Microplate, manufacturing method thereof, and metal mold for molding microplate

Abstract

To provide a microplate with excellent flatness.SOLUTION: A microplate includes: a bottom surface base material; and a plate body placed on the bottom surface base material. When glass-transition temperature of resin (resin A) constituting the plate body is defined as TgA(°C) and glass-transition temperature of resin (resin B) constituting the bottom surface base material is defined as TgB(°C), TgB-TgA≥20°C is satisfied in the microplate.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a microplate, a method for producing the same, and a mold for molding the microplate. [Background technology]

[0002] In the field of life science research, microplates with one or more wells are used as containers for cell culture, etc. Microplates have a container section for containing cells and culture medium, and the cells are cultured in the internal space of the container section.

[0003] 2. Description of the Related Art Insert injection molding is a conventional method for molding containers such as microplates.

[0004] For example, Patent Document 1 describes a method for manufacturing an insert-molded product in which, when injecting resin into a cavity in which an insert film is placed, the cavity surface is heated to a temperature higher than the heat distortion temperature of the thermoplastic resin to be injected, and after injection is completed, the cavity surface is cooled to a temperature lower than the heat distortion temperature of the thermoplastic resin. According to Patent Document 1, by using this manufacturing method, it is possible to reliably prevent the occurrence of weld lines and to efficiently manufacture molded products with hole shapes or large-sized molded products. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Laid-Open No. 2006-076276 Summary of the Invention [Problem to be solved by the invention]

[0006] However, the microplates produced by the above-described conventional manufacturing methods have room for further improvement in terms of improving the flatness of the microplates.

[0007] Therefore, an object of the present invention is to provide a microplate with excellent flatness, a method for manufacturing the microplate, and a mold used for molding the microplate. [Means for solving the problem]

[0008] The present inventors have conducted extensive research to solve the above problems, and have found that a microplate comprising a bottom substrate and a plate body provided on the bottom substrate, in which the glass transition temperatures of the resin constituting the plate body and the resin constituting the bottom substrate satisfy a predetermined relationship, has excellent flatness, and have completed the present invention.

[0009] That is, the present invention aims to advantageously solve the above-mentioned problems, and provides the following microplates (1) to (8), the following methods for manufacturing microplates (9) to (13), and the following molds for molding microplates (14) to (17).

[0010] [1] A plate body is provided with a bottom substrate and the bottom substrate, and the glass transition temperature of the resin (resin A) constituting the plate body is Tg A (°C), and the glass transition temperature of the resin (resin B) constituting the bottom substrate is Tg B (°C), the following formula (1): Tg B -Tg A ≧20℃ (1) Fill the microplate. In this way, if the glass transition temperature of the resin constituting the bottom substrate is at least 20° C. higher than the glass transition temperature of the resin constituting the plate body, the flatness of the microplate can be improved. In the present invention, the "glass transition temperature" can be measured using the method described in the examples of this specification.

[0011] [2] The microplate according to [1] above, wherein the plate body further contains a carbon material and the visible light transmittance of the plate body is less than 0.1%. If the plate body further contains a carbon material and has a visible light transmittance less than the above value, a microplate suitable for optical cell observation can be produced. In addition, light blocking properties are achieved, preventing light conduction between adjacent wells. In the present invention, the "visible light transmittance" means the light transmittance in the wavelength range of 300 nm or more and 800 nm or less, and can be measured using the method described in the examples of this specification.

[0012] [3] The microplate according to [1] or [2] above, wherein the light transmittance of the bottom substrate is 70% or more at a wavelength of 250 nm. If the light transmittance of the bottom substrate at 250 nm is equal to or greater than the above value, a microplate suitable for optical cell observation can be produced.

[0013] [4] The microplate according to any one of [1] to [3] above, wherein the light transmittance of the bottom substrate is 60% or more at a wavelength of 287 nm. If the light transmittance of the bottom substrate at 287 nm is equal to or greater than the above value, a microplate suitable for optical cell observation can be produced.

[0014] [5] The microplate according to any one of [1] to [4] above, wherein the refractive index of the bottom surface substrate is 1.530 or more and 1.540 or less. If the refractive index of the bottom substrate is within the above range, a microplate suitable for optical cell observation can be produced. In the present invention, the "refractive index" means the refractive index for light having a wavelength of 589.3 nm, and can be measured using the method described in the examples of this specification.

[0015] [6] The microplate according to any one of [1] to [5] above, wherein the average thickness of the bottom substrate is 90 μm or more and 200 μm or less. If the average thickness of the bottom substrate is within the above range, a microplate suitable for optical cell observation can be produced. In the present invention, the "average thickness" of the bottom substrate can be measured using the method described in the examples of this specification.

[0016] [7] The microplate according to any one of [1] to [6] above, wherein the bottom substrate is surface-treated. If the bottom substrate is surface-treated, the cell adhesiveness of the microplate can be improved.

[0017] [8] The microplate according to [7] above, wherein the surface treatment is at least one selected from the group consisting of plasma treatment, coating with collagen, and coating with a cell adhesion peptide. If the bottom substrate is surface-treated by plasma treatment, coating with collagen, or coating with a cell adhesion peptide, the cell adhesiveness of the microplate can be further improved.

[0018] [9] A method for manufacturing a microplate according to any one of [1] to [8] above, comprising the steps of preparing the bottom substrate containing the resin B, and fixing the prepared bottom substrate to a mold, and then filling the mold with a molding material containing the resin A to form the plate body. By going through the above-mentioned two steps, the microplate of the present invention having excellent flatness can be efficiently produced.

[0019]

[10] In the filling step, the temperature of the part of the mold where the wells of the microplate are to be formed is controlled to a glass transition temperature Tg A (°C) or higher, and after the filling step, the glass transition temperature Tg A The method for producing a microplate according to [9] above, wherein the temperature is set to (°C) or less. The temperature of the mold part that forms the wells of the microplate is kept at Tg during the process of filling the mold with molding material containing resin A.A (℃) or higher, and after the process of filling the mold with the molding material containing resin A, the Tg A (° C.) or less, the flatness of the obtained microplate can be further improved.

[0020]

[11] The method for producing a microplate according to [9] or

[10] above, further comprising the step of printing on the plate body with an ultraviolet laser. By further including the above-mentioned steps, production management of microplates can be facilitated.

[0021]

[12] A method for manufacturing a microplate according to any one of [1] to [8] above, comprising the steps of preparing the plate body containing the resin A, and melt-bonding the prepared plate body and the bottom substrate with a laser having a wavelength that is absorbed by the plate body. By going through the above-mentioned two steps, the microplate of the present invention having excellent flatness can be efficiently produced.

[0022]

[13] The method for manufacturing a microplate according to

[12] above, further comprising the step of printing on the plate body with an ultraviolet laser. By further including the above-mentioned steps, production management of microplates can be facilitated.

