Self-adhesive tape and manufacturing method of electronic component using self-adhesive tape

Abstract

To provide a self-adhesive tape easily separable even in picking up an electronic component such as an MEMS having a fine and fragile beam structure.SOLUTION: A self-adhesive tape 2 includes a substrate 3 and an adhesive layer 4 laminated on one side of the substrate, and is to be used on a surface of the adhesive layer to hold an electronic component 1. By reducing an average thickness of the adhesive layer, a protrusion 7 is generated on the surface of the adhesive layer so that an adhesion area between the adhesive layer and the electronic component decreases, and thus a holding power of the electronic component by the adhesive layer lowers.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to an adhesive tape optimal for picking up electronic components and a method for manufacturing electronic components using the same.

Background Art

[0002] Conventionally, picking up electronic components held on an adhesive tape has been performed using a pickup unit incorporated in a die bonder device or the like.

[0003] Picking up an electronic component is performed by vacuum-adsorbing an adhesive tape to which the electronic component is attached with a holder, and then pushing up the back surface of the adhesive tape with a needle while sucking the electronic component with a collet and pulling it up.

[0004] For example, a method for picking up a thinned semiconductor chip (electronic component) is described in Patent Document 1.

[0005] FIG. 8 is a diagram showing the pickup method described in Patent Document 1. An adhesive sheet 102 to which a semiconductor chip 101 is attached is adsorbed to a holder 120. On the surface of the holder 120, a block 123 having a concavo-convex adsorption surface 123a is embedded. The concavo-convex adsorption surface 123a has convex portions formed at a narrow pitch so as to support the semiconductor chip 101 at multiple points.

[0006] By performing vacuum suction through a vacuum hole 123b formed in the block 123, the adhesive sheet 102 is deformed following the concavo-convex adsorption surface 123a, and the semiconductor chip 101 adheres only to the adhesive sheet 102 at the convex portions of the concavo-convex adsorption surface 123a, resulting in a decrease in adhesive force. As a result, only the adhesive force of the target semiconductor chip 101 is decreased, and it can be picked up by vacuum-adsorbing with a collet 122, so that even a thin semiconductor chip 101 can be picked up without being damaged.

Prior Art Documents

Patent Documents

[0007] [Patent Document 1] Japanese Patent Laid-Open No. 2001-196443 [Summary of the Invention] [Problems to be Solved by the Invention]

[0008] However, in the method described in Patent Document 1, since the adhesive sheet 102 has a thickness (generally 50 μm to 300 μm), even if the unevenness of the uneven adsorption surface 123a is made minute, the minimum distance between adjacent convex portions is limited to several hundred μm.

[0009] In order to facilitate the peeling of the electronic component, at least two or more convex portion supports (adhesive portions) and the concave portions (peeling portions) therebetween are required on the attachment surface on the back surface of the electronic component. However, in the case of an electronic component such as a MEMS (Micro Electro Mechanical System) having a fine and fragile beam structure with a width of several tens to several hundred μm or less, if the distance between adjacent convex portions is wide (several hundred μm or more), the beam width direction cannot be supported by two or more convex portions. Therefore, there is a problem that the beam portion is twisted following the inclination of the concave and convex portions of the adhesive sheet 102, and the beam portion is damaged.

[0010] The present invention solves the above problems, and an object thereof is to provide an adhesive tape that can be easily peeled even in the pickup of an electronic component such as a MEMS having a fine and fragile beam structure. [Means for Solving the Problems]

[0011] The adhesive tape according to the present invention includes a base material and an adhesive layer laminated on one surface of the base material, and is an adhesive tape used to hold an electronic component on the surface of the adhesive layer. By reducing the average thickness of the adhesive layer, convex portions are generated on the surface of the adhesive layer, whereby the adhesion area between the adhesive layer and the electronic component is reduced, and the holding force of the electronic component by the adhesive layer is decreased.

