Manufacturing method of surface light source and repair method of surface light source

Abstract

To provide a manufacturing method of a surface light source which can easily replace a defective light emitting unit, in a surface light source which includes a plurality of light emitting units, and to provide a repair method of the surface light source.SOLUTION: A manufacturing method of a surface light source includes: preparing a surface light source in which, on a support member where an adhesive layer is arranged on a base material, a plurality of light emitting units is arranged in a planar manner containing a first light emitting unit having a light emitting element and a covering member arranged so as to cover the light emitting element; cutting and removing part of the first light emitting unit; coating a solvent on the adhesive layer exposed after part of the first light emitting unit is removed, and removing the remainder of the first light emitting unit; and mounting a second light emitting unit different from the first light emitting unit on the upper surface of the base material where the first light emitting unit is removed.SELECTED DRAWING: Figure 6

Description

Technical Field

[0001] The present disclosure relates to a method for manufacturing a planar light source and a method for repairing a planar light source.

Background Art

[0002] A planar light source in which light emitting units combining a light emitting element such as a light emitting diode and a light guide plate are arranged in a planar manner is known.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] An embodiment according to the present invention provides a method for manufacturing a planar light source and a method for repairing a planar light source in which a defective light emitting unit can be easily replaced in a planar light source including a plurality of light emitting units.

Means for Solving the Problems

[0005] A method for manufacturing a planar light source according to an aspect of the present disclosure includes preparing a planar light source in which a plurality of light emitting units including a first light emitting unit having a light emitting element and a covering member arranged to cover the light emitting element are arranged in a planar manner on a support member having an adhesive layer disposed thereon; cutting and removing a part of the first light emitting unit; applying a solvent to the adhesive layer exposed after a part of the first light emitting unit is removed to remove the remaining part of the first light emitting unit; and attaching a second light emitting unit different from the first light emitting unit to the upper surface of the base material from which the first light emitting unit has been removed.

Effects of the Invention

[0006] According to the embodiments of the present disclosure, a method for manufacturing a planar light source and a method for repairing a planar light source that can easily replace a defective light-emitting unit can be realized.

Brief Description of the Drawings

[0007]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Embodiments for Carrying Out the Invention

[0008] Hereinafter, with reference to the drawings, a method for manufacturing a planar light source according to an embodiment of the present disclosure will be described. The following embodiments exemplify a method for manufacturing a planar light source for embodying the technical idea of the present embodiment, and are not limited thereto. In addition, the dimensions, materials, shapes, relative arrangements, etc. of the components described in the embodiments are not intended to limit the scope of the present disclosure only thereto without specific description, but are merely illustrative examples. Note that the sizes, positional relationships, etc. of the members shown in each drawing may be exaggerated for clarity of explanation. In the following description, the same names and reference numerals indicate the same or similar members, and detailed descriptions will be omitted as appropriate. In addition, as a cross-sectional view, there may be a case where an end view showing only the cut surface is shown.

[0009] In the following description, terms indicating a specific direction or position (for example, "up", "down", and other terms including these terms) may be used. However, these terms are only used for ease of understanding of the relative direction or position in the referenced drawings. If the relative direction or position relationship by terms such as "up" and "down" in the referenced drawings is the same, in drawings other than the present disclosure, actual products, etc., they do not have to be arranged in the same way as the referenced drawings. The positional relationship expressed as "up (or down)" in this specification includes, for example, when two members are in contact and when two members are not in contact and one member is located above (or below) the other member, assuming that there are two members. In addition, in this specification, unless otherwise specified, a member covering a covered object includes both a case where the member directly covers the covered object in contact with the covered object and a case where the member indirectly covers the covered object without contact with the covered object. In addition, in this specification, "area" means the area in a plan view unless otherwise specified.

