Temperature control device, heat treatment device, thermal conductivity measurement apparatus, and heat treatment method

Abstract

To provide a temperature control device, heat treatment device, thermal conductivity measurement apparatus, and heat treatment method capable of controlling the temperature of a workpiece from before heating the workpiece.SOLUTION: A temperature control device comprises: a placement surface 611 on which a workpiece W is placed; a measurement unit 72 which measures the temperature of the workpiece W or the placement surface 611; a heating mechanism 63 which heats the placement surface 611; a cooling mechanism 64 which cools the placement surface 611; and a control unit 70 which controls the operation of the heating mechanism 63 and the cooling mechanism 64. The heating mechanism 63 and the cooling mechanism 64 are disposed below the placement surface 611. The control unit 70 heats the placement surface 611 using the heating mechanism 63 until the temperature measured by the measurement unit 72 reaches a first temperature, and cools the workpiece W using the cooling mechanism 64 when the temperature measured by the measurement unit 72 reaches or exceeds a second temperature higher than the first temperature.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a temperature control device, a heat treatment device, a thermal conductivity measurement device, and a heat treatment method.

Background Art

[0002] Conventionally, a thermal conductivity measurement device for measuring the thermal conductivity of a workpiece such as a metal member has been known. In such a thermal conductivity measurement device, the thermal conductivity such as the thermal conductivity and the thermal resistance value is measured based on the amount of heat input to the workpiece and the amount of heat radiated from the workpiece.

[0003] For example, in Patent Document 1, a workpiece is sandwiched between a heating-side clamping member connected to a heating unit and a cooling-side clamping member connected to a cooling unit, and the temperature is measured at a plurality of locations on the heating-side clamping member and the cooling-side clamping member, so that the thermal conductivity of the workpiece is calculated from the measured temperature gradient. A configuration is disclosed.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] With the increase in power consumption due to the high integration of semiconductor elements, the amount of heat generated by these semiconductor elements tends to increase. In order to suppress the temperature rise of such semiconductor elements, a heat dissipation member having a higher heat dissipation capacity than before is required. Since such a heat dissipation member is assumed to be mounted with a semiconductor element having a high heat generation amount, for a thermal conductivity measurement device for measuring the thermal conductivity of the heat dissipation member, the heat dissipation member is used under conditions (temperature and heat input amount) close to the situation where the heat dissipation member is used. It is required to measure the thermal conductivity. For example, in the prior art such as Patent Document 1, the heat conduction performance of a work at a target temperature can be measured by bringing a heating part into contact with the work and heating the work to the target temperature. However, in this case, since it is necessary to wait until the temperature of the work at room temperature rises to the target temperature, there is a problem that the measurement takes a long time, for example, about several tens of minutes per work.

[0006] An object of the present invention is to provide a temperature adjustment device, a heat treatment device, a heat conduction performance measurement device, and a heat treatment method that can adjust the temperature of a work before performing a heat treatment on the work, such as when measuring the heat conduction performance of the work, and thereby can efficiently perform the heat treatment on the work.

Means for Solving the Problems

[0007] The temperature adjustment device according to the present invention includes a placement surface on which a work is placed, a measurement unit that measures the temperature of the work or the placement surface, a heating mechanism that heats the placement surface, a cooling mechanism that cools the placement surface, and a control unit that controls the operations of the heating mechanism and the cooling mechanism. The heating mechanism and the cooling mechanism are both arranged below the placement surface. The control unit heats the placement surface by the heating mechanism until the measured temperature of the measurement unit reaches a first temperature, and cools the work by the cooling mechanism when the measured temperature of the measurement unit becomes equal to or higher than a second temperature that is higher than the first temperature. In the above temperature adjustment device, the cooling mechanism may adopt a configuration including a cooling block provided with a circulation flow path for a coolant and a circulation device that circulates the coolant. In the above temperature adjustment device, the control unit may adopt a configuration that controls the operation of the cooling mechanism so that the measurement unit is within a predetermined temperature range. In the above temperature adjustment device, the heating mechanism may adopt a configuration including a Peltier element. In the above temperature adjustment device, a configuration may be adopted in which the heating mechanism is arranged below the placement surface and the cooling mechanism is arranged below the heating mechanism. In the temperature control device, the heating mechanism may be a Peltier element, and the control unit may adopt a configuration in which the Peltier element functions as a temperature control mechanism for cooling the work when cooling the placement surface. In the temperature control device, a configuration in which one or more grooves are formed in the placement surface may be adopted. The heat treatment apparatus according to the present invention includes the temperature control device, a heating device provided opposite to the temperature control device for heating a work, and a drive device for adjusting the distance between the heating device and the temperature control device. The temperature control device adjusts the temperature of the work before the heating device heats the work. In the heat treatment apparatus, a control device for controlling the operations of the temperature control device and the heating device may be provided. The control device may adopt a configuration in which a process of simultaneously heating the work by the temperature control device and the heating device and a process of cooling the work by the temperature control device while heating the work by the heating device are repeated. In the heat treatment apparatus, the heating device may have a contact portion that contacts the work and transfers heat to the work, and the temperature control device may adopt a configuration in which it is composed of a member having a lower thermal conductivity than the contact portion. The thermal conductivity performance measuring device according to the present invention includes the heat treatment apparatus, a heat dissipation surface temperature measuring device for measuring the temperature of the heat dissipation surface where the heating device contacts the work, and an arithmetic device for calculating the thermal conductivity performance of the work based on the measured temperature of the placement surface or the work measured by the temperature control device and the measured temperature of the heat dissipation surface or the work measured by the heat dissipation surface temperature measuring device. The heat treatment method according to the first aspect of the present invention is a heat treatment method for heating a workpiece having a first surface and a second surface, using a heating device for heating the first surface of the workpiece and a temperature control device for heating or cooling the second surface of the workpiece, the method comprising: a preheating step of heating the second surface of the workpiece with the temperature control device; and a main heating step of heating or cooling the second surface of the workpiece with the temperature control device while heating the first surface of the workpiece with the heating device. In the main heating step, the second surface is heated until the temperature of the second surface reaches a first set temperature while heating the second surface, and when the temperature of the second surface becomes equal to or higher than a second temperature higher than the first set temperature, the second surface is cooled by the temperature control device. The heat treatment method according to the second aspect of the present invention is a heat treatment method for heating a workpiece having a first surface and a second surface, using a heating device for heating the first surface of the workpiece and a temperature control device for heating or cooling the second surface of the workpiece, the method comprising: a step of heating the second surface of the workpiece with the temperature control device while heating the first surface of the workpiece with the heating device; and a step of cooling the second surface of the workpiece with the temperature control device while heating the first surface of the workpiece with the heating device, which is repeated. In the above heat treatment method, when heating the first surface and the second surface, it can be configured such that, on the second surface, heat having a higher calorific value than that of the first surface is applied.

[0008] Further, the present invention is not limited to a thermal conductivity measurement device for measuring the thermal conductivity performance of a workpiece, and can be applied to a heat treatment device that transfers heat to a workpiece for processing and manufacturing any workpiece. For example, the present invention can be configured as a heat treatment device having the following characteristics, and a mounting table used for processing a workpiece with the heat treatment device or the like. The mounting table according to the present invention is a mounting table for providing a fluid used for processing a workpiece while the workpiece is mounted when processing the workpiece, and includes a mounting surface on which the workpiece is mounted and a liquid flow path through which liquid flows inside, and a liquid discharge hole communicating with the first end side of the liquid flow path is provided on the mounting surface, and a liquid supply hole communicating with the second end side of the liquid flow path is provided on a surface different from the mounting surface. In the above mounting table, the mounting surface may further include a gas flow path through which gas flows inside, a gas blowing hole communicating with the first end side of the gas flow path is provided on the mounting surface, and a gas supply hole communicating with the second end side of the gas flow path is provided on a surface different from the mounting surface. In the above mounting table, at least one of the liquid discharge hole and the gas blowing hole may be provided at a position closer to the center of the mounting surface than the outer edge of the mounting surface. In the above mounting table, the liquid supply hole can be connected to a liquid supply device via a first pipe to send out liquid from the liquid discharge hole on the mounting surface, and the gas supply hole can be connected to a gas supply device via a second pipe to send out gas from the gas blowing hole on the mounting surface. In the above mounting table, the liquid discharge hole can also serve as a liquid suction hole for sucking the liquid discharged onto the mounting surface, or the mounting surface can have a liquid suction hole for sucking the liquid discharged onto the mounting surface separately from the liquid discharge hole. In the above mounting table, an operation unit for a user to input instructions and a control unit are provided, and the control unit controls the liquid supply device and / or the gas supply device based on the user's instructions input to the operation unit to perform liquid delivery and / or gas delivery on the mounting table. In the above mounting table, a temperature sensor can be installed on the mounting surface. The heat treatment apparatus according to the present invention includes a heat source, a heat conductor that conducts the heat generated by the heat source, and a temperature control device that has the mounting table and adjusts the temperature of the mounting surface of the mounting table. When heat-treating a workpiece, the heat conductor contacts the workpiece to apply the heat conducted from the heat source to the workpiece, and the mounting table adjusts the temperature of the workpiece to the temperature adjusted by the temperature control device.

[0009] Furthermore, the present invention can be configured with a mounting table, a temperature control device, a heat treatment apparatus, and a heat conduction performance measuring device having the following characteristics. That is, the mounting table according to the present invention includes a mounting surface on which a workpiece is mounted, and a measuring unit that measures the temperature of the workpiece or the mounting surface, and one or more grooves are formed in the mounting surface. In the above mounting table, the measuring unit can be arranged in a region partitioned by the groove. In the above mounting table, a plurality of the measuring units can be arranged apart from each other in the vertical direction in the region. In the above mounting table, the plurality of measuring units arranged in the same region can be provided at substantially the same distance from the center of the mounting table. In the above mounting table, the depth of the groove can be made deeper than the position where the measuring unit is arranged. The temperature control device according to the present invention can be configured to have the above mounting table. The heat treatment apparatus according to the present invention can be configured to have the above temperature control device. The heat conduction performance measuring device according to the present invention includes the above heat treatment apparatus and an arithmetic device that calculates the heat conduction performance of the workpiece. The arithmetic device calculates the amount of heat input to the mounting table based on the measured temperatures measured by the plurality of measuring units, and calculates the heat conduction performance of the workpiece based on the amount of heat. Further, the heat treatment apparatus according to the present invention includes a mounting table having a mounting surface on which a workpiece is placed, and a heating device provided opposite to the mounting surface for heating the workpiece. The heating device has a contact portion that contacts the workpiece and transfers heat to the workpiece, and the mounting table can be configured of a member having a lower thermal conductivity than the contact portion.

Effect of the Invention

[0010] According to the present invention, since the temperature of the workpiece can be adjusted by the temperature adjusting device before heat-treating the workpiece, the time required to raise the temperature of the workpiece to the target temperature can be shortened, and the heat treatment can be efficiently performed.

