Liquid discharge head, head module, and liquid discharge apparatus

Abstract

To secure maintainability of a liquid discharge head and to inhibit displacement of a landing position of liquid.SOLUTION: A liquid discharge head 1 includes a nozzle plate 2 including a plurality of nozzles 3 to discharge liquid and a blow-out hole 4 to blow out gas. The blow-out hole is closer to an end in a longitudinal direction X of the nozzle plate than a nozzle 3 closest to the end in the longitudinal direction of the nozzle plate 2 among the plurality of nozzles is.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a liquid ejection head, a head module, and a liquid ejection device.

Background Art

[0002] By accurately landing the liquid from each nozzle of the liquid ejection head at a predetermined position on the recording medium, a desired image can be formed on the recording medium.

[0003] However, there is a problem that the landing position of the liquid is shifted due to the influence of the air flow generated by ejecting the liquid.

[0004] For example, the liquid ejection head described in Patent Document 1 (Japanese Patent No. 6018356) has an air flow blowing portion that blows out the air flow toward the recording medium. The air flow blowing portion has a main air flow outlet and a sub-air flow outlet, and these outlets are provided so as to surround a nozzle row that is a row of nozzles that eject ink. The air flow blowing portion is provided by a separate member from the nozzle plate having the nozzles, and is provided so as to protrude toward the recording medium side from the nozzle plate.

Summary of the Invention

Problems to be Solved by the Invention

[0005] When the portion that blows out the air flow and the nozzle member are formed by separate members as in Patent Document 1, the nozzle surface and the portion that blows out the air flow cannot be wiped simultaneously, and there is a problem that liquid remains or maintenance such as a wiping operation becomes complicated.

[0006] An object of the present invention is to ensure the maintainability of the liquid ejection head and suppress the deviation of the landing position of the liquid.

Means for Solving the Problems

[0007] In order to solve the above problems, the present invention provides a liquid ejection head including a nozzle member having a plurality of nozzles for ejecting a liquid, characterized in that a blowout hole for blowing out a gas is provided on an end side in one longitudinal direction of the nozzle member, on the end side in one longitudinal direction of the nozzle member, closer to the end side than the nozzle disposed on one of the outermost ends in the longitudinal direction of the nozzle member.

Effect of the Invention

[0008] According to the present invention, it is possible to ensure the maintainability of the liquid ejection head and suppress the deviation of the landing position of the liquid.

Brief Description of the Drawings

[0009]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Figure 12

Figure 13

Figure 14

Mode for Carrying Out the Invention

[0010] Hereinafter, embodiments of the present invention will be described with reference to the drawings. In each figure, the same or corresponding parts are denoted by the same reference numerals, and the overlapping description will be simplified or omitted as appropriate. In the following description, as an example of the liquid, a liquid ejection head that ejects ink will be described.

[0011] Using FIGS. 1 to 5, a liquid ejection head according to an embodiment of the present invention will be described. FIG. 1 shows the nozzle surface 2a side of a nozzle plate 2 provided on a liquid ejection head 1. FIG. 2 shows a cross-sectional view taken along line A1 - A1 of FIG. 1, FIG. 3 shows a cross-sectional view taken along line A2 - A2 of FIG. 1, and FIG. 4 shows a cross-sectional view taken along line A3 - A3 of FIG. 1, respectively. FIG. 5 is a perspective view showing the side opposite to the nozzle surface side of the liquid ejection head 1. The direction of arrow X in FIG. 1 is the longitudinal direction of the nozzle plate. This longitudinal direction is also the nozzle arrangement direction. Also, the vertical direction in FIG. 1 orthogonal to the direction of arrow X is the short side direction of the nozzle plate.

[0012] As shown in FIG. 1, the nozzle plate 2 as a nozzle member has a plurality of nozzles 3 and ejection holes 4. The nozzle surface 2a of the nozzle plate 2 shown in FIG. 1 is a surface provided with the end on the ink ejection side of the nozzle 3. Also, on the nozzle surface 2a, the end on the side where the gas of the ejection hole 4 is blown out is provided.

