Cooling apparatus and method for cooling water flow

Abstract

To provide a cooling apparatus for cooling a water flow.SOLUTION: A cooling apparatus for cooling a water flow is provided. The cooling apparatus comprises: a first evaporative cooler adapted to cool the water flow passing therethrough; a second evaporative cooler adapted to receive and cool the water flow passing through the first evaporative cooler, the second evaporative cooler being adapted to receive a passing air flow to cool the passing water flow, and the first evaporative cooler being adapted to receive the passing air flow from the second evaporative cooler to cool the passing water flow; and a deflector adapted to deflect the water flow from the first evaporative cooler to the second evaporative cooler and allow the air flow from the second evaporative cooler to the first evaporative cooler. A cooling method for cooling a water flow is also provided.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a cooling tower for cooling a water stream and a method for cooling a water stream. [Background technology]

[0002] Cooling towers and other cooling devices are used in buildings to cool water used in buildings, for example, for air conditioning. In conventional cross-flow chillers, dry air from the atmosphere passes horizontally through an infill, while water flows vertically downward through the infill, perpendicular to the water flow. This is why they are called cross-flow chillers. However, such cross-flow chillers have relatively low thermal efficiency. As the air flows across the water, it becomes saturated with water vapor, cooling the water through the infill. The air exiting the top of the infill is heated by the high-temperature water flowing into the infill. Meanwhile, the air exiting the bottom of the infill is relatively cool because the water loses heat as it falls through the infill. Therefore, the bottom of the infill remains cooler. The air is then exhausted by an exhaust fan located at the top of the chiller. The exhaust air is a mixture of high-temperature saturated air and low-temperature saturated air. This mixed flow limits the thermal efficiency of conventional chillers. Counterflow cooling towers are designed to overcome this limitation. Counterflow cooling towers overcome the above limitations, but have very high airflow resistance, which reduces the amount of airflow through the cooling system, thereby reducing the water carrying capacity of the airflow and again limiting the thermal efficiency of the cooling system.

[0003] Therefore, there is a need to improve the thermal efficiency and efficiency of such cooling devices. Summary of the Invention

[0004] According to various embodiments, a cooling apparatus for cooling a water flow is provided, the cooling apparatus comprising: a first evaporative cooler adapted to cool the water flow passing therethrough; a second evaporative cooler adapted to receive and cool the water flow through the first evaporative cooler, the second evaporative cooler adapted to receive and cool the air flow passing therethrough and the first evaporative cooler adapted to receive and cool the water flow passing therethrough from the second evaporative cooler; and a deflector adapted to deflect the water flow from the first evaporative cooler to the second evaporative cooler and to allow the air flow from the second evaporative cooler to the first evaporative cooler.

[0005] According to various embodiments, the deflector may have a first side and a second side behind the first side, whereby the deflector may be adapted to allow the water flow from the first evaporative cooler to the second evaporative cooler on the first side and to allow the air flow passing from the second evaporative cooler to the first evaporative cooler to flow from the second side to the first side.

[0006] According to various embodiments, the deflector may include a base layer having a plurality of openings adapted to pass the airflow therethrough and a plurality of protrusions spaced apart from one another and protruding into the plurality of openings, whereby the plurality of protrusions may be adapted to allow the airflow from the plurality of openings to flow between the plurality of protrusions and to obstruct the water flow to the plurality of openings, causing the water flow into the second evaporative cooler.

[0007] According to various embodiments, the deflector may comprise a louver panel having a plurality of overlapping panels and a plurality of gaps therebetween, such that during operation, the water flow from the first evaporative cooler may flow toward the plurality of overlapping panels and into the second evaporative cooler, and the air flow from the second evaporative cooler may flow through the plurality of gaps.

[0008] According to various embodiments, the base layer may include a plurality of openings adapted to pass airflow therethrough and a top layer, whereby the base layer may be adapted to receive the water flow and channel it to the second evaporative cooler, and the top layer may include a plurality of overhangs spaced apart from one another and overhanging the plurality of openings, whereby each of the plurality of overhangs may be adapted to receive the water flow and channel it to the base layer.

[0009] According to various embodiments, the base layer may include a plurality of flow channels spaced apart from one another to define the plurality of openings therebetween, whereby the plurality of flow channels may be adapted to direct the water flow to the second evaporative cooler, and the plurality of overhanging portions may include a plurality of flow channels.

[0010] According to various embodiments, the cooling device may further comprise a plurality of guides spaced apart from one another and adapted to guide the airflow from the second evaporative cooler to the first evaporative cooler.

[0011] According to various embodiments, the plurality of guides may be adapted to guide the airflow from the second evaporative cooler to the deflector. According to various embodiments, the first evaporative cooler may be positioned above the second evaporative cooler.

