Vehicular lighting device and vehicular lighting fixture

Abstract

To provide a vehicular lighting device capable of improving heat dissipation even when a gap is required between nearby a peripheral edge of a substrate and one end of a socket, and a vehicular lighting fixture.SOLUTION: A vehicular lighting device comprises: a socket which has a recessed part open to one end; a mount part or a salient part provided on a bottom side of the recessed part; a substrate provided on the mount part or the salient part and protruding from the mount part or the salient part nearby a peripheral edge in a direction crossing a center axis of the vehicular lighting device; a light-emitting element provided on the substrate; and a peripheral part provided in a region between a side face of the mount part and a side face of the recessed part or in a region between a side face of the salient part and the side face of the recessed part, including a heat dissipation resin, and coming into contact with the bottom of the recessed part and a bottom-side surface of the recessed part at the protruding portion of the substrate.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] Embodiments of the present invention relate to a vehicle lighting device and a vehicle lamp.

Background Art

[0002] From the viewpoints of energy saving and extended lifespan, instead of a vehicle lighting device equipped with a lamp having a filament, the spread of a vehicle lighting device equipped with a light emitting element such as a light emitting diode has been progressing. Such a vehicle lighting device includes a socket and a light emitting module having a substrate and a light emitting element. The substrate of the light emitting module is adhered to one end side of the socket.

[0003] Here, when adhering the substrate of the light emitting module to one end side of the socket, the vicinity of the periphery of the surface of the substrate on the socket side is held by a chuck such as a transfer device. Therefore, a gap for the chuck to enter is required between the vicinity of the periphery of the substrate and one end of the socket.

[0004] However, if there is a gap between the vicinity of the periphery of the substrate and one end of the socket, the heat generated when the vehicle lighting device is lit becomes difficult to be transmitted to the socket. When the generated heat becomes difficult to be transmitted to the socket, the temperature of the light emitting element tends to increase. In recent years, higher luminous flux of vehicle lighting devices has been demanded, and there is a risk that the temperature of the light emitting element will become even higher. In this case, if the temperature of the light emitting element exceeds the maximum junction temperature, the light emitting element may malfunction or the luminous flux of the light irradiated from the light emitting element may decrease.

[0005] Therefore, even if a gap is required between the vicinity of the periphery of the substrate and one end of the socket, the development of a technology capable of improving heat dissipation has been desired.

Prior Art Documents

Patent Documents

[0006]

Patent Document 1

SUMMARY OF THE INVENTION

PROBLEMS TO BE SOLVED BY THE INVENTION

[0007] The problem to be solved by the present invention is to provide a vehicle lighting device and a vehicle lamp that can improve heat dissipation even when a gap is required between the vicinity of the peripheral edge of a substrate and one end of a socket.

MEANS FOR SOLVING THE PROBLEMS

[0008] The vehicle lighting device according to the embodiment includes: a socket having a recess that opens at one end; a mounting portion or a convex portion provided on the bottom surface side of the recess; a substrate provided on the mounting portion or the convex portion and having a vicinity of the peripheral edge protruding from the mounting portion or the convex portion in a direction intersecting the central axis of the vehicle lighting device; a light-emitting element provided on the substrate; and a peripheral portion provided in a region between the side surface of the mounting portion and the side surface of the recess, or in a region between the side surface of the convex portion and the side surface of the recess in a direction intersecting the central axis of the vehicle lighting device, containing a heat-dissipating resin, and contacting the bottom surface of the recess and the surface on the bottom surface side of the protruding portion of the substrate.

EFFECTS OF THE INVENTION

[0009] According to the embodiment of the present invention, it is possible to provide a vehicle lighting device and a vehicle lamp that can improve heat dissipation even when a gap is required between the vicinity of the peripheral edge of a substrate and one end of a socket.

BRIEF DESCRIPTION OF THE DRAWINGS

[0010]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Mode for Carrying Out the Invention

[0011] Hereinafter, embodiments will be exemplified with reference to the drawings. In each drawing, the same components are denoted by the same reference numerals, and detailed descriptions thereof are omitted as appropriate.

[0012] (Vehicle lighting device) The vehicle lighting device 1 according to the present embodiment can be provided, for example, in an automobile, a railway vehicle, or the like. Examples of the vehicle lighting device 1 provided in an automobile include, for example, a front combination lamp (for example, a combination of a daytime running lamp (DRL), a position lamp, a turn signal lamp, etc. as appropriate), and a rear combination lamp (for example, a combination of a stop lamp, a tail lamp, a turn signal lamp, a back lamp, a fog lamp, etc. as appropriate). However, the use of the vehicle lighting device 1 is not limited to these.

