Dual interface IC card, antenna sheet, laminate, multifaceted laminate, and manufacturing method of dual interface IC card

Abstract

To provide a dual interface IC card etc. which can easily discriminate whether or not an antenna wire configuring a terminal unit of an antenna is disconnected.SOLUTION: A dual interface IC card 10 comprises: a card substrate 20 of a laminated structure at least having a core layer 21 inside; an antenna 30 which is arranged inside the card substrate 20, and located on a surface 20A side rather than the core layer 21; and a coloring layer 40 which is arranged inside the card substrate 20, and in contact with the surface on the surface 20A side in the core layer 21. The antenna 30 has a terminal unit 32 which is configured by an antenna wire 31, in which at least a part is embedded in the coloring layer 40, and which is exposed to a recessed part 20C. A color difference between the coloring layer 40 and a terminal unit 32A is larger than the color difference between the core layer 21 and the terminal unit 32A, and is 20 or more. A lightness L*of an L*a*b*colorimetric system in the coloring layer 40 is 20 or more.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a dual interface IC card, an antenna sheet, a laminate, a multi-face laminate, and a method for manufacturing a dual interface IC card. [Background technology]

[0002] Conventionally, contact IC cards have been used, which communicate with external devices through contact terminals on the surface of the card, contactless IC cards which communicate with external devices through an antenna using electromagnetic induction or the like, and dual interface IC cards which can achieve both the functions of a contact IC card and a contactless IC card using a single IC chip on the card.

[0003] Of these, in dual interface IC cards, an IC module equipped with an IC chip is placed in a recess provided on the surface side of the card base, and the terminal portion of an antenna placed inside the card base is exposed in the recess, and the IC module and the terminal portion of the antenna are electrically connected (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent No. 7142484 Summary of the Invention [Problem to be solved by the invention]

[0005] When manufacturing such a dual interface IC card, it is necessary to cut the card base to expose the antenna terminal, but there is a risk that excessive cutting may cut the antenna wire that makes up the antenna terminal. For this reason, after cutting the card base, it is necessary to visually inspect the antenna wire that makes up the antenna terminal for any breaks.

[0006] On the other hand, currently, in order to impart a sense of luxury and unity, it is being considered to use a core layer that is a color other than white, such as a chromatic color such as yellow or ochre, or black, as the core layer that constitutes the card base.

[0007] However, if the color of the core layer located directly below the antenna is the same as or close to the color of the antenna wire, there is a problem in that it is difficult to detect breaks in the antenna wire that constitutes the terminal portion of the antenna during visual inspection.

[0008] The present invention has been made to solve the above problems. Specifically, it is an object of the present invention to provide a dual interface IC card and a method for manufacturing the same that can easily determine whether or not the antenna wire constituting the antenna terminal has been broken. It is also an object of the present invention to provide an antenna sheet, a laminate, and a multi-surface laminate that can be used in the manufacture of a dual interface IC card and can easily determine whether or not the antenna wire constituting the antenna terminal has been broken. [Means for solving the problem]

[0009] [1] A dual interface IC card capable of contact and contactless communication with an external device, comprising: a laminated card base having a recess on the surface and a core layer at least inside; an antenna disposed inside the card base and positioned closer to the surface than the core layer; a colored layer disposed inside the card base and in contact with the surface of the core layer on the surface side; and an IC module disposed in the recess and having an IC chip; the antenna is composed of an antenna wire, at least a part of which is embedded in the colored layer and has a terminal portion exposed in the recess; the color difference between the colored layer and the terminal portion is greater than the color difference between the core layer and the terminal portion and is 20 or more; * a * b * Color system lightness L * is more than 20, dual interface IC card.

[0010] [2] The dual interface IC card according to [1] above, wherein the terminal portion is configured by a structure in which the antenna wire is repeatedly folded back from the outer periphery of the recess toward the center.

[0011] [3] The dual interface IC card according to [1] or [2] above, wherein the core layer is colored.

[0012] [4] The dual interface IC card according to [1] or [2] above, wherein the core layer is chromatic, black, or gray.

[0013] [5] The dual interface IC card according to any one of [1] to [4] above, wherein the colored layer is white.

[0014] [6] An antenna sheet used in the manufacture of a dual interface IC card capable of contact and contactless communication with an external device, the dual interface IC card comprising: a laminated card base having a recess on its surface; an antenna disposed inside the card base; and an IC module having an IC chip disposed in the recess and electrically connected to the antenna. The antenna sheet comprises: a laminated card base having a recess on its surface and at least a core layer inside; an antenna disposed inside the card base and positioned closer to the surface than the core layer; and a colored layer disposed inside the card base and in contact with the surface of the core layer on the surface side; the antenna is composed of an antenna wire, at least a portion of which is embedded in the colored layer and has a terminal portion for electrically connecting to the IC chip; the color difference between the colored layer and the terminal portion is greater than the color difference between the core layer and the terminal portion and is 20 or more; and the L of the colored layer * a * b * Color system lightness L * is 20 or more, antenna sheet.

[0015] [7] The antenna sheet according to [6] above, wherein the core layer is colored.

[0016] [8] The antenna sheet according to [6] above, wherein the core layer is chromatic, black, or gray.

[0017] [9] The antenna sheet according to any one of [6] to [8] above, wherein the colored layer is white.

[0018]

[10] A laminate comprising the antenna sheet according to any one of [6] to [9] above and at least one layer laminated on both sides of the antenna sheet in the thickness direction.

[0019]

[11] A multi-sided laminate in which two or more laminates according to the above

[10] are attached to each other.

