Display device with touch panel and method for manufacturing display device with touch panel

Abstract

To provide a display device with a touch panel capable of reducing the thickness of the display device with the touch panel.SOLUTION: A display device 11 with a touch panel includes a substrate 20, first electrodes 23 and an electrode for power supply 21 laminated on a top surface 20a of the substrate 20 and insulated from each other, and dielectric bodies 24 laminated only on the first electrodes 23 among the first electrodes 23 and the electrode for power supply 21. Also, the display device 11 with the touch panel includes second electrodes 25 laminated on top surfaces 24a of the dielectric bodies 24, and a light emission part 28 provided on the electrode for power supply 21 and electrically connected to the electrode for power supply 21. The second electrodes 25 constitute a capacitance type touch sensor 22 together with the first electrodes 23 and the dielectric bodies 24. The light emission part 28 and the touch sensor 22 are adjacent to each other in a plane direction of the substrate 20.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to a display device with a touch panel and a method for manufacturing a display device with a touch panel. [Background technology]

[0002] Patent Document 1 describes a stereoscopic liquid crystal display device with a touch panel (hereinafter referred to as the display device). The display device described in Patent Document 1 is formed by laminating, in order, a backlight, a liquid crystal display substrate, a three-dimensional substrate, an insulating layer, a touch panel substrate, and a cover glass. The touch panel substrate is a touch sensor that detects the contact position between a user's finger and the cover glass using an electrostatic capacitance method, and has a transparent inter-electrode insulating layer, and a first sensor electrode and a second sensor electrode that sandwich the transparent inter-electrode insulating layer in the lamination direction.

[0003] Furthermore, there has been a conventional touch panel display device that includes a substrate, a conductive layer provided on the substrate, a light source provided on the conductive layer, a bonding layer that covers the light source and the conductive layer, a touch panel substrate provided on the bonding layer, and a cover that covers the touch panel substrate. A light-guiding opening or a light-transmitting portion is provided in a portion of the touch panel substrate that overlaps with the light source in the stacking direction.

[0004] In such a touch panel display device, when a user's finger touches the cover, a change in the capacitance of the area where the finger touches is detected by the touch panel substrate, and electricity is passed through the conductive layer to the light source near the area where the finger touches, causing the light source to emit light, and the light from the light source is radiated to the outside through the opening or the transparent portion, causing the area near the area where the finger touches to emit light. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Laid-Open No. 2015-161795 Summary of the Invention [Problem to be solved by the invention]

[0006] In the latter touch panel display device, a light emitting layer consisting of a conductive layer, a light source, and a bonding layer is stacked on a touch panel substrate. This results in a problem of a large thickness in the stacking direction of the touch panel display device. Furthermore, it is time-consuming to bond the light emitting layer and the touch panel substrate after forming them separately. [Means for solving the problem]

[0007] Various aspects of a touch panel-equipped display device and a method for manufacturing a touch panel-equipped display device for solving the above problems will be described below. [Aspect 1] A display device with a touch panel comprising: a substrate; a first electrode and a power supply electrode laminated on the substrate and insulated from each other; a dielectric laminated only on the first electrode of the first electrode and the power supply electrode; a second electrode laminated on the dielectric and constituting a capacitive touch sensor together with the first electrode and the dielectric; and a light-emitting section provided on the power supply electrode and electrically connected to the power supply electrode, wherein the light-emitting section and the touch sensor are adjacent to each other in the surface direction of the substrate.

[0008] According to the above configuration, the first electrode of the touch sensor is stacked on the substrate, so that the light-emitting unit and the touch sensor are adjacent to each other in the surface direction of the substrate. This eliminates the need to provide a bonding layer between the first electrode constituting the touch sensor and the substrate to cover the light-emitting unit and the power supply electrode. This allows the thickness of the touch panel display device to be reduced.

[0009] [Aspect 2] The touch sensor has a through hole that penetrates the touch sensor in the thickness direction, and the power supply electrode and the light-emitting portion are provided inside the through hole.

[0010] According to the above configuration, the degree of freedom in arranging the power supply electrodes and the light emitting portions can be increased by changing the number and arrangement of the through holes provided in the touch sensor. [Aspect 3] The touch panel-equipped display device according to [Aspect 1] or [Aspect 2], wherein the thickness of the first electrode and the thickness of the power supply electrode are the same.

