Display device

Abstract

To provide a display device capable of suppressing color variation caused by a viewing angle when RGB micro LEDs having different directivities are used.SOLUTION: The display device includes: a micro LED substrate 130; COM wiring lines 140 and SEG wiring lines 150 formed on the micro LED substrate 130; RGB micro LEDs 160 disposed at intersections between the COM wiring lines 140 and the SEG wiring lines 150; and walls 170 formed so as to surround outer peripheries of the G and B micro LEDs 160. The walls 170 control directions of light L emitted from the G and B micro LEDs 160 having wide directivity, thereby suppressing color variation caused by a viewing angle.SELECTED DRAWING: Figure 6

Description

[Technical Field]

[0001] The present invention relates to a display device having a plurality of light-emitting elements formed on a substrate, and more particularly to a display device having micro LEDs (light-emitting diodes). [Background technology]

[0002] In recent years, micro LEDs have been developed that can display images directly from light-emitting diodes. Micro LEDs are arranged two-dimensionally to correspond to each pixel, and in color images, each pixel consists of blue, green, and red sub-pixels.

[0003] For example, Patent Document 1 discloses a passively driven LED stack for a display in which three LED stacks, namely a first red (R) LED stack, a second green (G) LED stack, and a blue (B) LED stack, are stacked vertically, the anodes of the light-emitting diodes of the first to third LED stacks are commonly connected to a data wiring, and the cathodes are connected to scan wirings 1, 2, and 3, respectively, and the R, G, and B light-emitting diodes in the same pixel are driven independently.

[0004] Patent Document 2 discloses an active-drive micro LED in which a thin film transistor (TFT) including a gate electrode, a drain electrode, and a source electrode is formed on a semiconductor layer, a planarization layer is formed to cover the TFT, a first electrode connected to the source electrode through a via hole in the planarization layer is formed on the planarization layer, and an LED is formed between the first electrode and a second electrode formed above it. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Patent Publication No. 2021-504752 [Patent Document 2] U.S. Patent No. 11,171,270 Summary of the Invention [Problem to be solved by the invention]

[0006] The color of a display using micro LEDs changes depending on the viewing angle (viewing angle). For example, as shown in Figure 1(A), when a user U looks at the display 10 from the front, the image can be seen clearly. However, when the user U looks at the display 10 from above or below, as shown in Figure 1(B), the image appears to be a dark blue-green.

[0007] 2 is a schematic perspective view of a substrate on which micro LEDs are mounted. As shown in the figure, COM wiring 30 is formed in the row direction on a substrate 20, SEG wiring 40 is formed in the column direction, and micro LEDs 50 are mounted at the intersections of these matrix wirings. The micro LEDs 50 include R, G, and B LED chips. For example, in passive driving, the SEG wiring 40 is driven in a time-division manner at a constant frequency, and a drive current corresponding to image data is applied from the SEG wiring 40 to the COM wiring 30, causing each micro LED 50 to emit light.

[0008] Figure 3 is a diagram illustrating the directivity of R, G, and B micro LEDs, and the perpendicular lines in the diagram represent the luminous intensity in the vertical direction (or optical axis direction) of the micro LED. Comparing the directivity of R, G, and B, the directivity of G and B is stronger in oblique directions (around 45 degrees) than R. For this reason, when an image viewed from the front of the display is viewed obliquely by changing the viewing angle, the image appears to have a relatively strong blue-green color.

[0009] The present invention aims to solve such conventional problems and to provide a display device that can suppress color shifts due to viewing angles when using RGB light-emitting elements with different directivities. [Means for solving the problem]

[0010] The display device of the present invention includes a substrate, wiring formed on the substrate, and a plurality of light-emitting elements formed on the substrate and electrically connected to the wiring, the plurality of light-emitting elements including red light-emitting elements that emit red light, green light-emitting elements that emit green light, and blue light-emitting elements that emit blue light, and a wall portion is provided around selected light-emitting elements from among the red light-emitting elements, green light-emitting elements, and blue light-emitting elements to control the light emitted from the selected light-emitting elements.