[0020]

[12] A method for manufacturing a dual interface IC card capable of contact communication and contactless communication with an external device, comprising the steps of: preparing a laminated body including a card base having at least a core layer therein; an antenna disposed inside the card base and having a terminal portion constituted by an antenna wire; and a colored layer disposed inside the card base and having at least a part of the terminal portion embedded therein; cutting the card base to form a recess in which the terminal portion of the antenna is exposed, for arranging an IC module having an IC chip; electrically connecting the terminal portion of the antenna to the IC chip and arranging the IC module in the recess; wherein the colored layer is in contact with the core layer and is located on the front side of the core layer when the surface of the card base on which the recess is formed is defined as the front side and the surface opposite to the front side is defined as the back side; the colored layer and the terminal portion have a color difference greater than the color difference between the core layer and the terminal portion and are 20 or more; and the L of the colored layer is * a * b * Color system lightness L * 20 or more. [Effects of the Invention]

[0021] According to one aspect of the present invention, a dual interface IC card can be provided that can easily determine whether or not an antenna wire constituting the antenna terminal section is disconnected. Also, according to another aspect of the present invention, an antenna sheet, a laminate, and a multi-surface laminate that can be used in the manufacture of a dual interface IC card and can easily determine whether or not an antenna wire constituting the antenna terminal section is disconnected can be provided. [Brief explanation of the drawings]

[0022] [Figure 1] FIG. 1 is a schematic plan view of a dual interface IC card according to an embodiment. [Figure 2] FIG. 2 is a cross-sectional view taken along the line AA in FIG. [Figure 3] FIG. 3 is an enlarged view of the vicinity of the terminal portion of the antenna in a state where the IC module and the anisotropic conductive film are removed from the dual interface IC card in FIG. [Figure 4] FIG. 4 is a schematic plan view of a multi-face laminate used in manufacturing a dual-interface IC card according to an embodiment. [Figure 5] FIG. 5 is a schematic plan view of a laminate according to an embodiment. [Figure 6] FIG. 6 is a cross-sectional view taken along line BB in FIG. [Figure 7] FIG. 7 is an enlarged view of the vicinity of the terminal portion of the antenna in FIG. [Figure 8] 8A and 8B are schematic diagrams showing the manufacturing process of a multi-face laminate used in a dual-interface IC card according to an embodiment. [Figure 9] 9A and 9B are schematic diagrams showing the manufacturing process of a multi-face laminate used in a dual-interface IC card according to an embodiment. [Figure 10] 10A and 10B are schematic diagrams showing the manufacturing process of the dual-interface IC card according to the embodiment. [Figure 11]11A and 11B are schematic diagrams showing the manufacturing process of the dual-interface IC card according to the embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0023] Hereinafter, a dual interface IC card according to an embodiment of the present invention, a manufacturing method thereof, an antenna sheet, a laminate with an antenna, and a laminate with a multi-sided antenna will be described with reference to the drawings. FIG. 1 is a schematic plan view of the dual interface IC card according to this embodiment, FIG. 2 is a cross-sectional view taken along line AA in FIG. 1, and FIG. 3 is an enlarged view of the vicinity of the antenna terminal portion in a state in which the IC module and the anisotropic conductive film have been removed from the dual interface IC card in FIG. 1. FIG. 4 is a schematic plan view of a multi-sided laminate used in manufacturing the dual interface IC card according to this embodiment, FIG. 5 is a schematic plan view of the laminate according to this embodiment, FIG. 6 is a cross-sectional view taken along line BB in FIG. 5, and FIG. 7 is an enlarged view of the vicinity of the antenna terminal portion in FIG. 5. FIGS. 8A, 8B, 9A, and 9B are schematic diagrams illustrating the manufacturing process of a multi-sided laminate used in the dual interface IC card according to this embodiment. FIGS. 10A, 10B, 11A, and 11B are schematic diagrams illustrating the manufacturing process of the dual interface IC card according to this embodiment.

[0024] <<<Dual interface IC card>>>

[0025] 1 and 2 (hereinafter, sometimes simply referred to as "IC card 10") includes a laminated card base 20 having a recess 20C on a surface 20A, an antenna 30 disposed inside the card base 20, a colored layer 40 disposed inside the card base 20, an IC module 50 disposed in the recess 20C, and an anisotropic conductive film 60 for electrically connecting the antenna 30 to an IC chip 54 (described later) of the IC module 50. Note that the anisotropic conductive film 60 is used to electrically connect the antenna 30 and the IC module 50, but the antenna 30 and the IC module 50 may also be electrically connected by a conductive paste method, a coil-on-module method, or solder welding method.

[0026] <<Card base>> For ease of explanation, an XYZ coordinate system is set for the card base 20. First, the normal direction to the front surface 20A of the card base 20 is defined as the Z axis. The direction from the back surface 20B, which is the opposite side of the card base 20 to the front surface 20A, toward the front surface 20A is defined as the +Z direction or upward in the thickness direction, and the opposite direction is defined as the -Z direction or downward in the thickness direction.

[0027] When card base 20 is viewed from the +Z direction, the X axis is a straight line perpendicular to both short sides of card base 20, which has long and short sides described below, and the Z axis, and the direction from one short side closer to recess 20C to the other short side is the +X direction or rightward, and the opposite direction is the -X direction or leftward. Furthermore, the Y axis is an axis perpendicular to the X and Z axes, and the direction from one long side farther from recess 20C to the other long side is the +Y direction or upward, and the opposite direction is the -Y direction or downward.

[0028] The recess 20C is composed of a first recess 20D and a second recess 20E that is connected to the first recess 20D. The second recess 20E is located deeper than the first recess 20D in the depth direction (from the +Z side to the -Z side) from the front surface 20A toward the back surface 20B. The hole diameter of the second recess 20E is smaller than the hole diameter of the first recess 20D. The first recess 20D is a portion that mainly stores the substrate 51 and the like of the IC module 50, and the second recess 20E is a portion that mainly stores the molded portion 55 and the like.

