Display device

Abstract

To solve the problem in which: when a base film used in flexible display panels is bonded to a resin member used to fix the base film in a bent state, a wrinkle may occur in the base film before and after thermal shock at a change in an environment such as temperature due to a difference in linear expansion coefficient.SOLUTION: A thin, flexible buffer plate is placed between a base film and a resin member used for a flexible display panel. By utilizing a heat radiation effect and a heat equalization effect of the buffer plate, a panel periphery structure that can withstand a change in an environment such as temperature may be provided.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] One embodiment of the present invention relates to a display device or a lighting device that displays an image.

[0002] Note that one embodiment of the present invention is not limited to the above technical fields. The technical field of one aspect relates to an article, a method, or a manufacturing method. One aspect of the present invention is a process, machine, manufacture, or composition. Therefore, the invention disclosed herein more specifically relates to The technical field of one embodiment of the present invention is a semiconductor device, a display device, a light-emitting device, a lighting device, a power storage device, Examples include storage devices, methods for driving them, and methods for manufacturing them. Cut.

[0003] In this specification, a semiconductor device is a device that can function by utilizing semiconductor characteristics. The term "semiconductor device" refers to devices in general, and electro-optical devices, semiconductor circuits, and electronic equipment are all semiconductor devices. [Background technology]

[0004] In recent years, there has been a demand for larger and more diverse display devices. Waterproof television sets are also becoming more common, allowing people to enjoy video displays in the bathroom or at home. Also, home television equipment (also called television or television receiver), Digital signage and PID (Public Identification Number) Digital Information Displays (DDIs) are also becoming popular. In the case of signage and PID, the larger the size, the more information can be provided. In addition, when used for advertising, the larger the size, the more people will notice it, and the greater the advertising effect. It is expected to increase

[0005] Most popular television sets are liquid crystal display devices that use glass substrates. .

[0006] In addition, organic EL (Electroluminescent) displays are representative of display devices that can replace liquid crystal displays. Luminescence elements and light-emitting diodes (LEDs) a light-emitting device equipped with a light-emitting element such as a light-emitting diode, and a display device using an electrophoresis method, etc. These display devices are lightweight and have a transparent substrate, rather than a glass substrate. It can also be made using thin plastic film (also called plastic sheet). can.

[0007] For example, the basic structure of an organic EL element is a layer containing a light-emitting organic compound between a pair of electrodes. By applying a voltage to the organic EL element, a light-emitting organic compound The display device to which such an organic EL element is applied is thin, A lightweight, high-contrast, and low-power-consumption display device can be realized.

[0008] In addition, development is underway to replace some of the instrument displays in automobiles with LCD displays. In addition, more information (such as information about the surroundings of the vehicle, traffic information, and geographical information) is available. In order to utilize this information, efforts are being made to support drivers of automobiles and other vehicles by using in-vehicle displays. It has been done.

[0009] LCD displays are increasingly being installed inside public transport vehicles (trains, buses, etc.). are.

[0010] Patent Document 1 discloses a flexible display panel with a backplane between a curved, belt-shaped holding structure and the flexible display panel. A terry (with an aluminum thin film exterior) is placed.

[0011] Patent Document 2 describes a method for forming a flexible display panel by inserting a print head between a curved belt-shaped holding structure and a flexible display panel. A bracelet-type display device is disclosed in which a main board and a battery are disposed.

[0012] In addition, Patent Document 3 discloses a display device that combines a curved flexible display panel. is shown. [Prior art documents] [Patent documents]

[0013] [Patent Document 1] Patent Publication No. 2015-38868 [Patent Document 2] Patent Publication No. 2015-187858 [Patent Document 3] Patent Publication No. 2016-167049 Summary of the Invention [Problem to be solved by the invention]

[0014] To provide an electronic device with a novel structure, specifically, to be used in various places, for example, inside a vehicle. The present invention provides an electronic device with a novel structure that can be installed anywhere.

[0015] Flexible display panels are formed on thin flexible films and are made of organic light-emitting elements. The thin flexible film is soft, so it can be hung up like a poster. However, if an optical film such as a polarizing film is attached to the display surface, warping or bending may occur. There is a risk that this may happen.

[0016] The thin flexible display panel can be embedded in the device housing, car, wall, etc. However, it is preferable to fix it to a member, and the surface of the member has at least a curved surface. This flexible display can give a different impression to the design of conventional display devices. The member that fixes the display panel can also be called a housing.

[0017] Depending on the material of the component to be fixed, the coefficient of thermal expansion (hereafter referred to as the linear expansion coefficient) may vary greatly. There is a risk of wrinkles forming on the flexible film due to changes in the environment. When acrylic is used as the material, the linear expansion coefficient of acrylic (linear expansion coefficient of acrylic is approximately 7 × 10 - 5 / ℃) and the linear expansion coefficient of the flexible film (the linear expansion coefficient of PET is approximately 17.1 × 10 - 5 / ℃), there is a risk of wrinkles occurring on the display panel and its surrounding area. There is a risk of distortion or wrinkling due to heat generation caused by the elements and changes in air pressure. [Means for solving the problem]

[0018] When materials with different linear expansion coefficients are fixed with adhesive or double-sided tape, the operating environment changes. For example, when the temperature inside a car rises in the summer and then drops due to the use of the air conditioner, the difference in the linear expansion coefficient The resulting thermal strain causes the material to change state. If you use adhesive or double-sided tape to fix the display panel and the parts you are going to install, heat Repeated exposure to shock can cause the flexible film to deform, resulting in a loss of quality as a display panel. Therefore, even if it is repeatedly exposed to such thermal shock, the quality is deteriorated. A buffer plate that reduces the stress on the flexible film is attached to the flexible film of the display panel. It is installed between the film and the component.

[0019] For example, a display panel using a flexible film as a component of a car dashboard. Consider the case where a car dashboard is installed. The linear expansion coefficient of PP resin is approximately 10 x 10 -5 / ℃ or more approx. 12×10 -5 / ℃ or less) , ABS resin (The linear expansion coefficient of ABS resin is approximately 7 x 10 -5 / ℃ or more approx. 13×10 -5 / ℃ (See below), acrylonitrile styrene resin, urethane resin, etc. The dashboard has a curved surface. The display panel is attached to fit this curved surface. When assembling the display panel, one side of the buffer plate is attached to the curved surface of the component, and then the display panel is attached to the other side of the buffer plate. It can withstand thermal shock if heated.

[0020] One aspect of the present invention is a method for manufacturing a light-emitting device comprising: forming an organic light-emitting element on a film made of a first organic resin material; The organic resin material has a member made of a second organic resin material having a different linear expansion coefficient, and a buffer plate. The member has a curved surface in part and has a region with a different thickness, and a buffer plate is provided on the curved surface of the member to provide a gentle The display device has a film made of a first organic resin material on a shock plate.

[0021] The buffer plate must be thick enough to bend along the curved surface of the component, and must be between 0.1mm and 2.5mm. The curved surface of the housing and the metal film should be attached with adhesive or double-sided tape. The metal film is fixed more firmly to the substrate film of the flexible display panel by adhesive or double-sided tape. Secure with a tape.

[0022] The material used for the buffer plate is stainless steel (the linear expansion coefficient of stainless steel is approximately 17.3 x 10 -6 / ℃ ), aluminum (the linear expansion coefficient of aluminum is approximately 23 x 10 -6 / ℃), copper (copper linear expansion The rate is approximately 16.8 x 10 -6 / ℃), silver (the linear expansion coefficient of silver is approximately 18.9 x 10 -6 / ℃), gold (The linear expansion coefficient of gold is approximately 14.3 x 10 -6 / ℃), iron (iron's linear expansion coefficient is approximately 11.7×10 - 6 / ℃), titanium (the linear expansion coefficient of titanium is approximately 8.4×10 -6 / ℃), molybdenum (molyb The linear expansion coefficient of the den is approximately 4.9 x 10 -6 / ℃), tungsten (the linear expansion rate of tungsten is Approximately 4.3×10 -6 / ℃), platinum (the linear expansion coefficient of platinum is approximately 9×10 -6 / ℃), In this specification, the TMA method (thermo-mechanical analysis method) is used. The evaluation of the average linear expansion coefficient in a certain temperature range obtained by the film thickness is used as the basis. When the material is thin or has low mechanical strength, evaluation using the conventional TMA method reveals that the material changes due to factors other than heat. Depending on the material, glass transition may occur. The linear expansion coefficient may change depending on the temperature.

[0023] In addition to the above configuration, the device further includes a printed circuit board having a drive circuit, A buffer plate and a member are provided between the film made of the first organic resin material and the printed circuit board. is electrically connected to the organic light emitting element via a flexible printed circuit board.

[0024] Devices with curved displays tend to be large due to their curved surfaces, Especially when miniaturizing, a printed circuit board equipped with a driver IC etc. is used as a flexible display panel. When placed on the back of the panel, it becomes compact and also serves as a fixing member. When using high frequency circuits that are prone to generating electromagnetic noise, the buffer plate acts as a shield. If a buffer plate is used as a shield, the buffer plate should be at ground potential (ground It is preferable to set the potential at a value lower than the reference potential.

[0025] In each of the above configurations, the materials used are acrylic, polypropylene, polyvinyl chloride, poly Carbonate, polyamide, etc. In addition, when the member is made of a resin material, the resin material Some ingredients may expand when they absorb moisture.

[0026] In addition, in order to further reduce the weight of the components, slits and thin-walled parts (grooves, recesses, etc.) are provided. Also, flexibility may be imparted by providing slits or thin-walled portions in the member.

[0027] The member may be divided into a plurality of parts. For example, a guide portion may be provided between the printed circuit board and the flexible display panel. This prevents damage such as breakage due to excessive loads being applied to the bending points of the flexible printed circuit board. The flexible printed circuit board may be deformed by being pressed against other parts. This may cause a physical overload, resulting in damage, or the connection with the external terminal may come off. do.

[0028] In addition, a guide is provided to store the flexible printed circuit board compactly. A part of the flexible display panel is changed in direction along the guide section, and the flexible printed circuit board is inserted. By connecting the flexible printed circuit board to the display panel, the flexible printed circuit board protrudes outside the display panel. By minimizing the length of the flexible printed circuit board, Although this is one of the solutions, there will be excess length when considering the manufacturing margin. The flexible printed circuit board curls and protrudes. In this case, curling or twisting of the flexible printed circuit board may occur unintentionally.

[0029] Another configuration disclosed in this specification is a method for forming an organic light-emitting element on a film made of an organic resin material. a terminal electrically connected to the organic light-emitting element; and a flexible printed circuit board that is in contact with and connected to the terminal. and a printed circuit board connected to the flexible printed circuit board, and made of an organic resin material. A part of the film overlaps with the member having a flat surface via a buffer plate, and the film is The plate is almost parallel to the plate, and the other part overlaps with the guide part, and the plane of the guide part is the plane of the member. It is almost vertical, and the plane of the guide part overlaps with the part that contacts the flexible printed circuit board and the terminal. The display device has a curved surface of the guide portion with a curvature radius of 5 mm or more.

