottom surface B2. Then, as shown in FIG. 15, the third mask Z3 is removed from the mold M.

[0080] Next, as shown in FIG. 16, as the first optical member placement process, the first optical member 31 is arranged on the second optical member 32 and the first bottom surface B1.

[0081] The other processes can be performed in the same manner as in the first embodiment to obtain the light-emitting device 2.

[0082] [Third Embodiment] An example of a light-emitting device according to the third embodiment is shown in FIG. 17. FIG. 17 is a schematic cross-sectional view of the light-emitting device 3. The light-emitting device 3 has a different optical member structure compared to the first and second embodiments. In the third embodiment, the base material constituting the first surface P1 and the base material constituting the second surface P2 are not separate but the same (integrated). The second surface P2 includes carbon particles 30q as granular bodies 30p, and the carbon particles 30q are held by the base material 30m of the optical member 30. Regarding other configurations, they are basically the same as those of the light-emitting device according to the first embodiment. Hereinafter, this different configuration will be described.

[0083] The manufacturing method of the light-emitting device according to the third embodiment a light-emitting device intermediate preparation step of preparing a light-emitting device intermediate including a light-emitting element and a substrate having an upper surface on which the light-emitting element is disposed; a mold preparation step of preparing a mold having a recess defined by a bottom surface and a side surface, the bottom surface including a first bottom surface and a second bottom surface disposed around the first bottom surface; an optical member arrangement step of arranging carbon particles or a carbon-containing member including carbon particles and a solvent in the recess; an insertion step of inserting the upper surface side of the substrate into the optical member; and has The optical member arrangement step includes a first arrangement step of arranging a carbon member including carbon particles or carbon particles and a volatile solution and not including resin or glass on the second bottom surface, and a second arrangement step of arranging a carbon-free carbon non-containing member on the first bottom surface and on the carbon member. Hereinafter, the different configurations will be described.

[0084] <Optical member arrangement step> The optical member arrangement step of the third embodiment includes a first arrangement step of arranging a carbon member on the second bottom surface of the mold M, and a second arrangement step of arranging a carbon-free carbon non-containing member on the first bottom surface and on the carbon member.

[0085] As the first configuration step, first, place a mask (third mask Z3) on the first bottom surface B1 as shown in FIG. 13. Next, place carbon particles 30q or a carbon member 30c containing carbon particles 30q and a volatile solution on the second bottom surface B2. The carbon member 30c does not contain resin or glass. In the case of a carbon member 30c consisting only of carbon particles 30q, the carbon particles 30q are placed as a powder. In the case of a carbon member 30c containing a volatile solution, a step of volatilizing the volatile solution is performed. For example, as a method of volatilization, for example, in an environment at a temperature of 40°C or higher and 100°C or lower, by standing for 1 hour or more and 24 hours or less, the volatile solution can be volatilized so that only the carbon particles 30q are placed on the second bottom surface B2.

[0086] The average particle size of the granular carbon particles 30q is preferably 1 nm or more and 300 nm or less, more preferably 5 nm or more and 150 nm or less, and even more preferably 10 nm or more and 90 nm or less. The shape of the carbon particles 30q can be spherical, crushed, fibrous, or amorphous, and these can be used alone or in combination, and spherical or crushed shapes are preferred from the viewpoint of workability.

[0087] Next, after removing the mask, place the optical member 30 on the carbon member 30c on the first bottom surface B1 and the second bottom surface B2.

[0088] The other steps can be performed in the same manner as in the first embodiment or the like to obtain the light-emitting device 3.

[0089] [Other Embodiments] The first embodiment, the second embodiment, and the third embodiment can be combined. For example, the light-emitting device 4 shown in FIG. 18 includes, as the optical member 30, a first optical member 31 that constitutes the first surface P1, a second optical member 32 that constitutes the second surface P2, and a third optical member 33 that further contacts the substrate 20. The first optical member 31 does not contact the substrate 20 in the same manner as in the first embodiment. The second optical member 32 does not contact the substrate 20 in the same manner as in the second embodiment. The third optical member 33 is translucent and does not contain granular materials.