[0023]

[14] A mold for use in molding the microplate described in any one of [1] to [8] above, the mold for molding a microplate having a member that forms the plate body and a member that forms the outer periphery of the plate body, the two members being controllable to different temperatures. By using a mold that has a member that forms the plate body and a member that forms the outer periphery of the plate body and that can control these two members to different temperatures, the microplate of the present invention, which has excellent flatness, can be efficiently manufactured.

[0024]

[15] The microplate molding mold according to

[14] above, further comprising pins for forming wells of the microplate, the pins and / or the contact portions of the pins being made of a copper alloy. By using a mold equipped with pins for forming the wells of a microplate, with the pins and / or their contact parts made of a copper alloy, the temperature distribution in the pins of the mold can be made uniform, further improving the flatness of the resulting microplate.

[0025]

[16] The microplate molding die according to

[15] above, which is provided with a carbon nanotube sheet at the contact portion of the pin. By placing a carbon nanotube sheet at the contact points of the pins, the temperature distribution of the mold can be made uniform, further improving the flatness of the resulting microplate.

[0026]

[17] The mold for forming microplates according to

[15] or

[16] above, which has a heat exchange pipe inside the pin. By providing a heat exchange pipe inside the pins for forming the wells of the microplate, the temperature distribution in the mold can be made uniform, further improving the flatness of the obtained microplate. [Effects of the Invention]

[0027] According to the present invention, it is possible to provide a microplate with excellent flatness, a method for manufacturing the microplate, and a mold used for molding the microplate. [Brief explanation of the drawings]

[0028] [Figure 1] FIG. 1 is a diagram showing a schematic configuration of an example of a multiwell plate according to the present invention. [Figure 2] FIG. 1 is a schematic diagram showing an example of a mold attached to an injection molding machine. [Figure 3] FIG. 1 is a diagram showing a schematic configuration of an example of a mold according to the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0029] Hereinafter, embodiments of the present invention will be described in detail. The microplate of the present invention can be used for purposes such as cell culture and biochemical analysis. The microplate of the present invention can be manufactured, for example, using the microplate manufacturing method of the present invention. The microplate mold of the present invention is used in manufacturing the microplate of the present invention.

[0030] (microplate) The microplate of the present invention comprises at least a plate body and a bottom substrate. The microplate of the present invention may further comprise members (other members) other than the plate body and the bottom substrate. Here, the microplate of the present invention has a glass transition temperature Tg A and the glass transition temperature Tg of the resin (resin B) that constitutes the bottom substrate B The given relationship (1) is: Tg B -Tg A ≧20℃ (1) It is characterized in that the following holds true.

[0031] The microplate of the present invention has a glass transition temperature Tg A and the glass transition temperature Tg of the resin that makes up the bottom substrate B When the above-mentioned relational expression (1) is satisfied, the flatness of the microplate can be improved.

[0032] <Tg B -Tg A > Tg B -Tg A The Tg must be 20°C or higher, preferably 22°C or higher, more preferably 24°C or higher, even more preferably 26°C or higher, and is preferably 50°C or lower, more preferably 40°C or lower, even more preferably 30°C or lower.B -Tg A If Tg is less than 20°C, the flatness of the microplate will decrease. B -Tg A If Tg is 22°C or higher, the flatness of the microplate can be further improved. B -Tg A If the temperature is 50° C. or less, the plate body and the bottom base material can be easily thermally welded together.

[0033] An example of the structure of the microplate of the present invention will be further explained below with reference to Fig. 1. However, the microplate of the present invention is not limited to the structure exemplified in Fig. 1.

[0034] An example of a microplate of the present invention is shown in Figure 1. The microplate 1 shown in Figure 1 comprises a plate body 11 and a bottom substrate 12. The microplate 1 is provided with wells 13 having internal spaces defined by the plate body 11 and the bottom substrate 12. The microplate may further comprise members other than the plate body 11 and the bottom substrate 12. For example, the multiwell plate of the present invention may be provided with a lid that covers the plate body 11 and can seal the wells 13.

[0035] <Plate body> The plate body is a member provided on the bottom substrate and forms a well together with the bottom substrate. The plate body contains at least a resin (resin A) and optionally further contains a carbon material and other components.

[0036] <<Resin A>> A thermoplastic resin that is solid at room temperature and normal pressure can be used as the resin A. Examples of the thermoplastic resin that is solid at room temperature and normal pressure include cycloolefin polymers, acrylic resins, silicone resins, fluororesins, polyethylene, polyester, polypropylene, ethylene-propylene copolymers, polymethylpentene, polyvinyl chloride, polyvinylidene chloride, polyvinyl acetate, ethylene-vinyl acetate copolymers, polyvinyl alcohol, polyacetal, polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, polystyrene, polyacrylonitrile, styrene-acrylonitrile copolymers, acrylonitrile-butadiene-styrene copolymers (ABS resins), styrene-butadiene block copolymers or hydrogenated products thereof, styrene-isoprene block copolymers or hydrogenated products thereof, polyphenylene ethers, modified polyphenylene ethers, aliphatic polyamides, aromatic polyamides, polyamideimides, polycarbonates, polyphenylene sulfides, polysulfones, polyethersulfones, polyethernitriles, polyetherketones, polyketones, polyurethanes, liquid crystal polymers, and ionomers. These resins may be used alone or in combination of two or more in any ratio. In this specification, "normal temperature" refers to 23°C, and "normal pressure" refers to 1 atm (absolute pressure).

[0037] Among the above resins, cycloolefin polymers and acrylic resins are preferred, and cycloolefin polymers are more preferred. By using cycloolefin polymers, it becomes possible to prepare microplates suitable for optical cell observation.

[0038] The cycloolefin polymer preferably used as the resin A will be described in detail below.

[0039] [Cycloolefin polymer] Here, the cycloolefin polymer is a polymer having an alicyclic structure in one or both of the main chain and the side chain. Examples thereof include norbornene-based polymers, monocyclic cyclic olefin-based polymers, cyclic conjugated diene-based polymers, vinyl alicyclic hydrocarbon-based polymers, and hydrogenated versions thereof. Among these, from the viewpoints of transparency and moldability, norbornene-based polymers are preferred, and norbornene-based polymers having no polar groups in the side chains are more preferred.

[0040] Examples of norbornene-based polymers include ring-opening polymers of monomers having a norbornene structure, ring-opening polymers of a monomer having a norbornene structure and an arbitrary monomer, or hydrogenated products thereof; addition polymers of a monomer having a norbornene structure, addition polymers of a monomer having a norbornene structure and an arbitrary monomer, or hydrogenated products thereof; and the like.

[0041] Here, the norbornene polymer is a polymer containing monomer units having a norbornene skeleton in an amount of 50% by mass or more, preferably 60% by mass or more, based on the total monomer units constituting the norbornene polymer. More specifically, norbornene polymers are obtained by polymerizing norbornene monomers, which are monomers having a norbornene skeleton, and are roughly classified into those obtained by ring-opening polymerization and those obtained by addition polymerization.

