Driving method for display device

Abstract

To provide a touch panel with high position detection accuracy, or a noncontact touch panel.SOLUTION: A display device has first and second pixels and a sensor pixel. The sensor pixel has a photoelectric conversion element having sensitivity to light with a first color emitted from the first pixel and light with a second color emitted from the second pixel. A driving method for the display device has a first period of performing first imaging with the first pixel on and the second pixel off, a second period of performing first readout with the first pixel and the second pixel off, a third period of performing second imaging with the second pixel on and the first pixel off, and a fourth period of performing second readout with the first pixel and the second pixel off.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] 1. Field of the Invention One aspect of the present invention relates to a display device. One aspect of the present invention relates to an imaging device. One aspect of the present invention relates to a touch panel. One aspect of the present invention relates to a non-contact touch panel. One aspect of the present invention relates to an authentication method for an electronic device.

[0002] Note that one embodiment of the present invention is not limited to the above technical field. Examples of the technical field of one embodiment of the present invention disclosed in this specification and the like include semiconductor devices, display devices, light-emitting devices, power storage devices, memory devices, electronic devices, lighting devices, input devices, input / output devices, driving methods thereof, and manufacturing methods thereof. A semiconductor device refers to any device that can function by utilizing semiconductor characteristics. [Background technology]

[0003] In recent years, information terminal devices such as smartphones and other mobile phones, tablet information terminals, and notebook PCs (personal computers) have become widespread. These information terminal devices often contain personal information, and various authentication technologies have been developed to prevent unauthorized use.

[0004] For example, Patent Document 1 discloses an electronic device that includes a fingerprint sensor in a push button switch section. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] US Patent Application Publication No. 2014 / 0056493 Summary of the Invention [Problem to be solved by the invention]

[0006] When adding authentication functions such as fingerprint authentication to electronic devices that function as information terminal devices, a module for capturing fingerprint images must be installed in addition to the touch sensor, which increases the number of components and increases the cost of the electronic device.

[0007] An object of one embodiment of the present invention is to provide a touch panel or a contactless touch panel with high position detection accuracy. Another object is to reduce the cost of an electronic device having an authentication function. Another object is to reduce the number of components in an electronic device. Another object is to provide a display device capable of capturing an image of a fingerprint or the like and a driving method thereof. Another object is to provide a display device having both a touch detection function and a fingerprint imaging function and a driving method thereof. Another object is to provide a contactless touch panel and a driving method thereof.

[0008] An object of one embodiment of the present invention is to provide a display device having a novel structure or a novel method for driving a display device.

[0009] Note that the description of these problems does not preclude the existence of other problems. Note that one embodiment of the present invention does not necessarily solve all of these problems. Note that problems other than these can be extracted from the description of the specification, drawings, claims, etc. [Means for solving the problem]

[0010] One embodiment of the present invention is a method for driving a display device including a first pixel, a second pixel, and a sensor pixel. The sensor pixel has a photoelectric conversion element sensitive to light of a first color emitted by the first pixel and light of a second color emitted by the second pixel. The method for driving the display device of one embodiment of the present invention includes: a first period for performing a first image capture while the first pixel is turned on and the second pixel is turned off; a second period for performing a first readout while the first pixel and the second pixel are turned off; a third period for performing a second image capture while the second pixel is turned on and the first pixel is turned off; and a fourth period for performing a second readout while the first pixel and the second pixel are turned off.

[0011] Another embodiment of the present invention is a method for driving a display device including a first pixel, a second pixel, and a sensor pixel. The first pixel has a first light-emitting element that emits light of a first color, the second pixel has a second light-emitting element that emits light of a second color, and the sensor pixel has a photoelectric conversion element that is sensitive to light of the first color and light of the second color. The driving method of the display device of one embodiment of the present invention includes a first period for writing first data to the first pixel, a second period for performing a first image capture by the sensor pixel while the first light-emitting element is turned on based on the first data, a third period for turning off the first light-emitting element and the second light-emitting element, and a fourth period for writing second data to the second pixel. Furthermore, a first readout is performed from the sensor pixel during one or both of the third and fourth periods.

[0012] In the above, the display device preferably includes a third pixel. The third pixel includes a third light-emitting element that emits light of a third color. After the fourth period, the display device preferably includes a fifth period in which a second image is captured by the sensor pixel while the second light-emitting element is turned on based on second data, a sixth period in which the first light-emitting element, the second light-emitting element, and the third light-emitting element are turned off, and a seventh period in which the third data is written to the third pixel. In this case, it is preferable to perform a second readout from the sensor pixel during one or both of the sixth and seventh periods.

[0013] In any of the above, the first light-emitting element and the photoelectric conversion element are preferably provided on the same surface.

[0014] In any of the above, the first light-emitting element preferably has a first pixel electrode, a light-emitting layer, and a first electrode. Furthermore, the photoelectric conversion element preferably has a second pixel electrode, an active layer, and a first electrode. Furthermore, the first electrode preferably has a portion overlapping the first pixel electrode via the light-emitting layer and a portion overlapping the second pixel electrode via the active layer. In this case, the first pixel electrode and the second pixel electrode are preferably formed by processing the same conductive film.

[0015] In addition, in the above, it is preferable that, during the first period, a first potential is applied to the first electrode, a second potential higher than the first potential is applied to the first pixel electrode, and a third potential lower than the first potential is applied to the second pixel electrode. [Effects of the Invention]

[0016] According to one embodiment of the present invention, a touch panel or a non-contact touch panel with high position detection accuracy can be provided. Alternatively, the cost of an electronic device having an authentication function can be reduced. Alternatively, the number of components in an electronic device can be reduced. Alternatively, a display device capable of capturing an image of a fingerprint or the like and a driving method thereof can be provided. Alternatively, a display device having both a touch detection function and a fingerprint imaging function and a driving method thereof can be provided. Alternatively, a non-contact touch panel and a driving method thereof can be provided.

[0017] According to one embodiment of the present invention, a display device having a novel structure or a novel method for driving a display device can be provided.

[0018] Note that the description of these effects does not preclude the existence of other effects. Note that one embodiment of the present invention does not necessarily have all of these effects. Note that effects other than these can be extracted from the description in the specification, drawings, claims, etc. [Brief explanation of the drawings]

[0019] [Figure 1] Fig. 1A is a diagram showing an example of the configuration of a display device, and Fig. 1B and Fig. 1C are diagrams illustrating an example of a method for driving the display device. [Figure 2] Fig. 2A is a diagram showing an example of the configuration of a display device, and Fig. 2B and Fig. 2C are circuit diagrams of pixel circuits. [Figure 3] 3A and 3B are timing charts illustrating a method for driving the display device. [Figure 4] Figures 4A, 4B, and 4D are cross-sectional views showing an example of a display device, Figures 4C and 4E are diagrams showing examples of images captured by the display device, and Figures 4F to 4H are top views showing examples of pixels. [Figure 5] Fig. 5A is a cross-sectional view showing an example of the configuration of a display device, and Figs. 5B to 5D are top views showing an example of a pixel. [Figure 6] 6A and 6B are diagrams showing configuration examples of a display device. [Figure 7] 7A to 7C are diagrams showing configuration examples of a display device. [Figure 8] 8A to 8C are diagrams showing configuration examples of a display device. [Figure 9] FIG. 9 is a diagram illustrating an example of the configuration of a display device. [Figure 10] Fig. 10A is a diagram showing a configuration example of a display device, Fig. 10B and Fig. 10C are diagrams showing configuration examples of a transistor. [Figure 11] 11A and 11B are diagrams showing examples of pixel configurations, and Fig. 11C to Fig. 11E are diagrams showing examples of pixel circuit configurations. [Figure 12] 12A and 12B are diagrams showing configuration examples of electronic devices. [Figure 13] 13A to 13D are diagrams showing configuration examples of electronic devices. [Figure 14] 14A to 14F are diagrams showing configuration examples of electronic devices. DETAILED DESCRIPTION OF THE INVENTION

[0020] Hereinafter, embodiments will be described with reference to the drawings. However, it will be readily understood by those skilled in the art that the embodiments can be implemented in many different ways and that various changes in form and details can be made without departing from the spirit and scope of the present invention. Therefore, the present invention should not be interpreted as being limited to the following description of the embodiments.

[0021] In the configuration of the invention described below, the same parts or parts having similar functions are denoted by the same reference numerals in different drawings, and repeated explanations thereof will be omitted. In addition, when referring to similar functions, the same hatch pattern may be used and no particular reference numeral may be assigned.

[0022] In the drawings described in this specification, the size of each component, the thickness of a layer, or an area may be exaggerated for clarity, and therefore, the drawings are not necessarily limited to the scale.

[0023] In this specification, ordinal numbers such as "first" and "second" are used to avoid confusion of components and do not limit the number.

[0024] (Embodiment 1) In this embodiment, a structural example of a display device according to one embodiment of the present invention and an example of a driving method thereof will be described.

[0025] A display device according to one embodiment of the present invention includes a plurality of display elements, a plurality of light-receiving elements (also referred to as light-receiving devices), and a touch sensor. The display elements are preferably light-emitting elements (also referred to as light-emitting devices). The light-receiving elements are preferably photoelectric conversion elements. Hereinafter, a case where a light-emitting element is used as a display element and a photoelectric conversion element is used as a light-receiving element will be described.

[0026] The display device has a function of displaying an image on a display surface side by means of display elements arranged in a matrix.

[0027] A display device according to one embodiment of the present invention includes a light-receiving element and a light-emitting element in a display portion, and the light-emitting elements are arranged in a matrix in the display portion, so that an image can be displayed on the display portion.

[0028] The display unit has light-receiving elements arranged in a matrix, and the display unit has one or both of an imaging function and a sensing function. For example, part of light emitted by a light-emitting element is reflected by an object, and the reflected light is incident on the light-receiving element. The light-receiving element can output an electric signal according to the intensity of the incident light. Therefore, when a display device has a plurality of light-receiving elements arranged in a matrix, it can acquire (also referred to as capturing) data such as position information and shape of an object. That is, the display unit can be used as an image sensor, a touch sensor, or the like. By detecting light in the display unit, it is possible to capture an image, detect a touch operation of an object (such as a finger or a pen), and the like. Furthermore, the display device of one embodiment of the present invention can use the light-emitting element as a light source for a sensor. Therefore, a light-receiving unit and a light source are not required to be provided separately from the display device, and the number of components in an electronic device can be reduced.

[0029] Furthermore, the display device can capture an image of an object touching or approaching the display surface using a light-receiving element. That is, the display device can function as an image sensor panel or the like. In particular, the display device can capture an image of a fingerprint of a fingertip touching the display surface. An electronic device to which the display device of one embodiment of the present invention is applied can acquire data related to biometric information such as a fingerprint or palm print by using the function as an image sensor. That is, a biometric authentication sensor can be built into the display device. By building a biometric authentication sensor into the display device, the number of components of the electronic device can be reduced compared to when a biometric authentication sensor is provided separately from the display device, and the electronic device can be made smaller and lighter.

[0030] In the display device of one embodiment of the present invention, when light emitted from a light-emitting element included in a display portion is reflected (or scattered) by an object, the light-receiving element can detect the reflected light (or scattered light); therefore, imaging, detection of a touch operation, and the like are possible even in a dark place.

[0031] As described above, the display device can function as a touch panel. In one embodiment of the present invention, the position of an object can be detected by using light reflected from the object. Therefore, the object does not necessarily need to be in contact with the display screen, and position information, shape information, and the like of an object that is far from the display screen can be acquired. Therefore, one embodiment of the present invention functions as a non-contact touch panel. A non-contact touch panel can also be called a near-touch panel or a non-touch panel.

[0032] In electronic devices using a touch panel (for example, a smartphone), it is necessary to directly touch the screen to operate the device. Therefore, the screen may become dirty with sebum, sweat, or the like from fingers. Furthermore, if viruses, bacteria, or the like are attached to the screen, there is a problem of an increased risk of infection. However, one embodiment of the present invention can be used as a non-contact touch panel, and therefore, an electronic device that can be used extremely hygienically can be provided.

[0033] An electronic device to which the non-contact touch panel of one embodiment of the present invention is applied can be suitably used, for example, in a medical monitoring device where hygiene is an issue.Furthermore, since the electronic device can be operated even when hands are wet or dirty during cooking or cleaning, the electronic device can also be suitably used in home electronic devices (for example, smartphones, tablet terminals, and laptop PCs).

[0034] When light-emitting elements are used as display elements, it is preferable to use EL elements such as OLEDs (organic light-emitting diodes) and QLEDs (quantum-dot light-emitting diodes). Examples of light-emitting materials that EL elements have include fluorescent materials, phosphorescent materials, thermally activated delayed fluorescence (TADF) materials, and inorganic compounds (quantum dot materials, etc.). LEDs such as micro LEDs (light-emitting diodes) can also be used as light-emitting elements.

[0035] As the light receiving element, for example, a pn-type or pin-type photodiode can be used. The light receiving element functions as a photoelectric conversion element that detects light incident on the light receiving element and generates an electric charge. The amount of electric charge generated by the photoelectric conversion element is determined according to the amount of incident light. In particular, it is preferable to use an organic photodiode having a layer containing an organic compound as the light receiving element. Organic photodiodes can be easily made thin, lightweight, and large in area, and have a high degree of freedom in shape and design, so they can be applied to various display devices.

[0036] The light-emitting element may have a laminated structure including a light-emitting layer between a pair of electrodes. The light-receiving element may have a laminated structure including an active layer between a pair of electrodes. The active layer of the light-receiving element may be made of a semiconductor material. For example, an organic semiconductor material containing an organic compound or an inorganic semiconductor material such as silicon may be used.

[0037] In particular, it is preferable to use an organic compound for the active layer of the light-receiving element. In this case, it is preferable to provide one electrode (also called a pixel electrode) of the light-emitting element and the light-receiving element on the same surface. Furthermore, it is more preferable that the other electrode of the light-emitting element and the light-receiving element be an electrode (also called a common electrode) formed from one continuous conductive layer. Furthermore, it is more preferable that the light-emitting element and the light-receiving element have a common layer. This allows part of the manufacturing process for the light-emitting element and the light-receiving element to be shared, thereby simplifying the manufacturing process, reducing manufacturing costs, and improving manufacturing yield.

[0038] Here, one embodiment of the present invention can have a structure including two or more types of pixels including light-emitting elements that exhibit different colors and a sensor pixel including a photoelectric conversion element. For example, a display device capable of color display can be realized by arranging three colors of pixels, red, green, and blue, and a sensor pixel in a matrix.

[0039] Furthermore, the display device is driven by a time-sequential additive color mixture method to display colors. Specifically, color display is achieved by sequentially lighting red, green, and blue pixels. After lighting each color pixel, it is preferable to provide a period during which all pixels are turned off (also referred to as a period during which black is displayed). This allows for smooth video display. This driving method can also be called a time-division display method (also referred to as a field-sequential driving method).

[0040] Furthermore, the sensor pixels are driven so that at least an exposure period is provided during the period when the red, green, or blue pixels are lit. Furthermore, the sensor pixels are driven so that a readout period is provided during the period when the red, green, or blue pixels are lit. In other words, imaging can be performed three times during one frame period. This allows for smooth sensing. Furthermore, since imaging (exposure) is performed during the lit period, the effects of electrical noise that occurs when driving the pixels can be effectively suppressed, enabling clear image capture.

[0041] A more specific example will be described below with reference to the drawings.

[0042] [Configuration example 1] 1A shows a schematic diagram of a display device 50 according to one embodiment of the present invention. The display device 50 includes a light-emitting element 51R that emits red light 55R, a light-emitting element 51G that emits green light 55G, a light-emitting element 51B that emits blue light 55B, and a light-receiving element 52. The light-receiving element 52 is a photoelectric conversion element that is sensitive to red, blue, and green light.

[0043] One pixel is composed of the light emitting element 51R, the light emitting element 51G, the light emitting element 51B, and the light receiving element 52. The display device 50 has a configuration in which a plurality of such pixels are arranged in a matrix.

[0044] The light emitting elements 51R, 51G, 51B, and the light receiving element 52 are arranged on the same plane. Light 55R, 55G, and 55B are emitted from the respective light emitting elements toward the display surface side.

[0045] 1A shows a state in which a finger 59 is held over display device 50. Light 55R, light 55G, and a portion of light 55B are reflected by finger 59, and a portion of the reflected light 56 ​​is incident on light receiving element 52. Light receiving element 52 can receive the incident reflected light 56, convert it into an electrical signal, and output it.

[0046] [Driving method example 1] 1B schematically shows a method for driving the display device 50. In this driving method, a period 60R, a period 60G, and a period 60B are repeated to display and capture an image. In this driving method, one or more of the period 60R, the period 60G, and the period 60B are provided within one frame period.

[0047] During period 60R, light-emitting element 51R emits light (turns on). At this time, light-emitting elements 51G and 51B are turned off. A portion of light 55R emitted from light-emitting element 51R is reflected by finger 59, and a portion of the reflected light 56 ​​enters light-receiving element 52. During period 60R, light-receiving element 52 is exposed to light, thereby obtaining one image.

[0048] Subsequently, in period 60G, light-emitting element 51G emits light. At this time, light-emitting elements 51R and 51B are turned off. In period 60G, green light 55G emitted from light-emitting element 51G is reflected by finger 59, and an image reflecting the intensity distribution of reflected light 56 ​​can be obtained.

[0049] Subsequently, in period 60B, light-emitting element 51B emits light, and light-emitting element 51R and light-emitting element 51G are turned off. In period 60B, blue light 55B is reflected by finger 59, and an image reflecting the intensity distribution of reflected light 56 ​​can be obtained.

