Temperature control device

Abstract

To provide a temperature control device capable of precisely controlling the temperature of each of a plurality of test objects and simultaneously testing the plurality of test objects at a plurality of temperature settings using a test device with a simple structure.SOLUTION: A temperature control device 1 according to the present invention controls the temperature of a plurality of test objects 9 and performs evaluation tests, and includes a holder 8 that stores the plurality of test objects 9, and a heat exchange plate 2 through which a temperature-controlled heat medium circulates. The heat medium flowing into the heat exchange plate 2 is controlled to a predetermined temperature by changing the ratio of the heat medium from a high-temperature heat medium tank 5a to the heat medium from a low-temperature heat medium tank 5b.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present invention relates to a temperature control device that is provided in a testing device that requires temperature control of a test object. [Background technology]

[0002] Conventionally, in tests in which the temperature of a test object is controlled, a temperature control device is known that controls the temperature of the test object via a heat exchange plate through which a heat medium whose temperature is controlled in a heat medium tank circulates (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2022-178211 Summary of the Invention [Problem to be solved by the invention]

[0004] In conventional temperature control devices of this type, when simultaneously testing test objects set to multiple temperatures using a heat transfer medium, it was necessary to prepare a heat transfer medium tank in which the heat transfer medium was regulated to the set temperature for each temperature setting.

[0005] However, installing as many heat transfer medium tanks as there are set temperatures has the disadvantages of increasing the power consumption required to maintain and change the temperature of the heat transfer medium, raising the environmental temperature of the test room, and increasing the installation costs.

[0006] In view of the above-mentioned disadvantages, an object of the present invention is to provide a temperature control device that can efficiently control the temperature of a test object to a plurality of temperature settings. [Means for solving the problem]

[0007] In order to achieve this object, the present invention provides a temperature control device that controls the temperature of a test object to a plurality of set temperatures, comprising a plurality of holders that store the test object, a plurality of heat exchange plates through which a temperature-controlled heat medium circulates, a high-temperature heat medium tank that supplies a heat medium that is higher than the set temperature to the heat exchange plates, and a low-temperature heat medium tank that supplies a heat medium that is lower than the set temperature to the heat exchange plates, wherein the heat medium flowing into each of the plurality of heat exchange plates is controlled to a plurality of different set temperatures by changing the mixing ratio of the heat medium in the high-temperature heat medium tank and the heat medium in the low-temperature heat medium tank, and the holders are detachably attached to the heat exchange plates, and the temperature of the test object stored in the holders is controlled to the different set temperatures by heat from each heat exchange plate.

[0008] According to the present invention, simply by providing the high-temperature-side heat medium tank and the low-temperature-side heat medium tank, the temperatures of the heat exchange plates can be efficiently controlled to the different set temperatures.

[0009] Furthermore, the present invention is characterized in that each of the plurality of heat exchange plates is connected in parallel to the high-temperature side heat medium tank and the low-temperature side heat medium tank, and the mixing ratio of the heat medium from the high-temperature side heat medium tank and the heat medium from the low-temperature side heat medium tank supplied to the heat exchange plate is changed so that the heat exchange plate can be set to a plurality of temperatures ranging from a high set temperature to a lower set temperature.

[0010] According to the present invention, by changing the mixing ratio of the heat medium from the high-temperature side heat medium tank and the heat medium from the low-temperature side heat medium tank, each of the plurality of heat exchange plates can be efficiently set to a plurality of different set temperatures, ranging from a high set temperature to a lower set temperature.

[0011] Furthermore, the present invention is characterized in that the high-temperature heat medium tank is connected in parallel to each of the plurality of heat exchange plates, a flow path from the low-temperature heat medium tank is further connected to the heat medium flow path from the high-temperature heat medium tank to the heat exchange plates, both flow paths are provided with flow control valves, and both flow control valves are controlled based on temperatures detected by temperature sensors provided on each heat exchange plate, so that the heat medium from the high-temperature heat medium tank and the heat medium from the low-temperature heat medium tank are mixed to achieve the plurality of set temperatures.

