Electronic apparatus

Abstract

To provide an electronic apparatus excellent in portability or an electronic apparatus excellent in at-a-glance visibility.SOLUTION: An electronic apparatus has a first support body, a second support body, a first hinge, and a flexible display panel. The first hinge has a first rotation axis and connects the first support body and the second support body. The first support body and the second support body are relatively rotatable about the first rotation axis. The display panel has a first section supported by the first support body, a second section supported by the second support body, and a third section that is not supported between a first area and a second area. A first plane including a display surface overlapping with the first section and the first rotation axis are in parallel. A second plane including a display surface overlapping with the second section and the first rotation axis are in parallel. Each of a distance between the first plane and the first rotation axis and a distance between the second plane and the first rotation axis are larger than zero.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] One aspect of the present invention relates to a display device. In particular, the display device has flexibility and can be bent. Further, one embodiment of the present invention relates to an electronic device including a display device.

[0002] Note that one embodiment of the present invention is not limited to the above technical fields. The technical field of one aspect relates to an article, a method, or a manufacturing method. One aspect of the present invention is a process, machine, manufacture, or composition. Therefore, the invention disclosed herein more specifically relates to The technical field of one embodiment of the present invention is a semiconductor device, a display device, a light-emitting device, a lighting device, a power storage device, Examples include storage devices, methods for driving them, and methods for manufacturing them. Cut. [Background technology]

[0003] In recent years, display devices have been expected to be used in a variety of applications, and are becoming increasingly diverse. For example, display devices used in portable electronic devices must be thin and lightweight. There is also a demand for new applications that have not been seen before. are.

[0004] In addition, Patent Document 1 discloses a film substrate on which transistors and other elements serving as switching elements are mounted. A flexible active matrix light emitting device having an organic EL element is disclosed. . [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Laid-Open No. 2003-174153 Summary of the Invention [Problem to be solved by the invention]

[0006] In recent years, the amount of information displayed has increased by enlarging the display area of ​​the display device, and the list of displayed information has On the other hand, for mobile device applications, the display devices are becoming larger. This reduces portability. It was difficult to achieve both high portability and high reliability.

[0007] An object of one embodiment of the present invention is to provide an electronic device with excellent portability. It is an object of the present invention to provide an electronic device with excellent visibility. It is one of the objects to provide a novel display device or electronic device. One of the goals is to

[0008] The description of these problems does not preclude the existence of other problems. It is not necessary to solve all of these problems. It will be clear from the description of the specification, etc. that there are other problems than those mentioned above. It is possible to extract it. [Means for solving the problem]

[0009] One aspect of the present invention is a display device including a first support, a second support, a first hinge, and a display panel. , wherein the display panel is flexible, and the display panel includes a first display a first display surface and a second display surface, and the first hinge is configured to rotate about a first rotation axis. The first hinge has a function of connecting the first support and the second support. The first support and the second support are capable of rotating relatively around the first rotation axis. The display panel has a function of being able to switch between a first part, a second part, and a third part. The first portion has a portion supported by a first support, and the second portion has a second The third portion is supported by the first support and the second support. The first display surface has an unfixed portion, and the first display surface and the first portion overlap each other. The second display surface has an area where the second display surface and the second portion overlap each other. The first plane has a region parallel to the first axis of rotation, and the first plane has a first surface. The first plane is located on the same plane as the first display surface, and the first plane is positioned in a direction parallel to the first display surface. The first plane is an extended plane, and the first plane and the first rotation axis overlap each other. The second plane has an area parallel to the first axis of rotation, and the second plane has an area parallel to the second axis of rotation. The second plane is located in the same plane as the display surface of the first display, and the second plane is located in a direction parallel to the second display surface. The second plane is a plane obtained by extending the first plane, and the second plane and the first rotation axis overlap each other. a distance between the first plane and the first rotation axis is greater than 0; The distance between the rotation axis is greater than 0.

[0010] Furthermore, one aspect of the present invention is a display panel including a first support, a second support, a first hinge, and a display panel. The display panel is an electronic device having a first portion supported by a first support. a second portion supported by a second support; and a movable member located between the first portion and the second portion. and a flexible third portion. The display panel includes a first portion, a second portion, and The first hinge has a first rotation axis and a first support. The first support and the second support have a function of connecting the first support and the second support. The first portion has a function of rotating relatively around a rotation axis of the first portion. a second plane that is parallel to the first rotation axis and includes a display surface that overlaps with the second portion; , the first rotation axis is parallel, and the distance between the first plane and the first rotation axis is greater than 0. , the distance between the second plane and the first rotation axis is greater than 0.

[0011] In the above, the distance between the first plane and the first rotation axis is 0.1 mm or more and 20 mm or less. It is preferable that the distance between the second plane and the first rotation axis is 0.1 mm or more and 20 mm or less. It's nice.

[0012] In the above, the distance between the first plane and the first rotation axis and the distance between the second plane and the first rotation axis are It is preferable that the distances from and are approximately equal.

[0013] In the above, the first support and the second support are rotated by 180 degrees around the first rotation axis. Preferably, the two electrodes are relatively rotatable by an angle greater than 1 / 2.

[0014] In the above, when the first plane and the second plane coincide with each other, the first rotation axis is The third display surface is located on the side of the normal vector of the display surface and overlaps with the third portion, and is concave. It is preferable that the display panel be foldable so that the first plane and the second plane are aligned. When the two planes coincide, the first rotation axis is opposite to the direction of the normal vector of the first display surface. and folding the display panel so that the third display surface overlapping the third portion is convex. It is preferably bendable.

[0015] In the above, the device further includes a third support and a second hinge, has a function of being able to rotate around a second rotation axis, and the second hinge has a function of being able to rotate around a second rotation axis, and the second hinge has a function of being able to rotate around a second rotation axis. The second support and the third support can be connected. The support has a function of being able to rotate relatively around the second rotation axis, and the display panel , a fourth portion, and a fifth portion, and the display panel has a fourth display surface, and the fourth portion The fifth portion has a portion supported by the third support, and the fifth portion is supported by the second support and the third support. The fourth display surface has a portion that is not fixed to the support, and the fourth display surface and the fourth portion are mutually The first plane has an area that overlaps the second plane, the second plane has an area that is parallel to the second axis of rotation, and the third plane has an area that is parallel to the second axis of rotation. The surface has a region parallel to the second axis of rotation, and the third plane is coplanar with the fourth display surface. The third plane is a plane extending the fourth display surface in a direction parallel to the fourth display surface. The third plane has an area where the third plane and the second rotation axis overlap each other, and the second The distance between the plane and the second rotation axis is greater than 0, and the distance between the third plane and the second rotation axis is 0 Larger is preferred.

[0016] Alternatively, the device may further include a third support and a second hinge, and the second hinge may include , having a second rotation axis and having a function of connecting the second support and the third support, The support and the third support have a function of rotating relatively around the second rotation axis, and the display The panel has a fourth portion supported by a third support and positioned between the second portion and the fourth portion. and a fifth portion that is flexible, and the display surface is The third plane includes a display surface that overlaps with the fourth portion, and the second rotation axis is a plane. The second plane and the second rotation axis are parallel to each other. It is preferable that the distance between the third plane and the second rotation axis is greater than 0, and the distance between the third plane and the second rotation axis is greater than 0. It's nice.

[0017] In the above, the distance between the second plane and the second rotation axis is 0.1 mm or more and 20 mm or less. and the distance between the third plane and the second rotation axis is 0.1 mm or more and 20 mm or less. preferable.

[0018] In the above, the distance between the second plane and the second rotation axis and the distance between the third plane and the second rotation axis are It is preferable that the distances from and are approximately equal.

[0019] In the above, the second support and the third support are rotated by 180 degrees around the second rotation axis. Preferably, the two electrodes are relatively rotatable by an angle greater than 1 / 2.

[0020] In the above, when the second plane and the third plane coincide with each other, When the planes coincide, the second rotation axis is located on the side of the normal vector of the second display surface, and the The display panel is bendable so that the fifth display surface overlapping the fifth portion is concave. Alternatively, when the second plane and the third plane coincide with each other, the second rotation axis is preferably the first rotation axis. The fifth portion is located on the opposite side of the normal vector of the second display surface and overlaps with the fifth portion. It is preferable that the display panel be foldable so that the display surface is convex. [Effects of the Invention]

[0021] It is possible to provide an electronic device with excellent portability or with excellent visibility. Alternatively, a highly reliable electronic device can be provided. Alternatively, a novel display device or electronic device can be provided. The description of these effects does not preclude the existence of other effects. Note that one embodiment of the present invention does not necessarily have all of these effects. Effects other than these will become apparent from the description, drawings, claims, etc. It is possible to extract other effects from the description, drawings, claims, etc. do. [Brief explanation of the drawings]

[0022] [Figure 1] 1 shows an example of the configuration of an electronic device according to an embodiment. [Figure 2] 1 shows an example of the configuration of an electronic device according to an embodiment. [Figure 3] 1 shows an example of the configuration of an electronic device according to an embodiment. [Figure 4] 1 shows an example of the configuration of an electronic device according to an embodiment. [Figure 5] 1 shows an example of the configuration of an electronic device according to an embodiment. [Figure 6] 1 shows an example of the configuration of an electronic device according to an embodiment. [Figure 7] 1 shows an example of the configuration of an electronic device according to an embodiment. [Figure 8] 1 shows an example of the configuration of an electronic device according to an embodiment. [Figure 9] 1 shows an example of the configuration of an electronic device according to an embodiment. [Figure 10] 1 shows an example of the configuration of an electronic device according to an embodiment. [Figure 11] 1A and 1B are diagrams illustrating examples of light-emitting panels according to an embodiment. [Figure 12] 1A and 1B are diagrams illustrating examples of light-emitting panels according to an embodiment. [Figure 13] 1A to 1C illustrate an example of a method for manufacturing a light-emitting panel according to an embodiment. [Figure 14] 1A to 1C illustrate an example of a method for manufacturing a light-emitting panel according to an embodiment. [Figure 15] FIG. 1 is a diagram showing an example of a touch panel according to an embodiment. [Figure 16] FIG. 1 is a diagram showing an example of a touch panel according to an embodiment. [Figure 17] FIG. 1 is a diagram showing an example of a touch panel according to an embodiment. [Figure 18] FIG. 1 is a diagram showing an example of a touch panel according to an embodiment. [Figure 19] 1A and 1B are a block diagram and a timing chart of a touch sensor according to an embodiment. [Figure 20] FIG. 2 is a circuit diagram of a touch sensor according to an embodiment. [Figure 21] 1A and 1B are a block diagram and a timing chart of a display device according to an embodiment. [Figure 22] 1A to 1C are diagrams illustrating operations of a display device and a touch sensor according to an embodiment. [Figure 23] 1A to 1C are diagrams illustrating operations of a display device and a touch sensor according to an embodiment. [Figure 24] FIG. 1 is a block diagram of a touch panel according to an embodiment. [Figure 25] FIG. 2 is a circuit diagram of a pixel according to the embodiment. [Figure 26] 4 is a timing chart illustrating an operation of a display device according to an embodiment. [Figure 27] 10 is a photograph of an electronic device according to an embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0023] The embodiments will be described in detail with reference to the drawings. However, the present invention is not limited to the following description. The present invention is not limited to the above embodiments, and various changes and modifications may be made in form and detail without departing from the spirit and scope of the present invention. Therefore, the present invention is based on the following embodiments. The present disclosure should not be construed as being limited to the contents of the preceding paragraph.

[0024] In the configuration of the invention described below, the same parts or parts having similar functions are The same reference numerals are used in common between different drawings, and repeated explanations thereof will be omitted. When referring to a function, the hatch pattern may be the same and no particular symbol may be assigned.

[0025] In each figure described in this specification, the size, layer thickness, or area of ​​each component is The figures may be exaggerated for clarity and are not necessarily limited to that scale. stomach.

[0026] In this specification, ordinal numbers such as "first" and "second" are used to avoid confusion of components. The number is not a numerical limitation.

[0027] In this specification, the fact that the surface A is parallel to the surface B means that the angle between the normal to the surface A and the normal to the surface B is In this specification, the C-plane is defined as a plane that is inclined from -20° to 20°. Perpendicular to surface B means that the angle between the normal to surface C and the normal to surface B is between 70° and 110°. In addition, in this specification, the expression "line D is perpendicular to surface B" means that the normal line between line D and surface B is The angle between the first and second electrodes is defined as -20° to 20°. The line E is parallel to the surface B if the angle between the line E and the normal to the surface B is between 70° and 110°. This refers to the

[0028] (Embodiment 1) In this embodiment, a structural example of an electronic device according to one embodiment of the present invention will be described with reference to drawings. do.

[0029] [Configuration example 1] FIG. 1A is a perspective view of an electronic device 100 according to this configuration example. The display panel 101 includes a support 102 a, a support 102 b, and a hinge 103 .

[0030] The support 102a and the support 102b are connected by a hinge 103. The support 102a and the support 102b are rotated relative to each other around the rotation axis 111 of the hinge 103. In the example of the configuration shown in FIG. 1(A), the support 102a and the support 102b are supported by water. From the flat state, the support 102a and the support 102b are rotated at an angle of 180° or more around the rotation axis 111. 102b can be rotated relative to each other.

[0031] Here, the rotation axis 111 of the hinge 103 is the rotation axis of the rotation mechanism of the hinge 103. For example, if the hinge 103 rotates around an axis such as a tangible object, In the case where the mechanism is provided, the straight line coinciding with the extension direction of the shaft is set as the rotation axis 111.

[0032] The display panel 101 has a display surface on which images and the like that are visually recognized by the user are displayed. In the fine print, the display surface refers to the surface of the display panel on which images are displayed. .

[0033] At least a part of the display panel 101 is flexible. The display panel 101 can be reversibly transformed from a flat surface to a curved surface. The display panel 101 has a small portion that deforms in accordance with a change in the relative position of the two supports. It is sufficient that the first portion has flexibility, and the other portions do not have to have flexibility.

[0034] The display panel 101 is partially supported by the support 102a and partially supported by the support 102b. Supported by 02b.

[0035] In the electronic device 100 according to one embodiment of the present invention, a flexible display panel 101 is provided between two supports. The display panel 101 is configured to be supported by the user's body. For example, the display panel 101 can be bent so that the display surface faces inward (inward bending). Moreover, the display panel 101 can be folded by bending it. The electronic device 100 of this embodiment is highly portable when the display panel 101 is folded, and is portable when unfolded. When in this state, the large, seamless display area provides excellent visibility.

[0036] FIG. 1B is a schematic diagram showing each area (also called a portion) of the display panel 101. The panel 101 is supported by the support 102a at the portion where it overlaps with the support 102a. The display panel 101 has a portion 101a that overlaps with the support 102b. The display panel 101 has a portion 101b supported by a support 102b. Between the portion 101a and the portion 101b, there is a portion 101c which is not fixed to any support. It has.

[0037] In the portion 101a, the display surface of the display panel 101 is made flat. It is preferable that the portion 101b is supported by the support 102a. The display panel 101 is supported by the support 102b so that the display surface of the display panel 101 is horizontal. It is preferable that the support is

[0038] The display panel 101 is attached to each support so as to slide in a direction parallel to the bending direction. For example, the display panel 101 is preferably supported such that its position in the thickness direction is fixed. In this case, the display panel 101 is preferably supported by the respective supports. It slides in the direction parallel to the display surface, but is fixed in position in the direction perpendicular to this. By using such a supporting method, for example, the display panel 101 When the supports are rotated relative to each other from a flat state to a 180° bent state, The slight difference in the length of the display panel 101 between the two states is compensated for by the sliding operation. This can prevent the display panel 101 from being damaged. The display panel 101 may be fixed so that it does not slide. In addition, the display panel 101 may have a stretchable portion. By expanding or contracting a portion of the display panel 101, the deviation in length can be compensated for. The display panel 101 is configured so that the portion 101c of the display panel 101 is bent in the open state. The display panel 101 may be provided with a flexure to achieve the above length. This can compensate for the discrepancy.

[0039] The method of supporting the display panel 101 by the supports is not particularly limited. The display panel 101 is sandwiched between two members that are processed to form a groove into which the display panel 101 fits. By using a method of holding the display panel 101, the display panel 101 can be supported so as to slide. In addition, when fixing the display panel 101 to each support, for example, a bonding method, a screw method, or the like can be used. or a method of fixing the display panel 101 mechanically by sandwiching it between members. can be done.

[0040] The area of ​​the portion 101a and the portion 101b is not particularly limited, and at least the display panel 101 is a diagram showing two regions supported by respective supports, and between these, there is no support. It is sufficient to have one or more areas that are not supported (fixed). For example, the edge of each support and The display panel 101 is supported in the overlapping area, and the entire visible area is supported by the support. It may be a portion 101c that does not have a hole.

[0041] FIG. 1(C) is a schematic cross-sectional view taken along the line A1-A2 in FIG. 1(A). In (C), the hinge 103 is shown by a dashed line to show the positional relationship between each component and the hinge 103. There are.