[0050] A plurality of light-emitting elements 51R, 51G, and 51B arranged in a matrix sequentially emit light during one frame period, thereby sequentially displaying a red image, a green image, and a blue image. This allows color display based on the sequential additive color mixing method. If the frame frequency of display device 50 is low, a so-called color break is likely to occur, in which the images of each color are not combined and are viewed individually. Therefore, the frame frequency is set to, for example, 60 Hz or higher, preferably 90 Hz or higher, and more preferably 120 Hz or higher.

[0051] In addition, in conjunction with the image display, the multiple light receiving elements 52 arranged in a matrix can capture images three times during one frame period. This makes it possible to obtain position information of the finger 59 three times during one frame period. For example, when the frame frequency is 60 Hz, position information can be obtained at three times the frequency, making it possible to obtain accurate position information even when the finger 59 moves quickly. Furthermore, position information of the finger 59 can be obtained based on an image obtained by combining three images captured during one frame period. This makes it possible to obtain accurate position information even for objects with low reflectivity for certain colors of light. For example, if the color of the object does not reflect red light, the shape and position information of the object can be obtained using two images captured with green light 55G and blue light 55B.

[0052] In addition to the image display, three images can be captured during one frame period using the plurality of light receiving elements 52 arranged in a matrix. The three images correspond to red, green, and blue reflected light from an object, respectively, and a color image can be obtained by combining these three images. That is, the display device 50 according to one embodiment of the present invention can also function as a full-color image scanner. For example, by placing a piece of paper, a printed material, or the like to be imaged on the display surface of the display device 50, the printed material can be digitized as an image.

[0053] Next, a more specific example of a method for driving the display device 50 will be described with reference to Fig. 1C. In the following, a pixel (sub-pixel) having a light-emitting element 51R will be referred to as an R pixel, a pixel having a light-emitting element 51G as a G pixel, and a pixel having a light-emitting element 51B as a B pixel. In Fig. 1C, the upper row of the two columns shows the operations of the pixels having the light-emitting element, and the lower row shows the operation of the sensor pixel having the light-receiving element 52.

[0054] 1C corresponds to the above-mentioned period 60 R. At this time, imaging (exposure) using the light receiving element 52 is performed at the same time.

[0055] Next, during the off period, the light-emitting elements 51R, 51G, and 51B are turned off. By providing the off period, afterimages are less likely to occur and smooth moving image display can be achieved, which is preferable. After the off period, data is written to all G pixels (G writing).

[0056] During the off period and the G write period, the data is read from the sensor pixels. Here, this is referred to as R readout because the R pixels are turned on and the captured data is read.

[0057] Thereafter, imaging is similarly performed during the G lighting period (corresponding to the 60G period). Then, after the light-off period, data is written to the B pixels during the B writing period. During the light-off period and B writing period, the G pixels are first lit and the imaged data is read (G readout).

[0058] Thereafter, imaging is performed during the B lighting period (corresponding to period 60B), and during the subsequent light-off period and R writing period, the data imaged by lighting the B pixels first is read (B readout).

[0059] By repeating the above operation, it is possible to simultaneously perform display and image capture. Furthermore, by capturing an image during the lighting period, it is possible to obtain a clear image with little noise.

[0060] The above is the description of the driving method example 1.

[0061] [Configuration example 2] A more specific example of the configuration of the display device will be described below.

[0062] 2A shows a block diagram of the display device 10. The display device 10 includes a display unit 11, a drive circuit unit 12, a drive circuit unit 13, a drive circuit unit 14, a circuit unit 15, and the like.

[0063] The display unit 11 has a plurality of pixels 30 arranged in a matrix. Each pixel 30 has sub-pixels 21R, 21G, and 21B, and an imaging pixel 22. Each of the sub-pixels 21R, 21G, and 21B has a light-emitting element that functions as a display element. The imaging pixel 22 has a light-receiving element that functions as a photoelectric conversion element. The imaging pixel 22 having a light-receiving element is one form of a sensor pixel.

[0064] The pixel 30 is electrically connected to the wiring GL, the wiring SLR, the wiring SLG, the wiring SLB, the wiring TX, the wiring SE, the wiring RS, the wiring WX, etc. The wirings SLR, the wiring SLG, and the wiring SLB are electrically connected to the drive circuit unit 12. The wiring GL is electrically connected to the drive circuit unit 13. The drive circuit unit 12 functions as a source line drive circuit (also referred to as a source driver). The drive circuit unit 13 functions as a gate line drive circuit (also referred to as a gate driver).

[0065] The pixel 30 has subpixels 21R, 21G, and 21B. For example, the subpixel 21R is a subpixel that exhibits red, the subpixel 21G is a subpixel that exhibits green, and the subpixel 21B is a subpixel that exhibits blue. This allows the display device 10 to perform full-color display. Note that, although an example in which the pixel 30 has subpixels of three colors is shown here, the pixel 30 may have subpixels of four or more colors.

[0066] Subpixel 21R has a light-emitting element that emits red light. Subpixel 21G has a light-emitting element that emits green light. Subpixel 21B has a light-emitting element that emits blue light. Note that pixel 30 may have subpixels that have light-emitting elements that emit other light. For example, pixel 30 may have, in addition to the above three subpixels, a subpixel that has a light-emitting element that emits white light or a subpixel that has a light-emitting element that emits yellow light.

[0067] The wiring GL is electrically connected to the sub-pixels 21R, 21G, and 21B arranged in the row direction (extension direction of the wiring GL). The wiring SLR, wiring SLG, and wiring SLB are electrically connected to the sub-pixels 21R, 21G, and 21B (not shown) arranged in the column direction (extension direction of the wiring SLR, etc.), respectively.

[0068] The imaging pixel 22 of the pixel 30 is electrically connected to the wiring TX, wiring SE, wiring RS, and wiring WX. The wiring TX, wiring SE, and wiring RS are each electrically connected to the drive circuit unit 14, and the wiring WX is electrically connected to the circuit unit 15.

[0069] The drive circuit unit 14 has a function of generating signals for driving the imaging pixels 22 and outputting them to the imaging pixels 22 via the wirings SE, TX, and RS. The circuit unit 15 has a function of receiving signals output from the imaging pixels 22 via the wirings WX and outputting them to the outside as image data. The circuit unit 15 functions as a readout circuit.

[0070] 2A, by arranging pixels 30, each including an imaging pixel 22, in a matrix, the display resolution (number of pixels) and the imaging resolution (number of pixels) can be made the same. Note that high resolution may not be necessary when the imaging pixel 22 is used only for the function of a touch panel. In such a case, a configuration may be used in which pixels 30 including an imaging pixel 22 are mixed with pixels that do not include the imaging pixel 22 (i.e., pixels consisting of sub-pixels 21R, 21G, and 21B).

[0071] [Pixel circuit configuration example 2-1] 2B shows an example of a circuit diagram of a pixel 21 that can be applied to the subpixels 21R, 21G, and 21B. The pixel 21 includes a transistor M1, a transistor M2, a transistor M3, a capacitor C1, and a light-emitting element EL. A wiring GL and a wiring SL are electrically connected to the pixel 21. The wiring SL corresponds to any one of the wirings SLR, SLG, and SLB shown in FIG. 2A.

[0072] The transistor M1 has a gate electrically connected to a wiring GL, one of a source and a drain electrically connected to a wiring SL, and the other electrically connected to one electrode of a capacitor C1 and the gate of the transistor M2. The transistor M2 has one of a source and a drain electrically connected to a wiring AL, and the other of the source and drain electrically connected to one electrode of a light-emitting element EL, the other electrode of the capacitor C1, and one of a source and a drain of the transistor M3. The transistor M3 has a gate electrically connected to a wiring GL, and the other of the source and drain electrically connected to a wiring RL. The light-emitting element EL has the other electrode electrically connected to a wiring CL.

[0073] The transistors M1 and M3 function as switches, and the transistor M2 functions as a transistor for controlling the current flowing through the light-emitting element EL.

[0074] Here, it is preferable that all of the transistors M1 to M3 be transistors in which low-temperature polysilicon (LTPS) is used for a semiconductor layer in which a channel is formed (LTPS transistors). Alternatively, it is preferable that the transistors M1 and M3 be OS transistors and the transistor M2 be an LTPS transistor.

[0075] The OS transistor may be a transistor including an oxide semiconductor in a semiconductor layer in which a channel is formed. The semiconductor layer preferably contains, for example, indium, M (M is one or more selected from gallium, aluminum, silicon, boron, yttrium, tin, copper, vanadium, beryllium, titanium, iron, nickel, germanium, zirconium, molybdenum, lanthanum, cerium, neodymium, hafnium, tantalum, tungsten, and magnesium), and zinc. In particular, M is preferably one or more selected from aluminum, gallium, yttrium, and tin. In particular, an oxide containing indium (In), gallium (Ga), and zinc (Zn) (also referred to as IGZO) is preferably used for the semiconductor layer of the OS transistor. Alternatively, an oxide containing indium (In), tin (Sn), and zinc (Zn) is preferably used. Alternatively, an oxide containing indium (In), gallium (Ga), tin (Sn), and zinc (Zn) is preferably used.

[0076] A transistor using an oxide semiconductor, which has a wider band gap and a lower carrier density than silicon, can achieve an extremely small off-state current. Therefore, the small off-state current allows charge stored in a capacitor connected in series with the transistor to be held for a long period of time. Therefore, it is preferable to use transistors including oxide semiconductors for the transistors M1 and M3 connected in series with the capacitor C1. Using transistors including oxide semiconductors as the transistors M1 and M3 can prevent charge stored in the capacitor C1 from leaking through the transistor M1 or M3. Furthermore, because charge stored in the capacitor C1 can be held for a long period of time, a still image can be displayed for a long period of time without rewriting data in the pixel 21.

[0077] The wiring SL is supplied with a data potential D. The wiring GL is supplied with a selection signal. The selection signal includes a potential that turns on a transistor and a potential that turns off a transistor.

[0078] A reset potential is applied to the wiring RL. An anode potential is applied to the wiring AL. A cathode potential is applied to the wiring CL. In the pixel 21, the anode potential is higher than the cathode potential. The reset potential applied to the wiring RL can be a potential such that the potential difference between the reset potential and the cathode potential is smaller than the threshold voltage of the light-emitting element EL. The reset potential can be a potential higher than the cathode potential, the same as the cathode potential, or a potential lower than the cathode potential.

[0079] [Driving method example 2-1] Next, an example of a driving method when the configuration of the pixel 21 shown in FIG. 2B is applied to the subpixels 21R, 21G, and 21B shown in FIG. 2A will be described using the timing chart shown in FIG. 3A.

[0080] In the following description, the pixels 30 are assumed to be arranged in a matrix of M rows and N columns. That is, the display device 10 is provided with M lines GL and N lines SLR. In the following description, when multiple lines are to be distinguished from one another, they will be indicated by adding a number to the reference symbol. Unless otherwise specified, when multiple lines are not to be distinguished from one another, or when matters common to multiple lines are being described, the lines will be indicated without adding a number to the reference symbol.

[0081] FIG. 3A shows examples of signals input to the wiring GL[1] in the first row, the wiring GL[M] in the Mth row, the wiring SLR, the wiring SLG, and the wiring SLB.

[0082] <Before time T11> Before time T11, the subpixels 21R, 21G, and 21B are in a non-selected state. Before time T11, a potential (here, a low-level potential) that turns off the transistor M1 is applied to all the lines GL. The state before time T11 shown on the left side of FIG. 3A corresponds to an off period.

[0083] <Period T11-T12> The period from time T11 to time T12 corresponds to a period during which data is written to the subpixel 21R (R writing period). At time T11, a potential (here, a high-level potential) that turns on the transistors M1 and M2 is applied to the line GL[1], and a data potential D R At this time, the transistor M1 in the subpixel 21R is turned on, and a data potential is applied to the gate of the transistor M2 from the line SLR. Also, the transistor M3 is turned on, and a reset potential is applied to one electrode of the light-emitting element EL from the line RL. This prevents the light-emitting element EL from emitting light during the writing period.

[0084] In the R writing period, the first row to the Mth row are selected in sequence, and a data potential D R is written.

[0085] <Period T12-T13> The period from time T12 to time T13 corresponds to a display period (R lighting period) by the subpixel 21R. During the period T12-T13, a red image based on the written data is displayed.

[0086] <Period T13-T14> The period from time T13 to time T14 corresponds to a period (light-off period) in which the light-emitting elements of all pixels are turned off. At time T13, a high-level potential is applied to all of the lines GL[1] to GL[M]. At this time, a low-level potential is applied to the lines SLR, SLG, and SLB, so a low-level potential is written to all pixels.

[0087] <After time T14> The period after time T14 corresponds to a period during which data is written to the subpixel 21G (G writing period). In the G writing period, a data potential D G is given, it is the same as the R write period.

[0088] Thereafter, in the same manner as above, a G lighting period, an extinguishing period, a B writing period, a B lighting period, an extinguishing period, and so on, are performed, and then the period returns to the R writing period.

[0089] This concludes the description of the example method for driving the pixel 21.

[0090] [Pixel circuit configuration example 2-2] 2C shows an example of a circuit diagram of the imaging pixel 22. The imaging pixel 22 includes a transistor M5, a transistor M6, a transistor M7, a transistor M8, a capacitor C2, and a light receiving element PD.

[0091] The transistor M5 has a gate electrically connected to the wiring TX, one of a source and a drain electrically connected to the anode electrode of the light receiving element PD, and the other of the source and drain electrically connected to one of the source and drain of the transistor M6, a first electrode of the capacitor C2, and the gate of the transistor M7. The transistor M6 has a gate electrically connected to the wiring RS, and the other of the source and drain electrically connected to the wiring V1. The transistor M7 has one of a source and a drain electrically connected to the wiring V3, and the other of the source and drain electrically connected to one of the source and drain of the transistor M8. The transistor M8 has a gate electrically connected to the wiring SE, and the other of the source and drain electrically connected to the wiring WX. The light receiving element PD has a cathode electrode electrically connected to the wiring CL. The capacitor C2 has a second electrode electrically connected to the wiring V2.

[0092] The transistors M5, M6, and M8 function as switches, and the transistor M7 functions as an amplifier.

[0093] It is preferable that all of the transistors M5 to M8 be LTPS transistors. Alternatively, it is preferable that the transistors M5 and M6 be OS transistors and the transistor M7 be an LTPS transistor. In this case, the transistor M8 may be either an OS transistor or an LTPS transistor.

[0094] By using OS transistors as transistors M5 and M6, the potential held at the gate of transistor M7 based on the charge generated in light-receiving element PD can be prevented from leaking through transistor M5 or transistor M6.

[0095] For example, when imaging using the global shutter method, the period from the end of the charge transfer operation to the start of the readout operation (charge retention period) differs depending on the pixel. For example, when capturing an image in which all pixels have the same grayscale value, ideally, all pixels will obtain output signals with the same potential. However, if the length of the charge retention period differs from row to row, and the charge accumulated in the nodes of the pixels in each row leaks over time, the potential of the pixel output signals will differ from row to row, resulting in image data with different grayscale levels for each row. Therefore, by using OS transistors as transistors M5 and M6, the potential change at the nodes can be minimized. In other words, even when imaging using the global shutter method, the change in grayscale of the image data due to different charge retention periods can be minimized, thereby improving the quality of the captured image.

[0096] On the other hand, it is preferable to use an LTPS transistor using low-temperature polysilicon in the semiconductor layer for the transistor M7. LTPS transistors can achieve higher field-effect mobility than OS transistors and have excellent driving and current capabilities. Therefore, the transistor M7 can operate at a higher speed than the transistors M5 and M6. Using an LTPS transistor for the transistor M7 allows the transistor M8 to quickly output a small potential based on the amount of light received by the light-receiving element PD.

[0097] In other words, in the imaging pixel 22, transistors M5 and M6 have low leakage current, and transistor M7 has high driving capability, so that the charge received by the light receiving element PD and transferred via transistor M5 can be held without leakage and can be read out at high speed.

[0098] The transistor M8 functions as a switch that allows the output from the transistor M7 to flow to the wiring WX, and therefore does not necessarily require a small off-state current, high-speed operation, or the like, as in the transistors M5 to M7. Therefore, low-temperature polysilicon or an oxide semiconductor may be used for the semiconductor layer of the transistor M8.

[0099] Although the transistors are shown as n-channel transistors in FIGS. 2B and 2C, p-channel transistors can also be used.

[0100] Moreover, it is preferable that the transistors included in the pixel 21 and the imaging pixel 22 are formed side by side on the same substrate.

[0101] [Driving method example 2-2] An example of a method for driving the imaging pixel 22 shown in Fig. 2C will be described with reference to the timing chart shown in Fig. 3B. Fig. 3B shows signals input to the wiring TX, the wiring SE[1] in the first row, the wiring SE[M] in the Mth row, the wiring RS, and the wiring WX.

[0102] <Before time T21> Before time T21, a low-level potential is applied to the wiring TX, the wiring SE, and the wiring RS. The wiring WX is in a state where no data is output, and is shown here as a low-level potential. Note that a predetermined potential may be applied to the wiring WX.

[0103] <Period T21-T22> The period from time T21 to time T22 corresponds to an initialization period (also referred to as a reset period). At time T21, potentials (here, high-level potentials) that turn on the transistors are applied to the wiring TX and the wiring RS. Also, potentials (here, low-level potentials) that turn off the transistors are applied to the wiring SE.

