Display device

Abstract

To provide a display device with a high visibility.SOLUTION: A display device includes a first region and a second region adjacent to the first region. The first region has a display element which has a function of reflecting visible light and a function of emitting visible light, and the second region has a display element which has a function of emitting visible light. In an electronic apparatus having the display device, the first region is provided in a first surface (an upper surface, for example) for the main display, and a second region is provided in a second surface (a side surface, for example) for the sub display.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to an article, a method, or a manufacturing method. Alternatively, the present invention relates to a process, a machine, relating to the manufacture or composition of matter, especially One embodiment of the present invention is a semiconductor device, a light-emitting device, a display device, an electronic device, a lighting device, or any of them. In particular, the present invention relates to a display device capable of displaying on a curved surface (display Or, electronic equipment, light-emitting device, etc., equipped with a display device capable of displaying on a curved surface. The present invention relates to lighting devices or methods for making the same.

[0002] In this specification and the like, a semiconductor device is a device that can function by utilizing semiconductor characteristics. Transistors, semiconductor circuits, arithmetic units, memory devices, etc. are examples of semiconductor devices. Furthermore, a light-emitting device, a display device, an electronic device, a lighting device, and an electronic device may include a semiconductor device. There are cases where they have. [Background technology]

[0003] Active matrix LCDs are broadly divided into two types: transmissive and reflective. is known.

[0004] Transmissive LCD displays use cold cathode fluorescent lamps and LEDs (Light Emitting Diodes). The backlight is a type of backlight such as a diode, and the optical modulation effect of the liquid crystal is used to The state in which light from the liquid crystal is transmitted through the liquid crystal and output to the outside of the liquid crystal display device and the state in which it is not output are shown. By selecting the desired color, light and dark colors are displayed, and then combining these colors, an image is displayed.

[0005] Reflective liquid crystal display devices utilize the optical modulation effect of liquid crystal to reflect external light, i.e., incident light. The state in which the incident light is reflected by the pixel electrode and output to the outside of the device, and the state in which the incident light is not output to the outside of the device. By selecting the state, light and dark are displayed, and by combining them, the image display can be Compared to transmissive LCD devices, reflective LCD devices use a backlight. This has the advantage of consuming less power.

[0006] Patent Document 1 also describes a polymerizable liquid crystal display (LCD) device having a transistor and an organic EL element on a film substrate. A flexible active matrix light emitting device is disclosed. [Prior art documents] [Patent documents]

[0007] [Patent Document 1] Japanese Patent Application Laid-Open No. 2003-174153 Summary of the Invention [Problem to be solved by the invention]

[0008] There is a demand for reducing the power consumption of electronic devices that use display devices. In particular, in devices that use batteries as power sources, the power consumption of the display device accounts for a large proportion. To achieve this, there is a demand for display devices with lower power consumption.

[0009] In addition, portable electronic devices have a display device that can display information with high visibility both indoors and outdoors. It is hoped that this will happen.

[0010] An object of one embodiment of the present invention is to provide a display device with high visibility. One of the objectives is to provide a display device capable of displaying various images. One of the objects is to provide a display device. Another object is to provide a novel display device. Another object of the present invention is to provide an electronic device equipped with the display device (display panel). Another object of the present invention is to provide a novel electronic device.

[0011] Note that the description of these problems does not preclude the existence of other problems. It is not necessary to solve all of these problems. It is clear from the description of the specification, etc. that the problems other than those mentioned above cannot be extracted from the description of the specification, etc. It is possible to issue it. [Means for solving the problem]

[0012] One embodiment of the present invention is a display device having a function of emitting visible light, a display device having a function of emitting visible light and a A display device having a function of reflecting visible light, and an electronic device having any of the display devices Regarding vessels.

[0013] One aspect of the present invention is a display device having a first display area and a second display area, The first display area and the second display area are provided adjacent to each other, and the first display area has a first pixel. the second display area has a second pixel, the first pixel having a first display element and a second display element; the first pixel has a first display element, the second pixel has a third display element, and the first display element reflects visible light. The second display element and the third display element have a function of emitting visible light. It is a display device.

[0014] The first display region is provided with a polarizing plate.

[0015] The first display element is a reflective liquid crystal element, and the second and third display elements are light-emitting It is preferable to use it as an element.

[0016] The first pixel and the second pixel are transistors containing an oxide semiconductor in a semiconductor layer in which a channel is formed. It is preferable to have a transistor.

[0017] The first display area is formed by a first light reflected by the first display element and a second light emitted by the second display element. It is preferable that the display device has a function of displaying an image by using either one or both of the first and second lights. I wish.

[0018] Another aspect of the present invention is a display device including the above-described display device and a housing, the housing having a first surface and a second surface. and two surfaces, the first surface and the second surface being continuous, the second surface having a curvature, and the first The electronic device has a display area on a first surface and a second display area on a second surface. .

[0019] It is preferable that a touch sensor be provided at a position overlapping the display device.

[0020] Another aspect of the present invention is a display device including a first display area, a second display area, a third display area, and A display device having a fourth display area, wherein the first to fourth display areas are substantially quadrilaterals; The first display area has a first side and a second side perpendicular to the first side, and the second display area The third display area has a third side and a fourth side perpendicular to the third side, and the third display area has a fifth side and and a sixth side perpendicular to the fifth side, and the fourth display area has a seventh side and a The first and third sides are in contact with each other, and the second and fifth sides are in contact with each other. The fourth and seventh sides are adjacent to each other, and the sixth and eighth sides are adjacent to each other. The second to fourth display areas are display devices having curved surfaces.

[0021] The first and third sides are equal in length, the second and fifth sides are equal in length, and the fourth The length of the first side is greater than the length of the seventh side, and the length of the sixth side is greater than the length of the eighth side. The seventh and eighth sides are configured to have equal lengths.

[0022] The first display area has a first pixel, the second display area has a second pixel, and the third display area has a The fourth display area has a third pixel, the fourth display area has a fourth pixel, and the first to fourth pixels are Each of the display devices has a first display element, and the first display element has a function of emitting visible light.

[0023] The first pixel further includes a second display element, the second display element having a function of reflecting visible light. It has.

[0024] It is preferable that the first display element is a light-emitting element and the second display element is a reflective liquid crystal element. stomach.

[0025] The first to fourth pixels are transistors each including an oxide semiconductor in a semiconductor layer in which a channel is formed. It is preferable to have a

[0026] Another aspect of the present invention is a display device including the above-described display device and a housing, the housing having a first surface and a second surface. The first to fourth surfaces are continuous, and the second surface is a first surface, a third surface, and a fourth surface. The second to fourth surfaces have curvatures, the first display area is provided on the first surface, and the second display area is provided on the The first display area is provided on the second surface, the third display area is provided on the third surface, and the fourth display area is provided on the fourth surface. It is an electronic device that is provided on the surface of the device.

[0027] It is preferable that a touch sensor be provided at a position overlapping the display device.

[0028] In this specification, a connector, such as an FPC (Flexible Printed Circuit) printed circuit) or TCP (Tape Carrier Packet modules with a TCP (transmission control) attached, and modules with a printed wiring board attached to the TCP COG (Chip On Glass) method on a substrate on which a module or display element is formed Modules in which ICs (integrated circuits) are directly mounted are included in the category of display devices. [Effects of the Invention]

[0029] By using one embodiment of the present invention, a display device with high visibility can be provided. A display device capable of displaying various images can be provided. Alternatively, a novel display device can be provided. It is possible to provide an electronic device equipped with a display device (display panel). Equipment can be provided.

[0030] The description of these effects does not preclude the existence of other effects. The embodiment does not necessarily have to have all of these effects. , the specification, drawings, claims, etc., and It is possible to extract other effects from the claims and other descriptions. [Brief explanation of the drawings]

[0031] [Figure 1] 1A and 1B illustrate the configuration of an electronic device. [Figure 2] 1A and 1B illustrate the configuration of an electronic device. [Figure 3] 1A and 1B illustrate the configuration of an electronic device. [Figure 4] 1A and 1B are diagrams illustrating examples of usage states of electronic devices. [Figure 5] 1A and 1B illustrate a structure of a display device. [Figure 6] 1A and 1B illustrate a structure of a display device. [Figure 7] 1A and 1B illustrate the configurations of a display device and a touch sensor. [Figure 8] 1A and 1B illustrate the configuration of an electronic device. [Figure 9] 1A and 1B illustrate the configuration of an electronic device. [Figure 10] 1A and 1B illustrate the configuration of an electronic device. [Figure 11] 1A and 1B illustrate the configuration of an electronic device. [Figure 12] 1A and 1B are diagrams illustrating examples of usage states of electronic devices. [Figure 13] 1A and 1B illustrate a structure of a display device. [Figure 14] 1A and 1B illustrate a structure of a display device. [Figure 15] 1A and 1B illustrate the configurations of a display device and a touch sensor. [Figure 16] FIG. 1 is a block diagram illustrating a display device. [Figure 17] FIG. 1 is a block diagram illustrating a display device. [Figure 18] FIG. 2 is a diagram illustrating a pixel unit. [Figure 19] FIG. 2 is a diagram illustrating a pixel unit. [Figure 20] FIG. 2 is a diagram illustrating a pixel unit. [Figure 21] 1A and 1B illustrate a structure of a display device. [Figure 22] 1A and 1B illustrate a structure of a display device. [Figure 23] 1A and 1B illustrate a structure of a display device. [Figure 24] 1A and 1B illustrate a structure of a display device. [Figure 25] 1A and 1B illustrate a structure of a display device. [Figure 26] 1A and 1B are a diagram illustrating a circuit of a display device and a top view of a pixel. [Figure 27] FIG. 2 illustrates a circuit of a display device. [Figure 28] 1A and 1B are a diagram illustrating a circuit of a display device and a top view of a pixel. [Figure 29] 1A and 1B illustrate a structure of a display device. [Figure 30] 1A and 1B illustrate a structure of a display device. [Figure 31] 1A and 1B illustrate a structure of a display device. [Figure 32] 1A and 1B illustrate a structure of a display device. [Figure 33] 1A and 1B illustrate a structure of a display device. [Figure 34] 1A and 1B illustrate a structure of a display device. [Figure 35] 1A and 1B illustrate a structure of a display device. [Figure 36] 1A and 1B illustrate a structure of a display device. DETAILED DESCRIPTION OF THE INVENTION

[0032] The embodiments will be described in detail with reference to the drawings. However, the present invention is not limited to the following description. The present invention may be modified in various forms and details without departing from the spirit and scope of the present invention. It will be readily apparent to those skilled in the art that the present invention can be modified in various ways. The present invention is not to be construed as being limited to the description in the form of

[0033] In the configuration of the invention described below, the same parts or parts having similar functions are The same reference numerals are used in common between different drawings, and repeated explanations thereof will be omitted. When referring to a function, the hatch pattern may be the same and no particular symbol may be assigned.

[0034] In each drawing described in this specification, the size of each component, the thickness of a layer, or the area is not clearly indicated. The figures may be exaggerated for clarity and are not necessarily limited to that scale. .

[0035] In this specification, ordinal numbers such as "first" and "second" are used to avoid confusion of components. The number is not a numerical limit.

[0036] (Embodiment 1) In this embodiment, a display device and an electronic device according to one embodiment of the present invention will be described with reference to the drawings. explain.

[0037] A display device according to one embodiment of the present invention includes a first region and a second region adjacent to the first region. The first region contains a display element having a function of reflecting visible light and a display element having a function of emitting visible light. The second region is provided with a display element having a function of emitting visible light. An indicator element is provided.

[0038] In the electronic device, the first area is provided on the first surface (top surface, etc.) where the main display is performed, and the second area is provided on the first surface (top surface, etc.) where the main display is performed. The area is provided on the second surface (such as the side) for auxiliary display.

[0039] The second area can be displayed only when necessary, so it is normally not used to reduce power consumption. In addition, the configuration of the display element in the second region can be simplified. Therefore, the manufacturing yield can be increased.

[0040] [Examples of electronic devices] FIG. 1A illustrates a top surface of an electronic device including a display device according to one embodiment of the present invention, which will be described below as an example. 1(A) is a schematic perspective view showing the bottom side, and FIG. 1(B) is a schematic perspective view showing the bottom side.

[0041] The electronic devices shown in Figures 1(A) and 1(B) are used as smartphones or tablet terminals. The device includes a housing 10 and a display device 11 provided along the surface of the housing 10. The housing 10 also includes a transparent protective cover, and the display device 11 is located inside the protective cover. It may be provided along the side.

[0042] For example, the housing 10 has a substantially hexahedral shape with a substantially rectangular top surface, and has a surface 12a (top surface) and a surface 12a and a surface 12b (side surface) adjacent to the surface 12a and the surface 12d. , a surface 12c (side surface) opposite to the surface 12b (side surface), and two other side surfaces.

[0043] The display device 11 has a display area 11a overlapping with the surface 12a and a display area 11b overlapping with the surface 12b. The display area 11a has a display area 11c overlapping with the surface 12c. A display element having a reflecting function and a display element having a visible light emitting function are provided. In addition, the display area 11b and the display area 11c are provided with display elements having a function of emitting visible light. A child is born.

[0044] The surfaces 12b and 12c overlapping the display area 11b and the display area 11c, respectively, are curved. For example, it is preferable that the upper surface and the side surface, and the side surface and the lower surface have corners. It is preferable that these surfaces are continuous. It is preferable that the curved surface has a continuous tangent slope from the top surface to the bottom surface.

[0045] This shape improves the stability and operability of the electronic device when held in the hand. In addition, the side surface can be viewed from a wide range of angles, and the display area 11b and the display This can improve the visibility when the display is made in the display area 11c.

[0046] As shown in FIGS. 1(A) and 1(B), the display area 11b is provided along the surface 12b. The display area 11c is provided along the surface 12c. The region 11c is provided so as to cover not the entire surface 12b and the surface 12c but a part of them. The display area 11b and the display area 11c may be provided so as to extend to the surface 12d. It may also be used.

[0047] In addition, although the configuration in which the display areas are provided on two sides is shown in Fig. 1(A) and (B), As shown in FIG. 1A, a display area 11b is provided on a surface 12b, and a display area 11c is provided on a surface 12c. It may be configured without this.

[0048] In addition, in FIGS. 1A, 1B, and 2A, a display area is provided on the side surface in the longitudinal direction of the housing 10. 2B, the surface 12, which is the side surface in the minor axis direction of the housing 10, A display area 11b may be provided in the area e.

[0049] A display area may also be provided on the bottom surface of the housing 10. For example, the oblique display area on the top surface shown in FIG. 3(B) and the perspective view of the bottom surface shown in FIG. 3(C), a display area 12d is formed on the surface 12d. The display element provided in the display area 11d may be the same as that in the display area 11a. The display element has the function of reflecting visible light and the function of emitting visible light, similar to the display element provided in the It is possible.

[0050] The display device 11 having the display areas 11a to 11d is flexible. As shown in FIG. 1B, the edge of the display area 11d is in contact with the edge of the display area 11c. Alternatively, the display area 11d may be configured so that the edge of the display area 11c overlaps with the edge of the display area 11d. By using this configuration, the joints (shown by the solid lines in Figure 3(B)) are less visible. This allows for continuous display on the four sides of the housing 10. It can also be an electronic device that does not require a sensor.

[0051] The display device 11 is flexible, but when it is incorporated into the housing 10, it is not flexible. It does not have to have gender.

[0052] In addition, as a configuration for providing a display area on the surface 12d, the first surface (upper surface) side shown in FIG. 3(D) and the perspective view of the second surface (lower surface) side shown in FIG. The display area 11b is provided on the surface 12e, which is the side surface in the minor axis direction of the housing 10. A configuration may be adopted in which the display area 11a and the display area 11d are provided adjacent to each other.

[0053] In addition to the display device 11, hardware buttons, external connection terminals, etc. are provided on the surface of the housing 10. It may have.

[0054] By adopting the above-mentioned configuration, it is possible to prevent the display panel from being displayed on one side (for example, the top surface) of the housing as in the case of conventional electronic devices. It is possible to display not only on one side of the housing but also on the side surface adjacent to one side of the housing. In addition, providing display areas along two or more sides is preferable because it increases the variety of displays. stomach.

[0055] For example, a display area 11a is arranged along a surface 12a of the housing 10, and a display area 11b is arranged along a surface 12b. The display area 11b arranged along the surface 12c and the display area 11c arranged along the surface 12c are independent of each other. It can be used as a separate display area to display different images, etc. It is also possible to display one image or the like across two or more display areas. For example, The image displayed in 1a may be displayed continuously in the display area 11b or the like.

[0056] FIG. 4 shows an example of how the electronic device shown in FIG. 1(A) and (B) is used. The area 11a includes text information and a plurality of icons 1 associated with application software, etc. 3a is displayed in the display area 11b. In addition, the display area 11b displays notification information 13b, Icon 13c associated with the operation of the device, etc. and icon 13c associated with application software, etc. 13 shows an example in which an icon 13a and the like are displayed.

[0057] For example, when a call or email is received, not only the display area 11a but also the display area 11b is displayed. Notification information 13b and caller information (e.g., caller name, phone number, email address, etc.) In FIG. 4, the notification information 13b is displayed in the display area as a notification of receipt of an email. An example of the case where the information is displayed in the area 11b is shown.

[0058] In addition, during the standby time of the electronic device, the display in the display area 11a is turned off (for example, black display). Alternatively, information may be displayed only in the display area 11b. When only the display area 11a is used continuously, the display of the display area 11b etc. is turned off (for example, black Alternatively, the information may be displayed only in the display area 11a. By turning off the display of the area, power consumption can be reduced.

[0059] In addition, a touch sensor is provided at a position overlapping the display device 11, specifically, at an area overlapping each display area. The touch sensor preferably has a sheet-type capacitance type touch sensor. The sensor may be provided on top of the display device 11. Alternatively, the display device 11 itself may have a tag. It is also possible to use a so-called in-cell type touch panel that has a touch sensor function. The touch panel may be a capacitive touch sensor or a photoelectric conversion An optical touch sensor using a conversion element may also be applied.

[0060] The electronic device according to one aspect of the present invention displays not only on the top surface of the housing but also along one or more side surfaces. This makes it possible to display a wider variety of images than conventional electronic devices. In addition, by providing touch sensors in each display area, it is possible to perform a variety of operations compared to conventional electronic devices. This makes it possible to realize electronic devices that can be operated more intuitively.

[0061] Here, an example in which various displays are made using the display device 11 has been shown, but the present invention One aspect of the present invention is not limited to this. For example, depending on the circumstances, As an example, the display device 11 may be used as a lighting device. By applying it to lighting equipment, it can be used as interior design with excellent design. Or it can be used as lighting that can illuminate in various directions. Alternatively, the display device 11 may be used as a light source such as a backlight or a frontlight. That is, the display device 11 may be used as a lighting device for the display device.

[0062] [Display panel configuration example] Next, structural examples of a display device that can be applied to the electronic devices of one embodiment of the present invention will be described. This will be explained with reference to the drawings.

[0063] 5A is a schematic top view of the display device 11. The display device 11 is made of a flexible substrate 1 The display device 11 has a display region 114 and a plurality of pixels formed on a substrate 14. a, display area 11b, and display area 11c.

[0064] The display area 11a has a quadrilateral shape. The display area 11 is provided adjacent to one of the four sides (side 15a) that define the outline of the display area 11. The widths of the display area 11a and the display area 11b in the direction parallel to the sides 15a are the same. preferable.