[0010] <1. Embodiment> (1.1. Planar light source 100) Referring to FIGS. 1 to 4, the configuration of the planar light source 100 in the present disclosure will be described. As shown in FIG. 1, the planar light source 100 has a support member 40 and a plurality of light emitting units 10 arranged in a planar manner on the support member 40. In the following description, it is assumed that the planar light source 100 is placed on a horizontal plane with the plane defined by the X-axis and Y-axis shown in FIG. 1 as the horizontal plane.

[0011] As shown in FIG. 2, the planar light source 100 includes a light emitting array 90 in which a plurality of light emitting units 10 are arranged in a planar manner. The light emitting array 90 is an aggregate of a plurality of light emitting units 10 arranged in a planar manner and is arranged on the support member 40. In the example shown in FIGS. 2 and 3, the light emitting array 90 includes 4×4 light emitting units 10. The planar light source 100 includes a light emitting array 90 arranged in an n×m continuous and planar manner, where n and m are arbitrary natural numbers (excluding n = m = 1). In the example shown in FIG. 2, n = 3 and m = 2 (or n = 2 and m = 3).

[0012] The planar light source 100 may include a first light emitting array 90A. In the present disclosure, the first light emitting array 90A means a light emitting array 90 having a first light emitting unit 10A with a defect such as abnormal brightness or non-lighting. In other words, the first light emitting unit 10A is a light emitting unit 10 that needs to be replaced due to a defect. Further, the first light emitting array 90A is a light emitting array 90 having a light emitting unit 10 that needs to be replaced.

[0013] Referring to FIG. 4, the structures of the support member 40 and the light emitting unit 10 will be described. The support member 40 includes a base material 50, an adhesive layer 60, and a wiring layer 70. The base material 50 may be a rigid substrate or a flexible substrate. For thinning of the planar light source, the base material 50 is preferably a flexible substrate. The base material 50 may be composed of a single layer or a laminate of a plurality of layers. For example, the base material 50 may be composed of a single-layer flexible substrate or a laminate of a plurality of rigid substrates. As the material of the base material 50, for example, a resin such as polyimide can be used.

[0014] The adhesive layer 60 is disposed on the side opposite to the surface of the base material 50 on which the wiring layer 70 is disposed. The adhesive layer 60 is disposed between the base material 50 and the light-emitting unit 10 and bonds the base material 50 and the light-emitting unit 10. The adhesive layer 60 is, for example, a resin layer containing light-scattering particles. As the light-scattering particles, for example, particles such as titanium oxide, silicon oxide, aluminum oxide, zinc oxide, magnesium oxide, zirconium oxide, yttrium oxide, calcium fluoride, magnesium fluoride, niobium pentoxide, barium titanate, tantalum pentoxide, barium sulfate, or glass can be used. As the resin of the adhesive layer 60, for example, a thermoplastic resin such as a urethane resin, an acrylic resin, a polycarbonate resin, a cyclic polyolefin resin, a polyethylene terephthalate resin or a polyester resin, or a thermosetting resin such as an epoxy resin or a silicone resin can be used. The wiring layer 70 has wiring including a metal film and may include, for example, a copper film.

[0015] As shown in FIG. 4, the light-emitting unit 10 includes a light-emitting element 20 and a covering member 30. The covering member 30 includes a reflecting member 31, a light-guiding member 32, and a light-transmitting member 33.

[0016] The light-emitting element 20 includes a semiconductor laminate. The semiconductor laminate includes, for example, a substrate such as sapphire or gallium nitride, an n-type semiconductor layer disposed on the substrate, a p-type semiconductor layer, and a light-emitting layer sandwiched therebetween. The light-emitting element 20 also includes an n-side electrode electrically connected to the n-type semiconductor layer and a p-side electrode electrically connected to the p-type semiconductor layer. Further, the light-emitting element 20 includes a pair of positive and negative electrodes disposed on the lower surface side. One of the pair of electrodes is electrically connected to the p-side electrode, and the other is electrically connected to the n-side electrode.

