Exposure apparatus

Abstract

To improve throughput of an exposure apparatus.SOLUTION: An exposure apparatus includes: a stage which moves a substrate in a scan direction; a spatial light modulator; an illumination optical system which illuminates the spatial light modulator; and a projection optical system which irradiates the substrate with light from the spatial light modulator while the stage moves the substrate in the scan direction, where the substrate includes a first region in which a first pattern is formed and a second region in which a second pattern is formed, which are arrayed in the scan direction, and a first exposure region above the first region is exposed, and a second exposure region above the second region is not exposed, on the basis of positional deviation of the first region from a design value and positional deviation of the second region from a design value, or on the basis of positional information of a mark of the first region and positional information of a mark of the second region.SELECTED DRAWING: Figure 8

Description

[Technical Field]

[0001] This relates to an exposure device. [Background technology]

[0002] Traditionally, the lithography process for manufacturing electronic devices (microdevices) such as liquid crystal and organic electroluminescent (EL) display panels and semiconductor elements (integrated circuits, etc.) has used step-and-repeat projection exposure equipment (so-called steppers) or step-and-scan projection exposure equipment (so-called scanning steppers, also called scanners). This type of exposure equipment projects and exposes a mask pattern for the electronic device onto a photosensitive layer applied to the surface of a substrate to be exposed (hereinafter simply referred to as the substrate), such as a glass substrate, semiconductor wafer, printed wiring board, or resin film.

[0003] Because it takes time and money to fabricate a mask substrate on which the mask pattern is fixedly formed, an exposure apparatus is known that uses a spatial light modulation element (variable mask pattern generator) such as a digital mirror device (DMD) in which a large number of micromirrors that can be slightly displaced are regularly arranged instead of a mask substrate (see, for example, Patent Document 1). In the exposure apparatus disclosed in Patent Document 1, for example, illumination light obtained by mixing light from a laser diode (LD) with a wavelength of 375 nm and light from an LD with a wavelength of 405 nm in a multimode fiber bundle is irradiated onto the digital mirror device (DMD), and the reflected light from each of the large number of tilt-controlled micromirrors is projected onto the substrate for exposure via an imaging optical system and a microlens array.

[0004] There is a demand for improving the throughput of exposure apparatuses. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Publication No. 2019-23748 Summary of the Invention

[0006] According to one aspect of the disclosure, the exposure apparatus is an exposure apparatus that exposes an object with pattern light generated by a spatial light modulator according to drawing data, and includes: an illumination optical system that irradiates illumination light onto the spatial light modulator; a projection optical system that projects the pattern light onto the object; a first movable body that is arranged below the projection optical system and holds the object; a first drive unit that moves the first movable body in a first direction and a second direction that are perpendicular to each other within a predetermined plane that is perpendicular to the optical axis of the projection optical system; a second movable body that holds the spatial light modulator; a second drive unit that moves the second movable body; a measurement unit that measures measurement results including at least one of position information of the object and position information of the first movable body; and a control unit that controls at least one of driving the second movable body and adjusting the projection optical system based on the measurement results obtained by the measurement unit, and controls the exposure position of the pattern light.

[0007] The configurations of the embodiments described below may be modified as appropriate, and at least a portion of the configuration may be replaced with other components. Furthermore, components that are not particularly limited in terms of their placement may be placed in any position that can achieve their function, not limited to the placement disclosed in the embodiments. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a perspective view showing the outline of the external configuration of an exposure apparatus according to one embodiment. [Figure 2] FIG. 2 is a diagram showing an example of the arrangement of the projection areas of the DMD projected onto the substrate by the projection units of the multiple exposure modules. [Figure 3] FIG. 3 is a diagram for explaining the state of the continuous exposure by each of the four specific projection areas in FIG. [Figure 4] FIG. 4 is an optical layout diagram showing a specific configuration of two exposure modules aligned in the X direction (scanning exposure direction) as viewed in the XZ plane. [Figure 5]Figure 5(A) is a diagram showing a schematic diagram of a DMD, Figure 5(B) is a diagram showing the DMD when the power is OFF, Figure 5(C) is a diagram explaining the mirror in the ON state, and Figure 5(D) is a diagram explaining the mirror in the OFF state. [Figure 6] 6(A) and 6(B) are diagrams illustrating the optical elements provided between the DMD and the first lens group of the projection unit. [Figure 7] FIG. 7 is a diagram showing a schematic configuration of an alignment device provided on a calibration reference portion attached to an end portion on a substrate holder of an exposure apparatus. [Figure 8] FIG. 8 is a functional block diagram showing the functional configuration of the exposure control device. [Figure 9] FIG. 9 is a flowchart showing an outline of the procedure for performing exposure processing on a substrate. [Figure 10] FIG. 10 is a diagram showing a case where patterns of four display panels are exposed onto one substrate. [Figure 11] 11(A) to 11(C) are diagrams showing examples of exposure results from the first exposure process of the display panel. DETAILED DESCRIPTION OF THE INVENTION

[0009] A pattern exposure apparatus (hereinafter simply referred to as exposure apparatus) according to one embodiment will be described with reference to the drawings.

[0010] [Overall configuration of exposure device] 1 is a perspective view showing an outline of the external configuration of an exposure apparatus EX according to one embodiment. The exposure apparatus EX is an apparatus that projects exposure light, the intensity distribution of which is dynamically modulated in space by a spatial light modulator (SLM), onto an exposed substrate as an image. Examples of spatial light modulators include liquid crystal elements, digital micromirror devices (DMDs), and magneto-optic spatial light modulators (MOSLMs). The exposure apparatus EX according to this embodiment includes a DMD 10 as a spatial light modulator, but may also include other spatial light modulators.

[0011] In a specific embodiment, the exposure apparatus EX is a step-and-scan projection exposure apparatus (scanner) that exposes a rectangular (square) glass substrate used in display devices (flat panel displays) and the like. The glass substrate is a substrate P for flat panel displays, with at least one side or diagonal length of 500 mm or more and a thickness of 1 mm or less. The exposure apparatus EX exposes a projected image of a pattern created by a DMD onto a photosensitive layer (photoresist) formed with a certain thickness on the surface of the substrate P. After exposure, the substrate P is unloaded from the exposure apparatus EX and sent to a predetermined process step (film formation step, etching step, plating step, etc.) after the development step.

[0012] The exposure apparatus EX is equipped with a stage device that includes a pedestal 2 placed on active vibration isolation units 1a, 1b, 1c, and 1d (1d not shown), a base plate 3 placed on the pedestal 2, an XY stage 4A that is movable two-dimensionally on the base plate 3, a first drive unit that moves the XY stage 4A, a substrate holder 4B (first movable body) that holds a substrate P on a plane by suction on the XY stage 4A, and laser length measurement interferometers (hereinafter simply referred to as interferometers) IFX, IFY1 to IFY4 that measure the two-dimensional movement position of the substrate holder 4B (substrate P). Such a stage device is disclosed, for example, in U.S. Patent Publication No. 2010 / 0018950 and U.S. Patent Publication No. 2012 / 0057140.

[0013] In FIG. 1, the XY plane of the Cartesian coordinate system XYZ is set parallel to the flat surface of the base 3 of the stage device, and the XY stage 4A is set to be able to move translationally within the XY plane. In this embodiment, the direction parallel to the X axis of the coordinate system XYZ is set as the scanning movement direction of the substrate P (XY stage 4A) during scan exposure. The movement position of the substrate P in the X axis direction is sequentially measured by the interferometer IFX, and the movement position in the Y axis direction is sequentially measured by at least one (preferably two or more) of the four interferometers IFY1 to IFY4. The substrate holder 4B is configured to be able to move slightly in the Z axis direction perpendicular to the XY plane relative to the XY stage 4A and to be able to tilt slightly in any direction relative to the XY plane, allowing for active focus adjustment and leveling (parallelism) adjustment between the surface of the substrate P and the imaging plane of the projected pattern. Furthermore, the substrate holder 4B is configured to be able to rotate slightly (θz rotation) around an axis parallel to the Z axis in order to actively adjust the tilt of the substrate P in the XY plane.

