Display device and tiled display device

Abstract

To provide a display device and a tiled display device.SOLUTION: A display device and a tilted display device can be provided. The display device and the tilted display device comprise: a first substrate including a display area and a non-display area surrounding the display area; a light emitting device provided in the display area on the first substrate; a first pad part provided in the non-display area on an upper surface of the first substrate and arranged in one side edge of the first substrate; a second substrate provided on a lower surface of the first substrate; a second pad part provided in the non-display area on a lower surface of the second substrate and arranged in one side edge of the second substrate; a side surface link line electrically connecting the first pad part and the second pad part; a side surface coating layer arranged so as to cover the side surface link line; a side surface protection layer arranged so as to cover at least a part of the side surface coating layer; and a side surface sealing layer arranged so as to cover at least a part of the side surface protection layer.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] SUMMARY OF THE DISCLOSURE Embodiments of the present disclosure relate to displays and tiled displays. [Background technology]

[0002] Recently, display devices have become increasingly important with the development of multimedia, and accordingly, display devices such as liquid crystal displays, organic light emitting display devices, and light emitting diode display devices have become commonplace.

[0003] Due to their excellent characteristics such as thinness, light weight, and low power consumption, display devices are widely used in portable electronic devices such as e-books, portable multimedia players (PMPs), navigation systems, mobile phones, smartphones, smart watches, tablet PCs (Personal Computers), watch phones, and mobile communication terminals, as well as in display screens for televisions, notebooks, and monitors.

[0004] Recently, the use of multi-display devices, in which display devices are arranged in a grid pattern to realize a large screen, has been increasing. Summary of the Invention [Problem to be solved by the invention]

[0005] The embodiments of the present disclosure may provide a display device and a tiled display device that can prevent static electricity from flowing into the sides of a display module.

[0006] The embodiments of the present disclosure can provide a display device and a tiled display device in which seams are not visible to a user by absorbing light incident on gaps between adjacent display modules.

[0007] The embodiments of the present disclosure may provide a display device and a tiled display device that can prevent moisture penetration from the side of a display module. [Means for solving the problem]

[0008] An embodiment of the present disclosure may provide a display device including a first substrate including a display area and a non-display area surrounding the display area, a light-emitting element provided in the display area on the first substrate, a first pad portion provided in the non-display area on the upper surface of the first substrate and arranged on one side edge of the first substrate, a second substrate provided on the lower surface of the first substrate, a second pad portion provided in the non-display area on the lower surface of the second substrate and arranged on one side edge of the second substrate, a side link line electrically connecting the first pad portion and the second pad portion, a side coating layer arranged to cover the side link line, a side protective layer arranged to cover at least a portion of the side coating layer, and a side sealing layer arranged to cover at least a portion of the side protective layer.

[0009] An embodiment of the present disclosure may provide a tiled display device including a plurality of display modules, each of which includes a first substrate including a display area and a non-display area surrounding the display area, a light-emitting element provided in the display area on the first substrate, a first pad portion provided in the non-display area on the upper surface of the first substrate and arranged on one side edge of the first substrate, a second substrate provided on the lower surface of the first substrate, a second pad portion provided in the non-display area on the lower surface of the second substrate and arranged on one side edge of the second substrate, a side link line electrically connecting the first pad portion and the second pad portion, a side coating layer arranged to cover the side link line, a side protective layer arranged to cover at least a portion of the side coating layer, and a side sealing layer arranged to cover at least a portion of the side protective layer. [Effects of the Invention]

[0010] According to an embodiment of the present disclosure, a display device and a tiled display device that can prevent static electricity from flowing into the side of a display module can be provided.

[0011] According to the embodiments of the present disclosure, it is possible to provide a display device and a tiled display device in which light incident on the gaps between adjacent display modules is absorbed, and seams are not visible to a user.

[0012] According to the embodiments of the present disclosure, a display device and a tiled display device that can prevent moisture penetration from the side surface of the display module can be provided.

[0013] According to the embodiments of the present disclosure, it is possible to provide a display device and a tiled display device that can consume low power by preventing static electricity and moisture penetration into a display module and improving the lifespan. [Brief explanation of the drawings]

[0014] [Figure 1] FIG. 1 is a system configuration diagram of a display device according to an embodiment of the present disclosure. [Figure 2] 1 is an equivalent circuit of a subpixel in a display device according to an embodiment of the present disclosure. [Figure 3] 1 is a diagram illustrating a tiled display device according to an embodiment of the present disclosure. [Figure 4] 4 is an exemplary cross-sectional view taken along line AB of FIG. 3. [Figure 5] 1 is a diagram illustrating a schematic flow of ESD in a display device according to an embodiment of the present disclosure. [Figure 6] 1 is an exemplary cross-sectional view of a partial configuration of a display device according to an embodiment of the present disclosure. [Figure 7] FIG. 10 is another exemplary cross-sectional view of a partial configuration of a display device according to an embodiment of the present disclosure. [Figure 8] FIG. 10 is another exemplary cross-sectional view of a partial configuration of a display device according to an embodiment of the present disclosure. [Figure 9] FIG. 10 is another exemplary cross-sectional view of a partial configuration of a display device according to an embodiment of the present disclosure. [Figure 10] FIG. 10 is another exemplary cross-sectional view of a partial configuration of a display device according to an embodiment of the present disclosure. [Figure 11]1 is a diagram illustrating a manufacturing process of a display device according to an embodiment of the present disclosure. [Figure 12] 10 is a diagram schematically illustrating a manufacturing process of a display device according to an embodiment of the present disclosure. [Figure 13] 10 is a diagram schematically illustrating a manufacturing process of a display device according to an embodiment of the present disclosure. [Figure 14] 10 is a diagram schematically illustrating a manufacturing process of a display device according to an embodiment of the present disclosure. [Figure 15] 10 is a diagram schematically illustrating a manufacturing process of a display device according to an embodiment of the present disclosure. [Figure 16] 10 is a diagram schematically illustrating a manufacturing process of a display device according to an embodiment of the present disclosure. [Figure 17] 10 is a diagram schematically illustrating a manufacturing process of a display device according to an embodiment of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0015] Some embodiments of the present invention will be described in detail below with reference to the accompanying drawings. When adding reference numerals to components in each drawing, the same components may be assigned the same numerals whenever possible, even if they are displayed in different drawings. Furthermore, when describing the present invention, if it is determined that a detailed description of related known structures or functions may obscure the gist of the present invention, such a detailed description may be omitted. When using terms such as "includes," "has," and "made" in this specification, other terms may be added unless "only" is used. When a component is expressed in the singular, it may also include a plural unless otherwise expressly stated.

[0016] In addition, in describing the components of this embodiment, terms such as first, second, A, B, (a), (b), etc. are used only to distinguish the component from other components, and do not limit the nature, order, sequence, or number of the corresponding component.

[0017] In describing the positional relationship of components, when two or more components are described as being "coupled," "coupled," or "connected," it should be understood that the two or more components can be directly "coupled," "coupled," or "connected," but that the two or more components can also be "coupled," "coupled," or "connected" through an additional "intervening" component. Here, the additional component can be included in one or more of the two or more components that are "coupled," "coupled," or "connected" to each other.