[0065] In addition, the display area 11c has one side (side 15b) of the four sides that form the outline of the display area 11a. The display area 11a and the display area 11c are provided in contact with the respective sides 15b. It is preferable that the widths in the directions are the same.

[0066] In addition, a part of the substrate 14 is provided with an FPC 16a for supplying signals and power for driving the pixels. 5A, the IC 17 is mounted on the FPC 16a. However, if IC 17 is not required, it may be omitted. It has the function of supplying signals and power to each drive circuit. There are also cases where this is the case.

[0067] The IC 17 may be directly mounted on the substrate 14. Here, the width of the FPC 16a is It is preferable that the width of the display area 11a is smaller than that of the display area 11b. When the display area 11b and the display area 11c are curved and the display area 11a is used in a flat state, In this case, the joint between the FPC 16a and the substrate 14 does not bend, and the FPC 16a peels off. This can prevent this from happening.

[0068] FIG. 5(B) is an enlarged schematic top view of region A in FIG. 5(A).

[0069] FIG. 5B shows the display areas 11a, 11b, and 11c. 1 shows a configuration having a driving circuit 18 that outputs a signal for driving the pixels included in The drive circuit 18 is provided along the side of the display area 11b opposite to the side 15a. The operating circuit 18 is electrically connected to the FPC 16b via, for example, a wire.

[0070] The drive circuit 18 may function as either a gate drive circuit or a source drive circuit, for example. However, it is preferable to use a gate drive circuit. It is preferable that IC17 has a function as a source driver circuit.

[0071] In this example, a so-called driver-integrated display device is configured with a drive circuit on the substrate 14. However, a configuration without a drive circuit may also be used.

[0072] 5A and 5B show a configuration including three display areas 11a to 11c. As shown in FIG. 6(A), two display areas 11a and 11b are shown. Alternatively, as shown in FIG. 6B, the display area 11a to 11b may be provided. The structure of the driver circuit may be the same as that shown in FIG. The FPC 16b is omitted in Figures 6(A) and 6(B).

[0073] The display area 11a has a plurality of pixels, and the pixels are display elements having a function of reflecting visible light. A display element having a function of emitting visible light and a display element having a function of reflecting visible light is provided. As a display element for this purpose, for example, a reflective liquid crystal display having a mirror that reflects light incident from the outside is used. Examples of display elements that can emit visible light include: A light emitting element can be used.

[0074] Transmissive liquid crystal elements and light-emitting elements are suitable for use in environments with relatively low illumination (outdoors at night, indoors under indoor lighting, etc.). However, in environments with relatively high illumination (such as outdoors in sunlight), In order to improve the visibility of the display under high illuminance, a transmissive LCD In a display device having a light-emitting element, a means is taken to increase the illuminance of the backlight. In electronic devices having such elements, measures are taken to increase the light emission intensity of the light emitting elements.

[0075] Therefore, a display device having only a transmissive liquid crystal element and a display device having only a light emitting element are In some cases, power consumption may increase when used under high illuminance. Even if measures to improve visibility are used, the visibility is still not sufficient.

[0076] In the display device according to one embodiment of the present invention, a reflective liquid crystal element having excellent visibility even under high illuminance is used. The stronger the external light intensity, the better the visibility of the reflective liquid crystal element. Since no light is used, the display device of one embodiment of the present invention consumes low power. In other words, under high illumination, it is as easy to see as a reflective LCD. By driving the element under low illumination, the light emitting element is driven, and the light emitting element is driven under low illumination, so that the light emitting element can be driven at low power regardless of the external illumination. It is possible to make a display element with high visibility and low power consumption. Display may be performed by driving both the liquid crystal element and the light emitting element.

[0077] The display areas 11b and 11c have a plurality of pixels, and the pixels have the function of emitting visible light. A display element is provided. Examples of the display element having a function of emitting visible light include a light-emitting element. A child can be used.

[0078] The display in the display areas 11b and 11c can be performed as needed, and is normally turned off without display. In addition, the structure of the display elements in the display areas 11b and 11c can be Since the structure can be simplified, the manufacturing yield can be increased.

[0079] The pixels provided in each display area of ​​the display device 11 and the transistors used in each drive circuit are In a semiconductor device such as a photodiode, an oxide semiconductor is preferably used for a semiconductor layer. Examples of the compound semiconductor include the Cloud-Aligned Composite (CAC-OS) Composite-Oxide Semiconductor) can be used. do.

[0080] In particular, it is preferable to use an oxide semiconductor having a larger band gap than silicon. If a semiconductor material with a wider band gap and lower carrier density than silicon is used, The current in the off state of the transistor can be reduced.

[0081] In addition, due to its low off-state current, the charge stored in the capacitor can be released over a long period of time via the transistor. By applying such a transistor to the pixel, It is also possible to stop the driving circuit while maintaining the gradation of the image displayed in the display area. As a result, electronic devices with extremely reduced power consumption can be realized.

[0082] In addition, the pixels included in each display area provided in the display device 11 and the transistors used in each drive circuit are Polycrystalline semiconductors may be used in semiconductor devices such as transistors. For example, polycrystalline silicon It is preferable to use polycrystalline silicon, which can be formed at a lower temperature than single-crystal silicon. It also has higher field-effect mobility and higher reliability than amorphous silicon. By applying such a polycrystalline semiconductor to the pixel, the aperture ratio of the pixel can be improved. Even when there are a large number of pixels, the gate driver circuit and the source driver circuit are It is possible to form the components on a single substrate, thereby reducing the number of components that make up the electronic device. do.

[0083] Here, an example of a case where a sheet-like touch sensor is provided over the display device 11 is shown in FIG. This will be explained using:

[0084] FIG. 7A shows a state in which a part of the display device 11 including the FPC 16a is bent. 7B shows a touch sensor 19 in a sheet shape that is curved along the curved surface of the display device 11. The touch sensor 19 is provided with an FPC 16c.

[0085] FIG. 7C shows an example of a state in which the display device 11 and the touch sensor 19 are overlapped. As shown in FIG. 7(C), the FPC 16a provided on the display device 11 and the touch sensor 1 It is preferable to arrange the FPC 16c on the back cover 9 so that it does not overlap with the FPC 16c. The display device 11 and the touch sensor 19 are not made to have the same shape, but rather, FPC 16a or F In the area where the PC 16c is attached, the display device 11 and the touch sensor 19 are arranged so as not to overlap. In addition, it is preferable that they have different shapes.

[0086] In this way, the display device 11 and the sheet-like touch sensor 19 are provided one on top of the other, and these are attached to the housing 1. By incorporating it into the 0, it is possible to touch not only the top surface of the housing but also parts of the side and bottom surfaces. It is possible to add functions.

[0087] This embodiment may be appropriately combined with at least a part of other embodiments described in this specification. It can be implemented in combination.

[0088] (Embodiment 2) In this embodiment mode, a display device and an electronic device different from those in Embodiment 1 will be described with reference to the drawings. The detailed description of elements common to the first embodiment will be omitted.

[0089] A display device according to one aspect of the present invention includes a first display area, a second display area, a third display area, and The first to fourth display areas are substantially quadrilaterals, and the first display area is The first display area is adjacent to the second display area, the first display area is adjacent to the third display area, and the second display area is adjacent to the fourth display area. The first display area is adjacent to the second display area, and the third display area is adjacent to the fourth display area.

[0090] The first to fourth display regions are provided with display elements that emit visible light. The first display area is further provided with a display element having a function of reflecting visible light. Good too.

[0091] In the electronic device, the first display area is provided on the surface (top surface, etc.) where the main display is performed, and the second The first to fourth display areas are provided on surfaces (such as sides or curved corners) that provide auxiliary display.

[0092] The second to fourth display areas are usually blanked out and do not display anything, since they can be displayed only when necessary. Conversely, during standby, any of the second to fourth display areas can be displayed. It is also possible to display only one of the two areas and not display the first area, thereby reducing power consumption. In addition, the display area of ​​the electronic device can be enlarged, improving visibility and operability. It can be increased.

[0093] [Examples of electronic devices] FIG. 8A illustrates a top surface of an electronic device including a display device according to one embodiment of the present invention, which will be described below as an example. 8(A) is a schematic perspective view showing the bottom side, and FIG. 8(B) is a schematic perspective view showing the bottom side.

[0094] The electronic devices shown in Figures 8(A) and 8(B) are used as smartphones or tablet terminals. The display device 61 is provided along the surface of the housing 60a. The display device 61 may be covered with a protective cover having a transparent area. It may be provided along the inside of the protective cover.

[0095] For example, the housing 60a has a substantially hexahedral shape with a substantially rectangular top surface, and has a surface 62a (top surface) and a surface 62b (bottom surface). a) and a surface 62b (the first surface) adjacent to the surface 62a and the surface 62g. side), surface 62c (second side), surface 62d (third side), and the fourth side In addition, as shown in Figures 8(A) and 8(B), the corners of the housing are provided with curvature. In this case, a curved surface is generated at the corner. Here, the curved surface between the surface 62b and the surface 62d is called the surface 62. The curved surface between the surface 62c and the surface 62d is called a surface 62f. The curved surfaces occurring between the first to third sides belong to the first to third sides. Let's say.

[0096] The display device 61 has a display area 61a that overlaps with the surface 62a and a display area 61b that overlaps with the surface 62b. a display area 61c overlapping with the surface 62c, a display area 61d overlapping with the surface 62d, and a surface 62e and a display area 61f that overlaps with the surface 62f.

[0097] The display areas 61a to 61f are provided with display elements that emit visible light. In addition, the display area 61a is further provided with a display element having a function of reflecting visible light. That's fine.

[0098] Surfaces 62b and 62c overlapping with the display area 61b, the display area 61c, and the display area 61d, respectively. Preferably, the surfaces 62c and 62d have curvature. It is preferred that there are no corners between the upper and lower surfaces and that these surfaces are continuous.

[0099] This shape improves the stability and operability of the electronic device when held in the hand. In addition, the side surface can be viewed from a wide range of angles, and the display area 61b and the display area This can improve visibility when displaying in the display area 61c and the display area 61d.

[0100] As shown in FIGS. 8(A) and 8(B), the display area 61b is provided along the surface 62b. The display area 61c is provided along the surface 62c. The display areas 61b, 61c, and 61d are arranged along the , and are provided so as to cover only a part of the surfaces 62b, 62c, and 62d, but not the entirety thereof. In addition, any one of the display area 61b, the display area 61c, and the display area 61d, or may all extend to the surface 62g.

[0101] In addition, in Figures 8(A) and (B), there are a total of six surfaces: the top surface, three side surfaces, and two curved surfaces (corners). The configuration in which the display area is provided is shown in Fig. 1, but the configuration in which the display area is provided on any one to five faces is also shown. It may also be possible to use the following.

[0102] For example, as shown in FIGS. 9A and 9B, the display area is formed on the curved surfaces of the corners (surfaces 62e and 62f). In such a configuration, the upper surface of the housing 60a and the first to third It is preferable to make the radius of curvature of the curved surface provided between the three side surfaces as small as possible. It is preferable to reduce the area of ​​the surfaces 62e and 62f by reducing the radius of curvature of the curved surfaces. It is possible to perform a display substantially equivalent to that of the display device shown in FIGS. 8(A) and 8(B). do.

[0103] Also, as in the case 60b shown in FIGS. 10(A) and 10(B), the upper surface and the first to third side surfaces are A configuration without a curved surface between them, i.e., the housing may be a rectangular parallelepiped. In this case, the surfaces 62e and 62f are not formed, and therefore the display area 61d is not the display area 61b and The display area 61c can be provided adjacent to the top surface and the first to third side surfaces of the housing 60b. In the case of the configurations shown in Figs. 10(A) and 10(B), In order to eliminate the difficulty of holding the product and the risk of damage to the corners, a cornered design as shown in Figure 10(C) was used. It is preferable to provide a transparent protective cover having a curved portion.

[0104] The display device 61 is flexible. Therefore, as shown in FIG. 8A, for example, the display area The edge of the display area 61e is in contact with the edge of the display area 61d, or the edge of the display area 61e is in contact with the edge of the display area 61d. The display area 61d can be configured so that the edge of the display area 61d overlaps the edge of the display area 61d. The joint can be made less visible, and the display area 61e and the display area 61d are essentially continuous. It is possible to display the information in this way.

[0105] Although the display device 61 is flexible, it is not movable when it is incorporated into the housing 60a or the housing 60b. In this case, the surface of the housing 60a or the housing 60b may not be flexible. In addition to the display device 61, the device may also have hardware buttons, external connection terminals, and the like.

[0106] By adopting the above-mentioned configuration, it is possible to prevent the display panel from being displayed on one side (for example, the top surface) of the housing as in the case of conventional electronic devices. It is possible to display not only on one surface of the housing but also on the curved surfaces of the sides and corners adjacent to one surface of the housing. In particular, providing display areas along two or more sides increases the variety of displays. This is preferable.

[0107] For example, the display areas 61a to 61f can be used as independent display areas to display different images. Or, one image can be displayed across two or more display areas. For example, an image displayed in the display area 61a can be displayed in the display area 61b. In addition, the display area 61d, the display area 61e, and the display area 61 may be displayed consecutively. A sequence of images may be displayed in b.

[0108] Alternatively, the display area may be provided on the top, bottom, and all sides of the housing. As shown in 11(A) to 11(D), a display area is provided on almost the entire surface of the housing 60a except for the corners. FIG. 11(A) is a perspective schematic diagram showing the top side, and FIG. 11(B) is a perspective schematic diagram showing the bottom side. 11(A) and 11(B). 11(D) is a cross section taken along the line X1-X2 shown in FIGS. 11(A) and 11(B).

[0109] In the configuration shown in FIGS. 11(A) and 11(B), the surface 62g (lower surface) is added to the configuration shown in FIGS. ), a display area 61g provided on a surface 62h (fourth side surface), a display area 61h provided on a surface 62b A display area 61i is provided on a curved surface 62i between the surface 62c and the surface 62h. 2h, and a display area 61j is provided on a curved surface 62j. 8A and 8B, one end of the housing 60a is not covered. In the configurations shown in (A) and (B), each display area covers almost the entire housing 60a.

[0110] The display area 61g can have the same configuration as the display area 61a. The display area 61i and 61j can be configured in the same manner as the display area 61d. The area 61e and the area 61f can have the same configuration.

[0111] By adopting such a configuration, it is possible to provide a continuous display on substantially the entire surface of the housing 60a. Alternatively, it can be an electronic device that does not care about the front and back, top and bottom, left and right. 9(A), (B), or 10(A), (B), (C), the same as in FIG. 11 As with the configurations shown in (A) and (B), the display area can be provided over almost the entire surface of the housing. Cut.

[0112] In the configuration shown in FIGS. 8(A) and 8(B), various corners that are not covered by the display device 61 are provided. For example, a lamp 29a may be provided as shown in FIG. Also, a camera 29b may be provided as shown in FIG. As shown in 36(C), an audio device 29c such as a speaker or a microphone may be provided. As shown in Figure 36(D), a strap hole 29d may be provided. In addition, in Fig. 36(A) to (D), for the sake of clarity, , hatching of the display area is omitted.

[0113] FIG. 12 shows an example of how the electronic device shown in FIGS. 8(A) and 8(B) is used. The display area 61a displays text information and a plurality of icons associated with application software, etc. In the example shown, notification information 63b, a telephone number 63a, and a telephone number 63b are displayed in the display area 61b. An example is shown in which an icon 63c associated with the operation of a child device is displayed. In the example shown, notification information 63d is displayed in the display area 61d.

[0114] For example, when a call or email is received, not only the display area 61a but also the display area 61b and and the display area 61d, etc., display notification information and caller information (for example, the caller's name, telephone number, email address, etc.). In FIG. 12, notification information 63b and notification information 6 3d, when an email reception notification is displayed in the display area 61b and the display area 61d. The notification information 63b and the notification information 63d are displayed in the display area 61b and the display area 61c. The area 61d can be displayed in a flowing manner.

[0115] In addition, during the standby time of the electronic device, the display in the display area 61a is turned off (for example, black display). Alternatively, information may be displayed only in the display areas 61b, 61c, etc. When mainly using only the display area 61a, the display areas 61b, 61c, etc. Alternatively, the information may be displayed only in the display area 61a by turning off the display area 61b (for example, displaying black). By turning off the display of unused display areas, power consumption can be reduced.

[0116] In addition, a touch sensor is provided at a position overlapping the display device 61, specifically, at an area overlapping each display area. The touch sensor preferably has a sheet-type capacitance type touch sensor. The sensor may be provided on top of the display device 61. Alternatively, the display device 61 itself may be provided with a tag. It is also possible to use a so-called in-cell type touch panel that has a touch sensor function. The touch panel may be a capacitive touch sensor or a photoelectric conversion An optical touch sensor using a conversion element may also be applied.

[0117] The electronic device according to one aspect of the present invention displays not only on the top surface of the housing but also along one or more side surfaces. This makes it possible to display a wider variety of images than conventional electronic devices. In addition, by providing touch sensors in each display area, it is possible to perform a variety of operations compared to conventional electronic devices. This makes it possible to realize electronic devices that can be operated more intuitively.

[0118] Here, an example in which various displays are made using the display device 61 has been shown, but the present invention One aspect of the present invention is not limited to this. For example, depending on the circumstances, As an example, the display device 61 may be used as a lighting device. By applying it to lighting equipment, it can be used as interior design with excellent design. Or it can be used as lighting that can illuminate in various directions. Alternatively, the display device 61 may be used as a light source such as a backlight or a frontlight. That is, it may be used as a part of a display device and as a lighting device for the display device. .

[0119] [Display panel configuration example] Next, structural examples of a display device that can be applied to the electronic devices of one embodiment of the present invention will be described. This will be explained with reference to the drawings.

[0120] Fig. 13(A) is a schematic top view of the display device 61 shown in Figs. 8(A) and 8(B). Display device The display device 61 includes a flexible substrate 64 and has a plurality of pixels formed on the substrate 64. The display device 61 includes a display area 61a, a display area 61b, a display area 61c, a display area 61d, and a display area 61a. The display area 61 has a display area 61e and a display area 61f.

[0121] The display areas 61a to 61d have an outline of a substantially quadrilateral shape, and the angles of the vertices of the substantially quadrilateral are The display area 61b is one of the four sides that form the outline of the display area 61a ( The display area 61a and the display area 61b are provided adjacent to the side 65a. The widths in the direction parallel to 5a are preferably equal.

[0122] The display area 61c is adjacent to one of the four sides (side 65b) that form the outline of the display area 61a. The display area 61a and the display area 61c are provided in a direction parallel to the respective sides 65b. The widths at are preferably equal.

[0123] The display area 61d is in contact with one of the four sides (side 65c) that form the outline of the display area 61a. The display area 61a and the display area 61d are provided in a direction parallel to the respective sides 65c. The widths at are preferably equal.

[0124] The display area 61e is adjacent to one of the four sides (side 65d) that form the outline of the display area 61b. The width L1 of the display area 61b in the direction parallel to the side 65d is It is preferable that the width is larger than the width L2 of 61e in the direction parallel to side 65d.

[0125] The display area 61f is in contact with one of the four sides (side 65e) that form the outline of the display area 61c. The width L3 of the display area 61c in the direction parallel to the side 65e is It is preferable that the width is larger than the width L4 of 61f in a direction parallel to the side 65e.

[0126] By configuring the display device 61 as described above, the housing as shown in FIGS. Each display area can be arranged along the surface of 60a.

[0127] In addition, a part of the substrate 64 is provided with an FPC 66a that supplies signals and power for driving the pixels. In FIG. 13(A), the FPC 66a is mounted on the FPC 66b. Although the configuration including the IC 67 is shown, the IC 67 may not be provided if it is not required. The PC66b has a function of supplying signals and power to each drive circuit, for example. 6b, FPC 66c may not be provided.

