Lighting module and lighting device

Abstract

To provide a lighting module and a lighting device in which at least one of light emitting devices of a light source has a size different from that of another light emitting device.SOLUTION: A lighting device disclosed in an embodiment of the invention includes: a substrate; a reflective layer disposed on the substrate; a light source passing through the reflective layer and disposed on the substrate; a resin layer disposed on the reflective layer; and an optical pattern disposed on the resin layer. The light source includes a first light emitting device, and a second light emitting device spaced apart from the first light emitting device. The optical pattern includes a first optical pattern disposed on an upper portion of the first light emitting device, and a second optical pattern disposed on an upper portion of the second light emitting device. The first optical pattern and the second optical pattern may have different areas.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] An embodiment of the invention relates to a lighting module having a plurality of light sources and a lighting device having the same. An embodiment of the invention is a lighting device in which at least one of the plurality of LEDs has a different size. The present invention relates to a light module and a lighting device having the same. [Background technology]

[0002] The application of lighting is not only vehicle lighting but also backlighting for displays and signs. Light-emitting elements, such as light-emitting diodes (LEDs), are used to replace existing light sources such as fluorescent lamps and incandescent lamps. Compared to light sources, it consumes less power, has a semi-permanent lifespan, is fast in response, is safe, and is environmentally friendly. The light emitting diodes are used in various applications such as various display devices, indoor and outdoor lights, etc. The LEDs are applied to lighting devices. Lamps that use light-emitting diodes as vehicle light sources have been proposed. Compared to incandescent lamps, light-emitting diodes have the advantage of consuming less power. However, since the angle of light emitted from the light-emitting diode is small, When used as a vehicle lamp, the luminous area of ​​the lamp using the light-emitting diode is increased. The LEDs are small in size, making it easy to design the lamp. It allows for greater freedom of design and is economical due to its semi-permanent lifespan. Summary of the Invention [Problem to be solved by the invention]

[0003] An embodiment of the invention comprises a light source and at least one light emitting element of said light source sealed in a resin layer. The lighting module and the lighting device each have a size different from that of the other light-emitting elements. An embodiment of the invention may provide a light source sealed within a resin layer and a light emitting element for said light source. At least one of the light elements has a size smaller than that of the other light elements. An embodiment of the invention provides a module and a lighting device encapsulated in a resin layer. The optical pattern includes a light source and an optical element of the light source, the optical pattern being disposed on the light source and the optical element. At least one of the patterns is an illumination module having an area different from the areas of the other optical patterns. Embodiments of the invention can provide modules and lighting devices. At least one of the optical patterns arranged has an area smaller than the area of ​​the other optical patterns. It is possible to provide a lighting module and a lighting device having a high efficiency. At least two light emitting elements with different lengths in the direction of the LED chips are arranged in different numbers. A lighting module and a lighting device can be provided. [Means for solving the problem]

[0004] The lighting device according to an embodiment of the invention comprises a substrate, a reflective layer disposed on the substrate, and a reflective layer disposed on the reflective layer. a light source that penetrates the reflective layer and is disposed on the substrate; and a resin layer that is disposed on the reflective layer. an optical pattern disposed on the resin layer, wherein the light source includes a first light-emitting element; The optical pattern includes a second light emitting element spaced apart from the first light emitting element. a first optical pattern disposed above the second light emitting element; and a second optical pattern disposed above the second light emitting element. The first optical pattern and the second optical pattern may have different areas. good.

[0005] According to an embodiment of the invention, the first optical pattern and the second optical pattern have different areas. A plurality of unit pattern layers each including the first optical pattern are arranged to overlap each other. The area of ​​the unit pattern layer disposed on top is the area of ​​the unit pattern layer disposed on top of the second optical pattern. The area of ​​the plurality of unit pattern layers of the first optical pattern may be larger than the area of ​​the unit pattern layers. The area of ​​the unit pattern layer placed at the top is the area of ​​the unit pattern layer placed at the bottom. According to an embodiment of the invention, the reflective layer may be formed such that the first light emitting element is a first hole in which the second light emitting element is disposed, and a second hole in which the second light emitting element is disposed, The first hole may be larger than the second hole. According to an embodiment of the invention, the first optical pattern may have a length greater than the length of the major axis of the hole. The maximum length is in the range of 2.4 to 2.6 times the length of the major axis of the first light emitting element. The maximum length of the second optical pattern is 3 times the length of the major axis of the second light emitting element. The range of the magnification may be 0.6 to 3.8. The lighting device according to the embodiment of the invention comprises a substrate, a reflective layer disposed on the substrate; and a light source disposed on the substrate, the light source passing through the reflective layer. a source, a resin layer disposed on the reflective layer, and an optical pattern disposed on the resin layer. and the light source includes a first light emitting element and a second light emitting element spaced apart from the first light emitting element. wherein the first light emitting element and the second light emitting element each include a different number of LED chips; The length of the major axis of the first light emitting element and the length of the major axis of the second light emitting element may be different.

[0006] According to an embodiment of the invention, the first light emitting element comprises a first lead frame and a first lead. The lead frame is sandwiched between a second lead frame and a third lead frame, both of which have the same area. The second light emitting element is connected to a fourth lead frame and has an area different from that of the fourth lead frame. According to an embodiment of the invention, the first light emitting element may include a fifth lead frame. a body to which the first to third lead frames are joined at the bottom of the cavity; a plurality of LED chips on a first lead frame disposed within the cavity, the cavity comprising: a first side surface portion disposed on a front surface of the main body, the first side surface portion facing the substrate; Each of the first to third lead frames has a bonded portion bent to the first side surface portion of the main body. According to an embodiment of the invention, the second light emitting element may include a second cavity. a second body having fourth and fifth lead frames disposed at the bottom of the cavity; At least one LED chip disposed on a fourth lead frame disposed at the bottom; a bonding member for bonding the fourth lead frame and the LED chip; and a bonding member between the bonding member and the The fourth lead frame may include a first wire having both ends connected thereto. According to an embodiment, a second lead frame is provided to connect the fifth lead frame and the LED chip of the second light emitting element. the second wire has multiple contacts on the top surface of the fifth lead frame. The sub-wires may include:

[0007] The lighting device according to an embodiment of the invention comprises a substrate, a reflective layer disposed on the substrate, and a reflective layer disposed on the reflective layer. a light source that penetrates the reflective layer and is disposed on the substrate; and a resin layer that is disposed on the reflective layer. an optical pattern disposed on the resin layer, and the light source includes M first light-emitting elements and N second light emitting elements spaced apart from the M first light emitting elements, wherein M is greater than N. is a natural number greater than or equal to the length of the major axis of the first light emitting element, and the length of the major axis of the second light emitting element is greater than or equal to the length of the major axis of the first light emitting element. and the second light emitting element has a large overlap in the long axis direction thereof passing over the center of the second light emitting element. The maximum width of the resin layer to be clamped is 2 to 2.2 times the length of the major axis of the first light emitting element. It can have a range.

[0008] According to an embodiment of the invention, the resin layer has a first minimum width, and the first light emitting element is arranged in a plurality of positions. a second region having a maximum second width and in which at least one second light emitting element is arranged; The second light emitting element includes two regions, the second width being smaller than the first width, and the length in the major axis direction of the second light emitting element is the second region is greater than the length of the second light emitting element in the major axis direction and is equal to or less than 2.2 times the length of the second light emitting element in the major axis direction; has the second width and extends from the second light emitting element to the second light emitting element in the light emission direction of the second light emitting element. According to an embodiment of the invention, the second light emitting element is elongated by a length of at least five times the width of the minor axis of the light emitting element. The element is located at a position of the first and second light emitting elements that is closest to the side surface of the resin layer. According to an embodiment of the invention, the optical pattern is arranged on each of the first light emitting elements. a first optical pattern vertically overlapping a portion of the second light emitting element; and a second optical pattern that overlaps the first optical pattern in the vertical direction, the second optical pattern comprising: The first and second optical patterns are disposed closest to the side surface of the resin layer. [Effects of the Invention]

[0009] According to an embodiment of the invention, for edge regions with a relatively narrow width in the lighting module, According to an embodiment of the invention, the lighting module can provide a relatively uniform light distribution. The light emitting element having a relatively small length is disposed in the edge region having a relatively narrow width, and the width is different. It is possible to provide uniform surface illumination over a wide area.

