Housing structure of electronic component

Abstract

To prevent moisture accumulating in a housing from damaging electronic components through pressure change in the housing.SOLUTION: A housing structure includes a housing, a storage space (Ra1), and an exhaust path (Pe). The housing includes a first housing (10) and a second housing (40) which are fitted with each other. The storage space (Ra1) is formed by the first housing (10) and the second housing (40) being fitted with each other and houses electronic components (20A, 20B). The exhaust path (Pe) is provided at the outside of the storage space (Ra1) and allows a fitting part (K) of the first housing (10) and the second housing (40) and the outside of the housing to communicate with each other.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present invention relates to a housing structure for an electronic component. [Background technology]

[0002] Patent Document 1 discloses a technology for preventing damage or deformation of a flat antenna cover that houses an antenna and other components due to pressure changes inside the antenna cover caused by temperature changes. This antenna cover has rectangular front and rear covers, with an antenna board fitted between the front and rear covers. Breathing holes that communicate with the outside are provided in the corners of the front cover, and the pressure rise and fall inside the antenna cover is suppressed through the contact surface with the rear cover. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2001-44735 Summary of the Invention [Problem to be solved by the invention]

[0004] The technology described in Patent Document 1 suppresses, to some extent, the rise and fall of pressure in the sealed space housing the antenna board. However, when a housing structure housing electronic components and the like by fitting two housings together is placed flat on the ground, for example, moisture such as rainwater that has seeped into the bottom of the housing due to, for example, an increase in internal pressure caused by temperature differences between day and night, or loosening of the waterproof packing, may be sucked up through the fitting and enter the storage space for the electronic components. Rainwater or the like entering the storage space may damage the electronic components.

[0005] The present disclosure aims to prevent moisture accumulated at the bottom of a housing due to pressure changes inside the housing from damaging electronic components. [Means for solving the problem]

[0006] The housing structure for an electronic component according to the present disclosure includes a housing, a storage space, and an exhaust path. The housing includes a first housing and a second housing that are fitted together. The storage space is formed by fitting the first housing and the second housing together, and stores the electronic component. The exhaust path is provided outside the storage space and connects the fitting portion between the first housing and the second housing to the outside of the housing. [Effects of the Invention]

[0007] According to the present disclosure, it is possible to prevent moisture accumulated at the bottom of the housing due to pressure changes inside the housing from damaging electronic components. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a perspective view showing the appearance of a housing structure of an electronic component according to an embodiment. [Figure 2] FIG. 2 is an exploded perspective view of the housing structure of the electronic component. [Figure 3] FIG. 3 is a schematic top view of the housing structure of the electronic component. [Figure 4] 4 is a schematic cross-sectional view of the housing structure of the electronic component shown in FIG. 3 taken along line IV-IV. [Figure 5] FIG. 5 is a diagram showing a part of the rear surface of the upper housing. [Figure 6] FIG. 6 is a schematic diagram showing the rear surface of the mounting plate. [Figure 7A] FIG. 7A is a perspective view of a housing structure of an electronic component in a modified example (1). [Figure 7B] FIG. 7B is a top view of the housing structure of the electronic component shown in FIG. 7A. [Figure 7C] 7C is a schematic cross-sectional view taken along line VIIC-VIIC in the housing structure of the electronic component shown in FIG. 7B. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, a housing structure for an electronic component according to an embodiment will be described with reference to the drawings. In the drawings, the same or corresponding parts are designated by the same reference characters, and description thereof will not be repeated.

[0010] FIG. 1 is a perspective view showing the appearance of a housing structure 1 for an electronic component according to this embodiment. Hereinafter, the housing structure for an electronic component will be referred to as housing structure 1. The housing structure 1 in this embodiment is used, for example, in a vehicle presence sensor installed outdoors. The configuration of the housing structure 1 will be specifically described below with reference to FIG. 1 and FIGS. 2 to 5.