[0011] According to the above configuration, for example, the first electrode and the power supply electrode can be easily formed by etching the electrode film laminated on the substrate. [Aspect 4] A method for manufacturing a display device with a touch panel according to any one of [Aspect 1] to [Aspect 3], comprising: a first electrode forming step of forming the first electrode and the power supply electrode on the substrate; a second electrode forming step of forming the second electrode on the dielectric; a bonding step of stacking and bonding the dielectric on which the second electrode has been formed on the substrate on which the first electrode and the power supply electrode have been formed; and an attachment step of attaching the light-emitting unit on the power supply electrode.

[0012] According to the above method, by laminating a dielectric having a second electrode formed on a first electrode formed on a substrate, the bonding process can be performed in the same process as the bonding of the substrate and the dielectric and the formation of the touch sensor, thereby easily forming a display device with a touch panel.

[0013] [Aspect 5] The method for manufacturing a display device with a touch panel according to [Aspect 4], wherein the first electrode forming process includes forming an electrode film on the substrate and then performing an etching process to form the first electrode and the power supply electrode.

[0014] According to the above method, the first electrode and the power supply electrode can be easily formed by etching the electrode film formed on the substrate. [Aspect 6] The method for manufacturing a display device with a touch panel according to [Aspect 4], wherein the second electrode forming step includes forming an electrode film on the dielectric and then performing an etching process to form the second electrode.

[0015] According to the above method, the second electrode can be easily formed by etching the electrode film formed on the dielectric. [Effects of the Invention]

[0016] According to the display device with a touch panel of the present invention, the thickness of the display device with a touch panel can be reduced. Also, according to the manufacturing method of the display device with a touch panel of the present invention, the display device with a touch panel can be easily formed. [Brief explanation of the drawings]

[0017] [Figure 1] FIG. 1(a) is a front view showing an operation panel on which a touch panel display device according to one embodiment is provided, and FIG. 1(b) is a front view showing an enlarged portion of the touch panel display device. [Figure 2] FIG. 2 is an enlarged perspective view of a part of the touch panel display device of FIG. [Figure 3] FIG. 3 is a cross-sectional view taken along line 3-3 in FIG. [Figure 4] FIG. 4 is a cross-sectional view showing a hard portion formed on an electrode film on a substrate. [Figure 5] FIG. 5 is a cross-sectional view showing the first electrode and the power supply electrode after the hard portion has been removed. [Figure 6] FIG. 6 is a cross-sectional view showing a hard portion formed on an electrode film on a dielectric. [Figure 7] FIG. 7 is a cross-sectional view showing the second electrode after the hard portion has been removed. [Figure 8] FIG. 8 is a cross-sectional view showing the hole-making step. [Figure 9] FIG. 9 is a cross-sectional view showing the joining step and the mounting step. [Figure 10]FIG. 10 is a perspective view showing a modified example of the touch panel display device. [Figure 11] FIG. 11 is a cross-sectional view taken along line 11-11 in FIG. DETAILED DESCRIPTION OF THE INVENTION

[0018] Hereinafter, one embodiment of a display device with a touch panel will be described with reference to FIGS. As shown in FIG. 1(a), the touch panel display device is provided on an operation panel for operating the temperature setting of an air conditioner installed in a vehicle, for example.

[0019] The operation panel includes a display device 10 and a display device 11 with a touch panel. <Display device 10> 1(a), the display device 10 is a device for displaying the set temperature of the air blown into the vehicle interior from the air conditioner. The display device 10 is a chip LED electrically connected to a control device (not shown).

[0020] <Touch panel display device 11> As shown in FIG. 1(a), the touch panel display device 11 is a device for changing the set temperature of the air that is blown into the vehicle interior from the air conditioner.

[0021] As shown in FIGS. 1(b) to 3, the touch panel display device 11 includes a substrate 20, a first electrode 23, a power supply electrode 21, a dielectric 24, a second electrode 25, a light emitting section 28, and a cover 29.

[0022] (Substrate 20) 2 and 3, the substrate 20 is a composite substrate formed by impregnating a glass cloth woven from glass fibers with a thermosetting resin. The thermosetting resin is an epoxy resin.

[0023] (1st electrode 23) 3, the first electrode 23 is laminated on the upper surface 20a of the substrate 20. In this embodiment, the first electrodes 23 have a rectangular shape in a plan view, and a plurality of the first electrodes 23 are provided at intervals from each other and arranged in a lattice pattern (see FIG. 1(b)).

[0024] The first electrode 23 and the upper surface 20a of the substrate 20 are bonded to each other with a resin material. The resin material is formed by impregnating a glass cloth woven from glass fibers with a thermosetting resin. The thermosetting resin is an epoxy resin.