[0012] Furthermore, the present invention is characterized in that the high-temperature heat medium and the low-temperature heat medium are mixed by opening and closing the flow control valves provided in the flow paths of the high-temperature side heat medium tank and the low-temperature side heat medium tank in response to temperatures detected by temperature sensors provided on the heat exchanger plates, so that the heat exchanger plates are kept at a predetermined temperature.

[0013] According to the present invention, the temperature of each heat exchange plate can be adjusted to a plurality of set temperatures with a simple structure.

[0014] Furthermore, the present invention is characterized in that, of the heat transfer medium from the plurality of heat exchange plates set to a plurality of set temperatures ranging from a high set temperature to a lower set temperature, the heat transfer medium from the plurality of heat exchange plates set to the higher set temperature is returned to the high-temperature side heat transfer medium tank, and the heat transfer medium from the plurality of heat exchange plates set to the lower set temperature is returned to the low-temperature side heat transfer medium tank.

[0015] Furthermore, the present invention is characterized in that a return heat medium tank is provided upstream of the return flow path of the high-temperature heat medium tank, through which the heat medium from multiple heat exchange plates with a high-temperature setting is returned, and that the return flow path of the low-temperature heat medium tank is provided upstream of the return flow path of the low-temperature heat medium tank, through which the heat medium from multiple heat exchange plates with a low-temperature setting is returned.The two return heat medium tanks are connected by a pipeline, so that when there is an excess of heat medium in one return heat medium tank, the excess heat medium can flow into the other return heat medium tank.

[0016] According to the present invention, the temperatures of the high-temperature side heat medium tank and the low-temperature side heat medium tank can be efficiently controlled.

[0017] According to the present invention, the temperature control device can simultaneously control the temperatures of heat exchange plates that are set to multiple set temperatures, from a high set temperature to a lower set temperature, while reducing the number of heat medium tanks used.This reduces the cost of installing the heat medium tanks, reduces the amount of power consumed by the heat medium tanks, and prevents the environmental temperature from increasing due to heat generated by the heat medium tanks.In addition, because it is not necessary to change the set temperature of the heat medium tank every time the temperature setting of the heat exchange plate is changed, there is no need to wait for the heat medium in the heat medium tank to reach the set temperature, and the temperature setting for the test can be quickly changed.

[0018] In the above invention, the test is preferably a secondary battery charge / discharge test. [Brief explanation of the drawings]

[0019] [Figure 1] 1 is a perspective view showing a temperature control device according to an embodiment of the present invention; [Figure 2] FIG. 2 is a perspective view showing the back side of the temperature control device according to the embodiment. [Figure 3] FIG. 3 is an explanatory diagram showing the holder of the present embodiment in an exploded state. [Figure 4] Circulation circuit diagram of the heat medium according to the present embodiment [Figure 5] 1 is an explanatory diagram of a method for controlling the temperature of a heat medium according to an embodiment of the present invention; [Figure 6A] 1 is a flow diagram illustrating processing before the start of a test according to this embodiment. [Figure 6B] Flow diagram of temperature monitoring processing according to this embodiment [Figure 6C] 1 is a flowchart showing a temperature deviation determination process during testing according to the present embodiment; [Figure 7] Circulation circuit diagram of a heat medium according to another embodiment [Figure 8] FIG. 10 is an explanatory diagram of a return circulation circuit according to another embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0020] A temperature control device according to an embodiment of the present invention will be described with reference to the drawings. Referring to Figures 1 and 2, a temperature control device 1 according to this embodiment is provided in a test device 100 that requires temperature control of a test object 9. A test that requires temperature control is, for example, a secondary battery charge / discharge test in which a secondary battery is used as the test object.

