Pressure-sensitive adhesive tape, and production method and use method of the same

Abstract

To provide a pressure-sensitive adhesive ape, and a production method and a use method of the same.SOLUTION: A pressure-sensitive adhesive tape includes a support layer, an adhesive layer 2, and a release layer. The solid content of the adhesive layer 2 contains a crosslinkable acrylic resin, acrylate monomer or its oligomer, an isocyanate-based crosslinking agent, and a photoinitiator. Before the adhesive layer 2 is irradiated with ultraviolet light, a crosslinking curing reaction is not generated on the acrylate monomer or its oligomer. After the adhesive layer 2 is irradiated with ultraviolet light, the photoinitiator generates a free radical initiating polymerization, and crosslinking / curing reaction of the crosslinkable acrylic resin, the acrylate monomer or its oligomer and the isocyanate-based crosslinking agent is performed so as to reduce adhesive force of the adhesive layer 2.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a pressure-sensitive adhesive tape, and more particularly, to a pressure-sensitive adhesive tape that decomposes an adhesive layer by ultraviolet rays, a method for manufacturing the same, and a method for using the same.

Background Art

[0002] In the prior art, in the wafer processing of semiconductors, wafers are processed into small dies including integrated circuits by processes such as laser dicing, plasma dicing, scribing dicing, or saw dicing, and these dies are individually separated for packaging or may be left unpackaged for use in larger circuits.

[0003] In the cutting (dicing, cutting) operation, a tape that decomposes the adhesive layer by ordinary light is used to attach the wafer to be cut to a carrier substrate. Since ultraviolet rays can penetrate the carrier substrate, the adhesive layer of the tape can be decomposed, which is advantageous for the subsequent die pickup.

[0004] However, the adhesive strength between the pressure-sensitive adhesive tape and the substrate to be cut is insufficient, leading to problems such as die dropout and easy scattering of materials in the cutting process (dicing process). On the other hand, after exposure to UV, the adhesive strength between the pressure-sensitive adhesive tape and the substrate to be cut is too high, making it difficult to peel off the pressure-sensitive adhesive from the cut substrate, and the adhesive layer may remain. That is, even if the adhesive layer is decomposed, the die still adheres to the adhesive layer. That is, even after exposure to UV, the adhesive force of the pressure-sensitive adhesive tape is reduced, but the die is still difficult to drop off. Therefore, conventional pressure-sensitive adhesive tapes have difficulties to overcome in wafer dicing in semiconductor processes.

[0005] Therefore, in view of the above-described problems being improvable, the present inventor has conducted intensive research and applied theories in combination, and as a result of these efforts, has arrived at the present invention as a method with a reasonable design that can effectively improve the above problems.

Summary of the Invention

Problems to be Solved by the Invention

[0006] The technical problem to be solved by the present invention is to provide a pressure-sensitive adhesive tape, a method for manufacturing the same, and a method for using the same, which overcome the problems of die detachment in the semiconductor cutting process and the phenomenon that the die still adheres to the adhesive layer even after the adhesive layer is decomposed, in view of the deficiencies of the prior art. The pressure-sensitive adhesive tape according to the present invention is used as a pressure-sensitive adhesive tape that decomposes the adhesive layer with ultraviolet rays for semiconductor processes, and can achieve good die pick-up properties.

Means for Solving the Problems

[0007] To solve the above technical problems, one technical means adopted by the present invention is to provide a pressure-sensitive adhesive tape comprising a support layer, an adhesive layer formed on one surface of the support layer, and a peelable release layer formed on a surface of the adhesive layer away from the support layer. The solid content of the adhesive layer includes a crosslinkable acrylic resin, an acrylate monomer or its oligomer, an isocyanate-based crosslinking agent, and a photoinitiator. Before the adhesive layer is irradiated with ultraviolet rays, the acrylate monomer or its oligomer does not undergo a crosslinking and curing reaction. After the adhesive layer is irradiated with ultraviolet rays, the photoinitiator generates free radicals that initiate polymerization, and a crosslinking and curing reaction of the crosslinkable acrylic resin, the acrylate monomer or its oligomer, and the isocyanate-based crosslinking agent is carried out so that the adhesive strength of the adhesive layer is reduced.

[0008] Preferably, assuming that the total weight of the solid content in the adhesive layer is 100 wt%, the content of the crosslinkable acrylic resin is 50 wt% to 95 wt%, the content of the acrylate monomer or its oligomer is 1 wt% to 40 wt%, the content of the isocyanate-based crosslinking agent is 0.1 wt% to 10 wt%, and the content of the photoinitiator is 0.1 wt% to 10 wt%.

[0009] Preferably, assuming that the total weight of the solid content in the adhesive layer is 100 wt%, the content of the crosslinkable acrylic resin is 50 wt% to 90 wt%, the content of the acrylate monomer or its oligomer is 5 wt% to 35 wt%, the content of the isocyanate-based crosslinking agent is 0.1 wt% to 5 wt%, and the content of the photoinitiator is 0.1 wt% to 5 wt%.

[0010] Preferably, the crosslinkable acrylic resin is polymerized from at least one selected from the group of monomer components consisting of 2-hydroxyethyl acrylate, methyl acrylate, 2-methoxyethyl acrylate, acrylic acid, acrylonitrile, 2-ethylhexyl methacrylate, 2-phenoxyethyl acrylate, and butyl acrylate, and the molecular structure of the crosslinkable acrylic resin contains at least an acrylic group, a hydroxyl group, and a carboxyl group.

[0011] Preferably, the acrylate monomer or its oligomer is at least one selected from the group consisting of bisphenol A acrylate, isopropylidene bis[(4,1-phenylene)oxyethylene] diacrylate ((1-methylethylidene)bis(4,1-phenyleneoxy-2,1-ethanediyl) diacrylate), ethoxylated bisphenol A dimethacrylate, isobornyl acrylate, and polyurethane acrylate.

