Transparent display device

Abstract

To provide a transparent display device that can be manufactured in various types (or various sizes).SOLUTION: A transparent display device according to one exemplary embodiment comprises: a substrate having a display area with a plurality of pixels having a transmissive portion and a plurality of sub-pixels, and a non-display area adjacent to the display area; and a plurality of dam areas extending from the non-display area to the display area on the substrate to form a closed loop.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] This specification relates to a transparent display device.

Background Art

[0002] As the information society develops, the requirements for display devices for displaying images are increasing in various forms. As a result, recently, various display devices such as liquid crystal display devices (LCDs), plasma display panels (PDPs), organic light emitting display devices (OLEDs), and quantum dot light emitting display devices (QLEDs) have been utilized.

[0003] In recent years, research on transparent display devices that allow users to see objects or backgrounds located on the opposite side through the display device has been actively conducted.

[0004] Such transparent display devices have high potential for utilization in various fields in that images and backgrounds can be seen together. However, since the fields and applications to which they are applied are diverse, they must be manufactured in multiple varieties (or various sizes). However, when manufacturing transparent display devices in multiple varieties (or various sizes), there is a problem that the manufacturing cost and production energy increase due to an increase in the number of processes.

Summary of the Invention

Problems to be Solved by the Invention

[0005] This specification aims to provide a technical solution to provide a transparent display device that can be manufactured in multiple varieties (or various sizes).

[0006] Furthermore, this specification aims to provide a technical solution to provide a transparent display device that can reduce production energy or manufacturing cost.

[0007] Further, this specification aims to provide a transparent display device that can reduce or prevent moisture permeation even when manufactured in multiple varieties (or various sizes).

Means for Solving the Problem

[0008] The transparent display device according to an embodiment of this specification includes a substrate provided with a display area in which a plurality of pixels each having a transmissive portion and a plurality of sub-pixels are arranged, and a non-display area adjacent to the display area, and a plurality of dam areas extending from the non-display area to the display area on the substrate and configured in a closed loop.

Effect of the Invention

[0009] This specification can be manufactured in multiple varieties (or various sizes) by providing a plurality of dam areas so that the display panel can be cut into various sizes.

[0010] In addition, this specification can be manufactured in multiple varieties (or various sizes) without an additional mask process, so production energy can be reduced compared to transparent display devices produced in multiple varieties through various production processes.

[0011] In addition, this specification can reduce or prevent moisture permeation even when manufactured in multiple varieties (or various sizes) by being configured such that the moisture permeation path of the cut portion is cut off.

[0012] The effects obtained in this specification are not limited to the effects mentioned above, and other effects not mentioned will be clearly understood by those with ordinary knowledge in the technical field to which this specification belongs from the following description.

Brief Description of the Drawings

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Mode for Carrying Out the Invention

[0014] The advantages and features of this specification, as well as the methods for achieving them, will become apparent by referring to the embodiments described in detail below together with the accompanying drawings. However, this specification is not limited to the embodiments disclosed below, but is configured in various different forms, and merely these embodiments are provided to complete the disclosure of this specification and to fully inform those with ordinary knowledge in the technical field to which this specification pertains of the scope of the invention.

[0015] The shapes, sizes, ratios, angles, numbers, etc. disclosed in the figures for explaining the embodiments of this specification are exemplary, and this specification is not limited to the matters shown in the figures. Throughout the specification, the same drawing numbers refer to the same components. In addition, in the description of this specification, when it is determined that a specific description of related known technologies may unnecessarily obscure the gist of this specification, the detailed description thereof is omitted.

[0016] When terms such as "including", "having", "consisting of", etc. mentioned in this specification are used, other parts can be added unless "only" is used. When a component is expressed in the singular, it includes the case of including a plurality unless there are specific descriptions to the contrary.

[0017] In interpreting a component, even if there is no separate explicit description regarding the error range, it is interpreted as including the error range.

[0018] In the case of an explanation regarding the positional relationship, for example, when the positional relationship between two parts is explained by phrases such as "on ~", "above ~", "below ~", "beside ~", etc., unless the expressions "immediately" or "directly" are used, one or more other parts can also be located between the two parts.

[0019] In the case of an explanation regarding the time relationship, for example, when the chronological relationship is explained by phrases such as "after ~", "subsequent to ~", "next to ~", "before ~", etc., unless the expressions "immediately" or "directly" are used, it can also include the case of not being continuous.

[0020] The terms "first", "second", etc. are used to describe various components, but these components are not limited by these terms. These terms are merely used to distinguish one component from another. Therefore, the first component mentioned below may also be the second component within the technical concept of this specification.

[0021] The "X-axis direction", "Y-axis direction", and "Z-axis direction" should not be interpreted as only having a geometric relationship that is perpendicular to each other, and can mean having a broader direction within the range where the configuration of this specification can function properly.

[0022] The term "at least one" should be understood to include all combinations that can be presented from one or more related items. For example, the meaning of "at least one of the first item, the second item, and the third item" can mean each of the first item, the second item, or the third item, as well as all combinations of items that can be presented from two or more of the first item, the second item, and the third item.

[0023] The features of each of several embodiments of this specification can be partially or wholly combined or combined with each other, enabling various technical linkages and drives. Each embodiment can be implemented independently of each other or can be implemented together in an associated relationship.

[0024] Hereinafter, preferred embodiments of this specification will be described in detail with reference to the accompanying drawings.

[0025] FIG. 1 is a schematic plan view of a transparent display device according to an embodiment of this specification, FIG. 2 is a plan view showing an enlarged view of part A shown in FIG. 1, and FIG. 3 is a schematic cross-sectional view of line I-I' shown in FIG. 2.

[0026] Hereinafter, the Y-axis direction represents the first direction (the first line (SL1) (for example, a data line)), the X-axis direction represents the second direction (parallel to the second line (SL2) (for example, a gate line)), and the Z-axis direction represents the third direction (the thickness direction of the transparent display device 100).

[0027] Referring to FIGS. 1 to 3, a transparent display device 100 according to an embodiment of the present specification includes a display area (DA) in which a transmissive portion (TA) and a plurality of pixels (P) each having a plurality of sub-pixels (SP) are arranged, and a non-display area (NDA) (or bezel area) around the display area (DA). The substrate 110, and a plurality of dam areas (DMA) configured on the substrate 110 and extending from the non-display area (NDA) (or bezel area) to the display area (DA) and configured in a closed loop can be included. Each of the plurality of dam areas (DMA) according to an example can be configured in a closed loop.

[0028] Here, when each of the plurality of dam areas (DMA) is configured in a closed loop, as shown in FIG. 1, it can mean that the display area (DA) is partially surrounded by the dam area (DMA). Therefore, the display area (DA) can have a structure divided by a plurality of dam areas (DMA) having a closed structure. For example, as shown in FIG. 1, the transparent display device 100 according to an embodiment of the present specification can include two dam areas (DMA), and each dam area (DMA) can include two display areas (DA) having different areas (or sizes) from each other. Therefore, when the transparent display device 100 according to an embodiment of the present specification is cut between the two dam areas (DMA), it can be divided into two transparent display devices having different areas (or sizes) from each other. For example, the transparent display device 100 according to an embodiment of the present specification can be divided into a first transparent display device 101 having a first area and a second transparent display device 102 having a second area larger than the first area.

[0029] Therefore, the transparent display device 100 according to an embodiment of the present specification can be manufactured in various models (or various sizes) by providing a plurality of dam areas (DMAs) so that the display panel can be cut into various sizes. However, if the transparent display device 100 according to an embodiment of the present specification cannot be separated by a cutting device, it can also be configured as one transparent display device. Therefore, as shown in FIG. 1, when including two dam areas (DMAs), the transparent display device 100 according to an embodiment of the present specification can be configured as a first transparent display device 101 having a first area, a second transparent display device 102 having a second area larger than the first area, and a third transparent display device 103 having a third area smaller than the second area. The display panel can include a substrate 110 and a counter substrate 200 adhesively bonded to face the substrate 110.

[0030] Therefore, the transparent display device 100 according to an embodiment of the present specification can reduce production energy compared to transparent display devices produced in various models (or various sizes) through various production processes (or manufacturing processes).

[0031] On the other hand, even if the transparent display device 100 according to an embodiment of the present specification is divided into the first and second transparent display devices 101 and 102, since the dam area (DMA) covers the edges of each of the first and second transparent display devices 101 and 102 in a closed-loop structure (or a closed structure), moisture permeation can be reduced or prevented. Therefore, even if the transparent display device 100 according to an embodiment of the present specification is cut (or divided) into a plurality of transparent display devices, the reliability against moisture permeation for each of the plurality of transparent display devices can be improved.

[0032] Hereinafter, with reference to FIGS. 1 to 3, the transparent display device 100 according to an embodiment of the present specification will be described in more detail.

[0033] Referring to FIG. 1, a transparent display device 100 according to an embodiment of the present specification may include a display panel including a substrate 110 having a plurality of gate driving units (GD), a source drive integrated circuit (hereinafter referred to as "IC") 120, a flexible film 130, and a plurality of circuit boards 140. Although not shown in the figure, the plurality of circuit boards 140 can be connected to a timing control unit via a cable.

[0034] The display panel may include a substrate 110 and a counter substrate 200 (shown in FIG. 3) adhered to each other.

[0035] The substrate 110 includes thin film transistors and can be a transistor array substrate, a lower substrate, a base substrate, or a first substrate. The substrate 110 can be a transparent glass substrate or a transparent plastic substrate. For example, the substrate 110 can be a transparent glass substrate. Hereinafter, the substrate 110 is defined as the first substrate.