[0011] Fig. 2 is an exploded perspective view of the housing structure 1 shown in Fig. 1. As shown in Fig. 1 and Fig. 2, the housing structure 1 includes a housing C (10, 40), electronic components 20 (20A, 20B), a waterproof packing 30 (an example of a waterproof buffer member), and a mounting plate 50. Hereinafter, the positive direction of the Z axis may be referred to as "up" and the negative direction of the Z axis may be referred to as "down."

[0012] The housing C includes an upper housing 10 (an example of a first housing) and a lower housing 40 (an example of a second housing). The upper housing 10 has a disk shape. The lower housing 40 has a cylindrical shape with an open top. The lower housing 40 has a storage space Rb therein for storing electronic components 20B (20). The housing C is installed via a mounting plate 50 so that the surface (rear surface) of the lower housing 40 opposite the upper housing 10 is approximately parallel to the installation surface, such as the ground, on which the housing C is installed.

[0013] The waterproof packing 30 has a ring shape and is sandwiched between the upper housing 10 and the lower housing 40 .

[0014] The electronic component 20A is, for example, a circuit board on which circuit components including a vehicle presence sensor are mounted. The electronic component 20B is, for example, a battery that supplies power to the electronic component 20A. The electronic component 20A is placed on top of the electronic component 20B housed in the lower housing 40. When the upper housing 10 is fitted to the lower housing 40 with the waterproof packing 30 sandwiched therebetween, the surface of the lower housing 40 is covered by the upper housing 10 as shown in FIG. 1, and the electronic components 20A and 20B are housed in the housing C.

[0015] The mounting plate 50 has a rectangular shape with a circular opening 501 formed inside. The area of ​​the opening 501 is smaller than the bottom area of ​​the lower housing 40, and the opening 501 is covered by the bottom surface of the lower housing 40 when the lower housing 40 is attached.

[0016] Here, the housing structure 1 will be described in further detail with reference to Figs. 3 to 6. Fig. 3 is a view of the housing structure 1 in Fig. 1 as seen from above. However, the mounting plate 50 is omitted from Fig. 3. Fig. 4 is a schematic cross-sectional view of the housing structure 1 taken along line IV-IV in Fig. 3. Fig. 5 is a view showing a portion of the back surface of the upper housing 10. Fig. 6 is a schematic view showing the back surface of the mounting plate 50.

[0017] 2 and 4, the lower housing 40 has a cylindrical side surface 411 and an upper end portion 401 of the side surface 411. As shown in Fig. 4, the waterproof packing 30 is disposed at the upper end portion 401. The side surface 411 is a portion that is fitted with the upper housing 10, and faces a part of the rear surface of the upper housing 10.

[0018] 4 and 5, the upper housing 10 has a disk-shaped outer wall 16 and circular inner walls 11 and 12 connected to the back surface of the outer wall 16. The inner walls 11 and 12 extend from the back surface of the outer wall 16 toward the mounting plate 50 and are arranged substantially parallel to each other. The inner wall 11 is arranged radially inward of the inner wall 12 and faces a side surface 411 of the lower housing 40 as shown in FIG.

[0019] The upper housing 10 further has a plurality of partition walls 13, 14 (an example of inner walls) on the back surface of the outer wall 16. The plurality of partition walls 13 have a substantially rectangular shape in a plan view, and are sandwiched between the inner wall 11 and the inner wall 12. The plurality of partition walls 14 have a substantially triangular shape in a plan view, and are sandwiched between the inner wall 12 and the outer edge portion 161 of the upper housing 10. The upper housing 10 has an internal space Ra21 (Ra2) partitioned between the inner wall 11 and the inner wall 12 by the plurality of partition walls 13, and an internal space Ra22 (Ra2) partitioned between the inner wall 12 and the outer edge portion 161 by the plurality of partition walls 14.

[0020] The upper housing 10 has a storage space Ra1 and a recess 101 in which a waterproof packing 30 is disposed, on the back surface of the outer wall 16, on the opposite side of the inner wall 11 from the internal space Ra2. The storage space Ra1 includes a storage space Ra11 in which the lower housing 40 is stored and a storage space Ra12 in which the electronic component 20A is stored. As shown in FIG. 4, the storage space Ra12 is located above the storage space Ra11.