[0104] At this time, the transistors M5 and M6 are turned on, so that a potential lower than the potential of the cathode electrode is applied to the anode electrode of the light receiving element PD from the wiring V1 via the transistors M6 and M5, i.e., a reverse bias voltage is applied to the light receiving element PD.

[0105] The potential of the wiring V1 is also supplied to the first electrode of the capacitor C2, and the capacitor C2 is charged.

[0106] <Period T22-T23> The period from time T22 to time T23 corresponds to an exposure period. At time T22, a low-level potential is applied to the wiring TX and the wiring RS, which causes the transistor M5 and the transistor M6 to be brought into a non-conductive state.

[0107] Because transistor M5 is in a non-conductive state, a reverse bias voltage is applied to light receiving element PD, and photoelectric conversion occurs due to the light incident on light receiving element PD, and charge is accumulated in the anode electrode of light receiving element PD.

[0108] The length of the exposure period may be set depending on the sensitivity of the light receiving element PD, the amount of incident light, etc., but it is preferable to set a period that is at least sufficiently longer than the initialization period.

[0109] During the period T22-T23, the transistors M5 and M6 are in a non-conductive state, so that the potential of the first electrode of the capacitor C2 is held at the low-level potential supplied from the wiring V1.

[0110] <Period T23-T24> The period from time T23 to time T24 corresponds to the transfer period. At time T23, a high-level potential is applied to the line TX. This causes the transistor M5 to become conductive, and the charge accumulated in the light-receiving element PD is transferred to the first electrode of the capacitor C2 via the transistor M5. This causes the potential of the node to which the first electrode of the capacitor C2 is connected to rise in accordance with the amount of charge accumulated in the light-receiving element PD. As a result, the gate of the transistor M7 is supplied with a potential corresponding to the amount of exposure of the light-receiving element PD.

[0111] <Period T24-T25> At time T24, a low-level potential is applied to the line TX. This turns off the transistor M5, and the node connected to the gate of the transistor M7 is set to a floating state. Because the light-receiving element PD is constantly exposed to light, turning off the transistor M5 after the transfer operation in the period T23-T24 is completed prevents the potential of the node connected to the gate of the transistor M7 from changing.

[0112] <Period T25-T26> The period from time T25 to time T corresponds to the readout period. At time T25, a high-level potential is first applied to the line SE[1], which turns on the transistor M8 in the imaging pixel 22 in the first row.

[0113] For example, the transistor M7 and a transistor included in the circuit unit 15 form a source follower circuit, and data can be read out. In this case, the data potential D S is determined according to the gate potential of the transistor M7. Specifically, the potential obtained by subtracting the threshold voltage of the transistor M7 from the gate potential of the transistor M7 is the data potential D S The potential is output to the wiring WX as a potential, and the potential is read out by a read circuit included in the circuit portion 15.

[0114] It is also possible to configure a common-source circuit with the transistor M7 and a transistor included in the circuit unit 15, and to read data using a read circuit included in the circuit unit 15.

[0115] The read operation is performed in order from the first row to the Mth row. M data potentials D S will be output in order.

[0116] <After time T26> At time T26, a low-level potential is applied to the line SE, which turns off the transistor M8. This completes the readout of data from the imaging pixels 22. After time T26, the readout operation of data from the next row onward is performed sequentially.

[0117] 3B, the exposure period and the readout period can be set separately, so that all of the imaging pixels 22 provided in the display unit 11 can be exposed simultaneously and then the data can be read out sequentially. This allows for so-called global shutter driving. When global shutter driving is performed, it is preferable to use transistors that function as switches in the imaging pixels 22 (particularly transistors M5 and M6) that use oxide semiconductors, which have extremely low leakage current in a non-conducting state.

[0118] Here, at least the exposure period shown in FIG. 3B corresponds to the imaging period in FIG. 1C. At least the readout period shown in FIG. 3B corresponds to the R readout period, G readout period, and B readout period in FIG. 1C. It is preferable to include the initialization period shown in FIG. 3B in the imaging period. Although the transfer period shown in FIG. 3B may be included in the R readout period, it is preferable to include it in the imaging period because the influence of electrical noise can be suppressed even during the transfer period.

[0119] While the above example illustrates reading data from all M×N imaging pixels 22, there are cases where high resolution is not necessary, such as when operating as a touch panel, i.e., when the purpose is to detect the position information of an object. In such cases, it is possible to read less data by thinning out the rows, columns, or rows and columns from which data is read. This shortens the readout time and enables a high frame frequency. For example, by reading only odd or even rows, the readout period can be halved. Furthermore, it is preferable to have a configuration in which the readout method can be switched between capturing high-resolution images (e.g., image scanning) and touch sensing.

[0120] The above is a description of an example of a method for driving the imaging pixels 22.

[0121] This embodiment mode can be implemented by appropriately combining at least a part thereof with other embodiment modes described in this specification.

[0122] (Embodiment 2) In this embodiment, a display device according to one embodiment of the present invention will be described. The method for driving the display device described in Embodiment 1 can be suitably applied to the display device exemplified below.

[0123] In one embodiment of the present invention, an organic EL element (also referred to as an organic EL device) is used as a light-emitting element, and an organic photodiode is used as a light-receiving element. The organic EL element and the organic photodiode can be formed on the same substrate. Therefore, the organic photodiode can be built into a display device using the organic EL element.

[0124] If all the layers constituting the organic EL element and the organic photodiode were to be fabricated separately, the number of film formation processes would be enormous. However, since the organic photodiode has many layers that can be configured in common with the organic EL element, the layers that can be configured in common can be formed in one go, thereby suppressing the increase in film formation processes.

[0125] For example, one of the pair of electrodes (common electrode) can be a layer common to the light-receiving element and the light-emitting element. It is also preferable that at least one of the hole injection layer, hole transport layer, electron transport layer, and electron injection layer be a layer common to the light-receiving element and the light-emitting element. Furthermore, the light-receiving element and the light-emitting element can have the same configuration, except that the light-receiving element has an active layer and the light-emitting element has an emitting layer. That is, a light-receiving element can be fabricated simply by replacing the emitting layer of the light-emitting element with an active layer. By having a common layer between the light-receiving element and the light-emitting element, the number of film formations and the number of masks can be reduced, thereby reducing the manufacturing process and manufacturing costs of the display device. Furthermore, a display device having a light-receiving element can be fabricated using existing display device manufacturing equipment and manufacturing methods.

[0126] Note that a layer common to a light-receiving element and a light-emitting element may have different functions in the light-emitting element and the light-receiving element. In this specification, components are named based on their functions in the light-emitting element. For example, a hole injection layer functions as a hole injection layer in the light-emitting element and functions as a hole transport layer in the light-receiving element. Similarly, an electron injection layer functions as an electron injection layer in the light-emitting element and functions as an electron transport layer in the light-receiving element. Furthermore, a layer common to a light-receiving element and a light-emitting element may have the same function in the light-emitting element and the light-receiving element. A hole transport layer functions as a hole transport layer in both the light-emitting element and the light-receiving element, and an electron transport layer functions as an electron transport layer in both the light-emitting element and the light-receiving element.

[0127] In addition, in the display device of one embodiment of the present invention, a subpixel that exhibits one of the colors may have a light-emitting / receiving element instead of a light-emitting element, and a subpixel that exhibits another color may have a light-emitting element. The light-emitting / receiving element is an element that has both a function of emitting light (light-emitting function) and a function of receiving light (light-receiving function). For example, when a pixel has three subpixels, namely, a red subpixel, a green subpixel, and a blue subpixel, at least one subpixel has a light-emitting / receiving element, and the other subpixels have a light-emitting element. Therefore, the display portion of the display device of one embodiment of the present invention has a function of displaying an image using both the light-emitting / receiving element and the light-emitting element.

[0128] By using a light-receiving / light-emitting element that serves as both a light-emitting element and a light-receiving element, a pixel can be given a light-receiving function without increasing the number of subpixels included in the pixel. This allows one or both of an imaging function and a sensing function to be added to the display portion of the display device while maintaining the aperture ratio of the pixel (aperture ratio of each subpixel) and the resolution of the display device. Therefore, the display device of one embodiment of the present invention can have a higher aperture ratio of the pixel and can easily achieve higher resolution than a display device in which a subpixel having a light-receiving element is provided separately from a subpixel having a light-emitting element.

[0129] Light-emitting and receiving elements can be fabricated by combining an organic EL element and an organic photodiode. For example, light-emitting and receiving elements can be fabricated by adding the active layer of an organic photodiode to the layered structure of an organic EL element. Furthermore, light-emitting and receiving elements fabricated by combining an organic EL element and an organic photodiode can suppress an increase in the number of film-forming steps by forming layers that can be configured in common with the organic EL element in a single step.

[0130] The display device of one embodiment of the present invention will be described in more detail below with reference to the drawings.

[0131] [Display device configuration example 1] [Configuration Example 1-1] 4A shows a schematic diagram of the display panel 200. The display panel 200 includes a substrate 201, a substrate 202, a light receiving element 212, a light emitting element 211R, a light emitting element 211G, a light emitting element 211B, a functional layer 203, and the like.

[0132] The light-emitting element 211R, the light-emitting element 211G, the light-emitting element 211B, and the light-receiving element 212 are provided between the substrate 201 and the substrate 202. The light-emitting element 211R, the light-emitting element 211G, and the light-emitting element 211B emit red (R), green (G), or blue (B) light, respectively. Note that hereinafter, when there is no need to distinguish between the light-emitting element 211R, the light-emitting element 211G, and the light-emitting element 211B, they may be referred to as the light-emitting element 211.

[0133] The display panel 200 has a plurality of pixels arranged in a matrix. Each pixel has one or more sub-pixels. Each sub-pixel has one light-emitting element. For example, a pixel may have three sub-pixels (e.g., three colors of R, G, and B, or three colors of yellow (Y), cyan (C), and magenta (M)), or four sub-pixels (e.g., four colors of R, G, B, and white (W), or four colors of R, G, B, and Y). Each pixel also has a light-receiving element 212. The light-receiving element 212 may be provided in all pixels or in some of the pixels. Alternatively, one pixel may have multiple light-receiving elements 212.

[0134] 4A shows a state in which finger 220 is approaching the surface of substrate 202. A part of the light emitted by light emitting element 211G is reflected by finger 220. Then, a part of the reflected light is incident on light receiving element 212, and it is possible to detect that finger 220 is approaching above substrate 202. In other words, display panel 200 can function as a non-contact touch panel. Note that, since it can detect even when finger 220 touches substrate 202, display panel 200 can also function as a contact-type touch panel (also simply referred to as a touch panel).

[0135] The functional layer 203 has a circuit for driving the light-emitting element 211R, the light-emitting element 211G, and the light-emitting element 211B, and a circuit for driving the light-receiving element 212. The functional layer 203 is provided with switches, transistors, capacitors, wiring, and the like. Note that when the light-emitting element 211R, the light-emitting element 211G, the light-emitting element 211B, and the light-receiving element 212 are driven by a passive matrix method, a configuration without switches, transistors, and the like may be adopted.

[0136] It is preferable that the display panel 200 has a function for detecting the fingerprint of a finger 220. Fig. 4B is a schematic enlarged view of a contact portion when the finger 220 is in contact with the substrate 202. Fig. 4B also shows light emitting elements 211 and light receiving elements 212 arranged alternately.

[0137] A fingerprint is formed by concave and convex portions of finger 220. Therefore, the convex portions of the fingerprint are in contact with substrate 202 as shown in FIG.

[0138] Light reflected from a surface or interface can be classified as specular or diffuse. Specular reflected light is highly directional, with the angle of incidence and the angle of reflection matching, while diffuse reflected light is less directional, with its intensity less dependent on the angle. The diffuse reflection component is dominant in the light reflected from the surface of the finger 220. On the other hand, the specular reflection component is dominant in the light reflected from the interface between the substrate 202 and the atmosphere.

[0139] The intensity of light reflected by the contact or non-contact surface between finger 220 and substrate 202 and incident on light receiving element 212 located directly below them is the sum of specularly reflected light and diffusely reflected light. As described above, at the concave portions of finger 220, substrate 202 and finger 220 do not come into contact, so specularly reflected light (indicated by solid arrows) is dominant, whereas at the convex portions, they come into contact, so diffusely reflected light (indicated by dashed arrows) from finger 220 is dominant. Therefore, the intensity of light received by light receiving element 212 located directly below the concave portions is higher than that of light receiving element 212 located directly below the convex portions. This makes it possible to capture an image of the fingerprint of finger 220.

[0140] A clear fingerprint image can be obtained by arranging the light receiving elements 212 at an interval smaller than the distance between two convex portions of a fingerprint, preferably the distance between adjacent concave and convex portions. Since the distance between concave and convex portions of a human fingerprint is approximately 200 μm, for example, the interval between the light receiving elements 212 is 400 μm or less, preferably 200 μm or less, more preferably 150 μm or less, even more preferably 100 μm or less, and even more preferably 50 μm or less, and is 1 μm or more, preferably 10 μm or more, and more preferably 20 μm or more.

[0141] An example of a fingerprint image captured by display panel 200 is shown in Fig. 4C. In Fig. 4C, the outline of finger 220 is indicated by a dashed line and the outline of contact area 221 is indicated by a dashed line within imaging area 223. Within contact area 221, a fingerprint 222 with high contrast can be captured due to differences in the amount of light incident on light receiving element 212.

[0142] Even when the finger 220 and the substrate 202 are not in contact with each other, the fingerprint can be imaged by capturing an image of the uneven shape of the fingerprint of the finger 220.

[0143] The display panel 200 can also function as a touch panel, a pen tablet, etc. Fig. 4D shows a state in which the tip of a stylus 225 is brought close to the substrate 202 and slid in the direction of the dashed arrow.

[0144] As shown in FIG. 4D, the diffused reflected light diffused by the tip of the stylus 225 is incident on the light receiving element 212 located at the part overlapping with the tip, thereby enabling the position of the tip of the stylus 225 to be detected with high accuracy.

[0145] 4E shows an example of a trajectory 226 of the stylus 225 detected by the display panel 200. The display panel 200 is capable of detecting the position of a detectable object such as the stylus 225 with high positional accuracy, and therefore is also capable of performing high-resolution drawing in drawing applications and the like. Furthermore, unlike when a capacitance-type touch sensor, an electromagnetic induction-type touch pen, or the like is used, the position of even a highly insulating detectable object can be detected, and therefore the material of the tip of the stylus 225 is not a factor, and various writing implements (for example, a brush, a glass pen, a feather pen, etc.) can be used.

[0146] 4F to 4H show an example of a pixel that can be applied to the display panel 200. FIG.

[0147] 4F and 4G each have a red (R) light-emitting element 211R, a green (G) light-emitting element 211G, a blue (B) light-emitting element 211B, and a light-receiving element 212. The pixel has a pixel circuit for driving the light-emitting element 211R, the light-emitting element 211G, the light-emitting element 211B, and the light-receiving element 212, respectively.

[0148] Fig. 4F shows an example in which three light-emitting elements and one light-receiving element are arranged in a 2 x 2 matrix. Fig. 4G shows an example in which three light-emitting elements are arranged in a row, and one horizontally elongated light-receiving element 212 is arranged below them.

[0149] 4H is an example of a pixel having a white (W) light-emitting element 211W. Here, four light-emitting elements are arranged in a row, and a light-receiving element 212 is arranged below them.

[0150] The pixel configuration is not limited to the above, and various arrangement methods can be adopted.

[0151] [Configuration Example 1-2] In the following, an example of a configuration including a light-emitting element that emits visible light, a light-emitting element that emits infrared light, and a light-receiving element will be described.

[0152] The display panel 200A shown in Fig. 5A includes a light-emitting element 211IR in addition to the configuration illustrated in Fig. 4A. The light-emitting element 211IR is a light-emitting element that emits infrared light IR. In this case, it is preferable to use an element that can receive at least the infrared light IR emitted by the light-emitting element 211IR as the light-receiving element 212. It is more preferable to use an element that can receive both visible light and infrared light as the light-receiving element 212.

[0153] As shown in FIG. 5A, when a finger 220 approaches the substrate 202, infrared light IR emitted from the light-emitting element 211IR is reflected by the finger 220, and a portion of the reflected light is incident on the light-receiving element 212, thereby obtaining position information of the finger 220.

[0154] 5B to 5D show examples of pixels applicable to the display panel 200A.

[0155] Fig. 5B shows an example in which three light-emitting elements are arranged in a row, and below them, light-emitting element 211IR and light-receiving element 212 are arranged side by side. Fig. 5C shows an example in which four light-emitting elements including light-emitting element 211IR are arranged in a row, and below them, light-receiving element 212 is arranged.

[0156] FIG. 5D shows an example in which three light-emitting elements and a light-receiving element 212 are arranged on all four sides with light-emitting element 211IR at the center.

[0157] In the pixels shown in FIGS. 5B to 5D, the positions of the light-emitting elements and the light-emitting elements and the light-receiving elements can be interchanged.

[0158] As described above, pixels with various arrangements can be applied to the display device of this embodiment mode.

[0159] [Device Structure] Next, detailed structures of a light-emitting element and a light-receiving element that can be used in the display device of one embodiment of the present invention will be described.

[0160] The display device of one embodiment of the present invention may be any of a top emission type that emits light in a direction opposite to a substrate on which a light-emitting element is formed, a bottom emission type that emits light toward a substrate on which a light-emitting element is formed, and a dual emission type that emits light to both sides.

[0161] In this embodiment, a top-emission display device will be described as an example.

