Screen mesh, screen mask, method for producing conductive pattern, and method for producing conductive substrate

Abstract

To provide a screen mesh that enables printing with reduced thickness irregularity.SOLUTION: A screen mesh 10 is used for printing conductive ink. In plan view, the screen mesh 10 comprises a portion having a first group and a second group combined. The first group comprises a plurality of wave lines 110a each extending in a first direction. The second group comprises a plurality of wave lines 110b each extending in a second direction. The second direction is a direction different from the first direction.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a screen mesh, a screen mask, a method for manufacturing a conductive pattern, and a method for manufacturing a conductive substrate. [Background technology]

[0002] Screen printing has a variety of uses, including circuit formation.

[0003] Patent Document 1 discloses a wire screen material including two or more wire pieces that extend in approximately the same direction without intersecting. The invention described in Patent Document 1 aims to provide a wire screen material that has the advantageous printing characteristics of a metal screen and can be manufactured simply and inexpensively from a variety of materials. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Special Publication No. 9-507042 Summary of the Invention [Problem to be solved by the invention]

[0005] However, the screen material described in Patent Document 1 leaves room for improvement in terms of thickness unevenness during printing.

[0006] The present invention provides a screen mesh that enables printing with minimal thickness variation. [Means for solving the problem]

[0007] According to one aspect of the present invention, there is provided the following methods for manufacturing a screen mesh, a screen mask, a conductive pattern, and a conductive substrate.

[0008] 1. A screen mesh for printing conductive ink, The invention includes a portion having a structure in which, in a plan view, a first group of a plurality of wavy lines each extending in a first direction and a second group of a plurality of wavy lines each extending in a second direction different from the first direction are combined. Screen mesh. 2. In the screen mesh described in 1., In a plan view, the plurality of wavy lines constituting the first group are spaced apart from one another, and the plurality of wavy lines constituting the second group are spaced apart from one another. Screen mesh. 3. In the screen mesh described in 2., In a plan view, the shortest distance between the plurality of wavy lines constituting the first group is 0.95 to 1.05 times the shortest distance between the plurality of wavy lines constituting the second group. Screen mesh. 4. The screen mesh according to any one of 1. to 3., In a plan view, each of the plurality of wavy lines constituting the first group intersects with at least one of the plurality of wavy lines constituting the second group. Screen mesh. 5. In the screen mesh described in 4., In a plan view, each of the plurality of wavy lines constituting the first group intersects with at least one of the plurality of wavy lines constituting the second group such that inflection points intersect with each other. Screen mesh. 6. The screen mesh according to any one of 1. to 5., In a plan view, among the plurality of wavy lines constituting the first group, adjacent wavy lines are line-symmetric, and among the plurality of wavy lines constituting the second group, adjacent wavy lines are line-symmetric. Screen mesh. 7. The screen mesh according to any one of 1. to 6., In a plan view, an average of the wave periods of the plurality of wavy lines constituting the first group is 0.95 to 1.05 times the average of the wave periods of the plurality of wavy lines constituting the second group, In a plan view, an average amplitude of waves drawn by the plurality of wavy lines constituting the first group is 0.95 to 1.05 times the average amplitude of waves drawn by the plurality of wavy lines constituting the second group. Screen mesh. 8. The screen mesh according to any one of 1. to 7., In plan view, the screen mesh has a periodic structure in which periodic units are arranged two-dimensionally, the periodic unit is a square, On the screen mesh, the rectangular slit is moved in the direction of the short side by the length of the short side of the slit, and the opening area through the slit at each slit position is determined, and the maximum value of the determined opening areas is defined as S. max , the minimum value is S min Then, the variability M=(S max -S min ) / (S max +S min ) is 0.8 or less when the orientation of the slit is in the first state and when the orientation of the slit is in the second state, the length of a long side of the slit is the length of one side of the square that is the periodic unit, and the length of a short side of the slit is half the line width of the wavy line in a plan view, the first state is a state in which a long side of the slit is parallel to any side of the square that is the periodic unit, The second state is a state in which the orientation of the slit is rotated 45° clockwise from the first state. Screen mesh. 9. The screen mesh according to any one of 1. to 7., In plan view, the screen mesh has a periodic structure in which periodic units are arranged two-dimensionally, the periodic unit is a rectangle, On the screen mesh, a rectangular slit is moved in the short side direction of the slit by the length of the short side of the slit, the opening area through the slit at each slit position is specified, and the maximum value among the specified plurality of opening areas is S max , and the minimum value is S min . When taking them as such, the degree of variation M = (S max - S min ) / (S max + S min ). The degree of variation M calculated in this way is 0.8 or less in both the case where the orientation of the slit is in the first state and the case where it is in the second state. The length of the long side of the slit is the length of the long side of the rectangle in the periodic unit, and the length of the short side of the slit is half of the line width in the plan view of the wavy line. The first state is a state where the long side of the slit is parallel to the long side of the rectangle that is the periodic unit. The second state is a state where the orientation of the slit is rotated 45° clockwise from the first state. Screen mesh. 10. In the screen mesh according to any one of 1. to 9., each of the plurality of wavy lines consists of curves. Screen mesh. 11. In the screen mesh according to any one of 1. to 10., each of the plurality of wavy lines has a shape in which a plurality of arcs are connected in the plan view. In the plan view, when the line width of the wavy line is w and the longest distance from the chord of the arc to the arc is d, w / 2 < d holds. Screen mesh. 12. A screen mesh according to any one of 1. to 11., and a mask layer attached to the screen mesh. Screen mask. 13. A method for manufacturing a conductive pattern, including the step of performing screen printing using the screen mask according to 12. Method for manufacturing a conductive pattern. 14. Using the screen mask according to 12., a conductive ink containing conductive particles is screen-printed onto a first substrate to form a conductive pattern on the first substrate; transferring the conductive pattern to a second substrate different from the first substrate; and applying pressure to a laminate including the second base material and the conductive pattern. A method for manufacturing a conductive substrate. [Effects of the Invention]

[0009] According to the present invention, a screen mesh that enables printing with minimal thickness variation can be provided. [Brief explanation of the drawings]

