Board connector

Abstract

To provide a board connector capable of reducing the possibility of generating RF signal interference between RF contacts.SOLUTION: The present disclosure relates to a board connector 200 including: a plurality of RF contacts; an insulating part supporting the RF contacts; a plurality of transmission contacts: a ground housing 230 having the insulating part coupled thereto; a first ground contact 250 coupled to the insulating part and shielding between a first RF contact 211 from among the RF contacts and the transmission contacts; and a second ground contact 260 coupled to the insulating part and shielding between a second RF contact 212 from among the RF contacts and the transmission contacts. The first ground contact 250 includes a first shielding member shielding between the first RF contact 211 and the transmission contacts with respect to a first axial direction and shielding between the first RF contact 211 and the transmission contacts with respect to a second axial direction perpendicular to the first axial direction.SELECTED DRAWING: Figure 5

Description

Technical Field

[0001] The present invention relates to a board connector installed in an electronic device for electrical connection between boards.

Background Art

[0002] A connector is provided in various electronic devices for electrical connection. For example, a connector is installed in an electronic device such as a mobile phone, a computer, a tablet computer, etc., and can electrically connect various components installed in the electronic device to each other.

[0003] Generally, inside wireless communication devices such as smartphones and tablet PCs among electronic devices, an RF connector and a board-to-board connector (hereinafter referred to as a "board connector") are provided. The RF connector transmits an RF (Radio Frequency) signal. The board connector processes digital signals such as those of a camera.

[0004] Such an RF connector and a board connector are mounted on a PCB (Printed Circuit Board). Since a large number of board connectors and RF connectors are mounted on a limited PCB space together with a large number of components in the existing situation, there is a problem that the PCB mounting area becomes large. Therefore, according to the trend of miniaturization of smartphones, a technology for integrating the RF connector and the board connector and optimizing with a small PCB mounting area is required.

[0005] FIG. 1 is a schematic perspective view of a board connector according to the prior art.

[0006] Referring to FIG. 1, a board connector 100 according to the prior art includes a first connector 110 and a second connector 120.

[0007] The first connector 110 is for coupling to a first substrate (not shown). The first connector 110 may be electrically connected to the second connector 120 through a plurality of first contacts 111.

[0008] The second connector 120 is for coupling to a second substrate (not shown). The second connector 120 may be electrically connected to the first connector 110 through a plurality of second contacts 121.

[0009] In the substrate connector 100 according to the prior art, the first substrate and the second substrate can be electrically connected to each other by connecting the first contact 111 and the second contact 121 to each other. Also, when some of the first contact 111 and the second contact 121 are used as RF contacts for RF signal transmission, the substrate connector 100 according to the prior art can be embodied such that an RF signal is transmitted between the first substrate and the second substrate through the RF contacts.

[0010] Here, the substrate connector 100 according to the prior art has the following problems.

[0011] First, when the substrate connector 100 according to the prior art uses contacts that are relatively closely spaced among the contacts 111 and 121 as the RF contacts, there is a problem that signal transmission is not made smoothly due to RF signal interference among the RF contacts 111′, 111″, 121′, 121″.

[0012] Second, in the substrate connector 100 according to the prior art, since there is an RF signal shielding portion 112 at the outermost portion of the connector, although radiation of the RF signal to the outside can be shielded, there is a problem that shielding between RF signals is not performed.

[0013] Thirdly, in the substrate connector 100 according to the prior art, the RF contacts 111′, 111″, 121′, and 121″ each include mounting portions 111a′, 111a″, 121a′, and 121a″ that are mounted on the substrate, and the mounting portions 111a′, 111a″, 121a′, and 121a″ are arranged to be exposed to the outside. Accordingly, the substrate connector 100 according to the prior art has a problem in that the mounting portions 111a′, 111a″, 121a′, and 121a″ are not shielded. Summary of the Invention Problems to be Solved by the Invention

[0014] The present invention has been devised to solve the problems as described above, and is for providing a substrate connector capable of reducing the possibility of RF signal interference between RF contacts. Means for Solving the Problems

[0015] In order to solve the above problems, the present invention can include the following configuration.

[0016] The substrate connector according to the present invention includes a plurality of RF contacts for RF (Radio Frequency) signal transmission; an insulating portion that supports the RF contacts; a plurality of transmission contacts coupled to the insulating portion; a ground housing to which the insulating portion is coupled; a first ground contact coupled to the insulating portion and shielding between a first RF contact and the transmission contact among the RF contacts; and a second ground contact coupled to the insulating portion and shielding between a second RF contact and the transmission contact among the RF contacts. The first ground contact can include a first shielding member that shields between the first RF contact and the transmission contact with reference to a first axial direction and also shields between the first RF contact and the transmission contact with reference to a second axial direction perpendicular to the first axial direction.

[0017] The substrate connector according to the present invention includes a plurality of RF contacts for RF (Radio Frequency) signal transmission; an insulating part that supports the RF contacts; a plurality of transmission contacts coupled to the insulating part; a ground housing to which the insulating part is coupled; a first ground contact coupled to the insulating part and shielding between a first RF contact and the transmission contact among the RF contacts; and a second ground contact coupled to the insulating part and shielding between a second RF contact and the transmission contact among the RF contacts. A ground arm that is connected to a ground contact of a mating connector and moves elastically can be formed on the first ground contact and the second ground contact.

Effects of the Invention

[0018] According to the present invention, the following effects can be achieved.

[0019] The present invention can implement a shielding function for signals, electromagnetic waves, etc. with respect to RF contacts by using a ground housing and ground contacts. Along with this, the present invention can prevent electromagnetic waves generated from the RF contacts from interfering with the signals of circuit components located around in an electronic device, and can prevent electromagnetic waves generated from circuit components located around in an electronic device from interfering with the RF signals transmitted by the RF contacts. Therefore, the present invention can contribute to improving EMI (Electro Magnetic Interference) shielding performance and EMC (Electro Magnetic Compatibility) performance by using a ground housing and ground contacts.

[0020] The present invention can be implemented such that the first RF contact and the second RF contact are arranged to be asymmetric with respect to the first axial direction and the second axial direction, thereby reducing the possibility of interference of RF signals between the RF contacts and miniaturizing the magnitude thereof.

Brief Description of the Drawings

[0021]

Figure 1

[0022]

Figure 2

[0023]

Figure 3

[0024]

Figure 4

[0025]

Figure 5

[0026]

Figure 6

[0027]

Figure 7

[0028]

Figure 8

[0029]

Figure 9

[0030] <N

Figure 10

[0031]

Figure 11

[0032]

Figure 12

[0033]

Figure 13

[0034]

Figure 14

[0035]

Figure 15

[0036]

Figure 16

Mode for Carrying Out the Invention

[0037] Hereinafter, embodiments of the board connector according to the present invention will be described in detail with reference to the accompanying drawings. FIG. 8 shows a state in which the connector according to the first embodiment and the connector according to the second embodiment are combined along the direction shown in FIG. 3.

[0038] Referring to FIG. 2, the board connector 1 according to the present invention can be installed in an electronic device (not shown) such as a mobile phone, a computer, a tablet computer, etc. The board connector 1 according to the present invention can be used to electrically connect a plurality of boards (not shown). The board can be a printed circuit board (PCB). For example, when electrically connecting a first board and a second board, a receptacle connector mounted on the first board and a plug connector mounted on the second board can be connected to each other. Accordingly, the first board and the second board can be electrically connected through the receptacle connector and the plug connector. The plug connector mounted on the first board and the receptacle connector mounted on the second board may also be connected to each other.

[0039] The board connector 1 according to the present invention can be embodied by the receptacle connector. The board connector 1 according to the present invention can be embodied by the plug connector. The board connector 1 according to the present invention may also be embodied including both the receptacle connector and the plug connector.

[0040] Hereinafter, an embodiment in which the board connector 1 according to the present invention is embodied by the receptacle connector is defined as the board connector 200 according to the first embodiment, and an embodiment in which the board connector 1 according to the present invention is embodied by the plug connector is defined as the board connector 300 according to the second embodiment, and will be described in detail with reference to the accompanying drawings. Also, an embodiment will be described based on the case where the board connector 200 according to the first embodiment is mounted on the first board and the board connector 300 according to the second embodiment is mounted on the second board. It will be apparent to those skilled in the art to which the present invention pertains to derive an embodiment in which the board connector 1 according to the present invention includes both the receptacle connector and the plug connector.

[0041]

[0042] <The board connector 200 according to the first embodiment>

[0043] Referring to FIGS. 2 to 4, the substrate connector 200 according to the first embodiment can include a plurality of RF contacts 210, a plurality of transmission contacts 220, a ground housing 230, and an insulating portion 240.

[0044] The RF contact 210 is for RF (Radio Frequency) signal transmission. The RF contact 210 can transmit an ultra-high frequency RF signal. The RF contact 210 can be supported by the insulating portion 240. The RF contact 210 can be coupled to the insulating portion 240 through an assembly process. The RF contact 210 may be integrally formed with the insulating portion 240 through injection molding.