[0128] The IC 67 may be directly mounted on the substrate 64. Here, the width of the FPC 66a is It is preferable that the width of the display area 61a is smaller than that of the display area 61b. When the display area 61b and the display area 61c are curved and the display area 61a is used in a flat state, In this case, the joint between the FPC 66a and the substrate 64 does not bend, and the FPC 66a peels off. This can prevent this from happening.

[0129] FIG. 14A is an enlarged schematic top view of the area A1 in FIG. 13A, and shows the display area 61 a, which outputs signals for driving pixels included in the display area 61b and the display area 61e; The display area 61d includes a driving circuit 68a for driving the pixels included in the display area 61d. 68b, which outputs a signal to operate the light emitting diode 68.

[0130] The drive circuit 68a is provided along the side of the display area 61b opposite to the side 65a. The driving circuit 68a is electrically connected to the FPC 66b via wiring, for example. The driving circuit 68b is connected along a side perpendicular to the side 65c of the display area 61d. The drive circuit 68b is electrically connected to the FPC 66c via wiring, for example. do.

[0131] FIG. 14B shows an example in which the area A1 and its vicinity are provided along the housing 60a shown in FIG. 8A. The drive circuit 68b may be configured so that a part of the drive circuit 68b overlaps a part of the display area 61e. Therefore, the display area 61d and the display area 61e are substantially continuous. In FIG. 14(B), for clarity, some display areas are highlighted. This eliminates the need for tuning.

[0132] The drive circuits 68a and 68b may be, for example, either gate drive circuits or source drive circuits. Although a circuit that functions as a gate driver can be used, it is preferable to apply a gate driver circuit. In this case, it is preferable that IC67 has a function as a source driver circuit.

[0133] In this example, a display device having a driver circuit on the substrate 64 is used, which is a so-called driver-integrated type display device. However, the configuration may be such that the driver circuit is not provided. Although an example of driving the display area 61a has been shown, the display areas 61c and 61f may also be provided. The display area 61a may be driven by a drive circuit provided in the display area 61b. Although this example shows the drive circuits being arranged at the edge of the display area, the drive circuits may be distributed within the pixels of each display area. In this case, it is possible to prevent the edges of each display area from becoming non-display areas.

[0134] FIG. 13(B) shows the display device 61 shown in FIGS. 9(A), (B) or 10(A), (B). The display device 61 includes a flexible substrate 64, and a display device 61 is formed on the substrate 64. The display device 61 has a display area 61a, a display area 61b, and a plurality of pixels. The display area 61c and the display area 61d are not provided. The display device 61 shown in FIG. 3(A) can have the same configuration as the display device 61 shown in FIG.

[0135] FIG. 14(C) is an enlarged schematic top view of the area A2 in FIG. 13(B), and shows the display area 61a and a drive circuit 68a that outputs signals for driving pixels included in the display area 61b. In addition, a signal for driving the pixels included in the display area 61d is 6 shows a configuration including a drive circuit 68b that outputs the signal.

[0136] The drive circuit 68a is provided along the side of the display area 61b opposite to the side 65a. The circuit 68a is electrically connected to the FPC 66b via, for example, a wiring. is provided along a side perpendicular to the side 65c of the display area 61d. For example, it is electrically connected to the FPC 66c via wiring.

[0137] FIG. 14(D) shows the area A2 and its vicinity, which are provided along the housing 60b shown in FIG. 10(A). In the area 25 shown in FIG. 14(C), the display area 61b and the driving circuit 6 14(D), a drive circuit 68b is provided. The enclosed area can be folded along the housing 60b. Therefore, the display area 61d and the display area 61b can be configured to overlap with each other. The display area 61b can be made substantially continuous with the display area 61a. In this figure, hatching has been omitted from some display areas for clarity.

[0138] FIG. 14(E) is a modified example of the area A2 in FIG. 13(B), in which the driving circuit 68b is not provided and the driving In this example, an area 68a' is provided in which the operating circuit 68a extends via the wiring 27. The display area 61d can be driven by the area 68a', and the drive circuit 68b and the FPC 6 6c can be eliminated.

[0139] FIG. 14(F) shows the area A2 and its vicinity, which are provided along the housing 60b shown in FIG. 10(A). 14(E) shows the details of an example. By folding along the dashed line 26 shown in FIG. 14(F), As shown, the area 68a' and the wiring 27 are connected to a part of the display area 61b and the driving circuit 68. Therefore, the display area 61d and the display area a can be configured to overlap with each other. 61b can be made substantially continuous with each other. For clarity, hatching has been omitted from some display areas.

[0140] The display areas 61a to 61f have a plurality of pixels, and the pixels have the function of emitting visible light. A display element having a function of emitting visible light can be provided. For example, a light-emitting element can be used.

[0141] The pixels of the display area 61a further include a display element having a function of reflecting visible light. The display element having the function of reflecting visible light may be, for example, a display element that reflects visible light from the outside. A reflective liquid crystal element having a mirror that reflects light incident thereon can be used.

[0142] Here, an example of a case where a sheet-like touch sensor is provided over the display device 61 is shown in FIG. 5 will be used to explain.

[0143] FIG. 15A shows a state in which a part of a display device 61 including an FPC 66a is bent. 15B shows a touch sensor 69 in sheet form that is attached along the curved surface of the display device 61. The touch sensor 69 is provided with an FPC 66c.

[0144] FIG. 15(C) shows an example of a state in which the display device 61 and the touch sensor 69 are overlapped. 15(C), the FPC 66a provided on the display device 61 and the touch sensor It is preferable to arrange the FPC 66c provided on the FPC 69 so that it does not overlap with the FPC 66c. Therefore, the display device 61 and the touch sensor 69 are not made to have the same shape, but rather, the FPC 66a or In the area where the FPC 66c is attached, the display device 61 and the touch sensor 69 do not overlap. It is preferable that they have different shapes so that

[0145] In this way, the display device 61 and the sheet-like touch sensor 69 are provided one on top of the other, and these are attached to the housing 6 By incorporating the sensor into the housing 60a or the housing 60b, the sensor can be mounted not only on the top surface of the housing but also on the sides and bottom. It is also possible to add touch functionality to part of the surface.

[0146] This embodiment may be appropriately combined with at least a part of other embodiments described in this specification. It can be implemented in combination.

[0147] (Embodiment 3) In this embodiment, the display area 11a described in the first embodiment or the display area 11b described in the second embodiment The display area 61a is one of the components of the display area 61a, and includes a first display element that reflects visible light and a second display element that receives visible light. A display device having a second display element that emits light will be described.

[0148] The display device is configured to display a first light reflected by a first display element and a second light emitted by a second display element. Either one or both of these have the function of displaying images. The device is configured to detect the amount of first light reflected by the first display element and the amount of second light emitted by the second display element. By controlling the amount of light, it has the function of expressing gradation.

[0149] The display device also expresses gradation by controlling the amount of light reflected by the first display element. A first pixel and a second display element are controlled to express gradation by controlling the amount of light emitted from the first pixel and the second display element. It is preferable that the first pixel and the second pixel have a structure in which, for example, A plurality of these are arranged in a matrix to form the display unit.

[0150] It is also preferable that the first pixels and the second pixels are arranged at the same pitch within the display area. In this case, the first pixel and the second pixel are combined and called a pixel unit. can be done.

[0151] Furthermore, the first pixels and the second pixels are arranged in a mixed manner in the display area of ​​the display device. As a result, an image displayed only by a plurality of first pixels, as will be described later, and An image displayed only by the plurality of second pixels, and an image displayed by the plurality of first pixels and the plurality of second pixels Each of the images displayed on both the display screens can be displayed in the same display area.

[0152] The first display element of the first pixel can be an element that reflects external light to display an image. Since such elements do not have a light source, power consumption during display is extremely low. This becomes possible.

[0153] The first display element can typically be a reflective liquid crystal element. As a display element, a shutter-type MEMS (Micro Electro Mechanical Systems) MEMS elements, optical interference type MEMS elements, microcapsules method, electrophoresis method, electrowetting method, electronic liquid powder (registered trademark) method, etc. Applied elements and the like can be used.

[0154] The second display element of the second pixel has a light source, and displays an image using light from the light source. In particular, an element that emits light from a light-emitting substance by applying an electric field can be used. It is preferable to use a light-emitting element that can extract light. The brightness and chromaticity of the light emitted from the LED are not affected by external light, resulting in high color reproducibility (wide color gamut). It is possible to provide a high contrast, i.e., a vivid display.

[0155] The second display element may be, for example, an OLED (Organic Light Emitting Diode), LED(Light Emitting Diode), QLED(Q Self-luminous, such as a uantum-dot Light Emitting Diode Alternatively, a backlight, which is a light source, can be used as the second display element. The LCD panel combines a transparent liquid crystal element that controls the amount of light transmitted from the backlight. It is also possible to use the above.

[0156] The first pixel may be a sub-pixel that exhibits, for example, white (W), or a sub-pixel that exhibits, for example, red (R), green (G), The pixel may have sub-pixels that emit light of three colors, i.e., blue (B), green (C), and blue (B). Similarly, the second pixel may have a sub-pixel that exhibits, for example, white (W), or a sub-pixel that exhibits, for example, red (R), green (G), or The pixel may have sub-pixels that respectively emit light of three colors: red (G), blue (B), and green (G). The sub-pixels of each of the first pixel and the second pixel may have four or more colors. The more types of sub-pixels there are, the more power consumption can be reduced and color reproducibility can be improved. It is possible.

[0157] One aspect of the present invention is a first mode in which an image is displayed by a first pixel, and a second mode in which an image is displayed by a second pixel. a second mode in which an image is displayed by the first pixel and the second pixel; and a third mode in which an image is displayed by the first pixel and the second pixel. You can switch between them.

[0158] The first mode is a mode in which an image is displayed using light reflected by the first display element. Mode 1 is a driving mode with extremely low power consumption because it does not require a light source. This is effective when the illuminance of the light is sufficiently high and the external light is white light or light of a similar color. Mode 1 is a display mode suitable for displaying text information such as books and documents. In addition, because it uses reflected light, it is easy on the eyes and reduces eye fatigue. It has an effect.

[0159] The second mode is a mode in which an image is displayed by utilizing light emitted by the second display element. Therefore, it is possible to achieve extremely vivid (high contrast and color reproduction) images regardless of the illuminance or chromaticity of external light. For example, it is possible to display images in situations where the external light is extremely bright, such as at night or in a dark room. This is effective when the external light is dark and the display is bright, making it difficult for the user to see clearly. To prevent this, the second mode reduces the brightness. This not only reduces glare but also power consumption. The second mode is suitable for displaying vivid images and smooth videos. It is a mode.

[0160] In the third mode, both the reflected light from the first display element and the emitted light from the second display element are used. Specifically, the light emitted by the first pixel and the light emitted by the first pixel are used to perform display. The light emitted by the adjacent second pixel is mixed to produce a single color. It provides a more vivid display than the first mode, while consuming less power than the second mode. For example, under indoor lighting or in the early morning or evening hours when the illuminance of external light is relatively low, This is effective when the chromaticity of the external light is not white. By using colored light, it displays images that make you feel as if you are looking at a painting. This becomes possible.

[0161] A more specific configuration example will be described below with reference to the drawings.

[0162] [Example of display device configuration] FIG. 16 shows a block diagram of the display device 11 having the display areas 11a to 11c described in the first embodiment. A block diagram is shown.

[0163] The display area 11a has a plurality of pixel units 30a arranged in a matrix. The unit 30a has a first pixel 31p and a second pixel 32p.

[0164] The display area 11b has a plurality of pixel units 30b arranged in a matrix. The unit 30b has a second pixel 32p.

[0165] The display area 11c has a plurality of pixel units 30c arranged in a matrix. The unit 30c has a second pixel 32p.

[0166] FIG. 17 shows a block diagram of a display device 61 having display areas 61a to 61f described in the first embodiment. A block diagram is shown.

[0167] The display area 61a has a plurality of pixel units 30a arranged in a matrix. The unit 30a has a first pixel 31p and a second pixel 32p.

[0168] The display area 61b has a plurality of pixel units 30b arranged in a matrix. The unit 30b has a second pixel 32p.

[0169] The display area 61c has a plurality of pixel units 30c arranged in a matrix. The unit 30c has a second pixel 32p.

[0170] The display area 61d has a plurality of pixel units 30d arranged in a matrix. The unit 30d has a second pixel 32p.

[0171] The display area 61e has a plurality of pixel units 30e arranged in a matrix. The unit 30e has a second pixel 32p.

[0172] The display area 61f has a plurality of pixel units 30f arranged in a matrix. The unit 30f has a second pixel 32p.

[0173] In FIGS. 16 and 17, the first pixel 31p and the second pixel 32p are red ( The example shows a display device having display elements corresponding to three colors: green (R), green (G), and blue (B). .

[0174] The first pixel 31p includes a display element 31R corresponding to red (R) and a display element 31B corresponding to green (G). The display elements 31R, 31G, and 31B correspond to blue (B). 31B are display elements that utilize reflection of external light.

[0175] The second pixel 32p includes a display element 32R corresponding to red (R) and a display element 32G corresponding to green (G). The display elements 32R, 32G, and 32B correspond to blue (B). Each of 32B is a display element that utilizes light from a light source.

[0176] [Pixel unit configuration example] 18A to 18C are schematic diagrams showing configuration examples of the pixel unit 30a. The pixel 30a has a first pixel 31p and a second pixel 32p.

[0177] The first pixel 31p has a display element 31R, a display element 31G, and a display element 31B. The display element 31R, the display element 31G, and the display element 31B each reflect external light for display. The display element 31R reflects external light and emits red light Rr to the display surface side. Similarly, the display element 31G and the display element 31B emit green light Gr and blue light Br, respectively. , and is emitted toward the display surface.

[0178] The second pixel 32p has a display element 32R, a display element 32G, and a display element 32B. The element 32R, the display element 32G, and the display element 32B are each a light-emitting element. The element 32R emits red light Rt toward the display surface. Similarly, green light Gt and blue light Bt are emitted toward the display surface. It is possible to achieve low power consumption and vivid display. It is possible to display an image that gives the impression of

[0179] FIG. 18A shows a display that is achieved by driving both the first pixel 31p and the second pixel 32p. The pixel unit 30a corresponds to a mode (third mode) in which light Rr, light Gr, and light B By mixing six light beams, r, light Rt, light Gt, and light Bt, the reflected light and transmitted light It is possible to emit light 35tr of a predetermined color that is a mixture of the above toward the display surface.

[0180] At this time, light Rr, light Gr, and light B are set so that light 35tr becomes light of a predetermined luminance and chromaticity. There are many combinations of the brightness of each of the six lights: r, light Rt, light Gt, and light Bt. Therefore, one aspect of the present invention is to provide six light sources that realize the same luminance and chromaticity of light 35tr. Among the combinations of brightness (gradation), the light Rr emitted from the first pixel 31p, It is preferable to select a combination that maximizes the brightness (gradation) of light Gr and light Br. This allows power consumption to be reduced without sacrificing color reproducibility.

[0181] FIG. 18B shows a display using only reflected light by driving the first pixel 31p. The pixel unit 30a corresponds to a mode (first mode) in which the illuminance of external light is sufficient. In cases where the second pixel 32p is too high, the light ( By mixing only the light Rr, light Gr, and light Br, the reflected light is combined. This allows light 35r of a specific color to be emitted toward the display surface. It is possible to drive the LCD panel and also to provide a display that is easy on the eyes.

[0182] FIG. 18C shows a case where only the emitted light (transmitted light) is used by driving the second pixel 32p. The pixel unit 30a corresponds to a mode (second mode) in which the pixel is illuminated by, for example, external light. When the illuminance is extremely low, the first pixel 31p is not driven, and the second pixel 32p is driven. By mixing only the light from the 35t can be projected onto the display surface, allowing for a vivid display. In addition, by lowering the brightness when the illuminance of external light is low, the glare felt by the user is reduced. At the same time, power consumption can be reduced.

[0183] [Variations] In the above, the first pixel 31p and the second pixel 32p are red (R) and green (G), respectively. Although an example in which display elements corresponding to three colors, blue (B), green (C), and blue (B), is shown, the present invention is not limited to this. Now, a configuration example different from the above will be shown.

[0184] 19(A) to 19(C) and 20(A) to 20(C) show the structure of the pixel unit 30a, respectively. Here, both the first pixel 31p and the second pixel 32p are driven. The diagram shows a schematic diagram corresponding to the mode (third mode) in which the display is performed with By driving the first pixel 31p, a display mode using only reflected light (first pixel 31p) is achieved. The first pixel 32p is driven to emit light (transmitted light), and the second pixel 32p is driven to emit light (transmitted light). It is also possible to perform display in a mode (second mode) in which display is performed using the same.

[0185] FIG. 19A shows a second pixel 32p including a display element 32R, a display element 32G, and a display element 32R. In addition to B, an example is shown in which a display element 32W that exhibits white (W) is provided. Consumption in display modes (second mode and third mode) using the second pixel 32p Power consumption can be reduced.

[0186] FIG. 19B shows that the second pixel 32p includes a display element 32R, a display element 32G, and a display element 32R. In addition to B, an example is shown in which a display element 32Y that exhibits yellow (Y) is provided. Consumption in display modes (second mode and third mode) using the second pixel 32p Power consumption can be reduced.

[0187] FIG. 19C shows that the first pixel 31p includes a display element 31R, a display element 31G, and a display element 31 In addition to B, an example is shown in which a display element 31W that exhibits white (W) is included. 1C shows that the second pixel 32p is applied to the display element 32R, the display element 32G, and the display element 32B. In addition, an example is shown in which a display element 32W that exhibits white (W) is provided. Display modes (first mode and third mode) using pixel 31p and second pixel Reduced power consumption in 32p display modes (second and third modes) It is possible.

[0188] FIG. 20A shows an example in which the first pixel 31p has only a display element 31W that exhibits white color. At this time, in the display mode (first mode) using only the first pixel 31p, , monochrome display or grayscale display can be performed, and the second pixel 32p In the display modes (second mode and third mode), color display can be performed.

[0189] In addition, such a configuration can increase the aperture ratio of the first pixel 31p. Therefore, the reflectance of the first pixel 31p is improved, and a brighter display can be achieved.

[0190] In a mode (first mode) in which only the first pixel 31p is used for display, for example, text information It is suitable for displaying information that does not require color display. When using electronic devices with built-in display devices, such as e-book readers and textbooks, It can be used.

[0191] In FIG. 20B, in addition to FIG. 20A, a display element 32W that exhibits white (W) is provided. This shows an example of a display mode using the second pixel 32p (second mode and It is possible to reduce power consumption in the first and second modes.

[0192] In FIG. 20(C), in addition to FIG. 20(A), a display element 32Y that exhibits yellow (Y) is provided. This shows an example of a display mode using the second pixel 32p (second mode and It is possible to reduce power consumption in the first and second modes.

[0193] The above is a description of an example of the configuration of the display unit.

[0194] [Example of cross-sectional structure of display device] FIG. 21(A) shows an example of a cross-sectional configuration of the display area 11a of the display device 11. The display area 61a of the device 61 can also have the same configuration.

[0195] The display region 11a includes a first layer 41, an insulating layer 134, an insulating film 135, an insulating film 136, an insulating film 137, an insulating film 138, an insulating film 139 ... The edge layer 135, the display element 32, the adhesive layer 151, the second layer 42, the insulating layer 234, and the display element 31 etc.

