System, substrate processing device, substrate processing method and goods producing method

Abstract

To provide an advantageous technique for drying ink on a substrate.SOLUTION: The system includes a first unit that moves at least one of an ink supply unit and a substrate for scanning the ink supply unit in a first direction along the main surface of the substrate to supply ink to the main surface of the substrate, and a second unit that dries the ink disposed on the main surface of the substrate. The second unit includes a container that defines an internal space into which the substrate is transported, and a cover that is disposed inside the container so as to face the main surface of the substrate transported inside the container. The cover is configured to define a plurality of slits that communicate a first space on the substrate side of the cover with a second space on the opposite side of the cover from the substrate. When viewed in a direction perpendicular to the main surface, at least two of the plurality of slits intersect an imaginary line extending parallel to the first direction.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present disclosure relates to substrate processing.

Background Art

[0002] When manufacturing an article such as a panel (organic EL panel) having an OLED (Organic Light Emitting Diode) which is an organic EL (Electro Luminescence) element, a method of disposing a solution film on a substrate by applying a solution using an inkjet coating device to a desired location on the substrate is known. The solution film is a film composed of a solution (ink) containing a solute and a solvent. By drying the solution film disposed on the substrate, a film (layer) is formed on the substrate. For drying the solution film, a vacuum drying device which is a substrate processing device is used.

[0003] In order to stably form a film from the solution film applied on the substrate, it is preferable to dry the solution film in a short time while consistently managing the process time, environment, etc. of each of the ink application process, conveyance process, and drying process.

[0004] Patent Document 1 discloses a drying chamber including a mask having a plurality of vapor permeation regions and a plurality of vapor barrier regions. Each of the plurality of vapor permeation regions is, for example, an opening.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0006] However, on the substrate, uneven application of ink, such as unevenness in the amount of ink applied or unevenness in the application position accuracy of the ink, may occur in a direction orthogonal to the scanning direction of the coating apparatus, which is caused by the coating performance of the coating apparatus. That is, uneven coating may occur where the ink appears streak-like along the scanning direction.

[0007] For example, in an inkjet coating apparatus, the coating head is scanned along the main surface of the substrate by moving at least one of the coating head and the substrate, and ink is applied onto the main surface of the substrate along the scanning direction. The coating head has a plurality of nozzles arranged in a direction intersecting the scanning direction. Due to variations in the performance of the plurality of nozzles, the above-described uneven application of ink may occur on the substrate.

[0008] In the panel formed after drying such ink with coating unevenness, streak-like unevenness along the scanning direction may be visually recognized. In particular, in an organic EL panel, if the unevenness in element performance is arranged in a streak shape, the streak-like performance unevenness may be visually recognized by the user. Since such a panel becomes a defective product, improvement in the yield rate is required.

[0009] The present disclosure aims to provide a technique advantageous for drying the ink on the substrate.

Means for Solving the Problems

[0010] A first aspect of the present disclosure includes a first unit that scans an ink supply unit in a first direction along a main surface of a substrate to supply ink to the main surface of the substrate by moving at least one of the ink supply unit and the substrate, and a second unit that dries the ink disposed on the main surface of the substrate. The second unit includes a container that defines an internal space in which the substrate is conveyed, and a cover disposed inside the container so as to face the main surface of the substrate conveyed inside the container. The cover is configured to define a plurality of slits that communicate a first space on the substrate side with respect to the cover and a second space on the side opposite to the substrate with respect to the cover. When viewed in a direction orthogonal to the main surface, at least two of the plurality of slits intersect a virtual straight line extending parallel to the first direction. The system is characterized by this.

[0011] A second aspect of the present disclosure includes a first unit that scans an ink supply unit in a first direction along a main surface of a substrate to supply ink to the main surface of the substrate by moving at least one of the ink supply unit and the substrate, and a second unit that dries the ink disposed on the main surface of the substrate. The second unit includes a container that defines an internal space in which the substrate is conveyed, and a cover disposed inside the container so as to face the main surface of the substrate conveyed inside the container. The cover is configured to define a plurality of slits that communicate a first space on the substrate side with respect to the cover and a second space on the side opposite to the substrate with respect to the cover. When viewed in a direction orthogonal to the main surface, in at least a region of the cover that overlaps with the main surface of the substrate, any virtual straight line extending parallel to the first direction intersects at least one of the plurality of slits. The system is characterized by this.

[0012] A third aspect of the present disclosure is a substrate processing apparatus for drying ink disposed on a main surface of a substrate, including: a container defining an internal space through which the substrate is conveyed; and a cover disposed inside the container so as to face the main surface of the substrate conveyed inside the container, wherein the cover is configured to define a plurality of slits that communicate a first space on the substrate side with respect to the cover and a second space on the side opposite to the substrate with respect to the cover, and at least two of the plurality of slits intersect a virtual straight line extending parallel to a first direction when viewed in a direction orthogonal to the main surface. The substrate processing apparatus is characterized by this.

[0013] A fourth aspect of the present disclosure is a substrate processing apparatus for drying ink disposed on a main surface of a substrate, including: a container defining an internal space through which the substrate is conveyed; and a cover disposed inside the container so as to face the main surface of the substrate conveyed inside the container, wherein the cover is configured to define a plurality of slits that communicate a first space on the substrate side with respect to the cover and a second space on the side opposite to the substrate with respect to the cover, and any virtual straight line extending parallel to a first direction in at least a region of the cover that overlaps the main surface of the substrate intersects at least one of the plurality of slits when viewed in a direction orthogonal to the main surface. The substrate processing apparatus is characterized by this. [Effect of the Invention]

[0014] According to the present disclosure, an advantageous technique for drying ink on a substrate is provided. [Brief Description of the Drawings]

[0015]

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Embodiments for Carrying Out the Invention

[0016] Hereinafter, preferred embodiments of the present disclosure will be described in detail based on the accompanying drawings. In each figure, the same members are denoted by the same reference numerals, and overlapping descriptions are omitted. In the embodiments and drawings described below, the directions are indicated by the XYZ coordinate system. In the XYZ coordinate system, the in-plane direction along the XY plane is the horizontal direction, and the minus direction of the Z axis can be the vertical direction (gravity direction).

[0017] <First Embodiment> FIG. 1 is a schematic explanatory diagram of a substrate processing system 1000 which is an example of a system according to the first embodiment. FIGS. 2(a) and 2(b) are schematic cross-sectional views of the substrate processing system 1000 according to the first embodiment. In FIG. 2(a), the A-A cross section of the substrate processing system 1000 shown in FIG. 1 is schematically illustrated. In FIG. 2(b), the B-B cross section of the substrate processing system 1000 shown in FIG. 1 is schematically illustrated. The substrate processing system 1000 is used in the process of manufacturing an article by processing a substrate S. For example, the substrate processing system 1000 is used in the process of manufacturing an organic EL panel having an OLED which is an organic EL element.

[0018] The substrate processing system 1000 includes a coating unit 100, a drying unit 200, a transfer unit 300, and a control device 90. The coating unit 100 is an example of a first unit, and the drying unit 200 is an example of a second unit. The coating unit 100 is an ink coating device. The drying unit 200 is a reduced-pressure drying device which is an example of a substrate processing device. The control device 90 is an example of a control unit and controls the entire system. The drying unit 200 forms an organic film on the substrate S by performing a drying process for drying the solution film F applied to the substrate S. Here, the process of bringing the substrate S into a state where almost no solvent remains is referred to as a drying process.

[0019] The coating unit 100 has a container 101, the drying unit 200 has a container 201, and the transfer unit 300 has a container 301. These containers 101, 201, and 301 are connected to each other. Specifically, the containers 101 and 201 are connected to the container 301. Each of the containers 101, 201, and 301 can be an airtight container. By connecting the containers 101, 201, and 301 to each other, it is possible to transfer the substrate S between the containers 101 to 301 so that the substrate S does not come into contact with the outside air.

[0020] The inside of the container 101 is a coating chamber for performing a coating process (coating step) of forming a solution film F containing the ink IK on the main surface MS of the substrate S. The inside of the container 201 is a drying chamber for performing a drying process (drying step) of drying the solution film F on the substrate S. The inside of the container 301 is a transfer chamber for performing a transfer process (transfer step) of transferring the substrate S. In the first embodiment, drying the solution film F is also expressed as drying the substrate S, drying the solution, drying the solvent, or evaporating the solvent.

[0021] The coating unit 100 is configured to supply the ink IK to a desired location on the main surface MS of the substrate S and form a solution film F at the desired location on the main surface MS of the substrate S. The ink IK is a solution containing a solute for forming an organic film and at least one or more solvents. By applying the ink IK to a desired location on the main surface MS of the substrate S, a solution film F is formed on the main surface MS.

[0022] Typical examples of the solvent include cyclohexanol, ethylene glycol, ethylene glycol diglycidyl ether, 1,3-octylene glycol, diethylene glycol, dipropylene glycol, triethylene glycol, tripropylene glycol, 1,3-butanediol, 2,3-butanediol, 1,4-butanediol, propylene glycol, hexylene glycol, ethylene glycol monobutyl ether, diethylene glycol diethyl ether, diethylene glycol dimethyl ether, ethylene glycol diethyl ether, diethylene glycol monoethyl ether acetate, diethylene glycol monobutyl ether acetate, dipropylene glycol monomethyl ether, diethylene glycol monoethyl ether, diacetone alcohol, γ-butyrolactone, ethyl lactate (ethyl lactate), n-hexyl acetate, ethyl cellosolve acetate, diethylene glycol monomethyl ether, and the like.

