Lighting module, lighting device, and method of manufacturing the same

Abstract

To provide a backlight unit, a liquid crystal display device, or a vehicle lamp having a lighting module.SOLUTION: A light emitting device includes: a substrate 401; a light source 100 including a plurality of light emitting elements 101, 103; a resin layer 420 disposed on the substrate 401; and a first diffusion layer disposed on the resin layer 420; wherein the resign layer 420 includes the first resign portion 421 disposed on the light sources 100 and a second resign portion 423 disposed on the substrate 401 adjacent to the first resign portion 421, an upper surface of the first resign portion 421 has a slope and is spaced apart from the first diffusion layer, the second resign portion 423 includes materials different from those of the first resign portion 421, and a height Z1 of the upper surface of the second resin portion 423 may be greater than a height Z0 of a lowermost end PS1 of the upper surface of the first resign portion 421, with the upper surface of the substrate 401 as a reference.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure relates to a lighting module having a light-emitting element, a lighting device, and a manufacturing method thereof. The present disclosure relates to a backlight unit having a lighting module, a liquid crystal display device, or relates to vehicle lamps. [Background technology]

[0002] The application of lighting is not only vehicle lighting but also backlighting for displays and signs. Light-emitting diodes (LEDs) consume less energy than conventional light sources such as fluorescent lamps and incandescent lamps. It has advantages such as low power consumption, semi-permanent lifespan, fast response speed, safety, and environmental friendliness. Light-emitting diodes are applied to various display devices and various lighting devices such as indoor and outdoor lights. Recently, lamps that use light-emitting diodes have been proposed as vehicle light sources. Compared to incandescent lamps, light-emitting diodes have the advantage of consuming less power. However, since the angle of light emitted from the LED is small, it is difficult to install the LED on the vehicle. When using it as a lamp for general use, the light emitting area of ​​the lamp using the light emitting diode should be increased. The small size of light-emitting diodes allows for greater freedom in lamp design. It can be used for a long time and is economical due to its semi-permanent lifespan. Summary of the Invention [Problem to be solved by the invention]

[0003] The present disclosure provides a resin layer having resin parts made of different materials between a substrate and a diffusion layer, and To provide a lighting module or a lighting device having a light source sealed with any one of the resin parts. The resin layer according to the present disclosure includes a first resin portion on the light source and a second resin portion spaced apart from the first resin portion. a first resin portion made of silicone material covering the light source, and a second resin portion separating the first resin portion from the light source; The present disclosure also provides a second resin portion made of UV resin material in front of the resin portion. An air region is provided between the first resin part and the diffusion layer, and an adhesive layer is disposed between the second resin part and the diffusion layer. The present disclosure provides a lighting module and a lighting device in which a light source is placed on a first resin portion that covers the light source. and an air region and a light-shielding portion are arranged on the first resin portion and bonded to the second resin portion spaced apart from the first resin portion. The present disclosure provides a lighting module and a lighting device in which the layers are arranged. An adhesive layer and a light-shielding portion are disposed between the diffusion layers, and different layers are disposed between the plurality of diffusion layers and the substrate. Lighting module and lighting device in which a resin layer having a light-shielding portion made of a material and an air region are arranged The present disclosure provides a lighting module and a device in which a reflective member is disposed between a resin layer and a substrate. The present disclosure provides a lighting module or lighting device that irradiates a surface light source, and The present disclosure provides a backlight unit having a lighting module and a manufacturing method thereof. , a liquid crystal display device or a vehicle lamp can be provided. [Means for solving the problem]

[0004] The lighting device according to the present disclosure includes a substrate and a light source including a plurality of light-emitting elements disposed on the substrate. a source, a resin layer disposed on the substrate, and a first diffusion layer disposed on the resin layer. the resin layer includes a first resin portion disposed on the light source and a second resin portion adjacent to the first resin portion. and a second resin portion disposed on the substrate, the upper surface of the first resin portion having an inclination. and the second resin portion is separated from the first diffusion layer, and the second resin portion includes a material different from that of the first resin portion. The height of the upper surface of the second resin portion is determined based on the upper surface of the substrate. The lighting device according to the present disclosure may include a substrate and a light source provided on the substrate. a light source disposed on the substrate, a resin layer disposed on the substrate, and a second insulating layer disposed on the resin layer. a first diffusion layer, and the light source includes a first light emitting element and a second light emitting element spaced apart from the first light emitting element. the resin layer is disposed on the first light-emitting element and the second light-emitting element. a plurality of first resin portions each including a first light emitting element and a second resin portion disposed between the first light emitting element and the second light emitting element; a resin portion, and upper surfaces of the plurality of first resin portions are spaced apart from the first diffusion layer and are disposed on the substrate. The height of the upper surface of the second resin portion is determined by the height of the upper surface of the first resin portion in the vertical direction on the upper surface of the substrate. The height of the first resin portion may be greater than the height of the upper surface of the first resin portion that overlaps with the light emitting element. The method for manufacturing the lighting device according to the present invention includes the steps of arranging a light source having a plurality of light-emitting elements on a substrate. forming a first resin portion on a front surface of each of the plurality of light emitting elements; forming a second resin portion on the outside of the first resin portion; and forming a first adhesive layer on the second resin portion. and bonding the second resin portion and the first diffusion layer by the first adhesive layer. the first resin portion and the second resin portion include different materials, The first diffusion layer and the first resin portion may be spaced apart from each other.

[0005] According to the present disclosure, the light source includes a first light emitting element and a second light emitting element spaced apart from the first light emitting element. the second resin portion is disposed between the first light emitting element and the second light emitting element. The first resin portion may be arranged in plurality, and the second resin portion may be formed by the plurality of first resin portions. Each of the plurality of first resin portions may be disposed between at least one light-emitting portion. The light-emitting elements are arranged on the substrate in N rows and M columns, The M and N are integers of 1 or more, and have a relationship of N≧M, and the first resin portion and the second resin portion The resin portions may be arranged alternately in the row direction. The resin layer may be integrally formed. The resin layer may have a first side surface and a second side surface that are disposed on opposite sides of each other. the first light emitting element is adjacent to the first side surface, and the second light emitting element is adjacent to the second side surface. the second resin portion is adjacent to the first light-emitting element adjacent to the first side surface of the resin layer, The second resin portion may be disposed between the second light-emitting element adjacent to the second side surface. The height of the uppermost end of the upper surface of the first resin portion may be greater than or equal to the height of the uppermost end of the upper surface of the first resin portion. The second resin portion and the first diffusion layer may be bonded to each other by a first adhesive layer. The first resin portion includes a light-shielding portion on the first resin portion, and the upper surface of the second resin portion is orthogonal to the light-shielding portion in a direction perpendicular to the light-shielding portion. A second diffusion layer disposed on the first diffusion layer and a second diffusion layer disposed on the first diffusion layer may be disposed on the first diffusion layer. a second adhesive layer disposed between the diffusion layer and the second diffusion layer, and the light blocking portion and a first diffusion layer and a second diffusion layer, the first diffusion layer being disposed between the first diffusion layer and the second diffusion layer, and overlapping the first resin portion in a vertical direction. The second adhesive layer and the first adhesive layer may overlap in the vertical direction. The first adhesive layer may not overlap the first resin portion in the vertical direction. The plurality of first resin portions may be spaced apart from each other. The upper surface of the first resin portion may include a region that becomes higher as it moves away from the light source. The upper surface of the first resin portion may include a plurality of recesses and protrusions. The second resin portion may include a cone resin or a thermosetting resin, and the second resin portion may include a UV resin. The region separated between the first resin portion and the first diffusion layer may be an air region. The first resin portion and the second resin portion disposed between the first light emitting element and the second light emitting element The horizontal length of the fat portion may have a ratio of 4:6 to 6:4. [Effects of the Invention]

[0006] According to the present disclosure, discoloration caused by UV resin can be reduced in front of the light source. The second resin part of (Ultra violet) resin is placed between the first resin parts that cover each of the light sources. This can block the influence of UV resin on the light source emission surface. By providing a resin layer having a second resin part disposed between the resin part and the light source, it is possible to The deterioration of electrical and optical characteristics can be prevented in the environment. Hot spots can be suppressed by placing an air area and a light-shielding area on the first resin part. Since the second resin portion is disposed between the first resin portions that cover the light source, the diffusion layer and the second resin The adhesive strength of the adhesive layer bonded between the adhesive layer and the part is improved.

[0007] According to the present disclosure, the luminous intensity and light uniformity of the surface light source can be improved. A reflective member is disposed between the substrate and the light reflective member, thereby improving the light reflection efficiency. The optical reliability of the lighting module and the lighting device having the same can be improved. The reliability of the vehicle lighting device having the lighting module or device can be improved. The device is suitable for backlight units, various display devices, surface light source lighting devices, and vehicle lamps. It can be used. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a cross-sectional view showing an example of an illumination device according to a first embodiment. [Figure 2] FIG. 2 is a partially enlarged view of the lighting device of FIG. [Figure 3] FIG. 3 is an example of a plan view of the lighting device of FIG. [Figure 4] FIG. 4 is a partially enlarged view of the lighting device of FIG. [Figure 5] FIG. 5 is another example of the lighting device of FIG. [Figure 6] FIG. 6 is another example of the lighting device of FIG. [Figure 7] FIG. 7 is a cross-sectional side view of the lighting device of FIG. 3 taken along the line B-B. [Figure 8] FIG. 8 shows an example of a reflecting member in the lighting device of FIG. [Figure 9] FIG. 9 is a diagram showing another example of the arrangement of the lighting device of FIG. [Figure 10] FIG. 10 is a diagram showing a first modified example of the lighting device according to the first embodiment. [Figure 11] FIG. 11 is a diagram showing a second modified example of the lighting device according to the first embodiment. [Figure 12] FIG. 12 is a diagram showing a third modified example of the lighting device according to the first embodiment. [Figure 13] FIG. 13 is a diagram showing a fourth modified example of the lighting device according to the first embodiment. [Figure 14] FIG. 14 is a diagram showing a fifth modified example of the lighting device according to the first embodiment. [Figure 15] FIG. 15 is a diagram showing a sixth modified example of the lighting device according to the first embodiment. [Figure 16] FIG. 16 is a diagram showing a seventh modified example of the lighting device according to the first embodiment. [Figure 17] FIG. 17 is a diagram showing another example of the lighting device according to the first embodiment. [Figure 18a]FIG. 18a is a diagram illustrating a manufacturing process of the lighting device of FIG. [Figure 18b] FIG. 18b is a diagram illustrating a manufacturing process of the lighting device of FIG. [Figure 18c] FIG. 18c is a diagram illustrating a manufacturing process of the lighting device of FIG. [Figure 18d] FIG. 18d is a diagram illustrating a manufacturing process of the lighting device of FIG. [Figure 19] FIG. 19 is an example of the lighting system of FIG. [Figure 20] 20 is a front view of a light emitting element of a light source in the lighting device of FIG. [Figure 21] FIG. 21 is an example of a side cross-sectional view of a light source in the lighting device of FIG. DETAILED DESCRIPTION OF THE INVENTION