[0013] FIG. 1 is a schematic exploded view for illustrating the vehicle lighting device 1 according to the present embodiment. FIG. 2 is a cross-sectional view taken along line A-A of the vehicle lighting device 1 in FIG. 1. FIG. 3 is a schematic plan view of the light emitting module 20. As shown in FIGS. 1 and 2, the vehicle lighting device 1 is provided with, for example, a socket 10, a light emitting module 20, a power supply unit 30, and a heat transfer unit 40.

[0014] Socket 10 has, for example, a mounting portion 11, a bayonet 12, a flange 13, heat dissipation fins 14, and a connector holder 15. The mounting portion 11 is provided on the surface of the flange 13 opposite to the side where the heat dissipation fins 14 are provided. The outer shape of the mounting portion 11 is, for example, cylindrical. The mounting portion 11 has, for example, a recess 11a that opens at the end opposite to the flange 13 side. That is, the socket 10 has a recess 11a that opens at one end.

[0015] The bayonet 12 is provided, for example, on the side surface of the mounting portion 11. The bayonet 12 protrudes toward the outside of the vehicle lighting device 1. The bayonet 12 faces the flange 13. A plurality of bayonets 12 can be provided. The bayonet 12 is used when mounting the vehicle lighting device 1 to the housing 101 of the vehicle lamp 100 described later, for example. The bayonet 12 can be used for a twist lock.

[0016] The flange 13 has, for example, a substantially disc shape. The side surface of the flange 13 is located outside the vehicle lighting device 1 compared to the side surface of the bayonet 12.

[0017] The heat dissipation fins 14 are provided on the side of the flange 13 opposite to the mounting portion 11 side. At least one heat dissipation fin 14 can be provided. For example, as shown in FIGS. 1 and 2, a plurality of heat dissipation fins 14 can be provided on the socket 10. The plurality of heat dissipation fins 14 can be arranged side by side in a predetermined direction. The heat dissipation fins 14 have, for example, a plate shape or a cylindrical shape.

[0018] The connector holder 15 is provided on the side of the flange 13 opposite to the mounting portion 11 side. The connector holder 15 can be provided side by side with the heat dissipation fins 14. The connector holder 15 has a cylindrical shape, and a connector 105 having a seal member 105a inside is inserted therein.

[0019] Socket 10 has the function of holding the light-emitting module 20 and the power supply unit 30, and the function of transferring the heat generated in the light-emitting module 20 to the outside. Therefore, the socket 10 is preferably formed of a material with high thermal conductivity. The socket 10 can be formed of a metal such as an aluminum alloy, for example.

[0020] Also, the socket 10 can be formed of a high thermal conductivity resin, for example. The high thermal conductivity resin is, for example, a resin such as PET (Polyethylene terephthalate) or Nylon mixed with a filler using carbon or aluminum oxide. If the socket 10 includes a high thermal conductivity resin, the heat generated in the light-emitting module 20 can be efficiently dissipated. Also, the weight of the socket 10 can be reduced.

[0021] The light-emitting module 20 (substrate 21) is provided, for example, inside the recess 11a of the socket 10. As shown in FIGS. 1 to 3, the light-emitting module 20 has, for example, a substrate 21, a light-emitting element 22, a frame portion 23, a sealing portion 24, and a circuit element 25.

[0022] The substrate 21 is provided, for example, on the mounting portion 41 described later. When the mounting portion 41 is omitted, for example, the substrate 21 is provided on the convex portion 41a provided on the bottom surface 11a1 of the recess 11a. The substrate 21 can be adhered to the mounting portion 41 or the convex portion 41a. The adhesive for adhering the substrate 21 is preferably an adhesive with high thermal conductivity. For example, the adhesive can be an adhesive mixed with a filler using a conductive material or an inorganic material.

[0023] The substrate 21 has a plate shape. The substrate 21 has a surface 21c and a surface 21b facing the surface 21c. The planar shape of the substrate 21 (the shape when viewed from the direction along the central axis 1a of the vehicle lighting device 1) is, for example, substantially square. The substrate 21 can be formed from an inorganic material such as ceramics (for example, aluminum oxide or aluminum nitride), or an organic material such as paper phenol or glass epoxy. Further, the substrate 21 may be a metal core substrate in which the surface of a metal plate is coated with an insulating material. The substrate 21 may have a single-layer structure or a multilayer structure.