[0013] As shown in FIGS. 2 and 3, the liquid ejection head 1 includes a nozzle plate 2, an individual liquid chamber substrate 5, a common liquid chamber substrate 6, a housing 7, a liquid port 8, a gas port 9, and the like. The individual liquid chamber substrate 5 forms respective individual liquid chambers 10 communicating with each nozzle 3 and individual supply channels communicating with the individual liquid chambers 10. A piezoelectric element 11 as a pressure generating member is provided facing each individual liquid chamber 10. The common liquid chamber substrate 6 forms a common liquid chamber 12 communicating with each individual liquid chamber 10 via each individual supply channel. The housing 7 forms a common supply channel 13 communicating with the common liquid chamber 12. The common supply channel 13 communicates with the liquid port 8 on the side opposite to the common liquid chamber 12 side. As shown in FIGS. 3 and 5, a liquid port 8, a gas port 9, and an electrical I / F 15 are provided on the upper part of the housing 7. The electrical I / F 15 of the present embodiment is one in which a connector is mounted on a printed circuit board (PCB). As shown in FIG. 3, the piezoelectric element 11 is electrically connected to the electrical I / F 15 via a wiring substrate 16. Further, as shown in FIGS. 2 and 4, a gas path 14 for supplying gas from the gas port 9 to the ejection holes 4 is formed by the housing 7, the common liquid chamber substrate 6, and the individual liquid chamber substrate 5. The gas path 14 is formed by a gas common path 14a communicating with the gas port 9, a gas branch path 14b, and a gas individual path 14c. The ejection holes 4 eject the gas supplied from the gas port 9 and do not eject ink. As a method of ejecting gas from the ejection holes 4, for example, an appropriate air flow generating mechanism such as an air pump or an air compressor is provided on the gas port 9 side, and by this air flow generating mechanism, gas such as compressed air can be ejected from the ejection holes 4 via the gas port 9 and the gas path 14.

[0014] In a liquid ejection head that ejects liquid from a nozzle onto a recording medium to form an image, there is a problem that the liquid ejected from the nozzle is washed away by an air flow or the like generated when the liquid is ejected, and the landing position of the liquid on the recording medium is shifted. This problem will be described with reference to FIGS. 6(a) and 6(b). FIG. 6 shows a nozzle plate 200 of a liquid ejection head having a configuration different from that of the present embodiment. FIG. 6(a) is a plan view of a nozzle surface 200a which is the ink ejection side surface of the nozzle plate, and FIG. 6(b) is a cross-sectional view taken along line A1-A1 of FIG. 6(a).

[0015] The nozzle plate 200 shown in Fig. 6(a) has two rows of nozzle arrays 201A and 201B in the short side direction as a nozzle array in which a plurality of nozzles 201 are arranged in the longitudinal direction. The nozzles 201 are arranged alternately in the longitudinal direction in the upper and lower nozzle arrays 201A and 201B.

[0016] As shown in Fig. 6(b), in the area where the nozzles are arranged in the longitudinal direction, an air flow downward in Fig. 6(b) is generated by the ejection of ink. On the other hand, such an air flow does not occur outside the area where the nozzles are arranged. For this reason, at the periphery of the boundary between the area where the nozzles are arranged and the outside thereof, as shown by the arrow in Fig. 6(b), a vortex of an air flow circulating clockwise in Fig. 6(b) is generated. Further, a recording medium M such as a sheet is conveyed facing the nozzle plate 200. The conveyance of this recording medium M also generates an air flow, and particularly when the recording medium M is conveyed in a direction parallel to the longitudinal direction, it has an effect of promoting the above-mentioned air flow circulating clockwise.

[0017] Due to the influence of the above air flow, in particular, the landing position of the ink 150 ejected from the nozzle 201 arranged at the outermost end in the longitudinal direction of the nozzle array is shifted outward in the longitudinal direction. This causes uneven density or streaks in the image formed on the recording medium M, resulting in the formation of abnormal images. In particular, in a liquid ejection head with a large printing gap, which is the distance between the nozzle surface and the recording medium, the ink ejected from the nozzle is easily affected by the air flow, and the deviation of the landing position of the ink due to the influence of the air flow becomes significant. As an example of a large printing gap, for example, a case where the printing gap is larger than 5 mm can be cited.

