Power conditioner

Abstract

To provide a power conditioner capable of miniaturizing a housing and improving cooling efficiency.SOLUTION: A power conditioner 1 includes: a first circuit board 20 provided with power system components; a second circuit board 30 provided with control system components; a shielding unit 40 for forming a shielding space; and a conductive housing 10 having an internal space for storing them. The first circuit board 20 is provided on an inner rear surface 11A of the housing 10, and the second circuit board 30 is provided in front of the first circuit board 20. The shielding unit 40 includes: a conductive first shielding plate 40A provided between the first circuit board 20 and the second circuit board 30, and a conductive second shielding plate 40B having a front end unit electrically connected to the first shielding plate 40A and a rear end unit electrically connected to the front surface 20A of the first circuit board 20 and the inner rear surface 11A of the housing 10.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to a power conditioner. [Background technology]

[0002] Patent Document 1 describes a power conditioner including an output circuit board, a power supply circuit board arranged to overlap (i.e., overlap) the front side of the output circuit board, a bracket and board assembly member arranged between the two, a reactor arranged above the output circuit board, and a housing that houses these. The bracket is arranged to straddle the entire output circuit board, and the board assembly member supports the power supply circuit board and is attached to the bracket. The bracket and board assembly member have walls that function as electromagnetic noise shielding, and they separate the output circuit board and the reactor, which are arranged side by side, and another wall that separates the output circuit board and the power supply circuit board. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2016-63715 Summary of the Invention [Problem to be solved by the invention]

[0004] However, because the bracket in Patent Document 1 is provided so as to straddle the entire output circuit board, space is required for providing the bracket outside the output circuit board, which poses a problem that the housing cannot be made smaller. Also, in a configuration in which the bracket is provided so as to straddle the entire output circuit board, the space that is shielded inside the housing becomes large, which may prevent improvement in cooling efficiency.

[0005] The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a power conditioner that can reduce the size of the housing and improve cooling efficiency. [Means for solving the problem]

[0006] In order to solve the above problem, the power conditioner of the present invention is a power conditioner comprising: a first circuit board on which power system components are provided; a second circuit board on which control system components are provided; a shielding section for forming a shielded space; and a conductive housing having an internal space for accommodating the first circuit board, the second circuit board, and the shielding section, wherein the first circuit board is provided on the inner rear surface of the housing, the second circuit board is provided in front of the first circuit board, and the shielding section comprises: a conductive first shielding plate provided between the first circuit board and the second circuit board; and a conductive second shielding plate having a front end electrically connected to the first shielding plate and a rear end electrically connected to the front surface of the first circuit board and the inner rear surface of the housing.

[0007] According to the above configuration, the first shielding plate does not span the entire first circuit board, but is electrically connected to the front surface of the first circuit board and the inner rear surface of the housing via the second shielding plate electrically connected to the first shielding plate. This allows for a more compact housing compared to a configuration in which the shielding plate is provided so as to span the entire first circuit board. Furthermore, compared to a configuration in which the shielding portion is provided so as to span the entire first circuit board, the shielded space within the housing can be made smaller. As a result, by forming a space containing the target cooling component separate from the conventional shielded space and intensively cooling that space, cooling efficiency can be improved. Furthermore, because the second shielding plate has a front end electrically connected to the first shielding plate and a rear end electrically connected to the inner rear surface of the housing, the potential of the first shielding plate and the second shielding plate can be brought closer to the potential of the housing (so-called frame ground), thereby improving radiation noise shielding effectiveness compared to a configuration in which the second shielding plate is connected to only one of the housing and the first shielding plate.

[0008] It is also preferable that the housing has a conductive shielding plate support portion that protrudes from its inner surface toward the internal space and supports the first shielding plate, and that the first shielding plate is connected to the shielding plate support portion.

[0009] Preferably, the shielding portion further includes a conductive third shielding plate that covers the front of the second circuit board and is electrically connected to the first shielding plate.

[0010] Preferably, the third shielding plate is provided with a conductive elastic member that abuts against the inner front surface of the housing.

[0011] It is also preferable that the power system components include a power conversion unit that converts power, a radiation noise reduction unit, and a conduction noise reduction unit, and that the second shielding plate separates a space including the power conversion unit and the conduction noise reduction unit from a space including the radiation noise reduction unit.

[0012] It is also preferable that the cooling system further includes an axial fan that blows air in the axial direction to cool some of the power system components, and that the axial fan is arranged to penetrate the first shielding plate and generate airflows in both the space behind and the space in front of the first shielding plate.