[0036] The counter substrate 200 can be adhered to face the first substrate 110 via a connecting member (RD, shown in FIG. 3) and a filling member (RF, shown in FIG. 3). For example, the counter substrate 200 has a size smaller than that of the first substrate 110 and can be adhered to face the remaining portion of the first substrate 110 excluding the pad portion. The counter substrate 200 can be an upper substrate, a second substrate, or a sealing substrate. The counter substrate 200 can be adhered to the first surface of the first substrate 110 through a substrate bonding process mediated by an adhesive member. Hereinafter, the counter substrate 200 is defined as the second substrate.

[0037] A transparent display device 100 according to an embodiment of the present specification may further include a connecting member (RD) and a filling member (RF).

[0038] A dam region (DMA) according to an embodiment may include a connection member (RD). The connection member (RD) can be disposed between the first substrate 110 and the second substrate 200. Thereby, the first substrate 110 and the second substrate 200 can be adhesively opposed to each other via the connection member (RD). For example, the connection member (RD) may include a thermosetting transparent adhesive or a photocuring transparent adhesive. The connection member (RD) may include an absorbent material (not shown) for absorbing external moisture and humidity that penetrates toward the display region (DA).

[0039] The connection member (RD) of the dam region (DMA) according to an example can be disposed to extend from the non-display region (NDA) and the non-display region (NDA) to the display region (DA). As shown in FIG. 3, the connection member (RD) can be disposed in the dam region (DMA) so as to fill a gap (GAP) between the first substrate 110 and the second substrate 200. Thereby, the connection member (RD) can prevent moisture and the like from entering toward the display region (DA) through the gap between the first substrate 110 and the second substrate 200.

[0040] The filling member (RF) can be disposed adjacent to the connection member (RD). The filling member (RF) can support the first substrate 110 and the second substrate 200 by being disposed so as to fill a gap (GAP) between the first substrate 110 and the second substrate 200. Therefore, the filling member (RF) can prevent the first substrate 110 and the second substrate 200 from being easily deformed by an external force.

[0041] On the one hand, the filling member (RF) or the connecting member (RD) is configured to be disposed between the organic light-emitting layer 116 formed on the first substrate 110 and the second substrate 200, so that external moisture and humidity penetrating through the second substrate 200 cannot reach the organic light-emitting layer 116. That is, each of the filling member (RF) and the connecting member (RD) can have a barrier function to prevent the penetration of moisture. Each of the filling member (RF) and the connecting member (RD) can further include an absorbent material for absorbing moisture and humidity in order to enhance the moisture permeability prevention effect. For example, the absorbent material can be a getter.

[0042] On the one hand, the filling member (RF) can include a thermosetting transparent adhesive or a photocuring transparent adhesive. In this case, the filling member (RF) can be used to bond the first substrate 110 and the second substrate 200 together with the connecting member (RD). Therefore, the adhesive force between the first substrate 110 and the second substrate 200 can be further improved. Since each of the plurality of dam regions (DMA) partially surrounds the display region (DA), the filling member (RF) can be arranged to be surrounded by the connecting member (RD). The connecting member (RD) can overlap with a plurality of pixels (P) by being partially disposed in the display region (DA).

[0043] The connecting member (RD) according to an example can be made of an opaque material, but is not necessarily limited thereto, and can also be made of a transparent material. Since the filling member (RF) according to an example is disposed in the display region (DA), it can be made of a transparent material in order to improve the transmittance of the emitted light.

[0044] Referring to FIG. 1 again, the gate driving unit (GD) can supply a gate signal to the gate line according to a gate control signal input from the timing control unit. When the source drive IC 120 is manufactured as a driving chip, the source drive IC 120 can be mounted on the flexible film 130 by a COF (chip on film) or COP (chip on panel) method.

[0045] In the non-display area (NDA) of the display panel, pads such as power pads and data pads can be formed. On the flexible film 130, wirings for connecting the pads to the source drive IC 120 and wirings for connecting the pads to the circuit board 140 can be formed. The flexible film 130 is attached onto the pads using an anisotropic conducting film, whereby the pads can be connected to the wirings of the flexible film 130.

[0046] The first substrate 110 according to an example can include a display area (DA) and a non-display area (NDA).

[0047] The display area (DA) is an area where an image is displayed, and can be a pixel array area, an active area, a pixel array section, a display section, or a screen. For example, the display area (DA) can be arranged at the central portion of the display panel (or the first substrate 110).

[0048] The display area (DA) according to an example can include a gate line, a data line, a pixel driving power line, and a plurality of pixels (P). Each of the plurality of pixels (P) can include a plurality of sub-pixels (SP) that can be defined by the gate line and the data line, and a transmissive portion (TA, shown in FIG. 2) arranged adjacent to the plurality of sub-pixels (SP). The transmissive portion (TA) is an area configured such that light can transmit through the front and back surfaces of the display panel. Therefore, a user positioned on the front side of the display panel can view an image, a background, etc. positioned on the back side of the display panel through the transmissive portion (TA).

[0049] Referring to FIG. 2, each of the plurality of sub-pixels (SP) can be defined as the smallest unit area where actual light emits.

[0050] According to one example, at least four sub-pixels (SP) arranged adjacent to each other among a plurality of sub-pixels, and one transmissive portion (TA) constitute one unit pixel (P). One unit pixel can include, but is not limited to, a red sub-pixel, a green sub-pixel, a blue sub-pixel, a white sub-pixel, and a transmissive portion (TA). As an example, one unit pixel can be configured to include at least one red sub-pixel, at least one green sub-pixel, at least one blue sub-pixel, at least one white sub-pixel, and at least one transmissive portion (TA).

[0051] According to another example, three sub-pixels (SP) arranged adjacent to each other among a plurality of sub-pixels, and one transmissive portion (TA) constitute one unit pixel. One unit pixel can include, but is not limited to, at least one red sub-pixel, at least one green sub-pixel, at least one blue sub-pixel, and one transmissive portion (TA).

[0052] Each of the plurality of sub-pixels (SP) can include a thin film transistor and a light emitting portion connected to the thin film transistor. The light emitting portion can include a light emitting element layer (or an organic light emitting layer) interposed between an anode electrode (or a first electrode) and a cathode electrode (or a second electrode).

[0053] The light emitting element layers arranged in each of the plurality of sub-pixels (SP) can emit light of different colors individually or emit white light in common. According to one example, when the light emitting element layers of each of the plurality of sub-pixels (SP) emit white light in common, each of the red sub-pixel, the green sub-pixel, and the blue sub-pixel can include a color filter (or a wavelength conversion member) that converts white light into light of different colors. In this case, the white sub-pixel according to one example may not be provided with a color filter. In the transparent display device 100 according to an embodiment of the present specification, the red sub-pixel can be the first sub-pixel (SP1), the white sub-pixel can be the second sub-pixel (SP2), the green sub-pixel can be the third sub-pixel (SP3), and the blue sub-pixel can be the fourth sub-pixel (SP4).

[0054] When a gate signal is input from a gate line to each sub-pixel (SP) using a thin-film transistor, a predetermined current is supplied to the organic light-emitting element by the data voltage of the data line. As a result, the light-emitting portion of each sub-pixel can emit light with a predetermined brightness by a predetermined current. The description of each structure of the sub-pixel (SP) will be described later with reference to FIG. 3.

[0055] The non-display area (NDA) is an area where an image is not displayed, and can be a peripheral circuit area, a signal supply area, an inactive area, or a bezel area. The non-display area (NDA) can be configured to be around the display area (DA). That is, the non-display area (NDA) can be arranged to surround the display area (DA).

[0056] The transparent display device 100 according to an embodiment of the present specification can include a plurality of gate driving units (GD) arranged in the non-display area (NDA). As shown in FIG. 1, the plurality of gate driving units (GD) can be arranged in the first direction (Y-axis direction) in the non-display area (NDA). The plurality of gate driving units (GD) can be arranged in parallel with the display area (DA) interposed therebetween, but is not necessarily limited thereto.

[0057] Each of the plurality of gate driving units (GD) supplies a gate signal to the gate line in accordance with a gate control signal input from a timing control unit connected to the plurality of circuit boards 140. Each of the plurality of gate driving units (GD) can be formed in a GIP (gate driver in panel) method in the non-display area (NDA) outside both sides of the display area (DA) as shown in FIG. 1. Alternatively, the plurality of gate driving units (GD) can be manufactured on a driving chip, mounted on a flexible film, and attached to the non-display area (NDA) outside both sides of the display area (DA) of the display panel by a TAB (tape automated bonding) method. A gate driving unit (GD) according to an example can include a plurality of gate driving circuits (or GIP circuits) and a plurality of GIP wirings. A GIP wiring according to an example can include a plurality of signal wirings and a plurality of power supply wirings.

[0058] The plurality of gate drivers (GD) can be separately arranged on the left side of the display area (DA), i.e., the second non-display area (NDA2), and on the right side of the display area (DA), i.e., the third non-display area (NDA3). According to an example, the plurality of gate drivers (GD) can be connected to the plurality of pixels (P) and a plurality of wirings (or a plurality of second lines (SL2)) for supplying power and / or signals to each of the plurality of pixels (P). As shown in FIG. 1, the transparent display device 100 according to an embodiment of the present specification can further include a plurality of first lines (SL1) intersecting the plurality of second lines (SL2).

[0059] The plurality of second lines (SL2) can extend in the second direction (X-axis direction). Each of the plurality of second lines (SL2) can include at least one gate line (GL) (or scan line (GL)). The second direction (X-axis direction) can mean a direction parallel to the gate line (GL).

[0060] Hereinafter, when the second line (SL2) includes a plurality of lines, one second line (SL2) can mean a signal line group composed of a plurality of lines. For example, when the second line (SL2) includes two scan lines, one second line (SL2) can mean a signal line group composed of two scan lines.