[0025] The first electrode 23 is a copper foil. (power supply electrode 21) 3, the power supply electrode 21 is laminated on the upper surface 20a of the substrate 20, and is laminated on a portion of the upper surface 20a of the substrate 20 where no first electrodes 23 are laminated. In this embodiment, the power supply electrodes 21 have a rectangular shape in a plan view, and are provided in plurality at intervals, and are provided between the first electrodes 23 adjacent to each other in the surface direction of the substrate 20 (see FIG. 1(b)).

[0026] The power supply electrode 21 is bonded to the upper surface 20a of the substrate 20 by a resin material. The resin material is formed by impregnating a glass cloth woven from glass fibers with a thermosetting resin. The thermosetting resin is an epoxy resin.

[0027] The power supply electrode 21 is made of copper foil. The power supply electrode 21 and the first electrode 23 are insulated from each other. In this embodiment, the first electrode 23 and the power supply electrode 21 are provided at an interval in the surface direction of the substrate 20, so that the power supply electrode 21 and the first electrode 23 are insulated from each other.

[0028] The thickness of the power supply electrode 21 and the thickness of the first electrode 23 are the same. The power supply electrode 21 and the first electrode 23 are electrically connected to a control device (not shown) by copper foil wiring (both not shown) provided on the underside of the substrate 20 and electrically connected to the power supply electrode 21 and the first electrode 23 through through holes that penetrate the substrate 20 in the thickness direction of the substrate 20.

[0029] (Dielectric 24) As shown in FIG. 3, the dielectric 24 is plate-shaped and is laminated only on the first electrode 23 out of the first electrode 23 and the power supply electrode 21.

[0030] The dielectric 24 is a composite substrate formed by impregnating a glass cloth woven from glass fibers with a thermosetting resin, which is an epoxy resin. The lower surface 24b of the dielectric 24 is bonded to the first electrode 23 by a resin material. The resin material is formed by impregnating a glass cloth woven from glass fibers with a thermosetting resin. The thermosetting resin is an epoxy resin.

[0031] (2nd electrode 25) 3, the second electrode 25 is laminated on an upper surface 24a, which is the surface opposite to the surface on the first electrode 23 side in the thickness direction of the dielectric 24. In this embodiment, the second electrodes 25 have a rectangular shape in a plan view, and are provided in plurality at intervals from each other, and are each provided at a position corresponding to the first electrode 23 in the surface direction of the substrate 20.

[0032] The second electrode 25 and the upper surface 24a of the dielectric 24 are bonded to each other by a resin material. The resin material is formed by impregnating a glass cloth woven from glass fibers with a thermosetting resin. The thermosetting resin is an epoxy resin.

[0033] The second electrode 25 is a copper foil. The first electrode 23, the dielectric 24, and the second electrode 25 constitute a touch sensor 22 that detects the contact position between the user's finger and a cover 29 (described later) by using an electrostatic capacitance method.

[0034] A through hole 26 is provided in the dielectric 24 at a position where the dielectric 24 overlaps with the power supply electrode 21 in the thickness direction of the dielectric 24, passing through the dielectric 24 in the thickness direction of the dielectric 24. A plurality of through holes 26 are provided, and each is provided at a position corresponding to a plurality of power supply electrodes 21. In this embodiment, the through hole 26 is located between adjacent second electrodes 25 in the surface direction of the substrate 20. In the surface direction of the substrate 20, the inner peripheral edge of the through hole 26 is located outside the outer edge of the power supply electrode 21.

[0035] (Light emitting part 28) 3, the light emitting section 28 is provided inside the through hole 26 together with the power supply electrode 21. The light emitting section 28 is provided on the power supply electrode 21 and is electrically connected to the power supply electrode 21.

[0036] The light emitting section 28 and the touch sensor 22 are adjacent to each other in the surface direction of the substrate 20. The upper end of the light emitting portion 28 is located below the upper surface of the second electrode 25 in the thickness direction of the dielectric 24.

[0037] The light emitting unit 28 is a chip LED. (Cover 29) 2 and 3, the cover 29 is laminated on the upper surface of the touch sensor 22 and covers the upper surface of the touch sensor 22 and the through-hole 26. The cover 29 and the upper surface of the touch sensor 22 are joined together by an adhesive (not shown).

