Imaging apparatus

Abstract

To provide an imaging apparatus capable of efficiently radiating heat from an imaging element.SOLUTION: An imaging apparatus (10) includes: an imaging element unit (230) including an imaging element (232), an electrical component (235), and an imaging element substrate (231) on which the imaging element and the electrical component are arranged; a heat radiating plate (280) for radiating heat from the imaging element unit; and a heat radiating member (282) for transmitting the heat from the imaging element unit to the heat radiating plate. The imaging element is arranged on the first surface (231a) of the imaging element substrate and the electrical component is arranged on the second surface (231b) opposite to the first surface of the imaging element substrate. The heat radiating member is arranged between the imaging element substrate and the heat radiating plate and at least a part of the heat radiating member overlaps the imaging element, when viewed from an optical axis direction.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present invention relates to an imaging device. [Background technology]

[0002] Conventionally, imaging devices have been known that include an image stabilization unit consisting of a fixed unit and a movable unit equipped with an imaging element, and that optically stabilizes image stabilization by moving the movable unit in a direction perpendicular to the optical axis. In recent years, imaging devices have become more pixelated and have improved functionality, such as high-speed continuous shooting, leading to an increase in the power consumption of imaging elements. Furthermore, stress during assembly and thermal expansion can reduce the accuracy of the installation of imaging elements, potentially affecting image quality. Patent Document 1 discloses an imaging device that dissipates heat from an imaging element by bringing a sheet member that receives heat from the imaging element into contact with an exterior member via an elastic member. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2020-022154 Summary of the Invention [Problem to be solved by the invention]

[0004] However, in the imaging device disclosed in Patent Document 1, when it is necessary to narrow or lengthen the width of the sheet member due to layout constraints or the like, the efficiency of dissipating heat from the imaging element decreases.

[0005] SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide an imaging device that can efficiently dissipate heat from an imaging element. [Means for solving the problem]

[0006] An imaging device according to one aspect of the present invention comprises an imaging element unit having an imaging element, electrical components, and an imaging element substrate on which the imaging element and the electrical components are arranged, a heat sink that dissipates heat from the imaging element unit, and a heat sink that transfers the heat from the imaging element unit to the metal member, wherein the imaging element is arranged on a first surface of the imaging element substrate, the electrical components are arranged on a second surface of the imaging element substrate opposite the first surface, and the heat sink is arranged between the imaging element substrate and the heat sink, and at least a portion of the heat sink overlaps the imaging element when viewed from the optical axis direction.

[0007] Other objects and features of the present invention are illustrated in the following examples. [Effects of the Invention]

[0008] According to the present invention, it is possible to provide an imaging device that can efficiently dissipate heat from an imaging element. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 2 is a perspective view of an imaging device according to each embodiment. [Figure 2] FIG. 2 is an exploded perspective view of the imaging device according to each embodiment. [Figure 3] FIG. 2 is an exploded perspective view of the image stabilization unit according to each embodiment. [Figure 4] FIG. 2 is an exploded perspective view of the image stabilization unit according to each embodiment. [Figure 5] FIG. 2 is a perspective view of a movable unit of the image stabilization unit according to each embodiment. [Figure 6] FIG. 2 is a cross-sectional view of a movable unit of the image stabilization unit according to each embodiment. [Figure 7] FIG. 2 is an enlarged cross-sectional view of a movable unit of the image stabilization unit according to the first embodiment. [Figure 8] FIG. 2 is a perspective view of an image pickup element unit according to each embodiment. [Figure 9] FIG. 2 is a front view of an image pickup element unit according to each embodiment. [Figure 10] FIG. 2 is a cross-sectional view of an image pickup element unit according to each embodiment. [Figure 11] FIG. 10 is an enlarged cross-sectional view of a movable unit of an image stabilization unit according to a second embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

[0011] Example 1 First, with reference to Figs. 1A and 1B, the external configuration of an imaging device 10 according to a first embodiment of the present invention will be described. Figs. 1A and 1B are perspective views of the imaging device 10. With regard to the orientation of the imaging device 10, the subject side is defined as the front side based on the direction as seen from the photographer (user), and the up-down direction, front-rear direction, and left-right direction are defined as seen from the user directly facing the back of the imaging device 10. Therefore, Fig. 1A shows a perspective view of the imaging device 10 as seen from the front side (subject side), and Fig. 1B shows a perspective view of the imaging device 10 as seen from the rear side (rear side).