[0010] [Figure 1] 1 is a diagram illustrating a screen mesh according to a first embodiment. FIG. [Figure 2] 1 is a reference example of a screen mask in a plan view. [Figure 3] FIG. 3 is a diagram illustrating an example of a wavy line according to the first embodiment. [Figure 4] FIG. 3 is a diagram illustrating an example of a wavy line according to the first embodiment. [Figure 5] FIG. 10 is a diagram for explaining the variability M of the screen mesh. [Figure 6] FIG. 10 is a diagram for explaining the variability M of the screen mesh. [Figure 7] 2A to 2C are diagrams illustrating the structure of a screen mask according to the first embodiment. [Figure 8] 2A to 2C are diagrams illustrating the structure of a screen mask according to the first embodiment. [Figure 9] 10A and 10B are diagrams illustrating an example of an opening in a mask layer. [Figure 10] 1 is a cross-sectional view illustrating a configuration of a structure including a conductive pattern. [Figure 11] FIG. 10 is a diagram showing the relationship between a screen mesh according to a comparative example and the positions of a plurality of slits in a first state. [Figure 12]10 is a graph showing the relationship between the slit position and the opening area S when the slit is in a first state in a comparative example. [Figure 13] FIG. 10 is a diagram showing the relationship between a screen mesh according to a comparative example and the positions of a plurality of slits in a second state. [Figure 14] 10 is a graph showing the relationship between the slit position and the opening area S when the slit is in a second state in a comparative example. [Figure 15] 10 is a graph showing the relationship between the slit position and the opening area S when the slit is in a first state in Example 1. [Figure 16] 10 is a graph showing the relationship between the slit position and the opening area S when the slit is in a second state in Example 1. [Figure 17] FIG. 6 is a diagram illustrating the flow of a method for producing a conductive substrate according to a second embodiment. [Figure 18] 1A to 1C are diagrams illustrating a method for manufacturing a conductive substrate according to a reference example. DETAILED DESCRIPTION OF THE INVENTION

[0011] Hereinafter, embodiments of the present invention will be described with reference to the drawings. In all drawings, similar components are denoted by similar reference numerals, and descriptions thereof will be omitted where appropriate. The x-axis, y-axis, and z-axis directions shown in each drawing are three directions perpendicular to each other, and the xy plane is a plane parallel to the main surface of the screen mesh.

[0012] In this specification, unless otherwise specified, the expression "X to Y" in the description of a numerical range means at least X and at most Y. For example, "1 to 5 mass %" means "at least 1 mass % and at most 5 mass %."

[0013] (First embodiment)

[0014] FIG. 1 is a diagram illustrating a screen mesh 10 according to a first embodiment. FIG. 1 shows the screen mesh 10 in a plan view. The screen mesh 10 according to this embodiment is a screen mesh for printing conductive ink. In a plan view, the screen mesh 10 includes a portion having a structure in which a first group and a second group are combined. The first group consists of a plurality of wavy lines 110a, each extending in a first direction. The second group consists of a plurality of wavy lines 110b, each extending in a second direction. The second direction is different from the first direction. A plan view refers to a view in which the line of sight is perpendicular to the main surface of the screen mesh 10.

[0015] If the printed conductive ink has uneven thickness, the resulting conductive pattern will have uneven film thickness and density, which may lead to deterioration of electrical properties. Therefore, it is preferable to be able to print conductive ink with small thickness variations.

[0016] As a result of extensive research, the present inventors have found that a mask having a mesh of a regular grid pattern of straight lines can cause thickness variations that depend on the period of the grid.

[0017] FIG. 2 shows a reference example of a screen mask in plan view. In the mesh of the screen mask shown in FIG. 2, linear wires 90 intersect vertically and horizontally in plan view. A mask portion 92 is provided on either side of a region 91 where a conductive pattern is to be formed. The portions that do not overlap with either the mask portion 92 or the wires 90 are openings 94. In the example of FIG. 2, non-openings 96 are generated by the mesh wires 90, crossing the region 91 where a conductive pattern is to be formed. In these non-openings 96, the conductive ink is not directly applied to the substrate during printing. Due to the fluidity of the conductive ink, some wraparound occurs, but the ink film thickness is thinner than in other regions. This results in thickness unevenness. In particular, as shown in FIG. 2, if the non-openings 96 are perpendicular to the extension direction of the conductive pattern, the cross-sectional area of ​​the conductive pattern (e.g., wiring or an antenna) becomes smaller at the non-openings 96, increasing the electrical resistance of the conductive pattern, which is a major problem. Furthermore, considering that a single circuit pattern contains wirings extending in various directions, it is easy for a portion to occur in which a wire 90 vertically crosses an area 91 in which a conductive pattern is to be formed, as shown in Figure 2.

[0018] In contrast, the screen mesh 10 according to this embodiment includes a portion having a structure in which a first group of multiple wavy lines 110a and a second group of multiple wavy lines 110b are combined in plan view, making it less likely that portions with continuous non-openings will occur in a specific direction compared to the mesh shown in Figure 2. This reduces thickness unevenness during printing, and allows for a conductive pattern with good electrical properties to be obtained.

[0019] The screen mesh 10 according to this embodiment will be described in detail below.

[0020] As described above, the screen mesh 10 according to this embodiment includes a portion having a structure in which a first group and a second group are combined in plan view. The first group is made up of a plurality of wavy lines 110a, each extending in a first direction. The second group is made up of a plurality of wavy lines 110b, each extending in a second direction. The second direction is different from the first direction. The wavy lines 110a constituting the first group and the wavy lines 110b constituting the second group are collectively referred to as wavy lines 110.

[0021] The wavy line 110 extending in a certain direction means that the center line of the wavy line 110 is parallel to that direction. The first direction and the second direction are preferably substantially perpendicular to each other. Specifically, the angle between the first direction and the second direction is preferably 85° or more and 95° or less. In FIG. 1, the center line of each wavy line 110 is indicated by a dashed dotted line. In the example of FIG. 1, the first direction is the x-axis direction, and the second direction is the y-axis direction. That is, in the example of FIG. 1, the first direction and the second direction are perpendicular to each other.

[0022] It is preferable that each of the multiple wavy lines 110 is made up of curved lines. In other words, it is preferable that the wavy lines 110 do not include straight line portions. It is preferable that the wavy lines 110 are made up of concaves and convexes facing in a direction perpendicular to the direction in which they extend. It is preferable that each of the multiple wavy lines 110 has a shape in which multiple arcs are connected in a plan view. In particular, it is preferable that the wavy lines 110 have a shape in which arcs with a central angle of 90° or less are connected.

[0023] It is preferable that the wavy line 110 has a high degree of curvature. FIGS. 3 and 4 are diagrams illustrating the wavy line 110 according to the present embodiment. The wavy line 110 illustrated in FIGS. 3 and 4 has a shape in which a plurality of arcs are connected in a plan view. In each of FIGS. 3 and 4, the center of the wavy line is indicated by a dotted line, and the chord of the arc is indicated by a dashed-dotted line. Also, r indicates the radius of the arc, w indicates the line width of the wavy line 110, 2θ indicates the central angle of the arc, and d indicates the longest distance from the chord of the arc to the arc. In a plan view, thus, when the line width of the wavy line 110 is w and the longest distance from the chord of the arc to the arc is d, it is preferable that w / 2 < d holds. In the example of FIG. 3, w / 2 < d holds. On the other hand, in the example of FIG. 4, w / 2 < d does not hold. In the wavy line 110a, the longest distance d is the distance in the direction perpendicular to the first direction, and in the wavy line 110b, the longest distance d is the distance in the direction perpendicular to the second direction.

[0024] As shown in FIG. 4, when w / 2 < d does not hold, the chord of the arc indicated by the dashed-dotted line overlaps the wavy line 110. That is, when w / 2 < d does not hold, a linear non-opening portion as indicated by the dashed-dotted line may occur. On the other hand, when w / 2 < d holds as shown in FIG. 3, a linear non-opening portion does not occur. Therefore, it can be said that when w / 2 < d holds, the degree of curvature is higher than when it does not hold, and thickness unevenness can be further reduced.