Brief Description of the Drawings

[0011]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Figure 12

Figure 13

Figure 14

Figure 15

Figure 16

Figure 17

Figure 18

Mode for Carrying Out the Invention

[0012] Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following, as an example of the heat treatment apparatus of the present invention, a thermal conductivity measurement apparatus that applies heat to a workpiece (including work-in-progress, parts, and products to be worked on) to measure the thermal conductivity performance of the workpiece will be exemplified and described. FIG. 1 is a perspective view of the thermal conductivity measurement apparatus 1 according to the present embodiment, and FIG. 2 is a configuration diagram showing the thermal conductivity measurement apparatus 1 according to the present embodiment, showing a cross section taken along line II-II of FIG. 1. As shown in FIGS. 1 and 2, the thermal conductivity measurement apparatus 1 according to the present embodiment includes a heater 10, a heat conductor 20, a heat insulation part 30, a connecting device 40, a driving part (driving device) 50, a temperature control part (temperature control device) 60, and a control part 70. In the present embodiment, it is assumed that the heater 10, the heat conductor 20, and the heat insulation part 30 constitute a heating part (heating device) 2. Also, in the present embodiment, the lower side of each figure (for example, the direction in which the temperature control part 60 is located with respect to the heating part 2) will be described as downward, and the upper side of the figure (for example, the direction in which the heating part 2 is located with respect to the temperature control part 60) will be described as upward. Further, in FIG. 2, the input and output of electrical signals to the control part 70 are shown by broken lines, and the tubes 651, 661, 671 to which the pumps 65, 66 and the refrigerant circulation device 67 to be described later are connected are shown by one-dot chain lines.

[0013] The heater 10 is a heat source, and for example, a ceramic heater of 900 to 1500 W is exemplified. In the present embodiment, the heater 10 is disposed on the upper surface of the heat conductor 20, and the heat generated by the heater 10 is input to the heat conductor 20. Note that the heater 10 can be configured to be in direct contact with the heat conductor 20, or can be configured to be indirectly in contact with the heat conductor 20 via a heat conductive grease, grease, elastomer, metal, or other highly heat conductive member.

[0014] The heat conductor 20 is a member for conducting the heat received from the heater 10 and applying it to the workpiece W. FIG. 3 is a configuration diagram showing the heat conductor 20 according to the present embodiment. The heat conductor 20 includes a heat receiving member 21 that holds the heater 10, and a columnar heat radiating part 22 that extends from the heat receiving member 21.

[0015] The heat receiving member 21, also referred to as a heater block, has a heat receiving portion 23 that holds the heater 10 as a heat source and a tapered heat convergence portion 24 as shown in FIG. 3. The heat receiving portion 23 is the portion of the heat receiving member 21 that has the widest diameter in plan view, and the heater 10 is placed on its upper surface (heat receiving surface 23a). Note that the heat receiving surface 23a of the heat receiving portion 23 on which the heater 10 is placed may be a flat surface, or may have a shape in which the portion where the heater 10 is placed is recessed, and the heater 10 may be embedded in the recess. The area of the heat receiving surface 23a of the heat receiving portion 23 is wider than the area of the heater 10, enabling the heat of the heater 10 to be efficiently applied to the heat receiving portion 23. Above the heat receiving portion 23, a flat fixing portion 26 is provided that biases and fixes the heater 10 to the heat receiving surface 23a of the heat receiving portion 23. The fixing portion 26 can switch between an open position and a fixed position by a locking member (not shown).

[0016] Also, the heat convergence portion 24 is formed on the lower end side of the heat receiving portion 23, and the diameter in plan view becomes narrower in the direction away from the heat receiving portion 23 (from the heat receiving portion 23 side toward the heat radiating portion 22 side). As a result, the heat generated by the heater 10 is input into the heat receiving member 21, conducted from the heat receiving portion 23 to the heat convergence portion 24, then heat-converged in the heat convergence portion 24, and conducted to the heat radiating portion 22 with a high heat flux. Note that the heater 10 may be arranged in the heat convergence portion 24, but in order to transfer heat evenly, it is preferable not to arrange the heater 10 in the heat convergence portion 24. In the present embodiment, the heat convergence portion 24 is configured not to have the heater 10.

[0017] As shown in FIG. 3, the heat radiating part 22 is a columnar member extending from the lower end of the heat convergence part 24 of the heat receiving member 21, and the cross-sectional area in the horizontal direction is substantially the same from the base part to the tip part. Further, the diameter (cross-sectional area) of the heat radiating part 22 is formed smaller than the diameter (cross-sectional area) of the heat receiving part 23. For example, the diameter of the heat radiating part 22 can be 1 / 2 or less of the diameter of the heat receiving part 23, and more preferably 1 / 3 or less. Also, as shown in FIG. 2, the lower end part of the heat radiating part 22 is exposed from a heat insulating part 30 to be described later, and has a heat radiating surface 25 that directly or indirectly contacts the work W. Thereby, the heat converged in the heat convergence part 24 is conducted from the heat radiating part 22 upward (toward the heater 10 side) to downward (toward the work W side), and is applied to the work W from the heat radiating surface 25. In particular, in the present embodiment, since the cross-sectional area of the heat radiating part 22 in the horizontal direction is smaller than that of the heat receiving member 21, it is possible to directly apply the heat of the high heat flux converged in the heat convergence part 24 from the heat radiating surface 25 to the work W. Further, the diameter of the planar heat radiating surface 25 is smaller than the area of the plane of the work W (for example, several mm to several tens of mm or 5 mm to 20 mm), but since no temperature measuring device is provided on the heat radiating surface 25, a sufficient contact area can be ensured, and heat can be efficiently applied to the work W. For example, in the present embodiment, even when a ceramic heater of 900 to 1500 W is used as the heater 10, heat fluxes of 200 W / cm 2 or more, 500 W / cm 2 or more, or 1000 W / cm 2 or more can be applied to the work W. The heat radiating part 22 is provided with a plurality of holes for arranging thermocouples 71 to be described later in the length direction.

[0018] Note that the material of the heat conductor 20 is not particularly limited as long as it has high thermal conductivity. For example, it can be made of silver, copper, gold, aluminum, iron, nickel, titanium, platinum, or their alloys. In this embodiment, the heat conductor 20 is made of copper. Further, in this embodiment, the heat conductor 20 is formed by integral molding to enhance its thermal conductivity. On the other hand, in the heat conductor 20, the heat receiving member 21 and the heat radiating portion 22 can be separately molded, and the end surface of the heat radiating portion 22 can be joined to the joining surface provided at the lower end of the heat receiving member 21 to manufacture the heat conductor 20. In this way, by joining the heat receiving member 21 and the heat radiating portion 22 separately, the thermal resistance at the joining surface increases, and by utilizing this thermal resistance, it is also possible to promote the uniformity of heat in the horizontal direction. Furthermore, in this embodiment, as shown in FIG. 1, the heat receiving member 21 is surrounded by the heat insulating portion 30, and is configured to suppress the heat generated by the heater 10 from diffusing to the outside. Note that the material of the heat insulating portion 30 is not particularly limited. For example, the inside can be made of a heat insulating material such as an inorganic porous material or a fiber material (such as glass fiber), and this heat insulating material can be covered with a heat resistant resin cover.

[0019] Also, in this embodiment, the heat receiving member 21 (the heat receiving portion 23 and the heat converging portion 24) of the heat conductor 20 is formed in a circular shape in plan view. By forming the heat receiving member 21 (the heat receiving portion 23 and the heat converging portion 24) in a circular shape in plan view, when the heat generated by the heater 10 is conducted to the heat radiating surface 25 of the heat radiating portion 22, the heat can be evenly converged in the horizontal direction, and it is possible to reduce the temperature unevenness on the heat radiating surface 25. In this embodiment, a configuration in which the heat receiving member 21 (the heat receiving portion 23 and the heat converging portion 24) and the heat radiating portion 22 are formed in a circular shape in plan view is illustrated, but the configuration is not limited to this. The heat receiving member 21 (the heat receiving portion 23 and the heat converging portion 24) and the heat radiating portion 22 can also be formed in a regular polygon shape in plan view. Also in this case, when the heat is conducted through the heat receiving member 21, it is possible to converge the heat almost evenly. Further, in this embodiment, since the heat radiating surface of the heat radiating portion 22 can have an arbitrary area and / or shape, heat input according to the situation in which each workpiece is used is possible.

[0020] Also, in the present embodiment, as shown in FIG. 3, a plurality of thermocouples 71, which are temperature measuring devices, are installed at equal intervals (for example, 2 mm pitch) along the extending direction of the heat radiating portion 22. The plurality of thermocouples 71 are respectively connected to the control unit 70, and the temperature data measured by each thermocouple 71 is periodically output to the control unit 70. The control unit 70 measures the heat conduction performance of the workpiece W based on the temperature data of the plurality of thermocouples 71. In particular, in the present embodiment, since the plurality of thermocouples 71 are installed at equal intervals along the extending direction of the heat radiating portion 22, based on the temperature data of these thermocouples 71, the temperature gradient of the heat radiating portion 22 is obtained, and based on the temperature gradient of the heat radiating portion 22, the temperature of the heat radiating surface 25 can be calculated with high precision. Since the temperature of the heat radiating surface 25 is used for calculating the heat conduction performance of the workpiece W, by calculating the temperature of the heat radiating surface 25 with high precision, the control unit 70 can calculate the heat conduction performance such as the thermal conductivity and thermal resistance of the workpiece W with high accuracy. Note that, in the present embodiment, a configuration using the thermocouple 71 as the temperature measuring device is illustrated, but the temperature measuring device is not limited to the thermocouple 71, and a configuration using a contact type temperature sensor such as a platinum resistance thermometer or a thermistor, or a non-contact type temperature sensor such as a thermography can also be adopted. Further, in the present embodiment, a configuration in which the thermocouples 71 are installed at equal intervals along the extending direction of the heat radiating portion 22 is illustrated, but the thermocouples 71 do not necessarily need to be installed at equal intervals as long as they are installed along the extending direction of the heat radiating portion 22, and the temperature gradient of the heat radiating portion 22 can be calculated in consideration of the interval between the thermocouples 71 and the positions of the respective thermocouples 71.

[0021] Next, the connecting device 40 will be described. The connecting device 40 has a plurality of shafts 41 which are connecting members, and the lower end portions of the respective shafts 41 are connected to the upper surface of the heat conductor 20. The shaft 41 is a straight columnar member, and is a cylindrical shape in the present embodiment. Further, the connecting device 40 is connected to the driving unit 50 directly or indirectly at the upper portion, and by the driving unit 50, it is possible to move up and down in the vertical direction together with the heat conductor 20.