[0021] The test device 100 in which the temperature control device 1 of this embodiment is installed includes a fixed plate 3 to which a heat exchange plate 2 is fixed, a frame body 4 that aligns the fixed plate 3 in the vertical direction and supports it on the front and back, and a plurality of heat medium tanks 5 that can adjust the temperature of a heat medium to a predetermined temperature and supply it to the heat exchange plate 2.

[0022] 3, the heat exchange plate 2 is provided with two parallel flow paths 7, an outward path and an inward path, through which the heat medium supplied from the heat medium tank 5 flows. Two holders 8 for accommodating test objects are detachably fixed to one heat exchange plate 2, side by side, so as to straddle the two flow paths 7.

[0023] Referring to Figure 3, the holder 8 comprises a base portion 10 having four storage sections 10a with an arc-shaped cross section, which are space capable of storing test objects 9, which are four cylindrical secondary batteries, in a parallel arrangement, and a lid portion 11 having four storage sections 11a with an arc-shaped cross section, which clamp and hold the test objects 9 between the storage sections 10a, 11a to prevent the test objects 9 from falling off the base portion 10.

[0024] The base 10 has four screw holes 10b through which screws 10e can be inserted, and the base 10 is detachably fastened to the female threads 2a of the heat exchange plate 2 by the screws 10e inserted into the screw holes 10b. Heat transfer sheets 12 are sandwiched between the base 10 and the test object 9, and between the lid 11 and the test object 9, to ensure efficient heat transfer with as few gaps as possible. If the test object is a secondary battery that requires temperature control as well as charging and discharging operations, it is advisable to provide an opening in the holder 8 for attaching an operation terminal 13 (charge and discharge terminal).

[0025] A hook 10c is provided on the side of the base 10. A snap lock 11b that can be engaged with the hook 10c is provided on the lid 11, and the lid 11 is detachably fixed to the base 10 by this snap lock 11b. The base 10 is also provided with a positioning pin 10d that protrudes toward the lid 11. The lid 11 is provided with a positioning hole 11c that can receive the positioning pin 10d.

[0026] In the testing device of this embodiment, the heat exchange plates 2 are arranged side by side in the vertical direction, so the surfaces of the heat exchange plates 2 are aligned vertically, and the work of fixing the holder 8 to the heat exchange plate 2 or fixing the fixing plate 3 to which the heat exchange plate 2 and holder 8 are fixed to the frame 4 can be done from one direction, making it easy. In addition, because the heat exchange plates 2 can be attached to the front and back of the frame 4, the installation space can be used effectively, allowing testing of a large number of test objects 9 with a compact device.

[0027] FIG. 4 shows the heat transfer medium circulation circuit of this embodiment. For ease of explanation, the number of heat exchange plates 2 in FIG. 4 is five, half the number of heat exchange plates 2 in FIG. 1. In the parallel circulation circuit of this embodiment, the heat transfer medium supplied from the high-temperature heat transfer medium tank 5a is controlled by the high-temperature flow control valve block 14a, and the heat transfer medium supplied from the low-temperature heat transfer medium tank 5b is controlled by the low-temperature flow control valve block 14b. The heat transfer medium is then distributed to the junctions M1 to M5. The heat transfer medium discharged from each heat transfer plate 2 passes through a check valve 15 and is returned to the return heat transfer medium tank 16. It is then returned to the high-temperature heat transfer medium tank 5a and the low-temperature heat transfer medium tank 5b, where its temperature is again adjusted. The test object 9 held by the holder 8 is maintained at a predetermined temperature by the heat transfer medium via the heat exchange plates 2.

[0028] The inflow rates of the heat medium discharged from the high-temperature heat medium tank 5a and the low-temperature heat medium tank 5b, which mix at confluences M1 to M5, are controlled by high-temperature flow control valves A1 to A5 and low-temperature flow control valves B1 to B5, respectively, and by controlling the ratio of the heat medium discharged from the high-temperature heat medium tank 5a to the heat medium discharged from the low-temperature heat medium tank 5b, it is possible to adjust the temperature to different predetermined temperatures for each heat exchange plate 2. The flow control valves are connected to the temperature control unit 6 via a flow control block 14 such as a solenoid valve and a wired or wireless communication line.