[0010] According to an embodiment of the invention, the entire area of ​​the resin layer is covered by using light emitting elements of the light source having different lengths. According to an embodiment of the invention, the different sizes of the light sources can be uniformly illuminated. Optical patterns of different areas are arranged on the light emitting element of the light source, and the entire area of ​​the resin layer is According to an embodiment of the invention, lighting having various shapes can be provided. The reliability of the light module and the lighting device can be improved. [Brief explanation of the drawings]

[0011] [Figure 1] FIG. 1 is an example of a plan view of a lighting device according to an embodiment of the invention. [Figure 2] FIG. 2 is an example of a plan view of a lighting device according to an embodiment of the invention. [Figure 3] FIG. 3 is a partially enlarged view of the lighting device of FIG. [Figure 4] 4A and 4B are an example of a plan view and a side cross-sectional view of the first optical pattern of FIG. [Figure 5] 5A and 5B are an example of a plan view and a side cross-sectional view of the second optical pattern of FIG. [Figure 6] FIG. 6 is a side cross-sectional view of the illumination device of FIG. 3 taken along line A1-A2. [Figure 7] FIG. 7 is a partially enlarged view of the lighting module in FIG. [Figure 8] FIG. 8 is an example of a front view of a first light emitting element of a lighting device according to an embodiment of the invention. [Figure 9] FIG. 9 is an example of a cross-sectional side view taken along line B1-B2 of the first light-emitting element of FIG. [Figure 10] FIG. 10 is an example of a bottom view of the first light emitting element of FIG. [Figure 11] FIG. 11 is an example of a front view of a second light emitting element of a lighting device according to an embodiment of the invention. [Figure 12]FIG. 12 is an example of a cross-sectional view of the second light-emitting element of FIG. 11 taken along line CC. [Figure 13] FIG. 13 is an example of a bottom view of the second light emitting element of FIG. [Figure 14] FIG. 14 is a partial enlarged view of the second light-emitting element of FIG. [Figure 15] FIG. 15 is a diagram comparing the first and second light emitting devices on the substrate in an embodiment of the present invention. [Figure 16] FIG. 16 is a diagram showing an example of a plan view of a vehicle having a lighting device of the invention. [Figure 17] FIG. 17 shows an example of a taillight of a vehicle to which the lighting device of FIG. 16 is applied. DETAILED DESCRIPTION OF THE INVENTION

[0012] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0013] The technical concept of the present invention is not limited to the embodiments described, and may be modified in various ways. The present invention may be embodied in various forms, and variations between embodiments are possible within the scope of the technical concept of the present invention. One or more of the components may be selectively combined or substituted for use. Terms (including technical and scientific terms) used in the present examples are clearly and specifically described. Unless otherwise specified, the meaning of the present invention is the same as that which is commonly understood by a person having ordinary skill in the art. Commonly used terms, such as dictionary-defined terms, are interpreted in accordance with the technical text involved. The meaning can be interpreted by considering the context. The terms are used to describe the embodiments and are not intended to limit the invention. In this specification, the singular form can include the plural form unless otherwise specified, and the term "A" is used interchangeably with "A" or "B" in the following. If it says "and at least one (or more) of B and C," then it means A, B, and C. It is possible to include one or more of all possible combinations. In describing the components of the embodiments, terms such as first, second, A, B, (A), (B), etc. may be used. Such terms are used to distinguish the component from other components. The terms do not limit the nature or order of the components. In this case, an element may be described as being "coupled," "coupled," or "connected" to another element. In this case, the component may be directly connected or connected to other components, or each component may be connected or connected to This includes all cases where other components are "linked," "coupled," or "connected" between elements. In addition, when it is described as being formed or arranged "above or below" each component, it is also "At or below" does not only mean when two components are in direct contact, but also when they are in contact with one or more further components. This also includes cases where a component is formed or placed between two components. When expressed, it means not only the upward direction but also the downward direction based on one component. The lighting device according to the present invention can be used with various lamp devices that require lighting, e.g. For example, it can be applied to vehicle lamps, home lighting devices, or industrial lighting devices. When applied to vehicle lamps, headlamps, width lamps, turn signals, side mirror lamps, Grand lamps, tail lamps, backup lamps, brake lights, daytime running lights, vehicle interior lighting , door scuffs, rear combination lamps, backup lamps, etc. The lighting device of the present invention can be applied to indoor and outdoor advertising devices, display devices, and various train applications. Others are currently being developed and commercialized, or may be realized through future technological developments. It can be said that the present invention can be applied to all possible lighting-related fields, advertising-related fields, etc.

[0014] 1 and 2 are examples of plan views of a lighting device according to an embodiment of the invention, and FIG. 3 is a plan view of the lighting device shown in FIG. 4 is a plan view and a side cross-sectional view of the first optical pattern of FIG. 3; 5A and 5B are examples of the second optical pattern of FIG. 3 and its cross-sectional side view. 6 is a side cross-sectional view of the illumination device of FIG. 3 taken along line A1-A2, and FIG. 7 is a side cross-sectional view of the illumination module of FIG. 6 taken along line A1-A2. 8 to 10 are partial enlarged views of the first light emitting element of the lighting device according to the embodiment of the invention. 11 to 13 are examples of a front view, a side cross-sectional view, and a bottom view of the embodiment of the present invention. 14 is a front view, a side cross-sectional view, and a bottom view of the second light-emitting element of the lighting device. FIG. 15 is a partial enlarged view of the second light emitting element, and FIG. 15 is a partial enlarged view of the first and second light emitting elements of the substrate in the embodiment of the invention. This is a comparative drawing.

[0015] 1 to 7, a lighting device 400 according to an embodiment of the invention includes a plurality of light emitting elements 10. The light source may include light sources having light emitting elements 100 and 102. Each of the light emitting elements 100 may have a length different from that of the other light emitting elements. At least one of the light emitting elements 102 has a size or volume smaller than that of the other light emitting elements. At least one of the light emitting elements 100 and 102 may have a volume. The area of ​​the light emitting surface may be different from the area of ​​the light emitting surface of the other light emitting elements. At least one of the light emitting elements has an area of ​​the light emitting surface smaller than that of the other light emitting elements. good.

[0016] As shown in FIG. 1, the lighting device 400 has a diffusion layer 430 disposed on the top and a plurality of light-emitting layers 430 disposed in the first region R1. A number of first light emitting elements 100 are arranged, and at least one The second light emitting element 102 is arranged in the same direction as the first light emitting element 100. The second light emitting element 102 can emit light in different directions. The light emitting element 100 is disposed at a position closest to or at the closest distance from the outer surface S1 of the light emitting element 100. As shown in FIG. 3, the minimum distance G1 between the second light emitting element 102 and the outer surface S1 is The length D11 of the second light emitting element 102 is equal to or less than twice the length D11 of the second light emitting element 102, for example, in the range of 0.5 to 1.5 times the length D11 of the second light emitting element 102. This can be done.

[0017] As shown in FIGS. 2 and 3, the lighting device 400A has a diffusion layer 430 on the top or a resin layer on the bottom. A layer 420 (FIG. 5) is disposed, and a plurality of first light-emitting elements 100 are disposed in a first region R1 having a first width W1 or more. A plurality of second light emitting elements 102 are arranged in a second region R2 having a second thinner width W2. The second region R2 is wider than the second width W2 in the light-emitting side direction of the second light-emitting element 102. The lighting device 400A extends with a small width W3. One or more coupling grooves 4 are formed around the lighting device 400A. 03 is disposed inside the first light emitting element 100. 05 will be placed.

[0018] As shown in FIGS. 1 and 2, when viewed from the top of the lighting device 400, 400A, a first light-emitting element 100 disposed in a first region R1 having a length equal to or greater than a minimum first width W1; The second light-emitting element 102 may be disposed in a second region R2 having a length of a large second width W2. The first width W1 is the width of the substrate 401 or the upper surface of the substrate 401 in the first region R1. The second width W2 may be the width of the resin layer 420 disposed in the second region R2. It may be the width of the substrate 401 or the width of the resin layer 420 disposed on the substrate 401. The first width W1 is three times or more the length D1 of the first light emitting element 100 in the first region R1. The second width W2 may be a ratio of the length D1 of the first light emitting element 101 in the second region R2. The second region R2 may have a ratio of 2.2 times or less, for example, a ratio in the range of 2 times to 2.2 times. The overlapping portion 104 is formed in the longitudinal direction of the second light emitting element 102, which passes over the center of the second light emitting element 102. The second region R2 has a maximum width W2 on the resin layer 420. is 2.2 times or less, for example, in the range of 2 to 2.2 times, the length of the first light emitting element 100 in the major axis direction. The first and second regions R1 and R2 may be formed on the substrate 401 or / and the resin. The first and second light emitting elements may be arranged such that the thickness of the first and second light emitting elements is smaller than the thickness of the second light emitting element. The lengths D1 and D11 of 100 and 102 may be the lengths in the longitudinal direction.

[0019] The lighting device 400, 400A has a second region R2 in a lamp structure of various shapes. Even if the width of the edge portion is narrow, one or more second light emitting elements 102 can be arranged, so that the illumination can be The lighting device 400, 400A can provide a uniform distribution of surface light over the entire area. The length of the second region R2 in the direction in which light is emitted from the second light emitting element 102 is 2. The length may be five times or more longer than the minor axis width H01 (see FIG. 12) of the light emitting element 102. At least one second light emitting element 102 is arranged along the second region R2. Here, the first light emitting devices 100 are arranged in at least one row in the second direction Y on the substrate 401. or arranged in two or more rows, and the first light-emitting elements in the one or more rows 100 are arranged in the first direction X of the substrate 401 or in different directions. The first light emitting devices 100 may be arranged in an m×n matrix, where m and n are integers of 2 or more. It is also possible.