[0012] Preferably, the isocyanate-based crosslinking agent is a diisocyanate, and the diisocyanate is at least one selected from the group consisting of toluene diisocyanate, isophorone diisocyanate, diphenylmethane diisocyanate, dicyclohexylmethane diisocyanate, and lysine diisocyanate.

[0013] Preferably, the photoinitiator is at least one selected from the group consisting of benzophenone, 2-hydroxy-2-methyl-1-propiophenone, 2,2-dimethoxy-1,2-diphenylethane-1-one, 1-hydroxycyclohexyl phenyl ketone, 2,4,6-trimethylbenzoyl diphenylphosphine oxide, N-phenylglycine, 9-phenylacridine, benzoin, benzyl dimethyl ketal, 4,4'-bis(diethylamino)benzophenone, and 2,4,5-triarylimidazole dimer.

[0014] To solve the above technical problems, another technical means adopted by the present invention is to provide a method for manufacturing a pressure-sensitive adhesive tape. The method for manufacturing a pressure-sensitive adhesive tape includes providing a release layer, applying a paint containing a solid content and a solvent component to one surface of the release layer, removing the solvent component in the paint so as to form an adhesive layer on the one surface of the release layer, and laminating a support layer to the surface of the adhesive layer away from the release layer to manufacture a pressure-sensitive adhesive tape. The solid content includes a crosslinkable acrylic resin, an acrylate monomer or its oligomer, an isocyanate-based crosslinking agent, and a photoinitiator. The solvent component is at least one of ethyl acetate and methyl ethyl ketone, and the solvent component:solid content (weight ratio) is 5:95 to 30:70.

[0015] Here, the release layer is peelable from the adhesive layer so that the adhesive layer is exposed to the external environment and laminated to a substrate to be cut.

[0016] Here, before the adhesive layer is irradiated with ultraviolet light, no crosslinking and curing reaction occurs in the acrylate monomer or its oligomer.

[0017] Here, after the adhesive layer is irradiated with ultraviolet rays, the photoinitiator generates free radicals that initiate polymerization, and a crosslinking and curing reaction is carried out between the crosslinkable acrylic resin, the acrylate monomer or its oligomer, and the isocyanate-based crosslinking agent so that the adhesive strength of the adhesive layer is reduced.

[0018] To solve the above technical problems, another technical means adopted by the present invention is to provide a method for using a pressure-sensitive adhesive tape. The method for using the pressure-sensitive adhesive tape includes providing the pressure-sensitive adhesive tape; peeling the release layer in the pressure-sensitive adhesive tape from one surface of the adhesive layer so that the adhesive layer is exposed to the external environment; providing a substrate to be cut, and installing the adhesive layer of the pressure-sensitive adhesive tape to face the substrate to be cut; bonding the pressure-sensitive adhesive tape to the substrate to be cut through the adhesive layer, wherein the first peel strength between the adhesive layer and the substrate to be cut is 200 gf / inch to 2,500 gf / inch; performing a cutting operation on the substrate to be cut to form a cut substrate; irradiating the adhesive layer of the pressure-sensitive adhesive tape with ultraviolet rays, so that the photoinitiator generates free radicals that initiate polymerization, and performing a crosslinking and curing reaction between the crosslinkable acrylic resin, the acrylate monomer or its oligomer, and the isocyanate-based crosslinking agent so that the adhesive strength of the adhesive layer is reduced.

[0019] Here, after being irradiated with the ultraviolet rays, the second peel strength between the adhesive layer and the cut substrate is 10 to 75 gf / inch.

[0020] Preferably, the wavelength of the ultraviolet rays is 300 nm to 380 nm, the exposure energy of the ultraviolet rays to the adhesive layer is more than 300 mJ / cm 2 and less than 2,000 mJ / cm 2 and the irradiation time is 5 seconds to 2 minutes.

Advantages of the Invention

[0021] As an advantageous effect of the present invention, the pressure-sensitive adhesive tape, its manufacturing method, and its usage method according to the present invention overcome the phenomenon that the die falls off during the semiconductor cutting process and the die still adheres to the adhesive layer even after the adhesive layer is decomposed, due to technical features such as "the solid content of the adhesive layer includes a crosslinkable acrylic resin, an acrylate monomer or its oligomer, an isocyanate-based crosslinking agent, and a photoinitiator", and "before the adhesive layer is irradiated with ultraviolet light, the acrylate monomer or its oligomer does not undergo a crosslinking and curing reaction, and after the adhesive layer is irradiated with ultraviolet light, the photoinitiator generates free radicals that initiate polymerization, and a crosslinking and curing reaction of the crosslinkable acrylic resin, the acrylate monomer or its oligomer, and the isocyanate-based crosslinking agent is carried out so that the adhesive strength of the adhesive layer is reduced."

[0022] The pressure-sensitive adhesive tape according to the present invention provides a pressure-sensitive adhesive tape that decomposes the adhesive layer with ultraviolet light, which is particularly suitable for semiconductor processes. The pressure-sensitive adhesive tape can achieve good die pick-up performance in the wafer cutting process in semiconductor processes.

Brief Description of the Drawings

[0023]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

[0024] To better understand the features and technical content of the present invention, please refer to the following detailed description of the present invention and the accompanying drawings. However, the provided accompanying drawings are for reference and explanation only and are not intended to limit the scope of the claims of the present invention.

[0025] Hereinafter, the "pressure-sensitive adhesive tape, its manufacturing method, and its usage method" will be described according to a specific embodiment, and those skilled in the art can understand the advantages and effects of the present invention based on the content disclosed in this specification. The present invention can be implemented or applied according to other different specific embodiments, and for each detail in this specification, various modifications and changes can be made based on different viewpoints and applications without departing from the concept of the present invention.