[0018] In describing the temporal flow relationship associated with components, operating methods, manufacturing methods, etc., when the temporal or flow sequence relationship is described using, for example, "after," "following," "next," or "before," it is possible to include cases where the relationship is not consecutive, since "immediately" or "directly" is not used.

[0019] On the other hand, when a numerical value or its corresponding information (e.g., level, etc.) for a component is mentioned, the numerical value or its corresponding information may be interpreted as including an error range that may occur due to various factors (e.g., process factors, internal or external impact, noise, etc.), even if not otherwise explicitly stated.

[0020] Hereinafter, various embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

[0021] FIG. 1 is a system configuration diagram of a display device 100 according to an embodiment of the present disclosure.

[0022] Referring to FIG. 1, a display device 100 according to an embodiment of the present disclosure may include a display panel 110 and a driving circuit for driving the display panel 110 .

[0023] The driving circuit may include a data driving circuit 120 and a gate driving circuit 130, and may further include a controller 140 that controls the data driving circuit 120 and the gate driving circuit 130.

[0024] The display panel 110 may include a substrate (SUB) and signal lines such as a plurality of data lines (DL) and a plurality of gate lines (GL) disposed on the substrate (SUB). The display panel 110 may include a plurality of sub-pixels (SP) connected to the plurality of data lines (DL) and the plurality of gate lines (GL).

[0025] The display panel 110 may include a display area (AA) where an image is displayed and a non-display area (DA) where an image is not displayed. In the display area (AA) of the display panel 110, a plurality of sub-pixels (SP) for displaying an image are arranged, and in the non-display area (DA), driving circuits 120, 130, and 140 may be electrically connected or may be mounted on the driving circuits 120, 130, and 140, and a pad unit to which an integrated circuit or a printed circuit is connected may also be arranged.

[0026] The data driving circuit 120 is a circuit for driving a plurality of data lines (DL) and can supply data signals to the plurality of data lines (DL).

[0027] The gate driving circuit 130 is a circuit for driving a plurality of gate lines (GL) and can supply gate signals to the plurality of gate lines (GL).

[0028] The controller 140 can supply a data control signal (DCS) to the data driving circuit 120 to control the operation timing of the data driving circuit 120, and can supply a gate control signal (GCS) to the gate driving circuit 130 to control the operation timing of the gate driving circuit 130.

[0029] The controller 140 starts scanning according to the timing implemented in each frame, converts the input image data input from the outside to match the data signal format used in the data driving circuit 120, supplies the converted image data to the data driving circuit 120, and controls data driving at an appropriate time in accordance with the scan.

[0030] The controller 140 receives various timing signals, including a vertical synchronization signal (VSYNC), a horizontal synchronization signal (HSYNC), an input data enable signal (DE), a clock signal (CLK), etc., from an external device (e.g., a host system 150) along with input video data.

[0031] In order to control the data driving circuit 120 and the gate driving circuit 130, the controller 140 receives timing signals such as a vertical synchronization signal (VSYNC), a horizontal synchronization signal (HSYNC), an input data enable signal (DE), and a clock signal (CLK), generates various control signals (DCS, GCS), and outputs them to the data driving circuit 120 and the gate driving circuit 130.

[0032] For example, the controller 140 outputs various gate control signals (GCS) including a gate start pulse (GSP), a gate shift clock (GSC), a gate output enable signal (GOE), etc. to control the gate driving circuit 130.

[0033] In addition, the controller 140 outputs various data control signals (DCS: Data Control Signals) including a source start pulse (SSP: Source Start Pulse), a source sampling clock (SSC: Source Sampling Clock), a source output enable signal (SOE: Source Output Enable), etc. to control the data driving circuit 120.

[0034] The controller 140 may be configured as a separate component from the data driving circuit 120, or may be integrated with the data driving circuit 120 to form an integrated circuit.

[0035] The data driving circuit 120 receives image data (Data) from the controller 140 and supplies data voltages to the data lines (DL), thereby driving the data lines (DL). Here, the data driving circuit 120 is also referred to as a source driving circuit.

[0036] The data driving circuit 120 may include one or more source driver integrated circuits (SDICs).

[0037] Each source driver integrated circuit (SDIC) may include a shift register, a latch circuit, a digital-to-analog converter (DAC), an output buffer, etc. Each source driver integrated circuit (SDIC) may further include an analog-to-digital converter (ADC) in some cases.

[0038] For example, each source driver integrated circuit (SDIC) can be connected to the display panel 110 using a tape automated bonding (TAB) method, or can be connected to a bonding pad of the display panel 110 using a chip on glass (COG) or chip on panel (COP) method, or can be configured using a chip on film (COF) method and connected to the display panel 110.

[0039] The gate driving circuit 130 can output a gate signal of a turn-on level voltage or a gate signal of a turn-off level voltage under the control of the controller 140. The gate driving circuit 130 can sequentially drive the plurality of gate lines (GL) by sequentially supplying the gate signals of a turn-on level voltage to the plurality of gate lines (GL).

[0040] The gate driving circuit 130 may be connected to the display panel 110 using a tape automated bonding (TAB) method, or may be connected to a bonding pad of the display panel 110 using a chip-on-glass (COG) or chip-on-panel (COP) method, or may be connected to the display panel 110 using a chip-on-film (COF) method. Alternatively, the gate driving circuit 130 may be formed in the non-display area (DA) of the display panel 110 using a gate-in-panel (GIP) type. The gate driving circuit 130 may be disposed on or connected to the substrate (SUB). That is, in the case of a GIP type, the gate driving circuit 130 may be disposed in the non-display area (DA) of the substrate (SUB). In the case of a chip-on-glass (COG) type or chip-on-film (COF) type, the gate driving circuit 130 may be connected to the substrate (SUB).

[0041] Meanwhile, at least one of the data driving circuit 120 and the gate driving circuit 130 may be disposed in the display area AA.

[0042] For example, the gate driving circuit 130 may be disposed in the display area (AA). In this case, the gate driving circuit 130 may be disposed over the entire display area (AA) or only in a portion of the display area (AA). The gate driving circuit 130 may be disposed so as not to overlap with the sub-pixels (SP), or may be disposed so as to overlap with the sub-pixels (SP) partially or entirely.

[0043] As another example, the data driving circuit 120 may be disposed in the display area (AA). In this case, the data driving circuit 120 may be disposed over the entire display area (AA) or only in a portion of the display area (AA). The data driving circuit 120 may be disposed so as not to overlap with the sub-pixels (SP), or may be disposed so as to overlap with the sub-pixels (SP) partially or entirely.

[0044] When a specific gate line (GL) is selected by the gate driving circuit 130, the data driving circuit 120 can convert image data (Data) received from the controller 140 into analog data voltages and supply them to a plurality of data lines (DL).

[0045] The data driving circuit 120 may be connected to one side (e.g., the top or bottom) of the display panel 110. Depending on the driving method, panel design method, etc., the data driving circuit 120 may be connected to both sides (e.g., the top and bottom) of the display panel 110, or may be connected to two or more of the four sides of the display panel 110.

