Ultrasonic endoscope

Abstract

To provide an ultrasonic endoscope whose size can be reduced.SOLUTION: An ultrasonic endoscope 12 includes a tip part 40 having an ultrasonic vibrator unit 46 and an imaging part. The ultrasonic vibrator unit 46 includes an ultrasonic vibrator 48 and a backing layer 54. The glass transformation temperature of the backing layer 54 is 5-45 degrees, preferably 20-40 degrees, and more preferably 25-35 degrees.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to an ultrasonic endoscope. [Background technology]

[0002] Patent Documents 1 to 3 describe examples of physical properties of the backing material layer provided in the ultrasonic transducer unit. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent Publication No. 2021-062170 [Patent Document 2] Japanese Patent Application Laid-Open No. 2011-176420 [Patent Document 3] Japanese Patent Application Laid-Open No. 2005-177479 Summary of the Invention [Problem to be solved by the invention]

[0004] An object of the present disclosure is to provide an ultrasonic endoscope that can be made compact. [Means for solving the problem]

[0005] An ultrasonic endoscope according to one embodiment of the disclosed technology has a tip portion including an ultrasonic transmitter / receiver unit and an imaging unit, and the ultrasonic transmitter / receiver unit includes an ultrasonic vibrator and a backing material layer, and the glass transition temperature of the backing material layer is 45 degrees or less. [Effects of the Invention]

[0006] The technology of the present disclosure enables miniaturization. [Brief explanation of the drawings]

[0007] [Figure 1]FIG. 1 is a schematic diagram showing an example of an ultrasound inspection system 10 that uses an ultrasound endoscope 12 according to an embodiment of the technology of the present disclosure. [Figure 2] FIG. 2 is a partially enlarged plan view showing the tip portion 40 and its vicinity shown in FIG. [Figure 3] 3 is a cross-sectional view taken along line III-III in FIG. 2, and is a longitudinal cross-sectional view of the tip portion 40 cut along a center line along the longitudinal axis thereof. [Figure 4] 4 is a cross-sectional view taken along line IV-IV shown in FIG. 3, and is a transverse cross-sectional view cut along the center line of the arc structure of the ultrasonic transducer array 50 of the ultrasonic observation unit 36 ​​of the tip portion 40. As shown in FIG. [Figure 5] FIG. 5 is a schematic diagram showing a cross section perpendicular to the axis of the signal cable 110. As shown in FIG. [Figure 6] FIG. 6 is a schematic diagram showing a cross section perpendicular to the axis of the cable 100. As shown in FIG. [Figure 7] FIG. 7 is an enlarged view of a portion including the substrate 60 and the cable 100. As shown in FIG. [Figure 8] FIG. 8 is a diagram showing the position of the filler 80 by partially omitting the cross section shown in FIG. [Figure 9] FIG. 9 is a schematic cross-sectional view taken along the line AA in FIG. DETAILED DESCRIPTION OF THE INVENTION

[0008] 1 is a schematic diagram showing an example of an ultrasound examination system 10 that uses an ultrasound endoscope 12 according to an embodiment of the technology of the present disclosure. The ultrasound examination system 10 includes the ultrasound endoscope 12, an ultrasound processor 14 that generates ultrasound images, an endoscope processor 16 that generates endoscopic images, a light source 18 that supplies illumination light to the ultrasound endoscope 12 to illuminate the inside of the body cavity, a monitor 20 that displays ultrasound images and endoscopic images, a water tank 21a that stores cleaning water and the like, and a suction pump 21b that sucks up material from the body cavity.

[0009] The ultrasonic endoscope 12 has an insertion section 22 that is inserted into the body cavity of the subject, an operation section 24 that is connected to the base end of the insertion section 22 and allows the surgeon to operate it, and a universal cord 26 that has one end connected to the operation section 24.

[0010] An air / water supply button 28a for opening and closing an air / water supply line (not shown) from the water supply tank 21a, and a suction button 28b for opening and closing a suction line (not shown) from the suction pump 21b are arranged side by side on the operation unit 24. The operation unit 24 is provided with a pair of angle knobs 29 and a treatment tool insertion port 30.

[0011] The other end of the universal cord 26 is provided with an ultrasound connector 32a connected to the ultrasound processor device 14, an endoscope connector 32b connected to the endoscope processor device 16, and a light source connector 32c connected to the light source device 18. The ultrasound endoscope 12 is detachably connected to the ultrasound processor device 14, the endoscope processor device 16, and the light source device 18 via these connectors 32a, 32b, and 32c, respectively. The connector 32c is provided with an air / water supply tube 34a connected to the water supply tank 21a and a suction tube 34b connected to the suction pump 21b.

[0012] The insertion section 22 has, in order from the tip side, a tip section 40 having an ultrasound observation section 36 and an endoscopic observation section 38, a bending section 42 connected to the base end side of the tip section 40, and a flexible section 43 connecting the base end side of the bending section 42 and the tip side of the operating section 24.

[0013] The bending portion 42 can be remotely bent by rotating a pair of angle knobs 29 provided on the operation portion 24. This allows the distal end portion 40 to be oriented in a desired direction.

[0014] The ultrasonic processor device 14 generates and supplies ultrasonic signals for generating ultrasonic waves to the ultrasonic transducer array 50 of the ultrasonic transducer unit 46 (see FIG. 2) of the ultrasonic observation section 36. The vibration frequency of the ultrasonic transducer 48 used in the ultrasonic endoscope 12 preferably has a center frequency of 5 MHz or more and 12 MHz or less. In addition, the ultrasonic processor device 14 receives and acquires echo signals reflected from the observation target area to which the ultrasonic waves are radiated using the ultrasonic transducer array 50, and performs various signal processing on the acquired echo signals to generate an ultrasonic image to be displayed on the monitor 20.

[0015] The endoscope processor device 16 receives and acquires an image signal obtained from the observation target area illuminated by illumination light from the light source device 18 in the endoscopic observation section 38, and performs various processes on the acquired image signal to generate an endoscopic image to be displayed on the monitor 20.

[0016] 1, the ultrasonic processor 14 and the endoscope processor 16 are configured by two separate devices (computers). However, this is not limited to this, and both the ultrasonic processor 14 and the endoscope processor 16 may be configured by a single device.

[0017] In order to capture an image of the observation target area in the body cavity using the endoscopic observation section 38 and obtain an image signal, the light source device 18 generates illumination light such as white light or light of a specific wavelength composed of three primary colors of light, such as red light, green light, and blue light, and propagates the light through a light guide (not shown) within the ultrasonic endoscope 12 and emits it from the endoscopic observation section 38 to illuminate the observation target area in the body cavity.

[0018] The monitor 20 displays an ultrasound image and an endoscopic image in response to the video signals generated by the ultrasound processor 14 and the endoscopic processor 16. The monitor 20 can be switched to display only one of the ultrasound images and the endoscopic image, or both images can be displayed simultaneously.

[0019] In this embodiment, ultrasound images and endoscopic images are displayed on one monitor 20, but a monitor for displaying ultrasound images and a monitor for displaying endoscopic images may be provided separately. Furthermore, ultrasound images and endoscopic images may be displayed in a display format other than on the monitor 20, for example, on a display of a terminal carried by the surgeon.