[0017] The semiconductor laminate may use one from which the substrate has been removed. Further, as the structure of the light-emitting layer, a structure having a single active layer such as a double hetero structure or a single quantum well structure (SQW) may be used, or a structure having a group of active layers as a unit such as a multiple quantum well structure (MQW) may be used. The light-emitting layer can emit visible light or ultraviolet light. The light-emitting layer can emit light from blue to red as visible light. As the semiconductor laminate including such a light-emitting layer, for example, In x Al y Ga 1-x-y N (0≦x, 0≦y, x + y≦1) can be included. The semiconductor laminate can include at least one light-emitting layer capable of emitting the above-described light.

[0018] The semiconductor laminate may be, for example, a structure including one or more light-emitting layers between an n-type semiconductor layer and a p-type semiconductor layer, or a structure in which a structure including an n-type semiconductor layer, a light-emitting layer, and a p-type semiconductor layer in this order is repeated a plurality of times. When the semiconductor laminate includes a plurality of light-emitting layers, it may include light-emitting layers having different emission peak wavelengths, or may include light-emitting layers having the same emission peak wavelength. Note that the same emission peak wavelength means that, for example, there may be a variation of about several nm. Such a combination of light-emitting layers can be appropriately selected. For example, when the semiconductor laminate includes two light-emitting layers, the light-emitting layers can be selected in combinations such as blue light and blue light, green light and green light, red light and red light, ultraviolet light and ultraviolet light, blue light and green light, blue light and red light, or green light and red light. Further, the light-emitting layer may include a plurality of active layers having different emission peak wavelengths, or may include a plurality of active layers having the same emission peak wavelength.

[0019] The reflecting member 31 is disposed around the light-emitting element 20. As the reflecting member 31, for example, a resin member including a large number of air bubbles or a resin member including light-scattering particles can be used. The resin of the reflecting member 31 can be selected from the resins listed as the resins that can be used for the adhesive layer 60, for example. The light-scattering particles can be selected from the light-scattering particles listed as the light-scattering particles that can be used for the adhesive layer 60, for example.

[0020] The light guide member 32 is disposed above the light emitting element 20 so as to be radial in a plan view. The light guide member 32 is a member having translucency with respect to the light emitted from the light emitting element 20. The transmittance of the light guide member 32 with respect to the peak wavelength of the light emitting element 20 is preferably, for example, 50% or more, more preferably 70% or more.

[0021] As the material of the light guide member 32, for example, a thermoplastic resin such as acrylic, polycarbonate, cyclic polyolefin, polyethylene terephthalate or polyester, a thermosetting resin such as epoxy or silicone, or glass can be used.

[0022] The thickness of the light guide member 32 is preferably, for example, 150 μm or more and 800 μm or less. In this specification, the thickness of each member represents the maximum value of the distance between the upper surface and the lower surface of each member in the vertical direction (that is, the Z-axis direction in FIGS. 1 and 3). The light guide member 32 may be composed of a single layer in the vertical direction, or may be composed of a laminate of a plurality of layers. When the light guide member 32 is composed of a laminate, a translucent adhesive layer may be disposed between the layers. Each layer of the laminate may use different types of main materials. As the material of the adhesive layer, for example, a thermoplastic resin such as acrylic, polycarbonate, cyclic polyolefin, polyethylene terephthalate or polyester, or a thermosetting resin such as epoxy or silicone can be used.

[0023] The translucent member 33 covers the upper surface of the light emitting element 20. The translucent member 33 protects the light emitting element 20 and has functions such as wavelength conversion and light diffusion according to the particles added to the translucent member 33.