[0011] In one aspect, the wall portion reflects or absorbs a portion of the light emitted from the selected light-emitting element. In one aspect, the wall portion has a top portion that is higher than the light-emitting surface of the selected light-emitting element. In one aspect, the wall portion controls the spread of light directionality of the selected light-emitting element. In one aspect, the wiring includes ring-shaped wiring in an area where the selected light-emitting element is mounted, the selected light-emitting element is placed in a central space of the ring-shaped wiring, and the wall portion is formed on the ring-shaped wiring. In one aspect, the wiring includes a pad, an electrode of the selected light-emitting element is connected to the pad, and the wall portion is formed in an area of ​​the pad where the selected light-emitting element is not mounted. In one aspect, a conductive adhesive is included between the pad and the electrode, and the wall portion is formed by pressing the conductive adhesive.

[0012] Furthermore, the display device according to the present invention includes a substrate, wiring formed on the substrate, and a plurality of light-emitting elements formed on the substrate and electrically connected to the wiring, the plurality of light-emitting elements including red light-emitting elements that emit red light, green light-emitting elements that emit green light, and blue light-emitting elements that emit blue light, and a light-transmitting portion is provided that covers at least the tops of selected light-emitting elements from among the red light-emitting elements, green light-emitting elements, and blue light-emitting elements, and the light-transmitting portion controls the light emitted from the selected light-emitting elements.

[0013] In one aspect, the light transmitting portion refracts the light having a wide directivity from the selected light emitting element in a vertical direction or in the optical axis direction. In one aspect, the selected light emitting element and the light transmitting portion are transferred from a stamp head. [Effects of the Invention]

[0014] According to the present invention, by providing a wall portion for controlling the light emitted from the selected light-emitting element or a light-transmitting portion that covers at least the top of the selected light-emitting element, color changes due to viewing angle can be suppressed. [Brief explanation of the drawings]

[0015] [Figure 1] FIG. 1 is a diagram illustrating the problems with conventional micro LED displays. [Figure 2] FIG. 1 is a schematic perspective view of a substrate on which a conventional micro LED is mounted. [Figure 3] FIG. 10 is a diagram illustrating the directivity of R, G, and B micro LEDs. [Figure 4] 1 is a block diagram showing an electrical configuration of a display device according to an embodiment of the present invention. [Figure 5] FIG. 1 is a diagram illustrating an example of an electrical connection relationship between a micro LED and substrate wiring in this embodiment. [Figure 6] 6A and 6B are diagrams showing the configuration of a display device according to a first embodiment of the present invention, in which FIG. 6A is a schematic perspective view of a micro LED substrate, and FIG. 6B is a schematic cross-sectional view taken along line A1-A1 thereof. [Figure 7] 7A and 7B are diagrams showing the configuration of a display device according to a second embodiment of the present invention, in which FIG. 7A is a schematic perspective view of a micro LED substrate, and FIG. 7B is a schematic cross-sectional view taken along line A2-A2 thereof. [Figure 8] 10A to 10C are diagrams illustrating a manufacturing process of a display device according to a second embodiment of the present invention. [Figure 9] FIG. 10 is a diagram illustrating a modified example of the display device according to the second embodiment of the present invention. [Figure 10] 10A and 10B are diagrams showing the configuration of a display device according to a third embodiment of the present invention, in which FIG. 10A is a schematic perspective view of a micro LED substrate, and FIG. 10B is a schematic cross-sectional view taken along line A3-A3 thereof. [Figure 11] 10A to 10C are diagrams showing the configuration of a display device according to a fourth embodiment of the present invention and a manufacturing process thereof. [Figure 12] 10A to 10C are diagrams illustrating the configuration of a display device according to a fifth embodiment of the present invention and a manufacturing process thereof. DETAILED DESCRIPTION OF THE INVENTION

[0016] The present invention relates to a display device including a substrate on which a plurality of light-emitting elements are formed, and in particular to a display using R, G, and B micro LEDs with different directivities, which suppress color shifts due to the viewing angle (viewing angle). It should be noted that the drawings referred to in the following description contain exaggerated representations to facilitate understanding of the invention, and do not directly represent the shape and scale of the actual product.

[0017] 4 is a block diagram showing the electrical configuration of a display device according to an embodiment of the present invention. As shown in the figure, the display device 100 includes a drive circuit 110 and a micro LED unit 120 driven by the drive circuit 110.

