Assembly structure and illuminating device

Abstract

To provide an assembly structure that improves heat dissipation performance from a chip-on-board type light emitting module.SOLUTION: An assembly structure 1 is used for a chip-on-board type light emitting module 4 comprising a board 2 and an LED light emitting part 3. The assembly structure 1 comprises a connection pin 6 electrically connected to a power supply part 5 for supplying electric power to the light emitting module 4, and a holding jig 7 provided on the board 2, and electrically connected to the LED light emitting part 3. The board 2 comprising a through hole 23 opened in a front surface 21 and a back surface 22, and penetrating the board 2. The connection pin 6 is inserted into the through hole 23. The holding jig 7 is electrically and mechanically connected to a portion of the connection pin 6 protruding from the through hole 23, on the side of the front surface 21 or the back surface 22 of the board 2.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present disclosure generally relates to an assembled structure and a lighting device, and more particularly to an assembled structure applicable to a lighting device and the like and a lighting device provided with the same.

Background Art

[0002] Patent Document 1 describes a light source device including a chip-on-board (COB) light-emitting diode (LED) light source, a light source encapsulation material, a dispersed color conversion medium, and a glass housing plate. The COB-LED light source includes a heat dissipation heat sink support and at least one LED, and inside, the light source encapsulation material is distributed on the upper part of the LED to define a light source encapsulation material cavity. The glass housing plate is disposed above the light source encapsulation material cavity and includes the dispersed color conversion medium. The light source encapsulation material encapsulates the LED and has a sufficient thickness to define a heat conduction path TPE that extends from the dispersed color conversion medium through the light source encapsulation material to the heat dissipation heat sink support, and is distributed on the upper part of the LED. The dispersed color conversion medium is two-dimensionally dispersed and formed above the light emitting field in the glass housing plate.

Prior Art Document

Patent Document

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In a lighting device including a COB type light emitting module as described above, compared with a surface mount device (SMD) type light emitting module, it has high output but also generates a large amount of heat, and it is desired to dissipate heat efficiently.

[0005] An object of the present disclosure is to provide an assembly structure and a lighting device that can improve the heat dissipation performance of a chip-on-board type light-emitting module.

Means for Solving the Problems

[0006] The assembly structure according to one aspect of the present disclosure is used for a chip-on-board type light-emitting module having a substrate and an LED light-emitting unit. The assembly structure includes a connection pin and a holding jig. The connection pin is electrically connected to a power supply unit that supplies power to the light-emitting module. The holding jig is provided on the substrate and is electrically connected to the LED light-emitting unit. The substrate has openings on the front surface and the back surface, and has through holes that penetrate the substrate in the thickness direction. The connection pin is inserted into the through hole. The holding jig is electrically and mechanically connected to a part of the connection pin protruding from the through hole on the front surface side or the back surface side of the substrate.

[0007] The lighting device according to one aspect of the present disclosure includes a light-emitting module, a power supply unit, a connection pin, and a holding jig. The light-emitting module is of a chip-on-board type having a substrate and an LED light-emitting unit. The power supply unit supplies power to the light-emitting module. The connection pin is electrically connected to the power supply unit. The holding jig is provided on the substrate and is electrically connected to the LED light-emitting unit. The substrate has openings on the front surface and the back surface, and has through holes that penetrate the substrate in the thickness direction. The connection pin is inserted into the through hole. The holding jig is electrically and mechanically connected to a part of the connection pin protruding from the through hole on the front surface side or the back surface side of the substrate.

Advantages of the Invention

[0008] The assembly structure and the lighting device of the present disclosure can improve the heat dissipation performance of a chip-on-board type light-emitting module.

Brief Description of the Drawings

[0009]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

[0010] Hereinafter, the assembly structure according to the embodiments of the present disclosure will be described with reference to the drawings. Note that each of the embodiments described below shows a preferred specific example of the present disclosure. Therefore, the numerical values, materials, components, arrangements of components, connection forms, order of steps, etc. shown in the following embodiments are merely examples and are not intended to limit the present disclosure. Thus, among the following embodiments, components not described in the independent claims indicating the highest-level concept of the present disclosure will be described as optional components. Note that each of the drawings referred to in the following embodiments is a schematic diagram and is not necessarily drawn precisely. That is, the respective ratios of the sizes and thicknesses of the components in the drawings do not necessarily reflect the actual dimensional ratios.

