Sheet-like heat pipe and manufacturing method for sheet-like heat pipe

Abstract

To provide a sheet-like heat pipe that can restrain expansion of an internal space, and hold a capillary structure enclosed in the internal space.SOLUTION: In a sheet-like heat pipe 1 according to the present invention, an internal space S1 is formed between a heat dissipating plate 2 and a heat receiving plate 3. A wick 4 and a working fluid are enclosed in the internal space S1. The sheet-like heat pipe 1 comprises: a supporting part 6 joining the heat dissipating plate 2 and the heat receiving plate 3 in the internal space S1; and a sandwiching part 7 formed in the heat dissipating plate 2, and sandwiching the wick 4 between itself and the heat receiving plate 3.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The present invention relates to a sheet-shaped heat pipe that is mounted on a device having a heat source and cools the heat source by receiving heat from the heat source and transporting the heat, and a method for manufacturing the sheet-shaped heat pipe. [Background technology]

[0002] A conventional vapor chamber is described in Patent Document 1. The vapor chamber (100) described in Patent Document 1 includes a container (20) having a hollow portion therein, a deformation prevention member (10) disposed in the hollow portion and having the function of preventing deformation of the container (20) in the thickness direction, and a working liquid (working fluid) (30) disposed in the hollow portion.

[0003] The deformation prevention member (10) is formed integrally with the fibers (131) that function as a wick, and is made of a resin material. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 2022-67179 Summary of the Invention [Problem to be solved by the invention]

[0005] As described above, the vapor chamber (100) described in Patent Document 1 requires the deformation prevention member (10) made of a resin material to prevent deformation of the container (20) in the thickness direction.

[0006] Therefore, the present invention aims to solve the above problems and provide a sheet-shaped heat pipe and a manufacturing method thereof that can suppress the expansion of the internal space and sandwich the capillary structure enclosed in the internal space without requiring a deformation prevention member (10) as described in Patent Document 1. [Means for solving the problem]

[0007] The sheet-type heat pipe of the present invention is a sheet-type heat pipe having an internal space formed between a first plate and a second plate, wherein a capillary structure and a working fluid are sealed in the internal space, and characterized in that it has a support portion that joins the first plate and the second plate in the internal space, and a clamping portion that is formed on the first plate and clamps the capillary structure between the first plate and the second plate.

[0008] The manufacturing method of the sheet-type heat pipe of the present invention is a manufacturing method of a sheet-type heat pipe in which an internal space is formed between a first plate and a second plate, and is characterized by having the steps of: sealing a capillary structure and a working fluid in the internal space; overlapping the first plate and the second plate to sandwich the capillary structure between a clamping portion and the second plate; and joining the first plate and the second plate in the internal space with a support portion. [Effects of the Invention]

[0009] According to the present invention, it is possible to suppress expansion of the internal space and maintain the capillary structure enclosed in the internal space. [Brief explanation of the drawings]

[0010] [Figure 1] 1 is a perspective view of a sheet-shaped heat pipe according to a first embodiment of the present invention; [Figure 2] 1 is a front view of a sheet-shaped heat pipe according to a first embodiment of the present invention; [Figure 3] FIG. 2 is a plan view of the heat dissipation plate according to the first embodiment of the present invention. [Figure 4] FIG. 3 is a bottom view of the heat-receiving plate according to the first embodiment of the present invention. [Figure 5] 1 is a partial vertical cross-sectional view of a sheet-shaped heat pipe according to a first embodiment of the present invention; [Figure 6] FIG. 4 is a partial vertical cross-sectional view of a sheet-shaped heat pipe according to a second embodiment of the present invention. [Figure 7] FIG. 10 is a perspective view of a sheet-shaped heat pipe according to a third embodiment of the present invention. [Figure 8] FIG. 10 is a partial vertical cross-sectional view of a sheet-shaped heat pipe according to a third embodiment of the present invention. [Figure 9] FIG. 10 is a partial vertical cross-sectional view of a sheet-shaped heat pipe according to a fourth embodiment of the present invention. [Figure 10] FIG. 10 is a partial vertical cross-sectional view of a sheet-shaped heat pipe according to a fifth embodiment of the present invention. [Figure 11] FIG. 10 is a partial vertical cross-sectional view of a sheet-shaped heat pipe according to a sixth embodiment of the present invention. [Figure 12] FIG. 10 is a partial vertical cross-sectional view of a sheet-shaped heat pipe according to a seventh embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0011] A preferred embodiment of the present invention will be described below using a sheet heat pipe (hereinafter referred to as "SHP") mounted in various devices as an example. Not all of the configurations described below are necessarily essential requirements of the present invention.

[0012] 1 and 2 show the external appearance of an SHP 1 according to a first embodiment of the present invention. The SHP 1 is configured to include a heat dissipation plate 2 as a first plate, a heat reception plate 3 as a second plate, and a wick 4 as a capillary structure housed inside.

[0013] The heat dissipation plate 2 and the heat receiving plate 3 in this embodiment are made of austenitic stainless steel, and the wick 4 is housed (enclosed) in an internal space S1 formed by joining the outer peripheries of the heat dissipation plate 2 and the heat receiving plate 3. The heat dissipation plate 2 and the heat receiving plate 3 may be made of an alloy containing titanium or copper as a main component, in addition to stainless steel.

[0014] 3, the heat dissipation plate 2 is formed in the shape of a rectangular thin plate, and has a flat portion 5 formed flat, and a plurality of support portions 6 and clamping portions 7 that protrude toward the heat receiving plate 3. In addition, one of the four short sides of the heat dissipation plate 2 is formed with a nozzle portion 8 for injecting a working fluid (not shown) into the internal space S1 and evacuating the internal space S1.

[0015] 5, the support portion 6 has a contact surface portion 9 that contacts the heat receiving plate 3, and a cylindrical first pillar portion 10 that connects the clamping portion 7 and the contact surface portion 9. The clamping portion 7 has a clamping surface portion 11 that clamps the wick 4 together with the heat receiving plate 3, and a second pillar portion 12 that connects the flat portion 5 and the clamping surface portion 11. The first pillar portion 10 and the clamping surface portion 11 are also connected.

[0016] The contact surface portion 9 is formed in a disk shape, and the clamping surface portion 11 is formed in an annular plate shape. In addition, the second pillar portion 12 has a larger diameter than the first pillar portion 10. Therefore, the support portion 6 and the clamping portion 7 have a multi-stage structure. The contact surface portion 9 and the clamping surface portion 11 are formed parallel to the flat portion 5.

[0017] The support portion 6 and the clamping portion 7 of this embodiment are formed by drawing the heat dissipation plate 2. Although the support portion 6 and the clamping portion 7 of this embodiment are cylindrical, they may also be rectangular tubular with a polygonal cross section. Furthermore, the support portion 6 and the clamping portion 7 may also be tapered cylindrical or rectangular tubular.

[0018] 4, the heat receiving plate 3 is formed in the shape of a rectangular thin plate, and has an outer peripheral joining portion 13 that joins to the outer peripheral portion of the flat portion 5 of the heat dissipation plate 2, and a housing portion 14 that protrudes in the opposite direction from the heat dissipation plate 2. In addition, one of the four short sides of the heat receiving plate 3 is formed with a nozzle portion 15 for injecting a working fluid into the internal space S1 and evacuating the internal space S1.