[0024] The translucent member 33 contains, for example, a translucent resin and may further contain a phosphor. As the translucent resin, for example, a silicone resin or an epoxy resin can be used. Further, as the phosphor, yttrium aluminum garnet-based phosphors (for example, Y3(Al,Ga)5O 12 :Ce), lutetium aluminum garnet-based phosphors (for example, Lu3(Al,Ga)5O12 :Ce), terbium-aluminum-garnet-based phosphor (e.g., Tb3(Al,Ga)5O 12 :Ce), CCA-based phosphor (e.g., Ca 10 (PO4)6C 12 :Eu), SAE-based phosphor (e.g., Sr4Al 14 O 25 :Eu), chlorosilicate-based phosphor (e.g., Ca8MgSi4O 16 Cl2:Eu), β-sialon-based phosphor (e.g., (Si,Al)3(O,N)4:Eu) or α-sialon-based phosphor (e.g., Ca(Si,Al) 12 (O,N) 16 :Eu), etc., oxynitride-based phosphors, SLA-based phosphors (e.g., SrLiAl3N4:Eu), CASN-based phosphors (e.g., CaAlSiN3:Eu) or SCASN-based phosphors (e.g., (Sr,Ca)AlSiN3:Eu), etc., nitride-based phosphors, KSF-based phosphors (e.g., K2SiF6:Mn), KSAF-based phosphors (e.g., K2Si 0.99 Al 0.01 F 5.99 :Mn), etc., fluoride-based phosphors, phosphors having a perovskite structure (e.g., CsPb(F,Cl,Br,I)3), or quantum dot phosphors (e.g., CdSe, InP, AgInS2 or AgInSe2), etc. can be used. As the phosphor added to the light-transmitting member 33, one type of phosphor may be used, or a plurality of types of phosphors may be used.

[0025] (1.2. Method for manufacturing the planar light source 100) Referring to FIGS. 5 to 10, the method for manufacturing the planar light source 100 will be described. As shown in FIG. 5, the method for manufacturing the planar light source 100 includes a preparation step (S100), a cutting step (S200), a remaining portion removing step (S300), an attachment step (S400), and an inspection step (S500). Hereinafter, the details will be described in order.

[0026] (1.2.1. Preparation step) In the preparation step (S100), a planar light source 100 including a first light-emitting array 90A having a first light-emitting unit 10A is prepared. As described above, since the first light-emitting array 90A has a first light-emitting unit 10A with problems such as abnormal brightness or non-lighting, it needs to be replaced. In the preparation step (S100), in the manufacture of the planar light source 100, a planar light source 100 including a light-emitting array 90 that has been found to need replacement is prepared.

[0027] (1.2.2. Cutting step) In the cutting step (S200), a part of a plurality of light-emitting units 10 (including the first light-emitting unit 10A) included in the first light-emitting array 90A is cut and removed. In the cutting step (S200), for example, a rod-shaped drill 85 is used as a cutting tool to cut a part of the light-emitting unit 10. The size of the drill 85 may be, for example, a blade width of about 2 mm. The shape of the drill 85 preferably has a flat tip, but may also have a convex or concave tip.

[0028] As an example, as shown in FIG. 6, an aluminum plate 80 is placed on the upper surface of the light-emitting unit 10, and the aluminum plate 80 is cut together with the energized drill 85. By doing so, since the aluminum plate 80 conducts electricity at the timing when the drill 85 contacts the upper surface of the aluminum plate 80, the vertical position of the contact point on the upper surface of the aluminum plate 80 (that is, the coordinate on the Z-axis) can be accurately grasped, and the drill 85 can be precisely controlled in the vertical direction. As a result, it becomes possible to cut a part of the light-emitting unit 10 without damaging the base material 50. Note that as the control of the vertical direction of the drill 85, it is preferable to cut up to the contact surface between the reflection member 31 and the adhesive layer 60, but in order not to damage the base material 50, a height of about 0.1 mm to 0.3 mm from the upper surface of the base material 50 is secured as a buffer region, and it may be specified to cut above the buffer region.

[0029] Also, in the cutting process (S200), as shown in FIG. 7, it is preferable to perform cutting by causing the drill 85 to meander within the first light-emitting array 90A in a plan view. FIG. 7 shows a cutting mark T as a mark cut by the drill 85 within the first light-emitting array 90A. By doing so, while ensuring the area to be cut within the first light-emitting array 90A, the cutting of the light-emitting unit 10 by the drill 85 can be efficiently performed.

