Composition, cured body, and display device

Abstract

To provide a composition capable of improving reliability of a display device.SOLUTION: Provided is a composition which contains a polymerizable compound (A) and a polymerization initiator (B), wherein a cured product of the composition has a storage elastic modulus E' of 0.5 to 5.0 GPa inclusive at 80°C when measured in a tensile mode with use of a dynamic viscoelasticity measurement device at a frequency of 1 Hz, for a measurement temperature range of 10°C to 200°C, at a heating rate of 2°C / min.SELECTED DRAWING: None

Description

[Technical Field]

[0001] The present invention relates to a composition, a cured product, and a display device. [Background technology]

[0002] BACKGROUND ART Display devices that include light-emitting diode elements and that are sealed with a sealant are known. Patent Document 1 discloses a technique relating to such sealants, for example.

[0003] Patent Document 1 describes a curable composition for inkjet coating and LED protection, which contains a first polyfunctional (meth)acrylate compound having a plurality of (meth)acryloyl groups and an aliphatic cyclic skeleton, a second polyfunctional (meth)acrylate compound having a plurality of (meth)acryloyl groups and an alkylene oxide skeleton, and a photopolymerization initiator, and which has a viscosity of 80 mPa·s or more and 2000 mPa·s or less at 25°C. According to the curable composition for inkjet coating and LED protection in Patent Document 1, when the curable composition is applied to at least one of the gaps between a plurality of LED chips and the tops of a plurality of LED chips by an inkjet method to form an LED protective layer, it is described that the shape of the edge portions of the applied object can be maintained in a good condition. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] International Publication No. 2022 / 050421 Summary of the Invention [Problem to be solved by the invention]

[0005] The present invention provides a composition capable of improving the reliability of a display device. [Means for solving the problem]

[0006] According to the present invention, there are provided a composition, a cured product, and a display device as shown below.

[0007] [1] 1. A composition comprising: Contains a polymerizable compound (A) and a polymerization initiator (B), A cured product of the composition has a storage modulus E' of 0.5 GPa or more and 5.0 GPa or less at 80°C when measured using a dynamic viscoelasticity measuring device at a frequency of 1 Hz, at a measurement temperature range of 10°C to 200°C, at a heating rate of 2°C / min in tensile mode. [2] The composition according to [1] above, wherein a cured product of the composition has a storage modulus E' at 25°C of 1.0 GPa or more and 10.0 GPa or less when measured using a dynamic viscoelasticity measuring device at a frequency of 1 Hz, at a measurement temperature range of 10°C to 200°C, at a heating rate of 2°C / min in tensile mode. [3] the polymerizable compound (A) contains a cationically polymerizable compound, The composition according to [1] or [2] above, wherein the polymerization initiator (B) includes a cationic polymerization initiator. [4] The composition according to [3] above, wherein the cationically polymerizable compound includes an epoxy compound. [5] The composition according to [4] above, wherein the epoxy compound includes an alicyclic epoxy compound. [6] The composition according to any one of [3] to [5] above, wherein the cationic polymerization initiator includes at least one selected from the group consisting of a photocationic polymerization initiator and a thermal cationic polymerization initiator. [7] the polymerizable compound (A) contains a radical polymerizable compound, The composition according to [1] or [2] above, wherein the polymerization initiator (B) includes a radical polymerization initiator. [8] The composition according to [7] above, wherein the radical polymerizable compound includes a (meth)acrylate. [9] The composition according to [7] or [8], wherein the radical polymerization initiator includes a photoradical polymerization initiator.

[10] The composition according to any one of the above [1] to [9], further comprising a cure retarder (C).

[11] The composition according to any one of [1] to

[10] above, wherein a cured product of the composition has a glass transition temperature of 70°C or higher when measured using a dynamic viscoelasticity measuring device at a frequency of 1 Hz, a heating rate of 2°C / min, and in a tensile mode.

[12] The composition according to any one of [1] to

[11] above, wherein a cured product of the composition has a refractive index at 25° C. and 589 nm of 1.45 or more and 1.70 or less.

[13] The composition according to any one of [1] to

[12] above, which is liquid at 25°C.

[14] The composition according to any one of [1] to

[13] above, wherein the viscosity of the composition is 1 mPa·s or more and 700 mPa·s or less, according to the following <Method 1>. <Method 1> Apparatus: Cone-plate type viscometer Temperature: 25℃ Cone: Radius 24mm, angle 0.8° Rotation speed: 250 rpm Sample volume: 0.5 mL Atmosphere: Atmospheric

[15] The composition according to any one of the above [1] to

[14] , which can be used for inkjet coating or dispenser coating.

[16] The composition according to

[15] above, which can be used for inkjet coating.

[17] The composition according to any one of [1] to

[16] above, wherein the cure shrinkage calculated by the following <Method 2> is 1.0% or more and 15.0% or less. <Method 2> The composition is filled into a pycnometer, and the liquid specific gravity is calculated by measuring the mass in the air and the mass in pure water. The specific gravity of the cured product is calculated by measuring the mass of a cured product made of the composition, 25 mm wide, 25 mm long, and 0.5 mm thick, in the air and in pure water, and the curing shrinkage is calculated using the formula: Cure shrinkage = ((specific gravity of cured product - liquid specific gravity) / specific gravity of cured product) x 100 (%).

[18] The composition according to any one of [1] to

[17] above, which has a static surface tension of 50 mN / m or less as measured by the pendant drop method.

[19] The composition according to any one of [1] to

[18] above, which can be used to encapsulate a micro LED.

[20] A cured product comprising a cured product of the composition according to any one of [1] to

[19] above. [twenty one] A display device comprising: a light-emitting diode element; a substrate; and a cured sealing layer between the light-emitting diode element and the substrate, the cured body according to

[20] . [twenty two] The display device according to

[21] , wherein the light-emitting diode elements include micro LEDs. [Effects of the Invention]

[0008] According to the present invention, it is possible to provide a composition that can improve the reliability of a display device. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, embodiments of the present invention will be described. Unless otherwise specified, the numerical range "A to B" represents A or more and B or less. In this embodiment, the term "(meth)acrylate" represents a concept that includes both acrylate and methacrylate. The same applies to similar terms such as "(meth)acrylic."

[0010] Display devices that include light-emitting diode elements sealed with a sealant are known, and some display devices are required to be reliable in high-temperature and high-humidity environments (e.g., 60°C and 90% RH). The present invention provides a composition capable of improving the reliability of a display device.

[0011] [Composition] The composition of the present embodiment contains a polymerizable compound (A) and a polymerization initiator (B), and the cured product of the composition has a storage modulus E' at 80°C of 0.5 GPa or more and 5.0 GPa or less.

[0012] The present inventors have found that, in a composition containing a polymerizable compound (A) and a polymerization initiator (B), the storage modulus E' at 80°C of a cured product of the composition is an effective design index for improving the reliability of display devices.

[0013] From the viewpoint of further improving the reliability of display devices, the storage modulus E' at 80°C of the cured product made from the composition of this embodiment is preferably 0.6 GPa or more and 4.5 GPa or less, more preferably 0.7 GPa or more and 4.0 GPa or less, even more preferably 0.8 GPa or more and 3.5 GPa or less, even more preferably 0.8 GPa or more and 3.0 GPa or less, and even more preferably 0.8 GPa or more and 2.8 GPa or less.

