Imaging module and imaging apparatus

Abstract

To provide an imaging module capable of suppressing distortion of a lid body caused by heat generation in operation in an imaging element.SOLUTION: The imaging module includes: a substrate; an imaging element which is mounted on the substrate; a frame body which has a plurality of side parts and a corner part and is provided outside the imaging element in a plan view; a first bonding material which is provided between the substrate and the frame body; a lid body which has translucency and covers a space formed by the substrate and the frame body; and a second bonding material which is provided between the frame body and the lid body. The thickness of the second bonding material in the central part of the side part is thicker than that of the second bonding material in the corner part.SELECTED DRAWING: Figure 2B

Description

[Technical Field]

[0001] The present invention relates to an imaging module and an imaging device. [Background technology]

[0002] Image sensor packages using CCD (Charge Coupled Device) image sensors or CMOS (Complementary Metal Oxide Semiconductor) image sensors used in imaging devices such as digital cameras and video cameras are hollow semiconductor modules. Hollow semiconductor modules include a wiring board on which a semiconductor element is mounted, a frame-shaped member provided on the outer edge of the mounting area of ​​the semiconductor element, and a light-transmitting lid, with the light-transmitting lid attached via a bonding material from above the wiring board to seal the semiconductor element in the air.

[0003] Patent Document 1 discloses a highly flat electronic component that includes a base having an area for arranging an electronic device, a frame having an opening corresponding to the area for arranging the electronic device and adhered to the base, a lid adhered to the top surface of the frame with adhesive of uniform thickness, and an electronic device fixed on the base. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2014-167990 Summary of the Invention [Problem to be solved by the invention]

[0005] When a lid body with a uniform thickness is joined to a highly flat frame body like the electronic component described in Patent Document 1, the light-transmitting lid body is heated by heat dissipation caused by the operation of the imaging element, which can result in temperature unevenness in the light-transmitting lid body.

[0006] SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide an imaging module that can suppress distortion of the lid body that accompanies heat generated during operation of the imaging element. [Means for solving the problem]

[0007] According to one aspect of the present invention, there is provided an imaging module having a substrate, an imaging element mounted on the substrate, a frame body having a plurality of sides and corners and arranged outside the imaging element in a planar view, a first bonding material arranged between the substrate and the frame body, a light-transmitting lid body covering a space formed by the substrate and the frame body, and a second bonding material arranged between the frame body and the lid body, and the thickness of the second bonding material at the center of the sides is thicker than the thickness of the second bonding material at the corners. [Effects of the Invention]

[0008] According to the present invention, distortion of the lid body due to heat generated during operation of the imaging element can be suppressed. [Brief explanation of the drawings]

[0009] [Figure 1] 1 is a top view showing an imaging module according to a first embodiment of the present invention. [Figure 2A] 1 is a cross-sectional view showing an imaging module according to a first embodiment of the present invention. [Figure 2B] 1 is a cross-sectional view showing an imaging module according to a first embodiment of the present invention. [Figure 3] 2 is a top view showing a frame body in the imaging module according to the first embodiment of the present invention. FIG. [Figure 4] FIG. 10 is a cross-sectional view showing an imaging module according to a sixth embodiment. [Figure 5] FIG. 13 is a cross-sectional view showing an imaging module according to a seventh embodiment. [Figure 6] FIG. 1 is a cross-sectional view showing an imaging module of Comparative Example 1. [Figure 7] FIG. 10 is a cross-sectional view showing an imaging module of Comparative Example 2. [Figure 8] FIG. 10 is a cross-sectional view showing an imaging module of Comparative Example 3. [Figure 9] FIG. 10 is a schematic diagram showing an electronic device according to a second embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. However, the embodiment described below is one embodiment of the invention, and the present invention is not limited to this. Common configurations will be described with mutual reference to multiple drawings, and descriptions of configurations with common reference numerals will be omitted as appropriate.

[0011] When a lid body with a uniform thickness is bonded to a highly flat frame body, as in the electronic component described in Patent Document 1, the transparent lid body heats up due to heat dissipation caused by operation of the imaging element. The temperature distribution of the transparent lid body is highest at the center of the lid body facing the imaging element, decreasing in a roughly concentric pattern toward the corners, with the temperature lowest at the corners of the lid. Temperature unevenness in the transparent lid body generates thermal stress in the transparent lid body due to differences in thermal expansion within the surface of the transparent lid, resulting in distortion of the transparent lid body. Distortion in the transparent lid body causes a shift in the optical axis of light entering the imaging element through the transparent lid, resulting in a degradation of the image quality of the captured image. This degradation in image quality has become even more problematic in recent years due to the demand for thinner transparent lids to reduce size and weight.

[0012] [First embodiment] An imaging module according to an embodiment of the present invention will be described with reference to FIGS. 1 to 3. FIG. 1 is a top view showing an imaging module 100 according to this embodiment. FIG. 2B is a cross-sectional view showing a cross section of imaging module 100 according to this embodiment taken along line AA shown in FIG. 1. FIG. 2B is a cross-sectional view showing a cross section of imaging module 100 according to this embodiment taken along line BB shown in FIG. 1. Note that in FIGS. 2A and 2B, the portion between substrate 1 and frame body 2 and the portion between frame body 2 and lid body 3 are exaggerated in the thickness direction. FIG. 3 is a top view showing frame body 2 in imaging module 100 according to this embodiment.

[0013] As shown in FIGS. 1 to 2B, the imaging module 100 according to this embodiment includes a substrate 1, a frame 2, a cover 3, and an imaging element 4.

[0014] An imaging element 4 is disposed and mounted on one surface 1a of the substrate 1. The imaging element 4 mounted on the substrate 1 is disposed, for example, in the center of the substrate 1. The imaging element 4 is electrically connected to the substrate 1 by a metal wire 7.

[0015] Furthermore, on the surface 1a of the substrate 1 on which the imaging element 4 is arranged, a frame 2 is arranged outside the imaging element 4 in a plan view seen perpendicular to the substrate 1 so as to surround the imaging element 4. The substrate 1 and the frame 2 are bonded via a first bonding material 5. Specifically, the surface 1a of the substrate 1 and one surface 2a of the frame 2 are bonded via the first bonding material 5. In this way, the frame 2 is bonded onto the substrate 1 via the first bonding material 5 so as to surround the imaging element 4.

[0016] As shown in FIG. 3, the frame 2 has an annular planar shape that surrounds a rectangular region including the imaging element 4 in a plan view perpendicular to the substrate 1. In FIG. 3, M1 to M4 indicate the centers of the sides of the frame 2, and C1 to C4 indicate the corners of the frame 2. The planar shape of the frame 2 is not limited to the planar shape shown in FIG. 3, and may be an annular planar shape that surrounds a polygonal region other than a rectangle that includes the imaging element 4 in a plan view perpendicular to the substrate 1. In other words, the frame 2 is a frame-shaped member having a frame shape with multiple sides and corners connecting two adjacent sides. The frame 2 does not need to have continuous sides that surround the imaging element 4, as long as it is arranged to surround the imaging element 4.