[0012] The method for manufacturing an electronic component according to the present invention includes a step (A) of holding the electronic component with an adhesive tape, and a step (B) of picking up the electronic component from the adhesive tape. The adhesive tape is composed of the adhesive tape according to the present invention. After step (A) and before step (B), the method further includes a step (C) of reducing the average thickness of the adhesive layer in the adhesive tape while the electronic component is held by the adhesive tape. In step (C), when the average thickness of the adhesive layer becomes thinner, convex portions are generated on the surface of the adhesive layer. As a result, the adhesion area between the adhesive layer and the electronic component decreases, and the holding force of the electronic component by the adhesive layer decreases. In step (B), the electronic component with the reduced holding force by the adhesive layer is picked up from the adhesive tape.

Effect of the Invention

[0013] According to the present invention, it is possible to provide an adhesive tape that can be easily peeled off even when picking up an electronic component such as a MEMS having a fine and fragile beam structure.

Brief Description of the Drawings

[0014]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Mode for Carrying Out the Invention

[0015] Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[0016] FIG. 1 is a cross-sectional view schematically showing a state where an electronic component is attached to an adhesive tape in an embodiment of the present invention.

[0017] As shown in FIG. 1, the adhesive tape 2 in the present embodiment includes a base material 3 and an adhesive layer 4 laminated on one surface of the base material 3. The adhesive layer 4 contains a filler 5, and a binder layer 6 is provided between the base material 3 and the adhesive layer 4. The adhesive tape 2 is used to hold the electronic component 1 on the surface of the adhesive layer 4. Note that examples of the electronic component 1 include a semiconductor chip, MEMS, a silicon photonics die, a wiring board, a ceramic capacitor, and the like.

[0018] The base material 3 is a support such as the adhesive layer 4 and is made of a material having stretchability. As the material of the base material 3, for example, polyvinyl chloride, polyester, polypropylene, fluororesin, etc. can be used. The thickness of the base material 3 is 10 μm to 500 μm, and 30 μm to 300 μm is preferable in view of its flexibility, processability, strength, etc.

[0019] The adhesive layer 4 is made of a material having stretchability, and for example, a pressure-sensitive adhesive, an active energy ray-curable adhesive, etc. can be used. Here, the pressure-sensitive adhesive refers to an adhesive made of a material whose shape changes when pressure is applied and whose adhesiveness is exhibited by an increase in wettability to the adherend. The active energy ray-curable adhesive refers to an adhesive made of a material that cures by irradiating ultraviolet rays (UV) or electron beams (EB) and has adhesiveness to the adherend.

[0020] As the base material of the pressure-sensitive adhesive, for example, there are rubber-based adhesives, acrylic-based adhesives, vinyl alkyl ether-based adhesives, silicone-based adhesives, polyester-based adhesives, polyamide-based adhesives, urethane-based adhesives, styrene-diene block copolymer-based adhesives, etc. These materials may be used alone or as a mixture of two or more. Furthermore, as additives, for example, crosslinking agents, tackifiers, plasticizers, fillers, preservatives, etc. may be blended.

[0021] As the material of the active energy ray curable adhesive, for example, there are those obtained by mixing a photopolymerization initiator such as a benzophenone-based, acetophenone-based, benzoin ether-based, thioxanthone-based, etc. with a base material such as a radical polymerization type urethane acrylate, epoxy acrylate, acrylic acrylate, polyester acrylate, polyfunctional acrylate monomer, monofunctional acrylate monomer, etc.

[0022] Also, as the material of the active energy ray curable adhesive, those obtained by mixing a photopolymerization initiator such as a sulfonium salt-based, iodonium salt-based, etc. with a base resin such as an alicyclic epoxy, glycidyl type epoxy, oxetane compound, vinyl ether monomer, etc. of the photo cationic polymerization type may be used. Also, as additives, for example, polymerization inhibitors, crosslinking agents, tackifiers, plasticizers, fillers, preservatives, etc. may be blended.

[0023] Considering the maintenance of adhesive strength, processability, etc., the thickness of the adhesive layer 4 is preferably 5 μm to 300 μm.

[0024] The material of the filler 5 is not particularly limited, but for example, in addition to inorganic materials such as silica and ceramics, organic materials such as acrylic resins, rubber-based resins, silicone-based resins, etc., composite materials in which a gas or liquid member is confined in a capsule-shaped outer shell can be used. Also, its shape may be spherical, pointed, flaky, crushed, spiral-shaped, or any shape.