[0029] For example, when simultaneously testing heat exchange plate 2a at 10°C, heat exchange plate 2b at 20°C, heat exchange plate 2c at 30°C, heat exchange plate 2d at 40°C, and heat exchange plate 2e at 50°C, the set temperature of the heat medium in high-temperature heat medium tank 5a is set to 50°C or higher (e.g., 60°C), and the set temperature of the heat medium in low-temperature heat medium tank 5b is set to 10°C or lower (e.g., 0°C), and both heat mediums are mixed, thereby controlling the temperature of each heat exchange plate 2 to the specified temperature.

[0030] The method for controlling the temperature of the heat medium flowing into the heat exchanger plate 2 will be explained in more detail with reference to Fig. 5. Temperature sensors T1 to T5 are provided downstream of the confluence points M1 to M5, respectively, and measure the temperature of the heat medium flowing into the heat exchanger plate 2. Although not shown, the temperature sensor T may be provided inside the heat exchanger plate 2 or downstream of the heat exchanger plate 2 as long as it is downstream of the confluence point M. The measured temperature of the heat medium is sent to the temperature control unit 6 connected to the temperature sensors via a wired or wireless communication line, and temperature monitoring processing is performed.

[0031] The processing before the test begins will be explained using the flow diagram in Figure 6A. After the user sets the set temperature, the temperature control device 6 acquires the set temperature (STEP 1) and opens the high-temperature side flow control valve A and the low-temperature side flow control valve B at a predetermined ratio set in advance according to the set temperature (STEP 2). Then, a temperature monitoring process (STEP 3) is performed, and if the temperature monitoring process result is positive (STEP 4...YES), a test start command is sent to the test control device (not shown), and the test begins (STEP 5). If the temperature monitoring process result is negative (STEP 4...NO), the temperature monitoring process is repeated.

[0032] The temperature monitoring process (STEP 3) will be described in detail using the flow diagram in Figure 6B. The temperature control device 6 acquires the heat medium temperature (hereinafter sometimes referred to as the sensor temperature) measured by the temperature sensor T (STEP 31) and determines whether the set temperature and the sensor temperature are the same or within a predetermined range (STEP 32). If the set temperature and the sensor temperature are the same or within the predetermined range, the temperature control device 6 recognizes that the heat medium temperature is appropriate (STEP 33), maintains the heat medium flow rate setting, terminates the temperature monitoring process, and proceeds to STEP 5. If the sensor temperature is lower than the set temperature, the temperature control unit 6 issues an instruction (STEP 321) to open the high-temperature side flow control valve A by a predetermined percentage (n1%) corresponding to the difference between the set temperature and the sensor temperature, and close the low-temperature side flow control valve B by a predetermined percentage (n2%) corresponding to the difference between the set temperature and the sensor temperature. After a waiting time (S1 seconds) has elapsed (STEP 322), the process from STEP 31 onwards is performed again. If the sensor temperature is higher than the set temperature, the temperature control unit 6 issues a command (STEP 323) to close the high-temperature side flow control valve A by a predetermined percentage (N1%) corresponding to the difference between the set temperature and the sensor temperature, and to open the low-temperature side flow control valve B by a predetermined percentage (N2%) corresponding to the difference between the set temperature and the sensor temperature. After a waiting time (S2 seconds) has elapsed (STEP 324), the process from STEP 31 onward is repeated. The opening and closing ratios (n1%, n2%, N1%, N2%) of each control valve according to the difference between the set temperature and the sensor temperature are controlled, for example, by PI control or PID control. The waiting times S1 and S2 may be the same or different, and may be a predetermined time or may be varied depending on the set temperature. By repeating these processes, the test can be started with the heat transfer medium temperature adjusted.

[0033] Furthermore, by making the sum of n1% and n2% and the sum of N1% and N2% 100%, the amount of heat medium flowing into the heat exchange plate 2 can be kept constant while regulating the temperature of the heat medium.