[0042] In each drawing of FIG. 1, a support is provided so that the display surface of the display panel 101 is flat over its entirety. 102a and the support 102b are positioned. a first plane 110a including a display surface in a portion 101a of the display panel 101; 10 shows a case where the second plane 110b including the display surface in the portion 101b is parallel to the second plane 110b. do.

[0043] At this time, the rotation axis 111 of the hinge 103 is aligned so as to overlap with the portion 101c of the display panel 101. (i.e., positioned on the portion 101c). As shown in FIG. 1, the rotation axis 111 of the hinge 103 and the display surface of the display panel 101 do not coincide with each other. (i.e., the rotation axis 111 is not positioned in a plane including the display surface), It is preferable that the distance between 111 and the display surface is r0. , the distance between the first plane 110a and the rotation axis 111, and the distance between the second plane 110b and the rotation axis 111 The hinge 103 is rotated so that the distances from the axis 111 are all greater than 0. It is preferable that the first plane 110a and the second plane 110b are When they coincide (i.e., are located on the same plane), the rotation axis 111 of the display panel 101 On the display surface side (specifically, on the side of the normal vector of the display surface), It is set up like this.

[0044] As shown in FIG. 1C, the display surface of the display panel 101 and the rotation axis 111 are parallel to each other. That is, it is preferable that the first plane 110a and the rotation axis 111 are parallel to each other. It is also preferable that the second plane 110b and the rotation axis 111 are parallel to each other.

[0045] When the display surface of the display panel 101 is made flat, a plane including the display surface (here, the first The plane including the first plane 110a and the second plane 110b is strictly parallel to the rotation axis 111. In this case, the display screen of the display panel 101 may not overlap with the display screen of the display panel 101. In the region, the first plane 110a or the second plane 110b intersects with the rotation axis 111. It should be noted that if the plane including the display surface and the rotation axis 111 are not strictly parallel ( That is, when the angle between the normal direction of the display surface and the rotation axis 111 is not exactly 90°, The distance r0 between the axis 111 and the display surface (or the first plane 110a, the second plane 110b) is Among the straight lines including the rotation axis 111, a line segment overlapping the display surface of the display panel 101 and the display surface (or The smallest distance between the first plane 110a and the second plane 110b is defined as the distance r0. It is possible.

[0046] FIG. 2(A) shows a state in which the support 102b is rotated relative to the support 102a by 18 degrees around the rotation axis 111. 2(B) is a perspective view of the electronic device 100 in a state where the electronic device 100 is rotated by 0°. FIG. 2(C) is a schematic cross-sectional view taken along the line B1-B2 in FIG. 2(A). 1 is an enlarged schematic cross-sectional view of the area surrounded by the dashed line in FIG.

[0047] As shown in FIGS. 2B and 2C, the display panel 101 has a concave display surface at a portion 101c. The display panel 101 has a portion curved 180 degrees so as to have a shape similar to that of the display panel 101. a first plane 110a including a part of the display surface in the portion 101b; It is parallel to the containing plane 110b.

[0048] At this time, the distance between the first plane 110a and the rotation axis 111 and the distance between the second plane 110b and the rotation axis 111 are It is preferable to set the distance between the axis 111 and the axial direction of the gyro so that the distance (r0) is the same as that of the axis 111. If the distances are equal, when the two supports are open as shown in Figure 1, No step (height difference) occurs on the surface of the display panel 101 located between the supports, and the display panel 1 It is possible to make the entire display surface of the 01 flat (planar). As a result, it has excellent visibility. The electronic device 100 can be realized.

[0049] A part of the portion 101c of the display panel 101 curves in accordance with the angle formed by the two supports. Furthermore, the two supports are each supported by a hinge 103 and rotate around a rotation axis 111. Therefore, when the angle between the two supports is changed, the portion 10 of the display panel 101 The direction of the force applied to 1c is parallel to the direction of rotation of the support, in other words, The direction is perpendicular to the surface in contact with the display panel 101. Most of the components of the force acting on the component 101c are parallel to the thickness direction of the display panel 101, That is, the display panel 101 is curved in this direction. Since no unnecessary force is applied, the curved portion of the display panel 101 is effectively prevented from being damaged. It can be effectively suppressed.

[0050] As shown in FIG. 2(C), the first plane 110a and the second plane 110b are parallel to each other. At a certain point, the radius of curvature r1 of the curved portion of the display panel 101 becomes approximately equal to the distance r0. do.

[0051] FIG. 3A shows a state in which the support 102b is rotated relative to the support 102a by 18 degrees around the rotation axis 111. 1 is a schematic perspective view of electronic device 100 in a state where it is rotated at an angle greater than 0°. 3B is a schematic cross-sectional view taken along the line C1-C2 in FIG. (C) is an enlarged schematic cross-sectional view of the area enclosed by the dashed line in FIG. 3(B).

[0052] In each of the drawings in FIG. 3, the support 102a and the support 102b are on the opposite side of the hinge 103. The two supports are shown rotated so that their edges touch.

[0053] As shown in FIG. 3C, when the display panel 101 is rotated by more than 180° from the flat state, When the two supports are rotated at a certain angle, the curvature of the portion 101c of the display panel 101 is The radius r1 is the distance between the rotation axis 111 of the hinge 110 and the first plane 110a (or the second plane 110b). 0b) is smaller than the distance r0.

[0054] Here, the radius of curvature r1 of the curved portion of the display panel 101 is the radius of curvature of the curved display surface. The smallest radius of curvature.

[0055] The larger the rotation angle from the flat state of the display panel 101, the greater the curvature relative to the distance r0. The radius r1 becomes smaller. For example, when the rotation angle is 185°, the radius of curvature r1 becomes smaller than the distance r When the rotation angle is 190°, the radius of curvature r1 is approximately 0.87 times the distance r0. When the rotation angle is 195°, the radius of curvature r1 is approximately 0.82 times the distance r0.

[0056] If the rotation angle of the display panel 101 from the flat state is greater than 180°, the two supports The thickness of the electronic device 100 in the folded state can be partially reduced. For example, the maximum rotation angle can be set to 180°. more than 200° and less than 200°, preferably more than 180° and less than 195°, more preferably It is sufficient to set it in the range of more than 180° and not more than 190°.

[0057] The rotation axis 111 of the hinge 110 and the first plane 110a (or the second plane 110b) The distance r0 is determined by dividing the maximum magnitude of the rotation angle by the minimum curvature half angle that the display panel 101 can tolerate. By taking the diameter into consideration when setting the display panel 101, damage to the curved portion of the display panel 101 can be prevented. can.

[0058] For example, the distance between the first plane 110a and the rotation axis 111 and the distance between the second plane 110b and the rotation axis 111 are When the distance between the first and second electrodes 111 is equal to r0, the value of r0 is preferably 0.1 mm or more and 20 mm or less. Or set it to 0.5 mm or more and 15 mm or less, more preferably 1 mm or more and 10 mm or less. It is preferable to set it to 4 mm, typically. The smaller r0 is, the more support Since the thickness of the electronic device 100 can be reduced when the body is folded, it is possible to This makes it possible to realize an electronic device 100 with excellent durability.

[0059] The thickness of the display panel 101 is 5 μm or more and 2000 μm or less, preferably 5 μm or more. 1000 μm or less, more preferably 10 μm or more and 500 μm or less, and even more preferably 20 The thinner the display panel 101, the more preferable the thickness. The minimum allowable radius of curvature can be reduced, and the thickness of the electronic device 100 can be reduced. This becomes possible.

[0060] Furthermore, if the thickness of the display panel 101 is too thin and the mechanical strength is insufficient, A flexible sheet or the like is attached to at least the curved portion of the cable 101 to supplement its strength. For example, elastic materials such as hard rubber, plastics, and metals such as aluminum can be used. Stainless steel, titanium alloy, and other alloys, silicone rubber, and other rubbers can be used. It is preferable that the sheet is made of a material that is less flexible than the display panel 101. In addition, if the sheet does not have light-transmitting properties, the back side of the display panel 101 or the display The screen has an opening in the area that overlaps with the display surface. The sheet may be disposed on the display surface side, and the display panel may be sandwiched between two sheets.

[0061] When the two supports are folded, that is, when the curved portion of the display panel 101 has the smallest curvature, The radius of curvature r1 in the state of being curved at a radius is preferably 0.1 mm or more and 20 mm or less. Or set it to 0.5 mm or more and 15 mm or less, more preferably 1 mm or more and 10 mm or less. It is preferable to set the thickness to 4 mm or less.

[0062] Here, a module equipped with a touch sensor is provided on the display surface side of the display panel 101. In this case, it is preferable that the module having the touch sensor is at least one It is preferable that the portion has flexibility and can be bent along the display panel 101. Even if the module having the touch sensor and the display panel 101 are bonded with an adhesive or the like, Alternatively, a polarizing plate or a buffer material (separator) may be provided between them. The thickness of the module including the sensor is preferably equal to or less than the thickness of the display panel 101 .

[0063] Alternatively, the display panel 101 may function as a touch panel. 101, the configuration of an on-cell type touch panel or an in-cell type touch panel is applied. By using an on-cell or in-cell touch panel configuration, Even if the display panel 101 is provided with a touch panel function, the thickness can be reduced.

[0064] The configuration of the hinge 103 is not limited to the configuration shown in FIG. 1, etc., and various configurations may be used. In addition, a part of the support 102a or the support 102b functions as a hinge 103. In addition, although a pair of hinges 103 is provided in FIG. There may be one hinge, or three or more hinges.

[0065] In addition, either one or both of the support 102a and the support 102b may be provided with a battery, a processor, or the like. Printed circuit boards on which various ICs such as computing devices and driver circuits are mounted, wireless receivers, wireless transmitters Appropriately incorporate electronic components such as various sensors including a power supply, a wireless power receiver, and an acceleration sensor. This allows the electronic device 100 to be used as a mobile terminal, a mobile image reproducing device, a mobile lighting device, etc. In addition, either one of the support 102a and the support 102b, or Both have various input / output terminals including a camera, speaker, power supply terminals, and signal supply terminals. Various sensors including optical sensors, operation buttons, etc. may be incorporated.

[0066] The above is the explanation of the first configuration example.

[0067] [Configuration example 2] The following describes a configuration example of the electronic device 120 that is partially different from the above configuration example 1. Note that explanations of parts that overlap with Configuration Example 1 may be omitted.

[0068] 4A is a perspective view of the display surface side of the electronic device 120, and FIG. 4B is a perspective view of the back surface side. FIG. 4(C) is a schematic cross-sectional view taken along the line D1-D2 in FIG. 4(A). do.

[0069] The electronic device 120 differs mainly in the position of the hinge 103 and the support 102a and The electronic device 100 differs from the electronic device 100 illustrated in the above-described configuration example 1 in that the shape of the support 102b is different. There are.

[0070] In an electronic device 120 according to one embodiment of the present invention, a flexible display panel 101 is provided between two supports. The display panel 101 is configured to be supported by the user's body. For example, the display panel 101 can be bent so that the display surface faces outward (outward bending). Moreover, the display panel 101 can be folded by bending it. The electronic device 120 of this embodiment is highly portable when the display panel 101 is folded, and is portable when unfolded. When in this state, the seamless, large display area provides excellent visibility of the display.

[0071] The hinge 103 has a rotation axis 111 positioned on the opposite side of the display surface of the display panel 101. In the configuration shown in FIG. 4, the hinge 103 is provided between the support 102a and the support The display panel 101 is provided on the opposite side of the display panel 102b. a first plane 110a including a display surface in a portion 101a of the display panel 101; When the second plane 110b including the display surface in the portion 101b of 101 coincides with the rotation axis 111 is on the opposite side of the display surface of the display panel 101 (specifically, in the direction of the normal vector of the display surface). The display screen is positioned away from the display surface (opposite the display screen).

[0072] The support 102a and the support 102b are arranged such that at least the portion 101 of the display panel 101 In FIG. 4C, the support 10 of the display panel 101 has a notch in the area where it overlaps with the support 10 of the display panel 101. The part overlapping with the support 102a is part 101a, the part overlapping with the support 102b is part 101b, and the notch The portion overlapping the support 102a is referred to as a portion 101c. (or support 102b) is entirely overlapped with support 102a (or support 102b). ), it is sufficient that a portion of the structure is supported, as in the first configuration example.

[0073] The support 102a and the support 102b are used to support the display in the portion 101c of the display panel 101. The surface is rotated by an angle of 180° or more relative to the rotation axis 111 so that the surface becomes convex. It is possible.

[0074] FIG. 5A shows a state in which the support 102b is rotated relative to the support 102a by 18 degrees around the rotation axis 111. 5B is a perspective view of the electronic device 120 in a state where the electronic device 120 is rotated by 0°. 5(A) is a schematic cross-sectional view taken along the line E1-E2 in FIG. FIG. 1 is an enlarged schematic cross-sectional view of the area surrounded by the dashed line.

[0075] As shown in each diagram of FIG. 5, the display panel 101 has a convex portion 101c of the display surface. At this time, the support 102a and the support 102b are curved so as to deform into a shape. The cutouts prevent physical interference between the display panel 101 and the supports. The display panel 101 can be curved.

[0076] When the display panel 101 is bent by 180 degrees as shown in FIG. The back surfaces of the supports 102b may be in contact with each other.

[0077] FIG. 7A shows a state in which the support 102b is rotated relative to the support 102a by 18 degrees around the rotation axis 111. 1 is a perspective schematic diagram of an electronic device 120 in a state where it is rotated at an angle greater than 0°. 7B is a schematic cross-sectional view taken along the line F1-F2 in FIG. 7(C) is an enlarged schematic cross-sectional view of the area enclosed by the dashed line in FIG. 7(B).

[0078] In this way, the display panel 101 is split into two pieces at an angle of more than 180° from the flat state. By rotating the support, the electronic device 120 in the state where the two supports are folded Since it is possible to partially reduce the thickness, it is possible to realize an electronic device with excellent portability.

[0079] As shown in FIG. 7C, when the display panel 101 is rotated by more than 180° from the flat state, When the two supports are rotated at a certain angle, the curvature of the portion 101c of the display panel 101 is The radius r1 is the distance between the rotation axis 111 of the hinge 110 and the first plane 110a (or the second plane 110b). 0b) is smaller than the distance r0.

[0080] The above is the explanation of configuration example 2.

[0081] [Configuration example 3] The following describes an example of the configuration of the electronic device 130, which is partially different from the above example. Note that explanations of parts that overlap with the above configuration example may be omitted.

[0082] 8A is a perspective view of the display surface side of the electronic device 130, and FIG. 8B is a perspective view of the back surface side. Figure.

[0083] The electronic device 130 includes the electronic device 120 illustrated in the second configuration example, and further includes a support 102c. The main difference is that

[0084] The support 102a and the support 102b are connected by a hinge 103a. The holder 102b and the support 102c are connected by a hinge 103b. 101 is supported by supports 102a, 102b, and 102c. The display panel 101 also has an area supported by the support 102a and an area supported by the support 102b. 102b and the area supported by the support 102b and the area supported by the support 102b. Between the regions supported by the support c, there is a region that is not supported by the support.

[0085] In the electronic device 130 according to one embodiment of the present invention, a part of the flexible display panel 101 is divided into three parts. The electronic device 130 has a structure in which the display panel 101 is supported by a support body. There are two areas where the screen can be bent so that the display surface faces outward (inward bending). The display panel 101 has an area where it can be bent outward. The electronic device 130 of one embodiment of the present invention can be mounted in a folded state. When unfolded, the display area is seamless and large, allowing you to see the entire display at a glance. Excellent performance.

[0086] As shown in FIG. 8A, when the display surface of the display panel 101 is flat, the hinge 103a The rotation axis 111a is provided on the opposite side of the display surface, as in the second configuration example. At this time, the rotation axis 111b of the hinge 103b is positioned on the display surface side, as in the first configuration example. It is designed to do so.

[0087] As in the second configuration example, the support 102a and the support 102b are disposed on the display surface of the display panel 101. is rotated by 180° or more relative to the rotation axis 111a of the hinge 103a so that the It can be rotated by an angle.

[0088] As in the first configuration example, the support 102b and the support 102c are connected to the display surface of the display panel 101. is rotated by 180° or more relative to the rotation axis 111b of the hinge 103b so that the hinge 103b is concave. It can be rotated by an angle.

[0089] By rotating the respective supports relative to each other around the rotation shafts 111a and 111b, The child device 130 goes through the form shown in FIG. 8(C) and then folds up as shown in FIG. 8(D). It can be transformed into a flat state.

[0090] As shown in FIG. 8(D), the angle formed by the opposing surfaces of the support 102a and the support 102b, and The electron beam is then aligned so that the angles formed by the opposing surfaces of the support 102b and the support 102c are equal. By folding the device 130, the support 102a and the support 102c can be made parallel to each other. This is preferable because the thickness of the electronic device 130 in the folded state is uniform. .

[0091] As shown in FIG. 8(D), the electronic device 130 is arranged so that both of the above two corners are acute angles. By folding, the thickness of the electronic device 130 is reduced compared to when the three supports are arranged in parallel. This makes it possible to

[0092] When the electronic device 130 of one embodiment of the present invention is used, the display panel 1 By unfolding the display screen, the entire seamless display surface can be used. As shown in Fig. 1D, a part of the display surface may be used in the folded state. By folding it to the side, the part of the display surface that is not visible to the user is hidden (deactivated), This can reduce the power consumption of the display panel 101.