[0020] Next, the configuration of the tip portion 40 will be described with reference to Fig. 2 to Fig. 4. Fig. 2 is a partially enlarged plan view showing the tip portion 40 and its vicinity shown in Fig. 1. Fig. 3 is a cross-sectional view taken along line III-III shown in Fig. 2, which is a longitudinal cross-sectional view of the tip portion 40 cut along a center line along its longitudinal axis. Fig. 4 is a cross-sectional view taken along line IV-IV shown in Fig. 3, which is a transverse cross-sectional view of the tip portion 40 cut along a center line of the arc structure of the ultrasound transducer array 50 of the ultrasound observation unit 36.

[0021] 2 and 3, the distal end portion 40 is equipped with an ultrasonic observation section 36 for acquiring ultrasonic images at the distal end side and an endoscopic observation section 38 for acquiring endoscopic images at the proximal end side. In addition, the distal end portion 40 is provided with a treatment tool outlet 44 between the ultrasonic observation section 36 and the endoscopic observation section 38.

[0022] The endoscopic observation section 38 includes an observation window 82, an objective lens 84, an imaging element 86, an illumination window 88, a cleaning nozzle 90, and a wiring cable 92. The observation window 82, the objective lens 84, the imaging element 86, and the illumination window 88 form an imaging section.

[0023] The treatment instrument outlet 44 is connected to a treatment instrument channel 45 that is inserted into the insertion section 22. A treatment instrument (not shown) inserted from the treatment instrument insertion port 30 in FIG. 1 is led out from the treatment instrument outlet 44 into the body cavity via the treatment instrument channel 45.

[0024] 2 to 4, the ultrasound observation section 36 includes an ultrasound transducer unit 46 constituting an ultrasound transmitting / receiving section, an exterior member 41 that holds the ultrasound transducer unit 46, and a cable 100 that is electrically connected to the ultrasound transducer unit 46 via a substrate 60. The cable 100 has an elongated shape that extends along the longitudinal axis direction of the insertion section 22, and is provided so as to extend to the connector 32a.

[0025] The exterior member 41 is made of a hard member such as hard resin, and constitutes a part of the tip portion 40. The exterior member 41 is provided with a housing space 410 that penetrates the insertion portion 22 in the longitudinal axis direction. The housing space 410 includes a first space 410A on the base end side and a second space 410B on the tip side that is wider than the first space 410A. The housing space 410 accommodates a part of the ultrasound transducer unit 46, the substrate 60, and the tip side of the cable 100. The housing space 410 constitutes a housing section that accommodates the ultrasound transducer unit 46 and the cable 100.

[0026] The ultrasonic transducer unit 46 includes an ultrasonic transducer array 50 consisting of a plurality of ultrasonic transducers 48, an electrode 52 provided at the end of the ultrasonic transducer array 50 in the width direction (a direction perpendicular to the longitudinal axis direction of the insertion portion 22), a backing material layer 54 supporting each ultrasonic transducer 48 from the underside, and a substrate 60 arranged along the side surface of the backing material layer 54 in the width direction and connected to the electrode 52.

[0027] The structure of the substrate 60 is not particularly limited as long as it can electrically connect the plurality of ultrasonic transducers 48 and the cable 100 .

[0028] It is preferable that the substrate 60 is composed of a wiring board such as a flexible substrate (also called a flexible printed circuit board (FPC)), a printed wiring circuit board (also called a printed circuit board (PCB)) made of a rigid substrate with high rigidity and no flexibility, or a printed wiring board (also called a printed wired board (PWB)).

[0029] The ultrasonic transducer unit 46 has an acoustic matching layer 76 laminated on the ultrasonic transducer array 50, and an acoustic lens 78 laminated on the acoustic matching layer 76. The ultrasonic transducer unit 46 is configured as a laminate 47 having the acoustic lens 78, the acoustic matching layer 76, the ultrasonic transducer array 50, and the backing material layer 54.

[0030] The ultrasonic transducer array 50 is composed of a plurality of rectangular parallelepiped ultrasonic transducers 48 arranged in a convex arc shape facing outward. The ultrasonic transducer array 50 is an array of 48 to 192 channels, for example, consisting of 48 to 192 ultrasonic transducers 48. Each ultrasonic transducer 48 has a piezoelectric body 49.

[0031] The ultrasonic transducer array 50 has electrodes 52. The electrodes 52 have individual electrodes 52a that are independent of each other for each ultrasonic transducer 48, and a transducer ground 52b that is a common electrode shared by all of the ultrasonic transducers 48. In Fig. 4, the multiple individual electrodes 52a are arranged on the lower surfaces of the ends of the multiple ultrasonic transducers 48, and the transducer ground 52b is arranged on the upper surface of the ends of the ultrasonic transducers 48.

[0032] The substrate 60 has 48 to 192 wirings (not shown) that are electrically connected to the individual electrodes 52a of the 48 to 192 ultrasonic transducers 48, respectively, and a plurality of electrode pads 62 that are each connected to the ultrasonic transducers 48 via these wirings.

[0033] The ultrasonic transducer array 50 has a configuration in which a plurality of ultrasonic transducers 48 are arranged in a one-dimensional array at a predetermined pitch, for example. The ultrasonic transducers 48 constituting the ultrasonic transducer array 50 are arranged at equal intervals in a convex curved shape along the longitudinal axis direction of the insertion section 22, and are sequentially driven based on a drive signal input from the ultrasonic processor device 14 (see FIG. 1). As a result, a convex electronic scan is performed over the range in which the ultrasonic transducers 48 shown in FIG. 2 are arranged as a scanning range.

[0034] The acoustic matching layer 76 is for matching the acoustic impedance between the object and the ultrasonic transducer 48 .

[0035] The acoustic lens 78 is used to converge the ultrasonic waves emitted from the ultrasonic transducer array 50 toward the observation target area. The acoustic lens 78 is formed of, for example, a silicone resin (such as millable silicone rubber or liquid silicone rubber), a butadiene resin, or a polyurethane resin. Powders of titanium oxide, alumina, silica, or the like are mixed into the acoustic lens 78 as needed. This allows the acoustic lens 78 to achieve acoustic impedance matching between the subject and the ultrasonic transducers 48 in the acoustic matching layer 76 and increase the transmittance of ultrasonic waves.

[0036] 3 and 4, the backing material layer 54 is disposed on the inside of the arrangement surface of the multiple ultrasonic transducers 48, i.e., on the back surface (underside) of the ultrasonic transducer array 50. The backing material layer 54 is composed of a layer of a member made of backing material. The backing material layer 54 mechanically and flexibly supports the ultrasonic transducer array 50, and also serves to attenuate ultrasonic waves that propagate toward the backing material layer 54 among ultrasonic signals emitted from the multiple ultrasonic transducers 48 or reflected from the observation object and propagated. Considering the small diameter of the ultrasonic endoscope 12 and the ultrasonic attenuation performance, the thickness of the backing material layer 54 is preferably 0.5 mm or more and 1.5 mm or less.