[0042] Examples of materials obtainable by ring-opening polymerization include ring-opening polymers of norbornene-based monomers, ring-opening polymers of norbornene-based monomers and other monomers that are ring-opening copolymerizable with the norbornene-based monomers, and hydrogenated products of these. Examples of the polymers obtained by addition polymerization include addition polymers of norbornene-based monomers and addition polymers of norbornene-based monomers and other monomers copolymerizable therewith. The norbornene polymers can be used either alone or in combination of two or more. Among these, a hydrogenated ring-opening polymer of a norbornene-based monomer (sometimes referred to as a "hydrogenated norbornene-based ring-opening polymer") is preferred because the effects of the present invention can be more easily obtained.

[0043] Norbornene monomers that can be used to synthesize norbornene polymers include bicyclo[2.2.1]hept-2-ene (common name: norbornene), 5-methyl-bicyclo[2.2.1]hept-2-ene, 5,5-dimethyl-bicyclo[2.2.1]hept-2-ene, 5-ethyl-bicyclo[2.2.1]hept-2-ene, 5-ethylidene-bicyclo[2.2.1]hept-2-ene, and 5-methyl-bicyclo[2.2.1]hept-2-ene. ]hept-2-ene, 5-vinyl-bicyclo[2.2.1]hept-2-ene, 5-propenylbicyclo[2.2.1]hept-2-ene, 5-methoxycarbonyl-bicyclo[2.2.1]hept-2-ene, 5-cyanobicyclo[2.2.1]hept-2-ene, 5-methyl-5-methoxycarbonyl-bicyclo[2.2.1]hept-2-ene, and other bicyclic monomers; Tricyclo[4.3.0 1,6 .1 2,5 ] Tricyclic monomers such as deca-3,7-diene (trivial name: dicyclopentadiene), 2-methyldicyclopentadiene, 2,3-dimethyldicyclopentadiene, and 2,3-dihydroxydicyclopentadiene; Tetracyclo[4.4.0.1 2,5 .1 7,10 ]-3-dodecene (tetracyclododecene), tetracyclo[4.4.0.1 2,5 .1 7,10 ]-3-dodecene, 8-methyltetracyclo[4.4.0.1 2,5 .1 7,10 ]-3-dodecene, 8-ethyltetracyclo[4.4.0.1 2,5 .1 7,10 ]-3-dodecene, 8-ethylidenetetracyclo[4.4.0.1 2,5 .1 7,10 ]-3-dodecene, 8,9-dimethyltetracyclo[4.4.0.1 2,5 .1 7,10 ]-3-dodecene, 8-ethyl-9-methyltetracyclo[4.4.0.1 2,5 .17,10 ]-3-dodecene, 8-ethylidene-9-methyltetracyclo[4.4.0.1 2,5 .1 7,10 ]-3-dodecene, 8-methyl-8-carboxymethyltetracyclo[4.4.0.1 2,5 .1 7,10 ]-3-dodecene, 7,8-benzotricyclo[4.3.0.1 2,5 ] tetracyclic monomers such as dec-3-ene (trivial name: methanotetrahydrofluorene; also known as 1,4-methano-1,4,4a,9a-tetrahydrofluorene), 1,4-methano-8-methyl-1,4,4a,9a-tetrahydrofluorene, 1,4-methano-8-chloro-1,4,4a,9a-tetrahydrofluorene, and 1,4-methano-8-bromo-1,4,4a,9a-tetrahydrofluorene; and the like. These norbornene-based monomers may have one or more substituents, such as alkyl groups, alkylene groups, aryl groups, silyl groups, alkoxycarbonyl groups, and alkylidene groups.

[0044] Other monomers that can be ring-opening copolymerized with norbornene-based monomers include monocyclic cycloolefin-based monomers such as cyclohexene, cycloheptene, cyclooctene, 1,4-cyclohexadiene, 1,5-cyclooctadiene, 1,5-cyclodecadiene, 1,5,9-cyclododecatriene, and 1,5,9,13-cyclohexadecatetraene.

[0045] Other monomers that can be addition copolymerized with norbornene monomers include α-olefin monomers having 2 to 20 carbon atoms, such as ethylene, propylene, 1-butene, 1-pentene, and 1-hexene; cyclobutene, cyclopentene, cyclohexene, cyclooctene, and tetracyclo[9.2.1.0]. 2,10 .0 3,8] Cycloolefin-based monomers such as tetradeca-3,5,7,12-tetraene (also known as 3a,5,6,7a-tetrahydro-4,7-methano-1H-indene); non-conjugated diene-based monomers such as 1,4-hexadiene, 4-methyl-1,4-hexadiene, 5-methyl-1,4-hexadiene, and 1,7-octadiene; and the like. Among these, as the other monomer capable of addition copolymerization with the norbornene-based monomer, an α-olefin-based monomer is preferred, and ethylene is more preferred. These other monomers may have one or more substituents, such as alkyl groups, alkylene groups, aryl groups, silyl groups, alkoxycarbonyl groups, and alkylidene groups.

[0046] A ring-opening polymer of a norbornene-based monomer, or a ring-opening polymer of a norbornene-based monomer and another monomer capable of ring-opening copolymerization therewith, can be obtained by polymerizing the monomer components in the presence of a known ring-opening polymerization catalyst. As the ring-opening polymerization catalyst, for example, a catalyst composed of a halide of a metal such as ruthenium or osmium, a nitrate or an acetylacetone compound, and a reducing agent, or a catalyst composed of a halide or an acetylacetone compound of a metal such as titanium, zirconium, tungsten, or molybdenum, and an organoaluminum compound can be used. The hydrogenated ring-opening polymer of a norbornene-based monomer can usually be obtained by adding a known hydrogenation catalyst containing a transition metal such as nickel or palladium to a polymerization solution of the ring-opening polymer and hydrogenating the carbon-carbon unsaturated bonds.

[0047] An addition polymer of a norbornene-based monomer or an addition polymer of a norbornene-based monomer and another monomer copolymerizable therewith can be obtained by polymerizing the monomer components in the presence of a known addition polymerization catalyst. As the addition polymerization catalyst, for example, a catalyst comprising a titanium, zirconium or vanadium compound and an organoaluminum compound can be used.

[0048] [Glass transition temperature TgA ] Here, the glass transition temperature Tg of Resin A A is not particularly limited as long as it satisfies the above-mentioned predetermined relational expression (1). From the viewpoint of further improving the flatness of the microplate, the glass transition temperature Tg A The glass transition temperature Tg of resin A is preferably 126°C or higher, more preferably 130°C or higher, and is preferably 150°C or lower, more preferably 140°C or lower. A If the glass transition temperature Tg of Resin A is 126°C or higher, the heat resistance of the microplate can be improved. A If the heating temperature is 150° C. or less, the flatness of the microplate can be further improved.