[0014] The exposure apparatus EX further includes an optical table 5 that holds multiple exposure (drawing) module groups MU(A), MU(B), and MU(C), and main columns 6a, 6b, 6c, and 6d (6d is not shown) that support the optical table 5 from the pedestal 2. Each of the multiple exposure module groups MU(A), MU(B), and MU(C) is attached to the +Z side of the optical table 5. Each of the multiple exposure module groups MU(A), MU(B), and MU(C) includes an illumination unit ILU that is attached to the +Z side of the optical table 5 and that receives illumination light from an optical fiber unit FBU, and a projection unit PLU that is attached to the -Z side of the optical table 5 and has an optical axis parallel to the Z axis. Each of the exposure module groups MU(A), MU(B), and MU(C) further includes a DMD 10 that serves as an optical modulation unit that reflects the illumination light from the illumination unit ILU in the -Z direction and causes it to enter the projection unit PLU. The detailed configuration of the exposure module including the illumination unit ILU, the DMD 10, and the projection unit PLU will be described later.

[0015] Multiple alignment systems (microscopes) ALG that detect alignment marks formed at multiple predetermined positions on the substrate P are attached to the -Z direction side of the optical surface plate 5 of the exposure apparatus EX. Furthermore, a calibration reference unit CU for calibration is provided at the -X direction end of the substrate holder 4B. Calibration includes at least one of confirming (calibrating) the relative positional relationship in the XY plane of the detection fields of the alignment systems ALG, confirming (calibrating) the baseline error between the projection positions of the pattern images projected from the projection units PLU of each of the exposure module groups MU(A), MU(B), and MU(C) and the positions of the detection fields of the alignment systems ALG, and confirming the position and image quality of the pattern images projected from the projection units PLU. Although some of the modules are not shown in FIG. 1, in this embodiment, each of the exposure module groups MU(A), MU(B), and MU(C) includes, for example, nine modules arranged at regular intervals in the Y direction. However, the number of modules may be more or less than nine. In addition, although three rows of exposure modules are arranged in the X-axis direction in FIG. 1, the number of rows of exposure modules arranged in the X-axis direction may be two or less, or may be four or more.

[0016] 2 is a diagram showing an example of the arrangement of projection areas IAn of the DMD10 projected onto the substrate P by the projection units PLU of each of the exposure module groups MU(A), MU(B), and MU(C), and the Cartesian coordinate system XYZ is set the same as in FIG. 1. In this embodiment, the first row of exposure module groups MU(A), the second row of exposure module groups MU(B), and the third row of exposure module groups MU(C), which are arranged spaced apart in the X direction (first direction), each comprise nine modules arranged in the Y direction (second direction). The exposure module group MU(A) comprises nine modules MU1 to MU9 arranged in the +Y direction, the exposure module group MU(B) comprises nine modules MU10 to MU18 arranged in the -Y direction, and the exposure module group MU(C) comprises nine modules MU19 to MU27 arranged in the +Y direction. All modules MU1 to MU27 have the same configuration, and when exposure module group MU(A) and exposure module group MU(B) are positioned opposite each other in the X direction, exposure module group MU(B) and exposure module group MU(C) are positioned back to back in the X direction.

[0017] 2, the shape of the projection areas IA1, IA2, IA3, ..., IA27 (sometimes represented as IAn, where n is 1 to 27) by each of the modules MU1 to MU27 is, for example, a rectangle extending in the Y direction with an aspect ratio of approximately 1:2. In this embodiment, as the substrate P is scanned and moved in the +X direction, splice exposure is performed at the -Y direction end of each of the first row of projection areas IA1 to IA9 and the +Y direction end of each of the second row of projection areas IA10 to IA18. Then, areas on the substrate P that were not exposed by each of the first and second rows of projection areas IA1 to IA18 are splice exposed by each of the third row of projection areas IA19 to IA27. The center point of each of the projection areas IA1 to IA9 in the first column is located on a line k1 parallel to the Y axis, the center point of each of the projection areas IA10 to IA18 in the second column is located on a line k2 parallel to the Y axis, and the center point of each of the projection areas IA19 to IA27 in the third column is located on a line k3 parallel to the Y axis. The distance in the X direction between lines k1 and k2 is set to a distance XL1, and the distance in the X direction between lines k2 and k3 is set to a distance XL2.

[0018] Here, let us assume that the joint between the −Y-direction end of projection area IA9 and the +Y-direction end of projection area IA10 is OLa, the joint between the −Y-direction end of projection area IA10 and the +Y-direction end of projection area IA27 is OLb, and the joint between the +Y-direction end of projection area IA8 and the −Y-direction end of projection area IA27 is OLc. The state of the joint exposure will be described with reference to FIG. 3. In FIG. 3, the Cartesian coordinate system XYZ is set to be the same as in FIGS. 1 and 2, and the coordinate system X'Y' within projection areas IA8, IA9, IA10, and IA27 (and all other projection areas IAn) is set to be tilted by an angle θk with respect to the X and Y axes (lines k1 to k3) of the Cartesian coordinate system XYZ. That is, the entire DMD 10 is tilted by an angle θk within the XY plane so that the two-dimensional array of the numerous micromirrors of the DMD 10 becomes the coordinate system X'Y'.

[0019] The circular area encompassing each of the projection areas IA8, IA9, IA10, and IA27 (and all other projection areas IAn) in FIG. 3 represents the circular image field PLf' of the projection unit PLU. At the joint OLa, the projected image of the micromirrors arranged diagonally (at an angle θk) at the end of the projection area IA9 in the -Y' direction is set to overlap with the projected image of the micromirrors arranged diagonally (at an angle θk) at the end of the projection area IA10 in the +Y' direction. At the joint OLb, the projected image of the micromirrors arranged diagonally (at an angle θk) at the end of the projection area IA10 in the -Y' direction is set to overlap with the projected image of the micromirrors arranged diagonally (at an angle θk) at the end of the projection area IA27 in the +Y' direction. Similarly, at the joint OLc, the projected image of the micromirrors arranged diagonally (at an angle θk) at the end of the +Y' direction of the projection area IA8 and the projected image of the micromirrors arranged diagonally (at an angle θk) at the end of the -Y' direction of the projection area IA27 are set to overlap.

[0020] [Configuration of lighting unit] FIG. 4 is an optical layout diagram showing the specific configuration of module MU18 in exposure module group MU(B) and module MU19 in exposure module group MU(C) shown in FIGS. 1 and 2, viewed in the XZ plane. The Cartesian coordinate system XYZ in FIG. 4 is set to be the same as the Cartesian coordinate system XYZ in FIGS. 1 to 3. As is clear from the arrangement of each module in the XY plane shown in FIG. 2, module MU18 is shifted by a fixed distance in the +Y direction relative to module MU19, and they are installed back-to-back. Since the optical components in module MU18 and module MU19 are made of the same materials and have the same configuration, the optical configuration of module MU18 will be mainly described in detail here. The optical fiber unit FBU shown in FIG. 1 is composed of 27 optical fiber bundles FB1 to FB27 corresponding to the 27 modules MU1 to MU27 shown in FIG. 2.