[0017] A lid body 3 is disposed on the other surface 2b of the frame body 2 so as to seal the opening 2c of the frame body 2. The frame body 2 and the lid body 3 are bonded together via a second bonding material 6. Specifically, the other surface 2b of the frame body 2 and one surface 3a of the lid body 3 are bonded together via the second bonding material 6. In this way, the lid body 3 is bonded onto the frame body 2 via the second bonding material 6. The lid body 3 covers the space formed by the substrate 1 and the frame body 2 so as to seal it.

[0018] In the imaging module 100 according to this embodiment, the thickness of the second bonding material 6 bonding the frame body 2 and the lid body 3 is greater at the center of the sides of the frame body 2 than at the corners of the frame body 2. By providing the second bonding material 6 with such a thickness, the frame body 2 can be used as a heat transfer path to efficiently transfer heat transferred from the image sensor 4 and substrate 1, which are heat sources, to the corners of the lid body 3, which have a lower temperature. This reduces temperature unevenness in the lid body 3 and minimizes distortion of the lid body 3. Thus, according to this embodiment, distortion of the lid body 3 due to heat generated during operation of the image sensor 4 can be suppressed.

[0019] Hereinafter, each of the components that make up the imaging module 100 according to this embodiment will be described in detail.

[0020] The substrate 1 can be formed by laminating plate materials. Specifically, the substrate 1 is a wiring board having wiring, electrodes, etc. on its surface or on its surface and inside for electrical connection between components. For example, a printed wiring board, a printed circuit board, a glass composite board, a glass epoxy board, a ceramic board, etc. can be used as the substrate 1.

[0021] In order to mount the imaging element 4 on the substrate 1, the substrate 1 has electrodes (not shown) patterned in advance on its mounting surface, surface 1a. The electrodes may be provided not only on one surface 1a of the substrate 1 but also on the other surface 2b. The substrate 1 may be made of a conductor such as a metal plate as long as it can ensure insulation between the internal and external terminals, but typically uses an insulator as the base material. The thickness of the substrate 1 is not limited to a particular thickness, but is, for example, in the range of 0.1 mm to 3 mm.

[0022] The frame 2 is a frame-shaped member arranged on the surface 1a of the substrate 1 on which the imaging element 4 is mounted so as to surround the area where the imaging element 4 is mounted. The frame 2 surrounds the imaging element 4 in a plan view seen perpendicular to the substrate 1. The frame 2 is bonded to the surface 1a of the substrate 1 with a first bonding material 5.

[0023] The frame 2 can be made of a suitable material such as resin, ceramic, or metal including an alloy. From the viewpoint of reducing the size and weight of the imaging module 100 and reducing warpage, the frame 2 is preferably made of a cured product of a thermosetting resin composition. The frame 2 preferably has a rectangular outer shape. Furthermore, the thickness of the frame 2 must be thicker than the imaging element 4 in order to accommodate the imaging element 4, and is preferably in the range of 0.5 mm to 3.0 mm.

[0024] As described above, the frame 2 has a frame-like shape with its sides connected at corners. In this case, it is preferable that the distance from the center of the side of the frame 2 to the lid 3 is longer than the distance from the corner of the frame 2 to the lid 3. On the other hand, it is also preferable that the distance from the corner of the frame 2 to the substrate 1 is longer than the distance from the center of the frame 2 to the substrate 1.

[0025] The edges of the frame 2 preferably have a convex warp that protrudes toward the substrate 1. A practical warp amount is preferably 10 μm or more, with a range of 10 μm to 100 μm being more preferable. When the warp amount is in the range of 10 μm to 100 μm, a sufficient amount of bonding material can be provided in the center of the edges of the frame 2, allowing heat transferred from the substrate 1 and the imaging element 4 to be efficiently transferred from the corners of the frame 2 to the lid 3. When the warp amount is less than 10 μm, the amount of heat transferred from the center of the edges of the frame 2 to the lid 3 increases, reducing the efficiency of heat transfer to the lid 3 through the corners of the frame 2, potentially making it difficult to achieve uniform heat distribution in the lid 3. Furthermore, when the warp amount is greater than 100 μm, changes in the external dimensions of the frame 2 due to the warp can make handling of the frame 2 difficult during the assembly process, potentially reducing productivity.

[0026] The amount of warping of the frame 2 is expressed as the height from a reference line connecting adjacent corners of the frame 2 to the center of the side that includes those corners. The shape of the warp of the frame 2 is not particularly limited and can be various shapes. For example, the shape of the warp of the frame 2 may be an arc shape overall in the length direction of the side, a straight line from the corner to the center of the side with a curved center, or a convex shape in which only the corner bulges out toward the lid 3.

[0027] The flatness of the frame body 2 having the above-described shape is preferably 100 μm or less. If the flatness of the frame body 2 is 100 μm or less, higher stability can be ensured in both the bonding to the substrate 1 via the first bonding material 5 and the bonding to the lid body 3 via the second bonding material 6. In addition, deterioration of image quality due to misalignment of the optical axis caused by the parallelism between the imaging element 4 of the substrate 1 and the lid body 3 can be further suppressed. If the amount of warping is greater than 100 μm, changes in the external dimensions of the frame body 2 may make handling of the frame body 2 during the assembly process difficult, which may reduce productivity.

[0028] Furthermore, the surface of the frame 2 may be roughened to form irregularities. Roughening the surface increases the surface area of ​​the frame 2, and improves the heat transfer efficiency in the thickness direction from the lower surface to the upper surface of the frame 2. In addition, when the frame 2 is made of a cured product of a resin composition containing a filler, the skin layer, which is the surface layer of the frame 2, may be removed to expose the filler. In this case, even higher heat transfer efficiency can be achieved by using the filler, which has a higher thermal conductivity than the resin, as a heat transfer path.

[0029] The thermal conductivity of the frame 2 is preferably greater than that of the first bonding material 5 and the second bonding material 6. This relationship in magnitude of the thermal conductivities enables even higher heat transfer efficiency to be achieved. Since the thermal conductivity of the frame 2 is greater than that of the first bonding material 5 and the second bonding material 6, heat generated from the imaging element 4 can be efficiently transferred to the lid 3 through the frame 2, thereby improving the uniformity of heat in the lid 3. It is more preferable that the thermal conductivity of the frame 2 be 1.1 times or more that of the first bonding material 5 and the second bonding material 6.