[0018] The configuration of the present embodiment for suppressing the deviation of the landing position of the ink due to the influence of the above air flow will be described below with reference to Figs. 7(a) and 7(b).

[0019] As shown in Fig. 7(a), similar to the aforementioned nozzle plate 200, a plurality of nozzle rows 30A and 30B are arranged on the nozzle plate 2, and the nozzles 3 are arranged alternately in the longitudinal direction in the nozzle rows 30A and 30B. However, the arrangement of the nozzles in the nozzle member of the present invention is not limited to this, and there may be one or three or more nozzle rows, and in addition to the configuration in which the nozzles are arranged in a row in the longitudinal direction, they may be arranged irregularly.

[0020] The nozzle plate 2 of the present embodiment is different from the nozzle plate 200 in that it has a blowing hole 4 for blowing out gas on the end side of the nozzle 3 on the most end side in the longitudinal direction. In Figs. 7(a) and 7(b), for convenience, the blowing hole 4 is shown by a two-dot chain line. The blowing hole 4 is provided particularly on the end side of the nozzle surface 2a with respect to the nozzle 3 on the nozzle surface 2a. In the present embodiment, the nozzle 3 and the blowing hole 4 extend in a direction substantially perpendicular to the nozzle surface 2a. In the embodiment of Fig. 7(a), a total of four blowing holes 4 are provided outside the nozzles 3 at both ends of each nozzle row 30A and 30B in the longitudinal direction.

[0021] As shown in Fig. 7(b), gas is blown out from the blowing hole 4 in the direction of arrow B toward the recording medium M side. That is, an air flow in the direction of arrow B is formed at a position corresponding to the position where the clockwise air flow shown in Fig. 6(b) is formed or in the vicinity thereof. Thereby, as shown in Fig. 7(b), the deviation of the ejection direction of the ink ejected from the outermost nozzle 3, that is, the deviation of the landing position can be suppressed. Therefore, density unevenness and abnormal images due to the deviation of the landing position of the ink can be suppressed. Further, in the present embodiment, by providing the blowing hole 4 in the nozzle plate 2, it is not necessary to provide a separate member for forming the blowing hole 4, and the liquid ejection head 1 can be cost-reduced and miniaturized. In addition, by providing the blowing hole 4, the maintainability of the liquid ejection head 1 is not adversely affected. That is, compared with the case where the blowing hole 4 is provided in a member separate from the nozzle plate 2, it does not cause adverse effects such as complicating the wiping operation and suction operation for the nozzle 3, and in the present embodiment, the blowing hole 4 can be wiped simultaneously by the wiping operation for the nozzle 3.

[0022] In this embodiment, the diameter of the ejection hole 4 is provided to be substantially the same as the diameter of the nozzle 3. Thereby, the processing of the nozzle plate 2 becomes easy, and the ejection hole 4 can be formed with high-precision dimensions.

[0023] Also, in this embodiment, the ejection holes 4 are provided on both outer sides in the longitudinal direction. Thereby, the influence of the air flow can be suppressed with respect to the nozzles 3 at the outermost ends on both sides in the longitudinal direction. However, the ejection holes of the present invention do not necessarily have to be provided on both sides in the longitudinal direction. For example, when the influence of the air flow is small on one side in the longitudinal direction and the deviation of the landing position of the liquid is small, the ejection holes may be provided only on the other side.

[0024] Also, as shown in FIG. 2, the gas path 14 for supplying gas from the gas port 9 to the ejection hole 4 is formed by the housing 7, the common liquid chamber substrate 6, and the individual liquid chamber substrate 5. The housing 7, the common liquid chamber substrate 6, and the individual liquid chamber substrate 5 are flow path members that form a liquid flow path including a common supply flow path and an individual supply flow path for supplying ink from the liquid port 8 to the nozzle 3. By forming the path for supplying ink and the path for supplying gas with a common member, the liquid ejection head can be miniaturized and the cost can be reduced. Note that it is not necessarily required to form the gas path by all of the housing 7, the common liquid chamber substrate 6, and the individual liquid chamber substrate 5, that is, all of the flow path members. For example, the gas path may be formed only in the individual liquid chamber substrate 5.

[0025] Next, modified examples of the liquid ejection head with different arrangements of the ejection holes 4 and the like will be described in order.