[0049] [Weight average molecular weight] There are no particular restrictions on the molecular weight of Resin A, but the weight-average molecular weight, calculated as polyisoprene, measured by gel permeation chromatography (GPC) of a cyclohexane solution (or a toluene solution if the polymer is not soluble) is usually 5,000 or more, preferably 5,000 to 500,000, more preferably 8,000 to 200,000, and particularly preferably 10,000 to 100,000. When the weight-average molecular weight of Resin A is within this range, a high level of balance between mechanical strength and moldability is achieved, making it suitable.

[0050] <<Carbon materials>> The plate body preferably further contains a carbon material in addition to the resin A. When the plate body further contains a carbon material, light blocking properties are created, making it possible to prevent light conduction between adjacent wells.

[0051] Examples of the carbon material include particulate carbon materials such as artificial graphite, flake graphite, exfoliated graphite, natural graphite, acid-treated graphite, expandable graphite, expanded graphite, and carbon black; fibrous carbon materials such as carbon nanotubes, vapor-grown carbon fibers, carbon fibers obtained by carbonizing organic fibers, and cut products thereof; etc. Among these, particulate carbon materials are preferred, and carbon black is more preferred.

[0052] The above-mentioned carbon materials can be used singly or in combination of two or more.

[0053] When the plate body contains a carbon material in addition to resin A, the content of the carbon material per 100 parts by mass of resin A is preferably 0.3 parts by mass or more, more preferably 1 part by mass or more, and even more preferably 1.4 parts by mass or more, and preferably 30 parts by mass or less, more preferably 25 parts by mass or less, and even more preferably 20 parts by mass or less. If the content of the carbon material per 100 parts by mass of resin A is 0.3 parts by mass or more, it is possible to reduce light conduction between adjacent wells. Furthermore, if the content of the carbon material per 100 parts by mass of resin A is 30 parts by mass or less, it is possible to maintain the shape of the molded body well.

[0054] <<Other ingredients>> Components other than the resin A and the carbon material (other components) optionally contained in the plate body include compounding agents commonly used in thermoplastic resin materials, such as soft polymers not included in the above-mentioned resin A, antioxidants, ultraviolet absorbers, light stabilizers, near-infrared absorbers, release agents, colorants such as dyes and pigments, plasticizers, antistatic agents, fluorescent whitening agents, etc. The other components may be used alone or in combination of two or more in any ratio.

[0055] <<Plate body properties>> [Visible light transmittance] When the plate body contains a carbon material, the visible light transmittance of the plate body is preferably less than 0.1%, more preferably 0.075% or less, and even more preferably 0.05% or less. If the visible light transmittance of the plate body is less than 0.1%, a microplate suitable for optical cell observation can be produced. Furthermore, the lower limit of the visible light transmittance of the plate body is not particularly limited, and can be, for example, 0.001% or more, or 0.005% or more. The visible light transmittance of the plate body can be adjusted by, for example, changing the amount and type of resin A, the amount and type of carbon material, and the like.

[0056] <Bottom base material> The bottom substrate is a member that constitutes the bottom of the wells of the microplate of the present invention. The bottom substrate contains at least resin B and optionally further contains other components.

[0057] <<Resin B>> The thermoplastic resins that are solid at room temperature and normal pressure as described in the section on "Resin A" can be used as Resin B. Among these, it is preferable to use the same type of resin as Resin A as Resin B, more preferably a cycloolefin polymer or a polycarbonate resin, even more preferably a cycloolefin polymer, and particularly preferably a norbornene-based polymer.

[0058] [Glass transition temperature Tg B ] Here, the glass transition temperature Tg of Resin B B is not particularly limited as long as it satisfies the above-mentioned predetermined relational expression (1). B The glass transition temperature Tg of Resin B is preferably 140° C. or higher, more preferably 150° C. or higher, and even more preferably 160° C. or higher. B If the glass transition temperature Tg of Resin B is 140°C or higher, the flatness of the microplate can be further improved and the heat resistance of the microplate can be increased. B The upper limit of the temperature is not particularly limited, and can be, for example, 200°C or lower, or 180°C or lower.

[0059] [Weight average molecular weight] There are no particular limitations on the molecular weight of Resin B, but the weight-average molecular weight, calculated as polyisoprene, measured by gel permeation chromatography (GPC) of a cyclohexane solution (or a toluene solution if the polymer is insoluble) is usually 5,000 or more, preferably 5,000 to 500,000, more preferably 8,000 to 200,000, even more preferably 10,000 to 100,000, and particularly preferably 20,000 to 50,000. When the weight-average molecular weight of Resin B is within this range, a high level of balance between mechanical strength and moldability is achieved, making it suitable.

[0060] <<Other ingredients>> Components other than resin B that are optionally contained in the bottom substrate (other components) include the carbon material and other components described above in the section "Plate body."

[0061] The shape of the bottom substrate is not particularly limited, and can be, for example, a circle, a triangle, a square, a rectangle, etc. Furthermore, when the microplate is viewed from the side, the bottom substrate may be flat or may be curved downward or upward in a U-shape, but is preferably flat.

[0062] In the microplate of the present invention, when the bottom substrate is curved downward in a U-shape, the bottom substrate refers to the portion located below the end point of the straight line that constitutes the side wall of the well.

[0063] [Surface treatment] Here, the bottom substrate is preferably surface-treated. Both surfaces of the bottom substrate may be surface-treated, or only one surface may be surface-treated. From the viewpoint of enhancing the cell adhesiveness of the microplate, it is preferable that at least the upper surface of the bottom substrate (the surface in contact with the well space) is surface-treated. Examples of surface treatments that can be applied to the bottom substrate include plasma treatment; corona discharge; ultraviolet irradiation; flame firing; laser irradiation; gamma ray treatment; electron beam treatment; uneven processing such as embossing, blasting, and etching; vapor deposition; and surface treatment using a surface treatment agent. These surface treatments can be used alone or in combination of two or more. Among these, plasma treatment and surface treatment using a surface treatment agent are preferred from the viewpoint of enhancing the ease of cell observation.

[0064] Examples of surface treatment agents that can be used include proteins such as collagen, fibronectin, and laminin; cell adhesion peptides; and polymers such as poly-D-lysine. These surface treatment agents can be used alone or in combination of two or more. Among the above, collagen and cell adhesion peptides are preferred as surface treatment agents from the viewpoint of increasing the ease of cell observation.

[0065] Cell adhesion peptides suitable for use as surface treatment agents are peptides with cell adhesive properties and typically consist of 2 to 50 amino acid residues. Specific examples of such cell adhesion peptides include those described in Japanese Patent No. 7024730.

[0066] <<Properties of the bottom substrate>> [Light transmittance at 250 nm] The light transmittance of the bottom substrate at a wavelength of 250 nm is preferably 70% or more, more preferably 71% or more. If the light transmittance of the bottom substrate at a wavelength of 250 nm is 70% or more, cells in the wells of a microplate can be clearly observed. Furthermore, the upper limit of the light transmittance of the bottom substrate at a wavelength of 250 nm is not particularly limited, and can be, for example, 95% or less, 90% or less, or 85% or less.