[0046] The gate driving circuit 130 may be connected to one side (e.g., the left or right side) of the display panel 110. Depending on the driving method, panel design method, etc., the gate driving circuit 130 may be connected to both sides (e.g., the left and right sides) of the display panel 110, or may be connected to two or more of the four sides of the display panel 110.

[0047] The controller 140 may be a timing controller used in conventional display technology, or may be a control device that includes a timing controller and can perform other control functions, or may be a control device different from a timing controller, or may be a circuit within the control device. The controller 140 may be composed of various circuits or electronic components such as an integrated circuit (IC), a field programmable gate array (FPGA), an application specific integrated circuit (ASIC), or a processor.

[0048] The controller 140 may be mounted on a printed circuit board, a flexible printed circuit, or the like, and may be electrically connected to the data driving circuit 120 and the gate driving circuit 130 via the printed circuit board, the flexible printed circuit, or the like.

[0049] The controller 140 can transmit and receive signals to and from the data driving circuit 120 through one or more predetermined interfaces, where the interfaces may include, for example, a Low Voltage Differential Signaling (LVDS) interface, an Embedded Clock Point to Point Interface (EPI), a Serial Peripheral Interface (SPI), etc.

[0050] The controller 140 may include a storage medium such as one or more registers.

[0051] The display device 100 according to the embodiment of the present disclosure may be a display device in which the display panel 110 cannot emit light by itself. For example, the display device 100 according to the embodiment of the present disclosure may be a liquid crystal display device including a backlight unit.

[0052] Alternatively, the display device 100 according to the embodiment of the present disclosure may be a self-emitting display device in which the display panel 110 can emit light by itself. For example, the display device 100 according to the embodiment of the present disclosure may be one of an organic light emitting diode (OLED) display device, a quantum dot display, a micro light emitting diode (Micro LED) display device, etc.

[0053] When the display device 100 according to the embodiment of the present disclosure is an organic light emitting diode display device, each subpixel (SP) may include an organic light emitting diode (OLED) that emits light by itself as a light emitting element. When the display device 100 according to the embodiment of the present disclosure is a quantum dot display device, each subpixel (SP) may include an light emitting element made of quantum dots, which are semiconductor crystals that emit light by themselves. When the display device 100 according to the embodiment of the present disclosure is a micro light emitting diode display device, each subpixel (SP) may include an inorganic-based micro light emitting diode that emits light by itself as a light emitting element.

[0054] FIG. 2 is an equivalent circuit of a sub-pixel (SP) in a display device 100 according to an embodiment of the present disclosure.

[0055] Referring to FIG. 2, the display panel 110 may include a plurality of sub-pixels (SP) formed on a substrate (SUB).

[0056] Each of the plurality of sub-pixels (SP) may include a light emitting diode (LED) as a light emitting element, a driving transistor (DRT) for driving the light emitting diode (LED), a scan transistor (SCT) for transmitting a data voltage (VDATA) to a first node (N1) of the driving transistor (DRT), and a storage capacitor (Cst) for maintaining a constant voltage for one frame.

[0057] The drive transistor (DRT) may include a first node (N1) to which a data voltage (VDATA) can be applied, a second node (N2) electrically connected to the light emitting diode (LED), and a third node (N3) to which a first power signal (VDD) is applied from the first power line (DVL). In the drive transistor (DRT), the first node (N1) may be a gate node, the second node (N2) may be a source node or a drain node, and the third node (N3) may be a drain node or a source node.

[0058] Light emitting diodes (LEDs) can also be called light emitting diode chips (LED chips). For example, light emitting diodes (LEDs) can also be called micro light emitting diodes or micro light emitting diode chips.

[0059] The light emitting diode (LED) may include a first semiconductor layer (SEMI1), a second semiconductor layer (SEMI2), and an active layer (AL). The first semiconductor layer (SEMI1) may be formed on at least one upper surface of the second semiconductor layer (SEMI2) and may expose at least a portion of the other upper surface of the second semiconductor layer (SEMI2). The active layer (AL) may be interposed between the first semiconductor layer (SEMI1) and the second semiconductor layer (SEMI2). Here, the active layer (AL) may also be referred to as a light emitting layer. The light emitting diode (LED) may further include a first electrode (AND) and a second electrode (CAT).

[0060] A first electrode (AND) may be formed on the first semiconductor layer (SEMI1) and electrically connected to the first semiconductor layer (SEMI1). A second electrode (CAT) may be formed on the exposed second semiconductor layer (SEMI2) and electrically connected to the second semiconductor layer (SEMI2). The first electrode (AND) and the second electrode (CAT) may be spaced apart by a predetermined distance.

[0061] The first semiconductor layer (SEMI1) may be composed of a p-type semiconductor layer.

[0062] The second semiconductor layer (SEMI2) may be composed of an n-type semiconductor layer.

[0063] The active layer (AL) may be a layer in which holes injected through the first semiconductor layer (SEMI1) and electrons injected through the second semiconductor layer (SEMI2) meet each other and emit light due to the band gap difference in the energy bands formed by the material of the active layer (AL).

[0064] The light emitting diode (LED) may further include a dielectric film (PRT) for protecting the LED element. The dielectric film (PRT) surrounds the exposed outer surface of the light emitting diode (LED) and may expose at least a portion of the first electrode (AND) and at least a portion of the second electrode (CAT). The dielectric film (PRT) may include an insulating material. For example, the dielectric film (PRT) may be made of a silicon oxide film (SiOx) or a silicon nitride film (SiNx), or a laminate structure thereof.

[0065] Meanwhile, a first electrode (AND) of the light emitting diode (LED) may be electrically connected to the pixel electrode, and a second electrode (CAT) of the light emitting diode (LED) may be electrically connected to the common electrode.

[0066] The pixel electrode may be disposed for each sub-pixel (SP) and may be electrically connected to the second node (N2) of the driving transistor (DRT) of each sub-pixel (SP). The common electrode may be disposed in common to a plurality of sub-pixels (SP).

[0067] The display panel 110 may further include a second power line (BVL) for supplying a second power signal (VSS) to the common electrode, and the second power line (BVL) may be electrically connected to the common electrode.

[0068] Meanwhile, as another example, the light emitting diode (LED) may be an organic light emitting diode (OLED) including an organic light emitting layer between a first electrode (AND) and a second electrode (CAT).

[0069] The scan transistor (SCT) is connected between the first node (N1) of the drive transistor (DRT) and a corresponding data line (DL) and can control the voltage state of the first node (N1) of the drive transistor (DRT).

[0070] The scan transistor (SCT) can control the connection between the first node (N1), which is the gate node of the drive transistor (DRT), and a corresponding data line (DL) among a plurality of data lines (DL), according to a scan signal (SCAN) supplied from a corresponding scan line (SCL) among a plurality of scan lines (SCL), which is a type of gate line (GL).

[0071] The drain or source node of the scan transistor (SCT) may be electrically connected to a corresponding data line (DL), the source or drain node of the scan transistor (SCT) may be electrically connected to a first node (N1) of the drive transistor (DRT), and the gate node of the scan transistor (SCT) may be electrically connected to a scan line (SCL) and receive a scan signal (SCAN).

