Display panel and display apparatus

Abstract

To provide a display panel including a dam that is disposed on a side of a base plate of the display panel and includes a first organic layer, where gas generated in the first organic layer of the dam flows out through a first via, so that a phenomenon of film layer peeling-off between the first organic layer and an inorganic layer is reduced, thereby improving the process performance of the display panel.SOLUTION: A display panel includes: a base plate; a dam disposed on a side of the base plate and including a first organic layer; and an inorganic layer disposed on a side of the dam away from the base plate and being in contact with and connected to the first organic layer. The inorganic layer is provided with a first via extending therethrough such that an orthographic projection of the first via on the base plate is located within an orthographic projection of the dam on the base plate. The inorganic layer is provided with the first via, and the orthographic projection of the first via on the base plate is located within the orthographic projection of the dam on the base plate.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present application relates to the technical field of display devices, and in particular to display panels and display devices. [Background technology]

[0002] Organic light-emitting diode (OLED) displays, also known as organic electroluminescence displays, have a number of advantages over existing LCDs, including self-luminance, wide viewing angles, ultra-lightweight, ultra-thin, high brightness, low power consumption, and fast response, with response speeds up to 1,000 times faster than LCDs. Therefore, OLED displays have become a popular flat panel display product both at home and abroad, with a wide range of potential applications.

[0003] However, the process performance of current display panels needs to be improved. Summary of the Invention

[0004] The embodiments of the present application provide a display panel and a display device that aim to improve the process performance of the display panel.

[0005] An embodiment of a first aspect of the present application provides a display panel, the display panel including: a substrate; a dam disposed on one side of the substrate and including a first organic layer; and an inorganic layer disposed on a side of the dam away from the substrate and in contact with and connected to the first organic layer, wherein a first through-hole is formed through the inorganic layer, and an orthogonal projection of the first through-hole on the substrate overlaps with an orthogonal projection of the first organic layer on the substrate.

[0006] According to an embodiment of the first aspect of the present application, an orthogonal projection of the first through-hole on the substrate is located within an orthogonal projection of the first organic layer on the substrate.

[0007] According to any of the above embodiments of the first aspect of the present application, a first conductive line is arranged on the side of the first organic layer facing the substrate, a second through hole is formed through the first conductive line, the first through hole includes a first sub-hole, and the orthogonal projection of the first sub-hole on the substrate is arranged to at least partially overlap with the orthogonal projection of the second through hole on the substrate.

[0008] According to any of the above embodiments of the first aspect of the present application, an orthogonal projection of the first sub-hole on the substrate is located within an orthogonal projection of the second through-hole on the substrate.

[0009] According to any of the embodiments of the first aspect of the present application, the orthogonal projections of the plurality of first sub-holes on the substrate are located within the orthogonal projections of the same dam on the substrate.

[0010] According to any one of the embodiments of the first aspect of the present application, the plurality of first sub-holes are provided at intervals along the extension direction of the dam.

[0011] According to any of the above embodiments of the first aspect of the present application, the number of first subholes and second through holes are both multiple, and the orthogonal projection of each first subhole on the substrate is located within the orthogonal projection of each second through hole on the substrate.

[0012] According to any of the above embodiments of the first aspect of the present application, the first through hole further includes a second subhole, the orthogonal projection of the second subhole on the substrate is located outside the orthogonal projection of the first conductive line on the substrate, and the area of ​​the orthogonal projection of the second subhole on the substrate is larger than the area of ​​the orthogonal projection of the first subhole on the substrate.

[0013] According to any of the embodiments of the first aspect of the present application, the second sub-hole is formed to extend along the extension direction of the dam.

[0014] According to any of the above embodiments of the first aspect of the present application, the display panel includes a display area and a non-display area surrounding the display area, the dam is located in the non-display area, the inorganic layer includes a pixel limiting portion located in the display area and a contact portion located in the non-display area, the first through hole is located in the contact portion, and a plurality of pixel openings are opened in the pixel limiting portion.

[0015] According to any of the above embodiments of the first aspect of the present application, a light-emitting unit is disposed within the pixel aperture.

[0016] According to any of the embodiments of the first aspect of the present application, the pixel element may further include an isolation structure disposed on the substrate, the isolation structure surrounding the isolation opening, and an orthogonal projection of the isolation opening on the substrate at least partially overlapping with an orthogonal projection of the pixel opening on the substrate.

[0017] According to any of the embodiments of the first aspect of the present application, the isolation structure is located on a side of the pixel limiting portion away from the substrate, or an accommodating opening is formed in the pixel limiting portion, and the isolation structure is disposed in the accommodating opening.

[0018] According to any of the embodiments of the first aspect of the present application, the isolation structure includes a first layer and a second layer located on a side of the first layer away from the substrate, and an orthogonal projection of the first layer on the substrate is located within an orthogonal projection of the second layer on the substrate.

[0019] According to any of the above embodiments of the first aspect of the present application, the material of the first layer comprises a conductive material.

[0020] According to any of the above embodiments of the first aspect of the present application, the isolation structure further includes a third layer, the third layer being located on a side facing the substrate of the first layer, and the orthogonal projection of the first layer on the substrate being located within the orthogonal projection of the third layer on the substrate.

[0021] According to any of the above embodiments of the first aspect of the present application, the number of dams is plural, the dams are mutually connected, and each dam includes the first organic layer.