[0045] Referring to FIGS. 2 to 5, the RF contacts 210 can be arranged spaced apart from each other. By being mounted on the first substrate, the RF contacts 210 can be electrically connected to the first substrate. By being connected to the RF contacts of the mating connector, the RF contacts 210 can be electrically connected to the second substrate on which the mating connector is mounted. Accordingly, the first substrate and the second substrate can be electrically connected. When the substrate connector 200 according to the first embodiment is a receptacle connector, the mating connector can be a plug connector. When the substrate connector 200 according to the first embodiment is a plug connector, the mating connector can be a receptacle connector.

[0046] A first RF contact 211 among the RF contacts 210 and a second RF contact 212 among the RF contacts 210 can be spaced apart from each other along a first axial direction (X-axis direction). The first RF contact 211 and the second RF contact 212 can be supported by the insulating portion 240 at positions spaced apart from each other along the first axial direction (X-axis direction).

[0047] Of the RF contacts 210, the first RF contact 211 and the second RF contact 212 of the RF contacts 210 may be spaced apart from each other along a second axial direction (Y-axis direction) perpendicular to the first axial direction (X-axis direction). The first RF contact 211 and the second RF contact 212 may be supported by the insulating portion 240 at positions spaced apart from each other along the second axial direction (Y-axis direction). In this case, the first ground contact may include a first shielding member that shields between the first RF contact and the transmission contact with reference to the first axial direction and shields between the first RF contact and the transmission contact with reference to a second axial direction perpendicular to the first axial direction. Accordingly, the transmission contact 220 may be disposed in a space where the first RF contact 211 and the second RF contact 212 are spaced apart from each other in order to reduce interference of RF signals between the first RF contact 211 and the second RF contact 212. Therefore, the substrate connector 200 according to the first embodiment can not only reduce interference of RF signals by increasing the distance between the first RF contact 211 and the second RF contact 212 from each other, but also improve the space utilization degree with respect to the insulating portion 240 by disposing the transmission contact 220 in the separation space for this purpose. By arranging the first RF contact 211 and the second RF contact 212 so as to be spaced apart from each other with respect to all of the first axial direction (X-axis direction) and the second axial direction (Y-axis direction), the first RF contact 211 and the second RF contact 212 may be located in a diagonal direction with respect to each other. In this case, compared with the case where the first RF contact 211 and the second RF contact 212 are arranged in a straight line, the distance between the RF contacts 210 can be secured. Therefore, the possibility of occurrence of RF signal interference between the RF contacts 210 can be reduced, and the size of the substrate connector 200 according to the first embodiment can be embodied to be miniaturized. The first RF contact 211 and the second RF contact 212 may be spaced apart with reference to the first axial direction (X-axis direction) and may be disposed at positions spaced apart and not facing each other with reference to a second axial direction (Y-axis direction) perpendicular to the first axial direction (X-axis direction).In this case, the first RF contact 211 and the second RF contact 212 can be arranged at positions that are separated with reference to the first axial direction (X-axis direction) and are also separated with reference to the second axial direction (Y-axis direction) to be asymmetric.

[0048] The first RF contact 211 can include a first RF mounting member 2111. The first RF mounting member 2111 can be mounted on the first substrate. Accordingly, the first RF contact 211 can be electrically connected to the first substrate through the first RF mounting member 2111. The first RF contact 211 can be formed of a material having electrical conductivity. For example, the first RF contact 211 can be formed of metal. The first RF contact 211 can be connected to any one of the RF contacts of the mating connector.

[0049] The second RF contact 212 can include a second RF mounting member 2121. The second RF mounting member 2121 can be mounted on the first substrate. Accordingly, the second RF contact 212 can be electrically connected to the first substrate through the second RF mounting member 2121. The second RF contact 212 can be formed of a material having electrical conductivity. For example, the second RF contact 212 can be formed of metal. The second RF contact 212 can be connected to any one of the RF contacts of the mating connector.

[0050] Referring to FIGS. 2 to 5, the transmission contact 220 is coupled to the insulating portion 240. The transmission contact 220 can be responsible for functions such as transmitting signals, data, power, etc. The transmission contact 220 can be coupled to the insulating portion 240 through an assembly process. The transmission contact 220 may be integrally formed with the insulating portion 240 through injection molding.

[0051] The transmission contacts 220 can be arranged to be separated from each other. By being mounted on the first substrate, the transmission contacts 220 can be electrically connected to the first substrate. In this case, the transmission mounting members 2201 each of the transmission contacts 220 has can be mounted on the first substrate. The transmission contacts 220 can be formed of a material having electrical conductivity. For example, the transmission contacts 220 can be formed of metal. The transmission contacts 220 can be electrically connected to the second substrate on which the mating connector is mounted by being connected to the transmission contacts of the mating connector. Accordingly, the first substrate and the second substrate can be electrically connected.

[0052] Referring to FIGS. 2 to 5, the transmission contacts 220 can include a first transmission contact 221 and a second transmission contact 222.

[0053] The first transmission contact 221 can be arranged to be separated from the second RF contact 212 with reference to the first axial direction (X-axis direction). The second transmission contact 222 can be arranged to be separated from the first RF contact 211 with reference to the first axial direction (X-axis direction). The first transmission contact 221 and the second transmission contact 222 can be arranged to be separated from each other along the second axial direction (Y-axis direction). In this case, a part of the first transmission contact 221 and a part of the second transmission contact 222 can be arranged to overlap only partially with reference to the second axial direction (Y-axis direction). For example, a part of the first transmission contact 221 and a part of the second transmission contact 222 can be arranged to face each other at positions separated from each other with reference to the second axial direction (Y-axis direction). The first transmission contacts 221 can be arranged to be separated from each other along the first axial direction (X-axis direction). The second transmission contacts 322 can be arranged to be separated from each other along the first axial direction (X-axis direction).

[0054] The first transmission contact 221 may include a first-1 transmission contact 221a, a first-2 transmission contact 221b, and a first-3 transmission contact 221c.

[0055] The first-1 transmission contact 221a, the first-2 transmission contact 221b, and the first-3 transmission contact 221c may be arranged to be spaced apart from the second RF contact 212 with reference to the first axial direction (X-axis direction). In this case, the first-1 transmission contact 221a may be arranged to be spaced apart from the second RF contact 212 at the farthest distance with reference to the first axial direction (X-axis direction). The first-2 transmission contact 221b may be arranged to be spaced apart from the second RF contact 212 at a distance shorter than the distance by which the first-1 transmission contact 221a is spaced apart from the second RF contact 212 with reference to the first axial direction (X-axis direction). The first-3 transmission contact 221c may be arranged to be spaced apart from the second RF contact 212 at a distance shorter than the distance by which the first-2 transmission contact 221b is spaced apart from the second RF contact 212 with reference to the first axial direction (X-axis direction). The first-2 transmission contact 221b may be arranged between the first-1 transmission contact 221a and the first-3 transmission contact 221c with reference to the first axial direction (X-axis direction). The first-3 transmission contact 221c may be arranged between the first-2 transmission contact 221b and the second RF contact 212 with reference to the first axial direction (X-axis direction).

[0056] Further, at least one of the first transmission contacts 221 may be arranged to overlap the first RF contact 211 with respect to the second axial direction (Y-axis direction). In this case, the first-1 transmission contact 221a may be arranged to overlap the first RF contact 211 with respect to the second axial direction (Y-axis direction). For example, at least one of the first transmission contacts 221 may be arranged to face the first RF contact 211 with respect to the second axial direction (Y-axis direction). In this case, the first-1 transmission contact 221a may be arranged to face the first RF contact 211 with respect to the second axial direction (Y-axis direction). Therefore, the substrate connector 200 according to the first embodiment can be embodied such that its size is reduced along the first axial direction (X-axis direction).

[0057] The second transmission contact 222 may include a second-1 transmission contact 222a, a second-2 transmission contact 222b, and a second-3 transmission contact 222c.

[0058] The second transmission contact 222a, the second transmission contact 222b, and the second transmission contact 222c may be arranged to be separated from the first RF contact 211 with respect to the first axial direction (X-axis direction). In this case, the second transmission contact 222a may be arranged to be separated from the first RF contact 211 at the farthest distance with respect to the first axial direction (X-axis direction). The second transmission contact 222b may be arranged to be separated from the second transmission contact 222a at a distance shorter than the distance at which the second transmission contact 222a is separated from the first RF contact 211 with respect to the first axial direction (X-axis direction). The second transmission contact 222c may be arranged to be separated from the second transmission contact 222b at a distance shorter than the distance at which the second transmission contact 222b is separated from the first RF contact 211 with respect to the first axial direction (X-axis direction). The second transmission contact 222b may be arranged between the second transmission contact 222a and the second transmission contact 222c with respect to the first axial direction (X-axis direction). The second transmission contact 222c may be arranged between the second transmission contact 222b and the first RF contact 211 with respect to the first axial direction (X-axis direction).

[0059] Also, at least one of the second transmission contacts 222 may be arranged to overlap the second RF contact 212 with respect to the second axial direction (Y-axis direction). In this case, the second transmission contact 222a may be arranged to overlap the second RF contact 212 with respect to the second axial direction (Y-axis direction). For example, at least one of the second transmission contacts 222 may be arranged to face the second RF contact 212 with respect to the second axial direction (Y-axis direction). In this case, the second transmission contact 222a may be arranged to face the second RF contact 212 with respect to the second axial direction (Y-axis direction). Accordingly, the substrate connector 200 according to the first embodiment can be embodied such that its size is reduced along the first axial direction (X-axis direction).