[0011] (1) Overview Figure 1 is a schematic cross-sectional view of the assembly structure 1 according to the present embodiment. The assembly structure 1 includes a light-emitting module 4, a connection pin 6, and a holding jig 7. The light-emitting module 4 is of a Chip On Board (hereinafter sometimes referred to as "COB") type having a substrate 2 and an LED light-emitting unit 3. The connection pin 6 is electrically connected to the power supply unit 5. The holding jig 7 is provided on the substrate 2 and is electrically connected to the LED (Light Emitting Diode) light-emitting unit 3. The substrate 2 has a through hole 23 that opens to the front surface 21 and the back surface 22. The connection pin 6 is inserted into the through hole 23. The holding jig 7 is electrically and mechanically connected to a part of the connection pin 6 protruding from the through hole 23 on the front surface 21 side (or the back surface 22 side) of the substrate 2.

[0012] In the assembly structure 1 of this embodiment, the heat generated in the light-emitting module 4 is conducted to the power supply unit 5 through the holding jig 7 and the connection pins 6. Therefore, the heat dissipation performance from the COB type light-emitting module 4, which generates more heat than the Surface Mount Device (hereinafter sometimes referred to as "SMD") type, can be improved.

[0013] When the heat dissipation performance from the COB type light-emitting module 4 is improved in this way, the temperature of the LEDs in the LED light-emitting unit 3 is less likely to rise due to the heat generated by the LEDs themselves, and the output decrease (decrease in luminous efficiency) due to this temperature rise is less likely to occur. Therefore, it becomes easier to increase the output (higher wattage) of the light-emitting module 4.

[0014] (2) Details The assembly structure 1 of this embodiment is applicable to various lighting devices. FIG. 1 shows a state in which the assembly structure 1 is incorporated into an LED lamp. The assembly structure 1 includes a light-emitting module 4, connection pins 6, and a holding jig 7.

[0015] The light-emitting module 4 is of the COB type having a substrate 2 and an LED light-emitting unit 3. That is, the light-emitting module 4 includes a flat substrate 2 and an LED light-emitting unit 3 provided on the surface 21 of the substrate 2. The LED light-emitting unit 3 has a plurality of LED chips directly mounted on one side of the substrate 2. The light-emitting module 4 emits light from the LED light-emitting unit 3 when the LED chips of the LED light-emitting unit 3 emit light.

[0016] In this embodiment, of the two surfaces facing each other in the thickness direction of the substrate 2, the one surface on which the LED light-emitting unit 3 is provided is defined as the surface 21 of the substrate 2, and the opposite surface (the surface on which the LED light-emitting unit 3 is not provided) is defined as the back surface 22 of the substrate 2.

[0017] The substrate 2 is a mounting substrate for mounting the LED chips of the LED light-emitting unit 3. As the substrate 2, for example, a ceramic substrate, a resin substrate, a metal substrate, or the like is used. As the metal substrate, an aluminum substrate is exemplified, but it is not limited thereto. The substrate 2 has a substantially rectangular shape in plan view (the shape seen from a direction perpendicular to the front surface 21 or the back surface 22), but for example, it may have a shape in which a part (such as a corner) of a square is cut out. Note that the shape of the substrate 2 in plan view is not limited to a rectangle, and it may be circular or the like. The substrate 2 is provided with a terminal for receiving DC power for causing the LED chips of the LED light-emitting unit 3 to emit light, and a metal wiring of a predetermined pattern for electrically connecting the LED chips to each other.