[0030] In this specification, the term "film" refers to a thin film of 200 μm or less that is made mainly of polymeric materials. It refers to a membrane-like material. To distinguish it from a film, anything thicker than 200 μm is called a sheet. Although it is generally called "fiber sieve," in this specification, it is mainly made of polymeric raw materials and is less than 0.5 mm. If so, we'll call it a film.

[0031] Also, metal plates used for buffer plates are sometimes called foils when they are thin. For example, JIS The standard states that the thickness of aluminum foil must be between 0.006 mm and 0.2 mm. When metal materials such as aluminum are vapor-deposited on a film made of polymeric materials, It is also called aluminum laminate film and can be used as a buffer board.

[0032] In addition, the image display on the flexible display panel uses a storage capacitor connected to the organic light-emitting element. Thin flexible films are too thin, for example, less than 100 μm. Therefore, if it is stacked on other electronic elements such as a printed circuit board, it will affect the storage capacitance. Therefore, it is necessary to use an organic light-emitting element and a plate. The shortest distance between the electrode and the print substrate is at least 150 μm. If the shortest distance between the element and the electrode on the printed circuit board is less than 150 μm, the displayed image will be distorted. do.

[0033] It is preferable that the light-emitting layers of the light-emitting elements of each color are separate from each other. Since the device is formed using multiple display panels, the size of each display panel is relatively small. This allows for increased metal mask alignment accuracy, This allows for an increase in the yield of the separation. This can be said to be advantageous in that respect.

[0034] The light emitting element may have either a bottom emission structure or a top emission structure. In particular, it is preferable to use a light emitting element with a top emission structure.

[0035] The flexible display panel can also be used for the interior or exterior walls of houses or buildings, or for the interior or exterior of automobiles. It is also possible to incorporate it along the curved surface of the exterior. For example, it can be made to fit the desired shape using a 3D printer. A member having a shape is formed, and a buffer plate is provided between the member and the flexible display panel. When using a 3D printer, the parts are AB S resin, PLA resin, epoxy resin, etc. are used.

[0036] When installing in a vehicle, it is preferable that the impact of temperature stress is minimal, especially when exposed to high temperatures. The configuration of the present invention is effective in a vehicle interior where it is easy to get lost. This allows for a lighter weight than conventional systems, and the LCD screen will remain intact even if it is damaged in a collision between two cars. Unlike display devices, the device does not use a glass substrate, so passengers will not be injured. [Effects of the Invention]

[0037] A display device with a novel structure that can be installed in various locations, such as inside a vehicle. can be provided.

[0038] When installed inside a car, it provides a wide display area for drivers and other users. By utilizing the information displayed on a wide display area, the driver can ensure safe driving. It is possible. [Brief explanation of the drawings]

[0039] [Figure 1] 1 is a schematic cross-sectional view of a display device illustrating one embodiment of the present invention. [Figure 2] FIG. 1 is a schematic cross-sectional view illustrating another example of one embodiment of the present invention. [Figure 3] 1A and 1B are a perspective view and a cross-sectional view of a display device illustrating one embodiment of the present invention. [Figure 4] 1A and 1B are diagrams illustrating examples of a display device according to one embodiment of the present invention that is mounted on a vehicle. [Figure 5] 1A to 1C are cross-sectional views illustrating an example of a method for manufacturing a display panel. [Figure 6] 1A to 1C are cross-sectional views illustrating an example of a method for manufacturing a display panel. [Figure 7] 1A and 1B are a top view and a cross-sectional view illustrating an example of a display panel. [Figure 8] FIG. 1 is a cross-sectional view showing an example of a display device. [Figure 9] FIG. 1 is a cross-sectional view showing an example of a display panel. [Figure 10] 1A to 1C illustrate a display panel and a display device according to a first embodiment. [Figure 11] FIG. 1 is a design drawing of a member according to a first embodiment. [Figure 12] 1 is a design drawing and photograph of a component of Example 1. [Figure 13] FIG. 2 is a photograph of the display panel of the first embodiment as seen from the side. [Figure 14] 1A and 1B are perspective views showing the sample configuration of the experiment and photographs of the experiment results. [Figure 15] FIG. 2 is a photograph showing the display device of the first embodiment. [Figure 16] 1 is a cross-sectional view showing the sample configuration of the experiment and a photograph of the experiment results (Comparative Example). DETAILED DESCRIPTION OF THE INVENTION

[0040] Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. The present invention is not limited to the following description, and various modifications in form and details are possible by those skilled in the art. Furthermore, the present invention should not be construed as being limited to the description of the following embodiments. It is not something that can be done.

[0041] (Embodiment 1) In this embodiment, a structural example and an application example of a display device according to one embodiment of the present invention will be described with reference to drawings. Please refer to the following for explanation.

[0042] In order to fix a flexible display panel to a part of a curved housing, Between the panel and the housing, a buffer plate made of a curved member and metal is provided. In the case of a vehicle, the housing is part of the dashboard, and the installed display panel is also included in the dashboard. In this specification, the dashboard is the area below the front window. It refers to the entire interior parts (including instruments and display devices) located in front of the driver's seat. It is also called the instrument panel.

[0043] FIG. 1 is a cross-sectional view showing an example in which a display panel 100 is installed on a member 501 having a curved surface.

[0044] The display device shown in FIG. 1 includes a curved member 501, a buffer plate 500, and a display panel 100. , a flexible printed circuit board (called FPC) 112, a printed circuit board 505, and a guide The electrode 502 has electrode portions 502a and 502b.

[0045] The display panel 100 uses an organic resin film as a substrate, and the display element of the display panel 100 When an organic light-emitting element is used as a display, reducing the thickness of the film reduces the tonality in the display area. It is also possible to realize a display panel 100 with a barrel thickness of 1 mm or less.

[0046] Furthermore, when the display panel 100 is provided with a touch input function, When the display panel 100 is pressed, the member 501 overlapping the display panel 100 supports the display panel 100 so that the user can press the display panel. The supporting member 501 is made of a hard material that gives a repulsive force when pressed with a finger. This prevents the display panel 100 from being broken even when pressed with a finger.

[0047] The member 501 is made of acrylic, polypropylene, polyvinyl chloride, polycarbonate, polyamide, The use of organic resins in this way is preferable because it allows for weight reduction.

[0048] When the member 501 and the film of the display panel 100 are fixed in contact with each other, the difference in the linear expansion coefficient of the materials Wrinkles occur when there is a change in temperature.

[0049] Here, the display panel 100 is attached to the flat acrylic plate 20 using double-sided tape. The cross-sectional perspective view of the sample is shown in Figure 16(A), and the results of a storage test in which thermal shock was applied are shown in Figure 1. 16(B) and 16(C). FIG. 16(B) shows a display panel mounted on a flat acrylic plate 20. Fig. 16(C) is a photograph of the surface immediately after the adhesive tape was attached to the surface of the glass substrate. Fig. 16(D) is a photograph of the surface immediately after the adhesive tape was attached to the glass substrate. Fig. 16(C) is a photograph of the sample after storage at 0°C for 12 hours and then at room temperature. As shown in Figure 1, wrinkles were formed after the storage test, and the appearance changed significantly.

[0050] Therefore, in this embodiment, as shown in FIG. 1, a curved member 501 and a display panel 10 1, a buffer plate 500 is provided. There is an adhesive layer such as double-sided tape between it and 0.

[0051] The thickness of the buffer plate 500 is 0.1 mm or more and 2.5 mm or less, and depending on the material, it may be machined. It is preferable to perform the above-mentioned process to form a shape that matches the curved surface of the member 501. Aluminum is a 0.5mm thick aluminum plate, which is a low-cost and inexpensive material. This thickness is flexible, so if you attach it to the member 501 with double-sided tape, The aluminum plate can be deformed to a shape that conforms to the curved surface of the component.

[0052] By providing the buffer plate 500, the occurrence of wrinkles as shown in FIG. 16(C) due to thermal shock is suppressed. When an aluminum plate is used, the buffer plate 500 can be called a heat buffer plate, and the display panel Even if the elements of the module 100 generate heat, the heat can be diffused and uniformly distributed or dissipated. When a stress is applied, the buffer plate 500 absorbs the stress applied to the member 501 and the display panel 100. It may be relaxed.

[0053] If the member 501 is made of the same metal material as the buffer plate 500, the buffer plate can be omitted without causing thermal shock. Although the occurrence of wrinkles can be suppressed, the total weight of the member 501 increases, and the display device also becomes heavy.

[0054] When installing a display device inside a car, it must be secured with screws to the frame that maintains the rigidity of the car body. In this case, the display device is fitted into a fixed frame or fixed to the frame with screws. If the weight is heavy, the load is concentrated on the fixed frame, so the display device including the member 501 In automobiles, the weight of the device should be light. Therefore, the light weight of the display device allows for flexible installation anywhere. The display panel is useful.

[0055] In addition, the display panel 100 shown in FIG. 1 has a curvature center on the right side in the area overlapping with the buffer plate. The surface has a radius of curvature greater than 700 mm, but in other areas The center of curvature is on the left side of the curved surface with a small radius of curvature. The curved surface having a radius is protected by the guide portion 502a so that the radius of curvature does not become less than 5 mm. The display panel 100 can ensure the reliability of the display if the radius of curvature is 5 mm or more.

[0056] In addition, the display panel 100 shown in FIG. 1 has terminal electrodes 120 electrically connected to the display elements. , and the flat surface of the guide portion 502b is electrically connected to the FPC 112. The terminal electrodes 120 overlap with the contacting portions, and the display panel 100 and the FPC 112 are guided by the guide portion 50. 2a, 502b are arranged along the outside.

[0057] In this way, the printed circuit board 505 on which the driving IC 506 is mounted is disposed on the back side of the display panel 100. It is compact when placed.

[0058] The guide portion 502b is fixed to the guide portion 502a, and the flat portion is made of a metal material. The guide portion 502b may have a portion that comes into contact with the FPC 112. As shown, even if the contacting part is not rounded, the FPC 112 is flexible and is therefore acceptable. In addition, in FIG. 1, the guide portion 502b is connected to the member 501 by fastening parts 504a such as bolts and screws. It is fixed.

[0059] The printed circuit board 505 has a group of elements such as a driving IC 506, and is connected to the member 501 and the fastening portion. The printed circuit board 505 and the member 501 are fixed to each other by components 504b and 504c. The FPC 112 is connected to the connection portion 503 of the printed circuit board 505. The power source for the display device is connected to the vehicle's power source (generator, secondary battery, etc.) via a connecting cord. The printed circuit board 505 may also be provided with a secondary battery, a wireless communication unit, etc. Alternatively, a system configuration in which video signals are transmitted and received wirelessly may be used.

[0060] In addition, the member 501 may have a notch or a cavity to reduce its weight. The component 501 has a complex shape, specifically, a shape in which the area overlapping with the printed circuit board is hollowed out. The printed circuit board 505 and the buffer plate 500 may be disposed so that the gap between them becomes narrower.