[0061] The plurality of first lines (SL1) can extend in the first direction (Y-axis direction). The plurality of first lines (SL1) can intersect the plurality of second lines (SL2). Each of the plurality of first lines (SL1) can be connected to at least one of a plurality of pads, a pixel power short bar or a pixel power line (EVDD), and a common power short bar (EVSS) in the first non-display area (NDA1). The pixel power short bar (EVDD) and the common power short bar (EVSS) can be arranged in the first non-display area (NDA1) provided between the pad area (PA) and the display area (DA) based on the display area (DA), and the fourth non-display area (NDA4) arranged to face the pad area (PA). The first direction (X-axis direction) can be a direction parallel to the data line.

[0062] The pixel power short bar (EVDD) can include a first pixel power short bar (EVDD1) arranged in the first non-display area (NDA1) and a second pixel power short bar (EVDD2) arranged in the fourth non-display area (NDA4). The first pixel power short bar (EVDD1) and the second pixel power short bar (EVDD2) can be arranged in parallel in the second direction (X-axis direction) with the display area (DA) interposed therebetween.

[0063] The common power short bar (EVSS) can include a first common power short bar (EVSS1) arranged in the first non-display area (NDA1) and a second common power short bar (EVSS2) arranged in the fourth non-display area (NDA4). The first common power short bar (EVSS1) and the second common power short bar (EVSS2) can be arranged in parallel in the second direction (X-axis direction) with the display area (DA) interposed therebetween. The first common power short bar (EVSS1) and the second common power short bar (EVSS2) according to an example can be arranged closer to the outer contour of the first substrate 110 than the first pixel power short bar (EVDD1) and the second pixel power short bar (EVDD2).

[0064] The plurality of first lines (SL1) can include a pixel power line connected to a pixel power short bar (EVDD) and a common power line connected to a common power short bar (EVSS). In one embodiment, the plurality of first lines (SL1) can further include a plurality of data lines and reference lines.

[0065] Hereinafter, when the first line (SL1) includes a plurality of lines, one first line (SL1) can mean a signal line group composed of a plurality of lines. For example, when the first line (SL1) includes two data lines, a pixel power line, a common power line, and a reference line, one first line (SL1) can mean a signal line group composed of two data lines, a pixel power line, a common power line, and a reference line.

[0066] The pixel (P) is configured to overlap at least one of the first line (SL1) and the second line (SL2), and emits predetermined light to display an image. The light emitting region (EA) can correspond to the region where the pixel (P) emits light.

[0067] Referring to FIG. 2, each pixel (P) can include a first sub-pixel (SP1), a second sub-pixel (SP2), a third sub-pixel (SP3), and a fourth sub-pixel (SP4). The first sub-pixel (SP1) includes a first light emitting region (EA) that emits red light, the second sub-pixel (SP2) includes a second light emitting region that emits white light, the third sub-pixel (SP3) includes a third light emitting region that emits green light, and the fourth sub-pixel (SP4) can be configured to include a fourth light emitting region that emits blue light. In FIG. 2, it is shown that the first to fourth sub-pixels (SP1, SP2, SP3, SP4) included in one pixel (P) are arranged in the first direction (Y-axis direction), but the arrangement order of each sub-pixel (SP1, SP2, SP3, SP4) can be variously changed.

[0068] According to an embodiment of the present specification, since the organic light-emitting element of the transparent display device 100 is configured to emit white light, as shown in FIG. 2, the second sub-pixel (SP2), which is a white sub-pixel, does not need to include a color filter. On the other hand, the first sub-pixel (SP1) includes a red color filter 210 so that red light is emitted, the third sub-pixel (SP3) includes a green color filter so that green light is emitted, and the fourth sub-pixel (SP4) may include a blue color filter so that blue light is emitted.

[0069] Hereinafter, with reference to FIGS. 2 and 3, the pixel (P) of the transparent display device 100 according to an embodiment of the present specification will be described.

[0070] Referring to FIGS. 2 and 3, each of the plurality of pixels (P) configured in the display area (DA) may include a plurality of sub-pixels (SP) and a transmissive portion (TA). As shown in FIG. 2, the transmissive portion (TA) can be disposed adjacent to each of the plurality of sub-pixels (SP). FIG. 3 shows a sub-pixel (SP) in which a connection member (RD) is disposed, but a filling member (RF) can be disposed in the sub-pixel (SP) disposed in the display area (DA) rather than the dam area (DMA). However, as shown in FIG. 3, in the area where the cut portion (CP) is disposed, both the filling member (RF) and the connection member (RD) may not be disposed. By not forming both the filling member (RF) and the connection member (RD) in the cut portion (CP), not only can the manufacturing cost be reduced by material savings, but also the cut can be easily performed and the defect rate can be reduced by cutting the area where the filling member (RF) and the connection member (RD) are not disposed.

[0071] On the other hand, since the structure of the sub-pixel (SP) in which the filling member (RF) is disposed is the same as the structure of the sub-pixel (SP) in which the connection member (RD) is disposed, as shown in FIG. 3, the description thereof is replaced with the description of the sub-pixel (SP) in which the connection member (RD) is disposed.

[0072] Referring back to FIG. 3, each of the plurality of sub-pixels (SP) is formed on the first substrate 110 and can include a buffer layer (BL) to prevent moisture penetration into the thin film transistor 112.

[0073] Also, each sub-pixel (SP) according to an embodiment of the present specification is formed on the upper surface of the buffer layer (BL) and includes an inorganic film layer 111 including a gate insulating film 111a (shown in FIG. 12), an interlayer insulating film 111b, a first passivation layer 111c, and a second passivation layer 111d, a planarization layer 113 formed on the inorganic film layer 111, an anode electrode 114 (or a first electrode 114) formed on the planarization layer 113, a bank 115, an organic light emitting layer 116, a cathode electrode 117 (or a second electrode 117), and a sealing layer 118.

[0074] A thin film transistor 112 for driving the sub-pixel (SP) can be disposed in the inorganic film layer 111. The inorganic film layer 111 can also be represented by the term circuit element layer. The buffer layer (BL) can be included in the inorganic film layer 111 together with the gate insulating film 111a, the interlayer insulating film 111b, the first passivation layer 111c, and the second passivation layer 111d. The anode electrode 114, the organic light emitting layer 116, and the cathode electrode 117 can be included in the light emitting element.

[0075] The buffer layer (BL) can be formed between the first substrate 110 and the gate insulating film 111a to protect the thin film transistor 112. A pixel power line (EVDD) or a wiring electrically connected to the pixel power line (EVDD) can be disposed between the buffer layer (BL) and the first substrate 110. The buffer layer (BL) can be disposed over the entire surface (or the front surface) of the first substrate 110. The buffer layer (BL) can also serve to block the diffusion of substances contained in the first substrate 110 into the transistor layer during a high-temperature process in the manufacturing process of the thin film transistor. Optionally, the buffer layer (BL) can be omitted in some cases.

[0076] A thin film transistor 112 according to an example can include an active layer 112a, a gate electrode 112b, a source electrode 112c, and a drain electrode 112d.

[0077] The active layer 112a can include a channel region, a drain region, and a source region formed in the thin film transistor region of the circuit region of the pixel (P). The drain region and the source region can be separated so as to be parallel to each other with the channel region therebetween.

[0078] The active layer 112a can be composed of a semiconductor material based on any one of amorphous silicon, polycrystalline silicon, oxide, and organic material.

[0079] The gate insulating film 111a can be formed over the channel region of the active layer 112a. As an example, the gate insulating film 111a can be formed in an island form only over the channel region of the active layer 112a, or can be formed over the entire front surface of the first substrate 110 or the buffer layer (BL) including the active layer 112a.

[0080] The gate electrode 112b can be formed over the gate insulating film 111a so as to overlap with the channel region of the active layer 112a.

[0081] The interlayer insulating film 111b can be formed over the gate electrode 112b and the drain region and the source region of the active layer 112a. The interlayer insulating film 111b can be formed over the entire circuit region and the light emitting region where light is emitted in the pixel (P). For example, the interlayer insulating film 111b can be made of an inorganic material. However, it is not necessarily limited thereto.

[0082] The source electrode 112c can be electrically connected to the source region of the active layer 112a through a source contact hole provided in the interlayer insulating film 111b that overlaps with the source region of the active layer 112a. Further, the source electrode 112c can be connected to a wiring (LS) that is electrically connected to the pixel power supply line (EVDD) through a contact hole provided in the interlayer insulating film 111b that does not overlap with the source region of the active layer 112a and the buffer layer (BL). The source electrode 112c can be connected to the anode electrode 114 through a connection electrode (CE) that penetrates the first passivation layer 111c.

[0083] The drain electrode 112d can be electrically connected to the drain region of the active layer 112a through a drain contact hole provided in the interlayer insulating film 111b that overlaps with the drain region of the active layer 112a.

[0084] Each of the drain electrode 112d and the source electrode 112c can be made of the same metal material. For example, each of the drain electrode 112d and the source electrode 112c can be composed of a single metal layer, a single layer of an alloy, or a multilayer of two or more layers that is the same as or different from the gate electrode.

[0085] Furthermore, the circuit region can further include first and second switching thin film transistors and a capacitor arranged together with the thin film transistor 112. Since each of the first and second switching thin film transistors is provided on the circuit region of the pixel (P) so as to have the same structure as the thin film transistor 112, the description thereof will be omitted. The capacitor can be provided in an overlapping region between the gate electrode 112b and the source electrode 112c of the thin film transistor 112 that overlap each other with the interlayer insulating film 111b interposed therebetween.

[0086] Furthermore, although the thin-film transistor provided in the pixel region can have the characteristic that its threshold voltage shifts due to light, in order to prevent this, the display panel or the first substrate 110 can further include a light-shielding layer (not shown) provided under at least one active layer 112a of the thin-film transistor 112, the first switching thin-film transistor, and the second switching thin-film transistor. The light-shielding layer is provided between the first substrate 110 and the active layer 112a, and can reduce the change in the threshold voltage of the transistor due to external light by blocking the light incident on the active layer 112a side through the first substrate 110.