[0018] The substrate 2 has through holes 23. The through holes 23 penetrate the substrate 2 in the thickness direction and open to the front surface 21 and the back surface 22 of the substrate 2. Two through holes 23 are provided in the substrate 2. One through hole 23 is formed near one corner of the substantially rectangular substrate 2 in plan view. The other through hole 23 is formed near the other corner of the substantially rectangular substrate 2 in plan view. The two through holes 23 are substantially located on the diagonal line of the substantially rectangular substrate 2 in plan view.

[0019] When the substrate 2 is a ceramic substrate, the through holes 23 can be formed as round holes (the shape of the opening in plan view is circular). When the substrate 2 is a ceramic substrate, the through holes 23 are formed in the shape of round holes during molding and then fired, so round holes are easier to make. On the other hand, when the substrate 2 is an aluminum substrate, since the through holes 23 are formed by cutting out from a flat square plate, the through holes 23 can be formed as square holes (the shape of the opening in plan view is square).

[0020] The LED light-emitting part 3 includes a plurality of LED chips mounted on the substrate 2 and a sealing member 31 that seals the plurality of LED chips. The sealing member 31 covers and seals the plurality of LED chips mounted on the substrate 2. The LED chips of the LED light-emitting part 3 are, for example, bare chips that emit single-color visible light. Specifically, blue LED chips that emit blue light when energized can be used. The plurality of LED chips are arranged in a matrix on the substrate 2. Note that at least one LED chip may be arranged.

[0021] The sealing member 31 of the LED light-emitting part 3 is made of a light-transmissive insulating resin material such as silicone resin, for example. The sealing member 31 in the present embodiment may contain a phosphor as a wavelength conversion material that converts the light from the LED chip. In this case, the sealing member 31 is, for example, a phosphor-containing resin in which the phosphor is dispersed in silicone resin, and converts the light from the LED chip to a predetermined wavelength (color conversion).

[0022] The sealing member 31 is formed so that its shape in plan view is circular so as to seal all the LED chips at once. A ring-shaped dam portion 32 is provided on the outer periphery of the sealing member 31 in plan view. By this dam portion 32, when the liquid sealing member 31 is applied to the substrate 2, it is blocked, and then the liquid sealing member 31 hardens to form a solid sealing member 31. Note that the sealing member 31 may seal the LED chips at once so as to have a shape other than circular (for example, rectangular).

[0023] The connection pin 6 is electrically connected to the power supply unit 5. The LED chips of the light-emitting module 4 emit light by the power supplied from the power supply unit 5. The power supply unit 5 generates the power for causing the light-emitting module 4 to emit light and supplies it to the light-emitting module 4. Specifically, the power supply unit 5 supplies a direct current to the light-emitting module 4. The light-emitting module 4 emits light from the LED chips by the direct current supplied from the power supply unit 5 and radiates light.

[0024] The power supply unit 5 includes a lighting circuit (power supply circuit) for turning on and off the light-emitting module 4. For example, the lighting circuit of the power supply unit 5 converts the AC power supplied from the base pins into DC power. The lighting circuit includes, for example, a constant current circuit. The power supply unit 5 may include not only the lighting circuit but also a lighting control circuit. For example, the power supply unit 5 may include a dimming circuit or a color mixing circuit as the lighting control circuit. Further, the power supply unit 5 may have other control circuits such as a wireless communication circuit for wireless communication with an external device.

[0025] As shown in FIG. 1, the power supply unit 5 has a circuit board 51 and a plurality of circuit elements 52 arranged on the circuit board 51. The circuit board 51 is, for example, a printed circuit board (PCB) on which metal wiring such as copper foil is formed. The circuit board 51 may be a single-sided board with metal wiring formed on only one side, or a double-sided board with metal wiring formed on both sides. The main surface of the circuit board 51 is arranged in a posture (lying horizontally) substantially facing the main surfaces (front surface 21 and back surface 22) of the board 2 of the light-emitting module 4.

[0026] The circuit elements 52 are mounted on the circuit board 51 and are electrically connected to each other by the metal wiring formed on the circuit board 51. The circuit elements 52 are electronic components for turning on the light-emitting module 4. The plurality of circuit elements 52 are, for example, capacitive elements such as electrolytic capacitors and ceramic capacitors, coil elements (inductors) such as choke coils and choke transformers, resistive elements such as resistors, transistor elements such as FETs, noise filters, diodes, or IC packages.