[0093] Also, only the support 102a is rotated to the back side, and is overlapped with the support 102b and the support 102c. In this case, the part of the display surface that overlaps with the support 102a may be You can display an image or make it non-operational. It can also be used as a wire rod.

[0094] In addition, part of the convexly curved display surface can be used to store emails and social networking information. Notifications of incoming calls, e-mails, SNS messages, etc. , sender name of email or SNS, date and time, remaining battery level, antenna reception strength It can also display functions such as operation buttons, icons, and sliders. An image may be displayed.

[0095] The display surface of the display panel 101 is in an unfolded state (for example, the state shown in FIG. 8(A)). It is preferable to set the aspect ratio to a specific value (for example, 9:16). In addition, when the display panel 101 is folded (for example, as shown in FIG. 8(D)), When the aspect ratio is close to the value shown in the unfolded state, This is preferable. As a result, the visual quality is improved in both the unfolded and folded states. When enlarging or reducing the same image to fill the entire display surface, an undesirable image may appear in either state. This can prevent natural blank spaces from being generated.

[0096] The above is the explanation of configuration example 3.

[0097] [Configuration example 4] A more specific configuration example will be described below. Note that the parts that overlap with the above configuration example will be In this case, the explanation may be omitted.

[0098] FIG. 9A is a perspective schematic diagram of the electronic device 140 with the display panel 101 unfolded. FIG. 9B is a perspective schematic view of the display panel 101 in a folded state.

[0099] The electronic device 140 includes a display panel 101, a housing 141, a support 142a, a support 142b, It has a support 142c, a hinge 143a and a hinge 143b.

[0100] The electronic device 140 has a rotation axis 151a of the hinge 143a and a rotation axis 151b of the hinge 143b. By relatively rotating each support around each of the 51b, the state of FIG. It can be reversibly transformed into the state shown in FIG. 9(B).

[0101] The electronic device 140 may also have an operation button 145. For example, the operation button 1 45 is a function for switching the image displayed on the display surface of the display panel 101, and for turning the power on and off. a function of controlling the display panel 101 from a folded state to an unfolded state; and the like.

[0102] FIG. 9(C) is a schematic cross-sectional view taken along the line G1-G2 shown in FIG. 9(B). As shown in Fig. 1C, the housing 141 contains a printed circuit board 144, a battery 149, etc. is doing.

[0103] In addition, a plurality of FPCs 147 electrically connected to the display panel 101 are 4. The printed circuit board 144 is also connected to a plurality of terminal connectors 148 of the battery. Power is supplied from 149.

[0104] The battery 149 is preferably a secondary battery such as a lithium ion battery. The battery 149 has an antenna and a circuit for controlling charging and discharging, and can be charged wirelessly. It is preferable that the above-mentioned configuration be adopted.

[0105] The printed circuit board 144 is mounted with various ICs such as a battery, a computing device, and a driving circuit. Although not shown, a wireless receiver, a wireless transmitter, a wireless power receiver, an accelerometer, and the like are installed in the housing 141. By appropriately incorporating various electronic components such as sensors, the electronic device 140 can function as a mobile terminal, a mobile image playback device, a mobile lighting device, etc. The housing 141 is equipped with various inputs and outputs including a camera, a speaker, a power supply terminal, a signal supply terminal, etc. It may also incorporate various sensors including a power terminal, an optical sensor, and an operation button.

[0106] As shown in FIG. 9A, the display panel 101 is overlapped with the housing 141 in an unfolded state. The support 142b and the support 142c that do not need to be formed are preferably thin. As shown in FIG. 9(C), the thickness t of the support 142b and the support 142c is equal, and It is preferable that the thickness of the support 142b and the support 142c is thinner than that of the housing 141. The thickness t is 0.3 mm or more and 10 mm or less, preferably 0.3 mm or more and 5 mm or less. It is preferable that the distance between the support 142b and the support 142b is set to 1 mm. By reducing the thickness of 142c, the weight of the electronic device 140 can be reduced, making it more portable. Furthermore, the thickness of the support 142b and the support 142c can be further improved. If it is thinner than 41, the change in the center of gravity between the unfolded and folded state will be smaller. Therefore, in either state, it is easy to use the device while holding only the housing 141 with one hand. , improving convenience.

[0107] The above is the explanation of configuration example 4.

[0108] [Modification] 10A shows a perspective schematic diagram of the electronic device 160. The electronic device 160 is the same as that shown in FIG. The main difference is the configuration of the housing 141 and the support 142b in the electronic device 140. .

[0109] The housing 161 of the electronic device 160 is thinner than the housing 141. This allows the electronic device 160 to be easily held in one hand.

[0110] The support 142b of the electronic device 160 is made of the support 142a and the support 142c. A mechanism that changes the length of both ends so that the distance can be changed (slide mechanism) (also called)

[0111] Figure 10(B) shows a schematic cross-sectional view of the support 142b and its vicinity. The plate-shaped member 162a, the plate-shaped member 162b, the plate-shaped member 162c, and the screw 163 and,

[0112] Member 162a is connected to hinge 143a. Member 162c is connected to hinge 143b. The member 162c is connected to the opening 164. The members 162a and 162b overlap with a part of the member 162c so as to sandwich the opening 164. The members 162a and 162b are fixed together by screws 163. Furthermore, the members 162a and 162c, and the members 162b and 162c are Not fixed.

[0113] With this configuration, the member 162c is Therefore, the hinge 143a and the The distance between the hinge 143b and the support 142a can be changed. It can also be said that it changes the

[0114] At this time, the display panel 101 is fixed to the support 142a and the support 142c. It is preferable that the support 142b is provided so as not to be fixed to the support 142b.

[0115] By adopting such a configuration, when the display panel 101 is bent, the A slight deviation in length caused by the support 142b can be compensated for by the sliding movement of the support 142b.

[0116] In the configuration shown in FIG. 10(B), the length that the member 162c can be displaced is equal to the length of the screw 16 3 and the size of the opening 164. When sliding the member 162c, When the end of the opening 164 comes into contact with the screw 163, the sliding stops.

[0117] The configuration shown in FIGS. 10(A) and 10(B) is an example, and the length of both ends of the support 142b can be changed. The structure is not limited to this, and any mechanism can be used as long as it can be realized. The electronic device 160 may be provided with a mechanism that can change the distance to the sensor 143b. The mechanism that can change the distance between the support 142a and the support 142c is called an electron It may be provided in the device 160.

[0118] This embodiment may be combined, at least in part, with other embodiments described in this specification. It can be implemented in combination.

[0119] (Embodiment 2) In this embodiment, a light-emitting panel that can be applied to a display panel included in an electronic device of one embodiment of the present invention will be described. An example of the configuration and manufacturing method of the panel will be described.

[0120] <Example 1> FIG. 11(A) shows a plan view of the light-emitting panel, and the dashed line A1-A2 in FIG. An example of a cross-sectional view between the color filters is shown in FIG. In this embodiment, the light-emitting panel is a top-emission type light-emitting panel using the For example, a panel has a structure in which one color is expressed using three sub-pixels of R (red), G (green), and B (blue). A structure in which one color is expressed using four sub-pixels: R (red), G (green), B (blue), and W (white). There are no particular limitations on the color elements, and colors other than RGBW may be used. For example, it may be configured with yellow, cyan, magenta, etc.

[0121] The light-emitting panel shown in FIG. 11(A) includes a light-emitting section 804, a driving circuit section 806, an FPC (Flexible Printed Circuit) The light emitting unit 804 and the driving circuit The light emitting element and the transistor included in the circuit portion 806 are formed on the substrate 801, the substrate 803, and the sealing layer It is sealed by 823.

[0122] The light-emitting panel shown in FIG. 11(C) includes a substrate 801, an adhesive layer 811, an insulating layer 813, and a plurality of A transistor, a conductive layer 857, an insulating layer 815, an insulating layer 817, a plurality of light-emitting elements, an insulating layer 8 21, sealing layer 823, overcoat 849, coloring layer 845, light-shielding layer 847, insulating layer 84 3, adhesive layer 841, and substrate 803. The sealing layer 823, overcoat 849, and insulating layer The edge layer 843, adhesive layer 841, and substrate 803 are transparent to visible light.

[0123] The light emitting section 804 is a transistor on the substrate 801 via an adhesive layer 811 and an insulating layer 813. The light emitting element 830 includes a lower electrode 83 on an insulating layer 817. 1, an EL layer 833 on the lower electrode 831, and an upper electrode 835 on the EL layer 833. The lower electrode 831 is electrically connected to the source electrode or the drain electrode of the transistor 820. The end of the lower electrode 831 is covered with an insulating layer 821. Preferably, the upper electrode 835 is transparent to visible light.

[0124] The light-emitting section 804 includes a colored layer 845 overlapping the light-emitting element 830 and a layer overlapping the insulating layer 821. The colored layer 845 and the light-shielding layer 847 are covered with an overcoat 849. The space between the light emitting element 830 and the overcoat 849 is filled with a sealing layer 823. There are.

[0125] The insulating layer 815 has the effect of suppressing the diffusion of impurities into the semiconductor that constitutes the transistor. The insulating layer 817 also has a planarizing function to reduce surface irregularities caused by the transistor. It is preferable to select an insulating layer having

[0126] The driving circuit section 806 is formed by forming a transistor on the substrate 801 via an adhesive layer 811 and an insulating layer 813. In FIG. 11C, the driver circuit portion 806 includes a plurality of transistors. One transistor is shown.

[0127] The insulating layer 813 and the substrate 801 are bonded together by an adhesive layer 811. The insulating layer 813 and the insulating layer 803 are bonded to each other by the adhesive layer 841. If a film with low water permeability is used for 843, impurities such as water may get into the light emitting element 830 or the transistor 820. This is preferable because it can prevent objects from entering and improve the reliability of the light-emitting panel.

[0128] The conductive layer 857 transmits signals (video signals, clock signals, switch signals, etc.) from the outside to the driving circuit section 806. It is electrically connected to an external input terminal that transmits a signal (such as a start signal or a reset signal) or a potential. Here, an example is shown in which an FPC808 is provided as an external input terminal. To prevent this, the conductive layer 857 is made of the same material as the electrodes and wiring used in the light emitting section and the drive circuit section. Here, the conductive layer 857 is preferably formed by a process. This shows an example in which the electrode is made of the same material and in the same process as the electrode to be used.

[0129] In the light-emitting panel shown in FIG. 11(C), the connector 825 is located on the substrate 803. 825 includes the substrate 803, the adhesive layer 841, the insulating layer 843, the sealing layer 823, the insulating layer 817, and The connecting body 8 is connected to the conductive layer 857 through an opening provided in the insulating layer 815. 25 is connected to the FPC 808. The FPC 808 and the conductive layer 857 are connected to each other via the connector 825. When the conductive layer 857 and the substrate 803 overlap, the substrate 803 is opened. By using a substrate with an opening, the conductive layer 857, the connector 825, and the F The PC 808 can be electrically connected.

[0130] In Example 1, the insulating layer 813, the transistor 820, and the light-emitting element 820 are formed on a highly heat-resistant substrate. The substrate 830 is then peeled off, and an insulating layer 8 is formed on the substrate 801 using an adhesive layer 811. 13, a transistor 820, and a light-emitting element 830. In addition, in Example 1, the insulating layer 843 and the colored layer 845 are formed on a highly heat-resistant substrate. and a light-shielding layer 847 is formed, the substrate on which the layer is formed is peeled off, and the layer is formed on the substrate 803 using the adhesive layer 841. A light-emitting panel can be produced by transposing the insulating layer 843, the colored layer 845, and the light-shielding layer 847. It shows.

[0131] If a substrate is made of a material with low heat resistance (such as resin), the substrate is exposed to high temperatures during the manufacturing process. Since it is difficult to form a thin film on the substrate, there are limitations on the conditions for forming transistors and insulating layers on the substrate. When using a highly permeable material (such as resin) for the substrate, high temperatures are applied to form a low-permeability film. In the manufacturing method of this embodiment, it is preferable to form a transistor on a manufacturing substrate having high heat resistance. High temperature can be used to produce highly reliable transistors and transistors with sufficient water permeability. Then, they can be transferred to the substrate 801 or the substrate 803. Thus, in one embodiment of the present invention, a light-emitting panel with high reliability can be manufactured. A light-weight, thin, and highly reliable light-emitting panel can be realized. Details of the manufacturing method will be described later. do.

[0132] <Example 2> FIG. 11(B) shows a plan view of the light-emitting panel, and the dashed line A3-A4 in FIG. An example of a cross-sectional view between the two is shown in FIG. 11(D). The light-emitting panel shown in Example 2 is different from Example 1 in that This is a top-emission type light-emitting panel that uses a color filter system. Only the differences from Example 1 will be described in detail, and explanations of the points in common with Example 1 will be omitted.

[0133] The light-emitting panel shown in FIG. 11(D) differs from the light-emitting panel shown in FIG. 11(C) in the following respects: .

[0134] The light-emitting panel shown in FIG. 11(D) has spacers 827 on the insulating layer 821. By providing the spacer 827, the distance between the substrate 801 and the substrate 803 can be adjusted.

[0135] In addition, in the light-emitting panel shown in FIG. 11(D), the substrate 801 and the substrate 803 are different in size. The connecting body 825 is located on the insulating layer 843 and does not overlap the substrate 803. through openings provided in the edge layer 843, the sealing layer 823, the insulating layer 817, and the insulating layer 815. The conductive layer 857 is connected to the substrate 803. Since there is no need to provide an opening in the substrate 803, the conductive layer 857 is connected to the conductive layer 857. There are no restrictions on materials.

[0136] <Example 3> FIG. 12(A) shows a plan view of the light-emitting panel, and the dashed line A5-A6 in FIG. An example of a cross-sectional view between the two panels is shown in Figure 12(C). The light-emitting panel used is a top-emission type.

[0137] The light-emitting panel shown in FIG. 12(A) includes a light-emitting section 804, a driving circuit section 806, and an FPC 808. The light emitting element and the transistor included in the light emitting section 804 and the driving circuit section 806 are mounted on the substrate 8 01, and is sealed by a substrate 803, a frame-shaped sealing layer 824, and a sealing layer 823.

[0138] The light-emitting panel shown in FIG. 12(C) includes a substrate 801, an adhesive layer 811, an insulating layer 813, and a plurality of A transistor, a conductive layer 857, an insulating layer 815, an insulating layer 817, a plurality of light-emitting elements, an insulating layer 8 21, a sealing layer 823, a frame-shaped sealing layer 824, and a substrate 803. The substrate 803 is transparent to visible light.

[0139] The frame-shaped sealing layer 824 is preferably a layer having higher gas barrier properties than the sealing layer 823. This prevents moisture and oxygen from entering the light-emitting panel from the outside. This makes it possible to realize a highly reliable light-emitting panel.

[0140] In Example 3, light emitted from the light emitting element 830 is extracted from the light emitting panel through the sealing layer 823. Therefore, it is preferable that the sealing layer 823 has higher light-transmitting properties than the frame-shaped sealing layer 824. Furthermore, it is preferable that the refractive index of the sealing layer 823 is higher than that of the frame-shaped sealing layer 824. Furthermore, the sealing layer 823 has a smaller shrinkage in volume when hardened than the frame-shaped sealing layer 824. It is preferable that:

[0141] The light emitting section 804 is a transistor on the substrate 801 via an adhesive layer 811 and an insulating layer 813. The light emitting element 830 includes a lower electrode 83 on an insulating layer 817. 1, an EL layer 833 on the lower electrode 831, and an upper electrode 835 on the EL layer 833. The lower electrode 831 is electrically connected to the source electrode or the drain electrode of the transistor 820. The end of the lower electrode 831 is covered with an insulating layer 821. Preferably, the upper electrode 835 is transparent to visible light.

[0142] The driving circuit section 806 is formed by forming a transistor on the substrate 801 via an adhesive layer 811 and an insulating layer 813. In FIG. 12C, the driver circuit portion 806 includes a plurality of transistors. One transistor is shown.

[0143] The insulating layer 813 and the substrate 801 are bonded together by an adhesive layer 811. If a film with low water permeability is used, impurities such as water may penetrate into the light emitting element 830 and the transistor 820. This is preferable because it can suppress the penetration of light and improve the reliability of the light-emitting panel.

[0144] The conductive layer 857 serves as an external input terminal for transmitting signals and potentials from the outside to the driving circuit portion 806. Electrically connect. Here, an example is shown where an FPC808 is used as the external input terminal. Here, the conductive layer 857 is made of the same material as the electrode of the transistor 820. An example produced using the same process is shown below.

[0145] In the light-emitting panel shown in FIG. 12(C), the connector 825 is located on the substrate 803. 825 is a substrate 803, a sealing layer 823, an insulating layer 817, and an opening provided in the insulating layer 815. The connector 825 is connected to the conductive layer 857 through a hole. The FPC 808 and the conductive layer 857 are electrically connected via the connector 825.

