Resin material supply device, resin molding device, and method of manufacturing resin molded article

Abstract

To provide a resin material supply device capable of suppressing a decrease in yield of a resin molded article.SOLUTION: A resin material supply device includes: a table capable of supporting a transfer part that can hold and transfer a resin material; a resin accommodation part that accommodates the resin material; a resin supply part that supplies the resin material supplied from the resin accommodation part to the transfer part supported by the table; an oscillation part that is provided in an upper part of the resin supply unit and vibrates the resin supply part to supply the resin material from the resin supply part to the transfer part; and a metering part that is provided in a lower part of the table and is capable of metering the resin material supplied to the transfer part.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to a resin material supplying device, a resin molding device, and a method for manufacturing a resin molded product. [Background technology]

[0002] Patent Document 1 discloses a resin material supplying device including a first storage unit for storing granular or powdered resin material and a second storage unit for receiving and temporarily storing the resin material stored in the first storage unit, then measuring and dropping the resin material through a resin material supply passageway from the outlet of the resin material supply passageway. A vibration applying unit for applying vibrations to the second storage unit and a weighing unit for weighing the resin material in the second storage unit are provided below the second storage unit. By applying vibrations to the second storage unit using the vibration applying unit, the resin material can be dropped from the outlet of the second storage unit and supplied to a resin material transfer tray. Furthermore, by weighing the second storage unit using the weighing unit while the vibration applying unit is applying vibrations to the second storage unit, the weight of the resin material supplied to the resin material transfer tray can be measured. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2018-27670 Summary of the Invention [Problem to be solved by the invention]

[0004] In a typical resin material supply device, as described in Patent Document 1, the vibration applying unit and measuring unit are located below the second storage unit, which creates a certain level of height difference (drop) between the second storage unit and the resin material transfer tray located below the second storage unit. As a result, there is a risk that resin material falling from the second storage unit will collide with the resin material transfer tray and bounce up high, adhering to the edge of the resin material transfer tray or scattering around. This could result in a decrease in the yield of resin molded products.

[0005] The present invention has been made in consideration of the above-described circumstances, and the problem it aims to solve is to provide a resin material supply device, a resin molding device, and a method for manufacturing resin molded products that are capable of suppressing a decrease in yield of resin molded products. [Means for solving the problem]

[0006] The problem that the present invention aims to solve is as described above, and in order to solve this problem, the resin material supplying device of the present invention comprises a table capable of supporting a transfer section capable of holding and transferring resin material, a resin storage section that stores resin material, a resin supplying section that supplies resin material supplied from the resin storage section to the transfer section supported on the table, an oscillation section that is provided above the resin supplying section and that supplies resin material from the resin supplying section to the transfer section by vibrating the resin supplying section, and a measuring section that is provided below the table and is capable of measuring the resin material supplied to the transfer section.

[0007] A resin molding apparatus according to the present invention includes the resin material supplying apparatus.

[0008] In addition, the method for manufacturing a resin molded product according to the present invention is a method for manufacturing a resin molded product using the resin molding device, and includes the steps of supplying resin material to the transfer section using the resin material supply device, transporting the resin material to a molding die using the transfer section, and clamping the molding die. [Effects of the Invention]

[0009] According to the present invention, it is possible to suppress a decrease in the yield of resin molded products. [Brief explanation of the drawings]

[0010] [Figure 1] 1 is a schematic plan view showing the overall configuration of a resin molding apparatus according to an embodiment; [Figure 2] FIG. 2 is a front view showing the configuration of the compression molding module according to the embodiment. [Figure 3] FIG. 1 is a front cross-sectional schematic view showing the configuration of a resin material supplying device according to an embodiment. [Figure 4] FIG. 10 is a front cross-sectional schematic view showing the resin material supplying device in which powdered resin is being replenished into the trough. DETAILED DESCRIPTION OF THE INVENTION

[0011] In the following explanation, the directions indicated by arrows U, D, L, R, F, and B in the figure will be defined as upward, downward, leftward, rightward, forward, and backward, respectively.

[0012] <Overall configuration of resin molding device 1> First, the configuration of a resin molding apparatus 1 of this embodiment will be described with reference to FIGS. 1 and 2. The resin molding apparatus 1 performs resin molding by compression molding. The resin molding apparatus 1 can resin-seal electronic elements such as semiconductor chips fixed to a pre-resin-sealed substrate Sa, which is a molding object, to produce a resin molded product. The pre-resin-sealed substrate Sa can be a semiconductor substrate such as a silicon wafer, a metal substrate, a glass substrate, a ceramic substrate, or a resin substrate. The pre-resin-sealed substrate Sa may or may not be provided with wiring. The shape of the pre-resin-sealed substrate Sa is not particularly limited, and it can be formed into, for example, a rectangular shape, a circular shape, or the like.