[0026] In the liquid ejection head shown in FIGS. 8(a) and 8(b), two ejection holes 4 are arranged side by side in the longitudinal direction outside the outermost nozzle 3 in the longitudinal direction of each nozzle row. Thereby, compared with the embodiment of FIG. 7, the range in the longitudinal direction in which the air flow from the ejection hole 4 is formed can be expanded, and the deviation of the landing position of the ink ejected from the nozzle 3 can be further suppressed. Therefore, for example, even when the printing gap between the nozzle surface 2a and the recording medium M is large, the deviation of the landing position of the ink can be suppressed. Also, a configuration in which three or more ejection holes 4 are arranged side by side in the longitudinal direction on the outside may be used.

[0027] In the liquid ejection head shown in FIG. 9, the diameter of the ejection hole 4 is made smaller than the diameter of the nozzle 3. By making the diameter of the ejection hole 4 smaller, the flow rate of the gas ejected from the ejection hole 4 decreases, but on the other hand, the flow velocity of the ejected gas can be increased. Thereby, when the influence of the air flow is large, etc., the deviation of the landing position can be effectively suppressed, and the deterioration of the quality of the image formed on the recording medium M can be suppressed.

[0028] Also, it is not always necessary to provide ejection holes corresponding to all the nozzle rows. For example, in the liquid ejection head shown in FIG. 10, one ejection hole 4 is provided between the upper and lower nozzle rows. Thereby, the ejection hole 4 and the path through which the gas flows can be reduced, and the liquid ejection head can be miniaturized and the cost can be reduced. Also, in the present embodiment, the diameter of the ejection hole 4 is made larger than the diameter of the nozzle 3. Thereby, the flow velocity of the gas ejected from the ejection hole 4 decreases, but the range in which the gas is ejected can be increased. Thereby, an air flow can be caused to flow over a wide range even with a small number of ejection holes 4. However, in the present embodiment, the diameter of the ejection hole 4 may be made the same as or smaller than that of the nozzle 3, or a plurality of ejection holes 4 may be provided in the longitudinal direction as shown in FIG. 8.

[0029] Next, an example of a method for manufacturing a liquid ejection head having an ejection hole will be described.

[0030] The nozzle plate 2 of the present embodiment is formed of silicon. Thereby, the nozzle plate 2 can be drilled with high precision, and the nozzles 3 and the ejection holes 4 can be formed with high precision. The nozzle plate 2 can also be formed of a metal such as stainless steel or nickel, or a resin such as polyimide.

[0031] First, nozzles 3 and ejection holes 4 are formed in a silicon wafer with a thickness of 600 μm by photolithography and dry etching processes. By forming the ejection holes 4 using the same processing method as the nozzles 3, the cost for providing the ejection holes 4 can be reduced or substantially eliminated. The diameter of the nozzles 3 was set to 0.02 mm. Then, the wafer is polished to reduce the thickness to 100 μm and diced from the wafer. Here, after processing, a water-repellent film is formed only on the end portions of the nozzles 3 on the nozzle surface 2a.

[0032] On a silicon wafer with a thickness of 600 μm, SiO 2 0.6 μm, Si 1.5 μm, SiO 2 After forming a three-layer diaphragm by laminating 0.4 μm, a lower electrode of Ti 20 nm and Pt 200 nm was formed by sputtering.

[0033] After forming a film with a thickness of 2 μm of lead zirconate titanate (PZT) on the lower electrode by the sol-gel method using an organometallic solution and firing at 700 °C, a piezoelectric film of PZT was formed. Then, 200 nm of Pt was formed on the piezoelectric film by sputtering to form an upper electrode. After forming the upper electrode, the upper electrode, piezoelectric body, and lower electrode were patterned by the dry etching method to form a piezoelectric element 11 on the nozzle plate 2.

[0034] Next, an interlayer insulating film was formed by plasma CVD. After forming contact holes in the interlayer insulating film on the upper electrode and the lower electrode, a wiring layer was formed by sequentially laminating 50 nm of Ti and 2 μm of Al and dry etching. Then, the diaphragm at the ink supply port portion was dry etched, and the wafer that becomes the individual liquid chamber substrate 5 was completed.