[0061] Furthermore, when the element provided on the printed circuit board 505 is a high-frequency circuit or the like, the buffer plate 500 is It is preferable that the buffer plate 500 functions as an electric field shielding film. This can prevent noise from degrading the image quality of the image displayed on the display panel 100. In order to reduce the influence of noise, the shortest distance between the printed circuit board and the organic light-emitting element is 150 It is preferable that the thickness is 1 μm or more.

[0062] A conductive film is provided so as to be in contact with and overlap with a part of the flexible film that overlaps the display area of ​​the display panel. When the plate was placed, it was confirmed that the image quality of the image displayed on the display panel 100 was degraded.

[0063] Therefore, the area where the buffer plate 500 overlaps with the display area of ​​the display panel 100 is at least The display area of ​​the display panel 100 should be equal to or larger than the display area of ​​the display panel. If there is a portion where the display area and the buffer plate 500 do not overlap, a difference in the image display occurs between them. There is a risk of boundaries being created in the presentation.

[0064] The cross-sectional shape of the member 501 shown in FIG. 1 is merely an example, and is not particularly limited as long as it has a curved surface. For example, the cross-sectional shape of the member 501 shown in FIG. 2 may be used. Since the cross-sectional shape of 501 is different, the shapes of the buffer plate 500 and the display panel 100 also change. The other configurations are the same, so detailed explanations will be omitted.

[0065] The member 501 in FIG. 2 is smaller in volume and lighter in weight than the member 501 in FIG. 1. In addition, the area of ​​the member 501 in FIG. 2 that overlaps with the printed circuit board 505 has been removed to reduce its weight. Such a complex shape can be easily manufactured using a 3D printer or the like. It becomes easier.

[0066] The display device shown in this embodiment is not limited to vehicles, but can also be used as a portable television receiver. This is a valid configuration.

[0067] FIG. 3(A) shows an example of a portable television receiver 5010. FIG. 3(B) shows the point in FIG. 3(A). 5 is a simplified cross-sectional view taken along line XY. 3, an LED lamp 5014, an operation key 5015, and a connection terminal 5016. As shown in A), a portable television receiver 5010 is connected to a charger 50 capable of transmitting and receiving signals. 17. The portable television receiver 5010 can be installed in addition to the above. The device includes an antenna, a tuner, an image processing unit, a recording medium reading unit, a secondary battery, etc.

[0068] The requirements for a portable TV are a large screen, light weight, and a variety of colors. The advantage of this is that it can be installed in various places. Conventional portable TVs have LCD display panels. The screen is flat and uses a glass substrate, and when it comes to large screens, the screen size is the same as the glass substrate. Because it has a backlight, it is difficult to balance and the base is large. It is as follows.

[0069] As the base gets larger, it becomes difficult to install it in a narrow space, for example, on a narrow shelf. Even if you try to place it, it is difficult to install because there is not enough space.

[0070] As shown in FIG. 3(B), the display element of this embodiment is an organic light-emitting element, and therefore, a backlight is not required. Since no wire is required and the ground surface side of the member 501 is wide and stable, it is possible to Furthermore, if the member 501 is made of acrylic resin, it is lightweight. Furthermore, when the device is installed in a bathroom or the like, a temperature shock is applied, but the component 501 and the display panel 1 00, the buffer plate 500 is provided, so wrinkles may occur on the display panel 100. This can be suppressed.

[0071] In addition, the screen of the display panel 100 is curved, making it easy to see.

[0072] In addition, since the liquid crystal panel uses a glass substrate, it will break if it falls over. The display panel 100 shown in FIG. 1 is constructed using a flexible film, so it can be folded down. It is unbreakable and safe. In addition, because it has a curved surface, even if it falls over, it will not touch the flat floor or desk. There is almost no contact with the screen.

[0073] The display device shown in this embodiment can be installed in various places such as inside a vehicle. In this case, the size and weight of the member 501 can be reduced by appropriately adjusting the shape of the member 501. It can be stored compactly in a space.

[0074] Here, an example of an application in which the display device described in this embodiment is arranged inside a vehicle will be described below. show.

[0075] FIG. 4A shows an example of the display device 5002 being mounted on a right-hand drive vehicle, but is not particularly limited thereto. In left-hand drive vehicles, the left and right positions are reversed.

[0076] In FIG. 4(A), a dashboard 5001, a steering wheel, and the like are arranged around the driver's seat and the passenger seat. 5003, windshield 5004, etc.

[0077] The display device 5002 is disposed at a predetermined position on the dashboard 5001, specifically around the driver. The T-shaped design allows the driver to see the inside of the car in front of the driver's seat. This allows display areas to be provided in front of the passenger seat and between the passenger seat and the driver's seat, which is preferable. In FIG. 4(A), a plurality of sensors are arranged on a curved or flat surface of the dashboard 5001. In the example shown, a single display device 5002 is provided by combining display panels. The number of display devices is not limited to one, and a plurality of display devices may be provided at multiple locations. One display device 5002 shown in FIG. 4(A) is attached to the steering wheel, the instrument display, or The air outlet 5006 and the like do not have a display area, and show a complex shape with multiple openings. Such complex shapes can be made by using flexible display panels. This is an advantage in that

[0078] In addition, a plurality of cameras 5005 are installed outside the vehicle to capture images of the rear and lateral areas. shows an example of installing a camera 5005 instead of a side mirror, Both cameras may be installed.

[0079] Camera 5005 uses a CCD camera or CMOS camera in combination with an infrared camera. The higher the temperature of the subject, the higher the output level of the infrared camera. It is possible to detect or extract living bodies such as humans and animals.

[0080] The image captured by the camera 5005 is displayed on the screen of the display device 5002 (display area 5002a, 5002b). 002b, 5002c, 5002d) In the display device 5002, for example, the display area 5002a corresponds to one display panel. The display panel is roughly divided into four parts and is configured by combining four display panels. 1 is used for the display area 5002b, and the display device shown in FIG. Used for 002a and 5002b.

[0081] This display device 5002 is mainly used to assist driving of the vehicle. By capturing the situation in the direction of the vehicle with a wide horizontal angle and displaying the image, the driver's blind spot is By being able to see the situation, accidents can be prevented.

[0082] In addition, the display areas 5002a, 5002b, 5002c, and 5002d are adjacent display areas. In order to display a seamless image, where the seams between images are not noticeable, we are using artificial intelligence ( A display system equipped with a correction circuit that has the function of correcting a video signal using AI is used. Specifically, it is preferable to use an artificial neural network (ANN) to learn: Correcting the video signal so that discontinuity in the video, especially at the joints between the regions, is alleviated Then, a correction circuit capable of correcting the error is constructed. By performing inference (cognition) on the image, the video signal is corrected and discontinuities in the image are compensated for. This makes it possible to display images with no noticeable seams, improving the quality of high-resolution images. It can be improved.

[0083] In addition, the display area 5002d of the display device 5002 is flexible. By using the position adjustment means to bend the left end portion 5002e, the angle is set to be easy for the driver to see. The angle of the screen, which is part of the display area 5002d, can be changed. The end of d is difficult to distinguish the display due to the distance from the driver and the viewing angle, but the display area 500 If the left end 5002e of 2d is bent to an angle that is easy for the driver to see, the side mirror This is useful as it can be provided at a position suitable for the display area where the image is displayed.

[0084] In addition, a distance image sensor is installed on the roof of the car, and the obtained image is displayed on a display device 5002. The range image sensor may be an image sensor or a LIDAR (Li Uses Light Detection and Ranging. Wide display area The device displays both the image obtained by the distance image sensor and the image obtained by the CCD camera. This will provide the driver with more information and assist them in driving.

[0085] The display device 5002 can also display map information, traffic information, TV images, DVD images, etc. If so, the number of display panels to be combined should be increased to create a larger display area. For example, it is preferable to display map information in the display areas 5002a, 5002b, 5002c, and 5002d. 002d can be displayed enlarged as one display screen.

[0086] The display areas 5002a, 5002b, 5002c, and 5002d fix the area where the image is displayed. It is not a fixed system, but can be freely changed according to the driver's preference. Video and DVD video are displayed in the left display area 5002d, and map information is displayed in the central display area 5002b The instrument display is in the right display area 5002c, and the audio display is near the gearbox. The area 5002a can be arranged between the driver's seat and the passenger seat. For example, a system consisting of multiple display panels can be designed to be fail-safe. Even if one of the display panels fails for some reason, the display area can be changed. This allows the image to be displayed on a display panel arranged in another area.

[0087] In the case of flat display panels, installation locations are limited and there is dead space between them and the curved surfaces inside the car. This results in a narrower interior space. If the display panel used in the 002d is a flexible display panel, it will be able to fit along the curved surface inside the car. This is desirable because it can be installed easily and does not take up much space inside the car. If the internal space is not too narrow, flat display panels and flexible display panels For example, the display area 5002a may be a flat display panel. In addition, since the display area 5002a is within the driver's reach, the touch panel It may also be possible to perform input operations as follows.

[0088] In this embodiment, an example of a vehicle is shown, but the present invention is not limited to this. Display devices and digital signage attached to cylindrical pillars It can also be used as a digital signage (digital signage) and can be mounted on the curved interior or exterior walls of a house or building. It can also be installed along the surface. Also, as shown in Figure 4(B), it can be installed on two-wheeled vehicles (scooters, etc.) The display device 8605 may be used as a display device 8605 around the handle of a car (such as a car). The panels are arranged in a T-shape to form a single display device. The scooter 8600 shown in FIG. 1 includes a secondary battery 8602, a side mirror 8601, a turn signal light 86 03. The secondary battery 8602 can supply electricity to the turn signal light 8603. In addition, the scooter 8600 shown in FIG. 4(B) has a secondary battery 860 in the storage space under the seat 8604. 2 can be stored. The secondary battery 8602 can be stored even if the under-seat storage 8604 is small. The secondary battery 8602 can be stored in the under-seat storage 8604. When charging, the secondary battery 8602 is brought indoors, charged, and stored before driving. Just do that.

[0089] (Embodiment 2) In this embodiment, a manufacturing method of the display panel 100 illustrated in FIG. 1A according to one embodiment of the present invention will be described. The display panel 100 includes a display area 101 and a display area adjacent to the display area 101. The region 120 includes, for example, a display region 110 that is in contact with the display region 110 and transmits visible light. Wiring is provided to electrically connect to the pixels included in the pixel array 01. In addition, a driving circuit (scanning line driving circuit, signal line driving circuit, etc.) for driving the pixels is provided. In addition, the area 120 may have a terminal (connection terminal) electrically connected to the FPC 112. The area where the wiring electrically connected to the terminal and the IC chip are provided. include.

[0090] First, as shown in FIG. 5(A), a peeling layer 233 is formed on a formation substrate 231. The surface of the peeling layer 233 is subjected to plasma treatment (see the dotted arrow in FIG. 5(A)). In this specification, a layer formed on a release layer may be referred to as a layer to be peeled.