[0022] Here, referring to FIG. 4, the arrangement method of the shaft 41 in the connecting device 40 will be described. FIG. 4 is a diagram for explaining the arrangement method of the shaft 41, (A1)-(A3) are top views of the connecting device 40, and (B1)-(B3) are perspective views of the connecting device 40. In addition, in FIG. 4, the illustration of the fixing portion 26 is omitted. In the present embodiment, as shown in (A1) and (B1), in the connecting device 40, a plurality of shafts 41 are arranged so as to surround the heater 10. Specifically, the connecting device 40 has three shafts 41, and these plurality of shafts 41 are arranged at an equal distance from the center point O of the heater 10 (or on a concentric circle of the center point O), and the angle θ formed by two adjacent shafts 41 and the center point of the heater 10 is substantially the same (in the examples shown in (A1) and (B1), each angle θ is 120°). In other words, the three shafts 41 connecting the heat conductor 20 and the drive unit 50 are connected to the heat receiving surface 23a of the heat receiving portion 23 at positions that are rotationally symmetric about the center point O in a plan view. Thereby, in the present embodiment, heat is evenly conducted from the heater 10 to each shaft 41, and even when the shaft 41 thermally expands, the expansion amount of each shaft 41 can be made the same, and it is possible to prevent the heat dissipation surface 25 of the heat conductor 20 from tilting in the horizontal direction. That is, if the distance from each shaft 41 to the heater 10 is different for each shaft 41, the elongation accompanying the thermal expansion of the shaft 41 becomes non-uniform, and there is a possibility that the heat dissipation surface 25 may tilt in the horizontal direction. Also, if the shaft 41 is arranged unevenly on the heat receiving surface 23a of the heat receiving portion 23, there is a bias in the pressure applied to the heat conductor 20 due to the thermal expansion of the shaft 41, and there is a possibility that the heat dissipation surface 25 may tilt in the horizontal direction. And when the heat dissipation surface 25 tilts in the horizontal direction, there is a problem that it cannot be in surface contact with the work W, and the measurement accuracy of the heat conduction performance of the work W decreases.In contrast, in the connecting device 40 according to the present embodiment, a plurality of shafts 41 are arranged at equal distances (or on a concentric circle) from the center point O of the heater 10, and the angle θ formed by two adjacent shafts 41 and the center point of the heater 10 is arranged to be substantially the same. Therefore, it is possible to suppress the heat dissipation surface 25 of the heat conductor 20 from tilting.

[0023] Note that, as the connecting device 40 according to the present embodiment, the configurations shown in FIGS. 4(A1) and (B1) are exemplified, but the present invention is not limited to this configuration, and the configurations shown in FIGS. 4(A2) and (B2) or (A3) and (B3) can also be adopted. That is, in the configuration shown in FIGS. 4(A2) and (B2), four shafts 41 are arranged at equal distances (or on a concentric circle) from the center point O of the heater 10, and are arranged to be line-symmetrical with respect to two or more lines passing through the center point O. Specifically, in the example shown in FIGS. 4(A2) and (B2), four shafts 41 are arranged to be line-symmetrical with respect to four lines L1 to L4 passing through the center point O. Also in this case, the thermal expansion amounts of the shafts 41 can be made uniform, and the heat dissipation surface 25 of the heat conductor 20 can be prevented from tilting. Further, in the example shown in FIGS. 4(A3) or (B3), a plurality of shafts 41 are arranged line-symmetrically with respect to the line L1 passing through the center point O of the heater 10, and each shaft 41 is arranged such that the angle θ formed by two adjacent shafts 41 and the center point O of the heater 10 is substantially the same. Thus, also in the example shown in FIGS. 4(A3) or (B3), since a plurality of shafts 41 are arranged symmetrically and at regular intervals, the inclination of the heat dissipation surface 25 of the heat conductor 20 due to the shafts 41 can be suppressed.

[0024] As described above, the drive unit 50 is connected to the heat conductor 20 via the connecting device 40, and drives the connecting device 40 and the heat conductor 20 in the vertical direction. In particular, in the present embodiment, the drive unit 50 operates based on the control of the control unit 70. When measuring the work W, the heat conductor 20 is moved downward to a position where it contacts the work W. After measuring the work W, the heat conductor 20 is moved upward to a predetermined height position where it does not contact the work W. In the present embodiment, the drive unit 50 is connected to a proximity sensor or a contact sensor (not shown), and based on the signals from these sensors, when the heat conductor 20 is moved downward, it can be determined whether the heat dissipation surface 25 of the heat dissipation unit 22 has contacted the work W. Further, the drive unit 50 can also be configured to determine whether the heat dissipation surface 25 of the heat dissipation unit 22 has contacted the work W based on the signal from the load sensor installed on the temperature control unit 60 side. By these sensors, it is possible to prevent damage to the work W due to overload while ensuring that the heat dissipation surface 25 contacts the work W. The type of the drive unit 50 is not particularly limited. For example, an air cylinder can be used. By using an air cylinder, the heat conductor 20 can be brought into contact with the work W with a constant thrust while performing drive control in the vertical direction, and it is possible to improve the measurement accuracy of the heat conduction performance of the work W.

[0025] Next, the temperature control unit 60 will be described. The temperature control unit 60 has a temperature control function for maintaining the workpiece W placed on its upper surface at a predetermined set temperature. In the present embodiment, as shown in FIGS. 2 and 5, the temperature control unit 60 includes a temperature control block 61 on which the workpiece W is placed, a heat spreader 62 for diffusing the heat conducted from the lower surface of the temperature control block 61 in the horizontal direction, a heating and cooling device 63 that abuts against the central portion of the lower surface of the heat spreader 62, and a cooling device 64 that abuts against the lower surface of the heating and cooling device 63. In the present embodiment, the workpiece W is held on the temperature control block 61 by its own weight, but a holding mechanism for holding the workpiece W by clamping or suction, for example, may be provided. Further, the temperature control block 61 is not particularly limited as long as it is a material with high thermal conductivity, similar to the heat conductor 20. For example, it can be made of silver, copper, gold, aluminum, iron, titanium, nickel, platinum, or their alloys.

[0026] The heat spreader 62 is a metal member with good thermal conductivity in the horizontal direction and can be constituted by, for example, a heat pipe or a vapor chamber for moving heat in the horizontal direction using a working fluid. The heating and cooling device 63 is a Peltier element that can heat and cool the temperature control block 61 via the heat spreader 62 by energization control by the control unit 70. The cooling device 64 includes a water-cooled block in which a flow path through which the refrigerant supplied from the refrigerant circulation device 67 circulates is formed inside.

[0027] In this embodiment, by performing the preheating process using the heating and cooling device 63, it is possible to significantly shorten the time for the measurement test of the heat conduction performance. For example, when heating a workpiece W with a predetermined amount of heat and measuring the heat conduction performance at that amount of heat, since the temperature of the workpiece W changes until it reaches the temperature corresponding to the heat of that amount, the heat conduction performance of the workpiece W may fluctuate. Also, when the preheating process is not performed, even if the workpiece W reaches the temperature corresponding to the heat of that amount, the calculated thermal resistance value may not be stable until a certain period of time has elapsed (until the temperature of the workpiece W stabilizes). Thus, conventionally, it was necessary to wait for the measurement of the heat conduction performance of the workpiece W until the temperature of the workpiece W reached the temperature corresponding to the heat applied, and also until the temperature of the workpiece W stabilized after reaching the temperature corresponding to the heat applied. However, in this embodiment, by preheating the temperature control block 61, the workpiece W can be stabilized at the temperature corresponding to the heat applied in a short time, and the heat conduction performance of the workpiece W can be measured.

[0028] Further, the control unit 70 can also measure the thermal conductivity performance of the work W at a predetermined temperature. For example, when measuring the thermal conductivity performance of the work W at 60°C, the control unit 70 adjusts the temperature of the work W before and after the measurement to 60°C. When the temperature of the temperature control block 61 is less than 60°C, the control unit 70 performs energization control to cause the heating and cooling device 63 to generate heat, thereby heating the temperature control block 61 by the heating and cooling device 63 and quickly heating the temperature of the work W in contact with the temperature control block 61 to the target 60°C. On the other hand, when the temperature of the temperature control block 61 is 60°C or higher, the control unit 70 operates the refrigerant circulation device 67 communicating with the cooling device 64, and circulates the refrigerant from the refrigerant circulation device 67 to the cooling device 64, thereby reducing the temperature of the temperature control block 61 and adjusting the temperature of the work to the target 60°C. In addition, when cooling the work W, the control unit 70 can also be configured to cool the work W by the Peltier element which is the heating and cooling device 63. That is, the heating and cooling device 63 can function as a heating device when heating the work W and can function as a cooling device when cooling the work W. Note that the set temperature of the temperature control block 61 (60°C in the above example) can be set as appropriate, but it is preferably set to a temperature lower than the temperature of the heat applied to the work W by the heating unit 2. In addition, in this embodiment, a configuration in which the work W is heated using a Peltier element as the heating and cooling device 63 is illustrated, but the configuration is not limited thereto. As the heating mechanism, instead of or in addition to the Peltier element, a heater can be provided in the temperature control unit 60, and the work W can be heated by the heater.

[0029] Also, as shown in FIGS. 5 and 6(A) and (B), in the present embodiment, the temperature control block 61 has a TIM flow path 612 and a TIM discharge hole 613 for discharging a thermal interface material (TIM) onto the upper surface 611 of the temperature control block 61, and an air flow path 615 and an air discharge hole 616 for ejecting air onto the upper surface 611 of the temperature control block 61. Note that FIG. 6(A) is a plan view of the temperature control block 61 according to the present embodiment, and FIG. 6(B) is a cross-sectional view of the temperature control block 61 according to the present embodiment.

[0030] Specifically, the TIM flow path 612 is a flow path formed inside the temperature control block 61. One end communicates with the TIM discharge hole 613 formed on the upper surface 611 of the temperature control block 61, and the other end communicates with the TIM supply hole 614 formed on the side surface of the temperature control block 61. Further, the TIM flow path 612 is connected to a tube 651 at the TIM supply hole 614, and the tube 651 is connected to a TIM pump 65. Thereby, the TIM pumped by the TIM pump 65 passes through the TIM flow path 612 and is discharged from the TIM discharge hole 613 onto the upper surface 611 of the temperature control block 61. In particular, in the present embodiment, with the work W placed on the upper surface 611 of the temperature control block 61, by discharging the TIM onto the upper surface 611 of the temperature control block 61 (between the temperature control block 61 and the work W), the work W can be brought into contact with the upper surface 611 of the temperature control block 61 via the TIM. Therefore, the adhesion between the work W and the temperature control block 61 is enhanced, heat conduction between the work W and the temperature control block 61 becomes easier, and heat can be input to the work W more efficiently.

[0031] Also, the air flow path 615 is a flow path formed inside the temperature control block 61. One end communicates with an air outlet hole 616 formed on the upper surface of the temperature control block 61, and the other end communicates with an air supply hole 617 opened on the side surface of the temperature control block 61. Further, the air flow path 615 is connected to a tube 661 at the air supply hole 617, and the tube 661 is connected to an air pump 66. Thus, the air blown from the air pump 66 passes through the air flow path 615 and is ejected from the air outlet hole 616. Therefore, even when the workpiece W is adsorbed on the upper surface 611 of the temperature control block 61 by the TIM, the workpiece W can be easily removed from the temperature control block 61.

[0032] Also, the temperature control block 61 can be configured to be provided with a TIM suction hole for sucking the TIM discharged onto the upper surface 611. The TIM suction hole can be configured to be shared with the TIM discharge hole 613, or can be configured to provide a TIM suction hole separately from the TIM discharge hole 613. Further, the control unit 70 can be configured to control the TIM discharge operation from the TIM discharge hole 613 and the TIM suction operation of the TIM discharged from the TIM suction hole for each workpiece W.

[0033] Also, in the thermal conductivity measurement device 1 according to the present embodiment, it can be configured to detect an abnormality in the discharge or suction of the TIM. For example, in the present embodiment, the drive unit 50 can be configured to include a sensor that detects a drive amount (the amount of movement in the upward or downward direction of the heating unit 2), and the sensor can detect the drive amount from a predetermined fixed position until the heat dissipation surface 25 comes into contact with the workpiece W when measuring the workpiece W, and transmit it to the control unit 70. In this case, the control unit 70 calculates the thickness of the TIM based on the drive amount acquired from the drive unit 50 (for example, calculated as drive amount - thickness of workpiece W = thickness of TIM), and determines the thickness of the TIM applied to the workpiece W. Then, when the thickness of the TIM applied to the workpiece W is outside a predetermined range, the control unit 70 can be configured to issue an alarm by an alarm unit (not shown) for reasons such as insufficient TIM or excessive TIM.