[0012] This embodiment will be described using an example of an interchangeable lens camera system in which a lens device (not shown) can be attached to the image capture device 10 as a camera body, but the present invention is not limited to this. This embodiment can also be applied to an image capture device in which the camera body and lens unit are integrated.

[0013] The imaging device 10 has an exterior part 10c. The exterior part 10c is composed of multiple members. The imaging device 10 has a mount 10a on the front side. An interchangeable lens (lens device) (not shown) can be attached to the mount 10a. An axis (dashed line) passing through the center of the mount 10a substantially coincides with the optical axis P of the imaging optical system of the interchangeable lens, i.e., the imaging optical axis.

[0014] Next, the internal structure of the imaging device 10 will be described with reference to Fig. 2. Fig. 2 is an exploded perspective view of the main parts of the imaging device 10 as seen from the rear side (user side). Note that Fig. 2 does not show the exterior part 10c and the like. Furthermore, Fig. 2 and subsequent figures show parts necessary for understanding this embodiment, and omit unnecessary parts.

[0015] The imaging device 10 has a control board 100, an image stabilization unit 200, a shutter unit 300, a base member 400, and a first heat sink 700. The image stabilization unit 200 constitutes an image stabilization device that performs image stabilization of an image. The control unit of the image stabilization device includes a control board 100 for controlling the driving of the image sensor unit 230 .

[0016] The image stabilization unit 200 includes a movable optical member. The image stabilization unit 200 is fixed to a base member 400 together with the shutter unit 300. The image stabilization unit 200 is held by the base member 400 to which the shutter unit 300 is attached and fixed. For example, the image stabilization unit 200 is supported by three screws 600a, 600b, and 600c and three coil springs 500a, 500b, and 500c (not shown) so as to be displaceable relative to the base member 400 in the direction along the optical axis P (see FIG. 1(A)).

[0017] The worker adjusts the amount of tightening of the screws 600a, 600b, and 600c. This makes it possible to adjust the tilt of the imaging surface of the image sensor unit 230 (see FIG. 3) relative to the base member 400. Once the adjustment of the tilt of the imaging surface is complete, the screws 600a, 600b, and 600c are adhesively fixed to the fixing unit 200b of the image stabilization unit 200 to prevent them from loosening. The fixing unit 200b is a support member, and will be described later with reference to FIG. 3.

[0018] The control board 100 is fixed to a base member 400. A control IC 101 used to control imaging signals, and connectors 102 and 103 are mounted on the control board 100. In addition, various electronic components (not shown) such as chip resistors, ceramic capacitors, inductors, and transistors are mounted on the control board 100.

[0019] First heat sink 700 is disposed between control board 100 and image stabilization unit 200, and connects control board 100 and image stabilization unit 200 via multiple components (not shown). First heat sink 700 is made of a material with high thermal conductivity, such as a metal material such as copper or aluminum.

[0020] A first connecting member 270a and a second connecting member 270b extend as flexible wiring members from the image stabilization unit 200. The first connecting member 270a is connected to a connector 102, and the second connecting member 270b is connected to a connector 103. This electrically connects the control board 100 and the image stabilization unit 200. A connector 104 arranged on the control board 100 is connected to a flexible board 301 extending from the shutter unit 300, electrically connecting the control board 100 and the shutter unit 300.

[0021] Next, the image stabilization unit 200 will be described with reference to Figures 3 and 4. Figure 3 is an exploded perspective view of the image stabilization unit 200 as seen from the rear side. Figure 4 is an exploded perspective view of the image stabilization unit 200 as seen from the front side.