[0091] The substrate 231 to be fabricated is a substrate having heat resistance that can withstand at least the processing temperature during the fabrication process. The substrate 231 may be, for example, a glass substrate, a quartz substrate, a sapphire substrate, a semiconductor substrate, or the like. A solid substrate, a ceramic substrate, a metal substrate, a plastic substrate, or the like can be used.

[0092] In order to improve mass productivity, a large glass substrate may be used as the production substrate 231. For example, 3rd generation (550mm x 650mm) or higher and 10th generation (2950mm) A glass substrate of 3400mm or less or larger than this can be used. preferable.

[0093] When a glass substrate is used as the formation substrate 231, a lower layer is formed between the formation substrate 231 and the peeling layer 233. Forming a base film is preferable because it can prevent contamination from the glass substrate. For example, a silicon oxide film, a silicon oxynitride film, a silicon nitride film, a silicon nitride oxide film, etc. Examples of insulating films include:

[0094] The peeling layer 233 can be made of an inorganic material. Examples of the inorganic material include tungsten, Molybdenum, titanium, tantalum, niobium, nickel, cobalt, zirconium, zinc, An element selected from the group consisting of ruthenium, rhodium, palladium, osmium, iridium, and silicon Examples of the silicon include metals containing the silicon element, alloys containing the silicon element, and compounds containing the silicon element. The crystal structure of the layer containing the cations may be amorphous, microcrystalline, or polycrystalline. When high melting point metal materials such as tungsten, titanium, and molybdenum are used, the process of forming the peeled layer This is preferable because it increases the degree of freedom.

[0095] When the peeling layer 233 has a single layer structure, it is a tungsten layer, a molybdenum layer, or a tungsten and molybdenum layer. It is preferable to form a layer containing a mixture of tungsten and molybdenum. The mixture of tungsten and molybdenum corresponds to, for example, an alloy of tungsten and molybdenum.

[0096] The peeling layer 233 is formed by, for example, a sputtering method or a CVD (Chemical Vapor Deposition) method. deposition) method (plasma CVD method, thermal CVD method, MOCVD (Metal O Organic CVD method, ALD (Atomic Layer Deposit) ion) method, coating method (including spin coating method, droplet ejection method, dispense method, etc.), It can be formed by a printing method, a vapor deposition method, or the like.

[0097] The thickness of the peeling layer 233 is 1 nm or more and 1000 nm or less, preferably 1 nm or more and 200 nm or less. More preferably, the thickness is 10 nm or more and 100 nm or less.

[0098] The peeling layer 233 may be a stack of a layer containing tungsten and a layer containing an oxide of tungsten. When forming a layer structure, a layer containing tungsten is formed, and an oxide insulating film is formed thereon. By this, a layer containing tungsten oxide is formed at the interface between the tungsten layer and the insulating film. It may be possible to take advantage of this.

[0099] In addition, the surface of the tungsten-containing layer is treated by thermal oxidation, oxygen plasma treatment, nitrous oxide (N 2) Plasma treatment, treatment with ozone water or other highly oxidizing solutions, etc., can be used to remove tungsten. A layer containing an oxide may be formed. The plasma treatment or heat treatment may be performed using oxygen, nitrogen, or a suboxide. The treatment can be carried out in an atmosphere of nitrogen alone or a mixture of nitrogen gas with other gases.

[0100] The surface state of the peeling layer 233 is changed by plasma treatment or heat treatment. It is possible to control the adhesion between the insulating film 33 and the insulating film to be formed later. The case of performing plasma processing will be described as an example.

[0101] The plasma treatment is preferably carried out in an atmosphere containing nitrous oxide. It is more preferable to carry out the process in an atmosphere containing chlorine. It is possible to form an oxide layer of the material that constitutes layer 233. In particular, an atmosphere containing silane If the oxide layer is formed in the following way, a very thin oxide layer can be formed. In some cases, it is difficult to confirm this in cross-sectional observation images.

[0102] The oxide layer is a layer containing an oxide of the material contained in the release layer. In this case, the oxide layer is a layer containing an oxide of the metal contained in the peeling layer 233. It is preferable that the oxide contains tungsten oxide, titanium oxide, or molybdenum oxide.

[0103] Next, as shown in FIG. 5B, a first insulating layer 205 is formed on the peeling layer 233. A second insulating layer 207 is formed on the insulating layer 205 .

[0104] The first insulating layer 205 and the second insulating layer 207 are made of a silicon nitride film and a silicon oxynitride film, respectively. It is formed in a single layer or multiple layers using silicon film, silicon oxide film, silicon nitride oxide film, etc. It can be achieved.

[0105] In this specification, "silicon oxynitride" refers to a silicon nitride having a higher content of oxygen than nitrogen. In this specification, the term "silicon nitride oxide" refers to a material having a high content of silicon. The composition of the material is one in which the nitrogen content is greater than the oxygen content.

[0106] The first insulating layer 205 preferably contains oxygen and silicon. A single layer structure of a silicon oxide film or a silicon oxynitride film is preferable.

[0107] The first insulating layer 205 preferably further contains hydrogen. The layer 205 has a function of releasing hydrogen during the heating process. The hydrogen is released and supplied to the oxide layer. The catalyst may have a function of releasing hydrogen and nitrogen in a subsequent heating step. Nitrogen is released from the first insulating layer 205, and is supplied to the oxide layer.

[0108] The first insulating layer 205 is subjected to secondary ion mass spectroscopy (SIMS). The hydrogen concentration detected by mass spectrometry is 1.0 × 10 20 atoms / cm 3 Over 1.0 x 10 22 atoms / cm 3 Below 5.0x, preferably 10 20 atoms / cm 3 Over 5.0 x 10 21 atoms / cm 3 The region where It is preferred that it contains

[0109] The first insulating layer 205 has a nitrogen concentration of 5.0×10 20 atom s / cm 3 Over 1.0 x 10 23 atoms / cm 3 Less than or equal to 1.0 × 10 21 atoms / cm 3 Over 5.0 x 10 22 atoms / cm 3 Contains areas that are: is preferred.

[0110] As the first insulating layer 205, a silicon oxide film or a silicon oxynitride film is formed by silane gas and By forming a film by the plasma CVD method using a film formation gas containing nitrous oxide gas, a large amount of This is preferable because it allows the film to contain hydrogen and nitrogen. The higher the proportion of hydrogen gas, the greater the amount of hydrogen released in the subsequent heating step, which is preferable. It's nice.

[0111] The second insulating layer 207 preferably contains nitrogen and silicon. A single layer structure of a silicon nitride film or a silicon nitride oxide film, or a silicon nitride film or a nitride It is preferable that the second insulating layer 207 has a stacked structure including a silicon oxide film. In this case, the second insulating layer 207 may further comprise at least a silicon oxide film and a silicon oxynitride film. It is preferable to have one of them.

[0112] The second insulating layer 207 is formed by absorbing hydrogen released from the first insulating layer 205 in a subsequent heating step. The second insulating layer 207 has a function of blocking hydrogen and nitrogen. The second insulating layer 207 may be a layer that can separate the first insulating layer 205 from the element layer. It is possible to suppress the supply of hydrogen (and nitrogen) to the oxide layer, and to prevent hydrogen from being supplied to the oxide layer. (and nitrogen) can be efficiently supplied. There may be other layers between layers 207.

[0113] The silicon nitride film included in the second insulating layer 207 is etched by a gas mixture of silane, nitrogen, and ammonia. It is preferable to form the film by plasma CVD using a film forming gas containing the gas.

[0114] The first insulating layer 205 and the second insulating layer 207 are formed by sputtering and plasma deposition, respectively. It can be formed by using a CVD method, a coating method, a printing method, etc. For example, plasma CVD By using the D method and setting the film formation temperature between 250℃ and 400℃, a dense and very The first insulating layer 205 and the second insulating layer 207 can be made to have high moisture resistance. The thickness of each is 10nm to 3000nm, and further 200nm to 1500nm. m or less is preferable.

[0115] Next, the peeling layer 233, the first insulating layer 205, and the second insulating layer 207 are heated. The heat treatment may be performed after forming at least a part of the element layer 209. After forming the transistor, heat treatment may be performed before forming the display element. When the manufacturing process of 9 includes a heating step, the heating step may also serve as the heat treatment.

[0116] By performing the heat treatment, hydrogen (and nitrogen) is released from the first insulating layer 205, and the first insulating layer 205 is oxidized. At this time, the second insulating layer 207 absorbs the released hydrogen (and nitrogen). Therefore, hydrogen (and nitrogen) can be efficiently supplied to the oxide layer.

[0117] The hydrogen supplied into the oxide layer reduces the oxide in the oxide layer, and oxygen is introduced into the oxide layer. For example, if the peeling layer contains tungsten, If not, WO3 formed by plasma treatment is reduced, and WO with a lower oxygen composition than WO3 (2 < x < 3) or WO2 is generated, and they are in a mixed state. Since such a mixed metal oxide exhibits different crystal structures depending on the oxygen composition, the mechanical strength within the oxide layer becomes vulnerable. As a result, a state where it is likely to collapse inside the oxide layer is realized, and the peelability in the subsequent peeling process can be improved.

[0118] Furthermore, due to the nitrogen supplied to the oxide layer, compounds containing nitrogen and the materials contained in the release layer are also generated. The presence of such compounds can further weaken the mechanical strength of the oxide layer and enhance the peelability. When the release layer contains a metal, a compound containing metal and nitrogen (metal nitride) is generated in the oxide layer. For example, when the release layer contains tungsten tungsten nitride is generated in the oxide layer.

[0119] The more hydrogen is supplied into the oxide layer, the easier it is for WO3 to be reduced, and it is likely to be in a state where a plurality of oxides with different oxygen compositions are mixed in the oxide layer. Therefore, the force required for peeling can be reduced The more nitrogen is supplied into the oxide layer, the more the mechanical strength of the oxide layer can be weakened, and the force required for peeling can be reduced. The thicker the first insulating layer 205 is, the more hydrogen (and nitrogen) can be released, which is preferable. On the other hand, the thinner the first insulating layer 205 is, the higher the productivity, which is preferable. <00008​​​​​​​​​​​​​​It is preferable to perform the heating at a temperature equal to or higher than the temperature at which the first insulating layer is formed. The amount of hydrogen (and nitrogen) released from 205 is increased, improving subsequent stripping properties. Depending on the heating time and temperature, peelability may become too high, resulting in unintended peeling. Therefore, the use of tungsten for the peeling layer 233 In this case, the temperature is 300°C or higher and lower than 700°C, preferably 400°C or higher and lower than 650°C, more preferably Alternatively, the material is heated at a temperature of 400°C or higher and 500°C or lower.