[0013] Furthermore, it is preferable that the power system component includes a terminal portion to which an electric wire leading to an external device is connected, and a relay portion connected between the power conversion portion and the terminal portion, the relay portion being provided in a space including the power conversion portion and the conduction noise reduction portion, and the axial fan being provided to blow air toward the relay portion. [Effects of the Invention]

[0014] According to the present invention, it is possible to provide a power conditioner that can reduce the size of the housing and improve the cooling efficiency. [Brief explanation of the drawings]

[0015] [Figure 1]1 is a block diagram showing a schematic configuration of a system including a power conditioner according to an embodiment of the present invention, and the power conditioner. [Figure 2] FIG. 2 is a perspective view showing the appearance of the power conditioner according to the embodiment. [Figure 3] 2 is a schematic diagram showing, in a simplified manner, the arrangement of a circuit board, a shielding plate, and the like included in the power conditioner according to the embodiment. FIG. [Figure 4] FIG. 2 is a front view of a first circuit board included in the power conditioner according to the embodiment. [Figure 5] FIG. 2 is a schematic diagram showing the state in which a first circuit board, a first shielding plate, and a second shielding plate are attached to a housing. [Figure 6] 6A is a cross-sectional view taken along line S1-S1 in FIG. 5, and FIG. 6B is a cross-sectional view taken along line S2-S2 in FIG. [Figure 7] 6 is a schematic diagram showing the state in which a second circuit board, a third shielding plate, an axial fan, etc. are attached to the first shielding plate in FIG. 5. FIG. [Figure 8] FIG. 8 is a cross-sectional view taken along line S3-S3 in FIG. 7. [Figure 9] 10A and 10B are simplified schematic diagrams showing the air flow inside the housing. [Figure 10] FIG. 10 is a schematic configuration diagram showing a schematic configuration of a power conditioner according to a modified example. DETAILED DESCRIPTION OF THE INVENTION

[0016] An embodiment of the present invention will be described with reference to the drawings. As shown in Fig. 1, the power conditioner 1 is connected to a power grid P and a power consumption device L via a distribution board D, and is also connected to a photovoltaic power generation device G and a power storage device S, which are stationary external devices. The power conditioner 1 is a power interchange device that interchanges power by performing power conversion.

[0017] The power conditioner 1 includes a conductive housing 10, a first circuit board 20, and a second circuit board 30. The first circuit board 20 includes terminal units 1A-1C, radiation noise reduction units 1D-1F for reducing radiation noise, a relay unit 1G, conduction noise reduction units 1H-1J for reducing conduction noise, a harmonic suppression unit 1K, a DC / DC conversion unit 1L, a smoothing unit 1M, a bidirectional AC / DC conversion unit 1N, a power supply unit 1P, and a portion of the configuration of a control unit 1Q. The second circuit board 30 includes the remaining configuration of the control unit 1Q.

[0018] Terminal unit 1A constitutes an input point and an output point of AC power, and is connected to a distribution board D. Terminal unit 1B constitutes an input point of DC power, and is connected to at least one (three in this embodiment) solar power generation device G. Terminal unit 1C constitutes an input point and an output point of DC power, and is connected to a power storage device S.

[0019] Radiation noise reducing sections 1D to 1F each reduce radiation noise (so-called radiation). Radiation noise reducing section 1D is connected to terminal section 1A, radiation noise reducing section 1E is connected to terminal section 1B, and radiation noise reducing section 1F is connected to terminal section 1C.

[0020] The relay unit 1G is interposed in the electric wire connecting the radiation noise reduction unit 1D and the conduction noise reduction unit 1H, and normally keeps the electric wire in a conductive state, but in the event of an abnormality such as a power outage, makes the electric wire in a non-conductive state. By making the electric wire non-conductive, the relay unit 1G cuts off abnormal current from the power conditioner 1 to the distribution board D. In this embodiment, the relay unit 1G includes a relay 22A (see FIG. 4) described later, and is part of the object to be cooled by an axial fan 50 (see FIG. 3) described later.

[0021] The conduction noise reduction units 1H to 1J each reduce conduction noise (i.e., noise terminal voltage). The conduction noise reduction unit 1H is connected between the relay unit 1G and the harmonic suppression unit 1K, the conduction noise reduction unit 1I is connected between the radiation noise reduction unit 1E and the DC / DC conversion unit 1L, and the conduction noise reduction unit 1J is connected between the radiation noise reduction unit 1F and the connection unit (DC power line) between the smoothing unit 1M and the DC / DC conversion unit 1L.

[0022] The harmonic suppression unit 1K suppresses harmonics contained in the AC current. The harmonic suppression unit 1K is connected between the conduction noise reduction unit 1H and the bidirectional AC / DC conversion unit 1N, and removes harmonic components from the AC current input / output to / from the bidirectional AC / DC conversion unit 1N.