[0025] FIG. 2 is a cross-sectional view showing a state where the adhesive tape 2 shown in FIG. 1 is stretched in the planar direction (left-right and front-back directions in the figure).

[0026] As shown in Fig. 2, by stretching the adhesive tape 2 in the plane direction, the base material 3 and the adhesive layer 4 are also stretched simultaneously. The average thickness of the adhesive layer 4 becomes thinner than that in the state before stretching. The adhesive layer 4 contains a filler 5, and the thickness variation of the adhesive layer 4 at the location where the blending ratio of the filler 5 is high is smaller than that at the location where the blending ratio of the filler 5 is low. Also, at the location where there are large fillers 5 or where the fillers 5 overlap each other, the thickness variation of the adhesive layer 4 is also smaller.

[0027] As shown in Fig. 2, the locations with little thickness variation appear as convex portions 7 reflecting the outer shape of the filler 5 on the surface of the adhesive layer 4, and between the convex portions 7 are concave portions 8. The concave portions 8 are peeled off from the bottom surface of the electronic component 1. As a result, the adhesion area between the electronic component 1 and the adhesive layer 4 decreases. In the state where the adhesive layer 4 is sufficiently stretched, the adhesion between the electronic component 1 and the adhesive layer 4 becomes close to point contact by the convex portions 7.

[0028] In this way, by stretching the adhesive tape 2, convex portions 7 are generated on the surface of the adhesive layer 4 at the sites where a part of the filler 5 contained in the adhesive layer 4 exists. As a result, the adhesion area between the electronic components 1 decreases, and the adhesive force per unit area of the electronic component 1 decreases. That is, by controlling the stretching amount of the adhesive layer 4, the holding force of the electronic component 1 can be freely controlled. For example, by making the adhesion between the electronic component 1 and the adhesive layer 4 close to point contact by the convex portions 7, even with the conventional pickup method, the electronic component 1 can be easily picked up. Thereby, when picking up the electronic component 1, the adhesive force per unit area of the electronic component 1 decreases, and since the electronic component 1 can be stably held by multi-point support with fine convex portions, even in the pickup of an electronic component 1 such as a MEMS having a fine and fragile beam structure, the load applied to the electronic component 1 is extremely small, and the electronic component 1 can be easily peeled off.

[0029] The stretching of the adhesive tape 2 can be carried out using a general expander or the like. Further, by expanding the adhesive tape 2 in the area to be stretched while heating it, stretching can be performed more efficiently.

[0030] As described above, as the filler 5, an inorganic material, an organic material, a composite material, etc. can be used as the material, and the shape is not particularly limited. However, for example, it is more preferable to use a spherical elastic body. By using a spherical elastic body, the local stress applied to the electronic component 1 when the electronic component 1 is attached to the adhesive tape 2 can be alleviated. Further, when the filler 5 is slightly deformed with respect to the stretching stress of the adhesive layer 4, the stress applied to the contact portion between the adhesive layer 4 and the filler 5 is dispersed, and the breakage of the adhesive layer 4 can be suppressed.

[0031] The center diameter of the filler 5 is preferably in the range of 10 to 80% with respect to the thickness of the adhesive layer 4. If the center diameter of the filler 5 is less than 10% with respect to the thickness of the adhesive layer 4, even if the adhesive layer 4 is stretched, sufficient unevenness is not formed on the surface of the adhesive layer 4, which is not preferable. Further, if the center diameter of the filler 5 exceeds 80% with respect to the thickness of the adhesive layer 4, unevenness is formed on the surface of the adhesive layer 4 even when the adhesive layer 4 is not stretched, so that the original holding force of the electronic component 1 is not exhibited, which is not preferable. In order to effectively control the holding force of the electronic component 1 by controlling the amount of stretching of the adhesive layer 4, the center diameter of the filler 5 is more preferably in the range of 20 to 60% with respect to the thickness of the adhesive layer 4. Further, the optimal range of the center diameter of the filler 5 may be appropriately determined according to the materials of the adhesive layer 4 and the filler 5. Further, it may be appropriately determined according to the size of the electronic component 1 to be picked up.