[0014] The storage modulus E' at 80°C of the cured product of the composition can be adjusted to a desired value, for example, by appropriately selecting the types of polymerizable compound (A) and polymerization initiator (B) and appropriately adjusting the content ratio of each component.

[0015] The storage modulus E' at 25°C of a cured product made from the composition of this embodiment is preferably 1.0 GPa or more and 10.0 GPa or less, more preferably 1.2 GPa or more and 8.0 GPa or less, even more preferably 1.3 GPa or more and 6.0 GPa or less, and even more preferably 1.5 GPa or more and 5.0 GPa or less.

[0016] From the viewpoint of further improving the reliability of display devices, the glass transition temperature of the cured product made from the composition of the present embodiment is preferably 70°C or higher, more preferably 73°C or higher, even more preferably 75°C or higher, even more preferably 78°C or higher, and even more preferably 80°C or higher. The upper limit is not particularly limited, but may be, for example, 200°C or lower, 180°C or lower, or 170°C or lower. From the viewpoint of further improving the reliability of display devices, the glass transition temperature of the cured product made from the composition of the present embodiment is preferably 70°C or higher and 200°C or lower, more preferably 73°C or higher and 180°C or lower, even more preferably 75°C or higher and 170°C or lower, even more preferably 78°C or higher and 170°C or lower, and even more preferably 80°C or higher and 170°C or lower.

[0017] The storage modulus E' at 80°C, storage modulus E' at 25°C, and glass transition temperature of a cured product made from the composition refer to values ​​obtained when measured using a dynamic viscoelasticity measuring device at a frequency of 1 Hz, in a measurement temperature range of 10°C to 200°C (the glass transition temperature is measured in a temperature range of 10°C or higher), at a heating rate of 2°C / min, and in tension mode.

[0018] The cured product of the composition of this embodiment means a cured product in a C-stage state. When the composition is a cationically polymerizable composition, the cured product of the composition can be cured by, for example, irradiating a 0.5 mm thick composition with ultraviolet light having a wavelength of 365 nm at a dose of 1500 mJ / cm using an LED lamp. 2 The cured product is obtained by irradiating the material so that the cured product becomes When the composition is a cationically polymerizable composition, a cured product of the composition can be produced, for example, by placing a silicone sheet mold having a thickness of 0.5 mm on a PET film, placing the composition in the mold, and sandwiching it between PET films. Next, the 0.5 mm thick composition is irradiated with ultraviolet light having a wavelength of 365 nm using an LED lamp at a dose of 1500 mJ / cm. 2 (100mW / cm 2and irradiation time: 15 seconds), followed by heating at 80° C. for 30 minutes to obtain a cured product made of the composition. When the composition is a radical polymerizable composition, the cured product of the composition can be cured by, for example, irradiating a 0.5 mm thick composition with ultraviolet light having a wavelength of 395 nm at a dose of 1500 mJ / cm using an LED lamp. 2 The term "cured product" refers to a cured product obtained by irradiating the material so as to obtain a cured product. When the composition is a radical polymerizable composition, a cured product of the composition can be produced, for example, by placing a silicone sheet mold having a thickness of 0.5 mm on a PET film, placing the composition in the mold, and sandwiching it between PET films. Next, using an LED lamp, ultraviolet light having a wavelength of 395 nm is irradiated onto the 0.5 mm thick composition at a dose of 1500 mJ / cm. 2 (100mW / cm 2 and irradiation time: 15 seconds) to obtain a cured product made of the composition. Hereinafter, the "cured product of the composition" in the measurement of other physical properties is the same as the cured product of the composition described in this paragraph, unless otherwise specified.

[0019] The refractive index at 25°C and 589 nm of a cured product made from the composition of the present embodiment is preferably 1.45 or more and 1.70 or less, more preferably 1.46 or more and 1.65 or less, even more preferably 1.47 or more and 1.60 or less, and even more preferably 1.48 or more and 1.57 or less, from the viewpoint of more efficiently extracting light from an organic EL display element or an LED element. The refractive index at 25° C. and 589 nm means a value measured with an Abbe refractometer.

[0020] The composition of this embodiment may be liquid at 25°C or solid at 25°C, but is preferably liquid at 25°C.

[0021] From the viewpoint of further improving the performance balance between the coatability of the composition to a substrate or the like and the dischargeability during coating, the viscosity of the composition of this embodiment according to <Method 1> is preferably from 1 mPa·s to 700 mPa·s, more preferably from 3 mPa·s to 500 mPa·s, even more preferably from 5 mPa·s to 300 mPa·s, even more preferably from 7 mPa·s to 100 mPa·s, and even more preferably from 10 mPa·s to 50 mPa·s.

[0022] <Method 1> Apparatus: Cone-plate type viscometer Temperature: 25℃ Cone: Radius 24mm, angle 0.8° Rotation speed: 250 rpm Sample volume: 0.5 mL Atmosphere: Atmospheric

[0023] The cure shrinkage of the composition of this embodiment calculated by <Method 2> is preferably 1.0% or more and 15.0% or less, more preferably 2.0% or more and 12.0% or less, and even more preferably 3.0% or more and 10.0% or less.

[0024] <Method 2> The composition is filled into a pycnometer, and the liquid specific gravity is calculated by measuring the mass in the air and in pure water. The specific gravity of the cured product is calculated by measuring the mass of a cured product made of the composition, 25 mm wide, 25 mm long, and 0.5 mm thick, in the air and in pure water, and the curing shrinkage is calculated using the formula: Cure shrinkage = ((specific gravity of cured product - liquid specific gravity) / specific gravity of cured product) x 100 (%).

[0025] The static surface tension of the composition of the present embodiment, as measured by the pendant drop method, is preferably 50 mN / m or less, more preferably 45 mN / m or less, and even more preferably 40 mN / m or less, from the viewpoint of further improving the applicability of the composition to a substrate or the like. The lower limit is not particularly limited, but may be, for example, 10 mN / m or more, 20 mN / m or more, or 25 mN / m or more. The static surface tension of the composition of the present embodiment, as measured by the pendant drop method, is preferably 10 mN / m or more and 50 mN / m or less, more preferably 20 mN / m or more and 45 mN / m or less, and even more preferably 25 mN / m or more and 40 mN / m or less, from the viewpoint of further improving the coatability of the composition to a substrate or the like. The pendant drop method is a method in which a liquid is pushed out from the tip of a tube and the surface tension is calculated from the shape of the pendant drop that hangs down.

[0026] Each of the components of the composition of this embodiment will be specifically described below.

[0027] <Polymerizable compound (A)> The composition of the present embodiment contains a polymerizable compound (A). The polymerizable compound (A) is a compound having a polymerizable group. The polymerizable group is not particularly limited, and examples thereof include a cationically polymerizable group, a radically polymerizable group, and an anionically polymerizable group. The polymerizable compound (A) may be a compound containing one polymerizable group in the molecule, or may be a compound containing two or more polymerizable groups in the molecule. From the viewpoint of further improving the heat resistance of a cured product made from the composition, the polymerizable compound (A) is preferably a compound containing two or more polymerizable groups in the molecule, and more preferably a compound containing two polymerizable groups in the molecule.

[0028] The polymerizable compound (A) preferably contains a bromine atom from the viewpoint of further improving the coatability of the composition onto a substrate, etc. Here, the polymerizable compound (A) containing a bromine atom means that the polymerizable compound (A) contains a bromine atom.