[0060] On the one hand, at least one of the first transmission contacts 221 may overlap with at least one of the second transmission contacts 222 along the second axial direction (Y-axis direction). In this case, the first-third transmission contact 221c and the second-third transmission contact 222c may be arranged to overlap each other along the second axial direction (Y-axis direction). For example, at least one of the first transmission contacts 221 may face at least one of the second transmission contacts 222 along the second axial direction (Y-axis direction). In this case, the first-third transmission contact 221c and the second-third transmission contact 222c may be arranged to face each other along the second axial direction (Y-axis direction). That is, at least one of the first transmission contacts 221 may be arranged so as not to overlap with at least one of the second transmission contacts 222 along the second axial direction (Y-axis direction). For example, at least one of the first transmission contacts 221 may be arranged so as not to face at least one of the second transmission contacts 222 along the second axial direction (Y-axis direction). Therefore, the substrate connector 200 according to the first embodiment can not only reduce the interference of RF signals by increasing the distance between the first RF contact 211 and the second RF contact 212, but also improve the space utilization rate for the insulating portion 240 by arranging the transmission contact 220 in the space for this purpose.

[0061] On the other hand, in FIGS. 2 to 5, the substrate connector 200 according to the first embodiment is illustrated as including three first transmission contacts 221 implemented by the first-first transmission contact 221a, the first-second transmission contact 221b, and the first-third transmission contact 221c and three second transmission contacts 222 implemented by the second-first transmission contact 222a, the second-second transmission contact 222b, and the second-third transmission contact 222c, but is not limited thereto. The substrate connector according to the first embodiment may include four or more first transmission contacts 221 and second transmission contacts 222, respectively.

[0062] Referring to FIGS. 2 to 5, the grounding housing 230 is coupled with the insulating part 240. The grounding housing 230 can be grounded by being mounted on the first substrate. Accordingly, the grounding housing 230 can implement a shielding function for signals, electromagnetic waves, etc. with respect to the RF contact 210. In this case, the grounding housing 230 can prevent the electromagnetic waves generated from the RF contact 210 from interfering with the signals of the circuit components located around in the electronic device, and can prevent the electromagnetic waves generated from the circuit components located around in the electronic device from interfering with the RF signals transmitted by the RF contact 210. Accordingly, the substrate connector 200 according to the first embodiment can contribute to improving the EMI (Electro Magnetic Interference) shielding performance and the EMC (Electro Magnetic Compatibility) performance by using the grounding housing 230. The grounding housing 230 can be formed of a material having electrical conductivity. For example, the grounding housing 230 can be formed of metal.

[0063] The grounding housing 230 can be disposed so as to surround the side of the inner space 230a. A part of the insulating part 240 can be located in the inner space 230a. The first RF contact 211, the second RF contact 212, and the transmission contact 220 can all be located in the inner space 230a. In this case, the first RF mounting member 2111, the second RF mounting member 2121, and the transmission mounting member 2201 can also all be located in the inner space 230a. Accordingly, the grounding housing 230 can strengthen the shielding function for the first RF contact 211 and the second RF contact 212 and implement complete shielding by implementing a shielding wall for all of the first RF contact 211 and the second RF contact 212. The mating connector can be inserted into the inner space 230a.

[0064] The grounding housing 230 can be arranged to surround all sides with reference to the inner space 230a. The inner space 230a can be arranged inside the grounding housing 230. When the grounding housing 230 is integrally formed in the shape of a square ring as a whole, the inner space 230a can be formed in the shape of a rectangular parallelepiped. In this case, the grounding housing 230 can be arranged to surround four sides with reference to the inner space 230a.

[0065] The grounding housing 230 can be integrally formed without joints. The grounding housing 230 can be integrally formed without joints by a metal injection method such as die casting or MIM (Metal Injection Molding). The grounding housing 230 may be integrally formed without joints by CNC (Computer Numerical Control) machining, MCT (Machining Center Tool) machining, etc.

[0066] Referring to FIGS. 2 to 5, the insulating portion 240 supports the RF contact 210. The RF contact 210 and the transmission contact 220 can be coupled to the insulating portion 240. The insulating portion 240 can be formed of an insulating material. The insulating portion 240 can be coupled to the grounding housing 230 such that the RF contact 210 is located in the inner space 230a.

[0067] Referring to FIGS. 2 to 6, the substrate connector 200 according to the first embodiment can include a first grounding contact 250.

[0068] The first grounding contact 250 is coupled to the insulating portion 240. The first grounding contact 250 can be grounded by being mounted on the first substrate. The first grounding contact 250 can be coupled to the insulating portion 240 through an assembly process. The first grounding contact 250 may be integrally formed with the insulating portion 240 through injection molding.

[0069] The first ground contact 250 can implement a shielding function for the first RF contact 211 together with the ground housing 230. In this case, the first ground contact 250 can be disposed between the first RF contact 211 and the transmission contact 220 with reference to the first axial direction (X-axis direction). The first ground contact 250 can be formed of a material having electrical conductivity. For example, the first ground contact 250 can be formed of metal. When the mating connector is inserted into the inner space 230a, the first ground contact 250 can be connected to the ground contact of the mating connector.

[0070] Referring to FIGS. 2 to 4, the board connector 200 according to the first embodiment can include a second ground contact 260.

[0071] The second ground contact 260 is coupled to the insulating portion 240. The second ground contact 260 can be grounded by being mounted on the first substrate. The second ground contact 260 can be coupled to the insulating portion 240 through an assembly process. The second ground contact 260 may be integrally formed with the insulating portion 240 through injection molding.

[0072] The second ground contact 260 can implement a shielding function for the second RF contact 212 together with the ground housing 230. The second ground contact 260 can be disposed between the transmission contact 220 and the second RF contact 212 with reference to the first axial direction (X-axis direction). The second ground contact 260 can be formed of a material having electrical conductivity. For example, the second ground contact 260 can be formed of metal. When the mating connector is inserted into the inner space 230a, the second ground contact 260 can be connected to the ground contact of the mating connector.

[0073] Referring to FIGS. 2 to 9, the first RF contact 211 and the second RF contact 212 can be arranged to be spaced apart from each other along the first axial direction (X-axis direction). Also, the first RF contact 211 and the second RF contact 212 can be arranged to be spaced apart from each other along the second axial direction (Y-axis direction). Based on the first axial direction (X-axis direction), the first RF contact 211 and the second transmission contact 222 can be arranged to be spaced apart. Based on the first axial direction (X-axis direction), the second RF contact 212 and the first transmission contact 221 can be arranged to be spaced apart. In this case, the first ground contact 250 can shield between the first RF contact 211 and the first transmission contact 221 with respect to the second axial direction (X-axis direction), and can shield between the first RF contact 211 and the second transmission contact 222 with respect to the first axial direction (X-axis direction). The second ground contact 260 can shield between the second RF contact 212 and the second transmission contact 222 along the second axial direction (Y-axis direction), and can shield between the second RF contact 212 and the first transmission contact 221 along the first axial direction (X-axis direction).

[0074] The substrate connector 200 according to the first embodiment can be arranged such that the first RF contact 211 and the second RF contact 212 are asymmetric with respect to each other based on the first axial direction (X-axis direction) and the second axial direction (Y-axis direction). In this case, the first ground contact 250 can implement a shielding function between the first RF contact 211 and the transmission contact 220, and a space can be secured for the substrate connector 200. Accordingly, by arranging the transmission contact 220 in the space, the size of the substrate connector 200 according to the first embodiment can be implemented to be miniaturized.

[0075] Referring to FIGS. 2 to 6, the first ground contact 250 can include the first shielding member 251.

[0076] The first shielding member 251 can be positioned between the first RF contact 211 and the first-1 transmission contact 221a with reference to the second axial direction (Y-axis direction). Accordingly, the first RF contact 211 can shield the space between the first RF contact 211 and the first-1 transmission contact 221a by using the first shielding member 251. Accordingly, the first ground contact 250 can prevent signals and the like from interfering between the first RF contact 211 and the first-1 transmission contact 221a by using the first shielding member 251. The first shielding member 251 can be formed in a plate shape arranged vertically between the first RF contact 211 and the first-1 transmission contact 221a.

[0077] The first ground contact 250 can include a first shielding protrusion 252.

[0078] The first shielding protrusion 252 protrudes from the first shielding member 251. The first shielding protrusion 252 can be connected to the insulating portion 240. Accordingly, the first ground contact 250 can be electrically connected to the insulating portion 240 through the first shielding protrusion 252, thereby enhancing the shielding performance against the space between the first RF contact 211 and the first-1 transmission contact 221a and realizing complete shielding. The first shielding protrusion 252 can be formed in a plate shape arranged in the vertical direction. The first shielding protrusion 252 can protrude outside the insulating portion 240 and be connected to a ground housing of the mating connector.

[0079] The first ground contact 250 can include the first ground connection member 253 and the first ground mounting member 254.