[0162] In this specification, unless otherwise specified, even when describing a configuration having a plurality of elements (light-emitting elements, light-emitting layers, etc.), when describing matters common to each element, the alphabet will be omitted. For example, when describing matters common to light-emitting layer 283R and light-emitting layer 283G, etc., they may be referred to as light-emitting layer 283.

[0163] A display device 280A shown in FIG. 6A has a light receiving element 270PD, a light emitting element 270R that emits red (R) light, a light emitting element 270G that emits green (G) light, and a light emitting element 270B that emits blue (B) light.

[0164] Each light-emitting element has a pixel electrode 271, a hole injection layer 281, a hole transport layer 282, a light-emitting layer, an electron transport layer 284, an electron injection layer 285, and a common electrode 275 stacked in this order. Light-emitting element 270R has a light-emitting layer 283R, light-emitting element 270G has a light-emitting layer 283G, and light-emitting element 270B has a light-emitting layer 283B. Light-emitting layer 283R contains a light-emitting material that emits red light, light-emitting layer 283G contains a light-emitting material that emits green light, and light-emitting layer 283B contains a light-emitting material that emits blue light.

[0165] The light emitting element is an electroluminescent element that emits light toward the common electrode 275 when a voltage is applied between the pixel electrode 271 and the common electrode 275 .

[0166] The light receiving element 270PD has a pixel electrode 271, a hole injection layer 281, a hole transport layer 282, an active layer 273, an electron transport layer 284, an electron injection layer 285, and a common electrode 275 stacked in this order.

[0167] The light receiving element 270PD is a photoelectric conversion element that receives light incident from outside the display device 280A and converts it into an electrical signal.

[0168] In this embodiment, in both the light-emitting element and the light-receiving element, the pixel electrode 271 functions as an anode, and the common electrode 275 functions as a cathode. In other words, by applying a reverse bias between the pixel electrode 271 and the common electrode 275 and driving the light-receiving element, the light incident on the light-receiving element can be detected, an electric charge can be generated, and the electric charge can be extracted as a current.

[0169] In the display device of this embodiment, an organic compound is used for the active layer 273 of the light-receiving element 270PD. The layers of the light-receiving element 270PD other than the active layer 273 can be configured in common with the light-emitting element. Therefore, by simply adding a step of forming the active layer 273 to the manufacturing process of the light-emitting element, the light-receiving element 270PD can be formed in parallel with the formation of the light-emitting element. Furthermore, the light-emitting element and the light-receiving element 270PD can be formed on the same substrate. Therefore, the light-receiving element 270PD can be incorporated into the display device without significantly increasing the number of manufacturing steps.

[0170] The display device 280A shows an example in which the light receiving element 270PD and the light emitting element have a common configuration, except that the active layer 273 of the light receiving element 270PD and the light emitting layer 283 of the light emitting element are fabricated separately. However, the configuration of the light receiving element 270PD and the light emitting element is not limited to this. The light receiving element 270PD and the light emitting element may have layers fabricated separately from each other, in addition to the active layer 273 and the light emitting layer 283. It is preferable that the light receiving element 270PD and the light emitting element have one or more layers used in common (common layers). This allows the light receiving element 270PD to be incorporated into the display device without significantly increasing the number of manufacturing steps.

[0171] A conductive film that transmits visible light is used for the electrode from which light is extracted, between the pixel electrode 271 and the common electrode 275. It is preferable to use a conductive film that reflects visible light for the electrode from which light is not extracted.

[0172] The light-emitting element included in the display device of this embodiment preferably has a micro-optical resonator (microcavity) structure. Therefore, one of a pair of electrodes included in the light-emitting element preferably has an electrode that is transparent and reflective to visible light (semi-transmissive / semi-reflective electrode), and the other preferably has an electrode that is reflective to visible light (reflective electrode). When the light-emitting element has a microcavity structure, light emitted from the light-emitting layer can be resonated between both electrodes, thereby intensifying the light emitted from the light-emitting element.

[0173] The semi-transmitting / semi-reflective electrode can have a laminated structure of a reflective electrode and an electrode that is transparent to visible light (also called a transparent electrode).

[0174] The light transmittance of the transparent electrode is 40% or more. For example, it is preferable to use an electrode with a visible light (light with a wavelength of 400 nm or more and less than 750 nm) transmittance of 40% or more for the light emitting element. The visible light reflectance of the semi-transmissive / semi-reflective electrode is 10% or more and 95% or less, preferably 30% or more and 80% or less. The visible light reflectance of the reflective electrode is 40% or more and 100% or less, preferably 70% or more and 100% or less. In addition, the resistivity of these electrodes is 1×10 -2 When the light-emitting element emits near-infrared light (light with a wavelength of 750 nm or more and 1300 nm or less), the transmittance or reflectance of these electrodes for near-infrared light preferably satisfies the above-mentioned numerical range, similar to the transmittance or reflectance for visible light.

[0175] The light-emitting element has at least the light-emitting layer 283. The light-emitting element may further have, in addition to the light-emitting layer 283, a layer containing a substance with high hole-injection properties, a substance with high hole-transport properties, a hole-blocking material, a substance with high electron-transport properties, a substance with high electron-injection properties, an electron-blocking material, a bipolar substance (a substance with high electron-transport properties and high hole-transport properties), or the like.

[0176] For example, the light-emitting element and the light-receiving element may have one or more layers of the hole injection layer, hole transport layer, electron transport layer, and electron injection layer in common, or the light-emitting element and the light-receiving element may have one or more layers of the hole injection layer, hole transport layer, electron transport layer, and electron injection layer formed differently from each other.

[0177] The hole injection layer is a layer that injects holes from the anode into the hole transport layer and contains a material with high hole injection properties, such as a composite material containing a hole transport material and an acceptor material (electron acceptor material), or an aromatic amine compound (a compound having an aromatic amine skeleton).

[0178] In a light-emitting element, the hole transport layer is a layer that transports holes injected from the anode by the hole injection layer to the light-emitting layer. In a light-receiving element, the hole transport layer is a layer that transports holes generated in the active layer based on incident light to the anode. The hole transport layer is a layer that contains a hole transport material. The hole transport material is a material having a concentration of 1×10 -6 cm 2 A material having a hole mobility of 1 / Vs or more is preferred. Note that other materials can also be used as long as they have a higher hole transporting property than electron transporting property. As the hole transporting material, a material having a high hole transporting property, such as a π-electron-rich heteroaromatic compound (e.g., a carbazole derivative, a thiophene derivative, a furan derivative, etc.) or an aromatic amine compound, is preferred.

[0179] In a light-emitting element, the electron transport layer is a layer that transports electrons injected from the cathode by the electron injection layer to the light-emitting layer. In a light-receiving element, the electron transport layer is a layer that transports electrons generated in the active layer based on incident light to the cathode. The electron transport layer is a layer that contains an electron transporting material. The electron transporting material is a material having a 1×10 -6 cm 2 A substance having an electron mobility of 1 / Vs or more is preferred. Note that other substances can also be used as long as they have a higher electron transporting property than holes. Examples of electron-transporting materials that can be used include metal complexes having a quinoline skeleton, metal complexes having a benzoquinoline skeleton, metal complexes having an oxazole skeleton, and metal complexes having a thiazole skeleton, as well as oxadiazole derivatives, triazole derivatives, imidazole derivatives, oxazole derivatives, thiazole derivatives, phenanthroline derivatives, quinoline derivatives having a quinoline ligand, benzoquinoline derivatives, quinoxaline derivatives, dibenzoquinoxaline derivatives, pyridine derivatives, bipyridine derivatives, pyrimidine derivatives, and π-electron-deficient heteroaromatic compounds including nitrogen-containing heteroaromatic compounds.

[0180] The electron injection layer is a layer that injects electrons from the cathode to the electron transport layer and contains a material with high electron injection properties. Examples of the material with high electron injection properties include alkali metals, alkaline earth metals, and compounds thereof. Examples of the material with high electron injection properties include a composite material containing an electron transport material and a donor material (electron donor material).

[0181] The light-emitting layer 283 is a layer containing a light-emitting substance. The light-emitting layer 283 can have one or more types of light-emitting substances. As the light-emitting substance, a substance that emits light of a color such as blue, purple, blue-purple, green, yellow-green, yellow, orange, or red is appropriately used. Furthermore, as the light-emitting substance, a substance that emits near-infrared light can also be used.

[0182] Examples of light-emitting materials include fluorescent materials, phosphorescent materials, TADF materials, and quantum dot materials.

[0183] Examples of fluorescent materials include pyrene derivatives, anthracene derivatives, triphenylene derivatives, fluorene derivatives, carbazole derivatives, dibenzothiophene derivatives, dibenzofuran derivatives, dibenzoquinoxaline derivatives, quinoxaline derivatives, pyridine derivatives, pyrimidine derivatives, phenanthrene derivatives, and naphthalene derivatives.

[0184] Examples of phosphorescent materials include organometallic complexes (particularly iridium complexes) having a 4H-triazole skeleton, a 1H-triazole skeleton, an imidazole skeleton, a pyrimidine skeleton, a pyrazine skeleton, or a pyridine skeleton; organometallic complexes (particularly iridium complexes) having a phenylpyridine derivative having an electron-withdrawing group as a ligand; platinum complexes; and rare earth metal complexes.

[0185] The light-emitting layer 283 may contain one or more organic compounds (host materials, assist materials, etc.) in addition to a light-emitting substance (guest material). As the one or more organic compounds, one or both of a hole-transporting material and an electron-transporting material can be used. Furthermore, as the one or more organic compounds, a bipolar material or a TADF material can be used.

[0186] The light-emitting layer 283 preferably includes, for example, a phosphorescent material and a hole-transporting material and an electron-transporting material that are a combination that easily forms an exciplex. This structure allows efficient emission using Exciplex-Triplet Energy Transfer (ExTET), which is energy transfer from an exciplex to a light-emitting substance (phosphorescent material). By selecting a combination that forms an exciplex that emits light that overlaps with the wavelength of the lowest-energy absorption band of the light-emitting substance, the energy transfer becomes smooth and light emission can be achieved efficiently. This structure simultaneously enables high efficiency, low-voltage operation, and long life of the light-emitting element.

[0187] As a combination of materials that form an exciplex, it is preferable that the HOMO level (highest occupied molecular orbital level) of the hole-transporting material is equal to or higher than the HOMO level of the electron-transporting material. It is also preferable that the LUMO level (lowest unoccupied molecular orbital level) of the hole-transporting material is equal to or higher than the LUMO level of the electron-transporting material. The LUMO level and HOMO level of the material can be derived from the electrochemical properties (reduction potential and oxidation potential) of the material measured by cyclic voltammetry (CV).

[0188] The formation of exciplexes can be confirmed, for example, by comparing the emission spectra of the hole-transporting material, the electron-transporting material, and the mixed film of these materials and observing the phenomenon that the emission spectrum of the mixed film is shifted to longer wavelengths than the emission spectra of each material (or has a new peak at longer wavelengths). Alternatively, it can be confirmed by comparing the transient photoluminescence (PL) of the hole-transporting material, the transient PL of the electron-transporting material, and the mixed film of these materials and observing differences in transient response, such as the transient PL lifetime of the mixed film having a longer-lived component or a larger proportion of delayed components than the transient PL lifetimes of the individual materials. The above-mentioned transient PL can also be interpreted as transient electroluminescence (EL). In other words, the formation of exciplexes can also be confirmed by comparing the transient EL of the hole-transporting material, the transient EL of the electron-transporting material, and the mixed film of these materials and observing differences in transient response.

[0189] The active layer 273 includes a semiconductor. Examples of the semiconductor include inorganic semiconductors such as silicon and organic semiconductors including organic compounds. In this embodiment, an example in which an organic semiconductor is used as the semiconductor included in the active layer 273 is shown. By using an organic semiconductor, the light-emitting layer 283 and the active layer 273 can be formed by the same method (for example, vacuum deposition), which is preferable because it allows the use of a common manufacturing device.

[0190] The active layer 273 has an n-type semiconductor material, such as fullerene (e.g., C 60 , C 70Examples of electron-accepting organic semiconductor materials include fullerene derivatives and other fullerenes. Fullerenes have a soccer ball-like shape, which is energetically stable. Fullerenes have deep (low) HOMO and LUMO levels. Because fullerenes have a deep LUMO level, they have extremely high electron-accepting (acceptor) properties. Normally, when the π-electron conjugation (resonance) spreads on a plane, as in benzene, the electron-donating (donor) properties increase, but fullerenes have a spherical shape, so they have high electron-accepting properties despite the large spread of π-electrons. High electron-accepting properties allow charge separation to occur quickly and efficiently, making them useful as light-receiving elements. C 60 , C 70 Both have a wide absorption band in the visible light region, especially C 70 is C 60 It is preferred because it has a larger π-electron conjugated system and a wide absorption band in the long wavelength region compared to the above.

[0191] Furthermore, examples of n-type semiconductor materials include metal complexes having a quinoline skeleton, metal complexes having a benzoquinoline skeleton, metal complexes having an oxazole skeleton, metal complexes having a thiazole skeleton, oxadiazole derivatives, triazole derivatives, imidazole derivatives, oxazole derivatives, thiazole derivatives, phenanthroline derivatives, quinoline derivatives, benzoquinoline derivatives, quinoxaline derivatives, dibenzoquinoxaline derivatives, pyridine derivatives, bipyridine derivatives, pyrimidine derivatives, naphthalene derivatives, anthracene derivatives, coumarin derivatives, rhodamine derivatives, triazine derivatives, and quinone derivatives.

[0192] Examples of the p-type semiconductor material of the active layer 273 include electron-donating organic semiconductor materials such as copper(II) phthalocyanine (CuPc), tetraphenyldibenzoperiflanthene (DBP), zinc phthalocyanine (ZnPc), tin phthalocyanine (SnPc), and quinacridone.

[0193] Examples of p-type semiconductor materials include carbazole derivatives, thiophene derivatives, furan derivatives, compounds having an aromatic amine skeleton, etc. Examples of p-type semiconductor materials include naphthalene derivatives, anthracene derivatives, pyrene derivatives, triphenylene derivatives, fluorene derivatives, pyrrole derivatives, benzofuran derivatives, benzothiophene derivatives, indole derivatives, dibenzofuran derivatives, dibenzothiophene derivatives, indolocarbazole derivatives, porphyrin derivatives, phthalocyanine derivatives, naphthalocyanine derivatives, quinacridone derivatives, polyphenylenevinylene derivatives, polyparaphenylene derivatives, polyfluorene derivatives, polyvinylcarbazole derivatives, polythiophene derivatives, etc.

[0194] The HOMO level of the electron-donating organic semiconductor material is preferably shallower (higher) than the HOMO level of the electron-accepting organic semiconductor material, and the LUMO level of the electron-donating organic semiconductor material is preferably shallower (higher) than the LUMO level of the electron-accepting organic semiconductor material.

[0195] It is preferable to use a spherical fullerene as the electron-accepting organic semiconductor material and a planar organic semiconductor material as the electron-donating organic semiconductor material. Molecules with similar shapes tend to aggregate together, and when molecules of the same type aggregate, the energy levels of their molecular orbitals become close, which can improve carrier transport properties.

[0196] For example, the active layer 273 is preferably formed by co-evaporating an n-type semiconductor and a p-type semiconductor, or alternatively, the active layer 273 may be formed by laminating an n-type semiconductor and a p-type semiconductor.

[0197] The light-emitting element and the light-receiving element can be made of either a low-molecular-weight compound or a high-molecular-weight compound, and may contain an inorganic compound. The layers constituting the light-emitting element and the light-receiving element can be formed by a method such as vapor deposition (including vacuum vapor deposition), a transfer method, a printing method, an inkjet method, or a coating method.

[0198] Display device 280B shown in FIG. 6B differs from display device 280A in that light receiving element 270PD and light emitting element 270R have the same configuration.

[0199] The light receiving element 270PD and the light emitting element 270R have the active layer 273 and the light emitting layer 283R in common.

[0200] Here, it is preferable that light receiving element 270PD has a common configuration with a light emitting element that emits light of a longer wavelength than the light to be detected. For example, light receiving element 270PD configured to detect blue light can have the same configuration as one or both of light emitting element 270R and light emitting element 270G. For example, light receiving element 270PD configured to detect green light can have the same configuration as light emitting element 270R.

[0201] By using a common configuration for the light receiving element 270PD and the light emitting element 270R, the number of film formation steps and the number of masks can be reduced compared to a configuration in which the light receiving element 270PD and the light emitting element 270R have separate layers, thereby reducing the manufacturing steps and manufacturing costs of the display device.

[0202] Furthermore, by using a common configuration for the light receiving element 270PD and the light emitting element 270R, the margin for misalignment can be narrowed compared to a configuration in which the light receiving element 270PD and the light emitting element 270R have separate layers. This allows for an increased pixel aperture ratio, improving the light extraction efficiency of the display device. This also extends the life of the light emitting element. Furthermore, the display device can display high brightness. Furthermore, it also allows for higher resolution display devices.

[0203] Light-emitting layer 283R includes a light-emitting material that emits red light. Active layer 273 includes an organic compound that absorbs light with a wavelength shorter than red (for example, one or both of green light and blue light). Active layer 273 preferably includes an organic compound that does not easily absorb red light and absorbs light with a wavelength shorter than red. This allows red light to be extracted efficiently from light-emitting element 270R, and light-receiving element 270PD to detect light with a wavelength shorter than red with high accuracy.

[0204] Furthermore, in the display device 280B, an example is shown in which the light emitting element 270R and the light receiving element 270PD have the same configuration, but the light emitting element 270R and the light receiving element 270PD may have optical adjustment layers of different thicknesses.