[0026] Also, as described in advance, the accompanying drawings of the present invention are simple schematic explanations and are not drawn based on actual sizes. The technical content of the present invention will be described in more detail based on the following embodiments, but the disclosed content does not limit the protection scope of the present invention.

[0027] It should be understood that in this specification, terms such as "first", "second", and "third" may be used to describe various elements or signals, but these elements or signals are not limited by these terms. These terms are mainly used to distinguish one element from another element, or one signal from another signal. Also, the term "or" used in this specification may include any one or a combination of a plurality of the items listed in relation to the actual situation.

[0028] [Pressure-Sensitive Adhesive Tape] As shown in FIG. 1, in an embodiment according to the present invention, there is provided a pressure-sensitive adhesive tape 100 capable of decomposing an adhesive layer 2 with ultraviolet light. The pressure-sensitive adhesive tape 100 is applicable to the cutting operation of elements, and in particular, is applicable to the wafer cutting operation and the cutting operation of package elements in the semiconductor process, but the present invention is not limited thereto.

[0029] In the semiconductor process, the element to be cut with which the pressure-sensitive adhesive tape 100 is bonded may be, for example, a wafer, a light-emitting diode (LED) substrate, a glass substrate, or a ceramic substrate. Also, the wafer and the light-emitting diode substrate can be cut so as to become dies including integrated circuits in the cutting process.

[0030] Subsequently, as shown in FIG. 1, the pressure-sensitive adhesive tape 100 according to an embodiment of the present invention includes a support layer 1, an adhesive layer 2, and a release layer 3 laminated from bottom to top. That is, the adhesive layer 2 is formed on one surface of the support layer 1 (for example, the upper surface of the support layer 1 in FIG. 1), and the release layer 3 may be formed on the surface of the adhesive layer 2 away from the support layer 1 (for example, the upper surface of the adhesive layer 2 in FIG. 1), but the present invention is not limited thereto. In actual application, the installation directions of the support layer 1, the adhesive layer 2, and the release layer 3 in the pressure-sensitive adhesive tape 100 may be changed as needed. For example, the support layer 1 may be the uppermost layer, the release layer 3 may be the lowermost layer, or the adhesive layer 2 may be between the support layer 1 and the release layer 3. Next, in order to easily understand the present invention, other material characteristics of each layer in the pressure-sensitive adhesive tape 100 according to an embodiment of the present invention will be described below, and the connection relationship between each layer will also be appropriately described.

[0031] [Support layer] The support layer 1 may be, for example, a polyolefin film (PO film) or a polyvinyl chloride film (PVC film). Regarding the thickness range, the first thickness D1 of the support layer 1 is 50 μm to 180 μm, preferably 80 μm to 150 μm. Here, the material type of the polyolefin film may be at least one selected from the group consisting of, for example, polyethylene (PE), polypropylene (PP), polymethylpentene (PMP), and polybutene-1 (PB-1).

[0032] Preferably, the material type of the polyolefin film may be, for example, polypropylene, but the present invention is not limited thereto.

[0033] [Adhesive layer] The adhesive layer 2 is formed on one surface of the support layer 1. After the release layer 3 is peeled off from the adhesive layer 2, the adhesive layer 2 is exposed to the external environment and bonded to the substrate S to be cut.

[0034] The adhesive layer 2 may be bonded to the back surface of the substrate S to be cut (for example, a wafer, an LED substrate, a glass / ceramics substrate) when performing the cutting process of the element. The second thickness D2 of the adhesive layer 2 is 5 μm to 35 μm, preferably 8 μm to 33 μm, but the present invention is not limited thereto.

[0035] Furthermore, the solid content of the adhesive layer 2 is (a) a self-crosslinking acrylic resin, (b) an acrylate monomer or its oligomer, (c) an isocyanate crosslinking agent, (d) a photo-initiator, and includes these.

[0036] Taking the total weight of the solid content of the adhesive layer 2 as 100 wt%, the content of the crosslinkable acrylic resin is 50 wt% to 95 wt%, preferably 50 wt% to 90 wt%. The content of the acrylate monomer or its oligomer is 1 wt% to 40 wt%, preferably 5 wt% to 35 wt%. The content of the isocyanate-based crosslinking agent is 0.1 wt% to 10 wt%, preferably 0.1 wt% to 5 wt%. In addition, the content of the photoinitiator is 0.1 wt% to 10 wt%, preferably 0.1 wt% to 5 wt%. Further explanation is that the adhesive layer 2 is formed by applying a paint formed of the solid content and a solvent component to the support layer 1 or the release layer 3 and then removing the solvent, but the present invention is not limited thereto.

[0037] [Crosslinkable acrylic resin] The crosslinkable acrylic resin has a crosslinking group or a crosslinking system introduced into the main chain of the acrylic resin molecular structure, and the weight average molecular weight (Mw) of the crosslinkable acrylic resin (before being irradiated with UV light) is 120,000 to 650,000. The crosslinkable acrylic resin can generate a polymer having a network structure by the reaction between crosslinking groups.

[0038] Preferably, the crosslinkable acrylic resin may be polymerized from at least one selected from the group of monomer components consisting of 2-hydroxyethyl acrylate (HEA), methyl acrylate (MA), 2-methoxyethyl acrylate (MEA), acrylic acid (AA), acrylonitrile, 2-ethylhexyl methacrylate (EHA), 2-phenoxyethyl acrylate (PEA), and butyl acrylate (BA).

[0039] The molecular structure of the crosslinkable acrylic resin contains at least an acrylic group, a hydroxyl group, and a carboxyl group.