[0009] The technical concept of the present disclosure is not limited to the described embodiments, but may be embodied in various forms. The components of the embodiments may be selectively combined within the scope of the technical concept of the present disclosure. In addition, the terms (technical and Terms used herein (including scientific terms) are understood to be terms commonly used in the art to which this disclosure pertains unless expressly and specifically stated otherwise. It is interpreted as meaning that is generally understandable to a person of ordinary skill in the art, and is not like a term defined in a dictionary. The meaning of commonly used terms can be interpreted taking into account the contextual meaning of the technology involved. Furthermore, the terms used in this disclosure are for the purpose of describing the embodiments, The disclosure is not intended to be limiting. As used herein, the singular forms "a," "an," and "the" are used without any specific limitation in the description. It can also include plurals unless otherwise specified, and it can be used to refer to "at least one of A, B, and C (or more than one)". When "Above") is written, it means that one or more of all possible combinations of A, B, and C can be used. In addition, in the description of the components of the present disclosure, first, second, A, B, Terms such as (a), (b), etc. can be used. Such terms are used to separate the components from other components. The term is used to distinguish it from the elements, and the essence or order of the components is not specified by the term. It is not limited to the fact that one component is "connected," "coupled," or "connected" to another component. When a component is described as being "connected," it means that the component is directly connected or connected to another component. and when other components are "connected," "coupled," or "connected" between the components. Also, it is described as being formed or arranged "above or below" each component. When mounted on a surface, "above or below" refers not only to when the two components are in direct contact, but also to when one This also includes cases where one or more other components are formed or disposed between the two components. Also, when it is expressed as "up or down," it is not limited to the upward direction, but is based on one component. It can also mean a downward direction.

[0010] The lighting device according to the present disclosure can be used in a variety of lamp devices that require illumination, such as vehicle lamps, It can be applied to home lighting devices and industrial lighting devices. For example, it can be applied to vehicle lamps. In this case, headlights, width lights, side mirror lights, fog lights, tail lights, brake lights Lights, daytime running lights, vehicle interior lighting, door scuffs, rear combination lamps, back door The lighting device of the present disclosure can be applied to indoor and outdoor advertising devices, display devices, etc. It can also be applied to various train fields, and other technologies are currently being developed and commercialized. It will be applicable to all lighting-related fields and advertising-related fields that can be realized with technological development. .

[0011] 1 to 7, a lighting device 400 according to the present disclosure includes a substrate 401, a light source 100 disposed on the substrate 1, a resin layer 420 covering the light source 100, and a resin layer The lighting device 400 may include a first diffusion layer 430 on the substrate 420. The lighting device 400 according to the present disclosure may include a reflective member 410 disposed on the light source 401. The light emitted from the light source 100 can be emitted as a surface light source. The device 400 includes a plurality of light sources on at least one of the upper and lower surfaces of the substrate 401. It is possible.

[0012] The light source 100 includes a plurality of light emitting elements 101 and 103. , 103 may be arranged in N rows and M columns (N and M are integers equal to or greater than 1, and N≧M). The resin layer 420 may be disposed between the substrate 401 and the first diffusion layer 430 . Between the substrate 401 and the first diffusion layer 430, the resin layer 420 and the light source 1 The light emitting elements 101 and 103 of the light source 100 are arranged in the same direction or in different directions. The resin layer 420 can irradiate the light in the opposite direction. A different resin material is disposed between the elements 101 and 103. The resin layer 420 is The resin layer guides and diffuses the light emitted from the resin layer, and emits a surface light source through the surface. 420 is a resin part 421, 423 of different materials arranged alternately in the horizontal direction, and either one The resin portion can be disposed between other resin portions that cover the light emitting elements 101 and 103, respectively. The resin layer 420 has different members disposed on resin parts 421 and 423 made of different materials. The resin layer 420 has resin parts 421 and 423 made of different materials, and the upper surfaces of these parts are on different planes. For the sake of explanation, in each drawing, the substrate 401 and the resin layer 420 The outer surfaces are illustrated as first to fourth outer surfaces S1, S2, S3, and S4, and the first outer surface S1 is , one side surface of the substrate 401 and the resin layer 420, and the second outer surface S2 is the first outer surface S3. The third and fourth outer surfaces S3 and S4 are opposite to the first and second outer surfaces S1 and S2. The first and second surfaces may be disposed between both ends of the side surfaces S1 and S2 and may be opposed to each other. The second outer surfaces S1 and S2 extend in a long length in the second direction, and the third and fourth outer surfaces S 3, S4 may be extended in the first direction. The irradiated module may be 3.5 mm or less, for example 3 mm or less or 2.3 m The lighting device 400 may be provided with a thickness Z5 in the range of 100 to 300 mm. , and may be provided with a flat horizontal surface or a flexible curved surface.

[0013] 1 to 4, the substrate 401 is a printed circuit board (PCB) having a circuit pattern. The substrate 401 may include, for example, a resin-based printed circuit board. Circuit board (PCB), Metal Core PCB, Flexible PCB, Ceramic The substrate 4 may include at least one of a micro PCB or an FR-4 substrate. When the light source 100 is mounted on a metal core PCB with a metal layer on the bottom, the heat dissipation efficiency of the light source 100 is improved. The substrate 401 is electrically connected to the light source 100. 01 includes a wiring layer (not shown) having a circuit pattern thereon, and the wiring layer The light emitting elements 101 and 103 are electrically connected to the substrate 4. When a plurality of light emitting elements 101 and 103 are arranged on the substrate 101, the plurality of light emitting elements 101 and 103 are connected by the wiring layer. The substrate 401 is connected to the light emitting device 101 in series, parallel, or series-parallel. , 103 and the resin layer 420. The top surface of the substrate 401 may have an XY plane. The upper surface of the substrate 401 can be a flat surface or a curved surface. The height may be the height in the vertical or Z direction, where the X direction is the first direction. The Y direction may be the second direction. The Z direction may be the first and second directions. The length of the substrate 401 in the first direction may be longer than the width in the second direction. The length of the substrate 401 in the first direction may be greater than the width Y1 in the second direction (see FIG. 4). The number of light emitting elements 101 and 103 may be two or more times, for example, four or more times. The substrate 401 may be arranged at predetermined intervals in the first direction. The transparent material may include a transparent material that transmits light through the bottom surface and the bottom surface. At least one of (Polyethylene terephthalate), PS (Polystyrene), and PI (Polyimide) It may contain one.

[0014] The light source 100 includes a plurality of light emitting elements 101, 103 arranged in at least a first direction X. The light source 100 may include at least one third light source arranged in the second direction Y. That is, the light source 100 includes N rows and M columns of light emitting elements. For convenience of explanation, the light emitting element may be a first light emitting element spaced apart in a first direction. The first light emitting element 101 and the second light emitting element 103 will be described as an example. The resin layer 420 is disposed adjacent to the first outer surface S1 of the resin layer 420, and emits light in the direction of the second outer surface S2. The second light emitting element 103 is located in the resin layer 420 adjacent to or adjacent to the second outer surface S2. is spaced apart from the first light emitting element 101 in the first direction X and emits light in the direction of the second outer surface S2. The light emitting elements 101 and 103 are disposed on a substrate 401 and are oriented in a first direction or a second direction. The light emitting elements 101 and 103 emit light in the direction of the side surface S2. The light emitting elements 101 and 103 have an emission surface 81 from which light is emitted. The light exit surface 81 is oriented in a third direction or The light emitting surface 81 may be arranged vertically. The light-emitting diode chip 7 may be a surface of the light-emitting diode chip 80, a vertical plane, or a It may include a concave or convex surface in one direction. The light emitting elements 101 and 103 are disposed on the substrate 401, and the conductive bonding member 203 , 205 are electrically connected to pads 403, 405 of the substrate 401. The composite members 203 and 205 may be made of a solder material or a metal material. The optical elements 101 and 103 are arranged in one or more rows in the second direction on the substrate 401. The one or more rows of light emitting elements 101, 103 may be arranged on the second substrate 401. They can emit light laterally or in the same or different directions. The light emitting elements 101 and 103 are elements having a light emitting diode (LED) chip. The light emitting diode may include a package in which the light emitting diode chip is packaged. The light emitting chip 71 emits at least one of blue, red, green, ultraviolet (UV), and infrared light. The light emitting diode chip can emit blue light, for example, 400 nm to 500 nm. The wavelength with the highest intensity is in the range of 400 nm to 470 nm. A molding member 80 is disposed inside the light emitting elements 101 and 103. The molding member 80 may include a wavelength conversion means. The means may include phosphors or quantum dots and may be best suited for blue, green, yellow or red wavelengths. This allows the light emitting elements 101 and 103 to emit light of a wavelength with high intensity. The emitted light is mixed with the wavelengths having the highest intensity. 03 can emit white, blue, yellow, green or red light. The light emitting elements 101 and 103 may be arranged as LED chips. , 103 is a side-view type whose bottom is electrically connected to the substrate 401. As another example, the light emitting elements 101 and 103 may be arranged as LED chips. The light emitting elements 101 and 103 have their light emitting surfaces 81 disposed on one side. The light emitting surface 81 may be a side surface adjacent to the upper surface of the substrate 401. and a light source having the highest intensity in the first direction. The light emitting surfaces 81 of the light emitting elements 101 and 103 are adjacent to the reflecting member 410. or a surface perpendicular to the upper surface of the substrate 401 and the upper surface of the reflecting member 410. The light emitted through the light emitting surface 81 of the light emitting elements 101 and 103 may be The light travels in a direction parallel to the upper surface of the substrate 401 or is reflected by the reflecting member 410. Alternatively, the thickness of the light emitting element 101 or 103 may be increased toward the upper surface of the resin layer 420. The thickness may be, for example, 3 mm or less, for example, in the range of 0.8 mm to 2 mm. The length of the light emitting elements 101 and 103 in the second direction (D1 in FIG. 4) is Such light emitting elements 101 and 103 may be 1.5 times or more in thickness in the ±Z directions. The light directivity angle in the ±Y direction may be wider than the light directivity angle of the second light emitting element 101, 103. The light direction angle is 110 degrees or more, for example, 120 degrees to 160 degrees or 140 degrees or more. The light direction angle of the light emitting elements 101 and 103 in the third direction may be 110 degrees or more, for example, 12 It can have a range of 0 degrees to 140 degrees.