[0067] [Light transmittance at 287 nm] The light transmittance of the bottom substrate at a wavelength of 287 nm is preferably 60% or more, more preferably 62% or more, and even more preferably 64% or more. If the light transmittance of the bottom substrate at a wavelength of 287 nm is 60% or more, cells in the wells of a microplate can be clearly observed. Furthermore, the upper limit of the light transmittance of the bottom substrate at a wavelength of 287 nm is not particularly limited, and can be, for example, 90% or less, 85% or less, or 80% or less. The light transmittance of the bottom substrate at 250 nm and 287 nm can be adjusted by, for example, changing the type of resin B, whether or not a surface treatment is performed, and the type of surface treatment.

[0068] Average Thickness The average thickness of the bottom substrate is preferably 90 μm or more, more preferably 95 μm or more, and is preferably 200 μm or less, more preferably 195 μm or less. If the average thickness of the bottom substrate is within the above range, cells in the wells of the microplate can be clearly observed using an oil immersion lens.

[0069] [Refractive Index] The refractive index of the bottom substrate is preferably 1.530 or more, more preferably 1.532 or more, and is preferably 1.540 or less, and more preferably 1.538 or less. If the refractive index of the bottom substrate is within the above range, cells and the like in the wells of a microplate can be clearly observed using an oil immersion lens. The refractive index of the bottom substrate can be adjusted by changing the material of the bottom substrate, whether or not a surface treatment is performed, and the type of surface treatment.

[0070] [Thickness accuracy] From the viewpoint of further improving the flatness of the microplate, the thickness accuracy of the bottom substrate is preferably ±3 μm or less, more preferably ±1 μm or less, and even more preferably ±0.3 μm or less. The lower limit of the thickness accuracy of the bottom substrate is not particularly limited, and can be, for example, ±0.01 μm or more, or ±0.1 μm or more. In the present invention, the thickness accuracy of the bottom substrate can be measured using the method described in the examples of this specification.

[0071] The microplate of the present invention can be suitably produced, for example, by either of the production methods 1 and 2 of the microplate of the present invention described below, although the production method is not particularly limited thereto.

[0072] (Microplate molding mold) The microplate molding die of the present invention (hereinafter sometimes abbreviated as "die") is used to mold the microplate of the present invention. The die of the present invention has a member for forming the plate body of the microplate (body-forming member) and a member for forming the periphery of the plate body of the microplate (periphery-forming member). Here, the mold of the present invention is characterized in that the main body forming member and the outer periphery forming member can be controlled to different temperatures.

[0073] Furthermore, since the mold of the present invention can control the main body forming member and the outer periphery forming member to different temperatures, microplates with excellent flatness can be manufactured using the mold of the present invention.

[0074] An example of the structure of the mold of the present invention will be further explained below with reference to Fig. 3. However, the mold of the present invention is not limited to the structure exemplified in Fig. 3.

[0075] The mold of the present invention consists of a pair of molds that can fit together, namely, a movable mold 32 and a fixed mold 33. The movable mold 32 has a main body forming member 34 for forming the plate body of the microplate and a periphery forming member 35 for forming the periphery of the microplate. By providing a thermal insulating structure at the joint between the main body forming member 34 and the periphery forming member 35, the main body forming member 34 and the periphery forming member 35 can be controlled to different temperatures. The main body forming member 34 has a cavity, a pin inserted into the cavity, and a portion that contacts the pin (pin contact portion). The pin inserted into the cavity forms the well of the microplate. A heat exchange pipe can be inserted into the pin, and a carbon nanotube sheet can also be placed at the pin contact portion.

[0076] The material of the pins and pin contact portions is not particularly limited, but may be a metal or alloy with high thermal conductivity such as copper, aluminum, copper alloy, etc. From the viewpoint of making the temperature distribution of the mold uniform and further improving the flatness of the obtained microplate, it is preferable that at least one of the pins and the pin contact portions be made of a copper alloy, and it is more preferable that both the pins and the pin contact portions be made of a copper alloy.

[0077] It is also preferable to place a carbon nanotube sheet at the pin contact area. By placing a carbon nanotube sheet at the pin contact area, the temperature distribution of the mold can be made uniform, further improving the flatness of the obtained microplate. A specific example of a carbon nanotube sheet is thermally conductive and heat dissipating material (TIM) VB200 (manufactured by Zeon Chemical Co., Ltd.).

[0078] The mold of the present invention preferably has a heat exchange pipe inside the pin. By disposing the heat exchange pipe inside the pin, the temperature distribution of the mold can be made uniform, further improving the flatness of the obtained microplate. The material of the heat exchange pipe is not particularly limited, but metals and alloys with high thermal conductivity such as copper, aluminum, and copper alloys can be used. Of these, copper is preferred.

[0079] (Microplate manufacturing method 1) The manufacturing method 1 of the microplate of the present invention includes a step of preparing a bottom substrate containing resin B (bottom substrate preparing step), and a step of fixing the bottom substrate prepared in the bottom substrate preparing step to a mold, and then filling the mold with a molding material containing resin A to form a plate body (insert injection molding step). Note that the manufacturing method 1 of the microplate of the present invention may include steps other than the bottom substrate preparing step and the insert injection molding step.

[0080] Furthermore, the method for manufacturing a microplate 1 of the present invention includes a bottom substrate preparation step and an insert injection molding step, and therefore can manufacture a microplate with excellent flatness.

[0081] <Bottom base material preparation process> In the bottom substrate preparation step, a bottom substrate is prepared that contains resin B. The bottom substrate may be prepared by molding a molding material that contains resin B, or a commercially available product may be used as is.

[0082] <<Molding material>> The molding material used to form the bottom substrate contains at least resin B and optionally further contains other components. As resin B and other components, those described above in the "microplate" section can be used.

[0083] The mixing method for obtaining a molding material containing the above-mentioned resin B and optionally other components is not particularly limited, and can be carried out using, for example, a known melt kneader such as a single-screw extruder, a twin-screw extruder, a Banbury mixer, a kneader, or a feeder ruder. After mixing, the mixture can be extruded into a rod shape in the usual way and cut to an appropriate length with a strand cutter to form pellets.

[0084] The method for forming the bottom substrate by molding the above-mentioned molding material is not particularly limited, and can be appropriately selected from known molding methods according to the desired shape of the bottom substrate. Such known molding methods include, for example, melt extrusion molding, injection molding, inflation molding, blow molding, extrusion blow molding, injection blow molding, press molding, vacuum molding, powder slush molding, calendar molding, foam molding, thermoforming, etc. Among them, it is preferable to use melt extrusion molding.

[0085] <Insert injection molding process> In the insert injection molding process, the bottom substrate prepared in the bottom substrate preparation process is fixed to a mold, and then a molding material containing resin A is filled into the mold to perform insert injection molding to form the plate body.