[0037] 4 has a plurality of electrode pads 62 electrically connected to the plurality of individual electrodes 52a at one end, and a ground electrode pad 64 electrically connected to the vibrator ground 52b. Note that the cable 100 is omitted from FIG. 4.

[0038] The electrical connection between the substrate 60 and the individual electrodes 52a can be established by, for example, a conductive resin material. Examples of the resin material include anisotropic conductive film (ACF) or anisotropic conductive paste (ACP), which are made by mixing fine conductive particles into a thermosetting resin and molding it into a film.

[0039] Another example of a resin material is a resin material in which conductive fillers such as metal particles are dispersed in a binder resin such as epoxy or urethane, so that the fillers form a conductive path after bonding. An example of such a resin material is a conductive paste such as silver paste.

[0040] As shown in FIG. 3, the cable 100 includes a plurality of signal cables 110 and a tubular covering portion 101 that bundles and covers the plurality of signal cables 110.

[0041] Fig. 5 is a schematic diagram showing a cross section perpendicular to the axis of a signal cable 110. In the example of Fig. 5, the signal cable 110 is a non-coaxial cable. The signal cable 110 has a plurality of signal lines 112 and a plurality of ground lines 114. The signal line 112 is composed of, for example, a conductor 112a and an insulating layer 112b that covers the outer surface of the conductor 112a.

[0042] The conductor 112a is made of, for example, copper or copper alloy wire. The wire is plated with, for example, tin or silver. The conductor 112a has a diameter of, for example, 0.03 mm to 0.04 mm. The insulating layer 112b can be made of, for example, a resin material such as fluorinated ethylene propylene (FEP) or perfluoroalkoxy (PFA). The insulating layer 112b has a thickness of, for example, 0.015 mm to 0.025 mm.

[0043] The ground wire 114 is made of, for example, a conductor having the same diameter as the signal wire 112. The ground wire 114 is made of a copper or copper alloy wire, or a stranded wire made by twisting together multiple copper or copper alloy wires.

[0044] A first signal line bundle 116 is formed by twisting together a plurality of signal lines 112 and a plurality of ground lines 114 .

[0045] The signal cable 110 includes a first shield layer 118 that bundles and covers the first signal wire bundle 116. The first shield layer 118 can be made of an insulating film or the like in which metal foil is laminated via an adhesive. The insulating film is made of a polyethylene terephthalate (PET) film or the like. The metal foil is made of aluminum foil, copper foil, or the like.

[0046] The signal cable 110 is shielded by a first shield layer 118 with a plurality of signal lines 112 as one set.

[0047] The first signal wire bundle 116 is configured by twisting together seven wires: four signal wires 112 and three ground wires. One of the four signal wires 112 is arranged in the center. The remaining three signal wires 112 and three ground wires 114 are arranged adjacent to and around the central signal wire 112. However, the number of signal wires 112 and the number of ground wires 114 in the first signal wire bundle 116, and their arrangement, are not limited to the structure in FIG. 5. Each conductor 112a included in the signal cable 110 is electrically connected to one of the electrode pads 62 on the substrate 60.

[0048] Fig. 6 is a schematic diagram showing a cross section perpendicular to the axis of cable 100. In the example of Fig. 6, cable 100 includes a plurality of signal cables 110, a tubular resin layer 106 that bundles and covers the plurality of signal cables 110, a tubular second shield layer 108 that is provided along the outer circumferential surface of resin layer 106 and covers the outer circumferential surface, and a tubular outer jacket 102 that is provided along the outer circumferential surface of second shield layer 108 and covers the outer circumferential surface. Resin layer 106, second shield layer 108, and outer jacket 102 form a covering portion 101.

[0049] The outer cover 102 can be made of extruded PFA, FEP, ethylene-tetrafluoroethylene copolymer (ETFE), polyvinyl chloride (PVC), or other fluorine-based resin materials. The outer cover 102 forms the outermost surface of the cable 100. It is preferable that the outer surface of the outer cover 102 be highly smooth in order to reduce friction with other components inside the ultrasonic endoscope 12 (such as the air / water supply tube, suction tube, or puller wire) and increase robustness.

[0050] The resin layer 106 can be made of, for example, the above-mentioned fluorine-based resin material or resin tape.

[0051] The second shield layer 108 preferably has an outer surface with a lower smoothness than the outer surface of the outer sheath 102. The smoothness can be defined, for example, by the average surface roughness. The second shield layer 108 is, for example, a metal mesh shield formed by braiding a plurality of wires. The wires are made of plated (tin-plated or silver-plated) copper wires or copper alloy wires, etc. The resin layer 106 and the second shield layer 108 form a first covering member that bundles and covers a plurality of signal cables 110. Note that the resin layer 106 is not essential to the cable 100 and may be omitted. The outer sheath 102 forms a second covering member that covers this first covering member.

[0052] The second shield layer 108 is provided concentrically with the resin layer 106 on the outer periphery of the resin layer 106, surrounding and covering the outer peripheral surface of the resin layer 106 within a 360-degree circumferential range. The outer cover 102 is provided concentrically with the second shield layer 108 on the outer periphery of the second shield layer 108, surrounding and covering the outer peripheral surface of the second shield layer 108 within a 360-degree circumferential range.

[0053] 6, the cable 100 includes 16 signal cables 110 and 64 signal lines 112. The numbers of signal cables 110 and signal lines 112 are not limited to these numbers.

[0054] Fig. 7 is an enlarged view of a portion including the substrate 60 and the cable 100. As shown in Fig. 7, the substrate 60 has a plurality of electrode pads 62 arranged along a side 60a on the base end side, and a ground electrode pad 64 arranged between the plurality of electrode pads 62 and the side 60a. The ground electrode pad 64 is arranged parallel to the side 60a.

[0055] The cable 100 is disposed in a position facing the side 60a of the substrate 60. The electrode pads 62 are electrically connected to the signal lines 112 of the signal cable 110. The signal cable 110 is disposed parallel to the sides 60b and 60c that are perpendicular to the side 60a. However, the positional relationship between the substrate 60 and the signal cable 110 is not particularly limited.

[0056] 3 and 7, the cable 100 has the sheath 101 stripped away from the distal end thereof, forming a first region AR1 where the signal cable 110 is partially exposed. The cable 100 has the outer sheath 102 stripped away from the proximal end of the first region AR1, forming a second region AR2 where the second shield layer 108 is partially exposed. The cable 100 has the outer sheath 102 stripped away from the proximal end of the second region AR2, forming a third region AR3 where the outer sheath 102 is exposed. Thus, in the accommodation space 410, the cable 100 is configured to include, in order from the ultrasonic transducer unit 46 side, the first region AR1 where the signal cable 110 is exposed, the second region AR2 where the second shield layer 108 is exposed, and the third region AR3 where the outer sheath 102 is exposed.

[0057] 3, a filler 80 is provided in the gap between the exterior member 41 and the tip side of the ultrasonic transducer unit 46, the substrate 60, and the cable 100 (the portion in the first space 410A other than the cable 100, and the portion in the second space 410B other than the ultrasonic transducer unit 46, the substrate 60, and the cable 100) to fill the gap. FIG. 8 is a diagram showing the position of the filler 80, with a portion of the cross section shown in FIG. 3 omitted.