[0029] The card base 20 includes at least a core layer 21. The card base 20 shown in Fig. 2 has a configuration in which an over-sheet layer 22, a core layer 23, an inner layer 24, a core layer 21, an inner layer 25, a core layer 26, and an over-sheet layer 27 are laminated in this order in the depth direction from the front surface 20A toward the back surface 20B. In addition, printing or an embedded magnetic stripe may be applied to the surface of the over-sheet layer 22 of the card base 20 opposite to the core layer 23 side or to the surface of the over-sheet layer 27 opposite to the core layer 26 side.

[0030] <Core layer> The core layers 21, 23, and 26 may be colored. In this specification, "colored" includes white. Examples of colored colors include yellow, ochre, red, blue, silver, gold, shiny colors, black, gray, white, translucent colors, and colors including colored translucent colors. Colors not listed here may also be used. Among the colored colors, chromatic, black, or gray is preferred. When manufacturing an IC card, the surface 20A of the card base 20 is printed in gold or black, but the side surfaces of the card base are typically not printed. Therefore, if the core layers 21, 23, and 26 are chromatic, black, or gray, the side surfaces of the card base 20 can also be colored similarly to the surface of the IC card, thereby imparting a sense of luxury and unity. Examples of chromatic colors include yellow and ochre.

[0031] When manufacturing a gold-colored IC card, it is preferable that the core layers 21, 23, 26 be yellow or ochre-colored, when manufacturing a black-colored IC card, it is preferable that the core layers 21, 23, 26 be black, and when manufacturing a silver-colored IC card, it is preferable that the core layers 21, 23, 26 be gray.

[0032] The core layers 21, 23, and 26 are not particularly limited, but may be, for example, plastic sheets. Examples of plastic sheets that can be used include polyethylene terephthalate (PET), PET-G (terephthalic acid-cyclohexanedimethanol-ethylene glycol copolymer), polyvinyl chloride, copolymer polyester, vinyl chloride-vinyl acetate copolymer, polycarbonate, polyamide, polyimide, cellulose diacetate, cellulose triacetate, polystyrene, ABS, polyacrylic ester, polypropylene, polyethylene, and polyurethane, as well as composite films thereof. From an environmental perspective, the plastic sheets may also be recycled plastic sheets made from waste materials generated during manufacturing or marine plastics. Note that using a crystallized plastic sheet, such as C-PET (crystalline PET), as the core layer results in poor adhesion to the IC module substrate.

[0033] The thickness of the core layers 21, 23, 26 can be appropriately selected taking into consideration the overall thickness of the IC card 10, and may be, for example, approximately 0.03 mm to 0.45 mm. The core layers 21, 23, 26 may have a laminated structure of two or more layers. In this case, the above-mentioned thickness of the core layer refers to the overall thickness of the core layer.

[0034] When a pattern is printed on the core layers 23, 26, it is preferable that the core layers 21, 23, 26 have marks for alignment, such as reference lines. When the marks and colored layer 40 are formed by printing, it is preferable to use the same ink for forming the marks as the ink for forming the colored layer 40, from the viewpoint of reducing the number of inks used by using a common ink.

[0035] <Oversheet layer> The over-sheet layers 22, 27 may be transparent, semi-transparent, or opaque layers such as white, but the over-sheet layers 22, 27 shown in Fig. 2 are transparent layers. The thickness of the over-sheet layers 22, 27 may be approximately 0.03 mm or more and 0.18 mm or less. From the viewpoint of preventing curling when the multi-sided laminate 70 described below is integrated by heat pressing or the like, it is preferable that the over-sheet layers 22, 27 have the same thickness, but they do not necessarily have to be the same.

[0036] The material of the over-sheet layers 22, 27 may be any material that is adhesive when heated, but even if the over-sheet layers themselves are not adhesive when heated, the two can be integrated by additionally forming a layer of a known adhesive that generates adhesive force when heated, etc., between the over-sheet layer 22 and the core layer 23 or between the over-sheet layer 27 and the core layer 26.

[0037] <Inner layer> The inner layers 24 and 25 are not particularly limited, but examples thereof include the plastic sheets described in the section on the core layers 21, 23, and 26. The thickness of the inner layers 24 and 25 can be appropriately selected taking into consideration the overall thickness of the IC card 10, and may be, for example, approximately 0.03 mm or more and 0.20 mm or less.

[0038] <<Antenna>> The antenna 30 is coil-shaped and has an end 32 made up of an antenna wire 31. The end 32 of the antenna 30 is electrically connected to an antenna connection terminal 53 of an IC module 50, which will be described later, so that an IC chip 54 provided in the IC module 50 and the antenna 30 form a communication circuit for contactless communication. The communication circuit may be one that performs close-proximity communication using an HF frequency band of 13.56 MHz, for example, or one that performs communication using another frequency band, such as a UHF frequency band of 920 MHz.

[0039] When a dual interface IC card is held over an external device such as a reader / writer, a magnetic field generated by the reader / writer generates a current in the communication circuit, which supplies power to the IC chip. This enables the IC chip to send and receive information contactlessly with the reader / writer, and to read and rewrite information from and to the memory.

[0040] The antenna wire 31 constituting the antenna 30 is typically formed of a coated conductor wire in which the periphery of a copper wire is coated with an insulating material. Alternatively, copper alloy wires such as Cu-Ni, Cu-Cr, Cu-Zn, Cu-Sn, and Cu-Be, or various metal wires and metal alloy wires such as iron, stainless steel, and aluminum can also be selected. By using a coated conductor wire as the antenna wire 31, it can be manufactured more inexpensively than, for example, a copper foil etching method.

[0041] The diameter of the antenna wire 31 is not particularly limited as long as it can ensure the characteristics required for a contactless communication circuit, but it can be, for example, 0.03 mm to 0.30 mm, and preferably 0.05 mm to 0.15 mm. By setting the diameter in the latter range, durability against heat and pressure during embedding and external forces due to cutting can be improved, ensuring good communication characteristics.

