Tape peeling device

Abstract

To provide a tape peeling device capable of peeling a transfer source adhesion tape without using a peeling tape.SOLUTION: A tape peeling device 1 is a tape peeling device in which a first adhesion tape is peeled from a workpiece and a first ring frame after a second adhesion tape is bonded to the workpiece at the time of a transfer step of mounting a plane-like workpiece mounted on the first ring frame via the first adhesion tape on a second ring frame via the second adhesion tape. The tape peeling device comprises: an insertion device 30 that inserts an insertion member 31 to between the first ring frame and the first adhesion tape, and peels a part of the first adhesion tape from the first ring frame; a clamp device 40 that can be moved along a surface of the workpiece while nipping the peeled portion of the first adhesion tape; and a depression device 50 that can be moved along the surface of the workpiece while depressing the first adhesion tape.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to a tape peeling device.

Background Art

[0002] In the manufacturing process of semiconductor devices, so-called transfer may be performed in which a semiconductor wafer mounted on a ring frame via an adhesive tape is mounted on another ring frame via another adhesive tape.

[0003] For example, when the semiconductor wafer is diced and the front and back of the chip are inverted, or when the pattern formation surface is attached to and mounted on a dicing tape and the front and back of the chip are inverted at the time of die bonding. Therefore, in the transfer, after the semiconductor wafer is mounted on the transfer destination ring frame, the adhesive tape of the transfer source is peeled off from the semiconductor wafer.

[0004] In addition, there is also a form in which the transfer is performed via a single ring frame. In this case, after attaching a transfer destination adhesive tape to the surface of the semiconductor wafer mounted on the ring frame via the transfer source adhesive tape to which the transfer destination adhesive tape is not attached, the transfer source adhesive tape is peeled off from the semiconductor wafer.

[0005] When peeling the adhesive tape of the transfer source, mainly, the tape of the transfer source is peeled off from the semiconductor wafer and the transfer source ring frame using a peeling tape (for example, Patent Document 1).

Prior Art Documents

Patent Documents

[0006]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0007] The peeling tape is discarded together with the original transfer adhesive tape after use. This is one of the reasons for the high manufacturing cost of semiconductor devices and also leads to an increase in waste.

[0008] The present invention has been made in view of the above matters, and an object thereof is to provide a tape peeling device capable of peeling the original transfer adhesive tape without using a peeling tape.

Means for Solving the Problems

[0009] The tape peeling device according to the first aspect of the present invention is In the transfer process of mounting a flat workpiece mounted on a first ring frame via a first adhesive tape on a second ring frame via a second adhesive tape, after the second adhesive tape is attached to the workpiece, the first adhesive tape is peeled from the workpiece and the first ring frame. A tape peeling device, An insertion device that inserts an insertion member between the first ring frame and the first adhesive tape to peel a part of the first adhesive tape from the first ring frame; A clamp device that can move along the surface of the workpiece while holding the peeled portion of the first adhesive tape; A pressing device that can move along the surface of the workpiece while pressing the first adhesive tape, and is provided with As the clamp device moves, the first adhesive tape is peeled from the workpiece and the first ring frame while being folded back at an acute angle by the pressing device. It is characterized by that.

[0010] The tape peeling device according to the second aspect of the present invention is In the transfer process of mounting a flat workpiece mounted on a ring frame via a first adhesive tape on the ring frame via a second adhesive tape, after the second adhesive tape is attached to the workpiece and the ring frame, the first adhesive tape is peeled from the workpiece and the ring frame. A tape peeling device, An insertion device that inserts an insertion member between the ring frame and the first adhesive tape to peel off a part of the first adhesive tape from the ring frame; A clamp device that can move along the surface of the workpiece while holding the peeled part of the first adhesive tape; A pressing device that can move along the surface of the workpiece while pressing the first adhesive tape, and is provided with: As the clamp device moves, the first adhesive tape is peeled off from the workpiece and the ring frame while being folded back at an acute angle by the pressing device. It is characterized by this.

[0011] Further, it is preferable that the pressing device is driven by the force with which the first adhesive tape is pulled as the clamp device moves.