[0030] Furthermore, in order to efficiently transfer heat generated by the imaging element 4 and transferred from the substrate 1 to the frame 2 via the substrate 1 to the lid 3, it is preferable that the thermal conductivity of the frame 2 be 1.0 W / m·K or higher.

[0031] 2A, the frame 2 is disposed only on one surface 1a of the substrate 1, but the arrangement of the frame is not limited to this. For example, the frame 2 may be disposed so as to cover the side surface of the substrate 1, or the side surface of the lid 3.

[0032] Hereinafter, the constituent materials of the thermosetting resin composition and the method for producing the frame 2 when the frame 2 is made of a cured product of the thermosetting resin composition will be described in detail.

[0033] The thermosetting resin composition forming the frame 2 can contain epoxy resin, a curing agent, a filler, an additive, and the like as constituent materials.

[0034] Examples of epoxy resins contained in the thermosetting resin composition include triphenylmethane-type epoxy resins, dicyclopentadiene-type epoxy resins, naphthol-cresol novolac-type epoxy resins, multifunctional epoxy resins, bisphenol A-type epoxy resins, bisphenol F-type epoxy resins, cyclic aliphatic epoxy resins, long-chain aliphatic epoxy resins, glycidyl ester-type epoxy resins, and glycidyl amine-type epoxy resins. Among these, multifunctional epoxy resins are preferred because they have a small epoxy equivalent and are excellent in heat resistance, chemical resistance, and electrical properties. The content of the epoxy resin in the bonding resin composition is preferably, for example, in the range of 3% by mass to 25% by mass.

[0035] Examples of curing agents contained in the thermosetting resin composition include materials that undergo a curing reaction with epoxy resins, such as amine-based curing agents (aliphatic amines, aromatic amines, etc.), imidazole-based curing agents, acid anhydride curing agents, and novolac-type phenolic resin curing agents. Of these, novolac-type phenolic resin curing agents are preferred, as they increase the crosslink density of the cured product and provide excellent heat resistance, moisture resistance, chemical resistance, etc. The amount of curing agent to be blended with the epoxy resin is determined by the amount of epoxy resin blended and the equivalent weight of the reactive functional groups of the epoxy resin and curing agent.

[0036] The filler contained in the thermosetting resin composition is used to adjust the linear expansion coefficient, elastic modulus, and thermal conductivity. If the linear expansion coefficient and elastic modulus of the frame body 2 are significantly different from those of the substrate 1 and the lid body 3, thermal deformation of the substrate 1 and the lid body 3 during bonding or reflow heating during mounting of the imaging element 4 and other components can cause significant strain at the bonding interface, potentially resulting in poor bonding between the frame body 2 and the substrate 1 or the lid body 3. The filler is preferably an inorganic filler, and examples thereof include silica particles such as spherical silica and crystalline silica, aluminum oxide, titanium oxide, zirconium oxide, magnesium oxide, calcium silicate, calcium carbonate, potassium titanate, silicon carbide, silicon nitride, boron nitride, and aluminum nitride. The inorganic filler may be used alone or in combination of two or more types. Of these, silica particles, which have a small linear expansion coefficient, are suitable for adjusting the linear expansion coefficient of the frame body 2, and calcium carbonate particles are suitable for adjusting the elastic modulus of the frame body 2.

[0037] When adjusting the linear expansion coefficient, the proportion of silica particles in the thermosetting resin composition is preferably in the range of 60% by mass to 95% by mass in order to make the difference in linear expansion coefficient between the frame 2 and the substrate 1 and the lid 3 preferably 10 ppm / K or less. Furthermore, the proportion of the silica particles is more preferably in the range of 65% by mass to 90% by mass.

[0038] In order to achieve a high loading of silica particles, it is preferable to mix two or more types of silica particles with different median particle diameters. More specifically, it is preferable that the large silica particles have a median particle diameter of 10 μm or more, and the small silica particles have a median particle diameter of 1 μm or less. Furthermore, it is more preferable that the large silica particles have a median particle diameter of 20 μm or more, and the small silica particles have a median particle diameter of 0.5 μm or less. It is preferable that the content of the large silica particles is in the range of 1 to 20 times the content of the small silica particles.

[0039] Furthermore, the ratio of the median particle size of the small silica particles to the median particle size of the large silica particles is preferably 0.05 or more and 0.5 or less, and more preferably 0.1 or more and 0.4 or less.

[0040] When adjusting the elastic modulus, the proportion of calcium carbonate in the thermosetting resin composition is preferably 1% by mass or more and 20% by mass or less, and more preferably 5% by mass or more and 15% by mass or less, so that the frame body 2 does not break when loaded.

[0041] Furthermore, the thermal conductivity of the filler is preferably higher than the thermal conductivity of the resin that constitutes the frame 2. For example, when the thermal conductivity of the resin is less than 1.0 W / m K, the addition of the filler allows the frame 2 to have a high thermal conductivity of 1.0 W / m K or higher.

[0042] In addition to the above-mentioned components, the thermosetting resin composition may contain various additives such as a curing accelerator, a coupling agent, a release agent, a flame retardant, a colorant, etc. Furthermore, the thermosetting resin composition may contain various additives known in the art, as needed, in addition to the additives exemplified below.

[0043] The curing accelerator is a catalyst that radically opens the epoxy group of the epoxy resin or radicalizes the reactive functional group of the curing agent to promote the polymerization reaction. The curing accelerator is not particularly limited, but is preferably an organophosphorus compound. Examples of organophosphorus compounds as curing accelerators include triphenylphosphine, tri-o-tolylphosphine, tri-p-tolylphosphine, diphenylcyclohexylphosphine, tricyclohexylphosphine, tetra-n-butylphosphonium laurate, and 1,2-bis(diphenylphosphino)acetylene. Among these, tri-p-tolylphosphine, which has excellent latency, is preferred. The organophosphorus compound is preferably present in an amount of 0.1 to 5 parts by mass, more preferably 0.5 to 3 parts by mass, based on 100 parts by mass of the total amount of the epoxy resin and curing agent. When the total amount of the epoxy resin and curing agent is taken as 100 parts by mass, if the amount of the organophosphorus compound is 0.5 parts by mass or more, rapid curing is possible, and if it is 3 parts by mass or less, the compound will stabilize without curing when heated and melted before molding, which tends to improve productivity.

[0044] Coupling agents can be used to enhance the affinity and adhesion between the epoxy resin and the inorganic filler. For example, coupling agents include silane coupling agents having a glycidyl group, a mercapto group, an amino group, an alkyl group, a urea group, or a vinyl group at the terminal. Among these, it is preferable to use a silane coupling agent having a glycidyl group at the terminal because it has a high affinity for the epoxy resin and can exhibit high adhesion to the inorganic filler.