[0042] The antenna 30 has a pair of terminal portions 32A. The terminal portions 32A are exposed in the recess 20C and are electrically connected to the IC chip 54. The terminal portions 32A shown in Fig. 2 are located on the bottom surface 20D1 of the first recess 20D.

[0043] 2, at least a portion of the terminal portion 32A is embedded in the colored layer 40. Therefore, when the card base 20 is cut so as to expose the terminal portion 32A from the front surface 20A side, the colored layer 40 is exposed along with the terminal portion 32A. Note that the terminal portion 32A may be entirely embedded in the colored layer 40.

[0044] Terminal portion 32A has a repeated folded structure as shown in Fig. 3. Specifically, for example, terminal portion 32A has a repeated folded structure extending from the outer periphery toward the center of recess 20C. That is, antenna wire 31 extends from the -X direction toward the +X direction so that the folded structure is repeated multiple times. Note that end portion 32 shown in Fig. 3 also has the above-described folded structure in addition to terminal portion 32A.

[0045] The folded structure has approximately arc-shaped bent portions at the ends on the +Y direction side and the -Y direction side, i.e., the upper end and the lower end, and the portion other than the bent portion connecting the bent portion at the upper end and the bent portion at the lower end is approximately straight or curved. However, from the viewpoint of saving material for the antenna wire 31, it is preferable to form the portion other than the bent portion as approximately straight as possible.

[0046] In addition, the parts other than the bent parts of the folded structure are inclined clockwise at a predetermined angle θ (see Figure 3) with respect to the Y axis, which is a straight line along the outer edge of the recess 20C, and the pitch of the zigzag shape between adjacent parts other than the bent parts is approximately constant.

[0047] The typical outline shape of an IC module in a plan view is a substantially rectangular shape with rounded corners. In this case, the outline shape of recess 20C is also substantially the same as the outline shape of IC module 50. Specifically, in consideration of the accuracy of the mounting position of IC module 50 on card base 20, the outline shape is often made approximately 0.1 mm to 0.2 mm larger than the outline shape of IC module 50. In this case, the outer periphery of recess 20C is a substantially rectangular shape with sides substantially parallel to the short and long sides of card base 20, and terminal portion 32A is configured by a structure in which antenna wire 31 is repeatedly folded back from the outer periphery, which is a side substantially parallel to the short sides of card base 20, toward the center.

[0048] On the other hand, if the contour shape of IC module 50 and recess 20C is elliptical or the like, the straight line along the outer circumferential side of recess 20C refers to a tangent to the center of that side because that side is a curve such as an arc. Usually, the contour of an IC module is configured to be symmetrical in the vertical and horizontal directions, so if end portions are formed in the horizontal directions, the straight line along the outer circumferential side of the recess will be a straight line parallel to the Y axis.

[0049] The inclination angle θ is preferably 2 degrees or more and 20 degrees or less, and more preferably 5 degrees or more and 15 degrees or less. The inclination angle θ does not need to be strictly the same in all portions of the folded structure other than the bent portions, and may vary within the above-mentioned range. When the inclination angle θ is in the former range, the antenna wire 31 is inclined relative to the direction along the Y-axis, which is the movement direction of the end mill when cutting the recess, and this makes it possible to prevent the antenna wire from unintentionally branching, or the occurrence of whiskers.

[0050] The inclination angle θ is the angle at which the portion other than the bent portion is inclined clockwise with respect to the Y-axis, which is a straight line along the outer peripheral side of the recess 20C. However, there is no problem in replacing the above-mentioned θ with the angle at which the portion other than the bent portion is inclined counterclockwise with respect to the Y-axis, which is a straight line along the outer peripheral side of the recess. This is because even if the portion other than the bent portion is inclined counterclockwise, the same effect as when it is inclined clockwise can be obtained.

[0051] The pitch depends on factors such as the capacity of the winding machine and the quality of the antenna sheet after the antenna wire 31 is embedded in the colored layer 40, but is preferably 0.50 mm or less, and more preferably 0.25 mm or less. A pitch in the former range increases the exposed area of ​​the antenna wire 31 per unit area at the end 32, expanding the area for electrical connection with the antenna connection terminal 53 of the IC module 50. This improves the reliability of the electrical connection and reduces the electrical resistance at the contact point between the antenna wire 31 and the antenna connection terminal 53 of the IC module 50.

[0052] <<Colored layer>> The colored layer 40 is in contact with the surface 21A on the surface 20A side of the core layer 21. The colored layer 40 may be present not only inside the recessed portion 20C as shown in FIG.

[0053] Color difference ΔE between the colored layer 40 and the terminal portion 32A * ab1 is the color difference ΔE between the core layer 21 and the terminal portion 32A * ab2 is larger than the color difference ΔE * ab is as specified in JIS Z8781-4:2013.

[0054] The method for measuring and calculating the color difference is as follows. * a * b * Color space L * , a * and b * is measured using a spectrophotometer ("eXact Standard NGH-XRX10" manufactured by X-Rite Inc.) by irradiating the surface of the colored layer 40 with light (D65 light source) at an incident angle of 10 degrees (the normal direction to the surface of the colored layer 40 is set to 0 degrees) and based on the total reflected light (specular reflected light + diffuse reflected light). * a * b * "Color system" refers to the color system standardized by the CIE (International Commission on Illumination) and adopted in JIS Z8781-4:2013. * a * b * In the color system, lightness is L * The chromaticity, which indicates the hue and saturation, is a * , b * The antenna wire 31 constituting the terminal portion 32A of the antenna 30 has a small wire diameter, so a plate made of the same material as the antenna wire 31 is used to form the L * a * b * Color space L * , a * and b * is measured in the same manner as for the colored layer 40. Furthermore, the L * a * b* Color space L * , a * and b * is measured in the same manner as for the colored layer 40. * , a * and b * L1 * , a1 * and b1 * and the L of the antenna wire 31 * , a * and b * respectively L2 * , a2 * and b2 * and L of the core layer 21 * , a * and b * L3 * , a3 * and b3 * When the color difference ΔE between the colored layer 40 and the terminal portion 32A of the antenna 30 is * ab1 and the color difference between the core layer 21 and the terminal portion 32A of the antenna 30 can be calculated by the following formula: The measurement results in the present invention will be described later. ΔE * ab1=((L1 * -L2 * ) 2 +(a1 * -a2 * ) 2 +(b1 * -b2 * ) 2 ) 1 / 2 ΔE * ab2=((L3 * -L2 * ) 2 +(a3 * -a2 * ) 2 +(b3 * -b2 * ) 2 ) 1 / 2