[0018] 5 is a diagram showing the electrical connection relationship between the micro LEDs and the substrate wiring in the micro LED unit 120. As shown in the figure, a plurality of COM wirings S1, S2, ..., S5, S6 extending in the row direction (X direction) and a plurality of SEG wirings D1, D2, ..., D5, D6 extending in the column direction (Y direction) are formed on the substrate, and micro LEDs are arranged at each intersection of the COM wirings and SEG wirings. Here, for convenience, 6x6 passively driven COM wirings and SEG wirings are illustrated as an example, but in reality, the number of COM wirings and SEG wirings formed corresponds to the number of pixels. Furthermore, the micro LED unit 120 is not limited to the passively driven type, and may be an active driven type, in which case switching elements are formed at the intersections of the COM wirings and SEG wirings.

[0019] Although the COM wiring and SEG wiring are illustrated as linear, the shape and pattern of the wiring are appropriately determined depending on the position and shape of the anode electrode / cathode electrode of the micro LED. The COM wiring is electrically insulated from the SEG wiring. For example, the COM wiring and the SEG wiring may be configured as multi-layer wiring, or the COM wiring and the SEG wiring may be insulated by an insulating layer in the wiring intersection area. At the intersection of the COM wiring and the SEG wiring, for example, the cathode electrode of the micro LED is electrically connected to the COM wiring, and the anode electrode of the micro LED is electrically connected to the SEG wiring.

[0020] When the micro LED unit 120 displays a color image, one pixel (picture element) is composed of three sub-pixels that generate R (red), G (green), and B (blue). The R, G, and B sub-pixels are composed of, for example, a diode that emits red light, a diode that emits green light, and a diode that emits blue light.

[0021] One micro LED is made up of chips several tens of microns in size. For example, if the micro LED unit 120 is a full HD (High Definition) display, the number of pixels is 1920 x 1080, and the number of LED chips implemented is 1920 x 1080 x 3 (RGB), or approximately 6.22 million chips.

[0022] There are two mounting methods for micro LEDs: chip mounting and wafer bonding. The former involves creating individual LED chips cut from a semiconductor wafer, and then mounting each LED chip on a substrate on which wiring and drive circuits are formed. The latter involves bonding the semiconductor wafer on which the LEDs are formed directly to a silicon wafer on which wiring and drive circuits are formed.

[0023] The drive circuit 110 passively or actively drives the micro LED unit 120 in accordance with the image data, applies a drive current in accordance with the image data from the SEG wiring to the COM wiring, and causes each micro LED to emit light. [Example]

[0024] Next, an embodiment of the present invention will be described. Fig. 6 shows the configuration of a display device according to a first embodiment of the present invention, in which Fig. 6(A) is a schematic perspective view of a micro LED substrate, and Fig. 6(B) is a schematic cross-sectional view taken along line A1-A1 (however, the cross section of the SEG wiring is omitted).

[0025] The micro LED unit 120-1 includes a generally rectangular micro LED substrate 130. The micro LED substrate 130 is, for example, a light-transmitting transparent substrate or film made of glass, plastic, acrylic, or the like, or a semiconductor substrate made of silicon or the like. When the micro LED substrate 130 is a transparent substrate, the transparent substrate can be bonded onto a semiconductor substrate on which the drive circuit 110 is formed. When the micro LED substrate 130 is a silicon substrate, the drive circuit 110 may be formed on the silicon substrate.

[0026] A plurality of COM wirings 140 extending in the row direction and a plurality of SEG wirings 150 extending in the column direction are formed on the surface of the substrate 130. These COM wirings 140 and SEG wirings 150 are electrically connected to the drive circuit 110. The material of the substrate wiring is not particularly limited, but may be, for example, a metal material such as Cu or a light-transmitting conductive material such as ITO, and the COM wirings 140 and SEG wirings 150 are formed by patterning the conductive material deposited on the substrate.