[0012] According to various embodiments, a method for cooling a water flow is provided, the method including receiving an airflow from a second evaporative cooler through a first evaporative cooler to cool the water flow through the first evaporative cooler, receiving an airflow from the first evaporative cooler through the second evaporative cooler to cool the water flow through the second evaporative cooler, deflecting the water flow from the first evaporative cooler to the first evaporative cooler with a deflector, and allowing the airflow from the second evaporative cooler to the first evaporative cooler.

[0013] According to various embodiments, deflecting the water flow and allowing the air flow may include directing the water flow from the first evaporative cooler to the second evaporative cooler through the deflector and allowing the air flow from the second evaporative cooler to the first evaporative cooler.

[0014] According to various embodiments, deflecting the water flow and allowing the air flow may include causing the water flow to flow from the first evaporative cooler to the second evaporative cooler on a first side of the deflector, and allowing the air flow from the second evaporative cooler to the first evaporative cooler from the second side of the deflector to the first side.

[0015] According to various embodiments, deflecting the water flow and allowing the air flow may include allowing the air flow through a plurality of openings in a base layer, allowing the air flow through the plurality of openings to flow between a plurality of spaced apart overhangs that overhang the plurality of openings, and impeding the water flow into the plurality of openings to cause the water flow to flow into the second evaporative cooler.

[0016] According to various embodiments, deflecting the water flow and permitting the air flow may include permitting the air flow through a plurality of openings in a base layer to receive the water flow and direct it to the second evaporative cooler, and receiving the water flow through a top layer having a plurality of flares spaced apart from one another and extending into the plurality of openings to direct it to the base layer.

[0017] According to various embodiments, the cooling method may further include directing the airflow from the second evaporative cooler to the first evaporative cooler. According to various embodiments, the cooling method may further include directing the airflow from the second evaporative cooler to the deflector evaporative cooler. [Brief explanation of the drawings]

[0018] [Figure 1] 1 is a cross-sectional view illustrating an exemplary embodiment of a cooling device for cooling a water flow. [Figure 2] 4 is a flow chart illustrating a cooling method for cooling a water flow. [Figure 3A] 1 is a cross-sectional view illustrating an exemplary embodiment of a deflector. [Figure 3B] FIG. 3B is a top view of an exemplary embodiment of the deflector shown in FIG. 3A. [Figure 4A] 1 is a cross-sectional view illustrating an exemplary embodiment of a deflector. [Figure 4B] FIG. 4B is a top view of an exemplary embodiment of the deflector shown in FIG. 4A. [Figure 4C] FIG. 4B is a side view of an exemplary embodiment of the deflector shown in FIG. 4A. [Figure 5] 1 is a cross-sectional view illustrating an exemplary embodiment of a cooling device. DETAILED DESCRIPTION OF THE INVENTION

[0019] In the following examples, reference is made to the figures in which like parts are numbered similarly. 1 is a cross-sectional view of an exemplary embodiment of a cooling device 100 for cooling a water flow 10. Cooling device 100 includes a first evaporative cooler 110 and a second evaporative cooler 120. First evaporative cooler 110 is adapted to cool the water flow 10 passing therethrough, and second evaporative cooler 120 is adapted to receive and cool the water flow 10 passing through first evaporative cooler 110. Second evaporative cooler 120 is adapted to receive and cool the air flow 20 passing therethrough. First evaporative cooler 110 is adapted to receive and cool the water flow 10 passing therethrough from second evaporative cooler 120 and cool the water flow 10 passing therethrough. Cooling device 100 includes a deflector 130. The deflector 130 is adapted to deflect the water flow 10 from the first evaporative cooler 110 to the second evaporative cooler 120 and to allow the air flow 20 from the second evaporative cooler 120 to the first evaporative cooler 110. The first evaporative cooler 110 of the cooling apparatus 100 of the present invention may provide a thermal barrier to the water flow 10 entering the cooling apparatus 100 so that the cooled water flow 10 is evaporated by the cooled air flow 20 from the second evaporative cooler 120. The cooled water flow 10 from the first evaporative cooler 110 flows to the second evaporative cooler 120 for further cooling. Compared to conventional cooling towers in which a heated water flow enters a chamber and infill, the thermal efficiency and effectiveness of the cooling apparatus 100 are increased. Furthermore, the water flow 10 further cooled by the second evaporative cooler 120 cools the air flow 20 entering the cooling apparatus 100 to a lower temperature compared to the temperature of the air flow entering via the cross-flow infill of a conventional cooling tower. Thus, the cooler air flow 20 flows from the second evaporative cooler 120 to the first evaporative cooler 110, further cooling the water flow 10 entering the first evaporative cooler 110. As can be seen, the cooling effectiveness and efficiency of the cooling system 100 is greater than or equal to that of a conventional cooling tower.

[0020] 1 , cooling device 100 may include chamber 140 having upper section 140T, middle section 140C, and lower section 140B. First evaporative cooler 110 may be disposed in upper section 140T, and second evaporative cooler 120 may be disposed in lower section 140B, thereby disposing first evaporative cooler 110 above second evaporative cooler 120. Deflector 130 may be disposed in middle section 140C between first evaporative cooler 110 and second evaporative cooler 120. With respect to water flow 10, first evaporative cooler 110 can be considered to be disposed upstream of deflector 130, and second evaporative cooler 120 can be considered to be disposed downstream of deflector 130.