[0055] Color difference ΔE between the colored layer 40 and the terminal portion 32A * ab1 is 20 or more. This color difference ΔE *If ab1 is 20 or more, the color difference between the colored layer 40 and the terminal portion 32A becomes clear, making it easier to distinguish the terminal portion 32A. * The lower limit of ab1 is preferably 30 or more, or 40 or more, and the upper limit may be 60 or less. For example, the color difference ΔE between the colored layer 40 and the terminal portion 32A * ab1 may be 20 or more and 60 or less, 30 or more and 60 or less, or 40 or more and 60 or less.

[0056] Lightness L of colored layer 40 * The lightness L is 20 or more. * However, if the lightness L of the colored layer 40 is 20 or more, the light absorption by the colored layer 40 present in the background of the terminal portion 32A can be suppressed, and therefore the terminal portion 32A can be more easily distinguished. * The lower limit of the lightness L of the colored layer 40 is preferably 30 or more, or 40 or more, and the upper limit may be 95 or less. * may be 20 or more and 95 or less, 30 or more and 95 or less, or 40 or more and 95 or less.

[0057] The color of the colored layer 40 is not particularly limited, but is preferably white, for example, when the core layer 21 is chromatic or black. When the antenna wire 31 is a copper wire, if the colored layer 40 is white, the terminal portion 32A becomes more easily distinguishable when the card base 20 is cut to expose the terminal portion 32A. Note that even when the antenna wire 31 is a coated copper wire, the laminate 70A is cut to expose the copper wire in the coated copper wire, and therefore, if the colored layer 40 is white, the terminal portion 32A becomes more easily distinguishable.

[0058] The colored layer 40 can be composed of a pigment or dye and a binder resin. In this case, for example, the colored layer 40 can be formed by printing a resin composition containing a pigment or dye using a printing method such as offset printing or silk screen printing. The colored layer 40 may also be a colored tape, such as white.

[0059] The thickness of the colored layer 40 is preferably, for example, 1 μm or more and 30 μm or less. If the thickness of the colored layer 40 is 1 μm or more, the color of the colored layer 40 can be clearly confirmed, and if it is 30 μm or less, the thickness of the colored layer 40 is thin, so unevenness and deformation of the pattern can be suppressed during hot press molding. The lower limit of the thickness of the colored layer 40 is preferably 3 μm or more or 5 μm or more, and the upper limit of the thickness of the colored layer 40 is preferably 15 μm or less or 10 μm or less. For example, the thickness of the colored layer 40 is preferably 3 μm or more and 15 μm or less or 5 μm or more and 10 μm or less.

[0060] <<ICモジュール> > 2, the IC module 50 includes a flat substrate 51, external contact terminals 52 arranged on a front surface 51A of the substrate 51, an antenna connection terminal 53 arranged on a back surface 51B of the substrate 51, an IC chip 54 arranged on the back surface 51B of the substrate 51, a molded portion 55 that covers the IC chip 54, and wires 56 such as gold wires that electrically connect the antenna connection terminals 53 and the IC chip 54. Note that the wires that electrically connect the external contact terminals 52 and the IC chip 54 are not shown in the figure.

[0061] <Board, external contact terminals, and antenna connection terminals> The substrate 51 can be made of a flexible resin film such as glass epoxy resin or polyimide resin. The external contact terminals 52 and the antenna connection terminals 53 are made of patterned copper foil. Specifically, copper foil is provided on the front surface 51A and the back surface 51B of the substrate 51, and the copper foil is etched into a predetermined pattern to form the external contact terminals 52 and the antenna connection terminals 53. The substrate 51 is also provided with a plurality of through holes (not shown) in advance for wire bonding to the external contact terminals 52.

[0062] <ICチップ> The IC chip 54 is fixed via an adhesive (not shown) to the rear surface 51B of the substrate 51. Specifically, it is disposed in the center of the surface of the substrate 51 where the antenna connection terminal 53 is formed. The IC chip 54 includes a CPU for controlling both contact and contactless communication operations, storage devices such as RAM, EEPROM, and flash memory, and various circuits such as an interface circuit for decoding input signals and generating output signals for contact and contactless communication, and a power generation circuit.

[0063] <Molded part> The molded portion 55 is intended to protect the IC chip 54 and the wires 56 from external force loads and environmental loads. The molded portion 55 is made of an ultraviolet curable resin, a thermosetting resin, or the like.

[0064] <<Anisotropic Conductive Film>> The anisotropic conductive film 60 is disposed between the exposed terminal portion 32A of the antenna 30 and the antenna connection terminal 53 of the IC module 50, and is in contact with the terminal portion 32A and the antenna connection terminal 53.