[0080] The first ground connection member 253 is coupled to the first shielding member 251 and the first ground mounting member 254 respectively. The first shielding member 251 and the first ground mounting member 254 can be connected through the first ground connection member 253. The first ground connection member 253 can be connected to a ground contact of a mating connector. Accordingly, the first ground contact 250 can be electrically connected to the ground contact of the mating connector by being connected to the ground contact of the mating connector through the first ground connection member 253. Therefore, between the first RF contact 211 and the first-1 transmission contact 221a that are spaced apart from each other along the second axial direction (Y-axis direction), the first ground contact 250 can be shielded by being connected to the ground contact of the mating connector through the first ground connection member 253. The first shielding member 251 can be coupled to the first ground connection member 253. The first shielding member 251 can protrude from the first ground connection member 253 along the first axial direction (X-axis direction). In this case, the first shielding protrusion 252 can protrude from the first shielding member 251 along the first axial direction (X-axis direction).

[0081] The first ground mounting member 254 is mounted on the first substrate. The first ground mounting member 254 can be grounded by being mounted on the first substrate. Accordingly, the first ground contact 250 can be grounded to the first substrate through the first ground mounting member 254. The first ground mounting member 254 can protrude from the first ground connection member 253 along the second axial direction (Y-axis direction). In this case, the first ground mounting member 254 can be disposed between the first RF contact 211 and the first transmission contact 221 with reference to the first axial direction (X-axis direction). The first ground mounting member 254 can protrude from the first ground connection member 253 by a length that can be connected to the ground housing 230 with reference to the second axial direction (Y-axis direction). In this case, the first ground mounting member 254 and the first shielding member 251 can protrude from the first ground connection member 253 in different directions and be connected to different side walls of the ground housing 230. Therefore, in the substrate connector 200 according to the first embodiment, since the first ground contact 250 and the ground housing 230 are electrically connected to each other while surrounding all sides of the first RF contact 211, the shielding performance against the first RF contact 211 can be further enhanced to realize complete shielding. The first ground mounting member 254 can be formed in a plate shape disposed in the horizontal direction.

[0082] The first ground contact 250 can include a first ground protrusion 255.

[0083] The first grounding protrusion 255 will protrude from the first shielding member 251. The first grounding protrusion 255 can be mounted on the first substrate. Accordingly, the substrate connector 200 according to the first embodiment can increase the area where the first grounding contact 250 is mounted on the first substrate, so that the shielding performance using the first grounding contact 250 can be further enhanced. The first grounding protrusion 255 can be mounted on the first substrate by penetrating through the insulating portion 240 and protruding from the insulating portion 240. The first grounding protrusion 255 and the first grounding mounting member 254 can be mounted on the substrate at positions spaced apart from each other. The first grounding protrusion 255 can protrude from the first shielding member 251 along the vertical direction. The first grounding protrusion 255 can be formed in a plate shape arranged in the vertical direction.

[0084] On the other hand, as shown in FIG. 7, the first grounding protrusion 255 and the first grounding protrusion 255 can be mounted at positions spaced apart from each other. Accordingly, electromagnetic waves or the like generated in the first shielding member 251 can be grounded through the first grounding protrusion 255, so that the shielding performance using the first grounding contact 250 can be further enhanced. In this case, since the electromagnetic wave is grounded through the first grounding protrusion 255 without detouring to the first grounding mounting member 254, the shielding distance for shielding the electromagnetic wave or the like in the substrate connector 200 according to the first embodiment can be shortened. Therefore, in the substrate connector 200 according to the first embodiment, since the electromagnetic wave is quickly grounded, the shielding performance of the substrate connector 200 can be improved.

[0085] For example, as illustrated in FIG. 7, a path through which electromagnetic waves generated by the first shielding member 251 are grounded to the substrate through the first grounding protrusion 255 can be defined as a first path A. A path through which electromagnetic waves generated by the first shielding member are grounded to the substrate through the first grounding connection member 253 and the first grounding mounting member 254 can be defined as a second path B. When the first grounding protrusion 255 is formed on the first shielding member 251 and grounded to the substrate, electromagnetic waves and the like can be grounded to and disappear from the first substrate through the first path A, which is relatively shorter than the second path B. Accordingly, by quickly disappearing the electromagnetic waves and the like from the substrate, the shielding performance of the board connector 200 according to the first embodiment can be further enhanced while ensuring reliability.

[0086] The first grounding contact 250 may include a first connection protrusion 256.

[0087] The first connection protrusion 256 protrudes from the first shielding member 251. The first connection protrusion 256 can be connected to the grounding housing of the mating connector. Accordingly, the board connector 200 according to the first embodiment can increase the connection area where the first grounding contact 250 is connected to the grounding housing of the mating connector, so that the shielding performance using the first grounding contact 250 can be further enhanced. The first connection protrusion 256 can penetrate through the insulating portion 240 and protrude from the insulating portion 240 to be connected to the grounding housing of the mating connector. The first connection protrusion 256 may be inserted into the insulating portion of the mating connector and connected to the grounding housing of the mating connector. In this case, a through hole into which the first connection protrusion 256 is inserted may be formed in the insulating portion of the mating connector. The first connection protrusion 256 can protrude from the first shielding member 251 along the vertical direction. With reference to the vertical direction, the first connection protrusion 256 and the first grounding protrusion 255 can protrude from the first shielding member 251 in opposite directions. The first connection protrusion 256 can be formed in a plate shape arranged in the vertical direction.

[0088] In this way, the substrate connector 200 according to the first embodiment can implement a first ground loop (250a, shown in FIG. 5) for the first RF contact 211 by using the first ground contact 250 and the ground housing 230. Therefore, the substrate connector 200 according to the first embodiment can implement complete shielding for the first RF contact 211 by further strengthening the shielding line ridge for the first RF contact 211 by using the first ground loop 250a.

[0089] The second ground contact 260 can include at least one of a second shielding member 261, a second shielding protrusion 262, a second ground connection member 263, a second ground mounting member 264, a second ground protrusion 265, and a second connection protrusion 266. In this case, since the second shielding member 261, the second shielding protrusion 262, the second ground connection member 263, the second ground mounting member 264, the second ground protrusion 265, and the second connection protrusion 266 can be implemented to substantially correspond to the first shielding member 251, the first shielding protrusion 252, the first ground connection member 253, the first ground mounting member 254, the first ground protrusion 255, and the first connection protrusion 256 respectively, a specific description thereof will be omitted.

[0090] The second ground contact 260 and the first ground contact 250 may be formed in the same form as each other. Accordingly, the substrate connector 200 according to the first embodiment can improve the ease of manufacturing operations for manufacturing the second ground contact 260 and the first ground contact 250, respectively. In this case, as illustrated in FIG. 5, the second ground contact 260 and the first ground contact 250 may be arranged to be point-symmetrical with respect to a symmetry point SP. The symmetry point SP is separated by the same distance from each of the side walls 230b and 230c of the ground housing 230 arranged at a distance from each other with respect to the first axial direction (X-axis direction), and is separated by the same distance from each of the side walls 230d and 230e of the ground housing 230 arranged at a distance from each other with respect to the second axial direction (Y-axis direction). Therefore, in the substrate connector 200 according to the first embodiment, since the second ground contact 260 and the first ground contact 250 are formed in the same form as each other and are embodied with only different arrangement directions, the ease of manufacturing operations for manufacturing the second ground contact 260 and the first ground contact 250 can be further improved. In this case, the second RF contact 212 and the first RF contact 211 may be arranged to be point-symmetrical with respect to the symmetry point SP.

[0091] On the other hand, as illustrated in FIG. 5, the second shielding member 261 and the first shielding member 251 may be arranged on the same line. In this case, the second shielding member 261 may be arranged to overlap with the first shielding member 251 along the first axial direction (X-axis direction). The second shielding member 261 may be arranged to face the first shielding member 251 along the first axial direction (X-axis direction). Accordingly, the substrate connector 200 according to the first embodiment can embody the shielding force between the first RF contact 211 and the first transmission contact 221, and the shielding force between the second RF contact 212 and the second transmission contact 222, while miniaturizing by reducing the overall size with respect to the first axial direction (X-axis direction).

[0092] Referring to FIGS. 2 to 9, in the board connector 200 according to the first embodiment, the ground housing 230 can be embodied as follows.

[0093] The ground housing 230 can include a ground inner wall 231, a ground outer wall 232, and a ground connection wall 233.

[0094] The ground inner wall 231 faces the insulating portion 240. The ground inner wall 231 can be arranged to face the inner space 230a. The first ground contact 250 and the second ground contact 260 can be respectively connected to the ground inner wall 231. The ground inner wall 231 can be arranged to surround all sides with respect to the inner space 230a. Although not shown, the ground inner wall 231 can include a plurality of sub-ground inner walls, and the sub-ground inner walls can be embodied to be arranged on different sides with respect to the inner space 230a.

[0095] The ground inner wall 231 can be connected to the ground housing of the mating connector inserted into the inner space 230a. For example, as shown in FIG. 9, the ground inner wall 231 can be connected to the ground housing 330 of the mating connector. In this way, the board connector 200 according to the first embodiment can further enhance the shielding function through the connection between the ground housing 230 and the ground housing of the mating connector. Also, the board connector 200 according to the first embodiment can reduce electrical adverse effects such as crosstalk that may occur due to mutual capacitance or induction between adjacent terminals through the connection between the ground housing 230 and the ground housing of the mating connector. In this case, since the board connector 200 according to the first embodiment can secure a path for electromagnetic waves to flow into at least one ground of the first board and the second board, the EMI shielding performance can be further enhanced.