[0205] [Display device configuration example 2] A detailed structure of a display device according to one embodiment of the present invention will be described below, particularly an example of a display device including a light-receiving element and a light-emitting element.

[0206] [Configuration Example 2-1] 7A shows a cross-sectional view of the display device 300 A. The display device 300 A includes a substrate 351, a substrate 352, a light receiving element 310, and a light emitting element 390.

[0207] The light-emitting element 390 has a pixel electrode 391, a buffer layer 312, a light-emitting layer 393, a buffer layer 314, and a common electrode 315 stacked in this order. The buffer layer 312 can have one or both of a hole injection layer and a hole transport layer. The light-emitting layer 393 contains an organic compound. The buffer layer 314 can have one or both of an electron injection layer and an electron transport layer. The light-emitting element 390 has a function of emitting visible light 321. Note that the display device 300A may further have a light-emitting element that has a function of emitting infrared light.

[0208] The light receiving element 310 has a pixel electrode 311, a buffer layer 312, an active layer 313, a buffer layer 314, and a common electrode 315 stacked in this order. The active layer 313 contains an organic compound. The light receiving element 310 has a function of detecting visible light. The light receiving element 310 may also have a function of detecting infrared light.

[0209] The buffer layer 312, the buffer layer 314, and the common electrode 315 are layers common to the light-emitting element 390 and the light-receiving element 310, and are provided across these elements. The buffer layer 312, the buffer layer 314, and the common electrode 315 have portions that overlap with the active layer 313 and the pixel electrode 311, portions that overlap with the light-emitting layer 393 and the pixel electrode 391, and portions that do not overlap with either.

[0210] In the present embodiment, the pixel electrode functions as an anode and the common electrode 315 functions as a cathode in both the light-emitting element 390 and the light-receiving element 310. In other words, by driving the light-receiving element 310 by applying a reverse bias between the pixel electrode 311 and the common electrode 315, the display device 300A can detect light incident on the light-receiving element 310, generate charges, and extract them as a current.

[0211] The pixel electrode 311, the pixel electrode 391, the buffer layer 312, the active layer 313, the buffer layer 314, the light-emitting layer 393, and the common electrode 315 may each have a single-layer structure or a multilayer structure.

[0212] The pixel electrode 311 and the pixel electrode 391 are each located on an insulating layer 414. Each pixel electrode can be formed using the same material and in the same process. Ends of the pixel electrode 311 and the pixel electrode 391 are covered with a partition wall 416. Two adjacent pixel electrodes are electrically insulated (or electrically separated) from each other by the partition wall 416.

[0213] An organic insulating film is suitable for the partition 416. Materials that can be used for the organic insulating film include acrylic resin, polyimide resin, epoxy resin, polyamide resin, polyimideamide resin, siloxane resin, benzocyclobutene resin, phenol resin, and precursors of these resins. The partition 416 is a layer that transmits visible light. Instead of the partition 416, a partition that blocks visible light may be provided.

[0214] The common electrode 315 is a layer that is used in common by the light receiving element 310 and the light emitting element 390 .

[0215] The materials and thicknesses of the pair of electrodes of the light-receiving element 310 and the pair of electrodes of the light-emitting element 390 can be made the same, which leads to reduction in manufacturing cost of the display device and simplification of the manufacturing process.

[0216] The display device 300A includes a light receiving element 310, a light emitting element 390, a transistor 331, a transistor 332, and the like between a pair of substrates (substrate 351 and substrate 352).

[0217] In the light-receiving element 310, the buffer layer 312, active layer 313, and buffer layer 314 located between the pixel electrode 311 and the common electrode 315 can also be called organic layers (layers containing an organic compound). The pixel electrode 311 preferably has a function of reflecting visible light. The common electrode 315 has a function of transmitting visible light. Note that, when the light-receiving element 310 is configured to detect infrared light, the common electrode 315 has a function of transmitting infrared light. Furthermore, the pixel electrode 311 preferably has a function of reflecting infrared light.

[0218] The light receiving element 310 has a function of detecting light. Specifically, the light receiving element 310 is a photoelectric conversion element that receives light 322 incident from outside the display device 300A and converts the received light into an electrical signal. The light 322 can also be said to be light emitted by the light emitting element 390 and reflected by an object. The light 322 may also be incident on the light receiving element 310 via a lens or the like provided in the display device 300A.

[0219] In the light-emitting element 390, the buffer layer 312, the light-emitting layer 393, and the buffer layer 314 located between the pixel electrode 391 and the common electrode 315 can be collectively referred to as an EL layer. The EL layer has at least the light-emitting layer 393. As described above, the pixel electrode 391 preferably has a function of reflecting visible light. Furthermore, the common electrode 315 has a function of transmitting visible light. Note that, when the display device 300A has a configuration including a light-emitting element that emits infrared light, the common electrode 315 has a function of transmitting infrared light. Furthermore, the pixel electrode 391 preferably has a function of reflecting infrared light.

[0220] It is preferable that a micro-optical resonator (microcavity) structure is applied to the light-emitting element included in the display device of this embodiment. The light-emitting element 390 may have an optical adjustment layer between the pixel electrode 391 and the common electrode 315. By applying the micro-resonator structure, it is possible to intensify and extract light of a specific color from each light-emitting element.

[0221] The light-emitting element 390 has a function of emitting visible light. Specifically, the light-emitting element 390 is an electroluminescent element that emits light (here, visible light 321) toward the substrate 352 by applying a voltage between the pixel electrode 391 and the common electrode 315.

[0222] The pixel electrode 311 of the light-receiving element 310 is electrically connected to the source or drain of the transistor 331 through an opening provided in the insulating layer 414. The pixel electrode 391 of the light-emitting element 390 is electrically connected to the source or drain of the transistor 332 through an opening provided in the insulating layer 414.

[0223] The transistor 331 and the transistor 332 are adjacent to each other on the same layer (substrate 351 in FIG. 7A).

[0224] At least a part of the circuit electrically connected to the light receiving element 310 is preferably formed using the same material and in the same process as the circuit electrically connected to the light emitting element 390. This allows the display device to be thinner and the manufacturing process to be simplified compared to when the two circuits are formed separately.

[0225] Preferably, the light receiving element 310 and the light emitting element 390 are each covered with a protective layer 395. In FIG. 7A, the protective layer 395 is provided on and in contact with the common electrode 315. Providing the protective layer 395 can prevent impurities such as water from entering the light receiving element 310 and the light emitting element 390, thereby improving the reliability of the light receiving element 310 and the light emitting element 390. In addition, the protective layer 395 and the substrate 352 are bonded together by an adhesive layer 342.

[0226] A light-shielding layer 358 is provided on the surface of the substrate 352 facing the substrate 351. The light-shielding layer 358 has openings at positions overlapping the light-emitting element 390 and the light-receiving element 310.

[0227] Here, the light receiving element 310 detects light emitted by the light emitting element 390 and reflected by the object. However, there is a case where the light emitted by the light emitting element 390 is reflected within the display device 300A and enters the light receiving element 310 without passing through the object. The light blocking layer 358 can suppress the influence of such stray light. For example, if the light blocking layer 358 is not provided, the light 323 emitted by the light emitting element 390 may be reflected by the substrate 352, and the reflected light 324 may enter the light receiving element 310. By providing the light blocking layer 358, it is possible to prevent the reflected light 324 from entering the light receiving element 310. This reduces noise and improves the sensitivity of the sensor using the light receiving element 310.

[0228] The light-shielding layer 358 can be made of a material that blocks light emitted from the light-emitting elements. The light-shielding layer 358 preferably absorbs visible light. For example, the light-shielding layer 358 can be made of a black matrix using a metal material or a resin material containing a pigment (such as carbon black) or a dye. The light-shielding layer 358 may have a laminated structure of red, green, and blue color filters.

[0229] [Configuration Example 2-2] The display device 300B shown in FIG. 7B differs from the display device 300A described above mainly in that it has a lens 349.

[0230] Lens 349 is provided on the substrate 351 side of substrate 352. Light 322 incident from the outside is incident on light receiving element 310 via lens 349. It is preferable that lens 349 and substrate 352 are made of a material that is highly transparent to visible light.

[0231] Light is incident on the light receiving element 310 via the lens 349, thereby narrowing the range of light incident on the light receiving element 310. This makes it possible to prevent the imaging ranges of the multiple light receiving elements 310 from overlapping, and to capture clear images with little blur.

[0232] Furthermore, the lens 349 can condense the incident light, thereby increasing the amount of light incident on the light receiving element 310. This increases the photoelectric conversion efficiency of the light receiving element 310.

[0233] [Configuration Example 2-3] The display device 300C shown in FIG. 7C differs from the display device 300A described above mainly in that the shape of the light-shielding layer 358 is different.

[0234] The light-shielding layer 358 is provided such that, in a plan view, the opening overlapping the light-receiving element 310 is located inside the light-receiving region of the light-receiving element 310. The smaller the diameter of the opening of the light-shielding layer 358 overlapping with the light-receiving element 310, the narrower the range of light incident on the light-receiving element 310 can be. This makes it possible to prevent the imaging ranges of the multiple light-receiving elements 310 from overlapping, allowing for the capture of clear images with little blur.

[0235] For example, the area of ​​the opening in the light-shielding layer 358 can be 80% or less, 70% or less, 60% or less, 50% or less, or 40% or less of the area of ​​the light-receiving region of the light-receiving element 310, and can be 1% or more, 5% or more, or 10% or more. The smaller the area of ​​the opening in the light-shielding layer 358, the clearer the image can be captured. On the other hand, if the area of ​​the opening is too small, the amount of light reaching the light-receiving element 310 may decrease, resulting in a decrease in light-receiving sensitivity. Therefore, it is preferable to set the area appropriately within the above-mentioned range. Note that the above-mentioned upper and lower limits can be combined arbitrarily. Furthermore, the light-receiving region of the light-receiving element 310 can be rephrased as the opening in the partition wall 416.

[0236] The center of the opening of the light-shielding layer 358 that overlaps with the light-receiving element 310 may be offset from the center of the light-receiving region of the light-receiving element 310 in a planar view. Furthermore, the opening of the light-shielding layer 358 may not overlap with the light-receiving region of the light-receiving element 310 in a planar view. This allows the light-receiving element 310 to receive only obliquely directed light that has passed through the opening of the light-shielding layer 358. This makes it possible to more effectively limit the range of light that enters the light-receiving element 310, thereby enabling a clear image to be captured.

[0237] [Configuration Example 2-4] The display device 300D shown in FIG. 8A differs from the display device 300A described above mainly in that the buffer layer 312 is not a common layer.

[0238] The light receiving element 310 has a pixel electrode 311, a buffer layer 312, an active layer 313, a buffer layer 314, and a common electrode 315. The light emitting element 390 has a pixel electrode 391, a buffer layer 392, a light emitting layer 393, a buffer layer 314, and a common electrode 315. The active layer 313, the buffer layer 312, the light emitting layer 393, and the buffer layer 392 each have an island-shaped top surface.

[0239] Buffer layer 312 and buffer layer 392 may comprise different materials or the same materials.

[0240] In this way, by forming separate buffer layers for the light-emitting element 390 and the light-receiving element 310, the degree of freedom in selecting materials for the buffer layers used for the light-emitting element 390 and the light-receiving element 310 is increased, making optimization easier. Furthermore, by using the buffer layer 314 and the common electrode 315 as a common layer, the manufacturing process is simplified and manufacturing costs can be reduced compared to when the light-emitting element 390 and the light-receiving element 310 are manufactured separately.

[0241] [Configuration Example 2-5] A display device 300E shown in FIG. 8B differs from the display device 300A described above mainly in that the buffer layer 314 is not a common layer.

[0242] The light-receiving element 310 has a pixel electrode 311, a buffer layer 312, an active layer 313, a buffer layer 314, and a common electrode 315. The light-emitting element 390 has a pixel electrode 391, a buffer layer 312, a light-emitting layer 393, a buffer layer 394, and a common electrode 315. The active layer 313, the buffer layer 314, the light-emitting layer 393, and the buffer layer 394 each have an island-shaped top surface.

[0243] Buffer layer 314 and buffer layer 394 may comprise different materials or the same materials.

[0244] In this way, by forming separate buffer layers for the light-emitting element 390 and the light-receiving element 310, the degree of freedom in selecting the materials for the buffer layers used for the light-emitting element 390 and the light-receiving element 310 is increased, making optimization easier. Furthermore, by using the buffer layer 312 and the common electrode 315 as a common layer, the manufacturing process is simplified and manufacturing costs can be reduced compared to when the light-emitting element 390 and the light-receiving element 310 are manufactured separately.

[0245] [Configuration Example 2-6] A display device 300F shown in FIG. 8C differs from the display device 300A described above mainly in that the buffer layer 312 and the buffer layer 314 are not a common layer.

[0246] The light-receiving element 310 has a pixel electrode 311, a buffer layer 312, an active layer 313, a buffer layer 314, and a common electrode 315. The light-emitting element 390 has a pixel electrode 391, a buffer layer 392, a light-emitting layer 393, a buffer layer 394, and a common electrode 315. The buffer layer 312, the active layer 313, the buffer layer 314, the buffer layer 392, the light-emitting layer 393, and the buffer layer 394 each have an island-shaped top surface.

[0247] In this way, by forming separate buffer layers for the light-emitting element 390 and the light-receiving element 310, the degree of freedom in selecting materials for the buffer layers used for the light-emitting element 390 and the light-receiving element 310 is increased, making optimization easier. Furthermore, by using the common electrode 315 as a common layer, the manufacturing process is simplified and manufacturing costs can be reduced compared to when the light-emitting element 390 and the light-receiving element 310 are manufactured separately.

[0248] [Display device configuration example 3] A more specific structure of the display device of one embodiment of the present invention will be described below.

[0249] FIG. 9 shows a perspective view of display device 400, and FIG. 10A shows a cross-sectional view of display device 400.

[0250] The display device 400 has a configuration in which a substrate 353 and a substrate 354 are bonded together. In Fig. 9, the substrate 354 is clearly indicated by a dashed line.

[0251] The display device 400 includes a display unit 362, a circuit 364, wiring 365, etc. Fig. 9 shows an example in which an IC (integrated circuit) 373 and an FPC 372 are mounted on the display device 400. Therefore, the configuration shown in Fig. 9 can also be said to be a display module including the display device 400, an IC, and an FPC.

[0252] The circuit 364 can be, for example, a scanning line driver circuit.

[0253] The wiring 365 has a function of supplying signals and power to the display unit 362 and the circuit 364. The signals and power are input to the wiring 365 from the outside via the FPC 372 or input to the wiring 365 from the IC 373.

[0254] 9 shows an example in which an IC 373 is provided on a substrate 353 by a COG (Chip On Glass) method or a COF (Chip On Film) method. The IC 373 may be, for example, an IC having a scanning line driver circuit or a signal line driver circuit. The display device 400 and the display module may not include an IC. Alternatively, the IC may be mounted on an FPC by a COF method or the like.

[0255] Figure 10A shows an example of a cross section of the display device 400 shown in Figure 9, with a portion of the area including the FPC 372, a portion of the area including the circuit 364, a portion of the area including the display unit 362, and a portion of the area including the end portion cut away.

[0256] A display device 400 shown in FIG. 10A includes a transistor 408, a transistor 409, a transistor 410, a light-emitting element 390, a light-receiving element 310, and the like between a substrate 353 and a substrate 354.

[0257] The substrate 354 and the protective layer 395 are bonded together via an adhesive layer 342, and a solid sealing structure is applied to the display device 400.

[0258] The substrate 353 and the insulating layer 412 are bonded together by an adhesive layer 355 .

[0259] The display device 400 is manufactured by first bonding a fabrication substrate provided with an insulating layer 412, each transistor, the light-receiving element 310, the light-emitting element 390, and the like to a substrate 354 provided with a light-shielding layer 358 and the like with an adhesive layer 342. Then, the fabrication substrate is peeled off, and a substrate 353 is bonded to the exposed surface using an adhesive layer 355, thereby transferring each component formed on the fabrication substrate to the substrate 353. The substrate 353 and the substrate 354 are preferably flexible. This can increase the flexibility of the display device 400.

[0260] The light-emitting element 390 has a layered structure in which a pixel electrode 391, a buffer layer 312, a light-emitting layer 393, a buffer layer 314, and a common electrode 315 are stacked in this order from the insulating layer 414 side. The pixel electrode 391 is connected to one of the source and the drain of the transistor 408 through an opening provided in the insulating layer 414. The transistor 408 has a function of controlling current flowing in the light-emitting element 390.

[0261] The light-receiving element 310 has a layered structure in which a pixel electrode 311, a buffer layer 312, an active layer 313, a buffer layer 314, and a common electrode 315 are stacked in this order from the insulating layer 414 side. The pixel electrode 311 is connected to one of the source and drain of the transistor 409 through an opening provided in the insulating layer 414. The transistor 409 has a function of controlling transfer of charges accumulated in the light-receiving element 310.

[0262] Light emitted by light emitting element 390 is emitted toward substrate 354. Light is incident on light receiving element 310 via substrate 354 and adhesive layer 342. It is preferable that substrate 354 be made of a material that is highly transparent to visible light.

[0263] The pixel electrode 311 and the pixel electrode 391 can be manufactured using the same material and in the same process. The buffer layer 312, the buffer layer 314, and the common electrode 315 are used in common for the light receiving element 310 and the light emitting element 390. The light receiving element 310 and the light emitting element 390 can have the same configuration except for the configurations of the active layer 313 and the light emitting layer 393. This allows the light receiving element 310 to be built into the display device 400 without significantly increasing the number of manufacturing processes.

