Light emitting device, display, photoelectric conversion device, electronic apparatus, and wearable device

Abstract

To provide a technique advantageous for preventing a reduction in infrared light receiving sensitivity.SOLUTION: A light emitting device includes: a display substrate that comprises a principal surface including a display area where a display element is arranged, and a peripheral area where an infrared emitting element and an infrared receiving element are arranged; and a translucent substrate that is arranged to cover the principal surface. The translucent substrate includes a first area overlapping the display area and a second area overlapping the peripheral area in an orthogonal projection on the principal surface. Recesses or openings having a thickness smaller than that of the first area, are provided in superimposition areas overlapping the infrared emitting element and the infrared receiving element in the second area on the orthogonal projection on the principal surface.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to a light-emitting device, a display device, a photoelectric conversion device, an electronic device, and a wearable device.

Background Art

[0002] A light-emitting device including a light-emitting layer containing an organic compound layer may be used in a wearable device such as a viewfinder of a camera, a head-mounted display, or smart glasses. In such a light-emitting device, it is conceivable to detect the user's line of sight and reflect the detected line-of-sight information in driving the light-emitting device. Patent Document 1 shows a light-emitting device in which an infrared light-emitting element that emits infrared light and a light-receiving element for detecting reflected light from the user's eyeball are arranged on a display substrate provided with an organic EL light-emitting element.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] Patent Document 1 shows that a counter substrate for protecting the display substrate is arranged so as to cover the infrared light-emitting element and the light-receiving element. Since part of the light emitted from the infrared light-emitting element and the reflected light from the user's eyeball is absorbed by passing through the counter substrate, there is a possibility that the light-receiving sensitivity of the infrared light decreases.

[0005] An object of the present invention is to provide a technique advantageous for suppressing a decrease in the light-receiving sensitivity of infrared light.

Means for Solving the Problems

[0006] In view of the above problems, a light-emitting device according to an embodiment of the present invention includes a display substrate having a main surface including a display region in which display elements are arranged and a peripheral region in which an infrared light-emitting element and an infrared light-receiving element are arranged, and a light-transmissive substrate arranged so as to cover the main surface. The light-transmissive substrate includes a first region overlapping the display region and a second region overlapping the peripheral region in a orthographic projection onto the main surface, and a concave portion or an opening having a thickness thinner than that of the first region is provided in a superimposed region of the second region that overlaps the infrared light-emitting element and the infrared light-receiving element in the orthographic projection onto the main surface.

Effect of the Invention

[0007] According to the present invention, it is possible to provide a technique advantageous for suppressing a decrease in the light reception sensitivity of infrared light.

Brief Description of the Drawings

[0008]

Figure 1

Figure 2

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Figure 13

Embodiments for Carrying Out the Invention

[0009] Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. Note that the following embodiments do not limit the invention according to the claims. Although a plurality of features are described in the embodiments, not all of these plurality of features are essential for the invention, and the plurality of features may be arbitrarily combined. Further, in the accompanying drawings, the same or similar configurations are denoted by the same reference numerals, and redundant descriptions are omitted.

[0010] With reference to FIGS. 1 to 4, a light-emitting device according to an embodiment of the present disclosure will be described. FIG. 1 is a diagram schematically showing a configuration example of the light-emitting device 600 of the present disclosure and a gaze detection operation. The light-emitting device 600 includes a display substrate 100 on which a display element 130, an infrared light-emitting element 170, and an infrared light-receiving element 180 are arranged on a main surface 101 (shown in FIGS. 2 and later). The display element 130 displays an image or the like by emitting display light DL. The infrared light-emitting element 170 emits infrared light IR to the eyeball E of an observer who is gazing at an image or the like displayed on the display element 130. An infrared light-receiving element 180 detects the reflected light of the infrared light IR emitted from the infrared light-emitting element 170, thereby obtaining an imaging image of the eyeball E. The gaze of the observer with respect to the display image is detected from the imaging image of the eyeball E obtained by imaging using the infrared light IR. Any known method can be applied to gaze detection using the imaging image of the eyeball E. As an example, a gaze detection method based on a Purkinje image by reflection of irradiation light on the cornea can be used. More specifically, gaze detection processing based on the pupil corneal reflection method is performed. Using the pupil corneal reflection method, a gaze vector representing the direction (rotation angle) of the eyeball is calculated based on the image of the pupil and the Purkinje image included in the imaging image of the eyeball E, thereby detecting the gaze of the observer.

[0011] Referring to FIG. 2, the light-emitting device 600 according to the present embodiment will be described in more detail. The upper side of FIG. 2 is a plan view showing a configuration example of the light-emitting device 600 in the present embodiment, and the lower side is a cross-sectional view between X and Y shown in the plan view.

[0012] The light-emitting device 600 includes a display substrate 100 having a main surface 101 including a display area DA in which a display element 130 is arranged and a peripheral area PA in which an infrared light-emitting element 170 and an infrared light-receiving element 180 are arranged, and a light-transmitting substrate 300 arranged so as to cover the main surface 101 of the display substrate 100. On the main surface 101 of the display substrate 100, terminals 150 for external connection and the like may be further arranged. A circuit board 400 such as a flexible printed circuit board can be joined to the terminal 150 via a joining member (not shown). The display substrate 100 and the light-transmitting substrate 300 are joined via a joining member 200 for joining the display substrate 100 and the light-transmitting substrate 300 such that the main surface 101 of the display substrate 100 faces the main surface 301 of the light-transmitting substrate 300. As shown in FIG. 2, in the orthographic projection onto the main surface 101 of the display substrate 100, the infrared light-emitting element 170 and the infrared light-receiving element 180 are arranged between the display element 130 and the joining member 200.

[0013] The display substrate 100 includes the display area DA and the peripheral area PA as described above. In the display area DA, semiconductor elements (not shown) such as a display element 130 and a transistor for driving the display element 130 are provided. In the peripheral area PA, a drive circuit (not shown) for operating the display element 130 arranged in the display area DA and a processing circuit such as a digital-analog conversion circuit (DAC) for processing the luminance signal input to the display element 130 are provided. Further, in the peripheral area PA, the above-described infrared light-emitting element 170, infrared light-receiving element 180, terminal 150, and joining member 200 may be arranged. A sealing layer for protecting the display element 130 from external damage, moisture, oxygen, etc. may be provided on the display element 130.

[0014] In the orthographic projection of the light-transmissive substrate 300 onto the main surface 101 of the display substrate 100, it includes a region FA overlapping the display region DA and a region SA overlapping the peripheral region PA. Further, in the overlapping region OA of the region SA of the light-transmissive substrate 300 that overlaps the infrared light-emitting element 170 and the infrared light-receiving element 180 in the orthographic projection onto the main surface 101 of the display substrate 100, a concave portion or an opening with a thickness thinner than that of the region FA is provided. In the configuration shown in FIG. 2, a concave portion 350 is provided in the overlapping region OA of the light-transmissive substrate 300.

[0015] For the light-transmissive substrate 300, an inorganic material having light-transmittance such as glass or quartz, or a plastic material having light-transmittance such as an acrylic resin is used. The concave portion 350 provided in the light-transmissive substrate 300 is dug in the thickness direction of the light-transmissive substrate 300 from the main surface 302 on the side opposite to the main surface 301 facing the display substrate 100 of the light-transmissive substrate 300. The concave portion 350 provided in the light-transmissive substrate 300 has a thickness of the light-transmissive substrate 300 thinner than that of a region other than the concave portion 350, for example, the region FA overlapping the display region DA. The thinner the thickness of the light-transmissive substrate 300 in the concave portion 350, the more the transmission amount of infrared light (infrared rays) increases, so that a decrease in the line-of-sight detection function can be suppressed. Therefore, for example, the thickness of the light-transmissive substrate 300 in the concave portion 350 may be less than or equal to half of the thickness of the region FA. On the other hand, if the thickness of the light-transmissive substrate 300 in the concave portion 350 becomes too thin, the light-transmissive substrate 300 may be damaged in the concave portion 350 due to internal pressure fluctuations in the sealed space surrounded by the coupling member 200. Therefore, for example, the thickness of the light-transmissive substrate 300 in the concave portion 350 may be 0.1 mm or more. For example, when the thickness of the light-transmissive substrate 300 other than the concave portion 350 such as the region FA is 0.8 mm, the thickness of the light-transmissive substrate 300 in the concave portion 350 may be 0.1 mm or more and 0.4 mm or less.