[0015] The reflecting member 410 may be disposed between the substrate 401 and the resin layer 420 . The reflective member 410 may be provided in the form of a film made of a metallic or non-metallic material. The reflecting member 410 may be bonded to the upper surface of the substrate 401. The reflecting portion 410 may have an area smaller than the area of ​​the top surface of the substrate 401. The material 410 is spaced from the edge of the substrate 401, and the spaced area is covered with a resin layer 420. At this time, the edge portion of the reflecting member 410 is peeled off. The reflecting member 410 is provided on the lower part of the light emitting elements 101 and 103. The opening 417 of the reflecting member 410 includes a front The upper surface of the substrate 401 is exposed, and the lower portions of the light emitting elements 101 and 103 are bonded. The size of the opening 417 is determined based on the size of the light emitting elements 101 and 103. The reflecting member 410 may be disposed on the substrate 401 in the same size or larger than the reflecting member 410. It may be in surface contact or adhered between the resin layer 420 and the substrate 401 . Here, when a reflective layer made of a highly reflective material is disposed on the upper surface of the substrate 401, the reflective member 4 The reflecting member 410 may be formed to have a thickness greater than the thickness of the light emitting elements 101 and 103. The thickness of the reflective member 410 may be 0.2 mm±0.02 mm. The light emitted through the opening 417 of the reflecting member 410 can have a range of . The lower portions of the light emitting elements 101 and 103 can be penetrated, and the upper portions of the light emitting elements 101 and 103 can be penetrated. The light emitting surfaces 81 of the light emitting elements 101 and 103 can be projected from the reflecting member 4. 10. The upper surface of the optical fiber 10 may be provided perpendicular to the upper surface of the optical fiber 10.

[0016] The reflecting member 410 may include a metallic material or a non-metallic material. The metallic material may include metals such as aluminum, silver, and gold. The plastic material may be a plastic or resin material. Ethylene, polypropylene, polystyrene, polyvinyl chloride, polychlorinated biphenyls, poly Ethylene terephthalate, polyvinyl alcohol, polycarbonate, polybutylene terephthalate Phthalate, polybutylene naphthalate, polyamide, polyacetal, polyphenylene Ether, polyamideimide, polyetherimide, polyetheretherketone, poly Imide, polytetrafluoroethylene, liquid crystal polymer, fluororesin, copolymers of these, and The resin material may be any one selected from the group consisting of: The material is a reflective material such as TiO2, Al2O3, SiO2 in silicone or epoxy. The reflective member 410 may be formed as a single layer or multiple layers. Such a layer structure can improve light reflection efficiency. The reflecting member 410 reflects incident light and distributes the light so that the light is emitted with a uniform distribution. The amount can be increased.

[0017] Referring to FIG. 8, the reflective member 410 includes an adhesive layer L1, a reflective layer L2, and a dot portion L The adhesive layer L1 may include a reflective member 410 and a reflective layer 412. The adhesive layer L1 can be made of a transparent material such as a UV adhesive or silicone. The reflective layer L2 may be made of a resin material. It can contain multiple reflecting agents La. The reflecting agents La can be air-like bubbles or The resin material of the reflective layer L2 may be a medium having the same refractive index as air. The material is resin or epoxy, and the reflector La is foamed in the resin material. The reflective layer L2 may be formed by injecting the reflective agent La. The reflective layer L2 can reflect or refract the light in another direction. The thickness of the reflective layer L2 may be 80% or more of the thickness of the reflective member 410. The dot portion L3 may include a dot portion L3 in which the reflective dots are arranged. The dot portions L3 may be formed on the layer L2 by printing. The dot portions L3 may contain reflective ink. For example, TiO2, CaCO3, BaSO4, Al2O3, Silicon, PS Each dot in the dot portion L3 can be printed with a material containing one of the following: The side cross section may be hemispherical or polygonal. The density of the ions may increase as the distance from the light emitting surface 81 of the light emitting elements 101 and 103 increases. The dot portion L3 may be made of a white material. The light reflectance is improved by arranging the light emitting element L3 in the light emitting direction of the light emitting elements 101 and 103. This can improve the brightness of the surface light source by reducing the light loss. The density may be uniformly spaced apart from the light emitting surface 81 of the light emitting element 101, 103. It may be as high as possible.

[0018] 2, 3 and 7, the reflective member 410 has a plurality of open areas H1 , H2. The plurality of open areas H1, H2 may include a plurality of first and second open areas H1, H2. The first open areas H1 are arranged in a first direction. The plurality of second open areas H2 may be arranged in a first direction. The first open area H1 and the second open area H2 may be spaced apart in a second direction. 1 is adjacent to the third outer surface S3 of the substrate 401, and the second open area H2 is adjacent to the third outer surface S3 of the substrate 401. Each of the first open areas H1 may be adjacent to the fourth outer surface S4 of the first open area H1. , and the second open area H2 may overlap with each other in the second direction. The second open areas H1 and H2 do not overlap the light emitting elements 101 and 103 in the first direction. The first and second open regions H1 and H2 and the opening 417 may be arranged in a second direction. The first and second open areas H1 and H2 may not overlap with each other. The shape may be an ellipse, a circle, or a polygon that is long in the first direction. and the second open areas H1 and H2 have a distance B4 in the first direction that is equal to or larger than the distance B4 between the first and second open areas H1 and H2. The length B5 of the first open area H1 and the second open area H2 in the first direction may be smaller than the length B5 of the first open area H1 and the second open area H2 in the first direction. >B4, and the difference between the interval B4 and the length B5 is in the range of 0.1 mm to 1 mm. The first and second open areas H1 and H2 of the reflecting member 410 can be Since the length B5 of the substrate 401 is long in the first direction, the substrate 401 is adjacent to the long side edge of the substrate 401. That is, the adhesive strength of the third outer surface S3 of the substrate 401 and the front surface S4 can be prevented from decreasing. Between the first open area H1 and the fourth outer surface S4 of the substrate 401 and the second open area H2 This prevents a decrease in the adhesive strength of the reflective member 410 disposed between the regions H2. Referring to FIG. 1, the distance C2 between the first and second open regions H1 and H2 is It may be greater than the length D1 of the elements 101 and 103 in the second direction, and may be 1.5 times the length D1. The width B6 in the second direction of the first and second open areas H1 and H2 may be The length B5 may be 1 / 5 or less, for example, in the range of 1 / 5 to 1 / 10. The width B6 may be 1.2 mm or less, for example, in the range of 0.8 mm to 1.2 mm. Each of the first and second open areas H1 and H2 has a reduced adhesive strength in the first direction. This can prevent a decrease in adhesive strength in the second direction. H1 and H2 are spaced apart from the third and fourth outer surfaces S3 and S4 of the substrate 401 by a predetermined distance B2. The interval B2 is 1.2 mm or less, for example, in the range of 0.5 mm to 1.2 mm. When the distance B2 is smaller than the above range, the first and second open areas H1 and H2 If the adhesive strength of the outer reflective member 410 is reduced and exceeds the above range, the reflective area The reflecting member 410 is disposed outside the first and second open areas H1 and H2. The first and second outer surfaces S1 and S2 of the substrate 401 are exposed. The resin layer 420 is disposed on the second open areas H1 and H2 and the reflecting member 410. The resin layer 420 is disposed through the first and second open areas H1 and H2. It can be adhered to the upper surface of the substrate 401 to fix the outer portion of the reflective member 410.

[0019] Referring to FIGS. 1 to 4, the resin layer 420 may be disposed on the substrate 401. The lower surface of the resin layer 420 may face the upper surface of the substrate 401. The resin layer 420 may be disposed on the entire upper surface of the substrate 401 or on a partial area thereof. A resin layer 420 may be disposed on the reflecting member 410. The resin layer 420 may be formed by The resin layer 420 may be disposed on the entire upper surface of the reflective member 410 or on a partial area thereof. The surface area may be equal to or smaller than the upper surface area of ​​the substrate 401. The resin layer 420 may be made of a transparent material. The resin layer may include at least two types of resin materials such as epoxy. 420 can include a thermosetting resin material, such as PC, OPS, PMMA, PVC The resin layer 420 may be made of glass. The main material of the resin layer 420 is a resin material whose main raw material is urethane acrylate oligomer. For example, a synthetic oligomer such as urethane acrylate oligomer can be used. It is possible to use a mixture of a polymer with a polyacrylic polymer type. Here, IBOA (isobornyl acrylate), HPA (H A mixture of 2-hydroxypropyl acrylate, 2-HEA (2-hydroxyethyl acrylate), etc. The polymer may further contain a photoinitiator (e.g., 1-hydroxycyclohexyl ph The resin layer 420 may be mixed with a resin such as vinyl acrylate or vinyl methacrylate. Because it is provided as a light-guiding layer with oil, it is provided in a thinner thickness than glass. The resin layer 420 can be provided as a flexible plate. The point light source emitted from the resin layer 3 can be emitted in the form of a line light source or a surface light source. The interior of 420 may include beads (not shown), which act to absorb incident light. The beads can diffuse and reflect the light from the resin layer 420. The beads may be placed in a range of 0.01 to 0.3% by weight. licon), silica, glass bubble, PMMA (Polymethyl methacrylate late), urethane, Zn, Zr, Al2O3, acrylic The particle diameter of the beads ranges from about 1 μm to about 20 μm. The resin layer 420 according to the present disclosure is made up of resin parts 421 and 423 made of different materials. The resin parts 421 and 423 may contain at least two kinds of resin materials. The resin layer 420 may be formed by disposing the resin layer 420 in different regions. The first resin portion 421 and the second resin portion 423 may be made of a resin material. The first resin portion and the second resin portion 421, 423 may be alternately arranged at least in the first direction. The first resin portions and the second resin portions 421 and 423 are alternately arranged in a first direction and alternately arranged in a second direction. The second resin portion 421 may be arranged between the plurality of first resin portions 421 in the same direction. 23 is disposed. The first resin portion 421 is disposed between the plurality of second resin portions 423. The second resin portion 423 may be disposed on both sides of the first resin portion 421. The second resin portion 423 may be disposed around the first resin portion 421. It can contact at least two of the sides or all of the sides.

[0020] The first resin part 421 is disposed on the light source 100 to seal the light source 100. The first resin portion 421 is disposed on the light emitting elements 101 and 103. The first resin portion 421 can cover the light emitting elements 101 and 103. The surface RS1 includes first and second side surfaces RS2 and RS3 that face each other in the first direction. The second resin part 423 may be spaced apart from the light emitting elements 101 and 103. The second resin portion 423 may be spaced apart from the light emitting surfaces 81 of the light emitting elements 101 and 103. The first resin portion 421 is made of a silicone resin or a thermosetting resin material. The resin layer 420 may include a UV resin material. The resin layer 420 may include a resin material cured by an outgassing method. The resin material may include a resin material that induces outgassing and a resin material that does not induce outgassing. The resin layer 420 is formed between the outgassing material and the light emitting elements 101 and 103. By placing materials that do not induce outgassing, problems caused by outgassing can be eliminated. For example, the UV resin material does not emit outgassing during processes such as reflow or in high temperature and humidity environments. Here, the UV resin material is disposed adjacent to or adjacent to each of the light emitting elements 101 and 103. If it is adjacent to the diode chip 71, gas will be released in a high temperature and humidity environment. The released gas discolors the light emitting surfaces 81 of the light emitting elements 101 and 103 and This induces a phenomenon in which the surface of the diode chip 71 is carbonized. 80 discoloration and carbonization of the surface of the LED chip can cause the luminous flux or optical quality of the light source to deteriorate. As a result, the resin material covering the light emitting elements 101 and 103 is By forming it from a material that does not induce outgassing, problems caused by outgassing can be prevented. When the resin layer 420 is made of a silicone resin material, the silicone resin material However, there is a problem that it does not adhere to some types of adhesives, such as acrylic adhesives. Resin materials do not have the adhesion problems with the adhesives mentioned above, and are more competitive than silicone resins in terms of cost. Therefore, the present disclosure solves the problem of outgassing and provides a method for adhesion to an adhesive layer. The resin layer 420 is divided into a first resin portion 421 made of silicone resin and a second resin portion 422 made of UV resin. Formed in 3.