[0023] The DC / DC conversion unit 1L boosts and outputs a DC voltage. The DC / DC conversion unit 1L is connected between the conduction noise reduction unit 1I and the smoothing unit 1M, and boosts the DC voltage input from the solar power generation device G. In this embodiment, the DC / DC conversion unit 1L includes a coil 22F (see FIG. 4) described later, and is part of a target to be cooled by an axial fan 50 (see FIG. 3) described later.

[0024] The smoothing unit 1M smoothes the DC current. The smoothing unit 1M is connected between the bidirectional AC / DC conversion unit 1N and the connection between the conduction noise reduction unit 1J and the DC / DC conversion unit 1L, and smooths the DC current input to and output from the bidirectional AC / DC conversion unit 1N.

[0025] The bidirectional AC / DC converter 1N converts a DC voltage and an AC voltage bidirectionally and outputs the converted voltage. Specifically, the bidirectional AC / DC converter 1N converts an AC voltage input to an AC terminal into a DC voltage and outputs the DC voltage from the DC terminal. The bidirectional AC / DC converter 1N also converts a DC voltage input to a DC terminal into an AC voltage and outputs the AC voltage from the AC terminal.

[0026] The power supply unit 1P supplies DC power to each unit of the power conditioner 1 that operates upon receiving power supply (for example, the control unit 1Q and the axial flow fan 50 (see FIG. 3)).

[0027] The control unit 1Q controls each unit (for example, the DC / DC conversion unit 1L and the bidirectional AC / DC conversion unit 1N) of the power conditioner 1. The control unit 1Q also communicates with external devices.

[0028] Fig. 2 is a perspective view showing the exterior of the power conditioner 1, and Fig. 3 is a schematic diagram showing a simplified internal configuration of the power conditioner 1. Note that the front-to-back direction X, left-to-right direction Y, and up-to-down direction Z indicated by arrows in the figure indicate linear directions that are perpendicular to one another.

[0029] 2 and 3, the power conditioner 1 includes a conductive housing 10, a first circuit board 20, a second circuit board 30, a shielding section 40 (see FIG. 3) for forming a shielded space, an axial flow fan 50 (see FIG. 3), and a protective plate 60 (see FIG. 3). The housing 10 has an internal space for accommodating the circuit boards 20, 30, the shielding section 40, etc. The housing 10 is composed of a conductive case 10A and a cover 10B.

[0030] The power conditioner 1 also includes a rear frame 70, a reactor 81, and a heat sink 82. The rear frame 70 is connected to the rear of the housing 10, and the reactor 81 and heat sink 82 that constitute the harmonic suppression unit 1K are provided within the rear frame 70. The rear frame 70 has slits (reference numerals omitted) that improve heat dissipation efficiency. The power conditioner 1 is attached to an outdoor wall (not shown) via the rear frame 70.

[0031] 3, case 10A has inner surfaces that form an internal space, including an inner rear surface 11A, an inner upper surface 11B, an inner lower surface 11C, an inner right surface 11D (see FIG. 6(A)), and an inner left surface 11E (see FIG. 6(A)). Cover 10B is configured to be detachable from case 10A, and has an inner front surface 11F as an inner surface that forms an internal space.

[0032] The inner rear surface 11A forms a board mounting surface to which the first circuit board 20 is attached, and covers the rear of the circuit boards 20, 30, etc. A portion of the inner rear surface 11A is provided with a plurality of board support portions 12 that support the first circuit board 20. The board support portions 12 are conductive and protrude forward from the inner rear surface 11A. An internal thread (not shown) is formed in the board support portions 12.

[0033] The inner upper surface 11B, the inner lower surface 11C, the inner right surface 11D, and the inner left surface 11E extend forward from the inner rear surface 11A and form inner circumferential surfaces that cover the upper, lower, right, and left sides (i.e., all four sides) of the circuit boards 20, 30, etc. The inner lower surface 11C is provided with a piping connection port (not shown) for introducing electric wires connected to the terminal portions 1A to 1C into the housing 10. The piping connection port is connected to a piping (not shown) that protects the electric wires connected to the terminal portions 1A to 1C.

[0034] The inner front surface 11F covers the front of the circuit boards 20, 30, etc. A seal 10C provided on the periphery of the front end of the case 10A is in close contact with the inner front surface 11F. The seal 10C is made of rubber and seals the gap between the case 10A and the cover 10B, preventing moisture such as rain from entering the internal space of the housing 10 through the gap between the case 10A and the cover 10B.

[0035] First circuit board 20 is a power system circuit board on which power system components are provided. First circuit board 20 is provided on inner rear surface 11A of housing 10. Specifically, first circuit board 20 is fastened to board support portion 12 by conductive male screws 91. A ground pattern (not shown) formed on first circuit board 20 is connected to conductive board support portion 12 via one or more male screws 91. In this way, first circuit board 20 and housing 10 are mechanically connected, and the ground pattern of first circuit board 20 and housing 10 are electrically connected.