[0016] Here, as shown in FIG. 2, in the orthographic projection onto the main surface 101 of the display substrate 100, the recess 350 provided in the overlapping region OA that overlaps with the infrared light-emitting element 170 in the overlapping region OA may be larger than the infrared light-emitting element 170. Similarly, in the orthographic projection onto the main surface 101 of the display substrate 100, the recess 350 provided in the overlapping region OA that overlaps with the infrared light-receiving element 180 in the overlapping region OA may be larger than the infrared light-receiving element 180. Thereby, as shown in FIG. 1, it is possible to suppress light rays inclined from the normal direction of the main surface 101 of the display substrate 100 from passing through the light-transmissive substrate 300 other than the recess 350. Also, in the configuration shown in the cross-sectional view of FIG. 2, the recess 350 is provided on the main surface 302 of the light-transmissive substrate 300, but it may be provided on the main surface 301.

[0017] In the configuration shown in FIG. 2, the display area DA has a substantially rectangular shape. The diagonal length of the display area DA may be, for example, 5 mm to 50 mm. As shown in FIG. 2, the infrared light-emitting elements 170 may be arranged in five regions along three sides of the outer periphery of the display area DA, and the infrared light-receiving elements 180 may be arranged along one side of the outer periphery of the display area DA where the infrared light-emitting elements 170 are not arranged. Even if the region where the infrared light-emitting elements 170 are arranged is only one place, it is possible to have a line-of-sight detection function. On the other hand, the more the regions where the infrared light-emitting elements 170 are arranged are increased, the greater the total intensity of the infrared light becomes, and the observer's eyeball E can be irradiated with infrared light from various angles. Therefore, for example, it is possible to suppress the infrared light from being blocked by the observer's eyelashes and the line-of-sight detection function from deteriorating.

[0018] For the coupling member 200, for example, an ultraviolet curable or thermosetting acrylic resin, epoxy resin, or the like can be used. In the orthographic projection onto the main surface 101 of the display substrate 100, the coupling member 200 is arranged so as not to overlap with the infrared light emitting element 170 and the infrared light receiving element 180. Thereby, the loss of infrared light when the infrared light passes through the coupling member 200 can be suppressed. More specifically, when the coupling member 200 contains an inorganic filler for the purpose of keeping the distance between the display substrate 100 and the light transmissive substrate 300 constant or for other desired purposes, the transmission of infrared light may be inhibited by the spacer or the inorganic filler. Therefore, the coupling member 200 may be arranged so as not to cover the infrared light emitting element 170 and the infrared light receiving element 180.

[0019] As shown in FIG. 2, when various optical films 303 such as a wavelength plate and a polarizing plate are arranged on the main surface 301 of the light transmissive substrate 300, it is conceivable. The optical film 303 may be arranged on the main surface 302 of the light transmissive substrate 300. In that case, the optical film 303 can be arranged so as not to cover the concave portion 350. Thereby, the loss of infrared light caused by the optical film 303 can be suppressed.

[0020] As described above, in the present embodiment, in the overlapping region OA overlapping with the infrared light emitting element 170 and the infrared light receiving element 180, the concave portion 350 is provided in the light transmissive substrate 300. Thereby, the loss of infrared light when passing through the light transmissive substrate 300 can be reduced. As a result, it is possible to suppress a decrease in the light reception sensitivity of the infrared light for line-of-sight detection, and it is possible to suppress a decrease in the line-of-sight detection function.

[0021] FIG. 3 is a diagram showing a modified example of the light emitting device 600 shown in FIG. 2. In the light emitting device 600 shown in FIG. 3, compared with the configuration shown in FIG. 2, an opening 360 penetrating from the main surface 301 to the main surface 302 of the light transmissive substrate 300 is provided in the light transmissive substrate 300 instead of the concave portion 350. Further, a resin member 250 is arranged in the light emitting device 600 shown in FIG. 3. Since the other configurations may be the same as those shown in FIG. 2, the description will focus on the differences.

[0022] In the configuration shown in FIG. 3, in the overlapping region OA that overlaps the infrared light-emitting element 170 and the infrared light-receiving element 180 in the orthographic projection of the region SA that overlaps the peripheral region PA of the light-transmissive substrate 300 with respect to the main surface 101 of the display substrate 100, an opening 360 is provided. Since the light-transmissive substrate 300 is open above the infrared light-emitting element 170 and above the infrared light-receiving element 180, the loss of infrared light due to the light-transmissive substrate 300 is eliminated. Thereby, compared with the configuration shown in FIG. 2, a decrease in the light-receiving sensitivity of the infrared light for line-of-sight detection can be further suppressed.

[0023] Here, similar to the configuration shown in FIG. 2, in the orthographic projection with respect to the main surface 101 of the display substrate 100, the opening 360 provided in the overlapping region OA that overlaps the infrared light-emitting element 170 in the overlapping region OA may be larger than the infrared light-emitting element 170. Further, in the orthographic projection with respect to the main surface 101 of the display substrate 100, the opening 360 provided in the overlapping region OA that overlaps the infrared light-receiving element 180 in the overlapping region OA may be larger than the infrared light-receiving element 180. Thereby, as shown in FIG. 1, it is possible to suppress infrared light inclined from the normal direction of the main surface 101 of the display substrate 100 from entering the light-transmissive substrate 300.

[0024] On the other hand, there is a possibility that foreign matter may enter from the outside through the opening 360 provided in the light-transmissive substrate 300 and adhere to the display region DA, thereby degrading the display quality of the light-emitting device 600. Therefore, in the present embodiment, in the orthographic projection with respect to the main surface 101 of the display substrate 100, a resin member 250 is disposed between the opening 360 and the display region DA (display element 130) and between the display substrate 100 and the light-transmissive substrate 300. Thereby, it is possible to suppress foreign matter that has entered through the opening 360 from entering the display region DA.

[0025] For the resin member 250, any resin such as an acrylic resin or an epoxy resin can be used. For example, the resin member 250 may be formed using the same material as the coupling member 200. Thereby, it becomes possible to form the coupling member 200 and the resin member 250 in the same process, and an increase in the manufacturing process for manufacturing the light-emitting device 600 can be suppressed.

[0026] In the orthographic projection onto the main surface 101 of the display substrate 100, the resin member 250 is arranged so as not to overlap with the infrared light-emitting element 170 and the infrared light-receiving element 180. Thereby, loss of infrared light when the infrared light passes through the resin member 250 can be suppressed. Also, in that case, the resin member 250 may contain a resin added with particles such as aluminum oxide that exhibit a high reflectance in the near-infrared region. Thereby, among the infrared light emitted from the infrared light-emitting element 170, the infrared light that is greatly inclined from the normal direction of the main surface 101 of the display substrate 100 is reflected by the resin member 250, and the efficiency of extracting it in the normal direction of the main surface 101 of the display substrate 100 is increased.

[0027] Also, for example, a case where the resin member 250 is formed of a material with a high transmittance of infrared light such as a translucent resin can be considered. In that case, an infrared reflection layer (not shown) for reflecting infrared light may be arranged on at least the surface of the resin member 250 that faces the opening 360 in the orthographic projection onto the main surface 101 of the display substrate 100. Thereby, the infrared light emitted from the infrared light-emitting element 170 can be efficiently extracted in the normal direction of the main surface 101 of the display substrate 100. As the infrared reflection layer, for example, a metal layer using aluminum, silver, etc., or a layer containing white particles such as aluminum oxide that exhibit a high reflectance in the near-infrared region as described above can be used. When the infrared reflection layer is a metal layer, the film thickness may be about 0.3 μm to 1 μm, and for example, it can be formed using a sputtering method. Also, a similar infrared reflection layer may be arranged on the inner wall of the opening 360 of the translucent substrate 300. Thereby, the infrared light emitted from the infrared light-emitting element 170 can be more efficiently extracted in the normal direction of the main surface 101 of the display substrate 100.

[0028] A gap (not shown) may be provided between the resin member 250 and the translucent substrate 300. In other words, in at least a part of the resin member 250, the resin member 250 does not have to be in contact with the translucent substrate 300. By providing the gap, when heat is applied to the light-emitting device 600, stress can be generated due to the difference in the coefficient of thermal expansion between the translucent substrate 300 and the display substrate 100, and damage to the resin member 250 can be suppressed. However, when the gap becomes wide, foreign matter easily enters the display area DA. Even when foreign matter smaller than the pixel size arranged in the display element 130 adheres to the display area DA, since it does not significantly affect the display quality, the size of the gap may be equal to or smaller than the size of the pixels arranged in the display element 130. The gap may be, for example, 10 μm or less.

[0029] In the plan view of FIG. 3, an example of forming the resin member 250 along the four outer sides of the display area DA is shown. The resin member 250 may continuously or intermittently surround the display area DA in the orthographic projection onto the main surface 101 of the display substrate 100. Further, for example, when the resin member 250 is formed using a translucent resin, the resin member 250 may be formed so as to cover the entire surface of the display area DA. Even in that case, by forming the resin member 250 so as not to cover the infrared light-emitting element 170 and the infrared light-receiving element 180, loss of infrared light can be suppressed.