[0030] In the example shown in FIG. 7, as an example, a cutting mark T in which the drill 85 is reciprocated 4 times within the first light-emitting array 90A is shown. However, regarding the meandering pattern (that is, how many times the drill 85 is reciprocated within the first light-emitting array 90A), it may be appropriately determined in consideration of the number of light-emitting units 10 included in the first light-emitting array 90A, the size of the light-emitting unit 10, and / or the size of the drill 85, etc.

[0031] Also, in the cutting process (S200), as shown in FIG. 8, it is preferable to perform internal cutting so as to leave the outer peripheral portion P1 of the first light-emitting array 90A in a plan view. In the example shown in FIG. 8, the outer peripheral portion P1 remains outside the cutting mark T within the first light-emitting array 90A. By doing so, the cutting operation of the first light-emitting array 90A can be performed without damaging the light-emitting units 10 included in the light-emitting array 90 adjacent to the first light-emitting array 90A. Note that the width D1 of the outer peripheral portion P1 is preferably 0.5 mm to 1.0 mm. By setting the width to this extent, the extraction of the outer peripheral portion P1 becomes easy in the subsequent remaining portion removal process (S300). On the other hand, the width D2 of the inner portion P2 sandwiched by the cutting mark T may be 0.5 mm to 2.0 mm.

[0032] (1.2.3. Remaining portion removal process) In the remaining part removal process (S300), after performing the cutting process (S200) on the light-emitting units 10 included in the first light-emitting array 90A, the remaining parts of the remaining light-emitting units 10 are removed. In the remaining part removal process (S300), first, using a clamping member such as tweezers, the remaining parts of the light-emitting units 10 remaining on the support member 40 in the first light-emitting array 90A are extracted. As an example, the remaining parts in the inner part P2 of the first light-emitting array 90A are extracted. Note that, together with the remaining parts of the light-emitting units 10, a part of the adhesive layer 60 may be extracted.

[0033] After extracting the remaining parts in the inner part P2 of the first light-emitting array 90A, the adhesive layer 60 remaining on the upper surface of the base material 50 from which a part of the light-emitting units 10 of the first light-emitting array 90A has been removed is removed. Specifically, a solvent is applied to the adhesive layer 60 exposed by a part of the first light-emitting unit 10A being removed. The solvent is preferably a material capable of swelling the adhesive layer 60. Specifically, at least one of acetone, methylpyrrolidone, xylene, toluene, and acetic anhydride may be selected as the solvent. Note that when the adhesive layer 60 contains a urethane resin, it is preferable to select at least one of methylpyrrolidone, xylene, and acetic anhydride as the solvent. By applying the solvent, the adhesive layer 60 swells, making it easier to peel the adhesive layer 60 from the base material 50. By removing the adhesive layer 60 by applying the solvent in this way, the adhesive layer 60 can be removed without damaging the base material 50. Note that it is preferable to apply the solvent to the exposed adhesive layer 60 while leaving the above-described outer peripheral part P1. By doing so, it is possible to suppress the solvent from leaking to the adjacent light-emitting arrays 90.

[0034] (1.2.4. Mounting process) In the mounting process (S400), as shown in FIG. 9, a second light-emitting array 90B including a second light-emitting unit 10B different from the first light-emitting unit 10A is mounted on the upper surface of the substrate 50 from which the first light-emitting array 90A including the first light-emitting unit 10A has been removed. The second light-emitting unit 10B is a light-emitting unit 10 without defects such as abnormal brightness or non-lighting. The second light-emitting unit 10B may be, for example, a new light-emitting unit 10. In the example shown in FIG. 9, since the first light-emitting array 90A has been removed, the wiring layer 70 is shown through the transparent substrate 50. In mounting the second light-emitting array 90B, it may be adhered using the same material as the adhesive layer 60, or it may be adhered using other materials.