[0022] A first aspect of the present application further provides a display panel, the display panel having a display area and a non-display area surrounding at least a portion of the display area, the display panel including a substrate, a dam disposed on one side of the substrate and disposed in the non-display area surrounding the display area, the dam including a first organic layer, and an inorganic layer disposed on a side of the dam away from the substrate, the inorganic layer having a first through-hole penetrating therethrough, the first through-hole exposing at least a portion of the first organic layer.

[0023] A first aspect of the present application further provides a display panel, the display panel having a display area and a non-display area surrounding at least a portion of the display area, the display panel including: a substrate; a dam disposed on the substrate and disposed in the non-display area surrounding the display area, the dam including a first organic layer; and a pixel definition layer disposed on the substrate, the pixel definition layer including a pixel limiting portion located in the display area and a contact portion located in the non-display area, the pixel limiting portion having a plurality of pixel openings, at least a portion of the contact portion covering the dam, and a first through-hole formed in the contact portion, and the orthogonal projection of the first through-hole on the substrate overlaps with the orthogonal projection of the first organic layer on the substrate.

[0024] An embodiment of the second aspect of the present application further provides a display device including any of the display panels of the embodiments of the first aspect described above.

[0025] In a display panel according to an embodiment of the present application, the display panel includes a substrate, a dam, and an inorganic layer. The dam includes a first organic layer, and during the preparation process of the first organic layer, the first organic layer may release oxygen to form gas. The inorganic layer has good compaction performance, and delamination may occur due to gas flow between the inorganic layer and the first organic layer. A first through-hole is formed in the inorganic layer, and the orthogonal projection of the first through-hole on the substrate overlaps with the orthogonal projection of the first organic layer on the substrate. This allows gas generated in the first organic layer to overflow through the first through-hole, thereby eliminating the delamination caused by gas remaining between the first organic layer and the inorganic layer and improving the processability of the display panel. [Brief explanation of the drawings]

[0026] Other features, objects and advantages of the present application will become more apparent from the following detailed description of non-limiting examples, taken in conjunction with the accompanying drawings, in which identical or similar reference numerals indicate identical or similar features.

[0027] [Figure 1] 1 is a structural schematic diagram of a display panel according to an embodiment of the present application; [Figure 2] 2 is a partially enlarged schematic structural view at position P in FIG. 1. [Figure 3] FIG. 3 is a cross-sectional view taken along line AA in FIG. 2. [Figure 4] FIG. 4 is a partially enlarged schematic structural view of FIG. 3. [Figure 5] FIG. 3 is a cross-sectional view taken along line BB in FIG. [Figure 6] FIG. 3 is a cross-sectional view taken along line CC in FIG. [Figure 7] FIG. 10 is a structural schematic diagram of a display panel according to another embodiment of the present application. [Explanation of symbols]

[0028] 100 boards 110 Dam 111 1st organic layer 120 First conductive wire 121 Second through hole 130 cushion layer 140 Planarization layer 200 Inorganic layer 210 Pixel Limited Section 220 Contact part 230 pixel aperture 240 First through hole 241 Subhall No. 1 242 Second Sub-Hall 300 luminescent layer 310 Light Emitting Unit 400 sealing layer 410 First sealing layer 411 Sealing part 420 Second sealing layer 430 Third sealing layer 500 isolation structure 510 Isolation opening 520 1st layer 530 2nd layer 540 3rd layer 700 1st electrode layer 710 1st electrode 800 2nd electrode layer 810 2nd electrode AA display area NA hidden area DETAILED DESCRIPTION OF THE INVENTION

[0029] Features and exemplary embodiments of various aspects of the present application are described in detail below. In the following detailed description, numerous specific details are set forth to provide a thorough understanding of the present application. However, it will be apparent to those skilled in the art that the present application may be practiced without some of these specific details. The following description of the embodiments is intended to provide a better understanding of the present application by merely illustrating examples of the present application. In the accompanying drawings and the following description, at least some well-known structures and techniques may not be shown to avoid unnecessarily obscuring the present application, and the size of some structures may be exaggerated for clarity. Furthermore, the features, structures, or characteristics described below may be combined in any suitable manner in one or more embodiments.

[0030] In the description of this application, unless otherwise specified, "plurality" means two or more. Terms such as "upper," "lower," "left," "right," "inner," and "outer" indicate a direction or relationship solely for convenience and simplicity of description of this application, but are not intended to suggest or imply that the devices or elements referenced must have a particular orientation or be constructed and operated in a particular orientation. Thus, they should not be construed as limitations on this application. Furthermore, terms such as "first," "second," and the like are used for descriptive purposes only and should not be construed as suggesting or implying relative importance.

[0031] All directional terms appearing in the following description refer to the directions shown in the drawings and do not limit the specific structure of the embodiments of the present application. In the description of the present application, unless otherwise clearly specified and limited, the terms "installed" and "connected" should be understood in a broad sense. For example, they may be fixedly connected, detachably connected, or integrally connected, and may be directly or indirectly connected. Those skilled in the art will understand the specific meanings of the above terms in the present application based on the specific circumstances.