[0146] In Example 3, the insulating layer 813, the transistor 820, and the light-emitting element 820 are formed on a substrate having high heat resistance. The substrate 830 is then peeled off, and an insulating layer 8 is formed on the substrate 801 using an adhesive layer 811. 13, a transistor 820, and a light-emitting element 830. Since transistors and other devices can be manufactured on a highly heat-resistant substrate, This allows for the formation of highly reliable transistors and films with sufficiently low water permeability. By transferring these to the substrate 801, a highly reliable light-emitting panel can be fabricated. Therefore, in one embodiment of the present invention, a light-emitting panel that is lightweight or thin and has high reliability can be realized. Cut.

[0147] <Example 4> FIG. 12(B) shows a plan view of the light-emitting panel, and the dashed line A7-A8 in FIG. An example of a cross-sectional view between the color filters is shown in FIG. This is a bottom-emission type light-emitting panel that uses this method.

[0148] The light-emitting panel shown in FIG. 12(D) includes a substrate 801, an adhesive layer 811, an insulating layer 813, and a plurality of Transistor, conductive layer 857, insulating layer 815, colored layer 845, insulating layer 817a, insulating layer 8 17b, a conductive layer 816, a plurality of light-emitting elements, an insulating layer 821, a sealing layer 823, and a substrate 803 The substrate 801, the adhesive layer 811, the insulating layer 813, the insulating layer 815, the insulating layer 817a, The insulating layer 817b transmits visible light.

[0149] The light emitting section 804 is a transistor on the substrate 801 via an adhesive layer 811 and an insulating layer 813. The light-emitting element 830 includes an insulating layer A lower electrode 831 on the EL layer 833, an EL layer 833 on the lower electrode 831, and an upper electrode 832 on the EL layer 833. The lower electrode 831 is the source electrode or drain electrode of the transistor 820. The end of the lower electrode 831 is covered with an insulating layer 821. The upper electrode 835 preferably reflects visible light. The lower electrode 831 preferably transmits visible light. The position where the colored layer 845 overlapping the light emitting element 830 is provided is not particularly limited. If it is provided between the edge layer 817a and the insulating layer 817b, or between the insulating layer 815 and the insulating layer 817a, good.

[0150] The driving circuit section 806 is formed by forming a transistor on the substrate 801 via an adhesive layer 811 and an insulating layer 813. In FIG. 12D, the driver circuit portion 806 includes a plurality of transistors. Two transistors are shown.

[0151] The insulating layer 813 and the substrate 801 are bonded together by an adhesive layer 811. If a film with low water permeability is used, impurities such as water can easily penetrate the light emitting element 830 and the transistors 820 and 822. This is preferable because it can prevent impurities from entering and improve the reliability of the light-emitting panel.

[0152] The conductive layer 857 serves as an external input terminal for transmitting signals and potentials from the outside to the driving circuit portion 806. Electrically connect. Here, an example is shown where an FPC808 is used as the external input terminal. Here, the conductive layer 857 is formed using the same material and in the same process as the conductive layer 816. Here is an example.

[0153] In Example 4, the insulating layer 813, the transistor 820, and the light-emitting element 820 are formed on a substrate having high heat resistance. The substrate is peeled off, and an insulating layer is formed on the substrate 801 using the adhesive layer 811. A light-emitting panel that can be produced by transposing 813, a transistor 820, a light-emitting element 830, etc. Since transistors and other devices can be manufactured on a highly heat-resistant substrate, This allows for the formation of highly reliable transistors and films with sufficiently low water permeability. By transferring these to the substrate 801, a highly reliable light-emitting panel can be fabricated. As a result, in one embodiment of the present invention, a light-weight or thin and highly reliable light-emitting panel can be realized. It can be realized.

[0154] <Example 5> FIG. 12(E) shows an example of a light-emitting panel different from the specific examples 1 to 4.

[0155] The light-emitting panel shown in FIG. 12(E) includes a substrate 801, an adhesive layer 811, an insulating layer 813, a conductive layer 814, conductive layer 857a, conductive layer 857b, light-emitting element 830, insulating layer 821, sealing layer 82 3, and a substrate 803.

[0156] The conductive layer 857a and the conductive layer 857b are external connection electrodes of the light-emitting panel, and are connected to an FPC or the like. Electrical connection can be made.

[0157] The light emitting element 830 has a lower electrode 831, an EL layer 833, and an upper electrode 835. The end of the bottom electrode 831 is covered with an insulating layer 821. The light emitting element 830 is a bottom emitting element. The light extraction side is either a top-emission type or a dual-emission type. The electrode, the substrate, the insulating layer, etc. are transparent to visible light. and electrically connect it.

[0158] The substrate on the light extraction side has a light extraction structure consisting of a hemispherical lens and a microlens array. For example, the resin substrate may have a film with a concave-convex structure, a light-diffusing film, or the like. The lens or film is placed on a plate with a refractive index similar to that of the substrate or the lens or film. By bonding the substrate using an adhesive having the above-mentioned properties, a light extraction structure can be formed.

[0159] The conductive layer 814 is not necessarily provided, but it is possible to reduce the voltage drop due to the resistance of the lower electrode 831. For the same purpose, the upper electrode 835 and the electrode A conductive layer for electrical connection is formed on the insulating layer 821, the EL layer 833, the upper electrode 835, or the like. It may be provided.

[0160] The conductive layer 814 may be made of copper, titanium, tantalum, tungsten, molybdenum, chromium, or neodymium. Materials selected from the group consisting of aluminum, scandium, nickel, and aluminum, or materials containing these as their main components The conductive layer 814 can be formed as a single layer or a stacked layer using an alloy material or the like. For example, it can be 0.1 μm or more and 3 μm or less, and preferably 0.1 μm or more and 0.1 μm or less. It is less than 0.5μm.

[0161] A paste (such as silver paste) is used as the material for the conductive layer electrically connected to the upper electrode 835. When the conductive layer is heated, the metal constituting the conductive layer becomes granular and aggregates. This results in a structure with many gaps, making it difficult for the EL layer 833 to completely cover the conductive layer, and This is preferable because it becomes easier to electrically connect the conductive layer to the conductive layer.

[0162] In Example 5, the insulating layer 813, the light emitting element 830, etc. are fabricated on a highly heat-resistant fabrication substrate. The substrate is peeled off, and an insulating layer 813 and a light emitting element 83 are formed on the substrate 801 using an adhesive layer 811. This shows a light-emitting panel that can be manufactured by transposing 0 etc. on a highly heat-resistant manufacturing substrate. By applying high temperature, an insulating layer 813 or the like having a sufficiently low water permeability is formed, and the insulating layer 813 is transferred to the substrate 801. As a result, a light-emitting panel with high reliability can be manufactured. This makes it possible to realize a thin and highly reliable light-emitting panel.

[0163] <Example of materials> Next, materials that can be used for the light-emitting panel will be described. The explanation of the configuration may be omitted.

[0164] The substrate can be made of materials such as glass, quartz, organic resin, metal, and alloy. The substrate on the side from which light from the optical element is extracted is made of a material that is translucent to the light.

[0165] In particular, it is preferable to use a flexible substrate. For example, an organic resin or a flexible substrate may be used. Any thickness of glass, metal or alloy can be used.

[0166] Since organic resin has a smaller specific gravity than glass, when organic resin is used as a flexible substrate, This is preferable because it allows the light-emitting panel to be lighter than when glass is used.

[0167] It is preferable to use a highly tough material for the substrate. This makes it possible to achieve excellent impact resistance and breakage resistance. For example, it is possible to realize a light-emitting panel that is hard to damage. By using a metal or alloy substrate, it is lighter and less susceptible to breakage than when using a glass substrate. It is possible to create a light-emitting panel.

[0168] Metallic and alloy materials have high thermal conductivity and can easily conduct heat across the entire substrate, making it possible to This is preferable because it can suppress local temperature rises in the panel. The thickness of the substrate is preferably 10 μm or more and 200 μm or less, and more preferably 20 μm or more and 50 μm or less. It is more preferable to do so.

[0169] The material for forming the metal substrate or alloy substrate is not particularly limited, but for example, aluminum Preferably, the material is a metal alloy such as aluminum, copper, nickel, or an aluminum alloy or stainless steel. It can be used appropriately.

[0170] In addition, if a material with high thermal emissivity is used for the substrate, the surface temperature of the light-emitting panel will increase. This can prevent damage to the light-emitting panel and a decrease in reliability. A stack of high emissivity layers (for example, metal oxides or ceramic materials can be used) It may also be constructed as such.

[0171] Examples of materials that are flexible and transparent include polyethylene terephthalate (PE T), polyester resins such as polyethylene naphthalate (PEN), polyacrylonitrile resin, polyimide resin, polymethyl methacrylate resin, polycarbonate (PC) resin Resin, polyethersulfone (PES) resin, polyamide resin, cycloolefin resin, Examples of resins that can be used include polystyrene resins, polyamide-imide resins, and polyvinyl chloride resins. It is preferable to use a material with a low expansion coefficient, such as polyamide-imide resin or polyimide. Resin, PET, etc. can be suitably used. Also, a substrate (printed) in which a fiber body is impregnated with resin can be used. Use a substrate with a reduced thermal expansion coefficient by mixing inorganic fillers into organic resins. It is also possible.

[0172] As for the flexible substrate, the layer using the above material acts as a hard layer to protect the surface of the device from scratches. Coating layers (e.g., silicon nitride layers) and layers of materials that can disperse pressure (e.g., ara The insulating layer may be laminated with a polymer layer (e.g., a polymer layer).

[0173] The flexible substrate may be formed by stacking a plurality of layers. This means that the barrier properties against water and oxygen can be improved, resulting in a highly reliable light-emitting panel. can.

[0174] For example, a flexible substrate in which a glass layer, an adhesive layer, and an organic resin layer are laminated from the side closer to the light emitting element is used. The thickness of the glass layer is preferably 20 μm or more and 200 μm or less. The thickness is preferably 25 μm or more and 100 μm or less. A glass layer with such a thickness is highly resistant to water and oxygen. The thickness of the organic resin layer can be set to 1. The thickness is 0 μm or more and 200 μm or less, preferably 20 μm or more and 50 μm or less. By placing the mechanical resin layer on the outside of the glass layer, breakage and cracks in the glass layer are suppressed. Such a composite material of glass material and organic resin can improve the mechanical strength. By applying it to the substrate, it becomes possible to create a highly reliable flexible light-emitting panel. can.

[0175] For adhesive and sealing layers, there are various types of adhesives, such as UV-curable adhesives, reactive-curable adhesives, and heat-curable adhesives. Various curing adhesives such as adhesives and anaerobic adhesives can be used. Epoxy resin, acrylic resin, silicone resin, phenolic resin, polyimide resin, Imide resin, PVC (polyvinyl chloride) resin, PVB (polyvinyl butyral) resin Examples of the resin include EVA (ethylene vinyl acetate) resin. A material with low wettability is preferred. A two-component resin may also be used. etc. may also be used.

[0176] The resin may also contain a desiccant. For example, an oxide of an alkaline earth metal (an acid The material used is one that absorbs moisture by chemical adsorption, such as calcium oxide or barium oxide. Alternatively, materials such as zeolite and silica gel can absorb water by physical adsorption. If a desiccant is included, impurities such as moisture can be absorbed into the functional element. This is preferable because it can suppress the intrusion of foreign matter and improve the reliability of the light-emitting panel.

[0177] Furthermore, by mixing a filler with a high refractive index or a light scattering material into the resin, it is possible to For example, titanium oxide, barium oxide, Zeolite, zirconium, etc. can be used.

[0178] The structure of the transistors included in the light-emitting panel is not particularly limited. The transistor may be a top gate transistor or an inverted staggered transistor. The transistor may have either a top-gate or bottom-gate structure. The semiconductor material is not particularly limited, and examples thereof include silicon and germanium. , In-Ga-Zn-based metal oxides, etc. An oxide semiconductor including one of these may be used.

[0179] The crystallinity of the semiconductor material used in the transistor is not particularly limited. A semiconductor having crystallinity (a microcrystalline semiconductor, a polycrystalline semiconductor, a single-crystal semiconductor, or a semiconductor having a partially crystalline region) If a semiconductor having crystallinity is used, This is preferable because it can suppress deterioration of the resistor characteristics.

[0180] Here, transistors used in pixels, drive circuits, touch sensors, etc., which will be described later, It is preferable to use an oxide semiconductor for any semiconductor device. It is preferable to use an oxide semiconductor with a larger band gap than silicon. When a semiconductor material with a wide band and low carrier density is used, the off state of the transistor This is preferable because it can reduce the current in the

[0181] For example, the oxide semiconductor may contain at least indium (In) or It is preferable that zinc (Zn) is contained. More preferably, it is an In-M-Zn-based oxide (wherein M is A). (metals such as l, Ti, Ga, Ge, Y, Zr, Sn, La, Ce or Hf) Contains oxides.

[0182] In particular, the semiconductor layer has a plurality of crystal portions, and the c-axes of the crystal portions are aligned with the surface on which the semiconductor layer is formed. or oriented perpendicular to the upper surface of the semiconductor layer and having no grain boundary between adjacent crystal portions. An oxide semiconductor film is preferably used.

[0183] Such oxide semiconductors have no crystal grain boundaries, so when the display panel is bent, The occurrence of cracks in the oxide semiconductor film due to stress is suppressed. Such oxide semiconductors are suitable for use in flexible display panels that are used in a curved state. You can be there.

[0184] By using such materials for the semiconductor layer, fluctuations in electrical characteristics are suppressed, and reliability is improved. High-performance transistors can be realized.

[0185] In addition, due to its low off-state current, the charge stored in the capacitance can be released for a long period of time via the transistor. By applying such a transistor to a pixel, It is also possible to stop the driving circuit while maintaining the gradation of the image displayed in the display area. As a result, electronic equipment with extremely reduced power consumption can be realized.

[0186] For stabilizing the characteristics of the transistor, it is preferable to provide an underlayer film. , silicon oxide film, silicon nitride film, silicon oxynitride film, silicon nitride oxide film, etc. The base film can be formed by a single layer or a multilayer structure using an organic insulating film. , CVD (Chemical Vapor Deposition) method (Plasma CVD method, thermal CVD method, MOCVD (Metal Organic CVD) method, etc.), ALD (Atomic Layer Deposition), coating, printing, etc. In addition, the undercoat film may not be provided if it is not necessary. The layer 813 can also serve as an underlying film for the transistor.

[0187] The light emitting element can be a self-luminous element, which can be illuminated by current or voltage. The category includes devices whose light intensity is controlled, such as light-emitting diodes (LEDs), organic An EL element, an inorganic EL element, etc. can be used.

[0188] Light-emitting elements are available in top-emission, bottom-emission, and dual-emission types. The electrode on the light extraction side uses a conductive film that transmits visible light. In addition, it is preferable to use a conductive film that reflects visible light for the electrode on the side from which light is not extracted. stomach.

[0189] The conductive film that transmits visible light is made of, for example, indium oxide or indium tin oxide (ITO). Indium Tin Oxide, Indium Zinc Oxide, Zinc Oxide, Gallium-doped It can be formed using zinc oxide containing gold, silver, platinum, magnesium, etc. , nickel, tungsten, chromium, molybdenum, iron, cobalt, copper, palladium, if Metallic materials such as titanium, alloys containing these metallic materials, or nitrides of these metallic materials (e.g. For example, titanium nitride can be used by forming it thin enough to have light transmission properties. Also, a laminated film of the above materials can be used as the conductive layer. For example, a laminated film of silver and magnesium It is preferable to use a laminated film of an alloy of ITO and a rubber material, as this can increase the electrical conductivity. Graphene or the like may also be used.

[0190] The conductive film that reflects visible light is made of, for example, aluminum, gold, platinum, silver, nickel, tungsten, or the like. Metallic materials such as stainless steel, chromium, molybdenum, iron, cobalt, copper, or palladium, or In addition, the above metal materials and alloys may contain lanthanum. Tungsten, neodymium, germanium, etc. may be added. Aluminum alloys such as tungsten alloys, aluminum-nickel alloys, and aluminum-neodymium alloys Alloys containing palladium (aluminum alloys), silver and copper alloys, silver, palladium and copper alloys, It can be formed using an alloy containing silver, such as an alloy of silver and magnesium. The alloy is preferable because of its high heat resistance. By laminating the metal oxide film, oxidation of the aluminum alloy film can be suppressed. Examples of materials for the metal film and metal oxide film include titanium and titanium oxide. A conductive film that transmits visible light and a film made of a metal material may be laminated. For example, silver and ITO A laminated film of an alloy of silver and magnesium and ITO can be used.

[0191] The electrodes may be formed by vapor deposition or sputtering. Forming using ejection methods such as ink jet printing, printing methods such as screen printing, or plating methods It can be achieved.

[0192] A voltage higher than the threshold voltage of the light emitting element is applied between the lower electrode 831 and the upper electrode 835. When this occurs, holes are injected into the EL layer 833 from the anode side, and electrons are injected from the cathode side. The electrons and holes are recombined in the EL layer 833, and the light-emitting material contained in the EL layer 833 emits light. It glows.