[0090] The light-emitting device 5 shown in FIG. 19 includes, as the optical member 30, a first optical member 31 that constitutes the first surface P1, and a carbon member 30c that constitutes the second surface P2 and includes a plurality of carbon particles 30q, and a second optical member 32. The first optical member 31 does not contact the substrate 20, similar to the first embodiment. The second optical member 32 holds the carbon member 30c and includes granular bodies 30p, similar to the third embodiment.

[0091] The light-emitting device 6 shown in FIG. 20 includes, as the optical member 30, a first optical member 31 that constitutes the first surface P1, and a carbon member 30c that constitutes the second surface P2 and includes a plurality of carbon particles 30q, and a second optical member 32. The first optical member 31 contacts the substrate 20, similar to the second embodiment. The second optical member 32 holds the carbon member 30c and includes granular bodies 30p, similar to the third embodiment.

[0092] The light-emitting device 7 shown in FIG. 21 includes, as the optical member 30, a first optical member 31 that constitutes the first surface P1, a carbon member that constitutes the second surface P2, and a second optical member 32, and a third optical member 33 that contacts the substrate 20. The first optical member 31 does not contact the substrate 20, similar to the first embodiment. The second optical member 32 does not contact the substrate 20, similar to the second embodiment, holds the carbon member, and includes granular bodies 30p, similar to the third embodiment.

[0093] <Modification Example> In each of the above embodiments, although a resin package or a ceramic package as illustrated in FIGS. 1A and 1B is exemplified as the substrate, as shown in FIGS. 22A and 22B, a light-emitting device 8 having only the conductive member 23 (lead) as the substrate may be used.

Examples

[0094] Hereinafter, regarding the light-emitting device of the present disclosure, the light-emitting devices of Examples 1 to 4 and Comparative Example 1 shown below were manufactured, and the surface roughness at the position corresponding to the second surface was evaluated.

[0095] ·Example 1 An intermediate light-emitting device 1b as shown in FIG. 3B was prepared. A mold M as shown in FIGS. 4A and 4B was prepared. As shown in FIG. 5, a first mask Z1 was placed on the second bottom surface B2, and after a liquid first optical member 31 was placed on the first bottom surface B1 by a potting method, it was heated at 130° C. for 1.5 hours and pre-cured to form a first optical member 31 having a convex upper surface as shown in FIG. 6. The first optical member 31 was prepared by mixing 100 parts of Celloxide 2021P manufactured by Daicel Corporation, 115 parts of Recacid MH700G manufactured by Shin Nippon Rika Co., Ltd., and 0.5 part of U-CAT50003 manufactured by San-Apro Co., Ltd. as an epoxy resin.

[0096] Next, using 100 g of the above-described epoxy resin as a base material, 50 g of SiO 2 (Crystallite VX-S2 manufactured by Tatsumori Co., Ltd., average particle size 3 μm, specific gravity 2.65) was mixed as granular material 30p to form a liquid second optical member 32. As shown in FIG. 8, the second optical member 32 was placed on the second bottom surface B2 of the mold M and the pre-cured first optical member 31 by a potting method.

[0097] The upper surface side of the intermediate light-emitting device 1b was inserted into the liquid second optical member 32 and heated at 150° C. for 2 hours to cure it. Then, the mold M was removed, and a roughening process was performed. In the roughening process, as shown in FIG. 10B, a second mask Z2 was placed on the first surface P1, and UV light was irradiated onto the upper surface of the second surface P2. The UV light was irradiated for 200 hours using a metal halide lamp at 16 mW / cm 2 . Thereby, the light-emitting device 1 as shown in FIG. 1B was manufactured. The light-emitting device 1 includes a light-emitting element 10, a substrate 20 on which the light-emitting element 10 is disposed, and an optical member 30 that covers a part of the substrate 20 and the light-emitting element 10 and contains granular material 30p. The optical member 30 has a first surface P1 that overlaps the light-emitting element 10 in a top view and a second surface P2 that is disposed around the first surface P1. The second surface P2 is a rough surface resulting from the shape of the granular material 30p. The manufacturing method of the light-emitting device was adopted from the manufacturing method of the light-emitting device of the first embodiment.