[0040] In one embodiment of the present invention, the crosslinkable acrylic resin can be formed, for example, by introducing N-hydroxymethylacrylamide and acrylic acid into an acrylic resin formed of acrylonitrile, methyl acrylate, and butyl acrylate, but the present invention is not limited thereto.

[0041] [Acrylate monomer or its oligomer] The molecular structure of the acrylate monomer or its oligomer has an alkenyl group (for example, a vinyl group or a propylene group). The acrylate monomer may be at least one of the following compounds.

[0042]

Chemical formula

[0043]

Chemical formula

[0044]

Chemical formula

[0045]

Chemical formula

[0046] The oligomer of the acrylate monomer may be, for example, polyurethane acrylate (PUA).

[0047] Hereinafter, m = 3 to 20 and n = 3 to 20. [Chemical formula]

[0048] In one specific example of the present invention, bisphenol A dimethyl acrylate is employed as the acrylate monomer, but the present invention is not limited thereto.

[0049] [Isocyanate crosslinking agent] The isocyanate crosslinking agent can improve the degree of polymerization of the resin composition in the adhesive layer 2.

[0050] Here, the isocyanate crosslinking agent may be, for example, diisocyanate.

[0051] In an embodiment of the present invention, the diisocyanate may be at least one selected from the group consisting of toluene diisocyanate (TDI), isophorone diisocyanate (IPDI), diphenylmethane diisocyanate (MDI), dicyclohexylmethane diisocyanate (H12MDI), and lysine diisocyanate (LDI).

[0052] In a specific example of the present invention, the isocyanate crosslinking agent is isophorone diisocyanate (IPDI), but the present invention is not limited thereto.

[0053] [Photoinitiator] In the subsequent layer 2, the photoinitiator absorbs radiant energy upon irradiation with ultraviolet light, and through a chemical change, the photoinitiator generates free radicals that initiate polymerization, and further performs a crosslinking and curing reaction of the crosslinkable acrylic resin, the acrylate monomer or its oligomer, and the isocyanate-based crosslinking agent.

[0054] In one embodiment of the present invention, the photoinitiator is at least one selected from the group consisting of benzophenone, 2-hydroxy-2-methyl-1-propiophenone, 2,2-dimethoxy-1,2-diphenylethane-1-one, 1-hydroxycyclohexyl phenyl ketone, 2,4,6-trimethylbenzoyl diphenylphosphine oxide, N-phenylglycine, 9-phenylacridine, benzoin, benzyl dimethyl ketal, 4,4'-bis(diethylamino)benzophenone, and 2,4,5-triarylimidazole dimer.

[0055] In a specific example of the present invention, the photoinitiator is 1-hydroxycyclohexyl phenyl ketone, that is, the photoinitiator is photoinitiator-184 (that is, Irgacure-184), but the present invention is not limited thereto.

[0056] [Release layer] An adhesive layer 2 is formed on the release layer 3. When performing an element cutting process (for example, wafer dicing), the release layer 3 can be peeled off from the adhesive layer 2 so that the adhesive layer 2 is exposed to the external environment and bonded to the substrate S to be cut.

[0057] Regarding the thickness, the third thickness D3 of the release layer 3 is 25 μm to 45 μm, preferably 28 μm to 40 μm, but the present invention is not limited thereto.

[0058] The release layer 3 may be, for example, a polyester release layer (for example, a PET release layer).

[0059] In one embodiment of the present invention, the polyester release layer can achieve the release effect by, for example, applying silicone oil to the surface of the polyester film or adding an inorganic material to the polyester film to reduce the adhesion on the surface of the polyester film.

[0060] [Mechanism of decomposing the adhesive layer with ultraviolet rays] Regarding the mechanism of decomposing the adhesive layer 2 with ultraviolet rays, after the photoinitiator in the adhesive layer 2 is irradiated with ultraviolet rays, the photoinitiator generates free radicals that initiate polymerization, and further performs a crosslinking and curing reaction between the crosslinkable acrylic resin, the acrylate monomer or its oligomer, and the isocyanate-based crosslinking agent.

[0061] Before being irradiated with ultraviolet rays, the adhesive layer 2 has a certain adhesive force with the substrate S to be cut (for example, a wafer, an LED substrate, a glass substrate, a ceramic substrate) so as to prevent the substrate S to be cut from falling off after being diced (for example, the die from falling off, etc.).

[0062] After being irradiated with ultraviolet rays for a predetermined time, the adhesive force of the adhesive layer 2 is reduced by the crosslinking and curing reaction, and the effect of decomposing the adhesive layer 2 with ultraviolet rays can be achieved. Thereby, even after decomposing the adhesive layer 2, after the cut substrate S and the adhesive layer 2 are separated, it is possible to avoid the adhesive layer 2 existing on the cut substrate S' or remaining the adhesive layer 2.

[0063] The wavelength of the ultraviolet rays is, for example, 300 nm to 380 nm, preferably 340 nm to 380 nm, particularly preferably 360 nm to 375 nm, but the present invention is not limited thereto.

[0064] The irradiation energy of the ultraviolet rays on the adhesive layer 2 is, for example, more than 300 mJ / cm 2 exceeding 2,000 mJ / cm 2 less than, and preferably more than 500 mJ / cm 2 exceeding 1,500 mJ / cm 2 less than, and preferably 500 mJ / cm2 Greater than 1,000 mJ / cm 2 It is particularly preferable that it is less than.

[0065] In addition, the irradiation time of the ultraviolet ray on the adhesive layer 2 is, for example, 5 seconds to 2 minutes, preferably 10 seconds to 1 minute, and particularly preferably 10 seconds to 45 seconds, but the present invention is not limited thereto.