[0025] Returning to FIG. 1, in the screen mesh 10, it is preferable that the plurality of wavy lines 110a constituting the first group are spaced apart from each other in a plan view. And, in a plan view, among the plurality of wavy lines 110a constituting the first group, it is preferable that adjacent wavy lines 110a are line-symmetric to each other. Also, it is preferable that the plurality of wavy lines 110b constituting the second group are spaced apart from each other in a plan view. And, in a plan view, among the plurality of wavy lines 110b constituting the second group, it is preferable that adjacent wavy lines 110b are line-symmetric to each other.

[0026] It is preferable that the period of the waves formed by wavy line 110a is substantially the same as the period of the waves formed by wavy line 110b. For example, in a plan view, it is preferable that the average period of the waves formed by the plurality of wavy lines 110a constituting the first group is 0.95 to 1.05 times the average period of the waves formed by the plurality of wavy lines 110b constituting the second group. The average period is, for example, the average within a 2 cm square.

[0027] It is preferable that the amplitude of the waves formed by wavy line 110a be substantially the same as the amplitude of the waves formed by wavy line 110b. For example, in a plan view, it is preferable that the average amplitude of the waves formed by the plurality of wavy lines 110a constituting the first group be 0.95 to 1.05 times the average amplitude of the waves formed by the plurality of wavy lines 110b constituting the second group. The average amplitude is, for example, the average within a 2 cm square.

[0028] It is preferable that the line width w of wavy line 110a is substantially the same as the line width w of wavy line 110b. For example, in a plan view, it is preferable that the average line width w of the multiple wavy lines 110a constituting the first group is 0.95 to 1.05 times the average line width w of the multiple wavy lines 110b constituting the second group. The average line width w of wavy line 110 is, for example, the average within a 2 cm square.

[0029] The line width w of the wavy lines 110 is, for example, 0.01 mm or more and 0.1 mm or less. The line width w of the wavy lines 110 is not particularly limited, but is preferably 0.03 mm or less, and more preferably 0.02 mm or less. This allows for printing of fine patterns. Furthermore, the line width w of the wavy lines 110 is preferably 0.02 mm or more, and more preferably 0.04 mm or more. This ensures high strength of the screen mesh 10.

[0030] It is preferable that the distance between the multiple wavy lines 110a and the distance between the multiple wavy lines 110b are substantially the same. For example, in a plan view, it is preferable that the shortest distance between the multiple wavy lines 110a constituting the first group is 0.95 to 1.05 times the shortest distance between the multiple wavy lines 110b constituting the second group. Furthermore, it is preferable that the average distance between the center lines of the multiple wavy lines 110a is 0.95 to 1.05 times the average distance between the center lines of the multiple wavy lines 110b. The average distance between the center lines is, for example, the average within a 2 cm square.

[0031] The shortest distance between adjacent wavy lines 110a is preferably 0.01 mm or more and 0.08 mm or less. Similarly, the shortest distance between adjacent wavy lines 110b is preferably 0.01 mm or more and 0.08 mm or less. Furthermore, the longest distance D1 between adjacent wavy lines 110a in a direction perpendicular to the first direction is preferably 0.05 mm or more and 0.15 mm or less. Similarly, the longest distance D2 between adjacent wavy lines 110b in a direction perpendicular to the second direction is preferably 0.05 mm or more and 0.15 mm or less.

[0032] In plan view, each of the plurality of wavy lines 110a constituting the first group preferably intersects with at least one of the plurality of wavy lines 110b constituting the second group. Each of the plurality of wavy lines 110a may intersect with two or more of the plurality of wavy lines 110b, or may intersect with all of the plurality of wavy lines 110b.

[0033] Each of the multiple wavy lines 110a and the multiple wavy lines 110b has, for example, multiple inflection points. In a plan view, each of the multiple wavy lines 110a constituting the first group may intersect with at least one of the multiple wavy lines 110b constituting the second group so that their inflection points intersect. Each of the multiple wavy lines 110a may intersect with two or more of the multiple wavy lines 110b so that their inflection points intersect, or each of the multiple wavy lines 110a may intersect with all of the multiple wavy lines 110b so that their inflection points intersect.

[0034] 1, the screen mesh 10 has a plurality of openings whose peripheries are defined by a plurality of wavy lines 110 in plan view. Specifically, each opening has an outer periphery defined by two wavy lines 110a and two wavy lines 110b. Each opening has a portion that is convex toward the inside of the opening and a portion that is convex toward the outside of the opening.

[0035] The wavy lines 110 are, for example, composed of one or more filaments. The screen mesh 10 can be composed, for example, by knitting a plurality of filaments. However, the plurality of filaments in the screen mesh 10 do not have to be knitted. For example, the screen mesh 10 may be composed of a plurality of filaments overlapping or glued together. The screen mesh 10 can be easily manufactured by combining a plurality of filaments. In particular, the screen mesh 10 can be easily manufactured by combining, for example, filaments corresponding to the plurality of wavy lines 110a as one of the vertical and horizontal lines and filaments corresponding to the plurality of wavy lines 110b as the other of the vertical and horizontal lines.

[0036] The material of the filament is, for example, a metal such as stainless steel or a resin such as polyester or nylon. The thickness of the filament is not particularly limited. The filament may be in the form of a wire or fiber.

[0037] Note that when the screen mesh 10 or the wavy lines 110 have a certain shape or structure in a planar view, this means that the screen mesh 10 or the wavy lines 110 have that shape or structure in a projection (i.e., silhouette) of the screen mesh 10 or the wavy lines 110 when viewed in a planar view. There are no limitations on how each wavy line 110 is realized. For example, each wavy line 110 does not have to consist of a single filament, but may consist of a combination of multiple filaments. Furthermore, unless otherwise specified, matters relating to the shapes of the screen mesh 10 and the wavy lines 110 refer to matters relating to the shapes of the screen mesh 10 and the wavy lines 110 in the projection.

[0038] In the screen mesh 10, the portions where the filaments overlap may be thicker than the other portions. However, the filaments may be partially removed at the overlapping portions. In other words, the overlapping portions may be the same thickness as the other portions.

[0039] When the screen mesh 10 is made up of multiple filaments, the line width w of the wavy lines 110 corresponds to the line diameter of the filaments. The length of the filaments is not particularly limited, but is, for example, 0.015 mm or more. For example, the length of the filaments is 10,000 times or more the shortest distance between the multiple wavy lines 110a. Furthermore, for example, the length of the filaments is 10,000 times or more the shortest distance between the multiple wavy lines 110b. The cross-sectional area and cross-sectional shape of the filaments do not necessarily have to be uniform.