[0086] <<Mold>> The mold is not particularly limited, but the mold of the present invention described above can be suitably used.

[0087] When fixing the bottom substrate in the mold, it is preferable to clamp the mold by arranging the bottom substrate so that one surface of the bottom substrate is exposed to the space in the mold. Furthermore, when using a bottom substrate that has been surface-treated on only one side, it is preferable to arrange it so that the surface-treated surface is exposed to the space in the mold.

[0088] When the mold of the present invention described above is used as the mold, when filling the mold with a molding material containing resin A, the temperature of the main body forming member of the movable mold is preferably controlled to 20° C. to 40° C., more preferably 25 to 35° C., and the temperature of the periphery forming member of the movable mold is preferably controlled to 50° C. to 70° C., more preferably 55 to 65° C. By controlling the temperatures of the main body forming member and periphery forming member of the movable mold within the above-mentioned ranges, the flatness of the obtained microplate can be further improved. The temperature of the fixed mold is preferably controlled to 80°C to 100°C, and more preferably to 85°C to 95°C.

[0089] <<Molding material>> The molding material used in the insert injection molding process contains at least resin A and optionally further contains a carbon material and other components. The resin A, carbon material, and other components can be those described above in the "microplate" section.

[0090] The mixing method for obtaining a molding material containing the above-mentioned resin A and, optionally, a carbon material and other components is not particularly limited, and can be carried out using, for example, a known melt kneader such as a single-screw extruder, a twin-screw extruder, a Banbury mixer, a kneader, or a feeder ruder. After mixing, the mixture can be extruded into a rod shape in the usual way and cut to an appropriate length with a strand cutter to form pellets.

[0091] The insert injection molding can be carried out, for example, through the following steps (1) to (3). (1) A process in which molding material is poured from the hopper of an injection molding machine into a cylinder and heated to melt the molding material; (2) A step of extruding a molten molding material with a screw to fill the space in the mold; and (3) A step of cooling the mold until the temperature of the mold is lower than the glass transition temperature of Resin A.

[0092] 2 is a schematic diagram of a mold attached to an injection molding machine 2. The injection molding machine 2 includes, for example, a hopper 21, a cylinder 22, and a screw 23. The mold 3 is fixed by a die plate 31 and attached to the injection molding machine 2.

[0093] In the above step (1), the molding material is introduced into the cylinder 22 from the hopper 21 of the injection molding machine 2, and then the introduced molding material is melted by heating the cylinder 22. The specific heating temperature can be appropriately set depending on the type of resin A used, etc., but is usually 260 to 340°C, and preferably 300 to 320°C. Next, in the above step (2), the molding material in a molten state in the cylinder 22 is extruded by the screw 23 to fill the space in the mold 3. As a result, the bottom substrate fixed in advance in the mold 3 and the molding material filled in the mold 3 are melted together by the heat of the molding material and are fused together to become one body. Thereafter, in the above step (3), the mold 3 is cooled to a temperature lower than the glass transition temperature of the resin A, whereby the molten molding material solidifies to form the plate body.

[0094] Here, the temperature of the part of the mold where the wells of the microplate are to be formed is set to the glass transition temperature Tg A (°C) or higher, and after the step (2) (i.e., in the step (3)), the glass transition temperature Tg A It is preferable to control the temperature to 0° C. or less. By controlling the temperature of the mold portion that forms the wells of the microplate as described above, the flatness of the obtained microplate can be further improved.

[0095] <Other processes> Other steps that may be optionally included in the microplate manufacturing method 1 of the present invention include, for example, a step (surface treatment step) of performing a surface treatment on the bottom substrate obtained in the bottom substrate preparation step before the insert injection molding step, and a step (printing step) of printing on the plate body with an ultraviolet laser after the insert injection molding step.

[0096] In particular, the microplate manufacturing method 1 of the present invention preferably includes a printing step as another step. In the printing step, an ultraviolet laser is irradiated onto the molded plate body to print a two-dimensional barcode recording data such as the shot number and molding conditions. By including the printing step, the manufactured microplate can be linked to data such as the shot number and molding conditions, facilitating production management of the microplate.

[0097] Examples of surface treatments applied to the bottom substrate in the surface treatment step include those described above in the "microplate" section. The method for applying surface treatment to the bottom substrate is not particularly limited as long as the desired effect is obtained, and can be performed using known techniques. Furthermore, when applying surface treatment using a surface treatment agent, for example, a surface treatment agent solution can be prepared by dissolving the surface treatment agent in an appropriate solvent and applying the surface treatment agent solution to the surface of the surface substrate. The application method is not particularly limited, and known application methods such as bar coating, comma coating, dipping, roll coating, gravure coating, knife coating, air knife coating, roll knife coating, die coating, screen printing, spray coating, and gravure offset can be used. After application, the surface modifier solution applied to the surface of the bottom substrate can also be dried. The drying method is not particularly limited, and known methods can be used, such as drying using warm air, hot air, or low-humidity air, vacuum drying, and drying using infrared rays or electron beams.

[0098] (Microplate manufacturing method 2) The microplate manufacturing method 2 of the present invention includes at least a step of preparing a plate body containing resin A (plate body preparation step), and a step of melt-bonding the plate body prepared in the plate body preparation step and a bottom substrate with a laser having a wavelength absorbed by the plate body (melt-bonding step). Note that the microplate manufacturing method 2 of the present invention may include steps other than the plate body preparation step and the melt-bonding step.

[0099] Furthermore, the microplate manufacturing method 2 of the present invention includes the plate body preparation step and the fusion bonding step, and therefore can manufacture a microplate with excellent flatness.

[0100] <Plate body preparation process> In the plate body preparation step, a plate body containing resin A is prepared. The plate body may be prepared by molding a molding material containing resin A, or a commercially available product may be used as is.

[0101] <<Molding material>> The molding material used to form the plate body contains at least resin A and optionally further contains a carbon material and other components. As resin A, the carbon material, and other components, those described above in the section "Microplate" can be used.

[0102] The mixing method for obtaining a molding material containing the above-mentioned resin A and, optionally, a carbon material and other components is not particularly limited, and can be carried out using, for example, a known melt kneader such as a single-screw extruder, a twin-screw extruder, a Banbury mixer, a kneader, or a feeder ruder. After mixing, the mixture can be extruded into a rod shape in the usual way and cut to an appropriate length with a strand cutter to form pellets.

[0103] The method for molding the above-mentioned molding material to form the plate body is not particularly limited, and can be appropriately selected from known molding methods depending on the desired shape of the plate body, such as extrusion molding, injection molding, inflation molding, blow molding, extrusion blow molding, injection blow molding, press molding, vacuum molding, powder slush molding, calendar molding, foam molding, thermoforming, etc.

[0104] <Fusion bonding process> In the fusion bonding step, the plate body prepared in the plate body preparation step and the bottom base material are fusion bonded together using a laser having a wavelength that is absorbed by the plate body.