[0027] The connection pin 6 is made of a conductive material such as copper or a copper alloy (such as brass) and is formed in a substantially cylindrical or substantially tubular shape. Further, the connection pin 6 may be plated with gold, nickel, a nickel alloy, or the like. The connection pin 6 is inserted into the through hole 23 of the board 2 of the light-emitting module 4. The connection pin 6 extends in a direction parallel to the through direction of the through hole 23. That is, the axial direction of the connection pin 6 is parallel to the through direction of the through hole 23.

[0028] One end of the connection pin 6 in the longitudinal direction is the first end 61. The first end 61 protrudes outside the through hole 23 from the opening of the through hole 23 on the surface 21 side of the substrate 2. The other end of the connection pin 6 in the longitudinal direction is the second end 62. The second end 62 protrudes outside the through hole 23 from the opening of the through hole 23 on the back surface 22 side of the substrate 2. The second end 62 is electrically connected to the metal wiring formed on the circuit board 51 of the power supply unit 5.

[0029] The holding jig 7 is electrically and mechanically connected to a part of the connection pin 6 protruding from the through hole 23. The holding jig 7 is provided on the surface 21 of the substrate 2. The holding jig 7 is electrically and mechanically connected to the metal wiring on the surface 21. The holding jig 7 is fixed, for example, by soldering to the pad portion 24 of the metal wiring. The connection pin 6 is electrically connected to the metal wiring of the substrate 2 of the light emitting module 4 and the LED chip of the LED light emitting portion 3 by being electrically connected to the holding jig 7.

[0030] Figure 3 shows a cross-sectional view of the holding jig 7. The holding jig 7 is formed of a conductive material. The holding jig 7 is formed of, for example, a metal material such as copper or a copper alloy (such as brass). The holding jig 7 may also be plated with gold, nickel, a nickel alloy, or the like.

[0031] The holding jig 7 has a base portion 71 and a pair of clamping portions 72. The base portion 71 is formed in a substantially rectangular shape in plan view. The base portion 71 has a pin insertion hole 73 penetrating in the thickness direction at a substantially central portion. The pair of clamping portions 72 are formed by being cut and raised on the base portion 71 at the peripheral portion of the pin insertion hole 73. The tip portions of the pair of clamping portions 72 are close to each other. The proximity position of the tip portions of the pair of clamping portions 72 is a position facing the pin insertion hole 73.

[0032] The holding jig 7 is provided on the surface 21 of the substrate 2. The holding jig 7 is provided corresponding to each of the two through holes 23 of the substrate 2. Accordingly, two holding jigs 7 are provided on the substrate 2. The holding jig 7 has the back surface of the base portion 71 (the surface opposite to the side where the pair of clamping portions 72 protrude) in contact with the pad portion 24 and electrically connected. Also, the holding jig 7 is mechanically connected by being fixed to the pad portion 24 by soldering or the like. Further, the pin insertion hole 73 is disposed at a position facing the opening on the surface 21 side of the through hole 23.

[0033] The connection pin 6 is inserted into the through hole 23. The connection pin 6 can be inserted from the opening on the back surface 22 side of the substrate 2 of the through hole 23. The first end portion 61 of the connection pin 6 protrudes from the opening on the front surface 21 side of the substrate 2 of the through hole 23. At this time, the connection pin 6 is inserted into the pin insertion hole 73 of the base portion 71 of the holding jig 7, whereby the connection pin 6 is positioned with respect to the holding jig 7. Also, the first end portion 61 of the connection pin 6 is inserted between the tip portions of the pair of clamping portions 72. Thereby, the tip portions of the pair of clamping portions 72 come into contact with the peripheral surface of the connection pin 6, and the connection pin 6 and the holding jig 7 are electrically connected. Also, the pair of clamping portions 72 has an elastic force like a leaf spring. Accordingly, the connection pin 6 is held by the pair of clamping portions 72 with an elastic force and mechanically and electrically connected.