[0045] If the amount of silane coupling agent is too small, the surface modification effect on the inorganic filler may not be fully exerted. Conversely, if the amount of silane coupling agent is too large, the excess silane coupling agent may reduce the performance of the thermosetting resin composition, such as the elastic modulus. Therefore, the amount of silane coupling agent is preferably in the range of 0.05 parts by mass to 5 parts by mass, more preferably in the range of 0.2 parts by mass to 2 parts by mass, per 100 parts by mass of the inorganic filler.

[0046] Mold release agents are used to ensure smooth release from a molding machine when molding a thermosetting resin composition. There are no particular limitations on the mold release agent, and conventionally known ones can be used. Specific examples of mold release agents include carnauba wax, higher fatty acids such as montanic acid and stearic acid, metal salts of higher fatty acids such as metal soaps, ester waxes, and polyolefin waxes such as oxidized polyethylene and non-oxidized polyethylene. One type of mold release agent may be used alone, or two or more types may be used in combination.

[0047] The amount of the release agent is preferably in the range of 0.1 to 10 parts by mass, more preferably in the range of 0.5 to 5 parts by mass, when the total amount of the epoxy resin and the curing agent is taken as 100 parts by mass. When the amount of the release agent is 0.5 parts by mass or more, sufficient releasability is easily obtained, and when it is 10 parts by mass or less, better bonding properties tend to be obtained.

[0048] Flame retardants are used to ensure the flame retardancy of the thermosetting resin composition. The flame retardant is not particularly limited, and conventionally known flame retardants can be used. Examples of flame retardants include organic or inorganic compounds containing bromine atoms, antimony atoms, nitrogen atoms, or phosphorus atoms, and metal hydroxides. One type of flame retardant may be used alone, or two or more types may be used in combination.

[0049] The colorant is used to tone the resin composition. The colorant is not particularly limited, and conventionally known colorants can be used. Examples of colorants include known colorants such as carbon black, organic dyes, organic pigments, titanium oxide, red lead, and red iron oxide. The content of the colorant can be appropriately selected depending on the purpose. One type of colorant may be used alone, or two or more types may be used in combination. In the imaging module 100 according to this embodiment, carbon black is preferred because it has low gloss and prevents diffuse reflection of incident light. The content of carbon black is preferably in the range of, for example, 0.01% by mass to 1% by mass.

[0050] The frame body 2 used in the imaging module 100 according to this embodiment is manufactured, for example, as follows.

[0051] The predetermined materials constituting the thermosetting resin composition described above, such as epoxy resin, curing agent, filler, and additives, are mixed in predetermined amounts and then heated, melted, and kneaded to obtain a kneaded resin composition. For the heat-melt kneading, a kneader, roll, twin-screw kneader, or the like preheated to a temperature in the range of 70 to 120°C can be used. Next, the kneaded resin composition is pulverized using a mixer, pulverizer, or the like.

[0052] Next, the finely divided kneaded resin composition is again heated and melted in the range of 70 to 100°C, and poured into a mold preheated to the range of 160 to 190°C, and thermally cured for a certain period of time. This results in a molded frame 2, which is molded in the mold. Examples of molding methods include injection molding, compression molding, and transfer molding. Of these methods, injection molding, which allows for continuous production, is preferred. If sufficient curing time cannot be ensured during the molding stage, it is preferable to carry out a full curing treatment after molding.

[0053] The frame 2 can be processed and shaped as desired by various methods. Specifically, for example, a frame 2 having a desired warp and shape can be obtained by processing a molding die into a desired shape in advance. Methods for forming a warp in the frame 2 include, in addition to processing a die, grinding and bending, in which a fulcrum is placed at each corner of the frame 2 and a load is applied to the center of each side.

[0054] The surface of the frame 2 can be roughened by various methods, such as wet blasting, sand blasting, and laser treatment.

[0055] The first bonding material 5 is provided between the substrate 1 and the frame 2 to bond the substrate 1 to the frame 2. The second bonding material 6 is provided between the frame 2 and the lid 3 to bond the frame 2 to the lid 3.

[0056] The first bonding material 5 and the second bonding material 6 are not particularly limited, but may each be, for example, a cured adhesive. From the viewpoints of moisture resistance and bonding strength, the adhesive forming the first bonding material 5 and the second bonding material 6 can be a known, commercially available adhesive whose main component is an epoxy resin that forms a dense cured structure. The adhesive may contain a curing agent, a filler, and the like, as appropriate. The adhesive curing method is not particularly limited, and a curing method such as dry curing, two-component mixing curing, or energy curing (thermal curing, photocuring) can be appropriately selected depending on the purpose.

[0057] For example, the adhesive forming the first bonding material 5 is preferably a thermosetting adhesive because the first bonding material 5 is interposed between the substrate 1 and the frame 2. On the other hand, the adhesive forming the second bonding material 6 is interposed between the frame 2 and the lid 3 and seals the space surrounded by the frame 2 and the surface 1a of the substrate 1, which is the mounting surface for the imaging element 4. For this reason, if a thermosetting adhesive is used as the adhesive forming the second bonding material 6, the sealed space may expand when heated while the adhesive is in an uncured state. From the viewpoint of avoiding such space expansion, the adhesive forming the second bonding material 6 is preferably a photocurable adhesive that does not require heating. Note that after the photocurable adhesive has sufficiently cured, the photocurable adhesive may be additionally heated to perform thermal curing. Thus, the adhesives forming the first bonding material 5 and the second bonding material 6 are preferably energy-curable resin compositions that are cured by heat or light.

[0058] The thickness of the second bonding material 6 at the center of the side of the frame body 2 is thicker than the thickness of the second bonding material 6 at the corner of the frame body 2. On the other hand, the thickness of the first bonding material 5 at the corner of the frame body 2 is thicker than the thickness of the first bonding material 5 at the center of the frame body 2. Specific ranges of the thickness of the first bonding material 5 and the second bonding material 6 are as follows:

[0059] The thickness of each of the first bonding material 5 and the second bonding material 6 is preferably in the range of 5 μm or more and 300 μm or less. If the thickness of the bonding material is 5 μm or more, the first bonding material 5 can achieve a sufficient bonding effect to the adherends, that is, the substrate 1 and the frame 2, and the second bonding material 6 can achieve a sufficient bonding effect to the adherends, that is, the frame 2 and the lid 3. Furthermore, if the thickness of the bonding material is 300 μm or less, distortion of the bonded body due to cure shrinkage can be minimized.

[0060] Furthermore, the thickness of the first bonding material 5 and the second bonding material 6 is preferably thicker than the amount of warping of the frame body 2, which has a convex warp toward the substrate 1 side. By making the thickness of the bonding material thicker than the amount of warping, higher bonding stability can be ensured. If there is no portion where the thickness of the bonding material is thicker than the amount of warping of the frame body 2, it may be difficult to hermetically seal the imaging element 4 on the substrate 1 with high parallelism.