[0032] In a display panel according to the related art, the display panel includes a substrate and a dam disposed on the substrate. The height of the dam is increased. Other film layers are then disposed on the dam, but the applicant discovered that peeling problems tend to occur between the dam and the other film layers. After further research, the applicant discovered that this is because an organic film layer is typically disposed within the dam, the dam is formed by stacking organic film layers, and an inorganic film layer is typically disposed on the dam, which has good compaction properties. If gas is generated during the preparation process of the organic film layer, the gas will flow between the inorganic film layer and the organic film layer, causing peeling problems between the inorganic film layer and the dam.

[0033] In order to improve the above technical problems, the present application is proposed. To better understand the present application, a display panel and a display device according to an embodiment of the present application will be described in detail below with reference to FIGS.

[0034] FIG. 1 is a structural schematic diagram of a display panel according to an embodiment of the present application, FIG. 2 is a partially enlarged structural schematic diagram at position P in FIG. 1, FIG. 3 is a cross-sectional view taken along line AA in FIG. 1, and FIG. 4 is a partially enlarged structural schematic diagram of FIG. 3.

[0035] As shown in Figures 1 to 4, an embodiment of the first aspect of the present application provides a display panel, which includes a substrate 100, a dam 110 arranged on one side of the substrate 100 and including a first organic layer 111, and an inorganic layer 200 arranged on a side of the dam 110 away from the substrate 100 and in contact with and connected to the first organic layer 111, wherein a first through-hole 240 is formed through the inorganic layer 200, and the orthogonal projection of the first through-hole 240 on the substrate 100 overlaps with the orthogonal projection of the first organic layer 111 on the substrate 100.

[0036] In the display panel according to the embodiment of the present application, the display panel includes a substrate 100, a dam 110, and an inorganic layer 200. The dam 110 includes a first organic layer 111. During the preparation process of the first organic layer 111, the first organic layer 111 may release oxygen to form gas. The inorganic layer 200 has good compaction performance, and delamination may occur due to gas flow between the inorganic layer 200 and the first organic layer 111. The inorganic layer 200 has a first through-hole 240. The orthogonal projection of the first through-hole 240 on the substrate 100 overlaps with the orthogonal projection of the first organic layer 111 on the substrate 100. This allows gas generated in the first organic layer 111 to overflow through the first through-hole 240, thereby eliminating the delamination caused by gas remaining between the first organic layer 111 and the inorganic layer 200 and improving the processability of the display panel.

[0037] Optionally, the orthogonal projection of the first through-hole 240 on the substrate 100 is located within the orthogonal projection of the first organic layer 111 on the substrate 100 , so that more gas can overflow from the first through-hole 240 .

[0038] The substrate 100 may be provided in various ways. The substrate 100 may include a substrate and a first conductive layer, a second conductive layer, and a third conductive layer stacked on one side of the substrate. An insulating layer is disposed between adjacent conductive layers. Exemplarily, a pixel driving circuit is disposed within the substrate 100, and the pixel driving circuit includes a transistor and a storage capacitor. The transistor includes a semiconductor, a gate, a source, and a drain. The storage capacitor includes a first electrode plate and a second electrode plate. For example, the gate and the first electrode plate may be located on the first conductive layer, the second electrode plate may be located on the second conductive layer, and the source and drain may be located on the third conductive layer.

[0039] Optionally, the substrate 100 includes a planarization layer 140, and the material of the planarization layer 140 includes an organic material.

[0040] Alternatively, the first organic layer 111 in the dam 110 and the planarization layer 140 may be disposed in the same layer and made of the same material. That is, when manufacturing the planarization layer 140, the organic material located on the dam 110 may remain to form the dam 110, thereby increasing the height of the dam 110 and simplifying the manufacturing process of the display panel.

[0041] Optionally, the substrate 100 further includes a plurality of conductive layers, and an insulating layer is disposed between the plurality of conductive layers. When manufacturing the insulating layer, part of the material in the dam 110 can be left to form the first organic layer 111, that is, the insulating layer and the first organic layer 111 are disposed in the same layer and made of the same material.

[0042] Optionally, the material of the first organic layer 111 includes an organic material. The first organic layer 111 can have a greater thickness to ensure that the dam 110 has a greater height.

[0043] In some optional embodiments, the orthogonal projection of the first through-hole 240 on the substrate 100 is located within the orthogonal projection of the first organic layer 111 on the substrate 100. This allows gas generated in the first organic layer 111 to overflow from the first through-hole 240 more quickly.

[0044] The number of first through-holes 240 may be one or more. The plurality of first through-holes 240 may be spaced apart and distributed along the extension direction of the dam 110. By arranging the plurality of first through-holes 240, gas can be released from different positions in the organic layer, and the problem of film delamination between the organic layer and the contact portion 220 can be improved.

[0045] Optionally, the number of dams 110 may be one. One dam 110 forms a closed ring around the display area AA. Optionally, the extension direction of the dam 110 may be the direction in which the dam 110 extends around the display area AA. For example, if portions of the dam 110 located on both sides of the display area AA in the first direction extend along the second direction, the extension direction of the portions of the dam 110 located on both sides of the display area AA in the first direction is the second direction. If portions of the dam 110 located on both sides of the display area AA in the second direction extend along the first direction, the extension direction of the portions of the dam 110 located on both sides of the display area AA in the second direction is the first direction.

[0046] Alternatively, the number of dams 110 may be two or more. The two or more dams 110 are mutually connected. Each dam 110 has a corresponding first through-hole 240, i.e., each dam 110 has a corresponding first through-hole 240 above the organic layer, which can more effectively alleviate the problem of film delamination occurring between the organic layer and the contact portion 220.