[0058] The filler 80 mainly serves to fix the substrate 60, the signal cable 110, and various wiring portions. It is preferable that the acoustic impedance of the filler 80 matches that of the backing material layer 54 with a certain degree of accuracy or higher at the boundary surface with the backing material layer 54 so as not to reflect ultrasonic signals propagating from the ultrasonic transducer array 50 toward the backing material layer 54. To improve the efficiency of dissipating heat generated in the multiple ultrasonic transducers 48, the filler 80 is preferably made of a material with heat dissipation properties. When the filler 80 has heat dissipation properties, it receives heat from the backing material layer 54, the substrate 60, the signal cable 110, etc., thereby improving heat dissipation efficiency. The material of the filler 80 is not particularly limited, and examples thereof include silicone resin and rubber.

[0059] As shown in FIG. 7, the filler 80 fills the gaps between the first region AR1, the second region AR2, and the third region AR3 and the inner surface of the exterior member 41, and is in contact with the first region AR1, the second region AR2, and the third region AR3.

[0060] This configuration allows the filler 80 to penetrate into the step at the boundary between the first area AR1 and the second area AR2, the step at the boundary between the second area AR2 and the third area AR3, and the like, providing an anchoring effect. As a result, the fixing force of the filler 80 to various components can be increased, and the durability of the ultrasonic endoscope 12 can be improved.

[0061] Furthermore, if the smoothness of the outer surface of the second region AR2 is lower than that of the outer surface of the third region AR3, the filler 80 can penetrate into the irregularities in the outer surface of the second region AR2, providing an anchoring effect. As a result, the durability of the ultrasonic endoscope 12 can be further improved. In this embodiment, the second region AR2 and the third region AR3 are disposed in the relatively narrow first space 410A of the housing space 410. Therefore, the volume of the gap between the second region AR2 and the third region AR3 and the exterior member 41 is small, leaving little room for the filler 80 to enter. Even with this configuration, the low smoothness of the second shield layer 108 ensures sufficient fixing force even with a small amount of filler 80.

[0062] As shown in Figures 7 and 8, the outer surface (surface of the outer sheath 102) of the portion of the third region AR3 of the cable 100 that is positioned in the first space 410A is provided with a protrusion 102A that protrudes radially of the cable 100.

[0063] FIG. 9 is a schematic cross-sectional view taken along the arrow AA in FIG. 7 . The cross section of the cable 100 is simplified in FIG. 9 . As shown in FIG. 9 , the protrusion 102A is formed of an annular member provided around the entire outer periphery of the outer sheath 102 of the cable 100. The outer shape of this annular member is not particularly limited, but may be a perfect circle, an ellipse, a polygon, or the like. The protrusion 102A may be formed integrally with the outer sheath 102 of the cable 100, but is preferably separate from the cable 100. For example, the protrusion 102A may be formed as a metal ring or the like, thereby crimping the cable 100 from its outer periphery. This prevents the outer sheath 102 from moving axially relative to the second shield layer 108 in the first space 410A. Furthermore, the filler 80 embedding in the protrusion 102A provides an anchoring effect, further improving the durability of the ultrasonic endoscope 12.

[0064] The protrusion 102A does not have to be provided along the entire outer circumferential surface of the outer sheath 102 of the cable 100. For example, the protrusion 102A may be C-shaped as shown in FIG. 10. By making the protrusion 102A C-shaped, when the cable 100 and the protrusion 102A are separate members, the protrusion 102A can be easily attached to the cable 100. Furthermore, the filler 80 can be embedded between both ends of the C-shaped protrusion 102A in the circumferential direction, thereby enhancing the anchor effect. The C-shaped protrusion 102A shown in FIG. 10 is an example of an annular member.

[0065] Note that, as long as the purpose is to obtain an anchor effect, protrusion 102A does not have to be formed of an annular member, and any shape can be adopted. By forming protrusion 102A as an annular member, as described above, it is possible to obtain an anchor effect while crimping cable 100. A plurality of protrusions 102A may be provided along the axial direction of cable 100. This can further enhance the anchor effect.

[0066] As shown in FIG. 7 , the substrate 60 and the first signal wire bundles 116 are fixed by fixing portions 130, and the relative positions of the substrate 60 and each first signal wire bundle 116 are fixed. The fixing portions 130 fix the substrate 60 and the first signal wire bundles 116 while overlapping the substrate 60. The first signal wire bundle 116, which is formed by twisting multiple signal wires 112 and multiple ground wires 114, is unraveled at the tip 116a into each signal wire 112. Each unraveled signal wire 112 is electrically connected to an electrode pad 62 arranged on the substrate 60. The tip 116a is the starting position for unraveling into each signal wire 112. Note that the fixing portions 130 are omitted for some of the first signal wire bundles 116 to facilitate understanding. The connection area between the substrate 60 and the signal cable 110 as described above is also covered and fixed with the filler 80 described above.

[0067] Next, a preferred configuration of the backing material layer 54 and the filler 80 will be described.

[0068] (Preferable physical properties of the backing material layer) The backing material layer 54 preferably has a glass transition temperature of 45 degrees or less. The temperature of the environment in which the ultrasonic endoscope 12 is placed can vary from the temperature of the storage location to the temperature inside the subject (approximately 45°C). Depending on the storage environment, the ultrasonic endoscope 12 may be placed in an environment with a temperature range of, for example, 5°C to 45°C. If the glass transition temperature of the backing material layer 54 is below 45°C, the temperature inside the subject, the physical properties of the backing material layer 54 change when the ultrasonic endoscope 12 is inserted into the subject. For example, the molecular motion in the backing material layer 54 becomes more intense, making it easier to consume external energy (ultrasound) as molecular kinetic energy (heat). This allows the backing material layer 54 to improve its ultrasonic attenuation performance during insertion into the subject, even when the thickness of the backing material layer 54 is reduced to reduce the diameter (size) of the ultrasonic endoscope 12. Furthermore, the softness of the backing material layer 54 reduces stress when a thermal load is applied to the ultrasonic endoscope 12, preventing cracking and improving durability.

[0069] On the other hand, when the ultrasonic endoscope 12 is outside the subject, it is placed in a temperature environment below the glass transition temperature of the backing material layer 54. In this temperature environment, the backing material layer 54 becomes sufficiently hard. This improves the durability of the ultrasonic endoscope 12 by increasing its impact resistance during storage. Note that while the backing material layer 54 softens somewhat when the ultrasonic endoscope 12 is inserted inside the subject, the inner walls of the subject's organs are also soft, so the impact on durability is minimal.