[0021] Referring to FIG. 1 , the cooling device 100 may include a water inlet 142 in the upper section 140T and a water outlet 144 in the lower section 140B. In this case, the water flow 10 may enter the chamber 140 through the upper section 140T and exit the chamber 140 through the lower section 140B. The cooling device 100 may include multiple nozzles 142N connected to the water inlet 142. The multiple nozzles 142N extend horizontally or laterally across the chamber 140 to distribute the water flow 10 evenly across the width of the chamber 140. The cooling device 100 may include an air inlet 146 in the lower section 140B of the chamber 140 and an air outlet 148 in the upper section 140T. In this case, the air flow 20 may enter the chamber 140 through the air inlet 146 in the lower section 140B and exit through the air outlet 148 in the upper section 140T. The cooling device 100 may include two or more air inlets 146 and two or more water outlets 144. The first evaporative cooler 110 may be positioned downstream or below the water inlet 142 to receive the water flow 10. The first evaporative cooler 110 may extend laterally or horizontally across the chamber 140 so that the water flow 10 passes through the first evaporative cooler 110 before flowing to the second evaporative cooler 120. The first evaporative cooler 110 may be positioned below the plurality of nozzles 142N to receive the water flow 10. The cooling device 100 may include a fan 150 positioned across the air outlet 148 and for discharging the air flow 20 from the top of the chamber 140. As shown in FIG. 1 , the fan 150 may be positioned above the plurality of nozzles 142N. The first evaporative cooler 110 may be positioned below the fan 150. The second evaporative cooler 120 may be connected to an air inlet 146 such that the air flow 20 enters the chamber 140 through the air inlet 146. The second evaporative cooler 120 may be connected to a water outlet 144 such that the water flow 10 exits the chamber 140 through the water outlet 144. The second evaporative cooler 120 may be positioned downstream of the air inlet 146 to receive the air flow 20 entering the chamber 140. The second evaporative cooler 120 may be positioned upstream of the water outlet 144 so that the water flow 10 exits the chamber 140.A water pan 152 may be fluidly connected to the chamber 140 to collect the water flow 10 discharged from the chamber 140. The water pan 152 may include a water conduit 154 for carrying the collected cooled water for use as needed in a building condenser, etc. The water flow 10 may also flow directly from the water outlet 144 without passing through the water pan 152. The second evaporative cooler 120 may extend longitudinally or vertically. As shown in FIG. 1, the water flow 10 may flow longitudinally through the second evaporative cooler 120, and the air flow 20 may flow laterally through the second evaporative cooler 120, forming a cross-flow. The second evaporative cooler 120 may include one or more infills. As shown in FIG. 1, the second evaporative cooler 120 may include two infills positioned opposite each other across the chamber 140. The second evaporative cooler 120 may extend along the periphery of the chamber 140, surrounding the chamber 140. 1 is shown in a vertical configuration with the first evaporative cooler 110 positioned above the second evaporative cooler 120, for example, but the cooling system 100 may also be arranged in a horizontal configuration with the first evaporative cooler 110 and the second evaporative cooler 120 positioned horizontally at the same height from the ground. In this case, the water flow 10 may be pumped from the first evaporative cooler 110 to the second evaporative cooler 120, and the air flow 20 may be drawn laterally across both the first evaporative cooler 110 and the second evaporative cooler 120.

[0022] 2 is a flowchart of a cooling method 2000 adapted to cool a water flow 10. The method 2000 includes, at block 2100, receiving an air flow 20 from a second evaporative cooler 120 through a first evaporative cooler 110 for cooling the water flow 10 through the first evaporative cooler 110. The method 2000 further includes, at block 2200, receiving an air flow 20 through the second evaporative cooler 120 for cooling the water flow 10 from the first evaporative cooler 110 through the second evaporative cooler 120. The method 2000 further includes, at block 2300, deflecting the water flow 10 from the first evaporative cooler 110 to the first evaporative cooler 110 with a deflector 130 and allowing the air flow 20 from the second evaporative cooler 120 to the first evaporative cooler 110. As described, the first evaporative cooler 110 may be adapted to allow the water flow 10 from the plurality of nozzles 142N to flow downward and the air flow 20 from the deflector 130 to flow upward. In this manner, the first evaporative cooler 110 may be adapted to allow a counterflow between the water flow 10 and the air flow 20. As a result, the water flow 10 may be evaporatively cooled as the air flow 20 passes through the water flow 10. The second evaporative cooler 120 may be adapted to allow a downward flow through the water flow 10 from the first evaporative cooler 110 and to allow the air flow 20 to flow over the second evaporative cooler 120. In this manner, the second evaporative cooler 120 may be adapted to allow a crossflow between the water flow 10 and the air flow 20. As a result, the water flow 10 may be evaporatively cooled as the air flow 20 passes through the water flow 10. Thus, the cooling system 100 may be a crossflow-counterflow two-stage cooling system 100.