[0121] The atmosphere in which the heat treatment is performed is not particularly limited, and the heat treatment may be performed in the air, but it is also possible to perform the heat treatment in an atmosphere containing nitrogen or a rare gas. It is preferable to carry out the reaction under an inert gas atmosphere such as

[0122] Next, as shown in FIG. 5(C), the second insulating layer 20 in the region 110 that transmits visible light is The second insulating layer 207 can be removed by dry etching, wet etching, or the like. Note that the manufacturing process of the element layer 209 and the insulating layer 208 may include a method such as a bonding method. Any of the etching steps may also serve as a step for removing the second insulating layer 207 .

[0123] In one embodiment of the present invention, the second insulating layer 2 is formed on the entire surface of the release layer 233 until the heat treatment is performed. After the heat treatment, the second region 110 that transmits visible light is formed. The insulating layer 207 is removed. This allows the peelability of the visible light transmitting region 110 to be improved. Therefore, the peelability of the entire display panel can be made uniform. The structure of the region 110 that transmits visible light can improve the yield of the manufacturing process of the display panel. The impact on the environment can be reduced.

[0124] Next, as shown in FIG. 5(D), an element layer 209 and an insulating layer 208 are formed on the second insulating layer 207. The insulating layer 208 forms a display element included in the element layer 209 and a connecting terminal 223. The insulating layer included in the element layer 209 and the insulating layer 208 are formed to cover the element layer 209. It is preferable that the area 110 is not included.

[0125] Next, a substrate 235 to be bonded to the fabrication substrate 231 in a later step is prepared. A release layer 237 is formed. Then, plasma treatment is performed on the surface of the release layer 237 (FIG. 5(E)). ) (see dotted arrow).

[0126] Next, as shown in FIG. 5(F), a third insulating layer 215 is formed on the peeling layer 237. A fourth insulating layer 217 is formed on the insulating layer 215, and a functional layer 219 is formed on the fourth insulating layer 217. Form.

[0127] The heat treatment is performed after the fourth insulating layer 217 is formed and after a part of the fourth insulating layer 217 is removed. Before forming the functional layer 219, the release layer 237 and the third insulating layer 215 are removed. The fourth insulating layer 217 may be heated. Alternatively, the heat treatment may be performed to at least partially heat the functional layer 219. If the manufacturing process of the functional layer 219 includes a heating step, the heating step may be performed after at least a part of the functional layer 219 is formed. The heating step may also serve as the heat treatment.

[0128] By carrying out the heat treatment, it is possible to improve the releasability in the subsequent peeling step.

[0129] Next, as shown in FIG. 5(G), the fourth insulating layer 21 in the region 110 that transmits visible light is The fourth insulating layer 217 can be removed by dry etching or wet etching. In addition, the etching process included in the manufacturing process of the functional layer 219 can be performed by using a method such as etching. Either of these steps may also serve as a step for removing the fourth insulating layer 217.

[0130] In one embodiment of the present invention, the fourth insulating layer 2 is formed on the entire surface of the release layer 237 until the heat treatment is performed. After the heat treatment, the fourth region 110 that transmits visible light is formed. The insulating layer 217 is removed. This allows the entire display panel to be uniformly peeled off. The structure of the region 110 that transmits visible light influences the yield of the manufacturing process of the display panel. This can suppress the noise.

[0131] Next, the fabrication substrate 231 and the substrate 235 are bonded together with the adhesive layer 221 (FIG. 6(A) ).

[0132] As the substrate 235, various substrates that can be used for the fabrication substrate 231 can be applied. A flexible substrate may be used. Conductor elements, light-emitting elements such as organic EL elements, liquid crystal elements, functional elements such as detector elements, and color filters A substrate on which a filter or the like is pre-formed may also be used.

[0133] The adhesive layer 221 may be a photo-curable adhesive such as an ultraviolet curable adhesive, a reaction-curable adhesive, or a thermosetting adhesive. Various curing adhesives such as adhesives, anaerobic adhesives, etc. can be used. 1. Water-soluble resin, organic solvent-soluble resin, plasticized by irradiation with ultraviolet light, etc. The substrate 235 and the first insulating layer 205 can be separated when necessary, for example, from a resin that can be easily removed. A suitable adhesive may also be used.

[0134] Then, the release layer 233 and the first insulating layer 205 are separated.

[0135] As a method of peeling, for example, the preparation substrate 231 or the substrate 235 is fixed to a suction stage, A peeling starting point is formed between the peeling layer 233 and the first insulating layer 205. For example, The starting point for peeling may be formed by inserting a sharp tool such as a blade. The peeling starting point may be formed by irradiating the peeling layer 233 with ultraviolet light to dissolve a part of the peeling layer 233. A liquid (for example, alcohol, water, or water containing carbon dioxide) is applied to the release layer 233 or the first The liquid is dropped onto the end of the insulating layer 205, and the liquid is transferred to the peeling layer 233 and the first insulating layer 205 by capillary action. The initiation of delamination may be achieved by penetrating the boundary of the edge layer 205 .

[0136] Next, in the area where the peeling starting point was formed, a gentle movement was performed in a direction approximately perpendicular to the contact surface. Applying physical force to the film (such as peeling it off with a human hand or a jig, or rotating a roller) By using a process such as separating the layer from the substrate, the layer to be peeled can be peeled off without damaging it. For example, tape or the like is attached to the fabrication substrate 231 or the substrate 235, and the tape is pulled in the above direction. The peeling may be performed by attaching a hook-shaped member to the edge of the substrate 231 or 235. It is also possible to peel it off by hooking it onto the part. Also, adhesive materials or materials that can be vacuum-adsorbed can be made. The peeling may be performed by adsorbing the film to the rear surface of the substrate 231 or 235 and pulling it. stomach.

[0137] Here, when peeling, a liquid containing water, such as water or an aqueous solution, is added to the peeling interface, and the liquid By performing peeling so that the adhesive penetrates the surface, peeling properties can be improved. The static electricity generated in the peeled layer adversely affects the functional elements contained in the peeled layer (semiconductor elements are statically charged). It can suppress damage such as destruction by electricity.

[0138] By the above method, the layer to be peeled can be peeled off from the formation substrate 231 with a high yield.

[0139] Thereafter, the substrate 201 is attached to the first insulating layer 205 via the adhesive layer 203 (FIG. 6(B) The adhesive layer 203 can be made of the same material as that used for the adhesive layer 221. Materials that can be used for the substrate 235 can be applied to 01.

[0140] By using flexible substrates for the substrate 201 and the substrate 235, In addition, when the substrate 235 functions as a temporary support substrate, In this case, the substrate 235 and the release layer 237 are separated from the layer to be peeled, and the layer to be peeled and the substrate 211 (for example, A flexible substrate may be attached to the substrate 210 using an adhesive layer 213 (FIG. 6(C)).

[0141] As described above, in the method for manufacturing a display panel of one embodiment of the present invention, the first insulating layer 205 and The insulating layer 207 is formed on the entire surface of the peeling layer 233, and then the heat treatment is performed. After the heat treatment, the peelability of the entire display panel can be improved uniformly. By removing the second insulating layer 207 in the region 110 that transmits visible light, The reflectance of 110 can be reduced.

[0142] In addition, in a method for manufacturing a display panel according to one embodiment of the present invention, after forming a functional element over a formation substrate, The functional element is then peeled off from the substrate and transferred to another substrate. There are almost no restrictions on the heat that can be applied to the device. Functional elements can be fabricated with a high yield on flexible substrates with poor heat resistance. This makes it possible to realize a highly reliable and flexible display panel.

[0143] In this embodiment, a display panel with a top emission structure to which a separate coloring method is applied is taken as an example. will be explained.

[0144] FIG. 7C shows a top-emission display panel 370A to which a color-coded method is applied. 7(A) and 7(B) are cross-sectional views of the area between the dashed dotted lines A1-A2 and 7A and 7B show the cross section of the display panel 370A. A top view is shown.

[0145] The display panel 370A includes a substrate 201, an adhesive layer 203, an insulating layer 205, and a plurality of transistors. , a capacitor element 305, a conductive layer 307, an insulating layer 312, an insulating layer 313, an insulating layer 314, an insulating layer 315, the light-emitting element 304, the conductive layer 355, the spacer 316, the adhesive layer 317, the substrate 211, It has an adhesive layer 213 and an insulating layer 215 .

[0146] Each layer included in the region 110 that transmits visible light transmits visible light. The visible light transmitting region 110 is formed by the substrate 201, the adhesive layer 203, the insulating layer 205, the gate insulating layer 206, and the like. layer 311, insulating layer 312, insulating layer 313, insulating layer 314, adhesive layer 317, insulating layer 215, An example having an adhesive layer 213 and a substrate 211 is shown. In this laminated structure, the refraction at each interface It is preferable to select the materials for each layer so that the difference in index is small.

[0147] The driver circuit portion 382 includes a transistor 301. The display portion 381 includes a transistor 302. and a transistor 303.

[0148] Each transistor has a gate, a gate insulating layer 311, a semiconductor layer, a source, and a drain. The gate and the semiconductor layer overlap with each other via a gate insulating layer 311. A part of the capacitor 305 functions as a dielectric of the transistor 302. The conductive layer functioning as a drain also serves as one electrode of the capacitor 305 .

[0149] 7C shows a bottom-gate transistor. The transistor structure may be different between the driving circuit section 382 and the display section 38. 1 may each have multiple types of transistors.

[0150] The capacitor 305 has a pair of electrodes and a dielectric between them. a conductive layer formed of the same material and in the same process as the gate (lower gate) of the transistor; a conductive layer formed of the same material and in the same process as the source and drain of the transistor; It has.

[0151] At least one of the insulating layers 312, 313, and 314 is impregnated with water or It is preferable to use a material that is difficult for impurities such as hydrogen to diffuse. This effectively prevents the diffusion of ions into the display, improving the reliability of the display panel. The insulating layer 314 functions as a planarization layer. The edge layer 314 is made of an organic material, and the insulating layer 314 is provided over the entire surface of the display panel. This configuration can increase the yield of the peeling process. In addition, the insulating layer using an organic material is not positioned at the edge of the display panel. In this case, it is possible to prevent impurities from entering the light emitting element 304.

[0152] The insulating layer 205 and the substrate 201 are bonded together by an adhesive layer 203. 15 and the substrate 211 are bonded together by an adhesive layer 213 .

[0153] In the display section 381 , the light emitting element 304 is located between the insulating layer 205 and the insulating layer 215 . Impurities are prevented from entering the light emitting element 304 from the thickness direction of the display panel 370A. Similarly, the display unit 381 has a plurality of insulating layers covering the transistors. Therefore, impurities are prevented from entering the transistor.

[0154] By disposing the light emitting element 304 and the transistor between a pair of highly moisture-proof insulating films, This prevents impurities such as water from entering these elements, improving the reliability of the display panel. Therefore, it is preferable.

[0155] Highly moisture-proof insulating films include silicon nitride films and silicon nitride oxide films containing nitrogen and silicon. and films containing nitrogen and aluminum, such as aluminum nitride films. A silicon oxide film, a silicon oxynitride film, an aluminum oxide film, or the like may also be used.