[0030] Also, in the configuration shown in FIG. 3, as shown in FIG. 2, a case where various optical films 303 are arranged on at least one of the main surface 301 and the main surface 302 of the translucent substrate 300 can be considered. In that case, the optical film 303 can be arranged so as not to cover the opening 360. Thereby, loss of infrared light due to the optical film 303 can be suppressed.

[0031] As described above, in the present embodiment, in the overlapping region OA that overlaps with the infrared light emitting element 170 and the infrared light receiving element 180, the light transmissive substrate 300 is provided with the opening 360. Thereby, the loss of infrared light can be reduced compared to the configuration in which the concave portion 350 shown in FIG. 2 is arranged. As a result, it is possible to suppress a decrease in the light reception sensitivity of the infrared light for line-of-sight detection, and it is possible to suppress a decrease in the line-of-sight detection function.

[0032] FIG. 4 is a diagram showing a modified example of the light emitting device 600 shown in FIGS. 2 and 3. In the light emitting device 600 shown in FIG. 3, in the orthographic projection onto the main surface 101 of the display substrate 100, compared to the configuration shown in FIGS. 2 and 3, the light transmissive substrate 300 covers the display region DA (display element 130) and does not cover the region of the peripheral region PA where the infrared light emitting element 170 and the infrared light receiving element 180 are arranged. More specifically, in the orthographic projection onto the main surface 101 of the display substrate 100, the outer edge of the light transmissive substrate 300 is arranged between the display region DA (display element 130) and the infrared light emitting element 170 and between the display region DA (display element 130) and the infrared light receiving element 180. Since other configurations may be the same as those shown in FIGS. 2 and 3, the description will focus on the differences.

[0033] In the light emitting device 600 shown in FIG. 4, the coupling member 200 is arranged along the outer periphery of the display region DA, and the display substrate 100 and the light transmissive substrate 300 are coupled. The light transmissive substrate 300 does not cover the infrared light emitting element 170 and the infrared light receiving element 180. Therefore, in the orthographic projection onto the main surface 101 of the display substrate 100, the coupling member 200 is arranged between the display region DA (display element 130) and the infrared light emitting element 170 and between the display region DA (display element 130) and the infrared light receiving element 180. As a result, the outer edge of the light transmissive substrate 300 is arranged between the outer edge of the coupling member 200 and the region of the peripheral region PA where the infrared light emitting element 170 and the infrared light receiving element 180 are arranged.

[0034] In the configuration shown in FIG. 4, an infrared reflection layer (not shown) may be disposed on a side surface located at the outer edge of at least one of the light-transmissive substrate 300 and the coupling member 200. The infrared reflection layer may have the same configuration as the above-described infrared reflection layer. Further, for example, the coupling member 200 may contain a resin added with particles such as aluminum oxide that exhibits a high reflectance in the near-infrared region. Thereby, components of the infrared light emitted from the infrared light-emitting element 170 that travel in the directions of the light-transmissive substrate 300 and the coupling member 200 can be efficiently extracted in the direction normal to the main surface 101 of the display substrate 100.

[0035] As described above, in the present embodiment, the light-transmissive substrate 300 is not disposed in the region overlapping with the infrared light-emitting element 170 and the infrared light-receiving element 180. Therefore, almost no loss of infrared light due to the light-transmissive substrate 300 occurs. As a result, it is possible to suppress a decrease in the light-receiving sensitivity of the infrared light for line-of-sight detection, and it is possible to suppress a decrease in the line-of-sight detection function.

[0036] Next, a method for manufacturing the light-emitting device 600 will be described. Here, as an example, a method for manufacturing the light-emitting device 600 in a case where each of the pixels disposed in the display element 130 includes a light-emitting element such as an organic electroluminescence (EL) element, and the light-emitting device 600 is a so-called organic EL light-emitting device will be described.

[0037] The display substrate 100 may be a semiconductor substrate such as single-crystalline silicon. Semiconductor elements are formed on the display substrate 100. The semiconductor elements are, for example, transistors, diodes, etc., and at least a part of them may be disposed inside the display substrate. An insulating layer is provided on the semiconductor elements. The insulating layer may include silicon oxide, silicon nitride, silicon carbide, etc. However, the material used for the insulating layer is not limited to these, and any appropriate dielectric material may be used. Here, since silicon oxynitride has oxygen and silicon as main elements, it may be regarded as a kind of silicon oxide. Also, since silicon oxynitride and silicon carbonitride have nitrogen and silicon as main elements, they may be regarded as a kind of silicon nitride.

[0038] On the insulating layer, a wiring layer including a wiring pattern extending along the main surface 101 of the display substrate 100 and terminals 150 are disposed, using a conductive material such as aluminum or copper. The wiring layer including the wiring pattern may be a single layer or a multilayer of two or more layers. Further, on the insulating layer, plugs for electrically connecting the wiring pattern, semiconductor elements, and terminals 150 are disposed. When a plurality of wiring layers including the wiring pattern are provided, the plugs may electrically connect between the wiring patterns disposed in the respective wiring layers. The terminals 150 may be formed simultaneously when forming the wiring pattern. It can also be said that at least a part of the terminals 150 and the wiring pattern are disposed in the same wiring layer.

[0039] In the display area DA of the display substrate 100, display elements 130 are disposed. For example, in FIG. 1, the display elements 130 are drawn integrally, but a plurality of pixels each including an organic EL light-emitting element are disposed, and each pixel emits light at an arbitrary luminance. The display elements 130 are electrically connected to semiconductor elements. The organic EL light-emitting element may have a lower electrode, an organic compound layer including a light-emitting layer, and an upper electrode in this order. The light emitted from the organic EL light-emitting element may be any color, or may emit white light. Further, different colors may be emitted for each pixel. On the display element 130, a sealing layer for suppressing the intrusion of moisture, oxygen, etc. is formed, and a color filter layer, a lens structure, etc. may be appropriately provided on the sealing layer.

[0040] In the peripheral area PA of the display substrate 100, infrared light-emitting elements 170 are formed in a plurality of areas. In FIG. 1, the infrared light-emitting elements 170 are depicted integrally, but one infrared light-emitting element 170 may be composed of a plurality of light-emitting elements, and each may emit light with an arbitrary luminance. The infrared light-emitting element 170 is not particularly limited as long as it has an infrared light-emitting element capable of emitting infrared light, and may have, for example, an organic light-emitting element or an LED element. If the infrared light-emitting element 170 is an organic light-emitting element, there is a possibility that the organic EL light-emitting element arranged in the display element 130 and the infrared light-emitting element 170 can be manufactured in the same process, and the number of manufacturing steps can be suppressed. When the infrared light-emitting element 170 is an organic light-emitting element, it may have a lower electrode, an organic compound layer including a light-emitting layer, and an upper electrode in this order, similar to the display element 130.

[0041] A plurality of infrared light-receiving elements 180 are formed in the peripheral area PA of the display substrate 100. In FIG. 1, the infrared light-receiving elements 180 are depicted integrally, but one infrared light-receiving element 180 may be composed of a plurality of light-receiving elements. The infrared light-receiving element 180 only needs to have a photoelectric conversion element having sensitivity in the infrared region. For the infrared light-receiving element 180, for example, a photodiode, an organic photoelectric conversion element, an inorganic photoelectric conversion element, etc. may be used.

[0042] For the light-transmissive substrate 300, inorganic materials such as glass and quartz, and organic materials such as plastics like acrylic plates are used. When the light-transmissive substrate 300 is glass or quartz, the concave portion 350 and the opening 360 can be formed by etching. Also, when the light-transmissive substrate 300 is plastic, the concave portion 350 and the opening 360 may be formed by cutting, or the light-transmissive substrate 300 provided with the concave portion 350 and the opening 360 may be directly formed by mold molding.

[0043] A light-transmissive substrate 300, which has recesses 350 and openings 360 formed in advance, is coupled to the display substrate 100 via a coupling member 200. As the coupling member 200, an ultraviolet-curable acrylic resin or epoxy resin can be used. A circuit board 400 is electrically joined onto the terminal 150 via a joining member. The circuit board 400 may be a wiring board such as a rigid board or a flexible board, or may be a drive circuit chip for operating the display element 130. For example, the circuit board 400 is a flexible wiring board such as a glass epoxy board or a polyimide film provided with a wiring pattern. As the joining member, an anisotropic conductive film (ACF) or the like can be used. The ACF contains conductive particles, and the conductive particles are sandwiched between the terminal 150 of the display substrate 100 and the electrode of the circuit board 400 and are pressure-bonded, whereby the terminal 150 of the display substrate 100 and the electrode of the circuit board 400 are electrically connected. When the display substrate 100 is connected to an external power supply, a control device, or the like via the circuit board 400, the light-emitting device 600 can operate. Including the above steps, a light-emitting device 600 that functions as the light-emitting device of the present embodiment is manufactured.