[0098] ·Example 2 As the second optical member 32, 100 g of the same base material (epoxy resin) as in Example 1, 50 g of granular material 30p of SiO 2 (Ronson Crystalite VX-S2, manufactured by Ronson Corporation, average particle size 3 μm, specific gravity 2.65), and Aerosil RY200L (nanosilica manufactured by Nippon Aerosil Co., Ltd., average primary particle size 12 nm) as a thickening agent were added and prepared. The liquid second optical member 32 was placed on the second bottom surface B2 of the mold M by the potting method as shown in FIG. 14, and then heated at 130° C. for 1.5 hours for preliminary curing. Then, the same epoxy resin as the base material of the second optical member 32 was placed on the first bottom surface B1 and the preliminarily cured second optical member 32 by the potting method, and then the upper surface side of the light-emitting device intermediate 1b was inserted into the liquid second optical member 32. The subsequent steps were performed in the same manner as in Example 1 to manufacture the light-emitting device 2 shown in FIG. 11. The manufacturing method of the light-emitting device adopted the manufacturing method of the light-emitting device of the second embodiment. The average primary particle size of Aerosil can be, for example, the average value obtained by measuring the particle sizes of 20 granular materials 30p from an image taken with a transmission electron microscope (TEM) as the average particle size.

[0099] · Example 3 A light-emitting device was manufactured in the same manner as in Example 2, except that glass bubbles iM16K (hollow glass manufactured by 3M Company, average particle size 15 μm) were used as the granular material 30p.

[0100] · Example 4 On the first bottom surface B1 of the forming mold M, SIM-360 (a silicone resin manufactured by Shin-Etsu Chemical Co., Ltd.) was placed as a mask by the potting method and heated at 150 °C for 30 minutes to cure. Next, on the second bottom surface B2, only 30 p of granular materials of Nitron #10 (carbon black manufactured by Nippon Steel Carbon Co., Ltd., average primary particle size of 30 nm) as a carbon member were temporarily held with a cotton swab, cotton ball, etc., and arranged using a holding member that can be transferred to a desired position. Next, the same second optical member 32 as in Example 2 was arranged. Then, the mask was removed, and the first optical member 31 of Example 2 was arranged as the optical member 30 on the first bottom surface B1 and the carbon member by the potting method. The subsequent steps were carried out in the same manner as in Example 2, and the light-emitting device 6 shown in FIG. 20 was manufactured. The manufacturing method of the said light-emitting device adopted the manufacturing method of the light-emitting device of the third embodiment.

[0101] · Comparative Example 1 When manufacturing the light-emitting device of Example 1, the light-emitting device was manufactured without containing granular materials in the optical member.

[0102] The results of the surface roughness at the positions corresponding to the second bottom surface in the light-emitting devices of Examples 1 to 4 and Comparative Example 1 are shown in Table 1 below.

[0103]

Table 1

[0104] According to Table 1 above, compared with Comparative Example 1 in which the optical member does not contain granular materials, the surface roughness of the second surface in the roughening process (before UV light irradiation) in Examples 1 to 4 in which the optical member contains granular materials is larger, and the result that the gloss can be reduced was obtained. Furthermore, the second surface after the roughening process (after UV light irradiation) in Examples 1 to 4 can have a greater degree of unevenness by exposing the granular materials on the surface, so the result that the gloss can be further reduced was obtained.

[0105] It should be noted that the embodiments disclosed this time are illustrative in all respects and are not a basis for restrictive interpretation.