[0022] The image stabilization unit 200 has a movable unit 200a and a fixed unit 200b. The movable unit 200a is a movable member including an image sensor unit 230. The fixed unit 200b is a support member fixed to the base member 400. The movable unit 200a is supported by the fixed unit 200b in a state in which it is displaceable in any direction within a plane perpendicular to the optical axis P relative to the fixed unit 200b. Optical image stabilization operation is achieved by moving the movable unit 200a in a direction perpendicular to the optical axis P. The movable unit 200a is mainly configured with a sensor holder 220 and an image sensor unit 230. The sensor holder 220 is a holding member that holds the image sensor unit 230.

[0023] The first connecting member 270a and the second connecting member 270b electrically connect the imaging element unit 230 and the control board 100 shown in Fig. 2. The first connecting member 270a and the second connecting member 270b are each a flexible printed circuit board.

[0024] The image sensor unit 230 includes an image sensor 232 (see FIG. 6), such as a CMOS (complementary metal-oxide semiconductor) image sensor or a CCD (charge-coupled device) image sensor, and converts an optical image of a subject into an electrical signal. The image sensor unit 230 is adhesively fixed to the sensor holder 220. An optical low-pass filter 221 is disposed in front of the image sensor unit 230 in the sensor holder 220. The optical low-pass filter 221 is an optical element that blocks infrared light from entering and prevents color moiré and the like.

[0025] A second heat dissipation plate 280 is fixed to the sensor holder 220 with screws or the like at a position overlapping with the image sensor unit 230 in the optical axis direction. The second heat dissipation plate 280 is made of a material with high thermal conductivity, such as a metal material such as copper or aluminum. A first heat dissipation member 281 is adhesively fixed to the second heat dissipation plate 280. A first heat dissipation plate 700 is adhered or connected to the tip of the first heat dissipation member 281. The first heat dissipation member 281 is made of a flexible graphite sheet or the like. The first heat dissipation member 281 adhered to the second heat dissipation plate 280 has a long, plate-like shape, and the first heat dissipation member 281 has a shape with a partial bend so that the distance from the first heat dissipation plate 700 can be made as short as possible.

[0026] 3, the first connection member 270a is joined to the imaging element unit 230 at a joint 271a by direct soldering or by an ACF (anisotropic conductive film), and is electrically connected to the imaging element board 231. The first connection member 270a is fixed to the movable unit 200a at the joint 271a.

[0027] Meanwhile, a connector 232b is mounted on the imaging element board 231. As shown in FIG. 4, a connector 271b is mounted on the second connecting member 270b. As shown in FIG. 3, an operator passes the first connecting member 270a through the opening 252 from the front side of the imaging element board 231 to bond the sensor holder 220 and the imaging element unit 230. Thereafter, the second connecting member 270b is inserted into the imaging element board 231 by passing it through the opening 252 from the rear side, and the connectors 232b and 271b are mated. The connectors 232b and 271b are in a plug connector and receptacle connector relationship, with matching mating shapes. The connector 271b has two parallel rows of signal terminals. The second connecting member 270b has a long, plate-like shape, and the connector 271b is mounted on one end thereof.

[0028] The wiring direction of the first connecting member 270a and the second connecting member 270b is the longitudinal direction. Connectors 273, 274 are mounted on the other end of each longitudinal member. The connectors 273, 274 have a plug connector and receptacle connector relationship that are compatible with the connectors 102, 103 (see FIG. 2) mounted on the control board 100. Similarly to the connector 271b, the connectors 273, 274 have a structure that has two parallel rows of signal terminals. The second connecting member 270b is electrically connected to the imaging element board 231 by connecting the connector 271b and the connector 232b. This also fixes the connector 271b to the movable unit 200a.

[0029] Next, with reference to Figs. 2 to 4, the wiring pattern deployed inside the imaging device 10 will be described. The first connection member 270a has wiring (high-speed transmission wiring) formed therein that is electrically connected from the joint 271a (see Fig. 3) to the connector 273 (see Fig. 4). This high-speed transmission wiring forms a transmission path consisting of a pair of two signal lines, employing a transmission method such as LVDS (Low Voltage Differential Signal). The imaging device 10 uses this high-speed transmission wiring to transmit imaging signals between the imaging element unit 230 and the control board 100, and is compatible with high-speed transmission of imaging signals. In addition to the high-speed transmission wiring, the first connection member 270a also has ground wiring and wiring necessary for the imaging element unit 230.