[0044] Here, application examples in which the light-emitting device 600 of the present embodiment is applied to an image forming device, a display device, a photoelectric conversion device, an electronic device, a lighting device, a moving body, and a wearable device will be described with reference to FIGS. 5(a), 5(b) to FIGS. 13(a), 13(b). It will be described that organic light-emitting elements such as organic EL elements using an organic light-emitting material are arranged in the pixels arranged in the display element 130 of the display substrate 100 of the light-emitting device 600. First, after showing the details of each configuration arranged in the pixels arranged in the display element 130 of the display substrate 100 of the above-described light-emitting device 600, application examples will be described.

[0045] Configuration of Organic Light-Emitting Element An organic light-emitting device is provided by forming an insulating layer, a first electrode, an organic compound layer, and a second electrode on a substrate. A protective layer, a color filter, a microlens, etc. may be provided on the cathode. When a color filter is provided, a planarization layer may be provided between the protective layer and the color filter. The planarization layer can be configured using an acrylic resin or the like. The same applies when a planarization layer is provided between the color filter and the microlens.

[0046] Substrate Examples of the substrate include quartz, glass, silicon wafers, resins, metals, etc. Also, the substrate may be provided with switching elements such as transistors and wiring patterns, and an insulating layer may be provided thereon. The material of the insulating layer is not limited as long as contact holes can be formed so that wiring patterns can be formed between the first electrode and the substrate, and insulation from non-connected wiring patterns can be ensured. For example, resins such as polyimide, silicon oxide, silicon nitride, etc. may be used for the insulating layer.

[0047] Electrode As the electrodes, a pair of electrodes can be used. The pair of electrodes may be an anode and a cathode. When an electric field is applied in the light-emitting direction of the organic light-emitting device, the electrode with a higher potential is the anode, and the other is the cathode. Also, it can be said that the electrode that supplies holes to the light-emitting layer is the anode, and the electrode that supplies electrons is the cathode.

[0048] As the constituent material of the anode, a material with a large work function may be selected. For example, simple metals such as gold, platinum, silver, copper, nickel, palladium, cobalt, selenium, vanadium, tungsten, etc., mixtures containing these, alloys combined with these, and metal oxides such as tin oxide, zinc oxide, indium oxide, indium tin oxide (ITO), indium zinc oxide, etc. can be used. Also, conductive polymers such as polyaniline, polypyrrole, polythiophene, etc. can be used as the constituent material of the anode.

[0049] These electrode materials may be used alone or in combination of two or more. Also, the anode may be composed of a single layer or multiple layers.

[0050] When using the electrode as a reflective electrode, for example, chromium, aluminum, silver, titanium, tungsten, molybdenum, or alloys thereof, or those obtained by laminating these can be used. With the above materials, it is also possible to function as a reflective film without having the role of an electrode. When using a transparent electrode as the electrode, an oxide transparent conductive layer such as indium tin oxide (ITO) or indium zinc oxide can be used, but it is not limited thereto. For the formation of the electrode, photolithography technology can be used.

[0051] On the other hand, as a constituent material of the cathode, a material with a small work function may be selected. For example, alkali metals such as lithium, alkaline earth metals such as calcium, simple metals such as aluminum, titanium, manganese, silver, lead, chromium, and mixtures containing these can be mentioned. Alternatively, alloys combining these simple metals can also be used. For example, magnesium-silver, aluminum-lithium, aluminum-magnesium, silver-copper, zinc-silver, etc. can be used. The use of metal oxides such as indium tin oxide (ITO) is also possible. These electrode materials may be used alone or in combination of two or more. Also, the cathode may have a single-layer structure or a multi-layer structure. As the cathode, silver may be used, and to reduce the aggregation of silver, it may be a silver alloy. As long as the aggregation of silver can be reduced, the ratio of the alloy does not matter. For example, silver: other metals may be 1:1, 3:1, etc.

[0052] The cathode may be a top-emission element using an oxide conductive layer such as ITO, or a bottom-emission element using a reflective electrode such as aluminum (Al), and is not particularly limited. The method for forming the cathode is not particularly limited, but when using a DC or AC sputtering method, etc., the coverage of the formed film is good and the resistance of the cathode can be reduced.

[0053] Pixel isolation layer The pixel isolation layer may be formed of a so-called silicon oxide such as silicon nitride (SiN), silicon oxynitride (SiON), or silicon oxide (SiO) formed using a chemical vapor deposition (CVD) method. In order to increase the in-plane resistance of the organic compound layer, the film thickness of the organic compound layer, particularly the hole transport layer, may be formed thinner on the sidewalls of the pixel isolation layer. Specifically, by increasing the taper angle of the sidewalls of the pixel isolation layer and the film thickness of the pixel isolation layer, and increasing the peeling during evaporation, the film thickness of the organic processed layer on the sidewalls can be made thinner.

[0054] On the other hand, the sidewall taper angle and the film thickness of the pixel isolation layer can be adjusted so that no voids are formed in the protective layer formed thereon. By preventing voids from being formed in the protective layer, the occurrence of defects in the protective layer can be reduced. Since the occurrence of defects in the protective layer is reduced, a decrease in reliability such as the occurrence of dark spots and poor conduction of the second electrode can be reduced.

[0055] According to the present embodiment, even if the taper angle of the sidewalls of the pixel isolation layer is not steep, it is possible to effectively suppress charge leakage to adjacent pixels. As a result of this study, it was found that sufficient reduction can be achieved if the taper angle is in the range of 60 degrees or more and 90 degrees or less. The film thickness of the pixel isolation layer may be from 10 nm to 150 nm. Further, the same effect can be obtained even when the pixel electrode is composed only of a pixel electrode without a pixel isolation layer. However, in this case, the film thickness of the pixel electrode should be less than half of the organic layer, or the end of the pixel electrode should be a forward taper of less than 60° to reduce the short circuit of the organic light-emitting element.

[0056] Also, when the first electrode is a cathode and the second electrode is an anode, a high color gamut and low voltage driving can be achieved by forming an electron transporting material and a charge transporting layer, and a light emitting layer on the charge transporting layer.

[0057] Organic compound layer The organic compound layer may be formed as a single layer or as multiple layers. When there are multiple layers, depending on their functions, they may be referred to as a hole injection layer, a hole transport layer, an electron blocking layer, a light-emitting layer, a hole blocking layer, an electron transport layer, an electron injection layer, etc. The organic compound layer is mainly composed of organic compounds, but may also contain inorganic atoms or inorganic compounds. The organic compound layer may have, for example, copper, lithium, magnesium, aluminum, iridium, platinum, molybdenum, zinc, etc. The organic compound layer may be disposed between the first electrode and the second electrode, or may be disposed in contact with the first electrode and the second electrode.

[0058] Protective layer A protective layer may be provided on the cathode. For example, by adhering glass provided with a moisture absorbent on the cathode, the intrusion of moisture, etc. into the organic compound layer can be reduced, and the occurrence of display defects can be reduced. Also, as another embodiment, a passivation layer such as silicon nitride may be provided on the cathode to reduce the intrusion of moisture, etc. into the organic compound layer. For example, after forming the cathode, it is transported to another chamber without breaking the vacuum, and silicon nitride with a thickness of 2 μm is formed by the CVD method, which may also serve as a protective layer. After forming the protective layer using the CVD method, a protective layer using the atomic layer deposition (ALD) method may be provided. The material of the protective layer by the ALD method is not limited, but may be silicon nitride, silicon oxide, aluminum oxide, etc. Silicon nitride may be further formed by the CVD method on the protective layer formed by the ALD method. The protective layer formed by the ALD method may have a smaller film thickness than the protective layer formed by the CVD method. Specifically, the film thickness of the protective layer formed by the ALD method may be 50% or less, and further 10% or less of the film thickness of the protective layer formed by the CVD method.

[0059] Color filter A color filter may be provided on the protective layer. For example, a color filter considering the size of the organic light-emitting element may be provided on another substrate, and the substrate on which the color filter is formed and the substrate on which the organic light-emitting element is provided may be bonded together. Also, for example, a color filter may be patterned on the above-described protective layer using photolithography technology. The color filter may be composed of a polymer.

[0060] Planarization layer A planarization layer may be disposed between the color filter and the protective layer. The planarization layer is provided for the purpose of reducing the unevenness of the layer below the planarization layer. Without limiting the purpose, it may sometimes be called a material resin layer. The planarization layer may be composed of an organic compound, and may be a low molecule or a high molecule. Considering the reduction of unevenness, a high-molecular organic compound may be used for the planarization layer.

[0061] The planarization layer may be provided above and below the color filter. In that case, the constituent materials of the respective planarization layers may be the same or different. Specifically, polyvinylcarbazole resin, polycarbonate resin, polyester resin, ABS resin, acrylic resin, polyimide resin, phenol resin, epoxy resin, silicon resin, urea resin, etc. can be mentioned as materials for the planarization layer.