[0106] The present disclosure includes the following embodiments. [Item 1] A light-emitting device intermediate preparation step of preparing a light-emitting device intermediate including a light-emitting element and a substrate having an upper surface on which the light-emitting element is disposed; A mold preparation step of preparing a mold having a recess defined by a bottom surface and a side surface, the bottom surface including a first bottom surface and a second bottom surface disposed around the first bottom surface; An optical member arrangement step of arranging an optical member including a first optical member and a second optical member including granular bodies in the recess; An insertion step of inserting the upper surface side of the substrate into the optical member; which has The optical member arrangement step includes a first optical member arrangement step of arranging the first optical member on the first bottom surface, and a second optical member arrangement step of arranging the second optical member on the first optical member and on the second bottom surface. A method for manufacturing a light-emitting device. [Item 2] The method for manufacturing a light-emitting device according to [Item 1], wherein the second bottom surface is a flat plane and the first bottom surface is a concave surface recessed from the second bottom surface. [Item 3] The first optical member arrangement step includes a step of arranging a first mask having an opening on the first bottom surface and covering the second bottom surface, a step of arranging the first optical member on the first bottom surface exposed in the opening, and a step of removing the first mask. The method for manufacturing a light-emitting device according to [Item 1] or [Item 2]. [Item 4] In the first optical member arrangement step, the first optical member is arranged on the first bottom surface such that the upper surface of the first optical member is located at a position higher than the second bottom surface. In the insertion step, at least a part of the second optical member located between the first optical member and the substrate is moved onto the second bottom surface. The method for manufacturing a light-emitting device according to any one of [Items 1] to [3]. [Item 5] The light-emitting device intermediate further has a convex light-transmissive member that covers the light-emitting element and is disposed on the substrate. The insertion step includes a step of moving at least a part of the second optical member located between the light-transmitting member and the first optical member onto the second bottom surface, and is the manufacturing method of the light-emitting device according to any one of [Item 1] to [Item 4]. [Item 6] The light-emitting device intermediate further includes a convex light-transmitting member that covers the light-emitting element and is disposed on the substrate. In the first optical member disposing step, the first optical member is disposed on the first bottom surface such that the upper surface of the first optical member is positioned higher than the second bottom surface. The insertion step includes a step of moving at least a part of the second optical member located between the light-transmitting member and the first optical member onto the second bottom surface, and is the manufacturing method of the light-emitting device according to any one of [Item 1] to [Item 5]. [Item 7] A light-emitting device intermediate preparation step of preparing a light-emitting device intermediate including a light-emitting element and a substrate having an upper surface on which the light-emitting element is disposed. A mold preparation step of preparing a mold having a recess defined by a bottom surface and a side surface, wherein the bottom surface includes a first bottom surface and a second bottom surface disposed around the first bottom surface. An optical member disposing step of disposing an optical member including a first optical member and a second optical member including granular bodies in the recess. An insertion step of inserting the upper surface side of the substrate into the optical member. It has The optical member disposing step includes a second optical member disposing step of disposing the second optical member on the second bottom surface and a first optical member disposing step of disposing the first optical member on the second optical member and the first bottom surface, and is the manufacturing method of the light-emitting device. [Item 8] The second bottom surface is a flat plane, and the first bottom surface is a concave surface recessed from the second bottom surface, and is the manufacturing method of the light-emitting device according to [Item 7]. [Item 9] The second optical member arranging step includes: arranging a second mask that covers the first bottom surface and exposes the second bottom surface; arranging the second optical member on the exposed second bottom surface; and removing the second mask, and is the method for manufacturing a light-emitting device according to [Item 7] or [Item 8]. [Item 10] The optical member includes the granular material and the resin. The specific gravity of the granular material is greater than that of the resin, and is the method for manufacturing a light-emitting device according to any one of [Item 1] to [Item 9]. [Item 11] The granular material is a light diffusion member, and is the method for manufacturing a light-emitting device according to any one of [Item 1] to [Item 10]. [Item 12] The granular material includes at least one of silicon oxide and aluminum oxide, and is the method for manufacturing a light-emitting device according to any one of [Item 1] to [Item 11]. [Item 13] The granular material is light-absorbing, and is the method for manufacturing a light-emitting device according to [Item 7] or any one of [Item 8] to [Item 12] that cites [Item 7]. [Item 14] After the optical member arranging step, a step of taking out the light-emitting device including the optical member from the mold. The method for manufacturing a light-emitting device according to any one of [Item 1] to [Item 13] further includes a roughening step of covering the first surface corresponding to the first bottom surface with a third mask and roughening the second surface corresponding to the second bottom surface among the surfaces of the optical member having the first surface corresponding to the first bottom surface and the second surface corresponding to the second bottom surface. [Item 15] The roughening step includes any one of plasma treatment, blast treatment, or UV treatment, and is the method for manufacturing a light-emitting device according to [Item 14]. [Item 16] A light-emitting element A substrate on which the light-emitting element is arranged An optical member that covers a part of the substrate and the light-emitting element and includes a granular material and is provided with The light-emitting device, wherein the optical member has a first surface that overlaps with the light-emitting element in a top view, and a second surface that is disposed around the first surface, and the second surface is a rough surface resulting from the shape of the granular material. [Item 17] The light-emitting device according to [Item 16], wherein the optical member includes a first optical member that constitutes the first surface and a second optical member that constitutes the second surface. [Item 18] A light-emitting device intermediate preparation step of preparing a light-emitting device intermediate including a light-emitting element and a substrate having an upper surface on which the light-emitting element is disposed; A mold preparation step of preparing a mold having a recess defined by a bottom surface and a side surface, wherein the bottom surface includes a first bottom surface and a second bottom surface disposed around the first bottom surface; An optical member placement step of placing an optical member having a granular material containing carbon particles in the recess; An insertion step of inserting the upper surface side of the substrate into the optical member; having The method for manufacturing a light-emitting device, wherein the optical member placement step includes a first placement step of placing a carbon member containing carbon particles or a carbon particle and a volatile solution and not containing resin or glass on the second bottom surface, and a second placement step of placing a carbon-free member on the first bottom surface and on the carbon member.