[0027] R, G, and B micro LEDs 160 are mounted at each intersection of the COM wiring 140 and the SEG wiring 150. The R, G, and B micro LEDs 160 are, for example, rectangular LED chips cut from a wafer, and are arranged, for example, in the order of R, G, and B in the row direction. The micro LEDs 160 include a p-type semiconductor layer and an n-type semiconductor layer, and an anode electrode electrically connected to the p-type semiconductor layer is electrically connected to the SEGM wiring 140, and a cathode electrode electrically connected to the n-type semiconductor layer is electrically connected to the COM wiring 150. When a driving current is applied between the anode electrode and the cathode electrode, the R, G, and B micro LEDs 160 emit red, green, and blue light from their tops (light emission surfaces). Note that the R, G, and B micro LEDs are referred to as micro LEDs 160R, 160G, and 160B, respectively, and may be referred to as the micro LEDs 160 as a whole.

[0028] The micro LED unit 120-1 further includes a wall 170 surrounding the outer periphery of each of the rectangular micro LEDs 160G and 160B. The wall 170 is made of a material that absorbs or reflects light emitted from the micro LEDs 160G and 160B (e.g., black resin). The manufacturing method of the wall 170 is not particularly limited, but for example, after or before mounting the micro LEDs 160 on the substrate, a black photosensitive resin is applied to the substrate, and the resin is patterned by a photolithography process to form a grid-shaped wall 170.

[0029] The wall 170 is formed to be larger by a height H than the light emission surfaces at the tops of the micro LEDs 160G and 160B, thereby controlling the light L having a directional spread from the micro LEDs 160G and 160B. In other words, the wall 170 suppresses the light having a directional spread from being emitted in the direction of the spread. For example, when the micro LEDs 160G and 160B emit light that spreads in a direction at an angle of approximately 45 degrees to the micro LED 160R as shown in FIG. 3, the wall 170 absorbs or reflects the light L from the micro LEDs 160G and 160B that spreads in a direction at an angle of approximately 45 degrees, thereby controlling the spread of the light from the micro LEDs 160G and 160B.

[0030] According to this embodiment, by providing a wall 170 around the outer periphery of the micro LEDs 160G and 160B to control the light with wide directionality, color change due to the viewing angle of the micro LED display can be suppressed, and high-quality images with little color change can be provided.

[0031] In the above embodiment, an example of controlling the spread of G and B relative to R has been shown, but this is just one example, and when R, G, and B have directivity different from the directivity shown in Fig. 3, it is also possible to control the spread of R and B relative to G, control the spread of R and G relative to B, control the spread of B relative to R and G, or control the spread of G relative to R and B. In these cases, a wall is provided around the periphery of the micro LED whose spread should be controlled.

[0032] Next, a second embodiment of the present invention will be described. Figure 7 shows the configuration of a display device according to the second embodiment of the present invention, where Figure 7(A) is a schematic perspective view of a micro LED substrate, and Figure 7(B) is a schematic cross-sectional view taken along line A2-A2 (however, the cross section of the SEG wiring is omitted).

[0033] In the micro LED unit 120-2 according to the second embodiment, a link-shaped wiring 152 is formed by extending the SEG wiring 150 around the outer periphery of each of the micro LEDs 160G and 160B at the intersection of the COM wiring 140 and the SEG wiring 150. The ring-shaped wiring 152 has a rectangular shape surrounding the outer periphery of the micro LEDs 160G and 160B, and the micro LEDs 160G and 160B are arranged in the central space of the ring-shaped wiring 152, and a wall 180 is formed on the ring-shaped wiring 152.

[0034] By forming the ring-shaped wiring 152, when the COM wiring 140 and the SEG wiring 150 are blackened, the wall 180 can be easily formed in accordance with the blackening of the ring-shaped wiring 152. As in the first embodiment, the wall 180 controls the spread of directional light from the micro LEDs 160G and 160B.

[0035] 8A and 8B are diagrams showing an example of a manufacturing process for the micro LED unit of the second embodiment shown in FIG. 7. First, as shown in FIG. 8A, a pattern of multiple COM wirings 140 extending in the row direction is formed on a substrate 130. At this time, protrusions 142 for electrically connecting to the cathode electrodes of the R, G, and B micro LEDs 160 are simultaneously formed on the COM wirings 140. Next, an insulating film or insulating member for electrical insulation from the COM wirings 140 is formed, and then a pattern of multiple SEG wirings 150 extending in the column direction is formed. At this time, ring-shaped wirings 152 for electrically connecting to the anode electrodes of the micro LEDs 160G and 160B are simultaneously formed on the SEG wirings 150. Furthermore, a protrusion 154 for electrically connecting to the anode electrode of the micro LED 160R is formed on the SEG wirings 150.