Effect of the Invention

[0012] According to the present invention, it is possible to provide a tape peeling device that can peel the transfer source adhesive tape without using a peeling tape.

Brief Description of the Drawings

[0013]

Figure 1

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Embodiments for Carrying Out the Invention

[0014] The tape peeling device according to the present embodiment will be described with reference to the drawings. The tape peeling device is used in a transfer process of mounting a flat workpiece such as a semiconductor wafer or a chip mounted on a transfer source ring frame via a transfer source adhesive tape onto a transfer destination ring frame via a transfer destination adhesive tape. Specifically, as shown in FIG. 1(A), the tape peeling device is used to peel the transfer source adhesive tape TA1 from the workpiece W and the transfer source ring frame RF1 from the state where the transfer destination adhesive tape TA2 is attached to the workpiece W as shown in FIG. 1(B).

[0015] In this specification, the state shown in FIG. 1(A), that is, the state where the transfer source adhesive tape TA1 and the transfer destination adhesive tape TA2 are respectively adhered to both sides of the workpiece W and fixed to the transfer source ring frame RF1 and the transfer destination ring frame RF2 is referred to as the object to be processed Op.

[0016] As shown in FIGS. 2 to 5, the tape peeling device 1 includes a base 10, a mounting stage 20, an insertion device 30, a clamping device 40, a pressing device 50, and a control device (not shown).

[0017] The base 10 is a base on which the mounting stage 20, the insertion device 30, the clamping device 40, the pressing device 50, etc. are arranged.

[0018] The placement stage 20 is a stage on which the object to be processed Op is placed. On the placement stage 20, a frame 21 corresponding to the shape of the object to be processed Op, specifically, the shapes of the transfer source ring frame RF1 and the transfer destination ring frame RF2, is erected. Further, intake holes 22 are formed in the placement stage 20, and the intake holes 22 are connected to a decompression device (not shown) such as a pump. By decompression through the intake holes 22 and the frame 21, it is possible to suppress the displacement of the object to be processed Op placed on the placement stage 20 during the peeling operation of the transfer source adhesive tape TA1. In addition to the frame 21 and the intake holes 22, any configuration may be used as long as it can suppress the displacement of the object to be processed Op.

[0019] The insertion device 30 includes an insertion member 31. The insertion device 30 is movable in the X direction and the Z direction by a drive source such as a motor (not shown). The insertion member 31 is a thin flat plate member extending in the X direction. The tip of the insertion member 31 is curved convexly. Further, the insertion member 31 is installed so that the tip extends slightly downward. By moving, the insertion device 30 inserts the insertion member 31 between the transfer source ring frame RF1 and the transfer source adhesive tape TA1, and peels off a part of the transfer source adhesive tape TA1 adhered to the transfer source ring frame RF1. The insertion member 31 is formed of a material having a strength such that it does not distort during partial peeling of the transfer source adhesive tape TA1, such as a metal such as aluminum or a hard resin.

[0020] The clamping device 40 clamps the peeled portion of the transfer source adhesive tape TA1 peeled by the insertion device 30. The clamping device 40 includes a slider 41, a lifting device 42, a clamp fixing portion 43, and a clamp rotating portion 44.

[0021] The slider 41 is arranged on both sides of the base 10 and includes a moving mechanism for moving the clamping device 40 in the X direction. The clamping device 40 straddles the mounting stage 20 and is supported so as to be spanned across both sliders 40, and is configured to be movable in the X direction by the slider 41. The slider 41 may have any configuration as long as it can move the clamping device 40 in the X direction. For example, a configuration including a drive source such as an air cylinder, a hydraulic cylinder, a motor, and a transmission member such as a gear can be cited.

[0022] The lifting device 42 is installed at the central portion of the U-shaped clamping device 40 so as to extend toward the mounting stage side. The clamp fixing portion 43 is connected to the clamping device 40 via the lifting device 42. The lifting device 42 may have any configuration as long as it can move the clamp fixing portion 43 up and down. For example, a configuration including a drive source such as an air cylinder, a hydraulic cylinder, a motor, and a transmission member such as a gear can be cited.