[0038] The cover 29 is made of a transparent material such as glass. When the user's fingers touch the cover 29, the change in capacitance at the part where the fingers touch is detected by the touch sensor 22, and electricity is passed through the power supply electrode 21 to the light-emitting part 28 near the part where the fingers touch.

[0039] <Method of manufacturing the touch panel-equipped display device 11> As shown in FIGS. 4 to 9, the method for manufacturing the touch panel-equipped display device 11 includes a first electrode forming step, a second electrode forming step, a hole forming step, a bonding step, and an attachment step.

[0040] (First electrode formation process) As shown in FIG. 4, in the first electrode formation step, an electrode film 30 is first formed on the upper surface 20a of the substrate 20. After a prepreg (not shown) and the electrode film 30 are laminated in this order on the upper surface 20a of the substrate 20, the laminated prepreg (not shown) and electrode film 30 are heated and pressed to bond the electrode film 30 to the upper surface 20a of the substrate 20. The prepreg is formed by impregnating a glass cloth woven from glass fibers with a semi-cured thermosetting resin. The thermosetting resin is an epoxy resin. The electrode film 30 is a film formed from copper foil, and covers the entire upper surface 20a of the substrate 20.

[0041] Next, resist ink is applied to the surface of the electrode film 30, and then ultraviolet light is irradiated onto the resist ink that overlaps the portions of the electrode film 30 that will become the first electrodes 23 and the power supply electrodes 21. The resist ink irradiated with ultraviolet light hardens, and the portions of the electrode film 30 that will become the first electrodes 23 and the power supply electrodes 21 are covered with hardened portions 31 of the resist ink. Note that, as the unhardened resist ink is washed away, the portions of the electrode film 30 other than the portions that will become the first electrodes 23 and the power supply electrodes 21 are exposed.

[0042] 5, an etching process is performed to form the first electrode 23 and the power supply electrode 21 on the upper surface 20a of the substrate 20. The etching process is, for example, wet etching, and the portions of the electrode film 30 that are not covered by the hardened portion 31 are brought into contact with an etching solution that corrodes the electrode film 30, thereby removing the portions of the electrode film 30 other than the portions that will become the first electrode 23 and the power supply electrode 21.

[0043] Next, as indicated by the two-dot chain line in Fig. 5, the hardened portions 31 formed on the surfaces of the first electrode 23 and the power supply electrode 21 are removed. The hardened portions 31 are removed from the surfaces of the first electrode 23 and the power supply electrode 21 by using, for example, a remover.

[0044] (Second electrode formation process) 6, in the second electrode formation step, first, an electrode film 32 is formed on the upper surface 24a of the dielectric 24. A prepreg (not shown) and the electrode film 32 are laminated in this order on the upper surface 24a of the dielectric 24, and then the laminated prepreg (not shown) and electrode film 32 are pressed while being heated, thereby bonding the electrode film 32 to the upper surface 24a of the dielectric 24. The electrode film 32 is a film made of copper foil, and covers the entire upper surface 24a of the dielectric 24.

[0045] Next, resist ink is applied to the surface of the electrode film 32, and then ultraviolet light is irradiated onto the resist ink that overlaps the portion of the electrode film 32 that will become the second electrode 25. The resist ink irradiated with ultraviolet light is cured, and the portion of the electrode film 32 that will become the second electrode 25 is covered with a cured portion 33 of the resist ink. Note that, as the uncured resist ink is washed away, the portion of the electrode film 32 other than the portion that will become the second electrode 25 is exposed.

[0046] 7, an etching process is performed to form the second electrode 25 on the upper surface 24a of the dielectric 24. The etching process is, for example, wet etching, and the portion of the electrode film 32 that is not covered by the hardened portion 33 is brought into contact with an etching solution that corrodes the electrode film 32, thereby removing the portion of the electrode film 32 other than the portion that will become the second electrode 25.

[0047] Next, as indicated by the two-dot chain line in Fig. 7, hardened portion 33 formed on the surface of second electrode 25 is removed. Hardened portion 33 is removed from the surface of second electrode 25 by using, for example, a remover.

[0048] (hole drilling process) 8, in the hole drilling step, a plurality of through holes 26 are formed in portions of the dielectric 24 that do not overlap with the second electrode 25 and at positions that will overlap with a plurality of power supply electrodes 21 in the thickness direction of the dielectric 24 in a bonding step described later. The through holes 26 are formed by drilling holes in the dielectric 24 with a drill.