[0020] As shown in FIGS. 3 and 6, the lighting device 400 includes a plurality of light-emitting elements 100, 102. The lighting device 400 may include a light source and a resin layer 420 that covers the light source. It may include a substrate 401 that supports the light emitting devices 100, 102 and a resin layer 420. The lighting device 400 includes at least one diffusion layer 430 on the resin layer 420, an optical At least one of the patterns 425, 426 and / or the light-transmitting layer may be included. The lighting device 400 includes a reflective layer 410 disposed between the substrate 401 and the resin layer 420. The lighting device 400 according to the embodiment of the invention may include the light emitting elements 100, 10 The light emitted from the light emitting cells 2 can be emitted as a surface light. The light source may be defined as a light source module. 100 and at least one second light emitting element 102. The light source may include: M first light emitting elements 100 and N second light emitting elements spaced apart from the M first light emitting elements 100. The optical element 102 may include M and N, where M and N are natural numbers and may have a relationship of M>N. The second light emitting element 102 has a length D1 that is smaller than the length D1 of each of the first light emitting elements 100. The upper surface area of ​​the second light emitting element 102 may be equal to or larger than the upper surface area of ​​the first light emitting element 102. The area of ​​the light emitting surface 8 of the second light emitting element 102 may be smaller than the area of ​​the upper surface of each of the light emitting elements 100. The area of ​​A may be smaller than the area of ​​the light emitting surface 81 of each of the first light emitting elements 100. The luminous intensity of the light emitted from the second light emitting element 102 is equal to that of each of the first light emitting elements 100. The luminous intensity of the light emitted from the LED chip 3 ( 11) is the number of LED chips disposed in at least one of the first light emitting elements 100. The number of LED chips 71 and 72 may be different from that of the first light emitting element 100. For example, It may be less than 72.

[0021] Hereinafter, each component of the lighting device 400 will be described with reference to FIGS. 7 and 8. do.

[0022] <Substrate 401> 6 and 7, the substrate 401 is a printed circuit board (PCB). The substrate 410 may include, for example, a resin-based printed circuit board. (PCB), PCB with metal core, PCB made of flexible material, ceramic The substrate 4 may include at least one of a PCB made of a plastic material or an FR-4 substrate. When the light emitting element 100, 101 is arranged on a metal core PCB with a metal layer arranged on the bottom, The substrate 401 is electrically connected to the light emitting elements 100 and 102. The substrate 401 includes a wiring layer (not shown) on the top thereof. The light emitting elements 100 and 102 are electrically connected to the substrate 4. When a plurality of light emitting elements 100 and 102 are arranged on the substrate 01, the plurality of light emitting elements 100 and 102 are connected by the wiring layer. The light emitting device 100 may be connected in series, in parallel, or in a series-parallel configuration. 102 and serves as a base member or support member disposed below the resin layer 420. Here, the first and second light emitting elements 100 and 102 can be driven separately. The upper surface of the substrate 401 may have an XY plane. The upper surface of the substrate 401 may be a flat surface or a curved surface. The thickness may be the height in the vertical direction or Z direction. The Z direction may be a first direction and the Y direction may be a second direction. The first light emitting element 10 may be a light emitting element having a first direction perpendicular to the first and second directions X and Y. The 0's are arranged at a constant pitch in the direction in which light is emitted on the substrate 401, but are not limited thereto. The substrate 401 is formed in a linear or curved bar shape in the long direction. The substrate 401 may be made of a light-transmitting material that transmits light through its upper and lower surfaces. The transparent material may include PET (Polyethylene terephthalate), PS (Polyester The substrate 401 may include at least one of a polyimide (PI) and a polystyrene (PS). For example, it may include a reflective layer 410. The reflective layer 410 is disposed on the substrate 401. Whether it is an insulating layer that protects the circuit pattern with the pads placed on it or a layer of reflective material good.

[0023] <Light-emitting elements 100 and 102> Referring to FIGS. 1 to 5, the light emitting elements 100 and 102 are disposed on the substrate 401. The light emitting elements 100 and 102 are arranged on the light emitting surface 8. The light emitting elements 100 and 102 emit the light with the highest intensity through the light emitting elements 100 and 102. The light emitting surface 81, 8A may have an exit surface 81, 8A from which light is emitted. The exit surface 81, 8A may be, for example, For example, it may be arranged in the third direction Z or vertically relative to the horizontal upper surface of the substrate 401. The exit surfaces 81 and 8A may be vertical planes or may include concave or convex surfaces. As shown in FIG. 15, the first light emitting element 100 is, for example, a first light emitting element disposed on the substrate 401. and the second pads 453 and 454 are bonded to the bonding member 250, and the second light emitting element 102 may be bonded to the third and fourth pads 455, 456 by the bonding member 250. The first and second light emitting elements 100 and 102 are electrically connected to the substrate 401. The material 250 is a conductive material, and may be a solder material or a metal material. The optical elements 100 and 102 are at least one of blue, red, green, ultraviolet (UV), and infrared. The light emitting elements 100 and 102 can emit white, blue, red, green, infrared, The light emitting element 100 may include an LED chip for emitting light from at least one of the lines. , 102 is a side view of which the bottom part is electrically connected to the substrate 401. As another example, the light emitting element 1 may be of a type other than the above, but is not limited thereto. 00, 102 may be an LED chip or a top-view package. A part of the light emitted through the emission surfaces 81 and 8A of the elements 100 and 102 is incident on the substrate 401. The light travels in a direction parallel to the upper surface, is reflected by the reflective layer 410, or is reflected by the resin layer 4 20 upward.

[0024] As shown in FIGS. 8 and 9, the length D1 of the first light emitting element 100 in the second direction Y is For example, the length D1 of the first light emitting device 100 may be greater than the width H0. It may be twice or more, for example, between 3 and 4.2 times. Since the length in the second direction Y is long, the light exit area in the first direction X perpendicular to the second direction Y is becomes larger, allowing a wider area to be illuminated.

[0025] As shown in FIGS. 11 and 12, the length D11 of the second light emitting element 102 in the second direction Y is The length D11 of the second light emitting element 102 may be greater than the width H01 in the direction X. For example, the length D11 of the second light emitting element 102 may be The width H01 may be equal to or less than twice the width H01, for example, between 1.4 and 2 times. The element 102 has a width H01 greater than a certain value and a length D11 in the second direction Y. It can be provided with a length D1 less than 100 to illuminate an area having a narrow width.

[0026] As shown in FIGS. 8 and 11, the thicknesses T1 and T2 of the light emitting elements 100 and 102 are, for example, The first light emitting element may have a thickness of 3 mm or less, for example, in the range of 0.8 mm to 2 mm. The thickness T1 of the second light emitting element 100 may be in the range of 1.3 mm to 1.5 mm. The thickness T2 of the first light emitting device 100 is equal to or greater than the thickness T1 of the first light emitting device 100. The thickness of the first light emitting device 100 may be in the range of 1.4 mm to 1.55 mm. The difference between T1 and the thickness T2 of the second light emitting element 102 is the height in the vertical direction, and the difference is 0. The size of the second light emitting element 102 may be in the range of 5 mm to 0.9 mm. Since it is relatively small, it provides a thicker body 1 and stably connects to the lead frames 5 and 6. The length D1 of the first light emitting element 100 in the second direction Y is It can be three times or more the thickness T1 of the optical element 100, for example, in the range of three to five times. The length D11 of the second light emitting element 102 in the second direction Y is It may be three times or less, for example, in the range of two to three times.

[0027] <Reflection layer 410> 6 and 7, the reflective layer 410 is separately disposed on the substrate 401. The reflective layer 4 may be a layer placed on the substrate 401 or a layer that protects the upper part of the substrate 401. The reflective layer 410 is disposed between the substrate 401 and the resin layer 420. The reflective layer 4 may be provided in the form of a film made of a metallic or non-metallic material. The reflective layer 410 may be attached to the top surface of the substrate 401. The reflective layer 410 may have an area smaller than the area of ​​the top surface of the substrate 40. 1, and a resin layer 420 is formed in the spaced apart area from the edge of the substrate 401. At this time, in order to prevent the edge portion of the reflective layer 410 from peeling off, The reflective layer 410 may be formed on the bottom of the light emitting elements 100 and 102. The holes 417 and 417A in the reflective layer 410 may be formed on the substrate 10. In this case, the upper surface of the substrate 401 is exposed, and the lower portions of the light emitting elements 100 and 102 are bonded. The holes 417 and 417A are formed to have a size that is equal to or larger than the size of the light emitting element 10. It may be arranged to be equal to or larger than the size of 0, 102, but is not limited to this. The first hole 417 in which the first light emitting device 100 is disposed is not the second light emitting device. 102 may be larger than the second hole 417A, for example, the first hole 41 The area of ​​the hole 7 is 1.5 times or more, for example, 1.5 to 2.2 times, the area of ​​the second hole 417A. The length of the first hole 417 in the major axis direction may be in the range The length of the long axis of 417A is 2.4 times or more, for example, in the range of 2.4 to 2.6 times. Due to such a difference in length or area, the first and second holes 417 and 417A can be The light emitting elements 100 and 102 can be easily accommodated, and the problem of the bonding member 250 being exposed to the outside can be reduced. It is possible.