[0029] The polymerizable compound (A) preferably contains a cationically polymerizable compound.

[0030] The cationically polymerizable compound is not particularly limited, and includes, for example, at least one selected from the group consisting of epoxy compounds and oxetane compounds, and preferably includes an epoxy compound. The epoxy compound may be a compound containing one epoxy group in the molecule, or a compound containing two or more epoxy groups in the molecule. From the viewpoint of further improving the heat resistance of a cured product made from the composition, the epoxy compound is preferably a compound containing two or more epoxy groups in the molecule, and more preferably a compound containing two epoxy groups in the molecule.

[0031] The epoxy compound includes, for example, at least one selected from the group consisting of an alicyclic epoxy compound, an epoxy compound containing an aromatic group in the molecule, and a compound containing a glycidyl ether group, and preferably includes an alicyclic epoxy compound.

[0032] The alicyclic epoxy compound is a compound containing an epoxy group and an alicyclic group in the molecule. The alicyclic epoxy compound may be a compound containing one epoxy group in the molecule, or a compound containing two or more epoxy groups in the molecule, but is preferably a compound containing two or more epoxy groups in the molecule, and more preferably a compound containing two epoxy groups in the molecule.

[0033] Examples of the alicyclic epoxy compound include a compound obtained by epoxidizing a compound having a cycloalkene ring or a derivative thereof, and a compound obtained by hydrogenating a compound having an epoxy group and an aromatic ring or a derivative thereof.

[0034] The compound or its derivative obtained by epoxidizing a compound having a cycloalkene ring includes, for example, at least one selected from the group consisting of 3',4'-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, 3,4-epoxycyclohexylalkyl(meth)acrylate (e.g., 3,4-epoxycyclohexylmethyl(meth)acrylate), and (3,3',4,4'-diepoxy)bicyclohexyl.

[0035] The compound obtained by hydrogenating a compound having an epoxy group and an aromatic ring or a derivative thereof includes, for example, at least one selected from the group consisting of hydrogenated bisphenol A epoxy resins and hydrogenated bisphenol F epoxy resins.

[0036] The alicyclic epoxy compound is preferably a compound having a 1,2-epoxycyclohexane structure. The compound having a 1,2-epoxycyclohexane structure is preferably a compound represented by formula (A1-1).

[0037] [ka]

[0038] In formula (A1-1), X represents a single bond or a linking group (a divalent group having one or more atoms), and is preferably a linking group.

[0039] When X is a single bond, the compound represented by formula (A1-1) is (3,3',4,4'-diepoxy)bicyclohexyl.

[0040] The linking group may be, for example, a divalent hydrocarbon group, a carbonyl group, an ether bond, an ester bond, a carbonate group, an amide bond, or a group in which multiple of these are linked together, preferably a group having an ester bond, and more preferably a group in which an ester bond and a divalent hydrocarbon group are linked together. The divalent hydrocarbon group is preferably an alkanediyl group, more preferably an alkanediyl group having 1 to 3 carbon atoms. When X is a group having an ester bond as a linking group, examples of the compound represented by formula (A1-1) include 3',4'-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate.

[0041] The compound represented by formula (A1-1) preferably includes at least one selected from the group consisting of 3',4'-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate and (3,3',4,4'-diepoxy)bicyclohexyl, and more preferably includes 3',4'-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate.

[0042] The epoxy compound containing an aromatic group in the molecule may be a compound containing one epoxy group in the molecule, or a compound containing two or more epoxy groups in the molecule, but is preferably a compound containing two or more epoxy groups in the molecule, and more preferably a compound containing two epoxy groups in the molecule. The epoxy compound containing an aromatic group in the molecule may be a compound containing no alicyclic group.

[0043] The epoxy compound containing an aromatic group in the molecule may be any of a monomer, an oligomer, or a polymer. The epoxy compound containing an aromatic group in the molecule preferably includes at least one selected from the group consisting of compounds having a bisphenol structure (e.g., bisphenol A structure, bisphenol F structure, bisphenol S structure, etc.) and bromine atom-containing aromatic epoxy compounds, more preferably includes at least one selected from the group consisting of bisphenol A type epoxy resins, bisphenol F type epoxy resins, and halophenyl glycidyl ethers, and even more preferably includes at least one selected from the group consisting of bisphenol A type epoxy resins, bisphenol F type epoxy resins, and dibromophenyl glycidyl ethers.

[0044] The compound containing a glycidyl ether group may be a compound containing one epoxy group in the molecule, or a compound containing two or more epoxy groups in the molecule, but is preferably a compound containing two or more epoxy groups in the molecule, and more preferably a compound containing two epoxy groups in the molecule. The compound containing a glycidyl ether group may be a compound containing no alicyclic group or aromatic ring.

[0045] The compound containing a glycidyl ether group preferably includes a diglycidyl ether compound. From the viewpoint of further improving the coatability of the composition to a substrate or the like, the diglycidyl ether compound preferably includes at least one selected from the group consisting of diglycidyl ethers of alkylene glycols, such as diglycidyl ether of ethylene glycol, diglycidyl ether of propylene glycol, diglycidyl ether of 1,6-hexanediol, and diglycidyl ether of neopentyl glycol; polyglycidyl ethers of polyhydric alcohols, such as di- or triglycidyl ethers of glycerin or an alkylene oxide adduct thereof; and diglycidyl ethers of polyalkylene glycols, such as diglycidyl ethers of polyethylene glycol or an alkylene oxide adduct thereof, and diglycidyl ethers of polypropylene glycol or an alkylene oxide adduct thereof, and more preferably includes a diglycidyl ether of an alkylene glycol. The diglycidyl ether of alkylene glycol preferably includes at least one selected from the group consisting of diglycidyl ether of ethylene glycol, diglycidyl ether of propylene glycol, diglycidyl ether of 1,6-hexanediol, and diglycidyl ether of neopentyl glycol, and more preferably includes one or two selected from the group consisting of diglycidyl ether of 1,6-hexanediol and diglycidyl ether of neopentyl glycol.

[0046] The content of the cationically polymerizable compound in the composition of this embodiment may be, for example, 50 parts by mass or more and 100 parts by mass or less, 70 parts by mass or more and 100 parts by mass or less, or 90 parts by mass or more and 100 parts by mass or less, when the content of the polymerizable compound (A) in the composition of this embodiment is taken as 100 parts by mass.

[0047] The content of the epoxy compound in the composition of the present embodiment may be, for example, 50 parts by mass or more and 100 parts by mass or less, 70 parts by mass or more and 100 parts by mass or less, or 90 parts by mass or more and 100 parts by mass or less, when the content of the polymerizable compound (A) in the composition of the present embodiment is taken as 100 parts by mass.

[0048] The content of the alicyclic epoxy compound in the composition of the present embodiment may be, for example, 5 parts by mass or more and 100 parts by mass or less, 10 parts by mass or more and 80 parts by mass or less, or 15 parts by mass or more and 30 parts by mass or less, relative to 100 parts by mass of the polymerizable compound (A) in the composition of the present embodiment.

[0049] The content of the aromatic epoxy compound in the composition of the present embodiment may be, for example, 5 parts by mass or more and 50 parts by mass or less, 10 parts by mass or more and 20 parts by mass or less, or 15 parts by mass or more and 30 parts by mass or less, relative to 100 parts by mass of the polymerizable compound (A) in the composition of the present embodiment.