[0049] (Joining process) As shown in FIG. 9, in the bonding step, a dielectric 24 on which a second electrode 25 is formed is laminated and bonded onto a substrate 20 on which a first electrode 23 and a power supply electrode 21 are formed.

[0050] The dielectric 24 is laminated on the first electrode 23 so that the plurality of through holes 26 overlap the plurality of power supply electrodes 21 in the thickness direction of the dielectric 24. With a prepreg (not shown) sandwiched between the first electrode 23 and the dielectric 24, the dielectric 24 and the prepreg are heated and pressed, whereby the first electrode 23 is bonded to the lower surface 24b of the dielectric 24.

[0051] (Installation process) 9, in the attachment step, the light emitting section 28 is attached onto the power supply electrode 21. The light emitting section 28 is electrically joined to the power supply electrode 21 by, for example, soldering.

[0052] <Operation of this embodiment> 3, the first electrode 23 of the touch sensor 22 is laminated on the upper surface 20a of the substrate 20, so that the light-emitting unit 28 and the touch sensor 22 are adjacent to each other in the surface direction of the substrate 20. Therefore, there is no need to provide a bonding layer covering the light-emitting unit 28 and the power supply electrode 21 between the first electrode 23 constituting the touch sensor 22 and the substrate 20.

[0053] <Effects of this embodiment> (1) The touch panel-equipped display device 11 has a dielectric 24 that is laminated only on the first electrode 23 out of the first electrode 23 and the power supply electrode 21. The second electrode 25 is laminated on an upper surface 24a of the dielectric 24, and constitutes a capacitive touch sensor 22 together with the first electrode 23 and the dielectric 24. The light-emitting section 28 and the touch sensor 22 are adjacent to each other in the surface direction of the substrate 20.

[0054] With this configuration, the above-mentioned effects are achieved, and the thickness of the touch panel-equipped display device 11 can be reduced. (2) The dielectric 24 has a through-hole 26 that penetrates the dielectric 24 in the thickness direction. The power supply electrode 21 and the light emitting portion 28 are provided inside the through-hole 26.

[0055] According to this configuration, the number and arrangement of the through holes 26 provided in the touch sensor 22 can increase the degree of freedom in arranging the power supply electrodes 21 and the light emitting sections 28. (3) The thickness of the first electrode 23 and the thickness of the power supply electrode 21 are the same.

[0056] According to this configuration, the first electrode 23 and the power supply electrode 21 can be easily formed by, for example, etching the electrode film laminated on the upper surface 20a of the substrate 20. (4) The manufacturing method of the touch panel-equipped display device 11 includes a bonding step of stacking and bonding a dielectric 24 having a second electrode 25 formed thereon onto a substrate 20 having a first electrode 23 and a power supply electrode 21 formed thereon.

[0057] According to this method, the dielectric 24 having the second electrode 25 formed thereon is laminated on the first electrode 23 formed on the upper surface 20a of the substrate 20. Therefore, in the bonding process, the process of bonding the substrate 20 and the dielectric 24 and the process of forming the touch sensor 22 can be performed in the same process. Therefore, the touch panel-equipped display device 11 can be easily formed.

[0058] (5) In the first electrode forming step, the electrode film 30 is formed on the substrate 20, and then an etching process is performed to form the first electrode 23 and the power supply electrode 21. According to this method, the electrode film 30 formed on the upper surface 20a of the substrate 20 is etched, whereby the first electrode 23 and the power supply electrode 21 can be easily formed.

[0059] (6) In the second electrode forming step, the electrode film 32 is formed on the upper surface 24a of the dielectric 24, and then an etching process is performed to form the second electrode 25. According to this method, the electrode film 32 formed on the upper surface 24a of the dielectric 24 is etched, whereby the second electrode 25 can be easily formed.

[0060] <Example of change> This embodiment can be modified as follows: This embodiment and the following modifications can be combined and implemented within the scope of technical compatibility.

[0061] In the above embodiment, the through-hole 26 is provided between the second electrodes 25 adjacent to each other in the surface direction of the substrate 20, but this is not limiting. As shown in Figures 10 and 11 , in the touch sensor 122, the power supply electrode 121 and the light-emitting portion 128 may be provided inside a through-hole 126 that passes through the first electrode 123, the dielectric 124, and the second electrode 125 in the thickness direction of the dielectric 124.

[0062] In the above embodiment, in the hole drilling step, the plurality of through holes 26 are formed in portions of the dielectric 24 that do not overlap with the second electrode 25 and at positions that overlap with the plurality of power supply electrodes 21 in the thickness direction in the bonding step, but this is not limiting. If there is no interference between the light emitting section 28 and the dielectric 24 when the dielectric 24 is laminated on the first electrode 23, the hole drilling step may be omitted.