[0021] The part of the upper surface RS1 of the first resin portion 421 that overlaps with the light emitting elements 101 and 103 in the vertical direction The formed area may be horizontal or inclined, and the light emitting elements 101 and 103 and the second resin The area between the portions 423 and the area vertically overlapping the portions 423 may be inclined or concave curved or protruding. The upper surface RS1 of the first resin portion 421 may be an inclined plane. In this case, the upper surface RS1 of the first resin portion 421 may have an inclination. The imaginary line connecting the first resin portion PS1 and the uppermost end PS2 may have an inclination. The upper surface RS1 of the light emitting device 101 may be spaced apart from the first diffusion layer 430. When a plurality of the first resin portions 421 are arranged in N rows and M columns, may be arranged in N rows and M columns, where M and N are integers of 1 or more, and N≧M. The second resin portion 423 may have a relationship between the first resin portion 421 and the second resin portion 423. The second resin portion 423 may be arranged in a plurality of positions, and may be interconnected or separated. Alternatively, the first resin portion 421 may be formed integrally with the first resin portion 421.

[0022] The lowermost end PS1 of the upper surface RS1 of the first resin portion 421 is located above the second resin portion 423. The lowermost portion of the upper surface RS1 of the first resin portion 421 may be located lower than the end or the upper surface. The end PS1 may be disposed at the same level as or higher than the top surfaces of the light emitting elements 101 and 103. The lowermost end PS1 of the upper surface RS1 of the first resin portion 421 is It may be the same as or higher than the top of the front surface and may be the same as or different from the top of the rear surface. The resin part 421 covers at least the front surface of the side surfaces of the light emitting elements 101 and 103. This can prevent a decrease in light extraction efficiency and can protect the second resin portion 423.

[0023] The uppermost end PS2 of the first resin portion 421 may be the same as or different from the upper end of the second resin portion 423. The uppermost end PS2 of the first resin portion 421 may be the same as the upper end of the second resin portion 423. In the case of one resin part, it is convenient to form and fix the second resin part 423 after forming the first resin part 421. When the uppermost end PS2 of the first resin portion 421 is higher than the upper end of the second resin portion 423, The inclination angle of the inclined upper surface is increased, and the first adhesive layer is attached to the upper surface of the first resin portion 421 to prevent various problems. The uppermost end PS2 of the first resin portion 421 is located at the uppermost end PS2 of the second resin portion 42. 3, the distance between the light emitting elements 101 and 103 and the second resin portion 423 is reduced. This allows the height of the air region 450 to be increased.

[0024] As shown in FIG. 1, the length K1 of the first resin portion 421 and the length K2 of the second resin portion 422 are The length K2 of the grease portion 423 may be the same or different. The ratio K1:K2 of the length K1 of the first resin portion 421 to the length K2 of the second resin portion 423 is 6: The length K1 of the first resin portion 421 in the first direction may be in the range of 4 to 4:6. By arranging the second resin portion 423 in the range of 40% to 60% of the length K2, The light emitting surfaces 81 of the optical elements 101 and 103 are spaced apart from the second resin portion 423 at a stable distance. Between the light emitting surface 81 of the light emitting element 101, 103 and the second resin portion 423 The minimum distance E1 may be 3 mm or more, for example, 5 mm or more. The upper surface area of ​​the first resin portion 421 may be equal to or smaller than the upper surface area of ​​the second resin portion 423 .

[0025] Referring to FIG. 2, the first resin portion 421 is disposed on the light emitting elements 101 and 103. a top surface RS1, a first side surface R disposed in front of the light emitting surfaces 81 of the light emitting elements 101 and 103; S2 and the second light emitting element 101, 103 disposed on the rear surface (i.e., the surface opposite to the light emitting surface). 7, the first resin portion 421 may include two side surfaces RS3. The third and fourth side surfaces RS4 and RS5 are arranged from the third and fourth outer surfaces S3 and S4. The second resin portion 423 may be spaced apart from both side surfaces RS2 and RS3 of the first resin portion 421. S3, RS4, and RS5 are arranged to surround the first resin portion 421, thereby reducing the area of ​​the first resin portion 421. This can prevent the outer portion of the first resin portion 421 from floating up. The first and second resin portions 421 and 423 are disposed on the outer sides of the light emitting elements 101 and 103. This can suppress the penetration of moisture through the third and fourth sides RS4 and RS5. The top view shape of the first resin portion 421 includes a polygonal shape, a circular shape, and an irregular shape. It can be done.

[0026] As shown in FIG. 5, the resin layer 420 is divided into a first resin portion 421 and a second resin portion 423 in a first direction. are alternately arranged, and the second resin portions 423 are separated by the first resin portions 421. The first and second resin portions 421 and 423 are respectively attached to the third outer surface S3 and the fourth outer surface S4. That is, the lengths of the first and second resin portions 421 and 423 in the second direction are The sum of the upper surface areas of the second resin portion 423 may be equal to that of the first resin portion 421. It may be larger than the sum of the upper surface areas.

[0027] As shown in FIG. 6, the first resin portion 421 of the resin layer 420 is the same as the region of the light-shielding portion 425. As a result, the second resin portion 423 may be formed along the periphery of the first resin portion 421. The first to fourth outer surfaces S1, S2, S3, and S4 are arranged in this manner and exposed through the first to fourth outer surfaces S1, S2, S3, and S4.

[0028] As shown in FIGS. 1 to 3, the first resin portion 421 of the resin layer 420 is Since the light emitting element 101 and the light emitting element 103 are disposed on the light emitting element 103, the light emitting element 101 and the light emitting element 103 can be protected. The loss of light emitted from the light emitting devices 101 and 103 can be reduced. The upper surface of the first resin portion 421 is buried under the first resin portion 421. 421 can contact the surface of the light emitting elements 101 and 103, and the light emitting elements 10 A part of the first resin portion 421 can contact the light emitting surface 81 of the light emitting element 103. The first resin portion 421 may be disposed in the opening 417 of the reflecting member 410. The upper surface of the substrate 401 can be contacted through the opening 417 of the reflecting member 410. As a result, a part of the first resin portion 421 comes into contact with the substrate 401, The reflecting member 410 can be fixed between the first resin part 421 and the substrate 401 .

[0029] The upper surface RS1 of the first resin portion 421 includes a lowermost end PS1 and an uppermost end PS2. The position of the end PS1 is on the top surface or / and of the first light emitting element and the second light emitting element 101, 103. and adjacent to the rear surface, and the position of the uppermost end PS2 is 101, 103 or the position furthest away from the lowest end PS1 in the direction of the second outer surface S2 The height Z0 of the bottom end PS1 may be set at a height equal to or greater than the height of the upper surface or reflective surface of the substrate 401. The upper surface of the member 410 is set to the same height as or higher than the upper surface of the light emitting elements 101 and 103. The height Z0 of the lowermost end PS1 is 1 mm or more, for example, 1.4 mm to 1.6 mm. The height Z1 of the uppermost end PS2 of the second resin portion 423 can be in the range of The lowermost end PS1 may be located at the same level as or higher than the upper surface. The uppermost end PS2 may be the upper end of the first side surface RS2. The upper surface RS1 of the first resin portion 421 has a height that gradually increases from a lowermost end PS1 to an uppermost end PS2. The upper surface RS1 of the first resin portion 421 may be The air region 450 may be arranged at a height that gradually increases as it moves away from the air region 450 in the first direction. is a region having a gap that gradually decreases as it moves away from each light emitting element 101, 103 in the first direction. The first resin part 421 may be perpendicular to the light emitting elements 101 and 103. The upper surface RS1 of the overlapping region A2 may be arranged to be inclined or horizontal. The air region 450 may be a region where there is no resin material. The second side surface RS3 can be in contact with or spaced apart from the rear surfaces of the light emitting elements 101 and 103. This is because the second side surface RS3 of the first resin portion 421 is in contact with the light emitting elements 101 and 103. When the second resin portion 423 is disposed outside the rear surface of the first resin portion 423, the manufacturing process of the first resin portion 423 is convenient. A part of the resin part 421 may be disposed in the opening 417 of the reflecting member 410. The first side surface RS2 and the second side surface RS3 of the first resin portion 421 are in contact with the second resin portion 423. The second side surface R of the first resin portion 421 in contact with the second resin portion 423 can be The distance between S3 and the light emitting elements 101 and 103 is determined by the distance between the first resin portion 423 and the second resin portion 423. It may be smaller than the distance between the side surface RS2 and the light emitting elements 101 and 103. The first resin portion 421 has a third side surface RS4 adjacent to the third outer surface S3 and The fourth side surface RS5 of the first resin portion 421 is adjacent to the fourth outer surface S4. The second resin portion 423 is disposed between the third side surface RS4 and the third outer surface S3. A second resin portion 423 is disposed between the fourth side surface RS4 of the resin portion 421 and the fourth outer side surface S4. The second resin portion 421 is disposed on the outside of the third and fourth side surfaces RS4 and RS5 of the first resin portion 421. The resin part 423 protects the first resin part 421 and prevents moisture from entering the light emitting elements 101 and 103 . The third and fourth sides RS4 and RS5 and the first and The boundary between the first and second side surfaces RS2 and RS3 may be an angular or curved surface. A plurality of light emitting elements 101, 102 are disposed between the outer surfaces S1, S2 of the second resin portion 423. 03 and a plurality of first resin parts 421 are arranged. At least one second resin portion 423 is disposed. As shown in FIGS. 3 and 7, 20 is a first protrusion P1 and a second open The first protrusion P1 may include a second protrusion P2 disposed in the region H2. The first protrusion P1 is attached to the upper surface of the substrate 401 along the first open region H1. is disposed in the first open area H1 and adjacent to the first outer surface S1 of the substrate 401. The second protrusion P can prevent a decrease in adhesive strength at the outer edge region of the reflective member 410. 2 is attached to the upper surface of the substrate 401 along the second open area H2. The protrusion P2 is disposed in the second open area H2 of the reflecting member 410, and the protrusion P2 is disposed in the second open area H2 of the substrate 401. and preventing a decrease in adhesive strength at the outer edge region of the reflective member 410 adjacent to the second outer surface S2. can be done.