[0087] The first passivation layer 111c can be disposed between the first substrate 110 and the planarization layer 113. The first passivation layer 111c according to an example covers the drain electrode 112d, the source electrode 112c of the thin-film transistor 112, and the interlayer insulating film 111b. The first passivation layer 111c can be formed over the entire circuit region and the light-emitting region.

[0088] The second passivation layer 111d can be provided on the first substrate 110 so as to cover the pixel region. For example, the second passivation layer 111d can be configured to cover the connection electrode (CE) between the first passivation layer 111c and the planarization layer 113. The second passivation layer 111d can be formed over the entire circuit region and the light-emitting region.

[0089] The planarization layer 113 can be provided on the first substrate 110 so as to cover the second passivation layer 111d. When the second passivation layer 111d is omitted, the planarization layer 113 can be provided on the first substrate 110 so as to cover the circuit region. The planarization layer 113 can be formed over the entire circuit region and light-emitting region. Also, the planarization layer 113 can be formed over the entire remaining region of the non-display region (NDA) excluding the pad region (PA) and the display region (DA). For example, the planarization layer 113 can include an extension (or expansion) extended or expanded toward the remaining non-display region (NDA) excluding the pad region (PA) from the display region (DA). Therefore, the planarization layer 113 can have a relatively larger size than the display region (DA).

[0090] The planarization layer 113 according to one embodiment is formed to have a relatively thick thickness and can provide a flat surface over the display region (DA) and the non-display region (NDA). For example, the planarization layer 113 can be made of an organic material such as photo acryl, benzocyclobutene, polyimide, and fluororesin.

[0091] The anode electrode 114 of the sub-pixel (SP) can be formed on the planarization layer 113. The anode electrode 114 is connected to the source electrode or drain electrode of the thin-film transistor 112 by being connected to the connection electrode (CE) through a contact hole penetrating the planarization layer 113 and the second passivation layer 111d.

[0092] The anode electrode 114 can be made of at least one of a transparent metal material, a semi-transparent metal material, and a highly reflective metal material.

[0093] When the transparent display device 100 is formed by the top emission method, the anode electrode 114 can be made of a metal material with high reflectivity or a laminated structure of a metal material with high reflectivity and a transparent metal material. For example, the anode electrode 114 can be formed of a metal material with high reflectivity such as a laminated structure of aluminum and titanium (Ti / Al / Ti), a laminated structure of aluminum and ITO (ITO / Al / ITO), an Ag alloy, and a laminated structure of an Ag alloy and ITO (ITO / Ag alloy / ITO). The Ag alloy can be an alloy of silver (Ag), palladium (Pd), copper (Cu), etc.

[0094] When the transparent display device 100 is configured by the bottom emission method, the anode electrode 114 can be formed of a transparent metal material (TCO, Transparent Conductive Material) such as ITO or IZO that can transmit light, or a semi-transmissive conductive material such as magnesium (Mg), silver (Ag), or an alloy of magnesium (Mg) and silver (Ag) (Semi-transmissive Conductive Material).

[0095] On the other hand, the material constituting the anode electrode 114 can include MoTi. Such an anode electrode 114 can be a first electrode or a pixel electrode.

[0096] The bank 115 is a non-emitting region that does not emit light and can be configured to surround each of the light-emitting regions (EA) of each of the plurality of sub-pixels (SP). That is, the bank 115 can partition (or define) each of the light-emitting regions (EA).

[0097] The bank 115 is formed so as to cover the end of the anode electrode 114 on the planarization layer 113, whereby each of the light-emitting regions (EA) (or light-emitting portions) of each of the plurality of sub-pixels (SP) can be partitioned (or defined).

[0098] Bank 115 can be formed to cover each end of each anode electrode 114 of each sub-pixel (SP) such that a part of each of the anode electrodes 114 is exposed. Thereby, by covering each end of each anode electrode 114, bank 115 can prevent a short circuit between the anode electrode 114 and the cathode electrode 117. The exposed portion of the anode electrode 114 not blocked by the bank 115 can be a light emitting region (EA) (or a light emitting portion).

[0099] Bank 115 can be formed of an organic film such as an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, or a polyimide resin. However, it is not limited thereto.

[0100] An organic light emitting layer 116 is formed on the anode electrode 114 and the bank 115. When a voltage is applied to the anode electrode 114 and the cathode electrode 117, holes and electrons move into the organic light emitting layer 116 respectively, and combine with each other in the organic light emitting layer 116 to emit light.

[0101] The organic light emitting layer 116 can be formed of a common layer formed on a plurality of sub-pixels (SP) and the bank 115. In this case, the organic light emitting layer 116 can be configured in a tandem structure in which a plurality of light emitting layers, for example, a yellow-green light emitting layer and a blue light emitting layer are laminated, and when an electric field is formed between the anode electrode 114 and the cathode electrode 117, white light can be emitted.

[0102] A color filter 210 corresponding to the color of the corresponding sub-pixel (SP) can be formed on the second substrate 200. For example, the red sub-pixel (SP1) is provided with a red color filter, the green sub-pixel is provided with a green color filter, and the blue sub-pixel is provided with a blue color filter. Since the organic light emitting layer 116 emits white light in the white sub-pixel, it does not need to be provided with a color filter.

[0103] The cathode electrode 117 is formed on the organic light-emitting layer 116. The cathode electrode 117 can be a common layer formed commonly for the sub-pixels (SP). Such a cathode electrode 117 can be made of a transparent metal material, a semi-transmissive metal material, or a highly reflective metal material.

[0104] When the transparent display device 100 is of the top-emission type, the cathode electrode 117 can be formed of a transparent metal material (TCO, Transparent Conductive Material) such as ITO or IZO that can transmit light, or a semi-transmissive conductive material such as magnesium (Mg), silver (Ag), or an alloy of magnesium (Mg) and silver (Ag).

[0105] When the transparent display device 100 is of the bottom-emission type, the cathode electrode 117 can be formed of a highly reflective metal material such as a stacked structure of aluminum and titanium (Ti / Al / Ti), a stacked structure of aluminum and ITO (ITO / Al / ITO), an Ag alloy, or a stacked structure of an Ag alloy and ITO (ITO / Ag alloy / ITO). The Ag alloy can be an alloy of silver (Ag), palladium (Pd), copper (Cu), etc. Such a cathode electrode 117 can be a second electrode or a counter electrode.

[0106] A sealing layer 118 is formed on the cathode electrode 117. The sealing layer 118 serves to prevent oxygen and moisture from penetrating into the organic light-emitting layer 116 and the cathode electrode 117. For this purpose, the sealing layer 118 can include at least one organic film and at least one inorganic film.

[0107] In the transparent display device 100 according to an embodiment of the present specification, the sealing layer 118 can be disposed not only in the display area (DA) but also in the non-display area (NDA). According to an example, the sealing layer 118 can be disposed between the cathode electrode 117 (and / or the buffer layer (BL)) and the second substrate 200.

[0108] Since the sealing layer 118 is disposed in the display area (DA) and extends to the non-display area (NDA), it can contact the dam area (DMA) in the non-display area (NDA) (or the outer portion) of the display panel. Further, in the transparent display device 100 according to an embodiment of the present specification, since the dam area (DMA) is disposed up to a part of the display area (DA), the sealing layer 118 can also contact the dam area (DMA) (or the connection member (RD) included in the dam area (DMA)) in the display area (DA).

[0109] Therefore, the transparent display device 100 according to an embodiment of the present specification can prevent moisture from penetrating toward the display area (DA), and can effectively prevent moisture from penetrating toward the display area (DA) even when it is divided into a plurality through the cut portion (CP).

[0110] Referring to FIG. 3 again, the color filter 210 and the black matrix 220 can be disposed between the sealing layer 118 and the second substrate 200. The color filter 210 according to an example can be disposed corresponding to each of a plurality of sub-pixels (SP) (or a plurality of light-emitting areas (EA)) on the second substrate 200 (or the counter substrate).

[0111] As described above, the white sub-pixel, that is, the second sub-pixel (SP2), does not need to include a color filter because the organic light-emitting layer 116 emits white light. On the other hand, the first sub-pixel (SP1), which is a red sub-pixel, may include the color filter 210 between the sealing layer 118 and the second substrate 200.

[0112] As shown in FIG. 3, the black matrix 220 can be disposed at the edge of the color filter 210. Accordingly, the black matrix 220 can prevent color mixing between sub-pixels (SP). The black matrix 220 is made of a black material and can be disposed in a non-emitting area (NEA). The black matrix 220 according to an example is formed on the second substrate 200 so as to at least partially overlap with the bank 115, thereby reducing the cell gap between the organic light-emitting layer 116 and the second substrate 200 and preventing color mixing between sub-pixels.

[0113] On the other hand, the transparent display device 100 according to an embodiment of the present specification may further include a plurality of upper organic films 230 covering the color filter 210. As shown in FIG. 3, each of the plurality of upper organic films 230 can be configured to cover not only the color filter 210 but also the black matrix 220 together.

[0114] The plurality of upper organic films 230 according to an example can be disposed separately from each other with a transmission part (TA) therebetween. Since the upper organic film 230 is an organic film, it can be a moisture permeation path from the outside to the display area (DA). However, in the transparent display device 100 according to an embodiment of the present specification, the plurality of upper organic films 230 are disposed separately from each other, so that the moisture permeation path to the display area (DA) can be blocked.

[0115] In addition, in the transparent display device 100 according to an embodiment of the present specification, since the plurality of upper organic films 230 are configured not to be disposed in the transmission part (TA), the transmittance can be improved as compared with the case where an organic film is disposed in the transmission part (TA).