[0021] The illumination unit ILU of the module MU18 is composed of a mirror 100 that reflects illumination light ILm traveling in the -Z direction from the output end of the optical fiber bundle FB18, a mirror 102 that reflects the illumination light ILm from mirror 100 in the -Z direction, an input lens system 104 that acts as a collimator lens, an illuminance adjustment filter 106, an optical integrator 108 that includes a micro fly's eye (MFE) lens and a field lens, etc., a condenser lens system 110, and an inclined mirror 112 that reflects the illumination light ILm from the condenser lens system 110 toward the DMD 10. The mirror 102, input lens system 104, optical integrator 108, condenser lens system 110, and inclined mirror 112 are arranged along an optical axis AXc that is parallel to the Z axis.

[0022] The optical fiber bundle FB18 is composed of one optical fiber line or a bundle of multiple optical fiber lines. The numerical aperture (NA, also called the divergence angle) of the illumination light ILm emitted from the output end of the optical fiber bundle FB18 (each optical fiber line) is set so that it can enter the subsequent input lens system 104 without being eclipsed. The position of the front focal point of the input lens system 104 is designed to be the same as the position of the output end of the optical fiber bundle FB18. Furthermore, the position of the back focal point of the input lens system 104 is set so that the illumination light ILm from a single or multiple point light sources formed at the output end of the optical fiber bundle FB18 is superimposed on the incident surface of the MFE lens 108A of the optical integrator 108. Therefore, the incident surface of the MFE lens 108A is Koehler illuminated by the illumination light ILm from the output end of the optical fiber bundle FB18. In the initial state, the geometric center point of the output end of the optical fiber bundle FB18 in the XY plane is located on the optical axis AXc, and the chief ray (center line) of the illumination light ILm from the point light source at the output end of the optical fiber line is parallel to (or coaxial with) the optical axis AXc.

[0023] The illumination light ILm from the input lens system 104 is attenuated by an illumination adjustment filter 106 to a value between 0% and 90%, and then passes through an optical integrator 108 (MFE lens 108A, field lens, etc.) and enters a condenser lens system 110. The MFE lens 108A is a two-dimensional array of many rectangular microlenses, each measuring several tens of micrometers square. Its overall shape in the XY plane is set to be approximately similar to the overall shape of the mirror surface of the DMD 10 (aspect ratio: approximately 1:2). The position of the front focal point of the condenser lens system 110 is set to be approximately the same as the position of the exit surface of the MFE lens 108A. Therefore, each of the illumination light beams from the point light sources formed on the exit side of each of the many microlenses of the MFE lens 108A is converted into approximately parallel beams by the condenser lens system 110, reflected by an inclined mirror 112, and then superimposed on the DMD 10 to form a uniform illumination distribution. A surface light source in which a large number of point light sources (light-converging points) are densely arranged two-dimensionally is generated on the exit surface of the MFE lens 108A, and therefore the MFE lens 108A functions as a surface light source member.

[0024] In module MU18 shown in FIG. 4, optical axis AXc, which is parallel to the Z axis and passes through condenser lens system 110, is bent by tilted mirror 112 and reaches DMD 10. The optical axis between tilted mirror 112 and DMD 10 is referred to as optical axis AXb. In this embodiment, a neutral plane including the center points of each of the numerous micromirrors of DMD 10 is set parallel to the XY plane. Therefore, the angle between the normal to this neutral plane (parallel to the Z axis) and optical axis AXb is the angle of incidence θα of illumination light ILm with respect to DMD 10. DMD 10 is attached to the lower side of mount 10M, which is fixed to the support column of illumination unit ILU. To finely adjust the position and orientation of DMD 10, mount 10M is provided with a fine-motion stage (second movable body) 10S that combines a parallel link mechanism and an expandable piezoelectric element, such as that disclosed in International Patent Publication No. 2006 / 120927. Fine movement stage 10S can be moved in the X and Y directions and rotated about θz (Z axis) by fine movement stage driver 10D (second driver). Therefore, by moving fine movement stage 10S in the X and Y directions or rotating it about θz, DMD 10 can be moved in the X and Y directions or rotated about θz. Furthermore, by using a displacement sensor (not shown), feedback control can be performed on the amount of movement or rotation of fine movement stage 10S.

[0025] [DMD configuration] Fig. 5(A) is a diagram showing a schematic of DMD 10, Fig. 5(B) is a diagram showing DMD 10 when the power is OFF, Fig. 5(C) is a diagram for explaining the mirror in the ON state, and Fig. 5(D) is a diagram for explaining the mirror in the OFF state. Note that in Fig. 5(A) to Fig. 5(D), mirrors in the ON state are indicated by hatching.

[0026] The DMD 10 has a plurality of micromirrors 10a whose reflection angles can be changed. In this embodiment, the DMD 10 is of a roll and pitch drive type that switches between an ON state and an OFF state by tilting the micromirrors 10a in the roll direction and in the pitch direction.

[0027] As shown in Figure 5(B), when the power is off, the reflective surface of each micromirror 10a is set parallel to the X'Y' plane. The arrangement pitch of each micromirror 10a in the X' direction is Pdx (μm), and the arrangement pitch in the Y' direction is Pdy (μm), but in practice, Pdx = Pdy.

[0028] Each micromirror 10a is turned ON by tilting around the Y' axis. FIG. 5C shows a case where only the central micromirror 10a is turned ON, and the other micromirrors 10a are in a neutral state (neither ON nor OFF). Each micromirror 10a is turned OFF by tilting around the X' axis. FIG. 5D shows a case where only the central micromirror 10a is turned OFF, and the other micromirrors 10a are in a neutral state. For simplicity, although not shown, the micromirrors 10a in the ON state are driven to tilt at a predetermined angle from the X'Y' plane so that illumination light irradiated onto the micromirrors 10a in the ON state is reflected in the X direction of the XZ plane. The micromirrors 10a in the OFF state are driven to tilt at a predetermined angle from the X'Y' plane so that illumination light irradiated onto the micromirrors 10a in the ON state is reflected in the Y direction of the YZ plane. The DMD 10 generates an exposure pattern by switching the ON and OFF states of each micromirror 10a.

[0029] The illumination light reflected by the mirror in the OFF state is absorbed by a light absorber (not shown).

[0030] Although the DMD 10 has been described as an example of a spatial light modulator and is therefore a reflective type that reflects laser light, the spatial light modulator may be a transmissive type that transmits laser light or a diffractive type that diffracts laser light. The spatial light modulator can modulate laser light spatially and temporally.

[0031] 4, illumination light ILm irradiated onto micromirrors 10a of DMD 10 that are in the ON state is reflected in the X direction within the XZ plane so as to head towards projection unit PLU. On the other hand, illumination light ILm irradiated onto micromirrors 10a of DMD 10 that are in the OFF state is reflected in the Y direction within the YZ plane so as not to head towards projection unit PLU.

[0032] A movable shutter 114 is removably provided in the optical path between the DMD 10 and the projection unit PLU to block light reflected from the DMD 10 during non-exposure periods. As shown on the module MU19 side, the movable shutter 114 is rotated to an angular position where it is removed from the optical path during exposure periods, and as shown on the module MU18 side, it is rotated to an angular position where it is inserted obliquely into the optical path during non-exposure periods. A reflective surface is formed on the DMD 10 side of the movable shutter 114, and light reflected therefrom from the DMD 10 is irradiated onto a light absorber 117. The light absorber 117 absorbs light energy in the ultraviolet wavelength range (wavelengths of 400 nm or less) without re-reflecting it and converts it into heat energy. For this reason, the light absorber 117 is also provided with a heat dissipation mechanism (heat dissipation fins and a cooling mechanism). Although not shown in Figure 4, the reflected light from the micromirror 10a of the DMD 10, which is in the OFF state during the exposure period, is absorbed by a similar light absorber (not shown in Figure 4) installed in the Y direction (a direction perpendicular to the plane of the paper in Figure 4) of the optical path between the DMD 10 and the projection unit PLU, as described above.