[0030] The first protrusions P1 are arranged in a first direction, and the second protrusions P2 are arranged in a second direction. The first protrusion and the second protrusion P1, P2 are spaced apart from each other in the second direction. The first protrusion P1 and the second protrusion P2 are provided on the reflecting member 410. The first protrusion P1 and the second protrusion P2 can protrude lower than the front surface. The first protrusion P1 and the second protrusion P2 can protrude in the direction of the lower surface of the substrate 401. The projection P2 prevents the edge area of ​​the reflective member 410 from lifting up, and the illuminating device is connected to the projection P2. The sensor may be disposed in a bezel area of ​​a housing in which the sensor is mounted.

[0031] As shown in FIGS. 3 and 7, the first and second openings are formed in the region of the first resin portion 421. The first protrusions P1 and second protrusions P2 arranged in the regions H1 and H2 are The second resin portion 423 may be made of the same material as the first opening. The first protrusion and the second protrusion arranged in the open area H1 and the second open area H2 P1 and P2 may be made of the material of the second resin part 423. At least one of the first and second protrusions P1 and P2 is a first resin portion and a second resin portion 421, The first resin portion and the second resin portion 421 may be overlapped with each other in the vertical direction. 6, the first protrusion and the second protrusion P1 , P2, the area that overlaps with the first resin portion and the second resin portion 421, 423 in the vertical direction is It can be made of the same material as the first resin portion and the second resin portions 421 and 423 .

[0032] 1 and 2, the thickness Z1 of the resin layer 420 is 1.5 mm or more, for example, For example, the thickness Z1 of the resin layer 420 may be in the range of 1.5 to 2.5 mm. If the thickness is greater than the specified range, the luminous intensity will decrease and the increased thickness of the device will hinder its flexibility. If the thickness Z1 of the resin layer 420 is smaller than the above range, it becomes difficult to provide a uniform Therefore, it becomes difficult to provide a surface light source with sufficient luminous intensity.

[0033] The length of the resin layer 420 in the first direction was the same as the length of the substrate 401 in the first direction. The width in the second direction of the resin layer 420 may be equal to the width Y1 in the second direction of the substrate 401 (see FIG. 4). As a result, each side surface of the resin layer 420 may be the same as that of the substrate 401. For example, the third outer surface and the fourth outer surface of the substrate 401 are arranged on the same plane. The side surfaces S3 and S4 may be disposed on the same vertical plane as both side surfaces of the resin layer 420. The first resin portion 421 is provided in a size that covers each of the plurality of light emitting elements 101 and 103. They may be separated or connected to each other.

[0034] As shown in FIG. 2, the maximum thickness Z4 of the first resin portion 421 is This means that the first resin part and the second resin part 421 may be the same as, larger than, or smaller than the first resin part 421. , 423 are formed in different steps, but after the first resin portion 421 is formed, the second resin portion Conversely, the first resin portion 421 may be formed after the second resin portion 423 is formed. As a result, the maximum thickness Z4 of the first resin portion 421 is If the thickness is the same, the process of forming the first resin part and the second resin part 421, 423 is convenient. The minimum thickness Z0 of the first resin portion 421 is greater than the thickness of the light emitting elements 101 and 103. The thickness of the second resin portion 423 may be smaller than the thickness of the second resin portion 423. The adhesive strength of the upper surface may be higher than the adhesive strength of the upper surface of the first resin portion 421. The upper surface RS1 of the portion 421 may include a light-shielding structure. The light-shielding structure may include an inclined surface, The light-blocking structure may include at least one of a concave curved surface and a convex curved surface. may include one or more recesses and one or more protrusions, and may be adjacent to each other. The light blocking structure may be arranged between the light emitting elements 101 and 103 and the second resin portion 423. and reflecting or refracting the light emitted from the light emitting elements 101 and 103. Such a light-shielding structure can block the light emitted from the light-emitting elements 101 and 103. The light-shielding structure can suppress hot spots caused by the light emitting element 101, Since the light emitting element 101 and the light emitting element 103 emit light in the side direction, i.e., the first direction, It covers an area where the light shading efficiency can be improved by the light directional angle distribution and light reflection characteristics.

[0035] 1 to 4, the light-shielding portion 425 faces the upper surface of the substrate 401. The light-shielding portion 425 can overlap the light-emitting elements 101 and 103 in the vertical direction. Each of the plurality of light-shielding portions 425 is connected to each of the plurality of light-emitting elements 101 and 103. As shown in FIGS. 1 and 3, the distance between the light blocking portions 425 is B1 may be smaller than the distance X1 between the light emitting elements 101 and 103. 425 may be spaced apart from the first and third outer surfaces S3 and S4 of the resin layer 420. The light blocking portions 425 may be arranged in a plurality of pieces in the first direction. The light-shielding portion 425 is formed on the first light-emitting element 101. The first light-shielding portion and the second light-shielding portion are disposed above the second light-emitting element 103. The first and second light-shielding portions block the light emitted from the first and second light-emitting elements 101 and 103. 2 to 4, the light blocking portion 425 may be disposed on the upper side of the resin. The light-shielding portion 420 may be disposed higher than the upper surface of the layer 420 or the upper surface of the second resin portion 423. 25 is 5 times the upper surface area of ​​the light emitting elements 101 and 103 on the light emitting elements 101 and 103. The light blocking portion 425 may have a value in the range of 0% or more or 50% to 200%. The light-shielding portion 425 may be an area printed with a color material. Using reflective ink containing one of O3, CaCO3, BaSO4, and Silicon The light-shielding portion 425 can be printed on the light-emitting surfaces of the light-emitting elements 101 and 103. The light emitted from the light emitting element 101 and the light emitting element 103 is reflected by the light emitting element 101 and the light emitting element 103. The light blocking part 425 is formed by printing a light blocking pattern using light blocking ink. The light blocking portion 425 may be printed on the lower surface of the first diffusion layer 430. The light blocking part 425 does not block 100% of the incident light, but has a reflective transmittance. Since the reflectance is lower than that of the light blocking portion 425, the light blocking portion 425 can block and diffuse light. can be formed in single layer or multilayer, with the same or different pattern shapes The light blocking portion 425 may be formed to have the same thickness. The thickness of 425 is gradually reduced in the direction of light emission from the light emitting elements 101 and 103. The thickness of the light blocking portion 425 may be reduced in proportion to the intensity of incident light. The size of the light blocking portion 425 may be 5 times the area of ​​the upper surface of the light emitting elements 101 and 103. 0% or more, for example, in the range of 50% to 200%, and can block incident light. This reduces the problem of the light emitting elements 101 and 103 being visible from the outside, and , which can reduce hot spots on the area of ​​103 and provide uniform light distribution over the entire area. In another example, the light blocking portion 425 may be provided under the first diffusion layer 430. The recess is an air area etched by a surface etching process, or the recess is The etching region may include a light-shielding film in which the light-shielding material is disposed. Like the light-shielding area, the light-emitting elements 101 and 103 are arranged in a range of 50% to 200% of the upper surface area. The shielding member 104 is arranged to cover the light emitting surfaces of the light emitting elements 101 and 103. The light emitting portion 425 may be formed in a hemispherical, elliptical or circular shape based on the light emitting elements 101 and 103. may be arranged in a shape.

[0036] 2 and 4, the light-shielding portion 425 is adjacent to the light-emitting elements 101 and 103. The width of the light-shielding area in the second direction is small, and gradually increases toward the center of the light-shielding portion 425. The width (for example, C3) in the second direction is maximized at the center of the light-shielding portion 425. The width in the second direction gradually decreases as the distance from the light emitting elements 101 and 103 increases. The maximum width C3 in the second direction is the largest at the center of the light-shielding portion 425. The width in the second direction gradually decreases as the light-shielding portion 425 moves in the second direction. The area vertically overlapping with the light emitting element 103 has a flat inner surface and a width in the second direction of the light emitting element 103. The length D1 of the light blocking portion 425 in the second direction may be longer than the length D1 of the light blocking portion 425 in the second direction. The minimum width in the direction is equal to the length D1 of the light emitting elements 101 and 103, or The length D1 of the light emitting elements 101, 103 is 0.8 mm or more larger than the length D1 of the light emitting elements 101, 10 3, and the heating caused by the light emitted from the light emitting elements 101 and 103 can be This can prevent toss spots.

[0037] As shown in FIG. 4, the light-shielding portion 425 overlaps the light-emitting elements 101 and 103 in the vertical direction. a first region g1 extending in a first direction from the first region g1; a second region g2 extending in a first direction from the first region g1; and a third region g extending from the second regions g1 and g2 toward the third outer surface S3 of the substrate 401. 3. From the first and second regions g1 and g2 to the fourth outer surface S4 of the substrate 401 The third and fourth regions g3 and g4 may include an extended fourth region g4. , the first and second regions g1 and g2 are connected to the third outer surface S3 and the third outer surface S4 of the substrate 401. The second region g2 to the fourth region g4 may extend in the direction of the outer surface S4. and a light emitting element 101, 103. The area of ​​the first region g1 is equal to or less than the area of ​​the upper surface of the light emitting elements 101 and 103. The light blocking area in the second region g2 may be 50% or more of the product. The light-shielding area of ​​the first region g1 may be larger than the light-shielding area of ​​the third region g2 and the light-shielding area of ​​the fourth region g3 and g4. The fourth regions g1, g2, g3, and g4 are the upper and output regions of the light emitting elements 101 and 103. The light can be blocked through the upper part of the area, thereby suppressing the occurrence of hot spots. The outer edge of the second region g2 may include a protruding curved surface. The first light-shielding portion may be formed as a curved surface that protrudes from the center of the first light-shielding portion toward the second light-shielding portion. The distance between the outer edge of the region g2 and the first region g1 is the farthest on the center side and gradually decreases toward the side. The outer edges of the third and fourth regions g3 and g4 are formed by the protruding curved surface. The outer edges of the third and fourth regions g3 and g4 are formed by the light-shielding portion 4. 25 toward the third outer surface S3 and the fourth outer surface S4 of the substrate 401. The outer edge of the third region g3 may have a curved surface that protrudes most toward the center and The first region g1 is connected to the outer edge of the first region g1 by a protruding curved surface, and the second region g2 is connected to the outer edge of the second region g2 by a protruding curved surface. The outer edge of the fourth region g4 is most protruding toward the center and is located at the outer edge of the first region g1. The second region g1 is connected to the outer edge of the second region g2 by a protruding curved surface. The distance between the outer edge of the third region g3 and the outer edge of the fourth region g4 is The distance between the center and the center line is the largest, and the distance gradually decreases as you move towards the sides.