[0072] The scan transistor (SCT) is turned on by a scan signal (SCAN) of a turn-on level voltage, and can transmit the data voltage (VDATA) supplied from the corresponding data line (DL) to the first node (N1) of the drive transistor (DRT).

[0073] The scan transistor (SCT) is turned on by a scan signal (SCAN) with a turn-on level voltage and turned off by a scan signal (SCAN) with a turn-off level voltage. Here, if the scan transistor (SCT) is an n-type, the turn-on level voltage may be a high level voltage and the turn-off level voltage may be a low level voltage. If the scan transistor (SCT) is a p-type, the turn-on level voltage may be a low level voltage and the turn-off level voltage may be a high level voltage.

[0074] The storage capacitor (Cst) may be electrically connected between the first node (N1) and the second node (N2) of the drive transistor (DRT). The storage capacitor (Cst) may be an external capacitor intentionally designed outside the drive transistor (DRT), rather than a parasitic capacitor (e.g., Cgs, Cgd), which is an internal capacitor that may exist between the first node (N1) and the second node (N2) of the drive transistor (DRT).

[0075] Each of the drive transistor (DRT) and the scan transistor (SCT) can be an n-type transistor or a p-type transistor.

[0076] As shown in FIG. 2, each subpixel (SP) may have a 2T (Transistor) 1C (Capacitor) structure including two transistors (DRT, SCT) and one capacitor (Cst), and may optionally include one or more additional transistors or one or more additional capacitors.

[0077] The display device 100 may have a top emission structure in which light is emitted in a direction opposite to the substrate (SUB) of the display panel 110 .

[0078] FIG. 3 is a diagram illustrating a tiled display device according to an embodiment of the present disclosure.

[0079] Referring to FIG. 3, a tiled display device according to an embodiment of the present disclosure may include multiple display modules (DM1, DM2, DM3, DM4).

[0080] Each of the plurality of display modules (DM1, DM2, DM3, DM4) can display an individual image or a single image in a divided form. Each of the plurality of display modules (DM1, DM2, DM3, DM4) includes the display device 100 according to the embodiment of the present disclosure shown in FIG. 1, and a redundant description thereof will be omitted.

[0081] Each of the display modules (DM1, DM2, DM3, DM4) may be tiled in a separate tiling frame so that their sides are in contact with each other. For example, each of the display modules (DM1, DM2, DM3, DM4) may be tiled to have an NxM configuration to form a large multi-screen display device. For example, N may be a positive integer greater than or equal to 1, and M may be a positive integer greater than or equal to 2. For example, N may be a positive integer greater than or equal to 2, and M may be a positive integer greater than or equal to 1.

[0082] Each of the plurality of display modules (DM1, DM2, DM3, DM4) may have an air bezel structure in which the display area (AA) is surrounded by air, without including a bezel area (or non-display area) that surrounds the entire display area (AA) where an image is displayed. That is, each of the plurality of display modules (DM1, DM2, DM3, DM4) may have the entire first surface of the first substrate 200 formed as the display area (AA).

[0083] A tiled display device can be constructed by combining multiple display modules (DM1, DM2, DM3, DM4). In this case, external foreign objects or moisture can enter the sides of each display module. Moisture can enter in a liquid or gas state. It can also enter in the form of water droplets or water vapor, or in shapes smaller than water vapor. Moisture can enter into empty spaces on the sides of the display module or directly into the side coating layer or side sealing layer. To prevent moisture from entering, empty spaces on the sides of the display module can be filled, or the side coating layer or side sealing layer can be treated to provide a moisture-proof function. However, even in this case, there is a problem that moisture, including shapes smaller than water vapor, can permeate and enter.

[0084] Figure 4 is an exemplary cross-sectional view taken along line AB in Figure 3. Specifically, Figure 4 may show a cross-sectional view of a portion where the first display module (DM1) and the third display module (DM3) come into contact with each other.

[0085] 4, the first display module (DM1) may include a first substrate 200, a first layer 210, a first pad portion 220, a light emitting element 230, a second layer 240, a functional film layer 250, a second substrate 300, a third layer 310, a second pad portion 320, an adhesive layer 410, a side link line 420, a side coating layer 430, a side sealing layer 440, and a side protection layer 500. In this case, the remaining display modules including the second display module (DM2) may have substantially the same structure as the first display module (DM1), or may be partially configured differently if necessary.

[0086] The first substrate 200 is a base substrate for supporting many components of the first display module DM1 and may be an insulating substrate. The first substrate 200 may be made of glass or plastic. The first substrate 200 may also be made of a flexible material that allows it to be bent.

[0087] A display area (AA) and a non-display area (NA) surrounding the display area (AA) may be defined on the first substrate 200. The display area (AA) is an area where an image is actually displayed on the display panel 200, and light emitting elements 230 may be disposed in the display area (AA). The non-display area (NA) is an area where an image is not displayed, and may be defined as an area surrounding the display area (AA).

[0088] A first layer 210 may be disposed on the first substrate 200. A plurality of insulating layers and a plurality of signal lines may be disposed on the first layer 210. The various transistors and capacitors described above may be disposed on the first layer 210.

[0089] A first pad section 220 connected to various signal lines may be disposed in the non-display area (NA) of the first substrate 200. The first pad section 220 may be disposed on one side edge of the non-display area (NA). The first pad section 220 may be an area electrically connected to a side link line 420 (described below). The first pad section 220 may be a metal layer extending from a plurality of signal lines.

[0090] A light emitting element 230 and a second layer 240 surrounding the light emitting element 230 may be disposed on the first layer 210. As described above, the light emitting element 230 may be a light emitting diode (LED) or a micro light emitting diode (μLED).

[0091] The second layer 240 may include multiple planarization and insulating layers.

[0092] The functional film layer 250 may be included on the second layer 240. The functional film layer 250 may include an anti-reflection layer (or anti-reflection film) for preventing reflection of external light and improving outdoor visibility and contrast ratio of an image displayed on the display device. The functional film layer 250 may include a barrier layer (or barrier film) for primarily preventing penetration of moisture or oxygen. The functional film layer 250 may further include a light path control layer (or light path control film) for controlling the path of light emitted from each pixel (P) to the outside.

[0093] The second substrate 300 may be disposed below the first substrate 200. The second substrate 300 is an auxiliary substrate that supports components disposed below the display device and may be an insulating substrate. For example, it may be made of glass or plastic. The second substrate 300 may be made of a flexible material so that it can be bent. The second substrate 200 may be made of the same material as the first substrate 200.

[0094] A third layer 310 may be disposed on the rear surface of the second substrate 200. A plurality of insulating layers and a plurality of link lines may be disposed on the third layer 310.

[0095] A second pad portion 320 may be disposed on one side edge of the second substrate 200. The second pad portion 320 may be an area electrically connected to a side link line 420, which will be described later. The second pad portion 320 may be a metal layer extending from a plurality of link lines.

[0096] An adhesive layer 410 may be disposed between the first substrate 200 and the second substrate 300. The adhesive layer 410 may bond the first substrate 200 and the second substrate 300. The adhesive layer 410 may be made of a material that can be hardened through various hardening methods to bond the first substrate 200 and the second substrate 200. The adhesive layer 2410 may be disposed in a partial region between the first substrate 200 and the second substrate 300, or may be disposed in the entire region.