[0023] The coating method for applying the ink IK onto the substrate S is preferably an inkjet coating method. The coating unit 100 includes a container 101, a substrate holding portion 120 that holds the conveyed substrate S, and a coating head 130 which is an example of an ink supply portion. The substrate holding portion 120 and the coating head 130 are disposed inside the container 101. The substrate holding portion 120 has a holding surface for holding the substrate S. The holding surface is a plane parallel to, for example, the XY plane (horizontal plane). The substrate holding portion 120 holds the substrate S when the substrate S is placed on the holding surface. The coating head 130 is disposed above the substrate holding portion 120 and is configured to supply the ink IK to the main surface MS of the substrate S held by the substrate holding portion 120.

[0024] The coating unit 100 includes a temperature control unit 170 that controls the temperature of the substrate holding unit 120, i.e., the temperature of the substrate S. The temperature control unit 170 may typically include a cooler that cools the substrate holding unit 120, but may also include a heater that heats the substrate holding unit 120. The temperature control unit 170 performs at least one of cooling and heating on the substrate holding unit 120. By controlling the temperature of the substrate S, the temperature control unit 170 can control the temperature of the solution film F applied to the substrate S. The temperature control unit 170 can control each region of the substrate holding unit 120 to a uniform temperature or different temperatures for each region so that the temperature distribution of the substrate S becomes uniform.

[0025] The temperature control unit 170 controls so that the difference in temperature in each region of the substrate S held by the substrate holding unit 120 is within 10°C. More preferably, the temperature control unit 170 controls so that the difference in temperature in each region of the substrate S held by the substrate holding unit 120 is within 5°C. The temperature control unit 170 can control the temperature of the substrate holding unit 120 so that the temperature of the substrate S becomes any temperature within the range from 0°C to 100°C. By the temperature control unit 170 cooling the substrate holding unit 120, it is possible to suppress the drying of the solution film F on the substrate S before sending it to the drying unit 200.

[0026] In the substrate holding unit 120, there is arranged a lifting pin PI1 configured to be able to protrude and retract with respect to the holding surface of the substrate holding unit 120. By protruding the lifting pin PI1 with respect to the holding surface, the transfer robot RB can place the substrate S on the lifting pin PI1, and it also becomes easier to receive the substrate S placed on the lifting pin PI1. By lowering the lifting pin PI1 on which the substrate S is placed from the holding surface, the substrate S placed on the lifting pin PI1 can be placed on the holding surface.

[0027] The transfer unit 300 includes a transfer robot RB which is an example of a transfer device disposed inside the container 301. The transfer robot RB has a robot hand RH capable of holding the substrate S, and is capable of transferring the substrate S held by the robot hand RH. The transfer robot RB is movable in the D10 direction parallel to the Y direction between a position P3 facing the container 101 and a position P4 facing the container 201 so as to be accessible to the inside of each of the containers 101 and 201.

[0028] At least one of the coating head 130 and the substrate holding unit 120, in the first embodiment, the substrate holding unit 120 is movable along the X direction. That is, the coating unit 100 has a drive mechanism (not shown) for moving the substrate holding unit 120. In the first embodiment, by moving the substrate holding unit 120 in the X direction between a position P1 which is the scanning start position and a position P2 which is the scanning end position, the coating head 130 can be opposed to a predetermined portion in the X direction of the main surface MS of the substrate S held by the substrate holding unit 120. The coating head 130 is a head having the Y direction as the longitudinal direction, and by opposing to a predetermined portion of the main surface MS of the substrate S, the ink IK can be supplied over the entire Y direction of the predetermined portion of the main surface MS of the substrate S.

[0029] In the first embodiment, the coating head 130 is capable of scanning along the main surface MS of the substrate S held by the substrate holding unit 120 as the substrate holding unit 120 moves. That is, by moving the substrate holding unit 120 in the direction D0 which is the minus direction of the X axis, the coating head 130 can scan in the direction D1 which is the plus direction of the X axis with respect to the main surface MS of the substrate S. Thereby, it is possible to apply the ink IK in the scanning direction D1 on the main surface MS of the substrate S. That is, it is possible to supply the ink IK to the entire main surface MS of the substrate S. The direction D1 which is the plus direction of the X axis is an example of the first direction.

[0030] In the first embodiment, the coating head 130 is fixed to a fixing member such as a frame (not shown) and is immovable, but the present invention is not limited to this. That is, the coating head 130 may be configured to be movable in the X direction by a drive mechanism. In this case, the coating head 130 may scan in the direction D1, which is the positive direction of the X axis, with respect to the main surface MS of the substrate S by moving in the direction D1, which is the positive direction of the X axis, with respect to the main surface MS of the substrate S. In this case, the substrate holding unit 120 may be movable in the X direction or may be fixed to a fixing member such as a frame (not shown) and be immovable.

[0031] As described above, the coating unit 100 scans the coating head 130 in the direction D1 along the main surface MS of the substrate S by moving at least one of the coating head 130 and the substrate S, and supplies the ink IK to the main surface MS of the substrate S.

[0032] The inkjet coating method is effective for forming a fine coating pattern. As shown in FIG. 2(a), the coating head 130 has a plurality of nozzles 140 that discharge the ink IK. The plurality of nozzles 140 are arranged at intervals in a direction intersecting the scanning direction D1, in the Y direction orthogonal to the direction D1 in the first embodiment. Each nozzle 140 is a fine nozzle at the micron level, for example. By intermittently discharging droplets of a small amount of ink IK of several picoliters from each nozzle 140, a plurality of solution films F can be formed on the substrate S. For example, a plurality of recesses surrounded by banks are formed on the main surface MS of the substrate S. By discharging the ink IK into each of the plurality of recesses with the coating head 130, a solution film F can be formed in each recess.

[0033] However, there are slight individual differences in the mechanical accuracy, ejection conditions, etc. of each nozzle 140 of the coating head 130. For this reason, minute differences also occur in the coating performance between the nozzles 140, such as the coating amount and the accuracy of the coating position.

[0034] FIG. 3(a) and FIG. 3(b) are explanatory views of the solution film F formed on the main surface MS of the substrate S by the coating head 130 according to the first embodiment. Since there are minute differences in performance among the plurality of nozzles 140 of the coating head 130, streak-like coating unevenness along the direction D1 may occur in the solution film F formed on the main surface MS of the substrate S. That is, undulation of the solution film F may occur in the Y direction.

[0035] Note that the coating method is not limited to the inkjet coating method. For example, the coating method may be a dispensing coating, a roll coating, a spray coating, a slit coating, a screen printing, or the like. Even with these methods, streak-like coating unevenness may occur. Note that the coating method is not limited to these exemplified methods.

[0036] FIG. 4(a) and FIG. 4(b) are schematic cross-sectional views of a drying unit 200 which is an example of the substrate processing apparatus according to the first embodiment. In FIG. 4(a), a C-C cross section of the substrate processing system 1000 shown in FIG. 1 is schematically illustrated. In FIG. 4(b), a D-D cross section of the substrate processing system 1000 shown in FIG. 1 is schematically illustrated.

[0037] The drying unit 200 is configured to perform a drying process for drying the solution film F disposed on the main surface MS of the substrate S. That is, the drying unit 200 is configured to evaporate the solvent from the solution film F supplied on the main surface MS of the substrate S to dry the solution film F and form a functional film. By using the drying unit 200, the substrate S can be dried. The drying method is preferably a vacuum drying method, and the vacuum drying method is used in the first embodiment. Note that the drying method is not limited to the vacuum drying method, and other drying methods, for example, a heat drying method may be used.

[0038] As described above, the solution film F is composed of a solution containing a solute for forming an organic film and one or more solvents. The solvent contained in the solution film F preferably has a property that evaporation is promoted in a reduced-pressure environment lower than atmospheric pressure (1 atm). Evaporation of the solvent is preferably promoted, for example, at a temperature higher than normal temperature (25°C).

[0039] The organic film is an organic layer and can be one of the functional films constituting the laminated film for the electronic device element. For example, the organic film can be any of the hole injection layer, hole transport layer, light-emitting layer, electron transport layer, or electron injection layer of the OLED. The manufacture of the organic EL element may include a step of forming each organic film of the hole injection layer, hole transport layer, light-emitting layer, electron transport layer, and electron injection layer on the substrate S.

[0040] The drying unit 200 includes a container 201, a decompression mechanism 30 for decompressing the inside of the container 201, and a substrate holding unit 20 which is a holding unit disposed inside the container 201 and capable of holding the substrate S. The substrate S is disposed on the upper surface (holding surface) of the substrate holding unit 20. Further, the drying unit 200 includes a cover unit 400 disposed at a position surrounding the substrate S held by the substrate holding unit 20 inside the container 201. The cover unit 400 is disposed at a position not in contact with the substrate S held by the substrate holding unit 20 inside the container 201.

[0041] The container 201 can be an airtight container. The pressure of the external environment of the container 201 is atmospheric pressure, for example, 1 atm. The container 201 is a member that defines an internal space SP0 which is a drying chamber where the substrate S is transported. The internal space SP0 includes a space SP2 surrounded by the cover unit 400 and a space SP1 other than the space SP2. In the first embodiment, the space SP2 is a space surrounded by the substrate holding unit 20 and the cover unit 400.

[0042] The space SP2 is the space on the side of the substrate S with respect to the cover 40, and the space SP1 is the space on the side opposite to the substrate S with respect to the cover 40. The space SP2 is an example of the first space, and the space SP1 is an example of the second space.