[0032] The content of the filler 5 contained in the adhesive layer 4 is preferably in the range of 20 to 80 vol%. If the content of the filler 5 contained in the adhesive layer 4 is less than 20 vol%, even if the adhesive layer 4 is stretched, sufficient unevenness is not formed on the surface of the adhesive layer 4, which is not preferable. Further, if the content of the filler 5 contained in the adhesive layer 4 exceeds 80 vol%, the strength of the adhesive component of the adhesive layer 4 is insufficient, and the adhesive layer 4 begins to break, which is not preferable. In order to effectively control the holding force of the electronic component 1 by controlling the stretching amount of the adhesive layer 4, the content of the filler 5 contained in the adhesive layer 4 is more preferably in the range of 30 to 60 vol%. Further, the content of the filler 5 contained in the adhesive layer 4 may be appropriately determined within an optimal range according to the materials of the adhesive layer 4 and the filler 5.

[0033] The bind layer 6 enhances the adhesive force between the base material 3 and the adhesive layer 4. The main material is the same as that of the adhesive layer 4 and is adjusted, for example, by blending a crosslinking agent, an adhesion promoter, and the like. However, if the bonding force between the base material 3 and the adhesive layer 4 is high due to chemical treatment, mechanical treatment, or the like, the bind layer 6 does not particularly need to be provided.

[0034] Further, after stretching the adhesive tape 2 to reduce the adhesion area between the electronic component 1 and the adhesive layer 4 and then returning the tension of the stretching of the adhesive tape 2, the convex portions formed on the surface of the adhesive layer 4 are smoothed, and again, the electronic component 1 and the adhesive layer 4 can be restored to surface adhesion. That is, the adhesive layer 4 having a reduced average thickness becomes thick again, so that the adhesion area between the surface of the adhesive layer 4 and the electronic component 1 increases, and the holding force of the electronic component 1 can be restored. Thereby, for example, when picking up the electronic component 1, a tension is applied to the adhesive layer 4 to stretch it, and then the tension is released, so that the remaining electronic component 1 can be held on the adhesive tape 2 again.

[0035] (Method for manufacturing an electronic component using an adhesive tape) The adhesive tape 2 in the present embodiment can be suitably used for manufacturing an electronic component including a step of picking up the electronic component 1 held by the adhesive tape 2.

[0036] The manufacturing method of the electronic component in the present embodiment includes a step of holding the electronic component 1 with the adhesive tape 2, and a step of reducing the holding force of the electronic component 1 by the adhesive layer 4 by thinning the average thickness of the adhesive layer 4 in the adhesive tape 2 while the electronic component 1 is held by the adhesive tape 2, and a step of picking up the electronic component 1 with a reduced holding force by the adhesive layer 4 from the adhesive tape 2.

[0037] Hereinafter, with reference to FIGS. 3(A) to 3(D), the manufacturing method of the electronic component 1 using the adhesive tape 2 in the present embodiment will be described in detail. In FIGS. 3(A) to 3(D), the same components as those shown in FIGS. 1 and 2 are denoted by the same reference numerals, and the description thereof is omitted.

[0038] FIG. 3(A) is a diagram showing a state in which the electronic component 1 is attached to the adhesive tape 2 and held by the adhesive tape 2. In this state, a crack 13 is formed along the planned division line of the electronic component 1. The attachment of the electronic component 1 to the adhesive tape 2 can be performed by a general tape mounter, a vacuum mounter, or the like. The formation of the crack 13 can be performed, for example, by condensing a laser at the processing point to generate a crack by multiphoton absorption.

[0039] Next, as shown in FIG. 3(B), the adhesive tape 2 is stretched until the first stretched state to divide the electronic component 1 into individual pieces. At this time, the stretching amount (expansion ratio) of the adhesive tape 2 is, for example, about 101 to 110%, and the tack force of the adhesive layer 4 at that time is about 98% to 50% of the initial (unstretched state).