[0033] [Configuration of the projection unit] The projection unit PLU attached to the underside of the optical table 5 is configured as a double-telecentric imaging projection lens system composed of a first lens group 116 and a second lens group 118 arranged along an optical axis AXa parallel to the Z axis. The first lens group 116 and the second lens group 118 are each configured to move translationally in the direction along the Z axis (optical axis AXa) by a micro-motion actuator relative to a support column fixed to the underside of the optical table 5. The projection magnification Mp of the imaging projection lens system formed by the first lens group 116 and the second lens group 118 is determined by the relationship between the array pitch Pd of the micromirrors on the DMD 10 and the minimum line width (minimum pixel dimension) Pg of the pattern projected within the projection area IAn (n = 1 to 27) on the substrate P.

[0034] As an example, if the required minimum line width (minimum pixel dimension) Pg is 1 μm and the micromirror array pitches Pdx and Pdy are each 5.4 μm, the projection magnification Mp is set to approximately 1 / 6, taking into consideration the tilt angle θk in the XY plane of the projection area IAn (DMD10) previously described with reference to Figure 3. The imaging projection lens system consisting of lens groups 116 and 118 inverts / flips a reduced image of the entire mirror surface of DMD 10 and forms an image on the projection area IA18 (IAn) on the substrate P.

[0035] The first lens group 116 of the projection unit PLU is capable of slight movement in the direction of the optical axis AXa by an actuator to make fine adjustments (on the order of ±several tens of ppm) to the projection magnification Mp, and the second lens group 118 is capable of slight movement in the direction of the optical axis AXa by an actuator to make high-speed focus adjustments. Furthermore, in order to measure positional changes in the Z-axis direction of the surface of the substrate P with an accuracy of submicron or less, a plurality of oblique incidence focus sensors 120 are provided below the optical surface plate 5. The plurality of focus sensors 120 measure the overall positional change in the Z-axis direction of the substrate P, the positional change in the Z-axis direction of partial areas on the substrate P corresponding to each of the projection areas IAn (n = 1 to 27), or partial tilt changes of the substrate P, etc.

[0036] In this embodiment, two deflection prisms 600a and 600b are provided between the DMD 10 and the first lens group 116, as shown in FIG. 6A, or two parallel plates 601a and 601b are provided between the DMD 10 and the first lens group 116, as shown in FIG. 6B. Hereinafter, the two deflection prisms 600a and 600b and the two parallel plates 601a and 601b are referred to as the optical element OPE unless otherwise specified. In this embodiment, correcting misalignment is also referred to as image shifting. In this embodiment, the optical element OPE is provided between the DMD 10 and the first lens group 116, but this is not a limitation. The optical element OPE may also be provided between the first lens group 116 and the second lens group, or between the projection unit PLU and the substrate P. The projection unit PLU and the optical element OPE constitute a projection optical system.

[0037] As explained above in Figure 3, the illumination unit ILU and projection unit PLU described above require the projection area IAn to be tilted by an angle θk in the XY plane, so the DMD 10 and illumination unit ILU in Figure 4 (at least the optical path portion from mirror 102 to mirror 112 along the optical axis AXc) are arranged so that they are tilted overall by an angle θk in the XY plane.

[0038] [Configuration of the calibration reference unit CU] 7 is a diagram showing a schematic configuration of an alignment device 60 provided in a calibration reference unit CU attached to an end portion on the substrate holder 4B of the exposure apparatus EX. The alignment device 60 includes a reference mark 60a and a two-dimensional image sensor 60e. The alignment device 60 is used to measure and calibrate the positions of various modules, and is also used to calibrate the alignment system ALG.

[0039] The position of each of the modules MU1 to MU27 is measured by projecting a calibration DMD pattern onto the reference mark 60a of the alignment device 60 using the projection unit PLU, and measuring the relative position of the reference mark 60a and the DMD pattern.

[0040] Furthermore, alignment system ALG can be calibrated by using alignment system ALG to measure reference mark 60a of alignment device 60. That is, the position of alignment system ALG can be determined by using alignment system ALG to measure reference mark 60a of alignment device 60. Furthermore, it is possible to determine the relative positions of alignment system ALG and modules MU1 to MU27 using reference mark 60a.

[0041] Furthermore, alignment system ALG can measure the position of an alignment mark on substrate P placed on substrate holder 4B, using reference mark 60a of alignment device 60 as a reference.

[0042] [Configuration of exposure control device] The various processes, including the scanning exposure process, performed in the exposure apparatus EX having the above configuration are controlled by an exposure control device 300. Figure 8 is a functional block diagram showing the functional configuration of the exposure control device 300 provided in the exposure apparatus EX according to this embodiment.

[0043] The exposure control device 300 includes a drawing data storage unit 310 , a control data creation unit 301 , a correction data creation unit 302 , a drive control unit 304 , and an exposure control unit 306 .

[0044] The drawing data storage unit 310 stores drawing data of a display panel pattern to be exposed by each of the multiple modules MUn (n = 1 to 27). The drawing data storage unit 310 sends drawing data MD1 to MD27 for pattern exposure to the DMD 10 of each of the 27 modules MU1 to MU27 shown in FIG. 2. The modules MUn (n = 1 to 27) selectively drive the micromirrors 10a of the DMD 10 based on the drawing data MDn to generate a pattern corresponding to the drawing data MDn, and project and expose the pattern onto the substrate P. In other words, the drawing data is data that switches the ON and OFF states of each micromirror 10a of the DMD 10.

[0045] Control data creation unit 301 creates first control data based on the alignment measurement result of substrate P by alignment system ALG, and outputs it to drive control unit 304. The first control data is data for controlling the driving of fine movement stage 10S of DMD 10 provided in each module MUn (n=1 to 27), the driving of the optical system (first lens group 116 and second lens group 118) of projection unit PLU, and the driving of optical element OPE, so as to correct the positional deviation of substrate P based on the alignment measurement result.

[0046] More specifically, when driving the fine movement stage 10S of the DMD 10, the drive amount of the fine movement stage 10S of each of the modules MU1 to MU27 is defined based on the first control data. The fine movement stage 10S driven by the fine movement stage driver 10D is moved in the X direction, the Y direction, or rotated in the θz direction. As a result, the image projected onto the substrate P can be shifted.

[0047] Furthermore, when adjusting the optical system of the projection unit PLU, the drive amount of the projection unit PLU of each of the modules MU1 to MU27 or the adjustment amount of the lens in the projection unit PLU is defined based on the first control data. When driving the projection unit PLU, the projection unit PLU moves at least one of the first lens group 116 or the second lens group 118 within the XY plane using an actuator or the like provided in the projection unit PLU. As a result, the projection image projected onto the substrate P can be shifted. Furthermore, from the viewpoint of aberration, it is more preferable that the projection unit PLU moves the first lens group 116 and the second lens group 118 by the same movement amount. When adjusting the lens in the projection unit PLU, at least one lens provided in the first lens group 116 or the second lens group 118 is moved within the XY plane using an actuator or the like provided in the first lens group 116 and the second lens group 118. As a result, the projection image projected onto the substrate P can be shifted.

[0048] Furthermore, when driving the two deflection prisms 600a, 600b provided between the DMD 10 and the first lens group 116 of each of the modules MU1 to MU27, the drive amounts of the two deflection prisms 600a, 600b are defined based on the first control data. By controlling the distance between the two deflection prisms, it is possible to shift the image projected onto the substrate P. Furthermore, the two deflection prisms 600a, 600b can be provided not only between the DMD 10 and the first lens group 116, but also between the first lens group 116 and the second lens group 118, and between the second lens group 118 and the substrate P.

[0049] Furthermore, when driving the two parallel plates 601a, 601b provided between the DMD 10 and the first lens group 116 of each of the modules MU1 to MU27, the drive amount of the two parallel plates 601a, 601b is defined based on the first control data. By controlling the amount of rotation by which the two parallel plates 601a, 601b are rotated by θz, it is possible to shift the image projected onto the substrate P. The two parallel plates 601a, 601b can be provided not only between the DMD 10 and the first lens group 116, but also between the first lens group 116 and the second lens group 118, and between the second lens group 118 and the substrate P.