[0043] The space SP2 inside the cover unit 400 and the space SP1 outside the cover unit 400 communicate with each other, but are adjusted so that the pressure distribution in the space SP2 becomes as uniform as possible by surrounding the substrate S with the cover unit 400.

[0044] Further, the drying unit 200 includes a gate valve 12 provided in the container 201. The substrate S coated with the solution film F to be dried is carried into the internal space SP0 from the container 301 through the gate valve 12. Further, the substrate S that has undergone the drying process is carried out from the internal space SP0 to the container 301 through the gate valve 12.

[0045] The loading and unloading of the substrate S with respect to the container 201 are performed by the transfer robot RB of the transfer unit 300 placed in the container 301, that is, outside the container 201. The transfer robot RB performs the loading of the substrate S onto the substrate holding unit 20 and the unloading of the substrate S from the substrate holding unit 20 in response to a command from, for example, the control device 90 in FIG. 1. At that time, the substrate S can be transferred through the gate valve 12 on the transfer route and the shutter 14 provided at the opening of the surrounding wall 41.

[0046] The opening can be closed by the shutter 14 except when the substrate S is being transferred. The shutter 14 is a mechanical shutter and can be a part of the cover unit 400 that defines the space SP2. When loading the substrate S, it can be transferred from the external space through the space SP1 to the space SP2 through the gate valve 12 and the shutter 14. When unloading the substrate S that has undergone the drying process, it can be transferred from the space SP2 through the space SP1 to the external space through the shutter 14 and the gate valve 12. Note that the drying unit 200 may include a lifting mechanism (not shown) that raises and lowers the cover unit 400 when loading the substrate S into the substrate holding unit 20 and unloading the substrate S from the substrate holding unit 20 instead of the opening of the surrounding wall 41 and the shutter 14.

[0047] The substrate holding unit 20 is provided with lifting pins PI2 configured to be able to protrude and retract with respect to the holding surface of the substrate holding unit 20. By protruding the lifting pins PI2 with respect to the holding surface, the transfer robot RB can place the substrate S on the lifting pins PI2, and it becomes easier to receive the substrate S placed on the lifting pins PI2. By lowering the lifting pins PI2 on which the substrate S is placed from the holding surface, the substrate S placed on the lifting pins PI2 can be placed on the holding surface.

[0048] At least one exhaust port, in the first embodiment, a plurality of exhaust ports are formed in the upper part of the container 201. An exhaust duct is connected to each exhaust port. By operating the pressure reducing mechanism 30, the gas in the internal space SP0 of the container 201 can be exhausted through the exhaust duct, and the internal space SP0 of the container 201 can be depressurized. The pressure reducing mechanism 30 includes at least one pump, for example, a plurality of pumps. The plurality of pumps include at least one of, for example, a dry pump and a diaphragm vacuum pump. Further, the plurality of pumps may include at least one of, for example, a turbo molecular pump, a cryopump, a soap solution pump, an oil diffusion pump, a mechanical booster pump, an ejector pump, and an oil rotary vacuum pump.

[0049] The drying unit 200 further includes a temperature control unit 70. The temperature control unit 70 controls the temperature of the substrate S or the solution film F on the substrate S by controlling the temperature of the substrate holding unit 20. The temperature control unit 70 may typically include a heater for heating the substrate holding unit 20. Further, the temperature control unit 70 may include a cooler for cooling the substrate holding unit 20. The temperature control unit 70 controls the temperature of the substrate holding unit 20 by performing at least one of heating and cooling on the substrate holding unit 20.

[0050] The temperature control unit 70 controls the plurality of regions of the substrate holding unit 20 to the same temperature or different temperatures from each other so that the substrate S has a uniform temperature distribution. Preferably, the temperature control unit 70 controls so that the temperature difference between the plurality of regions of the substrate S held by the substrate holding unit 20 is within 10°C. More preferably, the temperature control unit 70 controls so that the temperature difference between the plurality of regions of the substrate S held by the substrate holding unit 20 is within 5°C. The temperature control unit 70 controls the temperature of the substrate holding unit 20 so that the temperature of the substrate S becomes a predetermined temperature within the range from 0°C to 100°C. By heating the substrate holding unit 20, the drying rate of the solution film F applied on the substrate S can be improved.

[0051] The cover unit 400 is disposed on the substrate holding unit 20. The main material of the cover unit 400 is metal. For the metal, for example, stainless steel or aluminum is suitable. As the stainless steel, for example, austenitic stainless steel containing 0.045% or less of phosphorus and 0.030% or less of sulfur (that is, the stainless steel specified as SUS304 in the Japanese Industrial Standard: JIS) is suitable.

[0052] The cover unit 400 includes an enclosure wall 41 and a cover 40. The cover 40 may be integrally formed with the enclosure wall 41 or may be separate from the enclosure wall 41.

[0053] The enclosure wall 41 is an example of a side wall member. The enclosure wall 41 is a member that surrounds the outer periphery of the substrate S. Also, the enclosure wall 41 is a member that supports the cover 40, is placed or fixed on the substrate holding unit 20, and is disposed at a position where it can face the side surface of the substrate S disposed on the substrate holding unit 20. Note that the enclosure wall 41 may be placed on another member.

[0054] The cover 40 is disposed at a position facing the main surface MS of the substrate S conveyed onto the substrate holding portion 20 in a direction perpendicular to the upper surface of the substrate holding portion 20, i.e., the Z direction. Specifically, the cover 40 is disposed at a position facing the solution film F applied on the main surface MS of the substrate S in the Z direction. The cover 40 is disposed on the surrounding wall 41. The upper surface of the substrate holding portion 20 and the main surface MS of the substrate S are parallel to each other.

[0055] Further, the drying unit 200 includes a gas introduction portion 51 for introducing an inert gas into the space SP1 and a gas introduction portion 52 for introducing an inert gas into the space SP2. The gas introduction portions 51 and 52 are an example of pressure adjusting means. The gas introduction portions 51 and 52 are preferably, for example, flexible tubes. A valve (not shown) is disposed in the gas introduction portion 51. Also, a valve (not shown) is disposed in the gas introduction portion 52.

[0056] The gas introduction portion 51 is provided so as to penetrate the container 201 and is configured to supply an inert gas to the space SP1. The gas introduction portion 52 is provided so as to penetrate the surrounding wall 41 of the container 201 and the cover unit 400 and is configured to supply an inert gas to the space SP2.

[0057] The inert gas is, for example, nitrogen. In the first embodiment, the gas supplied from the gas introduction portions 51 and 52 into the interior of the container 201 is preferably an inert gas, but a gas having a composition different from that of the solvent of the solution film F may be a gas other than an inert gas, for example, clean dry air.

[0058] By supplying gas to the space SP1 via the gas introduction portion 51, the pressure of the internal space SP0 of the container 201, particularly the pressure of the space SP1, is adjusted. Also, by supplying gas to the space SP2 via the gas introduction portion 52, the pressure of the internal space SP0 of the container 201, particularly the pressure of the space SP2, is adjusted.

[0059] Further, the drying unit 200 may further include a gas analyzer 60 that detects a specific gas in the space SP2. The gas analyzer 60 is an example of a gas analysis unit. The gas in the space SP2 is introduced into the gas inlet of the gas analyzer 60 via a connection member 62. The gas analyzer 60 is, for example, a residual gas analyzer (RGA) such as a mass spectrometer. The specific gas detected by the gas analyzer 60 is the vapor (gas) of the solvent evaporated from the solution film F of the substrate S. The connection member 62 may be a flexible tube, for example, a glass fiber tube, or may be a bellows.

[0060] The connection member 62 has a first end and a second end. The first end is connected to the gas inlet of the gas analyzer 60, and the second end may be arranged to protrude from the inner surface of the cover unit 400 into the space SP2.

[0061] The control device 90 in FIG. 1 controls each part of the drying unit 200. The control device 90 is configured by, for example, a computer. The control device 90 includes a CPU which is an example of a processor, a RAM which is a temporary storage device, a ROM and an SSD which are non-temporary storage devices (recording media), an I / O which is an interface, and the like. A control program for causing the CPU of the control device 90 to execute the control of each part of the entire device in the manufacturing process described later is stored in the non-temporary storage device.

[0062] The control device 90 controls the opening and closing of the gate valve 12 and the shutter 14. Further, the control device 90 controls the pressure inside the container 201 by controlling the decompression mechanism 30. Further, the control device 90 controls the supply and stop of the gas to the inside of the container 201 and the gas flow rate by controlling the valves of the gas introduction parts 51, 52.

[0063] In addition to the above-described configuration, the control device 90 may be configured by, for example, a PLD (Programmable Logic Device) such as an FPGA (Field Programmable Gate Array), an ASIC (Application Specific Integrated Circuit), a general-purpose or dedicated computer in which a program is incorporated, or a combination of all or part of these.

[0064] Hereinafter, among a plurality of steps of a method for manufacturing an organic EL panel, which is an example of an article, some steps including a coating step (coating process), a conveyance step (conveyance process), and a drying step (drying process) will be described.

[0065] FIGS. 5 and 6 are flowcharts of a method for manufacturing an article including a substrate processing method according to the first embodiment. FIG. 5 is a flowchart of the coating process, and FIG. 6 is a flowchart of the drying process. The conveyance process is performed in the coating process and the drying process.