[0038] The third area g3 of the light-shielding part 425 is the same as any one of the first open areas H1. The fourth region g4 of the light-shielding portion 425 may overlap the second opening. The third region of the light-shielding portion 425 may overlap one of the regions H1 and H2 in the vertical direction. The region g3 may overlap one of the first protrusions P1 in the vertical direction. The fourth region g4 of the light-shielding portion 425 is perpendicular to one of the second protrusions P2. The first protrusion and the second protrusion P1, P2 can overlap with the light-shielding portion 4. The protrusions overlapping with the 25 in the vertical direction are provided on both sides of the light emitting surfaces 81 of the light emitting elements 101 and 103. The maximum length B3 of the light blocking portion 425 in the first direction is The maximum width C3 may be equal to or smaller than the maximum width C3. The maximum width C3 may be 13 mm or more, for example The maximum width of the light-shielding portion 425 in the second direction may be in the range of 13 mm to 17 mm. C3 can be varied depending on the length of the light emitting elements 101 and 103 in the second direction. The maximum width C3 of the substrate 401 in the second direction is 50% or more of the length Y1 of the substrate 401 in the second direction, for example, The maximum length B of the light blocking portion 425 in the first direction may be in the range of 50% to 90%. 3 is 0.3 times or more the distance (X1 in FIG. 2) between the light emitting elements 101 and 103, for example, 0.3 The maximum length B of the light blocking portion 425 in the first direction may be in the range of 0.52 to 0.52. 3 is arranged to be equal to or larger than the width of the light emitting elements 101 and 103 in the first direction, for example, in the range of 6 to 10 times. Here, the distance X1 between the light emitting elements 101 and 103 is 25 mm or more. For example, it may be in the range of 25 mm to 30 mm, depending on the characteristics of the light emitting elements 101 and 103. The light-shielding portion 425 can be adjusted in accordance with the maximum angle in the first direction passing through the center of the light-shielding portion 425. By providing the maximum length B3 and the maximum width C3 in the second direction within the above ranges, the light emitting device 1 Reduce hot spots on the 01, 103 and improve light uniformity The center of the light-shielding portion 425 is a first region overlapping the light-emitting elements 101 and 103. It may be arranged at a distance of 4.5 mm or more on the region g1, for example, in the range of 4.5 mm to 6.5 mm. The thickness of the light-shielding portion 425 is 0.1 times or less the thickness Z1 of the resin layer 420, for example, 0.05 The thickness of the light-shielding portion 425 may be in the range of 100 μm to 0.1 times. For example, the thickness of the light-shielding portion 425 may be in the range of 100 to 200 μm. If it is smaller than this range, there is a limit to reducing hot spots, and if it is larger than this range, The light uniformity is reduced. The distance between the electrodes can be 0.4 mm or more, for example, in the range of 0.4 mm to 0.6 mm. The distance Z0 between the upper surfaces of the light emitting elements 101 and 103 and the upper surface of the reflecting member 410 is 0. The thickness of the light-shielding portion 42 may be 8 mm or more, for example, in the range of 0.8 mm to 1.4 mm. The area 5 may not overlap the area of ​​the first adhesive layer 435 in the vertical direction.

[0039] Meanwhile, the air region 450 is disposed between the resin layer 420 and the first diffusion layer 430. The air region 450 may be formed between the first resin portion 421 and the first diffusion layer 430. The air region 450 may be disposed between the first resin portion 421 and the light-shielding portion 42 The air region 450 and the light-shielding portion 425 may be disposed between the resin layer 4 20 and the first diffusion layer 430. The air region 450 and the light-shielding layer The first resin portion 425 may be overlapped with the first resin portion 421 in the vertical direction. 50 may be disposed between the second resin portions 423 in the horizontal direction. The lower surface may have the same area as the upper surface area of ​​the first resin portion 421. The upper surface of the area 450 may be equal to or larger than the lower surface area of ​​the light blocking portion 425. The upper surface area of ​​the air region 450 may be equal to or smaller than that of the first resin portion 421. The upper surface area of ​​the first resin portion 421 is equal to or larger than the lower surface area of ​​the light-shielding portion 425. The depth of the air region 450 may be less than or equal to the bottom surface of the first diffusion layer 430. As a rule, it is maximum in the region perpendicular to the light emitting elements 101 and 103, and the first resin portion 42 The depth of the air region 450 may be minimum at the top end PS2 of the front With the lower surface of the light-shielding portion 425 as a reference, the smallest value is at the uppermost end PS2 of the first resin portion 421. The air area 450 may be the largest at the upper end of the rear surface of the light emitting element 101, 103. The depth of the light emitting element 101 is deeper as it approaches the light emitting element 103. The farther away from the exit surface of 103, the larger the light intensity becomes.

[0040] In the structure of the first resin portion 421 as shown in FIG. 5, the air region 450 is The first resin part and the second resin part are disposed in the same region as the optical part 425, and are disposed outside the air region 450. The upper surface of the resin layer 420 is filled with the material of the resin parts 421 and 423. 5 and a non-adhesive region where the first adhesive layer 435 is not present. The non-adhesive region may be the region of the light-shielding portion 425. The regions may be arranged in an alternating fashion.

[0041] 1 to 4, the first diffusion layer 430 is disposed on the resin layer 420. The first diffusion layer 430 may be formed in front of an adhesive region that is adhered to the upper surface of the resin layer 420. The first diffusion layer 430 may include a non-adhesive region on the light-shielding portion 425. The adhesive layer 420 may be adhered to the first adhesive layer 435. The first adhesive layer 435 may be The first adhesive may be disposed between the diffusion layer 430 and the second resin portion 423 and adhered thereto. The first adhesive layer 435 may be overlapped with the second resin portion 423 in the vertical direction. The first adhesive layer 435 does not need to overlap the first resin portion 421 in the vertical direction. may include at least one of a UV adhesive, an acrylic adhesive, and a transparent adhesive. The upper surface of the first resin portion 421 is located at a position closer to the second resin portion 421 than the first diffusion layer 430. 23. As a result, the first resin portion 421 and the first diffusion layer 430, at least one of the air region 450 and the light-shielding portion 425 is provided. In this case, one or both of the light blocking layers can be arranged, thereby improving the light blocking efficiency. In another example, the first diffusion layer 430 may be formed by applying a predetermined pressure or pressure / heat to the second resin. That is, the first diffusion layer 430 is attached on the second resin portion 423. It may be bonded by its own adhesive force without the use of an adhesive. This reduces the number of processes and materials required, and eliminates the need to use adhesives that are harmful to the human body. The first diffusion layer 430 is formed on the second resin portion 423. The non-adhesive area is where the light-shielding portion 425 is placed or the light-shielding portion 4 The first diffusion layer 430 diffuses light emitted from the resin layer 420. Spread the message.

[0042] In addition, the first diffusion layer 430 cannot mix a specific color when the luminous intensity of light is high. The first diffusion layer 430 has a thickness of 1000 nm, so that the light can be diffused and mixed. The first diffusion layer 430 may be made of a polyester (PET) film. At least one of the following materials: film, PMMA (Poly Methyl Methacrylate), and PC (Poly Carbonate) The first diffusion layer 430 may include a material such as silicone or epoxy. The first diffusion layer 430 may be a single layer or a multi-layer. The thickness of the first diffusion layer 430 is 25 μm or more, for example, 25 to The thickness may be in the range of 250 μm or in the range of 100 to 250 μm. The diffusion layer 430 has the thickness range and provides the incident light as a uniform surface light source. The first diffusion layer 430 may include a diffusion agent such as beads, phosphor, and ink particles. The phosphor may include at least one or more of the following: At least one of a phosphor, an amber phosphor, a yellow phosphor, a green phosphor, or a white phosphor The ink particles may include a metallic ink, a UV ink, or a curable ink. The size of the ink particles may include at least one of the size of the phosphor. The surface color of the ink particles may be one of green, red, yellow, and blue. The type of ink may be PVC (Polyvinyl chloride) ink, PC (Polycarbonate) ink, ABS (acrylonitrile butadiene styrene copolymer) ink UV resin ink, epoxy ink, silicone ink, PP (polypropylene) ink , water-based ink, plastic ink, PMMA (poly methyl methacrylate) ink, PS The ink particles can be selectively applied to metal inks. The ink may include at least one of a UV ink or a curable ink.

[0043] As shown in FIGS. 3, 5 and 6, the light-shielding portion 425 is formed in the region of the first resin portion 421. As shown in FIGS. 3 and 5, the upper surface of the first resin portion 421 can be overlapped with the upper surface of the first resin portion 421. The area may be larger than the area of ​​the upper surface of the light blocking portion 425. As shown in FIG. The upper surface area of ​​the light-shielding portion 421 may be the same as the upper surface area of ​​the light-shielding portion 425. A plurality of light emitting elements 101, 101A, 102A are arranged in the first and second directions or the row and column directions. 3, 103A are arranged, the light blocking portion 425 is arranged in the column direction or the second direction. The light emitting elements 101, 101A, 103, and 103A are provided in a size that covers the light emitting elements 101, 101A, 103, and 103A, respectively. It may be provided with a size that covers all of the light emitting elements 101, 101A, 103, and 103A. Here, one or more first resin portions 421 extending in the second direction are arranged, and one resin The unit 421 includes a plurality of first light emitting elements 101, 101A, 103, 103 spaced apart in the second direction. A. The first resin portions 421 arranged in the first direction may be The first resin portions 421 arranged in the first direction can be spaced apart from each other. The second resin portions 423 may be disposed between the plurality of first resin portions 423. The first open area and the second open area of ​​the reflecting member 410 may be disposed around the resin part 421. The open areas H1 and H2 are arranged along the third and fourth outer surfaces S3 and S4. The first open area H1 and the second open area H2 may be provided with a resin layer 42. The protrusions P1 and P2 of 0 are joined.

[0044] 10 to 16 show modified examples of the lighting device according to the first embodiment of the present disclosure.

[0045] Referring to FIG. 10, the first resin portion 421 of the resin layer 420 is The first resin portion 421 may include a first sub-region A1 extending toward the rear of the first resin portion 421. The first sub-region A1 is disposed at a predetermined distance from the rear surface of the light emitting element 101, 103, The second side surface RS3 is spaced apart from the light emitting elements 101 and 103. The upper surface of the first sub-region A1 can be flat or inclined. The upper end PS3 of the first sub-region A1 may be disposed at the same height as the lower end PS1. The first sub-region A1 may be positioned so as to overlap the reflective member 410 in the vertical direction. An air region 45 is formed on the first resin portion 421 having such a first sub-region A1. 0 and the light-shielding portion 425 are arranged, the light-shielding efficiency above the light-emitting elements 101 and 103 is improved. It will be improved.

[0046] Referring to FIG. 11, the first extension region 11 may extend onto the first sub-region A1. The first extension region 11 is formed by the second resin portion 423 in the direction of the upper surface of the first resin portion 421. The first extension region 1 may extend to contact the top surface of the first sub-region A1. The inner surface of the first extension region 11 may be an inclined side surface or a vertical side surface. reduces the reduction in the adhesive area of ​​the first adhesive layer 435 disposed on the second resin portion 423. That is, the first extension region 11 and the first adhesive layer 435 are 421, which is a part of the first sub-region A1. Therefore, the reduction in the adhesive area of ​​the first adhesive layer 435 compared to the first embodiment can be minimized. Cut.