[0096] The grounding outer wall 232 is separated from the grounding inner wall 231. The grounding outer wall 232 can be disposed outside the grounding inner wall 231. The grounding outer wall 232 can be disposed so as to surround all sides with respect to the grounding inner wall 231. The grounding outer wall 232 and the grounding inner wall 231 can be implemented as a double shielding wall surrounding the side of the inner space 230a. The first RF contact 211 and the second RF contact 212 can be located in the inner space 230a surrounded by the shielding wall. Accordingly, the grounding housing 230 can implement a shielding function for the RF contact 210 by using the shielding wall. Therefore, the substrate connector 200 according to the first embodiment can contribute to further improving the EMI shielding performance and the EMC performance by using the shielding wall.

[0097] The grounding outer wall 232 can be grounded by being mounted on the first substrate. In this case, the grounding housing 230 can be grounded through the grounding outer wall 232. When one end of the grounding outer wall 232 is coupled to the grounding connection wall 233, the other end of the grounding outer wall 232 can be mounted on the first substrate. In this case, the grounding outer wall 232 can be formed at a height higher than that of the grounding inner wall 231.

[0098] The grounding connection wall 233 is coupled to each of the grounding inner wall 231 and the grounding outer wall 232. The grounding connection wall 233 can be disposed between the grounding inner wall 231 and the grounding outer wall 232. The grounding inner wall 231 and the grounding outer wall 232 can be electrically connected to each other through the grounding connection wall 233. Accordingly, when the grounding outer wall 232 is mounted on the first substrate and grounded, the grounding connection wall 233 and the grounding inner wall 231 can also be grounded to implement a shielding function.

[0099] The grounding connection wall 233 can be coupled to one end of the grounding outer wall 232 and one end of the grounding inner wall 231, respectively. When referring to FIG. 9, one end of the grounding outer wall 232 corresponds to the upper end of the grounding outer wall 232, and one end of the grounding inner wall 231 may correspond to the upper end of the grounding inner wall 231. The grounding connection wall 233 is formed in a plate shape arranged in the horizontal direction, and the grounding outer wall 232 and the grounding inner wall 231 may be formed in plate shapes arranged in the vertical direction, respectively. The grounding connection wall 233, the grounding outer wall 232, and the grounding inner wall 231 may be integrally formed.

[0100] The grounding connection wall 233 can be connected to the grounding housing of a mating connector inserted into the inner space 230a. Accordingly, in the board connector 200 according to the first embodiment, since the grounding outer wall 232 and the grounding connection wall 233 are connected to the grounding housing of the mating connector, the shielding function can be further enhanced by increasing the contact area between the grounding housing 230 and the grounding housing of the mating connector.

[0101] The grounding bottom 234 protrudes from the lower end of the grounding inner wall 231 toward the inner space 230a side. That is, the grounding bottom 234 may protrude inside the grounding inner wall 231. The grounding bottom 234 may be formed in a closed annular shape extending along the lower end of the grounding inner wall 231. The grounding bottom 234 can be grounded by being mounted on the first board. In this case, the grounding housing 330 can be grounded through the grounding bottom 234. When the mating connector is inserted into the inner space 230a, the grounding bottom 234 can be connected to the grounding housing of the mating connector. The grounding bottom 234 may be formed in a plate shape arranged in the horizontal direction.

[0102] Here, the grounding housing 230 can implement a shielding function for the first RF contact 211 together with the first grounding contact 250. The grounding housing 230 can implement a shielding function for the second RF contact 212 together with the second grounding contact 260.

[0103] In this case, as shown in FIG. 5, the ground housing 230 may include a first shielding wall 230b, a second shielding wall 230c, a third shielding wall 230d, and a fourth shielding wall 230e. The first shielding wall 230b, the second shielding wall 230c, the third shielding wall 230d, and the fourth shielding wall 230e may be embodied by the ground inner wall 231, the ground outer wall 232, and the ground connection wall 233, respectively. The first shielding wall 230b and the second shielding wall 230c are arranged to face each other with reference to the first axial direction (X-axis direction). Between the first shielding wall 230b and the second shielding wall 230c with reference to the first axial direction (X-axis direction), the first RF contact 211 and the second RF contact 212 may be located. With reference to the first axial direction (X-axis direction), the first RF contact 211 may be located at a position where the distance from the first shielding wall 230b is shorter than the distance from the second shielding wall 230c. With reference to the first axial direction (X-axis direction), the second RF contact 212 may be located at a position where the distance from the second shielding wall 230c is shorter than the distance from the first shielding wall 230b. The third shielding wall 230d and the fourth shielding wall 230e are arranged to face each other with reference to the second axial direction (Y-axis direction). Between the third shielding wall 230d and the fourth shielding wall 230e with reference to the second axial direction (Y-axis direction), the first RF contact 211 and the second RF contact 212 may be located.

[0104] The first ground contact 250 may be disposed between the second transmission contacts 222 with reference to the first axial direction (X-axis direction). Accordingly, the first RF contact 211 is located between the first shielding wall 230b and the first ground connection member 253 of the first ground contact 250 with reference to the first axial direction (X-axis direction), and may be located between the third shielding wall 230d and the first shielding member 251 of the first ground contact 250 with reference to the second axial direction (Y-axis direction). Therefore, the substrate connector 200 according to the first embodiment can enhance the shielding function for the first RF contact 211 by using the first ground contact 250, the first shielding wall 230b, and the third shielding wall 230d. The first ground contact 250, the first shielding wall 230b, and the third shielding wall 230d are disposed on four sides with reference to the first RF contact 211 to implement a shielding force against RF signals. In this case, the first ground contact 250, the first shielding wall 230b, and the third shielding wall 230d can implement the first ground loop (250a, shown in FIG. 5) with respect to the first RF contact 211. Therefore, the substrate connector 200 according to the first embodiment can implement complete shielding for the first RF contact 211 by further enhancing the shielding function for the first RF contact 211 by using the first ground loop 250a.

[0105] The second ground contact 260 may be disposed between the second RF contact 212 and the first transmission contact 221 with reference to the first axial direction (X-axis direction). Accordingly, the second RF contact 212 may be positioned between the second shielding wall 230c and the second ground connection member 263 of the second ground contact 260 with reference to the first axial direction (X-axis direction), and may be positioned between the fourth shielding wall 230e and the second shielding member 261 of the second ground contact 260 with reference to the second axial direction (Y-axis direction). Therefore, the substrate connector 200 according to the first embodiment can enhance the shielding function for the second RF contact 212 by using the second ground contact 260, the second shielding wall 230c, and the fourth shielding wall 230e. The second ground contact 260, the second shielding wall 230c, and the fourth shielding wall 230e may be disposed on four sides with reference to the second RF contact 212 to implement a shielding force against RF signals. In this case, the second ground contact 260, the second shielding wall 230c, and the fourth shielding wall 230e can implement the second ground loop (260a, shown in FIG. 5) with respect to the second RF contact 212. Therefore, the substrate connector 200 according to the first embodiment can implement complete shielding for the second RF contact 212 by further enhancing the shielding function for the second RF contact 212 by using the second ground loop 260a.

[0106] Referring to FIGS. 2 to 9, in the substrate connector 200 according to the first embodiment, the insulating portion 240 may be implemented as follows.

[0107] The insulating portion 240 may include an insulating member 241, an insertion member 242, and a connecting member 243.

[0108] The insulating member 241 supports the RF contact 210 and the transmission contact 22

[0109] The insertion member 242 is inserted between the grounding inner wall 231 and the grounding outer wall 232. By inserting the insertion member 242 between the grounding inner wall 231 and the grounding outer wall 232, the insulating portion 240 can be coupled to the grounding housing 230. The insertion member 242 can be inserted between the grounding inner wall 231 and the grounding outer wall 232 in an interference fit manner. The insertion member 242 can be disposed outside the insulating member 241. The insertion member 242 can be disposed so as to surround the outside of the insulating member 241.

[0110] The connecting member 243 is coupled to each of the insertion member 242 and the insulating member 241. The insertion member 242 and the insulating member 241 can be connected to each other through the connecting member 243. With reference to the vertical direction, the connecting member 243 can be formed with a thickness that is thinner than that of the insertion member 242 and the insulating member 241. Accordingly, a space is provided between the insertion member 242 and the insulating member 24, and the mating connector can be inserted into the corresponding space. The connecting member 243, the insertion member 242, and the connecting member 243 may be integrally formed.

[0111] The insulating portion 240 can include a soldering inspection window (244, shown in FIG. 8).

[0112] The soldering inspection window 244 may be formed to penetrate the insulating portion 240. The soldering inspection window 244 may be used to inspect the state in which the RF mounting members 2111 and 2121 are mounted on the first substrate. In this case, the RF contact 210 may be coupled to the insulating portion 240 such that the RF mounting members 2111 and 2121 are positioned at the soldering inspection window 244. Accordingly, the RF mounting members 2111 and 2121 are not blocked by the insulating portion 240. Therefore, in a state where the substrate connector 200 according to the first embodiment is mounted on the first substrate, an operator can inspect the state in which the RF mounting members 2111 and 2121 are mounted on the first substrate through the soldering inspection window 244. Accordingly, the substrate connector 200 according to the first embodiment can improve the accuracy of the mounting operation of mounting the RF contact 210 including the RF mounting members 2111 and 2121 on the first substrate even when all of the RF contact 210 including the RF mounting members 2111 and 2121 is located inside the grounding housing 230. The soldering inspection window 244 may be formed to penetrate the insulating member 241.