[0066] In step S1, the control device 90 moves the substrate S held by the transfer robot RB to the position P3 while holding the substrate S. The substrate holding unit 120 is located at the position P1. The control device 90 raises the lifting pin PI1 and causes the robot hand RH holding the substrate S to enter the inside of the container 101. After the substrate S arrives directly above the substrate holding unit 120, the control device 90 lowers the robot hand RH, places the substrate S on the lifting pin PI1, further lowers the robot hand RH, and then retracts the robot hand RH from the container 101. Thereafter, the control device 90 lowers the lifting pin PI1 to place the substrate S on the substrate holding unit 120. Thereby, the loading of the substrate S onto the substrate holding unit 120 of the coating unit 100 is completed.

[0067] Next, in step S2, the control device 90 starts scanning by moving the substrate holding unit 120 from the position P1 toward the position P2 in the direction D0.

[0068] In step S3, the control device 90 performs a coating process of discharging ink IK onto a predetermined location on the main surface MS of the substrate S located directly below the coating head 130.

[0069] In step S4, the control device 90 determines whether the substrate holding unit 120 has moved to position P2. If it has reached position P2, since the coating process is completed, step S4 is YES, and the control device 90 proceeds to the next step S5. If it has not reached position P2, the coating process has not ended, step S4 is NO, and the control device 90 continues the process of step S3.

[0070] Through the above steps S3 and S4, ink IK is supplied along direction D1, which is the scanning direction, onto the main surface MS of the substrate S, and a solution film F is formed on the main surface MS.

[0071] In step S5, the control device 90 controls to return the substrate holding unit 120 holding the substrate S on which the solution film F is formed to position P1 where the robot hand RH of the transfer robot RB can access.

[0072] In step S6, the control device 90 raises the lifting pin PI1 of the substrate holding unit 120 to lift the substrate S with the lifting pin PI1. Thereby, a space where the robot hand RH can enter is secured between the substrate S and the substrate holding unit 120. Next, the control device 90 allows the robot hand RH to enter directly below the substrate S and raises the robot hand RH. Thereby, the substrate S separates from the lifting pin PI1 and is held by the robot hand RH. Then, the control device 90 retracts the robot hand RH from the container 101. Thereby, the unloading of the substrate S from the substrate holding unit 120 of the coating unit 100 is completed. Through the above coating process, the solution film F is coated on the necessary locations on the main surface MS of the substrate S.

[0073] Next, the drying process by the drying unit 200 will be described. The substrate S is carried into the space SP2 in the container 201, and in the drying unit 200, a drying process for drying the solution film F on the substrate S, that is, a drying process for evaporating the solvent of the solution film F, is performed under the control of the control device 90. The drying process may include a plurality of drying steps. In each drying step, the control device 90 controls the pressure inside the container 201, that is, the pressure in the internal space SP0, by controlling the pressure reducing mechanism 30. Hereinafter, the drying process by the drying unit 200 will be specifically described.

[0074] In step S7 of FIG. 6, the control device 90 moves the transfer robot RB holding the substrate S on which the solution film F is applied from position P3 to position P4. The lifting pin PI2 protrudes upward from the holding surface. Further, the control device 90 performs preparation for loading the substrate S into the drying unit 200, such as adjusting the temperature of the substrate holding unit 20.

[0075] In step S8, the control device 90 causes the robot hand RH holding the substrate S to enter the inside of the container 201. After the substrate S arrives directly above the substrate holding unit 20, the control device 90 lowers the robot hand RH, places the substrate S on the lifting pin PI2, further lowers the robot hand RH, and then retracts the robot hand RH from the container 201. Thereafter, the control device 90 lowers the lifting pin PI2 to place the substrate S on the substrate holding unit 20. Thereby, the loading of the substrate S onto the substrate holding unit 20 is completed.

[0076] Next, in step S9, the control device 90 moves the shutter 14 to the closed position.

[0077] Next, in step S10, the control device 90 executes each drying process of the drying treatment. Hereinafter, the drying treatment in step S10 will be specifically described. FIG. 7 is a graph showing an example of pressure control in the drying treatment according to the first embodiment. The horizontal axis shown in FIG. 7 is time, and the vertical axis is the pressure in the internal space SP0. Note that the pressure in the internal space SP0 of the container 201 can be detected by a pressure gauge (not shown). In the example of FIG. 7, the plurality of drying processes are four drying processes D11 to D14, but the number of drying processes is not limited to four.

[0078] First, the control device 90 controls the decompression mechanism 30 so that the pressure in the internal space SP0 of the container 201 decreases from the atmospheric pressure to the first pressure P11 (drying process D11). Thereby, the inside of the container 201 is decompressed to the first pressure P11. The drying process D11 is a process in the process of decompressing from the atmospheric pressure to the first pressure P11. The first pressure P11 is a pressure lower than the atmospheric pressure and higher than a predetermined pressure. The predetermined pressure is, for example, the vapor pressure of the solvent. Then, after the pressure in the internal space SP0 reaches the first pressure P11, the control device 90 controls the decompression mechanism 30 so that the pressure in the internal space SP0 is maintained at the first pressure P11 for the first time (drying process D12).

[0079] In the drying process D12, the control device 90 controls the exhaust amount of the gas of the decompression mechanism 30 and the introduction amount of the gas of the gas introduction part 51 so as to be the first pressure P11 higher than the vapor pressure of the solvent. The pressure inside the container 201 can be determined by adjusting the balance between the exhaust amount of the gas by the decompression mechanism 30 and the supply amount of the inert gas. Note that not only in the drying process D12, but also in any of the other drying processes D11, D13, D14, for example, in the drying process D14, an inert gas may be supplied from the gas introduction part 51 to the space SP1. Also, in the drying processes D11 and D12, the introduction of the inert gas from the gas introduction part 52 is stopped.

[0080] In the first embodiment, in order to uniformly adjust the pressure distribution around the substrate S, that is, in order to uniformly adjust the evaporation rate of the solvent in the solution film F on the substrate S, the cover unit 400 surrounds the substrate S. When the solvent evaporates from the solution film F, the solvent vapor temporarily stays in the space SP2 surrounded by the cover unit 400. A plurality of slits 42 that communicate the space SP2 and the space SP1 are formed in the cover 40 facing the main surface MS of the substrate S. Through these slits 42, the solvent vapor flows from the space SP2 to the space SP1. Note that an opening may also be formed in the surrounding wall 41. The vapor that has flowed into the space SP1 is exhausted by the decompression mechanism 30 through an exhaust duct connected to the exhaust ports 21 to 24 of the container 201.

[0081] In the drying step D12, the solution film F dries uniformly by maintaining the pressure in the space SP2 at the first pressure P11. That is, the solution film F can be dried so that the film thickness of the solution film F becomes uniform. Therefore, the surface of the solution film F can be made a flat surface. Further, the size and number of the slits 42 are adjusted so that the pressure distribution in the space SP2 becomes uniform while the pressure in the space SP2 is maintained at a predetermined pressure. For this reason, the pressure in the space SP2 is finely adjusted, and the solution film F can be dried more effectively uniformly. The shape of the solution film F is roughly determined by the drying step D12.

[0082] After the elapse of the first time, that is, after the first process, the control device 90 controls the gas exhaust amount of the decompression mechanism 30 and the gas introduction amount of the gas introduction unit 52 so that the pressure in the internal space SP0 of the container 201 decreases from the first pressure P11 to the second pressure P12 (drying step D13). Thereby, the inside of the container 201 is decompressed to the second pressure P12. The drying step D13 is a process in the process of decompressing from the first pressure P11 to the second pressure P12. The second pressure P12 is a pressure lower than the first pressure P11 and lower than the vapor pressure of the solvent. Then, after the pressure inside the container 201 reaches the second pressure P12, the control device 90 controls the gas exhaust amount of the decompression mechanism 30 and the gas introduction amount of the gas introduction unit 52 so that the pressure in the internal space SP0 is maintained at the second pressure P12 for the second time (drying step D14).

[0083] In the drying step D14, the gas introduction section 52 can maintain the pressure in the space SP2 at the second pressure by supplying an inert gas even when the pressure reducing mechanism 30 is operating. That is, the pressure inside the container 201 can be determined by adjusting the balance between the gas exhaust amount by the pressure reducing mechanism 30 and the inert gas supply amount. Further, the inert gas output from the gas introduction section 52 can also function as a means for discharging the solvent vapor remaining in the space SP2. Note that the gas introduction section 51 may supply an inert gas to the space SP1 in the drying step D14.

[0084] After the drying step D13, the solution film F on the substrate S is further dried while reducing the pressure inside the container 201 to the second pressure P12. In particular, in the drying step D14, the solution film F on the substrate S is further dried while maintaining the pressure in the internal space SP0 at the second pressure P12. Thereby, the drying time of the solution film F can be shortened.

[0085] In step S11, the control device 90 determines whether or not all the drying steps have been completed, that is, whether or not the drying process has been completed. Whether or not each drying step has been completed is determined based on a preset processing time. Note that whether or not each drying step has been completed may be determined based on the output value of the gas analyzer 60. Further, when the drying process includes a plurality of drying steps, the control device 90 may perform the determination process in step S11 after the start of the last drying step among the plurality of drying steps.

[0086] If step S11 is YES, that is, if the drying process has been completed, the control device 90 executes the next step S12. If step S11 is NO, that is, if the drying process has not been completed, the control device 90 returns to the process of step S10 again and continues the drying process.

[0087] In step S12, the control device 90 moves the shutter 14 to the open position, and in step S13, controls the lifting pins PI2 and the transfer robot RB so that the substrate S held by the substrate holder 20 is carried out of the container 201.