[0035] Next, a holding substrate having a holding substrate recess and a holding substrate opening serving as a supply port was formed using a silicon wafer. An epoxy-based adhesive was applied to the bonding surface of the fabricated holding substrate wafer with a flexographic printing machine to a film thickness of 2 μm, bonded, and the adhesive was cured to bond the holding substrates. Thereafter, after polishing the individual liquid chamber substrate 5 with a thickness of 600 μm to 80 μm, the individual liquid chambers 10 and the fluid resistance portions were formed by the ICP dry etching method, and the wafer was diced into chips to complete the individual liquid chamber substrate 5. The individual liquid chamber substrate 5 has a connection portion for inputting an electrical signal from the outside. The wiring layer is drawn out to the end of the individual liquid chamber substrate 5, and a wiring substrate 16 described later is connected thereto.

[0036] Upstream of the individual liquid chamber substrate 5, a common liquid chamber substrate 6 having a common liquid chamber 12 for supplying ink to each individual liquid chamber 10 was provided. The common liquid chamber substrate 6 is formed by dry etching a silicon wafer.

[0037] The housing 7 can be composed of a resin such as epoxy or PPS, a metal such as stainless steel, but here it is an inexpensive and lightweight epoxy resin. A liquid port 8 and a gas port 9 were provided on the upper part of the housing 7.

[0038] The wiring substrate is a flexible substrate and is electrically connected to the wiring of the individual liquid chamber substrate 5. Examples of methods include soldering, ACF, NCP, etc., but here NCP was used. Also, a drive circuit is installed on the wiring substrate 16. If the drive circuit is on the individual liquid chamber substrate 5, the drive circuit will be cooled, but heat generation will lead to a temperature distribution on the nozzle plate 2, resulting in deteriorated ejection characteristics. Therefore, in this embodiment, the drive circuit is provided on the wiring substrate.

[0039] Then, the nozzle plate 2, the individual liquid chamber substrate 5, and the common liquid chamber substrate 6 were bonded with an epoxy-based adhesive. The nozzle plate 2 and the individual liquid chamber substrate 5 may be silicon direct bonded. Further, the common liquid chamber substrate 6 and the housing 7 were bonded with an epoxy-based adhesive material. The wiring substrate 16 is a flexible wiring substrate. The wiring substrate 16 is connected to the electrical I / F 15 by soldering or the like and is drawn out from the electrical I / F 15.

[0040] Next, an example of a head module including a plurality of the above-described liquid ejection heads will be described with reference to FIG. 11.

[0041] As shown in FIG. 11, the head module 100 includes a plurality of liquid ejection heads 1, a base member 102, a cover member 103, a heat dissipation member 104, a manifold 105, a printed circuit board 106, and a module case 107.

[0042] The plurality of liquid ejection heads 1 are inserted into the opening 121 of the base member 102, and the cover member 103 joined and fixed to the base member 102 is joined and fixed to the individual liquid chamber substrate of the liquid ejection head 1 with an adhesive.

[0043] The cover member 103 has an opening in a region corresponding to the nozzles and ejection holes on the nozzle surface of the nozzle plate, and covers the peripheral edge of the nozzle surface.

[0044] The flow path provided in the manifold 105 communicates with the liquid port of the liquid ejection head 1.

[0045] The printed circuit board 106 is electrically connected to the piezoelectric element of the liquid ejection head 1 via a flexible wiring member 90. A driver IC (drive circuit) 91 is mounted on the flexible wiring member 90.

[0046] Next, an example of a liquid ejection apparatus including the above-described liquid ejection head or head module will be described with reference to FIGS. 12 and 13.

[0047] As shown in FIG. 12, a printing apparatus 500 as a liquid ejection apparatus includes a loading unit 501, a guiding and conveying unit 503, a printing unit 505, a drying unit 507, an unloading unit 509, and the like. The loading unit 501 loads a continuous body 510. The guiding and conveying unit 503 guides and conveys the continuous body 510 loaded from the loading unit 501 to the printing unit 505. The printing unit 505 ejects liquid onto the continuous body 510 to form an image. The drying unit 507 heats and dries the continuous body 510 after image formation. The unloading unit 509 unloads the dried continuous body 510.