[0034] The holding jig 7 is provided with a housing 70. The holding jig 7 is housed in the housing 70 with the tip portion exposed. The housing 70 is formed of an insulating material such as synthetic resin. Thereby, it becomes easier to ensure the insulation between the holding jig 7 and the connection pin 6 and the substrate 2. When the substrate 2 is an electrically insulating substrate such as a ceramic substrate, the housing 70 is not essential and may or may not be provided. When the substrate 2 is a conductive substrate such as an aluminum substrate, it is preferably provided in order to ensure the insulation between the holding jig 7 and the connection pin 6 and the substrate 2. A part of the housing 70 on the substrate 2 side is inserted into the through hole 23.

[0035] The assembled structure 1 of this embodiment is incorporated in the lighting device 10. As the lighting device 10, for example, a lighting lamp can be exemplified. The lighting device 10 shown in FIG. 1 includes a housing 11 and a globe 12. The housing 11 is formed hollow, and a power supply unit 5 is disposed inside the housing 11. Further, the housing 11 is provided with a flat installation portion 13. The peripheral end portion of the installation portion 13 protrudes outside the housing 11 as a globe installation portion 131. The opening end portion 121 of the globe 12 is installed in the globe installation portion 131.

[0036] The globe 12 is formed to be transparent or translucent and is formed in a hemispherical or dome shape. The globe 12 is formed of, for example, a synthetic resin such as polycarbonate resin or acrylic resin, or glass. The globe 12 is provided so as to cover the assembled structure 1 of this embodiment. That is, the substrate 2, the light emitting module 4, the holding jig 7, and the connection pin 6 are covered with the globe 12. The light emitted from the light emitting module 4 is radiated to the outside of the lighting device 10 through the globe 12.

[0037] In the assembled structure 1 of this embodiment, a flat support plate 14 is provided on the installation portion 13, and the substrate 2 is provided on the support plate 14. A hole portion 141 is provided in the support plate 14 at a position facing the through hole 23. The hole portion 141 is a hole that penetrates the support plate 14 in the thickness direction. Further, a through hole 132 is formed in the installation portion 13 at a position facing the hole portion 141 and the through hole 23. The through hole 132 is a hole that penetrates the installation portion 13 in the thickness direction. The substrate 2 is screwed in the vicinity of two corner portions on the diagonal line, and connection pins 6 are arranged at the remaining two corners.

[0038] Then, a housing 70 is inserted into the through hole 23 and the hole portion 141. Further, the connection pin 6 is inserted inside the through hole 23, the hole portion 141, and the through hole 132. The first end portion 61 of the connection pin 6 protrudes from the through hole 23 and is electrically and mechanically connected to the holding jig 7 and held. The second end portion 62 of the connection pin 6 protrudes from the through hole 132 and is electrically and mechanically connected to the power supply unit 5 and held.

[0039] In this embodiment, it is preferable that the minimum distance S1 between the substrate 2 and the connection pin 6 is 0.2 mm or more. This makes it easier to ensure the electrical insulation between the connection pin 6 and the substrate 2. In particular, when the substrate 2 is a conductive substrate such as an aluminum substrate, it becomes easier to ensure the electrical insulation. The minimum distance S1 is the distance between the back surface 22 of the substrate 2 and the portion of the connection pin 6 exposed from the housing 70. It is preferable to change the minimum distance S1 according to the input voltage from the power supply unit 5 to the substrate 2. If the input voltage from the power supply unit 5 to the substrate 2 is 38.1 V or less, the minimum distance S1 between the substrate 2 and the connection pin 6 may be 0.2 mm or more. However, if the input voltage from the power supply unit 5 to the substrate 2 exceeds 38.1 V and is about 90 V, it is preferable that the minimum distance S1 between the substrate 2 and the connection pin 6 is 0.4 mm or more. This makes it easier to ensure the electrical insulation.