[0036] 8(B), the micro LED 160 is mounted at the intersection of the COM wiring 140 and the SEG wiring 150. The cathode electrode of the micro LED 160R is electrically connected to the protrusion 142, and the anode electrode is electrically connected to the protrusion 154. On the other hand, the micro LEDs 160G and 160B are positioned in the central opening of the ring-shaped wiring 152, and their cathode electrodes are electrically connected to the protrusion 142, and their anode electrodes are electrically connected to the link-shaped wiring 152.

[0037] Next, a photosensitive film laminated with a release film (PET) and black photosensitive resin (positive type) is attached to the entire surface of transparent substrate 130 having COM wiring 140 and SEG wiring 150. Next, using COM wiring 140 and SEG wiring 150 themselves as a mask, the photosensitive film is exposed from the back side of transparent substrate 130, and the photosensitive film is developed, and as shown in Figure 8(C), the unexposed black photosensitive film remains only on COM wiring 140 and SEG wiring 150, and the remaining photosensitive film is heated and hardened to form wall 180. By appropriately selecting the thickness of the photosensitive film, wall 180 can be made to a desired height.

[0038] As described above, according to this embodiment, the photolithography process can be used to easily manufacture the wall 180 in a self-aligned manner in accordance with the blackening of the substrate wiring. In the above example, the ring-shaped wiring 152 is formed in the SEG wiring 150, but instead, the ring-shaped wiring may be formed in the COM wiring 140.

[0039] Next, a modified example of the second embodiment will be described. In the second embodiment, an example in which a ring-shaped wiring is formed is shown, but in the modified example, a pad having a relatively large mounting area is used instead of the ring-shaped wiring.

[0040] 9A and 9B are diagrams showing an example of a micro LED substrate according to a modified example and a manufacturing process thereof. As shown in Fig. 9A, at the intersection where the micro LEDs 160G and 160B are mounted, a rectangular pad 146 having a relatively large area is formed when the COM wiring 140 is patterned, and a rectangular pad 156 having a relatively large area is formed when the SEG wiring 150 is patterned. At the intersection where the micro LED 160R is mounted, a normal-sized pad is formed.

[0041] Next, as shown in Fig. 9(B), the micro LEDs 160G and 160B are mounted on the pads 146 and 156. As shown in the cross-sectional view of Fig. 9(D), the micro LEDs 160G and 160B have a cathode electrode 162 and an anode electrode 164 on the bottom surface of the chip, and the cathode electrode 162 is electrically connected to the n-type semiconductor layer via a conductive member 168 formed in an opening in the insulating film 166, and similarly, the anode electrode 164 is electrically connected to the p-type semiconductor layer via the conductive member 168. As a result, the cathode electrode 162 is electrically connected to the COM wiring 140 via the pad 146, and the anode electrode 164 is electrically connected to the SEG wiring 150 via the pad 156.

[0042] Next, as in the second embodiment, a black or gray photosensitive film printed on a transparent substrate is patterned by a photolithography process, and finally, as shown in Fig. 9(C), a wall 190 printed in black is formed on the COM wiring 140, the SEG wiring 150, and the pads 146 and 156. By making the distance between the pads 146 and 156 as small as possible, it is possible to form the wall 190 that substantially surrounds the outer periphery of the micro LEDs 160G and 160B without any gaps.

[0043] Next, a third embodiment of the present invention will be described. Fig. 10 shows the configuration of a display device according to the third embodiment of the present invention, in which Fig. 10(A) is a schematic perspective view of a micro LED substrate, and Fig. 10(B) is a schematic cross-sectional view taken along line A3-A3 (however, the cross section of the SEG wiring is omitted).

[0044] In the third embodiment, the micro LEDs 160G and 160B, which have a wide directivity, are covered with a transparent protective material 200 to control the spread of light from the micro LEDs 160G and 160B.