[0113] The insulating portion 240 may include a plurality of soldering inspection windows 244. In this case, the RF mounting members 2111 and 2121 may be positioned at different soldering inspection windows 244. A part of the soldering inspection windows 244 may have the transmission mounting member 2201 positioned therein. Therefore, in a state where the substrate connector 200 according to the first embodiment is mounted on the first substrate, an operator can inspect the state in which the RF mounting members 2111 and 2121 and the transmission mounting member 2201 are mounted on the first substrate through the soldering inspection windows 244. Accordingly, the substrate connector 200 according to the first embodiment can improve the accuracy of the operation of mounting the RF mounting members 2111 and 2121 and the transmission mounting member 2201 on the first substrate. The soldering inspection windows 244 may be formed to penetrate the insulating portion 240 at positions spaced apart from each other.

[0114]

[0115] <Substrate Connector 300 According to the Second Embodiment>

[0116] Referring to FIGS. 2, 10, and 11, the board connector 300 according to the second embodiment can be mounted on the second board. When the board connector 300 according to the second embodiment and the mating connector are assembled to be coupled to each other, the second board on which the board connector 300 according to the second embodiment is mounted and the first board on which the mating connector is mounted can be electrically connected. In this case, the mating connector may be embodied as the board connector 200 according to the first embodiment. On the other hand, the mating connector for the board connector 200 according to the first embodiment may be embodied as the board connector 300 according to the second embodiment.

[0117] The board connector 300 according to the second embodiment may include a plurality of RF contacts 310, a plurality of transmission contacts 320, a ground housing 330, and an insulating part 340. Since the RF contacts 310, the transmission contacts 320, the ground housing 330, and the insulating part 340 can be embodied to substantially correspond to the RF contacts 210, the transmission contacts 220, the ground housing 230, and the insulating part 240, respectively, in the board connector 200 according to the first embodiment described above, the following description will focus on the differences.

[0118] Among the RF contacts 310, a first RF contact 311 and a second RF contact 312 among the RF contacts 310 are separated with respect to the first axial direction (X-axis direction) and are supported by the insulating part 340 at positions that are separated with respect to the second axial direction (Y-axis direction) and are asymmetric. The first RF contact 311 may include a first RF mounting member 3111 for mounting on the second board. The second RF contact 312 may include a second RF mounting member 3121 for mounting on the second board.

[0119] Referring to FIG. 11, the transmission contact 320 may include a first transmission contact 321 and a second transmission contact 322.

[0120] The first transmission contact 321 may be arranged to be separated from the second RF contact 312 with reference to the first axial direction (X-axis direction). The second transmission contact 322 may be arranged to be separated from the first RF contact 311 with reference to the first axial direction (X-axis direction). The first transmission contact 321 and the second transmission contact 322 may be arranged to be separated from each other along the second axial direction (Y-axis direction). In this case, a part of the first transmission contact 321 and a part of the second transmission contact 322 may be arranged so as to overlap only partially with reference to the second axial direction (Y-axis direction). For example, a part of the first transmission contact 321 and a part of the second transmission contact 322 may be arranged so as to face only partially with reference to the second axial direction (Y-axis direction). The first transmission contacts 321 may be arranged to be separated from each other along the first axial direction (X-axis direction). The second transmission contacts 322 may be arranged to be separated from each other along the first axial direction (X-axis direction).

[0121] On the other hand, FIG. 11 illustrates a substrate connector 300 according to the second embodiment as including three first transmission contacts 321 and second transmission contacts 322, respectively, but is not limited thereto. The substrate connector 300 according to the second embodiment may include four or more first transmission contacts 321 and second transmission contacts 322, respectively.

[0122] The grounding housing 330 is one to which the insulating part 340 is coupled. The grounding housing 330 can be grounded by being mounted on the second substrate. The grounding housing 330 can be arranged to surround the side of the inner space 330a. The insulating part 340 can be positioned in the inner space 330a. The first RF contact 311, the second RF contact 312, and the transmission contact 320 can all be positioned in the inner space 330a. In this case, the first RF mounting member 3111, the second RF mounting member 3121, and the transmission mounting member 3201 can also all be positioned in the inner space 330a. The mating connector can be inserted into the inner space 330a. In this case, a part of the mating connector is inserted into the inner space 330a, and a part of the substrate connector 300 according to the second embodiment can be inserted into the inner space of the mating connector. The grounding housing 330 can be arranged to surround all sides with respect to the inner space 330a.

[0123] The insulating part 340 supports the RF contact 310. The RF contact 310 and the transmission contact 320 can be coupled to the insulating part 340. The insulating part 340 can be coupled to the grounding housing 330 such that the RF contact 310 and the transmission contact 320 are positioned in the inner space 330a.

[0124] Referring to FIGS. 9 to 16, the substrate connector 300 according to the second embodiment can include a first grounding contact 350 and a second grounding contact 360. Since the first grounding contact 350 and the second grounding contact 360 can be embodied to substantially coincide with the first grounding contact 250 and the second grounding contact 260, respectively, in the substrate connector 200 according to the first embodiment described above, the following description will focus on the differences.

[0125] The first ground contact 350 can implement a shielding function for the first RF contact 311 together with the ground housing 330. The first ground contact 350 can be disposed between the first RF contact 311 and the transmission contact 320 with reference to the first axial direction (X-axis direction). When the mating connector is inserted into the inner space 330a, the first ground contact 350 can be connected to the ground contact of the mating connector.

[0126] The second ground contact 360 can implement a shielding function for the second RF contact 312 together with the ground housing 330. The second ground contact 360 can be disposed between the transmission contact 320 and the second RF contact 212 with reference to the first axial direction (X-axis direction). When the mating connector is inserted into the inner space 330a, the second ground contact 360 can be connected to the ground contact of the mating connector.

[0127] Referring to FIGS. 10 to 16, the first RF contact 311 and the second RF contact 312 can be arranged to be spaced apart from each other along the first axial direction (X-axis direction).

[0128] The first ground contact 350 can include a first ground connection member 351 and a first ground mounting member 352.

[0129] The first ground connection member 351 is for connecting to the ground contact of the mating connector. The first ground contact 350 can be electrically connected to the ground contact of the mating connector by being connected to the ground contact of the mating connector through the first ground connection member 351. Therefore, the shielding force of the first ground contact 350 against the first RF contact 311 can be enhanced. For example, the first ground connection member 351 can be connected to the first ground connection member 253 of the first ground contact 250 of the board connector 200 according to the first embodiment.

[0130] The first ground connection member 351 may be positioned between the first RF contact and the second transmission contact 322 with reference to the first axial direction (X-axis direction). Accordingly, the first ground connection member 351 can shield between the first RF contact 311 and the transmission contact 320 with reference to the first axial direction (X-axis direction). In this case, the first ground connection member 351 may be positioned between the first RF contact 311 and the first-1 transmission contact 321a with reference to the first axial direction (X-axis direction). The first ground connection member 351 may be formed in a plate shape arranged in the vertical direction. In this case, the first ground connection member 351 may be implemented to be arranged in the vertical direction through bending processing on a plate material.

[0131] The first ground mounting member 352 is mounted on the second substrate. The first ground mounting member 352 can be grounded by being mounted on the second substrate. Accordingly, the first ground contact 350 can be grounded to the second substrate through the first ground mounting member 352. The first ground mounting member 352 may protrude from the first ground connection member 351 along the second axial direction (Y-axis direction). The first ground mounting member 352 may be formed in a plate shape arranged in the horizontal direction.

[0132] The first ground contact 350 can include a first ground connection member 353.

[0133] The first ground connection member 353 is coupled to the first ground connection member 351. The first ground connection member 353 may protrude from the first ground connection member 351 along the second axial direction (Y-axis direction). The first ground connection member 353 may be formed in a plate shape arranged in the horizontal direction.

[0134] On the other hand, the first ground connection member 353 is mounted on the second substrate. The first ground connection member 353 can be grounded by being mounted on the second substrate. Accordingly, the first ground contact 350 can be grounded to the second substrate through the first ground mounting member 352.

[0135] The first ground contact 350 may include a first connection arm 354.

[0136] The first connection arm 354 is for connecting to the ground contact of the mating connector. The first connection arm 354 can be elastically moved by being connected to the ground contact of the mating connector. Accordingly, the first ground contact 350 can be firmly maintained in a state of being connected to the ground contact of the mating connector by utilizing the elastic force or restoring force of the first connection arm 354, so that the connection stability with respect to the ground contact of the mating connector can be improved. Therefore, since the board connector 300 according to the second embodiment can strengthen the connection force with respect to the mating connector by utilizing the first connection arm 354, the shielding performance through the connection with the ground contact of the mating connector can be further strengthened. For example, as illustrated in FIG. 14, the first connection arm 354 can be connected to a first shielding member 251 included in the first ground contact 250 of the board connector 200 according to the first embodiment. In this case, the first connection arm 354 can press the first shielding member 251 by utilizing the restoring force by being pushed by the first shielding member 251 and elastically moving.