[0034] In addition, a plurality of thermocouples 72 are installed in the temperature control block 61. Specifically, as shown in FIG. 5, a plurality of thermocouples 72 are arranged in parallel on the upper surface 611 of the temperature control block 61. Thereby, the temperature on the lower surface side (heat dissipation side) of the work W placed on the upper surface 611 of the temperature control block 61 can be measured in the plane direction of the upper surface 611 of the temperature control block 61. The temperature data measured by the plurality of thermocouples 72 is output to the control unit 70 and used for calculating the heat conduction performance of the work W. Further, the temperature data measured by the plurality of thermocouples 72 is output to the control unit 70 and used for controlling the heating / cooling device 63 and the refrigerant circulation device 67 in order to adjust the temperature of the temperature control block 61.

[0035] The control unit 70 controls the operations of the heater 10, the drive unit 50, the heating / cooling device 63, the TIM pump 65, the air pump 66, and the refrigerant circulation device 67 in order to measure the heat conduction performance of the work W. Specifically, the control unit 70 causes the heater 10 to generate heat and drives the heat conductor 20 by the drive unit 50 to bring the heat dissipation surface 25 of the heat dissipation part 22 into contact with the work W, so that the heat converged by the heat conductor 20 can be applied to the work W. In addition, the control unit 70 controls the operations of the heating / cooling device 63 and the refrigerant circulation device 67 based on the temperature of the temperature control block 61, and maintains the temperature of the work W at a predetermined set temperature. Further, the control unit 70 controls the operation of the TIM pump 65 to supply and recover TIM between the temperature control block 61 and the work W, and by controlling the operation of the air pump 66, the operation of the operator applying TIM to the work W and the operation of wiping off TIM from the work W can be omitted or facilitated, and the operation of the operator removing the work W from the temperature control block 61 can be facilitated.

[0036] Further, the control unit 70 measures the heat conduction performance of the workpiece W. In particular, in the present embodiment, in order to measure the heat conduction performance of the workpiece W with high precision, the control unit 70 acquires temperature data from a plurality of thermocouples 71 installed in the heat dissipation unit 22, calculates the temperature gradient of the heat dissipation unit 22, and thereby calculates the temperature of the heat dissipation surface 25 with high precision. Further, in order to measure the heat conduction performance of the workpiece W with high precision, the control unit 70 acquires temperature data from a plurality of thermocouples 72 to 73 installed in the temperature control unit 60, calculates the temperature gradient of the temperature control unit 60, and thereby calculates the temperature of the upper surface 611 of the temperature control block 61 with high precision. The control unit 70 can calculate the heat conduction performance of the workpiece W with high precision based on the temperature of the heat dissipation surface 25 and the temperature of the upper surface 611 of the temperature control block 61 calculated in this way. Further, the control unit 70 can also determine whether the workpiece W is a good product or a defective product based on the measurement result of the heat conduction performance of the workpiece W. Although details will be described later, the control unit 70 can also be configured to determine whether the workpiece W is a good product or a defective product by determining whether the heat conduction performance of the workpiece W satisfies a predetermined reference value.

[0037] Next, the operation of the heat conduction performance measuring apparatus 1 according to the present embodiment will be described. In the present embodiment, a temperature control process for controlling the temperature of the temperature control block 61 on which the workpiece W is placed to a constant temperature and a measurement process for measuring the heat conduction performance of the workpiece W are performed in parallel. First, based on FIG. 7, the temperature control process according to the present embodiment will be described. FIG. 7 is a flowchart showing the temperature control process according to the present embodiment.

[0038] In step S101, the control unit 70 acquires the temperature data of the temperature control block 61. Specifically, the control unit 70 acquires the temperature data detected by the thermocouple 72 installed on the upper surface 611 of the temperature control block 61 as the temperature data of the temperature control block 61. In this embodiment, as shown in FIG. 5, the upper surface 611 of the temperature control block 61 has a plurality of thermocouples 72, and the average temperature of the temperatures detected by these plurality of thermocouples 72 is acquired as the temperature data of the temperature control block 61. Further, the control unit 70 may be configured to obtain the temperature gradient of the temperature control unit 60 from the average temperature of the plurality of thermocouples 72 and each temperature of the thermocouple 73, and calculate the upper surface temperature of the temperature control block 61.

[0039] Then, in step S102, the control unit 70 determines whether the temperature of the temperature control block 61 acquired in step S101 is equal to or higher than a predetermined set temperature. The set temperature is a temperature determined in advance for measuring the heat conduction performance of the work W, and the operator can appropriately set the set temperature via an input unit (not shown). When the temperature control block 61 is equal to or higher than the predetermined set temperature, the process proceeds to step S103. On the other hand, when the temperature control block 61 is lower than the predetermined set temperature, the process proceeds to step S104.

[0040] In step S103, since the temperature control block 61 is equal to or higher than the set temperature, the control unit 70 performs a process for lowering the temperature of the temperature control block 61. Specifically, the control unit 70 operates the refrigerant circulation device 67 to circulate a refrigerant such as water through the cooling device 64. Thereby, heat exchange is performed between the cooling device 64 and the temperature control block 61 via the heating and cooling device 63 and the heat spreader 62, and the temperature control block 61 can be cooled. Further, in addition to the cooling device 64, the control unit 70 may be configured to energize the Peltier element, which is the heating and cooling device 63, to cool the temperature control block 61. Then, the process returns to step S101.

[0041] Also, in step S104, since the temperature control block 61 is below the set temperature, the control unit 70 performs a process to increase the temperature of the temperature control block 61. Specifically, the control unit 70 energizes the heating and cooling device 63 to generate heat in the heating and cooling device 63, thereby heating the temperature control block 61 via the heat spreader 62 and increasing the temperature of the temperature control block 61. Then, the process returns to step S101.

[0042] In this way, the temperature control process according to the present embodiment cools the temperature control block 61 with the cooling device 64 or heats it with the heating and cooling device 63 so as to maintain the temperature of the temperature control block 61 at a constant set temperature. Thereby, in the thermal conductivity measurement device 1 according to the present embodiment, the temperature control block 61 is not excessively cooled, and the thermal conductivity of the work W can be measured. Therefore, it is possible to shorten the waiting time for waiting for the work W to reach a predetermined temperature, and the measurement efficiency of the work W can be improved (see the examples described later).

[0043] In the example shown in FIG. 7, when the temperature control block 61 is equal to or higher than a predetermined set temperature, the temperature control block 61 is cooled by the cooling device 64 (and the heating and cooling device 63), and when the temperature control block 61 is lower than the predetermined set temperature, the temperature control block 61 is heated by the heating and cooling device 63. However, the configuration is not limited to this. When the temperature control block 61 is equal to or higher than the first target temperature, the control unit 70 cools the temperature control block 61 with the cooling device 64 (and the heating and cooling device 63), and when the temperature control block 61 is lower than the second target temperature lower than the first target temperature, the heating and cooling device 63 may be configured to heat the temperature control block 61. That is, when the temperature control block 61 deviates from the range between the first target temperature and the second target temperature, the temperature control block 61 can be cooled or heated for temperature control.

[0044] Next, based on FIG. 8, the measurement process of the heat conduction characteristics of the workpiece W according to the present embodiment will be described. FIG. 8 is a flowchart showing the measurement process of the heat conduction characteristics of the workpiece W according to the present embodiment. As shown in FIG. 8, in step S201, the control unit 70 determines whether or not the workpiece W is set on the temperature control block 61. For example, in the present embodiment, when an operator places the workpiece W on the upper surface of the temperature control block 61 and presses a measurement start button (not shown), the control unit 70 can determine that the workpiece W is set. The control unit 70 waits in step S201 until the workpiece W is set, and proceeds to step S202 when the workpiece W is set.

[0045] In step S202, the control unit 70 supplies TIM to the workpiece W. Specifically, the control unit 70 operates the TIM pump 65 to discharge TIM from a TIM tank (not shown) through the tube 651 and the TIM flow path 612 in the temperature control block 61 from the TIM discharge hole 613. Thereby, TIM is supplied between the upper surface 611 of the temperature control block 61 and the workpiece W, and the adhesion between the workpiece W and the temperature control block 61 can be enhanced.

[0046] In step S203, the control unit 70 inputs heat to the workpiece W. Specifically, the control unit 70 operates the heater 10 to generate heat. Further, the control unit 70 operates the drive unit 50 to move the heating unit 2 downward until the heat dissipation surface 25 of the heat conductor 20 contacts the workpiece W. Thereby, the heat generated by the heater 10 is conducted to the heat receiving unit 23 of the heat conductor 20, converges at the heat convergence unit 24, then conducts through the heat dissipation unit 22, and heat input is performed from the heat dissipation surface 25 of the heat dissipation unit 22 to the workpiece W. In step S203, the control unit 70 determines whether there is an abnormality in the thickness of the TIM based on the moving amount of the heating unit 2 by the drive unit 50. When the driving amount of the heating unit 2 is outside the predetermined range, it is determined that there is an abnormality such as too much or too little TIM, and an alarm can be output to an alarm unit (not shown).

[0047] In step S204, the control unit 70 measures the heat conduction performance of the workpiece W. For example, based on the temperature data of a plurality of thermocouples 71 provided in the heat dissipation unit 22, the control unit 70 obtains the temperature gradient of the heat dissipation unit 22, and based on the temperature data of a plurality of thermocouples 72 and 73 provided in the temperature control unit 60, obtains the temperature gradient of the temperature control unit 60. Note that the control unit 70 may be configured to obtain the average temperature of the plurality of thermocouples 72 as the temperature at the height position of the thermocouple 72, and obtain the temperature gradient of the temperature control unit 60 from the average temperature of the thermocouple 72 and each temperature of the thermocouple 73. Then, the control unit 70 calculates the temperature T1 of the heat dissipation surface 25 of the heat dissipation unit 22 from the temperature gradient of the heat dissipation unit 22, and calculates the temperature T2 of the upper surface of the temperature control block 61 from the temperature gradient of the temperature control unit 60. Further, as shown in the following formula (1), the control unit 70 calculates the temperature T1 of the heat dissipation surface 25, the temperature T2 of the upper surface of the temperature control block 61, and the heat input amount Q In (e.g., 1000 W / cm 2 ) of the heater 10, and based on these, calculates the thermal resistance R W of the workpiece W, which is one of the heat conduction performances of the workpiece W.