[0193] The EL layer 833 has at least a light-emitting layer. The EL layer 833 includes the following layers other than the light-emitting layer: Materials with high hole injection properties, materials with high hole transport properties, hole blocking materials, materials with high electron transport properties Highly electron-injecting or bipolar material (highly electron-transporting and hole-transporting properties) The layer may further include a layer containing a material.

[0194] The EL layer 833 can be made of either a low molecular weight compound or a high molecular weight compound. The layers constituting the EL layer 833 may be formed by evaporation (vacuum evaporation). It can be formed by methods such as transfer method, printing method, ink jet method, coating method, etc. Cut.

[0195] The light emitting element is preferably provided between a pair of insulating films with low water permeability. This makes it possible to prevent impurities such as water from entering the light emitting element, thereby preventing a decrease in the reliability of the light emitting device. It can be controlled.

[0196] As insulating films with low water permeability, films containing nitrogen and silicon such as silicon nitride film and silicon nitride oxide film are used. and films containing nitrogen and aluminum, such as an aluminum nitride film. A silicon oxide film, a silicon oxynitride film, an aluminum oxide film, or the like may also be used.

[0197] For example, the water vapor permeation rate of a low-permeability insulating film is 1×10 -5 [g / (m 2 ·day) ] or less, preferably 1 × 10 -6 [g / (m 2 ·day)] or less, preferably 1 × 1 0 -7 [g / (m 2 ·day)] or less, more preferably 1 × 10 -8 [g / (m 2 ·d ay)] below.

[0198] It is preferable to use an insulating film with low water permeability for the insulating layer 813 and the insulating layer 843.

[0199] The insulating layer 815 may be, for example, a silicon oxide film, a silicon oxynitride film, or an aluminum oxide film. An inorganic insulating film such as an inorganic film can be used. The insulating layer 817b may be made of, for example, polyimide, acrylic, polyamide, or polyimide. Organic materials such as amide and benzocyclobutene resins can be used. Low dielectric constant materials (low-k materials) can be used. Each insulating layer may be formed by

[0200] The insulating layer 821 is formed using an organic insulating material or an inorganic insulating material. Examples of the resin include polyimide resin, polyamide resin, acrylic resin, siloxane resin, and epoxy resin. In particular, photosensitive resin materials can be used to provide insulation. The sidewall of the edge layer 821 is formed to have an inclined surface having a continuous curvature. preferable.

[0201] The method for forming the insulating layer 821 is not particularly limited, but may be a photolithography method, a sputtering method, or the like. , evaporation method, droplet ejection method (inkjet method, etc.), printing method (screen printing, offset printing) It is best to use a printing press, etc.

[0202] The spacer 827 may be formed using an inorganic insulating material, an organic insulating material, a metal material, or the like. For example, inorganic insulating materials and organic insulating materials can be used for the insulating layer. Examples of metal materials that can be used include titanium and aluminum. The spacer 827 containing a conductive material and the upper electrode 835 are electrically connected to each other. This can suppress the potential drop caused by the resistance of the upper electrode 835. The shape of the 27 may be either a forward tapered shape or a reverse tapered shape.

[0203] For light-emitting panels that function as electrodes and wiring of transistors or auxiliary electrodes of light-emitting elements, The conductive layer used may be made of, for example, molybdenum, titanium, chromium, tantalum, tungsten, or aluminum. Metallic materials such as aluminum, copper, neodymium, scandium, etc., or alloy materials containing these elements The conductive layer can be formed as a single layer or a laminated layer using a conductive metal oxide. The conductive metal oxide may be indium oxide (In2O3, etc.). ), tin oxide (SnO2, etc.), zinc oxide (ZnO), ITO, indium zinc oxide (I ZnO, etc.) or these metal oxide materials containing silicon oxide. It is possible.

[0204] The colored layer is a colored layer that transmits light in a specific wavelength band. For example, A red (R) color filter transmits light in the green wavelength band, and a green (G) color filter transmits light in the green wavelength band. A blue (B) color filter that transmits light in the blue wavelength band can be used. Each color layer can be formed using various materials by printing, inkjet printing, photolithography, etc. They are formed at desired positions by etching using a graphic technique or the like.

[0205] The light-shielding layer is provided between adjacent colored layers. The light-shielding layer blocks light from the adjacent light-emitting element. The colored layer is formed on the edge of the light-shielding layer to prevent color mixing between adjacent light-emitting elements. By providing the light-shielding layer so that it overlaps the light-shielding layer, it is possible to suppress light leakage. Materials that block light emitted from the light-emitting element can be used, and include, for example, metal materials, pigments, and dyes. The black matrix may be formed using a resin material containing the light-shielding layer. If the light emitting element is provided in an area other than the light emitting part, unintended light leakage due to guided light can be suppressed. This is preferable.

[0206] In addition, an overcoat may be provided to cover the colored layer and the light-shielding layer. By doing so, it is possible to prevent impurities contained in the colored layer from diffusing into the light emitting element. The overcoat is made of a material that transmits light emitted from the light emitting element, such as silicon nitride. It uses inorganic insulating films such as silicon oxide films, and organic insulating films such as acrylic films and polyimide films. The insulating film may have a laminated structure of an organic insulating film and an inorganic insulating film.

[0207] In addition, when the material for the sealing layer is applied onto the colored layer and the light-shielding layer, the material for the overcoat is It is preferable to use a material that has high wettability with respect to the material of the sealing layer. As the substrate, oxide conductive films such as ITO films and metal films such as Ag films that are thin enough to be transparent are used. It is preferred to use a membrane.

[0208] The connector is a paste or sheet made of a thermosetting resin mixed with metal particles. For example, a material that exhibits anisotropic conductivity when thermocompressed can be used. For example, particles with layers of two or more metals, such as nickel particles coated with gold, are used. It is preferable that

[0209] <Example of manufacturing method> Next, a method for manufacturing a light-emitting panel will be illustrated with reference to FIGS. 13 and 14. The following description will be given taking the light-emitting panel having the configuration of 1 (FIG. 11(C)) as an example.

[0210] First, a peeling layer 203 is formed on a fabrication substrate 201, and an insulating layer 813 is formed on the peeling layer 203. Next, a plurality of transistors, a conductive layer 857, an insulating layer 815, an insulating layer 816, and a conductive layer 857 are formed on the insulating layer 813. An edge layer 817, a plurality of light-emitting elements, and an insulating layer 821 are formed. In this manner, openings are formed in the insulating layer 821, the insulating layer 817, and the insulating layer 815 (FIG. 13(A)). ).

[0211] In addition, a peeling layer 207 is formed on the fabrication substrate 205, and an insulating layer 843 is formed on the peeling layer 207. Next, a light-shielding layer 847, a coloring layer 845, and an overcoat 84 are formed on the insulating layer 843. 9 is formed (Figure 13(B)).

[0212] The substrates 201 and 205 are made of glass, quartz, and surface treatment. A fiber substrate, a ceramic substrate, a metal substrate, or the like can be used.

[0213] The glass substrate may be made of, for example, aluminosilicate glass or aluminoborosilicate glass. Glass materials such as glass and barium borosilicate glass can be used. If the degree of hardness is high, it is advisable to use one with a strain point of 730°C or higher. By adding more BaO, a more practical heat-resistant glass can be obtained. Russ etc. can be used.

[0214] When a glass substrate is used as the substrate for fabrication, a silicon oxide film, an acid film, or the like is formed between the substrate for fabrication and the peeling layer. When an insulating film such as a silicon nitride film, a silicon nitride film, or a silicon nitride oxide film is formed, the glass This is preferable because it can prevent contamination from the substrate.

[0215] The peeling layer 203 and the peeling layer 207 are made of tungsten, molybdenum, and titanium, respectively. Niobium, tantalum, niobium, nickel, cobalt, zirconium, zinc, ruthenium, rhodium an element selected from the group consisting of palladium, osmium, iridium, and silicon; It is made of an alloy material or a compound material containing the element, and is a single layer or a laminated layer. The crystal structure of the layer containing silicon may be amorphous, microcrystalline, or polycrystalline.

[0216] The release layer can be formed by sputtering, plasma CVD, coating, printing, etc. The coating method includes a spin coating method, a droplet ejection method, and a dispensing method.

[0217] When the release layer has a single layer structure, it is made up of a tungsten layer, a molybdenum layer, or a combination of tungsten and molybdenum. It is preferable to form a layer containing a mixture of tungsten and tungsten. a layer containing an oxynitride, a layer containing an oxide or oxynitride of molybdenum, or a layer containing tungsten Alternatively, a layer containing an oxide or oxynitride of a mixture of silicon and molybdenum may be formed. The mixture of tungsten and molybdenum is, for example, a mixture of tungsten and molybdenum. Correct.

[0218] In addition, a layer containing tungsten and a layer containing tungsten oxide may be used as a peeling layer. When forming a structure, a layer containing tungsten is formed, and an insulating layer made of oxide is formed on top of it. By forming a film, a tungsten oxide film is formed at the interface between the tungsten layer and the insulating film. The surface of the tungsten-containing layer may be subjected to thermal oxidation. Oxidizing agents such as oxygen plasma treatment, nitrous oxide (N2O) plasma treatment, and ozone water A layer containing tungsten oxide may be formed by treating with a solution or the like. Treatment and heating may be carried out using oxygen, nitrogen, or nitrous oxide, either alone or in combination with other gases. The plasma treatment or heat treatment may be performed under a mixed gas atmosphere. By changing the temperature, it is possible to control the adhesion between the release layer and the insulating film that will be formed later. be.

[0219] Each insulating layer is formed by using a sputtering method, a plasma CVD method, a coating method, a printing method, etc. For example, it is possible to form a thin film at a temperature of 250°C or higher and 400°C or higher by plasma CVD. By forming the membrane at a temperature of 100° C. or lower, a dense membrane with extremely low water permeability can be obtained.

[0220] Thereafter, the surface of the production substrate 205 on which the colored layer 845 and the like are provided or the light-emitting element of the production substrate 201 is A material for the sealing layer 823 is applied to the surface on which the element 230 and the like are provided, and the sealing layer 823 is then applied to the surface on which the element 230 and the like are provided. The fabrication substrate 201 and fabrication substrate 205 are bonded together so that their surfaces face each other (FIG. 13( C).

[0221] Then, the fabrication substrate 201 is peeled off, and the exposed insulating layer 813 and the substrate 801 are bonded to the adhesive layer 81 1. The manufacturing substrate 205 is peeled off, and the exposed insulating layer 843 and the substrate 14(A), the substrate 803 is attached to the conductive layer 803 by using an adhesive layer 841. Although the conductive layer 857 does not overlap with the substrate 803, the conductive layer 857 may overlap with the substrate 803.

[0222] For example, a peeling layer may be formed by a method using a film made of a material such as a resin. When a layer containing a metal oxide film is formed on the side in contact with the peeling layer, the metal oxide film is crystallized. The layer to be peeled off can be peeled off from the substrate by weakening the film. When an amorphous silicon film containing hydrogen is formed as a peeling layer between the substrate and the peeled layer, laser light The amorphous silicon film is removed by irradiation or etching, and the layer to be peeled is separated from the substrate. The peeling layer can be peeled off from the peeled layer. The metal oxide film is weakened by crystallization, and a part of the peeling layer is then dissolved in a solution or NF. 3. After removal by etching using fluoride gases such as BrF3 and ClF3, the weakened It can be peeled off from the metal oxide film. Furthermore, nitrogen, oxygen, hydrogen, etc. can be used as a peeling layer. (for example, amorphous silicon film containing hydrogen, hydrogen-containing alloy film, oxygen-containing alloy film, etc.) The peeling layer is irradiated with laser light to release nitrogen, oxygen, and hydrogen contained in the peeling layer as gas. A method of promoting peeling between the peeled layer and the substrate by releasing the peeled layer may also be used. The substrate is mechanically removed or etched with a solution or fluorinated gas such as NF3, BrF3, or ClF3. In this case, the peeling layer can be removed without providing a peeling layer. good.

[0223] Furthermore, by combining a plurality of the above peeling methods, the peeling process can be carried out more easily. In other words, laser irradiation, etching of the peeling layer with gas or solution, sharp knife or Mechanical removal is performed using a scalpel or similar tool to make the peeling layer and the peeled layer easier to peel off. Alternatively, the peeling can be performed by physical force (using a machine, etc.).

[0224] In addition, a liquid is allowed to penetrate into the interface between the peeling layer and the layer to be peeled, and the layer to be peeled is peeled from the substrate. Furthermore, the peeling may be performed while pouring a liquid such as water on the film.

[0225] As for other peeling methods, if the peeling layer is made of tungsten, ammonia water and The peeling layer may be etched with a mixed solution of hydrogen peroxide and water to perform the peeling.

[0226] Note that if peeling can be performed at the interface between the formation substrate and the peeled layer, a peeling layer may not be provided. For example, glass is used as the substrate, and polyimide, polyester, or polyimide is placed in contact with the glass. Forming organic resins such as polyolefin, polyamide, polycarbonate, and acrylic, Insulating films, transistors, etc. are formed on the resin. In this case, by heating the organic resin, It can be peeled off at the interface between the substrate and the organic resin. A metal layer is provided, and the metal layer is heated by passing an electric current through the metal layer, and an organic resin is formed at the interface between the metal layer and the organic resin. Peeling may also be performed.

[0227] Finally, the insulating layer 843 and the sealing layer 823 are opened to expose the conductive layer 857. (FIG. 14B). In the case where the substrate 803 overlaps with the conductive layer 857, The substrate 803 and adhesive layer 841 are also opened to expose 7 (FIG. 14(C)). The method is not particularly limited, and examples thereof include laser ablation, etching, and ion beam. A sputtering method or the like may be used. Alternatively, an incision may be made in the membrane and a portion of the membrane may be peeled off by physical force.

[0228] In this manner, a light-emitting panel can be manufactured.

[0229] This embodiment may be combined, at least in part, with other embodiments described in this specification. It can be implemented in combination.

[0230] (Embodiment 3) In this embodiment, a folding LCD panel that can be applied to a display panel included in an electronic device of one embodiment of the present invention will be described. The structure of the bendable touch panel will be described with reference to FIGS. 15 to 18. For the material, reference can be made to Embodiment Mode 2.

[0231] <Configuration example 1> 15(A) is a top view of the touch panel. 15(C) is a cross-sectional view taken along the dashed line in FIG. This is a cross-sectional view between EF.

[0232] As shown in FIG. 15A, the touch panel 390 includes a display unit 301 .

[0233] The display unit 301 includes a plurality of pixels 302 and a plurality of imaging pixels 308. This allows the image pickup pixel 308 to detect a finger or the like touching the display unit 301. A touch sensor can be configured using the above.

[0234] The pixel 302 includes a plurality of sub-pixels (for example, the sub-pixel 302R), each of which includes a light-emitting element and a The pixel circuit is capable of supplying power to drive the light emitting element.

[0235] The pixel circuit includes wiring that can supply a selection signal and wiring that can supply an image signal. The wiring is electrically connected to the wiring.

[0236] The touch panel 390 also includes a scan line driver that can supply selection signals to the pixels 302. circuit 303g(1), and an image signal line driving circuit capable of supplying an image signal to the pixel 302. It has a path 303s(1).

[0237] The imaging pixel 308 includes a photoelectric conversion element and an imaging pixel circuit that drives the photoelectric conversion element.

[0238] The imaging pixel circuit has wiring that can supply a control signal and a power supply potential. It is electrically connected to the wiring that can be used.

[0239] The control signal is used to select an imaging pixel circuit that reads out the recorded imaging signal, for example. a signal that can initialize the imaging pixel circuit, and a signal that can initialize the imaging pixel circuit Examples of such signals include signals that can determine the time at which the signal is detected.

[0240] The touch panel 390 may provide control signals to the imaging pixels 308. and an image pickup signal line drive circuit 303s(2) that reads out the image pickup signal. .

[0241] As shown in FIG. 15B, the touch panel 390 is formed on a substrate 510 and a substrate 510 facing the substrate 510. The substrate 570 is a substrate for supporting the semiconductor device.

[0242] A flexible material can be suitably used for the substrate 510 and the substrate 570 .

[0243] Materials that suppress impurity permeation can be suitably used for the substrates 510 and 570. For example, if the water vapor permeability is 10 -5 g / (m 2 ·day) or less, preferably 10 -6 g / (m 2 A material having a shelf life of 10 days or less can be preferably used.

[0244] Materials with approximately the same linear expansion coefficient can be suitably used for the substrates 510 and 570. For example, if the linear expansion coefficient is 1×10 -3 / K or less, preferably 5×10 -5 / K or less, better Preferably 1 x 10 -5 A material having a solubility of 0.1 kJ / K or less can be suitably used.

[0245] The substrate 510 includes a flexible substrate 510b and an insulating layer 510a that prevents impurities from diffusing into the light emitting element. and an adhesive layer 510c that bonds the flexible substrate 510b and the insulating layer 510a together. It is a laminate.