[0061] The thickness of the second bonding material 6 at the corners of the frame 2 is preferably 15 μm or less. If the thickness of the second bonding material 6 at the corners of the frame 2 is 15 μm or less, heat from the frame 2 can be efficiently transferred to the lid 3.

[0062] The lid 3 is a plate-like member that seals the space surrounded by the frame 2 and the surface 1a of the substrate 1, which is the mounting surface for the imaging element 4. When the lid 3 is used in the imaging module 100 as in this embodiment, the lid 3 is a translucent member that is transparent to light, such as visible light, that the imaging module 100 targets. Examples of materials that can be used for the lid 3 include plastic, glass (borosilicate glass, quartz glass, alkali-free glass, heat-resistant glass, etc.), and quartz. The surface of the lid 3 may be provided with an anti-reflection coating or an infrared-cutting coating. When a photocurable adhesive is used as the second bonding material 6, the lid 3 preferably has sufficient optical transparency to the wavelength of light that cures the photocurable adhesive. The thickness of the lid 3 is required to be flat after installation, so it is preferably in the range of 0.1 mm to 2 mm, and more preferably in the range of 0.5 mm to 1.5 mm.

[0063] Assuming that the linear expansion coefficient of the above-mentioned substrate 1 is αb, the linear expansion coefficient of the frame 2 is αf, and the linear expansion coefficient of the lid 3 is αc, from the viewpoint of sufficiently suppressing distortion of the lid 3, it is preferable that these linear expansion coefficients satisfy the following magnitude relationship. αc<αf<αb By satisfying this magnitude relationship, it is possible to suppress warping of the entire imaging module 100 due to thermal deformation during bonding.

[0064] The imaging element 4 is a semiconductor element such as a CMOS (Complementary Metal Oxide Semiconductor) image sensor or a CCD (Charge Coupled Device) image sensor. As shown in the example of FIG. 2A, the imaging element 4 is mounted on the surface 1a, which is the mounting surface of the substrate 1, and is electrically connected to electrodes of the substrate 1 via metal wires 7. The imaging element 4 may also be mounted on the substrate 1 by flip-chip bonding.

[0065] The surface of the image sensor 4 that faces the cover 3 is the light incident surface. This light incident surface can be formed by the outermost layer of a multilayer film provided on a semiconductor substrate having a light receiving surface. The multilayer film includes layers with optical functions such as a color filter layer, a microlens layer, an anti-reflection layer, and a light-shielding layer, layers with mechanical functions such as a planarization layer, and layers with chemical functions such as a passivation layer.

[0066] As described above, according to this embodiment, the thickness of the second bonding material 6 that bonds the frame body 2 and the lid body 3 is thicker at the center of the sides of the frame body 2 than at the corners of the frame body 2, thereby suppressing distortion of the lid body 3 due to heat generated during operation of the imaging element 4.

[0067] In the imaging module 100 according to this embodiment, in which distortion of the lid body 3 is suppressed, for example, the difference between the maximum distance from the substrate 1 to the lid body 3 and the minimum distance is 100 μm or less, and distortion of the lid body 3 is sufficiently reduced. Therefore, deterioration of image quality due to misalignment of the optical axis can be further suppressed. In the above example, the shape of the frame body 2 is a convex shape facing the substrate 1 on the side in contact with the first bonding material 5, but is not limited to this shape. For example, the surface of the frame body 2 on the side in contact with the first bonding material 5 may be a surface parallel to the main surface of the substrate 1.

[0068] <Example> Next, the present invention will be described in more detail with reference to examples and comparative examples, but the present invention is not limited to the following examples.

[0069] First, the measurement method used to evaluate the imaging modules of the example and comparative example will be described. The imaging modules of the example and comparative example were evaluated by measuring the flatness of the lid 3 as follows.

[0070] In the measurement, first, the imaging modules 100 of the examples and comparative examples prepared as described below were operated as electronic devices, and the imaging element 4 was heated to 90°C. At this time, the imaging module 100 was placed on a surface plate, and the height of the lid 3 was measured using a laser displacement meter. The flatness of the lid 3 was evaluated based on the measurement results. Flatness is the deviation of the use surface from a geometrically correct plane. It is expressed as the minimum distance between two geometrically correct parallel planes when the use surface is sandwiched between them. Therefore, a smaller flatness indicates higher flatness. In this measurement, the use surface was the lid 3, and the difference between the minimum and maximum heights of the lid 3 from the surface plate, measured using the laser displacement meter, was the minimum distance between the two parallel planes. A four-level evaluation scale was used as the evaluation criteria, based on the relationship between the flatness of the lid 3 and the deviation of the incident optical axis. That is, the evaluation criteria used were "A (excellent)" for flatness less than 5 μm, "B (good)" for flatness between 5 μm and 10 μm, "C (fair)" for flatness between 10 μm and 15 μm, and "D (unacceptable)" for flatness of 15 μm or more. Misalignment of the incident optical axis causes degradation of the image captured by the imaging module 100.

[0071] Example 1 In Example 1, an imaging module 100 shown in FIGS. 1 to 2B was prepared. In the following description, the longitudinal direction of the imaging module 100 in a plan view perpendicular to the surface 1a is defined as the X direction, and the lateral direction is defined as the Y direction. In the imaging module 100, a glass epoxy substrate, which is a plate-shaped rigid printed wiring board, was used as the substrate 1, and a CMOS image sensor was mounted on the substrate 1 as the imaging element 4. A translucent member made of quartz glass with alpha ray protection was prepared for the lid 3. The glass epoxy substrate serving as the substrate 1 had a thickness of 0.8 mm, an outer diameter in the X direction of 54 mm, and an outer diameter in the Y direction of 43 mm. The lid 3 had a thickness of 0.5 mm, a dimension in the X direction of 53 mm, and a dimension in the Y direction of 42 mm. The linear expansion coefficients of the substrate 1 and the lid 3 were 14 ppm / K and 6 ppm / K, respectively. The frame 2 was prepared according to the following procedure.