[0024] Further, the substrate 21 has a wiring pattern 21a. The wiring pattern 21a is provided on the surface 21b of the substrate 21. The wiring pattern 21a is formed from, for example, a material mainly composed of silver or a material mainly composed of copper. Also, a coating portion for covering the wiring pattern 21a and a film-like resistor described later can be provided. The coating portion can contain, for example, a glass material.

[0025] The light-emitting element 22 is provided on the substrate 21. For example, the light-emitting element 22 is provided on the surface 21b side of the substrate 21. The light-emitting element 22 is electrically connected to the wiring pattern 21a. At least one light-emitting element 22 can be provided. The vehicle lighting device 1 (light-emitting module 20) illustrated in FIGS. 1 to 3 is provided with a plurality of light-emitting elements 22. When a plurality of light-emitting elements 22 are provided, the plurality of light-emitting elements 22 can be connected in series.

[0026] The light-emitting element 22 can be, for example, a light-emitting diode, an organic light-emitting diode, a laser diode, or the like.

[0027] The light-emitting element 22 can be any of a chip-shaped light-emitting element, a surface-mount type light-emitting element such as a PLCC (Plastic Leaded Chip Carrier) type, and a light-emitting element having lead wires such as a bullet type. However, if the light-emitting element 22 is a chip-shaped light-emitting element, the light-emitting module 20 can be miniaturized, and thus the vehicle lighting device 1 can be miniaturized.

[0028] In the following, as an example, the case where the light-emitting element 22 is a chip-shaped light-emitting element will be described. The chip-shaped light-emitting element 22 can be electrically connected to the wiring pattern 21a by COB (Chip On Board). The chip-shaped light-emitting element 22 may be any of an upper electrode type light-emitting element, an upper and lower electrode type light-emitting element, and a flip chip type light-emitting element.

[0029] The frame portion 23 has a frame shape and surrounds the light-emitting element 22. The frame portion 23 can be adhered to the surface 21b of the substrate 21 using an adhesive. The contour (planar shape contour) of the frame portion 23 when viewed from the direction along the central axis 1a of the vehicle lighting device 1 can be appropriately changed according to the required light distribution characteristics, luminance distribution, etc. For example, the planar shape contour of the frame portion 23 can be a circle, a quadrilateral, an ellipse, etc. Note that the planar shape contour of the frame portion 23 illustrated in FIGS. 1 to 3 is a circle.

[0030] The frame portion 23 is formed of, for example, a resin. The resin can be, for example, a thermoplastic resin such as PBT (polybutylene terephthalate), PC (polycarbonate), PET, nylon, PP (polypropylene), PE (polyethylene), PS (polystyrene).

[0031] The frame portion 23 has a function of a reflector that reflects the light emitted from the light-emitting element 22 and a function of defining the formation range of the sealing portion 24. Therefore, if the frame portion 23 is provided, the light extraction efficiency of the light emitted from the light-emitting element 22 can be improved. Also, if the frame portion 23 is provided, the formation range of the sealing portion 24 can be reduced, so that the light-emitting module 20 can be miniaturized, and thus the vehicle lighting device 1 can be miniaturized.

[0032] The sealing portion 24 is provided inside the frame portion 23. The sealing portion 24 is provided so as to cover the region surrounded by the frame portion 23. The sealing portion 24 is provided so as to cover the light-emitting element 22. The sealing portion 24 contains a resin having translucency. The sealing portion 24 is formed, for example, by filling resin inside the frame portion 23. The filling of the resin is performed using, for example, a dispenser or the like. The resin to be filled is, for example, a silicone resin or the like. Further, a phosphor can also be included in the sealing portion 24. In addition, when the light-emitting element 22 is a surface-mount type light-emitting element or a light-emitting element having lead wires such as a bullet type, the frame portion 23 and the sealing portion 24 can be omitted.

[0033] In addition, an optical element or the like can be provided as necessary. The optical element is, for example, a convex lens, a concave lens, a light guide, or the like. The optical element can be provided, for example, on the sealing portion 24.

[0034] The circuit element 25 can be a passive element or an active element used to constitute a light-emitting circuit having the light-emitting element 22. The circuit element 25 is provided, for example, on the substrate 21. The circuit element 25 is provided, for example, around the frame portion 23 and is electrically connected to the wiring pattern 21a. The circuit element 25 is electrically connected to the light-emitting element 22 via the wiring pattern 21a.