[0063] In the second electrode formation process, the second electrode 25 is formed by etching the electrode film 32 formed on the upper surface 24a of the dielectric 24, but copper foil of the second electrode 25 may also be printed on the upper surface 24a of the dielectric 24.

[0064] In the first electrode formation process, the first electrode 23 and the power supply electrode 21 are formed by etching the electrode film 30 formed on the upper surface 20a of the substrate 20, but copper foil of the first electrode 23 and the power supply electrode 21 may also be printed on the upper surface 20a of the substrate 20.

[0065] In the above embodiment, the second electrode forming step is performed after the first electrode forming step, but the first electrode forming step may be performed after the second electrode forming step. In the above embodiment, the attachment process is performed after the joining process, but the attachment process may be performed after the joining process.

[0066] In the above embodiment, the thickness of the first electrode 23 and the thickness of the power supply electrode 21 are the same, but this is not limiting. For example, by printing copper foil on the substrate 20, the first electrode 23 and the power supply electrode 21 may be formed separately on the substrate 20, so that the thickness of the first electrode 23 and the thickness of the power supply electrode 21 may be different from each other.

[0067] In the above embodiment, the power supply electrode 21 and the light emitting portion 28 are provided inside the through hole 26, but this is not limiting. A cutout that opens at a part of the outer periphery of the dielectric 24 and on both sides in the thickness direction of the dielectric 24 may be formed in the dielectric 24, and the power supply electrode 21 and the light emitting portion 28 may be provided inside the cutout.

[0068] In the above embodiment, the through holes 26 are formed in the dielectric 24, but this is not limiting. A plurality of dielectrics 24 may be provided only on the plurality of first electrodes 23, respectively.

[0069] In the above embodiment, the first electrode 23 and the power supply electrode 21 are spaced apart in the surface direction of the substrate 20 to insulate the power supply electrode 21 from the first electrode 23, but this is not limiting. An insulator may be provided between the power supply electrode 21 and the first electrode 23.

[0070] In the above embodiment, the touch panel display device 11 is embodied as being provided on an operation panel for operating a vehicle air conditioner, but the touch panel display device 11 may be modified as appropriate as long as it is a display device having a touch sensor. [Explanation of symbols]

[0071] 10…Display device 11...Touch panel display device 20...Substrate 20a…Top surface 21,121...Power supply electrode 22,122...Touch sensor 23,123…1st electrode 24,124...Dielectric 24a…Top surface 24b…Bottom surface 25,125…Second electrode 26,126...Through holes 28,128...Light-emitting part 29...Cover 30...electrode film 31...hardened part 32...electrode film 33...hardened part

Claims

1. A substrate; a first electrode and a power supply electrode laminated on the substrate and insulated from each other; a dielectric layer laminated only on the first electrode out of the first electrode and the power supply electrode; a second electrode laminated on the dielectric and constituting a capacitive touch sensor together with the first electrode and the dielectric; a light-emitting unit provided on the power supply electrode and electrically connected to the power supply electrode, The light-emitting unit and the touch sensor are adjacent to each other in a surface direction of the substrate. Display device with touch panel.

2. the touch sensor has a through hole that penetrates the touch sensor in a thickness direction, the power supply electrode and the light emitting portion are provided inside the through hole; The touch panel-equipped display device according to claim 1 .

3. The thickness of the first electrode and the thickness of the power supply electrode are the same. The touch panel-equipped display device according to claim 1 .

4. A method for manufacturing the touch panel-equipped display device according to any one of claims 1 to 3, comprising: a first electrode forming step of forming the first electrode and the power supply electrode on the substrate; a second electrode forming step of forming the second electrode on the dielectric; a bonding step of laminating and bonding the dielectric body, on which the second electrode is formed, onto the substrate, on which the first electrode and the power supply electrode are formed; and a mounting step of mounting the light emitting unit on the power supply electrode. A method for manufacturing a display device with a touch panel.

5. the first electrode forming step includes forming an electrode film on the substrate and then performing an etching process to form the first electrode and the power supply electrode. The method for manufacturing the touch panel-equipped display device according to claim 4 .

6. the second electrode forming step includes forming an electrode film on the dielectric and then performing an etching process to form the second electrode. The method for manufacturing the touch panel-equipped display device according to claim 4 .

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