[0036] Here, the configuration provided on first circuit board 20 will be described with reference to FIG. As shown in FIG. 4, the front surface 20A of the first circuit board 20 is provided with the following power system components: terminal blocks 21A to 21C, filter coils 21D to 21F, 22B to 22D, a relay 22A, capacitors 22E and 22G, a boost coil 22F, an inverter device 22H for the neutral line, and a reactor 22I.

[0037] As indicated by the dashed lines in FIG. 4, a boost device 23A and an inverter device 23B for AC voltage lines are provided as power system components on the rear surface 20B (see FIG. 3) of the first circuit board 20.

[0038] Terminal block 21A constitutes a three-pole terminal section 1A connected to distribution board D, with one neutral line and two AC voltage lines connected thereto. Terminal block 21B constitutes a six-pole terminal section 1B connected to three solar power generation devices G, with three positive lines and three negative lines connected thereto. Terminal block 21C constitutes a two-pole terminal section 1C connected to power storage device S, with a positive line and a negative line connected thereto. Terminal blocks 21A to 21C are arranged in space A6 (see FIG. 3) that is not covered by protective plate 60.

[0039] Coils 21D to 21F are each a common mode choke coil. Coil 21D is a coil in which electric wire for three poles (three phases) is wound around one core, and constitutes radiation noise reducing section 1D. Coil 21E is a coil in which electric wire for six poles is wound around one core, and constitutes radiation noise reducing section 1E. Coil 21F is a coil in which electric wire for two poles is wound around one core, and constitutes radiation noise reducing section 1F. Coils 21D to 21F are arranged in space A5 (see FIG. 3) covered by protective plate 60.

[0040] The relay 22A is at least one high-capacity relay and constitutes the relay unit 1G. That is, the relay 22A is connected between the coil 21D of the radiation noise reduction unit 1D and the coil 22B of the conduction noise reduction unit 1H. The relay 22A is disposed in the space A1 (see FIG. 3) covered by the first shielding plate 40A, and is disposed to the left of the axial flow fan 50.

[0041] Coils 22B to 22D are each a common mode choke coil. Coil 22B is a coil in which three-phase electric wires are wound around one core, and constitutes conduction noise reducing section 1H. Coil 22C is a coil in which at least two electric wires are wound around one core, and constitutes conduction noise reducing section 1I. Coil 22D is a coil in which two electric wires are wound around one core, and constitutes conduction noise reducing section 1J. Coils 22B to 22D are arranged in space A1 (see FIG. 3) covered by first shielding plate 40A.

[0042] Capacitor 22E and reactor 81 (see FIG. 2) constitute harmonic suppression unit 1K. Capacitor 22E is connected between the neutral line and the AC voltage line, and reactor 81 is connected in series to the AC voltage line. Capacitor 22E is disposed in space A1 (see FIG. 3) covered by first shielding plate 40A.

[0043] The coil 22F and the boost device 23A constitute the DC / DC conversion unit 1L. The boost device 23A includes a switching element controlled by a boost control circuit (not shown) provided on the boost control board 25, and performs a boost operation by turning the switching element on and off to store energy in the coil 22F and releasing the energy. The coil 22F is disposed in the space A1 covered by the first shielding plate 40A and to the right of the axial fan 50. The boost device 23A is disposed in the space A7 (see FIG. 3) behind the first circuit board 20.

[0044] The capacitor 22G constitutes the smoothing unit 1M. That is, the capacitor 22G is connected between the bidirectional AC / DC conversion unit 1N and the boost device 23A of the DC / DC conversion unit 1L and the coil 22D of the conduction noise reduction unit 1J. The capacitor 22G includes a plurality of pairs of capacitors, each pair consisting of at least two capacitors connected in series, and is connected between two DC voltage lines (bus bars). A neutral line is connected to the midpoint between the pair of capacitors. The capacitor 22G is disposed in a space A1 (see FIG. 3) covered by a first shielding plate 40A.

[0045] The inverter devices 23B and 22H and the reactor 22I configure the bidirectional AC / DC conversion unit 1N. The inverter device 23B includes, for example, two legs connected in parallel, with the connection point of the upper and lower arms of one leg connected to one AC voltage line (U phase) and the connection point of the upper and lower arms of the other leg connected to the other AC voltage line (W phase). Each arm includes a switching element. The inverter device 23B is disposed in the space A7 (see FIG. 3 ) behind the first circuit board 20. The inverter device 22H includes, for example, one leg, with the connection point of the upper and lower arms of that leg connected to the neutral line (N phase) via the reactor 22I. Each arm includes a switching element. The inverter device 22H and the reactor 22I equalize the voltages of the two DC voltage lines to suppress voltage imbalance between the two AC voltage lines and the neutral line. The inverter device 22H and the reactor 22I are disposed in a space A1 (see FIG. 3) covered by the first shielding plate 40A, and the inverter device 22H is disposed to the left of the axial flow fan 50.