[0246] The substrate 570 includes a flexible substrate 570b and an insulating layer 570a that prevents impurities from diffusing into the light-emitting element. and an adhesive layer 570c that bonds the flexible substrate 570b and the insulating layer 570a. do.

[0247] For example, polyester, polyolefin, polyamide (nylon, aramid, etc.), poly Imide, polycarbonate or acrylic, urethane, epoxy or siloxane bonded A material containing a resin having the formula (I) can be used for the adhesive layer.

[0248] The sealing layer 560 bonds the substrate 570 to the substrate 510. The sealing layer 560 is In addition, when light is extracted to the sealing layer 560 side, the sealing layer 560 is A layer that optically bonds two members (here, substrate 570 and substrate 510) sandwiching the stop layer 560. (hereinafter also referred to as an optical bonding layer) also functions as a pixel circuit and a light emitting element (for example, the first The light emitting element 350R is located between the substrate 510 and the substrate 570.

[0249] The pixel 302 includes a subpixel 302R, a subpixel 302G, and a subpixel 302B (see FIG. 15). (C)). The subpixel 302R includes a light-emitting module 380R, and the subpixel 302G includes a light-emitting The subpixel 302B comprises a light emitting module 380G, and the subpixel 302B comprises a light emitting module 380B.

[0250] For example, subpixel 302R supplies power to light emitting element 350R and light emitting element 350R. The pixel circuit includes a transistor 302t that can emit light (FIG. 15(B)). Module 380R includes light emitting element 350R and optical elements (eg, color layer 367R). .

[0251] The light emitting element 350R comprises a lower electrode 351R, an upper electrode 352, and a light emitting element 350R. It has an EL layer 353 between the electrodes 352 (FIG. 15(C)).

[0252] The EL layer 353 includes a first EL layer 353a, a second EL layer 353b, and a second EL layer 353c. An intermediate layer 354 is provided between 53a and the second EL layer 353b.

[0253] The light emitting module 380R has a color layer 367R on a substrate 570. The color layer has a specific wavelength. Any material may be used as long as it transmits light having a certain length, and light that exhibits red, green, or blue may be selected. Alternatively, a material that transmits light emitted by the light-emitting element directly can be used. An area may be provided for this purpose.

[0254] For example, the light emitting module 380R includes a sealing layer in contact with the light emitting element 350R and the color layer 367R. It has a layer 360.

[0255] The colored layer 367R is located so as to overlap the light emitting element 350R. A part of the light emitted by R passes through the sealing layer 360, which also serves as an optical bonding layer, and the colored layer 367R. , and is emitted to the outside of light emitting module 380R as shown by the arrow in the figure.

[0256] The touch panel 390 has a light-shielding layer 367BM on a substrate 570. The light-shielding layer 367BM , and is provided so as to surround the colored layer (for example, the colored layer 367R).

[0257] The touch panel 390 includes an anti-reflection layer 367p at a position overlapping the display unit 301. The antireflection layer 367p may be, for example, a circular polarizer.

[0258] The touch panel 390 includes an insulating layer 321. The insulating layer 321 is connected to the transistor 302t. The insulating layer 321 serves to flatten the unevenness caused by the pixel circuit. In addition, the diffusion of impurities into the transistor 302t and the like can be suppressed. An insulating layer having a laminate of layers that can be formed can be applied to the insulating layer 321.

[0259] The touch panel 390 has a light-emitting element (for example, a light-emitting element 350R) on an insulating layer 321. do.

[0260] The touch panel 390 has a partition wall 328 that overlaps the end of the lower electrode 351R and is disposed on the insulating layer 321. In addition, a spacer 329 for controlling the gap between the substrate 510 and the substrate 570 is provided between the partition wall 32. 8 above.

[0261] The image signal line driver circuit 303s(1) includes a transistor 303t and a capacitor 303c. The driver circuit can be formed on the same substrate as the pixel circuit in the same process. As shown in (B), the transistor 303t has a second gate 304 on the insulating layer 321. The second gate 304 is electrically connected to the gate of the transistor 303t. Alternatively, different potentials may be applied to the first and second electrodes. The second gate 304 may be provided to the transistor 308t, the transistor 302t, and so on.

[0262] The imaging pixel 308 converts light incident on the photoelectric conversion element 308p and the photoelectric conversion element 308p into a The imaging pixel circuit includes a transistor 308t. include.

[0263] For example, a pin-type photodiode can be used as the photoelectric conversion element 308p.

[0264] The touch panel 390 includes wiring 311 through which signals can be supplied, and terminals 319 The wiring 311 is provided to supply signals such as image signals and synchronization signals. The FPC 309(1) is electrically connected to the terminal 319. 1) may have a printed wiring board (PWB) attached.

[0265] The transistors formed in the same process are referred to as transistor 302t and transistor 303. This can be applied to transistors such as transistor 308t. Please refer to the second embodiment.

[0266] In addition to the gate, source, and drain of the transistor, each element constituting the touch panel Materials that can be used for the seed wiring and electrodes include aluminum, titanium, chromium, nickel, and the like. Nickel, copper, yttrium, zirconium, molybdenum, silver, tantalum, or tungsten Metals such as nickel or alloys containing nickel as the main component are used in a single layer structure or a laminated structure. For example, a single layer structure of an aluminum film containing silicon, or a structure in which an aluminum film is laminated on a titanium film, Two-layer structure: Two-layer structure with aluminum film laminated on tungsten film, copper-magnesium- Two-layer structure with copper film laminated on aluminum alloy film, two-layer structure with copper film laminated on titanium film , a two-layer structure in which a copper film is laminated on a tungsten film, a titanium film or titanium nitride film and its titanium An aluminum film or a copper film is laminated on the titanium nitride film or the titanium nitride film, and a titanium film is further laminated on the aluminum film or the copper film. a three-layer structure in which a titanium nitride film or a molybdenum nitride film is formed; a molybdenum film or a molybdenum nitride film; An aluminum film or a copper film is laminated on the molybdenum film or the molybdenum nitride film, and There is also a three-layer structure in which a molybdenum film or molybdenum nitride film is formed on top of the above. Transparent conductive materials containing indium, tin oxide, or zinc oxide may also be used. The use of copper is preferable because it improves the controllability of the shape by etching.

[0267] <Configuration example 2> 16(A) and (B) are perspective views of the touch panel 505. FIG. 17 is a cross-sectional view taken along the dashed line X1-X2 in FIG. 16(A). be.

[0268] The touch panel 505 includes a display unit 501 and a touch sensor 595 (FIG. 16(B)). The touch panel 505 also includes a substrate 510, a substrate 570, and a substrate 590. , the substrate 510, the substrate 570 and the substrate 590 are all flexible.

[0269] The display unit 501 includes a substrate 510, a plurality of pixels on the substrate 510, and a display device for supplying signals to the pixels. The plurality of wirings 511 are arranged on the periphery of the substrate 510. The terminal 519 is connected to the FPC 509 (1 ) and electrically connect it.

[0270] The substrate 590 includes a touch sensor 595 and a plurality of electrodes electrically connected to the touch sensor 595. The wiring 598 is routed around the periphery of the substrate 590, and some of the wiring 598 The terminal is electrically connected to the FPC 509(2). 16(B), for clarity, the terminals provided on the rear surface side (substrate 510 side) of the substrate 590 are shown. The electrodes, wiring, etc. of the touch sensor 595 are indicated by solid lines.

[0271] As the touch sensor 595, for example, a capacitance type touch sensor can be applied. The capacitance type includes a surface capacitance type, a projected capacitance type, and the like.

[0272] The projected capacitive type is mainly divided into self-capacitance type and mutual capacitance type, which differ mainly in the driving method. The mutual capacitance method is preferable because it allows simultaneous multi-point detection.

[0273] In the following, when a projected capacitive touch sensor is applied, the following is explained. This will be explained using:

[0274] In addition, various sensors that can detect the proximity or contact of a detection target such as a finger are used. It can be used.

[0275] The projected capacitive touch sensor 595 has an electrode 591 and an electrode 592. 591 is electrically connected to one of the plurality of wirings 598, and the electrode 592 is electrically connected to one of the plurality of wirings 598. and electrically connect to any other of the above.

[0276] As shown in FIGS. 16(A) and 16(B), the electrodes 592 are made up of a plurality of electrodes repeatedly arranged in one direction. The shape is such that two quadrilaterals are connected at their corners.

[0277] The electrode 591 is quadrilateral and is repeatedly arranged in a direction intersecting the direction in which the electrode 592 extends. It has been done.

[0278] The wiring 594 electrically connects the two electrodes 591 that sandwich the electrode 592. It is preferable to have a shape that minimizes the area of ​​the intersection between the electrode 592 and the wiring 594. This reduces the area of ​​the region where no electrodes are provided, and reduces variations in transmittance. As a result, unevenness in brightness of light passing through the touch sensor 595 can be reduced.

[0279] The shapes of the electrodes 591 and 592 are not limited to this, and may take various shapes. For example, a plurality of electrodes 591 are arranged with as few gaps as possible, and the electrodes 591 are connected to each other via an insulating layer. 92 may be provided at intervals so as to form an area that does not overlap with the electrode 591. At this time, a dummy electrode 592 is placed between two adjacent electrodes 592, and is electrically insulated from these electrodes. Providing an electrode is preferable because it can reduce the area of ​​the region with different transmittance.

[0280] The touch sensor 595 includes a substrate 590, electrodes 591 arranged in a staggered pattern on the substrate 590, and and electrode 592, an insulating layer 593 covering electrode 591 and electrode 592, and adjacent electrodes 59 1 is electrically connected to the wiring 594.

[0281] The adhesive layer 597 adheres the substrate 590 to the touch sensor 595 so that the touch sensor 595 overlaps the display unit 501. It is glued to board 570.

[0282] The electrode 591 and the electrode 592 are formed using a light-transmitting conductive material. Conductive materials that can be used include indium oxide, indium tin oxide, and indium zinc oxide. Conductive oxides such as zinc oxide and zinc oxide doped with gallium can be used. A film containing graphene can also be used. The film containing graphene is, for example, in the form of a film. The graphene oxide film can be formed by reducing the graphene oxide film. Examples of the method include a method of applying heat.

[0283] After forming a film of a light-transmitting conductive material on a substrate 590 by sputtering, By using various patterning techniques such as lithography, unnecessary parts are removed to form electrodes 59. 1 and electrode 592 can be formed.

[0284] The insulating layer 593 may be made of a resin such as acrylic or epoxy. In addition to resins with siloxane bonds, silicon oxide, silicon oxynitride, and aluminum oxide Inorganic insulating materials such as the above may also be used.

[0285] An opening reaching the electrode 591 is provided in the insulating layer 593, and a wiring 594 is formed on the adjacent electrode 591. The transparent conductive material increases the aperture ratio of the touch panel. Therefore, it can be suitably used for the wiring 594. 2. Materials with higher conductivity can reduce electrical resistance and are therefore suitable for use as wiring 594. can.

[0286] One electrode 592 extends in one direction, and multiple electrodes 592 are provided in a stripe pattern. .

[0287] The wiring 594 is provided to intersect with the electrodes 592 .

[0288] A pair of electrodes 591 are provided with one electrode 592 sandwiched therebetween, and wiring 594 is connected to the pair of electrodes 591 are electrically connected.

[0289] The plurality of electrodes 591 do not necessarily need to be arranged in a direction perpendicular to one electrode 592. The angle between the two electrodes may be less than 90 degrees.

[0290] One of the wirings 598 is electrically connected to the electrode 591 or the electrode 592. The wiring 598 is made of, for example, aluminum, gold, platinum, silver, or the like. , nickel, titanium, tungsten, chromium, molybdenum, iron, cobalt, copper, or para Metallic materials such as zinc and alloy materials containing such metallic materials can be used.

[0291] Note that an insulating layer is provided to cover the insulating layer 593 and the wiring 594 to protect the touch sensor 595. It is possible.

[0292] Furthermore, the connection layer 599 electrically connects the wiring 598 and the FPC 509(2).

[0293] The connection layer 599 may be made of various anisotropic conductive films (ACFs). Conductive Film) and Anisotropic Conductive Paste (ACP) opic conductive paste) can be used.

[0294] The adhesive layer 597 is transparent. For example, a thermosetting resin or an ultraviolet curing resin may be used. Specifically, the resin may have an acrylic, urethane, epoxy, or siloxane bond. Resins such as resins can be used.

[0295] The display unit 501 includes a plurality of pixels arranged in a matrix. The display device includes a pixel circuit that drives the display element.

[0296] In this embodiment, an organic EL element that emits white light is applied to a display element. However, the display element is not limited to this.

[0297] For example, organic EL elements with different luminescent colors can be used as sub-pixels so that the color of light emitted varies from sub-pixel to sub-pixel. It may be applied pixel by pixel.

[0298] The substrate 510, the substrate 570, and the sealing layer 560 can have the same configuration as in the first configuration example.

[0299] The pixel includes a sub-pixel 502R, which comprises a light-emitting module 580R.

[0300] The sub-pixel 502R can supply power to the light-emitting element 550R and the light-emitting element 550R. The light-emitting module 580R includes a pixel circuit including a transistor 502t that can emit light. It includes a light element 550R and an optical element (for example, a colored layer 567R).

[0301] The light-emitting element 550R has a lower electrode, an upper electrode, and an EL layer between the lower electrode and the upper electrode. .

[0302] The light emitting module 580R has a colored layer 567R in the direction in which light is extracted.

[0303] In addition, when the sealing layer 560 is provided on the side from which light is extracted, the sealing layer 560 The layer 550R contacts the colored layer 567R.

[0304] The colored layer 567R is located so as to overlap the light emitting element 550R. A part of the light emitted by R passes through the colored layer 567R and reaches the light emitting module in the direction of the arrow shown in the figure. It is ejected from the exterior of Lu 580R.

[0305] The display unit 501 has a light-shielding layer 567BM in the light-emitting direction. , and is provided so as to surround the colored layer (for example, the colored layer 567R).

[0306] The display unit 501 includes an anti-reflection layer 567p at a position overlapping the pixel. For example, a circular polarizer can be used as p.

[0307] The display portion 501 includes an insulating film 521. The insulating film 521 covers the transistor 502t. The insulating film 521 is used as a layer for flattening unevenness caused by the pixel circuit. In addition, a laminated film including a layer capable of suppressing the diffusion of impurities may be applied to the insulating film 521. This can reduce the reliability of the transistor 502t and the like due to the diffusion of impurities. This can suppress the decline in

[0308] The display unit 501 has a light-emitting element (for example, a light-emitting element 550R) on an insulating film 521.

[0309] The display portion 501 has a partition wall 528 on the insulating film 521, which overlaps with an edge of the lower electrode. A spacer for controlling the distance between the substrate 510 and the substrate 570 is provided on the partition wall 528 .

[0310] The scanning line driver circuit 503g(1) includes a transistor 503t and a capacitor 503c. In addition, the driver circuit can be formed on the same substrate as the pixel circuit in the same process.

[0311] The display unit 501 includes a wiring 511 capable of supplying a signal, and a terminal 519 is connected to the wiring 511. 11. In addition, F PC 509(1) is electrically connected to terminal 519.

[0312] A printed wiring board (PWB) may be attached to the FPC509(1). stomach.

[0313] The display portion 501 has wiring such as scanning lines, signal lines, and power supply lines. can be used for wiring.

[0314] Note that various transistors can be applied to the display portion 501. The configuration in which the data is applied to the display unit 501 is shown in FIGS.

[0315] For example, a semiconductor layer containing an oxide semiconductor, amorphous silicon, or the like is formed as shown in FIG. This can be applied to the transistor 502t and the transistor 503t shown.

[0316] For example, a semiconductor containing polycrystalline silicon crystallized by a process such as laser annealing. The layer is applied to the transistor 502t and the transistor 503t shown in FIG. It is possible.

[0317] 17 shows a configuration in which a top-gate type transistor is applied to the display unit 501. Illustrated in (C).

[0318] For example, a single crystal silicon film transferred from a polycrystalline silicon or single crystal silicon substrate, etc. The semiconductor layer including the above is used as the transistor 502t and the transistor 502t shown in FIG. Can be applied to 03t.

[0319] <Configuration example 3> 18 is a cross-sectional view of touch panel 505B. The display unit 505B displays the supplied image information on the side where the transistor is provided. The touch sensor is provided on the substrate 510 side of the display unit. This is different from the touch panel 505 of Example 2. The different configuration will be described in detail here. The above description is applicable to the parts where the above configuration can be used.

[0320] The colored layer 567R is located so as to overlap the light emitting element 550R. The optical element 550R emits light toward the side where the transistor 502t is provided. A part of the light emitted by the light emitting element 550R passes through the colored layer 567R and is reflected by the arrows in the figure. The light is emitted to the outside of the light-emitting module 580R in the direction of the arrow.

[0321] The display unit 501 has a light-shielding layer 567BM in the light-emitting direction. , and is provided so as to surround the colored layer (for example, the colored layer 567R).

[0322] The touch sensor 595 is provided on the substrate 510 side of the display unit 501 (FIG. 18(A)). ).

[0323] The adhesive layer 597 is located between the substrate 510 and the substrate 590, and connects the display unit 501 and the touch sensor 5 Glue 95 together.