Explanation of Signs

[0107] 1, 2, 3, 4, 5, 6, 7, 8 Light-emitting device 1a, 1b Light-emitting device intermediate 10 Light-emitting element 11 First light-emitting element 12 Second light-emitting element 13 Third light-emitting element 20 Substrate 21 Upper surface of the substrate 22 Lower surface of the substrate 23 Conductive member (lead electrode) 24 Translucent member 25 Base material 26 Wall portion 27 Recess 30 Optical member 31 First optical member 32 Second optical member 33 Third optical member 30p Granular body 30q Carbon particle 30c Carbon member 30m Base material P Upper surface of the optical member P1 First surface of the upper surface of the optical member P2 Second surface of the upper surface of the optical member 40 Wire M Mold B Bottom surface B1 First bottom surface B2 Second bottom surface B3 Third bottom surface S Side surface C Recessed portion Z1 First mask Z2 Second mask Z3 Third mask A Opening

Claims

1. A light-emitting device intermediate preparation step of preparing a light-emitting device intermediate including a light-emitting element and a substrate having an upper surface on which the light-emitting element is disposed; A mold preparation step of preparing a mold having a recess defined by a bottom surface and a side surface, the bottom surface including a first bottom surface and a second bottom surface disposed around the first bottom surface; An optical member arrangement step of arranging an optical member including a first optical member and a second optical member including granular bodies in the recess; An insertion step of inserting the upper surface side of the substrate into the optical member; which has; The optical member arrangement step includes a first optical member arrangement step of arranging the first optical member on the first bottom surface, and a second optical member arrangement step of arranging the second optical member on the first optical member and the second bottom surface. A method for manufacturing a light-emitting device.

2. The method for manufacturing a light-emitting device according to claim 1, wherein the second bottom surface is a flat plane, and the first bottom surface is a concave surface recessed from the second bottom surface.

3. The first optical member arrangement step includes a step of arranging a first mask having an opening on the first bottom surface and covering the second bottom surface, a step of arranging the first optical member on the first bottom surface exposed in the opening, and a step of removing the first mask. The method for manufacturing a light-emitting device according to claim 1 or claim 2.

4. In the first optical member arrangement step, the first optical member is arranged on the first bottom surface such that the upper surface of the first optical member is located at a position higher than the second bottom surface. In the insertion step, at least a part of the second optical member located between the first optical member and the substrate is moved onto the second bottom surface. The method for manufacturing a light-emitting device according to claim 1 or claim 2.

5. The light-emitting device intermediate further includes a convex light-transmissive member that covers the light-emitting element and is disposed on the substrate. The insertion step includes a step of moving at least a part of the second optical member located between the light-transmissive member and the first optical member onto the second bottom surface. The method for manufacturing a light-emitting device according to claim 1 or claim 2.