[0062] Micro lens The organic light-emitting device may have an optical member such as a micro lens on its light-emitting side. The micro lens can be composed of an acrylic resin, an epoxy resin, etc. The micro lens may be for the purpose of increasing the amount of light extracted from the organic light-emitting device and controlling the direction of the extracted light. The micro lens may have a hemispherical shape. When having a hemispherical shape, among the tangents in contact with the hemisphere, there is a tangent parallel to the insulating layer, and the contact point between the tangent and the hemisphere is the apex of the micro lens. The apex of the micro lens can be determined in the same way in any cross-sectional view. That is, among the tangents in contact with the semi-circle of the micro lens in the cross-sectional view, there is a tangent parallel to the insulating layer, and the contact point between the tangent and the semi-circle is the apex of the micro lens.

[0063] Also, the midpoint of the microlens can be defined. In the cross-section of the microlens, a line segment from the point where the arc shape ends to the point where another arc shape ends can be imagined, and the midpoint of this line segment can be called the midpoint of the microlens. The cross-section for discriminating the vertex and the midpoint may be a cross-section perpendicular to the insulating layer.

[0064] The microlens has a first surface with a convex portion and a second surface opposite to the first surface. The second surface can be arranged closer to the functional layer (light-emitting layer) side than the first surface. To adopt such a configuration, it is necessary to form a microlens on the light-emitting device. When the functional layer is an organic layer, processes that become high temperature in the manufacturing process of the microlens may be avoided. Also, when the configuration is such that the second surface is arranged closer to the functional layer side than the first surface, the glass transition temperatures of all the organic compounds constituting the organic layer may be 100 °C or higher, and for example, it is suitable that they are 130 °C or higher.

[0065] Counter substrate A counter substrate may be arranged on the planarization layer. Since the counter substrate is provided at a position corresponding to the aforementioned substrate, it is called a counter substrate. The constituent material of the counter substrate may be the same as that of the aforementioned substrate. The counter substrate may be a second substrate when the aforementioned substrate is taken as the first substrate.

[0066] Organic layer The organic compound layers (hole injection layer, hole transport layer, electron blocking layer, light-emitting layer, hole blocking layer, electron transport layer, electron injection layer, etc.) constituting the organic light-emitting element according to the embodiment of the present disclosure may be formed by the methods shown below.

[0067] For the organic compound layers constituting the organic light-emitting element according to the embodiment of the present disclosure, dry processes such as vacuum evaporation, ionization evaporation, sputtering, and plasma can be used. Also, instead of the dry process, a wet process of dissolving in an appropriate solvent and forming a layer by a known coating method (for example, spin coating, dipping, casting method, LB method, inkjet method, etc.) can also be used.

[0068] When a layer is formed by a vacuum deposition method, a solution coating method, or the like, crystallization and the like hardly occur, and the stability over time is excellent. Further, when forming a film by a coating method, a film can also be formed in combination with an appropriate binder resin.

[0069] Examples of the binder resin include, but are not limited to, polyvinyl carbazole resin, polycarbonate resin, polyester resin, ABS resin, acrylic resin, polyimide resin, phenol resin, epoxy resin, silicone resin, urea resin, and the like.

[0070] Further, these binder resins may be used alone as a homopolymer or a copolymer, or two or more of them may be mixed and used. Furthermore, additives such as known plasticizers, antioxidants, and ultraviolet absorbers may be used in combination as necessary.

[0071] Pixel circuit The light-emitting device may include a pixel circuit connected to the light-emitting element. The pixel circuit may be an active matrix type that independently controls the light emission of the first light-emitting element and the second light-emitting element. The active matrix type circuit may be voltage programming or current programming. The driving circuit has a pixel circuit for each pixel. The pixel circuit may include a light-emitting element, a transistor that controls the light emission luminance of the light-emitting element, a transistor that controls the light emission timing, a capacitor that holds the gate voltage of the transistor that controls the light emission luminance, and a transistor for connecting to GND without passing through the light-emitting element.

[0072] The light-emitting device includes a display area and a peripheral area disposed around the display area. The display area has a pixel circuit, and the peripheral area has a display control circuit. The mobility of the transistors constituting the pixel circuit may be smaller than the mobility of the transistors constituting the display control circuit.

[0073] The slope of the current-voltage characteristic of the transistor constituting the pixel circuit may be smaller than the slope of the current-voltage characteristic of the transistor constituting the display control circuit. The slope of the current-voltage characteristic can be measured by so-called Vg-Ig characteristics.

[0074] The transistor constituting the pixel circuit is a transistor connected to a light-emitting element such as a first light-emitting element.

[0075] Pixel The organic light-emitting device has a plurality of pixels. The pixels have sub-pixels that emit different colors from each other. The sub-pixels may each have an emission color of RGB, for example.

[0076] Light is emitted from a region called a pixel aperture. The pixel aperture may be 15 μm or less and may be 5 μm or more. More specifically, it may be 11 μm, 9.5 μm, 7.4 μm, 6.4 μm, etc.

[0077] The interval between sub-pixels may be 10 μm or less, and specifically may be 8 μm, 7.4 μm, 6.4 μm.

[0078] The pixel can take a known arrangement form in a plan view. For example, it may be a stripe arrangement, a delta arrangement, a pentile arrangement, or a Bayer arrangement. The shape of the sub-pixel in the plan view may take any known shape. For example, it may be a rectangle, a quadrilateral such as a rhombus, a hexagon, etc. Of course, if it is not an exact figure but a shape close to a rectangle, it is included in the rectangle. The shape of the sub-pixel and the pixel arrangement can be used in combination.

[0079] Use of the organic light-emitting element according to the embodiment of the present disclosure The organic light-emitting element according to the embodiment of the present disclosure can be used as a component of a display device or a lighting device. In addition, there are applications such as an exposure light source of an electrophotographic image forming device, a backlight of a liquid crystal display device, and a light-emitting device having a color filter for a white light source.

[0080] The display device may be an image information processing device having an image input unit that inputs image information from an area CCD, a linear CCD, a memory card, etc., an information processing unit that processes the input information, and a display unit that displays the input image.

[0081] Also, the display unit of an imaging device or an inkjet printer may have a touch panel function. The driving method of this touch panel function may be an infrared method, a capacitance method, a resistive film method, or an electromagnetic induction method, and is not particularly limited. Also, the display device may be used for the display unit of a multifunction printer.

[0082] Next, further explanation will be given with reference to the drawings. Fig. 5(a) is an example of a pixel arranged in the display element 130 of the display substrate 100 of the light emitting device 600. The pixel has a sub-pixel 810 (pixel). The sub-pixel is divided into 810R, 810G, and 810B by its light emission. The emission color may be distinguished by the wavelength emitted from the light emitting layer, or the light emitted from the sub-pixel may be selectively transmitted or color-converted by a color filter or the like. Each sub-pixel has a reflective electrode 802 which is a first electrode on the interlayer insulating layer 801, an insulating layer 803 covering the end of the reflective electrode 802, an organic compound layer 804 covering the first electrode and the insulating layer, a transparent electrode 805 which is a second electrode, a protective layer 806, and a color filter 807.

[0083] A transistor or a capacitor element may be arranged in the lower layer or inside the interlayer insulating layer 801. The transistor and the first electrode may be electrically connected via a contact hole (not shown).

[0084] The insulating layer 803 may also be called a bank or a pixel isolation film. The insulating layer 803 covers the end of the first electrode and is arranged surrounding the first electrode. The portion of the first electrode where the insulating layer 803 is not arranged is in contact with the organic compound layer 804 and becomes the light emitting region.

[0085] The organic compound layer 804 includes a hole injection layer 841, a hole transport layer 842, a first light-emitting layer 843, a second light-emitting layer 844, and an electron transport layer 845.

[0086] The second electrode may be a transparent electrode, a reflective electrode, or a semi-transmissive electrode.

[0087] The protective layer 806 reduces the penetration of moisture into the organic compound layer. Although the protective layer is shown as a single layer, it may be a plurality of layers. Each layer may be an inorganic compound layer or an organic compound layer.

[0088] The color filter 807 is divided into 807R, 807G, and 807B according to its color. The color filter may be formed on a planarization film (not shown). Also, a resin protective layer (not shown) may be disposed on the color filter. Further, the color filter may be formed on the protective layer 806. Additionally, the color filter may be bonded after being provided on a counter substrate such as a glass substrate.

[0089] The display device 800 (corresponding to the above-described light-emitting device 600) in FIG. 5(b) describes an organic light-emitting element 826 and a TFT 818 as an example of a transistor. A substrate 811 such as glass or silicon and an insulating layer 812 are provided on the substrate. Active elements such as the TFT 818 are arranged on the insulating layer, and a gate electrode 813, a gate insulating film 814, and a semiconductor layer 815 of the active element are arranged. The TFT 818 is further composed of a semiconductor layer 815, a drain electrode 816, and a source electrode 817. An insulating film 819 is provided on the TFT 818. The anode 821 constituting the organic light-emitting element 826 and the source electrode 817 are connected through a contact hole 820 provided in the insulating film.