[0040] In this state, the electronic component 1 is firmly held by the adhesive layer 4, and the holding force during the fragmentation of the electronic component 1 can be ensured, and peeling due to impact or vibration during transportation or handling can be suppressed. Therefore, for example, inter-factory transportation or inter-process transportation after the fragmentation of the electronic component 1 can be carried out in this state.

[0041] Next, as shown in FIG. 3(C), the adhesive tape 2 is stretched to the second stretched state to reduce the adhesion area per unit area between the electronic component 1 and the adhesive layer 4. At this time, the amount of stretching (expansion rate) of the adhesive tape 2 is, for example, about 110 to 140%, and the tack force of the adhesive layer 4 at that time drops to about 50% to 5% of the initial (unstretched state). In particular, by setting the expansion rate to 120% or more, the tack force drops to 30% or less of the initial value.

[0042] In this state, the electronic component 1 is in a state where it can be easily peeled off. For example, using a general pickup method such as vacuum-sucking the electronic component 1 with a collet 14 and picking it up, the electronic component 1 can be peeled off without damage. That is, by changing from the first stretched state or the initial state to the second stretched state during or before the pickup process, the electronic component 1 can be picked up without damage using a general pickup method without using the special pickup method described in Patent Document 1.

[0043] Also, by setting the expansion rate to 130% or more, the tack force drops to 15% or less of the initial value. In this state, even with a general pickup method, the electronic component 1 can be easily peeled off from the adhesive tape 2. That is, in such a state, pickup work with tweezers or the like in manual work is also possible.

[0044] Also, as shown in FIG. 3(D), by loosening the amount of stretching of the adhesive tape 2 and returning it to a state close to the first stretched state, the adhesion area between the electronic component 1 and the adhesive layer 4 can be increased, and the tack force can be increased again to a state where it can be handled.

[0045] (Modification example of the adhesive tape) Figs. 4 and 5 are diagrams schematically showing the configuration of the adhesive tape 2 in this modified example. Fig. 4 is a cross-sectional view schematically showing a state where the electronic component 1 is attached to the adhesive tape 2, and Fig. 5 is a cross-sectional view showing a state where the adhesive tape 2 shown in Fig. 4 is stretched in the planar direction. In Figs. 4 and 5, the same reference numerals are used for the same components as those shown in Figs. 1 and 2, and the description thereof is omitted.

[0046] In Figs. 4 and 5, the difference from the adhesive tape 2 in the above-described embodiment is that the adhesive layer 4 is composed of an intermediate deformation layer 9 containing a filler 5 and an adhesive material 10. The intermediate deformation layer 9 is a member specialized for displacement in the thickness direction by stretching the adhesive tape 2, and the adhesive material 10 is a member specialized for adhesiveness with the electronic component 1. By decomposing the functions required for the member specialized for displacement in the thickness direction and the member specialized for adhesiveness, the design of the adhesive layer 4 can be made easier.

[0047] Figs. 6 and 7 are diagrams schematically showing the configuration of the adhesive tape 2 in another modified example. Fig. 6 is a cross-sectional view schematically showing a state where the electronic component 1 is attached to the adhesive tape 2, and Fig. 7 is a cross-sectional view showing a state where the adhesive tape 2 shown in Fig. 6 is stretched in the planar direction. In Figs. 6 and 7, the same reference numerals are used for the same components as those shown in Figs. 1 and 2, and the description thereof is omitted.

[0048] In Figs. 6 and 7, the difference from the adhesive tape 2 in the above-described embodiment is that the shape of the filler 5 is made into a sharp shape.

[0049] As shown in Fig. 7, when the adhesive tape 2 is stretched and the adhesive layer 4 is simultaneously stretched and the average thickness of the adhesive layer 4 becomes thinner, the tip portion of the sharp shape of the filler 5 protrudes from the adhesive layer 4, thereby causing convex portions 7 on the surface of the adhesive layer 4. These protruding convex portions 7 are not in a state of covering the surface of the adhesive layer 4. When the adhesive tape 2 is stretched beyond a certain extent, the electronic component 1 can be completely peeled off from the adhesive layer 4, resulting in a state where there is no adhesive force.