[0045] The transparent protective material 200 is configured using a material with a selected refractive index and / or a convex curved surface shape to generate a lens effect that refracts light L emitted from the emission surfaces of the micro LEDs 160G and 160B in the vertical direction. In one embodiment, the transparent protective material 200 is configured using an acrylic resin, and the liquid resin is potted to cover the micro LEDs 160G and 160B, and then cured to harden the resin. In another embodiment, the entire surface of the substrate 130 including the COM wiring 140 and the SEG wiring 150 is coated with a transparent liquid photosensitive resin (e.g., a negative-type resin containing a siloxane polymer and a solvent), and a photolithography process is used to leave the transparent photosensitive resin only in the areas covering the micro LEDs 160G and 160B.

[0046] According to the third embodiment, by providing a transparent protective material 200 to cover the micro LEDs 160G and 160B, the light with broadened directivity from the micro LEDs 160G and 160B can be refracted vertically or in the direction of the optical axis, thereby suppressing color changes due to the viewing angle of the micro LED display.

[0047] Next, a fourth embodiment of the present invention will be described. The fourth embodiment relates to a method for manufacturing the micro LED units of the first and second embodiments, and Fig. 11 is a diagram showing the configuration of the micro LED unit according to the fourth embodiment and its manufacturing process.

[0048] 11(A), pads 210 and 220 are formed on the substrate 130. The pads 210 and 220 are disposed at the intersections of the COM wiring 140 and the SEG wiring 150. For example, the pad 210 is patterned simultaneously with the COM wiring 140, and the pad 220 is patterned simultaneously with the SEG wiring 150.

[0049] 11(B), for example, a ball-shaped LED bonding material 230 is formed to cover the pads 210, 220 on which the micro LEDs 160G, 160B are to be mounted. The LED bonding material 230 is, for example, a silver paste or a conductive adhesive. Preferably, the LED bonding material 230 is formed to cover the surfaces of the pads 210, 220 while preventing the pads from getting too close to each other.

[0050] Next, as shown in FIG. 11(C), the cathode electrode 240 and the anode electrode 250 of the micro LED 160G / 160B are aligned with the pads 210 and 220, and the micro LED 160G / 160G is pressed toward the substrate 130 to bond the cathode electrode 240 and the anode electrode 250 to the pads 210 and 220. As shown in FIG. 11(D), the pressed LED bonding material 230 bonds the cathode electrode 240 and the pad 210 and the anode electrode 250 and the pad 220, and also protrudes outside the pads 210 and 220 to form walls 230A. The LED bonding material 230 is then heated (cured) at a constant temperature to harden. In this way, a micro LED substrate 120-4 is obtained on which the walls 230A are formed by the LED bonding material 230.

[0051] According to the fourth embodiment, the wall 230A that substantially surrounds the outer periphery of the micro LEDs 160G and 160B can be formed by utilizing bonding between the electrodes of the micro LEDs and the substrate wiring.

[0052] Next, a fifth embodiment of the present invention will be described. The fifth embodiment relates to the manufacture of the micro LED unit of the third embodiment, and Fig. 12 is a diagram showing the configuration of the micro LED unit according to the fifth embodiment and the manufacturing process thereof.

[0053] First, as shown in Fig. 12(A), a stamp head 300 is prepared in which a depression 310 is formed at a position where the micro LEDs 160G and 160B are to be mounted. The bottom surface of the depression 310 has, for example, a curved surface. Next, as shown in Fig. 12(B), a liquid transparent protective material 320 is filled into the depression 310 of the stamp head 300.

[0054] Next, as shown in Figure 12(C), the R, G, and B micro LEDs 160 are picked up by the stamp head 300. The micro LEDs 160G and 160B are placed in the recesses 310, and the micro LED 160R is placed on the surface of the stamp head 300 via a peelable adhesive. The micro LEDs 160 placed on the stamp head 300 are inverted so that the cathode and anode electrodes on the back side are exposed. Then, the protective material 320 is cured at a constant temperature to harden.