[0264] A light-shielding layer 358 is provided on the surface of substrate 354 facing substrate 353. Light-shielding layer 358 has openings at positions overlapping with light-emitting element 390 and light-receiving element 310. By providing light-shielding layer 358, the range in which light is detected by light-receiving element 310 can be controlled. As described above, it is preferable to control the light incident on light-receiving element 310 by adjusting the position and area of ​​the opening in the light-shielding layer provided at a position overlapping with light-receiving element 310. Furthermore, by providing light-shielding layer 358, it is possible to prevent light from being directly incident on light-receiving element 310 from light-emitting element 390 without passing through an object. Therefore, a sensor with low noise and high sensitivity can be realized.

[0265] The edges of the pixel electrode 311 and the pixel electrode 391 are covered with a partition wall 416. The pixel electrode 311 and the pixel electrode 391 contain a material that reflects visible light, and the common electrode 315 contains a material that transmits visible light.

[0266] 10A shows an example in which there is a region where part of the active layer 313 overlaps part of the light emitting layer 393. The overlapping portion of the active layer 313 and the light emitting layer 393 preferably overlaps with the light blocking layer 358 and the partition wall 416.

[0267] The transistor 408, the transistor 409, and the transistor 410 are all formed over a substrate 353. These transistors can be manufactured using the same material and the same process.

[0268] An insulating layer 412, an insulating layer 411, an insulating layer 425, an insulating layer 415, an insulating layer 418, and an insulating layer 414 are provided over a substrate 353 with an adhesive layer 355 interposed therebetween. Parts of the insulating layer 411 and the insulating layer 425 each function as a gate insulating layer of each transistor. The insulating layer 415 and the insulating layer 418 are provided to cover the transistor. The insulating layer 414 is provided to cover the transistor and functions as a planarization layer. Note that the number of gate insulating layers and the number of insulating layers covering the transistors are not limited, and each may be a single layer or two or more layers.

[0269] It is preferable that at least one insulating layer covering the transistor is made of a material that is resistant to the diffusion of impurities such as water and hydrogen. This allows the insulating layer to function as a barrier layer. With this structure, it is possible to effectively prevent impurities from diffusing into the transistor from the outside, thereby improving the reliability of the display device.

[0270] The insulating layer 411, the insulating layer 412, the insulating layer 425, the insulating layer 415, and the insulating layer 418 are preferably formed using an inorganic insulating film. Examples of the inorganic insulating film that can be used include a silicon nitride film, a silicon oxynitride film, a silicon oxide film, a silicon nitride oxide film, an aluminum oxide film, and an aluminum nitride film. A hafnium oxide film, a hafnium oxynitride film, a hafnium nitride oxide film, an yttrium oxide film, a zirconium oxide film, a gallium oxide film, a tantalum oxide film, a magnesium oxide film, a lanthanum oxide film, a cerium oxide film, and a neodymium oxide film may also be used. Two or more of the above insulating films may be stacked.

[0271] Here, organic insulating films often have lower barrier properties than inorganic insulating films. Therefore, it is preferable that the organic insulating film has an opening near the edge of the display device 400. In region 428 shown in FIG. 10A, an opening is formed in insulating layer 414. This makes it possible to prevent impurities from entering from the edge of the display device 400 via the organic insulating film. Alternatively, the organic insulating film may be formed so that the edge of the organic insulating film is located inside the edge of the display device 400, so that the organic insulating film is not exposed at the edge of the display device 400.

[0272] In a region 428 near the edge of the display device 400, the insulating layer 418 and the protective layer 395 preferably contact each other through the opening in the insulating layer 414. In particular, it is preferable that the inorganic insulating film of the insulating layer 418 and the inorganic insulating film of the protective layer 395 contact each other. This makes it possible to prevent impurities from entering the display unit 362 from the outside through the organic insulating film. Therefore, the reliability of the display device 400 can be improved.

[0273] An organic insulating film is suitable for the insulating layer 414, which functions as a planarizing layer. Materials that can be used for the organic insulating film include acrylic resin, polyimide resin, epoxy resin, polyamide resin, polyimideamide resin, siloxane resin, benzocyclobutene resin, phenol resin, and precursors of these resins.

[0274] By providing the protective layer 395 that covers the light emitting element 390 and the light receiving element 310, it is possible to prevent impurities such as water from entering the light emitting element 390 and the light receiving element 310, thereby improving their reliability.

[0275] The protective layer 395 may have a single layer or a laminated structure. For example, the protective layer 395 may have a laminated structure of an organic insulating film and an inorganic insulating film. In this case, it is preferable that the end of the inorganic insulating film extends further outward than the end of the organic insulating film.

[0276] FIG. 10B illustrates a cross-sectional view of a transistor 401a that can be used for the transistor 408, the transistor 409, and the transistor 410. In FIG.

[0277] The transistor 401a is provided over an insulating layer 412 (not shown) and includes a conductive layer 421 functioning as a first gate, an insulating layer 411 functioning as a first gate insulating layer, a semiconductor layer 431, an insulating layer 425 functioning as a second gate insulating layer, and a conductive layer 423 functioning as a second gate. The insulating layer 411 is located between the conductive layer 421 and the semiconductor layer 431. The insulating layer 425 is located between the conductive layer 423 and the semiconductor layer 431.

[0278] The semiconductor layer 431 has a region 431i and a pair of regions 431n. The region 431i functions as a channel formation region. One of the pair of regions 431n functions as a source and the other functions as a drain. The region 431n has a higher carrier concentration and higher conductivity than the region 431i. The conductive layer 422a and the conductive layer 422b are connected to the region 431n through openings provided in the insulating layer 418 and the insulating layer 415, respectively.

[0279] 10C is a cross-sectional view of a transistor 401b that can be used for the transistor 408, the transistor 409, and the transistor 410. FIG. 10C also shows an example in which the insulating layer 415 is not provided. In the transistor 401b, the insulating layer 425 is processed in a similar manner to the conductive layer 423, and the insulating layer 418 and the region 431n are in contact with each other.

[0280] Note that the structure of the transistor included in the display device of this embodiment is not particularly limited. For example, a planar transistor, a staggered transistor, an inverted staggered transistor, or the like can be used. Furthermore, either a top-gate transistor or a bottom-gate transistor structure may be used. Alternatively, gates may be provided above and below a semiconductor layer in which a channel is formed.

[0281] The transistors 408, 409, and 410 each have a structure in which a semiconductor layer in which a channel is formed is sandwiched between two gates. The two gates may be connected and supplied with the same signal to drive the transistors. Alternatively, the threshold voltage of the transistor may be controlled by applying a potential for controlling the threshold voltage to one of the two gates and a potential for driving to the other.

[0282] The crystallinity of a semiconductor material used for a transistor is not particularly limited, and any of an amorphous semiconductor, a single crystal semiconductor, and a crystalline semiconductor (a microcrystalline semiconductor, a polycrystalline semiconductor, or a semiconductor having a crystalline region in part) may be used. The use of a crystalline semiconductor is preferable because it can suppress deterioration of transistor characteristics.

[0283] The semiconductor layer of the transistor preferably contains a metal oxide (also referred to as an oxide semiconductor). Alternatively, the semiconductor layer of the transistor may contain silicon. Examples of silicon include amorphous silicon and crystalline silicon (such as low-temperature polysilicon and single-crystal silicon). Alternatively, transistors using different semiconductor layers may be combined. For example, a circuit may be configured by combining a transistor using low-temperature polysilicon (LTPS) and a transistor using an oxide semiconductor (OS). Such a technology may also be called LTPO (Low Temperature Polycrystalline Oxide) or Low Temperature Polysilicon and Oxide).

[0284] The semiconductor layer preferably contains, for example, indium, M (wherein M is one or more elements selected from gallium, aluminum, silicon, boron, yttrium, tin, copper, vanadium, beryllium, titanium, iron, nickel, germanium, zirconium, molybdenum, lanthanum, cerium, neodymium, hafnium, tantalum, tungsten, and magnesium), and zinc. In particular, M is preferably one or more elements selected from aluminum, gallium, yttrium, and tin.

[0285] In particular, it is preferable to use an oxide containing indium (In), gallium (Ga), and zinc (Zn) (also referred to as IGZO) as the semiconductor layer.

[0286] When the semiconductor layer is an In-M-Zn oxide, the atomic ratio of In in the In-M-Zn oxide is preferably equal to or greater than the atomic ratio of M. Examples of atomic ratios of metal elements in such In-M-Zn oxides include compositions in which In:M:Zn=1:1:1 or thereabouts, In:M:Zn=1:1:1.2 or thereabouts, In:M:Zn=2:1:3 or thereabouts, In:M:Zn=3:1:2 or thereabouts, In:M:Zn=4:2:3 or thereabouts, In:M:Zn=4:2:4.1 or thereabouts, In:M:Zn=5:1:3 or thereabouts, In:M:Zn=5:1:6 or thereabouts, In:M:Zn=5:1:7 or thereabouts, In:M:Zn=5:1:8 or thereabouts, In:M:Zn=6:1:6 or thereabouts, and In:M:Zn=5:2:5 or thereabouts, etc. Note that "nearby compositions" includes a range of ±30% of the desired atomic ratio.

[0287] For example, when describing a composition with an atomic ratio of In:Ga:Zn=4:2:3 or thereabout, this includes a case where, when the atomic ratio of In is 4, the atomic ratio of Ga is 1 to 3 and the atomic ratio of Zn is 2 to 4. Furthermore, when describing a composition with an atomic ratio of In:Ga:Zn=5:1:6 or thereabout, this includes a case where, when the atomic ratio of In is 5, the atomic ratio of Ga is greater than 0.1 and less than 2 and the atomic ratio of Zn is greater than 5 and less than 7. Furthermore, when describing a composition with an atomic ratio of In:Ga:Zn=1:1:1 or thereabout, this includes a case where, when the atomic ratio of In is 1, the atomic ratio of Ga is greater than 0.1 and less than 2 and the atomic ratio of Zn is greater than 0.1 and less than 2.

[0288] The transistor 410 included in the circuit 364 may have the same structure as the transistors 408 and 409 included in the display portion 362 or may have different structures. The transistors included in the circuit 364 may all have the same structure or may have two or more types of structures. Similarly, the transistors included in the display portion 362 may all have the same structure or may have two or more types of structures.

[0289] A connection portion 404 is provided in an area of ​​the substrate 353 where the substrate 354 does not overlap. In the connection portion 404, the wiring 365 is electrically connected to the FPC 372 via a conductive layer 366 and a connection layer 442. The conductive layer 366, which is obtained by processing the same conductive film as the pixel electrodes 311 and 391, is exposed on the upper surface of the connection portion 404. This allows the connection portion 404 and the FPC 372 to be electrically connected via the connection layer 442.

[0290] Various optical members can be disposed on the outside of substrate 354. Examples of optical members include a polarizing plate, a retardation plate, a light diffusion layer (such as a diffusion film), an anti-reflection layer, and a light collecting film. In addition, an antistatic film that suppresses the adhesion of dust, a water-repellent film that makes it difficult for dirt to adhere, a hard coat film that suppresses scratches caused by use, an impact absorbing layer, etc. may be disposed on the outside of substrate 354.

[0291] The flexibility of the display device can be increased by using a flexible material for the substrate 353 and the substrate 354. Furthermore, without being limited thereto, the substrate 353 and the substrate 354 can be made of glass, quartz, ceramic, sapphire, resin, or the like.

[0292] The adhesive layer can be made of various curable adhesives, such as photo-curable adhesives (e.g., ultraviolet curable), reactive curable adhesives, thermosetting adhesives, and anaerobic adhesives. Examples of such adhesives include epoxy resin, acrylic resin, silicone resin, phenolic resin, polyimide resin, imide resin, PVC (polyvinyl chloride) resin, PVB (polyvinyl butyral) resin, and EVA (ethylene vinyl acetate) resin. Materials with low moisture permeability, such as epoxy resin, are particularly preferred. Two-component resins may also be used. Adhesive sheets, etc., may also be used.

[0293] The connection layer may be made of an anisotropic conductive film (ACF), an anisotropic conductive paste (ACP), or the like.

[0294] Materials that can be used for conductive layers such as the gate, source, and drain of a transistor, as well as various wirings and electrodes that constitute a display device include metals such as aluminum, titanium, chromium, nickel, copper, yttrium, zirconium, molybdenum, silver, tantalum, and tungsten, and alloys containing these metals as main components, etc. Films containing these materials can be used as a single layer or a stacked layer structure.

[0295] Examples of light-transmitting conductive materials include conductive oxides such as indium oxide, indium tin oxide, indium zinc oxide, zinc oxide, and zinc oxide containing gallium, or graphene. Alternatively, metal materials such as gold, silver, platinum, magnesium, nickel, tungsten, chromium, molybdenum, iron, cobalt, copper, palladium, and titanium, and alloy materials containing these metal materials can be used. Alternatively, nitrides of these metal materials (e.g., titanium nitride) can be used. When using metal materials or alloy materials (or their nitrides), it is preferable to thin them thin enough to have light-transmitting properties. A stacked film of the above materials can also be used as the conductive layer. For example, a stacked film of an alloy of silver and magnesium and indium tin oxide is preferable because it can enhance conductivity. These can also be used as conductive layers such as various wirings and electrodes constituting a display device, conductive layers (conductive layers functioning as pixel electrodes, common electrodes, etc.) of light-emitting elements and light-receiving elements (or light-emitting / receiving elements), and the like.

[0296] Examples of insulating materials that can be used for each insulating layer include resins such as acrylic resin and epoxy resin, and inorganic insulating materials such as silicon oxide, silicon oxynitride, silicon nitride oxide, silicon nitride, and aluminum oxide.

[0297] This embodiment mode can be implemented by appropriately combining at least a part thereof with other embodiment modes described in this specification.

[0298] (Embodiment 3) In this embodiment, a circuit that can be used in a display device of one embodiment of the present invention will be described.

[0299] FIG. 11A is a block diagram of a pixel of a display device of one embodiment of the present invention.

[0300] The pixel includes an OLED, an OPD (organic photo diode), a sensor circuit (referred to as a sensing circuit), a driving transistor (referred to as a driving transistor), and a selection transistor (referred to as a switching transistor).

[0301] Light emitted from the OLED is reflected by an object (hereinafter referred to as "Object"), and the reflected light is received by the OPD, thereby capturing an image of the object. One embodiment of the present invention can function as a touch sensor, an image sensor, an image scanner, etc. One embodiment of the present invention can be applied to biometric authentication by capturing an image of a fingerprint, palm print, blood vessels (veins, etc.), etc. It can also capture an image of a printed matter with photographs, text, etc., or the surface of an object, and acquire the image information.

[0302] The drive transistor and selection transistor constitute a drive circuit for driving the OLED. The drive transistor has the function of controlling the current flowing through the OLED, allowing the OLED to emit light at a brightness corresponding to that current. The selection transistor has the function of controlling the selection and non-selection of pixels. The value (e.g., voltage value) of video data (referred to as Video Data) input from outside via the selection transistor controls the magnitude of the current flowing through the drive transistor and OLED, allowing the OLED to emit light at the desired brightness.

[0303] The sensor circuit corresponds to a drive circuit for controlling the operation of the OPD, and can control operations such as a reset operation that resets the potential of the OPD electrodes, an exposure operation that accumulates charge in the OPD according to the amount of light irradiated, a transfer operation that transfers the charge accumulated in the OPD to a node in the sensor circuit, and a readout operation that outputs a signal (e.g., voltage or current) according to the magnitude of the charge to an external readout circuit as sensing data (referred to as "Sensing Data").

[0304] The pixel shown in FIG. 11B differs from the above mainly in that it has a memory section (denoted as Memory) connected to the drive transistor.

[0305] Weight data (referred to as "Weight Data") is provided to the memory unit. Data obtained by adding together the video data input via the selection transistor and the weight data stored in the memory unit is provided to the drive transistor. The weight data stored in the memory unit can change the brightness of the OLED from the brightness when only video data is provided. Specifically, it is possible to increase or decrease the brightness of the OLED. For example, increasing the brightness of the OLED can increase the light receiving sensitivity of the sensor.

[0306] FIG. 11C shows an example of a pixel circuit that can be used in the sensor circuit.

[0307] 11C includes a light receiving element PD, a transistor M1, a transistor M2, a transistor M3, a transistor M4, and a capacitor C1. Here, an example is shown in which a photodiode is used as the light receiving element PD.

[0308] The cathode of the light-receiving element PD is electrically connected to the wiring V1, and the anode is electrically connected to one of the source and drain of the transistor M1. The gate of the transistor M1 is electrically connected to the wiring TX, and the other of the source and drain is electrically connected to one electrode of the capacitor C1, one of the source and drain of the transistor M2, and the gate of the transistor M3. The gate of the transistor M2 is electrically connected to the wiring RES, and the other of the source and drain is electrically connected to the wiring V2. The source and drain of the transistor M3 is electrically connected to the wiring V3, and the other of the source and drain is electrically connected to one of the source and drain of the transistor M4. The gate of the transistor M4 is electrically connected to the wiring SE, and the other of the source and drain is electrically connected to the wiring OUT1.