[0097] 4, side link lines 420 may be disposed on the side surfaces of the first substrate 200 and the second substrate 300. The side link lines 420 may include a plurality of side link lines. The side link lines 420 may electrically connect a plurality of signal lines disposed on the top surface of the first substrate 200 to a plurality of link lines disposed on the rear surface of the second substrate 300. The side link lines 420 may be disposed to cover ends of the plurality of signal lines disposed on the top surface of the first substrate 200, the side surfaces of the first substrate 200 and the second substrate 300, and ends of the plurality of link lines disposed on the rear surface of the second substrate 300. That is, the side link lines 420 may be disposed to continuously cover the first pad portion 220 to which the plurality of signal lines are connected, the side surfaces of the first substrate 200 and the second substrate 300, and the second pad portion 320 to which the plurality of link lines are connected.

[0098] The side link lines 420 may be formed of a patterned metal layer so that the corresponding signal lines and link lines are connected to each other. In this case, the patterned metal layer may be formed by a printing method using a conductive paste. For example, the side link lines 420 may be formed by a pad printing method using a silver (Ag) paste, but the embodiment of the present disclosure is not limited thereto.

[0099] Referring to FIG. 4 , the side coating layer 430 may be disposed to cover the side link lines 420. The side coating layer 430 may be disposed to cover not only the side link lines 420 but also one edge portion and side of the first substrate 200 and one edge portion and entire side of the second substrate 300. The side coating layer 430 may prevent corrosion of each link line made of a conductive material and electrical shorts between the side link lines 420. In addition, the side coating layer 430 may prevent or minimize reflection of external light by the side link lines 420 and the pads of the first pad unit 220. The side coating layer 430 may include black ink containing at least one of carbon black, black dye, and black pigment. The side coating layer 430 may be formed by a printing method using black ink. For example, the side coating layer 430 may be formed by a pad printing method using black ink containing carbon black, but the embodiment of the present disclosure is not limited thereto.

[0100] Referring to FIG. 4, the side protective layer 500 may be disposed to cover the side coating layer 430. The side protective layer 500 may be disposed to cover not only the side coating layer 430 but also one edge portion and side of the first substrate 200 and one edge portion and the entire side of the second substrate 300. The side protective layer 500 may include multiple layers. The side protective layer 500 may include a moisture-proof material. The side protective layer 500 may include a conductive material. The side protective layer 500 may include a light-absorbing material. The side protective layer 500 may prevent static electricity from entering the side of the display module. The side protective layer 500 may absorb light incident into the gap between adjacent display modules to prevent seams from being visible to the user. The side protective layer 500 may prevent moisture from passing through the side of the display module.

[0101] The moisture-proof material may include an aromatic hydrocarbon-based compound. The moisture-proof material may include a vapor-deposited powder of an aromatic hydrocarbon-based compound. The moisture-proof material may include an aromatic hydrocarbon-based compound using a Parylene coating method.

[0102] The aromatic hydrocarbon compound may be at least one selected from the following compounds:

[0103] [ka]

[0104] The conductive material may include conductive particles and conductive polymers.

[0105] The conductive particles may be carbon nanotubes, which may be at least one selected from the group consisting of single-walled carbon nanotubes, double-walled carbon nanotubes, and multi-walled carbon nanotubes.

[0106] Conductive polymers include polyfluorene, polyphenylene, polypyrene, polyazulene, polynaphthalene, polyacetylene (PAC), poly(p-phenylenevinylene (PPV), polypyrrole (PPY), polycarbazole, polyindole, polyazepine, polythienylenevinylene (poly(thienylene vinylene)), polyaniline (PANI), polythiophene (poly(thiophene)), poly(p-phenylenesulfide (PPS)), poly3,4-ethylenedioxythiophene (PEDOT), and poly(styrene sulfonate). The polymer may be at least one selected from the group consisting of poly(3,4-ethylenedeoxythiophene) doped with (PEDOT:PSS), poly(3,4-ethylenedeoxythiophene)-tetramethacrylate (PEDOT-TMA), and polyfuran.

[0107] The conductive material may include conductive particles and black rubber.

[0108] The conductive particles may be equivalent to the carbon nanotubes mentioned above.

[0109] The black rubber may include at least one of carbon black, black dye, and black pigment, and isoprene-based rubber.

[0110] The light absorbing material may be black ink, which may include at least one of carbon black, black dye, and black pigment.

[0111] Referring to FIG. 4, the side sealing layer 440 may be disposed to cover the side protection layer 500. The side sealing layer 440 may be disposed to cover not only the side protection layer 500 but also one edge portion and side of the first substrate 200 and one edge portion and the entire side of the second substrate 300. The side sealing layer 440 may prevent corrosion of each link line made of a conductive material and electrical shorts between the side link lines 420. In addition, the side sealing layer 440 may prevent or minimize reflection of external light by the side link lines 420 and the pads of the first pad unit 220. The side sealing layer 440 may include at least one of carbon black, black dye, and black pigment. The side sealing layer 440 may fill the space formed between the functional film layer 250 and the side of the display module. As a result, the side sealing layer 440 may prevent foreign matter or moisture from entering the space between the substrates 200, 300 and the functional film layer 250 from the outside.

[0112] 4, the side edge of the functional film layer 250 and the side edge of the side sealing layer 440 may be arranged on the same line. By arranging the side edge of the functional film layer 250 and the side edge of the side sealing layer 440 on the same line, the gap formed between the display modules may be minimized, and seams due to the gap may be minimized.

[0113] FIG. 5 is a diagram illustrating a schematic diagram of an ESD flow in a display device according to an embodiment of the present disclosure.

[0114] FIG. 5 may be substantially similar to the portion of the display device shown in FIG. 4, except that the side protection layer 500 is not disposed between the side coating layer 430 and the side sealing layer 440 .

[0115] 5, when static electricity is generated externally, it can flow into the thin portions of the insulating side coating layer 430 and side sealing layer 440 and be transferred to the side link line 420. The flowed-in static electricity can then travel along the side link line 420, which is formed of silver (Ag), and flow to various lines formed on the display panel. In this case, if static electricity exceeds the capacity of the static electricity prevention circuit disposed on the display panel, the lines may be damaged.

[0116] FIG. 6 is an exemplary cross-sectional view of a partial configuration of a display device according to an embodiment of the present disclosure.

[0117] Referring to Figure 6, the side protective layer 500 may be substantially the same as the contents of the drawing shown in Figure 4 except that it includes a first side protective layer 510 and a second side protective layer 520, so duplicated explanations regarding this may be omitted or simplified.

[0118] Referring to FIG. 6, the side protective layer 500 may include a first side protective layer 510 and a second side protective layer 520 .

[0119] The first side protective layer 510 may contain a moisture-proof material, which may be the same as the moisture-proof material contained in the side protective layer 500 described in FIG.