[0040] However, the screen mesh 10 does not necessarily have to be composed of filaments, but may be realized by including a plate-like body having a plurality of openings. For example, the plate-like body may be made of metal or resin. The screen mesh 10 may be produced by forming openings in a plate-like body. The thickness of the plate-like body is, for example, 0.015 mm or more and 0.05 mm or less.

[0041] The opening ratio of the screen mesh 10 is not particularly limited, but is preferably 40% or more, and more preferably 50% or more. This ensures good dischargeability even when using a highly viscous conductive ink. On the other hand, the opening ratio of the screen mesh 10 may be 60% or less, or even 50% or less. This ensures a high repulsive force of the screen mask, improving printing stability. The opening ratio is the area ratio of the openings (areas without the wavy lines 110) in the screen mesh 10 in a plan view.

[0042] When the screen mesh 10 is made up of a plurality of filaments, the mesh thickness of the screen mesh 10 is not particularly limited, but is preferably 0.03 mm or more, and more preferably 0.04 mm or more. The mesh thickness of the screen mesh 10 is preferably 0.06 mm or less, and more preferably 0.04 mm or less. The mesh thickness is the thickness at the points where the filaments overlap.

[0043] The area of ​​each opening in the screen mesh 10 is, for example, 0.001 mm 2 More than 0.016mm 2 The openings in the screen mesh 10 are openings when the screen mesh 10 is viewed from above.

[0044] The screen mesh 10 preferably has a periodic structure in plan view. In particular, from the viewpoint of ease of manufacturing the screen mesh 10, the screen mesh 10 preferably has a two-dimensional periodic structure in plan view. That is, the screen mesh 10 preferably has a periodic structure in which periodic units 120 are arranged two-dimensionally in plan view. The periodic units 120 are quadrilaterals such as squares, rectangles, or parallelograms. In FIG. 1, the periodic units 120 are indicated by dashed lines. In the example of FIG. 1, the periodic units 120 are larger than one opening.

[0045] 5 and 6 are diagrams for explaining the degree of variability M of the screen mesh 10. The following degree of variability M can be considered as an index related to the magnitude of unevenness in the thickness of the coating film when screen printing is performed using the screen mesh 10.

[0046] First, a rectangular slit 140 is defined. In Fig. 5 and Fig. 6, the slit 140 is indicated by a dotted line. Each of Fig. 5 and Fig. 6 shows the slit 140 at a plurality of positions. On the screen mesh 10, the slit 140 is moved in the direction of the short side by the length of the short side of the slit 140, and the opening area S through the slit 140 at each position of the slit 140 is identified. Then, the maximum value of the identified opening areas S is defined as S. max , the minimum value is S min When this is done, the variability M is: max -S min ) / (S max +S min ) is calculated based on the relationship

[0047] When the periodic unit 120 is a square, the length of the long side of the slit 140 is the length of one side of the square that is the periodic unit 120. When the periodic unit 120 is a rectangle, the length of the long side of the slit 140 is the length of the long side of the rectangle that is the periodic unit 120.

[0048] The length of the short side of the slit 140 is set to half the line width of the wavy lines 110 that form the screen mesh 10 in a plan view.

[0049] The opening area S determined according to the position of the slit 140 means the area where the conductive ink is directly applied to the substrate in the region within the slit 140. The greater the variation in the opening area S according to the position of the slit 140, that is, the greater the degree of variation M, the greater the variation in the area where the conductive ink is directly applied to the substrate will be depending on the position on the screen mesh 10, resulting in greater thickness unevenness.

[0050] It has been confirmed that a simulation using the relationship between the position of the slit 140 and the opening area S can accurately reproduce the thickness distribution of the conductive ink that is actually printed.

[0051] Here, the degree of fluctuation M depends on the orientation of the slits 140 relative to the screen mesh 10.

[0052] When the periodic unit 120 is a square, the state in which the long side of the slit 140 is parallel to any side of the square that is the periodic unit 120 is called the first state, as shown in Fig. 5. When the periodic unit 120 is a rectangle, the state in which the long side of the slit 140 is parallel to the long side of the rectangle that is the periodic unit 120 is called the first state.

[0053] On the other hand, as shown in FIG. 6, a state in which the orientation of the slit 140 is rotated 45° clockwise from the first state is called a second state.

[0054] The number of positions of the slits 140 that determine the opening area S is set to a number that allows determination of the maximum and minimum values ​​of the opening area S in the screen mesh 10. For example, if the screen mesh 10 has periodicity in the direction in which the slits 140 are moved, the slits 140 may be moved by the same number of periods.

[0055] The degree of fluctuation M of the screen mesh 10 is preferably 0.8 or less, and more preferably 0.6 or less, when the orientation of the slits 140 is in the first state.

[0056] The degree of fluctuation M of the screen mesh 10 is preferably 0.8 or less, and more preferably 0.6 or less, when the orientation of the slits 140 is in the second state.

[0057] The variability M of the screen mesh 10 is preferably 0.8 or less, preferably 0.6 or less, and more preferably 0.5 or less, whether the orientation of the slits 140 is in the first state or the second state.

[0058] The absolute value of the difference between the degree of fluctuation M in the first state and the degree of fluctuation M in the second state of the screen mesh 10 is preferably 0.3 or less, and more preferably 0.2 or less.

[0059] When the periodic unit 120 is a square, there are two possible orientations of the side of the periodic unit 120 that can be parallel to the long side of the slit 140 in the first state, and each of the above preferred conditions only needs to be met when at least one of the orientations is selected.

[0060] 7 and 8 are diagrams illustrating the structure of the screen mask 20 according to this embodiment. The screen mask 20 according to this embodiment includes the screen mesh 10 according to this embodiment and a mask layer 210 attached to the screen mesh 10. FIG. 7 shows a part of the screen mask 20 in a plan view, and FIG. 8 shows a cross-sectional view of a part of the screen mask 20. The screen mask 20 according to this embodiment enables printing with little thickness variation.

[0061] The screen mask 20 can be produced by applying a mask layer 210 to the screen mesh 10. The mask layer 210 is, for example, an emulsion or a metal. The thickness of the mask layer 210 is not particularly limited, but is, for example, 0.005 mm or more and 0.1 mm or less.

[0062] The mask layer 210 has openings (through holes) corresponding to the pattern to be printed. FIG. 9 is a diagram illustrating an example of openings in the mask layer 210. In FIG. 9, the blackened areas correspond to the openings. In the example of FIG. 9, the mask layer 210 has openings corresponding to the shape of an antenna. However, the shape and size of the openings shown in FIG. 9 are merely examples, and the openings provided in the mask layer 210 are not limited to this example. The mask layer 210 may have openings corresponding to, for example, a circuit pattern, or openings corresponding to wiring.

[0063] The relationship between the shape of the screen mesh 10 and the opening pattern in the screen mask 20 is not particularly limited. For example, even if the opening pattern includes line portions corresponding to wiring or the like, the relationship between the extending direction of the line portions, the first direction, and the second direction is not particularly limited. Furthermore, the positional relationship between the position of the line portions and the wavy line 110 is not particularly limited. Therefore, the openings provided in the mask layer 210 can include multiple line portions extending in different directions.