[0066] To explain further, for example, as shown in FIG. 4, the adhesive layer 2 is disposed so as to be bonded to the base material S to be cut in the cutting process of the element. Before the adhesive layer 2 is irradiated with ultraviolet rays, the first peeling force between the adhesive layer 2 and the base material S to be cut is 200 gf / inch to 2,500 gf / inch. That is, before being irradiated with ultraviolet rays, the adhesive strength between the adhesive layer 2 and the base material S to be cut is high.

[0067] After the adhesive layer 2 is irradiated with ultraviolet rays, the crosslinking and curing reaction of the crosslinkable acrylic resin, acrylate monomer or its oligomer, and isocyanate-based crosslinking agent in the adhesive layer 2 is further performed to form the irradiated adhesive layer 2a (shown in FIG. 6).

[0068] Here, the second peeling strength between the irradiated adhesive layer 2a and the cut base material S' (for example, die) is 10 to 75 gf / inch, and the reduction rate is 75 to 99.9% compared to before irradiation.

[0069] That is, after being irradiated with ultraviolet rays, the adhesive force between the irradiated adhesive layer 2a and the cut base material S' is significantly reduced. Therefore, the irradiated adhesive layer 2a can be easily peeled from the cut base material S' so that the adhesive layer 2 does not remain.

[0070] The measurement methods for the first peel strength and the second peel strength may be carried out, for example, by adopting ASTM D3330. For example, as a measurement method, the adhesive layer 2 is adhered to the substrate S to be cut by rolling a roller back and forth, left for a while and then measured. After the substrate S is fixed to the lower grip and the sample is bent 180 degrees and fixed to the upper grip, the adhesive layer 2 is peeled from the substrate S at a predetermined speed (for example, 300 mm / min), and the average value during peeling is measured. The unit is gf / inch.

[0071] Overall, the photoinitiator in the adhesive layer 2 absorbs radiation energy by ultraviolet irradiation, generates free radicals that initiate polymerization by chemical change, and further effects the decomposition of the adhesive layer 2 by performing a crosslinking and curing reaction between the crosslinkable acrylic resin, the acrylate monomer or its oligomer, and the isocyanate-based crosslinking agent. There is a large difference between the peel strength before irradiation with ultraviolet light and the peel strength after irradiation with ultraviolet light, and it has the ability to control the peel strength within a wide range.

[0072] It should be noted that the crosslinkable acrylic resin and the acrylate monomer (or its oligomer) play an important role in the adhesive layer 2. That is, there is a large difference between the peel strength before irradiation with ultraviolet light and the peel strength after irradiation with ultraviolet light due to the crosslinkable acrylic resin and the acrylate monomer (or its oligomer). If the crosslinkable acrylic resin or acrylate monomer of the present invention is not added to the adhesive layer 2, the difference between the peel strength before irradiation with ultraviolet light and the peel strength after irradiation with ultraviolet light of the adhesive layer 2 becomes small. When adhering to the substrate S of the tape, the adhesive layer 2 may remain on the surface of the substrate S, and phenomena such as the material of the adhesive layer 2 and degumming may occur even after irradiation.

[0073] [Manufacturing Method of Pressure-Sensitive Adhesive Tape] The above content is an explanation of the material characteristics and structural characteristics of the pressure-sensitive adhesive tape 100 according to the embodiments of the present invention. Next, the manufacturing method of the pressure-sensitive adhesive tape 100 according to the embodiments of the present invention will be described. The manufacturing method of the pressure-sensitive adhesive tape 100 includes step S110, step S120, and step S130. It should be noted that the order and operation method of each step in this embodiment can be adjusted according to needs and are not limited thereto.

[0074] The step S110 includes providing a release layer 3. The release layer 3 may be, for example, a polyester release layer (PET release film).

[0075] The step S120 includes applying an adhesive layer 2 coating liquid composition to one surface of the release layer 3 and forming an adhesive layer 2 on the one surface of the release layer 3 by removing the solvent component in the adhesive layer 2 coating liquid composition.

[0076] Here, the coating method in S120 is to perform coating operations such as roller coating, screen coating, gravure coating, and offline coating, and perform desolventization treatment or curing treatment on the adhesive layer 2 coating liquid composition to form a film of the applied adhesive layer 2 composition to manufacture the adhesive layer 2.

[0077] Here, the adhesive layer 2 coating liquid composition (paint) may include a solid content and a solvent component. The solid content includes (a) a crosslinkable acrylic resin, (b) an acrylate monomer or its oligomer, (c) an isocyanate-based crosslinking agent, and (d) a photoinitiator in the implementation method. Since the material characteristics and formulation of the solid content are as shown in the above embodiment, they will not be described repeatedly here.

[0078] The solvent component dilutes the solid content so as to impart a predetermined viscosity to the adhesive layer 2 coating liquid composition. Thereby, the adhesive layer 2 coating liquid composition can be more easily applied to the release layer 3 and is easier to mold. Here, the solvent component:solid content (weight ratio) is 5:95 to 30:70. The solvent component is, for example, at least one of ethyl acetate (EAC) and methyl ethyl ketone (MEK). Preferably, the solvent component is ethyl acetate, but the present invention is not limited thereto.

[0079] It should be noted that since the acrylate monomer or its oligomer does not undergo a crosslinking and curing reaction before being irradiated with ultraviolet rays, the adhesive layer 2 has a high adhesive force and can adhere more appropriately to the substrate S to be cut. Also, after the adhesive layer 2 is irradiated with ultraviolet rays, the adhesive force is significantly reduced and it becomes easier to separate from the substrate S.

[0080] The step S130 includes manufacturing the pressure-sensitive adhesive tape 100 by bonding the support layer 1 to the surface of the adhesive layer 2 away from the release layer 3.

[0081] It should be noted that in the present embodiment, an example is described in which the adhesive layer 2 is first formed on the release layer 3 and then the support layer 1 is bonded to the adhesive layer 2, but the present invention is not limited thereto. For example, the adhesive layer 2 may be first formed on the support layer 1 and then the release layer 3 may be bonded to the adhesive layer 2.