[0105] As the bottom substrate, those described above in the section "microplate" can be used.

[0106] Here, the wavelength of the laser used to melt-bond the plate body and the bottom substrate in the melt-bonding step must be a wavelength that can be absorbed by the plate body. When the plate body absorbs the laser wavelength, the resin A contained in the plate body is melted by the heat of the laser and welded to the bottom substrate, thereby integrating the plate body and the bottom substrate. The wavelength of the laser used in the melt-bonding step is usually 380 to 12,000 nm, preferably 380 to 780 nm.

[0107] <Other processes> Other steps that may be optionally included in the microplate manufacturing method 2 of the present invention include, for example, the printing step and surface treatment step described above in the section "Microplate manufacturing method 1." [Example]

[0108] The present invention will be specifically described below based on examples, but the present invention is not limited to these examples. In the following description, "%" and "parts" representing amounts are based on mass unless otherwise specified. In the examples and comparative examples, various measurements and evaluations were carried out by the following methods.

[0109] <Glass transition temperature> The glass transition temperature was measured in accordance with JIS K 7121. <Light transmittance at 250nm and 287nm> The bottom substrates prepared in each of the Examples and Comparative Examples were used as test pieces, and the light transmittance in the thickness direction was measured at wavelengths of 250 nm and 287 nm using an integrating sphere spectrophotometer (V-670, manufactured by JASCO Corporation) in accordance with JIS K7375 (Method of determining total light transmittance and total light reflectance of plastics). <Visible light transmittance> The plate bodies produced in each of the Examples and Comparative Examples were used as test specimens, and the light transmittance in the thickness direction was measured in the wavelength range of 300 nm to 800 nm using an integrating sphere spectrophotometer (V-670, manufactured by JASCO Corporation) in accordance with JIS K7375 (Determination of total light transmittance and total light reflectance for plastics). <Refractive index> The bottom substrates prepared in each of the examples and comparative examples were used as test specimens, and the refractive indexes at 23°C were measured using a precision refractometer (manufactured by Shimadzu Corporation, light source = He lamp (wavelength 587.6 nm), light source = H2 lamp (wavelengths 656.3 nm and 486.1 nm), light source = Hg discharge tube (wavelength: 589.3 nm)). The table shows the refractive index for light with a wavelength of 589.3 nm. <Average thickness> The thickness of the bottom substrate was measured at 10 different points using a multilayer film thickness measuring instrument (manufactured by Keyence Corporation, product name "SI-T10"), and the average thickness was calculated as the average value of the measured thicknesses. <Thickness precision> The thickness of the bottom substrate was measured at 10 different points using a multilayer film thickness measuring instrument (manufactured by Keyence Corporation, product name "SI-T10"), and the thickness precision was calculated as the standard deviation of the measured thickness. <Flatness> The flatness of the microplates prepared in the examples and comparative examples was evaluated. Specifically, the distance (μm) from the bottom edge of the microplate to the bottom of the well was measured for all wells of the microplate. Then, the WBEV (μm) was calculated as the difference between the maximum and minimum measured distances. In addition, the distance between the highest and lowest points within the bottom of the well was measured for all wells of the microplate, and the IWBEV (μm) was calculated as the average value. The smaller the WBEV and IWBEV values, the better the flatness. <Ease of cell observation> Cells and culture medium were placed in each well of the microplates prepared in the examples and comparative examples, and after culturing for 24 hours at 37°C and 90% RH, the cells were observed under a microscope and evaluated according to the following criteria. [In the same well] A: Cells exist in the same well whose outlines can be recognized over the entire range within ±30 μm in the Z direction relative to the focal position adjusted for cell observation. B: Within the same well, within a range of ±30 μm in the Z direction relative to the focal position adjusted for cell observation, there is a location where no cells exist with a recognizable outline. [Between wells] The microscope was focused to observe the cells in one well of the microplate, and it was then investigated whether it was necessary to adjust the focus in the Z-axis direction of the microscope to observe the cells in other wells, and the results were evaluated according to the following criteria. A: By adjusting the focus of the microscope on the cells in one well, you can observe the cells in other wells without adjusting the focus in the Z-axis direction. B: After adjusting the focus of the microscope on the cells at the bottom of one well, cells in other wells cannot be observed unless the focus is adjusted in the Z-axis direction.

[0110] Example 1 <Preparation of microplates> A film B1 (manufactured by Zeon Corporation, trade name "ZeonorFilm® ZF16-188"; glass transition temperature 163°C) composed of a norbornene-based polymer as the bottom substrate was placed in a mold having the structure shown in Figure 3, and the mold was clamped. Next, the clamped mold was attached to an injection molding machine (manufactured by The Japan Steel Works, Ltd., product name "J110ELIII"). Next, a norbornene-based polymer A1 (manufactured by Zeon Corporation, trade name "ZEONOR® 1420R"; glass transition temperature 136°C) serving as resin A was poured from the hopper into the cylinder of the injection molding machine and heated to 320°C to become molten. The molten resin A was then extruded with a screw and filled into the mold. After the temperature inside the mold cooled below the glass transition temperature of resin A, the microplate was removed from the mold. The flatness of this microplate was evaluated. The results are shown in Table 1.

[0111] Example 2 A microplate was produced in the same manner as in Example 1, except that a mixture of norbornene polymer A1 and carbon black (manufactured by Mitsubishi Chemical Corporation, product name "#650B") (norbornene polymer A1 / carbon black = 100 / 1.5 (mass ratio)) was used instead of norbornene polymer A1. Evaluation was then carried out in the same manner as in Example 1. The results are shown in Table 1.

[0112] Example 3 A microplate was produced in the same manner as in Example 1, except that Film B2 (manufactured by Zeon Corporation, trade name "ZeonorFilm ZF16-100"; glass transition temperature 163°C) composed of a norbornene-based polymer was used instead of Film B1. Evaluations were then carried out in the same manner as in Example 1. The results are shown in Table 1.

[0113] Example 4 A microplate was produced in the same manner as in Example 1, except that Film B3 (manufactured by Zeon Corporation, trade name "ZeonorFilm ZF16-168.9"; glass transition temperature 163°C) composed of a norbornene-based polymer was used instead of Film B1. Evaluations were then carried out in the same manner as in Example 1. The results are shown in Table 1.

[0114] Example 5 A microplate was produced in the same manner as in Example 1, except that film B1 coated on one side with collagen was used instead of film B1. Evaluation was then carried out in the same manner as in Example 1. The results are shown in Table 1.

[0115] Example 6 A microplate was produced in the same manner as in Example 1, except that instead of film B1, one side of film B1 was coated with a peptide (number of amino acid residues: 29) containing an amino acid sequence (Ala-Cys-Thr-Val-Asp-Ser-Cys-Leu-Thr-Cys-Gly-Gly-Gly-Gly-Ser-Ser-Ser-Gly-Leu-Gly) that has the property of specifically adsorbing to a norbornene-based polymer described in Japanese Patent No. 6471567. Evaluation was then performed in the same manner as in Example 1. The results are shown in Table 1.