[0120] The second side protective layer 520 may include a conductive material. The conductive material may include conductive particles and a conductive polymer. The conductive particles and the conductive polymer may be the same as the conductive particles and the conductive polymer included in the side protective layer 500 described with reference to FIG. 4.

[0121] Referring to FIG. 6, the first side protective layer 510 may be disposed adjacent to the side coating layer 430, the second side protective layer 510 may be disposed adjacent to the first side protective layer 510, and the side sealing layer 440 may be disposed adjacent to the second side protective layer 520.

[0122] The first side protective layer 510 may be a parylene coating layer. The parylene coating layer is formed by depositing at least one parylene dimer selected from parylene compounds on a substrate at room temperature. At this time, the parylene dimers used may be one or a combination of the two.

[0123] The first side protective layer 510 may include a moisture-proof material. The first side protective layer 510 may include a vapor-deposited powder of an aromatic hydrocarbon-based compound. The first side protective layer 510 may include an aromatic hydrocarbon-based compound using a Parylene coating method. The first side protective layer 510 may be formed as a Parylene coating layer containing the moisture-proof material, thereby preventing moisture from penetrating from the outside to the inside of the display module. The first side protective layer 510 may have not only a moisture-proof function but also a moisture-proof function.

[0124] The second side protection layer 520 may be formed by pad printing, for example, by printing a mixture of multi-walled carbon nanotubes (conductive particles) and PEDOT:PSS (conductive polymer) using a pad unit including a silicon pad and a head.

[0125] The second side protective layer 520 is formed by including conductive particles and conductive polymers, thereby preventing static electricity from entering from the outside.

[0126] 7 to 10 are other exemplary cross-sectional views of a partial configuration of a display device according to an embodiment of the present disclosure.

[0127] Referring to Figure 7, the side protective layer 500 includes a third side protective layer 530, and may be substantially the same as the contents of the drawing shown in Figure 6 except for the procedure for arranging the side protective layer 500, so duplicate explanations regarding this may be omitted or simplified.

[0128] Referring to FIG. 7, the side protective layer 500 may include a first side protective layer 510, a second side protective layer 520, and a third side protective layer 530.

[0129] The third side protective layer 530 may include a light absorbing material, which may be the same as the light absorbing material included in the side protective layer 500 described with reference to FIG.

[0130] Referring to FIG. 7, the first side protective layer 510 may be disposed adjacent to the side coating layer 430, the second side protective layer 510 may be disposed adjacent to the first side protective layer 510, and the side sealing layer 440 may be disposed adjacent to the second side protective layer 520.

[0131] The second side protective layer 520 may be arranged in contact with the side coating layer 430, the third side protective layer 530 may be arranged in contact with the second side protective layer 520, the first side protective layer 510 may be arranged in contact with the third side protective layer 530, and the side sealing layer 440 may be arranged in contact with the first side protective layer 510.

[0132] The third side protective layer 530 may be formed by pad printing, for example, by printing black ink containing carbon particles, which are a light absorbing material, using a pad unit including a silicon pad and a head.

[0133] The third side protective layer 530 is formed to include a light absorbing material, thereby absorbing light incident into the gap between adjacent display modules, thereby making the seam invisible to the user.

[0134] Referring to Figure 7, the side protective layer 500 includes a third side protective layer 530, and the contents may be substantially the same as those shown in Figure 6 except for the placement procedure of the side protective layer 500, so duplicate explanations regarding this may be omitted or simplified.

[0135] Referring to FIG. 7, the side protective layer 500 may include a first side protective layer 510, a second side protective layer 520, and a third side protective layer 530.

[0136] The third side protective layer 530 may include a light absorbing material, which may be the same as the light absorbing material included in the side protective layer 500 described with reference to FIG.

[0137] Referring to FIG. 7, the first side protective layer 510 may be disposed adjacent to the side coating layer 430, the second side protective layer 510 may be disposed adjacent to the first side protective layer 510, and the side sealing layer 440 may be disposed adjacent to the second side protective layer 520.

[0138] The second side protective layer 520 may be arranged in contact with the side coating layer 430, the third side protective layer 530 may be arranged in contact with the second side protective layer 520, the first side protective layer 510 may be arranged in contact with the third side protective layer 530, and the side sealing layer 440 may be arranged in contact with the first side protective layer 510.

[0139] The third side protective layer 530 may be formed by pad printing, for example, by printing black ink containing carbon particles, which are a light absorbing material, using a pad unit including a silicon pad and a head.

[0140] The third side protective layer 530 is formed to include a light absorbing material, thereby absorbing light incident into the gap between adjacent display modules, thereby making the seam invisible to the user.

[0141] Referring to FIGS. 8 and 9, the side protective layer 500 may include a first side protective layer 510 and a fourth side protective layer 540.

[0142] The first side surface protective layer 510 is the same as the first side surface protective layer 510 explained in FIG. 6, and therefore a detailed explanation thereof will be omitted.

[0143] The fourth side protective layer 540 may include a conductive material. The conductive material may include conductive particles and black rubber. The conductive particles and black rubber may be the same as the conductive particles and black rubber included in the side protective layer 500 described in FIG. 4.

[0144] Referring to FIG. 8, the first side protective layer 510 may be disposed adjacent to the side coating layer 430, the fourth side protective layer 540 may be disposed adjacent to the first side protective layer 510, and the side sealing layer 440 may be disposed adjacent to the fourth side protective layer 540.

[0145] The fourth side protective layer 540 is formed by including conductive particles and black rubber, thereby preventing static electricity from entering from the outside.

[0146] Referring to FIG. 9, the fourth side protective layer 540 may be disposed adjacent to the side coating layer 430, the first side protective layer 510 may be disposed adjacent to the fourth side protective layer 540, and the side sealing layer 440 may be disposed adjacent to the first side protective layer 510.

[0147] The fourth side protective layer 540 is formed by including conductive particles and black rubber, thereby preventing static electricity from entering from the outside.

[0148] Referring to FIG. 10, the contents of the drawing may be substantially the same as those shown in FIG. 4 except that it includes an adhesive pad 610 and a cover bottom 620, so duplicated descriptions thereof may be omitted or simplified.

[0149] Referring to FIG. 10, an adhesive pad 610 and a cover bottom 620 may be disposed on the third layer 310 .

[0150] The cover bottom 620 is disposed to surround the display panel to prevent external impacts and foreign objects from penetrating in. The cover bottom 620 may be made of a polymer material such as polypropylene or polyethylene, and may be made of an elastic material.

[0151] 10, the side protective layer 500 disposed on the side may not be extended to the adhesive pad 610 or the bottom cover 620. The side protective layer 500 according to the embodiment of the present disclosure includes a conductive material including conductive particles and a conductive polymer, or a conductive material including conductive particles and black rubber, thereby preventing the inflow of externally generated static electricity. Therefore, a plastic bottom cover 620 including a polymer material can be applied instead of a bottom cover typically made of a metal material.

[0152] 11 to 17 are diagrams schematically illustrating a manufacturing process of a display device according to an embodiment of the present disclosure.