[0035] (1.2.5. Inspection process) In the inspection process (S500), the planar light source 100 including the second light-emitting array 90B mounted in the mounting process (S400) is inspected. In the inspection process (S500), for example, at least one of voltage, luminous flux, luminance, and color tone of the second light-emitting unit 10B included in the second light-emitting array 90B is measured, and it is inspected whether it is within the normal value range. Also, for other light-emitting arrays 90 in the planar light source 100, the same inspection may be performed to inspect whether there is an influence due to the replacement of the first light-emitting array 90A and the second light-emitting array 90B.

[0036] If there are defects such as being outside the normal value range in the inspection, the processes from the cutting process (S200) are performed again on the second light-emitting array 90B (or the light-emitting array 90 having the light-emitting unit 10 showing the defect) mounted in the mounting process (S400). On the other hand, if there are no defects, the manufacturing of the planar light source 100 is completed.

[0037] (1.3. Parentheses) As described above, in this embodiment, in the manufacture of the planar light source 100, a planar light source 100 in which a plurality of light emitting units 10 including the first light emitting unit 10A are arranged in a plane is prepared. A part of the first light emitting unit 10A is cut and removed, a solvent is applied to the adhesive layer exposed after a part of the first light emitting unit 10A is removed, the remaining part of the first light emitting unit 10A is removed, and a second light emitting unit 10B different from the first light emitting unit 10A is attached to the upper surface of the substrate from which the first light emitting unit 10A has been removed. By adopting such a configuration, the first light emitting unit 10A that needs to be replaced and is included in the planar light source 100 can be easily replaced in a form that suppresses the influence on other light emitting units 10.

[0038] Note that, before or after the cutting step (S200), an operation of forming a groove by inserting a blade into the outer edge of the first light emitting unit 10A included in the first light emitting array 90A and into the adhesive layer 60 directly below the outer edge may be performed. Specifically, as shown in FIG. 10, a blade is inserted into the outer edge B1 of the first light emitting array 90A and into the adhesive layer 60 directly below the outer edge B1 to form a vertical groove. Thereby, in the remaining part removal step (S300), when the solvent is applied to the exposed adhesive layer 60, it is possible to more reliably suppress the solvent from entering the groove due to the surface tension of the solvent and the solvent from leaking into the adjacent light emitting array 90. Further, in addition to (or instead of) the outer edge B1 of the first light emitting array 90A, a blade may be inserted into the inner edge B2 of the first light emitting array 90A and into the adhesive layer 60 directly below the inner edge B2 to form a vertical groove.

[0039] <2. Other Embodiments> Although the embodiments of the present disclosure have been described above, the present disclosure is not limited to the above. For example, in the above embodiment, the manufacturing method of the planar light source 100 has been described, but the technical idea of the present disclosure may also be applied to the repair of the planar light source 100.

[0040] In addition, in the above-described embodiment, in the cutting step (S200), a part of the first light-emitting unit 10A is cut using the bar-shaped drill 85, but the present invention is not limited to this aspect. That is, the cutting step (S200) may be performed using a cutting tool other than the bar-shaped drill 85, or the cutting step (S200) may be performed using a cutting tool (or polishing tool) other than a cutting tool.

[0041] In addition, in the above-described embodiment, in the inspection step (S500), the second light-emitting unit 10B attached to the planar light source 100 is inspected, but the timing of performing the inspection is not limited to this aspect. For example, the inspection may be performed in the preparation step (S100) of the planar light source 100 to identify the defective first light-emitting unit 10A from among the plurality of light-emitting arrays 90 included in the planar light source 100.

[0042] In addition, in the above-described embodiment, in the preparation step (S100), a planar light source 100 including the first light-emitting array 90A having the first light-emitting unit 10A is prepared, and each step from the cutting step (S200) to the mounting step (S400) is performed on the first light-emitting array 90A. However, the present invention is not limited to this aspect, and each step may be performed in units of the light-emitting unit 10 instead of in units of the light-emitting array 90. Specifically, in the preparation step (S100), a planar light source 100 including the first light-emitting unit 10A may be prepared, and each step from the cutting step (S200) to the mounting step (S400) may be performed only on the first light-emitting unit 10A. Even in such an aspect, the same effects as those of the above-described embodiment can be obtained.