[0021] The waterproof packing 30 is sandwiched between the upper end 401 of the side surface 411 of the lower housing 40 and the recess 101 of the upper housing 10. With the waterproof packing 30 sandwiched, the storage space Ra12 of the upper housing 10 and the storage space Rb of the lower housing 40 communicate with each other, forming a sealed storage space of the housing C.

[0022] 4, the portion K where the side surface 411 of the lower housing 40 faces the inner wall 11 of the upper housing 10 is the mating portion between the upper housing 10 and the lower housing 40. The degree of adhesion at the mating portion changes depending on the wear of the waterproof packing 30, the expansion of the air inside, etc.

[0023] As shown in FIGS. 4 and 5, the inner wall 11 of the upper housing 10 has exhaust holes 11a. The exhaust holes 11a connect the fitting portion K to the internal space Ra21. Furthermore, as shown in FIGS. 3 and 4, the outer wall 16 of the upper housing 10 has exhaust holes 16b. In this embodiment, six exhaust holes 16b are arranged at intervals of approximately 60° from the center 160 of the external wall 16 (see FIG. 3). The exhaust holes 16b connect the internal space Ra21 to the outside. The upper housing 10 has an exhaust path Pe that connects the fitting portion K to the outside of the upper housing 10 by the exhaust holes 11a, the internal space Ra21, and the exhaust holes 16b.

[0024] In this embodiment, six exhaust paths Pe are formed in the upper housing 10, but the number of exhaust paths Pe is not limited to this. It is sufficient that at least one exhaust path Pe is provided in the upper housing 10.

[0025] As shown in FIGS. 4 and 5, the upper housing 10 has a plurality of arch-shaped drain holes 12a, a plurality of arch-shaped drain holes 13a, and a plurality of arch-shaped drain holes 16a.

[0026] Drainage holes 13a (FIG. 5) are provided in the bottom of each partition wall 13, i.e., on the mounting plate 50 (FIG. 4) side of each partition wall 13. All of the internal spaces Ra21 communicate with each other through the drainage holes 13a provided in the bottom of each partition wall 13.

[0027] In this embodiment, as shown in Fig. 5, some of the drain holes 12a are provided in the inner wall 12 facing the exhaust hole 11a, and other drain holes 12a are provided in the inner wall 12 not facing the exhaust hole 11a. As shown in Fig. 4, the drain holes 12a are provided at positions lower than the exhaust hole 11a, and connect the internal space Ra21 and the internal space Ra22.

[0028] As shown in Fig. 5, drainage hole 16a faces drainage hole 12a at an outer edge 161 of outer wall 16 and is provided as a pair with drainage hole 12a. As shown in Fig. 4, drainage hole 16a is provided at a position lower than exhaust hole 11a. Drainage hole 16a connects internal space Ra22 with the outside.

[0029] The drain hole 12a may be provided in at least one of the inner wall 12 facing the exhaust hole 11a and the inner wall 12 not facing the exhaust hole 11a, and the drain hole 16a may be provided in the outer edge portion 161 so as to form a pair with the drain hole 12a.

[0030] As shown in FIG. 6, the mounting plate 50 has drainage holes 50a and 50b (examples of a second drainage hole and a first drainage hole).

[0031] Similar to the exhaust holes 16b, six drainage holes 50b are arranged at approximately 60° intervals from the center of the mounting plate 50, and pass through the mounting plate 50 to communicate with the internal space Ra21. As shown in FIG. 4, the drainage holes 50b overlap with the exhaust holes 16b of the upper housing 10 in a plan view.

[0032] The drainage holes 50a are provided between adjacent drainage holes 50b at positions that overlap with the fitting portion K between the upper housing 10 and the lower housing 40 in a plan view. In other words, the drainage holes 50a are provided radially inward of the drainage holes 50b and along the fitting portion K. The drainage holes 50a pass through the mounting plate 50 and connect the fitting portion K between the upper housing 10 and the lower housing 40 to the outside.