[0090] The method of electrical connection between the electrodes (anode, cathode) included in the organic light-emitting element 826 and the electrodes (source electrode, drain electrode) included in the TFT is not limited to the mode shown in FIG. 5(b). That is, it is sufficient that either one of the anode or the cathode is electrically connected to either one of the TFT source electrode or the drain electrode. TFT refers to a thin-film transistor.

[0091] In the display device 800 of FIG. 5(b), the organic compound layer is illustrated as if it were a single layer, but the organic compound layer 822 may be a plurality of layers. On the cathode 823, a first protective layer 824 and a second protective layer 825 for reducing the deterioration of the organic light-emitting element are provided.

[0092] In the display device 800 of FIG. 5(b), a transistor is used as the switching element, but other switching elements may be used instead.

[0093] Further, the transistor used in the display device 800 of FIG. 5(b) is not limited to a transistor using a single-crystalline silicon wafer, and may also be a thin-film transistor having an active layer on an insulating surface of a substrate. Examples of the active layer include non-single-crystalline silicon such as single-crystalline silicon, amorphous silicon, and microcrystalline silicon, and non-single-crystalline oxide semiconductors such as indium zinc oxide and indium gallium zinc oxide. Note that the thin-film transistor is also called a TFT element.

[0094] The transistor included in the display device 800 of FIG. 5(b) may be formed in a substrate such as a silicon substrate. Here, forming in the substrate means manufacturing a transistor by processing the substrate itself such as a silicon substrate. That is, having a transistor in the substrate can also be regarded as the substrate and the transistor being integrally formed.

[0095] The organic light-emitting device according to this embodiment has its emission luminance controlled by a TFT, which is an example of a switching device, and an image can be displayed according to the emission luminance of each organic light-emitting device by providing a plurality of organic light-emitting devices in a plane. Here, the switching device according to this embodiment is not limited to a TFT, and may be a transistor formed of low-temperature polysilicon, or an active matrix driver formed on a substrate such as a silicon substrate. "On the substrate" can also mean inside the substrate. Whether to provide a transistor inside the substrate or use a TFT is selected according to the size of the display unit. For example, if the size is about 0.5 inches, an organic light-emitting device may be provided on the silicon substrate.

[0096] Figs. 6(a) to 6(c) are schematic diagrams showing an example of an image forming apparatus using the light-emitting apparatus 600 of this embodiment. The image forming apparatus 926 shown in Fig. 6(a) includes a photoreceptor 927, an exposure light source 928, a developing unit 931, a charging unit 930, a transferrer 932, a conveying unit 933 (a conveying roller in the configuration of Fig. 6(a)), and a fixing unit 935.

[0097] Light 929 is irradiated from the exposure light source 928, and an electrostatic latent image is formed on the surface of the photoreceptor 927. The light-emitting apparatus 600 can be applied to this exposure light source 928. The developing unit 931 may include toner or the like as a developer and function as a developing device that applies the developer to the exposed photoreceptor 927. The charging unit 930 charges the photoreceptor 927. The transferrer 932 transfers the developed image to the recording medium 934. The conveying unit 933 conveys the recording medium 934. The recording medium 934 can be, for example, paper or film. The fixing unit 935 fixes the image formed on the recording medium.

[0098] Figs. 6(b) and 6(c) are schematic diagrams showing a state in which a plurality of light-emitting portions 936 are arranged along the longitudinal direction on a long substrate for the exposure light source 928. The light-emitting apparatus 600 can be applied to this light-emitting portion 936. That is, a plurality of pixels are arranged along the longitudinal direction of the substrate. The direction 937 is a direction parallel to the axis of the photoreceptor 927. This column direction is the same as the direction of the axis when the photoreceptor 927 rotates. This direction 937 can also be called the major axis direction of the photoreceptor 927.

[0099] FIG. 6(b) shows a form in which the light-emitting unit 936 is arranged along the major axis direction of the photoreceptor 927. FIG. 6(c) is a modified example of the arrangement of the light-emitting unit 936 shown in FIG. 6(b), and is a form in which the light-emitting units 936 are alternately arranged in the column direction in each of the first column and the second column. In the first column and the second column, the light-emitting units 936 are arranged at different positions in the row direction. In the first column, a plurality of light-emitting units 936 are arranged at intervals, and in the second column, the light-emitting units 936 are arranged at positions corresponding to the gaps between the light-emitting units 936 in the first column. Also, in the row direction, a plurality of light-emitting units 936 are arranged at intervals. The arrangement of the light-emitting units 936 shown in FIG. 6(c) can be described as, for example, a state of being arranged in a grid pattern, a state of being arranged in a staggered grid, or a checkered pattern.

[0100] FIG. 7 is a schematic diagram showing an example of a display device using the light-emitting device 600 of the present embodiment. The display device 1000 may include a touch panel 1003, a display panel 1005, a frame 1006, a circuit board 1007, and a battery 1008 between an upper cover 1001 and a lower cover 1009. The touch panel 1003 and the display panel 1005 are connected to flexible printed circuits FPC 1002 and 1004. Active elements such as transistors are arranged on the circuit board 1007. The battery 1008 may not be provided if the display device 1000 is not a portable device, or even if it is a portable device, it does not need to be provided at this position. The light-emitting device 600 can be applied to the display panel 1005. The pixels arranged in the light-emitting device 600 functioning as the display panel 1005 are connected to and operate with active elements such as transistors arranged on the circuit board 1007.

[0101] The display device 1000 shown in FIG. 7 may be used in a display unit of a photoelectric conversion device (which may also be called an imaging device) having an optical unit with a plurality of lenses and an imaging element that receives the light passing through the optical unit and performs photoelectric conversion into an electrical signal. The photoelectric conversion device may have a display unit that displays the information acquired by the imaging element. Further, the display unit may be a display unit exposed to the outside of the photoelectric conversion device or a display unit disposed in the viewfinder. The photoelectric conversion device may be a digital camera or a digital video camera.

[0102] FIG. 8 is a schematic diagram showing an example of a photoelectric conversion device using the light-emitting device 600 of the present embodiment. The photoelectric conversion device 1100 may include a viewfinder 1101, a rear display 1102, an operation unit 1103, and a housing 1104. The photoelectric conversion device 1100 may also be called an imaging device. The light-emitting device 600 of the present embodiment can be applied to the viewfinder 1101 and the rear display 1102 which are display units. In this case, the light-emitting device 600 may display not only the image to be captured but also environmental information, imaging instructions, etc. The environmental information may include the intensity of external light, the direction of external light, the moving speed of the subject, the possibility that the subject is shielded by an obstacle, etc.

[0103] Since the timing suitable for imaging is often a very short time, it is better to display the information as soon as possible. Therefore, the light-emitting device 600 including pixels in which light-emitting elements using organic light-emitting materials such as organic EL elements are arranged may be used for the viewfinder 1101 and the rear display 1102. This is because the organic light-emitting material has a high response speed. The light-emitting device 600 using the organic light-emitting material is more suitable for these devices where a high display speed is required than a liquid crystal display device.

[0104] The photoelectric conversion device 1100 has an optical unit (not shown). The optical unit has a plurality of lenses and forms an image on a photoelectric conversion element (not shown) housed in the housing 1104 that receives the light passing through the optical unit. The plurality of lenses can adjust the focus by adjusting their relative positions. This operation can also be performed automatically.

[0105] The light-emitting device 600 may be applied to the display unit of an electronic device. In that case, it may have both a display function and an operation function. Examples of the portable terminal include mobile phones such as smartphones, tablets, and head-mounted displays.

[0106] FIG. 9 is a schematic diagram showing an example of an electronic device using the light-emitting device 600 of the present embodiment. The electronic device 1200 includes a display unit 1201, an operation unit 1202, and a housing 1203. The housing 1203 may have a circuit, a printed circuit board having the circuit, a battery, and a communication unit. The operation unit 1202 may be a button or a reaction unit of a touch panel method. The operation unit 1202 may be a biometric recognition unit that recognizes a fingerprint and performs unlocking or the like. A portable device having a communication unit can also be called a communication device. The light-emitting device 600 of the present embodiment can be applied to the display unit 1201.

[0107] FIGS. 10(a) and 10(b) are schematic diagrams showing an example of a display device using the light-emitting device 600 of the present embodiment. FIG. 10(a) is a display device such as a TV monitor or a PC monitor. The display device 1300 has a frame 1301 and a display unit 1302. The light-emitting device 600 of the present embodiment can be applied to the display unit 1302. The display device 1300 may have a base 1303 that supports the frame 1301 and the display unit 1302. The base 1303 is not limited to the form of FIG. 10(a). For example, the lower side of the frame 1301 may also serve as the base 1303. Further, the frame 1301 and the display unit 1302 may be curved. The radius of curvature may be 5000 mm or more and 6000 mm or less.