[0050] Here, the reason for creating the first control data will be explained. For example, suppose that substrate P is placed on substrate holder 4B at a position displaced from its design position. If scanning exposure is performed in this state, the pattern generated based on drawing data MDn will be exposed onto substrate P at a position displaced from the design position. As a method for exposing a pattern at a predetermined position (design position) on substrate P placed in such a displaced position, for example, it is conceivable to rewrite drawing data MDn to match the displaced substrate P based on the alignment measurement results of substrate P by alignment system ALG. However, because the amount of drawing data MDn for the display panel is large, rewriting takes a long time (e.g., 40 minutes), which may reduce throughput. Furthermore, if the amount of positional deviation is smaller than the minimum line width (minimum pixel dimension) of the pattern projected onto substrate P, the positional deviation cannot be corrected even if the drawing data is changed. In other words, it may be difficult to correct the deviation accurately by changing the drawing data.

[0051] Therefore, in this embodiment, rather than rewriting the drawing data MDn based on the alignment measurement results of the substrate P by the alignment system ALG, the projection position of the pattern is shifted to correct the positional deviation from the design value of the substrate P. Specifically, the projection position of the pattern is shifted by controlling the driving of at least one of the fine movement stage 10S of the DMD 10, the optical system of the projection unit PLU, and the optical element OPE. This makes it possible to correct the positional deviation of the substrate P from the design value.

[0052] For example, if the substrate P is positioned at a deviation of α degrees from the design value around the Z axis (rotated by α degrees), the pattern can be projected onto the design position by rotating the fine movement stage 10S of the DMD 10 by α degrees from the initial position through θz and adjusting the position of the DMD 10 in the X and Y directions.

[0053] In this embodiment, since the modules MUn (n=1 to 27) are arranged in the X and Y directions, the control data creation unit 301 creates the first control data taking into consideration the relationships between the modules MUn. The creation time for the first control data is, for example, about several seconds.

[0054] When calibration is performed between exposure processes, correction data creation unit 302 creates correction data based on the calibration results and outputs it to drive control unit 304. The correction data is data for correcting the drive amount of fine movement stage 10S of DMD 10, the drive amount of the optical system of projection unit PLU, and the drive amount of optical element OPE, so as to correct positional deviations of the components of exposure apparatus EX (for example, modules MUn, alignment system ALG, etc.) based on the calibration results. For example, the correction data defines, for each of modules MU1 to MU27, an offset value for the drive amount of fine movement stage 10S of DMD 10, an offset value for the drive amount of the optical system of projection unit PLU, and an offset value for the drive amount of optical element OPE.

[0055] Here, the reason for creating correction data will be explained. For example, when exposure processes are repeated in the exposure apparatus EX, the positions of the components of the exposure apparatus EX may shift, and calibration may be required between exposure processes. Generally, when calibration is required, it is thought that the components will be set up again, or that the drawing data will be rewritten to correct the positional shift of each component.

[0056] However, reconfiguring the settings of each component of the exposure apparatus EX or rewriting the drawing data based on the calibration results takes time and may reduce throughput. Furthermore, if the amount of misalignment is smaller than the minimum line width (minimum pixel dimension) of the pattern projected onto the substrate P, the misalignment cannot be corrected even by changing the drawing data. In other words, it may be difficult to achieve accurate correction by changing the drawing data.

[0057] Therefore, in this embodiment, when calibration is performed between exposure processes, the settings of each component of the exposure apparatus EX are not redone or the drawing data is not rewritten based on the calibration results, but rather the drive amount of fine movement stage 10S of DMD 10, the drive amount of the optical system of projection unit PLU, and the drive amount of optical element OPE are corrected so as to correct misalignment of each component of the exposure apparatus EX. In this way, the correction data creation unit 302 creates correction data for correcting the drive amount of fine movement stage 10S of DMD 10, the drive amount of the optical system of projection unit PLU, and the drive amount of optical element OPE.

[0058] The drive control unit 304 corrects the first control data input from the control data generation unit 301 with the correction data input from the correction data generation unit 302 to generate second control data.

[0059] Furthermore, the drive control unit 304 may combine the first control data input from the control data creation unit 301 with the calibration result to generate the second control data, without using the correction data creation unit 302 to create the correction data.

[0060] Furthermore, based on the measurement results of interferometers IFY1-IFY4, drive control unit 304 creates drive amount control data CD1-CD27 by correcting in real time the drive amount of fine movement stage 10S of DMD 10, the drive amount of the optical system of projection unit PLU, and the drive amount of optical element OPE included in the second control data, and sends this data to modules MU1-MU27. Exposure control device 300 (drive control unit 304) may control a first drive unit that moves XY stage 4A. Exposure control device 300 (drive control unit 304) may also control fine movement stage drive unit 10D. Exposure control device 300 (drive control unit 304) may also control drive units that drive first lens group 116, second lens group 118, and optical element OPE, which are provided in the projection optical system.

[0061] Here, the reason why the drive control unit 304 corrects the second control data in real time will be explained. During scanning exposure of the substrate P, there are cases where the substrate holder 4B does not move as designed (for example, it meanders instead of moving straight in the X direction). When the substrate holder 4B does not move as designed in this way (for example, when the Y-direction position of the substrate holder 4B at a predetermined X-direction position differs from the design value), if scanning exposure is performed as is, the pattern based on the drawing data MDn will be exposed onto the substrate P at a position shifted from the designed position. In this case, it is difficult in terms of time to rewrite the drawing data so that it follows the positional shift of the substrate holder 4B. Furthermore, if the amount of positional shift is smaller than the minimum line width (minimum pixel dimension) of the pattern projected onto the substrate P, the positional shift cannot be corrected even if the drawing data is changed. In other words, there are cases where it is difficult to achieve a high level of accuracy in correction by changing the drawing data.

[0062] Therefore, in this embodiment, drive control unit 304 controls modules MU1-MU2 using drive amount control data (third control data) CD1-CD27 that corrects in real time the drive amount of fine movement stage 10S of DMD 10, the drive amount of the optical system of projection unit PLU, and the drive amount of optical element OPE, all of which are included in the second control data, based on the measurement results of interferometers IFY1-IFY4. This makes it possible to correct positional deviation of substrate P, positional deviation of each component of exposure apparatus EX, and positional deviation of substrate holder 4B during scanning exposure, and to project and expose the pattern onto substrate P according to the design values.

[0063] During scanning exposure, modules MU1 to MU27 control the driving of fine movement stage 10S of DMD 10, the driving of the optical system of projection unit PLU, and the driving of optical element OPE based on drive amount control data CD1 to CD27 sent from drive control unit 304.

[0064] The exposure control unit (sequencer) 306 controls the transmission of the drawing data MD1 to MD27 from the drawing data storage unit 310 to the modules MU1 to MU27 and the transmission of the drive amount control data CD1 to CD27 from the drive control unit 304 in synchronization with the scanning exposure (movement position) of the substrate P.

[0065] [Exposure processing procedure overview] Next, an overview of the exposure processing procedure in the exposure apparatus EX according to this embodiment will be explained with reference to Fig. 9. Fig. 9 is a flowchart showing an overview of the procedure when the exposure apparatus EX is used for the first time to perform exposure processing on a substrate P, or when an exposure apparatus EX that has not been used for a long time is used to perform exposure processing on a substrate P. In the example below, a case where a pattern such as a display panel is scanned and exposed onto the substrate P will be explained.