[0047] 5 and 6 , a first conductive line 120 is disposed on the side of the first organic layer 111 facing the substrate 100, and a second through hole 121 is formed through the first conductive line 120, and the first through hole 240 includes a first subhole 241, and the orthogonal projection of the first subhole 241 on the substrate 100 at least partially overlaps with the orthogonal projection of the second through hole 121 on the substrate 100. This allows the inorganic layer 200 to cover at least a portion of the inner wall surface of the first conductive line 120 facing the second through hole 121.

[0048] Optionally, the orthogonal projection of the first sub-hole 241 on the substrate 100 is located within the orthogonal projection of the second through-hole 121 on the substrate 100 .

[0049] In these alternative embodiments, a second through hole 121 is also opened in the first conductive line 120, and the orthogonal projection of the first sub-hole 241 on the substrate 100 is located within the orthogonal projection of the second through hole 121 on the substrate 100; that is, the size of the first sub-hole 241 is smaller than the size of the second through hole 121. A portion of the inorganic layer 200 extends into the second through hole 121 and wraps around the inner wall surface of the first conductive line 120 facing the second through hole 121, so that the inorganic layer 200 can protect the first conductive line 120.

[0050] Alternatively, the display panel may have a display area AA and a non-display area NA disposed around the display area AA, and the dam 110 may be disposed in the non-display area NA and around the display area AA. The first conductive line 120 may be disposed so as to cross the dam 110 in a direction from the display area AA toward the non-display area NA, or the first conductive line 120 may be disposed parallel to a portion of the dam 110.

[0051] Alternatively, the first conductive line 120 may be a power signal line, for example, the first conductive line 120 may be used to transmit a low-level voltage signal ELVSS, or the first conductive line 120 may be used to transmit a driving power supply voltage signal ELVDD.

[0052] Alternatively, the first conductive line 120 may be disposed as a single layer, or may include multiple conductive layers arranged in a stack. For example, the first conductive line 120 may include a first sublayer and a second sublayer arranged in a stack, where the second sublayer is located on the side of the first sublayer away from the substrate 100, and the material of the first sublayer may be aluminum. The material of the second sublayer may be titanium. Alternatively, the first conductive line 120 may further include a third sublayer located on the side of the first sublayer away from the second sublayer, and the material of the third sublayer may include titanium.

[0053] Optionally, a cushion layer 130 is disposed on the side of the first conductive line 120 facing the substrate 100, and the material of the cushion layer 130 can include an organic material. During the preparation process, the thickness of the first organic layer 111 above the first conductive line 120 is relatively thin due to the good fluidity of the organic material. During the etching process of the inorganic layer 200, the etching gas can include oxygen gas, which can etch and remove the thinner first organic layer 111 to expose the second sublayer. The etching gas can include fluorine gas, which can react with titanium to damage the second sublayer and cause leakage of the first sublayer. If the material of the first sublayer includes aluminum, the aluminum can react with oxygen to form a large amount of aluminum oxide, which can cause film delamination and lead to deterioration of the seal.

[0054] In the embodiment of the present application, the first conductive line 120 has a second through hole 121, and the inorganic layer 200 can cover the inner wall surface of the first conductive line 120 facing the second through hole 121. That is, the area where the first conductive line 120 exists is covered by the contact portion 220, which can reduce the probability that the first conductive line 120 will be deformed by etching or react with oxygen elements, thereby further improving the sealing rate.

[0055] The number of first sub-holes 241 and second through-holes 121 may be arranged in various ways, for example, the number of first sub-holes 241 and the number of second through-holes 121 may both be one. Alternatively, in some other embodiments, the number of first sub-holes 241 and the number of second through-holes 121 may both be plural, and the orthogonal projection of each first sub-hole 241 on the substrate 100 is located within the orthogonal projection of each second through-hole 121 on the substrate 100. This allows the inorganic layer 200 to better protect the first conductive lines 120.

[0056] Optionally, when there are a plurality of first subholes 241, the orthogonal projections of the plurality of first subholes 241 on the substrate 100 are located within the orthogonal projections of the same dam 110 on the substrate 100. The plurality of first subholes 241 may be spaced apart along the extension direction of the dam 110 so that gases generated from the first organic layer 111 at different positions can all flow out through the first subholes 241.

[0057] In some optional embodiments, the first through hole 240 further includes a second subhole 242, the orthogonal projection of the second subhole 242 on the substrate 100 is located outside the orthogonal projection of the first conductive line 120 on the substrate 100, and the area of ​​the orthogonal projection of the second subhole 242 on the substrate 100 is larger than the area of ​​the orthogonal projection of the first subhole 241 on the substrate 100.

[0058] In these optional embodiments, the first through-hole 240 may further include a second sub-hole 242 that does not overlap the first conductive line 120. The size of the second sub-hole 242 is larger than the size of the first sub-hole 241. That is, since the size of the first sub-hole 241 is smaller, the inorganic layer 200 can better cover the first conductive line 120. The larger the size of the second sub-hole 242, the faster the gas generated in the first organic layer 111 overflows the inorganic layer 200, thereby better alleviating the problem of easy peeling between the inorganic layer 200 and the first organic layer 111.