[0070] Considering that the ultrasonic endoscope 12 is stored indoors, the lower limit of the glass transition temperature of the backing material layer 54 is approximately 5°C. However, taking into account a more realistic storage environment, it is preferable to set it to approximately 10°C. Furthermore, considering that the ultrasonic endoscope 12 is stored indoors in an air-conditioned room, this lower limit should be set to approximately 20°C. Furthermore, considering that there may be variations in temperature inside the subject, it is preferable to set the upper limit of the glass transition temperature of the backing material layer 54 to 40°C. Considering the realistic usage environment of the ultrasonic endoscope 12 and the ease of manufacturing the backing material layer 54, it is more preferable that the glass transition temperature of the backing material layer 54 be between 25°C and 35°C.

[0071] The backing material layer 54 is preferably made of at least one of the following materials: a polyurea resin, an epoxy resin having a polyurethane structure, and an epoxy resin having a polyetheramine structure. By including these resins, stress during thermal loading can be sufficiently reduced. The resin included in the backing material layer 54 preferably includes a polyurea resin, in order to further improve processability.

[0072] The resin contained in the backing material layer 54 preferably has a loss tangent of 0.06 or more in the range of 0 to 50° C. and a loss tangent of less than 1.50 in the range of -20 to 110° C. When the content of the resin in the backing material layer 54 is 25 to 50% by volume, the storage modulus of the backing material layer 54 in the range of 0 to 50° C. is preferably 1000 MPa or more.

[0073] The preferred resins contained in the backing material layer 54 are described in detail below.

[0074] [Polyurea resin] The polyurea resin can be obtained by reacting a polyisocyanate compound with a polyamine compound. The polyisocyanate compound can be used without any particular limitation as long as it is a polyisocyanate compound having two or more isocyanate groups. The polyisocyanate compound may be either an aliphatic isocyanate compound (a compound in which an isocyanato group is bonded to an aliphatic chain or an aliphatic ring) or an aromatic isocyanate compound (a compound in which an isocyanato group is bonded to an aromatic ring), or a mixture thereof. The polyisocyanate compound may have a ring structure. The polyisocyanate compound is preferably an aliphatic polyisocyanate compound in terms of low reactivity and long pot life when producing a cured product, and preferably contains an aliphatic polyisocyanate compound having an aromatic ring and an aromatic polyisocyanate compound in terms of further improving ultrasonic attenuation. The polyamine compound can be any polyamine compound having two or more amino groups, and is preferably a polyamine compound commonly used as a curing agent for epoxy resins. The polyamine compound may be either an aliphatic polyamine compound (a chain aliphatic polyamine compound in which an amino group is bonded to an aliphatic chain, or a cyclic aliphatic polyamine compound in which an amino group is bonded to an aliphatic ring) or an aromatic polyamine compound (a compound in which an amino group is bonded to an aromatic ring), or a mixture thereof. Aliphatic polyamine compounds are preferred because of their excellent reactivity. The polyamine compound may have a cyclic structure. In addition to nitrogen atoms, it may also contain heteroatoms such as oxygen atoms. From the viewpoint of further improving ultrasonic attenuation and processability, the polyamine compound preferably contains an aliphatic polyamine compound having an aromatic ring and a chain aliphatic polyamine compound not having an aromatic ring.

[0075] [Epoxy resin with polyurethane structure] The epoxy resin having a polyurethane structure can be used without any particular limitation, so long as it is an epoxy resin having a polyurethane structure and an epoxy group. Commercially available epoxy resins having a polyurethane structure typically have a number-average molecular weight of 200 to 20,000. The viscosity of the epoxy resin having a polyurethane structure at 25°C is not particularly limited, but is preferably 200 to 200,000 mPa·s, and more preferably 600 to 30,000 mPa·s. The viscosity is measured at 25°C and a shear rate of 0.01 mPa·s. Although polyamines or acid anhydrides can be used as curing agents for reacting with epoxy resins having a polyurethane structure, it is preferable to use polyamines as curing agents. The polyamine compound to be reacted with epoxy resins having a polyurethane structure can be any polyamine compound having two or more amino groups without any particular limitation, and polyamine compounds generally used as curing agents for epoxy resins are preferably used.

[0076] [Epoxy resin with polyetheramine structure] The epoxy resin having a polyetheramine structure is a reaction cured product of an epoxy resin and a polyamine compound having two or more amino groups, and can be used without any particular limitation as long as it has a polyether structure. An epoxy resin having a polyetheramine structure can be obtained by either a reaction between an epoxy resin having a polyether structure and a polyamine compound not having a polyether structure, a reaction between an epoxy resin not having a polyether structure and a polyamine compound having a polyether structure, or a reaction between an epoxy resin having a polyether structure and a polyamine compound having a polyether structure. The polyether structure possessed by the reaction cured product obtained in this manner is generally a polyether structure having a number average molecular weight of 200 to 6,000. Among these, a reaction cured product of an epoxy resin having a polyether structure and a polyamine compound having no polyether structure, or a reaction cured product of an epoxy resin having no polyether structure and a polyamine compound having a polyether structure is preferred, and from the viewpoint of exhibiting a more preferable viscosity as a curable resin composition, a reaction cured product of an epoxy resin having no polyether structure and a polyamine compound having a polyether structure is more preferred. Commercially available epoxy resins having a polyether structure are generally, for example, epoxy resins having a polyether structure with a number average molecular weight of 200 to 6000, and specific examples thereof include the following, with those having a bisphenol structure being preferred in terms of excellent mechanical strength. Examples of epoxy resins having a polyether structure include bisphenol A epoxy resins, bisphenol F epoxy resins, bisphenol E epoxy resins, and novolac epoxy resins. Bisphenol A epoxy resins are preferred in terms of excellent mechanical strength of the cured product. The polyamine compound having a polyether structure can be used without any particular limitation as long as it is a polyamine compound having two or more amino groups, and polyamine compounds generally used as curing agents for epoxy resins are preferably used. Commercially available polyamine compounds having a polyether structure are generally, for example, polyamine compounds having a polyether structure with a number average molecular weight of 200 to 6000.

[0077] [Resin content in backing material layer] The resin content in the backing material layer 54 is 25 to 50% by volume, and preferably 30 to 50% by volume. The content of the reaction cured product of at least one of polyurea resin, epoxy resin having a polyurethane structure, and epoxy resin having a polyetheramine structure in the resin contained in the backing material layer 54 is not particularly limited as long as the effects of the technology of the present disclosure are achieved, and can be, for example, 15% by volume or more, preferably 20% by volume or more, more preferably 30% by volume or more, even more preferably 50% by volume or more, and particularly preferably 70% by volume or more. It is also preferable that all of the resin contained in the backing material layer 54 be composed of at least one of polyurea resin, epoxy resin having a polyurethane structure, and epoxy resin having a polyetheramine structure.

[0078] The backing material layer 54 is preferably constructed using at least one of the following base materials: polyurea resin, epoxy resin with a polyurethane structure, and epoxy resin with a polyetheramine structure, and containing a heat-dissipating filler. The backing material layer 54 can increase its thermal conductivity by including thermally conductive particles as a heat-dissipating filler. Increasing the thermal conductivity of the backing material layer 54 allows heat generated in the ultrasonic transducer unit 46 to be transferred to a heat-dissipating structure (not shown), preventing heat from accumulating in the tip portion 40. This reduces the thermal load on the backing material layer 54, further reducing stress caused by the thermal load.