[0156] For example, the water vapor permeability of a highly moisture-proof insulating film is 1×10 -5 [g / (m 2 ·day)] Less than 1 × 10 -6 [g / (m 2·day)] or less, more preferably 1 × 10 -7 [g / (m 2 ·day)] or less, more preferably 1 × 10 -8 [g / (m 2 ·da y)] or less.

[0157] When an organic material is used for the insulating layer 314, the insulating layer 314 exposed at the edge of the display panel is There is a risk that impurities such as moisture may enter the light emitting elements 304 and the like from the outside of the display panel through the insulating film. If the light emitting element 304 deteriorates due to the intrusion of impurities, it will lead to deterioration of the display panel. Therefore, as shown in the vicinity of the connection portion 306 in FIG. 7(C), an inorganic film (here, an insulating film) is formed on the insulating layer 314. An opening is provided that reaches the edge layer 313, so that even if impurities such as moisture enter from the outside of the display panel, It is preferable to have a structure that makes it difficult for the light to reach the light emitting element 304 .

[0158] The light-emitting element 304 includes an electrode 321, an EL layer 322, and an electrode 323. The light emitting element 304 may have an optical adjustment layer 324. The light emitting element 304 emits light toward the substrate 211. Put out.

[0159] By arranging the transistor, the capacitor, the wiring, etc. so as to overlap with the light emitting region of the light emitting element 304, As a result, the aperture ratio of the display section 381 can be increased.

[0160] One of the electrodes 321 and 323 functions as an anode, and the other functions as a cathode. A voltage higher than the threshold voltage of the light emitting element 304 is applied between the electrode 321 and the electrode 323. As a result, holes are injected into the EL layer 322 from the anode side, and electrons are injected from the cathode side. The electrons and holes are recombined in the EL layer 322, and the luminescent material contained in the EL layer 322 It glows.

[0161] The electrode 321 is electrically connected to the source or drain of the transistor 303. The electrodes 321 are connected directly or via other conductive layers. The electrodes 321 function as a light emitting element, and are provided for each light emitting element 304. Two adjacent electrodes 321 are 315 is electrically isolated.

[0162] The EL layer 322 is a layer containing a light-emitting material. An organic EL device using the compound can be suitably used.

[0163] The EL layer 322 has at least one light-emitting layer.

[0164] Quantum dots can also be used as light-emitting materials. Quantum dots are semiconductors with a size of a few nanometers. It is a nanocrystal with a particle size of 1×10 3 Pieces to 1×10 6 It is composed of about atoms. Since the dots have a size-dependent energy shift, quantum dots made of the same material Even if quantum dots are used, the emission wavelength varies depending on the size. This makes it possible to easily adjust the emission wavelength.

[0165] Quantum dots have a narrow peak width in the emission spectrum, making it possible to obtain light emission with good color purity. Furthermore, the theoretical internal quantum efficiency of quantum dots is said to be nearly 100%. By using quantum dots as a light-emitting material, a light-emitting device with high light-emitting efficiency can be obtained. Furthermore, quantum dots are inorganic compounds and have excellent inherent stability. In addition, a light-emitting element that is preferable in terms of life can be obtained.

[0166] The materials that make up quantum dots include elements in group 14 of the periodic table, elements in group 15 of the periodic table, and Group 16 elements, compounds consisting of multiple Group 14 elements, Groups 4 to 1 Compounds of elements in Group 4 and Group 16 of the periodic table, and compounds of elements in Group 2 and Group 16 of the periodic table Compounds with elements, compounds with elements in group 13 of the periodic table and elements in group 15 of the periodic table, compounds with elements in group 13 of the periodic table Compounds of elements and elements from Group 17 of the periodic table, compounds of elements from Group 14 of the periodic table and elements from Group 15 of the periodic table compounds of elements in Group 11 of the periodic table and elements in Group 17 of the periodic table, iron oxides, titanium oxides, Examples include chalcogenide spinels and various semiconductor clusters.

[0167] Examples of materials that make up quantum dots include cadmium selenide, cadmium sulfide, and tetrafluoroethylene. Cadmium sulphide, zinc sulphide, indium phosphide, lead selenide, lead sulphide, selenium and zinc Cadmium compounds, cadmium, selenium and sulfur compounds, etc. It is also possible to use so-called alloy quantum dots in which the ratios are expressed as arbitrary ratios. The quantum dots, which are alloys of selenium, selenium, and sulfur, can change the emission wavelength by changing the ratio of the elements. This is an effective way to obtain blue light emission because it can be changed.

[0168] Quantum dot structures include core type, core-shell type, and core-multishell type. Since the quantum efficiency of light emission is greatly improved, the core-shell type or It is preferable to use a core-multishell type quantum dot. Examples of shell materials include Examples include zinc sulfide and zinc oxide.

[0169] Quantum dots have a high proportion of surface atoms, making them highly reactive and prone to aggregation. Therefore, a protective agent or a protective group is attached to the surface of the quantum dots. This is preferable because it is possible to prevent the quantum dots from agglomerating and increase their solubility in a solvent. It can also reduce reactivity and improve electrical stability.

[0170] The size (diameter) of the quantum dots is 0.5 nm or more and 20 nm or less, preferably 1 nm or more and 10 nm or less. Quantum dots are usually used in the range of nanometers or less. The narrower the emission spectrum, the more excellent the color purity of the light emitted. The shape of the quantum dots is not particularly limited, and may be spherical, rod-shaped, disc-shaped, or other shapes. .

[0171] Quantum dots maintain their luminous efficiency even when the light-emitting layer is made up of only quantum dots without using a host material. Therefore, in this respect, a light emitting element that is preferable in terms of life can be obtained. When the light-emitting layer is formed only from quantum dots, the quantum dots have a core-shell structure (core- It is preferable that the structure is a multi-shell structure.

[0172] The electrode 323 functions as a common electrode and is provided across the plurality of light-emitting elements 304. A constant potential is applied to the electrode 323 .

[0173] Note that one embodiment of the present invention is not limited to the color-coded method, but may be a color filter method, a color conversion method, Alternatively, a quantum dot method or the like may be applied.

[0174] The light emitting element 304 overlaps the colored layer 325 via the adhesive layer 317. The spacer 316 7C, the light emitting element 304 and the light blocking layer 326 are overlapped with each other through the adhesive layer 317. 7(C) shows a case where there is a gap between the electrode 26 and the electrode 26, but they may be in contact with each other. 2 shows a configuration in which the spacer 316 is provided on the substrate 201 side, but it may be provided on the substrate 211 side (for example, a light shielding Alternatively, the layer 326 may be provided on the substrate 201 side.

[0175] The colored layer is a colored layer that transmits light in a specific wavelength band. For example, red, green, blue, or For the color layer, a color filter that transmits light in the yellow wavelength range can be used. Materials that can be used include metal materials, resin materials, or pigments or dyes. Examples of such materials include resin materials.

[0176] The light-shielding layer is provided between adjacent colored layers. The light-shielding layer blocks light from the adjacent light-emitting element. The colored layer is formed on the edge of the light-shielding layer, and the colored layer is formed on the edge of the light-shielding layer. By providing the light-shielding layer so that it overlaps with the light-emitting layer, it is possible to suppress light leakage. A material that blocks light from the element can be used, for example, a metallic material, or a pigment or dye. The black matrix can be formed using a resin material containing the following: If the light emitting diode is provided in an area other than the pixel area, such as a driving circuit, unintended light leakage due to guided light can be suppressed. This is preferable because it can be controlled.

[0177] The connection portion 306 includes a conductive layer 307 and a conductive layer 355. The conductive layer 307 is electrically connected to the source and drain of the transistor. The conductive layer 355 can be formed using the same material and in the same process. The external input terminal is electrically connected to the external input terminal, which transmits signals and potentials from the outside. 3 shows an example in which an FPC 373 is provided as an input terminal. and the conductive layer 355 are electrically connected.

[0178] The connector 319 may be made of various anisotropic conductive films (ACF). Conductive Film) and Anisotropic Conductive Paste (ACP) Pic Conductive Paste) can be used.

[0179] The transistors 301, 302, and 303 shown in FIG. 9 include a gate, a gate insulating layer 311, a semiconductor FIG. 9 shows a bottom gate structure transistor. vinegar.

[0180] The display panel may have an overcoat. The overcoat may cover the color layer 325. It is possible to prevent the diffusion of impurities contained therein into the light emitting element 304. The light-transmitting layer 304 is made of a material that transmits light from the light-emitting element 304. For example, a silicon nitride film, an oxide film, etc. Uses an inorganic insulating film such as a silicon film, or an organic insulating film such as an acrylic film or a polyimide film. It may also have a laminated structure of an organic insulating film and an inorganic insulating film.

[0181] It is preferable to use flexible substrates as the substrate 201 and the substrate 211. For example, materials such as glass, quartz, resin, metal, alloy, and semiconductor that are thick enough to be flexible are used. The substrate on the side where light from the light emitting element is extracted is made of a material that transmits the light. For example, the thickness of the substrate is preferably 1 μm or more and 200 μm or less, and more preferably 1 μm or more and 100 μm or less. It is more preferable that the thickness is 10 μm or less and 50 μm or less, and it is further preferable that the thickness is 10 μm or more and 20 μm or less. The thickness and hardness of the flexible substrate are determined based on the mechanical strength and flexibility. The flexible substrate can be either a single-layer structure or a multi-layer structure. That's fine.

[0182] Since resin has a smaller specific gravity than glass, if resin is used as a flexible substrate, This is preferable because it allows the display panel to be lighter than when glass is used.

[0183] It is preferable to use a highly tough material for the substrate. This makes it superior in impact resistance and breakage resistance. For example, a display panel that is less susceptible to cracks can be realized using a resin substrate or a thin metal substrate. By using a metal or alloy substrate, it is lighter and less susceptible to breakage than when using a glass substrate. It is possible to realize a display panel.

[0184] Metallic and alloy materials have high thermal conductivity and can easily conduct heat across the entire substrate, making it ideal for display panels. This is preferable because it can suppress a local temperature rise in the panel. The thickness of the substrate is preferably 10 μm or more and 200 μm or less, and more preferably 20 μm or more and 50 μm or less. It is more preferable that:

[0185] The material for forming the metal substrate or alloy substrate is not particularly limited, but for example, aluminum Aluminum, copper, nickel, or alloys of metals such as aluminum alloys or stainless steel The semiconductor substrate can be preferably made of silicon or the like. can be.

[0186] In addition, if a material with high thermal emissivity is used for the substrate, the surface temperature of the display panel can be prevented from rising. Therefore, damage to the display panel and a decrease in reliability can be suppressed. a layer of high thermal emissivity (for example, a metal oxide or ceramic material can be used); A laminated structure may also be used.