Example

[0050] An adhesive tape 2 was produced by laminating an adhesive layer 4 (thickness: 30 μm) containing a filler 5 on a base material 3 (thickness: 50 μm). The base material 3 is made of a polyolefin film, and the adhesive layer 4 is made of an acrylic adhesive material. The filler 5 is a spherical filler mainly composed of a polymer having a particle size of 2 to 18 μm and a central diameter of 8 μm (27% with respect to the thickness of the adhesive layer 4), and is contained in the adhesive layer 4 at 30 vol%.

[0051] The produced adhesive tape 2 was stretched, and the surface of the adhesive layer 4 was observed by SEM, and the tack force of the adhesive layer 4 was measured. The tack force was measured as the maximum stress value when, after fixing an evaluation chip (electronic component) to the tip of a push-pull gauge, the chip was peeled off from the tape until the chip was completely peeled off from the tape.

[0052] Table 1 is a table showing the SEM observation images and the measured tack forces when the elongation rate of the adhesive tape 2 was changed. Here, the elongation rate is a numerical value represented by (L - L0) / L0, where L0 is the length of the adhesive tape 2 when not stretched and L is the length of the adhesive tape 2 when stretched.

[0053]

Table 1

[0054] As shown in Table 1, in the initial adhesive tape 2 (elongation rate 0%) that was not stretched, no convex portions were observed on the surface of the adhesive layer 4, whereas in the adhesive tape 2 (elongation rates 13%, 32%) when stretched, convex portions occurred on the surface of the adhesive layer 4, and it can be seen that the higher the elongation rate, the higher the height of the convex portions.

[0055] Also, as shown in Table 1, when the tack force of the initial adhesive tape 2 (elongation rate 0%) is taken as 100, the tack force at an elongation rate of 13% is 31, and the tack force at an elongation rate of 32% is 9. This is presumably because as the average thickness of the adhesive layer 4 becomes thinner, convex portions are formed on the surface of the adhesive layer 4, and as a result, the adhesion area between the adhesive layer 4 and the adherend decreases, leading to a decrease in the tack force.

[0056] As described above, the present invention has been explained with reference to preferred embodiments. However, such descriptions are not limiting matters, and of course, various modifications are possible. For example, in the above embodiment, the thickness of the adhesive layer 4 was reduced by stretching the adhesive tape 2, but it is not limited thereto. For example, a solvent component may be included in the adhesive layer 4, and the thickness of the adhesive layer 4 may be reduced by volatilizing the solvent component.

[0057] Also, a method of using a material with a large linear expansion in the adhesive layer 4 and utilizing the expansion and contraction due to a temperature difference, or a method of using a photocurable resin in the adhesive layer 4 and utilizing the curing shrinkage during photoradical polymerization, etc. may be used to reduce the thickness of the adhesive layer 4.

[0058] Also, an active energy ray curable material may be used in the adhesive layer 4, and the thickness of the adhesive layer 4 may be reduced by utilizing the curing shrinkage due to the irradiation of active energy rays. In this case, since the adhesive force of the adhesive layer 4 decreases due to the curing by the irradiation of active energy, the adhesive force at the point contact portion between the electronic component 1 and the convex portion 7 of the adhesive layer 4 can be further reduced.

[0059] Also, in the above embodiment, the adhesive layer 4 containing the filler 5 was described as an example. However, for example, an adhesive layer 4 containing a warp having stretchability and a sheet in which the weft is interlaced in a plain weave pattern within the amount of the adhesive material may also be used. In this case, due to the stretching of the adhesive layer 4, the portions where the warp and the weft are woven together become convex portions, and the other portions become concave portions.