[0043] The present disclosure includes the following aspects. (Appendix 1) Preparing a planar light source in which a plurality of light-emitting units including a first light-emitting unit having a light-emitting element and a covering member arranged to cover the light-emitting element are arranged in a planar manner on a support member on which an adhesive layer is arranged on a base material; Cutting and removing a part of the first light-emitting unit; Applying a solvent to the adhesive layer exposed after a part of the first light-emitting unit is removed to remove the remaining part of the first light-emitting unit; A method for manufacturing a planar light source, comprising: attaching a second light-emitting unit different from the first light-emitting unit to the upper surface of the base material from which the first light-emitting unit has been removed. (Appendix 2) In the step of cutting and removing a part of the first light-emitting unit, a bar-shaped drill is meandered within the first light-emitting unit in a plan view for cutting. The method for manufacturing a planar light source according to Appendix 1. (Appendix 3) In the step of cutting and removing a part of the first light-emitting unit, internal cutting is performed so as to leave the outer peripheral portion of the first light-emitting unit in a plan view. The method for manufacturing a planar light source according to Appendix 1 or Appendix 2. (Appendix 4) After removing the remaining part of the first light-emitting unit, further comprising removing the adhesive layer remaining on the upper surface of the base material from which the first light-emitting unit has been removed. The method for manufacturing a planar light source according to any one of Appendices 1 to 3. (Appendix 5) Before or after cutting and removing a part of the first light-emitting unit, inserting a blade into the outer edge of the first light-emitting unit and the adhesive layer directly below the outer edge of the first light-emitting unit. The method for manufacturing a planar light source according to any one of Appendices 1 to 4. (Appendix 6) In preparing the planar light source, the adhesive layer contains a urethane resin. In removing the remaining part of the first light-emitting unit, the solvent contains at least one of N-methylpyrrolidone, xylene, and acetic anhydride. The method for manufacturing a planar light source according to any one of Appendices 1 to 5. (Appendix 7) In preparing the planar light source, further comprising performing an inspection to identify the first light-emitting unit from among the plurality of light-emitting units. The method for manufacturing a planar light source according to any one of Appendices 1 to 6. (Appendix 8) In preparing the planar light source, the coating member includes a reflecting member disposed around the light emitting element and a light guiding member disposed on the light emitting element and the reflecting member, and is the method for manufacturing a planar light source according to any one of Appendices 1 to 7. (Appendix 9) On a support member having an adhesive layer disposed thereon, a plurality of light emitting units each having a light emitting element and a coating member disposed so as to cover the light emitting element are arranged in a planar manner in an array of n×m (where n and m are arbitrary natural numbers, excluding n=m=1), and a planar light source including a first light emitting array is prepared. Cutting and removing a part of the first light emitting array. Applying a solvent to the adhesive layer exposed after a part of the first light emitting array is removed to remove the remaining part of the first light emitting array. Attaching a second light emitting array different from the first light emitting array to the upper surface of the base material from which the first light emitting array has been removed. The method for manufacturing a planar light source comprises the above steps. (Appendix 10) Preparing a planar light source in which a plurality of light emitting units each having a light emitting element and a coating member disposed so as to cover the light emitting element are arranged in a planar manner on a support member having an adhesive layer disposed thereon, the plurality of light emitting units including a first light emitting unit. Cutting and removing a part of the first light emitting unit. Applying a solvent to the adhesive layer exposed after a part of the first light emitting unit is removed to remove the remaining part of the first light emitting unit. Attaching a second light emitting unit different from the first light emitting unit to the upper surface of the base material from which the first light emitting unit has been removed. The method for repairing a planar light source comprises the above steps.

[0044] The embodiments according to the present disclosure have been described above with reference to specific examples. However, the present disclosure is not limited to these specific examples. Based on the above-described embodiments of the present disclosure, all forms that can be appropriately designed and implemented by those skilled in the art also belong to the scope of the present disclosure as long as they include the gist of the present disclosure. In addition, within the scope of the idea of the present disclosure, those skilled in the art can conceive of various modification examples and correction examples, and those modification examples and correction examples also belong to the scope of the present disclosure.