[0088] In the first embodiment, by performing drying through a plurality of drying steps D11 to D14 with different pressure conditions, it is possible to achieve both an increase in the drying speed and a uniformization of the thickness of the functional film. Specifically, after the approximate film shape is determined in the drying step D12, by rapidly drying the solution film F in the drying steps D13 and later, a film with a uniform thickness can be formed. Therefore, in the drying steps D13 and later, it becomes possible to gradually reduce the pressure.

[0089] Here, although it was described above that the predetermined pressure is the vapor pressure of the solvent contained in the solution film F, as long as it is a value based on the vapor pressure of the solvent contained in the solution film F, the predetermined pressure may be a pressure different from the vapor pressure of the solvent contained in the solution film F. For example, in order to make the film thickness of the solution film F more stable and flattened, the predetermined pressure may be a pressure slightly higher than the vapor pressure of the solvent contained in the solution film F.

[0090] FIG. 8(a) is a plan view of the cover 40X of Comparative Example 1, and FIG. 8(b) is a plan view of the cover 40Y of Comparative Example 2. The cover 40X of Comparative Example 1 has a plurality of openings 42X arranged in a matrix. Each opening 42X is a round hole. The cover 40Y of Comparative Example 2 has a plurality of openings 42Y arranged in a matrix. Each opening 42Y is a square hole. In the cover 40X of Comparative Example 1 shown in FIG. 8(a), when viewed in the negative direction of the Z-axis orthogonal to the main surface MS of the substrate S, the region without the opening 42X is linearly continuous in a direction parallel to the direction D1 from the upstream end to the downstream end of the region AS overlapping the main surface MS of the substrate S. In the cover 40Y of Comparative Example 1 shown in FIG. 8(b), when viewed in the negative direction of the Z-axis orthogonal to the main surface MS of the substrate S, the region without the opening 42Y is linearly continuous in a direction parallel to the direction D1 from the upstream end to the downstream end of the region AS overlapping the main surface MS of the substrate S. When the direction in which the region without the opening 42X is linearly continuous is parallel to the direction D1 of the streak-like coating unevenness shown in FIG. 3(b), streak-like unevenness is emphasized in the film formed after the drying process, and streak-like unevenness also occurs in the element performance.

[0091] FIG. 9(a) is a plan view of the cover 40 according to the first embodiment. The cover 40 is configured to define a plurality of slits 42. Each slit 42 is a slit-shaped opening defined by the cover 40. That is, each slit 42 is a slit-shaped through-hole that communicates the space SP2 and the space SP1.

[0092] When viewed in the negative direction of the Z-axis orthogonal to the main surface MS of the substrate S, each slit 42 is a linear slit extending along a virtual straight line SL2 that intersects a virtual straight line SL1. That is, each of the plurality of slits 42 extends linearly in a direction D2 that intersects the direction D1. And the plurality of slits 42 are arranged at intervals in the direction D1. In the first embodiment, the direction D2 is a direction orthogonal to the direction D1. That is, in the first embodiment, the virtual straight line SL2 is orthogonal to the virtual straight line SL1. The direction D2 is the extending direction of the virtual straight line SL2 and is also the length direction of the slit 42. The extending direction of the virtual straight line SL1 is the short-side direction, that is, the width direction of the slit 42.

[0093] Viewed in the negative direction of the Z-axis orthogonal to the main surface MS of the substrate S, at least two of the plurality of slits 42, and in the first embodiment all of the slits 42, intersect a virtual straight line SL1 extending parallel to the direction D1. Here, for each of the slits 42 that intersect the virtual straight line SL1, the slit length L1 in the length direction is at least twice the slit width W1 in the width direction. The slit width W1 is the maximum width throughout the length direction of the slit 42. The slit length L1 is preferably at least three times the slit width Wl, and more preferably at least four times the slit width W1. The minimum value of the slit width of each slit 42 is, for example, 1 mm.

[0094] In the first embodiment, viewed in the negative direction of the Z-axis orthogonal to the main surface MS of the substrate S, in at least the region AS of the cover 40 that overlaps the main surface MS of the substrate S, any virtual straight line SL1 extending linearly parallel to the direction D1 intersects at least one of the plurality of slits 42. That is, a plurality of virtual straight lines SL1 can be defined in the region AS. And any of the plurality of virtual straight lines SL1 that intersect the region AS intersects at least one of the plurality of slits 42. Although only one virtual straight line SL1 is shown in FIG. 9(a), a plurality of virtual straight lines SL1 arranged in the Y direction so as to intersect the region AS can be defined.

[0095] In this way, in the first embodiment, in the cover 40, the slits 42 are defined so that the direction D2 in which the regions without the slits 42 are linearly continuous and the direction D1 of the streak-like coating unevenness shown in FIG. 3(b) are not parallel. That is, at any position in the Y direction of the cover 40, there is no location where the region without the slits 42 is linearly continuous in a direction parallel to the direction D1 from the upstream end to the downstream end in the direction D1 in the region AS.

[0096] According to the first embodiment, in at least the region AS, the reduction is achieved in which the region without the slit 42 is continuous in the direction of the virtual straight line SL1, that is, the D1 direction. That is, the reduction is achieved in which the direction D1 of the streak-like coating unevenness on the substrate S and the direction D2 of the slit 42 in the cover 40 are parallel to each other. As a result, in the substrate S subjected to the drying process, the reduction is achieved in which the streak-like unevenness is emphasized. For example, the unevenness in the element performance in the organic EL panel is reduced, and the luminance unevenness is reduced. That is, the streak-like coating unevenness of the solution film F on the substrate S is relaxed through the drying process, the reduction is achieved in which the film formation unevenness is arranged in streaks, and the unevenness in the element performance visually recognized by the user is reduced. Therefore, according to the first embodiment, an advantageous technique is provided for drying the ink on the substrate S, and the yield of the panel obtained by drying the substrate S is improved.

[0097] FIG. 9(b) is a plan view of the cover 40 according to Modification 1 of the first embodiment. In the cover 40 shown in FIG. 9(a), the case where each slit 42 (virtual straight line SL2) linearly extends in the length direction at 90° with respect to the virtual straight line SL1 has been described, but it is not limited to 90°. That is, it is only necessary that each slit 42 (virtual straight line SL2) intersects the virtual straight line SL1, and for example, each slit 42 (virtual straight line SL2) may be at 45° with respect to the virtual straight line SL1.

[0098] The arrangement and dimensions of the plurality of slits 42 can be determined so that the drying of the solution film F is performed uniformly. For example, near the outer periphery of the substrate S, the drying rate of the solution film F tends to be high, and near the center of the substrate S, the drying rate of the solution film F tends to be low. In such a case, by increasing the aperture ratio near the center of the substrate S and decreasing the aperture ratio near the outer periphery of the substrate S, the drying rate of the solution film F can be made uniform in the in-plane direction along the main surface MS of the substrate S.

[0099] FIG. 10(a) is a plan view of the cover 40 according to Modification 2 of the first embodiment. The aperture area per unit area in the cover 40 is referred to as the aperture ratio. The cover 40 has the aperture areas of the respective slits 42 adjusted so that the aperture ratio near the outer periphery of the substrate S is smaller than the aperture ratio near the center of the substrate S.

[0100] That is, when viewed in the negative direction of the Z-axis orthogonal to the main surface MS of the substrate S, among the regions AS, the aperture ratio in the central region A1 including the center of the region AS is larger than the aperture ratio in the peripheral region A2 outside the central region A1. When viewed in the negative direction of the Z-axis, the central region A1 and the peripheral region A2 are regions included in the region AS.

[0101] The aperture ratio in the central region A1 is preferably 40% or more and 60% or less. Also, the aperture ratio in the peripheral region A2 is preferably 10% or more and 30% or less. As a means for adjusting the aperture ratio, at least one of the slit width of each slit 42 and the interval between two adjacent slits 42 may be adjusted. For example, the slit width of each slit 42 may be changed while keeping the number of slits 42 per unit area constant, or the number of slits 42 per unit area may be changed.

[0102] In Modification 2, when viewed in the negative direction of the Z-axis orthogonal to the main surface MS of the substrate S, the slit width W11 of the portion included in the central region A1 among the plurality of slits 42 is wider than the slit width W12 of the portion included in the peripheral region A2 among the plurality of slits 42.

[0103] Also, in Modification 2, when viewed in the negative direction of the Z-axis orthogonal to the main surface MS of the substrate S, the slit interval D21 of the portion included in the central region A1 among the plurality of slits 42 is narrower than the slit interval D22 of the portion included in the peripheral region A2 among the plurality of slits 42. Here, the slit intervals D21 and D22 are the minimum values of the intervals between two adjacent slits 42.

[0104] FIG. 10(b) is a plan view of a part of the cover 40 according to Modification 3 of the first embodiment. In Modification 2, an example in which the slit width of the slit 42 is adjusted stepwise has been described. However, as shown in FIG. 10(b), the slit width of the slit 42 may be adjusted continuously.

[0105] <Second Embodiment> The second embodiment will be described. Hereinafter, elements with the same reference numerals as those in the first embodiment have substantially the same configuration and operation as those described in the first embodiment unless otherwise specified, and the parts different from the first embodiment will be mainly described.

[0106] FIG. 11(a) is a plan view of a cover 40 according to the second embodiment. FIG. 11(b) is a plan view of a part of the cover 40 according to the second embodiment. In the second embodiment, what is different from the first embodiment is the configuration of the cover 40.

[0107] As shown in FIG. 11(a), a plurality of slits 42 are defined in the cover 40. Each slit 42 is a wave-shaped slit and extends in a direction parallel to the direction D1. Each slit 42 is formed such that the same shape is periodically repeated in a direction parallel to the direction D1. And the plurality of slits 42 are arranged at intervals in the Y direction orthogonal to the direction D1. The amplitude direction of each slit 42 is parallel to the Y direction orthogonal to the direction D1.