[0046] Further, on the front surface 20A of the first circuit board 20, in addition to the above-mentioned power system components, a power supply circuit 24 and a boost control board 25 are provided.

[0047] The power supply circuit 24 constitutes the power supply unit 1P. The power supply circuit 24 is disposed in a space A4 (see FIG. 3) that is not covered by the first shielding plate 40A. The space A4 is located above the space A1 described above.

[0048] The boost control plate 25 is provided perpendicular to the first circuit board 20, and is disposed in a space A1 (see FIG. 3) covered by the first shielding plate 40A. The boost control plate 25 is provided with a boost control circuit (not shown) that constitutes the control unit 1Q as a control system component.

[0049] As shown in Fig. 3, the second circuit board 30 is a control system circuit board provided with control system components. The second circuit board 30 is provided with a microcomputer (not shown) that constitutes part of the control unit 1Q as a control system component. The second circuit board 30 is provided in front of the first circuit board 20 and is arranged so as to overlap part of the first circuit board 20 in the front-rear direction X, with the first shielding plate 40A interposed therebetween. Thus, the second circuit board 30 is arranged in a space A2 in front of the first shielding plate 40A. The second circuit board 30 is fastened to a board support part 41 (described later) with a conductive male screw 92.

[0050] A communication board 31 (see FIG. 7) for communicating with external devices is connected to the second circuit board 30. A communication circuit (not shown) constituting part of the control unit 1Q is provided on the communication board 31. Like the second circuit board 30, the communication board 31 is also provided in front of the first circuit board 20 and is arranged in the above-mentioned space A2. The second circuit board 30 and the communication board 31 are provided with connectors 30A, 31A (see FIG. 7) for connecting communication lines (not shown). Although the second circuit board 30 and the communication board 31 are separate boards in this embodiment, they may be formed as a single board.

[0051] The shielding unit 40 includes a first shielding plate 40A, a second shielding plate 40B, and a third shielding plate 40C that are electrically conductive and made of a metal material. The shielding unit 40 is electrically connected to the housing 10 so as to serve as a frame ground. The electrical connection structure between the shielding unit 40 and the housing 10 will be described later with reference to FIGS. 5 to 7.

[0052] The first shielding plate 40A has a smaller surface area than the first circuit board 20 and is provided between the first circuit board 20, the second circuit board 30, and the communication board 31 so as to cover the front of a portion (the central portion in the vertical direction) of the first circuit board 20. The first shielding plate 40A separates a space A1 behind the first shielding plate 40A from spaces A2 and A3 in front of the first shielding plate 40A. Note that the space A1 and the space A2 are connected via a space A4 above the first shielding plate 40A that is not covered by the first shielding plate 40A.

[0053] The first shielding plate 40A is provided with one or more board support portions 41 that support the second circuit board 30 and the communication board 31. The board support portions 41 are conductive spacers provided on the front surface 42 of the first shielding plate 40A. The board support portions 41 are formed with internal threads (not shown).

[0054] The first shielding plate 40A is also provided with an opening 43 (see FIG. 5) in which the axial fan 50 is provided, and a slit 44 (see FIG. 5) for heat dissipation. The slit 44 is located in front of the relay 22A (see FIG. 4) that constitutes the relay unit 1G, and is an opening that can radiate heat generated in the space A1 to the space A3.

[0055] In this embodiment, a shielded wire (not shown) is fastened to the first shielding plate 40A with a male screw (not shown). The shielded wire forms a shield coating (not shown) that covers the communication wire connected to the second circuit board 30 and the communication board 31, and reduces the effect of radiated noise on the signal.

[0056] The second shielding plate 40B is provided on the front surface 20A of the first circuit board 20, and extends forward from the front surface 20A so as to be connected to the first shielding plate 40A. The second shielding plate 40B separates a space A1 above the second shielding plate 40B from a space A5 below the second shielding plate 40B.

[0057] The third shielding plate 40C covers the front of the second circuit board 30 and the communication board 31 and is provided between the second circuit board 30, the communication board 31 and the cover 10B. The third shielding plate 40C has a rear end 46 that overlaps with the front face 42 of the first shielding plate 40A and is connected to the front face 42 of the first shielding plate 40A via the rear end 46, separating spaces A2 and A4 behind the third shielding plate 40C from a space A8 in front of the third shielding plate 40C. The third shielding plate 40C partially separates the space A2 covered by the third shielding plate 40C from a space A3 located below the space A2 and not covered by the third shielding plate 40C.