[0064] The minimum width w of the opening provided in the mask layer 210 m That is, the minimum width of the pattern printed using the screen mask 20 is, for example, 0.08 mm or less. In this way, a fine conductive pattern can be obtained. m is, for example, 0.1 mm or more. This allows the pattern to be printed stably.

[0065] The minimum width w of the opening provided in the mask layer 210 m In contrast, when the ratio of the maximum distance D1 of the wavy lines 110a to the maximum distance D2 of the wavy lines 110b and the line width w of the wavy lines 110 is large, thickness unevenness is more likely to occur than when it is small. m In other words, the screen mesh 10 according to this embodiment can reduce thickness unevenness even when the ratio of the longest distance D1, the longest distance D2, and the line width w of the wavy line 110 is large. m This can be suitably used when the ratio of the longest distance D1, the longest distance D2, and the line width w of the wavy line 110 is large relative to the longest distance D1. For example, the longest distance D1 is set to the minimum width w of the opening provided in the mask layer 210. m The maximum distance D2 may be 0.5 times or more of the minimum width w of the opening provided in the mask layer 210. m The line width w of the wavy line 110 may be 0.5 times or more of the minimum width w of the opening provided in the mask layer 210. m The maximum distances D1 and D2 may be 0.3 times or more of the minimum width w mThe line width w of the wavy line 110 is, for example, 1 time or less. m For example, it is 0.5 times or less.

[0066] On the other hand, the maximum distance D1 is the minimum width w of the opening m It is preferable that the maximum distance D2 is 0.5 times or less. This can improve the stability of the mask layer 210. The maximum distance D2 is the minimum width w of the opening. m It is preferable that the width w of the wavy line 110 is 0.5 times or less. This can improve the stability of the mask layer 210. In addition, the width w of the wavy line 110 is preferably 0.5 times or less than the minimum width w of the opening. m It is preferable that the thickness is 0.3 times or less, which can improve the dischargeability of the conductive ink.

[0067] The method for manufacturing a conductive pattern according to this embodiment will be described below. The method for manufacturing a conductive pattern according to this embodiment includes a step of performing screen printing using a screen mask 20. According to the manufacturing method according to this embodiment, a conductive pattern with little thickness variation can be obtained.

[0068] 10 is a cross-sectional view illustrating the configuration of a structure 30 including a conductive pattern 320. The conductive pattern 320 can be, for example, at least one of a wiring pattern, a circuit pattern, an electrode pattern, a pattern having an electromagnetic wave shielding function, and an antenna pattern. The structure 30 can be, for example, at least one of a wireless communication tag (such as an RF tag), a circuit, an electromagnetic wave shielding film, a planar heating element, and an electronic device. Examples of electronic devices include sensors, solar cells, secondary batteries, membrane switches, etc.

[0069] In the screen printing step, the conductive ink is applied to the substrate 310 by screen printing. In this way, a pattern of the conductive ink can be formed on the substrate 310. This conductive pattern 320 has a shape and size corresponding to the opening pattern of the mask layer 210.

[0070] The thickness of the conductive ink film applied to the substrate 310 is not particularly limited, but is, for example, 0.003 mm or more and 0.03 mm or less.

[0071] The conductive ink contains conductive particles. The conductive particles may contain at least one element selected from the group consisting of silver, copper, gold, aluminum, platinum, palladium, iridium, tungsten, nickel, tantalum, lead, and zinc. In particular, from the viewpoints of availability and good conductivity, it is preferable that the conductive particles contain at least one element selected from the group consisting of silver and copper.

[0072] The conductive ink may further contain at least one of a solvent, a resin, and a binder. Specific examples of the resin or binder include polyvinylpyrrolidone, polyester, epoxy resin, (meth)acrylic resin, polyvinyl acetal, cellulose resin (e.g., ethyl cellulose), and phenol resin. The solvent may include at least one of water and an organic solvent.

[0073] The viscosity of the conductive ink at 25°C is not particularly limited, but may be 200 Pa·s or higher. In this case, the content of conductive particles in the conductive ink can be increased. Furthermore, when the viscosity of the conductive ink is high, thickness unevenness is more likely to occur than when the viscosity is low. However, the screen mesh 10 of this embodiment includes a portion having a structure in which the first and second groups are combined in a planar view, thereby reducing thickness unevenness. In other words, the screen mesh 10 of this embodiment is suitable for use when the viscosity of the conductive ink is high. The viscosity of the conductive ink at 25°C is, for example, 300 Pa·s or less. On the other hand, from the viewpoint of printability, the viscosity of the conductive ink at 25°C is preferably 100 Pa·s or less.

[0074] The substrate 310 is, for example, in the form of a film, a sheet, or a plate. The substrate 310 may or may not be flexible. The substrate 310 is, for example, a resin or paper. The substrate 310 is, for example, at least one selected from the group consisting of polyesters such as PET (polyethylene terephthalate) and PEN (polyethylene naphthalate), polyolefins such as polyethylene and polypropylene, polyimide, and paper.

[0075] In screen printing, the orientation of the squeegee is arbitrary. That is, the orientation of the squeegee relative to the first direction and the second direction is not particularly limited. However, from the viewpoint of reducing thickness unevenness, it is preferable that the direction of movement of the squeegee is parallel to the first direction or the second direction.

[0076] The method for manufacturing the conductive pattern 320 according to this embodiment may further include a sintering step after the screen printing step. In the step of sintering the conductive ink, the printed conductive ink pattern is heated to sinter the conductive particles contained in the conductive ink. This allows the conductive pattern 320 corresponding to the conductive ink pattern to be obtained. The thickness of the conductive pattern 320 is not particularly limited, but is, for example, 0.003 mm or more and 0.03 mm or less.

[0077] (Second embodiment) FIG. 17 is a diagram illustrating the flow of a manufacturing method for a conductive substrate 400 according to the second embodiment. The manufacturing method for a conductive substrate 400 according to this embodiment includes a printing step, a transfer step, and a pressure step. In the printing step, a conductive ink containing conductive particles is screen-printed onto a first substrate 41 using the screen mask 20 according to the first embodiment, thereby forming a conductive pattern 45 on the first substrate 41. In the transfer step, the conductive pattern 45 is transferred to a second substrate 42 different from the first substrate 41. In the pressure step, pressure is applied to a laminate including the second substrate 42 and the conductive pattern 45. These steps will be described in detail below.

[0078] In this embodiment, pressure is applied to the laminate of the second substrate 42 and the conductive pattern 45. Therefore, in the finally obtained conductive substrate 400, the adhesiveness of the conductive pattern 45 to the second substrate 42 is better than when the conductive pattern is simply printed on a substrate. In particular, in this embodiment, the screen mask 20 according to the first embodiment is used to screen-print a conductive ink containing conductive particles onto the first substrate 41, thereby obtaining a conductive pattern 45 with little thickness variation. Therefore, pressure can be applied uniformly, and the adhesiveness of the entire conductive pattern 45 can be improved.