[0019] The storage section 14 integrally includes a bottom plate section 16 formed parallel to the outer peripheral joint section 13, and an inclined wall section 17 connecting the outer peripheral joint section 13 and the bottom plate section 16. The bottom plate section 16 is formed flat.

[0020] The wick 4 has a capillary structure with fine gaps evenly distributed throughout to generate a strong capillary force in the liquid-phase working fluid. The wick 4 can be, for example, a flat mesh body in which metal wires are aligned vertically and horizontally and woven, or a flat metal foil or nonwoven fabric having fine intersecting grooves on its surface that generate capillary force and holes arranged at equal intervals in the grooves. As shown in FIG. 5 , in this embodiment, a flat mesh body is used as the wick 4. In addition to the gaps between the vertical and horizontal metal wires, the wick 4 is also formed with a plurality of insertion holes 18 through which the support 6 is inserted.

[0021] Here, the assembly method (manufacturing method) of the SHP 1 is outlined. The support portion 6 of the heat dissipation plate 2 is inserted into the insertion hole 18 of the wick 4, and the wick 4 is temporarily attached to the heat dissipation plate 2 by spot welding. Next, the heat dissipation plate 2 and the heat receiving plate 3 are overlapped, and the contact surface portion 9 of the support portion 6 is welded to the bottom plate portion 16 of the heat receiving plate 3, and the outer peripheral portion of the flat portion 5 of the heat dissipation plate 2 is welded to the outer peripheral joint portion 13 of the heat receiving plate 3. At this time, the nozzle portion 8 and the nozzle portion 15 are aligned, and the ends in the short direction are welded together. When the heat dissipation plate 2 and the heat receiving plate 3 are joined, a flow path 19 communicating with the internal space S1 is formed between the nozzle portions 8 and 15. Openings 20 are formed at the tips of the nozzle portions 8 and 15, and a working fluid such as pure water is injected into the internal space S1 through these openings to degas the internal space S1. The nozzle portions 8 and 15 are then welded and sealed, then cut and removed. The positions and number of nozzle portions 8 and 15 can be determined appropriately taking into consideration the size and shape of the SHP1.

[0022] The joining of the contact surface portion 9 and the bottom plate portion 16, the joining of the outer periphery of the flat portion 5 and the outer periphery joining portion 13 of the heat receiving plate 3, and the joining of the nozzle portion 8 and the nozzle portion 15 can be performed using known joining methods such as diffusion bonding, laser welding, brazing, etc. For example, a brazing material (not shown) such as copper plating or copper-phosphor brazing may be applied to the contact surface portion 9 of the support portion 6, and the brazing material may be melted by high-temperature heat treatment to join the contact surface portion 9 and the bottom plate portion 16 with the brazing material. Note that although the heat dissipating plate 2 and the heat receiving plate 3 in this embodiment are made of stainless steel, if the heat dissipating plate 2 and the heat receiving plate 3 are made of copper, solder can be used as the brazing material.

[0023] In this embodiment, the wick 4 is sandwiched between the heat receiving plate 3 and the clamping portion 7, so although it is not essential, a solder material (not shown) such as copper plating or phosphorus copper solder may be applied to part or all of the wick 4, and the solder material may be melted by high-temperature heat treatment to fix the wick 4 to the bottom plate portion 16 of the heat receiving plate 3.

[0024] In this embodiment, the heat dissipation plate 2, the heat receiving plate 3, and the wick 4 are all made of stainless steel, but either the heat dissipation plate 2 or the heat receiving plate 3 may be made of copper, and the contact surface portion 9 and the bottom plate portion 16 may be joined by molten copper through high-temperature heat treatment. Alternatively, either the heat receiving plate 3 or the wick 4 may be made of copper, and the heat receiving plate 3 and wick 4 may be joined by molten copper through high-temperature heat treatment.

[0025] As shown in Figure 5, the distance G1 between the clamping surface portion 11 and the bottom plate portion 16 is the same as the thickness T of the wick 4, or the distance G1 is slightly narrower than the thickness T, and the wick 4 is clamped between the clamping surface portion 11 and the bottom plate portion 16 and held so as not to move in the vertical direction (thickness direction).

[0026] The number of support portions 6 and clamping portions 7 to be formed can be determined taking into consideration the size and shape of the SHP 1, the expansion rate of the internal space S1 of the SHP 1 when the temperature rises due to heat received from the object to be cooled (heat source), etc. As shown in Figure 3, the distance between adjacent contact surfaces 9 is equal to or greater than the distance D that allows the contact surfaces 9 and the bottom plate 16 to be joined by welding. Also, the distance between adjacent clamping surfaces 11 is equal to or greater than the distance d that allows drawing to be performed to form the support portions 6. Naturally, the relationship D>d holds.

[0027] Next, we will explain the operation and effect of the SHP1 configured as described above when it is installed in equipment. The bottom plate portion 16 of the heat receiving plate 3, which is the other side of the SHP1, serves as the heat receiving portion, contacting and thermally connecting with the heat source of the installed equipment. Meanwhile, the flat portion 5 of the heat dissipation plate 2, which is one side, serves as the main heat dissipation portion. Heat from the heat source is transferred to the bottom plate portion 16 of the SHP1, evaporating the working fluid in the internal space S1, and the vapor flows toward the flat portion 5, which has a lower temperature, thereby transporting heat within the SHP1. The heat transported to the flat portion 5 is diffused and dissipated from the SHP1. This cools the heat source and reduces the temperature rise of the equipment.

[0028] Meanwhile, in the internal space S1 on the flat portion 5 side of the SHP 1, the vapor condenses and the working fluid accumulates, but the strong capillary force of the wick 4 inside the SHP 1 causes the working fluid to return from the flat portion 5 side to the bottom plate portion 16 side. In this way, heat transport continues as the working fluid circulates inside the internal space S1. Note that even if there are multiple heat sources, as long as these heat sources are thermally connected to the bottom plate portion 16 of the heat receiving plate 3, multiple heat sources can be cooled.

[0029] As described above, the SHP1 of this embodiment is an SHP1 in which an internal space S1 is formed between the heat dissipation plate 2 and the heat receiving plate 3, and the internal space S1 is filled with a wick 4 and a working fluid, and the SHP1 has a support part 6 that joins the heat dissipation plate 2 and the heat receiving plate 3 in the internal space S1, and a clamping part 7 that is formed on the heat dissipation plate 2 and clamps the wick 4 between the heat receiving plate 3. Therefore, the wick 4 can be held while suppressing expansion of the internal space S1 of the SHP1.

[0030] Furthermore, in the SHP1 of this embodiment, an insertion hole 18 is formed in the wick 4, and the support part 6 is inserted into the insertion hole 18. Therefore, the contact surface part 9 of the support part 6 can be brought into contact with the heat receiving plate 3, and the heat dissipation plate 2 and the heat receiving plate 3 can be reliably joined.

[0031] Furthermore, in the SHP1 of this embodiment, the support section 6 and the clamping section 7 are integrally formed in a multi-stage structure. Therefore, the area of the flat section 5 can be made larger than when the support section 6 and the clamping section 7 are formed separately, and when a cooler (heat sink) or a component of a device in which the SHP1 is mounted is brought into contact with the heat dissipation plate 2, the area of the flat section 5 that comes into contact with the cooler (heat sink) or the component is increased, thereby improving the heat dissipation efficiency from the heat dissipation plate 2.