[0035] The circuit elements 25 illustrated in FIGS. 1 and 3 are a protection element 25a, a resistor 25b, and a control element 25c. However, the type of the circuit element 25 is not limited to the illustrated ones and can be appropriately changed according to the configuration of the light-emitting circuit having the light-emitting element 22. For example, in addition to the above-described ones, the circuit element 25 may be a capacitor, a positive characteristic thermistor, a negative characteristic thermistor, an inductor, a surge absorber, a varistor, a transistor, an integrated circuit, an arithmetic element, or the like.

[0036] The protection element 25a is provided, for example, to prevent a reverse voltage from being applied to the light-emitting element 22 and to prevent pulse noise from the reverse direction from being applied to the light-emitting element 22. The protection element 25a is, for example, a diode. The protection element 25a illustrated in FIGS. 1 and 3 is a surface-mounted diode.

[0037] The resistor 25b can be, for example, a surface-mounted resistor, a resistor having lead wires (metal oxide film resistor), a film resistor formed using a screen printing method, or the like. Note that the resistor 25b illustrated in FIGS. 1 and 3 is a film resistor.

[0038] Here, since there are variations in the forward voltage characteristics of the light-emitting element 22, if the applied voltage between the anode terminal and the ground terminal is made constant, there will be variations in the brightness (luminous flux, luminance, luminous intensity, illuminance) of the light emitted from the light-emitting element 22. Therefore, in order for the brightness of the light emitted from the light-emitting element 22 to be within a predetermined range, the value of the current flowing through the light-emitting element 22 is made to be within a predetermined range by the resistor 25b connected in series with the light-emitting element 22. In this case, by changing the resistance value of the resistor 25b, the value of the current flowing through the light-emitting element 22 is made to be within a predetermined range.

[0039] When the resistor 25b is a surface-mounted resistor or a resistor having lead wires, a resistor 25b having an appropriate resistance value is selected according to the forward voltage characteristics of the light-emitting element 22. When the resistor 25b is a film resistor, if a part of the resistor 25b is removed, the resistance value can be increased. For example, if a laser beam is irradiated on the film resistor, a part of the film resistor can be easily removed. Note that the number, arrangement, size, etc. of the resistor 25b are not limited to those illustrated, and can be appropriately changed according to the number and specifications of the light-emitting element 22.

[0040] The control element 25c is provided, for example, to switch the voltage applied to the light-emitting element 22, to perform temperature derating, or to control the current flowing through the light-emitting element 22. However, the functions and applications of the control element 25c are not limited to those exemplified. The control element 25c can be, for example, a transistor or an integrated circuit. Note that the control element 25c exemplified in FIGS. 1 and 3 is a surface-mounted integrated circuit.

[0041] The power supply unit 30 has, for example, a plurality of power supply terminals 31 and a holding unit 32. The plurality of power supply terminals 31 can be rod-shaped. One end of the plurality of power supply terminals 31 protrudes from the bottom surface 11a1 of the concave portion 11a. One end of the plurality of power supply terminals 31 is soldered to the wiring pattern 21a provided on the substrate 21. The other end of the plurality of power supply terminals 31 is exposed inside the hole of the connector holder 15. A connector 105 is fitted onto the plurality of power supply terminals 31 exposed inside the hole of the connector holder 15. The plurality of power supply terminals 31 are formed of a metal such as a copper alloy, for example. Note that the shape, arrangement, material, etc. of the plurality of power supply terminals 31 are not limited to those exemplified and can be changed as appropriate.

[0042] When the socket 10 is formed using, for example, a high thermal conductivity resin containing a filler using carbon or metal, etc., the socket 10 has conductivity. Therefore, the holding unit 32 is provided to insulate between the plurality of power supply terminals 31 and the conductive socket 10. Note that when the socket 10 is formed using an insulating high thermal conductivity resin (for example, a high thermal conductivity resin containing a filler using aluminum oxide, etc.), the holding unit 32 can be omitted. The holding unit 32 can be press-fitted into a hole provided in the socket 10 or adhered to the inner wall of the hole, for example.

