Pixel-defining layer

Abstract

To not only ensure vivid colors but also increase the display reliability and lifespan by implementing a pixel-defining layer having a low outgas amount on an electrode substrate by using a photosensitive composition containing a fluorine-free leveling agent and a resin.SOLUTION: In other words, if the amount of outgas in a panel after post-heat treatment is 15 ppm or more, then it causes a decrease in the luminance and a decrease in the lifespan due to pixel shrinkage and, if the contact angle with water is 100 degrees (°) or more, then the surface energy is lowered and peeling of the deposit occurs.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to a pixel definition layer of a light-emitting display device using a photosensitive composition.

Background Art

[0002] Flat panel display devices such as liquid crystal display devices (LCDs) and organic light emitting display devices (OLEDs) are widely used. Among these, organic light emitting display devices have advantages such as low power consumption, fast response speed, high color reproducibility, high brightness, and wide viewing angle.

[0003] In the case of the organic light emitting display device, a polarizing film is used to block the light incident from the outside and reflected from the panel. However, when applying the polarizing film to a flexible device, there is a disadvantage that it is not suitable due to insufficient bending characteristics.

[0004] As a method for solving the above problems, a method of forming an inorganic film for blocking light on the upper substrate in addition to a color filter and a black matrix has been proposed. However, the above method has limitations in obtaining a desired level of antireflection effect and does not specifically present a method for replacing the polarizing film.

[0005] On the other hand, a coloring pattern is a red, green, or blue color filter and is used not only in liquid crystal displays but also in organic light emitting displays.

[0006] When manufacturing the coloring pattern, various types of organic pigments and the like, as well as carbon black and inorganic pigments, are used as colorants, and a pigment dispersion liquid in which these are dispersed is mixed with other compositions to form a pattern.

[0007] The organic light-emitting display made of the pixels formed in this way can achieve clearer colors. The pattern using the coloring composition uses a small amount of a leveling agent for good coating in a large area, and the main component is fluorine-based and has the best characteristics. However, at present, its use is restricted by fluorine compound regulations (PFAS), and the use of alternative additives that are not fluorine-based is inevitable. The alternative additives have lower characteristics than fluorine-based ones, which may increase the filter differential pressure in the process, the contact angle of the pattern, the flatness of the coating film, and the amount of outgas. When there is a large amount of outgas, problems such as pixel shrinkage, dark spots, and electrode oxidation may occur, reducing the lifespan and brightness of the organic light-emitting display.

Summary of the Invention

Problems to be Solved by the Invention

[0008] In an attempt to solve the problems of the prior art, one embodiment of the present invention is to use a leveling agent that does not contain fluorine to realize a pixel definition layer containing a resin with a contact angle, coating film flatness, and outgas amount lower than those of the conventional fluorine-based at the same content on an electrode substrate, which not only makes the color clearer but also improves the reliability and lifespan of the display.

[0009] That is, the purpose is to develop a photosensitive resin composition whose contact angle in the panel after post-heat treatment satisfies 60° to 100°, the pattern thickness is controlled to be 2.0 μm or less in the substrate, and the amount of outgas is 15 ppm or less. If the amount of outgas is 15 ppm or more, it may cause a decrease in brightness and lifespan due to pixel shrinkage. Therefore, in order to minimize the amount of outgas after the post-heat treatment process, the purpose is to generate sufficient fume at the post-heat treatment stage to minimize the generation of out-gas in the panel state.

[0010] Another exemplary embodiment is for providing an organic light-emitting display device including a pixel definition layer manufactured by the above method.

[0011] Another exemplary embodiment is for providing an electronic device including the organic light-emitting display device.

Means for Solving the Problems

[0012] The pixel definition layer according to the present invention preferably includes a photosensitive composition containing a resin and a leveling agent not containing fluorine.

[0013] The leveling agent preferably contains a silicon-based compound.

[0014] The molecular weight of the silicon-based compound is preferably from 5,000 g / mol to 15,000 g / mol.

[0015] The molecular weight of the silicon-based compound is more desirably from 5,000 g / mol to 10,000 g / mol.

[0016] The viscosity of the silicon-based compound is preferably from 100,000 mm 2 / s to 500,000 mm 2 / s.

[0017] The viscosity of the silicon-based compound is more desirably from 10 mm 2 / s to 40 mm 2 / s when measured at 20 °C for a mixture of 50 wt% of the silicon-based compound and 50 wt% of propylene glycol methyl ether acetate, and even more desirably from 10 mm 2 / s to 30 mm 2 / s.

[0018] The silicon-based compound has an alkyl group having C1 to C 40 ; an alkenyl group having C1 to C 40 ; an alkynyl group having C1 to C 40 ; an alkyl group having C1 to C 40an alkoxy group; C6-C 40 an aryloxy group; C1-C 40 It preferably contains a substituent selected from the group consisting of an alkoxycarbonyl group; a carbonyl group; an ether group; an ester group; a carboxyl group; or a combination thereof.

[0019] The pixel definition layer is preferably composed of a single layer.

[0020] The photosensitive composition preferably contains a leveling agent that does not contain fluorine in an amount of 0.01 to 0.5% by weight based on the total amount thereof.

[0021] The resin preferably contains an acrylic binder resin, a cardo binder resin, or a combination thereof.

[0022] The weight average molecular weight of the acrylic binder resin is preferably from 3,000 g / mol to 150,000 g / mol.

[0023] The cardo binder resin preferably contains the repeating structure of the following Chemical Formula 1.

[0024]

Chemical formula

[0025] In Chemical Formula 1,

[0026] 1) R1 and R2 are each independently hydrogen; deuterium; halogen; C6-C 30 an aryl group; a C2-C heterocyclic group containing at least one heteroatom of O, N, S, Si and P 30 C6-C 30 a fused ring group of an aliphatic ring and an aromatic ring; C1-C 20 an alkyl group; C2-C 20 an alkenyl group; C2-C 20 an alkynyl group; C1-C 20 an alkoxy group: C6-C 30an aryloxy group; a fluorenyl group: a carbonyl group; an ether group; or a C1-C 20 is an alkoxycarbonyl group of

[0027] 2) R1 and R2 can form a ring with adjacent groups

[0028] 3) m or n is independently an integer from 0 to 4

[0029] 4) A1 and A2 are independently the following Chemical Formula 2 or Chemical Formula 3

[0030]

Chemical Formula

[0031]

Chemical Formula

[0032] In the above Chemical Formula 2 and Chemical Formula 3

[0033] 4-1) * indicates the connecting site

[0034] 4-2) R3 to R6 are independently hydrogen; deuterium; halogen; C6-C 30 is an aryl group; a heterocyclic group containing at least one heteroatom of O, N, S, Si and P and having 2 to C 30 is a fused ring group of an aliphatic ring and an aromatic ring having 6 to C 30 is an alkyl group having 1 to C 20 is an alkenyl group having 2 to C 20 is an alkynyl group having 2 to C 20 is an alkoxy group having 1 to C 20 is an aryloxy group; a fluorenyl group; a carbonyl group; an ether group; or a C1-C 30 is an alkoxycarbonyl group of 20 and

[0035] 4-3) R3 to R6 can form a ring with adjacent groups

[0036] 4-4) Y1 and Y2 are independently of each other represented by the following Chemical Formula 6 or Chemical Formula 7,

[0037]

Chem.

[0038]

Chem.

[0039] In the above Chemical Formula 6 and Chemical Formula 7,

[0040] 4-4-1) * indicates the bonding position,

[0041] 4-4-2) R9 is hydrogen or methyl,

[0042] 4-4-3) R 10 or R 13 are independently of each other hydrogen; deuterium; halogen; an aryl group having 6 to C 30 a heterocyclic group having 2 to C containing at least one hetero atom of O, N, S, Si and P; a fused ring group of an aliphatic ring and an aromatic ring having 6 to C 30 an alkyl group having 6 to C 30 an alkenyl group having 2 to C 20 an alkynyl group having 2 to C 20 an alkoxy group having 1 to C 20 an aryloxy group having 6 to C 20 a fluorenyl group; a carbonyl group; an ether group; or an alkoxycarbonyl group having 1 to C 30 a fluorenylene group; C2 to C 20 wherein,

[0043] 4-4-4) L1 to L3 are independently of each other a single bond; a fluorenylene group; C2 to C 30 an alkylene; C6 to C 30 an arylene; C2 to C 30 a heterocycle; C1 to C 30 an alkoxylene; C2 to C30 alkyleneoxy; C6 - C 30 aryloxy group; C2 - C 30 is a polyethyleneoxy group,

[0044] 4 - 4 - 5) q and r are each independently an integer from 0 to 3; provided that q + r = 3,

[0045] 5) The ratio of A1 to A2 in the polymer chain of the resin containing the repeating unit represented by Chemical Formula 1 is 9:1 to 1:9,

[0046] 6) X1 is a single bond; O; CO; SO2; CR’R”; SiR’R”; the following Chemical Formula 4; or Chemical Formula 5,

[0047] 6 - 1) R’ and R” are each independently hydrogen; deuterium; halogen; C6 - C 30 aryl group; C2 - C containing at least one heteroatom of O, N, S, Si, and P 30 heterocyclic group; C6 - C 30 fused ring group of an aliphatic ring and an aromatic ring; C1 - C 20 alkyl group; C2 - C 20 alkenyl group; C2 - C 20 alkynyl group; C1 - C 20 alkoxy group; C6 - C 30 aryloxy group; fluorenyl group; carbonyl group; ether group; or C1 - C 20 alkoxycarbonyl group,

[0048] (6 - 2) R’ and R” can form a ring with adjacent groups,

[0049]

Chemical formula

[0050]

Chemical formula

[0051] In the above Chemical Formula 4 and Chemical Formula 5,

[0052] (6-3)* indicates the bonding position,

[0053] (6-4) R7 and R8 are each independently hydrogen; deuterium; halogen; C6-C 30 aryl group; C2-C containing at least one heteroatom of O, N, S, Si and P 30 heterocyclic group; C6-C 30 fused ring group of an aliphatic ring and an aromatic ring; C1-C 20 alkyl group; C2-C 20 alkenyl group; C2-C 20 alkynyl group; C1-C 20 alkoxy group; C6-C 30 aryloxy group; fluorenyl group; carbonyl group; ether group; or C1-C 20 alkoxycarbonyl group,