[0082] [Method of using the pressure-sensitive adhesive tape] The above content describes the material characteristics, structural characteristics, and manufacturing method of the pressure-sensitive adhesive tape 100 according to the embodiments of the present invention. Subsequently, the usage method of the pressure-sensitive adhesive tape 100 according to the embodiments of the present invention will be described below. The manufacturing method of the barrier film includes process S210, process S220, process S230, process S240, process S250, process S260, and process S170. It should be noted that the order and operation method of each process in this embodiment can be adjusted according to needs and are not limited thereto.

[0083] As shown in FIG. 2, in the process S210, the pressure-sensitive adhesive tape 100 according to the embodiment is provided, and the release layer 3 of the pressure-sensitive adhesive tape 100 is peeled off from the adhesive layer 2, thereby exposing the adhesive layer 2 to the external environment.

[0084] As shown in FIG. 3, in the process S220, a substrate S to be cut (for example, a die) is provided, and the adhesive layer 2 of the pressure-sensitive adhesive tape 100 is installed so as to face the substrate S to be cut.

[0085] As shown in FIG. 4, in the process S230, the pressure-sensitive adhesive tape 100 is bonded to the substrate S to be cut through its adhesive layer 2. Here, the first peeling force between the adhesive layer 2 and the substrate S to be cut is 200 - 2,500 gf / inch.

[0086] As shown in FIG. 5, in the process S240, by performing a cutting process on the substrate S to be cut, the substrate S to be cut is cut from the surface away from the adhesive layer 2 and formed as a cut substrate S' (for example, a wafer is diced into small dies including integrated circuits).

[0087] As shown in FIG. 6, in the step S250, when the adhesive layer 2 of the pressure-sensitive adhesive tape 100 is irradiated with ultraviolet rays, the photoinitiator in the adhesive layer 2 absorbs radiant energy by the irradiation of ultraviolet rays, and the photoinitiator generates free radicals that initiate polymerization by chemical changes. Further, a crosslinking and curing reaction is performed among the crosslinkable acrylic resin, the acrylate monomer or its oligomer, and the isocyanate-based crosslinking agent, and the irradiated adhesive layer 2a is formed.

[0088] In one embodiment of the present invention, the wavelength of the ultraviolet rays is 300 nm to 380 nm, and the exposure energy of the ultraviolet rays to the adhesive layer 2 is 300 mJ / cm 2 exceeding 2,000 mJ / cm 2 and the irradiation time may be 5 seconds to 2 minutes, but the present invention is not limited thereto.

[0089] Here, the second peel strength between the irradiated adhesive layer 2a and the cut substrate S' is 10 to 75 gf / inch, and the reduction amplitude is 75 to 99.9% compared to before irradiation. Therefore, after being irradiated with ultraviolet rays, the adhesive force between the irradiated adhesive layer 2a and the cut substrate S' is significantly reduced, and it becomes easy to peel from each other.

[0090] As shown in FIG. 7, in the step S260, by separating the cut substrate S' and the irradiated adhesive layer 2a, the cut substrate S' is divided into a plurality of small sheet-like materials (for example, a plurality of small dies including integrated circuits).

[0091] With the above-described configuration, the pressure-sensitive adhesive tape 100 according to the embodiment of the present invention can firmly adhere to the substrate S to be cut so that the adhesive layer 2 does not fall off the substrate S to be cut because the adhesive force between the adhesive layer 2 and the substrate S to be cut is high. When performing the cutting process, the adhesive layer 2 does not cause degumming or adhesive threads.

[0092] After being irradiated with ultraviolet rays, the adhesive force between the irradiated adhesive layer 2a and the cut base material S' is significantly reduced. The irradiated adhesive layer 2a can be easily peeled off from the cut base material S' so that the adhesive layer 2 does not remain.

[0093] [Experimental data and measurement results] In order to prove the technical effects of the pressure-sensitive adhesive tape 100 according to the embodiments of the present invention, the following will be described with experimental data and results. However, the scope of protection of the present invention is not limited to these examples.

[0094] <Example 1> 50 parts by weight of a crosslinkable acrylic resin (10AM, full name HT-6455UH-10AM, purchased from Shinso Industry Co., Ltd.), 25 parts by weight of an acrylate monomer (bisphenol A acrylate), 0.5 parts by weight of an isocyanate-based crosslinking agent (isophorone diisocyanate, IPDI), 0.3 parts by weight of a photoinitiator (Irgacure-184), and 24.2 parts by weight of a solvent (ethyl acetate, EAC) were adjusted as a paint. The paint was applied to a polyester release film (PET release film), and the solvent in the paint was removed to form an adhesive layer 2 (thickness: 10 μm) on the release film. The production of the pressure-sensitive adhesive tape 100 was completed by laminating the support layer 1 (polypropylene support layer) on the surface of the adhesive layer 2 away from the polyester release film.

[0095] The manufacturing methods of the pressure-sensitive adhesive tapes 100 according to Examples 2 to 7 are basically the same as the manufacturing method of Example 1, but their differences lie in the manufacturing conditions and measurement results of the adhesive layer 2. Their differences are as shown in Table 1 below.

[0096] The manufacturing methods of the pressure-sensitive adhesive tapes 100 according to Comparative Examples 1 to 3 are basically the same as the manufacturing method of Example 1, but their differences are that acrylate monomers are added to the adhesive layers 2 of Comparative Examples 1 to 3. The manufacturing conditions and measurement results of the adhesive layer 2 are as shown in Table 2 below.