[0032] In the SHP1 of this embodiment, the heat dissipation plate 2 has a flat portion 5, the support portion 6 has a disk-shaped contact surface portion 9 and a cylindrical first columnar portion 10, the clamping portion 7 has an annular plate-shaped clamping surface portion 11 and a cylindrical second columnar portion 12, the first columnar portion 10 and the clamping surface portion 11 are connected, and the second columnar portion 12 is connected to the flat portion 5, and the second columnar portion 12 has a larger diameter than the first columnar portion 10. Therefore, by inserting the first columnar portion 10 into the insertion hole 18 of the wick 4, the wick 4 can be clamped between the heat receiving plate 3 and the clamping surface portion 11.

[0033] Furthermore, in the SHP1 of this embodiment, the support part 6 has a contact surface part 9 that is joined to the heat receiving plate 3, and the contact surface part 9 is joined to the heat receiving plate 3 by melting the contact surface part 9 or by melting the brazing material applied to the contact surface part 9. Therefore, the heat receiving plate 3 and the contact surface part 9 can be easily joined by high-temperature heat treatment.

[0034] Furthermore, in the SHP1 of this embodiment, the wick 4 is joined to the heat receiving plate 3 by melting the wick 4 or the brazing material applied to the wick 4. Therefore, the heat receiving plate 3 and the wick 4 can be easily joined by high-temperature heat treatment.

[0035] The manufacturing method of the SHP1 of this embodiment is a manufacturing method of an SHP1 in which an internal space S1 is formed between the heat dissipation plate 2 and the heat receiving plate 3, and includes the steps of sealing the wick 4 and working fluid in the internal space S1, overlapping the heat dissipation plate 2 and the heat receiving plate 3 and sandwiching the wick 4 between the clamping part 7 and the heat receiving plate 3, and joining the heat dissipation plate 2 and the heat receiving plate 3 in the internal space S1 with the support part 6. Therefore, it is possible to manufacture an SHP1 that can hold the wick 4 while suppressing expansion of the internal space S1.

[0036] FIG. 6 shows an SHP 21 according to a second embodiment of the present invention. Components identical to those in the first embodiment are designated by the same reference numerals, and the following description focuses on components different from the first embodiment. In the first embodiment, the support portions 6 and clamping portions 7 all have the same shape, and the support portions 6 and clamping portions 7 are uniformly formed on the heat dissipation plate 2. The number of contact surfaces 9 is determined based on the size, shape, and expansion coefficient of the internal space S1 of the SHP 1. The number of clamping surfaces 11 can be determined based on the size and shape of the wick 4, and can be determined to clamp the wick 4 without moving it in the vertical direction (thickness direction). Therefore, as shown in FIG. 6, part of the multi-stage structure consisting of the support portions 6 and clamping portions 7 may be replaced with a single-stage support portion 23 without the clamping portion 7. The support portion 23 includes a disk-shaped contact surface 24 and a cylindrical third pillar portion 25 that connects the flat portion 5 and the contact surface 24. The support portion 23 is formed by drawing.

[0037] In the SHP 21, a heat dissipation plate 22 serving as a first plate has multiple multi-stage structures (supporting portions 6 and clamping portions 7) and multiple single-stage structures (supporting portions 23). The wick 4 and working fluid are contained (enclosed) in an internal space S2 formed by joining the outer periphery of the heat dissipation plate 22 to the outer periphery joining portion 13 of the heat receiving plate 3. As in the first embodiment, the contact surface portion 9 of the supporting portion 6 is joined to the heat receiving plate 3, and the clamping surface portion 11 and the bottom plate portion 16 sandwich the wick 4. On the other hand, the supporting portion 23 is inserted into the insertion hole 18 of the wick 4, and the contact surface portion 24 is joined to the heat receiving plate 3, but does not sandwich the wick 4.

[0038] The number and arrangement of the support portions 6, the clamping portions 7, and the support portions 23 can be determined appropriately taking into consideration the size and shape of the SHP 1, the expansion rate of the internal space S2, and the size and shape of the wick 4. Furthermore, although the third column portion 25 in this embodiment has a cylindrical shape, it may also have a rectangular cylindrical shape.

[0039] Here, the assembly method (manufacturing method) of the SHP 21 will be outlined. The support portions 6, 23 of the heat dissipation plate 22 are inserted into the insertion holes 18 of the wick 4, and the wick 4 is temporarily fixed to the heat dissipation plate 22 by spot welding. Next, the heat dissipation plate 22 and the heat receiving plate 3 are overlapped, and the contact surfaces 9, 24 of the support portions 6, 23 are joined to the bottom plate portion 16 of the heat receiving plate 3 by welding, and the outer periphery of the flat portion 5 of the heat dissipation plate 22 is joined to the outer periphery joining portion 13 of the heat receiving plate 3 by welding. The methods of joining, cutting, and removing the nozzle portions 8, 15 (see FIGS. 3 and 4), injecting the working fluid into the internal space S2, and degassing the internal space S2 are the same as in the first embodiment.

[0040] The contact surface portion 24 and the bottom plate portion 16 can be joined by known joining methods such as diffusion bonding, laser welding, brazing, etc. For example, the contact surface portion 24 of the support portion 23 may be copper-plated or coated with a brazing material (not shown) such as copper phosphorus brazing, and the brazing material may be melted by high-temperature heat treatment to join the contact surface portion 24 and the bottom plate portion 16 with the brazing material.

[0041] In this embodiment, the heat dissipation plate 2, the heat receiving plate 3, and the wick 4 are all made of stainless steel, but either the heat dissipation plate 2 or the heat receiving plate 3 may be made of copper, and the contact surface portions 9, 24 and the bottom plate portion 16 may be joined by molten copper through high-temperature heat treatment.

[0042] In this embodiment, since the wick 4 is sandwiched between the heat receiving plate 3 and the sandwiching portion 7, although this is not essential, a brazing material (not shown) such as copper plating or copper phosphorus brazing may be applied to part or all of the wick 4, and the brazing material may be melted by high-temperature heat treatment to fix the wick 4 to the bottom plate portion 16 of the heat receiving plate 3. Alternatively, either the heat receiving plate 3 or the wick 4 may be made of copper, and the heat receiving plate 3 and the wick 4 may be joined by the molten copper by high-temperature heat treatment.

[0043] As described above, the SHP 21 of this embodiment is an SHP 21 that forms an internal space S2 between the heat dissipation plate 22 and the heat receiving plate 3, and the internal space S2 is filled with a wick 4 and a working fluid, and has support parts 6 and 23 that join the heat dissipation plate 22 and the heat receiving plate 3 in the internal space S2, and a clamping part 7 that is formed on the heat dissipation plate 22 and clamps the wick 4 between the heat receiving plate 3. Therefore, the wick 4 can be held while suppressing expansion of the internal space S2 of the SHP 21.

[0044] Furthermore, in the SHP 21 of this embodiment, an insertion hole 18 is formed in the wick 4, and the support parts 6, 23 are inserted into the insertion hole 18. Therefore, the contact surfaces 9, 24 of the support parts 6, 23 can be brought into contact with the heat receiving plate 3, and the heat dissipation plate 22 and the heat receiving plate 3 can be reliably joined.

[0045] Furthermore, in the SHP 21 of this embodiment, the support section 6 and the clamping section 7 are integrally formed in a multi-stage structure. Therefore, the area of the flat section 5 can be made larger than when the support section 6 and the clamping section 7 are formed separately. When a cooler (heat sink) or a component of a device in which the SHP 1 is mounted is brought into contact with the heat dissipation plate 2, the area of the flat section 5 that comes into contact with the cooler (heat sink) or the component becomes larger, thereby improving the heat dissipation efficiency from the heat dissipation plate 2.