[0054] (6-5) o and p are each independently an integer from 0 to 4,

[0055] (7) X2 is a C6-C 30 aryl group; C2-C containing at least one heteroatom of O, N, S, Si and P 30 heterocyclic group; C6-C 30 fused ring group of an aliphatic ring and an aromatic ring; C1-C 20 alkyl group; C2-C 20 alkenyl group; C2-C 20 alkynyl group; C1-C 20 alkoxy group; C6-C 30 aryloxy group; fluorenyl group; carbonyl group; ether group; or C1-C 20 alkoxycarbonyl group,

[0056] (8) The above R’, R”, X2, L1 to L3, R1 to R8 and R 10 to R 13 are each deuterium; halogen; C1-C 30 alkyl group or C6-C 30A silane group which may or may not be substituted with an aryl group; a siloxane group; a boron group; a germanium group; a cyano group; an amino group; a nitro group; C1-C 30 of an alkylthio group; C1-C 30 of an alkoxy group; C6-C 30 of an arylalkoxy group; C1-C 30 of an alkyl group; C2-C 30 of an alkenyl group; C2-C 30 of an alkynyl group; C6-C 30 of an aryl group; a C6-C aryl group substituted with deuterium 30 of an aryl group; a fluorenyl group; a C2-C containing at least one heteroatom selected from the group consisting of O, N, S, Si, and P 30 of a heterocyclic group; C3-C 30 of an aliphatic ring group; C7-C 30 of an arylalkyl group; C8-C 30 of an arylalkenyl group; and can be further substituted with one or more substituents selected from the group consisting of these combinations, and adjacent substituents can form a ring with each other.

[0057] The weight average molecular weight of the cardo resin is preferably 1,000 to 100,000 g / mol.

[0058] The cardo resin is preferably contained in an amount of 1 to 30% by weight based on the total amount of the photosensitive composition.

[0059] The photosensitive composition preferably contains a colorant.

[0060] The colorant preferably contains one or more of an inorganic dye, an organic dye, an inorganic pigment, and an organic pigment.

[0061] The colorant is preferably contained in an amount of 1 to 40% by weight based on the total amount of the photosensitive composition.

[0062] The colorant is preferably pretreated using a dispersant; or a water-soluble inorganic salt and a wetting agent.

[0063] The average particle diameter of the coloring agent is preferably 20 nm to 110 nm.

[0064] The photosensitive composition preferably contains a reactive unsaturated compound.

[0065] The photosensitive composition preferably contains 1 to 40% by weight of a reactive unsaturated compound based on the total amount thereof.

[0066] The photosensitive composition preferably contains a photoinitiator.

[0067] The photosensitive composition preferably contains 0.01 to 10% by weight of a photoinitiator based on the total amount thereof.

[0068] When 2 to 10 microliters (μl) of water is brought into contact with the surface of the pixel definition layer under the temperature condition of 25 ± 3°C, the contact angle with the interface is preferably 60° to 100°.

[0069] The contact angle with the interface is more preferably 65° to 95°.

[0070] The pixel definition layer preferably has no residue.

[0071] The pixel definition layer is preferably manufactured by including a step of post-heat treatment of a photosensitive composition containing a leveling agent not containing fluorine.

[0072] The post-heat treatment step is preferably performed at a temperature of 210°C to 300°C for 30 minutes to 120 minutes.

[0073] The amount of outgas generated after the post-heat treatment step is preferably 15 ppm or less.

[0074] The pixel definition layer is preferably manufactured by further including steps of applying and coating a photosensitive composition; pre-baking; exposing; and developing.

[0075] It is preferable that the temperature in the pre-baking step is 80°C to 150°C.

[0076] It is preferable that the pre-baking step is performed for 50 seconds to 200 seconds.

[0077] It is preferable to irradiate actinic rays of 20 mJ / cm 2 to 350 mJ / cm 2 in the exposure step.

[0078] It is more preferable to irradiate actinic rays of 20 mJ / cm 2 to 150 mJ / cm 2 in the exposure step.

[0079] It is preferable that the post-heat treatment step is performed at a temperature of 210°C to 300°C.

[0080] It is more preferable that the temperature in the post-heat treatment step is 250°C to 270°C.

[0081] It is preferable that the post-heat treatment step is performed for 30 minutes to 120 minutes.

[0082] It is more preferable that the post-column treatment step is 60 minutes to 120 minutes.

[0083] It is preferable that the amount of outgas generated after the post-heat treatment step is 15 ppm or less.

[0084] It is preferable that the thickness of the pixel definition layer is 1.40 μm to 1.60 μm after the post-heat treatment step.

[0085] It is more preferable that the thickness of the pixel definition layer is 1.45 μm to 1.55 μm.

[0086] As another specific example, the present invention preferably provides an organic light-emitting display device including the pixel definition layer.

[0087] In still another embodiment, the present invention preferably provides an electronic device including the display device and a control unit that drives the display device. Effect of the Invention

[0088] The present invention uses a fluorine-free leveling agent to realize a pixel definition layer on an electrode substrate with a low amount of outgassing equivalent to that of existing fluorine-based additives, and satisfies the same level of contact angle and flatness to not only provide clear colors but also improve display reliability and lifespan. That is, if the contact angle after post-heat treatment is 100° or more, the surface energy decreases and the adhesive strength of the substrate and interface decreases, causing film peeling during the deposition process of the pattern and organic light-emitting material, and if the amount of outgassing in the panel is 15 ppm or more, it may cause a decrease in brightness and a decrease in lifespan due to pixel shrinkage, so the contact angle and amount of outgassing after the post-heat treatment process are minimized by including a suitable additive according to the present invention. [Brief description of the drawings]

[0089]

Figure 1

Figure 2

Figure 3

[0090] Hereinafter, some embodiments of the present invention will be described in detail with reference to the accompanying drawings. When reference numerals are used to designate components in each drawing, the same reference numerals are used to designate the same components even if they are displayed in different drawings.

[0091] In the description of the present invention, when it is determined that a specific description of a related known configuration or function may obscure the gist of the present invention, the detailed description thereof may be omitted. When terms such as "including", "having", and "comprising" mentioned in this specification are used, other parts may be added as long as "only" is not used. When a component is expressed in the singular, it includes a plurality unless there is a special explicit description.

[0092] In addition, in the description of the components of the present invention, terms such as first, second, A, B, (a), (b), etc. can be used. Such terms are for distinguishing the component from other components, and the essence, order, sequence, or number of the component is not limited by such terms.

[0093] In the description of the positional relationship of components, when it is described that two or more components are "connected", "coupled", or "joined", it should be understood that two or more components may be directly "connected", "coupled", or "joined", but two or more components and other components may also be "interposed" and then "connected" or "joined". Here, the other components may be included in one or more of the two or more components that are "connected", "coupled", or "joined" to each other.

[0094] In addition, when a component such as a layer, film, region, or plate is said to be "on" or "above" another component, this should be understood to include not only the case where it is directly "above" the other component, but also the case where there is another component in between. Conversely, when a component is said to be "directly above" another part, it should be understood to mean that there is no other part in between.

[0095] In the description of the temporal flow relationship related to components, operation methods, manufacturing methods, etc., for example, when the temporal front-back relationship or flow front-back relationship is described such as "after", "subsequent to", "next", "before", etc., it includes cases where it is not continuous unless "immediately" or "directly" is used.

[0096] On the one hand, when a numerical value for a component or its corresponding information is mentioned, even without separate explicit description, the numerical value or its corresponding information can be interpreted as including an error range that may be generated by various factors (e.g., process factors, internal or external shocks, noise, etc.).

[0097] The terms used in this specification and the appended claims are as follows, unless otherwise stated, within the scope not departing from the spirit of the present invention.

[0098] In this application, the terms "halo" or "halogen" include fluorine (F), chlorine (Cl), bromine (Br), and iodine (I) unless otherwise explained.

[0099] In this application, the term "alkyl" or "alkyl group" means a radical of a saturated aliphatic functional group having 1 to 60 carbons linked by a single bond, including a straight-chain alkyl group, a branched-chain alkyl group, a cycloalkyl (alicyclic) group, an alkyl-substituted cycloalkyl group, a cycloalkyl-substituted alkyl group, etc., unless otherwise explained.

[0100] In this application, the term "haloalkyl group" or "halogenalkyl group" means an alkyl group substituted with halogen unless otherwise explained.

[0101] In this application, the terms "alkenyl" or "alkynyl" each have a double bond or a triple bond, respectively, include straight-chain or side-chain groups, and have 2 to 60 carbon atoms, but are not limited thereto, unless otherwise explained.

[0102] In this application, the term "cycloalkyl" means alkyl forming a ring having 3 to 60 carbon atoms, but is not limited thereto, unless otherwise explained.

[0103] As used in this application, the term "alkoxy group" or "alkyloxy group" means an alkyl group to which an oxygen radical is bonded, and has 1 to 60 carbon atoms unless otherwise specified, but is not limited thereto.

[0104] As used in this application, the terms "alkenoxyl group", "alkenoxy group", "alkenyloxyl group", or "alkenyloxy group" mean an alkenyl group to which an oxygen radical is attached, and has 2 to 60 carbon atoms unless otherwise specified, but is not limited thereto.

[0105] As used in this application, the terms "aryl group" and "arylene group" each have 6 to 60 carbon atoms unless otherwise specified, but are not limited thereto. In this application, the aryl group or arylene group includes a single cyclic, ring assembly, a plurality of fused ring systems, etc. For example, the aryl group includes a phenyl group, a monovalent moiety of biphenyl, a monovalent moiety of naphthalene, a fluorenyl group, a substituted fluorenyl group, and the arylene group includes a fluorenylene group, a substituted fluorenylene group.

[0106] As used in this application, the term "ring assemblies" means that two or more ring systems (single ring or fused ring systems) are directly connected to each other by a single bond or a double bond, and the number of such direct connections between the rings is one less than the total number of ring systems contained in the compound. Ring assemblies can have the same or different ring systems directly connected to each other by single bonds or double bonds.