[0033] In Figure 4, water accumulated in the internal spaces Ra21 and Ra22 of the upper housing 10 is drained to the outside through drainage paths Pw1 and Pw2. The drainage path Pw1 is a path that drains water to the outside through drainage hole 13a of the upper housing 10 and drainage hole 50b of the mounting plate 50. The drainage path Pw2 is a path that drains water to the outside through drainage holes 12a and 16a of the upper housing 10. Furthermore, water accumulated in the fitting portion K between the upper housing 10 and the lower housing 40 is drained to the outside through drainage hole 50a of the mounting plate 50 (Figure 6).

[0034] The housing structure 1 in the above embodiment has an exhaust path Pe (FIG. 4) that connects the fitting portion K between the upper housing 10 and the lower housing 40 to the outside of the housing C. Specifically, an exhaust hole 11a that connects the fitting portion K to the internal space Ra21 is provided in the inner wall 11 of the upper housing 10, and an exhaust hole 16b that connects the internal space Ra21 to the outside is provided in the outer wall 16 of the upper housing 10. Therefore, air in the fitting portion K between the upper housing 10 and the lower housing 40 is exhausted from the exhaust hole 11a through the internal space Ra21 to the outside through the exhaust hole 16b. Therefore, when the pressure in the storage space inside the housing C increases due to a temperature change, moisture accumulated at the bottom of the housing C is less likely to be sucked up toward the upper housing 10 from loosely fitted portions, and electronic components 20A stored in the upper housing 10 are less likely to be damaged.

[0035] Furthermore, since the housing structure 1 in the above embodiment has drainage paths Pw1, Pw2 (FIG. 4) that communicate from the internal space Ra2 of the upper housing 10 to the outside, water that accumulates in the internal spaces Ra21 and Ra22 of the upper housing 10 is discharged to the outside. Furthermore, since the drainage holes 50a (FIG. 6) provided in the mounting plate 50 communicate with the outside and the mating portion K between the upper housing 10 and the lower housing 40, water that accumulates in the mating portion K is discharged to the outside. Therefore, even if moisture gets into the mating portion K of the housing C, the electronic component 20 is unlikely to be damaged.

[0036] Furthermore, the housing structure 1 in the above embodiment is placed in an outdoor parking lot where it is likely to be stepped on by parked vehicles. The inner walls 11, 12 and partition walls 13, 14 are provided on the back surface of the upper housing 10 so as to surround the storage space Ra1. Therefore, the strength of the upper housing 10 is increased compared to when these walls are not provided. Therefore, even if the housing structure 1 is placed in an outdoor parking lot where it is likely to be stepped on by parked vehicles, the inner walls 11, 12 and partition walls 13, 14 function as reinforcing materials, and the electronic components 20 stored therein are unlikely to be damaged.

[0037] The above describes embodiments of the present disclosure. However, the present disclosure is not limited to the above embodiments and can be implemented in various forms without departing from the spirit and scope of the present disclosure. The drawings mainly show each component in a schematic manner for ease of understanding, and the thickness, length, number, etc. of each component shown in the drawings may differ from the actual ones due to the convenience of creating the drawings. Furthermore, the shape, dimensions, etc. of each component shown in the above embodiments are merely examples and are not particularly limited, and various modifications are possible within a scope that does not substantially deviate from the effects of the present invention.

[0038] [Variations] (1) The shape of the housing C is not limited to the shape shown in the embodiment. Figures 7A to 7C are diagrams showing an example of a housing structure of an electronic component in this modified example. Specifically, Figure 7A is a perspective view of the housing structure in this modified example. Figure 7B is a top view of the housing structure shown in Figure 7A. Figure 7C is a schematic cross-sectional view of the housing structure shown in Figure 7B, taken along line VIIC-VIIC.

[0039] 7A to 7C, the housing structure 1A in this modification includes an upper housing 10A (an example of a first housing) and a lower housing 40A (an example of a second housing) as housings CA. Although not shown, the housing structure 1A also includes mounting plates that cover the bottom surfaces of the upper housing 10A and the lower housing 40A.