[0153] 11, side link lines 420 can be formed on the side of a display panel. The side link lines 420 can be formed using a pad unit 700 including a conductive paste 420a, a silicone pad 710, and a head 720. Specifically, the conductive paste 420a is attached to the silicone pad 710, and then the pad unit 700 is moved to the side of the display panel, and the silicone pad 710 is moved to the side of the display panel where the side link lines 420 are to be formed. Then, the conductive paste 420a attached to the silicone pad 710 is transferred to the side of the display panel, thereby forming the side link lines 420.

[0154] 12, a side coating layer 430 can be formed on a side of a display panel. The side coating layer 430 can be formed using a pad unit 700 including a black ink composition 430a, a silicone pad 710, and a head 720. Specifically, the black ink composition 430a is deposited on the silicone pad 710, and then the pad unit 700 is moved to the side of the display panel, and the silicone pad 710 is moved to the side of the display panel where the side coating layer 430 is to be formed. Then, the black ink composition 430a deposited on the silicone pad 710 is transferred to the side of the display panel, thereby forming the side coating layer 430.

[0155] 13, a first side protective layer 510 may be formed on a side of a display panel. The first side protective layer 510 may be formed using a parylene coating method. A parylene-based dimer 510a, which is an aromatic hydrocarbon-based compound, is heated and vaporized in a deposition device 800. The parylene-based dimer is then thermally decomposed at a high temperature to form a parylene-based monomer, and the pyrolyzed parylene-based monomer is then deposited at room temperature to form the first side protective layer 510.

[0156] If the first side protective layer 510 is formed using a deposition powder of an aromatic hydrocarbon-based compound, it can be coated uniformly and densely according to the shape of the substrate. Also, if the deposition powder of the aromatic hydrocarbon-based compound is coated on the substrate using a parylene coating method, it may be easy to adjust the thickness of the coating layer without applying thermal stress to the substrate.

[0157] 14, a second side protective layer 520 may be formed on a side of the display panel. The second side protective layer 520 may be formed using a pad unit 700 including a conductive material 520a, a silicone pad 710, and a head 720. Specifically, the conductive material 520a is attached to the silicone pad 710, and then the pad unit 700 is moved to the side of the display panel, and the silicone pad 710 is moved to the side of the display panel where the second side protective layer 520 is to be formed. Then, the conductive material 520a attached to the silicone pad 710 is transferred to the side of the display panel, thereby forming the second side protective layer 520.

[0158] 15, a side sealing layer 440 can be formed on a side of a display panel. The side sealing layer 440 can be formed using a pad unit 700 including a light absorbing material 440a, a silicone pad 710, and a head 720. Specifically, the light absorbing material 440a is attached to the silicone pad 710, and then the pad unit 700 is moved to the side of the display panel, and the silicone pad 710 is moved to the side of the display panel where the side sealing layer 440 is to be formed. Then, referring to FIG. 16, the light absorbing material 440a attached to the silicone pad 710 is transferred to the side of the display panel, thereby forming the side sealing layer 440.

[0159] 17, a functional film layer 250 may be formed on a display panel. After the functional film layer 250 is attached to the display panel, the side may be cut so that the side edge of the functional film layer 250 and the side edge of the side sealing layer 440 are aligned on the same line.

[0160] The above-described embodiment of the present disclosure can be briefly described as follows.

[0161] A display device according to an embodiment of the present disclosure may include a first substrate including a display area and a non-display area surrounding the display area, a light-emitting element provided in the display area on the first substrate, a first pad portion provided in the non-display area on the upper surface of the first substrate and arranged on one side edge of the first substrate, a second substrate provided on the lower surface of the first substrate, a second pad portion provided in the non-display area on the lower surface of the second substrate and arranged on one side edge of the second substrate, a side link line electrically connecting the first pad portion and the second pad portion, a side coating layer arranged to cover the side link line, a side protective layer arranged to cover at least a portion of the side coating layer, and a side sealing layer arranged to cover at least a portion of the side protective layer.

[0162] In the display device according to the embodiment of the present disclosure, the light emitting element may be a micro LED (Light Emitting Diode).

[0163] In the display device according to the embodiment of the present disclosure, the side protective layer may include a first side protective layer including a moisture-proof material, and a second side protective layer including conductive particles and a conductive polymer.

[0164] In the display device according to the embodiment of the present disclosure, the moisture barrier material may include an aromatic hydrocarbon compound.

[0165] In the display device according to the embodiment of the present disclosure, the aromatic hydrocarbon-based compound may be at least one selected from the following compounds:

[0166] [ka]

[0167] In the display device according to the embodiment of the present disclosure, the conductive particles may be at least one carbon nanotube selected from a single-walled carbon nanotube, a double-walled carbon nanotube, and a multi-walled carbon nanotube.

[0168] In the display device according to the embodiment of the present disclosure, the conductive polymer may be polyfluorene, polyphenylene, polypyrene, polyazulene, polynaphthalene, polyacetylene (PAC), poly-p-phenylenevinylene (PPV), polypyrrole (PPY), polycarbazole, polyindole, polyazepine, polythienylenevinylene (polythienylenevinyl), or the like. The polymer may be at least one selected from the group consisting of poly(3,4-ethylenedioxythiophene), poly(p-phenylene sulfide), poly(p-phenylene sulfide), poly(3,4-ethylenedioxythiophene), poly(3,4-ethylenedioxythiophene), poly(styrenesulfonate), poly(3,4-ethylenedioxythiophene) doped with poly(styrenesulfonate), poly(3,4-ethylenedioxythiophene)-tetramethacrylate (PEDOT-TMA), and polyfuran.

[0169] In the display device according to the embodiment of the present disclosure, the first side protective layer may be disposed in contact with the side coating layer, and the second side protective layer may be disposed in contact with the first side protective layer.

[0170] In the display device according to the embodiment of the present disclosure, the side protection layer may further include a third side protection layer including a light absorbing material.

[0171] In the display device according to the embodiment of the present disclosure, the light absorbing material may include black ink including at least one of carbon black, black dye, and black pigment.

[0172] In a display device according to an embodiment of the present disclosure, the second side protective layer can be arranged to be in contact with the side coating layer, the third side protective layer can be arranged to be in contact with the second side protective layer, and the first side protective layer can be arranged to be in contact with the third side protective layer.

[0173] In the display device according to the embodiment of the present disclosure, the side protective layers may include a first side protective layer including a moisture-proof material, and a fourth side protective layer including conductive particles and black rubber.

[0174] In the display device according to the embodiment of the present disclosure, the moisture barrier material may be an aromatic hydrocarbon compound.

[0175] In the display device according to the embodiment of the present disclosure, the aromatic hydrocarbon-based compound may be at least one selected from the following compounds:

[0176] [ka]

[0177] In the display device according to the embodiment of the present disclosure, the conductive particles may be at least one carbon nanotube selected from a single-walled carbon nanotube, a double-walled carbon nanotube, and a multi-walled carbon nanotube.

[0178] In the display device according to the embodiment of the present disclosure, the black rubber may include at least one of carbon black, black dye, and black pigment, and isoprene-based rubber.

[0179] In the display device according to the embodiment of the present disclosure, the first side protective layer may be disposed in contact with the side coating layer, and the fourth side protective layer may be disposed in contact with the first side protective layer.