[0116] On one hand, since a plurality of upper organic films 230 are arranged to be separated from each other with a transmission portion (TA) therebetween, a connection member (RD) (shown in FIG. 3) can be arranged between the plurality of upper organic films 230. That is, the connection member (RD) can be partially arranged between the plurality of upper organic films 230. According to an example, the connection member (RD) can be arranged entirely between the plurality of upper organic films 230 or, as shown in FIG. 3, can be partially arranged between the plurality of upper organic films 230. This describes the arrangement structure in the dam region (DMA). In a display region (DA) where the dam region (DMA) is not arranged, a filling member (RF) can be partially arranged between the plurality of upper organic films 230.

[0117] According to an embodiment of the present specification, a transparent display device 100 can be configured with N (N is an integer greater than 1) dam regions (DMA) on a first substrate 110. For example, as shown in FIG. 1, a transparent display device 100 according to an embodiment of the present specification can include two dam regions (DMA). Each of the two dam regions (DMA) can be configured in a closed-loop form (or a closed form) surrounding display regions (DA) with different areas from each other. However, it is not limited thereto, and the two dam regions (DMA) can also be configured in a closed-loop form (or a closed form) surrounding display regions (DA) with the same area from each other.

[0118] Each of the plurality of dam regions (DMA) can include a first dam arranged in a non-display region (NDA) and a second dam extending from the non-display region (NDA) to the display region (DA). As shown in FIG. 1, since the first dam and the second dam are connected to each other, they can be configured as one closed dam region (DMA). As shown in FIG. 1, the second dam can be arranged across the display region (DA). Therefore, a transparent display device 100 according to an embodiment of the present specification can have a structural feature of overlapping with a pixel (or a sub-pixel (SP)) in which a dam region (DMA) is arranged in a display region (DA) in a third direction (Z-axis direction).

[0119] Referring to FIGS. 1 and 2, the transparent display device 100 according to an embodiment of the present specification may further include a cut portion (CP) configured between N dam regions (DMA). A cut portion (CP) according to an example may be a portion cut through a cutting device such as a laser or a wheel. Therefore, when the cutting device cuts the cut portion (CP), the transparent display device 100 according to an embodiment of the present specification can be divided into a first transparent display device 101 and a second transparent display device 102. In FIG. 1, it is shown that the transparent display device 100 according to an embodiment of the present specification is configured to be divided into two transparent display devices having different areas (or sizes) from each other, but is not limited thereto, and can be configured to be divided into two transparent display devices having the same area (or size).

[0120] Taking FIG. 1 as an example, the transparent display device 100 according to an embodiment of the present specification can be configured to be divided into a first transparent display device 101 having a first area and a second transparent display device 102 having a second area larger than the first area through a cut portion (CP). A third transparent display device 103 between the first transparent display device 101 and the second transparent display device 102 cannot be used as a transparent display device because it does not have a gate driving unit (GD) capable of driving a display area (DA). However, it is not limited thereto, and if a gate driving unit (GD) can be connected to the third transparent display device 103, it can also function as the third transparent display device 103.

[0121] On the other hand, when the third transparent display device 103 cannot be used as a transparent display device, a filling member (RF) and a connecting member (RD) may not be disposed in the region of the third transparent display device 103 located between the first transparent display device 101 and the second transparent display device 102. Thereby, the transparent display device 100 according to an embodiment of the present specification can reduce the manufacturing cost because the filling member (RF) and the connecting member (RD) are not formed in the region that cannot be used as a transparent display device, and the region where the filling member (RF) and the connecting member (RD) are not disposed is cut, so that the cutting can be easily performed and the defective rate can be reduced.

[0122] As a result, the transparent display device 100 according to an embodiment of the present specification can configure a plurality of dam regions (DMA) in a number corresponding to the number of a plurality of gate driving units (GD). Accordingly, the transparent display device 100 according to an embodiment of the present specification can be configured to be divisible into a plurality of transparent display devices by the number of the plurality of gate driving units (GD) (or the number of the plurality of dam regions (DMA)).

[0123] Referring to FIG. 1 again, in the transparent display device 100 according to an embodiment of the present specification, each of the plurality of gate driving units (GD) can be arranged in the first direction (Y-axis direction) in the non-display region (NDA). Here, the cut portion (CP) can be arranged in parallel with the gate driving unit (GD). When the cut portion (CP) is arranged in a direction intersecting the gate driving unit (GD), the gate driving unit (GD) is damaged by the cutting device, so that it cannot operate as a transparent display device. Therefore, in the transparent display device 100 according to an embodiment of the present specification, the cut portion (CP) can be arranged in parallel with the gate driving unit (GD). For example, as shown in FIG. 1, the cut portion (CP) can be arranged in the first direction (Y-axis direction) between two gate driving units (GD1, GD2). Therefore, the transparent display device 100 according to an embodiment of the present specification can be cut in the first direction (Y-axis direction) by the cutting device, and thereby can be configured to be divided into a first transparent display device 101 and a second transparent display device 102 having different areas (or sizes).

[0124] As shown in FIG. 1, since the cut portion (CP) is arranged in the vertical direction, it can be expressed by the term of a vertical cut line. Or, since the cut portion (CP) is a portion where the transparent display device 100 is cut in one direction, it can be expressed by the term of a one-way cut line.

[0125] On the one hand, the transparent display device 100 according to an embodiment of the present specification can include only one cut portion (CP), but is not limited thereto. As shown in FIG. 1, two cut portions (CP) can be provided. For example, the cut portion (CP) can include a first cut portion (CP1) disposed between the first transparent display device 101 and the third transparent display device 103, and a second cut portion (CP2) disposed between the third transparent display device 103 and the second transparent display device 102.

[0126] When the cutting device cuts the first cut portion (CP1) and the second cut portion (CP2), one transparent display device can be divided into three transparent display devices. The first transparent display device 101 including the first gate driving unit (GD1) and the second transparent display device 102 including the second gate driving unit (GD2) can be used as separate transparent display devices having different areas (or sizes). Since the third transparent display device 103 disposed between the first cut portion (CP1) and the second cut portion (CP2) does not have a gate driving unit, it cannot function as a transparent display device. However, as described above, if a gate driving unit can be connected to the third transparent display device 103, it can also function as a transparent display device.

[0127] Referring to FIG. 1, in a transparent display device 100 according to an embodiment of the present specification, the circuit board 140 may include a first circuit board 141, a second circuit board 142, a third circuit board 143, and a fourth circuit board 144. For example, the first circuit board 141 can be connected to the first transparent display device 101. The first circuit board 141 can be connected to a timing control unit via a cable. The second circuit board 142 can be connected to the third transparent display device 103. As described above, when the third transparent display device 103 cannot function as a transparent display device, the second circuit board 142 cannot be connected to the timing control unit. The third circuit board 143 and the fourth circuit board 144 can be connected to the second transparent display device 102. The third circuit board 143 and the fourth circuit board 144 can be connected to the timing control unit via a cable. Therefore, when the transparent display device 100 according to an embodiment of the present specification is separated (or divided) by a cutting device, the first transparent display device 101 and the second transparent display device 102 can function as respective transparent display devices having different areas (or sizes).

[0128] A transparent display device 100 according to an embodiment of the present specification may include a planarization layer 113 disposed on a first substrate 110, and a plurality of inorganic film layers 111 disposed between the first substrate 110 and the planarization layer 113. For example, the plurality of inorganic film layers 111 may be a gate insulating film 111a, an interlayer insulating film 111b, a first passivation layer 111c, and a second passivation layer 111d formed on the upper surface of a buffer layer (BL).

[0129] A transparent display device 100 according to an embodiment of the present specification may include an undercut portion (UC) in which the planarization layer 113 and the plurality of inorganic film layers 111 are partially removed.

[0130] An undercut portion (UC) according to one example can be formed by partially removing each of the interlayer insulating film 111b, the first passivation layer 111c, and the second passivation layer 111d. As shown in FIG. 3, the undercut portion (UC) can be formed in the transmissive portion (TA). That is, the transmissive portion (TA) can include the undercut portion (UC).

[0131] The undercut portion (UC) is for disconnecting the organic light-emitting layer 116 formed in the transmissive portion (TA). In the transparent display device 100 according to an embodiment of the present specification, after the undercut portion (UC) is formed, the organic light-emitting layer 116, the cathode electrode 117, and the encapsulation layer 118 are formed, so that the organic light-emitting layer 116 can be disconnected by the undercut portion (UC). Therefore, the transparent display device 100 according to an embodiment of the present specification can prevent moisture permeation through the organic light-emitting layer 116.

[0132] An undercut portion (UC) according to one example can be configured as M (M is an integer greater than 0) in the transmissive portion (TA). Since the undercut portion (UC) is a region where the organic light-emitting layer 116 is disconnected, even if the undercut portion (UC) is cut by a cutting device, moisture permeation into the display region (DA) can be prevented. Therefore, in the transparent display device 100 according to an embodiment of the present specification, the cut portion (CP) can be any one of the M undercut portions (UC). For example, as shown in FIG. 3, the undercut portion (UC) can be formed on both sides of the planarization layer 113' disposed in the transmissive portion (TA). The planarization layer 113' disposed in the transmissive portion (TA) is disposed in an island form separated from the planarization layer 113 disposed in the light-emitting region (EA), and thus can be expressed by the term island OC or the first planarization layer. On the other hand, since the planarization layer 113 disposed to overlap the light-emitting region (EA) (and / or the non-light-emitting region (NEA)) is disposed to cover the thin-film transistor 112, it can be expressed by the term capping OC or the second planarization layer.