[0023] The clamp rotating portion 44 is rotatably arranged on the clamp fixing portion 43. The clamp rotating portion 44 rotates about the Y direction axis. By rotating the clamp rotating portion 44, the transfer source adhesive tape TA1 can be clamped or released by the clamp fixing portion 43 and the clamp rotating portion 44. The central portions of the clamp fixing portion 43 and the clamp rotating portion 44 are notched so that the insertion member 31 does not interfere.

[0024] The pressing device 50 moves while pressing the object to be processed Op from above during the peeling operation of the transfer source adhesive tape TA1, and realizes smooth and clean peeling of the transfer source adhesive tape TA1. The pressing device 50 is supported so as to be spanned across sliders 52 installed on both sides of the base 10. The slider 52 is provided with a mechanism movable in the X-axis direction, and the pressing device 50 is movable in the X direction by the slider 52.

[0025] The pressing device 50 is provided with a pressing member 51 rotatably installed. The pressing member 51 rotates about the Y direction as the axis. By rotating the pressing member 51, it can contact the object to be processed Op and press the object to be processed Op from above or release it.

[0026] The moving mechanism of the slider 52 is configured to move following the force with which the clamping device 40 pulls the original transfer adhesive tape TA1 when peeling the original transfer adhesive tape TA1. An air cylinder can be cited as such a moving mechanism. When peeling the original transfer adhesive tape TA1, by releasing the air inside the internal air cylinder, the pressing device 50 will move following an external force. Note that, to achieve the same purpose, it is not limited to only an air cylinder.

[0027] The control device controls the operations of the insertion device 30, the clamping device 40, and the pressing device 50.

[0028] Subsequently, the operation of the tape peeling device 1 will be described with reference to FIGS. 6 to 13. Note that, in FIGS. 6 to 13, for the sake of easier explanation, the configuration is shown in a simplified manner. First, as shown in FIG. 6, the object to be processed Op is placed on the placement stage 20. After the object to be processed Op is placed on the placement stage 20, air is inhaled through the intake holes 22, and the object to be processed Op adheres closely to the placement stage 20, suppressing subsequent displacement.

[0029] Next, as shown in FIG. 7, the pressing device 50 moves toward the insertion device 30. Then, the pressing member 51 rotates counterclockwise on the paper surface to press the object to be processed Op.

[0030] After that, the insertion device 30 moves. The tip of the insertion member 31 contacts the surface of the original transfer ring frame RF1, and the insertion device 30 moves toward the original transfer adhesive tape TA1 by sliding on the surface of the original transfer ring frame RF1.

[0031] As shown in FIG. 8, subsequently, as the insertion device 30 continues to move leftward on the paper surface, the insertion member 31 enters between the transfer source ring frame RF1 and the transfer source adhesive tape TA1, and the edge of the transfer source adhesive tape TA1 is peeled off. After peeling off a predetermined amount of the transfer source adhesive tape TA1, the insertion device 30 stops moving.

[0032] Subsequently, as shown in FIG. 9, the clamp rotating portion 44 rotates, and the peeled portion of the transfer source adhesive tape TA1 is clamped by the clamp fixing portion 43 and the clamp rotating portion 44.

[0033] Then, as shown in FIG. 10, while the clamp fixing portion 43 and the clamp rotating portion 44 hold the transfer source adhesive tape TA1, they move in the Z direction and the X direction to take up the slack of the transfer source adhesive tape TA1.

[0034] As shown in FIG. 11, further, the clamp fixing portion 43 and the clamp rotating portion 44 move in the X direction, and the transfer source adhesive tape TA1 is folded back at an acute angle at the tip of the pressing member 51.

[0035] Then, as shown in FIG. 12, as the clamp fixing portion 43 and the clamp rotating portion 44 move, the transfer source adhesive tape TA1 is peeled off while being folded back at an acute angle by the pressing member 51. As described above, since the pressing device 50 also moves in the X direction while being driven by the force of pulling the transfer source adhesive tape TA1 while the clamp fixing portion 43 and the clamp rotating portion 44 move in the X direction, the transfer source adhesive tape TA1 is sequentially peeled off from the workpiece W and the transfer source ring frame RF1.