[0309] A constant potential is supplied to the wiring V1, wiring V2, and wiring V3. When the light-receiving element PD is driven with a reverse bias, a potential lower than the potential of the wiring V1 is supplied to the wiring V2. The transistor M2 is controlled by a signal supplied to the wiring RES and has the function of resetting the potential of the node connected to the gate of the transistor M3 to the potential supplied to the wiring V2. The transistor M1 is controlled by a signal supplied to the wiring TX and has the function of controlling the timing of transferring the charge accumulated in the light-receiving element PD to the node. The transistor M3 functions as an amplifying transistor that outputs according to the potential of the node. The transistor M4 is controlled by a signal supplied to the wiring SE and functions as a selection transistor that reads out the output according to the potential of the node to an external circuit connected to the wiring OUT1.

[0310] Here, the light receiving element PD corresponds to the OPD, and the potential or current output from the wiring OUT1 corresponds to the sensing data.

[0311] FIG. 11D shows an example of a pixel circuit for driving the above OLED.

[0312] 11D includes a light-emitting element EL, transistors M5, M6, and M7, and a capacitor C2. Here, an example is shown in which a light-emitting diode is used as the light-emitting element EL. In particular, it is preferable to use an organic EL element as the light-emitting element EL.

[0313] The light-emitting element EL corresponds to the OLED, the transistor M5 corresponds to the selection transistor, the transistor M6 corresponds to the drive transistor, and the wiring VS corresponds to the wiring to which the video data is input.

[0314] The transistor M5 has a gate electrically connected to the wiring VG, one of its source and drain electrically connected to the wiring VS, and the other of its source and drain electrically connected to one electrode of the capacitor C2 and the gate of the transistor M6. One of the source and drain of the transistor M6 is electrically connected to the wiring V4, and the other is electrically connected to the anode of the light-emitting element EL and one of the source and drain of the transistor M7. The transistor M7 has a gate electrically connected to the wiring MS, and the other of its source and drain electrically connected to the wiring OUT2. The cathode of the light-emitting element EL is electrically connected to the wiring V5.

[0315] A constant potential is supplied to the wiring V4 and the wiring V5. The anode side of the light-emitting element EL can be set to a high potential, and the cathode side can be set to a lower potential than the anode side. The transistor M5 is controlled by a signal supplied to the wiring VG and functions as a selection transistor for controlling the selection state of the pixel circuit PIX2. The transistor M6 also functions as a drive transistor for controlling the current flowing through the light-emitting element EL according to the potential supplied to its gate. When the transistor M5 is in a conductive state, the potential supplied to the wiring VS is supplied to the gate of the transistor M6, and the light emission brightness of the light-emitting element EL can be controlled according to the potential. The transistor M7 is controlled by a signal supplied to the wiring MS and has one or both of the following functions: setting the potential between the transistor M6 and the light-emitting element EL to the potential supplied to the wiring OUT2, and outputting the potential between the transistor M6 and the light-emitting element EL to the outside via the wiring OUT2.

[0316] FIG. 11E shows an example of a pixel circuit including a memory unit that can be applied to the configuration shown in FIG. 11B.

[0317] 11E has a configuration in which a transistor M8 and a capacitor C3 are added to the pixel circuit PIX2. In addition, in the pixel circuit PIX3, the line VS in the pixel circuit PIX2 is changed to a line VS1, and the line VG is changed to a line VG1.

[0318] The transistor M8 has a gate electrically connected to the wiring VG2, one of a source and a drain electrically connected to the wiring VS2, and the other electrically connected to one electrode of the capacitor C3. The other electrode of the capacitor C3 is electrically connected to the gate of the transistor M6, one electrode of the capacitor C2, and the other of the source and drain of the transistor M5.

[0319] The wiring VS1 corresponds to the wiring to which the video data is supplied. The wiring VS2 corresponds to the wiring to which the weight data is supplied. The node to which the gate of the transistor M6 is connected corresponds to the memory unit.

[0320] An example of the operation method of the pixel circuit PIX3 will be described. First, a first potential is written from the wiring VS1 to a node connected to the gate of the transistor M6 via the transistor M5. Then, the transistor M5 is turned off, bringing the node into a floating state. Next, a second potential is written from the wiring VS2 to one electrode of the capacitor C3 via the transistor M8. As a result, the potential of the node changes from the first potential to a third potential in response to the second potential due to capacitive coupling of the capacitor C3. Then, a current corresponding to the third potential flows through the transistor M6 and the light-emitting element EL, causing the light-emitting element EL to emit light at a luminance corresponding to the third potential.

[0321] In the display device of this embodiment, an image may be displayed by causing the light-emitting element to emit light in a pulsed manner. By shortening the driving time of the light-emitting element, it is possible to reduce the power consumption of the display panel and suppress heat generation. In particular, organic EL elements are suitable because of their excellent frequency characteristics. The frequency can be, for example, 1 kHz or more and 100 MHz or less. Also, a driving method (also called duty driving) in which light is emitted by changing the pulse width may be used.

[0322] Here, it is preferable to use transistors that use a metal oxide (oxide semiconductor) in the semiconductor layer in which the channel is formed for the transistors M1, M2, M3, and M4 of the pixel circuit PIX1, the transistors M5, M6, and M7 of the pixel circuit PIX2, and the transistor M8 of the pixel circuit PIX3.

[0323] Alternatively, the transistors M1 to M8 may be transistors in which silicon is used as a semiconductor in which a channel is formed. In particular, using silicon with high crystallinity, such as single crystal silicon or polycrystalline silicon, is preferable because high field-effect mobility can be achieved and higher-speed operation can be achieved.

[0324] Alternatively, a structure may be used in which at least one of the transistors M1 to M8 includes an oxide semiconductor and the remaining transistors include silicon. This structure corresponds to the above-described LTPO.

[0325] For example, transistors including an oxide semiconductor and having extremely low off-state current are preferably used as the transistors M1, M2, M5, M7, and M8, which function as switches for retaining charge. In this case, a transistor including silicon may be used as one or more of the other transistors.

[0326] Although the transistors in the pixel circuits PIX1, PIX2, and PIX3 are represented as n-channel transistors, p-channel transistors may also be used, or a configuration in which n-channel transistors and p-channel transistors are mixed may be used.

[0327] This embodiment mode can be implemented by appropriately combining at least a part thereof with other embodiment modes described in this specification.

[0328] (Fourth embodiment) In this embodiment, a metal oxide (also referred to as an oxide semiconductor) that can be used for the transistor described in the above embodiment will be described.

[0329] The metal oxide preferably contains at least indium or zinc. It is particularly preferable that it contains indium and zinc. It is also preferable that it contains aluminum, gallium, yttrium, tin, or the like in addition to these. It may also contain one or more elements selected from boron, silicon, titanium, iron, nickel, germanium, zirconium, molybdenum, lanthanum, cerium, neodymium, hafnium, tantalum, tungsten, magnesium, cobalt, and the like.

[0330] Furthermore, metal oxides can be formed by sputtering, chemical vapor deposition (CVD) such as metal organic chemical vapor deposition (MOCVD), atomic layer deposition (ALD), or the like.

[0331] <Classification of crystal structures> Examples of the crystalline structure of oxide semiconductors include amorphous (including completely amorphous), c-axis-aligned crystalline (CAAC), nanocrystalline (nc), cloud-aligned composite (CAC), single crystal, and polycrystal.

[0332] The crystalline structure of a film or substrate can be evaluated using X-ray diffraction (XRD) spectra. For example, it can be evaluated using XRD spectra obtained by GIXD (Grazing-Incidence XRD) measurements. The GIXD method is also called the thin film method or the Seemann-Bohlin method.

[0333] For example, for a quartz glass substrate, the peak shape of the XRD spectrum is nearly symmetrical. On the other hand, for an IGZO film with a crystalline structure, the peak shape of the XRD spectrum is asymmetrical. The asymmetrical peak shape of the XRD spectrum clearly indicates the presence of crystals in the film or substrate. In other words, if the peak shape of the XRD spectrum is not symmetrical, the film or substrate cannot be said to be in an amorphous state.

[0334] The crystalline structure of a film or substrate can also be evaluated by the diffraction pattern (also called the nanobeam electron diffraction pattern) observed using nanobeam electron diffraction (NBED). For example, a halo is observed in the diffraction pattern of a quartz glass substrate, confirming that the quartz glass is in an amorphous state. Furthermore, a spot-like pattern is observed in the diffraction pattern of an IGZO film deposited at room temperature, rather than a halo. For this reason, it is estimated that an IGZO film deposited at room temperature is neither crystalline nor amorphous, but is in an intermediate state, and it cannot be concluded that it is in an amorphous state.

[0335] <<Oxide semiconductor structure>> Note that oxide semiconductors may be classified differently from the above when focusing on their structures. For example, oxide semiconductors are divided into single-crystal oxide semiconductors and other non-single-crystal oxide semiconductors. Examples of non-single-crystal oxide semiconductors include the above-mentioned CAAC-OS and nc-OS. Non-single-crystal oxide semiconductors include polycrystalline oxide semiconductors, amorphous-like oxide semiconductors (a-like OSs), amorphous oxide semiconductors, and the like.

[0336] Here, the above-mentioned CAAC-OS, nc-OS, and a-like OS will be described in detail.

[0337] [CAAC-OS] CAAC-OS is an oxide semiconductor having multiple crystalline regions, each with its c-axis aligned in a specific direction. The specific direction can be the thickness direction of the CAAC-OS film, the normal direction to the surface on which the CAAC-OS film is formed, or the normal direction to the surface of the CAAC-OS film. A crystalline region is a region with periodic atomic arrangement. If the atomic arrangement is considered as a lattice arrangement, a crystalline region can also be a region with a uniform lattice arrangement. Furthermore, CAAC-OS has a region where multiple crystalline regions are connected in the ab-plane direction, and the region may have distortion. Note that distortion refers to a location where the lattice arrangement changes between a region with a uniform lattice arrangement and a region with a different uniform lattice arrangement in the region where multiple crystalline regions are connected. In other words, CAAC-OS is an oxide semiconductor with a c-axis aligned but no clear orientation in the ab-plane direction.

[0338] Each of the multiple crystalline regions is composed of one or more minute crystals (crystals with a maximum diameter of less than 10 nm). When a crystalline region is composed of one minute crystal, the maximum diameter of the crystalline region is less than 10 nm. When a crystalline region is composed of many minute crystals, the size of the crystalline region may be several tens of nm.

[0339] In an In-M-Zn oxide (wherein M is one or more elements selected from aluminum, gallium, yttrium, tin, titanium, etc.), the CAAC-OS tends to have a layered crystal structure (also referred to as a layered structure) in which a layer containing indium (In) and oxygen (hereinafter referred to as an In layer) and a layer containing M, zinc (Zn), and oxygen (hereinafter referred to as an (M, Zn) layer) are stacked. Note that indium and the element M are mutually substituted. Therefore, the (M, Zn) layer may contain indium. The In layer may contain M. The In layer may contain Zn. The layered structure is observed as a lattice image in a high-resolution transmission electron microscope (TEM) image, for example.

[0340] When the CAAC-OS film is subjected to structural analysis using, for example, an XRD apparatus, a peak indicating c-axis orientation is detected at or near 2θ=31° in out-of-plane XRD measurement using θ / 2θ scan. Note that the position of the peak indicating c-axis orientation (2θ value) may vary depending on the type and composition of the metallic elements constituting the CAAC-OS.

[0341] For example, in the electron diffraction pattern of a CAAC-OS film, multiple bright spots are observed, and the spots are observed at positions that are point-symmetric with respect to the spot of the incident electron beam that has passed through the sample (also called the direct spot).

[0342] When the crystalline region is observed from the specific direction, the lattice arrangement within the crystalline region is basically a hexagonal lattice, but the unit cell is not necessarily a regular hexagon and may be non-regular hexagonal. Furthermore, the distortion may have a pentagonal, heptagonal, or other lattice arrangement. In the CAAC-OS, no clear grain boundaries are observed even near the distortion. This indicates that the formation of grain boundaries is suppressed by the distortion of the lattice arrangement. This is thought to be because the CAAC-OS can tolerate distortion due to the lack of close-packed oxygen atom arrangement in the ab-plane direction and the change in interatomic bond distance caused by metal atom substitution.

[0343] A crystal structure with clear grain boundaries is called polycrystalline. Grain boundaries act as recombination centers, trapping carriers and potentially causing a decrease in the on-state current and field-effect mobility of a transistor. Therefore, CAAC-OS, which lacks clear grain boundaries, is one of the crystalline oxides with a crystal structure suitable for use in the semiconductor layer of a transistor. Zn is preferred for use in CAAC-OS. For example, In-Zn oxide and In-Ga-Zn oxide are suitable because they can suppress the generation of grain boundaries more effectively than In oxide.

[0344] CAAC-OS is an oxide semiconductor with high crystallinity and no clear crystal grain boundaries. Therefore, it can be said that the CAAC-OS is less susceptible to a decrease in electron mobility due to crystal grain boundaries. Furthermore, since the crystallinity of an oxide semiconductor can be reduced by impurities or defects, the CAAC-OS can be said to be an oxide semiconductor with few impurities and defects (such as oxygen vacancies). Therefore, oxide semiconductors with CAAC-OS have stable physical properties. Therefore, oxide semiconductors with CAAC-OS are heat-resistant and highly reliable. Furthermore, the CAAC-OS is stable even under high temperatures (so-called thermal budgets) during the manufacturing process. Therefore, using a CAAC-OS for an OS transistor can increase the flexibility of the manufacturing process.

[0345] [nc-OS] The nc-OS has periodic atomic arrangement in a microscopic region (e.g., a region of 1 nm to 10 nm, particularly a region of 1 nm to 3 nm). In other words, the nc-OS has microcrystalline structures. The size of the microcrystalline structures is, for example, 1 nm to 10 nm, particularly 1 nm to 3 nm, and therefore these microcrystalline structures are also called nanocrystalline structures. Furthermore, the nc-OS exhibits no regularity in the crystal orientation between different nanocrystalline structures. Therefore, the entire film lacks orientation. Therefore, depending on the analytical method, the nc-OS may be indistinguishable from an a-like OS or an amorphous oxide semiconductor. For example, when a structural analysis of an nc-OS film is performed using an XRD apparatus, no peaks indicating crystallinity are detected in out-of-plane XRD measurements using θ / 2θ scanning. Furthermore, when an nc-OS film is subjected to electron diffraction (also known as selected-area electron diffraction) using an electron beam with a probe diameter larger than that of nanocrystalline structures (e.g., 50 nm or larger), a halo-like diffraction pattern is observed. On the other hand, when electron diffraction (also called nanobeam electron diffraction) is performed on an nc-OS film using an electron beam with a probe diameter close to or smaller than the size of the nanocrystals (for example, 1 nm to 30 nm), an electron diffraction pattern can be obtained in which multiple spots are observed within a ring-shaped region centered on the direct spot.

[0346] [a-like OS] The a-like OS is an oxide semiconductor having a structure between the nc-OS and the amorphous oxide semiconductor. The a-like OS has a pore or low-density region. That is, the a-like OS has lower crystallinity than the nc-OS and CAAC-OS. Furthermore, the a-like OS has a higher hydrogen concentration in the film than the nc-OS and CAAC-OS.

[0347] <<Oxide semiconductor structure>> Next, the above-mentioned CAC-OS will be described in detail, which relates to the material composition.

[0348] [CAC-OS] CAC-OS is a material structure in which elements constituting a metal oxide are unevenly distributed in a size range of 0.5 nm to 10 nm, preferably 1 nm to 3 nm, or a similar size range. Hereinafter, a metal oxide in which one or more metal elements are unevenly distributed and the regions containing the metal elements are mixed in a size range of 0.5 nm to 10 nm, preferably 1 nm to 3 nm, or a similar size range, is also referred to as a mosaic or patch state.

[0349] Furthermore, CAC-OS has a mosaic structure in which the material is separated into first and second regions, and the first regions are distributed throughout the film (hereinafter also referred to as a cloud structure). That is, CAC-OS is a composite metal oxide having a structure in which the first and second regions are mixed.

[0350] Here, the atomic ratios of In, Ga, and Zn to the metal elements constituting the CAC-OS in the In-Ga-Zn oxide are denoted as [In], [Ga], and [Zn], respectively. For example, in the CAC-OS in the In-Ga-Zn oxide, the first region is a region where [In] is larger than [In] in the composition of the CAC-OS film. The second region is a region where [Ga] is larger than [Ga] in the composition of the CAC-OS film. Alternatively, for example, the first region is a region where [In] is larger than [In] in the second region and [Ga] is smaller than [Ga] in the second region. The second region is a region where [Ga] is larger than [Ga] in the first region and [In] is smaller than [In] in the first region.

[0351] Specifically, the first region is a region whose main component is indium oxide, indium zinc oxide, or the like. The second region is a region whose main component is gallium oxide, gallium zinc oxide, or the like. In other words, the first region can be rephrased as a region whose main component is In. The second region can be rephrased as a region whose main component is Ga.

[0352] It should be noted that there are cases where a clear boundary between the first region and the second region cannot be observed.

[0353] In addition, CAC-OS in In-Ga-Zn oxide refers to a material structure containing In, Ga, Zn, and O, in which some regions primarily composed of Ga and other regions primarily composed of In are randomly arranged in a mosaic pattern. Therefore, it is presumed that CAC-OS has a structure in which metal elements are distributed nonuniformly.

[0354] The CAC-OS can be formed, for example, by a sputtering method without heating the substrate. When the CAC-OS is formed by a sputtering method, one or more of an inert gas (typically argon), oxygen gas, and nitrogen gas may be used as the deposition gas. The lower the flow rate ratio of oxygen gas to the total flow rate of deposition gas during deposition, the better. For example, the flow rate ratio of oxygen gas to the total flow rate of deposition gas during deposition is preferably 0% or more and less than 30%, and more preferably 0% or more and 10% or less.