[0097] Here, in the crosslinkable acrylic resin, 10AM is HT-6455UH-10AM purchased from TOTAL ACRYLIC POLYMER INDUSTRY (TAPI) CORPORATION. SD-488 is the UV-degradable acrylic adhesive layer 2 purchased from Nanbao Resin Chemical Co., Ltd. NC22 is the UV-degradable glue purchased from VISTAWIDE CO., LTD.

[0098] After the release layer 3 is peeled off from the pressure-sensitive adhesive tape 100 manufactured in Examples 1 to 7 and Comparative Examples 1 to 3, it is bonded to the substrate S (for example, a wafer) to which the adhesive layer 2 is to be cut, and the peel strength before the adhesive layer 2 is irradiated with ultraviolet light and the peel strength after being irradiated with ultraviolet light are measured, and it is observed whether the adhesive layer 2 of the adhesive layer 2 remains on the substrate S to be cut.

[0099] <Peel Strength> The adhesive layer 2 was bonded to the substrate S to be cut by rolling a roller back and forth once and left for a while for measurement. As a measurement method, ASTM D3330 may be adopted, and the unit of peel strength is gf / inch. It includes the peel strength before decomposing the adhesion with UV light and the peel strength after decomposing the adhesion with UV light. Here, the energy of the UV light is 500 mJ / cm 2 and the irradiation time was 15 seconds.

[0100] <Example>

Table 1

[0101] <Comparative Example 2>

Table 2

[0102] [Measurement Results] The pressure-sensitive adhesive tape 100 manufactured in the above Examples 1 to 7 had high peel strengths (270 gf / inch to 2,200 gf / inch) before the adhesive layer 2 was decomposed by UV light. In particular, in Examples 1 and 3 to 5, when the amount of acrylate monomer used was 15 to 25 parts by weight, it had relatively high peel strengths (850 to 2,200 gf / inch) before the adhesive layer 2 was decomposed by UV light. Further, after the pressure-sensitive adhesive tape 100 manufactured in Examples 1 to 7 was decomposed by UV light, the peel strength was significantly reduced (30 to 75 gf / inch). In addition, after the pressure-sensitive adhesive tape 100 manufactured in Examples 1 to 7 was separated from the base material S, the adhesive layer 2 did not remain in any case, so it was particularly suitable for wafer dicing operations in semiconductor processes. It should be noted that in Examples 1 and 3 to 5, the usage ratio of the crosslinkable acrylic resin to the acrylate monomer (weight ratio) was 50:25 to 70:15, so the pressure-sensitive adhesive tape 100 was given an excellent difference in peel strength.

[0103] On the other hand, the peel strengths of the pressure-sensitive adhesive tapes 100 manufactured in Comparative Examples 1 to 3 before being decomposed by UV light were ordinary (370 to 730 gf / inch). Also, after the pressure-sensitive adhesive tapes 100 manufactured in Comparative Examples 1 to 3 were decomposed by UV light, the peel strengths were not significantly reduced (220 to 365 gf / inch), and the reduction rate was less than 50% in all cases. After the pressure-sensitive adhesive tapes 100 manufactured in Comparative Examples 1 to 3 were peeled from the base material S, in some of the comparative examples, the adhesive layer 2 remained, and in some of the comparative examples, the peel strength increased and it became difficult to peel from the base material S, so die damage was likely to occur.

[0104] [Advantageous Effects According to the Embodiment] As an advantageous effect of the present invention, the pressure-sensitive adhesive tape 100, its manufacturing method, and its usage method according to the present invention overcome the phenomenon that dies fall off during the semiconductor cutting process and that the dies still adhere to the adhesive layer 2 even after the adhesive layer 2 is decomposed, due to technical features such as "the solid content of the adhesive layer 2 includes a crosslinkable acrylic resin, an acrylate monomer or its oligomer, an isocyanate-based crosslinking agent, and a photoinitiator" and "before the adhesive layer 2 is irradiated with ultraviolet light, the acrylate monomer or its oligomer does not undergo a crosslinking and curing reaction, and after the adhesive layer 2 is irradiated with ultraviolet light, the photoinitiator generates free radicals that initiate polymerization, and the crosslinking and curing reaction of the crosslinkable acrylic resin, the acrylate monomer or its oligomer, and the isocyanate-based crosslinking agent is carried out so that the adhesive strength of the adhesive layer 2 is reduced."

[0105] The pressure-sensitive adhesive tape 100 according to the present invention provides a pressure-sensitive adhesive tape 100 that decomposes the adhesive layer 2 with ultraviolet light and is particularly suitable for semiconductor processes. The pressure-sensitive adhesive tape 100 can achieve good die pick-up properties.

[0106] The content disclosed above is only a preferred executable embodiment of the present invention, and the scope of the claims of the present invention is not limited thereto. Therefore, all equivalent technical modifications made using the content of the specification and drawings of the present invention are included in the scope of the claims of the present invention.

Explanation of Reference Numerals

[0107] 100 Pressure-sensitive adhesive tape 1 Support layer 2 Adhesive layer 2a Irradiated adhesive layer 3 Release layer D1 First thickness D2 Second thickness D3 Third thickness S Substrate to be cut S’ Cut substrate

Claims

1. A pressure-sensitive adhesive tape comprising a support layer, an adhesive layer formed on one surface of the support layer, and a peelable release layer formed on a surface of the adhesive layer that is away from the support layer, wherein the solid content of the adhesive layer contains a crosslinkable acrylic resin, an acrylate monomer or its oligomer, an isocyanate-based crosslinking agent, and a photoinitiator, before the adhesive layer is irradiated with ultraviolet light, the acrylate monomer or its oligomer does not undergo a crosslinking and curing reaction, after the adhesive layer is irradiated with ultraviolet light, the photoinitiator generates free radicals that initiate polymerization, and the crosslinking and curing reaction of the crosslinkable acrylic resin, the acrylate monomer or its oligomer, and the isocyanate-based crosslinking agent is carried out so that the adhesive strength of the adhesive layer is reduced. A pressure-sensitive adhesive tape characterized by this.