[0040] In this embodiment, it is preferable that the light shielding angle θ1 of the LED light emitting unit 3 is 30° or less. This makes it less likely that the light emission from the LED light emitting unit 3 is obstructed by the holding jig 7. The light shielding angle θ1 is the angle between the limit line where the light from the LED light emitting unit 3 does not enter the eyes and the surface 21 of the substrate 2. Considering the 1 / 2 light distribution angle of the Lambertian light distribution of the LED light emitting unit 3, it is preferably the light shielding angle θ1, and it is particularly suitable when the lighting device 10 does not include a lens.

[0041] In the present embodiment, the LED light-emitting unit 3 and the holding jig 7 are provided on the same surface (the surface 21) of the substrate 2. It is preferable that the protruding dimension H1 from the same surface (the surface 21) of the holding jig 7 is 2 mm or more and 5 mm or less. Thereby, the emission of light from the LED light-emitting unit 3 is less likely to be obstructed by the holding jig 7, and the interference with the lens for light distribution control is also less likely to be obstructed. When the protruding dimension H1 from the surface 21 of the holding jig 7 is any one of 2 mm, 3 mm, 4 mm, and 5 mm, even if the light-emitting module 4 is of the COB type, the adverse effect on the height of the holding jig 7 is less likely to occur. Considering the light distribution of the LED light-emitting unit 3 and the shadow of the light on the glove 12, it is preferable that the protruding dimension H1 of the holding jig 7 is smaller. For example, when the protruding dimension H1 of the holding jig 7 is 5 mm, assuming the Lambertian light distribution of the LED light-emitting unit 3, the light that enters the range of the half-light angle can be taken out to the outside of the lighting device 10 almost without being obstructed. When the protruding dimension H1 of the holding jig 7 is 3 mm, the utilization efficiency of light can be further improved compared to the case of 5 mm, and the holding jig 7 can be brought closer to the LED light-emitting unit 3 compared to the case of 5 mm, making it easier to reduce the diameter and size of the lighting device 10.

[0042] In the present embodiment, it is preferable that the minimum distance L1 between the LED light-emitting unit 3 and the holding jig 7 is 2 mm or more. According to this, the emission of light from the LED light-emitting unit 3 is less likely to be obstructed by the holding jig 7. Note that the minimum distance L1 between the LED light-emitting unit 3 and the holding jig 7 referred to here is equivalent to the distance between the dam portion 32 of the LED light-emitting unit 3 and the pad portion 24 to which the holding jig 7 is connected.

[0043] As shown in FIG. 4, considering the light distribution of the COB type LED light emitting part 3, the light distribution angle (the angle at which it becomes 50% of the maximum value) is generally 120°. The width L2 of the dam part (bank part) 32 around the sealing member 31 of the LED light emitting part 3 is obtained by the difference between D1 and D2. Here, D1 is the outer diameter of the dam part 32, and D2 is the inner diameter of the dam part 32. When D1 = 11.5 mm and D2 = 9.8 mm, the width L2 of the dam part 32 is (11.5 - 9.8) / 2 = 0.85 mm. Also, when the distance (the same as the minimum distance L1 between the LED light emitting part 3 and the holding jig 7) L1 between the dam part 32 and the pad part 24 is 0.78 mm, the distance L3 from the sealing member 31 (light emitting part) to the pad part 24 is 0.85 + 0.78 = 1.63 mm. If the thickness t1 of the sealing member 31 (light emitting part) is 1.4 - 0.9 = 0.5 mm, the protruding dimension (height of the holding jig 7) H1 of the holding jig 7 is (1.63 / √3)+0.5 = 0.94 + 0.5 = 1.44 mm. Therefore, it is more preferable that the protruding dimension H1 of the holding jig 7 is 1.5 mm or less.

[0044] In the present embodiment, it is preferable that the distance L4 between the holding jig 7 and the glove 12 covering the light emitting module 4 is 8 mm or more. Thereby, the shadow of the holding jig 7 is less likely to appear on the glove 12, and the appearance of the lighting device 10 is less likely to be impaired. The distance L4 between the holding jig 7 and the glove 12 can be 10 mm or 15 mm. Note that the distance L4 between the holding jig 7 and the glove 12 is the same as the shortest distance between the holding jig 7 and the glove 12.