[0023] During operation of the cooling device 100, a water stream 10, which is relatively hot and flows from a heat source, such as a building condenser, may flow into the chamber 140 of the cooling device 100. The first evaporative cooler 110 may be adapted to receive and pass the "heated" water stream 10. The water is sprayed from a plurality of nozzles 142N, entering the first evaporative cooler 110 from the upper side and exiting the first evaporative cooler 110 from the lower side. Simultaneously, the second evaporative cooler 120 may be adapted to receive an air stream 20 passing from the atmosphere. As the air stream 20 from the second evaporative cooler 120 flows from the lower side of the first evaporative cooler 110 and exits the upper side, the air stream 20 evaporatively cools the water stream 10 through the water stream 10, i.e., countercurrently. The downward-flowing water stream 10 contacts the upward-flowing air stream 20, thereby cooling the water stream 10. The temperature of the water stream 10 exiting the first evaporative cooler 110 is lower than the temperature of the "heated" water stream 10 entering the first evaporative cooler 110. Meanwhile, the air stream 20 is heated to a temperature close to that of the incoming water stream 10 and saturated with water vapor. In this manner, the thermal cooling capacity of the first evaporative cooler 110 is maximized. Preferably, the temperature exiting the first evaporative cooler 110 is uniform throughout the first evaporative cooler 110, and the temperature of the air stream 20 exiting the top surface of the first evaporative cooler 110 is uniform throughout the first evaporative cooler 110.

[0024] The water flow 10 from the first evaporative cooler 110 may be deflected by the deflector 130 to the second evaporative cooler 120. The second evaporative cooler 120 may receive the water flow 10 as the air flow 20 passes through, and the water flow 10 may be evaporatively cooled, for example, by the cross-flowing air flow 20. In this manner, the temperature of the water flow 10 exiting the second evaporative cooler 120 may be lower than the temperature entering the second evaporative cooler 120. As a result, the air flow 20 absorbs heat and moisture from the water flow 10. The air flow 20 then enters the chamber 140 via the second evaporative cooler 120 and may be cooled by the “cooled” second evaporative cooler 120, and the cooled air flow 20 may be passed through the deflector 130 and the first evaporative cooler 110 to further cool the water flow 10 through the first evaporative cooler 110. In this manner, the water stream 10 is cooled before entering the second evaporative cooler 120 where it cools the air stream 20 passing through the second evaporative cooler 120. Such a continuous cooling cycle improves the thermal efficiency and effectiveness of the cooling system 100.

[0025] 1 , deflector 130 may include a first side 130F and a second side 130S behind first side 130F. Deflector 130 may be adapted to allow water flow 10 to flow from first evaporative cooler 110 to second evaporative cooler 120 on first side 130F, while allowing air flow 20 passing from second evaporative cooler 120 to first evaporative cooler 110 to flow from second side 130S to first side 130F. Deflector 130 may be designed to prevent water flow 10 from flowing from first side 130F to second side 130S. Additionally, water flow 10 from first evaporative cooler 110 may be channeled into second evaporative cooler 120 and may leak into second side 130S, e.g., water pan 152, to prevent water flow 10 from mixing with the cooling water in water pan 152 without first being cooled by second evaporative cooler 120. Also, due to the effect of deflector 130 in separating water flow 10 from air flow 20, water flow 10 exiting first evaporative cooler 110 may be channeled to the top of second evaporative cooler 120.

[0026] Deflector 130 may include a base layer 130B having a plurality of openings 130P adapted to pass air flow 20 therethrough and a plurality of spaced apart overhanging portions 130V overhanging the plurality of openings 130P. The plurality of overhanging portions 130V may be adapted to allow air flow 20 from the plurality of openings 130P to flow therebetween and to impede water flow 10 into the plurality of openings 130P, causing water flow 10 to flow into second evaporative cooler 120.

[0027] 1, deflector 130 may include louvered panels 132 having a plurality of overlapping panels 132P and a plurality of gaps 132G therebetween. In operation, water flow 10 from first evaporative cooler 110 flows toward overlapping panels 132P and into second evaporative cooler 120, and air flow 20 from second evaporative cooler 120 flows through gaps 132G.