[0079] The thermally conductive particles may be either inorganic or organic, as long as they are thermally conductive. To enhance the thermal conductivity of the backing material layer 54, the thermal conductivity per unit weight is preferably 30 W / m·K or higher, and more preferably 60 W / m·K or higher. Because the ultrasonic endoscope 12 is inserted into the body, the thermally conductive particles are preferably made of a safe material that is non-toxic and stable in the operating environment, such as hygroscopicity. Furthermore, to enhance attenuation, a high density is preferable, and because the particles are placed near the circuit, a material with low or no electrical conductivity is preferred to avoid short-circuit failures. There are no particular limitations on the shape of the thermally conductive particles, and various shapes such as amorphous, spherical, fibrous, branched fibrous, and flat are used. A spherical shape is preferred because it can increase the filling rate. An anisotropic shape such as a fibrous or flat shape is preferred because it can increase particle contact and improve heat dissipation. Irregular particles are preferred because they can randomly reflect ultrasonic waves, thereby improving the ultrasonic attenuation of the backing material layer 54.

[0080] Examples of thermally conductive particles include aluminum oxide, tungsten oxide, silicon carbide, tungsten carbide, aluminum nitride, silicon nitride, boron nitride, and aluminum nitride. Nitrides are particularly preferred from the viewpoint of high thermal conductivity and high insulating properties. The thermally conductive particles may contain one or more of these thermally conductive materials. The surfaces of the thermally conductive particles may be surface-treated to facilitate dispersion in the resin.

[0081] The particle size of the thermally conductive particles is not particularly limited. From the viewpoint of maintaining a high mechanical strength of the backing material layer 54 while keeping the viscosity of the curable resin composition contained in the backing material layer 54 low, the particle size of the thermally conductive particles is, for example, preferably 1 to 300 μm, more preferably 5 to 100 μm, and even more preferably 8 to 30 μm. The "particle size" of the thermally conductive particles is the number average particle size.

[0082] The proportion of thermally conductive particles in the total amount of components other than the resin in the backing material layer 54 is preferably 50% by volume or more, more preferably 60% by volume or more, and even more preferably 65% ​​by volume or more. It is also preferable that all components other than the resin in the backing material layer 54 are thermally conductive particles. The content of thermally conductive particles in the backing material layer 54 is, for example, preferably 30 to 60% by volume, more preferably 30 to 55% by volume, and even more preferably 30 to 50% by volume.

[0083] The backing material layer 54 may contain other components in addition to the above-mentioned resin and thermally conductive particles. The other components may include hollow particles. The inclusion of hollow particles can further improve ultrasonic attenuation. As the hollow particles, any hollow particles commonly used to exhibit the effect of improving acoustic wave attenuation or ultrasonic wave attenuation can be used without any particular limitation. Either hollow glass particles or hollow resin particles may be used, with hollow resin particles being preferred.

[0084] Preferred examples of hollow particles include glass balloons, hollow silica, senolite, phenolic resin microballoons, urea resin microballoons, polymethyl methacrylate balloons, and thermally expandable microcapsules. The hollow particles may be used singly or in combination of two or more types. In this specification, the content of hollow particles refers to the total amount when two or more types of hollow particles are used.

[0085] The particle size of the hollow particles is not particularly limited. From the viewpoint of maintaining high mechanical strength of the backing material layer 54 while keeping the viscosity of the curable resin composition low, the particle size of the hollow particles is, for example, preferably 1 to 300 μm, more preferably 5 to 100 μm, and even more preferably 20 to 80 μm. The "particle size" of the hollow particles is synonymous with the "particle size" of the thermally conductive particles described above. In other words, the "particle size" of the hollow particles is the number average particle size.

[0086] The other components may include a dispersant, a diluent, a colorant, a viscosity modifier, a plasticizer, a hardening accelerator, etc. The content of the other components in the backing material layer 54 may be, for example, 10 to 20% by volume.

[0087] A preferred embodiment of the backing material layer 54 includes, for example, a resin containing at least one of a polyurea resin, an epoxy resin having a polyurethane structure, and an epoxy resin having a polyetheramine structure, and thermally conductive particles, the resin having the specific loss tangent and storage modulus described above, and the hollow particles. In this embodiment, the content of each component in the backing material layer 54 is 25 to 50 volume %, preferably 30 to 50 volume % for the resin. The content of the thermally conductive particles is preferably 30 to 60 volume %, more preferably 30 to 55 volume %, and even more preferably 30 to 50 volume %. The content of the hollow particles is preferably 10 to 20 volume %.

[0088] The backing material layer 54 is preferably formed using a curable resin composition. The curable resin composition preferably contains the thermally conductive particles and, as a resin component, any of the following: a combination of a polyisocyanate compound and a polyamine compound; a combination of an epoxy resin having a polyurethane structure and a polyamine compound; and a combination of an epoxy resin and a polyamine compound, wherein at least one of the epoxy resin and the polyamine compound has a polyether structure.

[0089] <Method for manufacturing backing material layer> The curable resin composition constituting the backing material layer 54 can be prepared by a conventional method. For example, the curable resin composition can be obtained by kneading the above-mentioned thermally conductive particles and a resin component containing at least one of a polyurea resin, an epoxy resin having a polyurethane structure, and an epoxy resin having a polyetheramine structure, as well as other components as appropriate, using a kneading device such as a planetary rotation / revolution device, a kneader, a pressure kneader, a Banbury mixer (continuous kneader), or a two-roll mill. The order in which the components are mixed is not particularly limited. The kneading conditions are not particularly limited as long as the thermally conductive particles are dispersed in the resin component.

[0090] The curable resin composition thus obtained can be cured to obtain the backing material layer 54. The curing conditions can be adjusted depending on the chemical reaction of the resin components contained in the curable resin composition, and for example, the backing material layer 54 can be obtained by heat curing at a specific temperature for a certain period of time.

[0091] The shape of backing material layer 54 is not particularly limited, and for example, a shape suitable for the backing material layer may be formed using a mold during the curing process, or a sheet-like backing material may be obtained and then cut by dicing or the like to form the desired backing material layer. Note that, because backing material layer 54 of the present disclosure has excellent processability, the desired backing material layer can be produced while suppressing deformation, breakage, and the like, even when dicing into the desired shape at a pitch on the order of μm.

[0092] (Preferable physical properties of the filler layer) Considering that the physical properties of the backing material layer 54 change due to changes in the environmental temperature in which the ultrasonic endoscope 12 is placed, it is preferable that the filler 80 be configured to have a hardness greater than that of the backing material layer 54. In this way, even if dimensional changes in the backing material layer 54 may occur due to changes in the temperature environment in which the ultrasonic endoscope 12 is placed, the hardness of the backing material layer 54 can suppress such dimensional changes. Because the ultrasonic endoscope 12 has a very small diameter, suppressing such dimensional changes can stabilize quality. Furthermore, the high hardness of the filler 80 can improve the fixing strength between the substrate 60 and the cable 100.