[0058] The axial fan 50 blows air in the axial direction (leftward in this embodiment) to cool some of the power system components. The axial fan 50 is provided to penetrate the first shielding plate 40A in the front-rear direction X, and is disposed in the spaces A1 and A3 that are provided on either side of the first shielding plate 40A. In this way, the axial fan 50 is configured to generate airflow in each of the spaces A1 and A3.

[0059] The protective plate 60 is a non-conductive resin cover. The protective plate 60 covers a portion of the power system components that are not covered by the first shielding plate 40A, and separates a space A5 behind the protective plate 60 from a space A3 in front of the protective plate 60. The spaces A5 and A3 are connected via a space A6 below the protective plate 60 that is not covered by the protective plate 60. The protective plate 60 is fastened to the first shielding plate 40A with male screws (not shown). The protective plate 60 is not shown in Figures 2 and 4 onwards.

[0060] Next, the electrical connection structure between the first shielding plate 40A and the housing 10 and the electrical connection structure between the second shielding plate 40B and the housing 10 will be described with reference to Figures 5 and 6. Figure 5 shows the state in which the first circuit board 20 and the shielding plates 40A and 40B are attached to the housing 10. Figure 6(A) is a cross-sectional view of the S1-S1 line portion shown in Figure 5, and Figure 6(B) is a cross-sectional view of the S2-S2 line portion shown in Figure 5. Figure 6(A) shows both the left and right ends of the S1-S1 line portion.

[0061] 5 and 6(A), shielding plate supports 13 that support the first shielding plate 40A are provided on each of the inner right side 11D and the inner left side 11E of the case 10A. The shielding plate supports 13 protrude from the inner right side 11D and the inner left side 11E toward the internal space of the case 10A and extend in the up-down direction Z. The first shielding plate 40A is fastened to the left and right shielding plate supports 13 with conductive male screws 93. In this way, the first shielding plate 40A and the housing 10 are mechanically and electrically connected via the shielding plate supports 13.

[0062] As shown in FIG. 6(B), a plurality of board support portions 14 configured similarly to the board support portions 12 are provided on the inner rear surface 11A of the case 10A. Furthermore, the first circuit board 20 is provided with through holes 26 (see FIG. 4) at positions overlapping with the board support portions 14, allowing the board support portions 14 to be exposed. In this embodiment, the four board support portions 14 and the four through holes 26 are arranged in a substantially straight line at intervals in the left-right direction Y. The second shielding plate 40B has a rear end portion 45A that overlaps with the front surface 20A of the first circuit board 20, and the rear end portion 45A is fastened to the first circuit board 20 and the board support portions 14 by conductive male screws 94. In this manner, the second shielding plate 40B and the housing 10 are mechanically and electrically connected.

[0063] Furthermore, the second shielding plate 40B has a front end 45B that overlaps with the front surface 42 of the first shielding plate 40A, and the front end 45B is fastened to the first shielding plate 40A by a conductive male screw 95. In this way, the second shielding plate 40B and the first shielding plate 40A are mechanically and electrically connected. That is, the first shielding plate 40A is connected to the housing 10 not only via the shielding plate support part 13, but also via the second shielding plate 40B and the board support part 14.

[0064] Next, the electrical connection structure between the third shielding plate 40C and the housing 10, and the electrical connection structure between the case 10A and the cover 10B will be described with reference to Figures 7 and 8. Figure 7 shows the state in which the second circuit board 30, the communication board 31, the third shielding plate 40C, and the axial fan 50 are attached to the first shielding plate 40A shown in Figure 5. Figure 8 is a cross-sectional view of the S3-S3 line portion shown in Figure 7, showing both the left and right ends of the S3-S3 line portion.

[0065] 7 and 8, the third shielding plate 40C has a rear end 46 that bends and extends rearward from the lower end of the surface parallel to the second circuit board 30 and overlaps with the front surface 42 of the first shielding plate 40A, and the rear end 46 is fastened to the first shielding plate 40A by a conductive male screw 96. In this way, the third shielding plate 40C is mechanically and electrically connected to the first shielding plate 40A, and is connected to the housing 10 via at least the first shielding plate 40A.

[0066] As shown in FIG. 8 , the case 10A is provided with a cover contact portion 15 that contacts the cover 10B. The cover contact portion 15 is composed of a conductive elastic member support portion 15A and an elastic member 15B. The elastic member support portion 15A extends diagonally forward from each of the inner right side 11D and the inner left side 11E of the case 10A and supports the elastic member 15B. The elastic member 15B is adhered to the front end of the elastic member support portion 15A with, for example, a conductive adhesive. The elastic member 15B is composed of, for example, a cushioning material covered with a conductive covering material or a conductive cushioning material. When the cover 10B closes the case 10A, the elastic member 15B is in close contact with the inner front surface 11F of the cover 10B. In this way, the cover 10B is electrically connected to the case 10A via the cover contact portion 15.