[0196] The display element 31 includes a conductive layer 221, a conductive layer 223, and a liquid crystal 222 sandwiched between them. The conductive layer 221 reflects visible light, and the conductive layer 223 transmits visible light. The display element 31 is a reflective liquid crystal element that emits reflected light 22 toward the substrate 612. The conductive layer 221 is disposed for each pixel and functions as a pixel electrode. The conductive layer 223 is provided over the pixels. A constant potential is applied to the conductive layer 223 in a region not shown. It is connected to the wiring and functions as a common electrode.

[0197] The display element 32 includes a conductive layer 121, a conductive layer 123, and an EL layer 122 sandwiched between them. The EL layer 122 is a layer containing at least a light-emitting substance. The conductive layer 123 reflects visible light, while the conductive layer 124 transmits visible light. By applying a voltage between 121 and the conductive layer 123, light 21 is emitted toward the substrate 612. The conductive layer 121 is disposed for each pixel and functions as a pixel electrode. The layer 122 and the conductive layer 123 are disposed across multiple pixels. A region not shown is connected to a wiring to which a constant potential is supplied, and functions as a common electrode.

[0198] The first layer 41 is a layer including a circuit for driving the display element 31. The second layer 42 is a layer including a circuit for driving the display element 31. For example, the first layer 41 and the second layer 42 are layers including circuits for driving the element 32. A pixel circuit is configured by the transistor, the capacitor, the wiring, the electrode, etc. A circuit for driving the display element 31 and a circuit for driving the display element 32 are provided on one layer. It can also be done as follows.

[0199] An insulating layer 234 is provided between the first layer 41 and the conductive layer 221. The conductive layer 221 and the first layer 41 are electrically connected through an opening provided in the insulating layer 34. The first layer 41 and the display element 31 are electrically connected by this.

[0200] An insulating layer 134 is provided between the second layer 42 and the conductive layer 121. The conductive layer 121 and the second layer 42 are electrically connected through an opening provided in the insulating layer 34. The second layer 42 and the display element 32 are electrically connected by this.

[0201] The first layer 41 and the conductive layer 123 are bonded together by an adhesive layer 151. The layer 51 also functions as a sealing layer that seals the display element 32 .

[0202] Here, an oxide semiconductor is applied to the pixel circuit of the first layer 41, and a transistor with an extremely low off-current is used. When a transistor is applied or a memory element is applied to the pixel circuit, the display element When displaying a still image using the pixel 31, the gradation is maintained even if the writing operation to the pixel is stopped. In other words, it is possible to maintain the display even when the frame rate is extremely low. can be done.

[0203] FIG. 21(B) is a cross-sectional view of the vicinity of the boundary between the display area 11a and the display area 11c. The area 11c does not include the display element 31 and elements related to the display element 31. In the display area 11c, the area 43 corresponding to the first layer 41 of the display area 11a is No circuitry or the like is provided on the display panel, and a light-shielding layer or the like is provided partially as needed. In the region 225 corresponding to the region where the liquid crystal 222 of the region 11a is provided, the light emitting element 32 is provided. A resin layer or the like that transmits light is provided. Alternatively, a liquid crystal 222 is provided in the region 225. It's fine.

[0204] The display areas 61b, 61c, 61d, 61e, and 61f of the display device 61 are It can have the same configuration as the region 11c.

[0205] In addition, the display device 11 and the display device 61 have only the display device 32. In this case, the cross-sectional configuration of the display area is the same as that shown in FIG. ) is the configuration shown in

[0206] The above is a description of an example of the cross-sectional configuration of the display device 11.

[0207] [Display mode variations] In addition, a third pixel 31p and a second pixel 32p are driven to perform display. In each mode, different images can be displayed simultaneously. A background image is displayed on one of the first pixel 31p and the second pixel 32p, and the first pixel 31 It is possible to display a moving image on the other of the first pixel 32p and the second pixel 32p. This makes it possible to display images that give a more realistic feeling.

[0208] This embodiment may be appropriately combined with at least a part of another embodiment described in this specification. It can be implemented in combination.

[0209] (Fourth embodiment) In this embodiment, a basic structure of a display device according to one embodiment of the present invention will be described.

[0210] The display area 11a described in the first embodiment and the display area 61a described in the second embodiment One embodiment is a display panel including a first pixel having a reflective liquid crystal element, and a light-emitting element. A second display panel provided with a second pixel having an element is bonded to the first display panel via an adhesive layer. The reflective liquid crystal element expresses gradation by controlling the amount of reflected light. The light emitting element can express gradation by controlling the amount of light it emits. This can be done.

[0211] The display device may display images using only reflected light, or may display images using only light emitted from a light-emitting element. and to display using both reflected light and light from a light-emitting element. This can be done.

[0212] The first display panel is provided on the viewing side, and the second display panel is provided on the opposite side to the viewing side. The first display panel has a first resin layer located closest to the adhesive layer. The display panel has a second resin layer located closest to the adhesive layer.

[0213] In addition, a third resin layer is provided on the display surface side of the first display panel, and a second resin layer is provided on the back surface side ( It is preferable to provide a fourth resin layer on the side opposite to the display surface side. This makes it possible to make the display device extremely light and less likely to break.

[0214] The first to fourth resin layers (hereinafter collectively referred to as resin layers) are extremely thin. More specifically, the thickness of each is 0.1 μm or more and 3 μm or less. Therefore, even if two display panels are stacked, it is possible to reduce the thickness. In addition, the resin layer positioned on the path of the light emitted by the light emitting element of the second pixel can This suppresses absorption of light, allowing light to be extracted more efficiently and reducing power consumption. can be done.

[0215] The resin layer can be formed, for example, as follows: A thermosetting resin material is applied and hardened by heat treatment to form a resin layer. Then, the resin layer is peeled off from the support substrate, thereby forming a structure on the support substrate. One surface of the resin layer is exposed.

[0216] When peeling the support substrate and the resin layer, a method of reducing the adhesion between them is to use laser light. For example, a laser beam shaped into a line is used and scanned. It is preferable to irradiate the support substrate with the above method. The laser beam is preferably an excimer laser with a wavelength of 308 nm. It can be used for.

[0217] A typical example of a material that can be used for the resin layer is thermosetting polyimide. It is particularly preferable to use photosensitive polyimide. This material is suitable for use as a flattening film for glass, so the forming equipment and materials can be shared. Therefore, no new device or material is required to realize the configuration of one embodiment of the present invention. .

[0218] In addition, by using a photosensitive resin material for the resin layer, the For example, openings can be formed or unnecessary parts can be removed. Furthermore, by optimizing the exposure method and conditions, it is possible to remove unevenness on the surface. For example, it is possible to form a mask using a half-tone mask or a gray-tone mask. Exposure technology, multiple exposure technology, etc. may be used.

[0219] A non-photosensitive resin material may also be used. In this case, a resist mask or hard mask may be formed on the resin layer. Alternatively, a method of forming an opening or a concave-convex shape by forming a mask can be used.

[0220] At this time, it is preferable to partially remove the resin layer located on the path of light from the light emitting element. That is, an opening portion overlapping the light emitting element is provided in the first resin layer and the second resin layer. This results in a decrease in color reproducibility due to a portion of the light emitted from the light emitting element being absorbed by the resin layer. Furthermore, it is possible to suppress a decrease in light extraction efficiency.

[0221] Alternatively, the portion of the resin layer located on the path of light from the light emitting element becomes thinner than the other portions. In other words, the resin layer may have a structure in which recesses are formed in the resin layer. It is also possible to have a structure in which there are two portions, and the thinner portion overlaps the light emitting element. Even if the resin layer is formed in this manner, the absorption of light from the light emitting element by the resin layer can be reduced.

[0222] In addition, when the first display panel has a third resin layer, the opening overlapping the light-emitting element is It is preferable to provide an aperture, which further improves color reproducibility and light extraction efficiency. It is possible.

[0223] In addition, when the first display panel has a third resin layer, the light path in the reflective liquid crystal element is It is preferable to remove a part of the third resin layer located on the road. An opening is provided in the liquid crystal display device so as to overlap with the reflective liquid crystal element. can be improved.

[0224] When forming an opening in a resin layer, a light absorbing layer is formed on a support substrate, and an opening is formed on the light absorbing layer. A resin layer having a light absorbing layer is formed, and a light transmitting layer is further formed to cover the opening. This layer absorbs heat and releases gases such as hydrogen and oxygen. Then, light is irradiated from the support substrate side to release gas from the light absorption layer, and the light absorption layer and the support The adhesion at the interface of the substrate or between the light absorbing layer and the light transmitting layer may decrease, causing peeling. Alternatively, the light absorbing layer itself can be broken and peeled off.

[0225] Alternatively, the following method can be used. The resin layer is then peeled off from the support substrate by the method described above. By performing plasma treatment on the peeled surface to thin the resin layer, the thin part of the resin layer An opening can be formed in the

[0226] Preferably, the first pixel and the second pixel each have a transistor. Furthermore, an oxide semiconductor may be used as a semiconductor for forming a channel of the transistor. It is preferable that the oxide semiconductor be used to lower the maximum temperature in the manufacturing process of a transistor (for example, Even at temperatures below 400°C, preferably below 350°C, a high on-state current can be achieved. In addition, by using an oxide semiconductor, the reliability of the transistor can be improved. The material used for the resin layer located on the forming surface side does not require high heat resistance, so the material This allows for a wider range of choices. For example, it can also be used as a resin material for a flattening film. can.

[0227] Here, for example, low temperature polysilicon (LTPS) When using y-Silicon, high field effect mobility can be obtained, but laser The crystallization process, the baking process for pre-crystallization, and the baking process for activating impurities are all included. When the oxide semiconductor is used, the maximum temperature in the manufacturing process of the transistor is higher than (for example, 500°C or higher, or 550°C or higher, or 600°C or higher). Therefore, the resin layer located on the transistor forming surface side needs to have high heat resistance. In the laser crystallization process, the resin layer is also irradiated with the laser, so the resin layer is relatively It is necessary to form the film to a thickness that is sufficiently large (for example, 10 μm or more, or 20 μm or more).

[0228] On the other hand, when oxide semiconductors are used, special materials with high heat resistance are not required, and thick layers can be formed. Therefore, the proportion of the cost of the resin layer to the entire display panel can be reduced. can.

[0229] In addition, oxide semiconductors have a wide band gap (for example, 2.5 eV or more, or 3.0 e V or more), it has the property of transmitting light. Since laser light is hardly absorbed by oxide semiconductors when irradiated with it, the influence on their electrical characteristics is minimized. Therefore, it is possible to form a thin resin layer as described above.

[0230] One aspect of the present invention is to provide a thin film using a low-viscosity photosensitive resin material, typically a photosensitive polyimide. The resin layer is thinly formed, and the oxide layer allows for transistors with excellent electrical properties even at low temperatures. By combining it with semiconductors, a display device with extremely excellent productivity can be realized.

[0231] Next, the pixel configuration will be described. The first pixel and the second pixel are each a matrix. The display device includes a first pixel driving a second pixel. It is preferable that the first driving unit drives the first pixel and the second driving unit drives the second pixel. the first driving unit is provided on the first display panel, and the second driving unit is provided on the second display panel. It is preferable that:

[0232] It is also preferable that the first pixels and the second pixels are arranged at the same intervals within the display area. Furthermore, the first pixels and the second pixels are arranged in a mixed manner in the display area of ​​the display device. As a result, an image displayed only by a plurality of first pixels can be displayed. an image displayed only by the plurality of second pixels, and an image displayed only by the plurality of first pixels and the plurality of second pixels; Each of the images displayed by both pixels can be displayed in the same display area.

[0233] Here, the first pixel is configured by one pixel that exhibits white (W), for example. The second pixel preferably emits light of three colors, for example, red (R), green (G), and blue (B). In addition to this, it is preferable to have sub-pixels that exhibit white (W) or The first pixel and the second pixel may have a sub-pixel that emits yellow (Y) light. By arranging the pixels at the same interval, the area of ​​the first pixel is increased, and the aperture ratio of the first pixel is increased. It is possible.

[0234] The first pixel emits, for example, three colors of light, red (R), green (G), and blue (B). In addition, the pixel may have sub-pixels that emit white (W) or yellow (Y) light. The pixel may have a sub-pixel that exhibits the same.

[0235] Next, transistors that can be used in the first display panel and the second display panel are A transistor provided in a first pixel of a first display panel and a transistor provided in a second pixel of a second display panel will be described. The transistor provided in the second pixel of the display panel is a transistor having the same configuration as the transistor provided in the second pixel of the display panel. Alternatively, they may be different transistors.

[0236] The transistor may have a bottom gate structure, for example. A transistor with a Tom gate structure has a gate electrode below the semiconductor layer (on the surface where it is formed). In addition, for example, a source electrode and a drain electrode are connected to the upper surface and side edges of the semiconductor layer. The present invention is characterized in that it is provided as follows.

[0237] Another example of a transistor configuration is a top-gate transistor. The top-gate structure transistor is formed on the upper side of the semiconductor layer (opposite the surface on which the transistor is to be formed). The first source electrode and the first drain electrode are The semiconductor layer is provided on an insulating layer that covers a part of the upper surface and the side end portion of the semiconductor layer, and the insulating layer is provided on the insulating layer. The insulating layer is electrically connected to the semiconductor layer through the opening.

[0238] The transistor includes a first gate electrode and a second gate electrode which are provided opposite to each other with a semiconductor layer interposed therebetween. It is preferable that the first gate electrode has a first gate electrode and a second gate electrode.

[0239] Hereinafter, a more specific example of a display device according to one embodiment of the present invention will be described with reference to the drawings. do.

[0240] [Configuration example 1] 22(A) shows a schematic cross-sectional view of the display area 11a of the display device 11. 1 is a configuration in which a display panel 100 and a display panel 200 are bonded together with an adhesive layer 50. The display device 11 has a substrate 611 on the back side (opposite the viewing side) and a The display area 61a of the display device 61 has the same structure. It can be concluded that

[0241] The display panel 100 includes a transistor 110 and a light-emitting element between a resin layer 101 and a resin layer 102. The display panel 200 has a resin layer 201 and a resin layer 202 therebetween. The resin layer 101 is formed on the substrate 100 via an adhesive layer 51. The resin layer 202 is bonded to the substrate 611 via the adhesive layer 52. It is attached to 12.

[0242] In addition, the resin layer 102, the resin layer 201, and the resin layer 202 each have an opening. The region 81 shown in FIG. 22(A) is a region that overlaps with the light emitting element 120 and is a region that overlaps with the light emitting element 120. The opening of the fat layer 102, the opening of the resin layer 201, and the area overlapping the opening of the resin layer 202 is.

[0243] [Display panel 100] The resin layer 101 is provided with a transistor 110, a light-emitting element 120, an insulating layer 131, an insulating layer 132, and a conductive layer 133. , an insulating layer 133, an insulating layer 134, an insulating layer 135, etc. are provided. The resin layer 101 and the resin layer 102 are provided with a light-shielding layer 153, a colored layer 152, and the like. 02 is bonded by an adhesive layer 151.

[0244] The transistor 110 is provided over an insulating layer 131 and has a conductive layer 110 serving as a gate electrode. 11, a portion of the insulating layer 132 that functions as a gate insulating layer, the semiconductor layer 112, and the source A conductive layer 113a serving as one of an electrode and a drain electrode and a conductive layer 113b serving as one of a source electrode and a drain electrode are formed. and a conductive layer 113b that functions as the other of the inner electrodes.

[0245] The semiconductor layer 112 preferably includes an oxide semiconductor.

[0246] An insulating layer 133 and an insulating layer 134 are provided over the transistor 110. Layer 134 acts as a planarization layer.

[0247] The light emitting element 120 has a structure in which a conductive layer 121, an EL layer 122, and a conductive layer 123 are stacked. The conductive layer 121 has a function of reflecting visible light, and the conductive layer 123 has a function of transmitting visible light. Therefore, the light emitting element 120 emits light in the direction opposite to the surface on which the light is to be formed. It is a top-emission type light-emitting element.

[0248] The conductive layer 121 is electrically connected to the conductive layer 11 through openings provided in the insulating layer 134 and the insulating layer 133. The insulating layer 135 covers the end of the conductive layer 121 and is electrically connected to the conductive layer 3b. An opening is provided so that the top surface of the layer 121 is exposed. 3 is provided in turn to cover the exposed portions of the insulating layer 135 and the conductive layer 121.

[0249] An insulating layer 141 is provided on the resin layer 101 side of the resin layer 102. On the resin layer 101 side, a light-shielding layer 153 and a colored layer 152 are provided. The light-shielding layer 153 is provided in an area overlapping the light-emitting element 120. An opening is provided in the overlapping portion.

[0250] The insulating layer 141 is provided to cover the opening of the resin layer 102. The portion of the oil layer 102 that overlaps the opening is in contact with the adhesive layer 50 .

[0251] [Display panel 200] The resin layer 201 includes a transistor 210, a conductive layer 221, an alignment film 224a, an insulating layer 231, and a conductive film 221. , an insulating layer 232, an insulating layer 233, an insulating layer 234, etc. are provided. The insulating layer 204, the conductive layer 223, the alignment film 224b, etc. are provided on the substrate 201. The liquid crystal 222 is sandwiched between the resin layer 201 and the alignment film 224a and the alignment film 224b. 02 is bonded by an adhesive layer in an area not shown.

[0252] The transistor 210 is provided over an insulating layer 231 and has a conductive layer 2 11, a portion of the insulating layer 232 that functions as a gate insulating layer, the semiconductor layer 212, and the source A conductive layer 213a serving as one of an electrode and a drain electrode and a conductive layer 213b serving as a source electrode or a drain electrode are formed. and a conductive layer 213b that functions as the other of the inner electrodes.

[0253] The semiconductor layer 212 preferably includes an oxide semiconductor.

[0254] Insulating layers 233 and 234 are provided over the transistor 210. Layer 234 acts as a planarization layer.

[0255] The liquid crystal element 220 is made up of a conductive layer 221, a conductive layer 223, and a liquid crystal 222 disposed between them. The conductive layer 221 has a function of reflecting visible light, and the conductive layer 223 Therefore, the liquid crystal element 220 is a reflective liquid crystal element. be.

[0256] The conductive layer 221 is electrically connected to the conductive layer 21 through openings provided in the insulating layer 234 and the insulating layer 233. The alignment film 224a is electrically connected to the conductive layer 221 and the insulating layer 234. It is provided to cover the surface.

[0257] On the resin layer 201 side of the resin layer 202, a conductive layer 223 and an alignment film 224b are laminated. An insulating layer 204 is provided between the resin layer 202 and the conductive layer 223. In addition, a colored layer for coloring the reflected light of the liquid crystal element 220 may be provided.

[0258] The insulating layer 231 is provided to cover the opening of the resin layer 201. The portion of the resin layer 202 that overlaps the opening is provided in contact with the adhesive layer 50. The insulating layer 204 is provided to cover the opening of the resin layer 202. The portion of layer 202 that overlaps the opening is in contact with adhesive layer 52 .

[0259] [Display device 11] When the display area 11a of the display device 11 is viewed from above, the light emitting element 120 is a reflective liquid crystal display. 22A, the light emitting element 220 has a portion that does not overlap with the crystal element 220. From the element 120, emitted light 21 colored by the colored layer 152 is emitted to the viewing side. In the liquid crystal element 220, the reflected light 22, which is the external light reflected by the conductive layer 221, is reflected by the liquid crystal 22. It is injected through 2.