[0187] Examples of flexible and translucent materials include polyester resins such as PET and PEN. , polyacrylonitrile resin, acrylic resin, polyimide resin, polymethyl methacrylate Polyamide resin (nylon, aramid, etc.), polysiloxane San resin, cycloolefin resin, polystyrene resin, polyamide-imide resin, polyurethane Tan resin, polyvinyl chloride resin, polyvinylidene chloride resin, polypropylene resin, PTF E resin, ABS resin, etc. In particular, it is preferable to use a material with a low linear expansion coefficient. For example, polyamide-imide resin, polyimide resin, polyamide resin, PET, etc. are preferred. In addition, a substrate in which a fiber body is impregnated with a resin and an inorganic filler in which a resin is impregnated with a fiber body can be used. It is also possible to use a substrate or the like in which the linear expansion coefficient is reduced by mixing with

[0188] As for the flexible substrate, a layer using the above material protects the surface of the device from scratches, etc. Hard coat layer (e.g., silicon nitride layer), layer of material capable of dispersing pressure (e.g., The protective layer may be laminated with at least one of a protective layer and a protective layer of a polyester resin. Any substrate that can be used as the substrate 132 may be used.

[0189] When the flexible substrate has a glass layer, it has a barrier property against water and oxygen. This improves the display panel's reliability.

[0190] The adhesive layer can be made of a variety of adhesives, including UV-curable and other light-curable adhesives, reactive-curable adhesives, heat-curable adhesives, and adhesives containing Various curing adhesives such as vapor-curing adhesives can be used. Good too.

[0191] The adhesive layer may also contain a desiccant. For example, an alkaline earth metal oxide (oxide Use substances that adsorb moisture by chemical adsorption, such as calcium oxide and barium oxide. Alternatively, moisture can be absorbed by physical adsorption, such as with zeolites or silica gel. If a desiccant is included, impurities such as moisture may be absorbed into the functional element. This is preferable because it can prevent the light from entering the display panel and improve the reliability of the display panel.

[0192] Furthermore, by including a filler or a light scattering material with a high refractive index in the adhesive layer, light from the light emitting element can be For example, titanium oxide, barium oxide, zeolite, Light, zirconium, etc. can be used.

[0193] The light emitting element can be a self-luminous element that can be illuminated by current or voltage. The category includes devices whose light intensity is controlled, such as light-emitting diodes (LEDs), organic An EL element, an inorganic EL element, or the like can be used. Various display elements can be used. For example, liquid crystal elements, electrophoretic elements, MEMS A display element using the above may also be applied.

[0194] The light emitting elements are top emission type, bottom emission type, and dual emission type. For the electrode on the light extraction side, a conductive film that transmits visible light is used. It is also preferable to use a conductive film that reflects visible light for the electrode on the side from which light is not extracted. .

[0195] The conductive film that transmits visible light is, for example, indium oxide, ITO, indium zinc oxide, It can be formed using zinc oxide (ZnO), ZnO doped with gallium, etc. Gold, silver, platinum, magnesium, nickel, tungsten, chromium, molybdenum, iron, Metallic materials such as cobalt, copper, palladium, or titanium, and alloys containing these metallic materials; Alternatively, nitrides of these metal materials (for example, titanium nitride) may be thin enough to have translucency. In addition, a laminated film of the above materials can be used as a conductive film. For example, if a laminated film of an alloy of silver and magnesium and ITO is used, the conductivity can be improved. Graphene or the like may also be used.

[0196] The conductive film that reflects visible light is made of, for example, aluminum, gold, platinum, silver, nickel, or tungsten. Metallic materials such as zinc, chromium, molybdenum, iron, cobalt, copper, or palladium, or In addition, alloys containing these metal materials can be used. Lanthanum, neodymium, germanium, or the like may be added. Aluminum and titanium alloy, aluminum and nickel alloy, aluminum and neodymium alloy, aluminum Aluminum-containing alloys, such as aluminum, nickel, and lanthanum alloys (Al-Ni-La) alloys (aluminum alloys), silver-copper alloys, silver-palladium-copper alloys (Ag-Pd- Also usable are alloys containing silver, such as an alloy of silver and magnesium. The alloy containing copper is preferable because of its high heat resistance. By laminating a metal film or metal oxide film, oxidation of the aluminum alloy film can be suppressed. Examples of materials for the metal film and metal oxide film include titanium and titanium oxide. Alternatively, the conductive film that transmits visible light may be laminated with a film made of a metal material. A laminated film of silver and ITO, a laminated film of silver-magnesium alloy and ITO, etc. can be used. Cut.

[0197] The electrodes can be formed by vapor deposition or sputtering. Other methods include inkjet printing, printing such as screen printing, and plating. It can be formed using:

[0198] The EL layer 322 has at least a light-emitting layer. The EL layer 322 has a plurality of light-emitting layers. The EL layer 322 may be formed of a material other than a light-emitting layer, such as a material having a high hole injection property, a material having a high hole transport property, or high electron transporting material, high electron injecting material, or barrier material The semiconductor device further includes a layer containing a bipolar substance (a substance having high electron transporting and hole transporting properties). That's fine.

[0199] The EL layer 322 can be made of either a low molecular weight compound or a high molecular weight compound. The layers constituting the EL layer 322 may each be formed by evaporation (vacuum evaporation). The method may include a transfer method, a printing method, an ink jet method, a coating method, etc. do.

[0200] The light emitting element 304 may contain two or more types of luminescent materials. For example, it is possible to realize a light-emitting element that emits color light. White light can be obtained by selecting luminescent materials so that they have a complementary color relationship. For example, R (red), G (green), B (blue), Y (yellow), or O (orange) light A substance or a luminescent substance that emits light containing two or more of the R, G, and B spectral components. It can be used.

[0201] The light emitting element 304 may be a single element having one EL layer, or may be a charge generating element. The device may be a tandem device having a plurality of EL layers stacked with an intervening layer.

[0202] The structure of the transistor included in the display panel is not particularly limited. It may be a staggered transistor, or an inverse staggered transistor. It may also be a top-gate or bottom-gate transistor. Alternatively, gate electrodes may be provided above and below the channel.

[0203] The crystallinity of the semiconductor material used in the transistor is not particularly limited. A semiconductor with crystallinity (microcrystalline semiconductor, polycrystalline semiconductor, single crystal semiconductor, or semiconductor with a partially crystalline region) If a semiconductor having crystallinity is used, This is preferable because it can suppress deterioration of the resistor characteristics.

[0204] The semiconductor material used for the transistor is not particularly limited, and may be, for example, a group 14 element, a compound semiconductor, or the like. A conductor or an oxide semiconductor can be used for the semiconductor layer. semiconductors, semiconductors containing gallium arsenide, or oxide semiconductors containing indium can be applied. Cut.

[0205] In particular, it is preferable to use an oxide semiconductor as a semiconductor in which a channel of a transistor is formed. It is particularly preferable to use an oxide semiconductor having a larger band gap than silicon. It is desirable to use a semiconductor material with a wider band gap and lower carrier density than silicon. This is preferable because it can reduce the current in the off state of the transistor.

[0206] For example, the oxide semiconductor may contain at least indium (In) or zinc (Zn). More preferably, the oxide contains In-M-Zn (wherein M is Al, Ti, Ga). , Ge, Y, Zr, Sn, La, Ce, Hf or Nd, etc.) include.

[0207] As a semiconductor material used for transistors, CAAC-OS (C Axis Alignment d Crystalline Oxide Semiconductor) Unlike amorphous materials, CAAC-OS has few defect levels and is therefore suitable for transistor reliability. CAAC-OS has the advantage that no grain boundaries are visible. Therefore, it is possible to form a stable and uniform film over a large area, and the surface is flexible. The CAAC-OS film is less likely to crack due to stress caused when the display panel is bent.

[0208] CAAC-OS is a crystalline oxide semiconductor whose c-axis is aligned approximately perpendicular to the film surface. Another example of the crystalline structure of oxide semiconductors is nanoscale microcrystalline aggregates. There are various structures that differ from single crystals, such as nanocrystals (nc). It has been confirmed that CAAC-OS has lower crystallinity than single crystals and has a higher crystallinity than nc. High crystallinity.

[0209] In addition, the CAAC-OS has a c-axis orientation and multiple pellets in the ab-plane direction. The CAAC-OS is a composite of nanocrystals (nanocrystals) that are interconnected and have a distorted crystal structure. , CAA crystal(c-axis-aligned ab-plane-an It can also be called an oxide semiconductor having a chord crystal.

[0210] The insulating layer of the display panel can be made of an organic insulating material or an inorganic insulating material. Examples of the resin include acrylic resin, epoxy resin, polyimide resin, and polyamide resin. Polyimide amide resin, siloxane resin, benzocyclobutene resin, phenol resin Examples of inorganic insulating films include silicon oxide films, silicon oxynitride films, and silicon nitride films. silicon oxide film, silicon nitride film, aluminum oxide film, hafnium oxide film, yttria oxide film um film, zirconium oxide film, gallium oxide film, tantalum oxide film, magnesium oxide film, Examples include a lanthanum oxide film, a cerium oxide film, and a neodymium oxide film.

[0211] The conductive layers of the display panel are made of aluminum, titanium, chromium, nickel, Copper, yttrium, zirconium, molybdenum, silver, tantalum, or tungsten Any metal or alloy containing this metal as the main component can be used as a single layer or laminated structure. Alternatively, indium oxide, ITO, indium oxide containing tungsten, tungsten Indium zinc oxide containing titanium, Indium oxide containing titanium TO, indium zinc oxide, ZnO, gallium-doped ZnO, or silicon-containing A light-transmitting conductive material such as indium tin oxide containing impurity elements may also be used. Semiconductors such as polycrystalline silicon or oxide semiconductors that have been made low-resistance by incorporating Alternatively, a silicide such as nickel silicide may be used. The graphene-containing film can be prepared by reducing a film containing graphene oxide, for example. In addition, a semiconductor such as an oxide semiconductor containing an impurity element can be used. Alternatively, conductive paste such as silver, carbon, or copper, or polythiophene may be used. The conductive paste may be formed using a conductive polymer such as propylene. Conductive polymers are preferred because they are easy to apply.

[0212] FIG. 7(C) is a cross-sectional view of a display device having two display panels 370A stacked on top of each other. Shown in 8.

[0213] In FIG. 8, the display area 101a of the lower display panel (corresponding to the display unit 381 shown in FIG. 7(C)) ) and a region 120a that blocks visible light (corresponding to the driving circuit section 382 shown in FIG. 7(C)), and 7C) and the display area 101b of the upper display panel (corresponding to the display unit 381 shown in FIG. 7C). A region 110b that transmits visible light (corresponding to the region 110 that transmits visible light shown in FIG. 7(C)) Shows.

[0214] In the display device shown in FIG. 8, the display panel located on the display surface side (upper side) transmits visible light. The display area 110b of the lower display panel is adjacent to the display area 101b. The area 110a overlaps with the area 110b of the upper display panel that transmits visible light. This reduces the non-display area between the display areas of the two overlapping display panels, and even eliminates it. This allows for a large display where the seams of the display panel are less noticeable to the user. A display device can be realized.