[0067] The airflow generated by the axial fan 50 will be described with reference to Fig. 9. Fig. 9 is a diagram showing the arrangement of spaces A1 to A6 within the housing 10, and is a simplified diagram showing the configuration within the housing 10. The two-dot chain line in Fig. 9 schematically shows the airflow generated by the axial fan 50. Fig. 9(A) shows the rear side of the first shielding plate 40A, and Fig. 9(B) shows the front side of the first shielding plate 40A.

[0068] As shown in FIG. 9A, the axial fan 50 blows air to the left, causing it to flow toward the inverter device 22H of the bidirectional AC / DC conversion unit 1N and the relay 22A of the relay unit 1G. Because a second shielding plate 40B is provided below the axial fan 50, air is prevented from flowing downward from the axial fan 50 in the space A1. The air flows along the second shielding plate 40B, effectively dissipating heat generated in the inverter device 22H and the relay 22A. The air flowing leftward from the axial fan 50 flows upward and circulates through the spaces A1 and A4. The axial fan 50 also draws air from the right, causing the air to flow intensively toward the coil 22F of the DC / DC conversion unit 1L, effectively dissipating heat generated by the coil 22F. A portion of the air circulating through the spaces A1 and A4 flows through the space A4 into the space A2.

[0069] 9(B), the axial fan 50 blows air to the left, causing the air to flow toward the front of the slit 44. As a result, heat near the inverter device 22H and the relay 22A is also effectively diffused into the space A3. The air that flows leftward from the axial fan 50 flows mainly downward and circulates through the spaces A3 and A6. The axial fan 50 also draws air from the space A2, which has a lower temperature than the space A1, and from the space A6, which leads to the pipe connection port on the inner lower surface 11C, thereby blowing relatively cool air into the space A1.

[0070] The present embodiment provides the following effects. (1) The shielding section 40 includes a first shielding plate 40A provided between the first circuit board 20 and the second circuit board 30, and a second shielding plate 40B provided on the front surface 20A of the first circuit board 20. With this configuration, the size of the housing 10 can be reduced compared to a configuration in which the shielding plate is provided so as to straddle the entire first circuit board 20. Furthermore, the shielded space within the housing 10 can be made smaller compared to a configuration in which the shielding section is provided so as to straddle the entire first circuit board 20. As a result, by forming a space A1 within the housing 10 that includes the components to be cooled (relay 22A and coil 22F) separately from the conventional shielded space and cooling the space A1 intensively, the cooling efficiency can be improved. Furthermore, since the second shielding plate 40B has a front end 45B connected to the first shielding plate 40A and a rear end 45A connected to the inner rear surface 11A of the housing 10, the potentials of the first shielding plate 40A and the second shielding plate 40B can be made closer to the potential of the housing 10 (so-called frame ground), thereby improving the radiation noise shielding effect, compared to a configuration in which the second shielding plate 40B is connected to only one of the housing 10 and the first shielding plate 40A. Also, by making the potential of the first shielding plate 40A closer to the potential of the housing 10, the noise shielding effect of the shielded wire covering the communication wire can be improved.

[0071] (2) The housing 10 has an inner right surface 11D and an inner left surface 11E (inner peripheral surfaces) and a shielding plate support portion 13 protruding from these inner peripheral surfaces, and the first shielding plate 40A is connected to the shielding plate support portion 13. This configuration can further enhance the radiation noise shielding effect compared to a configuration in which the first shielding plate 40A is connected only to the second shielding plate 40B.

[0072] (3) The shielding portion 40 further includes a third shielding plate 40C that covers the front of the second circuit board 30 and is connected to the first shielding plate 40A. With this configuration, noise radiated from the second circuit board 30 can be blocked.

[0073] (4) The second shielding plate 40B separates the space A1 including the conversion units 1N, 1L (power conversion units) and the conduction noise reduction units 1H-1J from the space A5 including the radiation noise reduction units 1D-1F. This configuration can block noise radiated from the space A1 to the radiation noise reduction units 1D-1F.

[0074] (5) The axial flow fan 50 is provided to penetrate the first shielding plate 40A and generates airflow in both the space A1 behind the first shielding plate 40A and the space A3 in front of the first shielding plate 40A. With this configuration, the single axial flow fan 50 can uniformly distribute the temperature throughout the housing 10.