[0050] The content of the compound containing a glycidyl ether group in the composition of the present embodiment may be, for example, 5 parts by mass or more and 95 parts by mass or less, 10 parts by mass or more and 90 parts by mass or less, or 20 parts by mass or more and 80 parts by mass or less, relative to 100 parts by mass of the polymerizable compound (A) in the composition of the present embodiment.

[0051] The polymerizable compound (A) preferably includes a radically polymerizable compound.

[0052] The radical polymerizable compound is not particularly limited, but preferably contains a (meth)acrylate.

[0053] The (meth)acrylate may contain a monofunctional (meth)acrylate or a polyfunctional (meth)acrylate, but preferably contains a polyfunctional (meth)acrylate from the viewpoint of further improving the heat resistance of a cured product made from the composition. Here, the polyfunctional (meth)acrylate means a compound containing two or more (meth)acryloyl groups in the molecule.

[0054] The polyfunctional (meth)acrylate is preferably a compound containing 2 to 6 (meth)acryloyl groups, more preferably a compound containing 2 to 4 (meth)acryloyl groups, and even more preferably a compound containing 2 (meth)acryloyl groups.

[0055] The (meth)acrylate includes, for example, at least one selected from the group consisting of (meth)acrylates containing an alicyclic structure in the molecule, (meth)acrylates containing an aromatic group in the molecule, and acyclic (meth)acrylates, and preferably includes a (meth)acrylate containing an alicyclic structure in the molecule.

[0056] A (meth)acrylate containing an alicyclic structure in the molecule is a compound containing a (meth)acryloyl group and an alicyclic group. The alicyclic group includes at least one selected from the group consisting of groups having a dicyclopentadiene skeleton, such as a dicyclopentanyl group or a dicyclopentenyl group; a cyclohexyl group; an isobornyl group; a cyclodecatriene group; a norbornyl group; an adamantyl group; and a tricyclodecane group, and preferably includes a group having one or two skeletons selected from the group consisting of a dicyclopentadiene skeleton and a tricyclodecane skeleton.

[0057] The (meth)acrylate containing an alicyclic structure in the molecule includes, for example, at least one selected from the group consisting of tricyclodecane dimethanol di(meth)acrylate, dicyclopentanyloxyethyl (meth)acrylate, dicyclopentenyl (meth)acrylate, dicyclopentenyloxyethyl (meth)acrylate, etc., and preferably includes tricyclodecane dimethanol di(meth)acrylate.

[0058] The (meth)acrylate containing an alicyclic structure in the molecule may be a monofunctional (meth)acrylate or a polyfunctional (meth)acrylate, but is preferably a polyfunctional (meth)acrylate, and more preferably a bifunctional (meth)acrylate.

[0059] The (meth)acrylate containing an aromatic group in the molecule includes, for example, at least one selected from the group consisting of ethoxylated bisphenol A di(meth)acrylate, ethoxylated-o-phenylphenol (meth)acrylate, m-phenoxybenzyl (meth)acrylate, etc., and preferably includes ethoxylated bisphenol A di(meth)acrylate.

[0060] The (meth)acrylate containing an aromatic group in the molecule may be a monofunctional (meth)acrylate or a polyfunctional (meth)acrylate, but is preferably a polyfunctional (meth)acrylate, and more preferably a bifunctional (meth)acrylate.

[0061] The acyclic (meth)acrylate includes, for example, at least one selected from the group consisting of 1,6-hexadiol di(meth)acrylate, 1,9-nonanediol di(meth)acrylate, 1,10-decanediol di(meth)acrylate, 1,12-dodecanediol di(meth)acrylate, methoxydiethylene glycol (meth)acrylate, and the like, and preferably includes 1,12-dodecanediol di(meth)acrylate.

[0062] The acyclic (meth)acrylate may be a monofunctional (meth)acrylate or a polyfunctional (meth)acrylate, but is preferably a polyfunctional (meth)acrylate, and more preferably a difunctional (meth)acrylate.

[0063] The content of the radical polymerizable compound in the composition of this embodiment may be, for example, 50 parts by mass or more and 100 parts by mass or less, 70 parts by mass or more and 100 parts by mass or less, or 90 parts by mass or more and 100 parts by mass or less, when the content of the polymerizable compound (A) in the composition of this embodiment is taken as 100 parts by mass.

[0064] The content of the (meth)acrylate in the composition of the present embodiment may be, for example, 50 parts by mass or more and 100 parts by mass or less, 70 parts by mass or more and 100 parts by mass or less, or 90 parts by mass or more and 100 parts by mass or less, when the content of the polymerizable compound (A) in the composition of the present embodiment is taken as 100 parts by mass.

[0065] The content of the polyfunctional (meth)acrylate in the composition of the present embodiment may be, for example, 50 parts by mass or more and 100 parts by mass or less, 70 parts by mass or more and 100 parts by mass or less, or 90 parts by mass or more and 100 parts by mass or less, when the content of the polymerizable compound (A) in the composition of the present embodiment is taken as 100 parts by mass.

[0066] The content of the (meth)acrylate having an alicyclic structure in the molecule in the composition of the present embodiment may be, for example, 5 parts by mass or more and 100 parts by mass or less, 10 parts by mass or more and 80 parts by mass or less, or 20 parts by mass or more and 50 parts by mass or less, relative to 100 parts by mass of the polymerizable compound (A) in the composition of the present embodiment.

[0067] The content of the (meth)acrylate containing an aromatic group in the molecule in the composition of the present embodiment may be, for example, 1 part by mass or more and 50 parts by mass or less, or 3 parts by mass or more and 30 parts by mass or less, when the content of the polymerizable compound (A) in the composition of the present embodiment is taken as 100 parts by mass.

[0068] The amount of the acyclic (meth)acrylate in the composition of the present embodiment may be, for example, 50 parts by mass or more and 90 parts by mass or less, or 60 parts by mass or more and 80 parts by mass or less, relative to 100 parts by mass of the polymerizable compound (A) in the composition of the present embodiment.

[0069] The polymerizable compound (A) may be a single polymerizable compound, or two or more polymerizable compounds may be used in combination.

[0070] <Polymerization initiator (B)> The composition of the present embodiment contains a polymerization initiator (B). The polymerization initiator (B) is not particularly limited as long as it can initiate the polymerization reaction of the polymerizable compound (A). The polymerization initiator (B) may contain a photopolymerization initiator that can be activated by light to initiate the polymerization reaction of the polymerizable compound (A), or may contain a thermal polymerization initiator that can be activated by heat to initiate the polymerization reaction of the polymerizable compound (A).

[0071] In the composition of the present embodiment, the polymerizable compound (A) preferably includes a cationically polymerizable compound, and the polymerization initiator (B) preferably includes a cationic polymerization initiator.

[0072] The cationic polymerization initiator includes, for example, at least one selected from the group consisting of a photocationic polymerization initiator and a thermal cationic polymerization initiator, and more preferably includes a photocationic polymerization initiator.