[0260] The light 21 emitted from the light emitting element 120 passes through the openings in the resin layer 102 and the openings in the resin layer 201. The resin layer 10 is then injected onto the viewing side through the openings in the resin layer 202. 2. Even if the resin layer 201 and the resin layer 202 absorb part of the visible light, the light emitted Since these resin layers are not present on the optical path of 21, the light extraction efficiency and color reproducibility are high. It can be said that:

[0261] The substrate 612 functions as a polarizing plate or a circular polarizing plate. A polarizing plate or a circular polarizing plate may be provided on the outside.

[0262] Here, the display panel 200 does not have a colored layer and is configured not to perform color display. A colored layer may be provided on the resin layer 202 side to enable color display.

[0263] The configuration of the display area 11b described in the first embodiment is shown in FIG. In the display panel 200 area, a transistor 210 and a reflective liquid crystal element are provided. Since the alignment film 224a and the alignment film 224b are not formed, the display is performed by the operation of the display panel 100. 24b and the liquid crystal 222 are provided, all or part of which may be Instead, a resin layer or the like that transmits light emitted from the light emitting element 120 may be provided. The display area 61b described in the above can also have the same configuration.

[0264] The above is a description of the configuration example.

[0265] [Variations of the configuration example] Below, we will explain some configuration examples that are different from the configuration example shown in Figure 22(A). explain.

[0266] In FIG. 22(A), an opening is provided in a resin layer located on the path of light from the light emitting element 120. However, the resin layer positioned on the path of light in the reflective liquid crystal element 220 also has an opening. A section may be provided.

[0267] FIG. 23 shows an example in which a region 82 is provided in addition to the region 81. The region 82 is formed by the resin layer 2 02 and the area overlapping with the liquid crystal element 220.

[0268] 23, the resin layer 202 has an opening that overlaps the light emitting element 120 and a liquid crystal element 220. Although an example in which one opening is provided with both an opening and an opening overlapping the opening is shown, The opening overlapping the liquid crystal element 120 and the opening overlapping the liquid crystal element 220 are separately provided. That's fine.

[0269] [About transistors] The display device 11 illustrated in FIG. 22A includes both the transistor 110 and the transistor 210. On the other hand, this is an example in which a bottom-gate structure transistor is applied.

[0270] In the transistor 110, a conductive layer 111 functioning as a gate electrode is formed between the semiconductor layer 112 and the conductive layer 111. The insulating layer 132 is also located on the surface to be formed (the resin layer 101 side). The semiconductor layer 112 is provided to cover the conductive layer 111. The region of the conductive layer 111 overlapping the conductive layer 112 corresponds to the channel forming region. The conductive layer 113a and the conductive layer 113b are in contact with the upper surface and side edge of the semiconductor layer 112, respectively. It is provided.

[0271] In the transistor 110, the width of the semiconductor layer 112 is larger than that of the conductive layer 111. With this configuration, the conductive layer 111 and the conductive layer 113a or the conductive layer 11 Since the semiconductor layer 112 is disposed between the conductive layer 111 and the conductive layer 113a or the conductive layer 3b, The parasitic capacitance between the layer 113b and the layer 113b can be reduced.

[0272] The transistor 110 is a channel-etched transistor, and the surface area of ​​the transistor is Since it is relatively easy to reduce the area, it can be suitably used in high-definition display devices. do.

[0273] Transistor 210 shares characteristics with transistor 110 .

[0274] Here, the transistor structure applicable to the transistor 110 and the transistor 210 is An example will be described.

[0275] The transistor 110a shown in FIG. 24A has a conductive layer The difference is that the conductive layer 114 is formed on the insulating layer 133 and the insulating layer 136. The insulating layer 136 has a region overlapping with the semiconductor layer 112. and is provided over the insulating layer 133 .

[0276] The conductive layer 114 is located on the opposite side of the semiconductor layer 112 from the conductive layer 111. When the layer 111 is used as a first gate electrode, the conductive layer 114 functions as a second gate electrode. By applying the same potential to the conductive layer 111 and the conductive layer 114, the transistor In addition, the on-state current of the conductive layer 111 and the conductive layer 114 can be increased. By applying a potential to one side to control the threshold voltage and a potential to the other side for driving, , the threshold voltage of the transistor 110a can be controlled.

[0277] Here, it is preferable to use a conductive material containing an oxide for the conductive layer 114. Therefore, when the conductive film constituting the conductive layer 114 is formed, the conductive film is formed in an atmosphere containing oxygen. In this case, oxygen can be supplied to the insulating layer 133. The ratio of oxygen gas in the insulating layer 13 is preferably in the range of 90% to 100%. The oxygen supplied to the semiconductor layer 112 is supplied to the semiconductor layer 112 by a subsequent heat treatment. This can reduce oxygen deficiency.

[0278] In particular, it is preferable to use an oxide semiconductor with low resistance for the conductive layer 114. It is preferable to use an insulating film that releases hydrogen, such as a silicon nitride film, for the insulating layer 136. During the formation of the insulating layer 136 or by a subsequent heat treatment, hydrogen is supplied to the conductive layer 114. As a result, the electrical resistance of the conductive layer 114 can be effectively reduced.

[0279] The transistor 110b shown in FIG. 24B is a top-gate transistor.

[0280] In the transistor 110b, the conductive layer 111 functioning as a gate electrode is thicker than the semiconductor layer 112. The insulating layer 131 is provided on the upper side (opposite to the surface on which the semiconductor layer is to be formed). On the semiconductor layer 112, an insulating layer 132 and a conductive layer 111 are formed. The insulating layer 133 is formed by laminating the upper surface and side edges of the semiconductor layer 112. , and are provided to cover the side surfaces of the insulating layer 132 and the conductive layer 111. The conductive layer 113a and the conductive layer 113b are provided on the insulating layer 133. The insulating layer 133 is electrically connected to the upper surface of the semiconductor layer 112 through an opening formed in the insulating layer 133. is connected.

[0281] Here, an example in which the insulating layer 132 does not exist in a portion that does not overlap with the conductive layer 111 is described. 1, an insulating layer 132 is provided over the top surface and side edges of the semiconductor layer 112. That's fine.

[0282] The transistor 110b is formed by a physical connection between the conductive layer 111 and the conductive layer 113a or 113b. Since it is easy to separate them at a sufficient distance, it is possible to reduce the parasitic capacitance between them.

[0283] The transistor 110c shown in FIG. 24C has a conductive layer The difference is that the conductive layer 115 has the insulating layer 131 and the insulating layer 137. The insulating layer 137 is formed on the conductive layer 11 and has a region overlapping with the semiconductor layer 112. 5 and insulating layer 131.

[0284] The conductive layer 115 functions as a second gate electrode in the same manner as the conductive layer 114. It is possible to increase the on-current and control the threshold voltage.

[0285] Here, in the display device 11, the transistors included in the display panel 100 and the The transistors included in 200 may be different from those included in 200. The transistor electrically connected to the light emitting element 120 needs to pass a relatively large current. Therefore, the transistors 110a and 110c are applied, and the other transistors are applied. In order to reduce the area occupied by the transistor, the transistor 110 can be applied. Cut.

[0286] As an example, FIG. 25 shows a case where the transistor 11 is used instead of the transistor 210 in FIG. 22(A). 0a and a transistor 110c instead of the transistor 110. It shows.

[0287] This concludes the explanation of the transistor.

[0288] This embodiment may be appropriately combined with at least a part of another embodiment described in this specification. It can be implemented in combination.

[0289] (Embodiment 5) In this embodiment, a more specific example of a display device according to one embodiment of the present invention will be described. The display device 400 illustrated in FIG. 1 has the display area 11a described in the first embodiment and the display area 11b described in the first embodiment. Both the reflective liquid crystal element and the light emitting element that can be used in the display area 61a described in 2. and is capable of displaying in both transmissive and reflective modes.

[0290] [Configuration example] 26A is a block diagram showing an example of the configuration of the display device 400. The display device has a plurality of pixels 410 arranged in a matrix on the display section 362a. 400 includes a circuit GD and a circuit SD. Also, a plurality of pixels 410 arranged in a direction R, and and a plurality of wirings G1, G2, and ANO electrically connected to the circuit GD; and a plurality of wirings CSCOM. Also, a plurality of pixels 410 arranged in a direction C, and The semiconductor device has a plurality of wirings S1 and a plurality of wirings S2 electrically connected to the circuit SD.

[0291] For simplicity, a configuration having one circuit GD and one circuit SD is shown here. Circuits GD and SD for driving elements, and circuits GD and SD for driving light-emitting elements and may be provided separately.

[0292] The pixel 410 includes a reflective liquid crystal element and a light-emitting element. and the light-emitting element have overlapping portions.

[0293] 26(B1) shows a structural example of the electrode 311b included in the pixel 410. The electrode 311b has It functions as a reflective electrode for the liquid crystal element in the pixel 410. The electrode 311b also has an opening 4 51 is provided.

[0294] In FIG. 26(B1), the light emitting element 360 located in the area overlapping with the electrode 311b is shown by a broken line. The light emitting element 360 is disposed so as to overlap with an opening 451 of the electrode 311b. As a result, the light emitted by the light emitting element 360 is emitted through the opening 451 to the display surface side.

[0295] In FIG. 26(B1), pixels 410 adjacent in the direction R correspond to different colors. At this time, as shown in FIG. 26(B1), the openings 45 are formed in two pixels adjacent to each other in the direction R. It is preferable that the electrodes 311b are provided at different positions so that the electrodes 311b are not arranged in a line. This allows the two light emitting elements 360 to be spaced apart, and the light emitted by the light emitting elements 360 A phenomenon in which light is incident on the colored layer of an adjacent pixel 410 (also known as crosstalk) In addition, two adjacent light emitting elements 360 can be arranged apart from each other. Therefore, when the EL layer of the light emitting element 360 is separately formed using a shadow mask or the like, Even with this, a high-definition display device can be realized.

[0296] Alternatively, an arrangement such as that shown in FIG. 26(B2) may be used.

[0297] If the ratio of the total area of ​​the openings 451 to the total area of ​​the non-openings is too large, it is difficult to obtain a satisfactory image using a liquid crystal element. In addition, the ratio of the total area of ​​the openings 451 to the total area of ​​the non-openings is If the value is too small, the display using the light emitting element 360 will be too dark.

[0298] Furthermore, if the area of ​​the opening 451 provided in the electrode 311b that functions as a reflective electrode is too small, This reduces the efficiency of light that can be extracted from the light emitted by the light emitting element 360.

[0299] The shape of the opening 451 may be, for example, a polygon, a rectangle, an ellipse, a circle, a cross, or the like. It may also be in the form of thin stripes, slits, or a checkered pattern. The apertures 451 may be arranged close to adjacent pixels. Preferably, the apertures 451 are arranged so that they display the same color. This arrangement makes it possible to suppress crosstalk.

[0300] [Circuit configuration example] 27 is a circuit diagram showing a configuration example of a pixel 410. In FIG. 27, two adjacent pixels 4 It shows 10.

[0301] The pixel 410 includes a switch SW1, a capacitance element C1, a liquid crystal element 340, a switch SW2, a transistor The pixel 410 includes a transistor M, a capacitance element C2, and a light emitting element 360. Wire G1, wire G2, wire ANO, wire CSCOM, wire S1, and wire S2 are electrically 27, the wiring VCOM electrically connected to the liquid crystal element 340 is 1 and a wiring VCOM2 electrically connecting to the light emitting element 360.

[0302] FIG. 27 shows an example in which transistors are used for the switches SW1 and SW2. It shows.

[0303] The switch SW1 has a gate connected to the wiring G1 and a source or drain connected to the wiring S 1, and the other of the source or drain is connected to one electrode of the capacitance element C1 and the liquid crystal element The other electrode of the capacitance element C1 is connected to the wiring CSCOM. The other electrode of the liquid crystal element 340 is connected to the wiring VCOM1.

[0304] The switch SW2 has a gate connected to the wiring G2 and a source or drain connected to the wiring G3. The other of the source and drain is connected to one electrode of the capacitance element C2, The other electrode of the capacitance element C2 is connected to the gate of the transistor M. The source or drain of the transistor M is connected to the wiring ANO. The other of the source and drain is connected to one electrode of the light-emitting element 360. The other electrode of 60 is connected to the wiring VCOM2.

[0305] In FIG. 27, a transistor M has two gates that sandwich a semiconductor, and these are connected. This increases the current that the transistor M can pass. This can be done.

[0306] A signal that controls the switch SW1 to be in a conducting or non-conducting state is applied to the wiring G1. A predetermined potential can be applied to the wiring VCOM1. A signal for controlling the alignment state of the liquid crystal in the element 340 can be applied. M can be given a predetermined potential.

[0307] A signal that controls the switch SW2 to be in a conductive state or a non-conductive state is applied to the wiring G2. A potential difference that causes the light emitting element 360 to emit light is generated between the wiring VCOM2 and the wiring ANO. The wiring S2 can be connected to a potential that controls the conduction state of the transistor M. A signal to control the

[0308] In the pixel 410 shown in FIG. 27, when a reflective mode display is performed, for example, the wiring G1 and the wiring G2 are The liquid crystal element 340 is driven by a signal applied to the line S1 and displays the image by optical modulation. In addition, when displaying in a transmissive mode, the voltage applied to the wiring G2 and the wiring S2 is The light emitting element 360 can be driven by a signal to emit light for display. When driving with a mode, the voltages given to the wiring G1, the wiring G2, the wiring S1 and the wiring S2 are It can be driven by a signal.

[0309] In FIG. 27, one pixel 410 includes one liquid crystal element 340 and one light emitting element 360. 28A shows an example in which one pixel 410 has one The liquid crystal element 340 and four light-emitting elements 360 (light-emitting elements 360r, 360g, 360b, 360r) 28(A) shows an example in which the pixel 410 shown in FIG. 28(A) has a pixel width of 0w. A single pixel can display full color.

[0310] In FIG. 28(A), in addition to the example of FIG. 27, a line G3 and a line S3 are connected to the pixel 410. are.

[0311] In the example shown in FIG. 28(A), for example, four light emitting elements 360 are arranged to emit red (R), green (G), and blue light. Light-emitting elements that emit green (G), blue (B), and white (W) colors can be used. A reflective liquid crystal element that exhibits white color can be used as the liquid crystal element 340. In the case of display in reflective mode, white color with high reflectivity can be displayed. When display is performed in the transmissive mode, display with high color rendering can be performed with low power consumption.

[0312] 28B shows an example of the configuration of a pixel 410. The pixel 410 has an electrode 311 The light emitting element 360w overlaps with the opening of the electrode 311, and the light emitting element 360w is disposed around the electrode 311. The light emitting element 360r, the light emitting element 360g, and the light emitting element 360b. The light emitting element 360g and the light emitting element 360b preferably have approximately the same light emitting area. .

[0313] [Example of display device configuration] 29 is a perspective schematic diagram of a display device 300 according to an embodiment of the present invention. The plate 351 and the substrate 361 are bonded together. In FIG. 29, the substrate 361 is indicated by a dashed line. It is clearly stated in.

[0314] The display device 300 includes a display unit 362a, a display unit 362b, a display unit 362c, a circuit unit 364, The substrate 351 has wiring 365, a circuit section 366, wiring 367, etc. 4, the wiring 365, the circuit portion 366, the wiring 367, and the electrode 311b functioning as a pixel electrode 29, IC373, FPC372, IC375, etc. are provided on the substrate 351. and FPC374 are mounted. Therefore, the configuration shown in Figure 29 is Display device 300 and a table having IC373, FPC372, IC375 and FPC374 It can also be called a display module.

[0315] The display device 300 corresponds to the display device 11 described in the first embodiment, and includes a display unit 362a, a display The display unit 362b and the display unit 362c are the display areas 11a, 11b, and 11c, respectively. Equivalent to 1c.

[0316] The circuit section 364 and the circuit section 366 use a circuit that functions as, for example, a scanning line driving circuit. It is possible.

[0317] The wiring 365 and the wiring 367 have the function of supplying signals and power to the display unit and the circuit unit 364. The signals and power are transmitted to the outside via FPC372 or from IC373 via wiring 365. is entered into

[0318] In addition, in FIG. 29, a substrate 351 is provided with a COG (Chip On Glass) method or the like. This shows an example where IC373 and IC375 are provided. For example, an IC having a function as a scanning line driving circuit can be applied to 75. 00 may have a circuit that functions as a scanning line driver circuit and a signal line driver circuit, or The circuit that functions as the drive circuit and signal line drive circuit is provided externally, and the FPC372 and FPC When a signal for driving the display device 300 is input via IC374, It is also possible to configure the IC373 and IC375 without the IC373 and IC375. Alternatively, the light emitting element 352 may be provided on the substrate 351 by a COF (Chip On Film) method or the like. stomach.

[0319] 29 shows an enlarged view of a part of the display unit 362a. The display unit 362a corresponds to the display areas 11a and 11d described in the first embodiment. The electrodes 311b of the display element are arranged in a matrix. and functions as a reflective electrode for the liquid crystal element 340, which will be described later.

[0320] 29, the electrode 311b has an opening. The plate 351 has a light emitting element 360. The light from the light emitting element 360 is incident on the opening of the electrode 311b. It is ejected to the substrate 361 side through the opening.

[0321] The display areas 11b and 11c described in the first embodiment are the display units 362b and 362c. The display units 362b and 362c do not have the liquid crystal element 340, and therefore the electrodes 31 The area corresponding to 1b is formed of a light-shielding layer or the like.

[0322] [Cross-section example] FIG. 30 shows a part of the area including the FPC 372, the circuit area, and the like of the display device 300 shown in FIG. a part of the area including the display unit 362a, a part of the area including the circuit unit 366, The following shows examples of cross sections of a portion of the FPC374-containing area and a portion of the FPC374-containing area. .

[0323] The display device shown in FIG. 30 has a structure in which a display panel 100 and a display panel 200 are stacked. The display panel 100 includes a resin layer 101 and a resin layer 102. The resin layer 102 and the resin layer 201 are bonded to each other by an adhesive layer 5. The resin layer 101 is bonded to the substrate 351 by an adhesive layer 51. The resin layer 202 is bonded to the substrate 361 by an adhesive layer 52.

[0324] [Display panel 100]

[0325] The display panel 100 includes a resin layer 101, an insulating layer 478, a plurality of transistors, and a capacitance element 40. 5, wiring 407, insulating layer 411, insulating layer 412, insulating layer 413, insulating layer 414, insulating layer 4 15, light emitting element 360, spacer 416, adhesive layer 417, colored layer 425, light blocking layer 426, It has an insulating layer 476 and a resin layer 102 .

[0326] The resin layer 102 has an opening in the area where it overlaps with the light emitting element 360 .

[0327] The circuit portion 364 includes a transistor 401. The display portion 362a includes a transistor 402 and a and a transistor 403.

[0328] Each transistor has a gate, an insulating layer 411, a semiconductor layer, a source, and a drain. The gate and the semiconductor layer overlap with an insulating layer 411 interposed therebetween. A part of the insulating layer 411 is a gate insulating layer. One part functions as an edge layer, and the other part functions as a dielectric of the capacitor element 405 . The conductive layer serving as the source or drain of the transistor 402 is It also serves as one of the electrodes.

[0329] 30 shows a bottom-gate transistor. The circuit section 364 and the display section 362a may have different transistor structures. Each may have multiple types of transistors.

[0330] The capacitor 405 has a pair of electrodes and a dielectric between them. The conductive layer is made of the same material and formed in the same process as the gate of the transistor. The conductive layer is made of the same material as the source and drain and is formed in the same process.