[0133] For example, as shown in FIG. 2, the planarization layer 113' (or the first planarization layer 113') disposed in the transmissive portion (TA) can be arranged in parallel to the first direction (Y-axis direction) in two transmissive portions (TA). In this case, as shown in FIG. 3, four undercut portions (UC) can be arranged in one transmissive portion (TA). Any one of such four undercut portions (UC) can be a cut portion (CP). However, it is not necessarily limited to this, and the cut portion (CP) can be formed in a light-emitting region (EA) or a transmissive portion (TA) that is not an undercut portion (UC). Further, the cut portion (CP) can be located in a region that is not a dam region (DMA) and cannot be located in a region where the filling member (RF) is disposed. This is because when the cut portion (CP) is located in a region where the filling member (RF) is disposed, moisture permeation may occur through an organic layer such as an organic light-emitting layer when cut by a cutting device. Therefore, in the transparent display device 100 according to an embodiment of the present specification, the cut portion (CP) can be disposed in at least one of an undercut portion (UC) in a region where the filling member (RF) is not disposed, a light-emitting region (EA) in a region where the filling member (RF) is not disposed, and a transmissive portion (TA) in a region where the filling member (RF) is not disposed. Hereinafter, the case where the undercut portion (UC) is a cut portion (CP) will be described as an example.

[0134] According to an embodiment of the present specification, when any one of the M undercut portions (UC) of the transparent display device 100 is cut by a cutting device, it can be configured as a plurality of transparent display devices having different areas from each other or equal areas. Since the organic light-emitting layer 116 is interrupted in the undercut portion (UC), moisture permeation through the organic light-emitting layer 116 can be prevented even when cut by a cutting device. Further, since the cut portion (CP) is disposed between a plurality of dam regions (DMA), even when cut by a cutting device, the dam region (DMA) can be configured in a structure surrounding the display region (DA) at the ends of each transparent display device (for example, the first transparent display device 101 and the second transparent display device 102). And each transparent display device (for example, the first transparent display device 101 and the second transparent display device 102) can further enhance moisture permeation prevention for the display region (DA) because a getter included in the connection member (RD) disposed at the end can absorb moisture and oxygen.

[0135] Referring to FIG. 3, in the transparent display device 100 according to an embodiment of the present specification, the organic light-emitting layer 116 can be interrupted at the undercut portion (UC). Also, the cathode electrode 117 and the encapsulation layer 118 can be interrupted at the undercut portion (UC). Therefore, as shown in FIG. 3, the first planarization layer 113', the organic light-emitting layer 116 disposed on the first planarization layer 113', the cathode electrode 117, and the encapsulation layer 118 can be arranged in an island form. Therefore, the connection member (RD) can be disposed up to the undercut portion (UC) on both sides of the first planarization layer 113'. Since the connection member (RD) including a getter is disposed up to the undercut portion (UC) in the transparent display device 100 according to an embodiment of the present specification, moisture permeation can be further prevented. However, it is not necessarily limited thereto, and the connection member (RD) can also be partially formed only on one side of the first planarization layer 113'.

[0136] On the one hand, the transparent display device 100 according to an embodiment of the present specification can be configured to manufacture transparent display devices of various types (or various sizes) without an additional mask process through the process of forming an undercut portion (UC) that isolates the organic light-emitting layer 116. Therefore, compared with the case of manufacturing transparent display devices of various types (or various sizes) through various processes, the production energy can be reduced.

[0137] FIG. 4 is a schematic cross-sectional view showing another example of the C portion shown in FIG. 3.

[0138] Referring to FIG. 4, in the transparent display device 100 according to an embodiment of the present specification, the organic light-emitting layer 116 is isolated by an undercut portion (UC), and the cathode electrode 117 and the encapsulation layer 118 can be connected by the undercut portion (UC). This can be configured by forming a narrower width compared to the undercut portion (UC) in FIG. 3. Here, the width of the undercut portion (UC) can mean the length in the second direction (X-axis direction) of the upper surface of the buffer layer (BL) adjacent to the undercut portion (UC) with reference to FIG. 4. Thereby, the transparent display device 100 according to FIG. 4 can be configured with a structure in which the organic light-emitting layer 116 is isolated by the undercut portion (UC) and the cathode electrode 117 and the encapsulation layer 118 are connected.

[0139] On the other hand, after forming the undercut portion (UC), since the organic light-emitting layer 116, the cathode electrode 117, and the encapsulation layer 118 are sequentially deposited in a vacuum state, the undercut portion (UC) can partially include a vacuum region (VA). As shown in FIG. 4, the vacuum region (VA) can be sealed by the buffer layer (BL), the cathode electrode 117, and the first planarization layer 113'.

[0140] FIG. 5 is a schematic cross-sectional view showing still another example of the C portion shown in FIG. 3.

[0141] Referring to FIG. 5, in the transparent display device 100 according to an embodiment of the present specification, the organic light-emitting layer 116 and the cathode electrode 117 are disconnected at the undercut portion (UC), and the encapsulation layer 118 can be connected at the undercut portion (UC). This can be configured by forming it narrower than the undercut portion (UC) of FIG. 3 and wider than the undercut portion (UC) of FIG. 4. Here, the width of the undercut portion (UC) can mean the length in the second direction (X-axis direction) of the upper surface of the buffer layer (BL) adjacent to the undercut portion (UC) with reference to FIG. 5. Thereby, the transparent display device 100 according to FIG. 5 can be configured with a structure in which the organic light-emitting layer 116 and the cathode electrode 117 are disconnected at the undercut portion (UC) and the encapsulation layer 118 is connected.

[0142] On the other hand, after forming the undercut portion (UC), since the organic light-emitting layer 116, the cathode electrode 117, and the encapsulation layer 118 are sequentially deposited in a vacuum state, the undercut portion (UC) can partially include a vacuum region (VA). As shown in FIG. 5, the vacuum region (VA) can be sealed by the buffer layer (BL) and the encapsulation layer 118.

[0143] FIG. 6 is a schematic cross-sectional view taken along line II-II' shown in FIG. 2.

[0144] Referring to FIGS. 2 and 6, in the transparent display device 100 according to an embodiment of the present specification, the undercut portion (UC) can include a block portion (BKP) that partially overlaps with the planarization layer 113' (or the first planarization layer 113') between the first passivation layer 111c and the second passivation layer 111d. For example, as shown in FIG. 2, the block portion (BKP) can be formed at a portion where the first planarization layer 113' and the second line (SL2) (or the gate line (GL)) intersect.

[0145] The block part (BKP) is for preventing all inorganic film layers located above a wiring (for example, the second line (SL2) (or the gate line (GL))) from being etched by the etching solution used when the undercut part (UC) is formed. Therefore, as shown in FIG. 6, the block part (BKP) is disposed on the inorganic film layer (or the interlayer insulating film 111b and the first passivation layer 111c) on the second line (SL2) (or the gate line (GL)), thereby protecting the inorganic film layer (or the interlayer insulating film 111b and the first passivation layer 111c) from the etching solution. Thereby, when the cathode electrode 117 is deposited, it is possible to prevent the second line (SL2) (or the gate line (GL)) from contacting the cathode electrode 117. The block part (BKP) according to an example can include a metallic substance having high resistance to the etching solution. The block part (BKP) can be formed in the same layer as the connection electrode (CE).

[0146] Referring to FIG. 6, the block part (BKP) can be configured to have a width wider than that of the undercut part (UC) in the second direction (X-axis direction). Therefore, the end of the block part (BKP) can be covered by the second passivation layer 111d. Each of the organic light-emitting layer 116, the cathode electrode 117, and the encapsulation layer 118 insulated by the undercut part (UC) can contact the upper surface of the block part (BKP).

[0147] On the other hand, as shown in FIG. 6, a filling member (RF) used for bonding the first substrate 110 and the second substrate 200 can be disposed above the encapsulation layer 118 and the block part (BKP).

[0148] FIG. 7 is a schematic plan view showing another example of FIG. 2.

[0149] In the transparent display device 100 according to FIG. 2, in the transmissive portion (TA), two first planarization layers 113' are arranged to be long in the first direction (Y-axis direction). Accordingly, the transparent display device 100 according to FIG. 2 includes four undercut portions (UC) arranged to be long in the first direction (Y-axis direction) along each end of the two first planarization layers 113'. Accordingly, in the transparent display device 100 according to FIG. 2, since the undercut portions (UC) (or cut portions (CP)) that can be cut by a cutting device are arranged at various positions, it can be configured to easily manufacture a transparent display device having an area (or size) that meets various needs of users.

[0150] On the other hand, in the transparent display device 100 according to FIG. 7, one first planarization layer 113' is arranged to be long in the first direction (Y-axis direction) in the transmissive portion (TA). Accordingly, the transparent display device 100 according to FIG. 7 includes two undercut portions (UC) arranged in the first direction (Y-axis direction) along each end of the one first planarization layer 113'. Since the number of undercut portions (UC) arranged in the transmissive portion (TA) of the transparent display device 100 according to FIG. 7 is small, the durability against external impacts can be further improved. In FIG. 7, one first planarization layer 113' is arranged per one pixel (P), but it is not limited thereto, and one first planarization layer 113' can be arranged per two pixels (P).

[0151] FIG. 8 is a schematic plan view showing another example of FIG. 2, and FIG. 9 is a schematic cross-sectional view taken along line III-III' shown in FIG. 8.

[0152] In the transparent display device 100 according to FIG. 8, one first planarization layer 113' is arranged to be long in the first direction (Y-axis direction) in the transmissive portion (TA). However, different from the transparent display device 100 according to FIG. 2, in the transparent display device 100 according to FIG. 8, the width of the first planarization layer 113' is configured to be wide in the second direction (X-axis direction). Accordingly, in the transparent display device 100 according to FIG. 8, as shown in FIG. 9, since one first planarization layer 113' is widely arranged in the second direction (X-axis direction) in the transmissive portion (TA), the durability against external impacts can be enhanced.

[0153] FIG. 10 is a plan view showing an enlarged view of portion B shown in FIG. 1, and FIG. 11 is a schematic cross-sectional view taken along line IV-IV' shown in FIG. 10.