[0073] Examples of the photocationic polymerization initiator include arylsulfonium salt derivatives (e.g., Cyracure UVI-6990 and Cyracure UVI-6974 manufactured by The Dow Chemical Company; Adeka Optomer SP-150, Adeka Optomer SP-152, Adeka Optomer SP-170, and Adeka Optomer SP-172 manufactured by ADEKA Corporation; CPI-100P, CPI-101A, CPI-200K, CPI-210S, CPI-310FG, and LW-S1 manufactured by San-Apro Co., Ltd.; and arylsulfonium salt derivatives (e.g., Cyracure UVI-6990 and Cyracure UVI-6974 manufactured by The Dow Chemical Company; Adeka Optomer SP-150, Adeka Optomer SP-152, Adeka Optomer SP-170, and Adeka Optomer SP-172 manufactured by San-Apro Co., Ltd.; and CPI-100P, CPI-101A, CPI-200K, CPI-210S, CPI-310FG, and LW-S1 manufactured by Double Bond Co., Ltd.). The initiator includes at least one selected from the group consisting of an acid generator such as a hydroxybenzoate (CibaCure-1190 manufactured by Ciba Specialty Chemicals, etc.), an aryl iodonium salt derivative (e.g., Irgacure 250 manufactured by Ciba Specialty Chemicals, RP-2074 manufactured by Rhodia Japan, etc.), an allene-ion complex derivative, a diazonium salt derivative, a triazine initiator, or another halide, and preferably includes an aryl sulfonium salt derivative, more preferably includes a triaryl sulfonium salt derivative.

[0074] Examples of the thermal cationic polymerization initiator include onium salt compounds such as quaternary ammonium salts, phosphonium salts, and sulfonium salts. Commercially available thermal cationic polymerization initiators include, for example, Adeka Opton CP-66 and Adeka Opton CP-77 (manufactured by ADEKA Corporation), San-Aid SI-60L, San-Aid SI-80L, and San-Aid SI-100L (manufactured by Sanshin Chemical Industry Co., Ltd.), and the CI series (manufactured by Nippon Soda Co., Ltd.).

[0075] In the composition of the present embodiment, the polymerizable compound (A) preferably includes a radically polymerizable compound, and the polymerization initiator (B) preferably includes a radical polymerization initiator.

[0076] The radical polymerization initiator includes, for example, at least one selected from the group consisting of a photoradical polymerization initiator and a thermal radical polymerization initiator, and preferably includes a photoradical polymerization initiator.

[0077] The photoradical polymerization initiator includes at least one selected from the group consisting of, for example, benzophenone and its derivatives, benzil and its derivatives, enthraquinone and its derivatives, acetophenone derivatives, thioxanthone and its derivatives, camphorquinone derivatives, α-aminoalkylphenone derivatives, and acylphosphine oxide derivatives, and preferably includes an acylphosphine oxide derivative.

[0078] The acylphosphine oxide derivative includes at least one selected from the group consisting of, for example, benzoyldiphenylphosphine oxide, 2,4,6-trimethylbenzoyldiphenylphosphine oxide, benzoyldiethoxyphosphine oxide, 2,4,6-trimethylbenzoyldimethoxyphenylphosphine oxide, 2,4,6-trimethylbenzoyldiethoxyphenylphosphine oxide, bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide, and ethyl-2,4,6-trimethylbenzoylphenylphosphinate, and preferably includes at least one selected from the group consisting of 2,4,6-trimethylbenzoyldiphenylphosphine oxide and ethyl-2,4,6-trimethylbenzoylphenylphosphinate.

[0079] The content of the polymerization initiator (B) in the composition of the present embodiment is preferably 0.01 parts by mass or more and 10 parts by mass or less, more preferably 0.05 parts by mass or more and 8 parts by mass or less, and even more preferably 0.1 parts by mass or more and 6 parts by mass or less, from the viewpoint of further improving the curability of the composition and further improving the transparency of a cured product made from the composition, when the content of the polymerizable compound (A) in the composition of the present embodiment is taken as 100 parts by mass.

[0080] The content of the cationic polymerization initiator in the composition of the present embodiment is preferably 0.01 parts by mass or more, more preferably 0.05 parts by mass or more, and even more preferably 0.1 parts by mass or more, from the viewpoint of further improving the curability of the composition, when the content of the polymerizable compound (A) in the composition of the present embodiment is taken as 100 parts by mass, and is preferably 5 parts by mass or less, more preferably 3 parts by mass or less, and even more preferably 1 part by mass or less, from the viewpoint of further improving the transparency of a cured product made from the composition. The content of the cationic polymerization initiator in the composition of the present embodiment is preferably 0.01 parts by mass or more and 5 parts by mass or less, more preferably 0.05 parts by mass or more and 3 parts by mass or less, and even more preferably 0.1 parts by mass or more and 1 part by mass or less, from the viewpoint of further improving the curability of the composition and further improving the transparency of a cured product made from the composition, when the content of the polymerizable compound (A) in the composition of the present embodiment is taken as 100 parts by mass.

[0081] The content of the radical polymerization initiator in the composition of the present embodiment is preferably 0.5 parts by mass or more, more preferably 1 part by mass or more, and even more preferably 2 parts by mass or more, from the viewpoint of further improving the curability of the composition, when the content of the polymerizable compound (A) in the composition of the present embodiment is taken as 100 parts by mass, and from the viewpoint of further improving the transparency of the cured product made from the composition, it is preferably 10 parts by mass or less, more preferably 8 parts by mass or less, and even more preferably 6 parts by mass or less. The content of the radical polymerization initiator in the composition of the present embodiment is preferably 0.5 parts by mass or more and 10 parts by mass or less, more preferably 1 part by mass or more and 8 parts by mass or less, and even more preferably 2 parts by mass or more and 6 parts by mass or less, from the viewpoint of further improving the curability of the composition and further improving the transparency of a cured product made from the composition, when the content of the polymerizable compound (A) in the composition of the present embodiment is taken as 100 parts by mass.

[0082] The polymerization initiator (B) may be a single polymerization initiator, or two or more polymerization initiators may be used in combination.

[0083] <Cure retarder (C)> The composition of the present embodiment preferably further contains a cure retarder (C) from the viewpoint of extending the usable life of the composition.

[0084] The cure retarder (C) is not particularly limited, but preferably includes at least one selected from the group consisting of phosphoric acid-based cure retarders, ether-based cure retarders, thioether-based cure retarders, metal complex-based cure retarders, and nitroxy radical-based cure retarders, and more preferably includes at least one selected from the group consisting of phosphoric acid-based cure retarders and ether-based cure retarders.

[0085] The phosphoric acid-based set retarder is a set retarder selected from the group consisting of phosphate esters and phosphites. The phosphoric acid-based set retarder preferably comprises a phosphoric acid ester.

[0086] Examples of the phosphate ester include diethylbenzyl phosphate, trimethyl phosphate, triethyl phosphate, tri-n-butyl phosphate, tris(butoxyethyl)phosphate, tris(2-ethylhexyl)phosphate, (RO)3P=O (wherein R is a lauryl group, a cetyl group, a stearyl group, or an oleyl group), tris(2-chloroethyl)phosphate, tris(2-dichloropropyl)phosphate, triphenyl phosphate, butyl pyrophosphate, tricresyl phosphate, trixylenyl phosphate, octyl diphenyl phosphate, cresyl diphenyl phosphate, xylenyl diphosphate, monomethyl phosphate, diethyl ... The phosphate buffer solution may include at least one selected from the group consisting of mono-n-butyl phosphate, dibutyl phosphate, di-2-ethylhexyl phosphate, monoisodecyl phosphate, ammonium ethyl acid phosphate, 2-ethylhexyl acid phosphate salts, etc., preferably at least one selected from the group consisting of triethyl phosphate, tri-n-butyl phosphate, tris(butoxyethyl) phosphate, tris(2-ethylhexyl) phosphate, and (RO)3P=O (R is a lauryl group, a cetyl group, a stearyl group, or an oleyl group), more preferably tris(2-ethylhexyl) phosphate.