[0043] The heat transfer unit 40 has a mounting portion 41 and a peripheral portion 42. The mounting portion 41 is provided on the bottom surface 11a1 side of the recess 11a of the socket 10. The light-emitting module 20 (substrate 21) is adhered to the surface of the mounting portion 41 opposite to the socket 10 side. As shown in FIGS. 1 and 2, the mounting portion 41 can be adhered to the bottom surface 11a1 of the recess 11a, for example. Further, the mounting portion 41 can be adhered inside the recess provided on the bottom surface 11a1 of the recess 11a, attached inside the recess via a heat-conductive grease (heat-dissipating grease), or embedded inside the recess by an insert molding method. The mounting portion 41 is formed of a material having a high thermal conductivity. For example, the mounting portion 41 is formed of a metal such as aluminum, an aluminum alloy, copper, or a copper alloy.

[0044] In addition, when the socket 10 is formed of metal or when the heat generated in the light-emitting module 20 is small, the mounting portion 41 can be omitted. When the mounting portion 41 is omitted, for example, a convex portion 41a can be provided on the bottom surface 11a1 of the recess 11a, and the light-emitting module 20 (substrate 21) can be adhered on the convex portion 41a. In this case, the convex portion 41a can be formed integrally with the socket 10, for example.

[0045] Here, when adhering the light-emitting module 20 to the mounting portion 41 or the convex portion 41a provided on the bottom surface 11a1 of the recess 11a, an adhesive is applied to the surface of the mounting portion 41 or the surface of the convex portion 41a. Then, the vicinity of the periphery of the surface 21c of the light-emitting module 20 (substrate 21) is held by a chuck such as a transfer device, and the light-emitting module 20 (substrate 21) held by the transfer device or the like is pressed onto the adhesive.

[0046] Therefore, as shown in FIGS. 1 and 2, the vicinity of the periphery of the substrate 21 is provided outside (in a direction away from the central axis 1a of the vehicle lighting device 1) of the side surface of the mounting portion 41 (a surface intersecting the surface to which the light-emitting module 20 is adhered), or the side surface of the convex portion 41a (a surface intersecting the surface to which the light-emitting module 20 is adhered). That is, in a direction intersecting the central axis 1a of the vehicle lighting device 1, the vicinity of the periphery of the substrate 21 protrudes from the mounting portion 41 or the convex portion 41a. If the vicinity of the periphery of the substrate 21 is provided at such a position, a gap can be provided between the vicinity of the periphery of the surface 21c of the substrate 21 and the bottom surface 11a1 of the concave portion 11a for a chuck to enter.

[0047] However, if there is a gap between the vicinity of the periphery of the surface 21c of the substrate 21 and the bottom surface 11a1 of the concave portion 11a, it becomes difficult for the heat generated when current flows through the light-emitting element 22 to be transmitted to the socket 10. When the generated heat becomes difficult to be transmitted to the socket 10, the temperature of the light-emitting element 22 tends to increase. In recent years, higher luminous fluxes of the vehicle lighting device 1 have been demanded, and there is a risk that the temperature of the light-emitting element 22 will become even higher. In this case, if the temperature of the light-emitting element 22 exceeds the maximum junction temperature, the light-emitting element 22 may fail or the luminous flux of the light emitted from the light-emitting element 22 may decrease.

[0048] Also, as described above, the circuit element 25 is provided around the frame portion 23. In this case, the circuit element 25 may be provided near the periphery of the substrate 21. For example, in the case of the light-emitting module 20 illustrated in FIGS. 1 to 3, the protection element 25a, the resistor 25b, and the control element 25c are provided near the periphery of the substrate 21. Therefore, if there is a gap between the vicinity of the periphery of the surface 21c of the substrate 21 and the bottom surface 11a1 of the recess 11a, it becomes difficult for the heat generated when current flows through the circuit element 25 to be transmitted to the socket 10. When the generated heat becomes difficult to be transmitted to the socket 10, the temperature of the circuit element 25 rises. In this case, depending on the type of the circuit element 25, there is a risk that the function of the circuit element 25 may deteriorate or that the circuit element 25 may easily malfunction. For example, as shown in FIG. 2, if the control element 25c is located at a position facing the gap, there is a risk that the function of the control element 25c may deteriorate or that the control element 25c may easily malfunction.

[0049] Therefore, as shown in FIGS. 1 and 2, a peripheral portion 42 is provided inside the recess 11a of the socket 10. When the mounting portion 41 is provided, in a direction intersecting the central axis 1a of the vehicle lighting device 1, the peripheral portion 42 is provided, for example, in a region between the side surface of the mounting portion 41 and the side surface 11a2 of the recess 11a. When the convex portion 41a is provided on the bottom surface 11a1 of the recess 11a, in a direction intersecting the central axis 1a of the vehicle lighting device 1, the peripheral portion 42 is provided, for example, in a region between the side surface of the convex portion 41a and the side surface 11a2 of the recess 11a.