[0030] 4 is formed on the second connection member 270b, and is electrically connected from the connector 271b to the connector 274. In addition to the power supply wiring, the second connection member 270b also has a ground wiring and wiring necessary for the imaging element unit 230.

[0031] In this embodiment, the first connection member 270a and the second connection member 270b are each single-sided wiring. The wiring is provided on the surfaces of the first connection member 270a and the second connection member 270b on which the connectors 273 and 274 are mounted. The high-speed transmission wiring extends from the signal terminal row of the joint portion 271a and is electrically connected to the two parallel signal terminal rows of the connector 273.

[0032] The control IC 101 shown in FIG. 2 is a control circuit unit arranged on a connector 102 mounted on a control board 100 and having a rectangular package outer shape. A plurality of signal terminals of the control IC 101 are soldered to the control board 100 and electrically connected to the control board 100. The high-speed transmission wiring on the control board 100 is a differential transmission wiring that electrically connects the connector 102 to some of the signal terminals of the control IC 101. The high-speed transmission wiring is electrically connected to the high-speed transmission wiring inside the first connection member 270a via the connector 273 and the connector 102. The high-speed transmission wiring forms a differential transmission path similar to the high-speed transmission wiring inside the first connection member 270a. Note that various signal wiring and ground wiring are deployed on the control board 100 in addition to the high-speed transmission wiring, but these are not shown in FIG. 2.

[0033] Generally, when transmitting multiple electrical signals that require synchronization over a high-speed transmission line, the line is designed to minimize the difference in delay time due to the wiring. It is preferable to use equal-length wiring so that the lengths of the wires through which multiple electrical signals are transmitted are equal. Furthermore, the signal lines are designed to be as short as possible to minimize the effects of noise, etc.

[0034] Next, the second heat dissipation member 282 will be described with reference to Fig. 5 to Fig. 7. Fig. 5 is a perspective view of the movable unit 200a of the image stabilization unit 200. Fig. 6 is a cross-sectional view of the movable unit 200a. Fig. 7 is an enlarged cross-sectional view of the movable unit 200a.

[0035] As shown in FIGS. 6 and 7, the second heat dissipation member 282 is disposed between the second heat dissipation plate 280 and the image pickup element unit 230. The second heat dissipation member 282 has a heat dissipation sheet 282a and an elastic member 282b. The heat dissipation sheet 282a has a long, plate-like shape and is made of a flexible graphite sheet or the like. An elastic member 282b, whose thickness direction is in the optical axis direction, is disposed inside the heat dissipation sheet 282a. The heat dissipation sheet 282a is formed by adhering both ends of a single sheet and surrounding the elastic member 282b.

[0036] The elastic member 282b is made of an easily deformable material such as urethane or rubber. The heat dissipation sheet 282a and the elastic member 282b are bonded and fixed at at least one point on a plane perpendicular to the optical axis direction. In this embodiment, the heat dissipation sheet 282a and the elastic member 282b are bonded and fixed at an adhesive surface 283b.

[0037] The second heat dissipation member 282 is fixed to the second heat dissipation plate 280 with double-sided tape or the like. The heat dissipation sheet 282a of the second heat dissipation member 282 is not limited to a single sheet, and may be made up of multiple sheets. The heat dissipation sheet 282a may be configured such that both ends of the single sheet are adhered to the imaging element substrate 231.

[0038] As described above, in this embodiment, the second heat dissipation plate 280 is attached from the rear to the sensor holder 220 to which the image sensor unit 230 is adhered. During assembly, since the heat dissipation sheet 282a is flexible, it is difficult to secure the second heat dissipation plate 280 in close contact with it. For this reason, an elastic member 282b is disposed inside the heat dissipation sheet 282a, and the elastic member 282b is deformed in the optical axis direction by the pressing force during assembly, making it easier to secure the second heat dissipation member 282 and the second heat dissipation plate 280 in close contact with each other.

[0039] The elastic member 282b may be a heat dissipating rubber containing a filler, etc. If the elastic member 282b is a heat-transferable member (a thermally conductive elastic member) such as heat dissipating rubber, the second heat dissipating member 282 does not need to have the heat dissipating sheet 282a, and the second heat dissipating member 282 may have only the elastic member 282b.