[0013] The resin molding apparatus 1 shown in FIG. 1 mainly includes a resin supply module 2, a compression molding module 3, a substrate supply and storage module 4, and a control unit 5. In this embodiment, an example is shown in which the resin molding apparatus 1 includes three compression molding modules 3. The resin supply module 2, the three compression molding modules 3, and the substrate supply and storage module 4 are arranged side by side in the left-right direction. The resin supply module 2, the compression molding module 3, and the substrate supply and storage module 4 are each detachable from the other modules. Furthermore, the number of each module can be increased or decreased as needed.

[0014] The substrate supply and storage module 4 includes a first storage section 43 that stores a substrate S (pre-sealed substrate Sa) on which a chip is fixed before being sealed with resin, a second storage section 44 that stores a substrate S (sealed substrate Sb) after being sealed with resin, a substrate placement section 41 that transfers the pre-sealed substrate Sa and the sealed substrate Sb, and a substrate loader 42 that transports the pre-sealed substrate Sa and the sealed substrate Sb. The sealed substrate Sb is one embodiment of a resin molded product according to the present invention. The substrate placement section 41 moves in the front-rear direction within the substrate supply and storage module 4. The substrate loader 42 is configured to be movable in the front-rear and left-right directions throughout the substrate supply and storage module 4 and each compression molding module 3.

[0015] The substrate supply and storage module 4 also includes an inspection mechanism (not shown). The inspection mechanism inspects the area where a chip is present on the pre-resin-sealing substrate Sa. The inspection mechanism uses a laser displacement meter or the like to inspect whether or not a chip is actually present on the pre-resin-sealing substrate Sa, and stores the locations where a chip is present and where it is not present. The configuration of the inspection mechanism is not particularly limited. For example, the inspection mechanism may take an image of the pre-resin-sealing substrate Sa with a visible light camera or the like, and inspect the area where a chip is present on the pre-resin-sealing substrate Sa based on the captured image.

[0016] Each compression molding module 3 shown in Figures 1 and 2 includes a molding die M (lower die LM and upper die UM) and a clamping mechanism 35 that clamps and opens the upper die UM and lower die LM by raising and lowering the lower die LM. The upper die UM is disposed above the lower die LM and faces the lower die LM in the vertical direction. The lower die LM is disposed so that it can be raised and lowered in the vertical direction. A lower die cavity MC is formed in the lower die LM, into which a release film F and powdered or granular resin R are supplied. The powdered or granular resin R is one embodiment of the resin material according to the present invention. The specific configuration of the compression molding module 3 will be described later.

[0017] 1 includes a release film supply mechanism 25 that supplies a release film F, a cleaning mechanism 24 that cleans the lower surface and inner surface of the frame 23, a resin loader 26 that transports the frame 23, and a resin material supply device 100 that pours powdered or granular resin R into the inside of the frame 23 placed on the release film F. The resin material supply device 100 includes a table 190 on which the release film F and the frame 23 can be placed. The resin loader 26 is configured to be movable in the front-to-rear and left-to-right directions throughout the resin supply module 2 and each compression molding module 3.

[0018] The control unit 5 is disposed at any position (in the illustrated example, the substrate supply and storage module 4) in the resin molding apparatus 1. The control unit 5 can control the operation of each of the above-mentioned units in order to resin-seal the electronic elements fixed to the pre-resin-sealing substrate Sa to obtain the resin-sealed substrate Sb.

[0019] <Configuration of Compression Molding Module 3> As shown in Figure 2, the compression molding module 3 in this embodiment mainly comprises a lower fixed platen 31, a flat member 32, an upper fixed platen 33, a movable platen 34, a mold clamping mechanism 35, a lower heater 36, an upper heater 37, a lower mold holder 38, an upper mold holder 39, and a molding mold M, etc.

[0020] The upper fixed platen 33 is disposed above the lower fixed platen 31. The lower fixed platen 31 and the upper fixed platen 33 are connected by a pair of flat plate-like members 32 arranged to face each other. Instead of the flat plate-like members 32, the lower fixed platen 31 and the upper fixed platen 33 may be connected by four tie bars (columnar members).

[0021] A movable platen 34 is disposed between the lower fixed platen 31 and the upper fixed platen 33. The movable platen 34 is capable of moving up and down along the flat plate-like member 32. A mold clamping mechanism 35 for moving the movable platen 34 up and down is disposed on the lower fixed platen 31. The mold clamping mechanism 35 may be a ball screw mechanism, a hydraulic cylinder, a toggle mechanism, or the like. The mold clamping mechanism 35 is capable of clamping the forming mold M by moving the movable platen 34 upward. The mold clamping mechanism 35 is capable of opening the forming mold M by moving the movable platen 34 downward.