[0046] In the SHP 21 of this embodiment, the heat dissipation plate 22 has a flat portion 5, the support portion 6 has a disk-shaped contact surface portion 9 and a cylindrical first columnar portion 10, the clamping portion 7 has an annular plate-shaped clamping surface portion 11 and a cylindrical second columnar portion 12, the first columnar portion 10 and the clamping surface portion 11 are connected, the second columnar portion 12 and the flat portion 5 are connected, and the second columnar portion 12 has a larger diameter than the first columnar portion 10. Therefore, by inserting the first columnar portion 10 into the insertion hole 18 of the wick 4, the wick 4 can be clamped between the heat receiving plate 3 and the clamping surface portion 11.

[0047] Furthermore, in the SHP 21 of this embodiment, the support parts 6, 23 have contact surfaces 9, 24 that are joined to the heat receiving plate 3, and the contact surfaces 9, 24 are joined to the heat receiving plate 3 by melting the contact surfaces 9, 24 or by melting the brazing material applied to the contact surfaces 9, 24. Therefore, the heat receiving plate 3 and the contact surfaces 9, 24 can be easily joined by high-temperature heat treatment.

[0048] Furthermore, in the SHP21 of this embodiment, the wick 4 is joined to the heat receiving plate 3 by melting the wick 4 or the brazing material applied to the wick 4. Therefore, the heat receiving plate 3 and the wick 4 can be easily joined by high-temperature heat treatment.

[0049] The manufacturing method of the SHP 21 of this embodiment is a manufacturing method of an SHP 21 in which an internal space S2 is formed between the heat dissipation plate 22 and the heat receiving plate 3, and includes the steps of sealing the wick 4 and working fluid in the internal space S2, overlapping the heat dissipation plate 22 and the heat receiving plate 3 to sandwich the wick 4 between the clamping part 7 and the heat receiving plate 3, and joining the heat dissipation plate 22 and the heat receiving plate 3 in the internal space S2 with the support parts 6, 23. Therefore, it is possible to manufacture an SHP 21 that can prevent the wick 4 from moving in the vertical direction (thickness direction) while suppressing expansion of the internal space S2.

[0050] 7 and 8 show an SHP 31 according to a third embodiment of the present invention. Hereinafter, the same components as those in the first and second embodiments are designated by the same reference numerals, and the following description will focus on the components that differ from the first and second embodiments. The heat dissipation plate 32, which serves as the first plate, is formed by separately forming a support portion 33 that joins to the heat receiving plate 3 and a clamping portion 34 that, together with the bottom plate portion 16, clamps the wick 4. Therefore, the support portion 33 and the clamping portion 34 each have a single-stage structure. The support portion 33 and the clamping portion 34 are formed by drawing. The support portion 33 has a disk-shaped contact surface portion 35 and a tapered cylindrical fourth column portion 36 that are integrally formed. The clamping portion 34 is formed in an approximately hemispherical shape.

[0051] The heat dissipation plate 32 is formed with a plurality of support portions 33 and a plurality of clamping portions 34, and the portion other than the support portions 33 and the plurality of clamping portions 34 forms a flat portion 5. The wick 4 and working fluid are contained (enclosed) in an internal space S3 formed by joining the outer periphery of the heat dissipation plate 32 and the outer periphery joining portion 13 of the heat receiving plate 3. The support portions 33 are inserted into the insertion holes 18 of the wick 4, and the abutment surface portions 35 are joined to the heat receiving plate 3. The clamping portions 34, together with the bottom plate portion 16, clamp the wick 4.

[0052] The number and arrangement of the support portions 33 and the clamping portions 34 can be determined appropriately taking into consideration the size and external shape of the SHP 31, the expansion rate of the internal space S3, and the size and shape of the wick 4. In addition, although the support portions 33 in this embodiment are substantially cylindrical, they may also be rectangular tubular. Furthermore, although the clamping portions 34 are substantially hemispherical, they may have other shapes as long as they can clamp the wick 4 together with the bottom plate portion 16.

[0053] Here, the assembly method (manufacturing method) of the SHP 31 will be outlined. The support portion 33 of the heat dissipation plate 32 is inserted into the insertion hole 18 of the wick 4, and the wick 4 is temporarily fixed to the heat dissipation plate 32 by spot welding. Next, the heat dissipation plate 32 and the heat receiving plate 3 are overlapped, and the contact surface portion 35 of the heat dissipation plate 32 is joined to the bottom plate portion 16 of the heat receiving plate 3 by welding, and the outer peripheral joining portion 13 of the heat receiving plate 3 is joined to the outer peripheral portion of the flat portion 5 of the heat dissipation plate 32 by welding. The methods of joining, cutting, and removing the nozzle portions 8 and 15 (see FIGS. 3 and 4), injecting the working fluid into the internal space S2, and degassing the internal space S2 are the same as those in the first embodiment.

[0054] As shown in Figure 8, the distance G2 between the clamping portion 34 and the bottom plate portion 16 is the same as the thickness T of the wick 4, or the distance G2 is slightly narrower than the thickness T, and the wick 4 is clamped between the clamping portion 34 and the bottom plate portion 16 and held so as not to move in the vertical direction (thickness direction).

[0055] The contact surface 35 and the bottom plate 16 can be joined by known joining methods such as diffusion bonding, laser welding, brazing, etc. For example, the contact surface 35 of the support part 33 may be copper-plated or coated with a brazing material (not shown) such as copper phosphorus brazing filler metal, and the copper plating may be melted by high-temperature heat treatment to join the contact surface 35 and the bottom plate 16 together. In addition, although the heat dissipation plate 32 and the heat receiving plate 3 in this embodiment are made of stainless steel, it is also possible to form either the heat dissipation plate 32 or the heat receiving plate 3 from copper, and then melt the copper by high-temperature heat treatment to join the contact surface 35 and the bottom plate 16 together.

[0056] In this embodiment, the wick 4 is sandwiched between the heat receiving plate 3 and the sandwiching portion 34, so although not essential, a brazing material (not shown) such as copper plating or copper phosphorus brazing may be applied to part or all of the wick 4, and the brazing material may be melted by high-temperature heat treatment to fix the wick 4 to the bottom plate portion 16 of the heat receiving plate 3. Alternatively, either the heat receiving plate 3 or the wick 4 may be made of copper, and the copper may be melted by high-temperature heat treatment to fix the wick 4 to the bottom plate portion 16.

[0057] As described above, the SHP 31 of this embodiment is an SHP 31 in which an internal space S3 is formed between the heat dissipation plate 32 and the heat receiving plate 3, and the internal space S3 is filled with a wick 4 and a working fluid, and the SHP 31 has a support portion 33 that joins the heat dissipation plate 32 and the heat receiving plate 3 in the internal space S3, and a clamping portion 34 that is formed on the heat dissipation plate 32 and clamps the wick 4 between the heat receiving plate 3. Therefore, the wick 4 can be held while suppressing expansion of the internal space S3 of the SHP 31.

[0058] Furthermore, in the SHP 31 of this embodiment, an insertion hole 18 is formed in the wick 4, and the support part 33 is inserted into the insertion hole 18. Therefore, the contact surface part 35 of the support part 33 can be brought into contact with the heat receiving plate 3, and the heat dissipation plate 32 and the heat receiving plate 3 can be reliably joined.