[0180] In the display device according to the embodiment of the present disclosure, the fourth side protective layer may be disposed in contact with the side coating layer, and the first side protective layer may be disposed in contact with the fourth side protective layer.

[0181] In the display device according to the embodiment of the present disclosure, the side link lines may include a conductive paste.

[0182] In the display device according to the embodiment of the present disclosure, the side coating layer may include a black ink including at least one of carbon black, a black dye, and a black pigment.

[0183] In the display device according to the embodiment of the present disclosure, the side sealing layer may include at least one of carbon black, black dye, and black pigment.

[0184] The display device according to the embodiment of the present disclosure may further include a functional film layer, and a side edge of the functional film layer and a side edge of the side sealing layer may be arranged on the same line.

[0185] The display device according to the embodiment of the present disclosure may further include an adhesive layer disposed between the first substrate and the second substrate.

[0186] A tiled display device according to an embodiment of the present disclosure includes a plurality of display modules, each of which includes a first substrate including a display area and a non-display area surrounding the display area, a light-emitting element provided in the display area on the first substrate, a first pad portion provided in the non-display area on the upper surface of the first substrate and arranged on one side edge of the first substrate, a second substrate provided on the lower surface of the first substrate, a second pad portion provided in the non-display area on the lower surface of the second substrate and arranged on one side edge of the second substrate, a side link line electrically connecting the first pad portion and the second pad portion, a side coating layer arranged to cover the side link line, a side protective layer arranged to cover at least a portion of the side coating layer, and a side sealing layer arranged to cover at least a portion of the side protective layer.

[0187] The above description is merely an illustrative example of the technical idea of ​​the present disclosure, and various modifications and variations may be made by a person skilled in the art without departing from the essential characteristics of the present disclosure. Furthermore, the examples disclosed in the present disclosure are for the purpose of explanation, not for the purpose of limiting the technical idea of ​​the present disclosure, and therefore the scope of the technical idea of ​​the present disclosure is not limited by these examples.

Claims

1. a first substrate including a display area and a non-display area surrounding the display area; a light-emitting element provided in a display region on the first substrate; a first pad portion provided in the non-display area on the upper surface of the first substrate and disposed on one side edge of the first substrate; a second substrate provided on a lower surface of the first substrate; a second pad portion provided in the non-display area on the lower surface of the second substrate and disposed on one side edge of the second substrate; a side link line electrically connecting the first pad portion and the second pad portion; a side coating layer disposed to cover the side link line; a side protection layer disposed so as to cover at least a portion of the side coating layer; A display device including a side sealing layer disposed so as to cover at least a portion of the side protection layer.

2. The display device according to claim 1 , wherein the light emitting element is a micro LED (Light Emitting Diode).

3. The side protective layer is a first side protective layer including a moisture-proof material; The display device of claim 1 , further comprising a second side protection layer comprising conductive particles and a conductive polymer.

4. 4. The display device according to claim 3, wherein the moisture permeation preventing substance is an aromatic hydrocarbon compound.

5. 5. The display device according to claim 4, wherein the aromatic hydrocarbon compound is at least one selected from the following compounds: 【Chemical 1】

6. 4. The display device of claim 3, wherein the conductive particles are at least one carbon nanotube selected from the group consisting of single-walled carbon nanotubes, double-walled carbon nanotubes, and multi-walled carbon nanotubes.

7. The conductive polymer may be polyfluorene, polyphenylene, polypyrene, polyazulene, polynaphthalene, polyacetylene (PAC), poly(p-phenylenevinylene, PPV), polypyrrole (PPY), polycarbazole, polyindole, polyazepine, polythienylenevinylene, polyaniline, or the like.

4. The display device according to claim 3, wherein the display element is at least one selected from the group consisting of polyaniline (PANI), polythiophene (poly(thiophene)), poly(p-phenylene sulfide (PPS), poly3,4-ethylenedioxythiophene (PEDOT), poly3,4-ethylenedioxythiophene doped in poly(styrenesulfonate) (PEDOT:PSS), poly3,4-ethylenedioxythiophene)-tetramethacrylate (PEDOT-TMA), and polyfuran.

8. the first side protective layer is disposed in contact with the side coating layer; The display device according to claim 3 , wherein the second side surface protection layer is disposed so as to be in contact with the first side surface protection layer.

9. The display device of claim 3 , wherein the side protection layers further include a third side protection layer containing a light absorbing material.

10. 10. The display device of claim 9, wherein the light absorbing material comprises a black ink containing at least one of carbon black, a black dye, and a black pigment.

11. the second side surface protective layer is disposed so as to be in contact with the side surface coating layer; the third side surface protective layer is disposed so as to be in contact with the second side surface protective layer, The display device according to claim 9 , wherein the first side surface protection layer is disposed so as to be in contact with the third side surface protection layer.

12. The side protective layer is a first side protective layer including a moisture-proof material; The display device of claim 1 , further comprising a fourth side protective layer comprising conductive particles and black rubber.

13. The display device according to claim 12, wherein the moisture permeation prevention substance is an aromatic hydrocarbon compound.

14. 14. The display device according to claim 13, wherein the aromatic hydrocarbon compound is at least one selected from the following compounds: 【Chemistry 2】

15. 13. The display device of claim 12, wherein the conductive particles are at least one carbon nanotube selected from the group consisting of single-walled carbon nanotubes, double-walled carbon nanotubes, and multi-walled carbon nanotubes.

16. The display device of claim 12, wherein the black rubber comprises at least one of carbon black, black dye, and black pigment, and isoprene-based rubber.

17. the first side protective layer is disposed in contact with the side coating layer; The display device according to claim 12 , wherein the fourth side surface protection layer is disposed so as to be in contact with the first side surface protection layer.

18. the fourth side surface protective layer is disposed so as to be in contact with the side surface coating layer; The display device according to claim 12 , wherein the first side surface protection layer is disposed so as to be in contact with the fourth side surface protection layer.

19. The display device of claim 1 , wherein the side link lines include a conductive paste.

20. The display device of claim 1 , wherein the side coating layer includes a black ink containing at least one of carbon black, a black dye, and a black pigment.

21. The display device of claim 1 , wherein the side sealing layer comprises at least one of carbon black, black dye, and black pigment.

22. Further comprising a functional film layer, The display device according to claim 1 , wherein the side edges of the functional film layer and the side sealing layers are aligned on the same line.

23. The display device of claim 1 , further comprising an adhesive layer disposed between the first substrate and the second substrate.

24. In a tiled display device including a plurality of display modules, Each of the plurality of display modules a first substrate including a display area and a non-display area surrounding the display area; a light-emitting element provided in a display region on the first substrate; a first pad portion provided in the non-display area on the upper surface of the first substrate and disposed on one side edge of the first substrate; a second substrate provided on a lower surface of the first substrate; a second pad portion provided in the non-display area on the lower surface of the second substrate and disposed on one side edge of the second substrate; a side link line electrically connecting the first pad portion and the second pad portion; a side coating layer disposed to cover the side link line; a side protection layer disposed so as to cover at least a portion of the side coating layer; A tiled display comprising a display device including a side sealing layer disposed so as to cover at least a portion of the side protection layer.

Images