[0045] (3) Modification The embodiment is merely one of various embodiments of the present disclosure. The embodiment can be variously modified according to the design and the like as long as the object of the present disclosure can be achieved.

[0046] In the embodiment, the holding jig 7 is provided on the surface 21 of the substrate 2, but not limited thereto, the holding jig 7 may be provided on the back surface 22 of the substrate 2. In this case, the pad part to which the holding jig 7 is connected is formed on the back surface 22 of the substrate 2.

[0047] In the embodiment, the holding jig 7 is held by the housing 70, but it is not limited thereto, and the housing 70 may be omitted.

[0048] In the embodiment, the substrate 2 and the power supply unit 5 are separated, but it is not limited thereto, and the substrate 2 and the power supply unit 5 may be in contact with each other. In this case, heat is easily transferred from the substrate 2 to the power supply unit 5, and the heat dissipation property from the substrate 2 is enhanced. The substrate 2 preferably contacts the circuit board 51 of the power supply unit 5.

[0049] FIG. 5 shows, as a modified example, a lighting device 10 with a different shape of the globe 12. In FIG. 1, a dome-shaped globe 12 is used, but the globe 12 may have a flat shape as shown in FIG. 5.

[0050] Also, FIG. 6 shows, as another modified example, a lighting device 10 with a different shape of the globe 12. This globe 12 is formed in a flat shape and has a lens portion 125 at a substantially central portion.

[0051] (Summary) As described above, the assembly structure (1) according to the first aspect is used for a chip-on-board type light-emitting module (4) having a substrate (2) and an LED light-emitting portion (3). The assembly structure (1) includes a connection pin (6) and a holding jig (7). The connection pin (6) is electrically connected to a power supply unit (5) that supplies power to the light-emitting module (4). The holding jig (7) is provided on the substrate (2) and is electrically connected to the LED light-emitting portion (3). The substrate (2) has an opening on the front surface (21) and the back surface (22), and has a through hole (23) that penetrates the substrate (2) in the thickness direction. The connection pin (6) is inserted into the through hole (23). The holding jig (7) is electrically and mechanically connected to a part of the connection pin (6) protruding from the through hole (23) on the front surface (21) side or the back surface (22) side of the substrate (2).

[0052] According to this aspect, the heat generated in the light-emitting module (4) is conducted to the power supply unit (5) through the holding jig (7) and the connection pins (6), and the heat dissipation from the chip-on-board type light-emitting module (4), which generates more heat than the surface-mount type, can be improved.

[0053] The second aspect is that, in the assembly structure (1) according to the first aspect, the minimum distance between the substrate (2) and the connection pins (6) is 0.2 mm or more.

[0054] According to this aspect, even if the substrate (2) has conductivity, the electrical insulation with the connection pins (6) is less likely to deteriorate.

[0055] The third aspect is that, in the assembly structure (1) according to the first or second aspect, the holding jig (7) is electrically and mechanically connected to a part of the connection pins (6) by elasticity.

[0056] According to this aspect, the electrical and mechanical connection between the holding jig (7) and the connection pins (6) can be easily performed.

[0057] The fourth aspect is that, in the assembly structure (1) according to any one of the first to third aspects, the light-shielding angle of the LED light-emitting unit (3) is 30° or less.

[0058] According to this aspect, the emission of light from the LED light-emitting unit (3) is less likely to be obstructed by the holding jig (7).

[0059] The fifth aspect is that, in the assembly structure (1) according to any one of the first to fourth aspects, the LED light-emitting unit (3) and the holding jig (7) are provided on the same surface of the substrate (2), and the protruding dimension (H1) from the same surface of the holding jig (7) is 2 mm or more and 5 mm or less.

[0060] According to this aspect, the emission of light from the LED light-emitting unit (3) is less likely to be obstructed by the holding jig (7).