2. Taking the total weight of the solid content in the adhesive layer as 100 wt%, the content of the crosslinkable acrylic resin is 50 wt% to 95 wt%, the content of the acrylate monomer or its oligomer is 1 wt% to 40 wt%, and the content of the isocyanate-based crosslinking agent is 0.1 wt% to 10 wt%, and the content of the photoinitiator is 0.1 wt% to 10 wt%. The pressure-sensitive adhesive tape according to Claim 1.

3. Taking the total weight of the solid content in the adhesive layer as 100 wt%, the content of the crosslinkable acrylic resin is 50 wt% to 90 wt%, the content of the acrylate monomer or its oligomer is 5 wt% to 35 wt%, and the content of the isocyanate-based crosslinking agent is 0.1 wt% to 5 wt%, and the content of the photoinitiator is 0.1 wt% to 5 wt%. The pressure-sensitive adhesive tape according to Claim 2.

4. The crosslinkable acrylic resin is polymerized from at least one selected from the group of monomer components consisting of 2-hydroxyethyl acrylate, methyl acrylate, 2-methoxyethyl acrylate, acrylic acid, acrylonitrile, 2-ethylhexyl methacrylate, 2-phenoxyethyl acrylate, and butyl acrylate. The molecular structure of the crosslinkable acrylic resin contains at least an acrylic group, a hydroxyl group, and a carboxyl group. The pressure-sensitive adhesive tape according to Claim 1.

5. The acrylate monomer or its oligomer is at least one selected from the group consisting of bisphenol A acrylate, isopropylidene bis[(4,1-phenylene)oxyethylene] diacrylate ((1-methylethylidene)bis(4,1-phenyleneoxy-2,1-ethanediy l) diacrylate), ethoxylated bisphenol A dimethacrylate, isobornyl acrylate, and polyurethane acrylate. The pressure-sensitive adhesive tape according to claim 1.

6. The isocyanate-based crosslinking agent is a diisocyanate, and the diisocyanate is at least one selected from the group consisting of toluene diisocyanate, isophorone diisocyanate, diphenylmethane diisocyanate, dicyclohexylmethane diisocyanate, and lysine diisocyanate. The pressure-sensitive adhesive tape according to claim 1.

7. The photoinitiator is at least one selected from the group consisting of benzophenone, 2-hydroxy-2-methyl-1-propiophenone, 2,2-dimethoxy-1,2-diphenylethane-1-one, 1-hydroxycyclohexyl phenyl ketone, 2,4,6-trimethylbenzoyl diphenylphosphine oxide, N-phenylglycine, 9-phenylacridine, benzoin, benzyl dimethyl ketal, 4,4'-bis(diethylamino)benzophenone, and 2,4,5-triaryl imidazole dimer. The pressure-sensitive adhesive tape according to claim 1.

8. Providing a release layer; Applying a paint containing a solid content and a solvent component to one surface of the release layer, wherein the solid content includes a crosslinkable acrylic resin, an acrylate monomer or its oligomer, an isocyanate-based crosslinking agent, and a photoinitiator, and the solvent component is at least one of ethyl acetate and methyl ethyl ketone, and the solvent component:solid content (weight ratio) is 5:95 to 30:70; Removing the solvent component in the paint so as to form an adhesive layer on the one surface of the release layer; Laminating a support layer to the surface of the adhesive layer that is away from the release layer to produce a pressure-sensitive adhesive tape. The release layer is peelable from the adhesive layer so as to be attached to a substrate to be cut with the adhesive layer exposed to the external environment. Before the adhesive layer is irradiated with ultraviolet rays, the acrylate monomer or its oligomer does not undergo a crosslinking and curing reaction. After the adhesive layer is irradiated with ultraviolet rays, the photoinitiator generates free radicals that initiate polymerization, and a crosslinking and curing reaction is carried out between the crosslinkable acrylic resin, the acrylate monomer or its oligomer, and the isocyanate-based crosslinking agent so that the adhesive strength of the adhesive layer is reduced. A method for manufacturing a pressure-sensitive adhesive tape, characterized in that.

9. Providing the pressure-sensitive adhesive tape according to any one of claims 1 to 7; Peeling the release layer in the pressure-sensitive adhesive tape from the one surface of the adhesive layer so that the adhesive layer is exposed to the external environment; Providing a substrate to be cut, and installing the adhesive layer of the pressure-sensitive adhesive tape so as to face the substrate to be cut; Bonding the pressure-sensitive adhesive tape to the substrate to be cut through the adhesive layer, wherein a first peel strength between the adhesive layer and the substrate to be cut is 200 gf / inch to 2,500 gf / inch; Performing a cutting operation on the substrate to be cut to form a cut substrate; By irradiating the adhesive layer of the pressure-sensitive adhesive tape with ultraviolet rays, the photoinitiator generates free radicals that initiate polymerization, and a crosslinking and curing reaction of the crosslinkable acrylic resin, the acrylate monomer or its oligomer, and the isocyanate-based crosslinking agent is carried out so that the adhesive strength of the adhesive layer is reduced. After being irradiated with the ultraviolet rays, a second peel strength between the adhesive layer and the cut substrate is 10 to 75 gf / inch. A method for using the pressure-sensitive adhesive tape, characterized in that.

10. The wavelength of the ultraviolet light is 300 nm to 380 nm, and the exposure energy of the ultraviolet light to the adhesive layer is more than 300 mJ / cm ２ but less than 2,000 mJ / cm ２ The method for using the pressure-sensitive adhesive tape according to claim 9, wherein the irradiation time is 5 seconds to 2 minutes.

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