[0331] The insulating layer 412, the insulating layer 413, and the insulating layer 414 each cover a transistor and the like. The number of insulating layers covering the transistors and the like is not particularly limited. The insulating layer 412, the insulating layer 413, and the insulating layer 414 function as a planarization layer. At least one layer should be made of a material that is difficult for impurities such as water or hydrogen to diffuse into. It is possible to effectively prevent external impurities from diffusing into the transistor. This makes it possible to improve the reliability of the display device.

[0332] When an organic material is used for the insulating layer 414, the insulating layer 414 exposed at the edge of the display device is Therefore, there is a risk that impurities such as moisture may enter the light emitting element 360 from the outside of the display device. If the light emitting element 360 is deteriorated due to the intrusion of an object, it will lead to deterioration of the display device. As shown in Figure 30, it is preferable that the insulating layer 414 is not located at the edge of the display device. In the configuration of 30, the insulating layer using an organic material is located at the edge of the display device, so that the light-emitting element This can prevent impurities from entering 360.

[0333] The light-emitting element 360 includes an electrode 421, an EL layer 422, and an electrode 423. The light emitting element 360 may have an optical adjustment layer 424. The light emitting element 360 has a colored layer 425 side. It is a top emission structure that injects

[0334] The transistor, the capacitor, the wiring, etc. are arranged so as to overlap with the light-emitting region of the light-emitting element 360. This makes it possible to increase the aperture ratio of the display portion 362a.

[0335] One of the electrodes 421 and 423 functions as an anode, and the other functions as a cathode. A voltage higher than the threshold voltage of the light emitting element 360 is applied between the electrode 421 and the electrode 423. When a voltage is applied, holes are injected into the EL layer 422 from the anode side, and electrons are injected from the cathode side. The injected electrons and holes recombine in the EL layer 422, and emit light from the EL material contained in the EL layer 422. The quality glows.

[0336] The electrode 421 is electrically connected to the source or drain of the transistor 403. They may be connected directly or via another conductive layer. It functions as a pixel electrode and is provided for each light emitting element 360. Two adjacent electrodes 42 1 is electrically isolated by an insulating layer 415.

[0337] The EL layer 422 is a layer containing a light-emitting substance.

[0338] The electrode 423 functions as a common electrode and is provided across the plurality of light-emitting elements 360. A constant potential is applied to the electrode 423 .

[0339] The light emitting element 360 overlaps the colored layer 425 via an adhesive layer 417. The spacer 416 30, the electrode 423 and the light-shielding layer 426 are overlapped with each other through the adhesive layer 417. Although the case where there is a gap between them is shown, they may be in contact. Although the configuration in which the light-shielding layer 416 is provided on the substrate 351 side is shown, it may be provided on the substrate 361 side (for example, from the light-shielding layer 426). It may be provided on the substrate 351 side.

[0340] A combination of a color filter (colored layer 425) and a microcavity structure (optical adjustment layer 424) By combining these layers, light with high color purity can be extracted from the display device. The film thickness of 424 is changed depending on the color of each pixel.

[0341] The colored layer 425 is a colored layer that transmits light in a specific wavelength band, for example, red, green, or blue. Alternatively, a color filter that transmits light in the yellow wavelength band can be used.

[0342] Note that one embodiment of the present invention is not limited to the color filter method, but may be a color-coded method, a color conversion method, Alternatively, a quantum dot method or the like may be applied.

[0343] The light-shielding layer 426 is provided between the adjacent colored layers 425. The light from the light emitting element 360 is blocked, and color mixing between adjacent light emitting elements 360 is suppressed. Here, by providing the end of the colored layer 425 so as to overlap the light-shielding layer 426, light leakage is reduced. The light-shielding layer 426 is made of a material that blocks the light emitted by the light-emitting element 360. The light-shielding layer 426 can be used in the circuit section 364 and other areas other than the display section 362a. It is preferable to provide the light emitting element in the region (a) because unintended light leakage due to guided light or the like can be suppressed.

[0344] An insulating layer 478 is formed on one surface of the resin layer 101. An insulating layer 476 is formed on one surface. It is preferable to use a film having high moisture resistance. By arranging the elements such as the silicon dioxide and the transistors, the intrusion of impurities such as water into these elements is suppressed. This is preferable because it increases the reliability of the display device.

[0345] Highly moisture-proof insulating films include silicon nitride films and silicon nitride oxide films containing nitrogen and silicon. and films containing nitrogen and aluminum, such as aluminum nitride films. Alternatively, a silicon oxide film, a silicon oxynitride film, an aluminum oxide film, or the like may be used.

[0346] For example, the water vapor permeability of a highly moisture-proof insulating film is 1×10 -5 [g / (m 2 ·day)] Less than 1 × 10 -6 [g / (m 2 ·day)] or less, more preferably 1 × 10 -7 [g / (m 2 ·day)] or less, more preferably 1 × 10 -8 [g / (m 2 ·da y)] or less.

[0347] The connection portion 406 has a wiring 365. The wiring 365 is connected to the source and drain of the transistor. The connection portion 406 can be formed from the same material and in the same process as the circuit portion. 364 is electrically connected to an external input terminal that transmits signals and potentials from the outside. This shows an example in which an FPC 372 is provided as an external input terminal. 372 and the connection portion 406 are electrically connected.

[0348] The connection layer 419 may be made of various anisotropic conductive films (ACFs). Conductive Film) and Anisotropic Conductive Paste (ACP) opic conductive paste) can be used.

[0349] This concludes the description of the display panel 100.

[0350] [Display panel 200] The display panel 200 is a reflective liquid crystal display device that employs a vertical electric field method.

[0351] The display panel 200 includes a resin layer 201, an insulating layer 578, a plurality of transistors, and a capacitance element 50. 5, wiring 367, insulating layer 511, insulating layer 512, insulating layer 513, insulating layer 514, liquid crystal element 529, an alignment film 564a, an alignment film 564b, an adhesive layer 517, an insulating layer 576, and a resin layer It has 202.

[0352] The resin layer 201 and the resin layer 202 are bonded together by an adhesive layer 517. The liquid crystal 563 is sealed in the area surrounded by the resin layer 202 and the adhesive layer 517. A polarizer 599 is located on the outer surface of the substrate 572.

[0353] The resin layer 201 is provided with an opening that overlaps the light emitting element 360. The glass substrate 202 has an opening that overlaps with the liquid crystal element 529 and the light-emitting element 360 .

[0354] The liquid crystal element 529 includes an electrode 311b, an electrode 562, and a liquid crystal 563. b functions as a pixel electrode. Electrode 562 functions as a common electrode. The orientation of the liquid crystal 563 can be controlled by the electric field generated between the electrode 562 and the liquid crystal 563. An alignment film 564a is provided between the liquid crystal 563 and the electrode 311b. An alignment film 564b is provided between them.

[0355] The resin layer 202 is provided with an insulating layer 576, an electrode 562, an alignment film 564b, and the like. do.

[0356] The resin layer 201 includes an electrode 311b, an alignment film 564a, a transistor 501, a transistor 503, a capacitor element 505, a connection portion 506, a wiring 367, and the like are provided.

[0357] On the resin layer 201, insulating layers such as an insulating layer 511, an insulating layer 512, an insulating layer 513, and an insulating layer 514 are formed. An edge layer is provided.

[0358] Here, the source or drain of the transistor 503 that is electrically connected to the electrode 311b The conductive layer that is not connected may function as a part of the signal line. The conductive layer 503 that functions as the gate may also function as a part of the scan line.

[0359] In FIG. 30, an example of the display section 362a is shown in which a colored layer is not provided. The liquid crystal element 529 is an element that displays black and white gradations.

[0360] FIG. 30 shows an example in which a transistor 501 is provided as an example of the circuit section 366. do.

[0361] At least one of the insulating layers 512 and 513 covering each transistor is made of a material that is resistant to water, hydrogen, etc. It is preferable to use a material in which impurities are less likely to diffuse.

[0362] An electrode 311b is provided on the insulating layer 514. The electrode 311b is The source of the transistor 503 is connected to the insulating layer 513 through an opening formed in the insulating layer 512. The electrode 311b is electrically connected to one of the drains of the capacitor 505. The electrode is electrically connected to one of the electrodes.

[0363] Since the display panel 200 is a reflective liquid crystal display device, the electrode 311b reflects visible light. A conductive material that transmits visible light is used for the electrode 561, and a conductive material that transmits visible light is used for the electrode 562.

[0364] Examples of conductive materials that transmit visible light include indium (In), zinc (Zn), and tin. It is preferable to use a material containing one selected from the group consisting of indium oxide (Sn). , Indium Tin Oxide (ITO), Indium Zinc Oxide, Indium Oxide with Tungsten Oxide, Indium Oxide with Tungsten Oxide Zinc oxide, indium oxide with titanium oxide, indium tin oxide with titanium oxide , indium tin oxide with silicon oxide (ITSO), zinc oxide, oxide with gallium Zinc, etc. A film containing graphene can also be used. The film containing graphene oxide can be formed, for example, by reducing a film containing graphene oxide formed in a film shape. Cut.

[0365] Examples of conductive materials that reflect visible light include aluminum, silver, and metals thereof. Other examples include alloys containing gold, platinum, nickel, tungsten, and chromium. , molybdenum, iron, cobalt, copper, palladium, or other metallic materials, or these metals In addition, the above metal materials or alloys may contain lanthanum, nickel, or the like. Odum, germanium, etc. may be added. Alloys of aluminum and titanium, Aluminum and nickel alloy, aluminum and neodymium alloy, aluminum, nickel and lanthanum alloys (Al-Ni-La), Silver-copper alloy, silver-palladium-copper alloy (also known as Ag-Pd-Cu, APC) Alternatively, an alloy containing silver, such as an alloy of silver and magnesium, may be used.

[0366] Here, a linear polarizing plate may be used as the polarizing plate 599, but a circular polarizing plate may also be used. The circular polarizer is, for example, a laminate of a linear polarizer and a quarter-wave retardation plate. This makes it possible to suppress reflection of external light. By adjusting the cell gap, orientation, driving voltage, etc. of the liquid crystal element 529 according to the type, the desired It is sufficient to realize the contrast of

[0367] The electrode 562 is connected to the conductor provided on the resin layer 201 side in a portion close to the end of the resin layer 202. The conductive layer is electrically connected to the conductive layer by the connector 543. A potential or a signal can be supplied to the electrode 562 from the FPC 374, IC, or the like connected thereto.

[0368] The connector 543 may be, for example, a conductive particle. The surface of particles such as organic resin or silica coated with a metal material can be used. It is preferable to use nickel or gold as the metal material, as this can reduce the contact resistance. It uses particles coated with layers of two or more metal materials, such as nickel coated with gold. It is also preferable that the connector 543 is made of a material that undergoes elastic or plastic deformation. In this case, the connectors 543, which are conductive particles, are preferably arranged as shown in FIG. In this way, the connector 543 and the electrical This increases the contact area with the conductive layer that is directly connected, reducing contact resistance and preventing connection failures. The occurrence of defects can be suppressed.

[0369] The connector 543 is preferably disposed so as to be covered with the adhesive layer 517. For example, The connectors 543 may be dispersed in the previous adhesive layer 517 .

[0370] A connecting portion 506 is provided in an area near the end of the resin layer 201. The connecting portion 506 is The FPC 374 is electrically connected via the connection layer 519. In the configuration shown in FIG. A part of the wiring 367 and a conductive layer obtained by processing the same conductive film as the electrode 311b are laminated. This shows an example in which the connection section 506 is configured by the above.

[0371] This concludes the description of the display panel 200.

[0372] FIG. 31 shows a part of the area including the FPC 372, the circuit area, and the like of the display device 300 shown in FIG. 364 and a part of the area including the display unit 362b are cut away. The display unit 362b is configured to display images by the operation of the display panel 100. In addition, the embodiment in which alignment films 564a and 564b and a liquid crystal 563 are provided is shown in the figure. However, some or all of these may be omitted, and a resin layer that transmits light emitted from the light emitting element 360 may be used. Also, the polarizing plate 599 is unnecessary and may not be provided. The display unit 362c can have the same configuration as the display unit 362b.

[0373] [About each component] Each of the above components will be described below.

[0374] 〔substrate〕 A material having a flat surface can be used for the substrate of the display panel. The substrate on the side from which the light is extracted is made of a material that transmits the light. For example, glass, quartz, ceramic Materials such as aramic, sapphire, and organic resins can be used.

[0375] By using a thin substrate, it is possible to reduce the weight and thickness of the display panel. By using a substrate with a thickness that allows flexibility, a flexible display panel can be realized. can.

[0376] In addition, the substrate on the side from which light is not extracted does not need to be light-transmitting. In addition to the substrate, a metal substrate or the like can also be used. A metal substrate has high thermal conductivity, and the entire substrate Since heat can be easily conducted to the display panel, local temperature rises in the display panel can be suppressed. To obtain flexibility and bendability, the thickness of the metal substrate is preferably 10 μm or more and 400 μm or less. It is more preferable that the thickness is 20 μm or more and 50 μm or less.

[0377] The material for forming the metal substrate is not particularly limited, but examples thereof include aluminum, copper, and nickel. Metals such as aluminum alloys or stainless steel alloys are preferably used. It is possible.

[0378] In addition, insulating treatment is performed by oxidizing the surface of the metal substrate or forming an insulating film on the surface. For example, a substrate that has been subjected to a coating process such as spin coating or dipping, or an electrodeposition process may be used. The insulating film may be formed by deposition, evaporation, sputtering, or the like. In addition to leaving it in an atmosphere or heating it, an oxide film is formed on the surface of the substrate by anodizing or other methods. It may be done.

[0379] Examples of materials that are flexible and transparent to visible light include: Thickness of glass, polyethylene terephthalate (PET), polyethylene naphthalate Polyester resins such as (PEN), polyacrylonitrile resins, polyimide resins, polymers methyl methacrylate resin, polycarbonate (PC) resin, polyethersulfone (PE S) Resin, polyamide resin, cycloolefin resin, polystyrene resin, polyamide imide resin, polyvinyl chloride resin, polytetrafluoroethylene (PTFE) resin, etc. In particular, it is preferable to use a material with a low thermal expansion coefficient. x10 -6 / K or less polyamide-imide resin, polyimide resin, PET, etc. are preferably used. In addition, a substrate in which glass fiber is impregnated with organic resin or an organic filler is used. It is also possible to use a substrate with a lower thermal expansion coefficient by mixing it with resin. Since the substrate is light in weight, the display panel using the substrate can also be made light in weight.

[0380] When the above materials contain fibrous bodies, the fibrous bodies are made of high strength organic or inorganic compounds. High-strength fibers are specifically fibers with high tensile modulus or Young's modulus. Representative examples include polyvinyl alcohol fibers, polyester fibers, polyamide fibers, etc. Fibers based on cellulose, polyethylene fibers, aramid fibers, polyparaphenylene benzobisoxa Examples of the fiber include sol fiber, glass fiber, and carbon fiber. Glass fiber includes E-glass. Examples of glass fibers include those made of S-glass, D-glass, Q-glass, etc. The fiber is used in the form of a flexible or nonwoven fabric, and the structure is made by impregnating the fiber with resin and hardening the resin. As a flexible substrate, a substrate made of a fiber body and a resin may be used. The use of a structure is preferable because it improves reliability against damage due to bending or local pressure. stomach.

[0381] Alternatively, glass, metal, or the like that is thin enough to be flexible can also be used as the substrate. Alternatively, a composite material in which glass and a resin material are bonded together with an adhesive layer may be used.

[0382] A hard coat layer (e.g., , silicon nitride, aluminum oxide, etc.), or a layer of material that can distribute pressure (e.g., In addition, the display element may be laminated with other materials such as a polymer resin (e.g., a methyl methacrylate resin). In order to suppress this, an insulating film with low water permeability may be laminated on a flexible substrate. For example, silicon nitride, silicon oxynitride, silicon nitride oxide, aluminum oxide, nitride An inorganic insulating material such as aluminum can be used.

[0383] The substrate may be formed by laminating a plurality of layers. In particular, when the substrate has a glass layer, This improves the barrier properties against water and oxygen, making it possible to provide a highly reliable display panel.

[0384] [Transistor] A transistor includes a conductive layer that functions as a gate electrode, a semiconductor layer, and a gate electrode that functions as a source electrode. a conductive layer acting as a drain electrode; a conductive layer acting as a gate insulating layer; The above describes the case where a bottom gate structure transistor is applied. There are.

[0385] Note that the structure of a transistor included in a display device of one embodiment of the present invention is not particularly limited. For example, a planar type transistor or a staggered type transistor may be used. Alternatively, a top-gate or bottom-gate transistor may be used. Alternatively, gate electrodes may be provided above and below the channel. It may also be used.

[0386] The crystallinity of the semiconductor material used in the transistor is not particularly limited. A semiconductor with crystallinity (microcrystalline semiconductor, polycrystalline semiconductor, single crystal semiconductor, or semiconductor with a partially crystalline region) If a semiconductor having crystallinity is used, This is preferable because it can suppress deterioration of the resistor characteristics.

[0387] In addition, the semiconductor material used for the transistor has an energy gap of 2 eV or more, and is preferably Preferably, an oxide semiconductor having a conductivity of 2.5 eV or more, more preferably 3 eV or more, can be used. A typical example is an oxide semiconductor containing indium, for example, the CA C-OS, etc. can be used.

[0388] Using oxide semiconductors with a wider band gap and lower carrier density than silicon The transistor has a low off-state current, which is The accumulated charge can be maintained for a long period of time.

[0389] The semiconductor layer may be, for example, indium, zinc, and M (aluminum, titanium, gallium, Al, yttrium, zirconium, lanthanum, cerium, tin, neodymium or halide The film can be a film represented by an In-M-Zn oxide containing a metal such as fluorine.

[0390] When the oxide semiconductor constituting the semiconductor layer is an In-M-Zn oxide, The atomic ratio of the metal elements in the sputtering target used to form a film is In≧M It is preferable that Zn≧M is satisfied. The atomic ratios were In:M:Zn=1:1:1, In:M:Zn=1:1:1.2, In :M:Zn=3:1:2, In:M:Zn=4:2:3, In:M:Zn=4:2:4. 1, In:M:Zn=5:1:6, In:M:Zn=5:1:7, In:M:Zn=5: The atomic ratio of the semiconductor layers to be formed is preferably 1:8 or the like. This includes a ±40% variation in the atomic ratio of metal elements contained in the ring target.

[0391] The bottom-gate transistor exemplified in this embodiment can reduce the manufacturing process. In addition, by using an oxide semiconductor, it is possible to form the oxide semiconductor at a lower temperature than polycrystalline silicon. This allows for the use of materials with low heat resistance as wiring and electrode materials below the semiconductor layer, as well as substrate materials. For example, it is possible to use a very large area A glass substrate such as the above can be suitably used.

[0392] [Conductive Layer] In addition to the gate, source, and drain of the transistor, various wiring and Materials that can be used for conductive layers such as electrodes include aluminum, titanium, chromium, and the like. , nickel, copper, yttrium, zirconium, molybdenum, silver, tantalum, or tungsten Examples of such materials include metals such as tin and tin, and alloys containing these as the main component. Films containing silicon can be used as single layers or as laminated structures. a single layer structure of aluminum film containing titanium, a two-layer structure of aluminum film laminated on titanium film, Two-layer structure with aluminum film laminated on stainless steel film, copper-magnesium-aluminum alloy Two-layer structure with copper film laminated on top of titanium film, two-layer structure with copper film laminated on top of titanium film, tungsten film A two-layer structure with a copper film laminated on top, a titanium film or titanium nitride film laminated on top of that, and an aluminum film laminated on top of that. A three-layer structure in which an aluminum or copper film is laminated and a titanium or titanium nitride film is formed on top of that. Structure: Molybdenum film or molybdenum nitride film with aluminum film or copper film on top Three-layer structure in which a film is laminated and then a molybdenum film or molybdenum nitride film is formed on top of that It is also possible to use oxides such as indium oxide, tin oxide, or zinc oxide. The use of copper containing manganese is preferable because it improves the controllability of the shape by etching.