[0059] Alternatively, the display panel may include only the second sub-hole 242 and not the first sub-hole 241 .

[0060] As described above, the display panel further includes a display area AA and a non-display area NA, the dam 110 is located in the non-display area NA, the inorganic layer 200 includes a pixel limiting portion 210 located in the display area AA and a contact portion 220 located in the non-display area NA, the first through-hole 240 is disposed in the contact portion 220, and a plurality of pixel openings 230 are opened in the pixel limiting portion 210.

[0061] In these alternative embodiments, the pixel defining portion 210 and the contact portion 220 are arranged in the same layer, i.e., the film layer in which the first through-hole 240 is formed and the film layer in which the pixel opening 230 is formed are arranged in the same layer, and when manufacturing the pixel defining layer, some material can be left to cover the dam 110, thereby simplifying the manufacturing process of the display panel and improving the manufacturing efficiency of the display panel.

[0062] In these alternative embodiments, the non-display area NA includes a lower frame, and the first through-holes 240 are disposed in at least the lower frame.

[0063] Optionally, the display panel further includes a light-emitting layer 300, which includes a light-emitting unit 310 located within the pixel opening 230 to realize light-emitting display of the display panel.

[0064] In some optional embodiments, as shown in Figures 1 to 7, the display panel further includes an isolation structure 500, which is disposed on the substrate 100 and surrounds the isolation structure 500 to form an isolation opening 510, and the orthogonal projection of the isolation opening 510 on the substrate 100 at least partially overlaps with the orthogonal projection of the pixel opening 230 on the substrate 100.

[0065] In these alternative embodiments, the isolation structure 500 can be arranged to separate the light-emitting material into multiple light-emitting units 310 that are independent of each other and located within each isolated opening 510, thereby omitting the deposition process of a precision mask reticle and simplifying the manufacturing process of the display panel. The orthogonal projection of the isolated opening 510 on the substrate 100 at least partially overlaps with the orthogonal projection of the pixel opening 230 on the substrate 100, and the light-emitting units 310 can be located within the isolated opening 510 and the pixel opening 230 simultaneously.

[0066] Optionally, the orthogonal projection of the pixel opening 230 on the substrate 100 is located within the orthogonal projection of the isolation opening 510 on the substrate 100, i.e., the size of the isolation opening 510 is larger than the size of the pixel opening 230, and more light-emitting material falls into the pixel opening 230.

[0067] A first electrode layer 700 is disposed on the optional substrate 100, and the first electrode layer 700 includes a plurality of spaced apart first electrodes 710, where the orthogonal projection of each first electrode 710 on the substrate 100 at least partially overlaps with the orthogonal projection of each pixel opening 230 on the substrate 100, and the first electrodes 710 can drive the light-emitting units 310 in the pixel openings 230 to emit light. Optionally, the orthogonal projection of the pixel openings 230 on the substrate 100 is located within the orthogonal projection of the first electrodes 710 on the substrate 100, increasing the contact area between the light-emitting units 310 and the first electrodes 710.

[0068] Optionally, the display panel further includes a second electrode layer 800, which includes a second electrode 810 located on a side of each light-emitting unit 310 away from the substrate 100, and the second electrode 810 and the first electrode 710 interact with each other to drive the light-emitting unit 310 to emit light. Optionally, the material of the isolation structure 500 includes a conductive material, and the second electrode 810 and the isolation structure 500 are in contact with and connected to each other, so that the second electrodes 810 are connected to each other via the isolation structure 500 to form a full-surface electrode.

[0069] Optionally, the display panel further includes a sealing layer 400, which includes a first sealing layer 410, which includes a sealing portion 411 located on the side of each second electrode 810 away from the substrate 100, and each sealing portion 411 can seal each light-emitting unit 310 and reduce the impact of water and oxygen intrusion on the light-emitting effect of the light-emitting unit 310.

[0070] Optionally, the encapsulating portion 411 is located in the display area AA. The encapsulating layer 400 further includes a second encapsulating layer 420 located on the side of the first encapsulating layer 410 away from the substrate 100, and the second encapsulating layer 420 is in contact with and connected to at least a portion of the contact portion 220. If the contact area between the first encapsulating layer 410 and the second encapsulating layer 420 is excessively large, the second encapsulating layer 420 will have excessive fluidity, which can affect the sealing performance.

[0071] Optionally, the second sealing layer 420 and the contact portion 220 both extend to the non-display area NA and are in contact with and connected to each other in the non-display area NA. The first sealing layer 410 is located within the display area AA, and the second sealing layer 420 and the contact portion 220 protrude from the first sealing layer 410 and are connected to each other.

[0072] Optionally, each sealing portion 411 is located on the side of each second electrode 810 away from the substrate 100 , and the sealing portion 411 can protect each second electrode 810 .

[0073] Optionally, the orthogonal projection of each second electrode 810 on the substrate 100 is located within the orthogonal projection of each sealing portion 411 on the substrate 100, i.e., the size of the sealing portion 411 is larger than the size of the second electrode 810, and the sealing portion 411 can better protect the second electrode 810.

[0074] Optionally, the orthogonal projection of each isolation opening 510 on the substrate 100 is located within the orthogonal projection of each sealing portion 411 on the substrate 100, i.e., the size of the sealing portion 411 is larger, and the sealing portion 411 can extend to the surface of the isolation structure 500 away from the substrate 100 to provide better sealing performance.