[0154] Referring to FIG. 10, in a transparent display device 100 according to an embodiment of the present specification, the first substrate 110 may include a pixel power short bar (EVDD) disposed in the second direction (X-axis direction) in a non-display area (NDA).

[0155] For example, the pixel power short bar (EVDD) may include a first pixel power short bar (EVDD1) disposed in the first non-display area (NDA1). The first pixel power short bar (EVDD1) may include a first sub-pixel power short bar (EVDD1-1) disposed long in the second direction (X-axis direction), and a second sub-pixel power short bar (EVDD1-2) disposed on the first sub-pixel power short bar (EVDD1-1) and having a size smaller than that of the first sub-pixel power short bar (EVDD1-1). As shown in FIG. 10, each of the first sub-pixel power short bar (EVDD1-1) and the second sub-pixel power short bar (EVDD1-2) may intersect the first planarization layer 113' in the first non-display area (NDA1).

[0156] Referring to FIG. 11, the first sub-pixel power short bar (EVDD1-1) may be disposed between the first substrate 110 and the buffer layer (BL). The second sub-pixel power short bar (EVDD1-2) may be disposed between the interlayer insulating film 111b and the first passivation layer 111c and may be connected to the first sub-pixel power shot bar (EVDD1-1) through a contact hole (CNT).

[0157] The block part (BKP) can be arranged on the pixel power short bar (EVDD). Therefore, the block part (BKP) can protect the pixel power short bar (EVDD) (or the second sub-pixel power shot bar EVDD1-2) from the etching solution used when forming the undercut part (UC). The block part (BKP) according to an example can include a metal material with high resistance to the etching solution and can be formed in the same layer as the connection electrode (CE).

[0158] The block part (BKP) can be configured to have a width wider than that of the undercut part (UC) in the second direction (X-axis direction). Therefore, the ends of the block part (BKP) can be covered by the second passivation layer 111d. Each of the organic light-emitting layer 116, the cathode electrode 117, and the encapsulation layer 118 insulated by the undercut part (UC) can contact the upper surface of the block part (BKP). On the other hand, since FIG. 11 is a cross-sectional view of the first non-display area (NDA1), different from FIG. 6, the bank 115 can be arranged on the planarization layer 113 (or the second planarization layer 113).

[0159] FIG. 12 is a schematic cross-sectional view of a transparent display device according to the second embodiment of the present specification.

[0160] Referring to FIG. 12, the transparent display device 100 according to the second embodiment of the present specification is the same as the transparent display device according to FIG. 1 described above, except that the second substrate 200 (or the counter substrate) further includes an upper inorganic film 240 arranged to cover a plurality of upper organic films 230. Therefore, the same reference numerals are assigned to the same components, and only the different components will be described below.

[0161] In the case of the transparent display device according to FIG. 1 described above, since a plurality of upper organic films 230 are arranged on the second substrate 200 so as to be separated from each other, moisture permeation through the upper organic films 230 can be prevented. Further, due to the plurality of upper organic films 230 arranged on the second substrate 200 so as to be separated from each other, when the first substrate 110 and the second substrate 200 are adhered, the connecting member (RD) flows in the direction (D1) toward the filling member (RF) and / or the reverse direction (D2) (or the direction (D2) where there is no filling member (RF) or connecting member (RD)) can be reduced or prevented. For example, the direction (D2) where there is no filling member (RF) or connecting member (RD) can be the direction in which the cut portion (CP) is arranged. For example, the region where there is no filling member (RF) or connecting member (RD) can be the region of the third transparent display device 103 where the cut portion (CP) is arranged in FIG. 1.

[0162] On the contrary, in the case of the transparent display device according to FIG. 12, the upper inorganic film 240 can be arranged so as to cover the plurality of upper organic films 230 arranged so as to be separated from each other. Therefore, the upper inorganic film 240 can contact the second substrate 200 between the plurality of upper organic films 230. Since the upper inorganic film 240 contacts the second substrate 200 between the plurality of upper organic films 230, moisture permeation prevention through the plurality of upper organic films 230 can be enhanced.

[0163] Further, in the case of the transparent display device according to FIG. 12, since the upper inorganic film 240 contacts the second substrate 200 between the plurality of upper organic films 230, the upper inorganic film 240 can be arranged in the form of a groove (or trench) between the plurality of upper organic films 230. Here, the groove (or trench) can mean a form recessed in the direction from the first substrate 110 toward the second substrate 200. Therefore, the transparent display device 100 according to FIG. 12 can reduce or prevent the connecting member (RD) from flowing in the direction (D1) toward the filling member (RF) and / or the opposite direction (D2) (or the direction (D2) where there is no filling member (RF) or connecting member (RD)) when the first substrate 110 and the second substrate 200 are adhered by the upper inorganic film 240 arranged in the groove form.

[0164] On the other hand, since FIG. 12 is a cross-sectional view in the second direction (X-axis direction) in FIG. 2, sub-pixels (SP) (or first sub-pixels (SP1)) that emit the same color can be arranged adjacent to each other in the second direction (X-axis).

[0165] FIG. 13 is a schematic cross-sectional view of a transparent display device according to the third embodiment of the present specification.

[0166] Referring to FIG. 13, the transparent display device 100 according to the third embodiment of the present specification is the same as the transparent display device according to FIG. 1 described above, except that the structure of each of the plurality of upper organic films 230 formed on the second substrate 200 (or counter substrate) is changed. Therefore, the same reference numerals are given to the same components, and only the different components will be described below.

[0167] In the case of the transparent display device according to FIG. 1 described above, since the plurality of upper organic films 230 are arranged separately from each other on the second substrate 200, moisture permeation through the upper organic film can be prevented. Further, the plurality of upper organic films 230 arranged separately from each other on the second substrate 200 can reduce or prevent the connection member (RD) from flowing in the direction (D1) toward the filling member (RF) and / or the opposite direction (D2) (or the direction (D2) in which neither the filling member (RF) nor the connection member (RD) exists) when the first substrate 110 and the second substrate 200 are adhered.

[0168] In contrast, in the case of the transparent display device according to FIG. 13, it may include a main organic film 231 in which each of a plurality of upper organic films 230 is arranged to correspond to each of a plurality of sub-pixels (SP) (or a plurality of light-emitting areas (EA)), and a plurality of sub-organic films 232 and 233 arranged separately from the main organic film 231. Therefore, the connection member (RD) can be arranged between the main organic film 231 and the plurality of sub-organic films 232 and 233. Also, as shown in FIG. 13, the connection member (RD) can also be arranged between the sub-organic films of each of two adjacent sub-pixels arranged adjacent to each other. Therefore, the transparent display device 100 according to FIG. 13 can be configured to have more grooves (or trenches) formed between the main organic film 231 and the plurality of sub-organic films 232 and 233 than the transparent display device according to FIG. 1. Thus, when the first substrate 110 and the second substrate 200 are adhered, the flow of the connection member (RD) in the direction (D1) toward the filling member (RF) and / or the reverse direction (D2) (or the direction (D2) where there is no filling member (RF) or connection member (RD)) can be further reduced or prevented.

[0169] On the other hand, in the transparent display device 100 according to FIG. 13, the plurality of sub-organic films 232 and 233 can be arranged to overlap with the transmissive portion (TA) in the third direction (Z-axis direction). For example, each of the plurality of sub-organic films 232 and 233 can be arranged to correspond to each of the plurality of planarization layers 113' (or the first planarization layer 113') arranged in the transmissive portion (TA). Therefore, the transparent display device 100 according to FIG. 13 has a smaller cell gap (or the distance between the plurality of sub-organic films 232 and 233 and the plurality of first planarization layers 113') in the transmissive portion (TA) compared to the transparent display device according to FIG. 1. Thus, the effect of preventing the flow of the connection member (RD) with respect to the filling member (RF) (or the empty space without the filling member (RF) and the connection member (RD)) when the first substrate 110 and the second substrate 200 are adhered can be enhanced.

[0170] FIG. 14 is a schematic cross-sectional view of a transparent display device according to the fourth embodiment of the present specification, and FIG. 15 is a cross-sectional view simply showing FIG. 14.

[0171] Referring to FIGS. 14 and 15, the transparent display device 100 according to the fourth embodiment of the present specification is the same as the transparent display device according to FIG. 1 described above, except that the forms of the plurality of upper organic films 230 formed on the second substrate 200 (or the counter substrate) are changed. Therefore, the same reference numerals are assigned to the same configurations, and only the different configurations will be described below.

[0172] In the case of the transparent display device according to FIG. 1 described above, a plurality of upper organic films 230 are arranged separately from each other on the second substrate 200, and each of the plurality of upper organic films 230 is configured in a square form. Thereby, the transparent display device according to FIG. 1 can reduce or prevent the connection member (RD) from flowing in the direction (D1) toward the filling member (RF) and / or the opposite direction (D2) (or the direction (D2) where neither the filling member (RF) nor the connection member (RD) exists) when the first substrate 110 and the second substrate 200 are adhered by the plurality of upper organic films 230 having a square form.

[0173] On the other hand, in the case of the transparent display device according to FIG. 14, the width of each of the plurality of upper organic films 230 can be formed to be narrower as it goes from the second substrate 200 toward the first substrate 110. For example, each of the plurality of upper organic films 230 can be configured to have a convex lens form (or a parabolic form) or a round form in the direction from the second substrate 200 toward the first substrate 110. Therefore, the transparent display device 100 according to FIG. 14 can reduce or prevent the connection member (RD) from flowing in the direction (D1) toward the filling member (RF) and / or the reverse direction (D2) (or the direction (D2) where neither the filling member (RF) nor the connection member (RD) exists) when the first substrate 110 and the second substrate 200 are adhered by the plurality of upper organic films 230 having a lens form.