[0050] Also, in the direction along the central axis 1a of the vehicle lighting device 1, the peripheral portion 42 is in contact with, for example, the bottom surface 11a1 of the recess 11a and the vicinity of the periphery of the surface 21c of the substrate 21 (the surface 21c on the bottom surface 11a1 side of the protruding portion of the substrate 21). If the peripheral portion 42 is in contact with the bottom surface 11a1 of the recess 11a and the vicinity of the periphery of the surface 21c of the substrate 21, the heat in the vicinity of the periphery of the substrate 21 can be transmitted to the socket 10 through the peripheral portion 42. Therefore, even if a gap is required between the vicinity of the periphery of the substrate 21 and one end of the socket 10, the heat dissipation performance can be improved. If the heat dissipation performance can be improved, it is possible to suppress the functions of the light emitting element 22 and the circuit element 25 from deteriorating or being prone to failure.

[0051] When the mounting portion 41 is provided, the peripheral portion 42 can be formed, for example, by filling the region between the side surface of the mounting portion 41 and the side surface 11a2 of the recess 11a with resin. When the convex portion 41a is provided on the bottom surface 11a1 of the recess 11a, the peripheral portion 42 can be formed, for example, by filling the region between the side surface of the convex portion 41a and the side surface 11a2 of the recess 11a with resin.

[0052] In this case, the material of the peripheral portion 42 is preferably a resin (heat dissipating resin) having insulation properties and a high thermal conductivity. The heat dissipating resin having insulation properties can be, for example, a silicone resin (heat dissipating silicone) containing a filler having a high thermal conductivity. For example, the thermal conductivity of the heat dissipating silicone can be 0.55 W / (m·k) or more and 4.0 W / (m·k) or less.

[0053] Also, the color of the heat dissipating resin is preferably white. If the color of the heat dissipating resin is white, the peripheral portion 42 can be given the function of a reflector. Therefore, the light extraction efficiency of the light emitted from the light emitting element 22 can be improved.

[0054] Further, a reflective layer 43 can also be provided on the surface of the peripheral portion 42 on the side opposite to the bottom surface 11a1 side of the concave portion 11a. In this case, the reflectivity of the reflective layer 43 with respect to the light irradiated from the light-emitting element 22 can be made higher than the reflectivity of the peripheral portion 42. The reflective layer 43 can contain, for example, a metal such as aluminum or light-scattering particles such as titanium oxide.

[0055] Also, as described above, the light-emitting module 20 (substrate 21) is adhered to the mounting portion 41 or the convex portion 41a. The mounting portion 41 is adhered to the bottom surface 11a1 of the concave portion 11a or the like. In this case, if there is a gap in the adhesive layer between the mounting portion 41 and the socket 10, the heat generated in the light-emitting module 20 may be difficult to be transmitted to the socket 10. As described above, since the peripheral portion 42 is formed by filling with resin, the gap generated in the adhesive layer can be filled when the resin is filled. Therefore, even if there is a gap in the adhesive layer, it is possible to suppress a decrease in heat dissipation performance.

[0056] FIG. 4 is a schematic cross-sectional view for illustrating a heat transfer portion 40a according to another embodiment. As shown in FIG. 4, the heat transfer portion 40a has a mounting portion 41 and a peripheral portion 42a. Note that, similar to the heat transfer portion 40 described above, when the mounting portion 41 is omitted, a convex portion 41a can be provided on the bottom surface 11a1 of the concave portion 11a.

[0057] The peripheral portion 42a can be the same as the peripheral portion 42 described above. However, as shown in FIG. 4, the peripheral portion 42a further contacts the surface 21b of the substrate 21 on the side opposite to the bottom surface 11a1 side of the concave portion 11a. If the peripheral portion 42a contacts the surface 21b of the substrate 21, it is possible to protect the connection portion between the wiring pattern 21a and the circuit element 25. Also, if the peripheral portion 42a covers the circuit element 25, the heat generated in the circuit element 25 can be transmitted to the socket 10 through the peripheral portion 42a. Therefore, the heat dissipation performance of the circuit element 25 can be improved.

[0058] Further, similar to the heat transfer portion 40 described above, a reflective layer 43 can also be further provided on the surface of the peripheral portion 42a on the side opposite to the bottom surface 11a1 side of the concave portion 11a.