[0055] 12(D), the stamp head 300 is placed opposite a substrate 330 having wiring and pads 340 formed on the rear surface thereof, and the cathode and anode electrodes of the micro LEDs 160 of the stamp head 300 are bonded to the pads of the substrate 330. At this time, silver paste or a conductive adhesive may be applied to the surface of the pads to ensure good bonding between the electrodes and the pads.

[0056] Next, the stamp head 300 is removed, and the protective material 320 is removed from the recess 310 of the stamp head 300, thereby producing a micro LED unit 120-5 in which the micro LEDs 160G and 160B are covered with the transparent protective material 310, as shown in Figure 12(E). This figure shows the substrate turned upside down from the state shown in Figure 12(D).

[0057] According to the fifth embodiment, the recess 310 of the stamp head 300 can be used to manufacture the thickness and outer shape of the protection member 320 covering the micro LED with higher precision.

[0058] In the above embodiments, the micro LEDs are arranged in the row direction in the order of R, G, and B, but this is just an example and the order is not particularly limited. Furthermore, a passively driven micro LED substrate is exemplified, but this is not limited thereto and an active drive type may also be used. Furthermore, in the above embodiments, an example is shown in which the directivity of G and B spreads relative to R, but the present invention is not limited thereto, and it goes without saying that the spread of other directivities can also be controlled by a wall using a similar method.

[0059] Although the preferred embodiments of the present invention have been described in detail above, the present invention is not limited to the specific embodiments, and various modifications and changes are possible within the scope of the gist of the invention described in the claims. [Explanation of symbols]

[0060] 100: Display device 110: Drive circuit 120: Micro LED unit 130: Circuit board 140: COM wiring 146: Pad 150: SEG wiring 156: Pad 160: Micro LED 162: Cathode electrode 164: Anode electrode 170, 180, 190: Wall 200: Transparent protective material 210, 220: Pad 230: LED junction material 240: Cathode electrode 250: Anode electrode 300: Stamp head 310: Recess 320: Transparent protective material 330: Substrate 340: Wiring and pads

Claims

1. A substrate; Wiring formed on the substrate; a plurality of light-emitting elements formed on the substrate and electrically connected to the wiring; the plurality of light-emitting elements include a red light-emitting element that emits red light, a green light-emitting element that emits green light, and a blue light-emitting element that emits blue light; A display device comprising: a wall portion provided around a selected one of a red light-emitting element, a green light-emitting element, and a blue light-emitting element, for controlling light emitted from the selected light-emitting element.

2. The display device according to claim 1 , wherein the wall portion reflects or absorbs a portion of the light emitted from the selected light-emitting element.

3. The display device according to claim 1 , wherein the wall portion has a top portion that is higher than a light-emitting surface of the selected light-emitting element.

4. The display device according to claim 1 , wherein the wall portion controls the spread of light from the selected light-emitting element.

5. 2. The display device according to claim 1, wherein the wiring includes a ring-shaped wiring in an area where the selected light-emitting element is mounted, the selected light-emitting element is arranged in a central space of the ring-shaped wiring, and the wall portion is formed on the ring-shaped wiring.

6. 2. The display device according to claim 1, wherein the wiring includes a pad, an electrode of the selected light-emitting element is connected to the pad, and the wall portion is formed in an area of ​​the pad where the selected light-emitting element is not mounted.

7. The display device according to claim 6 , further comprising a conductive adhesive between the pad and the electrode, and the wall portion is formed by pressing the conductive adhesive.

8. A substrate; Wiring formed on the substrate; a plurality of light-emitting elements formed on the substrate and electrically connected to the wiring; the plurality of light-emitting elements include a red light-emitting element that emits red light, a green light-emitting element that emits green light, and a blue light-emitting element that emits blue light; A display device comprising a light-transmitting portion that covers at least the top of a selected light-emitting element from among a red light-emitting element, a green light-emitting element, and a blue light-emitting element, and the light-transmitting portion controls the light emitted from the selected light-emitting element.

9. The display device according to claim 8 , wherein the light transmitting portion refracts the light having a wide directivity from the selected light emitting element in a vertical direction or an optical axis direction.

10. The display device according to claim 8 , wherein the selected light-emitting elements and the light-transmitting portions are transferred from a stamp head.

Images