[0048] After the continuous body 510 is sent out from the original roll roller 511 provided in the loading unit 501, it is guided and conveyed by the loading unit 501, the guiding and conveying unit 503, the drying unit 507, and the unloading unit 509, and is wound around the winding roller 591 of the unloading unit 509.

[0049] In the printing unit 505, the continuous body 510 faces the head unit 550, and ink is ejected from the liquid ejection head to print an image.

[0050] As shown in FIG. 13, three head modules 100A, 100B, and 100C are provided on a common base member 552 of the head unit 550.

[0051] Next, as a liquid ejection apparatus including the above-described liquid ejection head or head module, a manufacturing apparatus for an electrode and an electrochemical element will be described with reference to FIG. 14. FIG. 14 is a schematic diagram showing an example of a manufacturing apparatus for an electrode according to an embodiment of the present invention. The manufacturing apparatus for an electrode is an apparatus that manufactures an electrode including a layer having an electrode material by ejecting a liquid composition using a head module including a liquid ejection head.

[0052] The discharging means included in the manufacturing apparatus of the electrode shown in FIG. 14 is the head module according to the embodiment of the present invention. By discharging the liquid composition from the discharging head of the head module, the liquid composition is applied onto the object, and a liquid composition layer is formed. The object (hereinafter, may be referred to as "discharge object") is not particularly limited as long as it is an object on which a layer containing an electrode material is formed, and can be appropriately selected according to the purpose. For example, examples of the object include an electrode substrate (current collector), an active material layer, and a layer containing a solid electrode material. Further, the object may be an electrode composite layer containing an active material on the electrode substrate (current collector). Further, as long as the discharging means and the discharging process can form a layer having an electrode material on the discharge object, they may be means and processes for forming a layer having an electrode material by directly discharging the liquid composition. Further, the discharging means and the discharging process may be means and processes for forming a layer having an electrode material by indirectly discharging the liquid composition.

[0053] As other configurations included in the manufacturing apparatus of the electrode composite layer, there are no particular limitations as long as the effects of the present invention are not impaired, and they can be appropriately selected according to the purpose. Further, other steps included in the manufacturing method of the electrode composite layer also have no particular limitations as long as the effects of the present invention are not impaired, and can be appropriately selected according to the purpose. For example, examples of the configurations and steps included in the manufacturing apparatus and the manufacturing method of the electrode composite layer include heating means and a heating step.

[0054] The heating means included in the manufacturing apparatus of the electrode composite layer is means for heating the liquid composition discharged by the discharging means. Further, the heating step included in the manufacturing method of the electrode composite layer is a step of heating the liquid composition discharged in the discharging step. By heating the liquid composition, the liquid composition layer can be dried.

[0055] Here, as an example of an electrode manufacturing apparatus, an electrode manufacturing apparatus that forms an electrode mixture layer containing an active material on an electrode substrate (current collector) will be described. As shown in FIG. 14, the electrode manufacturing apparatus includes a discharge process section 710 that includes a process of applying a liquid composition onto a printing substrate 704 having a discharge target to form a liquid composition layer, and a heating process section 720 that includes a heating process of heating the liquid composition layer to obtain an electrode mixture layer.

[0056] The electrode manufacturing apparatus includes a transport section 705 that transports the printing substrate 704. The transport section 705 transports the printing substrate 704 at a preset speed in the order of the discharge process section 710 and the heating process section 720. As a method for manufacturing the printing substrate 704 having a discharge target such as an active material layer, there is no particular limitation, and a known method can be appropriately selected. The discharge process section 710 includes a liquid discharge head 1 that realizes a process of applying a liquid composition onto the printing substrate 704, a storage container 701 that stores the liquid composition 707, and a supply tube 702 that supplies the liquid composition 707 stored in the storage container 701 to the liquid discharge head 1.

[0057] In the discharge process section 710, the liquid composition 707 is discharged from the liquid discharge head 1, the liquid composition 707 is applied onto the printing substrate 704, and a liquid composition layer is formed in a thin film shape. Note that the storage container 701 may be configured to be integrated with the electrode mixture layer manufacturing apparatus, or may be configured to be removable from the electrode mixture layer manufacturing apparatus. Further, the storage container 701 may be a storage container integrated with the electrode mixture layer manufacturing apparatus, or a container used for adding to a storage container that is removable from the electrode mixture layer manufacturing apparatus.