[0034] The temperature deviation determination process during testing will be explained using the flow diagram in Figure 6C. The temperature deviation determination process (STEP 6) is performed at a set or arbitrary timing after the start of the test. The temperature control device 6 acquires the sensor temperature (STEP 61) and determines whether the set temperature and the sensor temperature are the same or within a specified range (STEP 62). If the set temperature and the sensor temperature are the same or within the specified range (YES in STEP 62), it recognizes that the heat medium temperature is appropriate (STEP 63) and performs the processes from STEP 61 onwards again. If the set temperature and the sensor temperature are different or outside the specified range (NO in STEP 62), it recognizes that the heat medium temperature is abnormal. By accumulating the processing results and the sensor temperature at the time of processing, it is possible to check whether a temperature deviation occurred during the test.

[0035] The test may also be terminated if an abnormality is detected in any of the steps shown in Figures 6A to 6C. Examples of abnormalities include the inability to acquire the sensor temperature, the recognition that the temperature of the heat medium is abnormal, or the recognition that the temperature of the heat exchange plate 2 is abnormal due to a drop in the water level (flow rate) caused by a chiller abnormality.

[0036] Referring to FIG. 7 , a description of components with the same reference numerals will be omitted, and another embodiment will be described. By operating the return heat medium control valves C1 to C5, it is possible to select whether the heat medium returning from the heat exchange plate 2 is returned to the high-temperature return heat medium tank 16a or the low-temperature return heat medium tank 16b. The return heat medium control valves C1 to C5 can be operated by the user or by the return heat medium control unit 17, which is connected to the return heat medium control valves C1 to C5 via a wired or wireless communication line via the flow control valve block 14c. The return heat medium control unit 17 determines which of the set temperatures of the high-temperature return heat medium tank 5a or the low-temperature return heat medium tank 5b the temperatures measured by the temperature sensors T1 to T5 are closest to, and controls the return heat medium control valves C1 to C5 so that the heat medium is returned to either the high-temperature return heat medium tank 16a or the low-temperature return heat medium tank 16b. This configuration reduces the power consumption required to return the heat medium returned to the heat medium tank 5 to the set temperature.

[0037] The flow of heat medium returning to the return heat medium tank 16 is explained in more detail with reference to Figure 8. The return heat medium control valves C1 to C5 are connected so that the heat medium flowing into the high-temperature return heat medium tank 16a is returned to the high-temperature return heat medium tank 5a, and the heat medium flowing into the low-temperature return heat medium tank 16b is returned to the low-temperature return heat medium tank 5b. If the heat medium flows unevenly into either the high-temperature return heat medium tank 16a or the low-temperature return heat medium tank 16b, the high-temperature return heat medium tank 16a and the low-temperature return heat medium tank 16b are connected by an overflow prevention pipe 18. When the volume of heat medium contained in either the high-temperature return heat medium tank 16a or the low-temperature return heat medium tank 16b exceeds a certain level, the heat medium flows into the other return heat medium tank. The overflow prevention pipe 18 prevents the heat medium from overflowing from the return heat medium tank 16 while limiting the capacity of each return heat medium tank.

[0038] The temperature control unit 6 and the return heat medium control unit 17 are so-called processors that are composed of an arithmetic processing device such as a CPU (Central Processing Unit), a memory, and an I / O (Input / Output) device, and may be composed of the same device or different devices. [Explanation of symbols]

[0039] 1 Temperature control device 2 Heat exchange plate 2a Female thread 3 Fixed version 4 Frame 5 Heat medium tank 5a High temperature side heat medium tank 5b Low temperature side heat medium tank 6 Temperature control unit 7 Flow path 8 Holder 9 Test Object 10 Base 10a Storage area 10b screw hole 10c hook 10d Locating Pin 10e screw 11 Lid 11a Storage area 11b Snap lock 11c Positioning hole 12 Heat transfer sheet 13 Operation terminal 14 Flow Control Block 14a High temperature side flow control valve block 14b Low temperature side flow control valve block 15 Check valve 16 Return heat medium tank 16a High temperature return heat medium tank 16b Low temperature return heat medium tank 18 Overflow prevention piping 100 Test Equipment T temperature sensor M confluence A High temperature side flow control valve B Low temperature side flow control valve C Return heat medium control valve