[0215] The display device shown in FIG. 8 has a transparent region 110b between the display region 101a and the region 110b that transmits visible light. The display has a light-transmitting layer 103 that has a higher refractive index than air and transmits visible light. It is possible to prevent air from entering between the region 101a and the region 110b that transmits visible light, and the refractive index This can reduce reflection at the interface due to the difference in the thickness of the display device. Furthermore, it is possible to suppress uneven brightness.

[0216] The light-transmitting layer 103 is formed on the substrate 211 of the lower display panel or the substrate 201 of the upper display panel. The entire surface may be overlapped, or the display area 101a and the visible light transmitting area 110b may be overlapped. The transparent layer 103 may overlap only the area 120a that blocks visible light. It may be possible.

[0217] For example, the light-transmitting layer 103 may be an adsorption film having an adsorption layer on both sides of a substrate. This can be done.

[0218] The region 110b that transmits visible light is configured to suppress reflection of light. The overlapping portion of the two display panels is difficult for a user of the device to see. In addition, the display in the display area 101a is visually recognized through the area 110b that transmits visible light. This can reduce the difference in luminance between the portion that is visible through the region and the portion that is visible without passing through the region.

[0219] <Example of cross-sectional structure of display panel> Figure 9 shows a top-emission display panel that uses a color filter method. 3 shows a cross-sectional view of a display panel 370C having a thin film structure.

[0220] The display panel 370C has an EL layer provided in common for a plurality of light-emitting elements, and each transistor The MOS transistor does not have a back gate, and has a colored layer 325 and a light-shielding layer 326. This is different from the display panel 370A.

[0221] In the display panel 370C, the light emitting element 304 emits light toward the colored layer 325 side.

[0222] A combination of a color filter (colored layer 325) and a microcavity structure (optical adjustment layer 324) By combining these, light with high color purity can be extracted from the display panel. The thickness of the layer 324 varies depending on the color of each pixel.

[0223] The colored layer is a colored layer that transmits light in a specific wavelength band. For example, red, green, blue, or For the color layer, a color filter that transmits light in the yellow wavelength range can be used. Materials that can be used include metal materials, resin materials, or pigments or dyes. Examples of such materials include resin materials.

[0224] The light-shielding layer is provided between adjacent colored layers. The light-shielding layer blocks light from the adjacent light-emitting element. The colored layer is formed on the edge of the light-shielding layer, and the colored layer is formed on the edge of the light-shielding layer. By providing the light-shielding layer so that it overlaps with the light-emitting layer, it is possible to suppress light leakage. A material that blocks light from the element can be used, for example, a metallic material, or a pigment or dye. The black matrix can be formed using a resin material containing the following: If the light emitting diode is provided in an area other than the pixel area, such as a driving circuit, unintended light leakage due to guided light can be suppressed. This is preferable because it can be controlled.

[0225] The display panel may have an overcoat. The overcoat may cover the color layer 325. It is possible to prevent the diffusion of impurities contained therein into the light emitting element 304. The light-transmitting layer 304 is made of a material that transmits light from the light-emitting element 304. For example, a silicon nitride film, an oxide film, etc. Uses an inorganic insulating film such as a silicon film, or an organic insulating film such as an acrylic film or a polyimide film. It may also have a laminated structure of an organic insulating film and an inorganic insulating film.

[0226] This embodiment mode can be freely combined with Embodiment Mode 1. [Example]

[0227] <Display Panel> First, the details of the display panel used in the display device of this embodiment will be shown.

[0228] FIG. 10(A) shows a schematic diagram of the display panel of this embodiment. The display panel shown in FIG. The size of the light-emitting part 250 is 13.5 inches diagonally, the number of effective pixels is 1280 x 720, and the resolution is Active matrix organic EL display with a resolution of 108ppi and an aperture ratio of 41.3% The display panel has a built-in demultiplexer (DeMUX) 253. The display panel also includes a scan driver 255. Two sides of the light-emitting section 250 are in contact with the area 251 that transmits visible light. Around the two sides, wiring 257 is provided.

[0229] The transistor is a channel-etched type using CAAC-OS. The oxide semiconductor used was an In-Ga-Zn oxide.

[0230] The light-emitting element uses a top-emission organic EL element that uses a color-coded method. The light-emitting element has a top-emission structure combined with a color filter. The light is extracted to the outside of the display panel through a color filter.

[0231] FIG. 10(B) shows a schematic diagram of a display device in which three display panels are stacked in a T-shape. FIG. 10C is a schematic diagram of the XY cross section of the display device shown in FIG. 10B taken along the dashed dotted line.

[0232] The display device of this embodiment has a plurality of display panels, and the non-display areas between the display areas are small. Specifically, the visible light on the upper display panel A light-transmitting layer 10 is provided between the light-transmitting region 251 and the light-emitting section 250 of the lower display panel. 3 is provided.

[0233] On two sides of the display panel, wiring is provided from the end of the light emitting unit 250 to the end of the display panel. There are no structures that block visible light, such as wiring or drivers, and the visible light is transmitted through the area. 251. The width of the region 251 of the display panel that transmits visible light is set to about 5 mm. The thickness T of the visible light transmitting region 251 (which can also be said to be the thickness of one display panel) is about 110 Therefore, in the display device of this embodiment, up to three display panels can be overlapped. However, the difference in level on the display surface side is very small, making the seams less noticeable. are.

[0234] The three display panels are flexible. For example, as shown in FIG. 10(C), the lower display panel The area around FPC373a of the panel is curved, and the upper display panel adjacent to FPC373a is A part of the lower display panel and a part of the FPC 373a are arranged below the light emitting unit 250. As a result, the FPC373a does not physically interfere with the back surface of the upper display panel. This allows the display panel to be positioned without any need for a wire. This allows for the arrangement of one or more other display panels, making it easy to increase the display area.

[0235] In this example, an adhesive film having an adhesive layer on both sides of a substrate was used as the light-transmitting layer 103 . By using this adhesive film, the two display panels that make up the display device can be attached and detached. The adsorption layer on one side of the light-transmitting layer 103 is adsorbed to the substrate 211a. The adsorption layer on the other surface of the light-transmitting layer 103 is adsorbed to the substrate 201b.

[0236] In FIG. 10B, the light-transmitting layer 103 is formed only in a portion overlapping with the region 251 that transmits visible light. 10C, the light-transmitting layer 103 is not only a thin film but also a thin film that overlaps with the light-emitting portion 250. The area 251 that transmits visible light from the end of 201b is overlapped with the entire area 251 that transmits visible light, and further includes a display element. It also overlaps with a part of the region 155b. The light-transmitting layer 103 is not provided in the curved portion of the display panel near the curved portion. However, depending on the thickness and flexibility of the light-transmitting layer 103, the light-transmitting layer 103 may be provided. No.

[0237] Each display panel was fabricated by bonding a substrate and an element layer with an adhesive layer. As shown in (C), the substrate 201a and the element layer 153a, the substrate 211a and the element layer 153a, The substrate 201b and the element layer 153b, and the substrate 211b and the element layer 153b are bonded to each other. The element layer 153a is bonded to the display element region 155a by an adhesive layer 157. The element layer 153 also includes a region 156a including wirings electrically connected to the display element. b is a region 155b including a display element and a region 155b including wiring electrically connected to the display element. 6b and

[0238] As shown in FIG. 10(C), one of the three display panels is connected to the buffer plate 500. It is fixed to a curved member 501 with double-sided tape.

[0239] In this embodiment, a member, a guide portion, etc., which will be a part of the display device, is designed and attached to a member having a curved surface. The flexible display panel is fixed with double-sided tape via a buffer plate. The radius of curvature is 780 mm. The buffer plate is an aluminum plate with a thickness of 0.5 mm. In this example, one side of the three display panels shown in FIG. 10(B) overlaps two display panels. A display panel is fixed to a curved surface with a buffer plate, and a photograph showing the image is displayed. The photograph is shown in Figure 15(A). The oblique photograph is shown in Figure 15(B). ) and the image displayed on the display device of FIG. 15(B) is a car navigation image. are.

[0240] In addition, Figure 11 shows the design drawing of the side surface, including the parts that overlap with one display panel, the guide part, etc. FIG. 12(A) shows a rear view from the printed circuit board side.

[0241] 11 and 12(A), the display panel is positioned so that the display is directed upward. 11 and 12(A) are provided in the same parts as in FIG. The same reference numerals will be used in the following description. Note that in FIG. 11 and FIG. 12(A), the display panel and the FPC are Not shown.

[0242] Figure 12(B) shows a photograph taken from the printed circuit board side with the display panel and FPC connected. Figure 13 is a photograph taken from the side after connecting the display panel and FPC.

[0243] FIG. 14(A) shows a perspective view of the display panel with the display surface facing upward. The image is taken from above and placed on a desk so that the legs 510 are in contact with the desk surface. (B).

[0244] The results of a storage test in which thermal shock was applied are shown in Figure 14(C). This is a photograph taken after storing at 0°C for 12 hours and then returning to room temperature. As shown in Figure 14(C), no wrinkles were formed after the storage test, and there was almost no change in appearance. It is clear that

[0245] In addition, the member 501 was made of acrylic resin and the storage test was carried out. Similar preservation tests were carried out using glass epoxy resin, and similar results were obtained. It can be said that the occurrence of wrinkles is suppressed by the plate 500. However, the glass epoxy resin Acrylic resin is preferred for member 501 because it is heavier and more expensive than acrylic. It's nice.

[0246] A flexible display panel is placed on a curved acrylic resin member via a buffer plate. This makes it possible to realize a tile display made up of multiple flexible display panels. [Explanation of symbols]

[0247] 20 acrylic board 100 Display Panel 101a Display area 101b Display area 103 Translucent layer 112 FPC 120 terminal electrode 120a Field 132 Protective substrate 153a Element layer 153b Element layer 155a Field 155b Field 156a Field 156b Field 157 Adhesive layer

Claims

1. A member having a curved surface; a metal plate bonded to the member and having a shape that conforms to the curved surface; a display panel having a display portion overlapping the member via the metal plate; a printed circuit board electrically connected to the display panel, the display unit has a curved shape that follows the curved surface of the member, the display panel includes a flexible substrate; the linear expansion coefficient of the metal plate is smaller than the linear expansion coefficient of the member; The display device, wherein the metal plate has a linear expansion coefficient smaller than that of the substrate.

2. A member having a curved surface; a metal plate bonded to the member and having a shape that conforms to the curved surface; a display panel having a display portion overlapping the member via the metal plate; a printed circuit board electrically connected to the display panel, the display unit has a curved shape that follows the curved surface of the member, the display panel includes a flexible substrate; the member has a first organic resin material; the substrate has a second organic resin material; the first organic resin material and the second organic resin material are different materials, the linear expansion coefficient of the metal plate is smaller than the linear expansion coefficient of the first organic resin material; The display device, wherein the metal plate has a linear expansion coefficient smaller than the linear expansion coefficient of the second organic resin material.

3. In claim 1 or 2, The display device, wherein the metal plate comprises stainless steel, aluminum, copper, silver, gold, iron, titanium, molybdenum, tungsten, platinum, or an alloy thereof.

Images