[0107] Since the aryl group in this application includes ring assemblies, the aryl group includes biphenyl and terphenyl in which a benzene ring, which is a single aromatic ring, is connected by a single bond. Also, since the aryl group includes a compound in which an aromatic ring system joined to an aromatic single ring is connected by a single bond, for example, it also includes a compound in which fluorene, which is an aromatic ring system joined to a benzene ring, which is an aromatic single ring, is connected by a single bond.

[0108] As used herein, the term "fused multiple ring systems" means a fused ring form that shares at least two atoms, including a form in which two or more hydrocarbon ring systems are fused, and a form in which at least one hetero ring system containing at least one heteroatom is fused. Such fused multiple ring systems may be aromatic rings, heteroaromatic rings, aliphatic rings, or combinations of these rings. For example, in the case of an aryl group, it may be a naphthalenyl group, a phenanthrenyl group, a fluorenyl group, etc., but is not limited thereto.

[0109] As used herein, the term "spiro compound" has a "spiro union", and the spiro union means a linkage formed by two rings sharing only one atom. At this time, the atom shared by the two rings is called a "spiro atom", and depending on the number of spiro atoms in a compound, these are respectively called "monospiro-", "dispiro-", "trispiro-" compounds.

[0110] As used herein, the terms "fluorenyl group", "fluorenylene group", "fluorenetriyl group" mean monovalent, divalent or trivalent functional groups in which R, R', R" and R'" are all hydrogen in the following structures respectively, unless otherwise specified. A "substituted fluorenyl group", "substituted fluorenylene group" or "substituted fluorenetriyl group" means that at least one of the substituents R, R', R" and R'" is a substituent other than hydrogen, including the case where R and R' are bonded to each other to form a spiro compound together with the carbon to which they are bonded. In this specification, regardless of the valence such as monovalent, divalent, trivalent, etc., the fluorenyl group, fluorenylene group, fluorenetriyl group can all be named as fluorenyl group.

[0111]

Chemical formula

[0112] Also, each of R, R’, R” and R’” is independently an alkyl group having 1 to 20 carbon atoms, an alkenyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, or a heterocyclic group having 2 to 30 carbon atoms. For example, the aryl group may be phenyl, biphenyl, naphthalene, anthracene or phenanthrene, and the heterocyclic group may be pyrrole, furan, thiophene, pyrazole, imidazole, triazole, pyridine, pyrimidine, pyridazine, pyrazine, triazine, indole, benzofuran, quinazoline, quinoxaline. For example, the substituted fluorenyl group and fluorenylene group may be monovalent or divalent functional groups of 9,9-dimethylfluorene, 9,9-diphenylfluorene and 9,9’-spirobi[9H-fluorene], respectively.

[0113] As used herein, the term "heterocyclic group" includes not only aromatic rings such as "heteroaryl group" or "heteroarylene group", but also non-aromatic rings, and means a ring having 2 to 60 carbon atoms containing one or more heteroatoms each, unless otherwise specified, but is not limited thereto. As used herein, the term "heteroatom" means N, O, S, P or Si unless otherwise specified, and the heterocyclic group means a single cyclic, ring assembly, a plurality of joined ring systems, a spiro compound, etc. containing heteroatoms.

[0114] For example, the "heterocyclic group" may also include compounds containing heteroatomic groups such as SO2, P=O, etc. as shown in the following compounds instead of carbon forming the ring.

[0115]

Chemical formula

[0116] As used herein, the term "ring" includes single rings and polycyclic rings, including hydrocarbon rings as well as heterocyclic rings containing at least one heteroatom, and including aromatic and non-aromatic rings.

[0117] As used herein, the term "polycyclic" includes ring assemblies such as biphenyl and terphenyl, fused multiple ring systems, and spiro compounds, and includes not only aromatic but also non-aromatic compounds, including hydrocarbon rings as well as heterocyclic rings containing at least one heteroatom.

[0118] As used herein, the term "alicyclic group" means a cyclic hydrocarbon excluding aromatic hydrocarbons, and includes single cyclic, ring assemblies, fused multiple ring systems, spiro compounds, etc., and means a ring having 3 to 60 carbon atoms unless otherwise specified, but is not limited thereto. For example, when benzene, an aromatic ring, and cyclohexane, a non-aromatic ring, are fused, it also corresponds to an alicyclic ring.

[0119] Also, when prefixes are named continuously, it means that substituents are listed in the order described. For example, in the case of an arylalkoxy group, it means an alkoxy group substituted with an aryl group, in the case of an alkoxycarbonyl group, it means a carbonyl group substituted with an alkoxy group, and in the case of an arylcarbonylalkenyl group, it means an alkenyl group substituted with an arylcarbonyl group, where the arylcarbonyl group is a carbonyl group substituted with an aryl group.

[0120] Also, unless otherwise specified, in the term "substituted or unsubstituted" used herein, "substituted" means deuterium, halogen, amino group, nitrile group, nitro group, C1-C 30 alkyl group, C1-C 30 alkoxy group, C1-C 30 alkylamine group, C1-C 30 alkylthiophene group, C6-C 30 arylthiophene group, C2-C 30 alkenyl group, C2-C 30 alkynyl group, C3-C 30 cycloalkyl group, C6-C 30 aryl group, C6-C substituted with deuterium 30 aryl group, C8-C 30an arylalkenyl group, a silane group, a boron group, a germanium group, and a C2-C containing at least one heteroatom selected from the group consisting of O, N, S, Si, and P 30 It means being substituted with one or more substituents selected from the group consisting of the heteroaryl groups of 30 , and is not limited to these substituents.

[0121] In this application, for the "functional group name" corresponding to an aryl group, an arylene group, a heteroaryl group, etc. exemplified as examples of each symbol and its substituents, it is also possible to describe the "name of the functional group reflecting the valence", but it is also possible to describe it as the "name of the parent compound". For example, in the case of "phenanthrene" which is a kind of aryl group, the monovalent "group" can be described as "phenanthryl (group)", and the divalent group can be described as "phenanthrylene (group)" by distinguishing the valence, etc., but it can also be described as "phenanthrene" which is the name of the parent compound regardless of the valence.

[0122] Similarly, in the case of pyrimidine, it can be described as "pyrimidine" regardless of the valence, or as the "name of the group" of the corresponding valence such as "pyrimidinyl (group)" in the monovalent case and "pyrimidinylene (group)" in the divalent case. Therefore, when describing the type of substituent by the name of the parent compound in this application, it may mean an n-valent "group" formed by the elimination of a hydrogen atom bonded to a carbon atom and / or a heteroatom of the parent compound.

[0123] Also, in this specification, when describing a compound name or a substituent name, numbers, alphabets, etc. indicating the position may be omitted. For example, pyrido[4,3-d]pyrimidine can be described as pyridopyrimidine, benzofuro[2,3-d]pyrimidine can be described as benzofuropyrimidine, 9,9-dimethyl-9H-fluorene can be described as dimethylfluorene, etc. Therefore, both benzo[g]quinoxaline and benzo[f]quinoxaline can be described as benzoquinoxaline.

[0124] Also, unless otherwise explicitly stated, the chemical formulas used in this application are applied in the same way as the substituent definitions according to the index definitions of the following chemical formulas.

[0125]

Chem.

[0126] Here, when a is an integer of 0, it means that the substituent R 1 does not exist. That is, when a is 0, it means that all hydrogens are bonded to the carbons forming the benzene ring. At this time, the display of the hydrogens bonded to the carbons may be omitted, and the chemical formula or compound may be described. Also, when a is an integer of 1, one substituent R 1 is bonded to any one of the carbons forming the benzene ring. When a is an integer of 2 or 3, for example, it can be bonded as follows. When a is an integer of 4 to 6, it is also bonded to the carbons of the benzene ring in a similar manner. When a is an integer of 2 or more, R 1 may be the same as or different from each other.

[0127]

Chem.

[0128] Unless otherwise stated in this application, forming a ring means that adjacent groups are bonded to each other to form a single ring or a plurality of joined rings. The single ring and the formed plurality of joined rings include hydrocarbon rings as well as heterocyclic rings containing at least one heteroatom, and include aromatic and non-aromatic rings.

[0129] Also, unless otherwise stated in this specification, when displaying a fused ring, in "number-fused ring", the number indicates the number of rings to be fused. For example, a form in which three rings are fused to each other such as anthracene, phenanthrene, benzobenzoxazoline, etc. can be expressed as 3-fused ring.

[0130] On the one hand, unless otherwise specified, the term "bridged bicyclic compound" used in this application refers to a compound in which two rings share three or more atoms to form a ring. At this time, the atoms shared include carbon or heteroatoms.

[0131] In this application, the organic electronic device can mean the component(s) between the positive electrode and the negative electrode, or can also mean an organic light-emitting diode including the positive electrode, the negative electrode, and the component(s) located therebetween.

[0132] Also, in some cases, the display device in this application can mean an organic electronic device, an organic light-emitting diode and a panel including the same, or can mean an electronic device including a panel and a circuit. Here, for example, the electronic device may include all of a lighting device, a solar cell, a portable or mobile terminal (e.g., smartphone, tablet, PDA, electronic dictionary, PMP, etc.), a navigation terminal, a game machine, various TVs, various computer monitors, etc., and is not limited thereto, and any form of device may be used as long as it includes the above-mentioned component(s).

[0133] Another example of implementation is that the pixel definition layer manufactured using the aforementioned photosensitive composition can be patterned in the pixel separation part of the organic light-emitting display device.

[0134] Hereinafter, referring to FIG. 1, the organic light-emitting display device will be described. The organic light-emitting display device according to an example of the present invention may include a substrate 1, a TFT layer 2 on the substrate, a planarization layer 3 on the TFT layer, a pixel electrode 4 on the planarization layer, an organic light-emitting layer 5 on the pixel electrode, a counter electrode 7 disposed on the organic light-emitting layer, a sealing layer 8 disposed on the counter electrode, a touch panel 9 disposed on the sealing layer, a color filter 10 disposed on the touch panel, an OCA layer 11 disposed on the color filter, and a cover glass layer 12 disposed on the OCA layer.