[0065] According to this embodiment, at least a part of the terminal portion 32A of the antenna 30 is embedded in the colored layer 40. Therefore, when visually inspecting whether or not the antenna wire 31 constituting the terminal portion 32A has been broken, the colored layer 40 is present on the back surface of the terminal portion 32A. In addition, the color difference ΔE between the colored layer 40 and the terminal portion 32A of the antenna 30 is * ab1 is the color difference ΔE between the core layer 21 and the terminal portion 32A of the antenna 30 * ab2 and 20 or more, and the lightness L * is 20 or more, the visibility of the terminal portion 32A is improved compared to when at least a part of the terminal portion of the antenna is embedded in the core layer. This makes it easy to determine whether or not there is a break in the antenna wire 31 that constitutes the terminal portion 32A of the antenna 30.

[0066] When the terminal portion 32A of the antenna 30 is configured with a repeated folded structure as shown in FIG. 3, the antenna wires 31 that make up the terminal portion 32A are closely packed together, making it difficult to check whether or not there is a break in the antenna wires 31. However, according to this embodiment, since a colored layer 40 is present on the back surface of the terminal portion 32A, even if the terminal portion 32A of the antenna 30 has such a structure, it is easier to determine whether or not there is a break in the antenna wires 31 that make up the terminal portion 32A.

[0067] <<Dual Interface IC Card Manufacturing Method>> When manufacturing the dual interface IC card 10, first, a multi-faceted laminate 70 shown in Fig. 4 is prepared. The multi-faceted laminate 70 is formed by attaching two or more laminates 70A together as shown in Figs. 4 and 5. In this embodiment, the IC card 10 is manufactured using the multi-faceted laminate 70, but the IC card 10 may also be manufactured using the laminate 70A alone instead of the multi-faceted laminate 70.

[0068] As shown in Fig. 6, each laminate 70A is composed of a card base 20, an antenna 30, and a colored layer 40, similar to the IC card 10, but the card base 20 does not have a recess 20C. Also, as shown in Figs. 6 and 7, the terminal portion 32A of the antenna 30 and the colored layer 40 are present in a recess-planned region 20F, a portion of which will become the recess 20C after cutting. Note that the terminal portion 32A of the antenna 30 in the multi-surface laminate 70 and the laminate 70A is a portion that is exposed when the recess 20C is formed, and is not exposed in the multi-surface laminate 70 and the laminate 70A, but may be exposed in the multi-surface laminate 70 and the laminate 70A.

[0069] Each laminate 70A may be given a serial number, but when the serial number and the colored layer 40 described below are formed by a printing method, it is preferable to use the same ink to form the serial number as the ink to form the colored layer 40, in order to reduce the number of inks used by standardizing the ink.

[0070] The multi-surface laminate 70 can be obtained, for example, by the following manufacturing method: First, as shown in Fig. 8A, a colored layer 40 is formed by a printing method such as silk screen printing on at least the areas 21B corresponding to the respective antenna terminal portions on the surface 21A of the core layer 21 and the surrounding areas thereof.

[0071] 8B, the antenna 30 is partially embedded in the surface 21A of the core layer 21 and the surface 40A of the colored layer 40. Here, at least the terminal portion 32A of the antenna 30 is embedded in the colored layer 40. In this way, an antenna sheet 80 is formed in which two or more antennas 30 are attached to the core layer 21 and the colored layer 40.

[0072] 9A, the over-sheet layer 22, the core layer 23, the inner layer 24, the antenna sheet 80, the inner layer 25, the core layer 26, and the over-sheet layer 27 are stacked in this order in the thickness direction of the antenna sheet 80, specifically from the +Z direction side toward the −Z direction, to obtain a multi-surface laminate precursor 90. The antenna sheet 80 is positioned so that the antenna 30 faces the inner layer 24 side.

[0073] 9B, the multi-surface laminate precursor 90 is sandwiched between heat-press plates 100 such as stainless steel plates from above and below in the thickness direction, and the multi-surface laminate precursor 90 is heated and pressurized via the heat-press plates 100. By undergoing this heat-pressing process, an integrated multi-surface laminate 70 can be obtained. Furthermore, if any of the layers constituting the multi-surface laminate 70 is heat-resistant and does not heat-seal at a predetermined temperature, an adhesive sheet that heat-seals at a predetermined temperature can be sandwiched between the layers, or an adhesive can be applied, and then the layers can be subjected to the heat-pressing process to obtain the integrated multi-surface laminate 70.

[0074] After forming the multi-faceted laminate 70, laminates 70A are separated from the multi-faceted laminate 70. Then, first recesses 20D are formed along the outer periphery of the recess-planned region 20F of the card base 20 in the laminate 70A. Specifically, as shown in FIG. 10A, the card base 20 is cut from the surface 20A of the card base 20 in the depth direction of the card base 20 along the outer periphery of the recess-planned region 20F. This cutting of the card base 20 is continued until the terminal portions 32A are exposed.

[0075] 10B, a portion of the bottom surface 20D1 of the first recess 20D is further cut to form the second recess 20E. This cutting is performed so that the hole diameter of the second recess 20E is smaller than the hole diameter of the first recess 20D. This results in a card base 20 having a recess 20C consisting of the first recess 20D and the second recess 20E, and having a step between the bottom surfaces 20D1 and 20E1.

[0076] After forming the recess 20C in the card base 20, a visual inspection may be performed to check whether or not there is any break in the antenna wire 31 of the terminal portion 32A in the card base 20. After this visual inspection, if it is confirmed that there is no break in the antenna wire 31 of the terminal portion 32A in the card base 20, an anisotropic conductive film 60 is attached to the terminal portion 32A as shown in FIG.

[0077] 11B, the IC module 50 is placed in the recess 20C so that the antenna connection terminal 53 of the IC module 50 contacts the anisotropic conductive film 60 and the molded portion 55 is positioned in the second recess 20E. This electrically connects the IC module 50 and the antenna 30 via the anisotropic conductive film 60, and the dual interface IC card 10 is obtained. [Example]

[0078] In order to explain the present invention in detail, examples are given below, but the present invention is not limited to these descriptions.