[0059] In addition, in the SHP 31 of this embodiment, the support portions 33 and the clamping portions 34 are formed separately on the heat dissipation plate 32, and the heat dissipation plate 32 has a flat portion 5, and another flat portion 5 is formed between the support portions 33 and the clamping portions 34 of the heat dissipation plate 32. Therefore, the number of support portions 33 and the number of clamping portions 34 do not have to be the same, and it is possible to form them in different numbers. In addition, there are many options for the positions of the support portions 33 and the clamping portions 34. Furthermore, by forming the support portions 33 and the clamping portions 34 separately, the surface area of the heat dissipation plate 32 is larger than that of the heat dissipation plate 2 of the first embodiment. Therefore, when the heat dissipation plate 32 is not in contact with a cooler (heat sink) or components of the device in which the SHP 1 is installed, the heat dissipation efficiency from the heat dissipation plate 32 can be improved.

[0060] Furthermore, in the SHP 31 of this embodiment, the support portion 33 has a contact surface portion 35 that is joined to the heat receiving plate 3, and the contact surface portion 35 is joined to the heat receiving plate 3 by melting the contact surface portion 35 or by melting the brazing material applied to the contact surface portion 35. Therefore, the heat receiving plate 3 and the contact surface portion 35 can be easily joined by high-temperature heat treatment.

[0061] Furthermore, in the SHP 31 of this embodiment, the wick 4 is joined to the heat receiving plate 3 by melting the wick 4 or the brazing material applied to the wick 4. Therefore, the heat receiving plate 3 and the wick 4 can be easily joined by high-temperature heat treatment.

[0062] The manufacturing method of the SHP 31 of this embodiment is a manufacturing method of an SHP 31 in which an internal space S3 is formed between the heat dissipation plate 32 and the heat receiving plate 3, and includes the steps of sealing the wick 4 and working fluid in the internal space S3, overlapping the heat dissipation plate 32 and the heat receiving plate 3 to sandwich the wick 4 between the clamping portion 34 and the heat receiving plate 3, and joining the heat dissipation plate 32 and the heat receiving plate 3 with the support portion 33 in the internal space S3. Therefore, it is possible to manufacture an SHP 31 that can hold the wick 4 while suppressing expansion of the internal space S3.

[0063] FIG. 9 shows an SHP 41 according to a fourth embodiment of the present invention. A heat dissipation plate 42 serving as a first plate is formed with a support portion 43 that protrudes toward the heat reception plate 3. The support portion 43 is formed by drawing and has a substantially cylindrical shape. The support portion 43 has a disk-shaped contact surface portion 44 and a cylindrical first column portion 45. A plurality of support portions 43 are formed on the heat dissipation plate 42, and the portion other than the support portions 43 forms a flat portion 5. Although the support portion 43 in this embodiment is substantially cylindrical, it may also be a rectangular tube shape.

[0064] The internal space S4 of the SHP 41 contains (encloses) the wick 4 and working fluid. In this embodiment, the wick 4 is fixed to the bottom plate portion 16 of the heat receiving plate 3 by diffusion bonding. This prevents the wick 4 from moving in the vertical direction (thickness direction). A brazing material (not shown), such as copper plating or phosphorus copper brazing, may be applied to part or all of the wick 4, and the brazing material may be melted by high-temperature heat treatment to fix the wick 4 to the bottom plate portion 16 of the heat receiving plate 3. Alternatively, a brazing material (not shown), such as copper plating or phosphorus copper brazing, may be applied to part or all of the bottom plate portion 16, and the brazing material may be melted by high-temperature heat treatment to fix the wick 4 to the bottom plate portion 16 of the heat receiving plate 3. In this embodiment, the heat receiving plate 3 and the wick 4 are made of stainless steel. However, one of the heat receiving plate 3 and the wick 4 may be made of copper, and the copper may be melted by high-temperature heat treatment to join the heat receiving plate 3 and the wick 4. The wick 4 has the same number of insertion holes 18 as the number of the support parts 43 formed therein.

[0065] Here, the assembly method (manufacturing method) of the SHP 41 will be outlined. The wick 4 is bonded to the bottom plate portion 16 of the heat receiving plate 3 by diffusion bonding. Next, the heat dissipation plate 42 and the heat receiving plate 3 are overlapped. At this time, the support portion 43 is inserted into the insertion hole 18. The contact surface portion 44 of the support portion 43 is bonded to the bottom plate portion 16 of the heat receiving plate 3 by welding, and the outer peripheral bonding portion 13 of the heat receiving plate 3 is bonded to the outer peripheral portion of the flat portion 5 of the heat dissipation plate 42 by welding. The methods of bonding, cutting, and removing the nozzle portions 8 and 15 (see Figures 3 and 4), injecting the working fluid into the internal space S2, and degassing the internal space S2 are the same as in the first embodiment.

[0066] The contact surface portion 44 and the bottom plate portion 16 can be joined by known joining methods such as diffusion bonding, laser welding, brazing, etc. For example, the contact surface portion 44 of the support portion 43 may be coated with a brazing material (not shown) such as copper plating or copper-phosphor brazing, and the brazing material may be melted by high-temperature heat treatment to join the contact surface portion 44 and the bottom plate portion 16 with the brazing material.

[0067] As described above, the SHP 41 of this embodiment is an SHP 41 in which an internal space S4 is formed between the heat dissipation plate 42 and the heat receiving plate 3, and the internal space S4 is filled with the wick 4 and a working fluid, and has a support part 43 that joins the heat dissipation plate 42 and the heat receiving plate 3 in the internal space S4, and the wick 4 is fixed to the heat receiving plate 3. Therefore, the wick 4 can be held while suppressing expansion of the internal space S4 of the SHP 41.

[0068] Furthermore, in the SHP 41 of this embodiment, an insertion hole 18 is formed in the wick 4, and the support part 43 is inserted into the insertion hole 18. Therefore, the contact surface part 44 of the support part 43 can be brought into contact with the heat receiving plate 3, and the heat dissipation plate 42 and the heat receiving plate 3 can be reliably joined.

[0069] Furthermore, in the SHP 41 of this embodiment, the support portion 43 has a contact surface portion 44 that is joined to the heat receiving plate 3, and the contact surface portion 44 is joined to the heat receiving plate 3 by melting the contact surface portion 44 or by melting the brazing material applied to the contact surface portion 44. Therefore, the heat receiving plate 3 and the contact surface portion 44 can be easily joined by high-temperature heat treatment.

[0070] Furthermore, in the SHP 41 of this embodiment, the wick 4 is joined to the heat receiving plate 3 by melting the wick 4 or the brazing material applied to the wick 4. Therefore, the heat receiving plate 3 and the wick 4 can be easily joined by high-temperature heat treatment.

[0071] FIG. 10 shows an SHP 51 according to a fifth embodiment of the present invention. The heat dissipation plate 52, which serves as a first plate, is formed by etching. The entire outer surface of the heat dissipation plate 52 is a flat portion 5, and the inner surface has multiple support portions 53 and clamping portions 54 that protrude toward the heat receiving plate 3. The support portions 53 and clamping portions 54 of this embodiment are solid versions of the support portions 6 and clamping portions 7 of the first embodiment and are formed as a single unit. Therefore, the support portion 53 has a disk-shaped contact surface portion 55 that contacts the heat receiving plate 3 and a cylindrical first pillar portion 56 that connects the clamping portion 54 to the contact surface portion 55. The clamping portion 54 has an annular plate-shaped clamping surface portion 57 that clamps the wick 4 with the bottom plate portion 16, and a second pillar portion 58 that connects the flat portion 5 and the clamping surface portion 57. The first pillar portion 56 is also connected to the clamping surface portion 57.