[0028] FIG. 3A is a cross-sectional view of an exemplary embodiment of a deflector 330. FIG. 3A is a cross-sectional view taken along line AA in FIG. 3B. The deflector 330 may include a base layer 330B having a plurality of openings 33OP adapted to allow the airflow 20 to pass therethrough. The base layer 330B may also be adapted to receive and channel the water flow 10 to the second evaporative cooler 320 (not shown in FIG. 3A). The deflector 330 may include a top layer 330T having a plurality of spaced-apart overhanging portions 330V overhanging the plurality of openings 33OP. Each of the plurality of overhanging portions 330V may be adapted to receive and channel the water flow 10 to the base layer 330B. As shown in FIG. 3A, the base layer 330B may be a covered tray, and the plurality of openings 330P may be a plurality of through-holes for the airflow 20 to pass therethrough. The base layer 330B may be in fluid communication with the second evaporative cooler 320 so that the water flow 10 collected therein flows to the second evaporative cooler 320. Each of the multiple overhanging portions 330V may extend from the base layer 330B. Each of the multiple overhanging portions 330V may include a funnel 330L having a wide top portion 330W overhanging the opening 330P and a narrow bottom portion 330B connected to the base layer 330B. Each of the multiple overhanging portions 330V may be in fluid communication with the base layer 330B so that the water flow 10 flowing through the overhanging portion 330V flows into the base layer 330B, which may direct the water flow 10 to the second evaporative cooler 320. The top layer 330T may include multiple secondary overhanging portions 330V2 overhanging the multiple overhanging portions 330V. Each of the plurality of secondary overhanging portions 330V2 may extend from the base layer 330B through the plurality of overhanging portions 330V. Each of the plurality of secondary overhanging portions 330V2 may be adapted to receive and channel the water flow 10 into the base layer 330B. Each of the plurality of secondary overhanging portions 330V2 may include a funnel 330L having a wide top portion 330W that overhangs the plurality of spaces (shown in FIG. 3B ) formed by the plurality of overhanging portions 330V, and a narrow bottom portion 330B connected to the base layer 330B.Each of the multiple secondary overhangs 330V2 may be in fluid communication with the base layer 330B such that the water flow 10 flowing through the secondary overhangs 330V2 flows into the base layer 330B, which may direct the water flow 10 to the second evaporative cooler 320. The base layer 330B may be sloped to improve the water flow 10 to the second evaporative cooler 320 within the base layer 330B.

[0029] FIG. 3B is a top view of the exemplary embodiment of the deflector 330 shown in FIG. 3A. As shown in FIG. 3B, the multiple overhanging portions 330V may form multiple spaces 330S between them. The airflow 20 from the multiple openings 330P may flow through the multiple spaces 330S. The multiple secondary overhanging portions 330V2 may be adapted to overhang the multiple spaces 330S to obstruct the water flow 10 into the multiple spaces 330S. The multiple secondary overhanging portions 330V2 may form multiple secondary spaces 330S2 between them. The water flow 10 from the first evaporative cooler 310 may flow into the multiple secondary overhanging portions 330V2 and flow into the base layer 330B and the multiple secondary spaces 330S2. A portion of the water flow 10 may flow through the multiple secondary spaces 330S2, be received by the multiple overhanging portions 330V, and flow into the base layer 330B. Airflow 20 from spaces 330S may flow through secondary spaces 330S2 to first evaporative cooler 310 (not shown in FIG. 3B ). As shown in FIGS. 3A and 3B , deflector 330 may be adapted to direct water flow 10 from first evaporative cooler 310 (not shown in FIGS. 3A and 3B ) to second evaporative cooler 320 (not shown in FIG. 3A ) without passing through deflector 330, and deflector 330 may be adapted to allow airflow 20 from second evaporative cooler 320 to first evaporative cooler 310. Referring to FIG. 3B , the upper contours of overhangs 330V and secondary overhangs 330V2 are depicted as circular, but the upper contours may be square, octagonal, or other shapes. 3B, deflector 330 may provide a complete barrier to water flow 10 from first evaporative cooler 310 and allow water flow 10 to flow to second evaporative cooler 310. At the same time, deflector 330 may allow air flow 20 from second evaporative cooler 320 to pass to first evaporative cooler 310.

[0030] FIG. 4A is a cross-sectional view of an exemplary embodiment of a deflector 430. FIG. 4A is a cross-sectional view taken along line BB in FIG. 4B. The deflector 430 may include a base layer 430B having a plurality of openings 430P adapted to pass the airflow 20 therethrough and a plurality of spaced-apart overhanging portions 430V overhanging the plurality of openings 430P. The plurality of overhanging portions 430V may be adapted to allow the airflow 20 from the plurality of openings 430P to flow between the plurality of overhanging portions 430V and to prevent the waterflow 10 from entering the plurality of openings 430P. Additionally, the plurality of overhanging portions 430V may be adapted to direct the waterflow 10 to a second evaporative cooler 420 (not shown in FIG. 4A ). As shown in FIG. 4A , the base layer 430B may include a plurality of bottom channels 430CB spaced apart from one another, with a plurality of openings 430P formed between the plurality of bottom channels 430CB, adapted to allow the plurality of bottom channels 430CB to channel the water flow 10 to the second evaporative cooler 420. The plurality of overhanging portions 430V may include a plurality of upper channels 430CT adapted to allow the water flow 10 to flow to the second evaporative cooler 420. The plurality of upper channels 430CT may form a plurality of spaces 430S therebetween. The plurality of upper channels 430CT may be positioned above the plurality of openings 430P to overlap the plurality of bottom channels 430CB, ensuring that the water flow 10 flowing through the plurality of spaces 430S is received by the plurality of bottom channels 430CB and channeled to the second evaporative cooler 420. At the same time, airflow 20 from second evaporative cooler 420 may flow to first evaporative cooler 410 through a plurality of openings 430P and a plurality of spaces 430S.