[0066] 9, first, initial calibration of the exposure apparatus EX is performed (step S11). In the initial calibration, the settings of each component of the exposure apparatus EX are calibrated based on the measurement results of the alignment system ALG, etc. For example, the positions of the modules MU1 to MU27, the initial positions and initial attitudes of the illumination units ILU, DMD10, and projection units PLU of each of the modules MU1 to MU27, the tilt of the substrate holder 4B, etc. are corrected.

[0067] Next, drawing data of a pattern for a display panel to be exposed by each of the plurality of modules MUn (n=1 to 27) is loaded into the drawing data storage unit 310 (step S13).

[0068] Next, the substrate P is carried into the main body of the exposure apparatus EX and placed on the substrate holder 4B (step S15).

[0069] Next, alignment marks formed at a plurality of predetermined positions on the substrate P are measured by a plurality of alignment systems ALG (step S17).

[0070] Next, based on the measurement results by the alignment system ALG, the control data creation unit 301 creates first control data that specifies the driving amount of the fine movement stage 10S of the DMD 10, the driving amount of the optical system of the projection unit PLU, and the driving amount of the optical element OPE so as to correct the positional deviation of the substrate P (step S19).

[0071] Next, the module MUn (n=1 to 27) scans and exposes a pattern such as a display panel onto the substrate P based on the drawing data MDn and the drive amount control data CDn (step S21). The drive amount control data CDn at this time is data (fourth control data) obtained by correcting the first control data in real time based on the measurement results of the interferometers IFY1 to IFY4 (i.e., the position of the substrate holder 4B).

[0072] When the scanning exposure process is completed, the substrate P is carried out (step S23).

[0073] Next, it is determined whether calibration is necessary (step S25). For example, it is determined that calibration is necessary when the number of substrates P that have been subjected to scanning exposure processing after the previous calibration reaches a predetermined number (for example, 10). Alternatively, it is determined that calibration is necessary when a predetermined time has passed every day.

[0074] If calibration is not required (step S25 / NO), the process returns to step S15. On the other hand, if calibration is required (step S25 / YES), calibration is performed (step S27).

[0075] Next, based on the calibration results in step S27, the correction data creation unit 302 creates correction data for correcting the drive amount of the fine movement stage 10S of the DMD 10, the drive amount of the optical system of the projection unit PLU, and the drive amount of the optical element OPE so as to correct the positional misalignment of each device of the exposure apparatus EX (step S29).

[0076] Next, a new substrate P is carried into the main body of the exposure apparatus EX and placed on the substrate holder 4B (step S31).

[0077] Next, alignment marks formed at a plurality of predetermined positions on the newly loaded substrate P are measured by a plurality of alignment systems ALG (step S33).

[0078] Next, based on the measurement results by the alignment system ALG, the control data creation unit 301 creates first control data that specifies the drive amount of the fine movement stage 10S of the DMD 10, the drive amount of the optical system of the projection unit PLU, and the drive amount of the optical element OPE so as to correct the positional deviation of the substrate P (step S35).

[0079] Next, the drive control unit 304 generates second control data by correcting the first control data created in step S35 using the correction data created in step S29 (step S37).

[0080] It should be noted that step S29 may be omitted, and the drive control section 304 may create the second control data based on the first control data and the calibration result.

[0081] Next, the module MUn (n=1 to 27) scans and exposes a pattern such as a display panel onto the substrate P based on the drawing data MDn and the drive amount control data CDn (step S39). The drive amount control data CDn at this time is data (third control data) obtained by correcting the second control data in real time based on the measurement results of the interferometers IFY1 to IFY4 (i.e., the position of the substrate holder 4B).

[0082] When the scanning exposure process is completed, the substrate P is carried out (step S41).

[0083] Next, it is determined whether calibration is necessary (step S43). For example, it is determined that calibration is necessary when the number of substrates P that have been subjected to the scanning exposure process since the previous calibration has reached a predetermined number (for example, 10).

[0084] If calibration is not required (step S43 / NO), the process returns to step S31. On the other hand, if calibration is required (step S43 / YES), calibration is performed (step S27).

[0085] 9 is repeated until the manufacturing of a predetermined number of display panels is completed. Note that the processes of steps S25 to S29 may be omitted. In this case, the processes from step S31 onwards are not performed, and the process may return to step S15 after step S23 is completed. In this case, in step S21, the drive control unit 304 may send to each module MUn drive amount control data CDn obtained by correcting the first control data in real time based on the measurement results of the interferometers IFY1 to IFY4 (i.e., the position of the substrate holder 4B).

[0086] As described above in detail, according to this embodiment, the exposure apparatus EX includes a substrate holder 4B, a DMD10 that generates a pattern corresponding to writing data MDn (n = 1 to 27), a plurality of modules MU1 to MU27 that each include a plurality of illumination units ILU that irradiate the DMD10 with illumination light, and a plurality of projection units PLU that project the patterns formed by the DMD10 onto a substrate P placed on the substrate holder 4B. The exposure apparatus EX further includes a drive controller 304 that controls the driving of the DMD10, the driving of the projection units PLU, and the driving of the optical element OPE in each of the modules MU1 to MU27 in accordance with at least one of the state of the substrate P, the state of the substrate holder 4B, and the state of the exposure apparatus EX, without changing the writing data MDn. When the writing data MDn is rewritten so that a predetermined pattern is exposed at a predetermined position on the substrate P in accordance with at least one of the state of the substrate P, the state of the substrate holder 4B, and the state of the exposure apparatus EX, it takes time to rewrite the writing data MDn, which reduces the throughput of the exposure apparatus EX. The drive control unit 304 controls the driving of the DMD 10, the driving of the projection unit PLU, and the driving of the optical element OPE in accordance with at least one of the state of the substrate P, the state of the substrate holder 4B, and the state of the exposure apparatus EX without changing the drawing data MDn. This makes it possible to expose a predetermined pattern at a predetermined position on the substrate P while suppressing a decrease in throughput of the exposure apparatus EX. Furthermore, if the amount of misalignment is smaller than the minimum line width (minimum pixel dimension) of the pattern projected onto the substrate P, it is difficult to correct the misalignment by rewriting the drawing data. In this embodiment, the misalignment is corrected by driving the DMD 10, the driving of the projection unit PLU, and the driving of the optical element OPE. Therefore, even if the amount of misalignment is smaller than the minimum line width of the pattern projected onto the substrate P, the misalignment can be corrected. This improves exposure accuracy.

[0087] Furthermore, in this embodiment, the exposure apparatus EX is equipped with an alignment system ALG that measures the state of the substrate P relative to the substrate holder 4B, and a control data creation unit that creates first control data that controls the driving of at least one of the fine movement stage 10S of the DMD 10, the optical system of the projection unit PLU, and the optical element OPE, based on the measurement results of the alignment system ALG, so that the pattern is projected onto a predetermined position on the substrate P. The drive control unit 304 then controls the driving of the fine movement stage 10S of the DMD 10, the driving of the optical system of the projection unit PLU, and the driving of the optical element OPE, based on the first control data. This makes it possible to correct the positional deviation of the substrate P from the design position and expose the pattern onto the substrate P without reducing throughput. Furthermore, the positional deviation can be corrected even if the amount of positional deviation is smaller than the minimum line width of the pattern projected onto the substrate P.

[0088] Furthermore, in this embodiment, the exposure apparatus EX is equipped with a correction data creation unit 302 that creates correction data for correcting the first control data based on the calibration results, and a drive control unit 304 controls the driving of the fine movement stage 10S of the DMD 10, the driving of the optical system of the projection unit PLU, and the driving of the optical element OPE, based on second control data obtained by correcting the first control data using the correction data. This makes it possible to correct misalignment of the components of the exposure apparatus EX and expose a pattern onto the substrate P without reducing throughput. Furthermore, even if the amount of misalignment of the components of the exposure apparatus EX is smaller than the minimum line width of the pattern projected onto the substrate P, the misalignment can be corrected.