[0058] The storage container 701 and the supply tube 702 can be arbitrarily selected as long as they can stably store and supply the liquid composition 707.

[0059] In the heating engineering department 720, a solvent removal process is performed to heat and remove the solvent remaining in the liquid composition layer. Specifically, the solvent remaining in the liquid composition layer is heated by the heating device 703 in the heating engineering department 720 and dried, whereby the solvent is removed from the liquid composition layer. Thereby, the electrode mixture layer is formed. Further, the solvent removal process in the heating engineering department 720 may be performed under reduced pressure.

[0060] There is no particular limitation on the heating device 703, and it can be appropriately selected according to the purpose. For example, examples of the heating device 703 include substrate heating, IR heaters, and hot air heaters. Further, the heating device 703 may be a combination of at least two of substrate heating, IR heaters, and hot air heaters. Also, regarding the heating temperature and heating time, they can be appropriately selected according to the boiling point of the solvent contained in the liquid composition 707 or the formed film thickness.

[0061] By using the electrode manufacturing apparatus according to the embodiment of the present invention, the liquid composition can be discharged to the target position of the discharge object. The electrode mixture layer can be suitably used, for example, as a part of the configuration of an electrochemical element. There is no particular limitation on the configuration other than the electrode mixture layer in the electrochemical element, and known ones can be appropriately selected. For example, examples of the configuration other than the electrode mixture layer include a positive electrode, a negative electrode, and a separator.

[0062] By applying the aforementioned liquid discharge head to the above head module and liquid discharge device, it is possible to ensure the maintainability of the liquid discharge head and suppress the deviation of the liquid landing position.

[0063] As described above, the embodiments of the present invention have been described, but the present invention is not limited to the above-described embodiments, and it goes without saying that various changes can be made without departing from the gist of the present invention.

[0064] In the present application, the liquid to be ejected only needs to have a viscosity and surface tension that can be ejected from the head, and is not particularly limited. However, it is preferably such that the viscosity becomes 30 mPa·s or less at normal temperature and pressure, or by heating or cooling. More specifically, it includes solvents such as water and organic solvents, colorants such as dyes and pigments, polymerizable compounds, resins, functional imparting materials such as surfactants, biocompatible materials such as DNA, amino acids, proteins, and calcium, edible materials such as natural pigments, etc., and solutions, suspensions, emulsions, etc. containing these. These can be used, for example, in applications such as inkjet inks, surface treatment liquids, components of electronic elements and light-emitting elements, liquids for forming electronic circuit resist patterns, and material liquids for three-dimensional modeling.

[0065] The "liquid" includes not only inks but also paints, pretreatment liquids, binders, and overcoat liquids.

[0066] In the present application, the "liquid ejection device" is a device that includes a carriage having a liquid ejection head and drives the liquid ejection head to eject liquid. The liquid ejection device includes not only devices capable of ejecting liquid onto a recording medium to which the liquid can adhere, but also devices that eject liquid into the air or into a liquid.

[0067] This "liquid ejection device" can also include means related to the feeding, conveyance, and paper discharge of objects to which the liquid can adhere, as well as other pretreatment devices, post-treatment devices, etc.

[0068] For example, as the "liquid ejection device", there is an image forming device that ejects ink to form an image on paper, and a three-dimensional modeling device (three-dimensional shaping device) that ejects a shaping liquid onto a powder layer formed by layering powder in order to shape a three-dimensional object (three-dimensional shaped object).

[0069] Also, the "liquid ejection device" is not limited to those in which a significant image such as characters or figures is visualized by the ejected liquid. For example, those that form a pattern that has no meaning by itself, and those that shape a three-dimensional image are also included.

[0070] The above "object to which liquid can adhere" means an object to which liquid can adhere at least temporarily, such as an object to which liquid adheres and adheres firmly, or an object to which liquid adheres and penetrates, and it is the recording medium in the above embodiment. Specific examples include recording media such as paper, recording paper, recording sheets, films, and cloth, electronic components such as electronic substrates and piezoelectric elements, powder layers (powdered layers), organ models, and media such as test cells. Unless otherwise specifically limited, all objects to which liquid adheres are included.