[0028] The reflective layer 410 is in contact with the upper surface of the substrate 401 or is in contact with the resin layer 420 and the substrate. The plates 401 may be bonded together, but are not limited to this. The reflective layer 410 can be removed if a highly reflective material is coated on the upper surface of the substrate 401. The reflective layer 410 may have a thickness smaller than that of the light emitting elements 100 and 102. The thickness of the reflective layer 410 may be in the range of 0.2 mm±0.02 mm. The light emitting element 1 can be illuminated through the holes 417 and 417A in the reflective layer 410. The lower portions of the light emitting elements 100 and 102 can be penetrated, and the upper portions of the light emitting elements 100 and 102 can protrude. The light emitting surfaces 81 and 8A of the light emitting elements 100 and 102 are formed on the reflective layer 410. The axial direction of the gyro is perpendicular to the upper surface of the gyro.

[0029] The reflective layer 410 may include a metallic material or a non-metallic material. The material may include metals such as aluminum, silver, and gold. The material may be a plastic material or a resin material. The resin material may be silicone or Even if reflective materials such as TiO2, Al2O3, or metal oxides such as SiO2 are added to the epoxy, The reflective layer 410 may be implemented as a single layer or multiple layers, and the layer structure may improve light reflection. The reflective layer 410 according to the embodiment of the invention reflects incident light. By doing so, the amount of light can be increased so that the light is emitted with a uniform distribution. In another example of a lighting device, the reflective layer 410 may be removed above the substrate 401. For example, a resin layer 420 is disposed on the substrate 401 without a reflective layer 410, and the substrate A resin layer 420 can be in contact with the top surface of the plate 401 .

[0030] <Resin layer 420> The resin layer 420 may be disposed on the substrate 401. The resin layer 420 The resin layer 420 may face or be bonded to the substrate 401. The resin layer 420 may be disposed on the entire upper surface or a part of the upper surface. The resin layer 420 may be made of a transparent material. The resin layer 420 can be made of: It may be made of a resin-based material, such as silicone or epoxy, It can contain UV curable resin material. Such resin material can be used in place of the light guide plate. , it is possible to conveniently adjust the refractive index and the thickness. The oligomer disclosed in is used as the main material, and IBOA, diluent monomer and GMA are mixed. It is possible to adjust the hardness, heat resistance, and transmittance, and it is also possible to suppress adhesion and oxidation. The resin layer 420 contains a photoinitiator and a light stabilizer to regulate curing and prevent discoloration. It is possible.

[0031] The resin layer 420 is provided as a layer for guiding light with resin, so in the case of glass, The resin layer 420 may be provided as a flexible plate having a smaller thickness than the resin layer 420. The point light source emitted from the light emitting elements 100 and 102 is radiated in the form of a line light source or a surface light. The resin layer 420 may include beads (not shown). The beads can diffuse and reflect incident light, increasing the amount of light. The beads may be disposed in the range of 0.01 to 0.3% of the weight of the resin layer 420. Beads include silicone, silica, glass bubble, and PMMA. (Polymethyl methacrylate), Urethane, Zn, Zr, Al2O3, Acrylic The particle diameter of the beads is in the range of approximately 1 μm to approximately 20 μm. The resin layer 420 may have, but is not limited to, the above. Since it is disposed on the light emitting elements 100 and 102, it can protect the light emitting elements 100 and 102. This can reduce the loss of light emitted from the light emitting elements 100 and 102. The light emitting devices 100 and 102 may be embedded below the resin layer 420 .

[0032] The resin layer 420 may contact the surface of the light emitting device 100, 102, The resin layer 420 can be in contact with the light-emitting surfaces 81 and 8A of the light-emitting elements 100 and 102. A part of the resin layer 420 is disposed in the holes 417 and 417A of the reflective layer 410. A part of the light passes through the holes 417 and 417A of the reflective layer 410 and reaches the upper surface of the substrate 401. This allows a part of the resin layer 420 to come into contact with the substrate 401. By doing so, the reflective layer 410 is fixed between the resin layer 420 and the substrate 401. It is possible.

[0033] Referring to FIG. 7, the thickness Z1 of the resin layer 420 is 1.8 mm or more, for example, 1.8 to 2. If the thickness Z1 of the resin layer 420 is greater than the above range, the thickness Z1 may be in the range of 0.5 mm. In this case, the luminous intensity decreases, and the module thickness increases, making it difficult to provide a flexible module. If the thickness Z1 of the resin layer 420 is smaller than the above range, it becomes difficult to obtain uniform light. It is difficult to provide a uniform surface light. The length of the plate 401 in the first direction X may be the same as the width of the resin layer 420 in the second direction Y. may be the same as the width Y1 of the substrate 401 in the second direction Y. Each side of the layer 420 may be flush with each side of the substrate 401. The adhesive layer 420 is provided in a size that covers the plurality of light emitting elements 100, 102, or is provided in a size that covers the plurality of light emitting elements 100, 102. The resin layer 420 may be large enough to cover each of the light emitting elements 100 and 102. The upper surface of the resin layer 420 may have a first adhesive strength. The upper surface of the resin layer 420 is adhered to the transparent layer 415 with a first adhesive force.

[0034] <Transparent layer 415> The light-transmitting layer 415 may be an adhesive material such as silicone or epoxy, or a diffusing material. The diffusion material may include polyester (PET), PMMA (Polymethyl Methacrylate), The transparent layer may include at least one of polycarbonate (PC) or polycarbonate (PC). 415 is an adhesive region that is bonded to the upper surface of the resin layer 420, and The transparent layer 415 may include a non-adhesive region or a spaced-apart non-adhesive region. The diffusion layer 430 is disposed on 60% or more, for example, 80% or more of the upper surface area of ​​the The transparent layer 415 is adhered to the resin layer 420 or is disposed between the transparent layer 415 and the resin layer 420. When a diffusion layer (not shown) is disposed, the diffusion layer 430 is (i) can be attached to the

[0035] <Optical patterns 425 and 426> The optical patterns 425 and 426 may face the upper surface of the resin layer 420. The optical patterns 425 and 426 are aligned perpendicularly to the light emitting elements 100 and 102, respectively. The optical patterns 425 and 426 can overlap in the first direction or the third direction Z. It can overlap each of the plurality of light emitting elements 100, 102 in the vertical direction. The optical patterns 425 and 426 are disposed between the resin layer 420 and the diffusion layer 430. When a plurality of the diffusion layers 430 are arranged, the optical patterns 425 and 426 are arranged in a plurality of layers. The optical pattern 425 is disposed on the lower surface of the diffusion layer or between multiple diffusion layers. , 426 are disposed in the transparent layer 415. The optical patterns 425, 426 are The transparent layer 415 can be penetrated, and at least one of the resin layer 420 and the diffusion layer 430 can be The optical patterns 425 and 426 can be in contact with at least one of the transparent layers 4. 15 and / or the upper surface of the resin layer 420. The gap portions 427 and 427A may be formed between the optical patterns 425 and 426. 6 and can provide refractive indexes different from each other, improving light diffusion efficiency. The lower surface S13 of the optical patterns 425 and 426 is spaced apart from the upper surface of the resin layer 420, for example. The gap portions 427 and 427A are either air regions or vacuum regions. That's fine.

[0036] As shown in FIGS. 3, 6 and 7, the spacing between adjacent first optical patterns 425 is The distance between the first and second light emitting elements 100 may be smaller than the distance between the first and second light emitting elements 100. The distance between the optical patterns 425 and 426 is different from that of the first and second light emitting elements 100. , 102. The optical patterns 425 and 426 may be formed on the resin The optical pattern 425 may be spaced apart from the outer surface S1 of the layer 420 (see FIG. 3). The optical patterns 425 and 426 may have the same shape. The first and second light emitting elements 100 and 102 are disposed on the first and second light emitting elements 100 and 102, respectively. 425 may overlap with each of the first light emitting elements 100 in the vertical direction. The second optical pattern 426 may overlap the second light emitting element 102 in the vertical direction. The second optical pattern 426 is the resin layer of the first and second optical patterns 425 and 426. The optical pattern 4 is disposed closest to or closest to the side of the optical pattern 420. The optical patterns 25 and 426 may be disposed higher than the upper surface of the resin layer 420. 425, 426 are respectively arranged on the light emitting element 100, 102. 102, each of the upper surface area of ​​the The optical patterns 425 and 426 are areas printed with a white material. The optical patterns 425 and 426 may be made of, for example, TiO2, Al2O3, CaCO3, BaSO4, or Sil It can be printed using reflective ink containing one of the icons. The optical patterns 425 and 426 are formed through the light emitting surfaces 81 and 8A of the light emitting elements 100 and 102. The emitted light is reflected to prevent hot spots from occurring on each of the light emitting elements 100 and 102. The optical patterns 425 and 426 are formed by using light-blocking ink. The optical patterns 425, 426 can be printed on the diffusing layer. The optical patterns 425, 42 may be printed on the lower surface of the optical element 430. 6 is a material that does not block 100% of the incident light, and the transmittance may be lower than the reflectance. The optical patterns 425 and 426 can have the functions of blocking and diffusing light. They may be formed in a single layer or multiple layers, and may have the same or different pattern shapes. The optical patterns 425 and 426 may have the same thickness. The optical patterns 425 and 426 may be formed to have different thicknesses depending on the region. The thickness of the optical patterns 425 and 426 is the thickest in the center area and the thickest in the edge area. The thickness of the optical patterns 425 and 426 may be smaller than the incident light intensity. For example, it may be thick.