[0108] FIG. 10(b) is a schematic diagram showing another example of a display device using the light-emitting device 600 of the present embodiment. The display device 1310 in FIG. 10(b) is configured to be foldable and is a so-called foldable display device. The display device 1310 includes a first display unit 1311, a second display unit 1312, a housing 1313, and a bending point 1314. The light-emitting device 600 of the present embodiment can be applied to the first display unit 1311 and the second display unit 1312. The first display unit 1311 and the second display unit 1312 may be a single seamless display device. The first display unit 1311 and the second display unit 1312 can be separated at the bending point. The first display unit 1311 and the second display unit 1312 may display different images, or may display one image together.

[0109] FIG. 11 is a schematic diagram showing an example of an illumination device using the light-emitting device 600 of the present embodiment. The illumination device 1400 may include a housing 1401, a light source 1402, a circuit board 1403, an optical film 1404, and a light diffusing portion 1405. The light-emitting device 600 of the present embodiment can be applied to the light source 1402. The optical film 1404 may be a filter that improves the color rendering property of the light source. The light diffusing portion 1405 can effectively diffuse the light of the light source, such as lighting up, and deliver the light to a wide range. If necessary, a cover may be provided on the outermost side. The illumination device 1400 may have both the optical film 1404 and the light diffusing portion 1405, or may have only one of them.

[0110] The lighting device 1400 is, for example, a device for lighting an interior. The lighting device 1400 may emit any color from white, warm white, to other colors from blue to red. It may have a dimming circuit for dimming them. The lighting device 1400 may have a power supply circuit connected to a light emitting device 600 that functions as a light source 1402. The power supply circuit is a circuit that converts an AC voltage into a DC voltage. Also, white has a color temperature of 4200K and warm white has a color temperature of 5000K. Further, the lighting device 1400 may have a color filter. Also, the lighting device 1400 may have a heat dissipation part. The heat dissipation part releases the heat inside the device to the outside of the device, and examples include metals with high specific heat and liquid silicone.

[0111] FIG. 12 is a schematic diagram of an automobile having a tail lamp which is an example of a vehicle lamp using the light emitting device 600 of the present embodiment. The automobile 1500 has a tail lamp 1501, and when a brake operation or the like is performed, the tail lamp 1501 may be lit. The light emitting device 600 of the present embodiment may be used as a head lamp as a vehicle lamp. An automobile is an example of a moving body, and the moving body may be a ship, a drone, an aircraft, a railway vehicle, an industrial robot, or the like. The moving body may have a body and a lamp provided thereon. The lamp may inform the current position of the body.

[0112] The light emitting device 600 of the present embodiment can be applied to the tail lamp 1501. The tail lamp 1501 may have a protective member that protects the light emitting device 600 that functions as the tail lamp 1501. The protective member has a certain degree of strength and may be made of any material as long as it is transparent, and may be made of polycarbonate or the like. Also, the protective member may be mixed with a phthalic acid derivative, an acrylonitrile derivative, or the like in polycarbonate.

[0113] Automobile 1500 may have a vehicle body 1503 and a window 1502 attached thereto. The window may be a window for checking the front and rear of the automobile, or may be a transparent display such as a head-up display. The light-emitting device 600 of the present embodiment may be used for the transparent display. In this case, constituent materials such as electrodes included in the light-emitting device 600 are formed of transparent members.

[0114] With reference to FIGS. 13(a) and 13(b), a further application example of the light-emitting device 600 of the present embodiment will be described. The light-emitting device 600 can be applied to a system that can be worn as a wearable device such as smart glasses, a head-mounted display (HMD), or smart contacts. The imaging display device used in such an application example has an imaging device capable of photoelectrically converting visible light and a light-emitting device capable of emitting visible light.

[0115] FIG. 13(a) illustrates glasses 1600 (smart glasses) according to one application example. An imaging device 1602 such as a CMOS sensor or a SPAD is provided on the front surface side of the lens 1601 of the glasses 1600. Further, the light-emitting device 600 of the present embodiment is provided on the back surface side of the lens 1601.

[0116] The glasses 1600 further include a control device 1603. The control device 1603 functions as a power source that supplies power to the imaging device 1602 and the light-emitting device 600 according to each embodiment. Further, the control device 1603 controls the operations of the imaging device 1602 and the light-emitting device 600. An optical system for condensing light onto the imaging device 1602 is formed in the lens 1601.

[0117] FIG. 13(b) illustrates glasses 1610 (smart glasses) according to one application example. The glasses 1610 have a control device 1612, and the control device 1612 is equipped with an imaging device corresponding to the imaging device 1602 and a light emitting device 600. In the lens 1611, an optical system for projecting light emitted from the imaging device in the control device 1612 and the light emitting device 600 is formed, and an image is projected onto the lens 1611. The control device 1612 functions as a power source for supplying power to the imaging device and the light emitting device 600, and controls the operations of the imaging device and the light emitting device 600. The control device 1612 may have a line-of-sight detection unit for detecting the wearer's line of sight. Infrared rays may be used for line-of-sight detection. The infrared light emitting unit emits infrared light to the eyeball of the user who is gazing at the display image. An imaging image of the eyeball is obtained by detecting the reflected light of the emitted infrared light from the eyeball by an imaging unit having a light receiving element. By having a reducing means for reducing the light from the infrared light emitting unit to the display unit in a plan view, a decrease in image quality is reduced.

[0118] The user's line of sight with respect to the display image is detected from the imaging image of the eyeball obtained by imaging infrared light. Any known method can be applied to the line-of-sight detection using the imaging image of the eyeball. As an example, a line-of-sight detection method based on the Purkinje image by reflection of irradiation light on the cornea can be used.

[0119] More specifically, a line-of-sight detection process based on the pupil corneal reflection method is performed. Using the pupil corneal reflection method, a line-of-sight vector representing the orientation (rotation angle) of the eyeball is calculated based on the image of the pupil and the Purkinje image included in the imaging image of the eyeball, whereby the user's line of sight is detected.

[0120] The light emitting device 600 according to the embodiment of the present disclosure may have an imaging device having a light receiving element, and may control the display image based on the user's line-of-sight information from the imaging device.

[0121] Specifically, the light-emitting device 600 determines a first visual field region that the user is gazing at and a second visual field region outside the first visual field region based on the gaze information. The first visual field region and the second visual field region may be determined by the control device of the light-emitting device 600, or the light-emitting device 600 may receive those determined by an external control device. In the display region of the light-emitting device 600, the display resolution of the first visual field region may be controlled to be higher than that of the second visual field region. That is, the resolution of the second visual field region may be made lower than that of the first visual field region.

[0122] Further, the display region has a first display region and a second display region different from the first display region, and based on the gaze information, a region with a higher priority is determined from the first display region and the second display region. The first display region and the second display region may be determined by the control device of the light-emitting device 600, or the light-emitting device 600 may receive those determined by an external control device. The resolution of the region with a higher priority may be controlled to be higher than that of the region other than the region with a higher priority. That is, the resolution of the region with a relatively lower priority may be made lower.

[0123] Note that AI may be used to determine the first visual field region or the region with a higher priority. AI may be a model configured to estimate the angle of the line of sight and the distance to the object at the tip of the line of sight from an image of the eyeball using the image of the eyeball and the direction in which the eyeball in the image is actually looking as teacher data. The AI program may be possessed by the light-emitting device 600, the imaging device, or an external device. When it is possessed by an external device, it is transmitted to the light-emitting device 600 via communication.

[0124] When performing display control based on visual recognition detection, it can be applied to smart glasses that further include an imaging device for imaging the outside. The smart glasses can display the captured external information in real time.

[0125] The disclosure of this specification includes the following light-emitting devices, photoelectric conversion devices, and electronic devices.

[0126] (Item 1) A light-emitting device including a display substrate having a display area on which elements are arranged and a main surface including a peripheral area on which an infrared light-emitting element and an infrared light-receiving element are arranged, and a translucent substrate arranged to cover the main surface, In a orthographic projection onto the main surface, the translucent substrate includes a first area overlapping the display area and a second area overlapping the peripheral area, The light-emitting device is characterized in that a concave portion or an opening having a thickness thinner than that of the first area is provided in a superimposed area of the second area that overlaps the infrared light-emitting element and the infrared light-receiving element in the orthographic projection onto the main surface.

[0127] (Item 2) The light-emitting device further includes a coupling member for coupling the display substrate and the translucent substrate, In the orthographic projection onto the main surface, the coupling member does not overlap the infrared light-emitting element and the infrared light-receiving element. The light-emitting device according to Item 1.