[0059] FIG. 5 is a schematic cross-sectional view for illustrating a heat transfer portion 40b according to another embodiment. As shown in FIG. 5, the heat transfer portion 40b has a mounting portion 41 and a peripheral portion 42b. Note that, similar to the heat transfer portion 40 described above, when the mounting portion 41 is omitted, a convex portion 41a can be provided on the bottom surface 11a1 of the concave portion 11a.

[0060] The peripheral portion 42b is further in contact with the surface 21b of the substrate 21 on the side opposite to the bottom surface 11a1 side of the concave portion 11a, similar to the peripheral portion 42a described above. Therefore, protection of the connection portion between the wiring pattern 21a and the circuit element 25 can be achieved. Further, if the peripheral portion 42b also covers the circuit element 25, the heat generated in the circuit element 25 can be transmitted to the socket 10 through the peripheral portion 42b. Therefore, the heat dissipation performance of the circuit element 25 can be improved.

[0061] Also, the surface of the peripheral portion 42b on the side opposite to the bottom surface 11a1 side of the concave portion 11a is a curved surface protruding toward the bottom surface 11a1 side of the concave portion 11a. In this way, it becomes easy to emit the light irradiated from the light-emitting element 22 and incident on the peripheral portion 42b in the direction along the central axis 1a of the vehicle lighting device 1.

[0062] Further, similar to the heat transfer portion 40 described above, a reflective layer 43 can also be further provided on the surface of the peripheral portion 42b on the side opposite to the bottom surface 11a1 side of the concave portion 11a.

[0063] (Vehicle Lighting Fixture) In one embodiment of the present invention, a vehicle lamp 100 including a vehicle lighting device 1 can be provided. The above description regarding the vehicle lighting device 1 and the modified examples of the vehicle lighting device 1 (for example, the heat transfer parts 40a and 40b, and those in which those skilled in the art appropriately add, delete, or change the design of the components and have the features of the present invention) can all be applied to the vehicle lamp 100.

[0064] In the following, as an example, a case where the vehicle lamp 100 is a rear combination lamp provided in an automobile will be described. However, the vehicle lamp 100 is not limited to the rear combination lamp provided in an automobile. The vehicle lamp 100 may be any vehicle lamp provided in an automobile, a railway vehicle, or the like.

[0065] FIG. 6 is a schematic partial cross-sectional view for exemplifying the vehicle lamp 100. As shown in FIG. 6, the vehicle lamp 100 has, for example, a vehicle lighting device 1, a housing 101, a cover 102, an optical element 103, a seal member 104, and a connector 105.

[0066] The vehicle lighting device 1 is attached to the housing 101. The housing 101 holds the mounting portion 11. The housing 101 has a box shape with one end side open. The housing 101 is formed of, for example, a resin that does not transmit light. On the bottom surface of the housing 101, a mounting hole 101a into which the portion of the mounting portion 11 provided with the bayonet 12 is inserted is provided. A recess into which the bayonet 12 provided on the mounting portion 11 is inserted is provided at the periphery of the mounting hole 101a. Although the case where the mounting hole 101a is directly provided in the housing 101 is exemplified, a mounting member having the mounting hole 101a may be provided in the housing 101.

[0067] When attaching the vehicle lighting device 1 to the vehicle lamp 100, the portion of the mounting part 11 where the bayonet 12 is provided is inserted into the mounting hole 101a, and the vehicle lighting device 1 is rotated. Then, for example, the bayonet 12 is held by the fitting part provided on the periphery of the mounting hole 101a. Such an attachment method is called a twist lock.

[0068] The cover 102 is provided so as to close the opening of the housing 101. The cover 102 is formed of a translucent resin or the like. The cover 102 can also have functions such as a lens.

[0069] The light emitted from the vehicle lighting device 1 is incident on the optical element 103. The optical element 103 performs functions such as reflecting, diffusing, guiding, condensing the light emitted from the vehicle lighting device 1, and forming a predetermined light distribution pattern. For example, the optical element 103 illustrated in FIG. 6 is a reflector. In this case, the optical element 103 reflects the light emitted from the vehicle lighting device 1 to form a predetermined light distribution pattern.

[0070] The seal member 104 is provided between the flange 13 and the housing 101. The seal member 104 has an annular shape and is formed of an elastic material such as rubber or silicone resin.