[0040] The upper housing 10A has a substantially rectangular top surface (the side facing the positive Z-axis direction) and a square prism-shaped outer wall 60 with an open bottom surface (the side facing the negative Z-axis direction). An upper surface 601 of the outer wall 60 has exhaust holes 60a (FIGS. 7B and 7C) arranged along the outer edge thereof. As shown in FIG. 7C, a side surface 602 of the outer wall 60 is connected to the top surface 601 at an outward incline.

[0041] Although not shown, a recess for fitting a waterproof packing (not shown) is provided on the back surface of the top surface 601 of the upper housing 10A. The lower housing 40A is housed on the back surface side of the upper housing 10A via the waterproof packing.

[0042] Lower housing 40A has a generally rectangular prism shape with an open top surface (positive Z-axis direction). As shown in Fig. 7C, side surface 421 of lower housing 40A is generally perpendicular to bottom surface 422, and side surface 421 has storage space Rc for storing electronic component 20 (Fig. 2, etc.) inside.

[0043] A waterproof packing (not shown) is arranged on the upper end of side surface 421 of lower housing 40A, and upper housing 10A and lower housing 40A are fitted together via the waterproof packing. That is, in this modification, the storage space for electronic component 20 is not in upper housing 10A, but only in storage space Rc on the lower housing 40A side.

[0044] In FIG. 7C , the portion KA where the side surface 421 of the lower housing 40A faces the back surface of the upper housing 10A, i.e., the back surface of the side surface 602, is the mating portion between the upper housing 10A and the lower housing 40A in this modified example. The mating portion KA communicates with the outside through the exhaust hole 60a provided in the upper housing 10A. In other words, the housing structure 1A has an exhaust path that leads from the mating portion KA to the outside through the exhaust hole 60a. Because the mating portion KA communicates with the outside, moisture accumulated at the bottom of the housing CA is less likely to be sucked up from the mating portion KA to the upper housing 10A side due to pressure changes in the storage space Rc sealed in the housing CA, and the electronic components 20 in the storage space Rc are less likely to be damaged.

[0045] An inner wall may be provided inside the side surface 602 of the outer wall 60 of the upper housing 10A as a reinforcing material or a positioning member for the lower housing 40A. The inner wall may be provided from the top surface 601 of the outer wall 60 toward the bottom surface, approximately perpendicular to the top surface 601. When an inner wall is provided in the upper housing 10A, the side surface 421 of the lower housing 40A and the inner wall of the upper housing 10A face each other, and the portion where the inner wall of the upper housing 10A and the side surface 421 of the lower housing 40A face each other forms a mating portion. In this case, the exhaust hole 60a provided in the upper housing 10A may be arranged so as to communicate with the mating portion.

[0046] (2) The housing structure 1 has the exhaust path Pe and the drainage paths Pw1 and Pw2, but it is sufficient if it has at least the exhaust path Pe.

[0047] (3) The housing structure 1 has two drainage paths Pw1 and Pw2, but it is sufficient that at least the drainage path Pw2 is provided. Specifically, it is sufficient that the housing structure 1 is provided with the drainage path Pw2 that drains water from the internal space Ra21 to the outside through the drainage holes 12a of the inner wall 12 and the drainage holes 16a of the outer wall 16.

[0048] (4) In the above-described housing structure 1, the upper housing 10 has two separate internal spaces Ra21 and Ra22 (see FIG. 5, etc.). However, it is sufficient if there is a single internal space provided outside the storage space Ra1 that is in communication with the fitting portion K and the outside. Specifically, the upper housing 10 may be provided with only the internal wall 11 without the internal wall 12. That is, the internal spaces Ra21 and Ra22 form an internal space that is in communication with the outside via the drainage hole 16a in the external wall 16. In this case, the strength of the upper housing 10 is reduced compared to when the internal wall 12 is provided. Furthermore, in a configuration without the internal wall 12, the drainage hole 16a may function not only as a drainage hole but also as an exhaust hole.

[0049] (5) The housing structures 1, 1A do not necessarily have to be provided with the mounting plate 50. The housings C, CA may be mounted, for example, on a plate-like member placed on the ground so that the bottoms of the upper housings 10, 10A and lower housings 40, 40A are in close contact with each other. Even with this configuration, the mating portions K, KA are in communication with the outside, so that moisture is less likely to be absorbed into the storage space from the mating portions K, KA due to pressure changes inside the housings.