[0031] 4B shows a top view of the exemplary embodiment of the deflector 430 shown in FIG. 4A. As shown in FIG. 4B, the plurality of bottom channels 430CB may form a plurality of openings 430P therebetween, and the plurality of upper channels 430CT may be disposed over the plurality of openings 430P and overlap with the plurality of bottom channels 430CB to prevent the water flow 10 from passing through the plurality of spaces 430S and entering the plurality of openings 430P. The deflector 430 may include a side channel 430D in fluid communication with the plurality of base layers 430B and the plurality of overhanging portions 430V, such that the side channel 430D may be adapted to receive the water flow 10 from the base layer 430B and the plurality of overhanging portions 430V and direct it to the second evaporative cooler 420 (not shown in FIG. 4B). 4B, deflector 430 may provide a complete barrier to water flow 10 from first evaporative cooler 410 and allow water flow 10 to flow to second evaporative cooler 410. At the same time, deflector 430 may allow air flow 20 from second evaporative cooler 420 to pass through first evaporative cooler 410.

[0032] 4C is a side view of the exemplary embodiment of the deflector 430 shown in FIG. 4A. As shown in FIG. 4C, the plurality of upper channels 430CT may be disposed above the plurality of bottom channels 430CB. Both the plurality of upper channels 430CT and the plurality of bottom channels 430CB may be angled to direct the water flow 10 into the side channels 430D. The plurality of upper channels 430CT and the plurality of bottom channels 430CB may form a channel set, or may form multiple channel sets disposed above each other within the deflector 430. Furthermore, the multiple channel sets may be arranged in a zigzag pattern with alternating inclines.

[0033] 5 is a cross-sectional view of an exemplary embodiment of cooling device 500. Cooling device 500 may include features described in cooling device 100 of FIG. 1. Cooling device 500 may further include a plurality of guides 560 spaced apart from one another and adapted to guide airflow 20 from second evaporative cooler 520 to first evaporative cooler 510. Multiple guides 560 may include a plurality of parallel panels adapted to guide airflow 20 from second evaporative cooler 520 to deflector 530.

[0034] The second evaporative cooler 520 may be divided into multiple sections. The multiple sections may be, for example, an upper section 520T, a lower section 520B, and an intermediate section 520M between the upper section 520T and the lower section 520B. As the water flow 10 flows from the upper section 520T to the lower section 520B through the second evaporative cooler 520, the water flow 10 is cooled by the air flow 20 as it flows downward. As a result, the water flow 10 is further cooled as it flows downward through the second evaporative cooler 520. Due to the downstream cooling effect, the water flow 10 in the upper section 520T of the second evaporative cooler 520 has a higher temperature than the water flow 10 in the lower section 520B of the second evaporative cooler 520. Thus, the temperature of the water flow 10 in the lower section 520B of the second evaporative cooler 520 may be lower than the temperature of the water flow 10 in the upper section 520T. The air stream 20 exiting the second evaporative cooler 520 is saturated, and at the same time, the temperature of the water stream 10 flowing through the second evaporative cooler 520 results in the air stream 20 exiting the upper portion 520T of the second evaporative cooler 520 being at a higher temperature than the air stream 20 exiting the lower portion 520B. It can therefore be seen that the temperatures of the air stream 20 and water stream 10 passing through the second evaporative cooler 520 follow a gradually decreasing temperature gradient in the longitudinal or vertical direction of the second evaporative cooler 520 from the upper portion 520T to the lower portion 520B of the second evaporative cooler 520. It can also be seen that the temperature of the water stream 10 exiting the first evaporative cooler 510 will be the same or nearly the same as the temperature of the water stream 10 entering the second evaporative cooler 520. As the water stream 10 flows downward from the first evaporative cooler 510 to the second evaporative cooler 520, the water stream 10 may be evaporatively cooled by the air stream 20 flowing in the opposite direction. Therefore, the temperature of the water stream 10 entering the second evaporative cooler 520 may be lower than the temperature of the water stream 10 exiting the first evaporative cooler 510. It can be seen that regardless of the temperature of the water entering the cooling system 500 from the condenser, the external conditions of the water and air, such as the ambient air temperature and humidity, the temperature gradient of the air stream 20 exiting the second evaporative cooler 520 will always result in the average temperature of the air stream 20 entering the first evaporative cooler 510 being lower than the temperature of the water stream 10 exiting the first evaporative cooler 510.