[0072] The second pillar portion 58 has a larger diameter than the first pillar portion 56, and the support portion 53 and the clamping portion 54 have a multi-stage structure. In this embodiment, the first pillar portion 56 and the second pillar portion 58 are cylindrical, but they may also be rectangular.

[0073] The wick 4 and working fluid are contained (enclosed) in an internal space S5 formed by joining the outer peripheries of the heat dissipation plate 52 and the heat receiving plate 3. The support portion 53 is inserted into the insertion hole 18 of the wick 4, and the contact surface portion 55 is joined to the heat receiving plate 3. The clamping portion 54, together with the bottom plate portion 16, clamps the wick 4.

[0074] Here, the assembly method (manufacturing method) of the SHP 51 will be outlined. The support portion 53 of the heat dissipation plate 52 is inserted into the insertion hole 18 of the wick 4, and the wick 4 is temporarily fixed to the heat dissipation plate 52 by spot welding. Next, the heat dissipation plate 52 and the heat receiving plate 3 are overlapped, and the contact surface portion 55 of the support portion 53 is joined to the bottom plate portion 16 of the heat receiving plate 3 by welding, and the outer peripheral joining portion 13 of the heat receiving plate 3 is joined to the outer peripheral portion of the flat portion 5 of the heat dissipation plate 52 by welding. The methods of joining, cutting, and removing the nozzle portions 8 and 15 (see FIGS. 3 and 4), injecting the working fluid into the internal space S5, and degassing the internal space S5 are the same as those in the first embodiment.

[0075] The joining of the contact surface portion 55 and the bottom plate portion 16, the joining of the outer peripheral portion of the flat portion 5 and the outer peripheral joining portion 13 of the heat-receiving plate 3, and the joining of the nozzle portion 8 and the nozzle portion 15 can be performed using known joining methods such as diffusion bonding, laser welding, brazing, etc. For example, the contact surface portion 55 of the support portion 54 may be coated with a brazing material (not shown) such as copper plating or copper-phosphor brazing, and the brazing material may be melted by high-temperature heat treatment to join the contact surface portion 55 and the bottom plate portion 16 with the brazing material.

[0076] In this embodiment, the heat dissipation plate 52 and the heat receiving plate 3 are made of stainless steel, but either the heat dissipation plate 52 or the heat receiving plate 3 may be made of copper, and the copper may be melted by high-temperature heat treatment to join the contact surface portion 55 and the bottom plate portion 16.

[0077] The distance G3 between the clamping surface portion 57 and the bottom plate portion 16 is the same as the thickness T of the wick 4, or the distance G3 is formed to be slightly narrower than the thickness T, and the wick 4 is clamped between the clamping surface portion 57 and the bottom plate portion 16 and held so as not to move in the vertical direction (thickness direction).

[0078] In this embodiment, since the wick 4 is sandwiched between the heat receiving plate 3 and the sandwiching portion 54, although this is not essential, a brazing material (not shown) such as copper plating or copper-phosphor brazing may be applied to part or all of the wick 4, and the brazing material may be melted by high-temperature heat treatment to fix the wick 4 to the bottom plate portion 16 of the heat receiving plate 3. Also, in this embodiment, the heat receiving plate 3 and the wick 4 are made of stainless steel, but it is also possible to form either the heat receiving plate 3 or the wick 4 from copper, and melt the copper by high-temperature heat treatment to join the heat receiving plate 3 and the wick 4 together.

[0079] As described above, the SHP 51 of this embodiment is an SHP 51 in which an internal space S5 is formed between the heat dissipation plate 52 and the heat receiving plate 3, and the internal space S5 is filled with a wick 4 and a working fluid, and the SHP 51 has a support portion 53 that joins the heat dissipation plate 52 and the heat receiving plate 3 in the internal space S5, and a clamping portion 54 that is formed on the heat dissipation plate 2 and clamps the wick 4 between the heat receiving plate 3. Therefore, the wick 4 can be held while suppressing expansion of the internal space S5 of the SHP 51.

[0080] Furthermore, in the SHP 51 of this embodiment, an insertion hole 18 is formed in the wick 4, and the support part 53 is inserted into the insertion hole 18. Therefore, the contact surface part 55 of the support part 53 can be brought into contact with the heat receiving plate 3, and the heat dissipation plate 52 and the heat receiving plate 3 can be reliably joined.

[0081] Furthermore, in the SHP 51 of this embodiment, the support portion 53 and the clamping portion 54 are integrally formed in a multi-stage structure, which provides two functions and effects: suppressing expansion of the internal space S5 of the SHP 51 and holding the wick 4.

[0082] In the SHP 51 of this embodiment, the heat dissipation plate 52 has a flat portion 5, the support portion 53 has a disk-shaped contact surface portion 55 and a cylindrical first pillar portion 56, and the clamping portion 54 has an annular plate-shaped clamping surface portion 55 and a cylindrical second pillar portion 58, the first pillar portion 56 and the clamping surface portion 55 are connected, and the second pillar portion 58 and the flat portion 5 are connected, and the second pillar portion 58 has a larger diameter than the first pillar portion 56. Therefore, by inserting the first pillar portion 56 into the insertion hole 18 of the wick 4, the wick 4 can be clamped between the heat receiving plate 3 and the clamping surface portion 57.

[0083] Furthermore, in the SHP 51 of this embodiment, the support portion 53 has a contact surface portion 55 that is joined to the heat receiving plate 3, and the contact surface portion 55 is joined to the heat receiving plate 3 by melting the contact surface portion 55 or by melting the brazing material applied to the contact surface portion 55. Therefore, the heat receiving plate 3 and the contact surface portion 55 can be easily joined by high-temperature heat treatment.

[0084] Furthermore, in the SHP 51 of this embodiment, the wick 4 is joined to the heat receiving plate 3 by melting the wick 4 or the brazing material applied to the wick 4. Therefore, the heat receiving plate 3 and the wick 4 can be easily joined by high-temperature heat treatment.

[0085] The manufacturing method of the SHP51 of this embodiment is a manufacturing method of an SHP51 in which an internal space S5 is formed between the heat dissipation plate 52 and the heat receiving plate 3, and includes the steps of sealing the wick 4 and working fluid in the internal space S5, overlapping the heat dissipation plate 52 and the heat receiving plate 3 to sandwich the wick 4 between the clamping portion 54 and the heat receiving plate 3, and joining the heat dissipation plate 52 and the heat receiving plate 3 with the support portion 53 in the internal space S5. Therefore, it is possible to manufacture an SHP51 that can hold the wick 4 while suppressing expansion of the internal space S5.

[0086] 11 shows an SHP 61 according to a sixth embodiment of the present invention. A heat dissipation plate 62 serving as a first plate is formed by drawing, and is provided with a joint protrusion 63 that protrudes toward the heat reception plate 3. The joint protrusion 63 is formed in a substantially cylindrical shape and includes a contact surface 64 that contacts the wick 4 and a fifth columnar portion 65 also formed in a cylindrical shape. The joint protrusion 63 may be formed in a rectangular tube shape, a cylindrical shape, or a rectangular column shape.