[0108] Viewed in the negative direction of the Z axis orthogonal to the main surface MS of the substrate S, at least two of the plurality of slits 42 intersect a virtual straight line SL1 extending parallel to the direction D1. That is, at least two slits 42, two slits 42 in the second embodiment, intersect at least one virtual straight line SL1 among the plurality of virtual straight lines parallel to the direction D1 that can be defined in the cover 40.

[0109] For each of the plurality of slits 42, the slit length L1 is at least twice the slit width W1. The slit length L1 is the length along the length direction of the slit 42 and is the length of the meandering path as shown in FIG. 11(a). The slit length L1 is preferably at least three times the slit width W1, and more preferably at least four times the slit width W1.

[0110] In the second embodiment, when viewed in the negative direction of the Z-axis orthogonal to the main surface MS of the substrate S, any virtual straight line SL1 extending parallel to the direction D1 in at least the region AS of the cover 40 intersects at least one of the plurality of slits 42. Further, since one slit 42 is a wave-shaped slit extending in a direction parallel to the direction D1, it intersects the virtual straight line SL1 at a plurality of locations.

[0111] According to the second embodiment, in at least the region AS, the reduction of the continuous region without the slit 42 in the direction of the virtual straight line SL1, that is, the D1 direction, is reduced. As a result, in the substrate S subjected to the drying process, the reduction of the streaky unevenness being emphasized is reduced. For example, the unevenness of the element performance in the organic EL panel is reduced, for example, the luminance unevenness is reduced. That is, the streaky coating unevenness of the solution film F on the substrate S is relaxed through the drying process, the reduction of the film formation unevenness being arranged in streaks is reduced, and the unevenness of the element performance visually recognized by the user is reduced. Therefore, according to the second embodiment, an advantageous technique for drying the ink on the substrate S is provided, and the yield of the panel obtained by drying the substrate S is improved.

[0112] Further, since the slit 42 has a periodically bent shape, that is, a wave shape, in the direction parallel to the direction D1, the direction of the length direction of the slit 42 at each position in the direction D1 is prevented from being biased in one direction. Thereby, it is possible to reduce the coincidence of the direction D1 of the streaky coating unevenness and the length direction of the slit 42. Therefore, the unevenness of the element performance visually recognized by the user is reduced.

[0113] Note that depending on the definition method of the virtual straight line SL1, as shown in FIG. 11(b), when viewed in the negative direction of the Z-axis orthogonal to the main surface MS of the substrate S, each of the two adjacent slits 42 intersects a single virtual straight line SL1 at a plurality of locations. Also, although not shown, each of three or more slits 42 may intersect a single virtual straight line SL1 at a plurality of locations. Thereby, the continuity of the region without the slit 42 in the direction parallel to the D1 direction is effectively reduced.

[0114] Also, in the second embodiment, although the case where one slit 42 is a wavy slit that intersects the virtual straight line SL1 at a plurality of positions has been described, the present invention is not limited thereto. FIG. 11(c) is a plan view of a part of the cover 40 according to Modification 4 of the second embodiment. As shown in FIG. 11(c), when viewed in the negative direction of the Z-axis orthogonal to the main surface MS of the substrate S, one slit 42 has a zigzag shape that intersects the virtual straight line SL1 at a plurality of positions.

[0115] FIG. 12(a) is a plan view of the cover 40 according to Modification 5 of the second embodiment. The opening area per unit area in the cover 40 is referred to as the opening ratio. The opening area of each slit 42 of the cover 40 is adjusted so that the opening ratio near the outer periphery of the substrate S is smaller than the opening ratio near the center of the substrate S.

[0116] That is, when viewed in the negative direction of the Z-axis orthogonal to the main surface MS of the substrate S, among the regions AS, the opening ratio in the central region A1 including the center of the region AS is larger than the opening ratio in the peripheral region A2 outside the central region A1. When viewed in the negative direction of the Z-axis, the central region A1 and the peripheral region A2 are regions included in the region AS.

[0117] The opening ratio in the central region A1 is preferably 40% or more and 60% or less. Also, the opening ratio in the peripheral region A2 is preferably 10% or more and 30% or less. As a means for adjusting the opening ratio, at least one of the slit width of each slit 42 and the interval between two adjacent slits 42 may be adjusted. For example, the slit width of each slit 42 may be changed while keeping the number of slits 42 per unit area constant, or the number of slits 42 per unit area may be changed.

[0118] In Modification 5, when viewed in the negative direction of the Z-axis orthogonal to the main surface MS of the substrate S, the slit width W21 of the portion of the plurality of slits 42 included in the central region A1 is wider than the slit width W22 of the portion of the plurality of slits 42 included in the peripheral region A2.

[0119] Also, in Modification 5, when viewed in the negative direction of the Z-axis orthogonal to the main surface MS of the substrate S, among the plurality of slits 42, the slit interval D31 of the portion included in the central region A1 is narrower than the slit interval D32 of the portion included in the peripheral region A2 among the plurality of slits 42. Here, the slit intervals D31 and D32 are the minimum values among the intervals between two adjacent slits 42.

[0120] FIG. 12(b) is a plan view of a part of the cover 40 according to Modification 6 of the second embodiment. In Modification 5, an example in which the slit width of the slit 42 is adjusted stepwise has been described. However, as shown in FIG. 12(b), the slit width of the slit 42 may be adjusted continuously.

[0121] FIG. 12(c) is a plan view of a part of the cover 40 according to Modification 7 of the second embodiment. In Modification 5, an example in which the slit interval between two adjacent slits 42 is adjusted by adjusting the slit width of each of the two adjacent slits 42 has been described. However, as shown in FIG. 12(c), the slit interval may be adjusted by changing the pitch of the plurality of slits 42.

[0122] Thus, the adjustment of the aperture ratio may be performed by adjusting the slit width stepwise or continuously to adjust the aperture ratio, or by adjusting the pitch of the slits stepwise or continuously.

[0123] FIG. 13 is a plan view of the cover 40 according to Modification Example 8 of the second embodiment. In Modification Example 8, when viewed in the negative direction of the Z-axis orthogonal to the main surface MS of the substrate S, an opening (large opening) 43 is defined in the central region A1 of the cover 40. The opening area of the large opening 43 is wider than the opening area of each slit 42. The large opening 43 is formed in a substantially rectangular shape. The length of one side of the large opening 43 is wider than the slit width W40 of each of the plurality of slits 42. The size of the large opening 43 preferably has a maximum of 1 / 5 of the width in the short side direction of the substrate S on one side. Thereby, the drying rate of the solution film F disposed at the end portion on the main surface MS of the substrate S is suppressed by the slit 42, and as a result, the drying rate of the solution film F can be made uniform over the in-plane direction of the main surface MS. Note that the aperture ratio in the central region A1 can also be 100%. That is, the aperture ratio in the central region A1 can also be an aperture ratio exceeding the upper limit value 60% described in Modification Example 6.

[0124] FIG. 14(a) is a perspective view of the cover 40 according to Modification Example 9 of the second embodiment. In order to suppress a decrease in the rigidity of the cover 40, the thickness T1 of the cover 40 is set according to the number of slits 42 defined in the cover 40. That is, the larger the number of slits 42, the thicker the cover 40 is set. Thereby, since the rigidity of the cover 40 is increased, vibration and distortion are reduced.

[0125] FIG. 14(b) is a perspective view of the cover 40 and the support portion 50 that supports the cover 40 according to Modification Example 10 of the second embodiment. In Modification Example 10, in order to reduce the vibration and distortion of the cover 40, the support portion 50 has a plurality of beams 501 arranged at intervals from each other. The cover 40 is fixed to the plurality of beams 501. Thereby, the vibration and distortion of the cover 40 are reduced. The beam 501 is preferably arranged to intersect the direction D1.

[0126] FIG. 14(c) is a perspective view of the cover 40 and the support portion 50 that supports the cover 40 according to Modification Example 11 of the second embodiment. In Modification Example 11, in order to reduce the vibration and distortion of the cover 40, the support portion 50 is configured as a hanging structure that hangs the cover 40.

[0127] <Third Embodiment> The third embodiment will be described. Hereinafter, elements with the same reference numerals as those in the first embodiment have substantially the same configuration and operation as those described in the first embodiment unless otherwise specified, and the parts different from the first embodiment will be mainly described. FIG. 15 is a plan view of a cover 40 according to the third embodiment.

[0128] Here, the cover of the comparative example will be described. FIG. 16(a) is a plan view of a cover 40Z of Comparative Example 3. The cover 40Z has a plurality of openings 42Z arranged in a matrix. Each opening 42Z has the same opening area as each other. FIG. 16(b) is an explanatory diagram of the drying rate in the drying process of Comparative Example 3.

[0129] As shown in FIG. 16(b), when evaluating the drying rate, if the regions where the drying rate of the substrate S is the same are connected by lines, it often becomes a circular or elliptical drying rate profile like a contour line. The drying rate V1 of the portion corresponding to the central portion of the substrate S in the solution film F is slower than the drying rate V2 of the portion corresponding to the peripheral portion of the substrate S in the solution film F. That is, the drying rate V2 is faster than the drying rate V1. In order to uniformly adjust the drying rate of the solution film F on the substrate S, it is necessary to set a high opening ratio for the portion facing the portion with a slow drying rate and a low opening ratio for the portion facing the portion with a fast drying rate.