[0135] The pixel definition layer 6 according to the present invention is preferably formed on the pixel electrode 4.

[0136] The pixel definition layer 6 applies a leveling agent that does not contain fluorine to realize a colored pattern on the electrode substrate with the same content as the conventional fluorine-based type and low contact angle, coating film flatness, and outgassing amount. This not only makes the color vivid but also can improve the reliability and lifespan of the organic light-emitting display device.

[0137] Hereinafter, implementation examples of the present invention will be described in detail. However, this is presented as an example and does not limit the present invention, which is only defined by the scope of the claims described later.

[0138] The photosensitive composition according to an implementation example of the present invention is used for manufacturing a pixel definition layer, a red pattern, a green pattern, a blue pattern, a black matrix, or the like.

[0139] The black pixel definition layer (PDL) according to an implementation example of the present invention may further contain an organic black pigment or a black dye as an additional colorant other than the colorant contained in the aforementioned colorant. For example, the organic pigment can be used alone or mixed with a coloring pigment. At this time, in order to mix a coloring pigment with insufficient light-shielding property, even if the amount of the colorant relatively increases, there is an advantage that the strength of the film (layer) or the adhesion to the substrate does not decrease. The negative pixel definition layer (Negative PDL (Pixel define layer)) according to an implementation example of the present invention may contain a black pigment or a black dye as an additional colorant instead of the colorant contained in the aforementioned colorant.

[0140] Hereinafter, each component will be specifically described.

[0141] I. Composition Constituting the Pixel Definition Layer

[0142] (1) Leveling Agent

[0143] The photosensitive composition of the present invention contains a leveling agent in order to prevent stains and spots during coating, improve the smoothness and fluidity of the coating film, improve the leveling performance for preventing color unevenness and defects, and also prevent the generation of residues due to undevelopment.

[0144] The leveling agent of the present invention preferably does not contain fluorine.

[0145] The leveling agent is preferably a silicone-based leveling agent.

[0146] The molecular weight of the silicone-based compound is desirably from 5,000 g / mol to 15,000 g / mol, more desirably from 5,000 g / mol to 10,000 g / mol.

[0147] The viscosity of the silicone-based compound is preferably from 100,000 mm 2 / s to 500,000 mm 2 / s.

[0148] The viscosity of the silicone-based compound, when measured at 20 °C for a mixture of 50 wt% of the silicone-based compound and 50 wt% of propylene glycol methyl ether acetate, is more desirably from 10 mm 2 / s to 40 mm 2 / s, and even more desirably from 10 mm 2 / s to 30 mm 2 / s.

[0149] The silicone-based leveling agent preferably contains a substituent selected from the group consisting of an alkyl group of C1 to C 40 ; an alkenyl group of C1 to C 40 ; an alkynyl group of C1 to C 40 ; an alkoxy group of C1 to C 40 ; an aryloxy group of C6 to C 40 ; an alkoxycarbonyl group of C1 to C 40 ; a carbonyl group; an ether group; an ester group; a carboxyl group or a combination thereof.

[0150] Specific examples of the silicon-based leveling agent include EFS-101, EFS-104, EFS-106, EFS-109, EFS-120, EFS-121, EFS-134, EFS-135, EFS-201, EFS-203, EFS-204, EFS-210, EFS-220, EFS-301, EFS-302, EFS-303, EFS-314, EFS-317, EFS-318, EFS-326, EFS-329, EFS-333, EFS-349, EFS-355, EFS-358, EFS-359, EFS-362, EFS-362, EFS-601, EFS-701, EFS-801, RS-55, and RS-56 manufactured by DIC Corporation; silicon-based leveling agents commercially available under the names such as BYK-333, BYK-378, BYK-3550, BYK-3751, and BYK-3754 manufactured by BYK Japan K.K. may also be used.

[0151] The leveling agent is preferably contained in an amount of 0.01 to 0.5 parts by weight based on 100 parts by weight of the photosensitive resin composition.

[0152] When the leveling agent is contained within the above range, the coating uniformity of the photosensitive composition is ensured, bleeding does not occur, and the wettability to the glass substrate is excellent.

[0153] In addition, the pixel defining layer formed of the photosensitive composition containing the silicon-based leveling agent of the present invention is excellent in contact angle and coating flatness, and has a low outgassing amount. Therefore, when applied to a display, not only is the color vivid, but also the reliability and lifespan can be enhanced.

[0154] (2) Resin for patterning

[0155] The resin for patterning according to an embodiment of the present invention may include an acrylic binder resin, a cardo binder resin, or a combination thereof.

[0156] The acrylic binder resin is a copolymer of a first ethylenically unsaturated monomer and a second ethylenically unsaturated monomer copolymerizable therewith, and is a resin containing one or more acrylic repeating units.

[0157] The first ethylenically unsaturated monomer is an ethylenically unsaturated monomer containing one or more carboxy groups, and specific examples thereof include acrylic acid, methacrylic acid, maleic acid, itaconic acid, fumaric acid, or a combination thereof. The first ethylenically unsaturated monomer may be contained in an amount of 5% by weight to 50% by weight, for example, 10% by weight to 40% by weight, based on the total amount of the acrylic binder resin.

[0158] The second ethylenically unsaturated monomer includes aromatic vinyl compounds such as styrene, α-methylstyrene, vinyltoluene, and vinylbenzyl methyl ether; unsaturated carboxylic acid ester compounds such as methyl (meth)acrylate, ethyl (meth)acrylate, butyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, benzyl (meth)acrylate, cyclohexyl (meth)acrylate, and phenyl (meth)acrylate; unsaturated carboxylic acid aminoalkyl ester compounds such as 2-aminoethyl (meth)acrylate and 2-dimethylaminoethyl (meth)acrylate; vinyl carboxylate compounds such as vinyl acetate; unsaturated carboxylic acid glycidyl ester compounds such as glycidyl (meth)acrylate; vinyl cyanide compounds such as (meth)acrylonitrile; unsaturated amide compounds such as (meth)acrylamide; and these can be used alone or in combination of two or more.

[0159] Specific examples of the acrylic binder resin include, but are not limited to, (meth)acrylic acid / benzyl methacrylate copolymer, (meth)acrylic acid / benzyl methacrylate / styrene copolymer, (meth)acrylic acid / benzyl methacrylate / 2-hydroxyethyl methacrylate copolymer, (meth)acrylic acid / benzyl methacrylate / styrene / 2-hydroxyethyl methacrylate copolymer, etc. These may be used alone or in combination of two or more. The weight average molecular weight of the acrylic binder resin may be 3,000 g / mol to 150,000 g / mol, for example, 5,000 g / mol to 50,000 g / mol, for example, 20,000 g / mol to 30,000 g / mol.

[0160] The caldo resin contains a repeating structure as shown in Chemical Formula 1 below.

[0161]

Chemical formula

[0162] In Chemical Formula 1 above,

[0163] 1) R1 and R2 are independently of each other hydrogen; deuterium; halogen; an aryl group having 6 to 30 a heteroaryl group containing at least one heteroatom of O, N, S, Si and P and having 2 to 30 a fused ring group of an aliphatic ring and an aromatic ring having 6 to 30 an alkyl group having 1 to 20 an alkenyl group having 2 to 20 an alkynyl group having 2 to 20 an alkoxy group having 1 to 20 an aryloxy group having 6 to 30 a fluorenyl group; a carbonyl group; an ether group; or an alkoxycarbonyl group having 1 to 20 and

[0164] 2) R’ and R” can form a ring with adjacent groups

[0165] 3) m or n is independently an integer from 0 to 4,

[0166] 4) A1 and A2 are independently of each other the following Chemical Formula 2 or Chemical Formula 3,

[0167]

Chem.

[0168]

Chem.

[0169] In the above Chemical Formula 2 and Chemical Formula 3,

[0170] 4-1) * indicates a linking site,

[0171] 4-2) R3 to R6 are independently of each other hydrogen; deuterium; halogen; C6-C 30 aryl group; C2-C containing at least one heteroatom of O, N, S, Si and P 30 heterocyclic group; C6-C 30 fused ring group of aliphatic ring and aromatic ring; C1-C 20 alkyl group; C2-C 20 alkenyl group; C2-C 20 alkynyl group; C1-C 20 alkoxy group; C6-C 30 aryloxy group; fluorenyl group; carbonyl group; ether group; or C1-C 20 alkoxycarbonyl group,

[0172] 4-3) R3 to R6 can form a ring with adjacent groups,

[0173] 4-4) Y1 and Y2 are independently of each other the following Chemical Formula 6 or Chemical Formula 7,

[0174]

Chem.