[0089] Furthermore, in this embodiment, the exposure apparatus EX is equipped with interferometers IFY1-IFY4 that measure positional information of the substrate holder 4B relative to the surface plate 3 or the optical surface plate 5, and the drive control unit 304 controls the driving of the fine movement stage 10S of the DMD 10 of each module MUn, the driving of the optical system of the projection unit PLU, and the driving of the optical element OPE based on the positional information of the substrate holder 4B measured by the interferometers IFY1-IFY4 and the drive amount control data CDn (n = 1 to 27) obtained by correcting the second control data. As a result, even if the substrate holder 4B does not move according to the design value during the scanning exposure period, it is possible to expose a predetermined pattern at the designed position on the substrate P without reducing throughput. Furthermore, even if the amount of positional deviation of the substrate holder 4B is smaller than the minimum line width of the pattern projected onto the substrate P, the positional deviation can be corrected.

[0090] (Variation) The exposure apparatus EX according to the above embodiment can also be used to expose a different pattern onto a substrate P that has already been exposed with a predetermined pattern.

[0091] In the manufacture of flat panel displays, a first pattern may be exposed onto a substrate P, and then a second pattern different from the first pattern may be exposed onto the substrate P. For example, the first pattern may be exposed onto the substrate P using an exposure apparatus that uses a mask substrate the first time, and the second pattern may be exposed onto the substrate P using the exposure apparatus EX according to this embodiment the second time.

[0092] Fig. 10 is a diagram showing a case where patterns for four display panels are exposed on one substrate P. In the example of Fig. 10, it is assumed that patterns for four display panels PNL1 to PNL4 are exposed on one substrate P by a first exposure process. In Fig. 10, hatched areas indicate areas exposed in the first exposure process, and black circles in each area indicate alignment marks AM. Also in Fig. 10, dotted lines indicate cutting lines when separating each panel, and dashed lines indicate positions where display panel PNL2 and its alignment marks AM should have been exposed in the first exposure process.

[0093] 10, the pattern of the display panel PNL2 is exposed at a position significantly shifted from the design position compared to the other display panels PNL1, PNL3, and PNL4. In such a case, if the drawing data for the second exposure process is rewritten to match the exposed area of the display panel PNL2 by the first exposure process, it will take a long time to rewrite the drawing data, resulting in a decrease in throughput.

[0094] In such a case, the exposure apparatus EX according to the above embodiment can expose the second pattern so that it matches the exposed region of the first pattern on the display panel PNL2 as follows.

[0095] First, alignment system ALG measures the position of the area on display panels PNL1-PNL4 where the first pattern is actually exposed. Based on the measurement results of alignment system ALG, control data creation unit 301 creates first control data so that deviation from the design position of the exposed area of the first pattern on display panel PNL2 is corrected. Drive control unit 304 controls the driving of fine movement stage 10S of DMD 10 of modules MU1-MU27 and the optical system of projection unit PLU based on the first control data, thereby making it possible to expose the second pattern in the exposed area of the first pattern on display panel PNL2 where the first pattern was exposed deviated from the design position.

[0096] That is, in the modified example, it can be said that the first control data is created for each area of the display panels PNL1 to PNL4 according to the positional deviation of the exposed area from the design position.

[0097] In this way, when a second pattern must be exposed onto a single substrate P that has already been exposed with multiple first patterns, and the second pattern must be superimposed on the exposed area of the first pattern, even if the exposed area of the first pattern is shifted from the design position, the exposure apparatus EX of this embodiment can expose the second pattern in alignment with the exposed area of the first pattern without reducing throughput.

[0098] In this case, the distance D1 between the exposure area of the display panel PNL1 and the exposure area of the display panel PNL2 is preferably set so that the time it takes for the substrate holder 4B to move the distance D1 is longer than the time required to change the state of the fine movement stage 10S of the DMD 10, the state of the optical system of the projection unit PLU, and the state of the optical element OPE when exposure of the pattern on the display panel PNL1 is completed to the state for exposing the display panel PNL2. Here, the state of the fine movement stage 10S refers to information on the relative position of the DMD 10 with respect to the substrate holder 4B, the XY stage 4A, the optical surface plate 5, and the surface plate 3, as well as the tilt angle in the θz axis direction. Furthermore, the state of the optical system of the projection unit PLU refers to information on the relative position of the first lens group 116, the second lens group 118, and each lens included in the first lens group 116 and the second lens group 118 with respect to the substrate holder 4B, the XY stage 4A, the optical surface plate 5, and the surface plate 3. Furthermore, the state of the optical element OPE refers to information about the relative position of the optical element OPE with respect to the substrate holder 4B, the XY stage 4A, the optical surface plate 5, and the surface plate 3. If the optical element OPE is a pair of deflection prisms, the state of the optical element OPE also includes the spacing between the pair of deflection prisms and the rotation angle of each deflection prism. If the optical element OPE is a pair of parallel plates, the state of the optical element OPE also includes the spacing between the pair of parallel plates and the rotation angle of each parallel plate. Therefore, the exposure apparatus EX according to the above embodiment can expose the display panels PNL1 and PNL2 with a single scanning exposure. Furthermore, when performing exposure with a single scanning exposure, after exposing the exposure area of the display panel PNL1, the exposure apparatus EX changes at least one of the state of the fine movement stage 10S of the DMD 10 when exposure of the pattern on the display panel PNL1 is completed, the state of the optical system of the projection unit PLU, and the state of the optical element OPE to a state for exposing the display panel PNL2 while moving the distance D1, and then exposes the exposure area of the display panel PNL2.

[0099] The exposure control device 300 (drive control unit 304) provided in the exposure apparatus EX moves the XY stage 4A in the scanning direction (X-axis direction) to expose the exposure area of the display panel PNL1 of the substrate P, and then exposes the exposure area of the display panel PNL2, and changes the settings of the exposure apparatus EX while the projection optical system travels the distance D1 between the exposure area of the display panel PNL1 and the exposure area of the display panel PNL2.

[0100] An exposure control device 300 (drive control unit 304) provided in the exposure apparatus EX changes the settings of the exposure apparatus EX by controlling the driving of the fine movement stage 10S of the DMD 10 or the projection optical system.

[0101] In addition, the control unit provided in the exposure apparatus EX controls the XY stage 4A, the fine movement stage driving unit 10D that changes at least one of the position and attitude of the spatial light modulator 10, and the driving units that are provided in the projection optical system and drive the first lens group 116, the second lens group 118, and the optical element OPE, and drives the XY stage 4A so that the exposure areas of the display panels PNL1 and PNL2 that are arranged in the scanning direction (X-axis direction) on the substrate P move to the same side in the scanning direction (X-axis direction) with respect to the optical axis of the projection optical system, and drives at least one of the fine movement stage driving unit 10D and the driving units that drive the first lens group 116, the second lens group 118, and the optical element OPE in a state where the area (distance D) between the exposure areas of the display panels PNL1 and PNL2 on the substrate P that moves in the scanning direction (X-axis direction) intersects with the optical axis.

[0102] If the distance D1 is set as described above, the exposure process can be continued without waiting for the state of the fine movement stage 10S of the DMD 10, the state of the optical system of the projection unit PLU, and the state of the optical element OPE to become suitable for exposing the display panel PNL2, thereby improving throughput.

[0103] Note that, for example, if the positional deviation of the exposed area of the display panel PNL2 from the design value due to the first exposure process is so large that it cannot be corrected by driving the fine movement stage 10S of the DMD 10, the optical system of the projection unit PLU, and the optical element OPE to shift the projection position of the pattern, the exposure process may not be started, and information about this may be displayed on a display device provided in the exposure apparatus EX, allowing the operator of the exposure apparatus EX to choose whether to continue the exposure process. Alternatively, the exposure apparatus EX may output a warning. Alternatively, the operator may be allowed to choose whether to continue the exposure process, stop the exposure process, or expose a pattern on the substrate P that indicates that the substrate P is a defective product.