[0393] Examples of the light-transmitting conductive material include indium oxide, indium tin oxide, and indium tin oxide. Conductive oxides such as gallium zinc oxide, zinc oxide, and gallium-doped zinc oxide, or gallium-doped zinc oxide Alternatively, gold, silver, platinum, magnesium, nickel, titanium Gold, such as copper, chromium, molybdenum, iron, cobalt, copper, palladium, or titanium Metallic materials and alloy materials containing such metallic materials can be used. Alternatively, nitrided metallic materials can be used. It is also possible to use a material such as a metal material or an alloy material (or When using a material such as a nitride, it is sufficient to make it thin enough to have light transmission properties. For example, a laminated film of an alloy of silver and magnesium and an indium alloy can be used as the conductive layer. It is preferable to use a laminated film of tungsten oxide or the like, since this can increase the conductivity. These include conductive layers such as various wirings and electrodes that constitute the display device, and conductive layers of the display element. The conductive layer may also be used as a pixel electrode or a common electrode.

[0394] [Insulating layer] Examples of insulating materials that can be used for each insulating layer include polyimide, acrylic, and epoxy. Silicon oxide, silicon oxynitride, silicon nitride oxide, nitrogen, etc. Alternatively, inorganic insulating materials such as silicon oxide and aluminum oxide may be used.

[0395] It is also preferable that the light emitting element is provided between a pair of insulating films with low water permeability. This prevents impurities such as water from entering the light emitting element, and prevents a decrease in the reliability of the device. can.

[0396] Insulating films with low water permeability include those containing nitrogen and silicon, such as silicon nitride film and silicon nitride oxide film. and films containing nitrogen and aluminum, such as an aluminum nitride film. Alternatively, a silicon nitride film, a silicon oxynitride film, an aluminum oxide film, or the like may be used.

[0397] For example, the water vapor permeation rate of a low-permeability insulating film is 1×10 -5 [g / (m 2 ·day)] Less than 1 × 10 -6 [g / (m 2 ·day)] or less, more preferably 1 × 10 -7 [g / (m 2 ·day)] or less, more preferably 1 × 10 -8 [g / (m 2 ·da y)] or less.

[0398] [Display element] The display element of the first pixel located on the display surface side is an element that reflects external light to display. Such devices do not have a light source, so they consume very little power when displaying. The display element of the first pixel is typically a reflective type. A liquid crystal element can be used. Alternatively, a shutter can be used as the display element of the first pixel. -type MEMS (Micro Electro Mechanical System) ) elements, optical interference type MEMS elements, microcapsule type, electrophoresis type, electro Using elements that use the trowetting method, electronic liquid powder (registered trademark) method, etc. This can be done.

[0399] The display element of the second pixel located on the opposite side to the display surface side has a light source. The light emitted by such a pixel can be used to display images. Since its brightness and chromaticity are not affected by external light, it has high color reproducibility (wide color gamut). The second pixel has a high contrast, i.e., a vivid display. The display element is, for example, an OLED (Organic Light Emitting Diode). iode), LED(Light Emitting Diode), QLED(Qua Self-luminous light such as a luminous dot light-emitting diode Alternatively, a light source such as a bar light source can be used as the display element of the second pixel. The backlight and the transmissive liquid crystal element that controls the amount of light transmitted from the backlight are combined. A combination may also be used.

[0400] [Liquid Crystal Element] As the liquid crystal element, for example, a vertical alignment (VA) model A liquid crystal element to which a vertical alignment mode is applied can be used. ulti-Domain Vertical Alignment) mode, PVA(P atterned Vertical Alignment) mode, ASV (Adva nced Super View) mode can be used.

[0401] In addition, the liquid crystal element may be one that employs various modes. In addition to the VA mode, there are also TN (Twisted Nematic) and IPS (In- Plane-Switching mode, FFS (Fringe Field Switching) mode tching) mode, ASM(Axially Symmetric aligned) Micro-cell mode, OCB (Optically Compensated) d Birefringence mode, FLC (Ferroelectric Li quid Crystal) mode, AFLC(AntiFerroelectric) mode A liquid crystal element in which a liquid crystal mode or the like is applied can be used.

[0402] The liquid crystal element is an element that controls the transmission or non-transmission of light by the optical modulation action of the liquid crystal. The optical modulation effect of the liquid crystal is due to the electric field applied to the liquid crystal (horizontal electric field, vertical electric field). The liquid crystal used in the liquid crystal element is Thermotropic liquid crystal, low molecular weight liquid crystal, high molecular weight liquid crystal, polymer dispersed liquid crystal (PDLC) Polymer Dispersed Liquid Crystal, Ferroelectric Liquid Crystal These liquid crystal materials can be used as cholesteric liquid crystals depending on the conditions. The phases include nematic, smectic, cubic, chiral nematic, and isotropic phases.

[0403] The liquid crystal material may be either a positive type liquid crystal or a negative type liquid crystal. The optimum liquid crystal material may be used depending on the mode and design to be applied.

[0404] In addition, an alignment film can be provided to control the alignment of the liquid crystal. When using a liquid crystal, a liquid crystal that exhibits a blue phase without using an alignment film may be used. When the temperature of a cholesteric liquid crystal is increased, the phase transitions from the cholesteric phase to the isotropic phase. The blue phase appears only in a narrow temperature range. To improve this, a liquid crystal composition containing several weight percent or more of a chiral agent is used in the liquid crystal layer. A liquid crystal composition containing a liquid crystal exhibiting a blue phase and a chiral agent has a short response time and optically isotropic In addition, the liquid crystal composition containing the liquid crystal exhibiting the blue phase and the chiral agent does not require alignment treatment. The viewing angle dependency is small. Also, no alignment film is required, so rubbing treatment is not required. Therefore, electrostatic breakdown caused by the rubbing treatment can be prevented. This reduces defects and damage to the liquid crystal display device during the manufacturing process.

[0405] In one embodiment of the present invention, a reflective liquid crystal element can be used in particular.

[0406] When a reflective liquid crystal element is used, a polarizing plate is provided on the display surface side. It is preferable to place a light diffusion plate on the display surface side, since this improves visibility.

[0407] [Light-emitting element] The light emitting element can be a self-luminous element that can be illuminated by current or voltage. This category includes devices with controlled brightness, such as LEDs, QLEDs, and organic EL devices. , inorganic EL elements, etc. can be used.

[0408] In one embodiment of the present invention, a top-emission light-emitting element can be used in particular as the light-emitting element. It is preferable to use a conductive film that transmits visible light for the electrode on the light extraction side. It is preferable to use a conductive film that reflects visible light for the electrode on the non-exposed side.

[0409] The EL layer has at least a light-emitting layer. The EL layer has a layer other than the light-emitting layer that has a high hole injection property. materials with high hole transporting properties, hole blocking materials, materials with high electron transporting properties, and electron injecting properties materials with high electron transporting and hole transporting properties, or bipolar materials (materials with high electron transporting and hole transporting properties), etc. The film may further include a layer containing

[0410] The EL layer can be made of either low molecular weight compounds or high molecular weight compounds. The layers constituting the EL layer may each be formed by a deposition method (including a vacuum deposition method). The layer can be formed by a method such as a transfer method, a printing method, an ink jet method, or a coating method.

[0411] When a voltage higher than the threshold voltage of the light-emitting element is applied between the cathode and anode, the EL layer is charged from the anode side. Holes are injected from the cathode side and electrons are injected from the cathode side. The injected electrons and holes are Upon recombination, the light-emitting material contained in the EL layer emits light.

[0412] When a white light emitting element is used as the light emitting element, two or more types of light emitting materials are used in the EL layer. For example, the light emitted from two or more luminescent materials has a complementary color relationship. White light can be obtained by selecting a light-emitting material so that These are luminescent materials that emit light in R (red), G (green), B (blue), Y (yellow), O (orange), etc. Among luminescent materials that emit light containing spectral components of two or more colors of R, G, and B, It is preferable that the spectrum of light emitted from the light-emitting element includes wavelengths in the visible light region. A light-emitting element having two or more peaks in a wavelength range (for example, 350 nm to 750 nm) is used. It is preferable to use a material having a peak in the yellow wavelength region. Preferably, the material has spectral components in the green and red wavelength regions as well.

[0413] The EL layer is made up of a light-emitting layer containing a light-emitting material that emits one color and a light-emitting layer containing a light-emitting material that emits another color. For example, a plurality of light-emitting layers in the EL layer may be stacked. The light-emitting materials may be stacked in contact with each other or may be stacked with an area that does not contain any light-emitting material interposed therebetween. For example, a fluorescent-emitting layer or a phosphorescent-emitting layer may be layered between the fluorescent-emitting layer and the phosphorescent-emitting layer. The phosphorescent layer contains the same materials as those of the phosphorescent layer (for example, a host material and an assist material) and A region that does not contain the material may be provided. This makes it easier to manufacture the light-emitting element. Also, the driving voltage is reduced.

[0414] The light-emitting element may be a single element having one EL layer, or a light-emitting element having multiple EL layers. A tandem element may be used in which the charge generating layers are stacked one on top of the other.

[0415] The above-mentioned light-emitting layer, the substance having a high hole injection property, the substance having a high hole transport property, and the electron The layer containing a substance having a high transport property, a substance having a high electron injection property, a bipolar substance, or the like is These include inorganic compounds such as quantum dots and polymer compounds (oligomers, dendrimers, polymers, etc.). For example, by using quantum dots in the light-emitting layer, It can also function as

[0416] The quantum dot materials include colloidal quantum dot materials, alloy quantum dot materials, and A shell-type quantum dot material, a core-type quantum dot material, etc. can be used. Materials containing elements from groups 12 and 16, 13 and 15, or 14 and 16 are used. Alternatively, cadmium, selenium, zinc, sulfur, phosphorus, indium, tellurium, lead Quantum dot materials containing elements such as gallium, arsenic, and aluminum may also be used.

[0417] The conductive film that transmits visible light is made of, for example, indium oxide, indium tin oxide, or indium It can be formed using zinc oxide, zinc oxide, zinc oxide doped with gallium, etc. Also, gold, silver, platinum, magnesium, nickel, tungsten, chromium, molybdenum, Metallic materials such as iron, cobalt, copper, palladium, or titanium, and alloys containing these metallic materials Gold or nitrides of these metal materials (for example, titanium nitride) can also be used to a degree that they have translucency. It can be used by forming it thin. Also, a laminated film of the above materials can be used as a conductive layer. For example, a laminated film of an alloy of silver and magnesium and indium tin oxide can be used. In this case, it is preferable to use graphene or the like, since the conductivity can be increased. .

[0418] The conductive film that reflects visible light is made of, for example, aluminum, gold, platinum, silver, nickel, or tungsten. Metallic materials such as zinc, chromium, molybdenum, iron, cobalt, copper, or palladium, or In addition, the above metal materials and alloys may contain lanthanum. Titanium, neodymium, germanium, etc. may be added. Alternatively, an alloy containing neodymium and aluminum (aluminum alloy) may be used. Also, an alloy containing silver and copper, palladium, or magnesium may be used. The aluminum film or the aluminum alloy is preferable because of its high heat resistance. By laminating a metal film or a metal oxide film in contact with the film, oxidation can be suppressed. Examples of materials for such metal films and metal oxide films include titanium and titanium oxide. Alternatively, the conductive film that transmits visible light may be laminated with a film made of a metal material. , a laminated film of silver and indium tin oxide, a laminated film of silver-magnesium alloy and indium tin oxide A layer film or the like can be used.

[0419] The electrodes may be formed by evaporation or sputtering. It is formed using a discharge method such as the ink jet method, a printing method such as the screen printing method, or a plating method. It can be achieved.

[0420] [Adhesive layer] The adhesive layer may be a photo-curable adhesive such as an ultraviolet curable adhesive, a reaction-curable adhesive, or a heat-curable adhesive. Various curing adhesives such as elastomeric adhesives and anaerobic adhesives can be used. epoxy resin, acrylic resin, silicone resin, phenolic resin, polyimide resin, imide Resin, PVC (Polyvinyl Chloride) Resin, PVB (Polyvinyl Butyral) Resin, EV A (ethylene vinyl acetate) resins, etc. In particular, epoxy resins, etc., which have high moisture permeability, A material with low viscosity is preferable. Two-component resin may also be used. An adhesive sheet or the like may also be used. It's fine.

[0421] The resin may also contain a desiccant. For example, an alkaline earth metal oxide (oxide Use a substance that absorbs water by chemical adsorption, such as calcium or barium oxide. Alternatively, materials such as zeolite and silica gel can absorb moisture by physical adsorption. If a desiccant is included, impurities such as moisture may penetrate into the element. This is preferable because it can suppress the occurrence of such a problem and improve the reliability of the display panel.

[0422] In addition, by mixing a filler with a high refractive index or a light scattering material into the resin, it is possible to improve the light extraction efficiency. For example, titanium oxide, barium oxide, zeolite, silica Co, etc. can be used.

[0423] [Connection layer] Anisotropic Conductive Film (ACF) is used as the connection layer. tive Film) and Anisotropic Conductive Paste (ACP) Inductive Paste) can be used.

[0424] [Colored layer] Materials that can be used for the coloring layer include metal materials, resin materials, pigments, and dyes. Examples include resin materials.

[0425] [Light blocking layer] Materials that can be used for the light-shielding layer include carbon black, titanium black, gold, Examples of the light-shielding layer include metals, metal oxides, and composite oxides including solid solutions of multiple metal oxides. The film may be a film containing a resin material, or may be a thin film made of an inorganic material such as a metal. For example, a laminated film of a film containing a material of a colored layer may be used as the light-shielding layer. A film containing a material used for a color layer that transmits light of a certain color and a material used for a color layer that transmits light of another color are used. By using the same material for the colored layer and the light-shielding layer, This is preferable because it allows the equipment to be standardized and the process to be simplified.

[0426] This concludes the explanation of each component.

[0427] [Variations] Below, an example will be described in which the display device has a partial configuration different from that illustrated in the above cross-sectional configuration example. The explanation of the overlapping parts will be omitted and only the differences will be explained.

[0428] [Variation 1 of Cross-Sectional Configuration Example] 32 is different from FIG. 30 in the configuration of the transistor and the configuration of the resin layer 202. 5 and 6. The difference is that it has a coloring layer 565, a light-shielding layer 566, and an insulating layer 567.

[0429] The transistor 401, the transistor 403, and the transistor 501 shown in FIG. In this way, the transistors provided in the circuit portion 364 and the circuit portion 366 The transistor for controlling the current flowing through the light emitting element 360 has a pair of gates. It is preferable to apply a transistor.

[0430] The resin layer 202 has an opening overlapping the liquid crystal element 529 and an opening overlapping the light emitting element 360. This allows the reflectance of the liquid crystal element 529 to be improved. do.

[0431] Further, a light-shielding layer 566 and a colored layer 565 are provided on the surface of the insulating layer 576 on the liquid crystal element 529 side. The colored layer 565 is provided to overlap the liquid crystal element 529. The display panel 200 can display in color. 9 and an opening that overlaps with the light-emitting element 360. This suppresses color mixing and realizes a display device with high color reproducibility.

[0432] [Variation 2 of Cross-Sectional Configuration Example] FIG. 33 shows an example in which top-gate transistors are used for each transistor. In this way, by using a top-gate transistor, the parasitic capacitance can be reduced. This allows the display frame frequency to be increased. The present invention can be suitably used for display panels.

[0433] [Variation 3 of Cross-Sectional Configuration Example] FIG. 34 shows a top-gate transistor having a second gate electrode in each transistor. An example of application is shown.

[0434] Each transistor has a conductive layer 591 overlapping the channel region. An insulating layer 475 or an insulating layer 578 is provided over 91 .

[0435] In addition, a part of the resin layer 201 is opened at the connection portion 506 of the display panel 200, and the A conductive layer 592 is provided to fill the opening. The conductive layer 592 is provided so that the surface (on the panel 100 side) is exposed. The FPC 374 is electrically connected to the exposed surface of the conductive layer 592 and the connecting layer 593. The conductive layer 592 is electrically connected to the conductive layer 591 through the conductive film 19. The conductive layer 592 can be formed as an electrode that can also be called a back electrode. It works like this.

[0436] Such a configuration can be realized by using a photosensitive organic resin for the resin layer 201. For example, when forming the resin layer 201 on the support substrate, an opening is formed in the resin layer 201. Then, a conductive layer 592 is formed to fill the opening. When the conductive layer 592 and the supporting substrate are peeled off at the same time, the conductive layer 592 and the supporting substrate are peeled off at the same time. Such a conductive layer 592 can be formed.

[0437] By adopting such a configuration, the FPC 3 connected to the display panel 200 located on the display surface side 74 can be placed on the opposite side of the display surface. When embedding the FPC374, the space required for bending the FPC374 can be eliminated, making the product more compact. This makes it possible to realize electronic devices that are

[0438] [Variation 4 of Cross-Sectional Configuration Example] FIG. 35 shows a display device having a different configuration from those shown in FIGS. 30 to 34, in which a display unit 762 and a circuit 1 shows an example of a cross section of a path portion 764.

[0439] The display panel has an insulating layer 820 between the substrate 751 and the substrate 761. and an insulating layer 820, the light-emitting element 760, the transistor 801, the transistor 805, the transistor 806, the transistor 807, the transistor 808, the transistor 809, the transistor 810, the transistor 811, the transistor 812, the transistor 813, the transistor 814, the transistor 815, the transistor 816, the transistor 817, the transistor 818, the transistor The insulating layer 820 and the substrate 761 are connected to each other through a liquid crystal display (LCD) 806 and a colored layer 734. The substrate 761 and the insulating layer 820 are bonded to each other by an adhesive layer 741. The substrate 751 and the insulating layer 820 are bonded together via an adhesive layer 742 .

[0440] The transistor 806 is electrically connected to the liquid crystal element 740, and the transistor 805 is The transistor 805 and the transistor 806 are both electrically connected to the element 760. Since the insulating layer 820 is formed on the surface of the substrate 751 side, these can be formed using the same process. It can be made.

[0441] The substrate 761 is provided with a colored layer 731, a light-shielding layer 732, an insulating layer 721, and a liquid crystal element 740. A conductive layer 713 functioning as an electrode, an alignment film 733b, an insulating layer 717, etc. are provided. The insulating layer 717 functions as a spacer to maintain the cell gap of the liquid crystal element 740. do.

[0442] On the substrate 751 side of the insulating layer 820, there are insulating layers 811, 812, 813, and Insulating layers such as 814 and insulating layer 815 are provided. The insulating layer 812, the insulating layer 813, and the insulating layer 814 function as gate insulating layers of the transistor. The insulating layer 814 is provided to cover each transistor. The insulating layers 814 and 815 function as planarization layers. Here, insulating layers 812, 813, and 814 are used as insulating layers covering the transistors and the like. Although the example shows a case where the layer 814 has three layers, the present invention is not limited to this and may have four or more layers. The insulating layer 814 that functions as a planarization layer may be a single layer or a double layer. , it does not have to be provided if not required.