[0175] [Chemical formula]

[0176] In the above Chemical formula 6 and Chemical formula 7,

[0177] 4-4-1)* indicates the bonding position,

[0178] 4-4-2) R9 is hydrogen or methyl,

[0179] 4-4-3) R 10 or R 13 are independently of each other hydrogen; deuterium; halogen; C6-C 30 aryl group; C2-C containing at least one heteroatom of O, N, S, Si and P 30 heterocyclic group; C6-C 30 fused ring group of aliphatic ring and aromatic ring; C1-C 20 alkyl group; C2-C 20 alkenyl group; C2-C 20 alkynyl group; C1-C 20 alkoxy group; C6-C 30 aryloxy group; fluorenyl group; carbonyl group; ether group; or C1-C 20 alkoxycarbonyl group,

[0180] 4-4-4) L1 to L3 are independently of each other a single bond; fluorenylene group; C2-C 30 alkylene; C6-C 30 arylene; C2-C 30 heterocycle; C1-C 30 alkoxyalkylene; C2-C 30 alkyleneoxy; C6-C 30 aryloxy group; C2-C 30 polyethyleneoxy group,

[0181] 4-4-5) q and r are independently integers from 0 to 3; provided that q + r = 3,

[0182] 5) The ratio of A1 to A2 in the polymer chain of the resin containing the repeating unit represented by Chemical Formula 1 is from 9:1 to 1:9,

[0183] 6) X1 is a single bond; O; CO; SO2; CR’R”; SiR’R”; the following Chemical Formula 4; or Chemical Formula 5,

[0184] 6-1) R’ and R” are independently hydrogen; deuterium; halogen; an aryl group having 6 to C 30 a heterocyclic group having at least one heteroatom of O, N, S, Si and P and having 2 to C 30 a fused ring group of an aliphatic ring and an aromatic ring having 6 to C 30 an alkyl group having 1 to C 20 an alkenyl group having 2 to C 20 an alkynyl group having 2 to C 20 an alkoxy group having 1 to C 20 an aryloxy group having 6 to C 30 a fluorenyl group; a carbonyl group; an ether group; or an alkoxycarbonyl group having 1 to C 20 and are,

[0185] 6-2) R’ and R” can form a ring with adjacent groups,

[0186]

Chemical formula

[0187]

Chemical formula

[0188] In the above Chemical Formulas 4 and 5,

[0189] 6-3) * indicates the bonding position,

[0190] 6-4) R7 and R8 are each independently hydrogen; deuterium; halogen; a C6-C 30 aryl group; a C2-C 30 heterocyclic group containing at least one heteroatom of O, N, S, Si and P; a C6-C 30 fused ring group of an aliphatic ring and an aromatic ring; a C1-C 20 alkyl group; a C2-C 20 alkenyl group; a C2-C 20 alkynyl group; a C1-C 20 alkoxy group; a C6-C 30 aryloxy group; a fluorenyl group; a carbonyl group; an ether group; or a C1-C 20 alkoxycarbonyl group,

[0191] 6-5) o and p are each independently an integer from 0 to 4,

[0192] 7) X2 is a C6-C 30 aryl group; a C2-C 30 heterocyclic group containing at least one heteroatom of O, N, S, Si and P; a C6-C 30 fused ring group of an aliphatic ring and an aromatic ring; a C1-C 20 alkyl group; a C2-C 20 alkenyl group; a C2-C 20 alkynyl group; a C1-C 20 alkoxy group; a C6-C 30 aryloxy group; a fluorenyl group; a carbonyl group; an ether group; or a C1-C 20 alkoxycarbonyl group,

[0193] 8) The said R’, R”, X2, L1 to L3, R1 to R8 and R 10 to R 13 are each deuterium; halogen; a silane group substituted or unsubstituted with a C1-C 30 alkyl group or a C6-C 30 aryl group; a siloxane group; a boron group; a germanium group; a cyano group; an amino group; a nitro group; a C1-C 30 alkylthio group; a C1-C 30 alkoxy group; a C6-C30 an aryloxy group; C1-C 30 an alkyl group; C2-C 30 an alkenyl group; C2-C 30 an alkynyl group; C6-C 30 an aryl group; C6-C substituted with deuterium 30 an aryl group; a fluorenyl group; a C2-C containing at least one heteroatom selected from the group consisting of O, N, S, Si and P 30 a heterocyclic group; C3-C 30 an aliphatic ring group; C7-C 30 an arylalkyl group; C8-C 30 an arylalkenyl group; and can be further substituted with one or more substituents selected from the group consisting of these combinations, and adjacent substituents can form a ring with each other.

[0194] When the R', R", X2, L1 to L3, R1 to R8 and R 10 to R 13 is an aryl group, preferably a C6-C 30 aryl group, more preferably a C6-C 18 aryl group, for example, phenyl, biphenyl, naphthyl, terphenyl and the like.

[0195] When the R', R", X2, L1 to L3, R1 to R8 and R 10 to R 13 is a heterocyclic group, preferably a C2-C 30 heterocyclic group, more preferably a C2-C 18 heterocyclic group, for example, dibenzofuran, dibenzothiophene, naphthobenzothiophene, naphthobenzofuran and the like.

[0196] When the R', R", R1 to R8 and R 10 to R 13 is a fluorenyl group, preferably 9,9-dimethyl-9H-fluorene, 9,9-diphenyl-9H-fluorenyl group, 9,9'-spirobifluorene and the like.

[0197] When L1 to L3 are arylene groups, preferably, they are C6-C 30 arylene groups, more preferably, C6-C 18 arylene groups, and can be, for example, phenyl, biphenyl, naphthyl, terphenyl, etc.

[0198] When R’, R”, X2, R1 to R8 and R 10 to R 13 are alkyl groups, preferably, they are C1-C 10 alkyl groups, and can be, for example, methyl, t-butyl, etc.

[0199] When R’, R”, X2, R1 to R8 and R 10 to R 13 are alkoxy groups, preferably, they are C1-C 20 alkoxy groups, more preferably, C1-C 10 alkoxy groups, and can be, for example, methoxy, t-butoxy, etc.

[0200] The ring formed by the adjacent groups of R’, R”, X2, L1 to L3, R1 to R8 and R 10 to R 13 is a C6-C 60 aromatic ring group; a fluorenyl group; a C2-C 60 heterocyclic group containing at least one heteroatom of O, N, S, Si and P; or a C3-C 60 aliphatic ring group, and, for example, when the adjacent groups are bonded to each other to form an aromatic ring, preferably, it is a C6-C 20 aromatic ring, more preferably, a C6-C 14 aromatic ring, and can form, for example, benzene, naphthalene, phenanthrene, etc.

[0201] The cald resin can be produced by mixing two or more of, for example, fluorene-containing compounds such as 9,9-bis(4-oxiranylmethoxyphenyl)fluorene; anhydride compounds such as benzene tetracarboxylic dianhydride, naphthalene tetracarboxylic dianhydride, biphenyl tetracarboxylic dianhydride, benzophenone tetracarboxylic dianhydride, pyromellitic dianhydride, cyclobutane tetracarboxylic dianhydride, perylene tetracarboxylic dianhydride, tetrahydrofuran tetracarboxylic dianhydride, tetrahydrophthalic anhydride; glycol compounds such as ethylene glycol, propylene glycol, polyethylene glycol; alcohol compounds such as methanol, ethanol, propanol, n-butanol, cyclohexanol, benzyl alcohol; solvent compounds such as propylene glycol methyl ether acetate (PGMEA), N-methylpyrrolidone; phosphorus compounds such as triphenylphosphine; and amine or ammonium salt compounds such as tetramethylammonium chloride, tetraethylammonium bromide, benzyldiethylamine, triethylamine, benzyltriethylammonium chloride.

[0202] The weight average molecular weight of the cald resin can be 1,000 to 100,000 g / mol, preferably 1,000 to 50,000 g / mol, more preferably 1,000 to 30,000 g / mol. When the weight average molecular weight of the resin is within the above range, pattern formation can be successfully carried out without residue during the production of the light-shielding layer, there is no loss of film thickness during development, and a good pattern can be obtained. The resin may be contained in an amount of 1 to 30% by weight, more preferably 3 to 20% by weight, based on the total amount of the photosensitive resin composition. When the resin is contained within the above range, excellent sensitivity, developability, and adhesion (adhesion strength) can be obtained.

[0203] (3) Reactive unsaturated compound

[0204] The reactive unsaturated compound that is essential for the negative pattern has ethylenically unsaturated double bonds, so that sufficient polymerization occurs during exposure in the pattern formation process, and a pattern excellent in heat resistance, light resistance, and chemical resistance can be formed.

[0205] Specific examples of the reactive unsaturated compound include ethylene glycol diacrylate, ethylene glycol dimethacrylate, diethylene glycol diacrylate, triethylene glycol diacrylate, triethylene glycol dimethacrylate, 1,6 - hexanediol diacrylate, 1,6 - hexanediol dimethacrylate, pentaerythritol triacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, bisphenol A epoxy acrylate, ethylene glycol monomethyl ether acrylate, trimethylolpropane triacrylate, tripentaerythritol octaacrylate, and the like.

[0206] Examples of commercially available products of the reactive unsaturated compound are as follows.

[0207] Examples of the bifunctional esters of the (meth)acrylic acid include Aronix M - 210, M - 240, M - 6200, etc. of Toagosei Co., Ltd.; KAYARAD HDDA, HX - 220, R - 604, etc. of Nippon Kayaku Co., Ltd.; V - 260, V - 312, V - 335HP, etc. of Osaka Organic Chemical Industry Co., Ltd.

[0208] Examples of the trifunctional esters of the (meth)acrylic acid include Aronix M - 309, M - 400, M - 405, M - 450, M - 7100, M - 8030, M - 8060, etc. of Toagosei Co., Ltd.; KAYARAD TMPTA, DPCA - 20, DPCA - 60, DPCA - 120, etc. of Nippon Kayaku Co., Ltd.; V - 295, V - 300, V - 360, etc. of Osaka Organic Chemical Industry Co., Ltd.

[0209] The above products can be used alone or in combination of two or more.

[0210] The reactive unsaturated compound can also be treated with an acid anhydride and used to impart better developability. The reactive unsaturated compound may be contained in an amount of 1 to 40% by weight, for example, 1 to 20% by weight based on the total amount of the photosensitive resin composition. When the reactive unsaturated compound is contained within the above range, curing occurs sufficiently during exposure in the pattern forming process, and the resulting pattern has excellent reliability, heat resistance, light resistance, and chemical resistance, as well as excellent resolution and adhesion.

[0211] (4) Photoinitiator

[0212] In order to realize a negative pattern in photolithography, a photo radical initiator must be used. The photoinitiator has a molar absorption coefficient of 10,000 (L / mol·cm) or more in the wavelength range of 330 to 380 nm and a 5% weight loss occurring at 270 °C or lower. Here, the molar absorption coefficient can be calculated by the Beer-Lambert Law. The weight loss was measured using TGA while heating at a rate of 5 °C per minute up to 300 °C in a nitrogen atmosphere.

[0213] The photopolymerization initiator is an initiator generally used in photosensitive resin compositions. For example, acetophenone-based compounds, benzophenone-based compounds, thioxanthone-based compounds, benzoin-based compounds, triazine-based compounds, oxime-based compounds, or mixtures thereof may be used.

[0214] Examples of the acetophenone-based compounds include 2,2'-diethoxyacetophenone, 2,2'-dibutoxyacetophenone, 2-hydroxy-2-methylpropiophenone, p-t-butyltrichloroacetophenone, p-t-butyldichloroacetophenone, 4-chloroacetophenone, 2,2'-dichloro-4-phenoxyacetophenone, 2-methyl-1-(4-(methylthio)phenyl)-2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1-(4-(morpholinophenyl)-butan-1-one, and the like.