[0047] As shown in FIG. 12, the upper surface RS1 of the first resin portion 421 of the resin layer 420 includes a concave curved surface. The recessed upper surface RS1 faces the upper surface of the substrate 401 in the air region 450. The concave upper surface may be a continuous curve from the lowermost end PS1 to the uppermost end PS2. The concave curved surface may be provided as a curved surface or a discontinuous curved surface. The first resin portion 423 may be disposed at the same height as or higher than the upper surface of the second resin portion 423. The upper surface RS1 of the portion 421 reflects incident light in the direction of the second outer surface S2 due to the concave curved surface. In this case, the concave curved surface may be a total reflection surface.

[0048] As shown in FIG. 13, the upper surface RS1 of the first resin portion 421 of the resin layer 420 has a flat area A3 The flat area A3 overlaps the light emitting elements 101 and 103 in the vertical direction. The flat area A3 has a predetermined thickness from the upper surface of the light emitting elements 101 and 103. The first resin portion 421 can protect the surfaces of the light emitting elements 101 and 103. The upper surface RS1 has a lowermost end PS1 located in the flat area A3. The flat area A3 may have an inclined surface extending from the uppermost end PS2 to the uppermost end PS3. protects the upper surfaces of the light emitting elements 101 and 103 and passes through the light emitting surfaces of the light emitting elements 101 and 103. The inclined upper surface of the first resin portion 421 can be concave or convex. Alternatively, it may include a concave-convex structure.

[0049] Referring to FIG. 14, the upper surface RS1 of the first resin portion 421 extends from the lowermost end PS1 to the uppermost end The protruding curved surface may be a continuous curved surface. Alternatively, the protruding curved surface may be a discontinuous curved surface. The position of the lowest end PS1 is on the front or rear surface of the light emitting elements 101 and 103. The upper surface RS1 of the first resin portion 421 may be disposed on the light emitting elements 101, 10 3, or may contain a sloped overlapping area. The lowermost end PS1 of the protruding curved surface overlaps with the upper surface of the light emitting elements 101 and 103. The sensor may be placed in a region other than the sensor.

[0050] Referring to FIG. 15, the upper surface RS1 of the first resin portion 421 has a plurality of recesses and a plurality of protrusions. The upper surface of the first resin portion 421 is oriented from a lowermost end PS1 to an uppermost end PS2. The projections and recesses may be arranged alternately. The intervals between the recesses may be The recessed portion is a curved surface recessed toward the substrate 401, and the protruding portion is , the curved surface protruding toward the light-shielding portion 425 or the inflection point between the recesses may be a curved surface. The plurality of recesses and protrusions reflect incident light to suppress hot spots. The recessed portions and the protruding portions may each have a shape elongated in the second direction or a stripe shape. It may be provided in the form

[0051] Referring to FIG. 16, the upper surface RS1 of the first resin portion 421 is an inclined surface, a concave surface, or The upper surface RS1 of the first resin portion 421 may include a second extension. The second extension region 12 is disposed on the second resin portion 423. The second extension region 12 may extend in the direction of the first resin P1 or the direction of the uppermost end PS2. Since the second extension region 421 is disposed on the second extension region 421, the area of ​​the air region 450 is reduced. The second extension 12 may be disposed between the first resin portion 421 and the light-shielding portion 425. The long region 12 may be disposed between the air region 450 and the first resin portion 421 . The second extension region 12 of the second resin portion 423 extends onto the light emitting elements 101 and 103. The first adhesive layer 435 has an area different from that of the upper surface of the first resin portion 421, or the adhesive area is increased. Add.

[0052] 17 is another example of the lighting device of FIG. 1. Referring to FIG. 17, the lighting device is 01, light source, resin layer 420, first adhesive layer 435A, air region 450, first diffusion layer 430 A, the second adhesive layer 435B, the light blocking portion 425A, and the second diffusion layer 430B may be included. The first diffusion layer 430A is bonded through a first adhesive layer 435A. The first resin portion 421 may be bonded onto the second resin portion 423 of the resin layer 420. The first diffusion layer 430A may include any of the embodiments or variations disclosed above. A second adhesive layer 435B and a light-shielding portion 425A are disposed between the first and second diffusion layers 430A and 430B. The light-shielding portion 425A can overlap the first resin portion 421 in the vertical direction. The portion 425A can overlap the first resin portion 421 and the air region 450 in the vertical direction. The second adhesive layer 435B is perpendicular to the first adhesive layer 435A and the second resin portion 423. Here, the first and second adhesive layers 435A and 435B can be laminated on the UV The adhesive may include at least one of an adhesive, an acrylic adhesive, or a transparent adhesive. The first diffusion layer 430A may be thinner than the second diffusion layer 430B. The first diffusion layer 430A may be 100 μm or less, and the second diffusion layer 430B may be 100 μm or less. The first and second diffusion layers 430A and 430B may be made of the same material. For example, the light blocking portion 4 may be made of a PET material. The light-shielding portion 425A may be disposed on the lower surface of the first diffusion layer 430A. The upper or lower surface of the first diffusion layer 430A and the lower surface of the second diffusion layer 430B are arranged. That's fine.

[0053] 18a to 18d are diagrams illustrating the manufacturing process of the lighting device of FIG.

[0054] Referring to FIG. 18a, a reflective member 410 is bonded onto a substrate 401. The light emitting elements 101 and 103 of the light source are mounted in the opening of the reflecting member 410. may be formed after the light emitting elements 101 and 103 are mounted, but is not limited to this. The first resin portion 421 is formed on each of the light emitting elements 101 and 103. The resin portion 421 covers the light emitting surfaces, the upper surface, and each side surface of the light emitting elements 101 and 103. The first resin portion 421 is spaced apart from the light-emitting surfaces 81 of the light-emitting elements 101 and 103 by a predetermined distance. The upper surface RS1 of the first resin portion 421 may be spaced apart from the light emitting element. The inclined surface from the area where 101 and 103 are arranged to the top end PS2, The first resin portion 421 may be formed as a curved surface or a protruding surface. The first resin portion 4 can be injection molded with a structure in which the first resin portion 4 is embedded inside. When the first resin portion 421 is molded, it can be hardened by a thermosetting method. The region SA1 is a region where the second resin portion 423 is formed, and is The first resin parts 421 can be spaced apart from each other. The cone material may include a thermosetting resin or a resin material that does not induce outgassing. The first resin portion 421 is made of a transparent resin material and is formed on the light emitting surface of each of the light emitting elements 101 and 103. can be contacted.

[0055] Referring to FIG. 18b, the second resin part 423 is formed on the outside of the first resin part 421. The second resin portion 423 is made of a UV resin material or contains a resin material that induces outgassing. Once the second resin portion 423 is formed, it can be cured by UV curing. The second resin portions 423 are disposed between the first resin portions 421, The upper surface of the second resin portion 423 can be in contact with the outer surface of the first resin portion 21. It may be placed at the same height as the top end PS2 of 421, or it may be placed lower or higher. The upper surface of the second resin part 423 is flat to prevent a decrease in adhesive strength. The first and second resin parts 421 and 423 can be defined as a resin layer 420. This can be done.

[0056] Referring to FIG. 18c, a first adhesive layer 435 is disposed on the upper surface of the second resin portion 423. The first adhesive layer 435 is a UV adhesive, an acrylic adhesive, or a transparent adhesive. The first adhesive layer 435 may be spaced apart from the upper surface of the first resin portion 421. For example, the first adhesive layer 435 may be attached to the lower surface of the first diffusion layer 430. The first diffusion layer 430 is disposed on the resin layer 420. The first diffusion layer 430 is made of a transparent resin. It may be made of a material such as an oil-based or transparent plastic material, and the material disclosed in the first embodiment may be used. The first diffusion layer 430 has a light-shielding portion 425 formed on its lower surface. The light blocking portion 425 may be disposed on a region corresponding to the first resin portion 421. The light-shielding portion 425 may be an area printed with a white material. For example, it contains one of TiO2, Al2O3, CaCO3, BaSO4, and Silicon. The light-shielding portion 425 can be printed using reflective ink. The light emitted from the light emitting elements 101 and 103 is reflected by the light emitting elements 101 and 103. The light-shielding portion 425 can be formed in a single layer or multiple layers. The patterns may be the same or different.

[0057] As shown in FIG. 18d, the first diffusion layer 430 is attached to the resin layer 420 by the first adhesive layer 435. The first resin part 421 and the first diffusion layer 430 are bonded to the second resin part 423. An air region 450 is disposed between the light-shielding portion 425. The air region 450 may be the same as or different from the region of the first resin portion 421. The air region 450 may have the same refractive index as air, or may be different from the air region 450. The first resin part 421 and the light-shielding part 425 may be overlapped in the vertical direction. The lighting device is manufactured by disposing the light emitting elements 101 and 103 on the substrate 401, and then attaching the first resin portion and the The first resin portion 421 is formed on the light emitting element 101, and the second resin portion 421 is formed on the light emitting element 101. The second resin portion 423 is separated from the light emitting elements 101 and 103, and the light emitting elements 101 and 103 can be protected. Reflective structures, such as inclined surfaces, concave curved surfaces and / or convex curved surfaces Formed in one structure, it can reduce hot spots and improve the efficiency of the surface light source. .

[0058] FIG. 19 is a diagram showing a lighting system having a lighting device according to an embodiment. For the lighting device in such a lighting system, please refer to the above description.

[0059] Referring to FIG. 19, the lighting system includes a lighting device 40 disclosed in the embodiment or the modification. 0, for example, a substrate 401, and a plurality of light emitting elements 101 and 103 on the substrate 401. The light source 100 may include a resin layer 420, a reflecting member 410, and a first diffusing layer 430. The resin layer 420 of the lighting device 400 is made up of a first resin portion and a second resin portion 421, 422. 3. An air region 450 and a light-shielding portion 42 are provided between the first resin portion 421 and the first diffusion layer 430. The second resin portion 423 of the resin layer 420 may include the first diffusion layer 430. The optical member 230 may be attached to the lighting device 400 by a first adhesive layer 435. The optical member 230 is arranged to diffuse and transmit incident light. The optical member 230 uniformly diffuses the surface light source emitted through the first diffusion layer 430. The optical member 230 may include an optical lens or an inner lens. The optical lens can focus or redirect light toward a target. The optical member 230 has a number of lenses on at least one of the upper and lower surfaces. The lens portion 231 has a shape that protrudes downward from the optical member 230. Alternatively, the optical member 230 may have a shape that protrudes upward. The optical member 230 is made of a material having a refractive index of 2.0 or less, and the light distribution characteristics can be adjusted. For example, the optical member 230 may include a material having a refractive index of 1.7 or less. Transparent resin materials such as polymethyl methacrylate (PMMA), polycarbonate (PC), and epoxy resin (EP) The optical member 230 may be made of a transparent material or glass. For example, the distance from the substrate 401 is 10 mm or more, for example, in the range of 15 mm to 100 mm. If the distance exceeds the range, the light intensity is reduced. In this case, the uniformity of the light may be reduced. The heat dissipation plate may include a plurality of heat dissipation fins. The heat dissipation plate can dissipate the heat conducted to the substrate 401. At least one of the following metals: aluminum, copper, magnesium, nickel The lighting device includes a housing having a storage space 305. 300, and the lighting device according to the embodiment disposed on the bottom surface of the storage space of the housing 300. and an optical member 230 disposed on the lighting device. The outer surface of the storage space 305 is provided as an inclined surface with respect to the bottom surface of the housing 300. Such an inclined surface can improve light extraction efficiency. The surface of the storage space 305 of the 0 is formed with a reflective metal material, and by this metal material, This improves the light extraction efficiency in the storage space 305. The light emitted through the resin layer 420 is emitted from the high point of the resin layer 420. The housing 300 includes a bottom portion 301 and a reflecting portion 302. The bottom portion 301 is disposed under the substrate 401, and the reflecting portion 302 is disposed outside the bottom portion 301. The housing may protrude upward from the side and be disposed around the resin layer 420. The gasket 300 may include, but is not limited to, metal or plastic materials. The bottom 301 or the reflecting part 302 of the housing 300 is not provided with the substrate 401. An opening (not shown) is formed through which a cable connected to the The base plate 401 is attached to the bottom 301 of the housing 300 with a screw-like They may be attached by means of a suitable attachment or adhesive, or may be joined by hook-like structures. Thus, the substrate 401 is fixed to the bottom surface of the housing 300. The device includes headlights, width lights, side mirror lights, fog lights, tail lights, and control lights. Applicable to various vehicle lighting devices such as stop lamps and daytime running lights, display devices, and signal lights It is possible.