[0061] The sixth aspect is that, in the assembly structure (1) according to any one of the first to fifth aspects, the minimum distance (L3) between the LED light-emitting part (3) and the holding jig (7) is 2 mm or more.

[0062] According to this aspect, the emission of light from the LED light-emitting part (3) is less likely to be obstructed by the holding jig (7).

[0063] The seventh aspect is that, in the assembly structure (1) according to any one of the first to sixth aspects, the distance (L4) between the holding jig (7) and the glove (12) covering the light-emitting module (4) is 8 mm or more.

[0064] According to this aspect, the shadow of the holding jig (7) is less likely to appear on the glove (12).

[0065] The lighting device (10) according to the eighth aspect includes a light-emitting module (4), a power supply unit (5), a connection pin (6), and a holding jig (7). The light-emitting module (4) is of the chip-on-board type having a substrate (2) and an LED light-emitting part (3). The power supply unit (5) supplies power to the light-emitting module (4). The connection pin (6) is electrically connected to the power supply unit (5). The holding jig (7) is provided on the substrate (2) and is electrically connected to a part of the connection pin (6) protruding from the through-hole (23). The substrate (2) has an opening on the front surface (21) and the back surface (22), and has a through-hole (23) penetrating the substrate (2) in the thickness direction. The connection pin (6) is inserted into the through-hole (23). The holding jig (7) is electrically and mechanically connected to a part of the connection pin (6) protruding from the through-hole (23) on the front surface (21) side or the back surface (22) side of the substrate (2).

[0066] According to this aspect, the heat generated in the light-emitting module (4) is conducted to the power supply unit (5) through the holding jig (7) and the connection pin (6), and the heat dissipation from the chip-on-board type light-emitting module (4), which generates more heat than the surface-mount type, can be improved.

Explanation of reference numerals

[0067] 1 Assembly structure 2 Substrate 3 LED Light Emitting Unit 4 Light Emitting Module 5 Power Supply Unit 6 Connection Pin 7 Holding Fixture 10 Lighting Device 12 Glove 21 Surface 22 Back Surface 23 Through-Hole

Claims

1. An assembly structure used for a chip-on-board type light-emitting module having a substrate and an LED light-emitting unit, a connection pin electrically connected to a power supply unit that supplies power to the light-emitting module, and a holding jig provided on the substrate and electrically connected to the LED light-emitting unit, wherein the substrate has openings on a front surface and a back surface and has a through hole penetrating the substrate in a thickness direction, the connection pin is inserted into the through hole, and the holding jig is electrically and mechanically connected to a part of the connection pin protruding from the through hole on a front surface side or a back surface side of the substrate, the assembly structure.

2. The assembly structure according to claim 1, wherein a minimum distance between the substrate and the connection pin is 0.2 mm or more.

3. The assembly structure according to claim 1 or 2, wherein the holding jig is electrically and mechanically connected to a part of the connection pin by elasticity.

4. The assembly structure according to claim 1 or 2, wherein a light-shielding angle of the LED light-emitting unit is 30° or less.

5. The assembly structure according to claim 1 or 2, wherein the LED light-emitting unit and the holding jig are provided on the same surface of the substrate, and a protruding dimension of the holding jig from the same surface is 2 mm or more and 5 mm or less.

6. The assembly structure according to claim 1 or 2, wherein a minimum distance between the LED light-emitting unit and the holding jig is 2 mm or more.

7. The assembly structure according to claim 1 or 2, wherein a distance between the holding jig and a glove covering the light-emitting module is 8 mm or more.

8. A chip-on-board type light-emitting module having a substrate and an LED light-emitting unit, a power supply unit that supplies power to the light-emitting module, a connection pin electrically connected to the power supply unit, and a holding jig provided on the substrate and electrically connected to the LED light-emitting unit, wherein the substrate has openings on a front surface and a back surface and has a through hole penetrating the substrate in a thickness direction, the connection pin is inserted into the through hole, and the holding jig is electrically and mechanically connected to a part of the connection pin protruding from the through hole on a front surface side or a back surface side of the substrate, a lighting device. ​ ​ ​ ​ ​ ​

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