[0324] Note that various transistors can be applied to the display portion 501. The configuration in which the data is applied to the display unit 501 is shown in FIGS.

[0325] For example, a semiconductor layer containing an oxide semiconductor, amorphous silicon, or the like is formed as shown in FIG. This can be applied to the transistor 502t and the transistor 503t shown.

[0326] For example, a semiconductor layer containing polycrystalline silicon or the like is formed as a transistor 5 shown in FIG. 02t and transistor 503t.

[0327] 18 shows a configuration in which a top-gate transistor is applied to the display unit 501. Illustrated in (C).

[0328] For example, a semiconductor layer including polycrystalline silicon or a transferred single-crystal silicon film is formed as shown in FIG. This can be applied to the transistor 502t and the transistor 503t shown in FIG. do.

[0329] This embodiment may be combined, at least in part, with other embodiments described in this specification. It can be implemented in combination.

[0330] (Fourth embodiment) In this embodiment, a touch panel that can be applied to a display panel included in an electronic device of one embodiment of the present invention is described. An example of a method for driving the panel will be described with reference to the drawings.

[0331] [Example of sensor detection method] FIG. 19A is a block diagram showing the configuration of a mutual capacitance type touch sensor. In (A), a pulse voltage output circuit 601 and a current detection circuit 602 are shown. In (A), an electrode 621 to which a pulse voltage is applied and an electrode 622 to which a change in current is detected are arranged. These are shown as six wires, X1-X6 and Y1-Y6, respectively. A) illustrates a capacitance 603 formed by overlapping electrodes 121 and 122. The functions of electrode 121 and electrode 122 may be interchangeable.

[0332] The pulse voltage output circuit 601 is a circuit for applying a pulse voltage to the wires X1 to X6 in order. When a pulse voltage is applied to the wirings X1-X6, a current that forms a capacitance 603 flows. An electric field is generated between the electrodes 121 and 122. The electric field generated between the electrodes is prevented by shielding or the like. By using the change in the mutual capacitance of the quantity 603, the proximity or contact of the object to be detected is detected. It can be detected.

[0333] The current detection circuit 602 detects the current flowing through the wiring Y1-Y6 due to the change in mutual capacitance at the capacitor 603. This is a circuit for detecting changes in current. The wiring of Y1-Y6 detects the proximity of the object to be detected, or The detected current value does not change if there is no contact, but the proximity or contact of the object to be detected When the mutual capacitance decreases due to the current flowing through the resistor, a decrease in the current value is detected. This can be done using an integrating circuit or the like.

[0334] Next, FIG. 19(B) shows the input of the mutual capacitance type touch sensor shown in FIG. 19(A). The timing chart of the output waveform is shown in FIG. 19(B). In FIG. 19(B), when the object to be detected is not detected ( Two cases are shown: when the object is detected (touched) and when the object is not detected (touched). For the wiring of Y1-Y6, the waveform is shown as a voltage value corresponding to the detected current value. There are.

[0335] A pulse voltage is applied to the wires X1-X6 in order, and the The waveform in the Y6 wiring changes. When there is no proximity or contact of the object to be detected, X1-X6 The waveforms of Y1-Y6 change uniformly according to the change in the voltage of the wiring. Or, at the contact point, the current value decreases, and the corresponding voltage waveform also changes. do.

[0336] In this way, by detecting the change in mutual capacitance, the proximity or contact of the object to be detected can be detected. It is possible.

[0337] In addition, in FIG. 19(A), a panel in which only a capacitor 603 is provided at the intersection of the wiring as a touch sensor is used. The structure of the touch sensor of the passive matrix type is shown, but the structure of the touch sensor with transistors and capacitors is also shown. An active matrix touch sensor may also be used. 1 shows an example of one sensor circuit included in a touch sensor of the type.

[0338] The sensor circuit includes a capacitor 603, a transistor 611, a transistor 612, and a transistor The transistor 613 has a gate to which a signal G2 is applied, and a source or A voltage VRES is applied to one of the drains, and the other is connected to one electrode of the capacitor 603 and the transistor. The transistor 611 is electrically connected to the gate of the transistor 611. One is electrically connected to one of the source and drain of the transistor 612, and the other is connected to a voltage V The transistor 612 receives a signal G2 at its gate and a signal G3 at its source or drain. The other electrode of the capacitor 603 is electrically connected to the wiring ML. can be obtained.

[0339] Next, the operation of the sensor circuit will be described. First, the signal G2 is output from the transistor 613. When a potential that turns on the transistor 611 is applied, the gate of the transistor 611 is connected to the node A potential corresponding to the voltage VRES is applied to node n. By applying a potential that turns off 613, the potential of the node n is maintained.

[0340] Next, the mutual capacitance of the capacitor 603 changes when a detected object such as a finger approaches or touches the sensor. As a result, the potential of the node n changes from VRES.

[0341] The read operation applies a potential to the signal G1 that turns on the transistor 612. The current flowing through the transistor 611 in accordance with the potential of the node n, that is, the current flowing through the wiring ML, is By detecting this current, it is possible to detect the proximity or contact of an object to be detected. can.

[0342] The transistors 611, 612, and 613 have channels It is preferable to use a transistor in which an oxide semiconductor is used for a semiconductor layer to be formed. By applying such a transistor to the transistor 613, the potential of the node n It is possible to maintain VRES for a long period of time, and the operation of supplying VRES to node n again ( This reduces the frequency of the refresh operation.

[0343] [Example of display device driving method] FIG. 21(A) is a block diagram showing the configuration of a display device as an example. indicates the gate drive circuit GD, the source drive circuit SD, and the pixel pix. ), the gate lines x_1 to x_m (m is a natural number) electrically connected to the gate drive circuit GD. ), and source lines y_1 to y_n (n is a natural number) electrically connected to the source driver circuit SD. Correspondingly, the pixels pix are assigned the codes (1,1) to (n,m).

[0344] Next, FIG. 21(B) shows the gate lines and source lines in the display device shown in FIG. 21(A). 21(B) is a timing chart of signals applied to the line. The data signal is rewritten and not rewritten. Note that periods such as blanking periods are not taken into consideration in FIG. 21(B).

[0345] When rewriting the data signal every frame period, the gate lines x_1 to x_m are During the horizontal scanning period 1H, when the scanning signal is at H level, A data signal D is applied to the column source lines y_1 to y_n.

[0346] If the data signal is not rewritten every frame, the In the horizontal scanning period 1H, the scanning signal applied to the source lines y_1 to y_n of each column is stopped. Stop the data signal from being transmitted.

[0347] A driving method that does not rewrite the data signal every frame period is a method that uses the transistors in the pixels. This is particularly effective when an oxide semiconductor is used as the semiconductor layer in which the channel is formed. Transistors that use oxide semiconductors are different from transistors that use semiconductors such as silicon. Therefore, the off-state current can be reduced significantly compared to that of the conventional photodiode. This allows the data written in the previous period to be retained without rewriting the data signal. Therefore, the gradation of the pixel can be maintained for, for example, 1 second or more, preferably 5 seconds or more.

[0348] [Example of display device and touch sensor driving method] 22(A) to (D) show an example of the touch sensor described in FIG. 19(A) and (B). When the display device described in FIGS. 21(A) and 21(B) is driven for 1 second, 22A is a diagram illustrating the operation of a display device during successive frame periods. The frame period of the touch sensor is set to 16.7 ms (frame frequency: 60 Hz). The frame period is set to 16.7 ms (frame frequency: 60 Hz). .

[0349] In the touch panel of this embodiment, the operations of the display device and the touch sensor are independent of each other. Therefore, the touch detection period can be set in parallel with the display period. As shown in the figure, one frame period of both the display device and the touch sensor is set to 16.7 ms (frame The frame frequency of the touch sensor and the display device can be set to 60Hz. For example, as shown in FIG. 22B, in one frame period of the display device, is set to 8.3 ms (frame frequency: 120 Hz), and one frame period of the touch sensor It is also possible to set the frame rate to 16.7 ms (frame frequency: 60 Hz). The frame frequency of the display device may be set to 33.3 ms (frame frequency: 30 Hz). .

[0350] The display device is also configured to be switchable in frame frequency, so that the frame rate can be adjusted when displaying moving images. Increase the frame rate (for example, 60Hz or higher or 120Hz or higher) to minimize the time it takes to display a still image. In this case, reduce the frame frequency (for example, 60Hz or less, 30Hz or less, or 1Hz or less). ) can reduce the power consumption of the display device. The frequency can be switched between standby and when a touch is detected. They may be different.

[0351] The touch panel of the present embodiment also allows rewriting of data signals in the display device. By retaining the data rewritten in the previous period without changing the display, one frame period of the display device can be Therefore, as shown in FIG. 22(C), The frame period of the display device is set to 1 sec. (frame frequency: 1 Hz), and the touch The sensor frame period can also be set to 16.7 ms (frame frequency: 60 Hz). do.

[0352] Furthermore, when the touch panel of this embodiment is driven as shown in FIG. 22(C), Therefore, as shown in FIG. 22(D), the touch sensor can be driven continuously. When the touch sensor detects the proximity or contact of an object to be detected, the data on the display device is It is also possible to rewrite the data signal.

[0353] Here, the data signal of the display device is rewritten during the sensing period of the touch sensor. When the display device is driven, noise is transmitted to the touch sensor, causing the Therefore, it is necessary to rewrite the data signal of the display device. It is preferable to drive the touch sensor so that the period is shifted from the sensing period of the touch sensor.

[0354] In FIG. 23A, the rewriting of the data signal of the display device and the sensing of the touch sensor are performed. 23B shows an example in which the data signals of the display device are rewritten alternately. This example shows that the touch sensor performs sensing once for every two touch actions. This is not limited to this, but the touch sensor sensing is performed once every three or more rewrite operations. The following configuration may also be used.

[0355] In addition, a transistor used in a pixel of a display device may have an oxide layer in a semiconductor in which a channel is formed. When a nitride semiconductor is used, the off-state current can be reduced significantly, making it possible to write data signals. Specifically, the frequency of data signal rewriting can be reduced. After the data signal is written, a sufficiently long pause can be provided before the next data signal is rewritten. The pause period can be, for example, 0.5 seconds or more, 1 second or more, or 5 seconds or more. The upper limit of the pause period depends on the capacitance connected to the transistor and the leakage current of the display element, etc. For example, it may be limited to 1 minute or less, 10 minutes or less, 1 hour or less, or 1 day or less. It is possible.

[0356] FIG. 23C shows an example in which the data signal of the display device is rewritten once every five seconds. In FIG. 23(C), the display device rewrites the data signal and then writes the next data signal. A pause period is provided during which the operation is stopped until the rewrite operation. The touch sensor operates at a frame frequency of iHz (i is the frame frequency of the display device or higher, here 0 As shown in Figure 23(C), the touch sensor The sensing is performed during the rest period and not during the period when the data signal of the display device is rewritten. This is preferable because it is possible to improve the sensitivity of the touch sensor. As shown in the figure, the data signal of the display device is rewritten and the touch sensor is sensed at the same time. This allows the driving signals to be simplified.

[0357] In addition, during the pause period when the data signal of the display device is not rewritten, the signal to the drive circuit is It is possible to stop the supply of only the signal, or to stop the supply of the power supply potential in addition to this. Power consumption can be reduced.

[0358] The touch panel of one embodiment of the present invention is, for example, a flexible substrate having a display device and a touch panel. The touch sensor is sandwiched between the display device and the touch sensor, allowing the display device and the touch sensor to be placed very close to each other. At this time, noise generated when the display device is driven is easily transmitted to the touch sensor, Although there is a risk that the sensitivity of the sensor may decrease, the driving method exemplified in this embodiment is This makes it possible to realize a touch panel that is both thin and has high detection sensitivity.

[0359] (Embodiment 5) In this embodiment, a touch panel that can be applied to a display panel included in an electronic device of one embodiment of the present invention is described. An example of the panel configuration and driving method will be described with reference to the drawings.

[0360] [Touch panel configuration] FIG. 24 is a block diagram showing an example of the configuration of a touch panel exemplified below. As shown in the figure, the touch panel 90 includes a display device 900, a control circuit 910, a counter circuit 920, It has a touch sensor 950.

[0361] The touch panel 90 receives an image signal (Video) which is digital data, and a display device. A synchronization signal (SYNC) is input to control the rewriting of the screen of the device 900. Examples of signals include a horizontal synchronization signal (Hsync), a vertical synchronization signal (Vsync), and There is a reference clock signal (CLK), etc.

[0362] The display device 900 includes a display unit 901, a gate driver 902, and a source driver 903. The display unit 901 has a plurality of pixels PIX. The pixels PIX in the same row are shared The pixels PIX in the same column are connected to the gate driver 902 by the gate line L_X. It is connected to the source driver 903 by a source line L_Y.

[0363] The display device 900 includes a high-level voltage (VH), a low-level voltage (VL), and a voltage A high power supply voltage (VDD) and a low power supply voltage (VSS) are supplied as power supply voltages. The line voltage (VH) is supplied to each pixel PIX of the display unit 901 via the line L_H. In addition, the low level voltage (VL) is supplied to each pixel PIX of the display unit 901 via the line L_L. will be provided.

[0364] The source driver 903 processes the input image signal, generates a data signal, and outputs the source signal. The gate driver 902 outputs a data signal to the line L_Y. A scanning signal for selecting the pixel PIX is output to the gate line L_X.

[0365] The pixel PIX is a switch whose electrical connection with the source line L_Y is controlled by a scanning signal. When the switching element is turned on, a current flows from the source line L_Y to the pixel PIX. The data signal is written.

[0366] The control circuit 910 is a circuit for controlling the entire touch panel 90. It includes a circuit for generating control signals for the constituent circuits.

[0367] The control circuit 910 controls the gate driver 902 and the source driver 903 in response to a synchronization signal (SYNC). The gate driver 902 has a control signal generating circuit that generates a control signal for the gate driver 903. Control signals include a start pulse (GSP) and a clock signal (GCLK). The control signals for the switch driver 903 include a start pulse (SSP), a clock signal (SCL For example, the control circuit 910 may generate clock signals (GCLK, SCLK) , generate multiple clock signals with the same period but shifted phases.

[0368] The control circuit 910 also receives an image signal (Video ) to the source driver 903.

[0369] The control circuit 910 also controls the sensor signal (S_touch) input from the touch sensor 950. ch) is input, and correction is made to the image signal according to the sensor signal. Although it differs depending on the sensor signal, image processing according to the touch is performed.

[0370] The source driver 903 is connected to a digital / analog conversion circuit 904 (hereinafter referred to as a DA conversion circuit The DA conversion circuit 904 converts the image signal into an analog signal. Generates a time signal.

[0371] If the image signal input to the touch panel 90 is an analog signal, the control circuit The signal is converted into a digital signal at 910 and output to the display device 900 .

[0372] The image signal is made up of image data for each frame. The control circuit 910 processes the image data. Based on the information obtained by this processing, the output of the image signal to the source driver 903 is controlled. Therefore, the control circuit 910 processes the image data to generate a frame image. The motion detector 911 detects motion from image data for each object. In this case, the image signal is corrected based on the image data according to the sensor signal. .

[0373] When the motion detector 911 determines that there is motion, the control circuit 910 On the other hand, if it is determined that there is no movement, the control circuit 910 stops the output of the image signal to the source driver 903. If there is any movement again, If so, the output of the image signal is resumed.

[0374] The control circuit 910 determines whether or not a moving image is displayed (moving image display) based on the determination of the motion detection unit 911. The first mode is for displaying a still image (a moving image), and the second mode is for displaying a still image (a moving image). The display on the display unit 901 can be controlled by switching between two modes. For example, if the vertical synchronization signal (Vsync) is 60Hz, the frame frequency must be set to 60Hz or less. The second mode is a mode in which the vertical synchronization signal (Vsync) is 60 Hz, this is a mode in which the frame frequency is less than 60 Hz.

[0375] In the second mode, the frame frequency is set in advance according to the voltage holding characteristics of the pixel. For example, if the motion detection unit 911 determines that there is no motion for a certain period of time, When the output of the image signal to the source driver 903 is stopped, the pixel PIX is written. Therefore, the voltage corresponding to the gradation of the image signal will decrease. The voltage corresponding to the gray level is written at each frame frequency period (also called refresh). This refresh timing (also called refresh rate) is desirable. For example, the counter circuit 920 counts the H level of the vertical synchronization signal (Vsync). The signal obtained by the above process may be used to perform the process at regular intervals.

[0376] When the refresh rate is set to once per second by the counter circuit 920, If the frequency of the vertical sync signal (Vsync) is 60Hz, Based on the count signal (Count) obtained by counting the H level 60 times, the refresh If the refresh rate is set to once every 5 seconds, the vertical sync signal If the frequency of the vertical sync signal (Vsync) is 60Hz, The refresh rate is calculated based on the count signal (Count) obtained by counting the bell 300 times. The counter circuit 920 may also receive a sensor signal from the touch sensor 950. When a signal is input, the second mode is forcibly changed to the first mode in response to the sensor signal. A switchable configuration may also be used.