[0079] Example 1 An adhesive white silkscreen printing ink (product name "VAHS White Conc. No. 1", manufactured by Showa Ink Co., Ltd.) was used to silkscreen print the areas on the surface of a core layer made of 0.36 mm thick ochre-colored polyvinyl chloride ("J6.2-Y (7556C)" manufactured by Jiangsu Huaxin New Materials Co., Ltd.) where each antenna terminal would be embedded, forming a 3 μm thick white colored layer.

[0080] Next, after forming the colored layer, an antenna was embedded in the core layer and the colored layer using a copper wire with a diameter of 0.11 mm to form an antenna sheet. The antenna terminal was embedded in the colored layer.

[0081] Then, a 50 μm thick transparent upper over-sheet ("M1009" manufactured by Taihei Chemical Products Co., Ltd.), a 120 μm thick upper core layer ("J6.2-Y(7556C)" manufactured by Jiangsu Huaxin New Materials Co., Ltd.), a 50 μm thick upper inner sheet ("M1009" manufactured by Taihei Chemical Products Co., Ltd.), the antenna sheet, a 50 μm thick lower inner sheet ("M1009" manufactured by Taihei Chemical Products Co., Ltd.), a 120 μm thick lower core layer ("J6.2-Y(7556C)" manufactured by Jiangsu Huaxin New Materials Co., Ltd.), and a 50 μm thick transparent lower over-sheet ("M1009" manufactured by Taihei Chemical Products Co., Ltd.) were arranged in this order to form a laminate precursor. In the laminate precursor, the antenna sheet was arranged so that the antenna was on the upper over-sheet side. The laminate precursor was then sandwiched between heat press plates, heated to 140° C., and pressed at 2 MPa to be integrated, thereby obtaining a laminate.

[0082] After obtaining the laminate, the laminate was removed from the heat press plate and punched out to obtain a laminate measuring 53.98 mm x 85.60 mm. The laminate was then cut from the upper oversheet side to expose the antenna terminal, thereby obtaining a laminate with an exposed antenna terminal. In the laminate with an exposed antenna terminal according to Example 1, the background of the antenna terminal was a white colored layer.

[0083] <Example 2> In Example 2, instead of the white colored layer, a red colored layer having a thickness of 3 μm was formed using an ink blended in a ratio of 55:120 between "SS 8-1003 Red" manufactured by Toyo Ink Co., Ltd. and "SS 8-121 Crimson" manufactured by Toyo Ink Co., Ltd. as the ink used for silk screen printing, and a laminate with an exposed antenna terminal was obtained by the same procedure as in Example 1. In the laminate with an exposed antenna terminal according to Example 2, the background of the antenna terminal was a red colored layer.

[0084] <Comparative Example 1> In Comparative Example 1, except that no colored layer was provided, a laminate with an exposed antenna terminal portion was obtained by the same procedure as in Example 1. In the laminate with an exposed antenna terminal portion according to Comparative Example 1, the background of the antenna terminal portion was the ochre-colored core layer.

[0085] <Comparative Example 2> In Comparative Example 2, a laminate with an exposed antenna terminal was obtained by the same procedure as in Example 1, except that a black colored layer with a thickness of 3 μm was formed using "SS 8-911 Black" manufactured by Toyo Ink Co., Ltd. as the ink used for silk screen printing instead of the white colored layer. In the laminate with an exposed antenna terminal according to Comparative Example 2, the background of the antenna terminal was a black colored layer.

[0086] <L * , a * , b * and color difference measurement> The L in the laminates in which the antenna terminal portion is exposed according to Examples 1 and 2 and Comparative Examples 1 to 3 (hereinafter referred to as "laminates") * a * b * The color tone of the color system was measured. * a * b * Color space L * , a * and b *Using a spectrophotometer ("eXact Standard NGH-XRX10" manufactured by X-Rite Inc.), light (D65 light source) was irradiated onto the surface of the colored layer in Examples 1 and 2 and Comparative Example 2, and the surface of the core layer in Comparative Example 1, at an incident angle of 10 degrees (the normal direction to the surface of the colored layer or core layer is set to 0 degrees), and measurements were taken at five points based on total reflected light (specular reflected light + diffuse reflected light). In addition, as a reference color, a copper plate made of the same material as the antenna used in the laminate was also similarly measured. * a * b * Color space L * , a * and b * The L of each color obtained by the measurement was * , a * , b * Using the average values ​​of each, ΔL was calculated using the copper plate value as the standard color. * , Δa * , Δb * and color difference ΔE * ab was calculated.

[0087] <Visibility evaluation> The laminates according to Examples 1 and 2 and Comparative Examples 1 and 2 were visually inspected for disconnection at the antenna terminals under fluorescent lighting of 1000 lux.

[0088] The results are shown in Tables 1 and 2 below. [Table 1]

[0089] [Table 2]

[0090] When comparing the laminate having a white colored layer according to Example 1 with the laminate having no colored layer according to Comparative Example 1, the visibility of the antenna terminal portion of the laminate according to Example 1 was good, while the visibility of the antenna terminal portion of the laminate according to Comparative Example 1 was poor. This is thought to be due to the color difference between the respective portions. Specifically, the color difference ΔE between the white colored layer and the antenna terminal portion in Example 1 * The large ab of 60.83 ensured good visibility of the antenna terminal, while the color difference ΔE between the ochre-colored core layer and the antenna terminal in Comparative Example 1 was * It can be determined that the visibility of the antenna terminal portion is poor because ab is small at 17.25. In Example 1, the color difference between the colored layer and the antenna terminal portion is larger than the color difference between the core layer and the antenna terminal portion, which is the color difference ΔE * ab is the color difference ΔE between the core layer and the antenna terminal portion in Comparative Example 1 * This can be confirmed by the fact that it is larger than ab.