[0215] Examples of the benzophenone-based compounds include benzophenone, benzoylbenzoic acid, methyl benzoylbenzoate, 4-phenylbenzophenone, hydroxybenzophenone, acrylated benzophenone, 4,4'-bis(dimethylamino)benzophenone, 4,4'-bis(diethylamino)benzophenone, 4,4'-dimethylaminobenzophenone, 4,4'-dichlorobenzophenone, 3,3'-dimethyl-2-methoxybenzophenone, and the like.

[0216] Examples of the thioxanthone-based compounds include thioxanthone, 2-chlorothioxanthone, 2-methyloxanthone, isopropylthioxanthone, 2,4-diethylthioxanthone, 2,4-diisopropylthioxanthone, 2-chlorothioxanthone, and the like.

[0217] Examples of the benzoin-based compounds include benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzyl dimethyl ketal, and the like.

[0218] Examples of the triazine compounds include 2,4,6-trichloro-s-triazine, 2-phenyl 4,6-bis(trichloromethyl)-s-triazine, 2-(3’,4’-dimethoxystyryl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4’-methoxynaphthyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-methoxyphenyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-tolyl)-4,6-bis(trichloromethyl)-s-triazine, 2-biphenyl 4,6-bis(trichloromethyl)-s-triazine, bis(trichloromethyl)-6-styryl-s-triazine, 2-(naphth-1-yl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4-methoxynaphth-1-yl) 4,6-bis(trichloromethyl)-s-triazine, 2-4-trichloromethyl(piperonyl)-6-triazine, 2-4-trichloromethyl(4’-methoxystyryl)-6-triazine, and the like.

[0219] Examples of the oxime compounds include 2-(o-benzoyloxime)-1-[4-(phenylthio)phenyl]-1,2-octanedione, 1-(o-acetyloxime)-1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]ethanone, (E)-1(((3-cyclopentyl-1-(9-ethyl-6-(2-methylbenzoyl)9H-carbazol-3-yl)propylidene)amino)oxy)ethane-1-one (PBG-304, Trony), and the like.

[0220] In addition to the above compounds, the photoinitiator can use carbazole compounds, diketone compounds, sulfonium borate compounds, diazo compounds, imidazole compounds, non-imidazole compounds, and the like.

[0221] As the radical polymerization initiator, the photoinitiator can use peroxide compounds, azobis compounds, and the like.

[0222] Examples of the peroxide compound include ketone peroxides such as methyl ethyl ketone peroxide, methyl isobutyl ketone peroxide, cyclohexanone peroxide, methyl cyclohexanone peroxide, and acetylacetone peroxide; diacyl peroxides such as isobutyryl peroxide, 2,4-dichlorobenzoyl peroxide, o-methylbenzoyl peroxide, and bis-3,5,5-trimethylhexanoyl peroxide; hydroperoxides such as 2,4,4-trimethylpentyl-2-hydroperoxide, diisopropylbenzene hydroperoxide, cumene hydroperoxide, and t-butyl hydroperoxide; dialkyl peroxides such as dicumyl peroxide, 2,5-dimethyl-2,5-di(t-butylperoxy)hexane, 1,3-bis(t-butyloxyisopropyl)benzene, and t-butyl peroxy valerate n-butyl ester; alkyl peresters such as 2,4,4-trimethylpentyl peroxyphenoxyacetate, α-cumyl peroxyneodecanoate, t-butyl peroxybenzoate, and di-t-butyl peroxytriethyl adipate; percarbonates such as di-3-methoxybutyl peroxydicarbonate, di-2-ethylhexyl peroxydicarbonate, bis-4-t-butylcyclohexyl peroxydicarbonate, diisopropyl peroxydicarbonate, acetylcyclohexylsulfonyl peroxide, and t-butyl peroxyallyl carbonate, and the like.

[0223] Examples of the azo-bis compound include 1,1'-azobiscyclohexane-1-carbonitrile, 2,2'-azobis(2,4-dimethylvaleronitrile), 2,2'-azobis(methyl isobutyrate), 2,2'-azobis(4-methoxy-2,4-dimethylvaleronitrile), α,α'-azobis(isobutyl nitrile), and 4,4'-azobis(4-cyanovaleric acid), and the like.

[0224] The photoinitiator may be used together with a photochromic agent that causes a chemical reaction by absorbing light and becoming excited and then transferring its energy. Examples of the photosensitizer include tetraethylene glycol bis-3-mercaptopropionate, pentaerythritol tetrakis-3-mercaptopropionate, dipentaerythritol tetrakis-3-mercaptopropionate, and the like.

[0225] The photoinitiator may be contained in an amount of 0.01 to 10% by weight, for example, 0.1 to 5% by weight based on the total amount of the photosensitive composition. When the photoinitiator is contained within this range, sufficient curing occurs during exposure in the pattern forming process, and excellent reliability can be obtained. The pattern has excellent heat resistance, light resistance, and chemical resistance, as well as excellent resolution and adhesion, and can prevent a decrease in transmittance due to unreacted initiator.

[0226] (5) Colorant

[0227] All of organic pigments, inorganic pigments, and dyes can be used as the colorant.

[0228] As the colorant, red pigments, green pigments, blue pigments, yellow pigments, black pigments, etc. can be used.

[0229] Examples of the red pigment include C.I. Pigment Red 254, C.I. Pigment Red 255, C.I. Pigment Red 264, C.I. Pigment Red 270, C.I. Pigment Red 272, C.I. Pigment Red 177, C.I. Pigment Red 89, etc.

[0230] Examples of the green pigment include halogen-substituted copper phthalocyanine pigments such as C.I. Pigment Green 36 and C.I. Pigment Green 7.

[0231] Examples of the cyan pigment include copper phthalocyanine pigments such as C.I. Pigment Blue 15:6, C.I. Pigment Blue 15, C.I. Pigment Blue 15:1, C.I. Pigment Blue 15:2, C.I. Pigment Blue 15:3, C.I. Pigment Blue 15:4, C.I. Pigment Blue 15:5, and C.I. Pigment Blue 16.

[0232] Examples of the yellow pigment include isoindoline pigments such as C.I. Pigment Yellow 139, quinophthalone pigments such as C.I. Pigment Yellow 138, nickel complex pigments such as C.I. Pigment Yellow 150, and the like.

[0233] Examples of the black pigment include lactam black, aniline black, perylene black, titanium black, carbon black, and the like.

[0234] In addition, the colorant in the photosensitive resin composition according to the implementation example may include a pigment, a dye, or a combination thereof. For example, the dye may include a phthalocyanine-based compound.

[0235] The pigment and the dye may be used alone or in combination of two or more, and are not limited to these examples.

[0236] Among these, the black pigment can be used to efficiently block light in the light-shielding layer. When using the black pigment, it can also be used together with a color corrector such as an anthraquinone-based pigment, a perylene-based pigment, a phthalocyanine-based pigment, or an azo-based pigment.

[0237] A dispersant can be used together to disperse the pigment in the photosensitive resin composition. Specifically, the pigment can be surface-treated with a dispersant in advance and then used, or a dispersant can be added together with the pigment during the production of the photosensitive resin composition and then used.

[0238] As the dispersant, a nonionic dispersant, an anionic dispersant, a cationic dispersant, etc. can be used. Specific examples of the dispersant include polyalkylene glycol and its esters, polyoxyalkylene, polyhydric alcohol ester alkylene oxide adducts, alcohol alkylene oxide adducts, sulfonic acid esters, sulfonates, carboxylic acid esters, carboxylates, alkylamide alkylene oxide adducts, alkylamines, etc. These can be used alone or in admixture of two or more thereof.

[0239] Examples of commercially available products of the dispersant include DISPERBYK-101, DISPERBYK-130, DISPERBYK-140, DISPERBYK-160, DISPERBYK-161, DISPERBYK-162, DISPERBYK-163, DISPERBYK-164, DISPERBYK-165, DISPERBYK166, DISPERBYK-170, DISPERBYK-171, DISPERBYK-182, DISPERBYK-2000, DISPERBYK-2001, etc. of BYK; EFKA-47, EFKA-47EA, EFKA-48, EFKA-49, EFKA-100, EFKA-400, EFKA-450, etc. of EFKA Chemicals; Solsperse5000, Solsperse12000, Solsperse13240, Solsperse13940, Solsperse17000, Solsperse20000, Solsperse24000GR, Solsperse27000, Solsperse28000, etc. of Zeneka; or PB711, PB821, etc. of Ajinomoto.

[0240] The dispersant can be contained in an amount of 0.1% by weight to 15% by weight based on the total amount of the photosensitive resin composition. When the dispersant is contained within the above range, since the dispersibility of the composition is excellent, the stability, developability and patternability during the production of the light-shielding layer are excellent.

[0241] The pigment may be pretreated with a water-soluble inorganic salt and a wetting agent before use. When the pigment is pretreated, the average particle size of the pigment may be reduced.

[0242] The pretreatment includes kneading the pigment with a water-soluble inorganic salt and a wetting agent, and filtering and washing the pigment obtained from the kneading step.

[0243] The kneading is carried out at a temperature of 40° C. to 100° C., and the filtering and washing are carried out by washing the inorganic salt with water or the like and then filtering.

[0244] Examples of the water-soluble inorganic salt include, but are not limited to, sodium chloride and potassium chloride.

[0245] The wetting agent serves as a medium for uniformly mixing the pigment and the water-soluble inorganic salt to facilitate pulverization of the pigment. Examples of the wetting agent include alkylene glycol monoalkyl ethers such as ethylene glycol monoethyl ether, propylene glycol monomethyl ether, diethylene glycol monomethyl ether, etc.; alcohols such as ethanol, isopropanol, butanol, hexanol, cyclohexanol, ethylene glycol, diethylene glycol, polyethylene glycol, glycerin polyethylene glycol, etc.; and the like. These can be used alone or in combination of two or more.