Explanation of Reference Numerals

[0060] 1 Electronic component 2 Adhesive tape 3 Base material 4 Adhesive layer 5 Filler 6 Binding layer 7 Convex part 8 Concave part 9 Intermediate deformation layer 10 Adhesive 13 Crack 14 Collet

Claims

1. An adhesive tape comprising a base material and an adhesive layer laminated on one surface of the base material, and used for holding an electronic component on the surface of the adhesive layer, wherein as the average thickness of the adhesive layer becomes thinner, convex portions are formed on the surface of the adhesive layer, whereby the adhesion area between the adhesive layer and the electronic component is reduced, and the holding force of the electronic component by the adhesive layer is decreased.

2. The adhesive layer contains a filler, wherein as the average thickness of the adhesive layer becomes thinner, convex portions are formed on the surface of the adhesive layer at a site where a part of the filler contained in the adhesive layer exists. The adhesive tape according to claim 1.

3. The base material and the adhesive layer have stretchability, wherein the average thickness of the adhesive layer becomes thinner by stretching the adhesive tape in a planar direction. The adhesive tape according to claim 2.

4. The central diameter of the filler contained in the adhesive layer is in the range of 20 to 80% with respect to the thickness of the adhesive layer. The adhesive tape according to claim 2.

5. The content of the filler contained in the adhesive layer is in the range of 20 to 80 vol%. The adhesive tape according to claim 2.

6. The filler is an elastic body. The adhesive tape according to claim 2.

7. The filler includes at least spherical fillers. The adhesive tape according to claim 2.

8. The filler includes at least acutely shaped fillers. The adhesive tape according to claim 2.

9. wherein as the average thickness of the adhesive layer becomes thinner, the tip portions of the acutely shaped fillers protrude from the adhesive layer, whereby convex portions are formed on the surface of the adhesive layer. The adhesive tape according to claim 8.

10. The adhesive layer is composed of an intermediate deformation layer and an adhesive material, wherein as the average thickness of the intermediate deformation layer becomes thinner, convex portions are formed on the surface of the intermediate deformation layer, whereby convex portions are formed on the surface of the adhesive material, and the adhesion area between the adhesive material and the electronic component is reduced, and the holding force of the electronic component is decreased. The adhesive tape according to claim 1.

11. A bind layer is provided between the base material and the adhesive layer. The adhesive tape according to claim 1.

12. The adhesive layer contains a solvent component, wherein as the solvent component in the adhesive layer volatilizes, the average thickness of the adhesive layer becomes thinner. The adhesive tape according to claim 1.

13. The pressure-sensitive adhesive layer is made of an active energy ray-curable material, The pressure-sensitive adhesive tape according to claim 1, wherein the average thickness of the pressure-sensitive adhesive layer is reduced by irradiating the pressure-sensitive adhesive layer with active energy rays.

14. The pressure-sensitive adhesive tape according to claim 1, wherein when the pressure-sensitive adhesive layer with a reduced average thickness becomes thick again, the convex portions formed on the surface of the pressure-sensitive adhesive layer are smoothed, whereby the adhesion area between the pressure-sensitive adhesive layer and the electronic component increases and the holding force of the electronic component is restored.

15. A step (A) of holding an electronic component with a pressure-sensitive adhesive tape, A step (B) of picking up the electronic component from the pressure-sensitive adhesive tape, comprising: The pressure-sensitive adhesive tape is composed of the pressure-sensitive adhesive tape according to any one of claims 1 to 13, After the step (A) and before the step (B), the method further includes a step (C) of reducing the average thickness of the pressure-sensitive adhesive layer in the pressure-sensitive adhesive tape while the electronic component is held by the pressure-sensitive adhesive tape, In the step (C), when the average thickness of the pressure-sensitive adhesive layer is reduced, convex portions are formed on the surface of the pressure-sensitive adhesive layer, whereby the adhesion area between the pressure-sensitive adhesive layer and the electronic component is reduced and the holding force of the electronic component by the pressure-sensitive adhesive layer is decreased. A method for manufacturing an electronic component, wherein in the step (B), the electronic component with a reduced holding force by the pressure-sensitive adhesive layer is picked up from the pressure-sensitive adhesive tape.

16. The pressure-sensitive adhesive layer contains a filler, The method for manufacturing an electronic component according to claim 15, wherein the step (C) is performed by stretching the pressure-sensitive adhesive tape in a planar direction.

Images