[0091] When comparing the laminate of Example 1 having a white colored layer with the laminate of Comparative Example 2 having a black colored layer, the color difference between the colored layer and the antenna terminal portion is large in both cases, but the visibility of the antenna terminal portion of the laminate of Example 1 is good, whereas the visibility of the antenna terminal portion of the laminate of Comparative Example 2 is poor. * and b * Although there is not much difference in the values ​​of lightness L * There is a large difference between Example 1 and Comparative Example 2, with an average value of 92.42 and 7.67, respectively. Generally, the lower the lightness, i.e., the closer to black the color, the more light-absorbing the material is. Therefore, it is believed that the lower the lightness of the colored layer and the easier it is to absorb light, the lower the visibility of the antenna terminal. Conversely, if the lightness is above a certain value, light absorption can be suppressed, and the visibility of the antenna terminal can be ensured.

[0092] Furthermore, when comparing the laminate having a red colored layer according to Example 2 with the laminate having a black colored layer according to Comparative Example 2, the color difference was smaller in Example 2, but the visibility of the antenna terminal part in Example 2 was good. This can also be considered to be due to the lightness, and the lightness L * In Comparative Example 2, where the average value is 7.67, the visibility of the antenna terminal is poor, and the brightness L * It can be judged that Example 2, in which the average value is 31.77, has good visibility of the antenna terminal portion.

[0093] However, when comparing the laminate of Example 2 having a red colored layer with the laminate of Comparative Example 1 having an ochre core layer, the lightness L * The visibility of the antenna terminal portion was higher in Comparative Example 1 than in Example 2, whereas the visibility of the antenna terminal portion was better in Example 2 than in Comparative Example 1. * Visibility cannot be judged solely by brightness L * It can be determined that the visibility of the antenna terminal requires a value of 20 or more and a color difference of 20 or more. In Example 2, the color difference between the colored layer and the antenna terminal is larger than the color difference between the core layer and the antenna terminal. * ab is the color difference ΔE between the core layer and the antenna terminal portion in Comparative Example 1 * This can be confirmed by the fact that it is larger than ab. [Explanation of symbols]

[0094] 10...Dual interface IC card 20...Card base 21...Core layer 30...Antenna 31...Antenna wire 32A…Terminal section 40...Colored layer 50...IC module 70...Multi-surface laminate

Claims

1. A dual interface IC card capable of contact communication and contactless communication with an external device, a laminated card base having a recess on the surface and at least a core layer inside; an antenna disposed inside the card body and positioned closer to the surface than the core layer; a colored layer disposed inside the card base and in contact with the surface of the core layer on the front side; an IC module having an IC chip disposed in the recess, the antenna is made of an antenna wire, at least a part of which is embedded in the colored layer, and has a terminal portion exposed in the recess; a color difference between the colored layer and the terminal portion is greater than a color difference between the core layer and the terminal portion and is 20 or more; L in the colored layer ＊ a ＊ b ＊ Color system lightness L ＊ A dual interface IC card, wherein the number of times is 20 or more.

2. 2. The dual interface IC card according to claim 1, wherein said terminal portion is configured by a structure in which said antenna wire is repeatedly folded back from the outer periphery of said recess toward the center thereof.

3. 2. The dual interface IC card according to claim 1, wherein the core layer is colored.

4. 2. The dual interface IC card according to claim 1, wherein the core layer is chromatic, black, or gray.

5. 2. The dual interface IC card according to claim 1, wherein the colored layer is white.

6. An antenna sheet used in the manufacture of a dual interface IC card capable of contact communication and contactless communication with an external device, the dual interface IC card comprising: a laminated card base having a recess on its surface; an antenna disposed inside the card base; and an IC module having an IC chip disposed in the recess and electrically connected to the antenna, a laminated card base having a recess on the surface and at least a core layer inside; an antenna disposed inside the card body and positioned closer to the surface than the core layer; a colored layer disposed inside the card base and in contact with the surface of the core layer on the front side, the antenna is composed of an antenna wire, at least a part of which is embedded in the colored layer, and has a terminal portion for electrically connecting to an IC chip; a color difference between the colored layer and the terminal portion is greater than a color difference between the core layer and the terminal portion and is 20 or more; L in the colored layer ＊ a ＊ b ＊ Color system lightness L ＊ The antenna sheet has a value of 20 or more.

7. The antenna sheet according to claim 6 , wherein the core layer is colored.

8. The antenna sheet according to claim 6 , wherein the core layer is chromatic, black, or gray.

9. The antenna sheet according to claim 6 , wherein the colored layer is white.

10. A laminate comprising the antenna sheet according to claim 6 and at least one layer laminated on both sides of the antenna sheet in the thickness direction.

11. A multi-sided laminate comprising two or more laminates according to claim 10 attached to each other.

12. A method for manufacturing a dual interface IC card capable of contact communication and contactless communication with an external device, comprising: a step of preparing a laminate including a card base having a laminated structure with at least a core layer inside, an antenna disposed inside the card base and having a terminal portion constituted by an antenna wire, and a colored layer disposed inside the card base and in which at least a portion of the terminal portion is embedded; a step of cutting the card base to form a recess in which the terminal portion of the antenna is exposed and in which an IC module having an IC chip is to be placed; a step of electrically connecting the terminal portion of the antenna and the IC chip, and placing the IC module in the recess, the colored layer is in contact with the core layer, and is located closer to the front surface than the core layer, when the surface of the card base on which the recess is formed is defined as the front surface and the surface opposite to the front surface is defined as the back surface; a color difference between the colored layer and the terminal portion is greater than a color difference between the core layer and the terminal portion and is 20 or more; L in the colored layer ＊ a ＊ b ＊ Color system lightness L ＊ A method for manufacturing a dual interface IC card, wherein the number of times is 20 or more.

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