[0087] The wick 4 and working fluid are contained (enclosed) in an internal space S6 formed by joining the outer peripheral portion of the heat dissipation plate 62 and the outer peripheral joining portion 13 of the heat receiving plate 3. In this embodiment, the wick 4 does not have an insertion hole 18, and when the heat dissipation plate 62 and the heat receiving plate 3 are overlapped, the joining surface portion 64 comes into contact with the wick 4.

[0088] The contact portion 66 of the wick 4, which contacts the joint surface portion 64, and its surrounding area are coated with copper plating 67, which serves as a brazing material. Therefore, when high-temperature heat treatment is performed on the heat dissipation plate 62 and the heat receiving plate 3 while they are stacked, the copper plating 67 melts, bonding the joint surface portion 64 to the contact portion 66 and bonding the bottom plate portion 16 of the heat receiving plate 3 to the contact portion 66. This results in the heat dissipation plate 62 and the heat receiving plate 3 being bonded via the wick 4 and the copper plating 67. In this embodiment, the copper plating 67 is applied only to the contact portion 66 of the wick 4 and its surrounding area. However, the copper plating 67 may also be applied to some or all of the other portions of the wick 4. In this case, the bonding strength between the wick 4 and the bottom plate portion 16 of the heat receiving plate 3 is increased. Furthermore, phosphorus copper brazing may be used as the brazing material instead of the copper plating 67. Furthermore, if the heat dissipation plate 62, the heat receiving plate 3, and the wick 4 are made of copper, solder may be used as the brazing material.

[0089] In this embodiment, the wick 4 is plated with copper 67, but the joining surface 64 and the bottom plate 16 may be plated with copper 67 as a brazing material, and the copper plating 67 may be melted to join the heat dissipation plate 62 and the heat receiving plate 3 via the wick 4 and the copper plating 67. Furthermore, the joining surface 64 or the upper surface side (heat dissipation plate 62 side) of the wick 4 may be plated with copper 67 as a brazing material, and the lower surface side (heat receiving plate 3 side) of the wick 4 or the bottom plate 16 may be plated with copper 67 as a brazing material, and the copper plating 67 may be melted to join the heat dissipation plate 62 and the heat receiving plate 3 via the wick 4 and the copper plating 67.

[0090] In this embodiment, the heat dissipation plate 62, the heat receiving plate 3, and the wick 4 are all made of stainless steel, but either the heat dissipation plate 62 or the wick 4 may be made of copper, and the joining surface 64 and the wick 4 may be joined by molten copper through high-temperature heat treatment. Alternatively, either the heat receiving plate 3 or the wick 4 may be made of copper, and the heat receiving plate 3 and the wick 4 may be joined by molten copper through high-temperature heat treatment.

[0091] As described above, the SHP 61 of this embodiment has an internal space S6 formed between the heat dissipation plate 62 and the heat receiving plate 3. The internal space S6 contains the wick 4 and a working fluid. The heat dissipation plate 62 has a joint protrusion 63 that protrudes toward the heat receiving plate 3. At least one of the joint protrusion 63, the wick 4, the copper plating 67 on the joint protrusion 63, or the wick 4 is melted to bond the joint protrusion 63 to the wick 4. At least one of the wick 4, the heat receiving plate 3, the copper plating 67 on the wick 4, or the heat receiving plate 3 is melted to bond the wick 4 to the heat receiving plate 3. Therefore, high-temperature heat treatment can easily bond the heat dissipation plate 62 and the wick 4 and the heat receiving plate 3 and the wick 4. Furthermore, the wick 4 can be held in place while suppressing expansion of the internal space S6 of the SHP 61.

[0092] 12 shows an SHP 71 according to a seventh embodiment of the present invention. A heat dissipation plate 72 serving as a first plate and a heat reception plate 73 serving as a second plate are formed by etching. A wick 4 and a working fluid are contained (enclosed) in an internal space S7 formed by joining the outer peripheries of the heat dissipation plate 72 and the heat reception plate 73.

[0093] The entire outer surface of the heat dissipation plate 72 is a flat portion 5, and a plurality of clamping portions 74 that protrude toward the heat receiving plate 73 are formed on the inner surface. The clamping portions 74 have a disk-shaped clamping surface portion 75 that clamps the wick 4 with the heat receiving plate 73, and a cylindrical second pillar portion 76 that connects the flat portion 5 and the clamping surface portion 75. In addition, a one-side outer peripheral joint portion 77 that protrudes toward the heat receiving plate 73 is formed on the outer periphery of the inner surface of the heat dissipation plate 72. The height H1 of the clamping portion 74 and the height H2 of the one-side outer peripheral joint portion 77 are the same height (H1 = H2).

[0094] The outer periphery of the heat receiving plate 73 is formed with an other-side outer periphery joint 78 that protrudes toward the heat dissipation plate 72 and joins with the one-side outer periphery joint 77 of the heat dissipation plate 72. The area surrounded by this other-side outer periphery joint 78 is a housing section 79, which houses the wick 4. Furthermore, the same number of support sections 81 as the clamping sections 74 are formed on a bottom plate section 80 of the housing section 79 of the heat receiving plate 73, protruding toward the heat dissipation plate 72. The support sections 81 are cylindrical and have a smaller diameter than the clamping sections 74. The support sections 81 have a disk-shaped abutment surface section 82 that abuts and joins with the clamping section 74, and a first column section 83 that connects the bottom plate section 80 and the abutment surface section 82. The height H3 of the other-side outer periphery joint 78 and the height H4 of the support sections 81 are the same height (H3 = H4). The height H4 of the support portion 81 is formed to be the same as or slightly shorter than the thickness T of the wick 4, and when the clamping portion 74 and the support portion 81 are joined, the wick 4 is clamped between the clamping portion 74 and the bottom plate portion 80 of the heat receiving plate 73, preventing the wick 4 from moving in the vertical direction (thickness direction).

[0095] Here, the assembly method (manufacturing method) of the SHP 71 will be outlined. The support portion 81 of the heat receiving plate 73 is inserted into the insertion hole 18 of the wick 4, and the wick 4 is temporarily fixed to the heat receiving plate 73 by spot welding. Next, the heat dissipation plate 72 and the heat receiving plate 73 are overlapped, and the clamping surface portion 75 of the clamping portion 74 is joined to the abutting surface portion 82 of the support portion 81 by welding, and the one-side outer peripheral joint portion 77 is joined to the other-side outer peripheral joint portion 78 by welding. The methods of joining, cutting, and removing the nozzle portions 8, 15 (see Figures 3 and 4), injecting the working fluid into the internal space S7, and degassing the internal space S7 are the same as in the first embodiment.

[0096] The joining of the clamping surface portion 75 and the abutment surface portion 82, and the joining of the one-side outer peripheral joining portion 77 and the other-side outer peripheral joining portion 78 can be performed using known joining methods such as diffusion joining, laser welding, brazing, etc.

[0097] The distance G4 between the clamping surface portion 75 and the bottom plate portion 80 is the same as the thickness T of the wick 4, or the distance G4 is formed to be slightly narrower than the thickness T, so that the wick 4 is clamped between the clamping surface portion 75 and the bottom plate portion 80 and held so as not to move in the vertical direction (thickness direction).

[0098] In this embodiment, since the wick 4 is sandwiched between the heat receiving plate 73 and the sandwiching portion 74, although this is not essential, a brazing material (not shown) such as copper plating or copper-phosphor brazing may be applied to part or all of the wick 4, and the brazing material may be melted by high-temperature heat treatment to fix the wick 4 to the bottom plate portion 80 of the heat receiving plate 73. Also, in this embodiment, the heat receiving plate 73 and the wick 4 are made of stainless steel, but it is also possible to form either the heat receiving plate 73 or the wick 4 from copper, and melt the copper by high-temperature heat treatment to join the heat receiving plate 73 and the wick 4.