[0174] On the one hand, in the transparent display device 100 according to the fourth embodiment of the present application, as each of the plurality of upper organic films 230 is formed to be narrower as it goes from the second substrate 200 toward the first substrate 110, the spacer (SPC) disposed between the second substrate 200 and the first substrate 110 cannot be disposed so as to overlap the light-emitting region (EA) when the first substrate 110 and the second substrate 200 are adhered, and can be disposed between the plurality of upper organic films 230. For example, when the first substrate 110 and the second substrate 200 are adhered, the spacer (SPC) can be extruded between the upper organic films 230 by the round-shaped upper organic film 230. Therefore, in the transparent display device 100 according to the fourth embodiment of the present application, since the spacer (SPC) is disposed between the plurality of upper organic films 230 (or the transmissive portion (TA)), the cell gap becomes smaller compared to the case where the spacer is disposed so as to overlap the light-emitting region (EA), and the light viewing angle characteristics can be improved.

[0175] Moreover, in the transparent display device 100 according to the fourth embodiment of the present application, since the spacer (SPC) is disposed between the plurality of upper organic films 230, the cell gap becomes smaller compared to the case where the spacer is disposed so as to overlap the light-emitting region (EA), and color mixing between the plurality of sub-pixels (SP) can be prevented.

[0176] FIG. 16 is a schematic cross-sectional view showing a part of the transparent display device according to the fifth embodiment of the present specification, and FIG. 17 is a schematic cross-sectional view taken along line V-V' shown in FIG. 16.

[0177] The transparent display device 100 according to the fifth embodiment of the present specification is the same as the transparent display device according to FIG. 1 described above, except that the arrangement structure of the plurality of sub-pixels (SP) included in the pixel (P) is changed. Therefore, the same reference numerals are given to the same configurations, and only the different configurations will be described below.

[0178] In the case of the transparent display device according to FIG. 1 described above, a plurality of sub-pixels (SP) included in each of the plurality of pixels (P) are arranged in a stripe form that is long in the first direction (Y-axis direction). For example, a first sub-pixel (SP1) that emits red light, a second sub-pixel (SP2) that emits white light, a third sub-pixel (SP3) that emits green light, and a fourth sub-pixel (SP4) that emits blue light are arranged long in the first direction (Y-axis direction), and each of the first to fourth sub-pixels (SP1, SP2, SP3, SP4) has a structure in which it is arranged adjacent to a transmissive portion (TA) in the second direction (X-axis direction).

[0179] On the other hand, in the case of the transparent display device according to FIG. 16, a first sub-pixel (SP1) that emits red light, a second sub-pixel (SP2) that emits white light, a third sub-pixel (SP3) that emits green light, and a fourth sub-pixel (SP4) that emits blue light can be configured in a 2×2 structure. For example, the fourth sub-pixel (SP4) that emits blue light and the first sub-pixel (SP1) that emits red light can be arranged adjacent to each other in the second direction (X-axis direction), and the third sub-pixel (SP3) that emits green light and the second sub-pixel (SP2) that emits white light can be arranged adjacent to each other in the second direction (X-axis direction). Here, the third sub-pixel (SP3) and the second sub-pixel (SP2) can be arranged adjacent to each other below the fourth sub-pixel (SP4) and the first sub-pixel (SP1), that is, in the first direction (Y-axis direction). And a transmissive portion (TA) can be arranged adjacent to the right side of the first sub-pixel (SP1) and the second sub-pixel (SP2). However, the arrangement structure of the first to fourth sub-pixels (SP1, SP2, SP3, SP4) can be changed according to the design of the first substrate 110 (or the second substrate 200).

[0180] Therefore, as shown in FIG. 17, the transparent display device 100 according to the fifth embodiment of the present specification can be configured with a structure in which color filters 210 and 211 of two different sub-pixels (SP) are covered by one upper organic film 230.

[0181] The embodiments of this specification have been described in more detail with reference to the attached drawings above. However, this specification is not necessarily limited to such embodiments, and various modifications can be made within the scope not departing from the technical idea of this specification. Therefore, the embodiments disclosed in this specification are for the purpose of explaining rather than limiting the technical idea of this specification, and the scope of the technical idea of this specification is not limited by such embodiments. Therefore, it must be understood that the embodiments described above are exemplary in all respects and not restrictive. All technical ideas within the protection scope of this specification must be construed as being included in the scope of rights of this specification.

Explanation of Reference Numerals

[0182] 100: Transparent display device 110: First substrate P: Pixel 111: Inorganic film layer 112: Thin film transistor 113: Flattening layer 114: Anode electrode 115: Bank 116: Organic light emitting layer 117: Cathode electrode 118: Encapsulation layer 200: Second substrate 210: Color filter 220: Black matrix 230: Upper organic film 240: Upper inorganic film DMA: Dam region CP: Cut portion BKP: Block portion SL1: First line SL2: Second line RD: Connection member RF: Filling member SPC: Spacer

Claims

1. A substrate having a display area in which a plurality of pixels each having a transmissive portion and a plurality of sub-pixels are arranged, and a non-display area adjacent to the display area, and A transparent display device including a plurality of dam regions that extend from the non-display area to the display area on the substrate and are configured in a closed loop.

2. The transparent display device according to claim 1, wherein the plurality of dam regions are configured in N (N is an integer greater than 1) on the substrate.

3. The transparent display device according to claim 2, further including a cut portion provided between the N dam regions.

4. The substrate further includes a plurality of gate driving portions arranged in a first direction in the non-display area, The transparent display device according to claim 3, wherein the cut portion is arranged parallel to the plurality of gate driving portions.

5. A planarization layer arranged on the substrate, and A plurality of inorganic film layers arranged between the substrate and the planarization layer, The transparent display device according to claim 1, wherein the transmissive portion includes an undercut portion in which the planarization layer and the plurality of inorganic film layers are partially removed.

6. The transparent display device according to claim 5, wherein the undercut portion is configured in M (M is an integer greater than 0) in the transmissive portion.

7. Including a cut portion provided between the plurality of dam regions, The transparent display device according to claim 6, wherein the cut portion is any one of the M undercut portions.

8. The plurality of inorganic film layers include a first passivation layer arranged between the substrate and the planarization layer, and a second passivation layer arranged between the first passivation layer and the planarization layer, The transparent display device according to claim 5, wherein the undercut portion includes a block portion that partially overlaps the planarization layer between the first passivation layer and the second passivation layer.

9. The substrate further includes a gate line extending in a second direction in the display area, The transparent display device according to claim 8, wherein the block portion is arranged on the gate line.

10. The substrate further includes a pixel power short bar arranged in a second direction in the non-display area, The transparent display device according to claim 8, wherein the block portion is arranged on the pixel power short bar.

11. A counter substrate arranged to face the substrate, and including a plurality of upper organic films covering color filters arranged corresponding to each of the plurality of sub-pixels on the counter substrate, The transparent display device according to claim 1, wherein the plurality of upper organic films are arranged to be separated from each other with the transmissive portion therebetween.

12. each of the plurality of dam regions includes a connecting member disposed between the substrate and the counter substrate, The transparent display device according to claim 11, wherein the connecting member is partially disposed between the plurality of upper organic films.

13. the counter substrate includes an upper inorganic film disposed to cover the plurality of upper organic films, The transparent display device according to claim 11, wherein the upper inorganic film contacts the counter substrate between the plurality of upper organic films.

14. each of the plurality of upper organic films, a main organic film disposed corresponding to each of the plurality of sub-pixels, and including a plurality of sub-organic films disposed separately from the main organic film, The transparent display device according to claim 12, wherein the connecting member is disposed between the main organic film and the plurality of sub-organic films.

15. The transparent display device according to claim 14, wherein the plurality of sub-organic films are disposed to overlap the transmissive portion.

16. Each of the plurality of upper organic films is formed to have a narrower width as going from the counter substrate toward the substrate, The transparent display device according to claim 11.

17. including a spacer disposed between the counter substrate and the substrate, The transparent display device according to claim 16, wherein the spacer is disposed between the plurality of upper organic films.

18. each of the plurality of pixels, an anode electrode disposed on the planarization layer, an organic light-emitting layer disposed on the anode electrode, a cathode electrode disposed on the organic light-emitting layer, including a sealing layer disposed on the cathode electrode, The transparent display device according to claim 5, wherein the organic light-emitting layer is interrupted at the undercut portion.

19. The transparent display device according to claim 18, wherein the cathode electrode and the sealing layer are connected at the undercut portion.

20. the cathode electrode is interrupted at the undercut portion, The transparent display device according to claim 18, wherein the sealing layer is connected to the undercut portion.

21. further including a filling member disposed adjacent to the connecting member, The transparent display device according to claim 12, wherein the filling member is disposed so as to fill a gap between the substrate and the opposing substrate and support the substrate and the opposing substrate.

22. The transparent display device according to claim 21, wherein the filling member joins the substrate and the opposing substrate together with the connecting member, and the filling member is disposed surrounded by the connecting member.

23. Further including a cut portion between the plurality of dam regions, The transparent display device according to claim 21, wherein the cut portion is disposed in at least one of an undercut portion of a region where the filling member is not disposed, a light emitting region of the pixel in a region where the filling member is not disposed, and a transmissive portion of a region where the filling member is not disposed.

24. The transparent display device according to claim 8, wherein the blocking portion is configured to have a width wider than that of the undercut portion in a second direction.

25. A blocking portion located on the plurality of inorganic layers, and The transparent display device according to claim 18, further including a filling member disposed above the sealing layer and above the blocking portion.

26. The transparent display device according to claim 12, further including a filling member partially disposed between the plurality of upper organic layers in the display region where the dam region is not disposed.

27. The transparent display device according to claim 14, wherein the connecting member is further disposed between sub-organic films of two adjacent sub-pixels.

Images