[0072] First, 7.6 mass% of epoxy resin (multifunctional epoxy resin manufactured by Nippon Kayaku Co., Ltd., product name EPPN-502H), 4.7 mass% of curing agent (novolac type phenolic resin manufactured by DIC Corporation, product name TD-2131), 69 mass% of silica particles (manufactured by Denka Co., Ltd., average particle size 24 μm, product name FB-950), 6.9 mass% of silica particles (manufactured by Denka Co., Ltd., average particle size 0.4 μm, product name SFP-20M), calcium carbonate (manufactured by Shiraishi Kogyo Co., Ltd., product name Bril A mixture was obtained by mixing 10% by mass of PEG-1500 (product of Hokko Chemical Co., Ltd., trade name TPTP), 0.2% by mass of an organic phosphorus compound: tri-p-tolylphosphine (product of Hokko Chemical Co., Ltd., trade name TPTP), 0.7% by mass of a silane coupling agent (product of Shin-Etsu Chemical Co., Ltd., glycidyl-terminated, trade name KBM-403), 0.7% by mass of magnesium stearate (product of Sakai Chemical Co., Ltd., trade name SM-1000), and 0.2% by mass of carbon black (product of Mitsubishi Chemical Corporation, trade name MA-100) at room temperature. The resulting mixture was then heated and kneaded at 120°C in a continuous twin-screw kneader (product of JSW, trade name TEX-44α) to obtain a kneaded resin composition. After cooling, the kneaded resin composition was pulverized and mixed in a mixer (product of Kawata Corporation, trade name SMV-100) to obtain a thermosetting resin composition. The obtained thermosetting resin composition was molded using an injection molding machine for thermosetting resins (Shibaura Machine Co., Ltd., product name RC75SXR) and a mold formed in the shape of frame 2 at a cylinder temperature of 80°C, a mold temperature of 180°C, and a curing time of 50 seconds to obtain a molded body. After molding, the obtained molded body was heat-treated at 180°C for 8 hours to obtain frame 2. At this time, the mold was processed so that each side of frame 2 would have an arc-shaped warp, resulting in frame 2 with a warp of 100 μm on each side. The dimensions of frame 2 were a thickness of 1.54 mm, an outer diameter in the X direction of 54 mm, and an outer diameter in the Y direction of 43 mm. The linear expansion coefficient of frame 2 was 11 ppm / K.

[0073] A thermosetting adhesive (product name EW2050, manufactured by 3M Corporation) was used as the adhesive for forming the first bonding material 5. The thermosetting adhesive was applied to the substrate 1 using a dispenser so that sealing could be achieved after bonding. Next, the frame 2 was placed on the thermosetting adhesive so that it had a convex warp protruding toward the substrate 1, and a load was applied to the frame 2 so that the substrate 1 and the frame 2 were parallel to each other. The thermosetting adhesive was then cured by heating at 120 to 150°C, thereby obtaining the first bonding material 5. At this time, the thickness of the first bonding material 5 at the corners of the frame 2 was 115 μm, and the thickness of the first bonding material 5 at the center of the sides of the frame 2 was 15 μm.

[0074] An ultraviolet-curable adhesive (Kyoritsu Chemical Industry Co., Ltd., product name: Worldlock 5210) was used as the adhesive forming the second bonding material 6. This ultraviolet-curable adhesive was also a thermosetting adhesive. The ultraviolet-curable adhesive was applied using a dispenser to the surface 2b, which is the bonding surface, of the frame 2 so that the imaging element 4 would be hermetically sealed in the space surrounded by the substrate 1, frame 2, and lid 3 after bonding. Furthermore, the ultraviolet-curable adhesive was brought into contact with the surface 3a, which is the bonding surface of the lid 3, so that the substrate 1 and the lid 3 were parallel to each other, and the ultraviolet-curable adhesive was cured and bonded by irradiating ultraviolet light using an LED light source with a wavelength of 365 nm. After bonding by ultraviolet irradiation, the components were heated at 80 to 100°C, thereby obtaining the imaging module 100 of Example 1.

[0075] In the imaging module 100 of Example 1 obtained as described above, the thickness of the second bonding material 6 at the corners of the frame body 2 was 15 μm, and the thickness of the second bonding material 6 at the center of the sides of the frame body 2 was 115 μm. In Fig. 3, the positions of the center of the sides of the frame body 2 are indicated by M1 to M4, and the positions of the corners are indicated by C1 to C4.

[0076] In this embodiment, the adhesive that forms the first bonding material 5 is applied to the substrate 1, and the adhesive that forms the second bonding material 6 is applied to the frame 2, but in either case, there is no limitation on which of the adherends the adhesive is applied to. Furthermore, after bonding members together using the adhesive, additional adhesive may be injected between the members to adjust the thickness of the bonding material that is formed.

[0077] Example 2 In Example 2, the thickness of the first bonding material 5 at the corners of the frame body 2 was 65 μm, and the thickness of the first bonding material 5 at the center of the sides of the frame body 2 was 15 μm. The thickness of the second bonding material 6 at the corners of the frame body 2 was 15 μm, and the thickness of the second bonding material 6 at the center of the sides of the frame body 2 was 65 μm. Except for these points, the imaging module 100 of Example 2 was obtained by forming it in the same manner as in Example 1.

[0078] Example 3 In Example 3, the thickness of the first bonding material 5 at the corners of the frame body 2 was 25 μm, and the thickness of the first bonding material 5 at the center of the sides of the frame body 2 was 15 μm. In addition, the thickness of the second bonding material 6 at the corners of the frame body 2 was 15 μm, and the thickness of the second bonding material 6 at the center of the sides of the frame body 2 was 25 μm. Except for these points, the imaging module 100 of Example 3 was obtained by forming it in the same manner as in Example 1.

[0079] Example 4 In Example 4, the thickness of the first bonding material 5 at the corners of the frame body 2 was 120 μm, and the thickness of the first bonding material 5 at the center of the sides of the frame body 2 was 20 μm. In addition, the thickness of the second bonding material 6 at the corners of the frame body 2 was 20 μm, and the thickness of the second bonding material 6 at the center of the sides of the frame body 2 was 120 μm. Except for these points, the imaging module 100 of Example 4 was obtained by forming it in the same manner as in Example 1.

[0080] Example 5 In Example 5, a frame body 2 having a warp of 110 μm was used, and the thickness of the first bonding material 5 at the corners of the frame body 2 was set to 125 μm, and the thickness of the first bonding material 5 at the center of the sides of the frame body 2 was set to 15 μm. In addition, the thickness of the second bonding material 6 at the corners of the frame body 2 was set to 15 μm, and the thickness of the second bonding material 6 at the center of the sides of the frame body 2 was set to 125 μm. Except for these points, the imaging module 100 of Example 5 was obtained by forming it in the same manner as in Example 1.

[0081] Example 6 Fig. 4 is a cross-sectional view showing an imaging module 100 of Example 6, and corresponds to the cross-sectional view shown in Fig. 2B. In Example 6, as shown in Fig. 4, a frame body 2 was used in which only the surface 2b of the frame body 2 on the lid body 3 side was carved out by 100 µm in a convex shape protruding toward the substrate 1 side, and the surface 2a of the frame body 2 on the substrate 1 side was flat. In addition, the thickness of the first bonding material 5 at the corners and central parts of the sides of the frame body 2 was set to a uniform 50 µm. Except for these points, the imaging module 100 of Example 6 was obtained by forming it in the same manner as in Example 1.