[0104] Furthermore, the exposure result (exposure shape) of the first exposure process on the display panel PNL1 may not be a rectangle like the PNL1 in FIG. 10, but may be a barrel shape like the one in FIG. 11A or a pincushion shape like the one in FIG. 11B. In such cases, when performing the second exposure on the display panel PNL1, it is necessary to perform exposure while shifting the image at each position on the display panel PNL1. Therefore, based on the measurement results of the alignment mark AM on the display panel PNL1 by the alignment system ALG, the fine movement stage 10S of the DMD 10 and the optical system and optical element OPE of the projection unit PLU are driven in real time during exposure of the display panel PNL1. This allows the pattern projection position to be corrected at each position on the display panel PNL1. Furthermore, the shape of the display panel PNL1 is not limited to this and may also include a combination of two shapes, such as a barrel shape on the right side of PNL1 and a pincushion shape on the left side of PNL1, as shown in FIG. 11C. Furthermore, such exposure results are not limited to PNL1; similar exposure results may also occur on PLN2 to PLN4.

[0105] Furthermore, the exposure apparatus EX according to the above embodiment can expose the display panels PNL1 and PNL3 with a single scanning exposure. To simultaneously expose the display panels PNL1 and PNL3, the alignment system ALG performs alignment measurements of the two display panels PNL1 and PNL3, including measuring the alignment marks AM on the display panel PNL1 (first measurement) and measuring the alignment marks AM on the display panel PNL3 (second measurement). By performing the first measurement, the exposure result of the display panel PNL1 can be measured, and by performing the second measurement, the exposure result of the display panel PNL3 can be measured. Furthermore, the exposure apparatus EX according to the above embodiment can expose the display panels PNL1 and PNL2 with a single scanning exposure. The distance D1 between the exposure region of the display panel PNL1 and the exposure region of the display panel PNL2 can be set to be larger than the exposure field of the exposure module. Furthermore, if there is no problem with accuracy, the distance D1 may be set to be smaller than the exposure field of the exposure module.

[0106] Furthermore, in the exposure module group MU(A), PNL3 is exposed using modules MU1 to MU4, and PNL1 is exposed using modules MU5 to MU9. At this time, while exposing the display panel PNL3, modules MU1 to MU4 drive the fine movement stage 10S of the DMD 10 and the optical system and optical element OPE of the projection unit PLU in real time based on the measurement results of the second measurement to perform exposure while correcting the projection position of the pattern. While exposing the display panel PNL1, modules MU5 to MU9 drive the fine movement stage 10S of the DMD 10 and the optical system and optical element OPE of the projection unit PLU in real time based on the measurement results of the first measurement to perform exposure while correcting the projection position of the pattern. This makes it possible to perform exposure while correcting multiple panels PNL1 and PLN3 in a single scanning exposure.

[0107] Here, it has been assumed that modules MU1 to MU4 expose display panel PNL3, and modules MU5 to MU9 expose display panel PNL1, but these are set appropriately. The exposure module group MU(B) and exposure module group MU(C) are similar to the exposure module group MU(A).

[0108] Furthermore, for example, even if the distance D1 between the exposure area of display panel PNL1 and the exposure area of display panel PNL2 is short and driving of fine movement stage 10S of DMD 10, driving of the optical system of projection unit PLU, or driving of optical element OPE cannot be completed in time while substrate holder 4B moves the distance D1, this information may be displayed on a display device provided in exposure apparatus EX to allow the operator of exposure apparatus EX to choose whether to continue the exposure process. Alternatively, the operator may be able to choose whether to continue the exposure process, stop the exposure process, or expose a pattern on substrate P that will indicate that it is a defective product.

[0109] In the above embodiment and modified example, the drive control unit 304 controls the driving of the fine movement stage 10S of the DMD 10, the driving of the optical system of the projection unit PLU, and the driving of the optical element OPE, but this is not limited to this. The drive control unit 304 only needs to control the driving of any one of the fine movement stage 10S of the DMD 10, the optical system of the projection unit PLU, and the optical element OPE. In addition, when the amount of positional deviation measured by the alignment system ALG, calibration, or interferometers IFY1 to IFY4 exceeds a specified amount set in advance by the operator, it may be determined in advance as recipe information (exposure conditions) whether to perform exposure, continue exposure, or perform alignment again.

[0110] Furthermore, in the above embodiment, drive control unit 304 corrects the first control data or second control data based on the measurement results of interferometers IFY1 to IFY4, but correction based on the measurement results of interferometers IFY1 to IFY4 does not have to be performed. In this case, drive control unit 304 only needs to control the driving of fine movement stage 10S of DMD 10, the driving of the optical system of projection unit PLU, and the driving of optical element OPE based on the first control data or the second control data.

[0111] The above-described embodiment is a preferred example of the present invention, but the present invention is not limited to this and can be modified in various ways without departing from the spirit of the present invention. [Explanation of symbols]

[0112] 4B PCB holder 10 DMD 10a Micromirror 10S fine movement stage 116 First lens group 118 Second lens group 300 Exposure control device 301 Control Data Creation Department 302 Correction Data Creation Department 304 Drive control unit ALG alignment system EX exposure equipment IFY1~IFY4 Interferometers MU1 to MU27 modules P board PLU Projection Unit

Claims

1. a stage that moves the substrate in a scanning direction; a spatial light modulator; an illumination optical system that illuminates the spatial light modulator; a projection optical system that irradiates the substrate with light from the spatial light modulator while the stage moves the substrate in the scanning direction, the substrate includes a first region in which a first pattern is formed and a second region in which a second pattern is formed, the first region and the second region being aligned in the scanning direction; a first exposure area above the first area is exposed, and a second exposure area above the second area is not exposed, based on a positional deviation from a design value of the first area and a positional deviation from a design value of the second area, or based on positional information of marks in the first area and positional information of marks in the second area; Exposure device.

2. a stage that moves the substrate in a scanning direction; a spatial light modulator; an illumination optical system that illuminates the spatial light modulator; a projection optical system that irradiates the substrate with light from the spatial light modulator while the stage moves the substrate in the scanning direction, the substrate includes a first region in which a first pattern is formed and a second region in which a second pattern is formed, the first region and the second region being aligned in the scanning direction; the first exposure area is exposed and the second exposure area is not exposed based on a distance between a first exposure area above the first area and a second exposure area above the second area; Exposure device.

3. a stage that moves the substrate in a scanning direction; a spatial light modulator; an illumination optical system that illuminates the spatial light modulator; a projection optical system that irradiates the substrate with light from the spatial light modulator while the stage moves the substrate in the scanning direction, the substrate includes a first region in which a first pattern is formed and a second region in which a second pattern is formed, the first region and the second region being aligned in the scanning direction; a width of an exposure field of the projection optical system in the scanning direction is set smaller than a distance between a first exposure area above the first area and a second exposure area above the second area; The first exposure area is exposed, and the second exposure area is exposed. Exposure device.

4. the setting of the exposure device is changed while traveling a distance between the first exposure area above the first area and the second exposure area above the second area; 4. The exposure apparatus according to claim 3.

5. an exposure position by the projection optical system is controlled by adjusting at least one of a moving body that moves the spatial light modulator and the projection optical system; 5. The exposure apparatus according to claim 1.

6. adjusting the movable body includes moving the movable body in a direction perpendicular to an optical axis of the projection optical system and rotating the movable body around the optical axis; adjusting the projection optical system includes adjusting the projection magnification of the projection optical system or driving an optical element in the projection optical system; 6. The exposure apparatus according to claim 5.

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