[0116] Example 7 A microplate was produced in the same manner as in Example 1, except that the bottom substrate prepared as follows was used, and evaluation was carried out in the same manner as in Example 1. The results are shown in Table 1. <Preparation of bottom substrate> A bottom substrate was produced using norbornene polymer A1 according to the method of Example 1 described in Japanese Patent No. 6471564.

[0117] Example 8 A microplate was produced in the same manner as in Example 1, except that an embossed film B1 was used instead of film B1. Evaluations were then carried out in the same manner as in Example 1. The results are shown in Table 1.

[0118] Example 9 A microplate was produced in the same manner as in Example 1, except that a plasma-treated film B1 was used instead of film B1. Evaluations were then carried out in the same manner as in Example 1. The results are shown in Table 1.

[0119] Example 10 A film made of polycarbonate resin (manufactured by Teijin Limited, product name "Panlite (registered trademark) PC-2152") was used instead of film B1, and an acrylic resin (manufactured by Mitsubishi Chemical Corporation, product name "ACRYPET (registered trademark) TN100") was used instead of norbornene-based polymer A1. Except for this, a microplate was produced in the same manner as in Example 1. Evaluation was then carried out in the same manner as in Example 1. The results are shown in Table 1.

[0120] (Comparative Example 1) A microplate was produced in the same manner as in Example 1, except that Film B4 (manufactured by Zeon Corporation, trade name "ZeonorFilm ZF14-188"; glass transition temperature 136°C) composed of a norbornene-based polymer was used instead of Film B1. Evaluations were then carried out in the same manner as in Example 1. The results are shown in Table 2.

[0121] (Comparative Example 2) A microplate was produced in the same manner as in Example 1, except that Film B4 was used instead of Film B1, and Norbornene-based Polymer A2 (manufactured by Zeon Corporation, trade name "ZEONEX (registered trademark) 790R"; glass transition temperature 163°C) was used instead of Norbornene-based Polymer A1. Evaluations were then carried out in the same manner as in Example 1. The results are shown in Table 2.

[0122] (Comparative Example 3) A microplate was produced in the same manner as in Example 1, except that Film B4 was used instead of Film B1, and Norbornene-based Polymer A3 (manufactured by Zeon Corporation, trade name "ZEONOR 1430R"; glass transition temperature 133°C) was used instead of Norbornene-based Polymer A1. Evaluations were then carried out in the same manner as in Example 1. The results are shown in Table 2.

[0123] In addition, in Tables 1 and 2 shown below, "CB" indicates carbon black, "1420R" indicates ZEONOR 1420R, "PMMA" indicates acrylic resin, "790R" indicates ZEONEX 790R, "1430R" indicates ZEONOR 1430R, "ZF16-188" indicates ZeonorFilm ZF16-188, "ZF16-100" refers to the ZeonorFilm ZF16-100, "ZF16-168.9" indicates the ZeonorFilm ZF16-168.9, "ZF14-188" indicates ZeonorFilm ZF14-188, "PC" refers to polycarbonate resin.

[0124] [Table 1]

[0125] [Table 2]

[0126] From Table 1, the glass transition temperature (Tg B ) is the glass transition temperature (Tg A ) are 20° C. or more higher than the microplates of Examples 1 to 10, and are found to be excellent in flatness. On the other hand, from Table 2, TgB and Tg A It can be seen that the microplates of Comparative Examples 1 to 3, in which the difference in temperature was less than 20°C, had lower flatness than the microplates of Examples 1 to 10. [Industrial Applicability]

[0127] According to the present invention, it is possible to provide a microplate with excellent flatness, a method for manufacturing the microplate, and a mold used for molding the microplate. [Explanation of symbols]

[0128] 1 microplate 11 Plate body 12 Bottom base material 13 wells 2 Injection molding machine 21 Hopper 22 cylinders 23 Screw 3. Mold 31 Die Plate 32 Movable mold 33 Fixed mold 34 Body forming member 35 Periphery forming member

Claims

1. A bottom substrate and a plate body provided on the bottom substrate, The glass transition temperature of the resin (resin A) constituting the plate body is Tg Ａ (°C), and the glass transition temperature of the resin (resin B) constituting the bottom substrate is Tg Ｂ (°C), the following formula (1): Tg Ｂ -Tg Ａ ≧20℃ ・・・(1) Fill the microplate.

2. the plate body further comprises a carbon material; 2. The microplate of claim 1, wherein the visible light transmittance of the plate body is less than 0.1%.

3. 2. The microplate according to claim 1, wherein the light transmittance of the bottom substrate is 70% or more at a wavelength of 250 nm.

4. 2. The microplate according to claim 1, wherein the light transmittance of the bottom substrate is 60% or more at a wavelength of 287 nm.

5. 2. The microplate according to claim 1, wherein the refractive index of the bottom substrate is 1.530 or more and 1.540 or less.

6. 2. The microplate according to claim 1, wherein the average thickness of the bottom substrate is 90 μm or more and 200 μm or less.

7. The microplate of claim 1 , wherein the bottom substrate is surface-treated.

8. 8. The microplate according to claim 7, wherein the surface treatment is at least one selected from the group consisting of plasma treatment, coating with collagen, and coating with a cell adhesion peptide.

9. A method for producing a microplate according to any one of claims 1 to 8, preparing the bottom substrate containing the resin B; a step of fixing the prepared bottom base material to a mold, and then filling the mold with a molding material containing the resin A to form the plate body; A method for producing a microplate, comprising:

10. In the filling step, the temperature of the portion of the mold where the wells of the microplate are to be formed is set to the glass transition temperature Tg Ａ (°C) or higher, and after the filling step, the glass transition temperature Tg Ａ The method for producing a microplate according to claim 9, wherein the temperature is set to (°C) or less.

11. The method for producing a microplate according to claim 9, further comprising the step of printing on the plate body with an ultraviolet laser.

12. A method for producing a microplate according to any one of claims 1 to 8, preparing the plate body containing the resin A; a step of melt-joining the prepared plate body and the bottom base material with a laser having a wavelength that is absorbed by the plate body; A method for producing a microplate, comprising:

13. The method for producing a microplate according to claim 12, further comprising the step of printing on the plate body with an ultraviolet laser.

14. A mold used for molding the microplate according to any one of claims 1 to 8, the mold has a member that forms the plate body and a member that forms an outer periphery of the plate body, A mold for molding microplates, wherein the two members can be controlled to different temperatures.

15. further comprising pins for forming wells in the microplate; The microplate molding die according to claim 14, wherein the pins and / or the contact portions of the pins are made of a copper alloy.

16. The microplate mold according to claim 15, wherein a carbon nanotube sheet is provided at the contact portion of the pin.

17. The microplate mold of claim 15, further comprising a heat exchange pipe within the pin.

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