Claims

1. In a temperature control device that controls the temperature of a test object to a plurality of set temperatures, a plurality of holders for storing test objects; a plurality of heat exchange plates through which a temperature-controlled heat medium circulates; a high-temperature side heat medium tank that supplies a heat medium having a temperature higher than the set temperature to the heat exchange plate; a low-temperature side heat medium tank that supplies a heat medium having a temperature lower than the set temperature to the heat exchange plate; Equipped with the heat medium flowing into each of the plurality of heat exchange plates is adjusted to a plurality of different set temperatures by changing the mixing ratio of the heat medium in the high-temperature side heat medium tank and the heat medium in the low-temperature side heat medium tank; The temperature testing device is characterized in that the holder is detachably attached to the heat exchange plate, and the temperature of the test object stored in the holder is controlled to the different set temperatures by heat from each heat exchange plate.

2. 2. The temperature testing device according to claim 1, the plurality of heat exchange plates are connected in parallel to the high-temperature side heat medium tank and the low-temperature side heat medium tank, A temperature testing device characterized in that a mixing ratio of the heat medium from the high-temperature-side heat medium tank and the heat medium from the low-temperature-side heat medium tank supplied to the heat exchange plate is changed so that the heat exchange plate can be set to a plurality of temperatures ranging from a high set temperature to a lower set temperature.

3. 3. The temperature testing device according to claim 2, the high-temperature-side heat medium tank is connected in parallel to each of the plurality of heat exchange plates; a flow path from the low-temperature heat medium tank is further connected to a heat medium flow path from the high-temperature heat medium tank to the heat exchange plate; a flow control valve provided in each flow path, and controlling both flow control valves based on the temperatures detected by temperature sensors provided on each heat exchange plate, to mix the heat medium from the high-temperature side heat medium tank and the heat medium from the low-temperature side heat medium tank so as to achieve the plurality of set temperatures.

4. 3. The temperature testing device according to claim 2, a temperature control device for mixing a high-temperature heat medium and a low-temperature heat medium by opening and closing the flow control valves provided in the flow paths of the high-temperature side heat medium tank and the low-temperature side heat medium tank in response to temperatures detected by temperature sensors provided on the heat exchanger plates, so that the heat exchanger plates are maintained at a predetermined temperature.

5. 2. The temperature testing device according to claim 1, A temperature control device characterized in that, of the heat transfer media from the plurality of heat exchange plates set to a plurality of set temperatures ranging from a high set temperature to a lower set temperature, the heat transfer media from the plurality of heat exchange plates set to the higher set temperature is circulated back to the high-temperature-side heat transfer media tank, and the heat transfer media from the plurality of heat exchange plates set to the lower set temperature is circulated back to the low-temperature-side heat transfer media tank.

6. 6. The temperature control device according to claim 5, A temperature control device comprising: a high-temperature heat transfer medium tank connected to the upstream of a return path of the high-temperature heat transfer medium tank through which the heat transfer medium from a plurality of heat exchange plates having a high-temperature setting is returned; and a low-temperature heat transfer medium tank connected to the upstream of a return path of the low-temperature heat transfer medium tank through which the heat transfer medium from a plurality of heat exchange plates having a low-temperature setting is returned; and both return heat transfer medium tanks are connected by a pipe so that when the heat transfer medium in one return heat transfer medium tank becomes excessive, the heat transfer medium can flow into the other return heat transfer medium tank.

7. 7. The temperature control device according to claim 1, The temperature control device is characterized in that the test is a secondary battery charge / discharge test.

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