[0246] The pigment having undergone the kneading step may have an average particle size of 20 nm to 110 nm. When the average particle size of the pigment is within the above range, it is possible to effectively form a fine pattern while having excellent heat resistance and light resistance.

[0247] The pigment may be contained in an amount of 1 to 40% by weight, more specifically 2 to 30% by weight, based on the total amount of the photosensitive resin composition. When the pigment is contained within the above range, the color reproduction rate is excellent, and the curing property and adhesion of the pattern are excellent.

[0248] (6) Solvent

[0249] The solvent used is one having compatibility with the cardo resin, the reactive unsaturated compound, the pigment, the cardo compound, and the initiator, but is a non-reactive substance.

[0250] Examples of the solvent include alcohols such as methanol and ethanol; ethers such as dichloroethyl ether, n-butyl ether, diisoamyl ether, methyl phenyl ether, and tetrahydrofuran; glycol ethers such as ethylene glycol monomethyl ether and ethylene glycol monoethyl ether; cellosolve acetates such as methyl cellosolve acetate, ethyl cellosolve acetate, and diethyl cellosolve acetate; carbitols such as methyl ethyl carbitol, diethyl carbitol, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol dimethyl ether, diethylene glycol methyl ethyl ether, and diethylene glycol diethyl ether; propylene glycol alkyl ether acetates such as propylene glycol methyl ether acetate (PGMEA) and propylene glycol propyl ether acetate; aromatic hydrocarbons such as toluene and xylene; ketones such as methyl ethyl ketone, cyclohexanone, 4-hydroxy-4-methyl-2-pentanone, methyl-n-propyl ketone, methyl-n-butyl ketone, methyl-n-amyl ketone, and 2-heptanone; saturated aliphatic monocarboxylic acid alkyl esters such as ethyl acetate, n-butyl acetate, and isobutyl acetate; lactate esters such as methyl lactate and ethyl lactate; oxyacetic acid alkyl esters such as methyl oxyacetate, ethyl oxyacetate, and butyl oxyacetate; alkoxyacetic acid alkyl esters such as methyl methoxyacetate, ethyl methoxyacetate, butyl methoxyacetate, methyl ethoxyacetate, and ethyl ethoxyacetate; 3-oxypropionic acid alkyl esters such as methyl 3-oxypropionate and ethyl 3-oxypropionate; 3-alkoxypropionic acid alkyl esters such as methyl 3-methoxypropionate, ethyl 3-methoxypropionate, ethyl 3-ethoxypropionate, and methyl 3-ethoxypropionate; 2-oxypropionic acid alkyl esters such as methyl 2-oxypropionate, ethyl 2-oxypropionate, and propyl 2-oxypropionate;2-alkoxypropionic acid alkyl esters such as methyl 2-methoxypropionate, ethyl 2-methoxypropionate, ethyl 2-ethoxypropionate, methyl 2-ethoxypropionate; 2-oxy-2-methylpropionic acid esters such as methyl 2-oxy-2-methylpropionate, ethyl 2-oxy-2-methylpropionate; 2-alkoxy-2-methylpropionic acid alkyl esters of monooxy monocarboxylic acid alkyl esters such as methyl 2-methoxy-2-methylpropionate, ethyl 2-ethoxy-2-methylpropionate; esters such as ethyl 2-hydroxypropionate, ethyl 2-hydroxy-2-methylpropionate, ethyl hydroxyacetate, methyl 2-hydroxy-3-methylbutanoate; ketone acid esters such as ethyl pyruvate, etc.;

[0251] Also, high-boiling solvents such as N-methylformamide, N,N-dimethylformamide, N-methylformanilide, N-methylacetamide, N,N-dimethylacetamide, N-methylpyrrolidone, dimethyl sulfoxide, benzyl ethyl ether, dihexyl ether, acetylacetone, isophorone, caproic acid, caprylic acid, 1-octanol, 1-nonanol, benzyl alcohol, benzyl acetate, ethyl benzoate, diethyl oxalate, diethyl maleate, γ-butyrolactone, ethylene carbonate, propylene carbonate, phenyl cellosolve acetate can also be used.

[0252] Among the above solvents, glycol ethers such as ethylene glycol monoethyl ether; ethylene glycol alkyl ether acetates such as ethyl cellosolve acetate; esters such as ethyl 2-hydroxypropionate; carbitols such as diethylene glycol monomethyl ether; propylene glycol alkyl ether acetates such as propylene glycol methyl ether acetate and propylene glycol propyl ether acetate can be used considering compatibility and reactivity.

[0253] The solvent can be included as the remaining amount with respect to the total amount of the photosensitive resin composition, and specifically, it is included in an amount of 40 to 90% by weight. When the solvent is included within the above range, the photosensitive resin composition has an appropriate viscosity, and thus is excellent in processability during the production of the pattern layer.

[0254] II. Manufacturing Process of Pixel Definition Layer

[0255] (1) Coating and Coating Stage

[0256] The photosensitive composition is a low-viscosity liquid sample, and a spin coater or a slit coater is used to coat it with a certain thickness after coating it on a substrate. The faster the rotation speed of the spin coater, the thinner the thickness, but the advantage is that the flatness deviation in terms of area decreases. For coating a large-area substrate, a slit coater is preferred over a spin coater. After coating, the remaining solvent makes the surface have fluidity, and thus there is a disadvantage that the flatness deteriorates. To overcome this, a part of the solvent is removed using VCD (vacuum chamber dry) to lower the fluidity on the surface.

[0257] (2) Pre-baking Stage

[0258] This is a process of heating the coated substrate on a hot plate or in an oven at a certain temperature and for a certain time to remove a part of the solvent contained in the coating film. If the surface or the depth of the coating film is not dried, contamination of the photomask will occur during exposure in the next process, and curing will not be successfully performed in the exposed area during ultraviolet light irradiation, and the pattern will not be formed and will be removed in the development process due to non-curing.

[0259] (3) Exposure Stage

[0260] After the pre-baking step is completed, it is a step of curing a film formed by irradiating actinic rays (ultraviolet rays) using a photomask on which a pattern is formed. The types of lamps that generate actinic rays include LED lamps or metal (mercury) lamps, and the wavelengths are g-line (436 nm), h-line (405 nm), i-line (365 nm), Deep UV (<260 nm), and they can be used individually or in combination.

[0261] (4) Development stage

[0262] During the actinic ray irradiation in the exposure stage, the photomask divides the irradiated area and the non-irradiated area. In the case of a positive type, the irradiated area becomes soluble in the developer, and the non-irradiated area withstands the developer and the pattern remains. In the case of a negative type, the irradiated area hardens and has resistance to the developer, and the non-irradiated area is developed. The black pixel definition layer (Black PDL) manufactured with the composition containing the colorant of the present invention is of the negative type, and is divided into an irradiated area (hardened) and a non-irradiated area (developed) to form a pattern.

[0263] (5) Post-heat treatment stage

[0264] This is a step of heating the developed substrate at a high temperature of 210 °C to 300 °C to remove the remaining solvent and fume. If the solvent and fume are not completely removed in this step, outgassing will occur in the subsequent steps after the post-heat treatment, affecting the device, which in turn affects dark spots or pixel shrinkage.

[0265] Another implementation example is that the aforementioned photosensitive resin composition can be used to pattern the pixel separation part of the organic light-emitting device electrode.

[0266] Hereinafter, synthesis examples and examples according to the present invention will be specifically described, but the synthesis examples and examples of the present invention are not limited thereto.

[0267] (Manufacture of black photosensitive composition)

[0268] Synthesis Example 1: Production of 9,9-Bis[4-(glycidyloxy)phenyl]fluorene of Chemical Formula 8

[0269] 20 g of 9,9'-bisphenolfluorene (Sigma aldrich), 8.67 g of glycidyl chloride (Sigma aldrich), and 30 g of anhydrous potassium carbonate were placed in a 300 ml three-necked round-bottom flask equipped with a dimethylformamide of 100 ml and a distillation tube, heated to 80 ° C and reacted for 4 hours. After the temperature was lowered to 25 ° C, the reaction solution was filtered, and the filtrate was added dropwise to 1000 ml of water with stirring. The precipitated powder was filtered, washed with water, and dried under reduced pressure at 40 ° C to obtain 25 g of 9,9-Bis[4-(glycidyloxy)phenyl]fluorene of the following Chemical Formula 8. The obtained powder was analyzed by HPLC, and as a result of purity analysis, it showed a purity of 98%.

[0270]

Chem.

[0271] Synthesis Example 2: Production of Cardo Binder Resin

[0272] 25 g (54 mmol) of the compound 1 obtained from Synthesis Example 1, 8 g of acrylic acid (Daejung Chemicals & Metals), 0.2 g of benzyltriethylammonium chloride (Daejung Chemicals & Metals), and 0.2 g of hydroquinone (Daejung Chemicals & Metals) were placed in a 300 ml three-necked round-bottom flask equipped with a distillation tube together with 52 g of propylene glycol methyl ether acetate (Sigma aldrich) and stirred at 110 ° C for 6 hours. After completion of the reaction, 8 g of biphenyltetracarboxylic dianhydride (Mitsubishi Gas) and 1.8 g of tetrahydrophthalic acid (Sigma aldrich) were added, and then stirred again at 110 ° C for 6 hours. After completion of the reaction, the reaction solution was recovered and analyzed. As a result, a cardo binder resin having a solid content of 45% with a molecular weight of 4,580 was obtained.

[0273] Production Example 1: Production of Black Pigment Dispersion

[0274] 15 g of Irgaphor Black S 100 CF (black pigment / BASF), 8.5 g of Disperbyk 163 (BYK), and 6.5 g of SR-3613 (SMS) were dispersed in 70 g of propylene glycol methyl ether acetate together with 100 g of zirconia beads with a diameter of 0.5 mm (Toray) using a paint shaker (Asada) for 10 hours to obtain a dispersion.

[0275] A photosensitive composition solution was produced with the composition as shown in Table 1 below.

[0276] Specifically, after dissolving the initiator in the solvent and stirring at room temperature, the binder resin and the polymerizable compound were added thereto and stirred at room temperature. Subsequently, a colorant and other additives were added to the obtained reactant and stirred at room temperature. Subsequently, the product was filtered three times to remove impurities, thereby producing a photosensitive resin composition.