Description of Reference Numerals

[0045] 10: Light-emitting unit, 10A: First light-emitting unit, 10B: Second light-emitting unit, 20: Light-emitting element, 31: Reflective member, 32: Light guide member, 33: Translucent member, 40: Support member, 50: Substrate, 60: Adhesive layer, 70: Wiring layer, 80: Aluminum plate, 85: Drill, 90: Light-emitting array, 90A: First light-emitting array, 90B: Second light-emitting array, 100: Planar light source.

Claims

1. Preparing a planar light source in which a plurality of light-emitting units including a first light-emitting unit having a light-emitting element and a covering member disposed so as to cover the light-emitting element are disposed in a planar manner on a support member having an adhesive layer disposed thereon; Cutting and removing a part of the first light-emitting unit; Applying a solvent to the adhesive layer exposed after a part of the first light-emitting unit is removed to remove the remaining part of the first light-emitting unit; Attaching a second light-emitting unit different from the first light-emitting unit to the upper surface of the base material from which the first light-emitting unit has been removed. A method for manufacturing a planar light source.

2. In the step of cutting and removing a part of the first light-emitting unit, the method for manufacturing a planar light source according to claim 1, wherein a rod-shaped drill is meandered within the first light-emitting unit in a plan view for cutting.

3. In the step of cutting and removing a part of the first light-emitting unit, the method for manufacturing a planar light source according to claim 1, wherein internal cutting is performed so as to leave an outer peripheral portion of the first light-emitting unit in a plan view.

4. After removing the remaining part of the first light-emitting unit, the method for manufacturing a planar light source according to claim 1, further comprising removing the adhesive layer remaining on the upper surface of the base material from which the first light-emitting unit has been removed.

5. Before or after cutting and removing a part of the first light-emitting unit, a blade is inserted into the outer edge of the first light-emitting unit and the adhesive layer directly below the outer edge of the first light-emitting unit. The method for manufacturing a planar light source according to claim 1.

6. In preparing the planar light source, the adhesive layer contains a urethane resin, In removing the remaining part of the first light-emitting unit, the solvent contains at least one of methylpyrrolidone, xylene, and acetic anhydride. The method for manufacturing a planar light source according to claim 1.

7. The method for manufacturing a planar light source according to claim 1, further comprising performing an inspection to identify the first light-emitting unit from among the plurality of light-emitting units in preparing the planar light source.

8. In preparing the planar light source, the covering member includes a reflecting member disposed around the light-emitting element and a light guide member disposed on the light-emitting element and the reflecting member. The method for manufacturing a planar light source according to claim 1.

9. On a support member having an adhesive layer disposed thereon, a light-emitting array in which a plurality of light-emitting units each having a light-emitting element and a covering member disposed so as to cover the light-emitting element are arranged in a planar manner is arranged in an n×m array where n and m are arbitrary natural numbers (excluding n = m = 1), and a planar light source including a first light-emitting array is prepared. Cutting and removing a part of the first light-emitting array. Applying a solvent to the adhesive layer exposed after a part of the first light-emitting array is removed to remove the remaining part of the first light-emitting array. A method for manufacturing a planar light source, comprising attaching a second light-emitting array different from the first light-emitting array to the upper surface of the substrate from which the first light-emitting array has been removed.

10. Preparing a planar light source in which a plurality of light-emitting units including a first light-emitting unit having a light-emitting element and a covering member disposed so as to cover the light-emitting element are arranged in a planar manner on a support member having an adhesive layer disposed thereon. Cutting and removing a part of the first light-emitting unit. Applying a solvent to the adhesive layer exposed after a part of the first light-emitting unit is removed to remove the remaining part of the first light-emitting unit. A method for repairing a planar light source, comprising attaching a second light-emitting unit different from the first light-emitting unit to the upper surface of the substrate from which the first light-emitting unit has been removed.

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