[0079] Furthermore, it is thought that a finer and more accurate conductive pattern 45 can be formed by forming the pattern by a method called "transfer" rather than by directly printing the conductive ink onto the second substrate 42 to form the pattern.

[0080] The first substrate 41 is not particularly limited as long as the conductive pattern 45 can be easily separated. Specific examples of the first substrate 41 include resin films. More specific examples include resin films with a silicone resin applied to the surface and resin films with silicone resin kneaded into them. The main material of these resin films is not particularly limited, but in consideration of strength and cost, polyester-based materials are preferred, and polyethylene terephthalate is more preferred. Various commercially available films known as "release films" or "peeling films" can also be used as the first substrate 41.

[0081] Furthermore, release paper can also be used as the first substrate 41. Release paper typically refers to laminated paper in which a thin film-like resin is laminated on paper to give it easy peelability. Release paper is sometimes expressed as release paper. As for the release paper, various types of release paper available on the market can be used as appropriate.

[0082] The first substrate 41 may be in the form of a film or a sheet, or may be in the form of a cylinder, for example. For example, the first substrate 41 may be a roll whose surface is made of metal or resin, on which the conductive pattern 45 can be formed, and from which the conductive pattern 45 can be easily separated. By using a cylindrical first substrate 41, it is possible to expect improvements in the productivity of the conductive substrate 400. The first substrate 41 may be disposable or may be reused.

[0083] The conductive ink is as described in the first embodiment. In the printing process, the screen mask 20 described in the first embodiment is used to screen-print the conductive ink on the first substrate 41. The screen printing using the screen mask 20 is as described in the first embodiment.

[0084] When the conductive ink contains a solvent, the method for manufacturing the conductive substrate 400 according to this embodiment may further include a step of volatilizing the solvent in the conductive pattern 45. Heating conditions for volatilizing the solvent are, for example, 50 to 150°C for 1 to 60 minutes. However, the temperature is preferably set so as not to damage the first substrate 41. Heating can be performed, for example, by applying hot air to the conductive pattern 45. Another example is by placing the first substrate 41 and the conductive pattern 45 on a hot plate. Light heating is also possible. Specific examples include heating using a far-infrared heating furnace (IR oven) or Adphos NIR (ultra-near infrared), heating with a high-brightness LED, and laser heating.

[0085] It is preferable that the conductive particles in the conductive pattern 45 are not substantially sintered after being printed. Incidentally, the conductive particles are usually sintered by a known method after the pressure step described below. It is also preferable that the conductive pattern 45 is not substantially cured. Specifically, even if the conductive ink contains a curable resin or a crosslinking agent, it is preferable that the curable resin or crosslinking agent in the conductive pattern 45 is substantially unreacted after being printed.

[0086] In the transfer step, the conductive pattern 45 is transferred from the first substrate 41 to a second substrate 42 that is different from the first substrate 41. In the example of Fig. 17, the conductive pattern 45 is transferred to the second substrate 42 via an adhesive layer 43.

[0087] The second substrate 42 is usually in the form of a film, sheet, or plate. From the viewpoint of industrial productivity, the shape of the second substrate 42 is preferably one of these. The second substrate 42 is preferably flexible. By employing a flexible second substrate 42, a flexible printed circuit (FPC) can be manufactured. By using a flexible second substrate 42, it becomes easier to apply pressure using a "roll" in the pressure application step described below. This is preferable from the viewpoint of mass productivity. Just to be clear, the second substrate 42 may be a rigid substrate that does not have flexibility.

[0088] Considering cost and end use, the second substrate 42 is preferably at least one selected from the group consisting of polyesters such as PET (polyethylene terephthalate) and PEN (polyethylene naphthalate), polyolefins such as polyethylene and polypropylene, polyimide, polycarbonate, and paper. Here, the paper may be coated paper (paper whose surface is coated with a coating agent) or ordinary uncoated paper. Furthermore, the second substrate 42 is not limited to PET, and any general resin film can be used. Furthermore, the second substrate 42 may be transparent or opaque. Examples of opaque resin films include foamed resin films or foamed resin sheets, such as foamed PET film.

[0089] In this embodiment, even without heating or with heating at a relatively low temperature in the pressurizing step, sufficiently good adhesion of the conductive pattern 45 to the second substrate 42 can be obtained. Therefore, a second substrate 42 made of a low heat resistance material such as polyester, polyolefin, polycarbonate, or paper can also be suitably used as the substrate.

[0090] The adhesive layer 43 is preferably thermosetting or photocurable. More preferably, the adhesive layer 43 is formed of a thermosetting resin material or a photocurable resin material. When the second substrate 42 is light-transmitting, the adhesive layer 43 can be cured by irradiating light from the second substrate 42 side by making the adhesive layer 43 photocurable. When the second substrate 42 is not light-transmitting, the adhesive layer 43 can be cured by irradiating light from the adhesive layer 43 side, or by heating by making the adhesive layer 43 thermosetting. Just to be clear, the adhesive layer 43 may have both thermosetting and photocurable properties, or may have only one of thermosetting and photocurable properties.

[0091] Examples of materials that can be used to form the adhesive layer 43 include various thermosetting or photocurable resin materials. Specific examples include thermosetting or photocurable resin materials such as epoxy resin-containing materials, polymerizable (meth)acrylate-containing materials, urethane-based materials, urethane (meth)acrylate-containing materials, and silicone-based materials. The adhesive layer 43 can also be made of commercially available products. For example, the adhesive layer 43 can be made of various thermosetting or photocurable resin materials that are known or commercially available as hard coating agents. Additionally, various thermosetting or photocurable resin materials that are known or commercially available as primers can also be used.

[0092] When the adhesive layer 43 is thermosetting, it is preferable to form the adhesive layer 43 so that the thermosetting proceeds at a heating temperature that does not damage the second base material 42. For example, when the second base material 42 is made of a resin, it is preferable to design the adhesive layer 43 so that the curing reaction proceeds sufficiently when heated at a temperature lower than the glass transition temperature of the resin.

[0093] The thickness of the adhesive layer 43 is not particularly limited, but considering the need to obtain sufficient adhesion and to appropriately control penetration into the temporary pattern, it is preferably 1 to 30 μm, and more preferably 5 to 15 μm. The adhesive layer 43 may be a single layer or may have two or more layers. For example, if the second substrate 42 is paper, a two-layer adhesive layer 43 may be used in consideration of penetration into the fibrous paper. In this case, the first adhesive layer closest to the paper plays a role of "sealing."

[0094] In the transfer step, the conductive pattern 45 is brought into contact with the adhesive layer 43 provided on the surface of the second substrate 42. This causes the conductive pattern 45 to be transferred to the surface of the adhesive layer 43. Then, the first substrate 41 is peeled off from the conductive pattern 45. However, the step of peeling off the first substrate 41 from the conductive pattern 45 may be performed after the adhesive layer curing step described below and before the pressure application step.