[0082] Example 7 Fig. 5 is a cross-sectional view showing an imaging module 100 of Example 7, and corresponds to the cross-sectional view shown in Fig. 2B. In Example 7, as shown in Fig. 5, a frame body 2 was used in which only the corners of the surface 2b of the frame body 2 facing the lid body 3 swell in a convex shape protruding toward the lid body 3, and only the center portions of the sides of the surface 2a of the frame body 2 facing the substrate 1 swell in a convex shape protruding toward the substrate 1. Except for these points, the imaging module 100 of Example 7 was obtained by forming it in the same way as in Example 1.

[0083] (Comparative Example 1) FIG. 6 is a cross-sectional view showing the imaging module 100 of Comparative Example 1, and corresponds to the cross-sectional view shown in FIG. 2B. In Comparative Example 1, as shown in FIG. 6, the frame body 2 was placed on the substrate 1 so as to have a convex warp protruding toward the lid body 3, and the thickness of the first bonding material 5 at the corners of the frame body 2 was set to 15 μm and the thickness of the first bonding material 5 at the center of the side of the frame body 2 was set to 115 μm. In addition, the thickness of the second bonding material 6 at the corners of the frame body 2 was set to 115 μm and the thickness of the second bonding material 6 at the center of the side of the frame body 2 was set to 15 μm. Except for these points, the imaging module 100 of Comparative Example 1 was obtained by forming it in the same manner as in Example 1.

[0084] (Comparative Example 2) Fig. 7 is a cross-sectional view showing the imaging module 100 of Comparative Example 2, and corresponds to the cross-sectional view shown in Fig. 2B. In Comparative Example 2, as shown in Fig. 7, a flat frame body 2 with no warping on any side was used, and the thickness of the first bonding material 5 was set to a uniform 50 µm, and the thickness of the second bonding material 6 was set to a uniform 15 µm. Except for these points, the imaging module 100 of Comparative Example 2 was obtained by forming it in the same manner as in Example 1.

[0085] (Comparative Example 3) FIG. 8 is a cross-sectional view showing an imaging module 100 of Comparative Example 3, corresponding to the cross-sectional view shown in FIG. 2B. In Comparative Example 3, as shown in FIG. 8, a frame body 2 was used in which only the surface 2a of the frame body 2 facing the substrate 1 was raised by 100 μm in a convex shape protruding toward the substrate 1, and the surface 2b of the frame body 2 facing the lid body 3 was flat. In addition, the thickness of the first bonding material 5 at the corners of the frame body 2 was 115 μm, and the thickness of the first bonding material 5 at the center of the sides of the frame body 2 was 15 μm. In addition, the thickness of the second bonding material 6 at the corners and center of the sides of the frame body 2 was 15 μm. Except for these points, the imaging module 100 of Comparative Example 3 was obtained by forming it in the same manner as in Example 1.

[0086] Table 1 shows the details of the Examples and Comparative Examples obtained as described above, as well as the evaluation results obtained for the Examples and Comparative Examples.

[0087] [Table 1]

[0088] As shown in Table 1, in all of the imaging modules 100 of Examples 1 to 7, distortion of the lid 3 due to heat generated by the imaging element 4 during operation could be suppressed.

[0089] Comparing Example 1, Example 2, and Example 3, Example 1 was able to best suppress distortion of the lid body 3, followed by Example 2. This is for the following reason. Specifically, Example 1 has a larger difference in thickness between the center and corner portions of the side portions of the frame body 2 compared to Examples 2 and 3. Therefore, in Example 1, heat generated by the imaging element 4 can be more efficiently transferred to the corner portions of the lid body 3, which are the lowest in the temperature distribution of the lid body 3. As a result, in Example 1, distortion due to temperature unevenness of the lid body 3 can be further suppressed by uniformly heating the lid body 3. In Example 1, temperature unevenness of the lid body 3 was suppressed to 2°C or less.

[0090] Comparing Example 1 and Example 6, Example 1 was able to suppress distortion of the lid 3 more effectively than Example 6. This is because in Example 1, the frame 2 itself is warped, which results in a large difference in thickness between the center and corner portions of the side of the frame 2, and as a result, heat obtained from the center of the side of the underside of the frame 2, which is closest to the imaging element 4, which is the heat source, can be efficiently transferred to the corners of the lid 3. In the case of a shape like Example 6, heat is transferred so that it spreads over the underside of the frame 2, increasing the number of heat transfer paths.

[0091] Comparing Example 1 and Example 7, Example 1 was able to suppress distortion of the lid body 3 more effectively than Example 7. This is because Example 1 has a smooth arc-shaped warp, which is advantageous for uniform heating of the lid body 3, which faces the imaging element 4 and has temperature unevenness in a roughly concentric pattern.

[0092] On the other hand, in Comparative Example 1, the frame 2 has a convex warp that protrudes toward the lid 3, so the difference in thickness of the bonding material at the center and corners of the sides of the frame 2 is the opposite of the configuration of the Examples. In the configuration of Comparative Example 1, the second bonding material 6 is thicker than the corners of the lid 3, and is formed so that the frame 2, which is the heat transfer path, is farther away, so heat cannot be uniformly distributed and distortion of the lid 3 cannot be suppressed.

[0093] In Comparative Example 2, the frame body 2 has a flat shape, so the second bonding material 6 has a uniform thickness. With a configuration like Comparative Example 2, the heat transferred to the lid body 3 through the frame body 2 is most or almost uniformly transferred from the center of the side of the frame body 2, so it is not possible to reduce the temperature unevenness of the lid body 3 caused by heat generation by the imaging element 4. For this reason, with a configuration like Comparative Example 2, it is not possible to suppress distortion of the lid body 3.

[0094] In Comparative Example 3, similar to Comparative Example 2, the second bonding material 6 has a uniform thickness, and therefore distortion of the lid body 3 cannot be suppressed.

[0095] Furthermore, when the imaging modules 100 of Examples 1 to 7 were housed in a housing and operated as a camera, which is an imaging device, good images were obtained for a long period of time even when the temperature rose due to heat generation during operation.

[0096] [Second embodiment] An electronic device according to a second embodiment of the present invention will be described with reference to Fig. 9. Fig. 9 is a schematic diagram showing a digital camera 600, which is an example of an electronic device according to the second embodiment. In this embodiment, the digital camera 600 will be described as an imaging device, which is an example of an electrical device that uses the imaging module 100 according to the first embodiment. Note that imaging device is a general term that refers not only to digital cameras but also to electronic devices that have an imaging module, such as smartphones and tablets.

[0097] The digital camera 600 according to this embodiment is an interchangeable lens digital camera and includes a camera body 601. A lens unit 602 including one or more lenses 602a is detachably attached to the camera body 601. The camera body 601 includes a housing 611, the imaging module 100 according to the first embodiment, and a printed circuit board 700. The imaging module 100 and the printed circuit board 700 are disposed inside the housing 611.