[0037] The lower surface area of ​​the optical patterns 425 and 426 is equal to the upper surface area of ​​the light emitting devices 100 and 102. Place it in the range of 50% or more of the product, for example, 50% to 800% or 200% to 700% This allows the light emitting elements 100, 1 to be shielded from the outside. 102 visibility problem and hot spots above the area of ​​the light emitting elements 100, 102. The optical pattern can reduce the light intensity and provide a uniform light distribution over the entire area. The light emitting elements 100 and 102 are used as references and are formed in a hemispherical, elliptical or may be arranged in a circular shape.

[0038] As shown in FIG. 4A, the first optical pattern 425 is formed on the light-emitting side of the upper surface of the first light-emitting element 100. The first light emitting element 100 may have a length C3 that is longer than the length D1 of the first light emitting element 100. The maximum length C3 of the first optical pattern 425 is perpendicular to the direction in which light is emitted. The maximum length in the direction of the arrow is 8 mm or more, for example, in the range of 8 mm to 20 mm or 12 mm to 18 mm. The maximum width B3 of the first optical pattern 425 may be in the range of mm. The maximum length in the direction of discharge is 6 mm or more, for example, 6 mm to 15 mm or 8 mm to 1 The first optical pattern 425 may have a maximum length C3 of up to It may be smaller than the width B3, for example, the maximum length C3 is 1.2 times or more the maximum width B3, for example 1. The thickness may be in the range of 2 to 1.7 times. The first optical pattern 425 arranged on the area to be heated is used to block or reflect light. The area of ​​the first optical pattern 425 can be reduced by It can be varied according to the directivity angle distribution of the first light emitting element 102.

[0039] As shown in FIG. 5A, the second optical pattern 426 is formed on the upper surface of the second light emitting element 102. The second light emitting element 102 has a length C31 that is longer than the length D11 of the second light emitting element 102. The length C31 of the second optical pattern 426 is perpendicular to the direction in which light is emitted. The maximum length in the direction of rotation is 6 mm or more, for example, in the range of 6 mm to 15 mm or The width B31 of the second optical pattern 426 may be in the range of 12 mm. The maximum length in the direction of emission is 8 mm or more, for example, 8 mm to 18 mm or 8 mm to The second optical pattern 426 may have a length C31 and a width B For example, the length C31 may be 1.2 times or more the width B31, for example, 1.2 times to It may be formed in the range of 1.7 times.

[0040] As shown in FIG. 4A, the maximum length C3 of the first optical pattern 425 is The length D1 of the element 100 in the long axis direction Y is 2.6 times or less, for example, in the range of 2.4 to 2.6 times. The maximum length C31 of the second optical pattern 426 is 3.6 times or more, for example, in the range of 3.6 to 3.8 times, of the length D11 of the major axis direction Y of the sensor 02 This allows the second light emitting element 102 to be disposed above the light emitting region. The second optical pattern 426 can suppress hot spots through light blocking or reflection. The area of ​​the second optical pattern 426 is determined based on the directivity angle of the second light emitting element 102. The length C31 of the second optical pattern 426 can be varied depending on the distribution. It may be smaller than the length C3 of the turn 425, for example, 0.9 times or less the length C3. For example, the ratio may be in the range of 0.7 to 0.9. The width B31 may be smaller than the length B3 of the first optical pattern 425, for example, The thickness B3 may be 0.85 times or less, for example, in the range of 0.68 times to 0.82 times. do.

[0041] As shown in FIGS. 4A and 4B and 5A and 5B, the first and second optical patterns 425, 426 are laminated with a plurality of unit pattern layers M1, M2, M3, and have the same laminate structure. A part of the first optical pattern 425 may be formed on the first light emitting element 100. A part of the second optical pattern 426 is disposed on the upper side of the second light emitting element 102. The first and second optical patterns 425 and 426 are arranged, for example, from the top to the bottom. The first unit pattern layer M1, the second unit pattern layer M2 and the third unit pattern layer M The second unit pattern layer M2 is laminated on the surface of the first unit pattern layer M1. The third unit pattern layer M3 or the bottom pattern layer is smaller than the second unit pattern The area of ​​the first to third unit pattern layers M1, M2, and M3 may be smaller than that of the first unit pattern layer M1. can be overlapped on the first and second light emitting devices 100 and 102, respectively, and The number of layers or the number of layers gradually decreases toward the region or the region farther from the light emitting elements 100 and 102. The first to third unit pattern layers M1, M2, and M3 may be arranged with gradually thinner thicknesses. The patterns may have different shapes and / or areas and may overlap each other in the vertical direction. The reflective pattern Ma of the first unit pattern layer M1 is the reflective pattern of the second unit pattern layer M2. The reflective pattern of the second unit pattern layer M2 has a size smaller than that of the second unit pattern layer Mb. The second unit pattern layer M2 may be arranged with a pitch smaller than that of Mb. The pattern Mb has a size smaller than the size of the reflective pattern Mc of the third unit pattern layer M3. The pitch of the reflection pattern Mc of the third unit pattern layer M3 is smaller than the pitch of the reflection pattern Mc of the third unit pattern layer M3. Here, the first optical pattern 425 may be arranged on the uppermost side of the first optical pattern 425. The area of ​​the unit pattern layer M1 is the area of ​​the first optical pattern 426 arranged on the top side of the second optical pattern 426. The area of ​​the first and second optical patterns 425 may be larger than that of the unit pattern layer M1. , 426, the reflection patterns Ma, Mb, Mc of the first to third unit pattern layers M1, M2, M3 The inside is filled with an adhesive material M0 such as silicone or epoxy. The first and second optical patterns 425 and 426 are formed on the light emitting elements 100 and 102 as a multi-layered reflector. The unit pattern layers M1, M2, and M3 each having a projection pattern Ma, Mb, and Mc are laminated. , the first and second optical patterns 425 and 426 can be effectively blocked. In addition, the first and second optical patterns 425, 426 adjacent to the light emitting elements 100, 102 The 26 areas are the thickest, and the farther away they are the thinner, so the difference in luminosity due to the difference in distance Through this, the light uniformity can be improved.

[0042] As shown in FIG. 7, the thickness Z3 of the optical patterns 425 and 426 is The optical length Z1 may be 0.1 times or less, for example, in the range of 0.05 to 0.1 times. The thickness Z3 of the patterns 425 and 426 is 100 μm or more, for example, in the range of 100 to 200 μm. The thickness Z3 of the optical patterns 425 and 426 may be smaller than the above range. If the range is smaller, there is a limit to reducing hot spots, and if the range is larger, the light uniformity will be The optical patterns 425 and 426 are projected from the upper surfaces of the light emitting devices 100 and 102. The distance Z4 between the lower surfaces of the The distance Z between the upper surface of the light emitting element 100, 102 and the upper surface of the reflective layer 410 can be The distance 0 can be 0.8 mm or more, for example, in the range of 0.8 mm to 1.4 mm. The areas of the optical patterns 425 and 426 do not overlap the area of ​​the transparent layer 415 in the vertical direction. That's fine.

[0043] The optical patterns 425 and 426 are arranged on the light emitting elements 100 and 102 . It is possible to prevent hot spots caused by light emitted in the emission direction of the elements 100 and 102. The optical patterns 425 and 426 are provided in a size or area of ​​about Since the light emitting elements 100 and 102 emit light in the side direction, i.e., in the first direction X, The light shading efficiency due to the light directional angle distribution and light reflection characteristics of the light emitting elements 100 and 102 is improved. This will cover the areas where it is possible to do this.

[0044] Here, the interval between the first light emitting element 100 or the first and second light emitting elements 100, 1 The spacing between the two may be 25 mm or more, for example, in the range of 25 mm to 30 mm. The light emitting element 100 can be varied depending on the characteristics of the light emitting elements 100 and 102 .