[0355] Furthermore, for example, in the case of CAC-OS in an In-Ga-Zn oxide, EDX mapping obtained using EDX (Energy Dispersive X-ray spectroscopy) confirms that the CAC-OS has a structure in which a region containing In as a main component (first region) and a region containing Ga as a main component (second region) are unevenly distributed and mixed.

[0356] Here, the first region has higher conductivity than the second region. That is, the flow of carriers through the first region causes the metal oxide to exhibit conductivity. Therefore, the first region is distributed in a cloud-like manner in the metal oxide, thereby achieving a high field-effect mobility (μ).

[0357] On the other hand, the second region has higher insulating properties than the first region. That is, the second region is distributed in the metal oxide, thereby suppressing leakage current.

[0358] Therefore, when CAC-OS is used in a transistor, the conductivity due to the first region and the insulating property due to the second region act complementarily, thereby providing the CAC-OS with a switching function (the ability to turn on / off). In other words, CAC-OS has a conductive function in part of the material and an insulating function in part of the material, and the material as a whole functions as a semiconductor. By separating the conductive function from the insulating function, both functions can be maximized. Therefore, by using CAC-OS in a transistor, a high on-current (I on ), high field-effect mobility (μ), and good switching behavior can be achieved.

[0359] Furthermore, a transistor using CAC-OS has high reliability, making it ideal for various semiconductor devices such as display devices.

[0360] Oxide semiconductors have a variety of structures, each with different characteristics. The oxide semiconductor of one embodiment of the present invention may include two or more of an amorphous oxide semiconductor, a polycrystalline oxide semiconductor, an a-like OS, a CAC-OS, an nc-OS, and a CAAC-OS.

[0361] <Transistors containing oxide semiconductors> Next, a case where the oxide semiconductor is used in a transistor will be described.

[0362] By using the oxide semiconductor for a transistor, a transistor with high field-effect mobility and high reliability can be realized.

[0363] For the transistor, an oxide semiconductor with a low carrier concentration is preferably used. For example, the carrier concentration of the oxide semiconductor is 1×10 17 cm -3 Less than 1 × 10 15 cm -3 or less, more preferably 1 × 10 13 cm -3Less than 1×10, more preferably 11 cm -3 or less, more preferably 1 × 10 10 cm -3 Less than 1 x 10 -9 cm -3 That is all. Note that in order to reduce the carrier concentration of an oxide semiconductor film, the impurity concentration in the oxide semiconductor film may be reduced to reduce the density of defect states. In this specification and the like, a semiconductor having a low impurity concentration and a low density of defect states is referred to as a highly purified intrinsic or substantially highly purified intrinsic oxide semiconductor. Note that an oxide semiconductor having a low carrier concentration may also be referred to as a highly purified intrinsic or substantially highly purified intrinsic oxide semiconductor.

[0364] Furthermore, a highly purified intrinsic or substantially highly purified intrinsic oxide semiconductor film has a low density of defect states, and therefore the density of trap states may also be low.

[0365] Furthermore, charges trapped in the trap states of an oxide semiconductor take a long time to disappear and may behave like fixed charges. Therefore, a transistor in which a channel formation region is formed in an oxide semiconductor with a high density of trap states may have unstable electrical characteristics.

[0366] Therefore, in order to stabilize the electrical characteristics of a transistor, it is effective to reduce the impurity concentration in the oxide semiconductor. Furthermore, in order to reduce the impurity concentration in the oxide semiconductor, it is preferable to also reduce the impurity concentration in the adjacent film. Examples of impurities include hydrogen, nitrogen, alkali metals, alkaline earth metals, iron, nickel, and silicon.

[0367] <Impurities> Here, the influence of each impurity in an oxide semiconductor will be described.

[0368] When an oxide semiconductor contains silicon or carbon, which is one of the Group 14 elements, defect levels are formed in the oxide semiconductor. Therefore, the concentration of silicon or carbon in the oxide semiconductor and the concentration of silicon or carbon near the interface with the oxide semiconductor (concentration obtained by secondary ion mass spectrometry (SIMS)) are calculated to be 2×10 18 atoms / cm 3 Less than or equal to 2 x 10 17 atoms / cm 3 The following applies.

[0369] Furthermore, when an oxide semiconductor contains an alkali metal or alkaline earth metal, defect levels may be formed and carriers may be generated. Therefore, a transistor using an oxide semiconductor containing an alkali metal or alkaline earth metal is likely to have normally-on characteristics. Therefore, when the concentration of the alkali metal or alkaline earth metal in the oxide semiconductor obtained by SIMS is 1×10 18 atoms / cm 3 Less than or equal to 2 x 10 16 atoms / cm 3 Do the following:

[0370] Furthermore, when nitrogen is contained in an oxide semiconductor, electrons serving as carriers are generated, the carrier concentration increases, and the semiconductor is likely to become n-type. As a result, a transistor using an oxide semiconductor containing nitrogen as a semiconductor tends to have normally-on characteristics. Alternatively, when nitrogen is contained in an oxide semiconductor, trap states may be formed. As a result, the electrical characteristics of the transistor may become unstable. For this reason, the nitrogen concentration in the oxide semiconductor obtained by SIMS is set to 5×10 19 atoms / cm 3 Less than 5 x 10 18 atoms / cm 3 Less than 1×10, more preferably 18 atoms / cm 3 Less than 5 × 10, more preferably 17 atoms / cm 3 Do the following:

[0371] Furthermore, hydrogen contained in an oxide semiconductor may react with oxygen bonded to a metal atom to form water, which may form an oxygen vacancy. When hydrogen enters the oxygen vacancy, electrons serving as carriers may be generated. Furthermore, some of the hydrogen may bond with oxygen bonded to a metal atom to generate electrons serving as carriers. Therefore, a transistor using an oxide semiconductor containing hydrogen is likely to have normally-on characteristics. For this reason, it is preferable to reduce the amount of hydrogen in the oxide semiconductor as much as possible. Specifically, the hydrogen concentration in an oxide semiconductor measured by SIMS is 1×10 20 atoms / cm 3 Less than 1 x 10 19 atoms / cm 3 less than 5 × 10 18 atoms / cm 3 less than 1×10 18 atoms / cm 3 Make it less than.

[0372] When an oxide semiconductor with sufficiently reduced impurities is used for a channel formation region of a transistor, stable electrical characteristics can be obtained.

[0373] This embodiment mode can be implemented by appropriately combining at least a part thereof with other embodiment modes described in this specification.

[0374] (Embodiment 5) In this embodiment, electronic devices of one embodiment of the present invention will be described with reference to FIGS.

[0375] An electronic device of one embodiment of the present invention can capture an image with a display portion, detect a touch operation, etc. This can improve the functionality, convenience, and the like of the electronic device.

[0376] Examples of electronic devices according to one embodiment of the present invention include electronic devices with relatively large screens, such as television sets, desktop or notebook personal computers, computer monitors, digital signage, and large game machines such as pachinko machines, as well as digital cameras, digital video cameras, digital photo frames, mobile phones, portable game machines, personal digital assistants, and sound reproduction devices.

[0377] An electronic device according to one embodiment of the present invention may have a sensor (including a function for measuring force, displacement, position, velocity, acceleration, angular velocity, rotation speed, distance, light, liquid, magnetism, temperature, chemical substance, sound, time, hardness, electric field, current, voltage, power, radiation, flow rate, humidity, gradient, vibration, odor, or infrared rays).

[0378] The electronic device of one embodiment of the present invention can have various functions, such as a function to display various information (still images, videos, text images, etc.) on a display portion, a touch panel function, a function to display a calendar, date, time, etc., a function to execute various software (programs), a wireless communication function, a function to read programs or data recorded on a recording medium, etc.

[0379] Electronic device 6500 shown in FIG. 12A is a portable information terminal that can be used as a smartphone.

[0380] The electronic device 6500 includes a housing 6501, a display portion 6502, a power button 6503, a button 6504, a speaker 6505, a microphone 6506, a camera 6507, and a light source 6508. The display portion 6502 has a touch panel function.

[0381] The display device described in Embodiment 2 can be applied to the display portion 6502.

[0382] FIG. 12B is a schematic cross-sectional view including the end of the housing 6501 on the microphone 6506 side.

[0383] A light-transmitting protective member 6510 is provided on the display surface side of the housing 6501, and a display panel 6511, optical members 6512, a touch sensor panel 6513, a printed circuit board 6517, a battery 6518, etc. are arranged in the space surrounded by the housing 6501 and the protective member 6510.

[0384] A display panel 6511, an optical member 6512, and a touch sensor panel 6513 are fixed to the protective member 6510 by adhesive layers (not shown).

[0385] In an area outside the display unit 6502, a part of the display panel 6511 is folded back, and an FPC 6515 is connected to the folded back part. An IC 6516 is mounted on the FPC 6515. The FPC 6515 is connected to a terminal provided on a printed circuit board 6517.

[0386] The flexible display of one embodiment of the present invention can be applied to the display panel 6511. Therefore, an extremely lightweight electronic device can be realized. In addition, since the display panel 6511 is extremely thin, a large-capacity battery 6518 can be mounted thereon while keeping the thickness of the electronic device small. Furthermore, by folding back a part of the display panel 6511 and arranging a connection portion with the FPC 6515 on the back side of the pixel portion, an electronic device with a narrow frame can be realized.

[0387] When the display device described in Embodiment 2 is used for the display panel 6511, an image can be captured in the display portion 6502. For example, a fingerprint can be captured on the display panel 6511 for fingerprint authentication.

[0388] The display portion 6502 further includes a touch sensor panel 6513, which allows the display portion 6502 to have a touch panel function. The touch sensor panel 6513 can be of any of various types, such as a capacitive type, a resistive type, a surface acoustic wave type, an infrared type, an optical type, or a pressure-sensitive type. Alternatively, the display panel 6511 may function as a touch sensor, in which case the touch sensor panel 6513 is not necessarily provided.

[0389] 13A shows an example of a television device. A television device 7100 has a display unit 7000 built into a housing 7101. Here, the housing 7101 is supported by a stand 7103.

[0390] The display device described in Embodiment 2 can be applied to the display portion 7000.

[0391] 13A can be operated using an operation switch provided on the housing 7101, a separate remote control 7111, or the like. Alternatively, a touch sensor may be provided on the display unit 7000, and the television 7100 may be operated by touching the display unit 7000 with a finger or the like. The remote control 7111 may have a display unit that displays information output from the remote control 7111. Using operation keys or a touch panel provided on the remote control 7111, it is possible to operate the channel and volume, and to control the video displayed on the display unit 7000.

[0392] The television device 7100 is configured to include a receiver, a modem, and the like. The receiver can receive general television broadcasts. In addition, by connecting to a wired or wireless communication network via the modem, it is possible to perform one-way (from sender to receiver) or two-way (between sender and receiver, or between receivers, etc.) information communication.

[0393] 13B shows an example of a laptop personal computer 7200. The laptop personal computer 7200 includes a housing 7211, a keyboard 7212, a pointing device 7213, an external connection port 7214, and the like. A display portion 7000 is incorporated in the housing 7211.

[0394] The display device described in Embodiment 2 can be applied to the display portion 7000.

[0395] 13C and 13D show an example of digital signage.

[0396] 13C includes a housing 7301, a display unit 7000, and a speaker 7303. The digital signage 7300 may further include an LED lamp, operation keys (including a power switch or an operation switch), a connection terminal, various sensors, a microphone, and the like.

[0397] 13D shows a digital signage 7400 attached to a cylindrical pillar 7401. The digital signage 7400 has a display unit 7000 provided along the curved surface of the pillar 7401.

[0398] The larger the display unit 7000, the more information can be provided at one time. Also, the larger the display unit 7000, the more easily it will attract people's attention, which can increase the advertising effectiveness of, for example, advertisements.

[0399] Applying a touch panel to the display unit 7000 is preferable because it not only displays images or videos on the display unit 7000 but also allows the user to intuitively operate it. Furthermore, when used to provide information such as route information or traffic information, intuitive operation can improve usability.

[0400] 13C and 13D, it is preferable that digital signage 7300 or digital signage 7400 can wirelessly link with information terminal 7311 or information terminal 7411, such as a smartphone carried by a user. For example, advertising information displayed on display unit 7000 can be displayed on the screen of information terminal 7311 or information terminal 7411. Furthermore, by operating information terminal 7311 or information terminal 7411, the display on display unit 7000 can be switched.

[0401] 13C and 13D, the display device described in Embodiment 2 can be applied to the display portion of the information terminal 7311 or the information terminal 7411.

[0402] Furthermore, it is also possible to run a game on the digital signage 7300 or the digital signage 7400 using the screen of the information terminal 7311 or the information terminal 7411 as an operation means (controller), thereby allowing an unspecified number of users to simultaneously participate in and enjoy the game.

[0403] The electronic device shown in Figures 14A to 14F has a housing 9000, a display unit 9001, a speaker 9003, operation keys 9005 (including a power switch or an operation switch), a connection terminal 9006, a sensor 9007 (including the function of measuring force, displacement, position, speed, acceleration, angular velocity, rotation speed, distance, light, liquid, magnetism, temperature, chemical substance, sound, time, hardness, electric field, current, voltage, power, radiation, flow rate, humidity, gradient, vibration, odor or infrared rays), a microphone 9008, etc.

[0404] The electronic devices shown in Figures 14A to 14F have various functions. For example, they may have a function to display various information (still images, videos, text images, etc.) on a display unit, a touch panel function, a function to display a calendar, date, or time, a function to control processing using various software (programs), a wireless communication function, a function to read and process programs or data recorded on a recording medium, etc. Note that the functions of the electronic devices are not limited to these, and they may have various other functions. The electronic devices may have multiple display units. Furthermore, the electronic devices may be provided with a camera or the like to capture still images, videos, etc. and store them on a recording medium (external or built-in to the camera), and a function to display the captured images on the display unit, etc.

[0405] The electronic devices shown in FIGS. 14A to 14F will be described in detail below.

[0406] FIG. 14A is a perspective view showing a mobile information terminal 9101. The mobile information terminal 9101 can be used as, for example, a smartphone. The mobile information terminal 9101 may be provided with a speaker 9003, a connection terminal 9006, a sensor 9007, and the like. The mobile information terminal 9101 can display text, image information, and the like on multiple surfaces thereof. FIG. 14A shows an example in which three icons 9050 are displayed. Information 9051, indicated by a dashed rectangle, can also be displayed on another surface of the display unit 9001. Examples of the information 9051 include notifications of incoming emails, SNS messages, phone calls, and the like, the titles of emails, SNS messages, and the like, the sender's name, the date and time, the remaining battery level, and the strength of antenna reception. Alternatively, the icon 9050 or the like may be displayed in the position where the information 9051 is displayed.

[0407] 14B is a perspective view showing a mobile information terminal 9102. The mobile information terminal 9102 has a function of displaying information on three or more sides of the display unit 9001. Here, an example is shown in which information 9052, information 9053, and information 9054 are displayed on different sides. For example, while the user holds the mobile information terminal 9102 in a breast pocket of their clothes, the user can check information 9053 displayed in a position that can be observed from above the mobile information terminal 9102. The user can check the display without taking the mobile information terminal 9102 out of their pocket and decide, for example, whether to answer a call.

[0408] FIG. 14C is a perspective view showing a wristwatch-type mobile information terminal 9200. The mobile information terminal 9200 can be used as, for example, a smart watch. The display surface of the display unit 9001 is curved, and display can be performed along the curved display surface. The mobile information terminal 9200 can also perform hands-free calling by communicating with, for example, a headset capable of wireless communication. The mobile information terminal 9200 can also perform data transmission and charging with another information terminal through a connection terminal 9006. Note that charging may be performed by wireless power supply.

[0409] 14D to 14F are perspective views showing a foldable mobile information terminal 9201. FIG. 14D shows the mobile information terminal 9201 in an unfolded state, FIG. 14F shows it in a folded state, and FIG. 14E is a perspective view showing a state in the process of changing from one of FIG. 14D and FIG. 14F to the other. The mobile information terminal 9201 is highly portable when folded, and has a seamless, wide display area when unfolded, providing excellent viewability of the display. The display unit 9001 of the mobile information terminal 9201 is supported by three housings 9000 connected by hinges 9055. For example, the display unit 9001 can be bent with a curvature radius of 0.1 mm or more and 150 mm or less.

[0410] This embodiment mode can be implemented by appropriately combining at least a part thereof with other embodiment modes described in this specification. [Explanation of symbols]

[0411] 10: Display device: 11: Display unit: 12, 13, 14: Drive circuit unit: 15: Circuit unit: 21, 21B, 21G, 21R: Pixel: 22: Imaging pixel: 30: Pixel: 50: Display device: 51, 51B, 51G, 51R: Light-emitting element: 52: Light-receiving element: 55B, 55G, 55R: Light: 56: Reflected light: 59: Finger: 60B, 60G, 60R: Period

Claims

[Claim 1] A method for driving a display device having a first pixel, a second pixel, and a sensor pixel, comprising: the sensor pixel includes a photoelectric conversion element that is sensitive to light of a first color emitted by the first pixel and light of a second color emitted by the second pixel; a first period in which a first image is captured while the first pixel is turned on and the second pixel is turned off; a second period in which a first readout is performed in a state in which the first pixel and the second pixel are turned off; a third period in which a second image is captured while the second pixel is turned on and the first pixel is turned off; a fourth period in which a second readout is performed in a state in which the first pixel and the second pixel are turned off; A method for driving a display device.

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