[0035] The first evaporative cooler 510 may similarly be divided into multiple sections. The multiple sections may be, for example, a left section 510L, a right section 510R, and a central section 510C between the left section 510L and the right section 510R. The multiple guides 560 may be adapted to guide the airflow 20 from a portion of the second evaporative cooler 520 to a portion of the first evaporative cooler 510. For example, the multiple guides 560 may be adapted to guide the airflow 20 from the upper section 520T of the second evaporative cooler 520 to one of the left section 510L and the right section 510R, and to guide the airflow 20 from the lower section 520B to the central section 510C. In this manner, airflow 20 from multiple portions of second evaporative cooler 520 having different temperatures, e.g., upper portion 520T being the warmest and lower portion 520B being the coldest, does not mix as it flows from second evaporative cooler 520 to first evaporative cooler 510. Multiple guides 560 may include multiple lower guides 560B between second evaporative cooler 520 and deflector 530 to guide airflow 20 from second evaporative cooler 520 to deflector 530. Multiple guides 560 may include multiple upper guides 560T between deflector 530 and first evaporative cooler 510 to guide airflow 20 from deflector 530 to first evaporative cooler 510. Airflow 20 in each portion of second evaporative cooler 520 is guided by multiple lower guides 560B to deflector 530 and flows through deflector 530. Each portion of the airflow 20 is guided from the deflector 530 to a corresponding portion of the first evaporative cooler 510 by a plurality of upper guides 560T. For example, the left and right airflows 20 at the upper portion 520T of the second evaporative cooler 520 may flow to the left and right portions 510L and 510R of the first evaporative cooler 510. The left and right airflows 20 at the lower portion 520B of the second evaporative cooler 520 may flow to the center portion 510C of the first evaporative cooler 510. In this manner, the airflow 20 exiting the second evaporative cooler 520 flows to the first evaporative cooler 510 with minimal interference, thereby reducing the resistance of the water flow and the airflow 20 between the airflow 20 and the water flow 10.

[0036] It can be seen that the cooling system 500 provides a stable feedback cooling loop. For example, when water from a hot condenser enters the cooling system 500 through the water inlet 542, the water stream 10 is sprayed into the first evaporative cooler 510 through multiple nozzles 542N. As the water stream 10 flows through the first evaporative cooler 510, it is cooled by the countercurrent airflow 20 before exiting the first evaporative cooler 510. A cooling effect is achieved throughout the first evaporative cooler 510, particularly at the bottom surface of the first evaporative cooler 510, thereby reducing the temperature of the water stream 10 exiting the bottom surface of the first evaporative cooler 510. As a result, the temperature of the water stream 10 entering the second evaporative cooler 520 is reduced compared to the cooling system 500 without the first evaporative cooler 510. Subsequently, the temperature of the water stream 10 exiting the lower portion 520B of the second evaporative cooler 520 is further reduced due to the cross-flow cooling effect between the water stream 10 and the airflow 20 within the second evaporative cooler 520. Therefore, the temperature of the airflow 20 exiting the second evaporative cooler 520 is much lower than the waterflow 10 entering the second evaporative cooler 520. Because the cooling effects of the first evaporative cooler 510 and the second evaporative cooler 520 reduce the temperature of the waterflow 10 in the second evaporative cooler 520, the airflow 20 entering the second evaporative cooler 520, i.e., the ambient air, can be cooled to a lower temperature than with a conventional cooling tower. As a result, the cooled airflow 20 exiting the second evaporative cooler 520 flows into the first evaporative cooler 510, enhancing the cooling effect of the first evaporative cooler 510. The cooled airflow 20 may be further evaporatively cooled in the first evaporative cooler 510, and at the same time, the cooled first evaporative cooler 510 may further cool the waterflow 10 passing through the first evaporative cooler 510 before it is again flowed into the second evaporative cooler 520. This return cooling loop increases the thermal efficiency of the cooling system 500 and produces a cooler water flow 10 compared to conventional cross-flow cooling towers. The cooling system 500 also provides lower airflow resistance compared to conventional counter-flow cooling towers.

[0037] As described above, the cooling system 500 of the present invention has higher thermal efficiency than a conventional crossflow cooling tower. As mentioned above, the return cooling loop increases the effectiveness of the cooling effect in the second evaporative cooler 520. This improved cooling efficiency allows some physical and operational parameters used in the cooling system 500 of the present invention to be reduced while still achieving the same results as a conventional cooling tower. For example, the width of the second evaporative cooler 520 may be smaller than the width of the crossflow infill used in a conventional cooling tower. The power consumption of the fan 550 in the cooling system 500 of the present invention may be lower than that of a conventional cooling tower. Alternatively, a lower-power exhaust fan may be used. Although not described, the cooling system 500 of the present invention does not require additional power consumption, such as an additional pump. Therefore, power consumption is reduced. Physical parameters, such as the dimensions of the fan 550 and the first evaporative cooler 510, may be reduced to reduce the size of the cooling system 500 compared to a conventional cooling tower with equivalent cooling efficiency. This allows the cooling system 500 to be more compact and require a smaller footprint than a conventional cooling tower. It is possible to install more cooling devices 500 in the same space. From a parts cost and maintenance standpoint, it is cost effective to purchase or replace smaller fans 550 and evaporative coolers 510, 520. From the above discussion, it can be seen that this leads to current and long-term cost savings.