[0075] (6) The relay unit 1G connected between the bidirectional AC / DC conversion unit 1N (power conversion unit) and the terminal unit 1A is provided in the space A1, and the axial flow fan 50 is provided to blow air toward the relay unit 1G. With this configuration, heat generated in the relay unit 1G in the space A1 can be effectively diffused.

[0076] The present invention is not limited to the above-described embodiment, and the above configurations can be modified. For example, the following modifications can be made, or the following modifications can be combined to make the present invention.

[0077] 10, the third shielding plate 40C may be provided with a conductive elastic member 16 that abuts against the inner front surface 11F (see FIG. 3) of the housing 10. The elastic member 16 is made of, for example, a cushion material covered with a conductive covering material or a conductive cushion material, and is adhered to the third shielding plate 40C with a conductive adhesive.

[0078] According to the above configuration, the third shielding plate 40C is provided with an elastic member 16 that abuts against the inner front surface 11F of the housing 10, so that in addition to the shock absorbing effect as a cushioning material, the impedance of the central portion of the cover 10B can be reduced, thereby enhancing the noise shielding effect of the cover 10B.

[0079] 10, the case 10A may be provided with conductive cover abutment portions 15 spaced apart in the vertical direction Z. This configuration can reduce impedance at the top and bottom of the cover 10B, further improving the noise shielding effect of the cover 10B.

[0080] Furthermore, external devices other than the solar power generation device G and the power storage device S may be connected to the power conditioner 1. For example, a vehicle charging / discharging device for an electric vehicle equipped with a chargeable / dischargeable secondary battery may be further connected to the power conditioner 1. The power conditioner 1 may also function as a vehicle charging / discharging device. In this case, the power conditioner 1 performs, for example, power conversion for outputting power from the power grid P and / or the solar power generation device G to the secondary battery of the electric vehicle, and power conversion for outputting power from the secondary battery of the electric vehicle to the power consumption device L. [Explanation of symbols]

[0081] 1 Power conditioner 1A~1C terminal section 1D~1F Radiation noise reduction section 1G relay section 1H~1J Conduction noise reduction section 1L DC / DC conversion unit (power conversion unit) 1N bidirectional AC / DC converter (power converter) 10. Cabinet 10A case 10B Cover 11A Medial rear surface 11B Inside top surface 11C Inner lower surface 11D Inner right surface (inner peripheral surface) 11E Inner left surface (inner peripheral surface) 11F Inside front 12,14 Substrate support 13 Shield plate support part 15 Cover contact part 15A Elastic member support part 15B Elastic member 16 Elastic member 20 1st circuit board 20A front 30 Second circuit board 31 Communication board 40 Shielding part 40A 1st shielding plate 40B 2nd shielding plate 40C 3rd shielding plate 45A Rear end 45B Front end 50 axial fan A1~A8 space X Anteroposterior direction Y left / right direction Z vertical direction

Claims

1. a first circuit board on which power system components are provided; a second circuit board on which control system components are provided; a shielding portion for forming a shielded space; a conductive housing having an internal space for accommodating the first circuit board, the second circuit board, and the shielding portion; A power conditioner comprising: the first circuit board is provided on the inner rear surface of the housing, the second circuit board is provided in front of the first circuit board, The shielding portion is a conductive first shielding plate provided between the first circuit board and the second circuit board; a second conductive shielding plate having a front end electrically connected to the first shielding plate and a rear end electrically connected to the front surface of the first circuit board and the inner rear surface of the housing; Equipped with A power conditioner characterized by the above.

2. the housing includes a conductive shielding plate support portion that protrudes from an inner peripheral surface toward the internal space and supports the first shielding plate, The first shielding plate is connected to the shielding plate support portion. The power conditioner according to claim 1 .

3. The shielding portion further includes a conductive third shielding plate that covers the front of the second circuit board and is electrically connected to the first shielding plate. The power conditioner according to claim 1 .

4. The third shielding plate is provided with a conductive elastic member that abuts against the inner front surface of the housing. The power conditioner according to claim 3 .

5. the power system components include a power conversion unit that converts power, a radiation noise reduction unit, and a conduction noise reduction unit; The second shielding plate separates a space including the power conversion unit and the conduction noise reduction unit from a space including the radiation noise reduction unit. The power conditioner according to claim 1 .

6. an axial flow fan that blows air in an axial direction to cool a portion of the power system component; The axial flow fan is provided to penetrate the first shielding plate and generates airflows in a space behind the first shielding plate and a space in front of the first shielding plate. The power conditioner according to claim 5 .

7. the power system component includes a terminal unit to which an electric wire leading to an external device is connected, and a relay unit connected between the power conversion unit and the terminal unit, the relay unit is provided in a space including the power conversion unit and the conduction noise reduction unit, The axial flow fan is provided to blow air toward the power relay unit. The power conditioner according to claim 6 .

Images