[0040] Next, the imaging element unit 230 will be described with reference to Fig. 8 to Fig. 10. Fig. 8 is a perspective view of the imaging element unit 230. Fig. 9 is a front view (view from the front side) of the imaging element unit 230. Fig. 10 is a cross-sectional view of the imaging element unit 230.

[0041] As shown in FIG. 8, the imaging element unit 230 includes an imaging element substrate 231 made of glass epoxy or the like, and has a structure in which an imaging element 232 is directly mounted on the imaging element substrate 231, that is, a so-called packageless structure.

[0042] The imaging element 232 outputs an image signal in response to incident light. The imaging element substrate 231 has a first surface 231a and a second surface 231b opposite to the first surface 231a. The imaging element 232 is bonded to the imaging element substrate 231 on the first surface 231a using an adhesive. Electrical components 235, which will be described later, are arranged on the second surface 231b of the imaging element substrate 231, and connecting patterns are formed from a metal such as copper.

[0043] The imaging element substrate 231 is preferably a rigid substrate for mounting the imaging element 232. In this embodiment, the imaging element substrate 231 is made of glass epoxy or the like, but is not limited to this and may be a flexible substrate made of a plastic material, for example. The imaging element substrate 231 may also be an LTCC (low temperature co-fired ceramics) substrate made of ceramics and copper wiring. In this way, the imaging element substrate 231 may be a substrate on which a pattern is formed with metal wiring such as copper on a specific material and on which components are mounted.

[0044] The electrical components 235 include, but are not limited to, passive components such as capacitors, resistors, and coils required to operate the imaging element 232, as well as a linear regulator that generates a voltage for operating the imaging element 232 and an oscillator that provides a clock. The electrical components 235 may also be components for purposes other than operating the imaging element 232, such as a thermometer that monitors the state of the imaging element 232, and a ROM (Read Only Memory) that stores individual information about the imaging element 232. The electrical components 235 also include a connector 232b that collectively connects signals for exchanging power and signals between the imaging element board 231 and an external board.

[0045] The wire bonding pads 236 are arranged on the first surface 231a, which is the same surface as the imaging element 232 on the imaging element substrate 231, in order to electrically connect the imaging element 232 and the imaging element substrate 231. Specifically, the wire bonding pads 236 are electrodes formed on a surface layer of the imaging element substrate 231 by gold plating or other processing.

[0046] The connection conductor 237 is a metal wire (bonding wire) for electrically connecting the imaging element 232 and the imaging element substrate 231. The connection conductor 237 is a gold wire, an aluminum wire, a copper wire, or the like, and is generally connected by ultrasonic thermocompression bonding using a known wire bonder.

[0047] The cover glass 238 is a sealing member that seals the image sensor 232. An anti-reflection coating or the like is formed on the cover glass 238. The frame 239 is a resin molded part that is provided so as to surround the outer periphery of the wire bonding pad 236 and is bonded to the image sensor substrate 231. The cover glass 238 is also bonded to the frame 239.

[0048] The high-speed transmission wiring is drawn out from the left and right sides or the top and bottom sides of the imaging element 232. It is possible to make the wiring equal in length by drawing out the imaging signal from the center of the imaging element substrate 231. For this reason, it is preferable that the joint 271a of the first connecting member 270a be disposed approximately in the center of the imaging element substrate 231.

[0049] 8, a joint 271a and a non-mounting area 234 for electrical components 235 are provided in the center of the imaging element substrate 231, and the second heat dissipation member 282 is disposed in a range that is a projection of the imaging element 232 in the optical axis direction in a plan view. In other words, the second heat dissipation member 282 is disposed so as to overlap with the imaging element 232 when viewed from the optical axis direction.