[0038] Those skilled in the art will appreciate that features described in one example are not limited to that example and may be combined with any of the other examples. The present invention relates to a cooling apparatus and method generally as herein described with reference to and / or as illustrated in the accompanying drawings.

Claims

1. 1. A cooling device for cooling a water flow, comprising: a first evaporative cooler adapted to cool the water flow therethrough; a second evaporative cooler adapted to receive and cool the water flow passing through the first evaporative cooler, the second evaporative cooler adapted to receive and cool the air flow passing therethrough, and the first evaporative cooler adapted to receive and cool the air flow passing therethrough from the second evaporative cooler; a deflector adapted to deflect the water flow from the first evaporative cooler to the second evaporative cooler and to allow the air flow from the second evaporative cooler to the first evaporative cooler. Cooling device.

2. the deflector having a first side and a second side rearward of the first side; the deflector is adapted to direct the water flow from the first evaporative cooler to the second evaporative cooler on the first side and to allow the air flow passing from the second evaporative cooler to the first evaporative cooler to flow from the second side to the first side. The cooling device of claim 1 .

3. the deflector comprises a base layer having a plurality of openings adapted to pass the airflow therethrough and a plurality of spaced apart overhanging portions overhanging the plurality of openings; the plurality of overhanging portions are adapted to allow the airflow from the plurality of openings to flow between the plurality of overhanging portions and to impede the water flow to the plurality of openings to cause the water flow into the second evaporative cooler. The cooling device according to claim 1 or 2.

4. the deflector comprises a louver panel having a plurality of overlapping panels and a plurality of gaps therebetween; In operation, the water flow from the first evaporative cooler flows toward the plurality of overlapping panels and into the second evaporative cooler, and the air flow from the second evaporative cooler flows through the plurality of gaps. A cooling device according to any one of claims 1 to 3.

5. the base layer including the plurality of openings adapted to allow the airflow therethrough and a top layer; the base layer is adapted to receive the water flow and direct it to the second evaporative cooler; the top layer includes a plurality of protruding portions spaced apart from one another and protruding into the plurality of openings; each of the plurality of overhangs adapted to receive and channel the water flow onto the base layer; The cooling device according to claim 3 .

6. the base layer includes a plurality of channels spaced apart from one another to define the plurality of openings therebetween; the plurality of flow paths are adapted to direct the water flow to the second evaporative cooler; The plurality of overhanging portions include a plurality of flow channels. The cooling device according to claim 3 .

7. further comprising a plurality of spaced apart guides adapted to guide the airflow from the second evaporative cooler to the first evaporative cooler. A cooling device according to any one of claims 1 to 6.

8. the plurality of guides are adapted to guide the airflow from the second evaporative cooler to the deflector; A cooling device according to any one of claims 1 to 7.

9. The first evaporative cooler is disposed above the second evaporative cooler. A cooling device according to any one of claims 1 to 8.

10. 1. A cooling method for cooling a water flow, comprising: receiving an airflow from a second evaporative cooler through the first evaporative cooler to cool the water flow through the first evaporative cooler; receiving an airflow from the first evaporative cooler through the second evaporative cooler to cool the water flow through the second evaporative cooler; deflecting the water flow from the first evaporative cooler to the second evaporative cooler with a deflector; and allowing the air flow from the second evaporative cooler to the first evaporative cooler. Cooling method.

11. deflecting the water flow and permitting the air flow includes: directing the water flow from the first evaporative cooler to the second evaporative cooler through the deflector; and permitting the air flow from the second evaporative cooler to the first evaporative cooler. The method of claim 10.

12. Deflecting the water flow and allowing the air flow includes: directing the water flow from the first evaporative cooler to the second evaporative cooler on a first side of the deflector; and allowing the air flow from the second evaporative cooler to the first evaporative cooler from a second side of the deflector to the first side. The method according to claim 10 or claim 11.

13. deflecting the water flow and allowing the air flow includes allowing the air flow through a plurality of openings in a base layer, allowing the air flow through the plurality of openings to flow between a plurality of spaced-apart overhangs that overhang the plurality of openings, and impeding the water flow into the plurality of openings to cause the water flow into the second evaporative cooler.

13. The method according to any one of claims 10 to 12.

14. The deflecting the water flow and permitting the air flow include permitting the air flow through a plurality of openings in a base layer to receive the water flow and direct it to the second evaporative cooler, and permitting the water flow to receive the water flow and direct it to the base layer through a top layer having a plurality of overhangs spaced apart from one another and overhanging the plurality of openings.

14. The method according to any one of claims 10 to 13.

15. further comprising directing the airflow from the second evaporative cooler to the first evaporative cooler.

15. The method according to any one of claims 10 to 14.

16. further comprising directing the airflow from the second evaporative cooler to the deflector evaporative cooler.

16. The method according to any one of claims 10 to 15.

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