[0071] The material of the above "object to which liquid can adhere" may be paper, thread, fiber, fabric, leather, metal, plastic, glass, wood, ceramics, etc., as long as liquid can adhere even temporarily.

[0072] In addition, as other "liquid ejection devices", there are also treatment liquid coating devices that eject treatment liquid onto paper for the purpose of modifying the surface of the paper, and injection granulation devices that inject a composition liquid in which raw materials are dispersed in a solution through nozzles to granulate fine particles of the raw materials.

[0073] In the terms of this application, image formation, recording, printing, imprinting, printing, shaping, etc. are all synonymous.

[0074] Aspects of the present invention are as follows, for example. <1> A liquid ejection head including a nozzle member having a plurality of nozzles for ejecting liquid, characterized in that a blow-out hole for blowing out gas is provided on the end side of one side in the longitudinal direction of the nozzle member, on the end side of one side in the longitudinal direction of the nozzle member, closer to the end than the nozzle disposed on the one most end side in the longitudinal direction of the nozzle member. <2> The liquid ejection head according to <1>, wherein the diameter of the blow-out hole is the same as the diameter of the nozzle. <3> The liquid ejection head according to <1>, wherein the diameter of the blow-out hole is smaller than the diameter of the nozzle. <4> The liquid ejection head according to any one of <1> to <3>, wherein a blowout hole for blowing out gas is provided on the end side on the other side in the longitudinal direction of the nozzle member, on the end side on the other side in the longitudinal direction of the nozzle disposed on the other end side in the longitudinal direction of the nozzle member. <5> The liquid ejection head according to any one of <1> to <4>, further comprising a flow path member that forms a liquid flow path communicating with the nozzle, wherein the flow path member is a liquid ejection head having a gas path communicating with the blowout hole. <6> The liquid ejection head according to any one of <1> to <5>, wherein a plurality of the blowout holes are arranged side by side in the longitudinal direction, on the end side of the nozzle disposed on one or the other end side in the longitudinal direction. <7> A head module including a plurality of the liquid ejection heads according to any one of <1> to <6>. <8> A liquid ejection apparatus including the liquid ejection head according to any one of <1> to <6>.

Explanation of Signs

[0075] 1 Liquid ejection head 2 Nozzle plate (nozzle member) 2a Nozzle surface 3 Nozzle 4 Blowout hole 14 Gas path 100 Head module 150 Ink (liquid) 500 Liquid ejection apparatus M Recording medium (recording medium) X Longitudinal direction of the nozzle plate

Prior Art Documents

Patent Documents

[0076]

Patent Document 1

Claims

1. A liquid ejection head including a nozzle member having a plurality of nozzles for ejecting a liquid, wherein a gas ejection hole is provided on an end side in one direction of the longitudinal direction of the nozzle member, on the end side in one direction of the longitudinal direction of the nozzle member, rather than on the nozzle disposed on the most end side in one direction of the longitudinal direction of the nozzle member.

2. The liquid ejection head according to Claim 1, wherein a diameter of the gas ejection hole is the same as a diameter of the nozzle.

3. The liquid ejection head according to Claim 1, wherein a diameter of the gas ejection hole is smaller than a diameter of the nozzle.

4. The liquid ejection head according to Claim 1, wherein a gas ejection hole is provided on an end side in the other direction of the longitudinal direction of the nozzle member, on the end side in the other direction of the longitudinal direction of the nozzle member, rather than on the nozzle disposed on the most end side in the other direction of the longitudinal direction of the nozzle member.

5. The liquid ejection head according to Claim 1, further including a flow path member forming a liquid flow path communicating with the nozzle, wherein the flow path member has a gas path communicating with the gas ejection hole.

6. The liquid ejection head according to Claim 1, wherein a plurality of the gas ejection holes are arranged side by side in the longitudinal direction, on the end side of the nozzle disposed on the most end side in one or the other direction of the longitudinal direction.

7. A head module including a plurality of the liquid ejection heads according to any one of Claims 1 to 6.

8. A liquid ejection device including the liquid ejection head according to any one of Claims 1 to 6.

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