[0075] Optionally, there is a gap between adjacent sealing portions 411, and the gap is located on the side of the isolation structure 500 away from the substrate 100, that is, the multiple sealing portions 411 are arranged independently of each other.

[0076] Optionally, the material of the inorganic layer 200 can include at least one of silicon nitride, silicon oxide, and silicon oxynitride.

[0077] Alternatively, inorganic layer 200 may be a single layer film layer, or inorganic layer 200 may include multiple film layers arranged one on top of the other, i.e., inorganic layer 200 may be formed by stacking multiple film layers.

[0078] Alternatively, the deposition conditions for the inorganic layer 200 are 150°C or higher. Therefore, compared with the deposition conditions for the first sealing layer 410, the film quality is denser, and there are relatively fewer free atoms of oxygen elements, which plays a certain buffering role in preventing the overflow of the second sealing layer 420.

[0079] Optionally, the material of the first sealing layer 410 includes an inorganic material, that is, the material of each sealing portion 411 includes an inorganic material, and the sealing portion 411 has good compactness, and the sealing portion 411 can provide better compactness protection for each light-emitting unit 310.

[0080] Optionally, the material of the second encapsulation layer 420 includes an organic material, and the second encapsulation layer 420 can have a larger thickness, and the flatness of the entire surface of the encapsulation layer 400 can be adjusted.

[0081] In some optional embodiments, the sealing layer 400 further includes a third sealing layer 430 located on the side of the second sealing layer 420 away from the substrate 100, the third sealing layer 430 extending from the second sealing layer 420 in the non-display area NA and contacting and connected to the contact portion 220.

[0082] In these optional embodiments, the sealing layer 400 further includes a third sealing layer 430, which extends from the second sealing layer 420 in the non-display area NA, i.e., the size of the third sealing layer 430 is larger than the size of the second sealing layer 420, and the third sealing layer 430 is in contact with and connected to the contact portion 220 outside the second sealing layer 420, which can improve the overall sealing performance of the sealing layer 400.

[0083] Optionally, the edge of the second encapsulating layer 420 as orthogonally projected onto the substrate 100 is located on the side of the outer edge of the contact portion 220 as orthogonally projected onto the substrate 100, facing the display area AA. That is, the edge of the contact portion 220 extends from the second encapsulating layer 420 along the direction from the display area AA toward the non-display area NA, and the contact portion 220 can be hermetically connected to the third encapsulating layer 430 outside the second encapsulating layer 420. That is, a portion of the contact portion 220 is in contact with and connected to the second encapsulating layer 420, and another portion of the contact portion 220 is in contact with and connected to the third encapsulating layer 430, thereby increasing the contact area between the contact portion 220 and the second encapsulating layer 420 and the third encapsulating layer 430 and improving the sealing effect of the encapsulating layer 400.

[0084] Optionally, the orthogonal projection of the second encapsulating layer 420 on the substrate 100 is located within the orthogonal projection of the third encapsulating layer 430 on the substrate 100. That is, the size of the third encapsulating layer 430 is larger than the size of the second encapsulating layer 420, and the third encapsulating layer 430 can provide a longer sealing length, thereby further improving the sealing effect of the encapsulating layer 400.

[0085] Optionally, the material of the third sealing layer 430 includes an inorganic material, so that the third sealing layer 430 has a better densifying effect and can improve the overall sealing performance of the sealing layer 400 .

[0086] Optionally, the second encapsulation layer 420 is located on the side of the dam 110 towards the display area AA, and the contacts 220 and the third encapsulation layer 430 extend on the side of the dam 110 away from the display area AA.

[0087] In these optional embodiments, the second sealing layer 420 is located on the side of the dam 110 facing the display area AA, the second sealing layer 420 is limited by the area surrounded by the dam 110, and the third sealing layer 430 and the contact portion 220 extend on the side of the dam 110 away from the display area AA, i.e., the third sealing layer 430 and the contact portion 220 extend to the outside of the dam 110, which can increase the sealing length and improve the sealing rate.

[0088] Optionally, in the region of the dam 110, the contact portion 220 is in contact with the third encapsulation layer 430, i.e., the contact portion 220 and the third encapsulation layer 430 are in contact with and connected to the side of the dam 110 away from the substrate 100, and the height of the dam 110 is usually high, so that the high step can be increased by the dam 110. The contact portion 220 and the third encapsulation layer 430 are in contact with and connected to the position with the large step, which can further improve the encapsulation rate.

[0089] The isolation structure 500 may be provided in various ways. For example, the isolation structure 500 may be a single-layer structure, including a first surface facing the substrate 100 and a second surface away from the substrate 100, where the orthogonal projection of the first surface on the substrate 100 is located within the orthogonal projection of the second surface on the substrate 100. That is, the size of the first surface is smaller than the size of the second surface, and a recessed structure may be formed below the second surface. When the light-emitting units 310 are subsequently manufactured, the light-emitting material is divided into a plurality of light-emitting units 310 that are independent of each other at the edge of the second surface.

[0090] Alternatively, in another embodiment, the isolation structure 500 includes a first layer 520 and a second layer 530 arranged in a stacked manner, the second layer 530 being located on the side of the first layer 520 away from the substrate 100, and the orthogonal projection of the first layer 520 on the substrate 100 being located within the orthogonal projection of the second layer 530 on the substrate 100. That is, the size of the first layer 520 is smaller than the size of the second layer 530, so that a recessed structure can be formed under the second layer 530. When the light-emitting units 310 are subsequently manufactured, the light-emitting material is divided into a plurality of light-emitting units 310 that are independent of each other at the edges of the second layer 530.