[0050] The second heat dissipation member 282 is arranged to overlap the joint 271a of the imaging element substrate 231 in the optical axis direction. That is, the second heat dissipation member 282 is configured to overlap both the joint 271a and the first connecting member 270a in the optical axis direction. By arranging the second heat dissipation member 282 to overlap the joint 271a in the optical axis direction, the entire non-mounting region 234 of the electrical component 235 can be used as a heat dissipation portion, making it possible to ensure a large heat dissipation area. Note that in this embodiment, the second heat dissipation member 282 may be arranged to avoid the joint 271a. Also, in this embodiment, it is sufficient that at least a portion of the second heat dissipation member 282 is in contact with the imaging element substrate 231.

[0051] <Example 2> Next, the configuration of a movable unit 200a of an image stabilization unit 200 according to a second embodiment of the present invention will be described with reference to Fig. 11. Fig. 11 is an enlarged cross-sectional view of a movable unit 200a according to this embodiment, and corresponds to Fig. 7 described in the first embodiment. Note that in this embodiment, the same reference numerals are used for components common to the first embodiment, and descriptions thereof will be omitted.

[0052] The configuration of the movable unit 200a of this embodiment differs from that of Example 1 in that it has a first sheet member 284 and a second sheet member 285. The first sheet member 284 is disposed between the second heat dissipation member 282 and the second heat dissipation plate 280. The second sheet member 285 is disposed between the second heat dissipation member 282 and the imaging element board 231 of the imaging element unit 230.

[0053] The first sheet member 284 and the second sheet member 285 function, for example, as heat dissipation members for further enhancing the heat dissipation effect, or as protective members for protecting the image pickup element board 231. The first sheet member 284 may be a metal plate made of aluminum, copper, or the like. Furthermore, in this embodiment, a configuration may be employed in which another member is sandwiched between the second heat dissipation member 282 and the image pickup element unit 230, or between the second heat dissipation member 282 and the second heat dissipation plate 280.

[0054] According to this embodiment, it is possible to efficiently transfer heat from the center of the image sensor 232, which is a heat generating portion of the image sensor unit 230, to the second heat sink 280. In each embodiment, heat is diffused from the second heat sink 280 to the first heat sink 700 via the first heat sink 281, but various methods may be used to diffuse heat to other components within the image sensor 10.

[0055] The disclosure of each embodiment includes the following configuration. (Configuration 1) an imaging element unit having an imaging element, electrical components, and an imaging element substrate on which the imaging element and the electrical components are arranged; a heat sink that dissipates heat from the imaging element unit; a heat dissipation member that transfers the heat from the imaging element unit to the heat dissipation plate, the imaging element is disposed on a first surface of the imaging element substrate; the electrical components are disposed on a second surface of the imaging element substrate opposite to the first surface, the heat dissipation member is disposed between the imaging element substrate and the heat dissipation plate, An imaging device, characterized in that at least a portion of the heat dissipation member overlaps with the imaging element when viewed from the optical axis direction. (Configuration 2) the electrical components are arranged on the second surface of the imaging element substrate in a second region different from a first region including a center of the imaging element as viewed in the optical axis direction; 2. The imaging device according to configuration 1, wherein at least a portion of the heat dissipation member is disposed between the imaging element substrate and the heat dissipation plate in the first region. (Configuration 3) 3. The imaging device according to configuration 2, wherein the second area is an area surrounding the first area when viewed from the optical axis direction. (Configuration 4) 4. The imaging device according to any one of configurations 1 to 3, wherein the imaging element unit further includes a frame provided so as to surround the outer periphery of the imaging element substrate. (Configuration 5) a holding member for holding the image pickup element unit; 5. The imaging device according to any one of configurations 1 to 4, wherein the heat sink is fixed to the holding member. (Configuration 6) 6. The imaging device according to any one of configurations 1 to 5, wherein the heat dissipation member includes an elastic member and a heat dissipation sheet surrounding the elastic member. (Configuration 7) The elastic member has a long plate shape, 7. The imaging device according to configuration 6, wherein the heat dissipation sheet is flexible. (Configuration 8) 8. The imaging device according to claim 6, wherein the elastic member is made of urethane or rubber. (Configuration 9) 6. The imaging device according to any one of configurations 1 to 5, wherein the heat dissipation member is a thermally conductive elastic member. (Configuration 10) a control board for controlling the driving of the imaging element unit; a first connection member that electrically connects the imaging element unit and the control board; the first connecting member is connected to the imaging element substrate at a joint; 10. The imaging device according to any one of configurations 1 to 9, wherein at least a portion of the heat dissipation member is disposed between the joint and the heat dissipation plate. (Configuration 11) Wiring is formed on the imaging element substrate, 11. The imaging device according to configuration 10, wherein a signal is transmitted from the first connection member to the wiring via the joint portion. (Configuration 12) a first sheet member disposed between the heat dissipation member and the heat dissipation plate; 12. The imaging device according to any one of configurations 1 to 11, further comprising a second sheet member disposed between the heat dissipation member and the imaging element substrate. (Configuration 13) A base member; a support member fixed to the base member; a movable member supported by the support member so as to be displaceable relative to the support member within a plane perpendicular to the optical axis, 13. The imaging device according to any one of configurations 1 to 12, wherein the movable member includes at least the imaging element unit, the heat dissipation member, and the heat dissipation plate.