[0099] In this embodiment, the height H1 of the clamping portion 74 and the height H2 of the one-side outer peripheral joint 77 are formed to be the same, and the height H3 of the other-side outer peripheral joint 78 and the height H4 of the support portion 81 are formed to be the same, but the height H2 of the one-side outer peripheral joint 77 and the height H3 of the other-side outer peripheral joint 78 can be changed as appropriate as long as the one-side outer peripheral joint 77 and the other-side outer peripheral joint 78 can be abutted and joined.

[0100] As described above, the SHP 71 of this embodiment is an SHP 71 that forms an internal space S7 between the heat dissipation plate 72 and the heat receiving plate 73, and the internal space S7 is filled with a wick 4 and a working fluid, and has a support portion 81 that joins the heat dissipation plate 72 and the heat receiving plate 73 in the internal space S7, and a clamping portion 74 that is formed on the heat dissipation plate 72 and clamps the wick 4 between the heat receiving plate 73. Therefore, the wick 4 can be held while suppressing expansion of the internal space S7 of the SHP 71.

[0101] Furthermore, in the SHP 71 of this embodiment, an insertion hole 18 is formed in the wick 4, and the support portion 81 is inserted into the insertion hole 18. Therefore, the contact surface portion 82 of the support portion 81 can be brought into contact with the clamping portion 74 of the heat dissipation plate 72, and the heat dissipation plate 72 and the heat receiving plate 73 can be reliably joined together.

[0102] Furthermore, in the SHP 71 of this embodiment, the support portion 81 is formed on the heat receiving plate 73, and the support portion 81 is joined to the clamping portion 74. Therefore, expansion of the internal space S7 of the SHP 71 can be suppressed.

[0103] The manufacturing method of the SHP71 of this embodiment is a manufacturing method of an SHP71 in which an internal space S7 is formed between a heat dissipation plate 72 and a heat receiving plate 73, and includes the steps of sealing the wick 4 and working fluid in the internal space S7, overlapping the heat dissipation plate 72 and the heat receiving plate 73 and sandwiching the wick 4 between the clamping portion 74 and the heat receiving plate 73, and joining the heat dissipation plate 72 and the heat receiving plate 73 with the support portion 83 in the internal space S7. Therefore, it is possible to manufacture an SHP71 that can hold the wick 4 while suppressing expansion of the internal space S7.

[0104] The present invention is not limited to the above-described embodiments, and various modifications are possible without departing from the spirit of the present invention. For example, the external shape of the SHPs 1, 21, 31, 41, 51, 61, and 71 is not limited to a rectangular shape, and other external shapes may be used that correspond to the shape of the heat source of the equipment in which the SHPs 1, 21, 31, 41, 51, 61, and 71 are housed. Furthermore, a combination of multiple support portions 6, 23, 33, 43, 53, and 81, clamping portions 7, 34, 54, and 74, and joining protrusions 63 in the above-described embodiments may be used. [Explanation of symbols]

[0105] 1. Sheet-type heat pipe 2 Heat dissipation plate (first plate) 3 Heat receiving plate (second plate) 4. Wick (capillary structure) 5 Flat area 6 Support part 7 Clamping part 9 Contact surface part 10 1st pillar section 11 Clamping surface part 12 Second pillar section 18 Insertion hole 21 Sheet-type heat pipe 22 Heat dissipation plate (first plate) 23 Support part 24 Contact surface part 31 Sheet-type heat pipe 32 Heat dissipation plate (first plate) 33 Support part 34 Clamping part 35 Contact surface part 41 Sheet-type heat pipe 42 Heat dissipation plate (first plate) 43 Support part 44 Contact surface part 51 Sheet-type heat pipe 52 Heat dissipation plate (first plate) 53 Support part 54 Clamping part 55 Contact surface part 56 1st pillar section 58 Second pillar section 61 Sheet-type heat pipe 62 Heat dissipation plate (first plate) 63 Joint protrusion 67 Copper plating (brazing material) 71 Sheet-shaped heat pipe 72 Heat dissipation plate (first plate) 73 Heat receiving plate (second plate) 74 Clamping part 75 Clamping surface part 81 Support part 82 Contact surface part S1 interior space S2 interior space S3 interior space S4 interior space S5 interior space S6 interior space S7 interior space

Claims

1. A sheet-shaped heat pipe having an internal space formed between a first plate and a second plate, A capillary structure and a working fluid are sealed in the internal space, a support portion that joins the first plate and the second plate in the internal space; a clamping portion formed on the first plate for clamping the capillary structure between the first plate and the second plate.

2. A sheet-shaped heat pipe having an internal space formed between a first plate and a second plate, A capillary structure and a working fluid are sealed in the internal space, a support portion at which the first plate and the second plate are joined in the internal space, The sheet-shaped heat pipe is characterized in that the capillary structure is fixed to the second plate.

3. A sheet-shaped heat pipe having an internal space formed between a first plate and a second plate, A capillary structure and a working fluid are sealed in the internal space, The first plate has a joint projection formed thereon that projects toward the second plate, At least one of the joining protrusion, the capillary structure, and the brazing material applied to the joining protrusion or the capillary structure is melted to join the joining protrusion and the capillary structure, A sheet-type heat pipe characterized in that at least one of the capillary structure, the second plate, and the brazing material applied to the capillary structure or the second plate is melted to join the capillary structure and the second plate.

4. 3. The sheet-shaped heat pipe according to claim 1, wherein the capillary structure has an insertion hole formed therein, and the support portion is inserted into the insertion hole.

5. the support portion is formed on the second plate, 2. The sheet-shaped heat pipe according to claim 1, wherein the support portion and the clamping portion are joined together.

6. 2. The sheet-shaped heat pipe according to claim 1, wherein the support portion and the clamping portion are integrally formed in a multi-stage structure.

7. the first plate has a flat portion; The support portion has a disk-shaped contact surface portion and a cylindrical or columnar first pillar portion, The clamping portion has a clamping surface portion having an annular plate shape and a second pillar portion having a cylindrical or columnar shape, The first pillar portion and the clamping surface portion are connected to each other, The second pillar portion and the flat portion are connected to each other, The sheet-shaped heat pipe according to claim 6, wherein the second columnar portion has a larger diameter than the first columnar portion.

8. The support portion and the clamping portion are formed separately on the first plate, the first plate has a flat portion; 2. The sheet-shaped heat pipe according to claim 1, wherein the flat portion is formed between the support portion and the clamping portion of the first plate.

9. the support portion has an abutment surface portion that is joined to the second plate, 9. The sheet-shaped heat pipe according to claim 1, wherein the contact surface is joined to the second plate by melting the contact surface or by melting a brazing material applied to the contact surface.

10. 9. The sheet-type heat pipe according to claim 1, wherein the capillary structure is joined to the second plate by melting the capillary structure or by melting a brazing material applied to the capillary structure.

11. A method for manufacturing a sheet-shaped heat pipe having an internal space formed between a first plate and a second plate, comprising: sealing a capillary structure and a working fluid in the internal space; a step of overlapping the first plate and the second plate to sandwich the capillary structure between a sandwiching portion and the second plate; and joining the first plate and the second plate with a support portion in the internal space.

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