[0095] In the example of Figure 17, an adhesive layer curing step is performed between the transfer step and the pressure step, in which the curing of the adhesive layer 43 progresses. Note that in Figure 17, the laminate is depicted upside down for the transfer step and the adhesive layer curing step. The adhesive layer 43 can be cured by light such as ultraviolet light if the adhesive layer 43 is photocurable. Alternatively, the adhesive layer 43 can be cured by heating if the adhesive layer 43 is thermosetting. The light irradiation and heating conditions may be adjusted and optimized as appropriate depending on the specific material that constitutes the adhesive layer 43. However, when curing the adhesive layer 43 by heating, care must be taken to ensure that the second substrate 42 is not damaged by the heat.

[0096] In the adhesive layer curing step, it is preferable to completely cure the adhesive layer 43, but it is also possible to cure it to a certain extent, without completely curing it.

[0097] In the pressing step, a laminate including the second substrate 42 and the conductive pattern 45 is pressed. In the example of FIG. 17 , a laminate including the second substrate 42, the adhesive layer 43, and the conductive pattern 45 is placed on a flat plate, and a roll 48 is placed on top of the laminate. The roll 48 is rolled to pressurize the laminate. In this way, the pressing step may use one or more rolls 48. However, the pressing method is not limited to the example of FIG. 17 . As another example, the laminate including the second substrate 42, the adhesive layer 43, and the conductive pattern 45 may be sandwiched between two rolls 48 with their sides facing each other and the two rolls 48 rotated. In this case, the laminate is pressed while being transported between the two rolls 48. In addition, in FIG. 17 , the laminate is pressed with the second substrate 42 facing the flat plate and the conductive pattern 45 facing the roll 48. However, the laminate may also be pressed with the second substrate 42 facing the roll 48 and the conductive pattern 45 facing the flat plate. As yet another example, the laminate may be pressed by sandwiching it between two flat plates (i.e., two flat surfaces).

[0098] By not applying too great a pressure P to the conductive pattern 45 in the pressing step, it is possible to prevent damage to the second base material 42 and the conductive pattern 45. Incidentally, if the second base material 42 has sufficient strength, the pressure P can be increased to improve the adhesion of the finally obtained conductive pattern 45 to the second base material 42.

[0099] In the method for manufacturing the conductive base material 400 according to this embodiment, after the pressing step, the conductive pattern 45 is sintered by a known method (for example, heating, etc.) to obtain the conductive base material 400.

[0100] In the method for manufacturing the conductive substrate 400 according to this embodiment, the conductive substrate 400 is obtained, which includes at least the second substrate 42 and the conductive pattern 45. In the example of FIG. 17 , the conductive substrate 400 further includes an adhesive layer 43 between the second substrate 42 and the conductive pattern 45.

[0101] The present inventors have discovered that in a manufacturing method in which a conductive pattern is transferred and pressed by a roll, if the conductive pattern has large thickness unevenness, cracks are likely to occur in the conductive pattern due to the pressure applied by the roll. In contrast, in the manufacturing method of the conductive substrate 400 according to this embodiment, a conductive pattern 45 with small thickness unevenness is obtained by performing screen printing using the screen mask 20 according to the first embodiment. Therefore, even when the conductive pattern 45 is transferred and pressed by a roll 48, the effect of preventing cracks from occurring in the conductive pattern 45 is achieved. This will be described in detail below.

[0102] 18 is a diagram illustrating a method for manufacturing a conductive substrate according to a reference example. In this reference example, a conductive pattern 55 having large thickness variations is formed on a first substrate 51 without using the screen mask 20 according to the first embodiment in the printing process.

[0103] In the reference example, when the second base material 52 having the adhesive layer 53 attached thereto is brought into contact with the conductive pattern 55, a portion of the conductive pattern 55 does not come into contact with the adhesive layer 53 due to unevenness in the thickness of the conductive pattern 55. The portion of the conductive pattern 55 that does not come into contact with the adhesive layer 53 remains floating above the adhesive layer 53 even after the adhesive layer curing step. When pressure is applied by the roll 58 in this state, the conductive pattern 55 peels up from the adhesive layer 53 in the portion of the conductive pattern 55 that does not come into contact with the adhesive layer 53, causing cracks in the conductive pattern 55.

[0104] In order to prevent such cracks in conductive pattern 55 with large thickness variations, it is conceivable to ensure that the thickness of adhesive layer 53 is equal to or greater than the difference in elevation of the surface of conductive pattern 55. However, such a method raises the problems of an increased thickness of the conductive base material that is ultimately obtained, and an increased cost due to the formation of thick adhesive layer 53.

[0105] In the method for manufacturing the conductive substrate 400 according to this embodiment, the screen mask 20 according to the first embodiment is used to perform screen printing, thereby obtaining a conductive pattern 45 with little thickness variation. Therefore, the entire conductive pattern 45 is likely to come into contact with the adhesive layer 43 without floating, that is, is well adhered to the second substrate 42. As a result, an effect is obtained in which cracks are unlikely to occur in the conductive pattern 45 even when pressure is applied by the roll 48.

[0106] In the method for producing the conductive substrate 400 according to this embodiment, a laminate including the second substrate 42 and the conductive pattern 45 is pressurized. Therefore, in the finally obtained conductive substrate 400, the adhesiveness of the conductive pattern 45 to the second substrate 42 is better than when the conductive pattern is simply printed on the substrate. In addition, in the method for producing the conductive substrate 400 according to this embodiment, the screen mask 20 according to the first embodiment is used for screen printing, thereby obtaining a conductive pattern 45 with little thickness variation. Therefore, even when the conductive pattern 45 is transferred and pressed by a roll, the effect of preventing cracks from occurring in the conductive pattern 45 is obtained. [Example]

[0107] The present embodiment will be described in detail below with reference to examples, but the present embodiment is not limited to the descriptions of these examples.

[0108] <Comparative Example> For a screen mesh made of straight wires that intersect vertically and horizontally in a plan view, the degree of variation M in the first and second states was determined using the method described in the first embodiment. The opening ratio of the screen mesh in Example 1 was 0.56.

[0109] FIG. 11 is a diagram showing the relationship between a screen mesh according to a comparative example and multiple slit positions in a first state. In FIG. 11, the silhouette outline of the screen mesh in a plan view is shown by a solid line, and slits arranged at multiple positions are shown by dotted lines. This is the same as FIG. 13, which will be described later. FIG. 12 is a graph showing the relationship between the slit position and the opening area S when the slit is in the first state in the comparative example. In the graph showing the relationship between the slit position and the opening area S, the slit position shown on the horizontal axis corresponds to the slit number when the multiple slit positions are numbered in order from the left. The opening area S shown on the vertical axis is the maximum value S max is normalized to be 1. The same applies to Figs. 14 to 16 described later.

[0110] Fig. 13 is a diagram showing the relationship between a screen mesh according to a comparative example and the positions of multiple slits in the second state. Fig. 14 is a graph showing the relationship between the slit positions and the opening area S when the slits are in the second state in the comparative example.