[0056] Although the preferred embodiments of the present invention have been described above, the present invention is not limited to these embodiments and various modifications and changes can be made within the scope of the present invention. Parts of the above-described embodiments may be combined as appropriate. [Explanation of symbols]

[0057] 10. Imaging device 230 Image sensor unit 231 Image sensor board 231a 1st page 231b 2nd page 232 Image sensor 235 Electrical Components 280 Heat sink 282 Heat dissipation materials

Claims

1. an imaging element unit having an imaging element, electrical components, and an imaging element substrate on which the imaging element and the electrical components are arranged; a heat sink that dissipates heat from the imaging element unit; a heat dissipation member that transfers the heat from the imaging element unit to the heat dissipation plate, the imaging element is disposed on a first surface of the imaging element substrate; the electrical components are disposed on a second surface of the imaging element substrate opposite to the first surface, the heat dissipation member is disposed between the imaging element substrate and the heat dissipation plate, An imaging device, characterized in that at least a portion of the heat dissipation member overlaps with the imaging element when viewed from the optical axis direction.

2. the electrical components are arranged on the second surface of the imaging element substrate in a second region different from a first region including a center of the imaging element as viewed in the optical axis direction; The imaging device according to claim 1 , wherein at least a portion of the heat dissipation member is disposed between the imaging element substrate and the heat dissipation plate in the first region.

3. 3. The imaging device according to claim 2, wherein the second area is an area surrounding the first area when viewed in the optical axis direction.

4. 2. The imaging device according to claim 1, wherein the imaging element unit further comprises a frame provided so as to surround the outer periphery of the imaging element substrate.

5. a holding member for holding the image pickup element unit; 2. The imaging device according to claim 1, wherein the heat sink is fixed to the holding member.

6. 6. The imaging device according to claim 1, wherein the heat dissipation member includes an elastic member and a heat dissipation sheet surrounding the elastic member.

7. The elastic member has a long plate shape, 7. The imaging device according to claim 6, wherein the heat dissipation sheet is flexible.

8. 7. The imaging device according to claim 6, wherein the elastic member is made of urethane or rubber.

9. 6. The imaging device according to claim 1, wherein the heat dissipation member is a thermally conductive elastic member.

10. a control board for controlling the driving of the imaging element unit; a first connection member that electrically connects the imaging element unit and the control board, the first connecting member is connected to the imaging element substrate at a joint portion; 6. The imaging device according to claim 1, wherein at least a portion of the heat dissipation member is disposed between the joint and the heat dissipation plate.

11. Wiring is formed on the imaging element substrate, The imaging device according to claim 10 , wherein a signal is transmitted from the first connection member to the wiring via the joint portion.

12. a first sheet member disposed between the heat dissipation member and the heat dissipation plate; 6. The imaging device according to claim 1, further comprising a second sheet member disposed between the heat dissipation member and the imaging element substrate.

13. A base member; a support member fixed to the base member; a movable member supported by the support member so as to be displaceable relative to the support member within a plane perpendicular to the optical axis, 6. The imaging device according to claim 1, wherein the movable member includes at least the imaging element unit, the heat dissipation member, and the heat dissipation plate.

Images