[0071] When the vehicle lighting device 1 is attached to the vehicle lamp 100, the seal member 104 is sandwiched between the flange 13 and the housing 101. Therefore, the internal space of the housing 101 can be sealed by the seal member 104. Further, due to the elastic force of the seal member 104, the bayonet 12 is pressed against the housing 101. Therefore, it is possible to prevent the vehicle lighting device 1 from detaching from the housing 101.

[0072] The connector 105 is fitted to the ends of a plurality of power supply terminals 31 exposed inside the connector holder 15. A lighting circuit or the like provided outside the vehicle lamp 100 is electrically connected to the connector 105. Therefore, by fitting the connector 105 to the ends of the plurality of power supply terminals 31, the lighting circuit or the like and the light emitting element 22 can be electrically connected.

[0073] Further, the connector 105 is provided with a seal member 105a. When the connector 105 having the seal member 105a is inserted into the connector holder 15, the inside of the connector holder 15 is sealed so as to be watertight.

[0074] As mentioned above, some embodiments of the present invention have been illustrated. However, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, changes, etc. can be made without departing from the gist of the invention. These embodiments and their modifications are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalent scope thereof. Also, the above-described embodiments can be implemented in combination with each other.

[0075] Hereinafter, an appendix regarding the above-described embodiment is shown.

[0076] (Appendix 1) A socket having a recess that opens at one end; A mounting portion or a convex portion provided on the bottom surface side of the recess; A substrate provided on the mounting portion or the convex portion, and in a direction intersecting the central axis of the vehicle lighting device, the vicinity of the periphery protrudes from the mounting portion or the convex portion; A light-emitting element provided on the substrate; In a direction intersecting the central axis of the vehicle lighting device, in the region between the side surface of the mounting portion and the side surface of the recess, or in the region between the side surface of the convex portion and the side surface of the recess, provided with a heat-dissipating resin, and the bottom surface of the recess and the surface on the bottom surface side of the protruding portion of the substrate are in contact with the peripheral portion; A vehicle lighting device comprising:

[0077] (Appendix 2) The vehicle lighting device according to Appendix 1, wherein the color of the heat-dissipating resin is white.

[0078] (Appendix 3) The vehicle lighting device according to Appendix 1 or 2, wherein the peripheral portion further contacts a surface of the substrate on a side opposite to the bottom surface side of the concave portion.

[0079] (Appendix 4) The vehicle lighting device according to any one of Appendices 1 to 3, wherein a surface of the peripheral portion on a side opposite to the bottom surface side of the concave portion is a curved surface protruding toward the bottom surface side of the concave portion.

[0080] (Appendix 5) The vehicle lighting device according to any one of Appendices 1 to 4; A housing to which the vehicle lighting device is attached; A vehicle lamp including the same.

Explanation of Reference Numerals

[0081] 1 Vehicle lighting device, 1a Central axis, 10 Socket, 11 Mounting portion, 11a Concave portion, 11a1 Bottom surface, 20 Light emitting module, 21 Substrate, 22 Light emitting element, 25 Circuit element, 40 Heat transfer portion, 40a Heat transfer portion, 40b Heat transfer portion, 41 Mounting portion, 41a Convex portion, 42 Peripheral portion, 42a Peripheral portion, 42b Peripheral portion, 43 Reflective layer, 100 Vehicle lamp, 101 Housing

Claims

1. A socket having a recess opening at one end; A mounting portion or a convex portion provided on the bottom surface side of the recess; A substrate provided on the mounting portion or the convex portion, and in a direction intersecting the central axis of the vehicle lighting device, a vicinity of the periphery protrudes from the mounting portion or the convex portion; A light-emitting element provided on the substrate; In a direction intersecting the central axis of the vehicle lighting device, a region between the side surface of the mounting portion and the side surface of the recess, or a region between the side surface of the convex portion and the side surface of the recess, provided with a heat-dissipating resin, and a peripheral portion that contacts the bottom surface of the recess and the surface on the bottom surface side of the protruding portion of the substrate; A vehicle lighting device comprising the above.

2. The vehicle lighting device according to claim 1, wherein the color of the heat-dissipating resin is white.

3. The vehicle lighting device according to claim 1 or 2, wherein the peripheral portion further contacts the surface of the substrate on the side opposite to the bottom surface side of the recess.

4. The vehicle lighting device according to claim 1 or 2, wherein the surface of the peripheral portion on the side opposite to the bottom surface side of the recess is a curved surface protruding toward the bottom surface side of the recess.

5. The vehicle lighting device according to claim 1; A housing to which the vehicle lighting device is attached; A vehicle lamp comprising the above.

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