[0130] The cover 40 of the third embodiment shown in FIG. 15 has a plurality of ring-shaped slits 42 arranged concentrically along the drying rate profile of Comparative Example 3 when viewed in the negative direction of the Z-axis orthogonal to the main surface MS of the substrate S.

[0131] When viewed in the negative direction of the Z-axis orthogonal to the main surface MS of the substrate S, each slit 42 may be circular or elliptical, but in the third embodiment, when viewed in the negative direction of the Z-axis orthogonal to the main surface MS of the substrate S, each slit 42 is in a zigzag shape along the circumferential direction of the ring. Note that each slit 42 may be in a waveform instead of the zigzag shape.

[0132] As described above, according to the third embodiment, in the in-plane direction along the main surface MS, the drying rate of the solution film F can be made more uniform. Also, in the third embodiment, similar to the modification of the first embodiment, the opening ratio of the central region A1 may be made larger than the opening ratio of the peripheral region A2. For example, a large opening 43 may be arranged in the central region A1, or the slit width and slit interval of each slit 42 may be adjusted. And the cover 40 may be supported by the support portion 50 as in any of the modifications shown in FIGS. 14(b) and 14(c).

[0133] <Fourth Embodiment> The fourth embodiment will be described. Hereinafter, elements denoted by the same reference numerals as those in the first to third embodiments have substantially the same configuration and operation as those described in the first embodiment unless otherwise specified, and differences from the first to third embodiments will be mainly described. FIG. 17(a) is a schematic cross-sectional view of a cover unit 400 according to the fourth embodiment.

[0134] The cover 40 of the cover unit 400 has a plurality of rotatable members 40-1 to 40-5. Each of the plurality of members 40-1 to 40-5 is a plate member and has two main surfaces. The plurality of members 40-1 to 40-5 are rotatable independently of each other. Specifically, each of the members 40-1 to 40-5 is rotatable by the drive of a drive mechanism (not shown). The rotation control of the members 40-1 to 40-5 is performed by the control device 90 shown in FIG. 1.

[0135] FIGS. 17(b) and 17(c) are perspective views of the cover 40 according to the fourth embodiment. In the fourth embodiment, the members 40-1 to 40-5 are arranged at intervals in the Y direction. The members 40-1 to 40-5 have the X direction as the longitudinal direction and the Y direction as the short direction. Each of the members 40-1 to 40-5 has a rotation axis 44 parallel to the X axis and is rotationally driven about the rotation axis 44.

[0136] As shown in Fig. 17(a), when the main surfaces of each of the members 40-1 to 40-5 face the substrate S side, these main surfaces are flush with each other. In the state where the members 40-1 to 40-5 are in the posture shown in Fig. 17(a), a plurality of wavy slits 42 as described in the second embodiment are defined by the members 40-1 to 40-5. The solvent vapor G flows from the space SP2 to the space SP1 through each slit 42.

[0137] Hereinafter, the rotation control of the members 40-1 to 40-5 by the control device 90 will be described. The control device 90 controls the pressure inside the container in the drying steps D11 to D14 shown in Fig. 7. Figs. 18(a) to 18(c) are explanatory views of the rotation control of each of the members 40-1 to 40-5 of the cover 40 according to the fourth embodiment.

[0138] In the drying step D12, the main surfaces of the members 40-1 to 40-5 face the main surface MS of the substrate S, and the pressure in the space SP2 is maintained at the first pressure P11, so that the solution film F dries uniformly. That is, the solution film F can be dried so that the film thickness of the solution film F is uniform. Therefore, the surface of the solution film F can be made into a flat surface.

[0139] In the drying step D12, when the solvent evaporates from the solution film F, the solvent vapor G temporarily stays in the space SP2 surrounded by the cover unit 400. Then, the solvent vapor G flows from the space SP2 to the space SP1 through the slit 42 between the members 40-1 to 40-5. A part of the solvent vapor G in the space SP2 aggregates on the surrounding wall 41 and the members 40-1 to 40-5 and adheres as a liquid.

[0140] When the amount of the solvent adhering to the inner surface of the cover unit 400 increases, the solvent partial pressure in the space SP2 rises when the solvent adhering to the inner surface of the cover unit 400 evaporates. When the solvent partial pressure rises, there is a risk that the evaporation of the solvent in the solution film F will be inhibited.

[0141] Therefore, in the fourth embodiment, after the drying step D13, that is, in the drying step D13 or D14, preferably in the drying step D13, the control device 90 controls a drive mechanism (not shown) so that the members 40-2 to 40-4 rotate about the rotation shaft 44 by 180° from the state in the drying step D12. FIG. 18(b) shows the state of the members 40-2 to 40-4 before rotation, and FIG. 18(c) shows the state of the members 40-2 to 40-4 after rotation.

[0142] In the fourth embodiment, by rotating the members 40-2 to 40-4 by half a turn, the main surface to which the solvent adheres is directed toward the space SP1 side, and the clean main surface is directed toward the space SP2 side. Therefore, by rotating the members 40-2 to 40-4 by 180°, the amount of solvent adhering to the inner surface of the cover unit 400 facing the space SP2 can be reduced. As a result, the amount of solvent adhering to the inner surface of the cover unit 400 facing the space SP2 can be maintained at a low level, the solvent contained in the solution film F can be dried stably and at high speed, and a film can be formed stably. That is, the drying time of the solution film F can be shortened.

[0143] Further, since the main surface to which the solvent adheres in the members 40-2 to 40-4 faces the space SP1 side, the solvent adhering to the main surface evaporates, and the main surface becomes a clean surface. Therefore, it is not necessary to separately provide a step of removing the solvent on the main surface after the drying step D14, and the tact time can be shortened.

[0144] Also, in the drying steps D13 and D14, the control device 90 introduces an inert gas into the space SP2 through the gas introduction portion 52. As a result, the inert gas is sprayed onto the inner surface of the surrounding wall 41, and the solvent adsorbed on the inner surface of the surrounding wall 41 can be desorbed. In addition, the drying of the solution film F can be promoted, and the drying speed can be further increased.

[0145] In the drying steps D13 and D14, the inert gas introduced from the gas introduction part 52 also has the effect of discharging the solvent staying in the space SP2 to the space SP1. Thereby, the drying rate of the solvent of the solution film F can be further increased. Note that the timing of starting the introduction of the inert gas may be before the rotation of the members 40-2 to 40-4, during the rotation, or after the rotation.

[0146] In the fourth embodiment, the case where the members 40-2 to 40-4 facing the substrate S in the Z direction are rotated by 180° in the drying step D13 or D14, preferably in the drying step D13, has been described. However, the present invention is not limited to this. All the members 40-1 to 40-5 may be rotated by 180°. <Embodiment of the method for manufacturing an article> The method for manufacturing an article according to an embodiment of the present disclosure is suitable for manufacturing an article such as an organic EL (OLED) panel using an inkjet coating apparatus, for example. The method for manufacturing an article of the present embodiment includes a step (coating step) of disposing or coating a solution film (a solution containing a solute and a solvent for forming an organic film) on a substrate by a printing method or the like using an inkjet coating apparatus to obtain a coated substrate. Further, the method includes a step (drying step) of drying the solution film on the coated substrate by the above-described reduced-pressure drying apparatus to obtain a dried substrate on which a dried film is formed. Furthermore, such a manufacturing method includes other well-known steps (firing, cooling, dehumidification, dry cleaning, formation of electrodes, formation of a sealing film, etc.). The method for manufacturing an article of the present embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of the article as compared with the conventional method.

[0147] The present disclosure is not limited to the embodiments described above, and many modifications are possible within the technical idea of the present disclosure. For example, at least two of the above-described plurality of embodiments and a plurality of modification examples may be combined. In addition, the effects described in the present embodiment merely list the most preferable effects resulting from the embodiments of the present disclosure, and the effects according to the embodiments of the present disclosure are not limited to those described in the present embodiment.

[0148] The disclosure of the above embodiments includes the following items.

[0149] (Item 1) A first unit that scans the ink supply unit in a first direction along the main surface of the substrate by moving at least one of the ink supply unit and the substrate, and supplies ink to the main surface of the substrate; A second unit that dries the ink disposed on the main surface of the substrate, and the second unit includes a container that defines an internal space in which the substrate is conveyed, and a cover disposed inside the container so as to face the main surface of the substrate conveyed into the container, and the cover is configured to define a plurality of slits that communicate a first space on the substrate side with respect to the cover and a second space on the side opposite to the substrate with respect to the cover, and when viewed in a direction orthogonal to the main surface, at least two of the plurality of slits intersect a virtual straight line extending parallel to the first direction, A system characterized by this.

[0150] (Item 2) Each of the at least two slits has a slit length that is two or more times the slit width, The system according to Item 1, characterized by this.

[0151] (Item 3) The at least two slits are arranged at intervals from each other in the first direction, The system according to Item 1 or 2, characterized by this.

[0152] (Item 4) Each of the at least two slits linearly extends in a second direction intersecting the first direction, The system according to Item 2 or 3, characterized by this.

[0153] (Item 5) The second direction is a direction orthogonal to the first direction. The system according to claim 4, characterized in that.

[0154] (Clause 6) When viewed in the direction orthogonal to the main surface, each of the at least two slits has a wavy or zigzag shape that intersects the virtual straight line at a plurality of locations. The system according to claim 1 or 2, characterized in that.

[0155] (Clause 7) When viewed in the direction orthogonal to the main surface, each of the at least two slits is a ring-shaped slit. When viewed in the direction orthogonal to the main surface, the at least two slits are arranged concentrically. The system according to claim 1 or 2, characterized in that.