[0036] Then, as shown in FIG. 13, the original transfer adhesive tape TA1 is peeled off. Next, the clamping of the clamp fixing portion 43 and the clamp rotating portion 44 is released, and the peeled original transfer adhesive tape TA1 is collected in a collection box (not shown) or the like. After that, the insertion device 30, the clamp device 40, and the pressing device 50 return to their original positions, the original transfer ring frame RF1 is removed from the mounting stage 10, and the transfer destination ring frame RF2 with the workpiece W mounted thereon is removed from the mounting stage 20. Then, a new workpiece Op is placed on the mounting stage 20, and the above operation is repeated.

[0037] As described above, in the tape peeling device 1, the original transfer adhesive tape TA1 is peeled off without using a peeling tape. Therefore, the manufacturing cost required when using a peeling tape can be reduced, and the discharge of waste can also be suppressed.

[0038] The present invention can be implemented in various embodiments and modifications without departing from the broad spirit and scope of the present invention. Further, the above-described embodiments are for explaining the present invention and do not limit the scope of the present invention. For example, in the above, the insertion device 30 and the clamp device 40 are described as separate devices, but a form in which the insertion device 30 is incorporated in the clamp device 40 may also be possible.

[0039] Further, in the above, a form in which the workpiece W is transferred from the original transfer ring frame RF1 to the transfer destination ring frame RF2 has been described, but the tape peeling device 1 can also be applied to a workpiece Op using only one ring frame. Specifically, as shown in FIG. 14(A), even for a workpiece Op in which the original transfer adhesive tape TA1 and the transfer destination adhesive tape TA2 are respectively attached to both surfaces of the ring frame RF and the workpiece W, the tape peeling device 1 can peel off the original transfer adhesive tape TA1 by the same operation as above and bring it into the state shown in FIG. 14(B).

Explanation of Reference Numerals

[0040] 1 Sheet peeling device 10 Base 20 Mounting stage 21 Frame 22 Air inlet hole 30 Insertion device 31 Insertion member 40 Clamping device 41 Slider 42 Lifting device 43 Clamping fixed part 44 Clamping rotating part 50 Pressing device 51 Pressing member 52 Slider Op Workpiece to be processed RF Ring frame RF1 Source transfer ring frame RF2 Destination transfer ring frame TA1 Source adhesive tape TA2 Destination adhesive tape W Workpiece

Claims

1. A tape peeling device for peeling a first adhesive tape from a work and a first ring frame after a second adhesive tape is attached to the work during a transfer process of mounting a flat work mounted on a first ring frame via the first adhesive tape to a second ring frame via the second adhesive tape, comprising: An insertion device for inserting an insertion member between the first ring frame and the first adhesive tape to peel a part of the first adhesive tape from the first ring frame; A clamp device movable along the surface of the work while clamping the peeled portion of the first adhesive tape; A pressing device movable along the surface of the work while pressing the first adhesive tape, and The first adhesive tape is peeled from the work and the first ring frame while being folded back at an acute angle by the pressing device as the clamp device moves. A tape peeling device characterized by the above.

2. A tape peeling device for peeling a first adhesive tape from a work and a ring frame after a second adhesive tape is attached to the work and the ring frame during a transfer process of mounting a flat work mounted on a ring frame via the first adhesive tape to the ring frame via the second adhesive tape, comprising: An insertion device for inserting an insertion member between the ring frame and the first adhesive tape to peel a part of the first adhesive tape from the ring frame; A clamp device movable along the surface of the work while clamping the peeled portion of the first adhesive tape; A pressing device movable along the surface of the work while pressing the first adhesive tape, and The first adhesive tape is peeled from the work and the ring frame while being folded back at an acute angle by the pressing device as the clamp device moves. A tape peeling device characterized by the above.

3. The pressing device is driven by a force that the first adhesive tape is pulled as the clamp device moves. The tape peeling device according to claim 1 or 2, characterized by the above.

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