[0045] In another example, the optical patterns 425 and 426 may be formed by etching the upper surface of the resin layer 420. The recess is an air region formed by the etching process, or the light-shielding material is not present in the recess. The etching area may include a light-shielding film disposed on the optical pattern area. As shown in the figure, the light emitting elements 100 and 102 are arranged in a range of 50% to 800% of the upper surface area. The light emitting surfaces of the light emitting elements 100 and 102 can be covered.

[0046] <Diffusion layer 430> The diffusion layer 430 is disposed on the resin layer 420. The lower surface of the diffusion layer 430 is The first region S11 where the transparent layer 415 is disposed and the optical patterns 425 and 426 are disposed are The diffusion layer 430 may include a second region S12 disposed in the optical pattern 4. 25, 426 are printed on the bottom and fixed on the resin layer 420 through the light-transmitting layer 415. will be done.

[0047] Here, a lower diffusion layer (not shown) is disposed between the transparent layer 415 and the resin layer 420. When the lower diffusion layer is bonded to the resin layer 420, for example, the resin layer 420 The upper surface of the diffusion layer is adhered to the lower diffusion layer by the first adhesive force having fine cilia. The diffusion layer 430 and / or the lower diffusion layer are formed by applying a predetermined pressure or pressure / heat to the resin layer 42. It may be attached on top of 0.

[0048] The diffusion layer 430 is made of a polyester (PET) film, a PMMA (Poly Methyl Methacrylate) The diffusion layer 430 may include at least one of a SiO 2 material and a PC (Poly Carbonate). The spreading member may be provided as a film made of a resin material such as silicone or epoxy. The diffusion layer 430 can include a single layer or multiple layers.

[0049] The thickness Z2 of the diffusion layer 430 is 25 μm or more, for example, in the range of 25 to 250 μm. Alternatively, the thickness may be in the range of 100 μm to 250 μm. The diffusion layer has a thickness in the above range, and can provide incident light as a uniform surface light. 430 or / and the lower diffusion layer, which contains a diffusion agent such as beads, phosphor, and ink particles. The phosphor may include at least one or more of a red phosphor, At least one of amber phosphor, yellow phosphor, green phosphor, and white phosphor is included The ink particles may be at least one of a metallic ink, a UV ink, and a curable ink. The size of the ink particles may be smaller than the size of the phosphor. The surface color of the ink particles may be any one of green, red, yellow, and blue. The type of ink may be PVC (Polyvinyl Chloride) ink, PC (Polycar bonate) ink, ABS (acrylonitrile butadiene styrene copolymer) ink, UV resin ink ink, epoxy ink, silicone ink, PP (polypropylene) ink, water-based ink, plastic Stick ink, PMMA (poly methyl methacrylate) ink, PS (Polystyrene) ink The ink particles can be applied selectively. The connector may include at least one of the following:

[0050] In an embodiment of the invention, the light diffused by the resin layer 420 is transmitted through the transparent layer 415, The light is emitted as a surface light through the diffusion layer 430. At this time, the optical patterns 425 and 426 In another embodiment of the invention, the following can be implemented: A reflective material layer or an upper substrate is disposed on the resin layer 420. The layer or upper substrate may face the upper surface of the resin layer 420, and the light emitting device 1 The light emitting elements 100, 102 are arranged in at least one row or column. The respective emission surfaces 81.8A are arranged at the same intervals as one side surface of the resin layer 420, and the resin layer Light can be emitted through one side of 420.

[0051] The detailed structures of the first and second light emitting elements 100 and 102 will be described below with reference to FIGS. 8 to 14. 8 to 10, the first light emitting element 100 has a cavity 15 A body 10 having a cavity 15A, a plurality of lead frames 20, 30, 40 in the cavity 15A and disposed on at least one of the plurality of lead frames 20, 30, 40. The first light emitting element 100 includes a plurality of LED chips 71 and 72. It is realized as a package of mobile phones, mobile computers, various lighting fields, vehicle lamps, etc. The length D2 of the main body 10 in the first direction is 4 m. m or more, for example, in the range of 4 mm to 7 mm or in the range of 4.5 mm to 6.5 mm. The body 10 has a large length D2 in the first direction, so that the cavity 15A The thickness T1 of the first light emitting device 100 is 1.5 The first light emitting element may have a thickness of 0.6 mm to 1.5 mm or less, for example, in the range of 0.6 mm to 1.5 mm. 100 can be provided with a relatively thin thickness T1, and the first light emitting element 100 This allows for a reduction in the thickness of the lighting module or lamp.

[0052] The body 10 is coupled to the lead frames 20, 30, and 40. The body 10 is an insulating The body 10 may be made of a resin-based insulating material, such as polyphthalamide. Polyphthalamide (PPA), silicone or epoxy or plastic materials The body 10 may be made of a thermosetting resin containing fluorine or a material having high heat resistance and high light resistance. The reflecting material may include a resin material to which a reflective material, for example, a metal oxide, is added. The side of the main body 10 may include at least one of TiO2, SiO2, and Al2O3. 1, the first side surface portion 11 and the second side surface portion 12 are arranged on opposite sides in the thickness direction. The housing may include third and fourth side portions 13, 14 disposed longitudinally opposite each other. The first side surface 11 is the bottom or bottom surface of the main body 10, and the second side surface 12 is The front surface 15 of the body 10 may be the upper surface of the cavity 1. The front surface 15 may be the surface on which the optical fiber 5A is disposed or the surface from which light is emitted. The rear surface portion on the opposite side of the first side surface portion 11 and the second side surface portion 12 may be the rear side surface of the first side surface portion 11 and the second side surface portion 12. The body 10 is made up of a first body 10A in which the cavity 15A is disposed and a second body 10B in which the cavity 15A is disposed. The first body 10A may include a second body 10B at the rear side of the lead frame. The casings 20, 30, and 40 are arranged in the front portion 15 and are arranged around the cavity 15A. The second body 10B supports the lead frames 20, 30, and 40 and It may also be a part that supports the device.

[0053] The cavity 15A faces the first to fourth side surface portions 11, 12, 13, and 14, respectively. The first to fourth inner surfaces 11A, 12A, 13A, and 14A are 1A, 12A, 13A, and 14A are arranged so as to be inclined with respect to the bottom of the cavity 15A. As shown in FIG. 9, the depth H11 of the cavity 15A is The distance to the bottom of the cavity 15A has a range of, for example, 0.3 mm ± 0.05 mm. When the depth H11 of the cavity 15A is less than the above range, the light directionality can be improved. It is difficult to control the angle, and if it exceeds the range, the light beam angle becomes narrow.

[0054] The plurality of lead frames 20, 30, 40 are disposed at the bottom of the cavity 15A. The lead frame is bent and extends to the first side surface portion 11 of the main body 10. The arms 20, 30, and 40 are spaced apart from the first lead frame 20. The first lead frame may include spaced apart second and third lead frames 30, 40. The lead frame 20 is disposed between the second and third lead frames 30 and 40 .

[0055] The first lead frame 20 is a first frame disposed at the bottom center of the cavity 15A. a first frame portion 21 and a first bone extending from the first frame portion 21 to the first side portion 11; The second lead frame 30 may include a sealing portion 22. A second frame portion 31 disposed on one side of the bottom of the 5A and a second frame portion 31 extending from the second frame portion 31 to the The third bonding portion 32 may extend in the direction of the first side portion 11. The base frame 40 is made up of a third frame portion 41 and a second frame portion 42 arranged on the other side of the bottom of the cavity 15A. and a second bonding wire extending from the third frame portion 41 toward the first side surface portion 11. It may include a section 32.

[0056] The plurality of LED chips 71 and 72 are mounted on the first frame portion 2 of the first lead frame 20. 1, and the second and third frame parts 31, 41 and wires 75, 76 are connected thereto. As shown in FIG. 8, the first LED chip 71 is connected to the first frame portion 21 at the joint portion. The second LED chip is connected to the second frame portion 31 by a wire 75. The first frame portion 21 is connected to the second frame portion 21 by a joint member 79. The first LED chip 71 and the second LED chip 72 are connected to the frame part 41 by a wire 76. The LED chips 71 and 72 may be vertical chips. Choose from chips, blue LED chips, green LED chips, and yellow green LED chips The LED chips 71 and 72 can emit light with a red peak wavelength, for example. The LED chips 71 and 72 are made of at least one of a II-VI group compound and a III-V group compound. The LED chips 71 and 72 may each include one of GaN, AlGaN, InGaN, Selected from the group consisting of AlInGaN, GaP, AlN, GaAs, AlGaAs, InP and mixtures thereof. As another example, the first LED chip 71 and the second LED chip The flip chip 72 is disposed on the first to third frame portions 21, 31, and 41 by flip chip mounting. The separation portions 18 and 19 at the bottom of the cavity 15A may separate the first frame portion 21 and the between the second frame portion 31 and between the first frame portion 21 and the third frame portion 41. The separating portions 18 and 19 may be arranged parallel to each other or in a diagonal line. good.