[0091] Optionally, the material of the first layer 520 may include a conductive material and may be in contact with and connected to the second electrodes 810, so that the multiple second electrodes 810 are connected to each other via the first layer 520 to form a full-surface electrode.

[0092] Optionally, the material of the second layer 530 includes a conductive material, and the material of the second layer 530 is different from the material of the first layer 520. In these optional embodiments, the material of the second layer 530 includes a conductive material that can increase the distribution area of ​​the conductive structure and reduce the overall resistance of the second electrode 810. Because the material of the second layer 530 is different from the material of the first layer 520, different etching rates when the different materials react with the same etchant can be used to form the first layer 520 and the second layer 530 with different sizes.

[0093] Optionally, the isolation structure 500 further includes a third layer 540 located on a side of the first layer 520 facing the substrate 100, and an orthogonal projection of the first layer 520 on the substrate 100 is located within an orthogonal projection of the third layer 540 on the substrate 100. When the first layer 520 is side-etched to form the isolation structure 500, the third layer 540 can play a protective role and can improve the etching effect on the film layer on the side of the third layer 540 facing the substrate 100.

[0094] In any of the above embodiments, the relative positional relationship between the isolation structure 500 and the inorganic layer 200 may be variously arranged. For example, the isolation structure 500 may be located on the side of the inorganic layer 200 that is farther from the substrate 100, or the isolation structure 500 may be located on the side of the pixel limiting portion 210 that is farther from the substrate 100. Alternatively, a receiving opening may be formed in the pixel limiting portion 210, and the isolation structure 500 may be located in the receiving opening and directly contact and connect to the substrate 100.

[0095] An embodiment of the first aspect of the present application further provides a display panel, the display panel having a display area AA and a non-display area NA arranged around at least a portion of the display area AA, the display panel including a substrate 100, a dam 110 arranged on one side of the substrate 100 and arranged around the display area AA of the non-display area NA, the dam 110 including a first organic layer 111, and an inorganic layer 200 arranged on a side of the dam 110 away from the substrate 100, the inorganic layer 200 having a first through-hole 240 penetrating therethrough, the first through-hole 240 exposing at least a portion of the first organic layer 111.

[0096] In the embodiment of the present application, the first through-hole 240 exposes at least a portion of the first organic layer 111, i.e., at least a portion of the first organic layer 111 can be exposed through the first through-hole 240, and gas generated in the first organic layer 111 can leak through the first through-hole 240, thereby improving the problem of easy peeling caused by the presence of gas between the first organic layer 111 and the inorganic layer 200.

[0097] An embodiment of the first aspect of the present application further provides a display panel, the display panel having a display area AA and a non-display area NA surrounding at least a part of the display area AA, the display panel including: a substrate 100; a dam 110 disposed on the substrate 100 and disposed around the display area AA of the non-display area NA, the dam 110 including a first organic layer 111; and a pixel definition layer disposed on the substrate 100, the pixel definition layer including a pixel limiting portion 210 located in the display area AA and a contact portion 220 located in the non-display area NA, the pixel limiting portion 210 having a plurality of pixel openings 230 formed therein, wherein at least a part of the contact portion 220 covers the dam 110, the contact portion 220 having a first through-hole 240 formed therein, and the orthogonal projection of the first through-hole 240 on the substrate 100 overlaps with the orthogonal projection of the first organic layer 111 on the substrate 100.

[0098] In these alternative embodiments, the display panel includes a substrate 100, a dam 110, and a pixel defining layer. The dam 110 is disposed to surround the display area AA and is used to confine the encapsulating material of the organic encapsulation layer 400. The pixel defining layer includes a pixel defining portion 210 and a contact portion 220. The pixel defining portion 210 has a pixel opening 230 for accommodating the light-emitting unit 310 to realize luminescence display of the display panel. The contact portion 220 covers the dam 110, and a first through-hole 240 is formed in the contact portion 220, allowing gas generated in the first organic layer 111 to escape, thereby improving the problem of easy peeling between the contact portion 220 and the first organic layer 111.

[0099] Alternatively, the material of the pixel defining layer may include an inorganic material, and the application manner of the pixel defining layer may be the same as that of the inorganic layer 200 described above.

[0100] Optionally, the manner in which the substrate 100 and the dam 110 are installed is as described above and will not be repeated here.

[0101] Here, Chinese patent application numbers 202311117143.6, 202310759370.2, 202310771124.9, 202311499823.9, 202310731471.9, 202410008807.3, 202311091555.7, and 202310707209.0 record related technical solutions such as isolation structures, the contents of which are incorporated herein by reference and will not be repeated in this embodiment.

[0102] An embodiment of the second aspect of the present application further provides a display device including any of the display panels of the embodiments of the first aspect. Because the display device according to the embodiment of the second aspect of the present application includes any of the display panels of the embodiments of the first aspect, the display device according to the embodiment of the second aspect of the present application has the beneficial effects of any of the display panels of the embodiments of the first aspect, which will not be repeated here.