Equation

[0048] In step S205, the control unit 70 performs a process for removing the workpiece W. Specifically, the control unit 70 causes the driving unit 50 to move the heating unit 2 upward and move the heat conductor 20 to a predetermined height position. As a result, the upper surface 611 of the temperature control block 61 is exposed, and the operator can take out the workpiece W for which the measurement has been completed from the upper surface 611 of the temperature control block 61. Further, in the present embodiment, the control unit 70 can also operate the TIM pump 65 to recover the TIM supplied to the upper surface 611 of the temperature control block 61. Furthermore, the control unit 70 operates the air pump 66 to eject air from the air ejection holes 616 through the tube 661 and the air flow path 615. Thereby, even when the workpiece W is in close contact with the upper surface 611 of the temperature control block 61 by the TIM, the workpiece W can be easily removed from the temperature control block 61. In this way, by taking out the workpiece W for which the measurement has been completed, the measurement process of the heat conduction performance of the workpiece W shown in FIG. 8 is completed. Note that the operator can directly place a new workpiece W on the upper surface 611 of the temperature control block 61 and measure the heat conduction performance of the workpiece W. In this case, the process returns to step S201.

[0049] Note that in the present embodiment, as described above, since the measurement process of the heat conduction performance of the workpiece W and the temperature control process are performed in parallel, even if the temperature control block 61 is heated in steps S202 and S203, the temperature control block 61 can be cooled to prevent excessive heating of the temperature control block 61. Further, in the present embodiment, when the cooling of the temperature control block 61 is excessively performed and the temperature of the temperature control block 61 is lower than the set temperature, heating by the heating and cooling device 63 is performed. Therefore, when continuously measuring the heat conduction performance of the workpiece W, even if the temperature of the workpiece W is lower than the temperature suitable for measurement, the temperature of the workpiece W can be quickly raised to the temperature suitable for measurement.

Example

[0050] Next, Example 1 of the thermal conductivity performance measuring apparatus 1 according to the present embodiment will be described. In this Example 1, using the thermal conductivity performance measuring apparatus 1 according to the present embodiment, the thermal resistance value, which is one of the thermal conductivity performances, was measured for (1) a copper plate, (2) a normal product of a flat heat pipe, and (3) a defective product of a flat heat pipe as the work W. Note that, for (2) and (3), normal products and defective products of the flat heat pipes that had been previously determined as normal and defective were used. FIG. 9 is a graph showing the measurement results of the thermal conductivity performance in this Example 1. In the example shown in FIG. 9, the control unit 70 repeatedly calculates the thermal resistance value of the work W, and when the thermal resistance value after a certain time from when the heat dissipation surface 25 of the heat dissipation unit 22 is brought into contact with the work W to perform heat input is lower than a predetermined reference value, it is determined as a non-defective product with no abnormality in the thermal conductivity performance, and when the thermal resistance value after a certain time is higher than the predetermined reference value, it is determined as a defective product with an abnormality in the thermal conductivity performance. Note that the reference value was set based on the thermal resistance value of the copper plate.

[0051] Also, in the example shown in FIG. 9, for (1) the copper plate, the thermal resistance value was measured only once, and for (2) the normal product of the flat heat pipe and (3) the defective product of the flat heat pipe, the thermal resistance value was measured three times to improve the measurement accuracy. If the thermal resistance value exceeded the reference value even once, it was determined that there was an abnormality. Also, in the example shown in FIG. 9, the thermal resistance values were measured in the order of the copper plate, the normal product of the flat heat pipe, and the defective product of the flat heat pipe, and the thermal resistance values were measured for three copper plates, three normal products of the flat heat pipes, and three defective products of the flat heat pipes, respectively. Note that in FIG. 9, the measurement results of the thermal resistance values of the copper plates are indicated by C1 to C3, the measurement results of the thermal resistance values of the normal products of the flat heat pipes are indicated by WG1 to WG3, and the measurement results of the thermal resistance values of the defective products of the flat heat pipes are indicated by WR1 to WR3.

[0052] As shown in FIG. 9, in the case of normal products of the (2) flat heat pipes, all three (WG1 to WG3) had heat resistance values below the reference value in all three measurements and were determined to be non-defective products. Also, in the case of defective products of the (3) flat heat pipes, all three (WR1 to WR3) had heat resistance values exceeding the reference value in at least one of the three measurements (for example, in the second WR2, the heat resistance value exceeded the reference value in the second measurement), and all were determined to be defective products. Thus, in the heat conduction performance measurement apparatus 1 according to the present embodiment, the heat conduction performance of the work W can be appropriately measured, and based on the measurement result of the heat conduction performance, it was possible to appropriately determine whether the work W is a non-defective product or not.

[0053] Also, in the example shown in FIG. 10, the relationship between the temperature control process of the temperature control block 61 and the measurement time of the heat conduction performance was verified. That is, using each of a copper plate (indicated by C4 in FIG. 10) and a normal product of a flat heat pipe (indicated by WG4 in FIG. 10), the measurement time Tt required for measuring the heat conduction performance (heat resistance value) was verified when no temperature control process was performed and when a temperature control process was performed. In the first embodiment, the heater 10 was caused to generate heat at 170 W, and the time from the time Ts when heat input to the work W was started until the time Te when the heat input amount and the temperature (T2) of the upper surface 611 of the temperature control block 61 became stable was detected as the measurement time Tt. In the first embodiment, the time Te when the heat input amount and the temperature (T2) of the upper surface 611 of the temperature control block 61 became stable was defined as the time when the temperature (T2) of the upper surface 611 of the temperature control block 61 was within ±0.2% / 10 seconds of the set value and the heat input amount was within ±1.0% / 10 seconds of the set value, but it is not limited to this.

[0054] Among the examples shown in Fig. 10, when the copper plate C4 was used, without temperature adjustment treatment, the temperature of the temperature adjustment block 61 was 20°C, but with temperature adjustment treatment, the temperature of the temperature adjustment block 61 was 36°C due to preheating. When 170 W of heat was input to the copper plate C4, regardless of the presence or absence of temperature adjustment treatment, the temperature of the heat dissipation surface 25 of the heat conductor 20 in contact with the copper plate C4 rose to 83°C and stabilized at 83°C, and the temperature of the temperature adjustment block 61 stabilized at 45°C. However, without temperature adjustment treatment, it took 542 seconds for the temperature of the heat dissipation surface 25 of the heat conductor 20 in contact with the copper plate C4 and the temperature of the temperature adjustment block 61 to stabilize. On the other hand, with temperature adjustment treatment, it took 60 seconds for the temperature of the heat dissipation surface 25 of the heat conductor 20 in contact with the copper plate C4 and the temperature of the temperature adjustment block 61 to stabilize.

[0055] Furthermore, among the examples shown in Fig. 10, when the normal product WG4 of the flat heat pipe was used as the workpiece W, without temperature adjustment treatment, the temperature of the temperature adjustment block 61 was 30°C, and with temperature adjustment treatment, the temperature of the temperature adjustment block 61 was 40°C due to preheating. When 170 W of heat was input to the normal product WG4 of the flat heat pipe, the stable temperatures were different depending on the presence or absence of temperature adjustment treatment. Without temperature adjustment treatment, the temperature of the heat dissipation surface 25 of the heat conductor 20 in contact with the normal product WG4 of the flat heat pipe stabilized at 83°C, and the temperature of the temperature adjustment block 61 stabilized at 45°C. On the other hand, with temperature adjustment treatment, the temperature of the heat dissipation surface 25 of the heat conductor 20 in contact with the normal product WG4 of the flat heat pipe stabilized at 80°C, and the temperature of the temperature adjustment block 61 stabilized at 45°C. Also, however, without temperature adjustment treatment, it took 302 seconds for the temperature of the heat dissipation surface 25 of the heat conductor 20 in contact with the normal product WG4 of the flat heat pipe and the temperature of the temperature adjustment block 61 to stabilize. On the other hand, with temperature adjustment treatment, it took 55 seconds for the temperature of the heat dissipation surface 25 of the heat conductor 20 in contact with the normal product WG4 of the flat heat pipe and the temperature of the temperature adjustment block 61 to stabilize.

[0056] In this way, by performing a temperature adjustment process of pre-adjusting the temperature of the temperature adjustment block 61, the temperature of the workpiece W becomes stable, and the waiting time until the thermal conductivity performance of the workpiece W can be measured can be shortened, and it has been found that the measurement time Tt when repeatedly measuring the thermal conductivity performance of a plurality of workpieces W can be significantly shortened. Further, in the present Example 1, in the normal product WG4 of the flat heat pipe, when the temperature adjustment process was not performed, the thermal resistance value R at the measurement time of 302 seconds was 0.228 ° C / W, but the thermal resistance value R at the measurement time of 2400 seconds was 0.220 ° C / W, and the measured thermal resistance value R did not stabilize even after a long time had passed. However, when the temperature adjustment process was performed, after the measurement time of 55 seconds, the thermal resistance value R fluctuated only within the range of ±0.001 ° C / W, and it was also found that the measurement result of the thermal resistance value R stabilized.

[0057] As described above, the thermal conductivity performance measuring apparatus 1 according to the present embodiment includes an upper surface 611 of a temperature adjustment block 61 on which a workpiece W is placed, a thermocouple 72 that measures the temperature of the workpiece W or the upper surface 611, a heating / cooling device 63 that heats the upper surface 611, a cooling device 64 that cools the upper surface 611, and a control unit 70 that controls the operations of the heating / cooling device 63 and the cooling device 64. Both the heating / cooling device 63 and the cooling device 64 are disposed below the upper surface 611. The control unit 70 has a temperature adjustment unit 60 that heats the upper surface 611 by the heating / cooling device 63 until the measured temperature of the thermocouple 72 reaches a first temperature, and cools the workpiece W by the cooling device 64 when the measured temperature of the thermocouple 72 becomes equal to or higher than a second temperature that is higher than the first temperature. Thereby, in the thermal conductivity performance measuring apparatus 1 according to the present embodiment, since the workpiece W can be temperature-adjusted by the temperature adjustment unit 60 before the heat treatment of the workpiece W, when measuring the thermal conductivity performance of the workpiece W at the target temperature of the workpiece W or when measuring the thermal conductivity performance of the workpiece W with a predetermined heat input amount, the time required to raise the workpiece W to the target temperature can be shortened, and the heat treatment of the workpiece W can be efficiently performed. Further, in the thermal conductivity performance measuring apparatus 1 according to the present embodiment, by preheating the workpiece W in advance, the temperature of the workpiece W can be quickly stabilized, and thereby, the thermal conductivity performance of the workpiece W can be stably measured in a shorter time.

[0058] 《Second Embodiment》 Next, a second embodiment of the present invention will be described. In the above-described embodiment, the present invention has been described by exemplifying the thermal conductivity measurement device 1 for measuring the thermal conductivity performance of the work W. However, the present invention is not limited to the thermal conductivity measurement device 1 for measuring the thermal conductivity performance of the work W, and can be applied to a test device for evaluating other performances of the work W, or a processing device such as a heat treatment device for heat-treating the work W. For example, when evaluating the work W or processing the work W, a liquid (agent) according to the purpose may be applied to the work W. Such an application operation is troublesome when performed manually, and there are problems such as an error in the application amount. In addition, when picking up the work W from the workbench after the evaluation test or after the processing, there is also a problem that the work W coated with the liquid adheres to the workbench and is difficult to pick up. In response to such problems, it is an issue to improve the working efficiency when testing or processing the work W. In the above-described first embodiment, in the temperature control block 61, the TIM can be applied to the work W by discharging the TIM from the TIM discharge hole 613, and the TIM adhered to the temperature control block 61 can be easily removed by ejecting air from the air ejection hole 616. Also in the second embodiment of the present invention, similar to the first embodiment, on the mounting table for mounting the work W, by discharging the agent and ejecting air, the above problems can be solved. In the following, the second embodiment of the present invention will be described by exemplifying a heat treatment device 1a for processing and manufacturing the work W by introducing the heat of the heater 10 into the work W such as metal. In the heat treatment device 1a according to the second embodiment, the description of the same configuration as that of the thermal conductivity measurement device 1 according to the first embodiment will be omitted, and the different parts will be described in detail.