[0060] FIG. 20 is a front view showing a light emitting element on a substrate in a lighting device according to an embodiment; 21 is a side view of the light-emitting element of FIG. 20. Referring to FIG. 20 and FIG. 21, The elements 101 and 103 are a body 10 having a cavity 20, and a plurality of Frames 30, 40 and a plurality of frames 30, 40 disposed on at least one of the frames Such light emitting elements 101 and 103 include a light emitting diode chip 71 mounted on a side surface. The main body 10 has a frame 30 on the bottom, 40 may include an exposed cavity 20. The plurality of frames 30, 40 may include: For example, the frame is divided into a first frame 30 and a second frame 40 and is coupled to the main body 10 . The body 10 may be made of an insulating material. The body 10 may be made of a reflective material. The body 10 is reflective to the wavelength emitted from the light emitting diode chip. The reflectance can be higher than the transmittance, for example, a material having a reflectance of 70% or more. The body 10 is defined as a non-transparent material or a reflective material if its reflectance is 70% or more. The main body 10 is made of a resin-based insulating material, such as polyphthalamide (PPA). The main body 10 may be made of a resin material such as silicone. Thermosetting resins or high heat resistance, high resistance, including epoxy or plastic materials The first frame 30 may be made of a light-transmitting material. a first lead portion 31 disposed on the body 10; and a first bonding portion 32 extending outward from the body 10. and a first heat dissipation portion 33. The first bonding portion 32 is The first heat dissipation portion 33 is bent from the first lead portion 31 and protrudes to the outside of the body. The second frame 40 is bent from the first bonding portion 32. a second lead portion 41 disposed on the bottom surface of the body 20; The second bonding portion 42 includes a bonding part 42 and a second heat dissipation part 43. The second bonding portion 42 includes the The second lead portion 41 is bent inside the main body 10, and the second heat dissipation portion 43 is bent from the second lead portion 41. It is bent from the bonding portion 42.

[0061] Here, the light emitting diode chip 71 is, for example, connected to the first lead portion 3 of the first frame 30. 1 and connected to the first lead portion and the second lead portion 31, 41 by wires. Alternatively, it is connected to the first lead portion 31 with an adhesive and to the second lead portion 41 with a wire. Such a light-emitting diode chip 71 may be a horizontal chip, a vertical chip, or a chip having a via structure. The light emitting diode chip 71 may be mounted by a flip chip method. The light emitting diode chip 71 may emit light in the wavelength range from ultraviolet to visible light. The light emitting diode chip 71 can selectively emit light, for example, blue, green or The light emitting diode chip 71 can emit light of II- or red peak wavelengths. It may contain at least one of a group VI compound and a group III-V compound. The light-emitting diode chip 71 is made of, for example, GaN, AlGaN, InGaN, AlInGaN, GaP, AlN, GaAs, or Al It may consist of a compound selected from the group consisting of GaAs, InP and mixtures thereof. One or more light-emitting diode chips 71 are disposed in the cavity 20, The light emitting element 101 and the light emitting element 103 according to the embodiment emit light with the highest intensity in the direction of the central axis Y0. The light emitting diode chips arranged in the cavity 20 may be arranged in one or more. The light emitting diode chip may be, for example, a red LED chip, a blue LED chip, a green LED chip, or a You can choose from LED chips and yellow green LED chips.

[0062] A molding member 80 is disposed in the cavity 20 of the body 11. The sealing member 80 includes a light-transmitting resin such as silicone or epoxy, and may be a single layer or multiple layers. The molding member 80 or the light emitting diode chip may be formed as a layer. On the plate 71 there may be included means for converting the wavelength of the emitted light, said wavelength The conversion means includes quantum dots or phosphors, and emits light from the light-emitting diode chip 71. The phosphors are quantum dots, YAG, TAG, It can be selectively formed from silicate, nitride, and oxynitride-based materials. The light source may include at least one of a red phosphor, a yellow phosphor, and a green phosphor. However, the present invention is not limited to this. The shape may be, but is not limited to, a grooved, concave, convex, etc. As a result, a light-transmitting film having a phosphor is placed on the cavity 20. However, the present invention is not limited to the above. A lens is further formed on the upper part of the main body 10. The lens may include a concave lens or / and a convex lens structure, and the light emitting elements 101, 10 The light distribution of the light emitted from the main body 10 can be adjusted. On one of the frames, semiconductor elements such as a light receiving element and a protection element are mounted. The protection element may be a thyristor, a Zener diode, or a TVS (Transient voltage suppressor). The Zener diode may be formed by the LED chip. The substrate 401 is provided with at least one protective layer 404 for protecting the substrate 401 from ESD (electro static discharge). A plurality of light emitting elements 101, 103 are arranged, and the lower portions of the light emitting elements 101, 103 A reflective member 410 is disposed around the first and second leads of the light emitting elements 101 and 103. The conductive adhesive members 203 and 204 are attached to the pads 403 and 405 of the substrate 401. 05 solder or conductive tape.

[0063] The lighting device of the present invention can be used in a variety of lamp devices that require lighting, such as vehicle lamps, household lamps, etc. For example, when applied to vehicle lamps, , headlamps, width lights, side mirror lights, fog lights, tail lights, brake lights, Daytime running lights, vehicle interior lighting, door scuffs, rear combination lamps, backup lights The lighting device of the present invention can be used for indoor and outdoor advertising devices, display devices, and It can also be applied to various train fields, and there are other technologies currently being developed and commercialized, or in the future. It will be applicable to all lighting-related fields and advertising-related fields that can be realized as development progresses.

Claims

1. A substrate; a light source including a plurality of light-emitting elements disposed on the substrate; a resin layer disposed on the substrate; a first diffusion layer disposed on the resin layer; Including, The resin layer includes a first resin portion disposed on the light source and a front resin portion adjacent to the first resin portion. a second resin portion disposed on the substrate, an upper surface of the first resin portion has an inclination and is spaced apart from the first diffusion layer; the second resin portion includes a material different from that of the first resin portion, The height of the upper surface of the second resin portion is determined based on the upper surface of the substrate. The height of the bottom edge of the lighting device is greater than the height of the bottom edge of the lighting device.

2. The light source includes at least one first light emitting element and at least one second light emitting element spaced apart from the first light emitting element. and a second light-emitting element, the second resin portion is disposed between the first light-emitting element and the second light-emitting element, A plurality of the first resin portions are arranged, and the second resin portions are arranged between the plurality of first resin portions. The lighting device according to claim 1 .

3. 3. The method of claim 2, wherein each of the plurality of first resin portions covers at least one first light-emitting element. The lighting device according to claim 1.

4. The light-emitting elements are arranged on the substrate in N rows and M columns, where M and N are 1 or more. are integers having a relationship N≧M, 4. The method according to claim 1, wherein the first resin portions and the second resin portions are alternately arranged in the row direction.

10. The lighting device according to claim 9 .

5. The lighting device according to claim 4 , wherein the first resin portions are spaced apart from each other in the column direction or are integrally formed. Place.

6. the resin layer includes a first side and a second side disposed opposite each other; the first light emitting element is adjacent to the first side surface, the second light emitting element is adjacent to the second side surface, The second resin portion is formed between the first light-emitting element adjacent to the first side surface of the resin layer and the second light-emitting element adjacent to the second side surface of the resin layer. The lighting device according to claim 5 , wherein the second light-emitting element is disposed between the first light-emitting element and the second light-emitting element adjacent to the surface.

7. A substrate; a light source disposed above the substrate; a resin layer disposed on the substrate; a first diffusion layer disposed on the resin layer; Including, The light source includes a first light emitting element and a second light emitting element spaced apart from the first light emitting element, The resin layer includes a plurality of first light-emitting elements disposed on the first light-emitting element and the second light-emitting element. a resin portion and a second resin portion disposed between the first light emitting element and the second light emitting element. 、 upper surfaces of the plurality of first resin portions are spaced apart from the first diffusion layer; The height of the upper surface of the second resin portion is determined based on the upper surface of the substrate. the height of the upper surface of the first resin portion overlapping the first light emitting element in the direction Lighting equipment.

8. Is the height of the uppermost end of the second resin portion greater than the height of the uppermost end of the upper surface of the first resin portion? 10. The lighting device according to claim 1 or 7, wherein the lighting device is identical.

9. The second resin portion and the first diffusion layer are bonded by a first adhesive layer.

8. The lighting device according to claim 7.

10. a light-shielding portion on the first resin portion, and an upper surface of the second resin portion is perpendicular to the light-shielding portion; 10. The lighting device of claim 9, wherein the first and second light sources do not overlap.

11. a second diffusion layer disposed on the first diffusion layer; and a second diffusion layer disposed between the first diffusion layer and the second diffusion layer. a second adhesive layer disposed therebetween; The light-shielding portion is disposed between the first diffusion layer and the second diffusion layer, and the first resin portion and The second adhesive layer and the first adhesive layer overlap in the vertical direction. The lighting device of claim 10, wherein the lighting device is burlapped.

12. The method according to claim 9 , wherein the first adhesive layer does not overlap the first resin portion in a vertical direction. On-board lighting device.

13. The plurality of first resin portions are arranged spaced apart from each other, and a plurality of first resin portions are arranged between the plurality of first resin portions. The second resin portions are interconnected, the first resin portion includes a silicone resin or a thermosetting resin, The lighting device according to claim 3 , wherein the second resin portion includes a UV resin.

14. The region separated between the first resin portion and the first diffusion layer is an air region, The water content of the first resin portion and the second resin portion disposed between the first light emitting element and the second light emitting element is 8. The lighting device according to claim 1, wherein the horizontal lengths are in a ratio of 4:6 to 6:4.

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