[0128] (Item 3) In the orthographic projection onto the main surface, the infrared light-emitting element and the infrared light-receiving element are arranged between the display element and the coupling member. The light-emitting device according to Item 2.

[0129] (Item 4) An optical film is arranged on at least one of the two main surfaces of the translucent substrate, The optical film does not cover the concave portion or the opening. The light-emitting device according to any one of Items 1 to 3.

[0130] (Item 5) In the orthographic projection onto the main surface, The concave portion or the opening provided in the superimposed area of the superimposed area that overlaps the infrared light-emitting element is larger than the infrared light-emitting element, The light-emitting device according to any one of Items 1 to 4, wherein the concave portion or the opening provided in the overlapping region that overlaps the infrared light-receiving element in the overlapping region is larger than the infrared light-receiving element.

[0131] (Item 6) A concave portion is provided in the overlapping region, The light-emitting device according to any one of Items 1 to 5, wherein the thickness of the concave portion is equal to or less than half of the thickness of the first region.

[0132] (Item 7) The light-emitting device according to Item 6, wherein the thickness of the concave portion is 0.1 mm or more.

[0133] (Item 8) An opening is provided in the overlapping region, The light-emitting device according to any one of Items 1 to 7, wherein in a front projection onto the main surface, a resin member is disposed between the opening and the display element and between the display substrate and the light-transmissive substrate.

[0134] (Item 9) The light-emitting device according to Item 8, wherein in a front projection onto the main surface, the resin member does not overlap the infrared light-emitting element and the infrared light-receiving element.

[0135] (Item 10) The light-emitting device according to Item 8 or 9, wherein an infrared reflection layer is disposed on at least the surface of the resin member that faces the opening in a front projection onto the main surface.

[0136] (Item 11) The light-emitting device according to Item 10, wherein the infrared reflection layer is a metal layer or a layer containing aluminum oxide.

[0137] (Item 12) The light-emitting device according to any one of Items 8 to 11, wherein the resin member contains a resin to which aluminum oxide particles are added.

[0138] (Item 13) The light-emitting device according to any one of Items 8 to 12, wherein a gap is provided between the resin member and the translucent substrate.

[0139] (Item 14) A light-emitting device including a display substrate having a main surface including a display area where a display element is disposed and a peripheral area where an infrared light-emitting element and an infrared light-receiving element are disposed, and a translucent substrate disposed so as to cover the main surface, In a orthographic projection onto the main surface, the translucent substrate covers the display area and does not cover an area of the peripheral area where the infrared light-emitting element and the infrared light-receiving element are disposed.

[0140] (Item 15) In a orthographic projection onto the main surface, an outer edge of the translucent substrate is disposed between the display area and the infrared light-emitting element and between the display area and the infrared light-receiving element. The light-emitting device according to Item 14.

[0141] (Item 16) The light-emitting device further includes a coupling member for coupling the display substrate and the translucent substrate, In a orthographic projection onto the main surface, the coupling member is disposed between the display area and the infrared light-emitting element and between the display area and the infrared light-receiving element. The light-emitting device according to Item 14 or 15.

[0142] (Item 17) An infrared reflection layer is disposed on a side surface located at an outer edge of at least one of the translucent substrate and the coupling member. The light-emitting device according to Item 16.

[0143] (Item 18) A display device comprising: a light-emitting device according to any one of items 1 to 17; and an active element connected to the light-emitting device.

[0144] (Item 19) An optoelectronic conversion device comprising: an optical unit having a plurality of lenses; an imaging element that receives light that has passed through the optical unit; and a display unit that displays an image. The display unit displays an image captured by the imaging element and includes a light-emitting device according to any one of items 1 to 17.

[0145] (Item 20) An electronic device comprising: a housing provided with a display unit; and a communication unit provided in the housing and communicating with the outside. The display unit includes a light-emitting device according to any one of items 1 to 17.

[0146] (Item 21) A wearable device having a display device for displaying an image, The display device includes a light-emitting device according to any one of items 1 to 17.

[0147] The invention is not limited to the above embodiments, and various changes and modifications can be made without departing from the spirit and scope of the invention. Therefore, the claims are attached to disclose the scope of the invention.

Description of Reference Numerals

[0148] 100: Display substrate, 101: Main surface, 130: Display element, 170: Infrared light-emitting element, 180: Infrared light-receiving element, 300: Translucent substrate, 350: Concave portion, 360: Opening, DA: Display area, FA, SA: Area, OA: Overlap area, PA: Peripheral area

Claims

1. A light-emitting device including: a display substrate having a main surface including a display region where a display element is arranged and a peripheral region where an infrared light-emitting element and an infrared light-receiving element are arranged; and a light-transmitting substrate arranged so as to cover the main surface, the light-transmitting substrate includes a first region overlapping the display region and a second region overlapping the peripheral region in orthogonal projection onto the main surface; A light-emitting device characterized in that a recess or opening having a thickness thinner than that of the first region is provided in an overlapping region of the second region that overlaps the infrared light-emitting element and the infrared light-receiving element in an orthogonal projection onto the main surface.

2. a connecting member for connecting the display substrate and the light-transmitting substrate; 2. The light emitting device according to claim 1, wherein the coupling member does not overlap the infrared light emitting element and the infrared light receiving element in orthogonal projection onto the main surface.

3. 3. The light emitting device according to claim 2, wherein, in an orthogonal projection onto the main surface, the infrared light emitting element and the infrared light receiving element are disposed between the display element and the connecting member.

4. an optical film is disposed on at least one of the two main surfaces of the light-transmitting substrate; The light emitting device according to claim 1 , wherein the optical film does not cover the recess or the opening.

5. In the orthogonal projection onto the principal surface, the recess or the opening provided in the overlapping region that overlaps the infrared light emitting element is larger than the infrared light emitting element, 2. The light emitting device according to claim 1, wherein the recess or the opening provided in the overlapping region that overlaps the infrared receiving element is larger than the infrared receiving element.

6. A recess is provided in the overlapping region, 2. The light emitting device according to claim 1, wherein the thickness of the recess is equal to or less than half the thickness of the first region.

7. 7. The light emitting device according to claim 6, wherein the recess has a thickness of 0.1 mm or more.

8. An opening is provided in the overlapping region, 2. The light emitting device according to claim 1, wherein a resin member is disposed between the opening and the display element and between the display substrate and the light-transmitting substrate in an orthogonal projection onto the main surface.

9. 9. The light emitting device according to claim 8, wherein the resin member does not overlap the infrared light emitting element and the infrared light receiving element in orthogonal projection onto the main surface.

10. 9. The light emitting device according to claim 8, wherein an infrared reflective layer is disposed on at least a surface of the resin member that faces the opening in orthogonal projection onto the main surface.

11. 11. The light-emitting device according to claim 10, wherein the infrared reflective layer is a metal layer or a layer containing aluminum oxide.

12. 9. The light emitting device according to claim 8, wherein the resin member includes a resin to which aluminum oxide particles are added.

13. 9. The light emitting device according to claim 8, wherein a gap is provided between the resin member and the light-transmitting substrate.

14. A light-emitting device including: a display substrate having a main surface including a display region where a display element is arranged and a peripheral region where an infrared light-emitting element and an infrared light-receiving element are arranged; and a light-transmitting substrate arranged so as to cover the main surface, In an orthogonal projection onto the main surface, the light-transmitting substrate covers the display area and does not cover an area of the peripheral area in which the infrared light-emitting element and the infrared light-receiving element are arranged.

15. 15. The light emitting device according to claim 14, wherein, in orthogonal projection onto the main surface, an outer edge of the light-transmitting substrate is disposed between the display area and the infrared light emitting element and between the display area and the infrared light receiving element.

16. a connecting member for connecting the display substrate and the light-transmitting substrate; 15. The light emitting device according to claim 14, wherein, in an orthogonal projection onto the main surface, the coupling member is disposed between the display area and the infrared light emitting element and between the display area and the infrared light receiving element.

17. 17. The light emitting device according to claim 16, wherein an infrared reflective layer is disposed on a side surface located at an outer edge of at least one of the light transmissive substrate and the coupling member.

18. A display device comprising: a light-emitting device according to claim 1; and an active element connected to the light-emitting device.

19. an optical unit having a plurality of lenses, an image sensor that receives light that has passed through the optical unit, and a display unit that displays an image; A photoelectric conversion device, wherein the display section displays an image captured by the imaging element, and the photoelectric conversion device comprises the light-emitting device according to claim 1 .

20. A display unit is provided in the housing, and a communication unit is provided in the housing and communicates with an external device.

18. An electronic device, wherein the display unit comprises the light-emitting device according to claim 1.

21. A wearable device having a display device for displaying an image, A wearable device, wherein the display device comprises the light-emitting device according to claim 1 .

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