[0059] The heat treatment apparatus 1a according to the second embodiment has a mounting table 81 instead of the temperature control block 61 according to the first embodiment. FIG. 11 is a configuration diagram showing the mounting table 81 according to the second embodiment. The mounting table 81 is a table on which the workpiece W is mounted, and can have the same configuration as the temperature control block 61 according to the first embodiment. Similar to the temperature control block 61, it can be made of silver, copper, gold, aluminum, iron, nickel, titanium, platinum, or their alloys. However, in the second embodiment, the mounting table 81 may be configured to control the temperature of the workpiece W, or may not be configured to control the temperature. That is, the mounting table 81 can be used alone without being combined with the heating and cooling device 63 or the cooling device 64 in the first embodiment.

[0060] As shown in FIG. 11, the mounting table 81 has a mounting surface 811 for mounting the workpiece W on the upper surface, and inside, a liquid flow path 812 and a gas flow path 815. Further, a liquid discharge hole 813 communicating with the first end side of the liquid flow path 812 is provided in the mounting surface 811. Furthermore, a liquid supply hole 814 communicating with the second end side of the liquid flow path 812 is provided on the side surface (main body surface) of the mounting table 81. In the example shown in FIG. 11, a configuration having a single liquid discharge hole 813 and a single liquid supply hole 814 is illustrated, but the configuration is not limited thereto. For example, a configuration having a plurality of liquid discharge holes 813 and / or a plurality of liquid supply holes 814 can be adopted.

[0061] In addition, a gas blowing hole 816 communicating with the first end side of the internal gas flow path 815 is provided in the mounting surface 811. Also, a gas supply hole 817 communicating with the second end side of the gas flow path 815 is provided on the side surface (main body surface) of the mounting table 81. In the example shown in FIG. 11, a configuration having a single gas blowing hole 816 and a single gas supply hole 817 is illustrated, but the configuration is not limited thereto. For example, a configuration having a plurality of gas blowing holes 816 and / or a plurality of gas supply holes 817 can be adopted.

[0062] In addition, since the workpiece W is often placed near the center of the placement surface 811, from the perspective of working efficiency, it is preferable that the liquid discharge holes 813 and the gas blowing holes 816 are provided at positions closer to the center of the placement surface 811 than to the outer edge of the placement surface 811. However, they may be provided on the outer edge side of the placement surface 811 so as not to interfere during testing or processing. Alternatively, one of the liquid discharge holes 813 and the gas blowing holes 816 may be provided on the center side of the placement surface 811, and the other may be provided on the outer edge side of the placement surface 811.

[0063] Also, in the second embodiment as well, the placement surface 811 of the placement table 81 may be configured to have a liquid supply device for supplying liquid and a gas supply device for supplying gas, and further include an operation unit for the user to instruct the operations of the liquid supply device and the gas supply device, and a control unit for controlling the operations. The liquid supply device (also referred to as a liquid pump) may be a positive displacement pump (for example, a reciprocating pump such as a plunger pump or a piston pump, a tube pump, a gear pump, a vane pump, a screw pump, etc.), a non-positive displacement pump (a centrifugal pump such as a volute pump or a turbine pump, a propeller pump such as an axial flow pump or a mixed flow pump, a viscous pump such as a cascade pump, etc.). As long as it can supply liquid, it is not limited to these. Further, a flow meter sensor may be attached to the liquid supply device to stably supply a predetermined amount of liquid. The gas supply device (also referred to as an air pump) may include a compression pump and a vacuum pump. As long as it can supply gas, it is not limited to these.

[0064] Also, in the second embodiment, the placement surface 811 may be configured to be provided with a liquid suction hole communicating with the first end side of the liquid suction channel inside the placement table 81, and the side surface (the surface of the main body) may be provided with a liquid suction access hole communicating with the second end side of the liquid suction channel. Further, the liquid suction hole may be configured to be shared with the liquid discharge hole 813, or a liquid suction hole may be provided separately from the liquid discharge hole 813.

[0065] In the second embodiment, the heat treatment apparatus 1a can be configured to perform a process of coating the surface of the workpiece W. In this case, the mounting table 81 can supply a coating agent for coating the workpiece W placed on the mounting table 81 from a liquid pump to the mounting table 81 via the tube 851, and discharge it from the liquid discharge holes 813 via the liquid flow path 812. The coating agent is not particularly limited, and examples thereof include a coating agent containing a water repellent, an antibacterial agent, a photocatalyst, silicon, or a fluororesin. Further, the heat treatment apparatus 1a can be configured to perform a process of polishing the workpiece W. In this case, the mounting table 81 can supply an abrasive for polishing the workpiece W placed on the mounting table 81 from a liquid pump to the mounting table 81 via the tube 851, and discharge it from the liquid discharge holes 813 via the liquid flow path 812. The abrasive is also not particularly limited, and examples thereof include abrasives containing silica, diamond, boron nitride, silicon carbide, aluminum(III) oxide, chromium oxide, iron(II) oxide, alumina, etc. as abrasives.

[0066] In the first embodiment, the temperature near the upper surface 611 of the temperature control block 61 was detected by the thermocouple 72. In the second embodiment, a temperature sensor such as a contact type temperature sensor such as a platinum resistance thermometer or a thermistor, or a non-contact type temperature sensor such as a thermograph can be used to measure the temperature near the mounting surface 811 of the mounting table 81.

[0067] The mounting table 81 is preferably made of a material having good thermal conductivity in order to warm the liquid agent, and can be configured to heat the mounting table 81 using a heater or a Peltier element. The mounting table 81 can also be configured to have a thermocouple or a temperature sensor for managing the temperature of the liquid agent.

[0068] As described above, in the heat treatment apparatus 1a according to the second embodiment, similar to the heat conduction performance measuring apparatus 1 according to the first embodiment, the heat generated by the heater 10 is converged at the heat convergence portion 24 of the heat conductor 20, and heat can be efficiently input to the work W. Therefore, the work W can be heated to a predetermined temperature in a short time. Further, in the heat treatment apparatus 1a according to the second embodiment, since the liquid agent used for processing and manufacturing the work W can be provided around the work W at an appropriate temperature, the processing and manufacturing of the work W can be performed more efficiently.

[0069] Note that the mounting table 81 according to the second embodiment can be applied not only to the heat treatment apparatus 1a having the heating unit 2 but also to a processing apparatus not having the heating unit 2. For example, as described above, it can be applied to a processing apparatus that mounts the work W on the mounting table 81 and performs a coating process or a polishing process by supplying a coating agent or a polishing agent to the work W. It is also possible to dry the work W by blowing hot air from the gas blowing holes 816 of the mounting table 81.

[0070] <<Third Embodiment>> Next, a third embodiment of the present invention will be described. The heat conduction performance measuring apparatus 1 according to the third embodiment has the same configuration as the heat conduction performance measuring apparatus 1 according to the first embodiment and operates in the same manner, except that the temperature control block 61 is composed of a member having a lower thermal conductivity than the heat conductor 20 (heat radiation portion 22) and the work W.

[0071] In this embodiment, the material of the work W is not particularly limited, and examples thereof include copper, copper alloy, aluminum, aluminum alloy, ceramics, titanium, titanium alloy, and the like. For example, when the heat conductor 20 (heat dissipation part 22) or the work W is made of copper or a copper alloy, the temperature control block 61 can be made of a member having a lower thermal conductivity than copper or a copper alloy such as aluminum, aluminum alloy, nickel, iron, stainless alloy, platinum, or the like. Further, when the heat conductor 20 (heat dissipation part 22) or the work W is made of aluminum or an aluminum alloy, the temperature control block 61 can be made of a member having a lower thermal conductivity than aluminum or an aluminum alloy such as nickel, iron, stainless alloy, platinum, or the like. Furthermore, when the heat conductor 20 (heat dissipation part 22) or the work W is made of ceramics, depending on the type of ceramics, the temperature control block 61 can be made of a member having a lower thermal conductivity than the above ceramics such as stainless alloy, platinum, or the like. In addition, when the heat conductor 20 (heat dissipation part 22) or the work W is made of titanium or a titanium alloy, the temperature control block 61 can be made of a member having a lower thermal conductivity than titanium or a titanium alloy such as stainless alloy, or the like.

[0072] Here, if the temperature control block 61 is made of a member having the same thermal conductivity as the heat conductor 20 or the work W, or a member having a higher thermal conductivity than the heat conductor 20 or the work W, the heat applied from the heat conductor 20 to the work W will be released from the temperature control block 61 without sufficiently diffusing within the work W, and the thermal conduction performance such as the thermal resistance value and thermal conductivity of the work W cannot be appropriately measured. On the other hand, by configuring the temperature control block 61 with a member having a lower thermal conductivity than the heat conductor 20 or the work W, the heat input from the heat conductor 20 to the work W can be appropriately diffused within the work W, and the thermal conduction performance of the work W can be appropriately measured. In particular, when the work W is an article with a relatively thin thickness like a heat pipe, if the vertical thermal conductivity of the temperature control block 61 is high and the heat applied to the work W does not diffuse within the work W, it is difficult to evaluate the thermal conduction performance in the horizontal direction of the work W. However, in this embodiment, since heat can be diffused within the work W, the thermal conduction performance in the horizontal direction of the work W can also be appropriately evaluated.

[0073] However, if the thermal conductivity of the temperature control block 61 is too low, it becomes difficult to cool the temperature control block 61, and there is a risk that it will take a long time to reach the target temperature of the work W. Also, the amount of heat generated in the heat conductor 20 may not be released from the temperature control block 61 and may accumulate in the heat conductor 20, causing the heat conductor 20 and the heater 10 to overheat. Therefore, the difference in thermal conductivity between the heat conductor 20 or the work W and the temperature control block 61 is preferably 300 W / (m·k) or less, and more preferably 200 W / (m·k) or less. From another perspective, the thermal conductivity of the temperature control block 61 is preferably 100 W / (m·k) or more, and more preferably 200 W / (m·k) or more, within a range lower than the thermal conductivity of the heat conductor 20 or the work W.

[0074] As described above, in the thermal conductivity performance measuring device 1 according to the third embodiment, since the temperature control block 61 is composed of a member having a lower thermal conductivity than the heat conductor 20 (heat dissipation part 22) and the work W, the heat input from the heat conductor 20 to the work W can be appropriately diffused within the work W, and the thermal conductivity performance of the work W can be measured more appropriately. In the above-described embodiment, in the thermal conductivity performance measuring device 1, the configuration in which the temperature control block 61 is composed of a member having a lower thermal conductivity than the heat conductor 20 and the work W is illustrated, but the present invention is not limited to this configuration. For example, in the heat treatment device 1a according to the second embodiment, the mounting table 81 can also be composed of a member having a lower thermal conductivity than the heat conductor 20 and the work W.