6. The light-emitting device intermediate further includes a convex light-transmissive member that covers the light-emitting element and is disposed on the substrate. In the first optical member arrangement step, the first optical member is arranged on the first bottom surface such that the upper surface of the first optical member is located at a position higher than the second bottom surface. The manufacturing method of the light-emitting device according to claim 1 or claim 2, wherein the insertion step includes a step of moving at least a part of the second optical member located between the light-transmissive member and the first optical member onto the second bottom surface.

7. A light-emitting device intermediate preparation step of preparing a light-emitting device intermediate including a light-emitting element and a substrate having an upper surface on which the light-emitting element is disposed; A mold preparation step of preparing a mold having a recess defined by a bottom surface and a side surface, wherein the bottom surface includes a first bottom surface and a second bottom surface disposed around the first bottom surface; An optical member arrangement step of arranging an optical member including a first optical member and a second optical member including granular bodies in the recess; An insertion step of inserting the upper surface side of the substrate into the optical member; having The optical member arrangement step includes a second optical member arrangement step of arranging the second optical member on the second bottom surface, and a first optical member arrangement step of arranging the first optical member on the second optical member and the first bottom surface. A manufacturing method of a light-emitting device.

8. The manufacturing method of the light-emitting device according to claim 7, wherein the second bottom surface is a flat plane, and the first bottom surface is a concave surface recessed from the second bottom surface.

9. The second optical member arrangement step includes a step of arranging a second mask that covers the first bottom surface and exposes the second bottom surface, a step of arranging the second optical member on the exposed second bottom surface, and a step of removing the second mask. The manufacturing method of the light-emitting device according to claim 7 or claim 8.

10. The optical member includes the granular bodies and a resin. The manufacturing method of the light-emitting device according to claim 1 or claim 7, wherein the specific gravity of the granular bodies is greater than the specific gravity of the resin.

11. The manufacturing method of the light-emitting device according to claim 1 or claim 7, wherein the granular bodies are light-diffusing members.

12. The manufacturing method of the light-emitting device according to claim 1 or claim 7, wherein the granular bodies include at least one of silicon oxide and aluminum oxide.

13. The manufacturing method of the light-emitting device according to claim 7, wherein the granular bodies are light-absorbing.

14. A step of taking out the light-emitting device including the optical member from the mold after the optical member arrangement step. Of the surfaces of the optical member including the first surface corresponding to the first bottom surface and the second surface corresponding to the second bottom surface, a roughening step of covering the first surface with a third mask and roughening the second surface is further provided. The method for manufacturing a light-emitting device according to claim 1 or claim 7.

15. The roughening step includes any one of plasma treatment, blast treatment, or UV treatment. The method for manufacturing a light-emitting device according to claim 14.

16. A light-emitting element, A substrate on which the light-emitting element is disposed, An optical member covering a part of the substrate and the light-emitting element and including granular bodies, Comprising, The upper surface of the optical member has a first surface that overlaps the light-emitting element in a top view and a second surface disposed around the first surface. The second surface is a rough surface resulting from the shape of the granular bodies. A light-emitting device.

17. The optical member has a first optical member constituting the first surface and a second optical member constituting the second surface. The light-emitting device according to claim 16.

18. A light-emitting device intermediate preparation step of preparing a light-emitting device intermediate including a light-emitting element and a substrate having an upper surface on which the light-emitting element is disposed, A mold preparation step of preparing a mold having a recess defined by a bottom surface and a side surface, the bottom surface including a first bottom surface and a second bottom surface disposed around the first bottom surface, An optical member arrangement step of arranging an optical member having granular bodies containing carbon particles in the recess, An insertion step of inserting the upper surface side of the substrate into the optical member, Having, The optical member arrangement step includes a first arrangement step of arranging a carbon member containing carbon particles or a carbon particle and a volatile solution and not containing resin or glass on the second bottom surface, and a second arrangement step of arranging a carbon-free member on the first bottom surface and on the carbon member. The method for manufacturing a light-emitting device.

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