[0093] The filler 80 is not particularly limited to a specific material, but in order to provide the desired hardness as described above and heat dissipation properties, it is preferable to use a filler having a crosslink density of 500 mol / m 3 More than 12000mol / m 3 Preferably, the crosslinking density is 3000 mol / m or less. 3 More than 10000mol / m 3 It is preferable that the composition contains the following epoxy resin.

[0094] As such an epoxy resin, an epoxy resin having an epoxy equivalent of 140 or less, as exemplified in International Publication No. 2023 / 054203, can be used. Filler 80 may be an epoxy resin having an epoxy equivalent of 140 or less that has been cured by itself, or may be an epoxy resin that has been cured by reacting with a curing agent.

[0095] In the ultrasonic transducer unit 46 configured as described above, when each ultrasonic transducer 48 of the ultrasonic transducer array 50 is driven and a voltage is applied to the electrode 52 of the ultrasonic transducer 48, the piezoelectric body 49 vibrates to sequentially generate ultrasonic waves, which are then irradiated toward the observation target area of ​​the subject. Then, by sequentially driving the plurality of ultrasonic transducers 48 with an electronic switch such as a multiplexer, ultrasonic waves are scanned within a scanning range along the curved surface on which the ultrasonic transducer array 50 is arranged, for example, within a range of about several tens of mm from the center of curvature of the curved surface.

[0096] Furthermore, when an echo signal reflected from the observation target area is received, the piezoelectric element 49 vibrates to generate a voltage, which is output as an electrical signal corresponding to the received ultrasonic echo to the ultrasonic processor 14. Then, various signal processing is performed in the ultrasonic processor 14, and the signal is displayed on the monitor 20 as an ultrasonic image.

[0097] (Modification of endoscope) The above-described characteristic physical properties of the backing material layer 54 and the filler 80 are applicable to ultrasonic endoscopes of any structure. For example, in the ultrasonic endoscope 12, the cable 100 may be configured without the second region AR2 (i.e., the covering portion 101 is peeled off at the tip end to expose the signal cable 110, and the portion closer to the base end than the exposed portion of the signal cable 110 is the outer sheath 102), or may be configured without the protrusion 102A.

[0098] Furthermore, the signal cable 110 is not limited to a non-coaxial cable as shown in Fig. 5, but may be a coaxial cable, a twisted pair cable, or the like. When the signal cable 110 is a coaxial cable, for example, a shielding layer is provided around one signal line 112, and this shielding layer is covered with an insulating layer. When the signal cable 110 is a twisted pair cable, two signal lines 112 are twisted together.

[0099] Although the ultrasonic endoscope 12 is a convex type, the technology of the present disclosure can also be applied to a radial type ultrasonic endoscope. The technology of the present disclosure can also be applied to a radial type ultrasonic endoscope in which the ultrasonic observation section is located closer to the tip than the endoscopic observation section. [Example]

[0100] Examples of the backing material layer 54 of the technology of the present disclosure will be described below, but the backing material layer 54 should not be construed as being limited by these results.

[0101] <1> Preparation of the backing layer composition A composition for a backing material layer (curable resin composition) having the following formulation was prepared.

[0102] (Polyurea resin) A composition for the backing material layer was prepared by mixing 45 parts of a resin composition prepared by mixing 2.5 parts of metaxylene diisocyanate (Tokyo Chemical Industry Co., Ltd.) as the polyisocyanate, 2 parts of Elasmer 250P (Kumiai Chemical Co., Ltd.) and 8 parts of Elasmer 250P (Kumiai Chemical Co., Ltd.) as the polyamine, 25 parts of tungsten carbide particles (WC-100S (manufactured by Allied Materials Corporation)) and 15 parts of silicon carbide particles (SSC-A15 (manufactured by Shinano Electric Refining Co., Ltd.)) as the thermally conductive particles.

[0103] (Epoxy resin with polyurethane structure) A composition for the backing material layer was prepared by mixing 10 parts of ADEKA Resin EPU-11F (ADEKA Corporation) as an epoxy resin having a polyurethane structure, 45 parts of a resin composition obtained by mixing 0.6 parts of 2,2,4-trimethylhexamethylenediamine (Tokyo Chemical Industry Co., Ltd.) and 1.0 parts of Gasgamine-328 (Mitsubishi Gas Chemical Company, Inc.) as polyamines, 25 parts of tungsten carbide particles (WC-100S (manufactured by A.L.M.T. Corporation)) as thermally conductive particles, and 15 parts of silicon carbide particles (SSC-A15 (manufactured by Shinano Electric Refining Co., Ltd.)).

[0104] (Epoxy resin with polyetheramine structure) A composition for the backing material layer was prepared by mixing 10 parts of jER828 (Mitsubishi Chemical Corporation) as a bisphenol A type epoxy resin, 45 parts of a resin composition prepared by mixing 4.5 parts of JEFFAMINE D400 (Huntsman Corporation) and 6.0 parts of JEFFAMINE D400 (Huntsman Corporation) as a bifunctional polyether polyamine, 25 parts of tungsten carbide particles (WC-100S (manufactured by Allied Materials Corporation)) as thermally conductive particles, and 15 parts of silicon carbide particles (SSC-A15 (manufactured by Shinano Electric Refining Co., Ltd.)).

[0105] <2> Fabrication, measurement, and evaluation of backing material sheets The backing material layer composition prepared above was poured into a square mold with a side length of 30 mm and the desired depth, and cured by heating at 80°C for 18 hours and then at 150°C for 1 hour to produce a square backing material sheet with a side length of 30 mm and the desired thickness. The depth of the mold used and the thickness of the resulting sheet were 2 mm or 0.5 mm, respectively. The following measurements and evaluations were performed on this backing material sheet.

[0106] (1) Measurement of glass transition temperature The loss tangent of the prepared 0.5 mm backing material sheet was measured using a dynamic viscoelasticity measuring device (Vibron: DVA-225 (trade name), manufactured by IT Measurement Control Co., Ltd.) under the conditions of a grip distance of 20 mm, a heating rate of 2°C / min, a measurement temperature range of -150°C to 250°C, and a frequency of 5 Hz, and the glass transition temperature was determined by calculating the maximum value of the loss tangent. The glass transition temperatures of the backing material sheets made of the backing material layer compositions were all in the range of 25°C to 35°C.

[0107] (2) Measurement of thermal conductivity Test pieces were prepared by cutting a 0.5 mm thick square backing material sheet into 5 mm wide strips. These test pieces were measured using the laser flash method in accordance with JIS (Japanese Industrial Standards) R 1611. Test pieces made from any of the backing material layer compositions showed a good value of 1.0 W / m K.

[0108] (3) Measurement of attenuation rate Based on the method described in JIS (Japanese Industrial Standards) Z 2354 (2012), Method for Measuring Ultrasonic Attenuation Coefficient of Solids, the intensity of the reflected echo was measured using a sing-around sound velocity measuring device (manufactured by Ultrasonic Industries, product name "UVM-2 Model"). The measurement was performed in water at 23°C using a 2 MHz measurement probe, and the attenuation rate was calculated from the difference in the intensity of the reflected echo with and without the test specimen used in the sound velocity measurement, and the thickness of the test specimen. All test specimens made from the backing material layer composition showed good attenuation rates exceeding 4.0 dB / mm MHz.