[0277]

Table 1

[0278] The acrylic resin used was SR-3100 (SMS, a resin containing double bonds with an average molecular weight of 6,000 to 8,000), the reactive unsaturated compound was Miraemer M600 (Miwon Specialty Chemical), the photoinitiator was PBG-304 (Trony), and the solvent used was propylene glycol methyl ether acetate.

[0279] The molecular weight of the silicone leveling agent used in Compositions 1-1 to 1-5 was 5,000 g / mol to 15,000 g / mol.

[0280] The molecular weight is measured using Agilent's GPC (1260 Infinity). After dissolving 100 mg of the sample to be measured in 10 g of Tetrahydrofuran (THF), the measurement is carried out. The GPC Column is analyzed using a combination of Shodex (GPC-802, 803, 804), and measured for 1 hour at a rate of 1 ml / min using an RI detector.

[0281] The viscosity of the silicon-based leveling agent itself is 100,000 mm 2 / s to 500,000 mm 2 / s. The viscosity of a mixture of 50 wt% silicon-based leveling agent and 50 wt% propylene glycol methyl ether acetate measured at 20°C is 10 mm 2 / s to 40 mm 2 / s.

[0282] The viscosity is measured using a Brookfield viscometer (LVDVNX-CP). 1 ml of the sample is placed in a sample cup, and measured at a temperature of 20 ± 3°C for 1 minute. The spindle (Z-40) used during the measurement is used, and the rotational speed (rpm) during the analysis is measured in the range of 10 to 15.

[0283] The method for manufacturing a negative pixel definition layer (negative PDL) using the photosensitive composition is as follows.

[0284] (1) Coating and coating stage

[0285] The photosensitive composition is applied to a 10 cm * 10 cm metal-deposited substrate that has been cleaned to a certain thickness using a spin coater, and then a part of the solvent is removed using VCD (vacuum chamber dry) to form a coating film. The coating thickness of the photosensitive composition forms a film with a thickness of 2.0 micrometers to 1.7 micrometers after VCD.

[0286] (2) Pre-bake stage

[0287] To remove the solvent contained in the obtained coating film, heat it on a hot plate at 90°C to 120°C for 100 seconds to 150 seconds. By removing a certain amount of solvent in this process, mask contamination in the form of pixels can be reduced during the next process (exposure) stage, and a clean pattern can be created.

[0288] (3) Exposure stage

[0289] To obtain the necessary pattern formation and a certain thickness on the obtained coating film, after interposing a mask in the form of pixels, use an exposure machine to irradiate a light source of actinic rays of 190 nm to 600 nm, preferably a metal or LED lamp with ghi-line, to form a pattern. The exposure dose irradiated for pattern formation is 80 mJ / cm 2 to 110 mJ / cm 2 of actinic rays, and it is a negative-type photoresist material to be formed.

[0290] (4) Development stage

[0291] Following the exposure stage, develop it by dipping in a 2.38 wt% TMAH (tetramethylammonium hydroxide) developer at 23 ± 2°C for a certain time (minutes), and then wash it with ultrapure water (DI water). By dissolving and removing the unexposed part, only the exposed part remains to form an image pattern, and the thickness of the coating film is 1.70 to 1.90 μm.

[0292] (5) Post-heat treatment stage

[0293] To obtain the image pattern obtained by the development, perform post-baking at 210°C to 300°C for 60 minutes to 120 minutes to completely remove the solvent, cure the pattern to form a film, and then measure the outgas.

[0294] (6) Element reliability evaluation

[0295] As shown in FIGS. 2 and 3, electrodes with a thickness of ITO (80 to 12 Å)-Ag (900 to 1,100 Å)-ITO (80 to 120 Å) were formed on the glass surface according to each condition of the composition for the evaluation of element reliability such as pixel shrinkage and dark spots. The photosensitive composition of the present invention was provided with a pixel definition layer by the above steps (1) to (6) on the electrodes to manufacture an evaluation substrate, and reliability verification elements were confirmed.

[0296] (7) Outgas measurement

[0297] After forming a pattern on the substrate by the steps (1), (2), (3), (4) and (5) described above with the photosensitive composition, the outgas in an area of 10 cm × 10 cm was measured. The coating thickness was 1.45 μm to 1.55 μm after post-heat treatment, and the weight of the photosensitive composition coated and post-heat treated on a 10 cm × 10 cm substrate was 11 to 12 g. The outgas of the substrate was collected at 250 ° C for 30 minutes using JTD-505III of JAI. After measuring toluene calibration samples (5, 10, 50 ppm) using QP2020 GC / MS of Shimadzu, a calibration curve was created, and the outgas generation amount of the collected sample was measured by extrapolation. Samples were samples with changed process conditions such as development time and temperature in the development stage, heating temperature and heat treatment time in the post-heat treatment stage, and the detected amounts of the measured outgas were compared.

[0298] (8) Contact angle measurement method

[0299] Ultra-pure water (DI water) is dropped onto the film formed with a thickness of 1.45 μm to 1.55 μm after the above coating and coating, exposure, development and post-heat treatment to measure the contact angle with the surface. The equipment for measuring the contact angle uses the DSA25 equipment of KRUSS. Ultra-pure water is put into a microsyringe and 2 microliters are dropped to measure the contact angle with the interface. The contact angle measures the average of the values on the left and right sides of the water droplet.

[0300]

Table 2

[0301] In Table 2, referring to the results of Comparative Example 1 and Examples 4 to 6, it was confirmed that at the same post-heat treatment temperature, the results of the examples showed that the outgassing amount after the post-heat treatment was even lower, at 15 ppm or less. This is judged to be the result of the silicon-based leveling agent mixed with the resin contained in the photosensitive composition having better thermal stability at higher temperatures than the fluorine-based leveling agent.

[0302] Also, referring to Table 2 and FIG. 2, in the case of the examples where the post-heat treatment temperature was adjusted in the range of 210°C to 300°C, the amount of outgas decreased compared to the result of Comparative Example 2 with a lower post-heat treatment temperature, and it was confirmed that the contact angle was included in the range of 60° to 100°. Comparing with the result of Comparative Example 3 with a higher post-heat treatment temperature, the amount of outgas was at a similar level, but it was confirmed that the contact angle was included within the range limited by the present invention.

[0303] Also, referring to Table 2 and FIG. 3, in the case of the examples where the pixel definition layer was manufactured by applying a post-heat treatment temperature within the appropriate range of 210°C to 300°C, it was confirmed that since the residue and pixel shrinkage development of the pixel definition layer did not occur, excellent reliability in the device configuration could be ensured.

[0304] On the other hand, when the post-heat treatment temperature was as low as less than 210°C as in the result of Comparative Example 2, it was confirmed that the amount of outgas increased after the post-heat treatment and dark spots occurred in the device. When the post-heat treatment temperature was 300°C or higher as in Comparative Example 3, it was confirmed that the pixel definition layer could not withstand the high temperature and pixel shrinkage development occurred due to the additional outgas generated during device driving.

[0305] The above description is merely illustrative of the present invention, and those with ordinary knowledge in the technical field to which the present invention pertains can make various modifications without departing from the essential characteristics of the present invention.

[0306] Therefore, the embodiments disclosed in this specification are not for limiting the present invention, but for explaining it. The idea and scope of the present invention are not limited by such embodiments. The protection scope of the present invention should be interpreted by the claims, and all technologies within the equivalent scope should be interpreted as being included in the scope of rights of the present invention.

Explanation of Reference Numerals

[0307] 1: Substrate 2: TFT layer 3: Flat layer 4: Pixel electrode 5: Light-emitting layer 6: Pixel defining layer 7: Counter electrode 8: Encapsulation layer 9: Touch panel 10: Color filter 11: OCA layer 12: Cover glass layer

Claims

1. A pixel definition layer comprising a resin; and a photosensitive composition containing a leveling agent that does not contain fluorine.

2. The pixel definition layer according to claim 1, wherein the leveling agent contains a silicon-based compound.

3. The pixel definition layer according to claim 2, wherein the molecular weight of the silicon-based compound is 5,000 g / mol to 15,000 g / mol.

4. The viscosity of the silicon-based compound is 100,000 mm ２ / s to 500,000 mm ２ / s, and the pixel definition layer according to claim 2

5. The silicon-based compound is C １ to C 4０ alkyl group; C １ to C 4０ alkenyl group; C １ to C ３０ alkynyl group; C １ to C 4０ alkoxy group; C ６ to C 4０ aryloxy group; C １ to C 4０ alkoxycarbonyl group; carbonyl group; ether group; ester group; carboxyl group or a substituent in the group consisting of a combination thereof. The pixel definition layer according to claim 2.

6. The pixel definition layer according to claim 1, wherein the photosensitive composition contains a leveling agent that does not contain fluorine in an amount of 0.01 to 0.5% by weight based on the total amount thereof.

7. The pixel definition layer according to claim 1, wherein the resin contains an acrylic binder resin; a cardo binder resin or a combination thereof.

8. The pixel definition layer according to claim 1, which is manufactured by including a step of post-heat treatment of the photosensitive composition.

9. The pixel definition layer according to claim 8, wherein the post-heat treatment step is performed at a temperature of 210°C to 300°C for 30 minutes to 120 minutes.

10. The pixel definition layer according to claim 8, which is further manufactured by including steps of coating and applying the photosensitive composition; pre-baking; exposure; development.

11. The pixel definition layer according to claim 1, wherein the photosensitive composition contains a colorant.

12. The pixel definition layer according to claim 1, wherein the photosensitive composition contains a reactive unsaturated compound.

13. The pixel definition layer according to claim 1, wherein the photosensitive composition contains a photoinitiator.

14. The pixel definition layer according to claim 1, wherein when 2 to 10 microliters (μl) of water is brought into contact with the surface at a temperature condition of 25 ± 3°C, the contact angle with the interface is 60° to 100°.

15. The pixel definition layer according to claim 1, wherein after the post-heat treatment step, the thickness of the pixel definition layer is 1.40 μm to 1.60 μm.

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