[0103] The display device in the embodiments of the present application includes, but is not limited to, devices with display capabilities such as mobile phones, personal digital assistants (abbreviated as PDA), tablet computers, e-books, televisions, access control, smart landlines, consoles, etc.

[0104] Although the present application has been described with reference to preferred embodiments, various modifications may be made and equivalents may be substituted for its components without departing from the scope of the present application. In particular, the technical features mentioned in the various embodiments may be combined in any manner unless there is a structural contradiction. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A display panel, The display panel includes: A substrate; a dam disposed on one side of the substrate and including a first organic layer; an inorganic layer disposed on a side of the dam away from the substrate and connected to the first organic layer in contact therewith; A display panel, characterized in that a first through-hole is formed through the inorganic layer, and an orthogonal projection of the first through-hole on the substrate overlaps with an orthogonal projection of the first organic layer on the substrate.

2. an orthogonal projection of the first through hole on the substrate is located within an orthogonal projection of the first organic layer on the substrate; The display panel according to claim 1 .

3. The display panel includes: The device further includes a first conductive line disposed on a side of the first organic layer facing the substrate, wherein a second through-hole is formed through the first conductive line, the first through-hole includes a first sub-hole, and an orthogonal projection of the first sub-hole on the substrate is disposed to at least partially overlap with an orthogonal projection of the second through-hole on the substrate. The display panel according to claim 1 .

4. The display panel according to claim 3 , wherein an orthogonal projection of the second through-hole on the substrate is located within an orthogonal projection of the dam on the substrate.

5. The display panel of claim 3 , wherein an orthogonal projection of the first sub-hole on the substrate is located within an orthogonal projection of the second through-hole on the substrate.

6. orthogonal projections of the first subholes on the substrate are located within orthogonal projections of the same dam on the substrate; The display panel of claim 3 , wherein the first sub-holes are spaced apart from one another along the extending direction of the dam.

7. 4. The display panel of claim 3, wherein the number of the first subholes and the number of the second through holes are both plural, the first subholes and the second through holes correspond to each other one-to-one, and the orthogonal projection of each of the first subholes is located within the orthogonal projection of the corresponding second through hole.

8. The display panel of claim 3 , wherein the first conductive lines include power signal lines.

9. The inorganic layer covers an inner wall surface of the first conductive line facing the second through hole. The display panel according to claim 3 .

10. The display panel of claim 3 , wherein the first through hole further includes a second sub-hole, and an orthogonal projection of the second sub-hole on the substrate is positioned outside an orthogonal projection of the first conductive line on the substrate.

11. a length of the second sub-hole in the extension direction of the dam is longer than a length of the first sub-hole in the extension direction of the dam; The display panel of claim 10 , wherein an area of ​​the second sub-holes projected orthogonally onto the substrate is larger than an area of ​​the first sub-holes projected orthogonally onto the substrate.

12. The second sub-hole is formed to extend along the extension direction of the dam. The display panel according to claim 10.

13. the display panel includes a display area and a non-display area surrounding the display area, the dam is located in the non-display area, the inorganic layer includes a pixel limiting portion located in the display area and a contact portion located in the non-display area, the first through-hole is located in the contact portion, and a plurality of pixel openings are formed in the pixel limiting portion, A light-emitting unit is disposed within the pixel opening, the pixel opening is formed on the substrate; and the pixel opening is formed on the substrate. The ... The isolation structure is located on a side of the pixel defining portion away from the substrate, or the pixel defining portion has a receiving opening, and the isolation structure is disposed in the receiving opening. The display panel according to claim 1 .

14. the isolation structure includes a first layer and a second layer located on a side of the first layer away from the substrate, and an orthogonal projection of the first layer on the substrate is located within an orthogonal projection of the second layer on the substrate; the material of the first layer includes a conductive material; The isolation structure further includes a third layer, the third layer being located on a side of the first layer facing the substrate, and an orthogonal projection of the first layer on the substrate being located within an orthogonal projection of the third layer on the substrate, or an orthogonal projection of the first layer on the substrate being overlapped with an orthogonal projection of the third layer on the substrate. The display panel according to claim 13.

15. The display panel includes a display area and a non-display area surrounding the display area, the number of the dams is plural, the dams are sequentially arranged along a direction from the display area to the non-display area, and each of the dams includes the first organic layer. The display panel according to claim 1 .

16. A display panel, The display panel has a display area and a non-display area surrounding at least a part of the display area, and the display panel A substrate; a dam disposed on one side of the substrate, the dam being disposed in the non-display area to surround the display area, the dam including a first organic layer; an inorganic layer disposed on a side of the dam away from the substrate; A display panel, comprising: a first through-hole formed through the inorganic layer, the first through-hole exposing at least a partial region of the first organic layer.

17. A display panel, The display panel has a display area and a non-display area surrounding at least a part of the display area, and the display panel A substrate; a dam disposed on one side of the substrate and surrounding the display area in the non-display area, the dam including a first organic layer; a pixel defining layer disposed on one side of the substrate, the pixel definition layer includes a pixel defining portion located in the display area and a contact portion located in the non-display area, the pixel defining portion having a plurality of pixel openings; Here, at least a portion of the contact portion covers the dam, a first through hole is opened in the contact portion, and a positive projection of the first through hole on the substrate overlaps with a positive projection of the first organic layer on the substrate.

18. A display device comprising the display panel according to any one of claims 1 to 17.

Images