[0087] The phosphite ester includes, for example, at least one selected from the group consisting of trimethyl phosphite, triethyl phosphite, tri-n-butyl phosphite, tris(2-ethylhexyl) phosphite, triisooctyl phosphite, tridecyl phosphite, triisodecyl phosphite, tris(tridecyl) phosphite, trioleyl phosphite, tristearyl phosphite, triphenyl phosphite, and tris(nonylphenyl) phosphite.

[0088] The ether-based cure retarder is a cure retarder having an ether bond. The ether-based cure retarder may contain a chain ether or a cyclic ether. From the viewpoint of appropriate reactivity with cations, the ether-based cure retarder preferably contains a cyclic ether, more preferably contains a crown ether, and even more preferably contains 18-crown ether-6.

[0089] The content of the cure retarder (C) in the composition of the present embodiment, relative to 100 parts by mass of the polymerizable compound (A) in the composition of the present embodiment, is preferably 0.10 parts by mass or more, more preferably 0.20 parts by mass or more, and even more preferably 0.30 parts by mass or more, from the viewpoint of extending the usable life of the composition, and is preferably 10.0 parts by mass or less, more preferably 5.0 parts by mass or less, and even more preferably 2.0 parts by mass or less, from the viewpoint of further improving the moisture resistance of a cured product made from the composition. The content of the curing retarder (C) in the composition of the present embodiment is preferably 0.10 parts by mass or more and 10.0 parts by mass or less, more preferably 0.20 parts by mass or more and 5.0 parts by mass or less, and even more preferably 0.30 parts by mass or more and 2.0 parts by mass or less, from the viewpoint of extending the usable life of the composition and further improving the moisture resistance of a cured product made from the composition, when the content of the polymerizable compound (A) in the composition of the present embodiment is taken as 100 parts by mass.

[0090] The set retarder (C) preferably includes a phosphoric acid-based set retarder and an ether-based set retarder. The mass ratio of the content of the phosphoric acid-based cure retarder in the cure retarder (C) to the content of the ether-based cure retarder in the cure retarder (C) is preferably 0.001 or more, more preferably 0.003 or more, and even more preferably 0.005 or more, from the viewpoint of further improving the coatability of the composition to a substrate, etc., and is preferably 2.0 or less, more preferably 1.0 or less, and even more preferably 0.5 or less, from the viewpoint of further improving the moisture resistance of a cured product made from the composition. The mass ratio of the content of the phosphoric acid-based cure retarder in the cure retarder (C) to the content of the ether-based cure retarder in the cure retarder (C) is preferably 0.001 or more and 2.0 or less, more preferably 0.003 or more and 1.0 or less, and even more preferably 0.005 or more and 0.5 or less, from the viewpoint of further improving the coatability of the composition to a substrate or the like and further improving the moisture resistance of a cured product made from the composition.

[0091] The curing retarder (C) may be a single curing retarder or a combination of two or more curing retarders.

[0092] <Leveling agent> The composition of the present embodiment may further contain a leveling agent from the viewpoint of further improving the applicability of the composition to a substrate or the like. Examples of the leveling agent include acrylic leveling agents and silicone leveling agents, and among these, acrylic leveling agents are preferred.

[0093] The content of the leveling agent in the composition of the present embodiment may be, for example, 0.005 parts by mass or more and 1 part by mass or less, or 0.01 parts by mass or more and 0.1 parts by mass or less, when the content of the polymerizable compound (A) in the composition of the present embodiment is taken as 100 parts by mass.

[0094] The leveling agent may be a single leveling agent, or two or more leveling agents may be used in combination.

[0095] <Other ingredients> The composition of the present embodiment may further contain other components. Examples of other components include photosensitizers, silane coupling agents, antioxidants, inorganic fillers, resin particles, metal deactivators, bulking agents, stabilizers, neutralizing agents, lubricants, and antibacterial agents. The other components may be contained in appropriate amounts.

[0096] The total content of the polymerizable compound (A) and the polymerization initiator (B) in the composition of the present embodiment is preferably 60% by mass or more and 100% by mass or less, more preferably 70% by mass or more and 100% by mass or less, even more preferably 80% by mass or more and 100% by mass or less, even more preferably 90% by mass or more and 100% by mass or less, and even more preferably 95% by mass or more and 100% by mass or less, when the entire composition of the present embodiment is taken as 100% by mass.

[0097] [Use of the composition] The composition of the present embodiment is preferably a composition that can be used to encapsulate a light-emitting diode device, and more preferably a composition that can be used to encapsulate a micro LED.

[0098] The composition of the present embodiment is preferably a composition that can be used for inkjet coating or dispenser coating, and more preferably a composition that can be used for inkjet coating.

[0099] [Method of producing the composition] The composition of the present embodiment can be produced, for example, by thoroughly mixing the components. The method for mixing the components is not particularly limited, but examples thereof include a stirring method that utilizes the stirring force associated with the rotation of a propeller, and a method that utilizes a conventional dispersing machine such as a planetary stirrer that revolves around its axis.

[0100] [Cured body] The cured product of this embodiment includes a cured product made of the composition of this embodiment. The cured product of this embodiment is preferably a cured product that can be used as a cured sealing layer of a display device.

[0101] The method for obtaining the cured product of this embodiment is not particularly limited, and examples thereof include a method in which the cured product is obtained by irradiating the composition of this embodiment with light. In order to further accelerate the curing reaction, the composition may be heated after light irradiation.

[0102] The light source for irradiating the composition of the present embodiment with light is not particularly limited, and examples thereof include a halogen lamp, a metal halide lamp, a high-power metal halide lamp (containing indium or the like), a low-pressure mercury lamp, a high-pressure mercury lamp, an ultra-high-pressure mercury lamp, a xenon lamp, a xenon excimer lamp, a xenon flash lamp, and an LED.

[0103] The above light sources have different radiation wavelengths and energy distributions. Therefore, the light source can be appropriately selected depending on the reaction wavelength of the photopolymerization initiator. Natural light (sunlight) can also be used as a light source to initiate the reaction of the sealant.

[0104] The irradiation method may be direct irradiation, focused irradiation using a reflecting mirror or the like, or focused irradiation using a fiber or the like. Irradiation may also be carried out using a low wavelength cut filter, a heat ray cut filter, a cold mirror, or the like.

[0105] The amount of light irradiation is not particularly limited and may be adjusted appropriately depending on the thickness of the coating film of the composition, etc. The amount of light irradiation is, for example, 50 mJ / cm 2 More than 20000mJ / cm 2 may be less than or equal to 100 mJ / cm 2 More than 10000mJ / cm 2 The following is the result.

[0106] [Display device] The display device of this embodiment includes a light-emitting diode element, a substrate, and a cured sealing layer including the cured body of this embodiment between the light-emitting diode element and the substrate.

[0107] The light emitting diode element includes, for example, an organic electroluminescent display element or a micro LED, and preferably includes a micro LED. The light-emitting diode element may also be in the form of a substrate with light-emitting diode elements (TFT substrate), which is a substrate with projections and recesses.