[0443] In addition, the transistors 801, 805, and 806 are partially gate-coupled. A conductive layer 821 functions as a gate, and a conductive layer 82 partially functions as a source or a drain. 2, a semiconductor layer 831. Here, a plurality of layers obtained by processing the same conductive film are The same hatching pattern is used.

[0444] The liquid crystal element 740 is a reflective liquid crystal element. The liquid crystal element 740 includes a conductive layer 711a, a liquid crystal 7 12, and a conductive layer 713. A conductive layer 711b that reflects visible light is provided in contact with the opening 8. 51. The conductive layer 711a and the conductive layer 713 contain a material that transmits visible light. An alignment film 733a is provided between the liquid crystal 712 and the conductive layer 711a. An alignment film 733b is provided between the substrate 761 and the polarizer 13. It has 730.

[0445] In the liquid crystal element 740, the conductive layer 711b has a function of reflecting visible light, and the conductive layer 713 The light incident from the substrate 761 side is polarized by the polarizing plate 730. The light is polarized, passes through the conductive layer 713 and the liquid crystal 712, and is reflected by the conductive layer 711b. The light passes through the conductive layer 712 and the conductive layer 713 again and reaches the polarizer 730. The orientation of the liquid crystal is controlled by the voltage applied between 1b and the conductive layer 713, and the optical modulation of light is controlled. That is, the intensity of the light emitted through the polarizing plate 730 can be controlled. In addition, the colored layer 731 absorbs light outside of a specific wavelength range. The extracted light is, for example, red light.

[0446] The light emitting element 760 is a bottom emission type light emitting element. A laminated structure in which a conductive layer 791, an EL layer 792, and a conductive layer 793b are laminated in this order from the 820 side. The conductive layer 793a is provided to cover the conductive layer 793b. The conductive layer 791 and the conductive layer 793a contain a material that reflects visible light. The light emitted by the light emitting element 760 passes through the colored layer 734, the insulating layer 820, the opening 851, and the insulating layer 820. , and is emitted to the substrate 761 side via the conductive layer 713 and the like.

[0447] Here, as shown in FIG. 35, a conductive layer 711a that transmits visible light is provided in the opening 851. This allows the area overlapping with the opening 851 to be Since the liquid crystal 712 is oriented in the same manner as in the other regions, poor alignment of the liquid crystal occurs at the boundary between these regions. This can prevent unintended light leakage.

[0448] Here, a linear polarizer may be used as the polarizer 730 disposed on the outer surface of the substrate 761. However, a circular polarizer can also be used. For example, a linear polarizer and a 1 / 4 wavelength polarizer can be used as a circular polarizer. A laminate of retardation films can be used, which can suppress external light reflection. In addition, the cell gap of the liquid crystal element used in the liquid crystal element 740 can be adjusted depending on the type of polarizer. By adjusting the orientation, driving voltage, etc., a desired contrast can be achieved. stomach.

[0449] An insulating layer 817 is provided on the insulating layer 816 that covers the end portion of the conductive layer 791. The edge layer 817 acts as a spacer to prevent the insulating layer 820 and the substrate 751 from coming closer than necessary. The EL layer 792 and the conductive layer 793a function as a shielding mask (metal mask ) is formed, the function of preventing the shielding mask from coming into contact with the surface on which it is formed. Note that the insulating layer 817 does not have to be provided if it is not necessary.

[0450] One of the source and drain of the transistor 805 is connected to the light-emitting element 76 through a conductive layer 824. 0 conductive layer 791.

[0451] One of the source and the drain of the transistor 806 is connected to the conductive layer 711 through the connection portion 807. The conductive layer 711b and the conductive layer 711a are provided in contact with each other, and this Here, the connection portion 807 is formed by an opening provided in the insulating layer 820. This is a portion that connects the conductive layers provided on both sides of the insulating layer 820 together via the insulating layer 820 .

[0452] A connection portion 804 is provided in the area where the substrate 751 and the substrate 761 do not overlap. The connecting portion 804 is electrically connected to the FPC 772 via the connecting layer 842. The upper surface of the connecting portion 804 has the same structure as the conductive layer 711a. The conductive layer obtained by processing the first conductive film is exposed. C772 can be electrically connected via a connection layer 842.

[0453] A connecting portion 852 is provided in a portion of the area where the adhesive layer 741 is provided. 2, a conductive layer obtained by processing the same conductive film as the conductive layer 711a, and a conductive layer 713 A part of the wiring is electrically connected by the connector 843. A signal input from an FPC 772 connected to the substrate 751 side is input to the formed conductive layer 713. or a potential can be supplied via connection 852.

[0454] The above is a description of the modified example.

[0455] This embodiment may be appropriately combined with at least a part of another embodiment described in this specification. It can be implemented in combination.

[0456] (Sixth embodiment) Hereinafter, a CAC(Cl) compound that can be used in a transistor disclosed in one embodiment of the present invention will be described. oud-Aligned Composite)-OS(Oxide Semicond This section explains about CAC-metal oxide.

[0457] In this specification, metal oxide is a broad term referring to metal oxides. Metal oxides are oxides. Metal oxides are oxide insulators and oxide conductors (including transparent oxide conductors). , oxide semiconductors (also called "OS"), For example, when a metal oxide is used in the active layer of a transistor, the metal oxide In other words, when describing an OS FET, In other words, the transistor can be a transistor including a metal oxide or an oxide semiconductor.

[0458] In this specification and the like, metal oxides containing nitrogen are also referred to as metal oxides. Nitrogen-containing metal oxides are also called metal oxynitrides (met). It may also be called hydroxybenzoxanthate (hydroxybenzoxanthate).

[0459] In this specification, CAAC (c-axis aligned crystal ), and CAC (cloud-aligned composite) CAAC represents an example of a crystal structure, and CAC represents an example of a function or material configuration. Represents.

[0460] An example of the crystal structure of an oxide semiconductor or a metal oxide will be described below. n-Ga-Zn oxide target (In:Ga:Zn=4:2:4.1 [atomic ratio]) The oxide semiconductor film formed by sputtering will be described as an example. Using a get, the substrate temperature is set to 100°C or higher and 130°C or lower, and the sputtering method is used. The oxide semiconductor formed is called sIGZO, and the substrate temperature is set to room temperature using the above target. (RT), and the oxide semiconductor formed by sputtering is called tIGZO. For example, sIGZO can be used in either nc (nano crystal) or CAAC. tIGZO has either one or both of the crystal structures. tIGZO has the nc crystal structure. The room temperature (RT) mentioned here includes the temperature when the substrate is not intentionally heated.

[0461] In this specification and the like, CAC-OS or CAC-metal oxide means Some materials have the function of a conductor, while other materials have the function of a dielectric (or insulator). The material as a whole functions as a semiconductor. When tal oxide is used in the active layer of a transistor, the conductor acts as a carrier. The dielectric has the function of preventing the flow of electrons (or holes), while the dielectric has the function of preventing the flow of electrons that serve as carriers. The function as a conductor and the function as a dielectric are complementary to each other. By doing so, the switching function (On / Off function) can be set to CAC-OS or C It can be attached to AC-metal oxide. CAC-OS or CAC-m By separating the functions of each compound in the acetal oxide, both functions can be maximized. can be increased to the limit.

[0462] In this specification and the like, CAC-OS or CAC-metal oxide is a The conductive region has the function of the conductor described above, and the dielectric region has the function of the dielectric. The region has the above-mentioned dielectric function. Also, in the material, there are conductive regions and dielectric regions. The regions may be separated at the nanoparticle level. The conductive regions may be unevenly distributed in the material. They may be observed connected in a similar manner.

[0463] That is, CAC-OS or CAC-metal oxide is a matrix composite material. (matrix composite), or metal matrix composite It can also be called a matrix composite.

[0464] In addition, in the CAC-OS or CAC-metal oxide, a conductive region and a dielectric region are The conductive regions are each 0.5 nm to 10 nm, preferably 0.5 nm to 3 nm. The following sizes may be dispersed in the material:

[0465] The OS preferably contains at least indium, and particularly contains indium and zinc. In addition to these, aluminum, gallium, yttrium, copper, Vanadium, beryllium, boron, silicon, titanium, iron, nickel, germanium, Zr, molybdenum, lanthanum, cerium, neodymium, hafnium, tantalum, tantalum It may contain one or more selected from the group consisting of gusten, magnesium, etc. stomach.

[0466] For example, CAC-OS made of In-Ga-Zn oxide (In-Ga-Zn oxide among CAC-OS) α-Zn oxide may be specifically referred to as CAC-IGZO. (Hereinafter, InO X1 (X1 is a real number greater than 0) or indium zinc oxide In X2 Zn Y2 O Z2 (X2, Y2, and Z2 are real numbers greater than 0) ) and gallium oxide (hereinafter referred to as GaO X3 (X3 is a real number greater than 0) . ), or gallium zinc oxide (Ga X4 Zn Y4 O Z4 (X4, Y4, and Z4 is a real number greater than 0.) The material is separated into two parts, forming a mosaic pattern. Mosaic InO X1 , or In X2 Zn Y2 O Z2 is uniformly distributed in the film This is a cloud-like configuration (hereinafter also referred to as "cloud-like").

[0467] In other words, CAC-OS is X3 The region where In is the main component and X2 Zn Y2 O Z2 , or InO X1 A composite oxide semiconductor having a structure in which a region in which In this specification, for example, the atomic ratio of In to the element M in the first region is is greater than the atomic ratio of In to the element M in the second region. Compared to region 2, the concentration of In is higher.

[0468] IGZO is a common name and refers to a compound of In, Ga, Zn, and O. A typical example is InGaO3(ZnO) m1 (m1 is a natural number), or In( 1+x0) Ga (1-x0) O3(ZnO) m0 (-1≦x0≦1, m0 is an arbitrary number) Examples of such crystalline compounds include:

[0469] The crystalline compound has a single crystal structure, a polycrystalline structure, or a CAAC structure. The CAAC structure is a structure in which multiple IGZO nanocrystals have a c-axis orientation and are aligned in the ab plane. is a non-oriented connected crystal structure.

[0470] On the other hand, CAC-OS refers to the material structure of an oxide semiconductor. In a material composition containing Ga, Zn, and O, some nanoparticles with Ga as the main component were observed. The region where the In nanoparticles are observed is shown in part. This refers to a structure in which the pixels are randomly distributed in a mosaic pattern. The crystal structure is a secondary factor.

[0471] It should be noted that the CAC-OS does not include a laminated structure of two or more films with different compositions. For example, a structure consisting of two layers, one containing In as the main component and the other containing Ga as the main component, is not included. do not have.

[0472] In addition, GaO X3 The region where In is the main component and X2 Zn Y2 O Z2 , or InO X1 but In some cases, a clear boundary between the main component region and the main component region cannot be observed.

[0473] Instead of gallium, aluminum, yttrium, copper, vanadium, and beryllium can be used. , boron, silicon, titanium, iron, nickel, germanium, zirconium, molybdenum , lanthanum, cerium, neodymium, hafnium, tantalum, tungsten, or magnesium If one or more selected elements such as sodium are included, CAC-OS will The nanoparticle-like regions are observed in the region where the metal element is the main component, and the region where In is the main component. The nanoparticle-like regions are randomly dispersed in a mosaic pattern. say.

[0474] CAC-OS is formed by sputtering without intentionally heating the substrate. In addition, when the CAC-OS is formed by a sputtering method, the deposition gas is The gas is selected from an inert gas (typically argon), oxygen gas, and nitrogen gas. One or more of these may be used. The lower the flow rate ratio of the gas, the more preferable. For example, the flow rate ratio of oxygen gas is preferably 0% or more and less than 30%. It is more preferable to set the content to 0% or more and 10% or less.

[0475] CAC-OS is a type of X-ray diffraction (XRD) measurement method. When measured using the θ / 2θ scan by the out-of-plane method, In other words, from the X-ray diffraction, the measurement region It can be seen that no orientation in the ab plane direction or the c axis direction is observed.

[0476] In addition, the CAC-OS uses an electron beam with a probe diameter of 1 nm (also called a nanobeam electron beam). In the electron diffraction pattern obtained by irradiating the Therefore, from the electron diffraction pattern, it is clear that the CAC-O The crystal structure of S is nc (nano) which has no orientation in the plane direction and cross-sectional direction. It can be seen that it has a (-crystal) structure.

[0477] For example, in the case of CAC-OS, an In-Ga-Zn oxide, energy dispersive X-ray Energy Dispersive X-ray spectroscopy (EDX) EDX mapping obtained using a copy of the GaO X3 The region where is the principal component and , In X2 Zn Y2 O Z2 , or InO X1 The area where the main component is unevenly distributed and mixed. It can be confirmed that it has the structure shown in the figure.

[0478] CAC-OS has a structure different from that of IGZO compounds, in which metal elements are uniformly distributed. CAC-OS has different properties from ZO compounds. X3 The main ingredients are In a certain area, X2 Zn Y2 O Z2 , or InO X1 The region where is the principal component and The phases are separated into two, and the regions containing each element as the main component are arranged in a mosaic pattern.

[0479] Here, In X2 Zn Y2 O Z2 , or InO X1 The region where is the main component is GaO X3 This region has higher conductivity than the region where In is the main component. X2 Zn Y 2O Z2 , or InO X1The carriers flow through the region where the main component is oxidized. Therefore, the conductivity of In is expressed as a semiconductor. X2 Zn Y2 O Z2 , or In O X1 The region where the main component is distributed in a cloud-like shape in the oxide semiconductor allows for a high electric field. Effective mobility (μ) can be achieved.

[0480] On the other hand, GaO X3 The region where the main components are In X2 Zn Y2 O Z2 , or InO X This region has higher insulating properties than the region where GaO is the main component. X3 etc. The distribution of the main component in the oxide semiconductor suppresses leakage current and provides good switching. Switching operation can be realized.

[0481] Therefore, when CAC-OS is used in a semiconductor device, GaO X3 Insulation caused by And, In X2 Zn Y2 O Z2 , or InO X1 The conductivity caused by the This results in a high on-state current (I on ) and high field-effect mobility (μ) This can be done.

[0482] Furthermore, semiconductor devices using CAC-OS have high reliability. This is ideal for various semiconductor devices including displays.

[0483] This embodiment may be appropriately combined with at least a part of another embodiment described in this specification. It can be implemented in combination. [Explanation of symbols]

[0484] 10. Cabinet 11 Display device 11a Display area 11b Display area 11c Display area 11d display area 12a side 12b side 12c side 12d side 12e side 13a Icon 13b Notification information 13c Icon 14 PCB Around 15a Around 15b 16a FPC 16b FPC 16c FPC 17 IC 18 Drive circuit 19 Touch Sensor 21 Light 22 Reflected light 25 areas 26 dashed line 27 Wiring 29a Lamp 29b Camera 29c audio equipment 29d Strap hole 30a pixel unit 30b pixel unit 30c pixel unit 30d pixel unit 30e pixel unit 30f pixel unit 31 Display element 31B Display element 31G display element 31p pixels 31R display element 32 Display element 32B display element 32G display element 32p pixels 32R display element 32Y display element 35r light 35t light 35tr light 41 layers 42 layers 43 areas 50 Adhesive layer 51 Adhesive layer 52 Adhesive layer 60a housing 60b case 61 Display device 61a Display area 61b Display area 61c display area 61d display area 61e display area 61f display area 61g display area 61h display area 61i display area 61j Display area 62a side 62b side 62c side 62d side 62e side 62f side 62g side 62h side 62i side 62j side 63a Icon 63b Notification information 63c Icon 63d Notification information 64 boards Around 65a Around 65b Around 65c 65d side Around 65e 66a FPC 66b FPC 66c FPC 67 IC 68a Drive circuit 68b Drive circuit 69 Touch Sensor 81 areas 82 areas 100 Display Panel 101 Resin layer 102 Resin layer 110 Transistor 110a transistor 110b transistor 110c transistor 111 Conductive layer 112 Semiconductor layer 113a conductive layer 113b Conductive layer 114 Conductive layer 115 Conductive layer 120 Light-emitting element 121 Conductive layer 122 EL layer 123 Conductive Layer 131 Insulating layer 132 Insulating layer 133 Insulating Layer 134 Insulating Layer 135 Insulating Layer 136 Insulating Layer 137 Insulating Layer 141 Insulating layer 151 Adhesive layer 152 Colored layer 153 Light blocking layer 200 Display Panel 201 Resin layer 202 Resin layer 204 Insulation layer 210 Transistor 211 Conductive layer 212 Semiconductor layer 213a conductive layer 213b Conductive layer 220 Liquid crystal element 221 Conductive layer 222 LCD 223 Conductive Layer 224a Alignment film 224b Alignment film 225 areas 231 Insulating layer 232 Insulating layer 233 Insulating Layer 234 Insulating Layer 300 display device 311 Electrode 311b electrode 340 Liquid Crystal Devices 351 Circuit Board 360 Light-emitting element 360b Light-emitting element 360g light emitting element 360r light emitting element 360w light emitting element 361 PCB 362a Display 362b Display section 362c display 364 Circuit section 365 Wiring 366 Circuit section 367 Wiring 372 FPC 373 IC 374 FPC 375 IC 400 display device 401 Transistor 402 transistor 403 Transistor 405 Capacitor 406 Connection 407 Wiring 410 pixels 411 Insulating layer 412 Insulating layer 413 Insulating Layer 414 Insulating Layer 415 Insulation Layer 416 Spacer 417 Adhesive layer 419 Connection Layer 421 Electrode 422 EL layer 423 Electrode 424 Optical adjustment layer 425 Colored layer 426 Light blocking layer 451 Aperture 475 Insulation Layer 476 Insulating Layer 478 Insulating Layer 501 Transistor 503 Transistor 505 Capacitor 506 Connection 511 Insulating layer 512 Insulation layer 513 Insulating Layer 514 Insulating layer 517 Adhesive layer 519 Connection Layer 529 Liquid crystal element 543 Connectors 562 Electrode 563 LCD 564a Alignment film 564b Alignment film 565 Colored layer 566 Light blocking layer 567 Insulating Layer 572 PCB 576 Insulating Layer 578 Insulating Layer 591 Conductive Layer 592 Conductive layer 599 Polarizing Plate 611 Substrate 612 PCB 711a conductive layer 711b Conductive layer 712 LCD 713 Conductive Layer 717 Insulation Layer 721 Insulation Layer 730 Polarizing Plate 731 Colored layer 732 Light blocking layer 733a Alignment film 733b Alignment film 734 Colored layer 740 Liquid Crystal Devices 741 Adhesive layer 742 Adhesive layer 751 PCB 760 Light-emitting element 761 Circuit Board 762 Display section 764 Circuit section 772 FPC 791 Conductive Layer 792 EL layer 793a Conductive layer 793b Conductive layer 801 transistors 804 Connection 805 transistor 806 Transistor 807 Connection 811 Insulation layer 812 Insulation layer 813 Insulation layer 814 Insulating layer 815 Insulation layer 816 Insulating layer 817 Insulation layer 820 Insulation layer 821 Conductive layer 822 Conductive layer 824 Conductive layer 831 Semiconductor layer 842 Connection Layer 843 Connector 851 Aperture 852 Connection

Claims

[Claim 1] A display device having a first display area and a second display area, the first display area and the second display area are provided adjacent to each other, the first display area has a first pixel; the second display area has second pixels; the first pixel has a first display element and a second display element; the second pixel has a third display element; the first display element has a function of reflecting visible light, the second display element and the third display element have a function of emitting visible light, A display device in which a polarizing plate is provided in the first display region.

Images