[0109] The above results demonstrate that a backing material using at least one of polyurea resin, epoxy resin having a polyurethane structure, and epoxy resin having a polyetheramine structure can achieve a glass transition temperature lower than the temperature inside the test object, while also achieving high heat dissipation and a high attenuation rate inside the test object.

[0110] As explained above, this specification describes at least the following:

[0111] (1) a distal end portion including an ultrasonic wave transmitting / receiving unit and an imaging unit; the ultrasonic transmitting / receiving unit includes an ultrasonic transducer and a backing material layer; The backing material layer has a glass transition temperature of 45 degrees or less.

[0112] (2) The ultrasonic endoscope according to (1), The ultrasonic endoscope has a glass transition temperature of 10 degrees or higher.

[0113] (3) The ultrasonic endoscope according to (2), The ultrasonic endoscope has a glass transition temperature of 40 degrees or less.

[0114] (4) The ultrasonic endoscope according to (3), The ultrasonic endoscope has a glass transition temperature of 20 degrees or higher.

[0115] (5) (4) An ultrasonic endoscope according to the present invention, The glass transition temperature of the ultrasonic endoscope is 25 degrees or higher and 35 degrees or lower.

[0116] (6) An ultrasonic endoscope according to any one of (1) to (5), the tip end portion is provided with a housing portion that houses the ultrasonic transmitting / receiving portion and a cable connected to the ultrasonic vibrator, and a filler that fills a gap in the housing portion; The hardness of the filler is greater than the hardness of the backing material layer.

[0117] (7) (6) An ultrasonic endoscope according to the present invention, The filler has a crosslink density of 500 mol / m 3 More than 12000mol / m 3 The following is an epoxy resin ultrasound endoscope.

[0118] (8) An ultrasonic endoscope according to any one of (1) to (5), The backing material layer of the ultrasonic endoscope is made of at least one of a polyurea resin, an epoxy resin having a polyurethane structure, and an epoxy resin having a polyetheramine structure.

[0119] (9) (8) The ultrasonic endoscope according to (8), The backing material layer is configured to contain a heat dissipating filler.

[0120] (10) (9) The ultrasonic endoscope according to (9), The thermal conductivity of the heat dissipation filler is 30 W / m·K or more.

[0121] (11) The ultrasonic endoscope according to (10), The heat dissipation filler includes at least one of aluminum oxide, tungsten oxide, silicon carbide, tungsten carbide, aluminum nitride, silicon nitride, boron nitride, and aluminum nitride.

[0122] (12) An ultrasonic endoscope according to any one of (1) to (5), The thickness of the backing material layer is 0.5 mm or more and 1.5 mm or less.

[0123] (13) The ultrasonic endoscope according to (12), The ultrasonic endoscope has a vibration frequency of the ultrasonic vibrator with a center frequency of 5 MHz or more and 12 MHz or less.

[0124] (14) An ultrasonic endoscope according to any one of (1) to (5), The ultrasonic endoscope has an ultrasonic transmitting / receiving unit disposed closer to the distal end than the imaging unit. [Explanation of symbols]

[0125] 10 Ultrasonic Inspection System 12 Endoscopic Ultrasound 14 Ultrasonic processor 16. Endoscope processor unit 18 Light source device 20 monitors 21a Water tank 21b Suction pump 22 Insertion section 24 Control section 26 Universal Code 28a Air and water supply button 28b Suction button 29 Angle knob 30 Treatment tool insertion port 32a, 32b, 32c connectors 34a Air and water supply tube 34b Suction tube 36 Ultrasound Observation Department 38 Endoscopic observation section 40 Tip 41 Exterior materials 42 Curved section 43 Soft part 44 Treatment tool outlet 45 Treatment tool channel 46 Ultrasonic transducer unit 47 Laminate 48 Ultrasonic transducer 49 Piezoelectric 50 Ultrasound transducer array 52 electrodes 52a Individual electrode 52b Resonator ground 54 Backing material layer 60 boards Areas 60a, 60b, and 60c 62 Electrode Pads 64 Ground electrode pad 76 Acoustic matching layer 78 Acoustic Lens 80 Fillers 82 Observation window 84 Objective Lens 86 image sensor 88 Lighting window 90 Cleaning nozzle 100 Cable 101 Covering part 102 Hull 102A Protrusion 106 Resin layer 108 Second shield layer 110 Signal Cable 112 signal line 112a conductor 112b insulating layer 114 Grand Line 116 1st signal line bundle 116a tip 118 First Shield Layer 130 Fixed part 410 Containment Space 410A 1st space 410B 2nd space AR1 1st area AR2 2nd area AR3 3rd area

Claims

1. a distal end portion including an ultrasonic wave transmitting / receiving unit and an imaging unit; the ultrasonic transmitting / receiving unit includes an ultrasonic transducer and a backing material layer; The backing material layer has a glass transition temperature of 45 degrees or less.

2. The ultrasonic endoscope according to claim 1, The glass transition temperature is 10 degrees or higher.

3. The ultrasonic endoscope according to claim 2, The glass transition temperature of the ultrasonic endoscope is 40 degrees or less.

4. The ultrasonic endoscope according to claim 3, The glass transition temperature of the ultrasonic endoscope is 20 degrees or higher.

5. The ultrasonic endoscope according to claim 4, The glass transition temperature is 25 degrees or more and 35 degrees or less.

6. 6. The ultrasonic endoscope according to claim 1, The tip portion is provided with a housing portion that houses the ultrasonic transmitting / receiving portion and a cable connected to the ultrasonic transducer, and a filler that fills a gap in the housing portion, An ultrasonic endoscope, wherein the hardness of the filler is greater than the hardness of the backing material layer.

7. The ultrasonic endoscope according to claim 6, The filler has a crosslink density of 500 mol / m ３ More than 12000mol / m ３ The following is an epoxy resin ultrasound endoscope.

8. 6. The ultrasonic endoscope according to claim 1, The backing material layer is made of at least one of a polyurea resin, an epoxy resin having a polyurethane structure, and an epoxy resin having a polyetheramine structure.

9. The ultrasonic endoscope according to claim 8, The backing material layer is configured to contain a heat dissipation filler.

10. The ultrasonic endoscope according to claim 9, The thermal conductivity of the heat dissipation filler is 30 W / m·K or more.

11. The ultrasonic endoscope according to claim 10, The heat dissipation filler includes at least one of aluminum oxide, tungsten oxide, silicon carbide, tungsten carbide, aluminum nitride, silicon nitride, boron nitride, and aluminum nitride.

12. 6. The ultrasonic endoscope according to claim 1, The thickness of the backing material layer is 0.5 mm or more and 1.5 mm or less.

13. The ultrasonic endoscope according to claim 12, The ultrasonic endoscope has a vibration frequency of the ultrasonic vibrator with a center frequency of 5 MHz or more and 12 MHz or less.

14. 6. The ultrasonic endoscope according to claim 1, The ultrasonic endoscope has an ultrasonic transmitter / receiver unit disposed closer to the distal end than the imaging unit.

Images