[0108] The substrate is not particularly limited and includes, for example, at least one selected from the group consisting of a color filter, a glass substrate, a silicon substrate, a plastic substrate, etc., and is preferably selected from the group consisting of a color filter and a glass substrate. Contains at least one type.

[0109] The cured sealing layer may be made of the cured product of this embodiment, or may contain the cured product of this embodiment and other constituent materials. Examples of other constituent materials include inorganic layers such as silicon nitride films, silicon oxide films, and silicon nitride oxide, and inorganic fillers such as silica, mica, kaolin, talc, and aluminum oxide.

[0110] Although the embodiments of the present invention have been described above, these are merely examples of the present invention, and various other configurations can also be adopted. Furthermore, the present invention is not limited to the above-described embodiment, and modifications and improvements within the scope of achieving the object of the present invention are included in the present invention. [Example]

[0111] The present embodiment will be described in detail below based on examples and comparative examples. However, the present embodiment is not limited to the descriptions of these examples. Unless otherwise specified, the examples were tested at 23°C and a relative humidity of 50% by mass.

[0112] [Examples 1 to 12 and Comparative Examples 1 to 3] The components shown in Tables 1 and 2 were mixed in the composition ratios (parts by mass) shown in Tables 1 and 2 to prepare the compositions of Examples 1 to 12 and Comparative Examples 1 to 3, respectively.

[0113] The components shown in Tables 1 and 2 have the following meanings:

[0114] <Cationic polymerizable compound> (A-1) Bisphenol A epoxy resin (manufactured by Mitsubishi Chemical Corporation, product name: jER828) (A-2) Bisphenol F epoxy resin (manufactured by Mitsubishi Chemical Corporation, product name: jER806) (A-3) 3',4'-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate (manufactured by Daicel Corporation, product name: Celloxide 2021P) (A-4) (3,3',4,4'-diepoxy)bicyclohexyl (manufactured by Daicel Corporation, product name: Celloxide 8010) (A-5) Dibromophenyl glycidyl ether (manufactured by Nippon Kayaku Co., Ltd., product name: BR-250H) (A-6) 1,6-Hexanediol diglycidyl ether (ADEKA Corporation, product name: ADEKA Glycirol ED-503G) (A-7) Neopentyl glycol diglycidyl ether (ADEKA Corporation, product name: ADEKA Glycirol ED-523L) (A-8) 2-Ethylhexyloxetane (manufactured by Toagosei Co., Ltd., product name: OXT-212)

[0115] <Radical polymerizable compound> (B-1) 1,12-dodecanediol dimethacrylate (manufactured by Shin-Nakamura Chemical Co., Ltd., product name: DDD) (B-2) Ethoxylated bisphenol A dimethacrylate (manufactured by Shin-Nakamura Chemical Co., Ltd., product name: NK Ester BPE-200) (B-3) Tricyclodecane dimethanol diacrylate (manufactured by Shin-Nakamura Chemical Co., Ltd., product name: NK Ester A-DCP) (B-4) Ethoxylated o-phenylphenol acrylate (manufactured by Shin-Nakamura Chemical Co., Ltd., product name: NK Ester A-LEN-10)

[0116] <Cationic polymerization initiator> (C-1) Triarylsulfonium salt hexafluoroantimonate (manufactured by ADEKA Corporation, product name: ADEKA Optomer SP-170) (C-2) Triarylsulfonium salt-tetrakispentafluorophenyl gallate (manufactured by San-Apro Co., Ltd., product name: CPI-310FG)

[0117] <Radical polymerization initiator> (D-1) 2,4,6-trimethylbenzoyldiphenylphosphine oxide (manufactured by IGM RESINS, product name: Omnirad TPO) (D-2) Ethyl 2,4,6-trimethylbenzoylphenylphosphinate (manufactured by IGM RESINS, product name: Omnirad TPO-L)

[0118] <Curing retarder> (E-1) 18-Crown Ether-6 (Tokyo Chemical Industry Co., Ltd., product name: Crown Ether O-18) (E-2) Tris(2-ethylhexyl)phosphate (manufactured by Daihachi Chemical Industry Co., Ltd., product name: TOP)

[0119] <Leveling agent> (F-1) Acrylic leveling agent (BYK, product name: BYK-356)

[0120] [Measurement and Evaluation] The compositions of each example and comparative example were subjected to the following measurements and evaluations. The evaluation results are shown in Tables 1 and 2.

[0121] <Storage modulus E' and glass transition temperature> A silicone sheet mold having a length of 50 mm, a width of 7 mm, and a thickness of 0.5 mm was placed on a PET film (manufactured by Toray Industries, Inc., product name: Lumirror S10, thickness: 50 μm), and the composition was placed in the mold and sandwiched between PET films (manufactured by Toray Industries, Inc., product name: Lumirror S10, thickness: 50 μm). When the composition was a cationically polymerizable composition (Examples 1 to 9 and Comparative Examples 1 and 2), a 0.5 mm thick composition was irradiated with ultraviolet light having a wavelength of 365 nm at a dose of 1500 mJ / cm using an LED lamp (manufactured by HOYA Corporation, product name: H64AH4). 2 (100mW / cm 2 After irradiating the composition for 15 seconds, the composition was heated at 80° C. for 30 minutes to obtain a cured product of the composition having a thickness of 0.5 mm. When the composition was a radical polymerizable composition (Examples 10 to 12 and Comparative Example 3), a 0.5 mm thick composition was irradiated with ultraviolet light having a wavelength of 395 nm at a dose of 1500 mJ / cm using an LED lamp (manufactured by HOYA Corporation, product name: H-4MLH200). 2 (Irradiation intensity: 100mW / cm 2 The coating was irradiated for 15 seconds (irradiation time: 15 seconds) to obtain a cured product of the composition having a thickness of 0.5 mm. The resulting cured product of the composition, 0.5 mm thick, was measured for its storage modulus E' and tanδ as a function of temperature using a dynamic viscoelasticity measuring device (Seiko Instruments Inc., product name: DMS210) under the following conditions: frequency 1 Hz, temperature range 10°C to 200°C, heating rate 2°C / min, sample length 50 mm, sample width 7 mm, nitrogen atmosphere, and tensile mode. From the measurement results, the storage modulus E' at 80°C and 25°C was calculated. The temperature at the peak top of tanδ was taken as the glass transition temperature. The peak top of tanδ was taken as the maximum value in the range where tanδ was 0.3 or greater. If tanδ was 0.3 or less in the range from 10°C to 200°C, the peak top of tanδ was considered to be greater than 200°C, and the glass transition temperature was considered to be greater than 200°C (200<).

[0122] <Refractive index> A cured product of the composition having a thickness of 0.5 mm was obtained in the same manner as in the above <Storage modulus E' and glass transition temperature>. The refractive index of a 0.5 mm thick cured product of the composition was measured at 25° C. and 589 nm using an Abbe refractometer (Atago Co., Ltd., product name: DR-M2).