[0057] As shown in FIGS. 8 and 10, the first bonding portion 22 is formed on the first side surface of the body 10. The first bonding portion 11 is disposed on the bottom surface of the second body 10B. The first frame portion 21 projects from the first side surface portion 11 of the main body 10 to form a rear surface portion 22. The first lead frame 20 is bent in the direction of the connecting portions 25, 26, and 27. , and a plurality of coupling holes H1, H2 disposed between the plurality of connecting portions 25, 26, 27. The protrusions P1 and P2 of the body are exposed through the coupling holes H1 and H2. The second bonding portion 32 of the second lead frame 30 can be The third bonding pad is disposed on the first side surface portion 11 of the body 10 and is bent toward the rear surface portion. The buckle portion 42 is disposed on the first side surface portion 11 of the main body 10 and is bent toward the rear surface portion. The second bonding portion 32 is formed on the first extension portion 3 so as to increase the heat dissipation area. 3, and the first extension portion 33 is bent toward the third side portion 13 of the main body 10. The third bonding part 42 is formed by extending the second extension part 43 so as to increase the heat dissipation area. The second extension 43 is bent toward the fourth side surface 14 of the main body 10. do.

[0058] Here, the areas of the second lead frame 30 and the third lead frame 40 are Alternatively, the areas of the second and third bonding portions 32 and 42 may be the same. They may be identical to each other.

[0059] As shown in FIG. 2, the thickness of the main body 10 is larger than that of the center region of the main body 10. The thickness of the area adjacent to the third and fourth side portions 13, 14 may be reduced. The first side surface portion 11 of the first embodiment has recessed areas 11B and 11C adjacent to the third and fourth side surfaces 13 and 14. The recessed regions 11B, 11C may include a protruding region 16 relative to the recessed regions 11B, 11C. The second and third bonding portions 32 and 42 of the second and third lead frames 30 and 40 are placed The protruding area 16 has a length in the first direction equal to that of the first frame 21. The length may be shorter than the first frame 21 of the first lead frame 20. The chips 71 and 72 are spaced apart from the first inner surface 11A by a distance C4 from the second inner surface 12A. The distance C3 may be narrower than the distance C4. The first bonding part 22 extends in the direction of the heat transfer. The LED chips 71 and 72 are closer to the first side surface portion 11 than to the second side surface portion 12. The length Y1 of the LED chips 71 and 72 in the third direction Z is Even if it is positioned at 40% or more of the bottom length C1 of bitty 15A, for example, in the range of 40% to 60% Such LED chips 71 and 72 have large surfaces that are long in the first and second directions. The arrangement of the elements in a stacked arrangement increases the heat dissipation efficiency and the light efficiency. The width C1 of the first frame 21 exposed at the bottom of the cavity 15A is The width C1 of the first frame 21 and the width C2 of the second frame 31 may be larger than the width C1 of the first frame 21. The difference C5 in width C2 is at most 0.1 mm or more, for example, in the range of 0.1 to 0.25 mm. This is because the first frame 21 is located in the first inner surface 11A and the second frame 21 is located in the first inner surface 11A. When the frame 31 and the third frame 41 are extended to the area where they are arranged, the area becomes narrower. The narrowed area corresponds to one corner of the LED chips 71 and 72. This allows the light emitted from each corner of the LED chips 71 and 72 to be directed to the third and fourth and loss in the outer region of the first inner surface 11A adjacent to the fourth inner surfaces 13A and 14A. The third and fourth side surfaces 13 and 14 of the body 10 have recesses that are recessed inward. The recesses 13B and 14B may be formed during the injection process of the main body 10. The fingers that support the body 10 are inserted into the cavity of the body 10. The molding member 80 is disposed on the 15A. It may contain a light-transmitting resin such as cone or epoxy, and may be formed in a single layer or multiple layers. In the molding member 80, when the LED chips 71 and 72 are red LED chips, In this case, the molding member may not contain impurities such as phosphors. 80 or on the LED chips 71 and 72, fluorescent lamps are provided to change the wavelength of the emitted light. The phosphor may include a phosphor that converts a portion of the light emitted from the LED chips 71 and 72 into a The phosphors are quantum dots, YAG, TAG, etc. The fluorescent material may be selected from the group consisting of silicate, nitride, and oxynitride. The light source may include at least one of a red phosphor, a yellow phosphor, and a green phosphor; However, the surface of the molding member 80 may have a flat shape. The cavity may be formed in a concave or convex shape, but is not limited thereto. A light-transmitting film having a phosphor may be disposed on the tee 15A, but is not limited thereto. A gate groove 16B may be formed at the rear of the main body 10. A lens is further formed on the upper part of the body 10, and the lens has a concave or / and convex lens structure. The first light emitting element 100 may include a light distribution adjusting structure. The main body 10 or any one of the lead frames may have a light receiving element. The protective element is a thyristor, a Zener diode, or the like. It can be realized by a diode or TVS (Transient voltage suppression), and the Zener The diodes protect the LED chips 71 and 72 from ESD (electro static discharge). This will happen.

[0060] Referring to FIGS. 11 to 14, the second light emitting element 102 is a main light emitting element having a cavity 1A. a body 1, lead frames 5 and 6 disposed at the bottom of a cavity 1A of the body 1, and a fourth The lead frame 5 may include a third LED chip 3 disposed on the fourth frame portion 5A of the lead frame 5. can.

[0061] The third LED chip 3 is electrically connected to the fourth and fifth lead frames 5 and 6. The third LED chip 3 is mounted on the fourth frame 5A of the fourth lead frame 5 by a bonding member 3. D and connected to the fifth frame portion 6A of the fifth lead frame 6 by the fourth wire 3B. The areas of the fourth and fifth lead frames 5 and 6 may be different. The area of ​​the fourth lead frame 5 may be larger than the area of ​​the fifth lead frame 6; The small package can prevent the heat dissipation efficiency of the third LED chip 3 from decreasing. The fifth lead frame 5 is a fifth bonding wire extending to one side of the first side surface portion S21 of the main body 1. The sixth lead frame 6 can have a fifth extension portion 5B and a fifth lead frame 5C. The sixth bonding portion 6B and the sixth extension portion 6 are extended to the other side of the first side surface portion S21 of the body 1. It can have a C.

[0062] Here, the bottom area of ​​the fifth bonding portion 5B is the bottom area of ​​the sixth bonding portion 6B. The shape of the bottom of the fifth bonding part 5B may be larger than the product of the sixth bonding part 5B. The shape of the bottom of the first portion 5B1 of the fifth bonding portion 5B may be different from that of the bottom of the first portion 5B1 of the fifth bonding portion 5B. The length K1 may be greater than the length K2 of the first portion 6B1 of the sixth bonding portion 6B, For example, the length K1 may be 1.5 times or more the length K2. The length K3 of the second part 5B2 and its outer bent part of the sixth bonding part 6 The length of the second part 6B2 of B and the length of its outer folded part K4 may be the same. Therefore, the fifth bonding portion 5B of the fifth lead frame 5 on which the third LED chip 3 is arranged is The bottom surface area can be further increased to improve the heat dissipation area and bonding area. The width K5 of the fifth and sixth extensions 5C and 6C is 0.8 times or less the length K3 and K4. For example, it can be in the range of 0.4 times to 0.8 times.

[0063] As shown in FIG. 14, the third LED chip 3 is connected to the third wire 3A for double connection. The third wire 3A is connected to the bonding member 3D bonded to the third LED chip 3 using the bonding member 3D. One end of the wire is bonded to the joining member 3D, and the other end is bonded to the fourth frame portion 5A. As a result, when the joining member 3D is lifted up from the fourth frame portion 5A, The fourth frame part 5A is connected to the third LED chip 3 through the third wire 3A. If the third wire 3A breaks, the fourth frame portion 5A will be connected to the third wire 3A through the connecting member 3D. The third wire 3 is connected to the LED chip 3. Here, the part 3D1 of the joining member 3D is The wire 3A is protruded toward the other end of the third wire 3A to provide a wide bonding area with one end of the third wire 3A. The fourth wire 3B has multiple contact points with the fifth frame portion 6A, for example. If the sub-wire 3C is jumped or extended in a different direction to separate the contacts The sensor may further include:

[0064] 9 and 11, the bottom width of the cavity 15A of the first light emitting device 100 is T3 may be the same as the width T4 of the bottom of the cavity 1A of the second light emitting element 102. The heights of the cavities 15A and 1A of the first light emitting element 100 and the second light emitting element 102 H11 may be the same. The bottom lengths D3 and D31 of the cavities 15A and 1A are The thickness D3 may be 0.7 times or less, for example, in the range of 0.4 to 0.7 times. The third LED chips 71, 72, and 73 emit light of the same color wavelength and are the same size. The first light emitting element 100 and the second light emitting element 102 may have a width H Here, the body 10 of the first light emitting device 100 may be the same as the first light emitting device 100. The body 1 of the second light emitting device 102 can be defined as a second body. The cavity 15A of the first light emitting element 100 is defined as a first cavity. The cavity 1A of the second light emitting element 102 is defined as a second cavity. Here, the length D11 of the second light emitting element 102 is 2.5 times or more the thickness T2. For example, the thickness T2 of the main body 1 is minimized and the length is Only the thickness D11 can be reduced and applied to the second region R2 (FIG. 1) having a smaller width.