[0098] The imaging module 100 and the printed circuit board 700 are electrically connected by a cable 950. As described in the first embodiment, the imaging module 100 is equipped with an imaging element 4 (see FIG. 2A), which is a semiconductor element. The imaging element 4 is, for example, a CMOS image sensor or a CCD image sensor. The imaging element 4 has a function of converting light incident via the lens unit 602 into an electrical signal.

[0099] An image processing device 800 is mounted on the printed circuit board 700. The image processing device 800 is, for example, a digital signal processor. The image processing device 800 has a function of acquiring an electrical signal from an imaging element, correcting the acquired electrical signal, and generating image data.

[0100] According to this embodiment, distortion of the cover 3 in the imaging module 100 caused by heat generated during operation of the imaging element 4 can be suppressed, and the quality of images captured by the digital camera 600 can be improved.

[0101] The above-described embodiments can be modified as appropriate without departing from the technical concept. For example, multiple embodiments can be combined. Furthermore, some features of at least one embodiment can be deleted or replaced. Furthermore, new features can be added to at least one embodiment.

[0102] The disclosure of this specification includes not only what is explicitly described in this specification, but also all matters that can be understood from this specification and the drawings attached to this specification.

[0103] The present disclosure includes the following configurations and methods. (Configuration 1) A substrate; an imaging element mounted on the substrate; a frame body having a plurality of sides and corners and provided outside the imaging element in a plan view; a first bonding material provided between the substrate and the frame; a light-transmitting lid that covers a space formed by the substrate and the frame; a second bonding material provided between the frame body and the lid body; The thickness of the second bonding material at the center of the side is greater than the thickness of the second bonding material at the corner. An imaging module characterized by: (Configuration 2) The thickness of the first bonding material at the corners is greater than the thickness of the first bonding material at the center. 2. The imaging module according to configuration 1, (Configuration 3) The distance from the center to the lid is longer than the distance from the corner to the lid. 3. The imaging module according to configuration 1 or 2. (Configuration 4) The distance from the corner to the substrate is longer than the distance from the center to the substrate. 4. The imaging module according to any one of configurations 1 to 3. (Configuration 5) The side of the frame has a convex warp that protrudes toward the substrate. 5. The imaging module according to any one of configurations 1 to 4. (Configuration 6) The thickness of the second bonding material at the corner is 15 μm or less. 6. The imaging module according to any one of configurations 1 to 5. (Configuration 7) The flatness of the frame is 100 μm or less 7. The imaging module according to any one of configurations 1 to 6. (Configuration 8) The frame body has a warp, The amount of warping of the frame is 10 μm or more. 8. The imaging module according to any one of configurations 1 to 7. (Configuration 9) The frame body has a warp, The thickness of the first bonding material and the second bonding material is greater than the amount of warping of the frame body. 8. The imaging module according to any one of configurations 1 to 7. (Configuration 10) The thermal conductivity of the frame is greater than the thermal conductivity of the first bonding material and the second bonding material. 10. The imaging module according to any one of configurations 1 to 9. (Configuration 11) The difference between the maximum distance from the substrate to the lid and the minimum distance is 100 μm or less. 11. The imaging module according to any one of configurations 1 to 10. (Configuration 12) When the linear expansion coefficient of the substrate is αb, the linear expansion coefficient of the frame is αf, and the linear expansion coefficient of the lid is αc, the relationship αc<αf<αb is satisfied. 12. The imaging module according to any one of configurations 1 to 11. (Configuration 13) The frame is a cured product of a thermosetting resin. 13. The imaging module according to any one of configurations 1 to 12. (Configuration 14) The frame is a molded body formed by injection molding. 14. The imaging module according to any one of configurations 1 to 13. (Configuration 15) The housing and and an imaging module according to any one of configurations 1 to 14 disposed in the housing. An imaging device characterized by: [Explanation of symbols]

[0104] 1: Circuit board 2: Frame 3: Lid 4: Image sensor 5: First bonding material 6: Second bonding material 7: Metal wire 100: Imaging module

Claims

1. A substrate; an imaging element mounted on the substrate; a frame body having a plurality of sides and corners and provided outside the imaging element in a plan view; a first bonding material provided between the substrate and the frame; a light-transmitting lid that covers a space formed by the substrate and the frame; a second bonding material provided between the frame body and the lid body; The thickness of the second bonding material at the center of the side is greater than the thickness of the second bonding material at the corner. An imaging module characterized by:

2. The thickness of the first bonding material at the corners is greater than the thickness of the first bonding material at the center.

2. The imaging module according to claim 1, wherein the imaging module is a semiconductor laser.

3. The distance from the center to the lid is longer than the distance from the corner to the lid.

2. The imaging module according to claim 1, wherein the imaging module is a semiconductor laser.

4. The distance from the corner to the substrate is longer than the distance from the center to the substrate.

2. The imaging module according to claim 1, wherein the imaging module is a semiconductor laser.

5. The side of the frame has a convex warp that protrudes toward the substrate.

2. The imaging module according to claim 1, wherein the imaging module is a semiconductor laser.

6. The thickness of the second bonding material at the corner is 15 μm or less.

2. The imaging module according to claim 1, wherein the imaging module is a semiconductor laser.

7. The flatness of the frame is 100 μm or less.

2. The imaging module according to claim 1, wherein the imaging module is a semiconductor laser.

8. The frame body has a warp, The amount of warping of the frame is 10 μm or more.

2. The imaging module according to claim 1, wherein the imaging module is a semiconductor laser.

9. The frame body has a warp, The thickness of the first bonding material and the second bonding material is greater than the amount of warping of the frame body.

2. The imaging module according to claim 1, wherein the imaging module is a semiconductor laser.

10. The thermal conductivity of the frame is greater than the thermal conductivity of the first bonding material and the thermal conductivity of the second bonding material.

2. The imaging module according to claim 1, wherein the imaging module is a semiconductor laser.

11. The difference between the maximum distance from the substrate to the lid and the minimum distance is 100 μm or less.

2. The imaging module according to claim 1, wherein the imaging module is a semiconductor laser.

12. When the linear expansion coefficient of the substrate is αb, the linear expansion coefficient of the frame is αf, and the linear expansion coefficient of the lid is αc, the relationship αc<αf<αb is satisfied.

2. The imaging module according to claim 1, wherein the imaging module is a semiconductor laser.

13. The frame is a cured product of a thermosetting resin.

2. The imaging module according to claim 1, wherein the imaging module is a semiconductor laser.

14. The frame is a molded body formed by injection molding.

2. The imaging module according to claim 1, wherein the imaging module is a semiconductor laser.

15. The housing and and an imaging module according to any one of claims 1 to 14, which is disposed in the housing. An imaging device characterized by:

Images