[0050] (6) In the embodiments, the housing structures 1 and 1A are installed in an outdoor parking lot and house a vehicle presence sensor as an electronic component, but the location where the housing structures 1 and 1A are installed and the electronic components are not limited to those in the embodiments. The housing structures 1 and 1A may be installed in a location other than a parking lot, and may house circuit components other than a vehicle presence sensor as an electronic component. [Industrial Applicability]

[0051] The present invention can be used for sensors and the like that are installed outdoors. [Explanation of symbols]

[0052] 1, 1A: Housing structure 10, 10A: Upper housing 11, 12: Inner wall 11a, 16b, 60a: Exhaust holes 12a, 13a, 16a, 50a, 50b: Drain hole 13, 14: Bulkhead 16: Exterior wall 20, 20A, 20B: Electronic components 30: Waterproof packing 40, 40A: Lower housing 50: Mounting plate 60: Exterior wall 101: Recess 161: Outer edge 401: Upper end 411, 421, 602: Side 601:Top surface C, CA: Housing K, KA: Mating part Pe: Exhaust path Pw1, Pw2: Drainage route Ra1, Ra11, Ra12, Rb, Rc: Storage space Ra2, Ra21, Ra22: Internal space

Claims

1. a housing including a first housing and a second housing that are fitted together; a storage space for storing electronic components, the storage space being formed by fitting the first housing and the second housing together; A housing structure for electronic components, comprising: an exhaust path provided outside the storage space, communicating between a mating portion between the first housing and the second housing and the outside of the housing.

2. the fitting portion is a portion where a side surface of the second housing and a part of a back surface of the first housing face each other, The housing structure for an electronic component according to claim 1 , wherein the exhaust path is a path for discharging air between a side surface of the second housing and a part of a rear surface of the first housing to the outside of the housing.

3. the storage space includes a first storage space provided on the back surface side of the first housing and a second storage space provided in the second housing, the first housing includes an internal space that is separated from the first storage space on a rear surface of the first housing and is formed around the first storage space, 3. The housing structure for an electronic component according to claim 1, wherein the internal space of the first housing is part of the exhaust path and communicates with the fitting portion and the outside of the housing.

4. The first housing includes: an outer wall including a rear surface of the first housing and having a disk shape with a recess on the rear surface side; an inner wall facing a side surface of the second housing and extending from a rear surface of the outer wall toward the second housing; a first exhaust hole provided in the outer wall and communicating with an internal space of the first housing and an outside of the first housing; the first storage space is a space surrounded by the inner wall, an internal space of the first housing is provided between the inner wall and the outer wall, the inner wall has a second exhaust hole communicating with the fitting portion and an internal space of the first housing; The housing structure for an electronic component according to claim 3 , wherein the exhaust path includes an internal space of the first housing, the first exhaust hole, and the second exhaust hole.

5. The first housing further includes a drainage path, 5. The electronic component housing structure of claim 4, wherein the drainage path is provided in the internal space of the first housing at a bottom portion below the first exhaust hole and the second exhaust hole, and communicates from the internal space of the first housing to the outside of the first housing.

6. The electronic component housing structure according to claim 5 , wherein the first housing has a drainage hole, as the drainage path, at an outer edge of the outer wall, which is in communication with an internal space of the first housing and the outside of the first housing.

7. a plate-like member that covers a bottom surface of the first housing and at least a portion of a bottom surface of the second housing; the plate-shaped member has a first drainage hole and a second drainage hole, the first drainage hole communicates with an internal space of the first housing; The electronic component housing structure according to claim 5 , wherein the second drainage hole communicates with the fitting portion.

8. The housing structure for an electronic component according to claim 1 , further comprising a waterproof buffer member provided between the first housing and the second housing.

9. The electronic component housing structure according to claim 1 or 2, wherein the plurality of electronic components includes a circuit board on which a vehicle presence sensor is mounted.

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