[0377] There are no particular restrictions on the image processing for motion detection performed by the motion detection unit 911. For example, a motion detection method may be to use the difference between image data of two consecutive frames. There is a way to obtain minute data. The difference data obtained can be used to determine whether there is movement or not. There are also methods for detecting motion vectors.

[0378] The touch sensor 950 can apply the operation and structure described in the above embodiment. do.

[0379] In this embodiment, the operation of the display device and the operation of the touch sensor 950 are independent of each other. Therefore, the touch sensing period can be set in parallel with the display period. Therefore, even if the control circuit 910 is configured to switch between the first mode and the second mode, The operation of the display device 900 and the touch sensor 95 can be controlled independently. 0, and the rewriting operation of the data signal of the display device 900 and the touch sensor 950 are synchronized. By performing the sensing operations at different periods, the sensitivity of the sensing can be increased.

[0380] [Pixel configuration example] 25A is a circuit diagram showing an example of the configuration of a pixel PIX. It includes TR1, a transistor TR2, a light-emitting element EL, and a capacitance element CAP.

[0381] The transistor TR1 is electrically connected between the source line L_Y and the gate of the transistor TR1. It functions as a switching element that controls the The transistor TR2 is a transistor for controlling the current flowing through the light emitting element EL. It functions as a switching element.

[0382] The transistors TR1 and TR2 have semiconductors in which channels are formed. It is preferable to use an oxide semiconductor.

[0383] The light-emitting element EL has an EL layer containing a light-emitting organic compound sandwiched between two electrodes. The brightness of the light emitted from the light-emitting element changes depending on the current flowing between the two electrodes. One electrode of the transistor is given a low level potential from the wiring L_L, and the other electrode of the transistor is given a low level potential from the wiring L_L. A high level potential is applied from the line L_H via TR2.

[0384] The capacitance element Cap has a function of holding the potential of the gate of the transistor TR2.

[0385] FIG. 25(B) is an example of a pixel PIX having a liquid crystal element. It has a capacitor TR, a liquid crystal element LC, and a capacitor element CAP.

[0386] The transistor TR controls the electrical connection between one electrode of the liquid crystal element LC and the source line L_Y. It is a switching element that controls the on / off state by the scanning signal input to its gate. To be controlled.

[0387] Note that an oxide semiconductor is used as a semiconductor in which a channel is formed in the transistor TR. It is preferable.

[0388] The liquid crystal element LC has two electrodes and liquid crystal. The liquid crystal is induced by the action of an electric field between these two electrodes. The orientation changes depending on the application of the transistor TR. One electrode connected to the source line L_Y corresponds to the pixel electrode, and Vcom is applied to it. The other electrode connected to the common line L_com corresponds to the common electrode.

[0389] The capacitance element Cap is connected in parallel with the liquid crystal element LC. The electrode of the capacitor is connected to the source or drain of the transistor TR, and the other electrode of the capacitor is connected to the capacitor line. It is connected to a capacitance line L_cap to which a voltage is applied.

[0390] Here, examples in which a liquid crystal element LC or a light-emitting element EL is used as a display element will be described. However, one aspect of the present invention is not limited thereto.

[0391] For example, in this specification, a display element, a display device which is a device having a display element, a light-emitting device, A light-emitting device, which is a device having an element and a light-emitting element, can be used in various forms or in various The display element, the display device, the light-emitting element or the light-emitting device can have, for example, an E EL (electroluminescence) elements (EL elements containing organic and inorganic materials, organic EL elements) , inorganic EL elements), LEDs (white LEDs, red LEDs, green LEDs, blue LEDs, etc.), Transistors (transistors that emit light according to the current), electron-emitting devices, liquid crystal devices, electronic Links, electrophoretic elements, grating light valves (GLVs), plasma display panels LCDs (PDPs), and displays using MEMS (microelectromechanical systems) Display element, Digital Micromirror Device (DMD), DMS (Digital Micromirror Shutter), MIRASOL (registered trademark), Interferometric Modulation (IMOD) element, Shutter method MEMS display elements, optical interference type MEMS display elements, electrowetting elements, At least piezoelectric ceramic displays, display elements using carbon nanotubes, etc. In addition to these, there are also other features such as contrast, brightness, etc., which can be achieved by electrical or magnetic effects. The display medium may have a variable reflectance, transmittance, etc. An example of such a device is an EL display. Examples include field emission displays (FED) or SED flat panel displays. Spray (SED: Surface-conduction Electron-emissive An example of a display device using a liquid crystal element is a liquid crystal display. LCD displays (transmissive LCD displays, semi-transmissive LCD displays, reflective LCD displays) LCDs include spray, direct-view LCDs, and projection LCDs. An example of a display device using an electrophoretic element is electronic paper. When realizing a transmissive or reflective LCD, part of the pixel electrode Alternatively, all of the pixel electrodes may function as reflective electrodes. may be partly or entirely made of aluminum, silver, etc. In this case, it is possible to provide a memory circuit such as an SRAM under the reflective electrode. This further reduces power consumption.

[0392] For example, in this specification, a pixel having an active element (active element, nonlinear element) active matrix type, in which the pixels have no active elements, or passive matrix type, in which the pixels have no active elements Equation can be used.

[0393] In the active matrix system, various active elements, not just transistors, are used. For example, MIM (Metal Insulator Metal) or TFD (Thin Film Diode) can also be used. These elements require fewer manufacturing steps, which reduces manufacturing costs and improves yield. Or, since these elements are small in size, the aperture ratio can be increased. This can improve the light emission efficiency, thereby reducing power consumption and increasing brightness.

[0394] Since the passive matrix type does not use active elements, there are fewer manufacturing processes and manufacturing costs are low. Furthermore, since no active elements are used, the aperture ratio can be reduced. This can improve the brightness and reduce power consumption, thereby enabling higher brightness and the like.

[0395] [Touch panel driving method example] Hereinafter, the first mode for displaying moving images and the second mode for displaying still images will be explained using the timing chart shown in FIG. The operation of the touch panel 90 for displaying in the second mode for displaying still images will be described. 6 is a vertical synchronization signal (Vsync) and a source line L_Y from the source driver 903. 1 shows the signal waveform of the data signal (Vdata) output to

[0396] FIG. 26 shows an example of a case where a moving image is displayed, then a still image is displayed, and then a moving image is displayed again. 1 is a timing chart of the touch panel 90. Here, from the first frame to the k Assume that there is motion in the image data up to the frame (k+1). Assume that there is no movement in the image data up to the (k+3)th frame. Then, in the (k+4)th frame, It is assumed that the image data thereafter includes motion. Note that k is an integer of 2 or greater.

[0397] During the first moving image display period, the motion detector 911 detects motion in the image data of each frame. Therefore, the touch panel 90 operates in the first mode. In 10, the frame frequency is set to be equal to or higher than the vertical sync signal frequency, here frame frequency f1. Then, the image signal (Video) is output to the source driver 903. The output of the data signal (Vdata) to the source line L_Y is performed continuously by the output of the data signal (Vdata). The length of one frame period during the moving image display period is expressed as 1 / f1 (seconds).

[0398] Next, during the still image display period, the motion detection unit 911 performs image processing for motion detection. Therefore, it is determined that there is no movement in the image data of the (k+1)th frame. 0 operates in the second mode. The control circuit 910 controls the frame frequency to the vertical sync signal Here, the signal is output to the source driver 903 at a frequency lower than the frame frequency f2. The source driver 903 controls the output of the data signal (Vdata) to the source line L_Y. The length of one frame period during the still image display period is 1 / f2 (seconds) )

[0399] The source driver 903 can output the data signal (Vdata) intermittently. Therefore, the control signal (start pulse) to the gate driver 902 and the source driver 903 The gate driver 9 may also be supplied intermittently with the gate driver 9 (signal, clock signal, etc.). 02 and source driver 903 can be stopped.

[0400] In the second mode, the data signal (Vdata) is intermittently output to the source line L_Y. As an example, as shown in FIG. At this point, the control circuit 910 controls the gate driver 902 and the source driver 903. The image signal VIDE is output to the source driver 903 at a frame frequency of f2. The source driver 903 outputs the data signal (Vdata ), that is, the data signal (Vdat a) is output to the source line L_Y. In this way, during the still image display period, The input data signal (Vdata) is repeatedly applied to the source line L_Y every period 1 / f2 (seconds). Therefore, the voltage corresponding to the gradation of the image signal of the same image is refreshed. By refreshing periodically, the gray scale deviation caused by the voltage drop can be prevented. This reduces flicker caused by the above and provides a touch panel with improved display quality. It is possible.

[0401] Then, in the control circuit 910, the motion detection unit 911 determines that there is motion in the image data. The system operates in the second mode until a result is obtained or a sensor signal is input.

[0402] Then, the motion detector 911 detects motion in the image data from the (k+4)th frame onwards. If it is determined that the touch panel 90 is in the first mode, the control circuit 910 operates in the first mode again. So, let's set the frame frequency to be equal to or higher than the vertical sync signal frequency, here frame frequency f1. , and outputs an image signal (Video) to the source driver 903. 03 is to continuously output the data signal (Vdata) to the source line L_Y. .

[0403] The touch panel of one embodiment of the present invention is, for example, a flexible substrate having a display device and a touch panel. The touch sensor is sandwiched between the display device and the touch sensor, allowing the display device and the touch sensor to be placed very close to each other. In this case, noise generated when the display device is driven is easily transmitted to the touch sensor, Although there is a risk that the sensitivity of the sensor may decrease, the driving method exemplified in this embodiment is This makes it possible to realize a touch panel that is both thin and has high detection sensitivity.

[0404] This embodiment may be combined, at least in part, with other embodiments described in this specification. It can be implemented in combination. [Example]

[0405] In this example, electronic devices according to one embodiment of the present invention were manufactured.

[0406] The display panel of the electronic device manufactured in this embodiment is formed on a manufacturing substrate (glass substrate) by peeling off A separation layer (tungsten film) is formed, and the separation target including transistors, light-emitting elements, etc. is formed on the separation layer. After forming the layer, the substrate and the peeled layer are separated, and the flexible substrate is attached to the peeled layer using an adhesive. It was made by attaching layers together.

[0407] The transistor uses CAAC-OS (C Axis Aligned Crystal A transistor using a line oxide semiconductor (WO2) was applied. Unlike amorphous materials, CAAC-OS has fewer defect levels, which improves the reliability of transistors. In addition, CAAC-OS has the characteristic that no grain boundaries are observed. Therefore, it is possible to form a stable and uniform film over a large area, and it is also possible to manufacture a flexible light-emitting device. The CAAC-OS film is less likely to crack due to stress when bent.

[0408] CAAC-OS is a crystalline oxide semiconductor whose c-axis is aligned approximately perpendicular to the film surface. Another example of the crystalline structure of oxide semiconductors is a nanoscale microcrystalline aggregate. There are various structures that are different from single crystals, such as nano-crystals (nc). It has been confirmed that CAAC-OS has lower crystallinity than single crystals and higher crystallinity than nc. expensive.

[0409] In this example, a channel-etched transistor using an In-Ga-Zn oxide was used. The transistor was fabricated on a glass substrate at a temperature of less than 500°C.

[0410] In the method of fabricating elements such as transistors directly on organic resin such as plastic substrates, The temperature in the manufacturing process of the element must be lower than the heat resistance temperature of the organic resin. The substrate used for the fabrication is a glass substrate, and the peeling layer, which is an inorganic film, has high heat resistance. The transistor can be fabricated at the same temperature as when fabricating a transistor on a silicon substrate. Therefore, the performance and reliability of the transistor can be easily ensured.

[0411] The light-emitting element used was a tandem (stacked) organic EL element that emits white light. The device has a top-emission structure, and light from the light-emitting element is emitted to the display panel through a color filter. It is taken out of the box.

[0412] The display panel we created has a diagonal size of 5.9 inches and a pixel count of 720 x 128. 0, pixel size 102μm x 102μm, resolution 249ppi, aperture ratio 45.2% The frame frequency is 60Hz, and the scan driver is built-in. The driver was mounted using the COF method. The thickness of the manufactured display panel was less than 100 μm. The weight was approximately 3 g.

[0413] 27(A), (B), and (C) show photographs of the electronic device. 27(A) shows the state in which the display surface of the panel is flat, and FIG. 27(B) shows the state in which the display panel is being folded. 27(C) shows the display panel in a folded state. Therefore, symbols etc. are omitted in Figures 27(B) and (C).

[0414] The electronic device shown in FIG. 27A and the like includes a display panel 101, a support 142a, a support 142b, and a b, a support 142c, a hinge 143a, and a hinge 143b. The slide mechanism 165 has a mechanism for changing the length of both ends of the slide mechanism 165.

[0415] In this way, in the electronic device of one embodiment of the present invention, the display surface of the display panel 101 is flat. The display panel 101 can be easily transformed from the folded state to the opened state without being damaged. It is possible.

[0416] The above is a description of the embodiment.

[0417] At least a part of this embodiment may be appropriately combined with the embodiment described in this specification. This can be implemented. [Explanation of symbols]

[0418] 100 Electronic equipment 101 Display Panel 101a part 101b part 101c part 102a Support 102b Support 102c support 103 Hinge 103a Hinge 103b Hinge 110 Hinge 110a plane 110b plane 111 Rotation axis 111a Rotating shaft 111b Rotation axis 120 Electronic equipment 121 Electrode 122 electrodes 130 Electronic equipment 140 Electronic equipment 141 Case 142a Support 142b Support 142c support 143a Hinge 143b Hinge 144 Printed Circuit Board 145 Operation Buttons 147 FPC 148 Terminal connection 149 Battery 151a Rotating shaft 151b Rotation axis 160 Electronic equipment 161 Case 162a Parts 162b Materials 162c Materials 163 screws 164 Openings 201 Fabricated substrate 203 Peeling layer 205 Fabricated substrate 207 Peeling layer 230 Light-emitting element 301 Display section 302 pixels 302B subpixel 302G subpixel 302R subpixel 302t transistor 303c capacity 303g(1) Scanning line driver circuit 303g(2) Imaging pixel drive circuit 303s(1) Image signal line driver circuit 303s(2) Image signal line driver circuit 303t transistor Gate 304 308 imaging pixels 308p photoelectric conversion element 308t transistor 309 FPC 311 Wiring 319 terminal 321 Insulating Layer 328 Bulkhead 329 Spacer 350R light emitting element 351R lower electrode 352 Upper electrode 353 EL layer 353a EL layer 353b EL layer 354 Middle Class 360 sealing layer 367BM light shielding layer 367p anti-reflection layer 367R colored layer 380B Light Emitting Module 380G light emitting module 380R Light Emitting Module 390 Touch Panel 501 Display section 502R subpixel 502t transistor 503c capacity 503g Scanning line driver circuit 503t transistor 505 touch panel 505B Touch Panel 509 FPC 510 board 510a Insulating layer 510b flexible substrate 510c adhesive layer 511 Wiring 519 terminal 521 Insulating film 528 Bulkhead 550R light emitting element 560 Sealing Layer 567BM light shielding layer 567p anti-reflection layer 567R colored layer 570 PCB 570a Insulating layer 570b flexible substrate 570c ​​adhesive layer 580R Light Emitting Module 590 PCB 591 Electrode 592 Electrode 593 Insulating Layer 594 Wiring 595 Touch Sensor 597 Adhesive layer 598 Wiring 599 Connection Layer 601 Pulse voltage output circuit 602 Current detection circuit 603 capacity 611 Transistor 612 Transistor 613 Transistor 621 Electrode 622 Electrode 801 board 803 board 804 Light-emitting part 806 Drive circuit section 808 FPC 811 Adhesive layer 813 Insulation layer 814 Conductive layer 815 Insulation layer 816 Conductive layer 817 Insulation layer 817a Insulating layer 817b Insulating layer 820 transistors 821 Insulation layer 822 transistor 823 Sealing layer 824 Sealing layer 825 Connector 827 Spacer 830 Light-emitting element 831 Lower electrode 833 EL layer 835 Upper electrode 841 Adhesive layer 843 Insulation Layer 845 Colored layer 847 Light blocking layer 849 Overcoat 857 Conductive layer 857a Conductive layer 857b Conductive layer 90 Touch Panel 900 Display device 901 Display section 902 Gate Driver 903 Source Driver 904 DA conversion circuit 910 Control circuit 911 detection unit 920 Counter Circuit 950 Touch Sensor

Claims

[Claim 1] An electronic device having a first support, a second support, a first hinge, and a display panel, the display panel has a first portion supported by the first support, a second portion supported by the second support, and a flexible third portion located between the first portion and the second portion; the display panel has a display surface overlapping the first portion, the second portion, and the third portion; the first hinge has a first rotation axis and functions to connect the first support body and the second support body; the first support body and the second support body have a function of relatively rotating about the first rotation axis, a first plane including the display surface overlapping the first portion is parallel to the first rotation axis; a second plane including the display surface overlapping the second portion is parallel to the first rotation axis; a distance between the first plane and the first rotation axis is greater than 0; a distance between the second plane and the first rotation axis is greater than 0; electronic equipment.

Images