[0156] (Clause 8) When viewed in the direction orthogonal to the main surface, each of the at least two slits has a wavy or zigzag shape along the circumferential direction of the ring. The system according to claim 7, characterized in that.

[0157] (Clause 9) When viewed in the direction orthogonal to the main surface, among the regions of the substrate that overlap the main surface, the aperture ratio in the central region is larger than the aperture ratio in the peripheral region outside the central region. The system according to any one of claims 1 to 8, characterized in that.

[0158] (Clause 10) The aperture ratio in the central region is 40% or more and 60% or less. The aperture ratio in the peripheral region is 10% or more and 30% or less. The system according to claim 9, characterized in that.

[0159] (Clause 11) When viewed in a direction perpendicular to the main surface, the slit width of the portion included in the central region among the plurality of slits is wider than the slit width of the portion included in the peripheral region among the plurality of slits. The system according to claim 9 or 10, characterized in that.

[0160] (Item 12) When viewed in a direction perpendicular to the main surface, the slit interval of the portion included in the central region among the plurality of slits is narrower than the slit interval of the portion included in the peripheral region among the plurality of slits. The system according to any one of claims 9 to 11, characterized in that.

[0161] (Item 13) When viewed in a direction perpendicular to the main surface, an opening wider than the opening area of each of the plurality of slits is defined in the central region of the cover. The system according to any one of claims 9 to 12, characterized in that.

[0162] (Item 14) The cover has a plurality of rotatable members, and the plurality of slits are defined by the plurality of members with the main surface of each of the plurality of members facing the substrate side. The system according to any one of claims 1 to 6, characterized in that.

[0163] (Item 15) A first unit that scans the ink supply unit in a first direction along the main surface of the substrate to supply ink to the main surface of the substrate by moving at least one of the ink supply unit and the substrate; A second unit that dries the ink disposed on the main surface of the substrate, and is provided with. The second unit is A container that defines an internal space in which the substrate is conveyed; A cover disposed inside the container so as to face the main surface of the substrate conveyed inside the container, and has. The cover is configured to define a plurality of slits that communicate a first space on the substrate side with respect to the cover and a second space on the side opposite to the substrate with respect to the cover. When viewed in a direction orthogonal to the main surface, in at least the region of the cover that overlaps the main surface of the substrate, any virtual straight line extending parallel to the first direction intersects at least one of the plurality of slits. A system characterized by the above.

[0164] (Item 16) The ink supply unit is an application head having a plurality of nozzles arranged in a direction intersecting the first direction. The system according to any one of Items 1 to 15, characterized by the above.

[0165] (Item 17) A substrate processing apparatus for drying ink disposed on the main surface of a substrate, comprising: A container that defines an internal space in which the substrate is conveyed; A cover disposed inside the container so as to face the main surface of the substrate conveyed inside the container. The cover is configured to define a plurality of slits that communicate a first space on the substrate side with respect to the cover and a second space on the side opposite to the substrate with respect to the cover. When viewed in a direction orthogonal to the main surface, at least two of the plurality of slits intersect a virtual straight line extending parallel to the first direction. A substrate processing apparatus characterized by the above.

[0166] (Item 18) A substrate processing apparatus for drying ink disposed on the main surface of a substrate, comprising: A container that defines an internal space in which the substrate is conveyed; A cover disposed inside the container so as to face the main surface of the substrate conveyed inside the container. The cover is configured to define a plurality of slits that communicate a first space on the substrate side with respect to the cover and a second space on the side opposite to the substrate with respect to the cover. When viewed in a direction orthogonal to the main surface, any virtual straight line extending parallel to the first direction in at least the region of the cover that overlaps the main surface of the substrate intersects at least one of the plurality of slits. A substrate processing apparatus characterized by the above.

[0167] (Item 19) A substrate processing method characterized by processing a substrate using the substrate processing apparatus according to Item 17 or 18.

[0168] (Item 20) A method for manufacturing an article, characterized by manufacturing an article by processing a substrate using the system according to any one of Items 1 to 16.

Explanation of Reference Numerals

[0169] D1… Direction (First Direction), IK… Ink, MS… Main Surface, S… Substrate, SL1… Virtual Straight Line, 40… Cover, 42… Slit, 100… Coating Unit (First Unit), 130… Coating Head (Ink Supply Unit), 200… Drying Unit (Second Unit, Substrate Processing Apparatus), 201… Container, 1000… Substrate Processing System (System)

Claims

1. A first unit that scans the ink supply unit in a first direction along the main surface of the substrate by moving at least one of the ink supply unit and the substrate to supply ink to the main surface of the substrate; A second unit that dries the ink disposed on the main surface of the substrate, The second unit, A container that defines an internal space in which the substrate is conveyed; A cover disposed inside the container so as to face the main surface of the substrate conveyed inside the container, The cover is configured to define a plurality of slits that communicate a first space on the substrate side with respect to the cover and a second space on the side opposite to the substrate with respect to the cover; When viewed in a direction orthogonal to the main surface, at least two of the plurality of slits intersect a virtual straight line extending parallel to the first direction; A system characterized by the above.

2. Each of the at least two slits has a slit length that is at least twice the slit width; The system according to claim 1, characterized by the above.

3. The at least two slits are arranged at intervals from each other in the first direction; The system according to claim 1, characterized by the above.

4. Each of the at least two slits linearly extends in a second direction intersecting the first direction; The system according to claim 2, characterized by the above.

5. The second direction is a direction orthogonal to the first direction; The system according to claim 4, characterized by the above.

6. When viewed in a direction orthogonal to the main surface, each of the at least two slits is in a wave shape or a zigzag shape that intersects the virtual straight line at a plurality of locations; The system according to claim 1, characterized by the above.

7. When viewed in a direction orthogonal to the main surface, each of the at least two slits is a ring-shaped slit; When viewed in a direction orthogonal to the main surface, the at least two slits are arranged concentrically; The system according to claim 1, characterized by the above.

8. When viewed in a direction orthogonal to the main surface, each of the at least two slits is in a wave shape or a zigzag shape along the circumferential direction of the ring; The system according to claim 7, characterized by the above.

9. When viewed in a direction perpendicular to the main surface, among the regions of the substrate that overlap with the main surface, the aperture ratio in the central region is larger than the aperture ratio in the peripheral region outside the central region. The system according to claim 1, characterized in that.

10. The aperture ratio in the central region is 40% or more and 60% or less, The aperture ratio in the peripheral region is 10% or more and 30% or less. The system according to claim 9, characterized in that.

11. When viewed in a direction perpendicular to the main surface, the slit width of the portion of the plurality of slits included in the central region is wider than the slit width of the portion of the plurality of slits included in the peripheral region. The system according to claim 9, characterized in that.

12. When viewed in a direction perpendicular to the main surface, the slit pitch of the portion of the plurality of slits included in the central region is narrower than the slit pitch of the portion of the plurality of slits included in the peripheral region. The system according to claim 9, characterized in that.

13. When viewed in a direction perpendicular to the main surface, in the cover, an opening wider than the opening area of each of the plurality of slits is defined in the central region. The system according to claim 9, characterized in that.

14. The cover has a plurality of rotatable members, and the plurality of slits are defined by the plurality of members with the main surface of each of the plurality of members facing the substrate side. The system according to claim 1, characterized in that.

15. A first unit that scans the ink supply unit in a first direction along the main surface of the substrate to supply ink to the main surface of the substrate by moving at least one of the ink supply unit and the substrate; A second unit that dries the ink disposed on the main surface of the substrate, and The second unit is A container that defines an internal space through which the substrate is conveyed; A cover disposed inside the container so as to face the main surface of the substrate conveyed inside the container, and The cover is configured to define a plurality of slits that communicate a first space on the substrate side with respect to the cover and a second space on the side opposite to the substrate with respect to the cover. When viewed in a direction perpendicular to the main surface, in the cover, at least in the region overlapping the main surface of the substrate, any virtual straight line extending parallel to the first direction intersects at least one of the plurality of slits. A system characterized by the following.

16. The ink supply unit is an application head having a plurality of nozzles arranged in a direction intersecting the first direction. The system according to claim 1, characterized by the above.

17. A substrate processing apparatus for drying ink disposed on a main surface of a substrate, comprising: A container defining an internal space in which the substrate is conveyed; A cover disposed inside the container so as to face the main surface of the substrate conveyed inside the container. The cover is configured to define a plurality of slits that communicate a first space on the substrate side with respect to the cover and a second space on the side opposite to the substrate with respect to the cover. When viewed in a direction orthogonal to the main surface, at least two of the plurality of slits intersect a virtual straight line extending parallel to the first direction. A substrate processing apparatus characterized by the above.

18. A substrate processing apparatus for drying ink disposed on a main surface of a substrate, comprising: A container defining an internal space in which the substrate is conveyed; A cover disposed inside the container so as to face the main surface of the substrate conveyed inside the container. The cover is configured to define a plurality of slits that communicate a first space on the substrate side with respect to the cover and a second space on the side opposite to the substrate with respect to the cover. When viewed in a direction orthogonal to the main surface, in at least the region of the cover that overlaps the main surface of the substrate, any virtual straight line extending parallel to the first direction intersects at least one of the plurality of slits. A substrate processing apparatus characterized by the above.

19. A substrate processing method characterized by processing a substrate using the substrate processing apparatus according to claim 17 or 18.

20. A method for manufacturing an article, characterized by manufacturing an article by processing a substrate using the system according to any one of claims 1 to 16.

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