[0075] 《Fourth Embodiment》 Next, a fourth embodiment of the present invention will be described. As shown in FIG. 12, in the thermal conductivity performance measuring device 1b according to the fourth embodiment, a groove 618 is formed on the upper surface 611 of the temperature control block 61a, and a pair of thermocouples 72 are respectively installed in a region A divided by the groove 618, and the pair of thermocouples 72 are arranged apart in the vertical direction (arranged at different positions in the vertical direction). Note that FIG. 12 is a diagram for explaining the temperature control block 61a according to the fourth embodiment.

[0076] Specifically, in the temperature control block 61a according to this embodiment, one or more grooves 618 are formed on its upper surface 611. The depth of the groove 618 is not particularly limited. However, as shown in FIG. 12, the depth is such that a pair of thermocouples 72 can be installed with a vertical shift in the region A below the upper surface 611 partitioned by the groove 618. For example, the groove 618 can be made to have the same depth as the thickness of the temperature control block 61a, that is, a groove that separates the temperature control block 61a into a plurality of blocks for each region A. Also, the width of the groove 618 is not particularly limited and can be, for example, 0.1 mm to several centimeters, preferably 1 mm to several millimeters. Furthermore, the number of grooves 618 is not particularly limited. For example, a configuration can be adopted in which only one groove 618 is formed, or a configuration can be adopted in which a plurality of grooves 618 are formed every several millimeters to several tens of centimeters. Also, when a plurality of grooves 618 are formed, the plurality of grooves 618 can be arranged in only one direction, or the plurality of grooves 618 can be arranged in two or more directions (two-dimensionally). Furthermore, as shown in FIG. 13(A), a configuration in which a plurality of grooves 618 are formed in a ladder shape may be adopted, or as shown in FIG. 13(B), a configuration in which a plurality of grooves 618 are arranged concentrically may be adopted, or as shown in FIG. 13(C), a configuration in which a plurality of linear grooves 618 are arranged orthogonally may be adopted. Note that FIG. 13 is a diagram showing an example of the arrangement of the grooves 618 formed in the temperature control block 61a according to the fourth embodiment.

[0077] Further, in the present embodiment, the thermal conductivity characteristics of the work W are obtained based on the temperatures measured by the pair of thermocouples 72 in each region A. In order to accurately obtain the thermal conductivity characteristics of the work W, it is preferable that the arrangement positions of the pair of thermocouples 72 in the vertical direction are the same in each region A. Also, the pair of thermocouples 72 installed in the same region A are preferably provided at substantially the same distance in the horizontal direction from the center of the temperature control block 61a. Here, FIGS. 14(A) to (C) are diagrams for explaining the horizontal arrangement of the pair of thermocouples 72 in the temperature control block 61a according to the present embodiment, and are views of the temperature control block 61a shown in FIGS. 13(A) to (C) as seen from above. In FIGS. 14(A) to (C), the pair of thermocouples 72 arranged in each temperature control block 61a are illustrated, and the center O of the temperature control block 61a is also illustrated. In the present embodiment, since the position of the temperature control block 61a is adjusted so that the center O of the temperature control block 61a coincides with the center position of the heat radiation part 22, the center O of the temperature control block 61a can also be referred to as the center position of the heat radiation part 22 which is the heat source. As shown in FIGS. 14(A) to (C), the pair of thermocouples 72 installed in each region A are preferably provided at substantially the same distance in the horizontal direction from the center O (center position of the heat source) of the temperature control block 61a. In other words, the pair of thermocouples 72 installed in each region A are preferably provided at positions that are substantially concentric with the center O (center position of the heat source) of the temperature control block 61a in the horizontal direction. Since the heat input from the heat radiation part 22 spreads radially from the center O of the temperature control block 61a in the temperature control block 61a, by providing the pair of thermocouples 72 installed in each region A at substantially the same distance in the horizontal direction from the center O (center position of the heat source) of the temperature control block 61a, the heat transferred to each region A can be appropriately measured, and the thermal conductivity characteristics of the work W can be accurately obtained.

[0078] By forming the groove 618, the air present in the groove 618 serves as a heat insulating material, making it difficult for heat to be transferred between adjacent regions A. As shown in FIG. 12, each thermocouple 72 can mainly measure the heat transferred vertically from the work W to each region A. In FIG. 12, the heat transferred from the work W to the temperature control block 61a is indicated by black arrows, and the magnitude of the heat quantity is represented by the thickness of the arrows. In this embodiment, the groove 618 is configured to be insulated with air without filling anything, but the groove 618 can be filled with a heat insulating member such as a resin having high heat insulation (low thermal conductivity). Also in this case, it is possible to prevent heat from being transferred between adjacent regions A.

[0079] In this way, by preventing heat from being transferred between adjacent regions A, it becomes possible to measure the thermal resistance value of the work W with high accuracy in a form that does not include the thermal resistance of the temperature control block 61a. Hereinafter, the details of the effects when the groove 618 is formed in the temperature control block 61a according to this embodiment will be described.

[0080] FIG. 15 is an example of a simple equivalent circuit model of the temperature control block 61 without a groove. In the example shown in FIG. 15, a scene where TIM is applied to the upper and lower surfaces of the work W to measure the thermal resistance value is illustrated. In this embodiment, as shown in the above formula (1), the heat conduction characteristics of the work W are calculated based on the temperature T1 measured by the thermocouple 71 of the heat dissipation part 22 and the temperature T2 measured by the thermocouple 72 of the temperature control block 61. As shown in FIG. 15, the path through which the heat input from the heat dissipation part 22 is transferred from the thermocouple 71 to the thermocouples 721 and 723 can be represented as paths Q1 and Q2 when simplified. In this case, the thermal resistance value from the thermocouple 71 to the thermocouples 721 and 723 can be represented by the combination of the thermal resistance value R1 in the path Q1 and the thermal resistance value R2 in the path Q2.

[0081] Here, FIG. 16 is a diagram for explaining the thermal resistance between the thermocouple 71 and the thermocouples 711 and 723 when the groove 618 is not formed in the temperature control block 61. In FIG. 16, Rz Wis the thermal resistance value of the work W in the vertical direction, Rz TIM is the thermal resistance value of the TIM in the vertical direction. Also, Rr W is the thermal resistance value of the work W in the horizontal direction, Rr B is the thermal resistance value of the temperature control block 61 in the horizontal direction. As shown in FIG. 16, the thermal resistance value R1 in the path Q1 is Rz W +Rz TIM +Rr B and can be expressed as. Also, the thermal resistance value R2 in the path Q2 is Rr W +Rz W +Rz TIM and can be expressed as. And the thermal resistance value R c from the thermocouple 71 to the thermocouples 721 and 723 can be expressed by the following formula (2) as the combined value of the thermal resistance value R1 of the path Q1 and the thermal resistance value R2 of the path Q2. 1 / R c =1 / R1 + 1 / R2 ··· (2)

[0082] Thus, the thermal resistance value R c from the thermocouple 71 to the thermocouples 721 and 723 includes the thermal resistance value R1 of the path Q1. The thermal resistance value R1 of the path Q1 is Rz W +Rz TIM +Rr B and can be expressed as, and includes the thermal resistance value Rr B in the horizontal direction of the temperature control block 61. Therefore, when the material of the temperature control block 61 changes, the thermal resistance value Rr B in the horizontal direction of the temperature control block 61 also changes according to the thermal conductivity of the material, and there is a possibility that the thermal conduction characteristics of the work W cannot be measured with high accuracy.

[0083] On the other hand, in the temperature control block 61a according to the present embodiment, by forming the groove 618 on the upper surface 611, the thermal resistance value Rr BThe thermal resistance value of the work W can be measured in a form that does not include it. Here, FIG. 17 is a diagram for explaining the thermal resistance between the thermocouple 71 and the thermocouples 711 and 723 when the groove 618 is formed in the temperature control block 61a. As shown in FIG. 17, when the groove 618 is formed on the surface 611 of the temperature control block 61a, the thermal resistance value R c in the path from the thermocouple 71 to the thermocouples 721 and 723 can be represented by the thermal resistance value R2 in the path Q2. The thermal resistance value R2 in the path Q2 can be expressed as Rr W +Rz W +Rz TIM and does not include the thermal resistance value of the temperature control block 61a. Note that also for the thermocouple 722, the thermal resistance value R c in the path from the thermocouple 71 to the thermocouple 722 can be represented by the thermal resistance value R3 in the path Q3, and since the thermal resistance value R3 can be expressed as Rz W +Rz TIM it can be made a component that does not include the thermal resistance value of the temperature control block 61a, similar to the thermal resistance value R2 in the path Q2.

[0084] Thus, in this embodiment, by forming the groove 618 on the upper surface 611 of the temperature control block 61a, the thermal resistance value Rr B in the horizontal direction of the temperature control block 61 can be excluded, and the thermal resistance value of the work W can be obtained, so that the thermal conductivity of the work W can be measured with high precision.

[0085] Also, in this embodiment, as shown in FIG. 12, a pair of thermocouples 72 are arranged vertically separated in each region A divided by the groove 618. By arranging the pair of thermocouples 72 vertically separated, the amount of heat input to the region A can be calculated from the difference in the temperatures measured by this pair of thermocouples 72, and based on this, the thermal conduction characteristics such as the thermal resistance value and thermal conductivity of the work W can be appropriately measured. That is, also in this embodiment, as shown in the above formula (1), the temperature T1 of the heat dissipation surface 25, the temperature T2 of the upper surface of the temperature control block 61, and the amount of heat input Q In (for example, 1000 W / cm 2Based on this, the thermal resistance value R of the workpiece W W can be calculated. Instead of this, or in addition to this, from the temperature difference between a pair of thermocouples 72 arranged vertically apart in the region A, the heat input amount Q to the temperature control block 61a B can be calculated. Therefore, using this heat input amount Q B to calculate the thermal resistance value R of the workpiece W W can more appropriately measure the thermal resistance value R of the workpiece W W

Example

[0086]

Table 1

[0087] ​From this, it was found that when the groove 618 is not formed on the upper surface 611 of the temperature control block 61, even for the same sample, depending on the material of the temperature control block 61, the measurement results of heat conduction characteristics such as the thermal resistance value and the thermal conductivity change. In particular, as shown in Table 1 above, the lower the thermal conductivity of the material, the higher the thermal resistance value of the measurement result, and it is presumed that the material of the temperature control block 61 (difference in thermal conductivity) affects the measurement result.

[0088] Next, in order to verify whether the reason for the change in the measurement result of the thermal resistance value even for the same sample when the material of the temperature control block 61 is changed is due to the thermal resistance of the temperature control block 61, the thermal resistance between the work W and the temperature control block 61 was modeled by a simple equivalent circuit model, and it was verified whether the measurement results in Table 1 above could be derived from the model.

[0089] Specifically, in the simple equivalent circuit model shown in FIG. 16, the thermal resistance value R in the path from the thermocouple 71 to the thermocouples 721 and 723 c was simulated to be 0.436 °C / W for the stainless steel temperature control block 61, 0.259 °C / W for the aluminum temperature control block 61, and 0.206 °C / W for the copper temperature control block 61 as shown in Table 1 above when the material of the temperature control block 61 was stainless steel alloy (SUS303), aluminum alloy (A502), or copper (C1020). Here, as described above, in the model shown in FIG. 16, the thermal resistance value R in the path from the thermocouple 71 to the thermocouples 721 and 723 c can be expressed as the paths Q1 and Q2, and the thermal resistance value R from the thermocouple 71 to the thermocouples 721 and 723 c can be expressed as the combination of the thermal resistance value R1 in the path Q1 and the thermal resistance value R2 in the path Q2.