[0123] <Viscosity> The viscosity of the composition was measured under the following conditions. Apparatus: Cone-plate type viscometer (manufactured by Eiko Seiki Co., Ltd., product name: HB DV3T) Temperature: 25℃ Cone: Radius 24mm, angle 0.8° Rotation speed: 250 rpm Sample volume: 0.5 mL Atmosphere: Atmospheric

[0124] <Hardening shrinkage rate> The liquid specific gravity was calculated by filling the composition into a pycnometer and measuring the mass in air and the mass in pure water. A cured product made of a composition with a thickness of 0.5 mm was obtained in the same manner as the above <Storage elastic modulus E' and glass transition temperature>, except that the mold of the silicon sheet was 25 mm in length and 25 mm in width. A cured product made of a composition with a width of 25 mm, a length of 25 mm, and a thickness of 0.5 mm was used as a measurement sample. Next, the cured product specific gravity was calculated by measuring the mass in air and the mass in pure water for the measurement sample. The hardening shrinkage rate was calculated from the formula: Hardening shrinkage rate = ((Cured product specific gravity - Liquid specific gravity) / Cured product specific gravity) × 100 (%).

[0125] <Static surface tension> The static surface tension of the composition was measured by the pendant drop method using a contact angle meter (manufactured by Kyowa Interface Science Co., Ltd., product name: DM500) in an atmosphere of 23°C.

[0126] <LED reliability test> As LED light-emitting devices, devices each formed of an LED chip as a light-emitting source, a first lead frame on which the light-emitting source is mounted, a second lead frame, the compositions of Examples 1 to 12 and Comparative Examples 1 to 3 that cover the light-emitting source, a bonding wire that electrically connects the light-emitting source and the second lead frame, and a synthetic resin cap that covers these were each prepared. The light-emitting source used was an LED chip that generates light with a wavelength of 300 nm or more and 500 nm or less. When the composition is a cationic polymerizable composition (Examples 1 to 9 and Comparative Examples 1 and 2), using an LED lamp (manufactured by HOYA Corporation, product name: H64AH4), ultraviolet light with a wavelength of 365 nm was irradiated with an irradiation amount of 1500 mJ / cm 2 (100 mW / cm 2 , irradiation time: 15 seconds), and then heated at 80°C for 30 minutes to seal the LED chip. [[ID = 29]] When the composition was a radical polymerizable composition (Examples 10 to 12 and Comparative Example 3), an LED lamp (manufactured by HOYA Corporation, product name: H-4MLH200) was used to irradiate ultraviolet light with a wavelength of 395 nm at a dose of 1500 mJ / cm. 2 (Irradiation intensity: 100mW / cm 2 The LED chip was then sealed by irradiating the LED with the light source for 15 seconds. After sealing, the LED light-emitting device was subjected to a 500-hour power-on light-emitting test at 60°C and 90% RH. Those in which the LED chip did not light up were rated A (good), and those in which the LED chip light up was rated B (bad).

[0127] [Table 1]

[0128] [Table 2]

[0129] As can be seen from Tables 1 and 2, the compositions of the examples all had good results in the LED reliability test. That is, it can be seen that the composition of the present embodiment can improve the reliability of display devices.

Claims

1. 1. A composition comprising: Contains a polymerizable compound (A) and a polymerization initiator (B), A cured product of the composition has a storage modulus E' of 0.5 GPa or more and 5.0 GPa or less at 80°C when measured using a dynamic viscoelasticity measuring device at a frequency of 1 Hz, a measurement temperature range of 10°C to 200°C, a heating rate of 2°C / min in a tensile mode.

2. 2. The composition according to claim 1, wherein a cured product of the composition has a storage modulus E' at 25°C of 1.0 GPa or more and 10.0 GPa or less when measured using a dynamic viscoelasticity measuring device at a frequency of 1 Hz, at a measurement temperature range of 10°C to 200°C, at a heating rate of 2°C / min in a tensile mode.

3. the polymerizable compound (A) contains a cationically polymerizable compound, The composition according to claim 1 or 2, wherein the polymerization initiator (B) comprises a cationic polymerization initiator.

4. The composition of claim 3 , wherein the cationically polymerizable compound comprises an epoxy compound.

5. The composition of claim 4 , wherein the epoxy compound comprises a cycloaliphatic epoxy compound.

6. The epoxy compound includes a compound containing a glycidyl ether group, The composition of claim 4 , wherein the compound containing a glycidyl ether group comprises a diglycidyl ether compound.

7. The composition according to claim 3 , wherein the cationic polymerization initiator comprises at least one selected from the group consisting of a photocationic polymerization initiator and a thermal cationic polymerization initiator.

8. the polymerizable compound (A) contains a radical polymerizable compound, The composition according to claim 1 or 2, wherein the polymerization initiator (B) comprises a radical polymerization initiator.

9. The composition of claim 8 , wherein the radically polymerizable compound comprises a (meth)acrylate.

10. The (meth)acrylate comprises a polyfunctional (meth)acrylate, 10. The composition according to claim 9, wherein a content of the polyfunctional (meth)acrylate in the composition is 90 parts by mass or more and 100 parts by mass or less, relative to 100 parts by mass of a content of the polymerizable compound (A) in the composition.

11. The (meth)acrylate includes a (meth)acrylate containing an alicyclic structure in the molecule, 10. The composition according to claim 9, wherein a content of the (meth)acrylate having an alicyclic structure in the molecule in the composition is 75 parts by mass or more and 100 parts by mass or less, relative to 100 parts by mass of a content of the polymerizable compound (A) in the composition.

12. The composition of claim 8 , wherein the radical polymerization initiator comprises a photoradical polymerization initiator.

13. The composition of claim 1 or 2, further comprising a cure retarder (C).

14. 3. The composition according to claim 1, wherein a cured product of the composition has a glass transition temperature of 70°C or higher when measured using a dynamic viscoelasticity measuring device at a frequency of 1 Hz, a heating rate of 2°C / min, and in a tensile mode.

15. The composition according to claim 1 or 2, wherein a cured product of the composition has a refractive index at 25°C and 589 nm of 1.45 or more and 1.70 or less.

16. 3. The composition according to claim 1, which is liquid at 25°C.

17. The composition according to claim 1 or 2, wherein the viscosity of the composition is 1 mPa·s or more and 700 mPa·s or less, according to the following <Method 1>. <Method 1> Apparatus: Cone-plate type viscometer Temperature: 25℃ Cone: radius 24 mm, angle 0.8° Rotation speed: 250 rpm Sample volume: 0.5 mL Atmosphere: Atmospheric

18. The composition according to claim 1 or 2, which can be used for inkjet or dispenser application.

19. 20. The composition of claim 18, which can be used in inkjet applications.

20. 3. The composition according to claim 1, wherein the cure shrinkage calculated by the following <Method 2> is 1.0% or more and 15.0% or less. <Method 2> The composition was filled into a pycnometer, and the liquid specific gravity was calculated by measuring the mass in the air and the mass in pure water. The specific gravity of the cured product was calculated by measuring the mass of a cured product made of the composition, 25 mm wide, 25 mm long, and 0.5 mm thick, in the air and in pure water, and the curing shrinkage was calculated using the formula: Cure shrinkage = ((specific gravity of cured product - liquid specific gravity) / specific gravity of cured product) x 100 (%).

21. 3. The composition according to claim 1, wherein the static surface tension measured by the pendant drop method is 50 mN / m or less.

22. 3. The composition according to claim 1, which can be used to encapsulate a micro LED.

23. A cured product comprising the composition according to claim 1 or 2.

24. A display device comprising: a light-emitting diode element; a substrate; and a cured sealing layer between the light-emitting diode element and the substrate, the cured sealing layer comprising the cured body according to claim 23.

25. 25. The display device of claim 24, wherein the light emitting diode elements comprise micro LEDs.