[0065] As shown in FIG. 15, the first light emitting element 100 includes first to third lead frames 20, 30, 40 are connected to a plurality of pads 452, 453, 454 of the substrate 401 and the bonding member 250. The second light emitting element 102 may be bonded to the fourth and fifth lead frames 5 and 6. Each of them may be bonded to a plurality of pads 455, 456 of the substrate 401 by the bonding member 250. The first and second light emitting elements 100 and 102 are disposed on the substrate 401. The second light emitting elements 100 and 102 have different numbers of LED chips 71, 72, and 3. The first and second light emitting elements 100, 102 may have different lengths, for example The second light emitting element 102 may be provided with a length shorter than that of the first light emitting element 100 .

[0066] FIG. 16 is a plan view of a vehicle to which the lighting device according to the embodiment is applied, and FIG. 17 is a plan view of the vehicle to which the lighting device according to the embodiment is applied. 16 and 17 are drawings showing examples of taillights of a vehicle. In the vehicle 900, the forward lamp 850 may include one or more lighting modules. By individually controlling the driving time of these lighting modules, it is possible to not only function as a normal headlight, but also Instead, when the driver opens the vehicle door, a welcome light or celebration light will be displayed. It can even provide additional functions such as celebration effects. Apply to daytime running lights, high beams, low beams, fog lights or turn signals In the vehicle 900, the taillights 800 are multiple lamps supported by a housing 801. For example, the lamp units 810, 812, 814, and 816 may be The units 810, 812, 814, and 816 are the first lamp unit 81 disposed on the outside. 0, a second lamp unit 814 arranged around the inside of the first lamp unit 810; The third and fourth lamp units are respectively arranged inside the second lamp unit 814. The first to fourth lamp units 810, 812, 814, 816 can selectively apply the lighting device disclosed in the embodiment, For the lighting characteristics of the lamp units 810, 812, 814, and 816, A red lens cover or a white lens cover may be provided. The lighting device disclosed in the embodiment applied to units 810, 812, 814, and 816 is The first and second lamp units 810 and 812 can emit light with a uniform distribution. 12 is at least one of a curved shape, a linear shape, an angular shape, an inclined shape, and a flat shape The first and second lamp units may be provided in one or a combination of these structures. One or more of the first lamp units 810 and 812 may be provided for each taillight. The first lamp unit 810 serves as a tail light, and the second lamp unit 812 serves as a brake light. The third lamp unit 814 is provided as a backup lamp, and the fourth lamp The lamp unit 816 may be provided as a turn signal lamp. The structure and location of the groups can be varied.

[0067] The features, structures, effects, etc. described in the above embodiments may be used in at least one embodiment of the present invention. The present invention is not limited to any one embodiment. The features, structures, effects, etc. of the present invention may be easily understood by a person having ordinary skill in the art to which the present invention pertains. The examples can be combined or modified in various ways. The above description should be interpreted as including the contents of the present invention. Although the above description is given with a view to the present invention, it is merely an example and is not intended to limit the scope of the present invention. A person having ordinary skill in the art would understand the present invention to the extent that it does not deviate from the essential characteristics of this embodiment. Therefore, various modifications and applications not exemplified above are possible. Each of the components presented can be implemented in a modified form. Any variations in application are to be construed as falling within the scope of the invention as defined in the appended claims. should be.

Claims

1. A substrate; a reflective layer disposed on the substrate; a light source disposed above the substrate and passing through the reflective layer; a resin layer disposed on the reflective layer; an optical pattern disposed on the resin layer; The light source includes a first light emitting element and a second light emitting element spaced apart from the first light emitting element, The optical pattern includes a first optical pattern disposed above the first light emitting element; a second optical pattern disposed above the second light emitting element; The first optical pattern and the second optical pattern have different areas.

2. The first optical pattern and the second optical pattern are formed of a plurality of unit pattern layers having different areas. The lighting device according to claim 1 , wherein the first and second light sources are arranged to overlap each other.

3. The area of ​​the unit pattern layer arranged on top of the first optical pattern is The lighting device according to claim 1 , wherein the area of ​​the unit pattern layer is larger than the area of ​​the unit pattern layer arranged on top of the turn. Place.

4. a unit pattern disposed at the top of the plurality of unit pattern layers of the first optical pattern; 3. The illumination device according to claim 2, wherein the area of ​​the layer is larger than the area of ​​the unit pattern layer arranged at the bottom. Lighting device.

5. The reflective layer has a first hole in which the first light emitting element is disposed and a second light emitting element in which the second light emitting element is disposed. a second hole 5. The method according to claim 1, wherein the first hole is larger than the second hole. Lighting equipment.

6. The length of the first hole in the major axis direction is greater than the length of the second hole in the major axis direction.

6. The lighting device according to claim 5.

7. The maximum length of the first optical pattern is 2. The range is 4 times to 2.6 times, The maximum length of the second optical pattern is 3.

5. The lighting device according to claim 1, wherein the brightness is in the range of 6 times to 3.8 times.

8. A substrate; a reflective layer disposed on the substrate; a light source disposed above the substrate and passing through the reflective layer; a resin layer disposed on the reflective layer; an optical pattern disposed on the resin layer; The light source includes a first light emitting element and a second light emitting element spaced apart from the first light emitting element, the first light emitting element and the second light emitting element each include a different number of LED chips; The length of the first light emitting element in the major axis direction is different from the length of the second light emitting element in the major axis direction. Lighting device.

9. The first light emitting element is disposed on a first lead frame with the first lead frame sandwiched therebetween. and a second lead frame and a third lead frame having the same area. The second light emitting element has an area different from that of the fourth lead frame. The lighting device of claim 8 including a fifth lead frame.

10. The first light emitting device has the first to third lead frames coupled to the bottom of the first cavity. a first body having a plurality of LEDs on a first lead frame disposed in the first cavity; Including tip, the first cavity is disposed on a front surface of the body; the first body includes a first side portion facing the substrate, Each of the first to third lead frames is bent to a first side portion of the first body.

10. The lighting device of claim 9, comprising a bonding portion.

11. The second light emitting element has fourth and fifth lead frames disposed on the bottom of the second cavity. a second body disposed on the bottom of the second cavity; and a fourth lead frame disposed on the bottom of the second cavity. and at least one LED chip, and a bonding member for bonding between the fourth lead frame and the LED chip. a first wire whose both ends are connected between the bonding member and the fourth lead frame; 10. The lighting device of claim 9, comprising a yar.

12. a second wire connecting the fifth lead frame and the LED chip of the second light emitting element; fruit, The second wire is a sub-wire having multiple terminal contacts on the upper surface of the fifth lead frame.

12. The lighting device of claim 11, comprising:

13. A substrate; a reflective layer disposed on the substrate; a light source disposed above the substrate and passing through the reflective layer; a resin layer disposed on the reflective layer; an optical pattern disposed on the resin layer; The light source includes M first light emitting elements and N second light emitting elements spaced apart from the M first light emitting elements. a light element, wherein M is a natural number greater than N; The length of the first light emitting element in the major axis direction is greater than the length of the second light emitting element in the major axis direction. 、 overlapping the second light emitting element in the major axis direction passing over the center of the second light emitting element; The maximum width of the resin layer is in the range of 2 to 2.2 times the length of the first light-emitting element in the major axis direction. That is, the lighting equipment.

14. The maximum width of the resin layer above the second light emitting element is equal to or less than the length in the major axis direction of the first light emitting element.

14. The lighting device of claim 13, wherein the thickness is 2.2 times or less.

15. The resin layer has a first minimum width and includes a first region in which a plurality of the first light-emitting elements are arranged, and a a second region having a large second width and in which at least one second light emitting element is disposed; The second width is smaller than the first width and larger than the length of the second light emitting element in the major axis direction. , the length of the second light-emitting element in the major axis direction is 2.2 times or less, The second region has the second width and is aligned in a direction in which the second light-emitting element is irradiated.

15. The light emitting element according to claim 13, wherein the light emitting element extends from the first light emitting element by a length equal to or greater than five times the width of the minor axis of the second light emitting element. The lighting device according to claim 1.

16. The second light emitting element is the one of the first and second light emitting elements that is closer to the side surface of the resin layer than the other.

15. The lighting device according to claim 13 or 14, which is arranged at a nearest position.

17. The optical pattern vertically overlaps a portion of each of the first light emitting elements. a first optical pattern that overlaps a portion of the second light emitting element in a vertical direction; Including an optical pattern, The second optical pattern is formed by forming the first and second optical patterns on the side surface of the resin layer.

17. The lighting device of claim 16, wherein the lighting device is arranged so as to be nearest adjacent.

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