[0090] Also, the thermal resistance value R2 in the path of the path Q2 is the horizontal thermal resistance value Rr of the work W W , the vertical thermal resistance value Rz of the work W W and the vertical thermal resistance value Rz of the TIM TIMIt consists of , and since it does not include the thermal resistance of the temperature control block 61, it should be constant regardless of the material of the temperature control block 61. Therefore, in this simulation, the thermal resistance value R2 was assumed to be 0.5 °C / W. Also, from the relationship of the above formula (2), the thermal resistance value R1 for each material was obtained. That is, the thermal resistance value R c from the thermocouple 71 to the thermocouples 721 and 723 is the combination of the thermal resistance value R1 in the path Q1 and the thermal resistance value R2 in the path Q2, and 1 / R c = 1 / R1 + 1 / R2. Therefore, for example, when the material of the temperature control block 61 is stainless steel alloy (SUS303), it can be expressed by the relationship of 1 / 0.436 = 1 / R1 + 1 / 0.5, and the thermal resistance value R1 can be obtained as 3.4 °C / W. Similarly, for the aluminum temperature control block 61, the thermal resistance value R1 is 0.54 °C / W, and for the copper temperature control block 61, the thermal resistance value R1 is 0.35 °C / W.

[0091] As shown in Fig. 16, the thermal resistance value R1 is Rz W + Rz TIM + Rr B and can be expressed as such. In addition to the thermal resistance value Rr B in the horizontal direction of the temperature control block 61, it includes the thermal resistance value Rz W in the vertical direction of the work W and the thermal resistance value Rz TIM in the vertical direction of the TIM. However, the higher the thermal resistance value R1 is for stainless steel alloys with low thermal conductivity, and the lower the thermal resistance value R1 is for copper with high thermal conductivity. Therefore, it is confirmed that the assumption that the thermal conductivity of the material of the temperature control block 61 affects the measurement results of the thermal conduction characteristics of the work W is correct when no groove is formed on the upper surface 611.

[0092] Thus, when no groove is formed on the upper surface 611, the thermal resistance of the material of the temperature control block 61 may be added to the heat conduction characteristics of the work W. Therefore, in order to measure the heat conduction characteristics of the work W more precisely, it is understood that it is desirable to configure the temperature control block 61 such that the thermal conductivity characteristics of the material of the temperature control block 61 are not added. In the present embodiment, by forming the groove 618 on the upper surface 611 of the temperature control block 61a, the influence of the thermal resistance of the material of the temperature control block 61a can be suppressed, and the heat conduction characteristics of the work W can be measured more precisely. In particular, in the present embodiment, by making the depth of the groove 618 deeper than the position where the pair of thermocouples 72 are arranged, the heat conduction between adjacent regions A can be further suppressed, and the thermal resistance component of the temperature control block 61a can be appropriately excluded from the thermal resistance of the work W calculated based on the measurement results of the pair of thermocouples 72.

[0093] Also, in the fourth embodiment, by arranging the pair of thermocouples 72 in the vertical direction at a distance from each other in the temperature control block 61, in the pair of thermocouples 72, the amount of heat input to the temperature control block 61 can be measured, and the heat conduction performance of the work W, such as the thermal resistance value of the work W, can also be measured with higher precision. Furthermore, by measuring and comparing the thermal resistance values in each region A, it is also possible to grasp the characteristics of how heat diffuses in the work W.

[0094] In the fourth embodiment, the temperature control block 61 is configured to have the groove 618. For example, a groove may be provided on the upper surface 811 of the mounting table 81 according to the second embodiment, and the thermocouples 72 installed on the mounting table 81 may be arranged at a distance from each other in the vertical direction.

[0095] As described above, the preferred embodiments of the present invention have been described. However, the technical scope of the present invention is not limited to the description of the above embodiments. Various changes and improvements can be made to the above embodiments, and those in the form with such changes or improvements are also included in the technical scope of the present invention.

[0096] For example, in the above-described embodiment, a connecting device having a plurality of shafts around the heater 10 was exemplified, but the present invention is not limited to this configuration. Instead, the configuration may be such that a single shaft is provided at the center of the upper surface of the heat conductor 20, or a donut-shaped or annular connecting member may be provided instead of the shaft.

[0097] Also, in the above-described embodiment, a configuration in which the temperature control unit 60 is disposed below the heating unit 2 was exemplified. However, a configuration in which the temperature control unit 60 is disposed above the heating unit 2 may be adopted, or a configuration in which the temperature control unit 60 is disposed on the side of the heating unit 2 may be adopted.

[0098] Furthermore, in the above-described embodiment, a configuration in which the heat convergence portion 24 of the heat conductor 20 has a tapered structure was exemplified. However, the heat convergence portion 24 is not limited to a tapered shape as long as it becomes thinner in the direction away from the heat receiving portion 23. For example, as shown in FIG. 18(A), a configuration in which a part of the heat convergence portion 24a has a cylindrical shape (a configuration in which a part extends vertically) can be adopted, or as shown in FIG. 18(B), a configuration in which the heat convergence portion 24b has a step can be adopted. Note that FIGS. 18(A) and 18(B) are schematic side views showing other embodiments of the heat conductor 20.

[0099] In addition, in the above-described fourth embodiment, as shown in FIG. 12, a configuration in which a pair of thermocouples 72 are respectively installed in each region A divided by the groove 618 was exemplified. However, the present invention is not limited to this configuration. For example, a configuration in which a pair of thermocouples 72 are arranged only in a part of the region A may be adopted. Also, in the fourth embodiment, a configuration in which a pair of thermocouples 72 are arranged in the region A was exemplified. However, the present invention is not limited to this configuration. For example, a configuration in which three or more thermocouples 72 are arranged in the region A can be adopted.

[0100] Furthermore, in the above-described fourth embodiment, an example is given in which the depth of the groove 618 is made deeper than the position where the pair of thermocouples 72 are arranged. However, the present invention is not limited to this configuration, and the depth of the groove 618 may be made shallower than the position where the pair of thermocouples 72 are arranged. Also in this case, heat conduction between adjacent regions A can be suppressed, and the thermal resistance component of the temperature control block 61a can be excluded from the thermal resistance of the work W. However, it is preferable to configure the groove 618 to be deeper than the position where the pair of thermocouples 72 are arranged because the thermal resistance component of the temperature control block 61a can be appropriately excluded and the thermal conduction characteristics of the work W can be measured with higher accuracy.

Explanation of Signs

[0101] 1, 1b... Thermal conduction performance measuring device 2... Heating section (heating device) 10... Heater 20... Heat conductor 21... Heat receiving member 22... Heat radiating section 23... Heat receiving section 23a... Heat receiving surface 24... Heat convergence section 25... Heat radiating surface 26... Fixing section 30... Heat insulating section 40... Connecting device 41... Shaft 50... Driving section (driving device) 60... Temperature control section (temperature control device) 61, 61a... Temperature control block 611... Upper surface 612... TIM flow path 613... TIM discharge hole 614... TIM supply hole 615... Air flow path 616... Air blow hole 617... Air supply hole 618... Groove 62... Heat spreader 63... Heating and cooling device 64... Cooling device 65... TIM pump 651... Tube 66... Air pump 661… Tube 67… Refrigerant circulation device (chiller) 70… Control unit 71~73… Thermocouple 1a… Heat treatment device 81… Mounting table 811… Mounting surface 812… Liquid flow path 813… Liquid discharge hole 814… Liquid supply hole 815… Gas flow path 816… Gas blowing hole 817… Gas supply hole

Claims

1. A mounting surface on which a workpiece is placed; A measurement unit for measuring a temperature of the workpiece or the placement surface; A heating mechanism for heating the mounting surface; A cooling mechanism for cooling the mounting surface; a control unit for controlling the operation of the heating mechanism and the cooling mechanism, the heating mechanism and the cooling mechanism are both disposed below the placement surface, The control unit heats the placement surface using the heating mechanism until the measured temperature of the measurement unit becomes a first temperature, and cools the work using the cooling mechanism when the measured temperature of the measurement unit becomes equal to or higher than a second temperature that is higher than the first temperature.

2. The temperature adjustment device according to claim 1 , wherein the cooling mechanism comprises: a cooling block provided with a circulation flow path for a cooling liquid; and a circulator that circulates the cooling liquid.

3. The temperature adjustment device according to claim 1 , wherein the heating mechanism comprises a Peltier element.

4. The heating mechanism is disposed below the mounting surface, The temperature adjustment device according to claim 1 , wherein the cooling mechanism is disposed below the heating mechanism.

5. the heating mechanism is a Peltier element, The temperature adjustment device according to claim 1 , wherein the control unit causes the Peltier element to function as a temperature adjustment mechanism that cools the workpiece when the placement surface is cooled.

6. The temperature control device according to claim 1 , wherein one or more grooves are formed on the mounting surface.

7. A temperature control device according to any one of claims 1 to 6, A heating device that is provided opposite the temperature control device and heats the workpiece; a drive device for adjusting the distance between the heating device and the temperature adjustment device; The temperature adjustment device adjusts the temperature of the workpiece before the heating device heats the workpiece.

8. A control device for controlling the operation of the temperature control device and the heating device, The heat treatment device according to claim 7 , wherein the control device repeats a process of simultaneously heating the workpiece with the temperature adjustment device and the heating device, and a process of heating the workpiece with the heating device while cooling the workpiece with the temperature adjustment device.

9. The heating device has a contact portion that contacts the workpiece and transfers heat to the workpiece, The heat treatment device according to claim 7 , wherein the temperature adjustment device is made of a material having a lower thermal conductivity than the contact portion.

10. The heat treatment device according to claim 7 ; A heat radiation surface temperature measuring device for measuring the temperature of a heat radiation surface where the heating device contacts the workpiece or the temperature of the workpiece; a calculation device that calculates the thermal conductivity performance of the workpiece based on the measured temperature of the placement surface or the workpiece measured by the temperature control device and the measured temperature of the heat dissipation surface or the workpiece measured by the heat dissipation surface temperature measuring device.

11. A heat treatment method for heating a workpiece using a heating device that heats a first surface of the workpiece and a temperature control device that heats or cools a second surface of the workpiece, comprising: A preheating process of heating a second surface of the workpiece by the temperature control device; A main heating process in which a first surface of the workpiece is heated by the heating device while a second surface of the workpiece is heated or cooled by the temperature control device, A heat treatment method, in which, in the main heating step, the second surface is heated by the temperature control device until the temperature of the second surface reaches a first set temperature, and when the temperature of the second surface reaches or exceeds a second temperature that is higher than the first set temperature, the second surface is cooled by the temperature control device.

12. A heat treatment method for heating a workpiece using a heating device that heats a first surface of the workpiece and a temperature control device that heats or cools a second surface of the workpiece, comprising: A step of heating a second surface of the workpiece with the temperature control device while heating a first surface of the workpiece with the heating device; a step of heating a first surface of the workpiece with the heating device while cooling a second surface of the workpiece with the temperature adjustment device is repeated.

13. 13. The heat treatment method according to claim 11, wherein, when the first surface and the second surface are heated, a higher amount of heat is applied to the second surface than to the first surface.

Images