[0111] Example 1 For the screen mesh shown in Fig. 1 of the first embodiment, the degree of variation M in the first and second states was determined using the method described in the first embodiment. That is, in Example 1, the screen mesh included a portion having a structure in which the first group and the second group were combined in plan view. The opening ratio of the screen mesh according to Example 1 was 0.67.

[0112] The relationship between the screen mesh according to Example 1 and the positions of the slits in the first state is as shown in Fig. 5. Fig. 15 is a graph showing the relationship between the slit positions and the opening area S when the slits are in the first state in Example 1.

[0113] The relationship between the screen mesh according to Example 1 and the positions of the slits in the second state is as shown in Fig. 6. Fig. 16 is a graph showing the relationship between the slit positions and the opening area S when the slits are in the second state in Example 1.

[0114] <Example 2> For the screen mesh of Example 2, the degree of fluctuation M in the first state and the second state was determined using the method described in the first embodiment. The screen mesh of Example 2 was the same as Example 1 except that the opening ratio was set to 0.44.

[0115] The fluctuation degree M of the screen meshes according to the comparative example, example 1, and example 2 is summarized in Table 1. Table 1 also shows the opening ratio of each screen mesh and the absolute value (referred to as the "difference Δ") of the difference between the fluctuation degree M in the first state and the fluctuation degree M in the second state.

[0116] [Table 1]

[0117] The fluctuation rate of the screen mesh according to the comparative example was 1.00 when the slit orientation was in state 1. Therefore, it can be seen that the screen mesh according to the comparative example can cause large thickness variations during printing.

[0118] On the other hand, the fluctuation rates of the screen meshes of Examples 1 and 2 were both less than 1 when the slit orientation was in the first state and when it was in the second state, indicating that thickness unevenness was reduced compared to the comparative example.

[0119] Although the embodiments of the present invention have been described above with reference to the drawings, these are merely examples of the present invention, and various other configurations can also be adopted. [Explanation of symbols]

[0120] 10 screen mesh 20 Screen Mask 30 Structure 41 First base material 42 Second base material 43 Adhesive layer 45 Conductive Pattern 48 rolls 51 1st base material 52 Second base material 53 Adhesive layer 55 Conductive Pattern 58 rolls 90 wire 91 areas 92 Mask Section 94 Aperture 96 Non-opening 110 Wavy Line 120 cycle units 140 slit 210 Mask Layer 310 Base material 320 Conductive Pattern 400 Conductive substrate

Claims

1. A screen mesh for printing conductive ink, comprising: The invention includes a portion having a structure in which, in a plan view, a first group of a plurality of wavy lines each extending in a first direction and a second group of a plurality of wavy lines each extending in a second direction different from the first direction are combined. Screen mesh.

2. The screen mesh according to claim 1, In a plan view, the plurality of wavy lines constituting the first group are spaced apart from one another, and the plurality of wavy lines constituting the second group are spaced apart from one another. Screen mesh.

3. The screen mesh according to claim 2, In a plan view, the shortest distance between the plurality of wavy lines constituting the first group is 0.95 to 1.05 times the shortest distance between the plurality of wavy lines constituting the second group. Screen mesh.

4. The screen mesh according to claim 1 or 2, In a plan view, each of the plurality of wavy lines constituting the first group intersects with at least one of the plurality of wavy lines constituting the second group. Screen mesh.

5. The screen mesh according to claim 4, In a plan view, each of the plurality of wavy lines constituting the first group intersects with at least one of the plurality of wavy lines constituting the second group such that inflection points intersect with each other. Screen mesh.

6. The screen mesh according to claim 1 or 2, In a plan view, among the plurality of wavy lines constituting the first group, adjacent wavy lines are line-symmetric, and among the plurality of wavy lines constituting the second group, adjacent wavy lines are line-symmetric. Screen mesh.

7. The screen mesh according to claim 1 or 2, an average wave period of the plurality of wavy lines constituting the first group is 0.95 to 1.05 times the average wave period of the plurality of wavy lines constituting the second group in a plan view; In a plan view, an average amplitude of waves drawn by the plurality of wavy lines constituting the first group is 0.95 to 1.05 times the average amplitude of waves drawn by the plurality of wavy lines constituting the second group. Screen mesh.

8. The screen mesh according to claim 1 or 2, In plan view, the screen mesh has a periodic structure in which periodic units are arranged two-dimensionally, the periodic unit is a square, On the screen mesh, the rectangular slits are moved in the direction of the short side by the length of the short side of the slit, and the opening area through the slit at each slit position is identified, and the maximum value of the identified multiple opening areas is designated as S. ｍａｘ , the minimum value is S ｍｉｎ When this is done, the degree of fluctuation M = (S ｍａｘ -S ｍｉｎ ) / (S ｍａｘ +S ｍｉｎ ) is 0.8 or less when the orientation of the slit is in the first state and when the orientation of the slit is in the second state, a length of a long side of the slit is the length of one side of the square that is the periodic unit, and a length of a short side of the slit is half the line width of the wavy line in a plan view, the first state is a state in which a long side of the slit is parallel to any side of the square that is the periodic unit, The second state is a state in which the orientation of the slit is rotated 45° clockwise from the first state. Screen mesh.

9. The screen mesh according to claim 1 or 2, In plan view, the screen mesh has a periodic structure in which periodic units are arranged two-dimensionally, the periodic unit is a rectangle, On the screen mesh, the rectangular slits are moved in the direction of the short side by the length of the short side of the slit, and the opening area through the slit at each slit position is identified, and the maximum value of the identified multiple opening areas is designated as S. ｍａｘ , the minimum value is S ｍｉｎ When this is done, the degree of fluctuation M = (S ｍａｘ -S ｍｉｎ ) / (S ｍａｘ +S ｍｉｎ ) is 0.8 or less when the orientation of the slit is in the first state and when the orientation of the slit is in the second state, the length of a long side of the slit is the length of a long side of the rectangle that is the periodic unit, and the length of a short side of the slit is half the line width of the wavy line in a plan view, the first state is a state in which a long side of the slit is parallel to a long side of a rectangle that is the periodic unit, The second state is a state in which the orientation of the slit is rotated 45° clockwise from the first state. Screen mesh.

10. The screen mesh according to claim 1 or 2, Each of the plurality of wavy lines is a curved line. Screen mesh.

11. The screen mesh according to claim 1 or 2, each of the plurality of wavy lines has a shape in plan view in which a plurality of arcs are connected; In a plan view, when the line width of the wavy line is w and the longest distance from the chord of the arc to the arc is d, w / 2<d holds. Screen mesh.

12. The screen mesh according to claim 1 or 2; a mask layer attached to the screen mesh; Screen mask.

13. A step of performing screen printing using the screen mask according to claim 12 is included. A method for manufacturing a conductive pattern.

14. forming a conductive pattern on a first substrate by screen-printing a conductive ink containing conductive particles on the first substrate using the screen mask according to claim 12; transferring the conductive pattern to a second substrate different from the first substrate; and applying pressure to a laminate including the second base material and the conductive pattern. A method for manufacturing a conductive substrate.

Images