[0137] Referring to FIGS. 13 to 16, the first connection arm 354 can be elastically movably coupled to the first ground connection member 353. When the first connection arm 354 is connected to the ground contact of the mating connector, the first connection arm 354 can rotate with reference to the portion coupled to the first ground connection member 353. Also, the first connection arm 354 can protrude from the first ground connection member 353 along the first axial direction (X-axis direction). In this case, the included angle between the first connection arm 354 and the first ground connection member 353 can be coupled to the first ground connection member 353 so as to form an obtuse angle. For example, the first connection arm 354 and the first ground connection member 353 can be formed to extend in different directions from each other. The first connection arm 354 can be formed in a plate shape disposed in the horizontal direction.

[0138] The first ground contact 350 may include the first connection protrusion 355.

[0139] The first connection protrusion 355 is connected to the ground contact of the board connector 200 according to the first embodiment. The first connection protrusion 355 may protrude from the first ground connection member 351. The first connection protrusion 355 may be connected to the ground contact of the mating connector. In this case, the first connection protrusion 355 and the first connection arm 354 may be respectively connected to the ground contact of the mating connector at different positions. Accordingly, the first ground contact 350 is connected to the ground contact of the mating connector at a plurality of locations, so that the distance to the position where the electromagnetic wave or the like is grounded to the board can be shortened. Therefore, the board connector 300 according to the second embodiment can further enhance the shielding performance by quickly grounding the electromagnetic wave or the like through the first ground contact 350.

[0140] For example, referring to FIGS. 14 to 16, the first connection arm 354 of the first ground contact 350 can be connected to the first shielding member 251 of the first ground contact 250 of the board connector 200 according to the first embodiment. The first connection protrusion 355 of the first ground contact 350 can be connected to the first ground connection member 253 of the first ground contact 250 of the board connector 200 according to the first embodiment. In this case, electromagnetic waves or the like generated at the portion where the first connection arm 354 and the first ground contact 250 are connected can be grounded at the shortest distance through the first ground connection member 353 mounted on the second substrate. Electromagnetic waves or the like generated at the portion where the first connection protrusion 355 and the first ground connection member 253 are connected can be grounded at the shortest distance through the first ground mounting member 254 mounted on the first substrate. Accordingly, the board connector 1 can further enhance the shielding performance by enabling the electromagnetic waves or the like to be quickly grounded through the first ground contact 250 of the board connector 200 according to the first embodiment and the first ground contact 350 of the board connector 300 according to the second embodiment.

[0141] As described above, the first connection arm 354 and the first connection protrusion 355 can be respectively connected to the ground contacts of the counterpart connector at different positions. Accordingly, by increasing the number of connection points between the ground contacts 250 and 350, the distance for grounding the electromagnetic waves or the like can be realized at the shortest distance. Therefore, the board connector 1 can further enhance the shielding performance by quickly grounding the electromagnetic waves or the like.

[0142] Thus, the board connector 300 according to the second embodiment can implement a first ground loop (350a, shown in FIG. 12) for the first RF contact 311 by using the first ground contact 350 and the ground housing 330. Therefore, the board connector 300 according to the second embodiment can implement complete shielding for the first RF contact 311 by further enhancing the shielding performance for the first RF contact 311 by using the first ground loop 350a.

[0143] The second ground contact 360 may include at least one of a second ground connection member 361, a second ground mounting member 362, a second ground connecting member 363, a second connecting arm 364, and a second connecting protrusion 365. In this case, since the second ground connection member 361, the second ground mounting member 362, the second ground connecting member 363, the second connecting arm 364, and the second connecting protrusion 365 can be implemented to substantially correspond to the first ground connection member 351, the first ground mounting member 352, the first ground connecting member 353, the first connecting arm 354, and the first connecting protrusion 355, respectively, a detailed description thereof will be omitted.

[0144] The second ground contact 360 and the first ground contact 350 may be formed in the same form as each other. Accordingly, the substrate connector 300 according to the second embodiment can improve the ease of manufacturing operations for manufacturing the second ground contact 360 and the first ground contact 350 respectively. In this case, as illustrated in FIG. 12, the second ground contact 360 and the first ground contact 350 may be arranged to be point-symmetrical with respect to the symmetry point SP. The symmetry point SP is spaced the same distance from each of the side walls 330b and 330c of the ground housing 330 arranged at intervals with respect to the first axial direction (X-axis direction), and is spaced the same distance from each of the side walls 330d and 330e of the ground housing 330 arranged at intervals with respect to the second axial direction (Y-axis direction). Therefore, in the substrate connector 300 according to the second embodiment, since the second ground contact 360 and the first ground contact 350 are formed in the same form as each other and are embodied with only different arrangement directions, the ease of manufacturing operations for manufacturing the second ground contact 360 and the first ground contact 350 can be further improved. In this case, the second RF contact 312 and the first RF contact 311 may be arranged to be point-symmetrical with respect to the symmetry point SP.

[0145] On the other hand, as illustrated in FIGS. 12 and 13, the first connection arm 354 and the second connection arm 364 may be arranged to overlap along the first axial direction (X-axis direction). For example, the first connection arm 354 and the second connection arm 364 may be arranged to face each other along the first axial direction (X-axis direction). In this case, the first connection arm 354 and the second connection arm 364 may be arranged on the same line. Accordingly, the substrate connector 300 according to the second embodiment can embody the shielding force between the first RF contact 311 and the first transmission contact 321, and the shielding force between the second RF contact 312 and the second transmission contact 322, while miniaturizing by reducing the overall size with respect to the first axial direction (X-axis direction).

[0146] Referring to FIGS. 10 to 12, in the board connector 300 according to the second embodiment, the ground housing 330 can be embodied as follows.

[0147] The ground housing 330 can include a ground side wall 331, a ground upper wall 332, and a ground lower wall 333.

[0148] The ground side wall 331 faces the insulating portion 240. The ground side wall 331 can be arranged to face the inner space 330a. The ground side wall 331 can be arranged to surround all sides with respect to the inner space 330a.

[0149] The ground side wall 331 can be connected to the ground housing of the mating connector inserted into the inner space 330a. For example, as shown in FIG. 9, the ground side wall 331 can be connected to the ground inner wall 231 of the ground housing 230 of the board connector 200 according to the first embodiment. In this way, the board connector 300 according to the second embodiment can further enhance the shielding function through the connection between the ground housing 330 and the ground housing of the mating connector. Also, the board connector 300 according to the second embodiment can reduce electrical adverse effects such as crosstalk that may occur due to mutual capacitance or induction between adjacent terminals through the connection between the ground housing 330 and the ground housing of the mating connector. In this case, since the board connector 300 according to the second embodiment can secure a path for electromagnetic waves to flow into at least one ground of the second board and the first board, the EMI shielding performance can be further enhanced.

[0150] The grounding upper wall 332 is coupled to the grounding side wall 331. The grounding upper wall 332 can be coupled to one end of the grounding side wall 331. The grounding upper wall 332 can protrude from the grounding side wall 331 toward the inner space 330a side. The grounding upper wall 332 can be connected to the grounding housing of a mating connector inserted into the inner space 330a. Accordingly, in the substrate connector 300 according to the second embodiment, since the grounding upper wall 332 and the grounding side wall 331 are connected to the grounding housing of the mating connector, the shielding function can be further enhanced by increasing the contact area between the grounding housing 330 and the grounding housing of the mating connector. For example, as illustrated in FIG. 9, the grounding upper wall 332 can be connected to the grounding bottom 234 of the grounding housing 230 of the substrate connector 200 according to the first embodiment.

[0151] The grounding lower wall 333 is coupled to the grounding side wall 331. The grounding lower wall 333 can be coupled to the other end of the grounding side wall 331. The grounding lower wall 333 can protrude from the grounding side wall 331 to the opposite side of the inner space 330a. The grounding lower wall 333 can be disposed so as to surround all sides with respect to the grounding side wall 331. The grounding lower wall 333 and the grounding side wall 331 can be embodied as a shielding wall surrounding the side of the inner space 330a. The first RF contact 311 and the second RF contact 312 can be located in the inner space 330a surrounded by the shielding wall. Accordingly, the grounding housing 330 can implement a shielding function for the RF contact 310 by using the shielding wall. Therefore, the substrate connector 300 according to the second embodiment can contribute to further improving the EMI shielding performance and the EMC performance by using the shielding wall. The grounding lower wall 333 can be grounded by being mounted on the second substrate. In this case, the grounding housing 330 can be grounded through the grounding lower wall 333.

[0152] The grounding lower wall 333 and the grounding upper wall 332 may be formed in a plate shape arranged in the horizontal direction, and the grounding side wall 331 may be formed in a plate shape arranged in the vertical direction. The grounding lower wall 333, the grounding upper wall 332, and the grounding side wall 331 may be integrally formed.

[0153] Here, the grounding housing 330 can implement a shielding function for the first RF contact 311 together with the first grounding contact 350. The grounding housing 330 can implement a shielding function for the second RF contact 312 together with the second grounding contact 360.

[0154] In this case, as shown in FIG. 12, the grounding housing 330 may include a first shielding wall 330b, a second shielding wall 330c, a third shielding wall 330d, and a fourth shielding wall 330e. The first shielding wall 330b, the second shielding wall 330c, the third shielding wall 330d, and the fourth shielding wall 330e may be implemented by the grounding side wall 331, the grounding lower wall 333, and the grounding upper wall 332, respectively. The first shielding wall 330b and the second shielding wall 330c are arranged to face each other with respect to the first axial direction (X-axis direction). Between the first shielding wall 330b and the second shielding wall 330c with respect to the first axial direction (X-axis direction), the first RF contact 311 and the second RF contact 312 may be located. With respect to the first axial direction (X-axis direction), the first RF contact 311 may be located at a position where the distance from the first shielding wall 330b is shorter than the distance from the second shielding wall 330c. With respect to the first axial direction (X-axis direction), the second RF contact 312 may be located at a position where the distance from the second shielding wall 330c is shorter than the distance from the first shielding wall 330b. The third shielding wall 330d and the fourth shielding wall 330e are arranged to face each other with respect to the second axial direction (Y-axis direction). Between the third shielding wall 330d and the fourth shielding wall 330e with respect to the second axial direction (Y-axis direction), the first RF contact 311 and the second RF contact 312 may be located.

[0155] The first ground contact 350 may be disposed between the first RF contact 311 and the second transmission contact 322 with reference to the first axial direction (X-axis direction). Accordingly, the first RF contact 311 is located between the first shielding wall 330b and the first ground connection member 351 of the first ground contact 350 with reference to the first axial direction (X-axis direction), and may be located between the third shielding wall 330d and the first connection arm 354 of the first ground contact 350 with reference to the second axial direction (Y-axis direction). Therefore, the substrate connector 300 according to the second embodiment can enhance the shielding function for the first RF contact 311 by using the first ground contact 350, the first shielding wall 330b, and the third shielding wall 330d. The first ground contact 350, the first shielding wall 330b, and the third shielding wall 330d are disposed on four sides with reference to the first RF contact 311 to implement a shielding force against RF signals. In this case, the first ground contact 350, the first shielding wall 330b, and the third shielding wall 330d can implement the first ground loop (350a, shown in FIG. 12) with respect to the first RF contact 311. Therefore, the substrate connector 300 according to the second embodiment can implement complete shielding for the first RF contact 311 by further enhancing the shielding function for the first RF contact 311 by using the first ground loop 350a.

[0156] The second ground contact 360 may be disposed between the second RF contact 312 and the first transmission contact 321 with reference to the first axial direction (X-axis direction). Accordingly, the second RF contact 312 is located between the second shielding wall 330c and the second ground connection member 361 of the second ground contact 360 with reference to the first axial direction (X-axis direction), and may be located between the third shielding wall 330d and the second connection arm 364 of the second ground contact 360 with reference to the second axial direction (Y-axis direction). Therefore, the substrate connector 300 according to the second embodiment can enhance the shielding function for the second RF contact 312 by using the second ground contact 360, the second shielding wall 330c, and the fourth shielding wall 330e. The second ground contact 360, the second shielding wall 330c, and the fourth shielding wall 330e are disposed on four sides with reference to the second RF contact 312 to implement a shielding force against RF signals. In this case, the second ground contact 360, the second shielding wall 330c, and the fourth shielding wall 330e can implement the second ground loop (360a, shown in FIG. 12) with respect to the second RF contact 312. Therefore, the substrate connector 300 according to the second embodiment can implement complete shielding for the second RF contact 312 by further enhancing the shielding function for the second RF contact 312 by using the second ground loop 360a.

[0157] Referring to FIG. 11, in the substrate connector 300 according to the second embodiment, the insulating portion 340 may include a soldering inspection window 341.

[0158] The soldering inspection window 341 of the lead can be formed through the insulating portion 340. The soldering inspection window 341 can be used to inspect the state in which the RF mounting members 3111 and 3121 are mounted on the second substrate. In this case, the RF contact 310 can be coupled to the insulating portion 340 such that the RF mounting members 3111 and 3121 are positioned at the soldering inspection window 341. Accordingly, the RF mounting members 3111 and 3121 are not blocked by the insulating portion 340. Therefore, in a state where the substrate connector 300 according to the second embodiment is mounted on the second substrate, an operator can inspect the state in which the RF mounting members 3111 and 3121 are mounted on the second substrate through the soldering inspection window 341. Accordingly, the substrate connector 300 according to the second embodiment can improve the accuracy of the mounting operation of mounting the RF contact 310 including the RF mounting members 3111 and 3121 on the second substrate even when all of the RF contacts 310 are located inside the ground housing 330.

[0159] The insulating portion 340 may include a plurality of soldering inspection windows 341. In this case, the RF mounting members 3111 and 3121 can be positioned at different soldering inspection windows 341. The transmission mounting member 3201 may be positioned at a part of the soldering inspection windows 341. Therefore, in a state where the substrate connector 300 according to the second embodiment is mounted on the second substrate, an operator can inspect the state in which the RF mounting members 3111 and 3121 and the transmission mounting member 3201 are mounted on the second substrate through the soldering inspection windows 341. Accordingly, the substrate connector 300 according to the second embodiment can improve the accuracy of the operation of mounting the RF mounting members 3111 and 3121 and the transmission mounting member 3201 on the second substrate. The soldering inspection windows 341 can be formed through the insulating portion 340 at positions spaced apart from each other.

[0160] The present invention described above is not limited to the foregoing embodiments and the attached drawings, and it will be apparent to those having ordinary knowledge in the technical field to which the present invention pertains that various substitutions, modifications, and changes are possible without departing from the technical idea of the present invention.

Claims

1. A plurality of RF contacts provided for RF (Radio Frequency) signal transmission, including a first RF contact and a second RF contact; An insulating part that supports the RF contacts; A plurality of transmission contacts coupled to the insulating part; A ground housing coupled to the insulating part; A first ground contact coupled to the insulating part and shielding between the first RF contact and the plurality of transmission contacts; and A second ground contact coupled to the insulating part and shielding between the second RF contact and the plurality of transmission contacts, wherein each of the first ground contact and the second ground contact includes a connection arm that is elastically connected to a ground contact of a mating connector, characterized in that it is a printed circuit board connector.

2. The first ground contact includes a first ground connection member connected to a ground contact of the mating connector; and a first ground coupling member respectively coupled to the first ground connection member and the connection arm, characterized in that it is the printed circuit board connector according to Claim 1.

3. The connection arm is elastically moved with reference to a portion coupled to the first ground coupling member and is connected to the ground contact of the mating connector, characterized in that it is the printed circuit board connector according to Claim 2.

4. [[ID=1,7]]The first ground contact includes a first ground connection member connected to the ground contact of the mating connector; and a first ground coupling member respectively coupled to the first ground connection member and the connection arm, characterized in that it is the printed circuit board connector according to Claim 1.

5. The connection arm and the first ground coupling member are continuous at a predetermined angle with respect to each other, characterized in that it is the printed circuit board connector according to Claim 4.

6. The predetermined angle is an obtuse angle, characterized in that it is the printed circuit board connector according to Claim 5.

7. The first ground contact includes a first ground connection member connected to a ground contact of the mating connector; and a first connection protrusion formed to protrude on one surface of the first ground connection member, wherein the first ground connection member and the first connection protrusion are connected to the ground contact of the mating connector at different positions, characterized in that it is the printed circuit board connector according to Claim 1.

8. The first ground contact The substrate connector according to claim 7, characterized by comprising a first ground mounting member that is coupled to the first ground connection member and extends in one direction.

9. The ground contact of the mating connector includes a shielding member formed in a plate shape, The connection arm is The substrate connector according to claim 1, characterized in that it is pressed by the shielding member and is elastically connected to the shielding member.

10. The first ground contact includes a first ground connection member that is connected to the ground contact of the mating connector, The ground contact of the mating connector includes a ground connection member that is continuous with the shielding member, The substrate connector according to claim 9, characterized in that the first ground connection member is connected to the ground connection member when the connection arm is elastically connected to the shielding member.

11. The first ground contact is A first ground connection member connected to the ground contact of the mating connector; and A first connection protrusion protruding from one surface of the first ground connection member, The ground contact of the mating connector is The substrate connector according to claim 9, characterized by including a ground connection member that is continuous with the shielding member and is connected to the first ground connection member and the first connection protrusion respectively.

12. The ground connection member is A first portion that is continuous with the shielding member and extends in one direction; A second portion that extends in a different direction at a predetermined angle with respect to the first portion; and A third portion that extends in the one direction at a predetermined angle with respect to the second portion, The first ground connection member is connected to the third portion of the ground connection member, The substrate connector according to claim 11, characterized in that the first connection protrusion is connected to the second portion of the ground connection member.

13. The insulating portion is formed to have a length in the X-axis direction and a width in the Y-axis direction orthogonal to the X-axis direction, The substrate connector according to claim 1, characterized in that each side in the X-axis direction and each side in the Y-axis direction of the plurality of RF contacts and the plurality of transmission contacts are surrounded by the ground housing and are not exposed to the outside.

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