[0022] An upper die holder 39 for attaching an upper die UM is provided on the lower surface of the upper fixed platen 33. An upper heater 37 is provided inside the upper die holder 39. The upper die UM is attached to the lower surface of the upper die holder 39. A substrate S (pre-resin-sealed substrate Sa) on which chips and the like are fixed is attached to the lower surface of the upper die UM.

[0023] A lower die holder 38 for attaching a lower die LM is provided on the upper surface of the movable platen 34. A lower heater 36 is provided inside the lower die holder 38. The lower die LM, in which a lower die cavity MC is formed, is attached to the upper surface of the lower die holder 38.

[0024] A suction mechanism (not shown) adsorbs and holds the release film F to the lower mold cavity MC. As a result, the powdered or granular resin R supplied onto the release film F by the resin material supply device 100 is accommodated in the lower mold cavity MC. The powdered or granular resin R in the lower mold cavity MC is melted by the lower heater 36, and the mold M is clamped by the clamping mechanism 35, thereby resin-sealing the pre-resin-sealing substrate Sa. This allows a resin-sealed substrate Sb (resin molded product) to be obtained.

[0025] <Manufacturing method for resin molded products> The following describes a method for manufacturing a resin molded product using the resin molding apparatus 1 configured as described above. The control unit 5 controls the operation of each unit of the resin molding apparatus 1, thereby manufacturing the resin molded product.

[0026] First, in the substrate supply and storage module 4 shown in FIG. 1 , the pre-resin-sealed substrate Sa is sent from the first storage section 43 to the substrate placement section 41. Next, the pre-resin-sealed substrate Sa on the substrate placement section 41 is transferred to the substrate loader 42. At this time, an inspection mechanism (not shown) inspects the pre-resin-sealed substrate Sa for the presence of chips, etc. Based on the inspection results (presence or absence of chips on the pre-resin-sealed substrate Sa) by the inspection mechanism, the control section 5 calculates in advance the target supply amount of powdered or granular resin R to be supplied into the frame 23, the target supply position of the powdered or granular resin R within the frame 23, the supply trajectory of the powdered or granular resin R to be supplied into the frame 23, etc. The substrate loader 42 transports the pre-resin-sealed substrate Sa to the compression molding module 3 and fixes it to the upper mold UM. Thereafter, the substrate loader 42 moves to the substrate supply and storage module 4.

[0027] Next, in the resin supply module 2, the release film F supplied from the release film supply mechanism 25 to the table 190 is cut to a predetermined size. Next, the resin loader 26 receives the frame 23 cleaned by the cleaning mechanism 24. The resin loader 26 places the frame 23 on the release film F adsorbed to the table 190. The release film F and the frame 23 form a transfer section for transferring the powdered or granular resin R. Thereafter, the resin loader 26 retreats from above the table 190.

[0028] Next, the resin material supplying device 100 supplies a target supply amount of powdered or granular resin R onto the release film F inside the frame 23. The specific configuration of the resin material supplying device 100 will be described later.

[0029] Next, the resin loader 26 receives the release film F and the frame 23 to which the powdered or granular resin R has been supplied, which are placed on the table 190. The resin loader 26 transports the release film F and the frame 23 to the compression molding module 3 and places them on the lower mold LM. The release film F is adsorbed to the lower mold cavity MC by a suction mechanism (not shown), and the powdered or granular resin R is accommodated in the lower mold cavity MC. The frame 23 is returned to the cleaning mechanism 24 by the resin loader 26. The powdered or granular resin R in the lower mold cavity MC is melted by the lower heater 36.

[0030] 2, the lower mold LM is moved upward by the mold clamping mechanism 35, and the upper mold UM and the lower mold LM are clamped together. As a result, the chips and the like of the pre-resin-sealing substrate Sa are immersed in the molten powdered or granular resin R (molten resin).

[0031] After a certain period of time has passed, the molten resin solidifies, and resin molding can be performed on the pre-resin-sealed substrate Sa to obtain a resin-sealed substrate Sb (resin molded product). After the resin has solidified, the lower mold LM is moved downward, and the upper mold UM and lower mold LM are opened.

[0032] Next, the substrate loader 42 shown in Fig. 1 moves to the compression molding module 3 and receives the resin-sealed substrate Sb. The substrate loader 42 moves to the substrate supply and storage module 4 and places the resin-sealed substrate Sb on the substrate placement section 41. The resin-sealed substrate Sb placed on the substrate placement section 41 is transferred to and stored in the second storage section 44. By performing such resin molding in parallel in multiple compression molding modules 3, resin molded products can be manufactured efficiently.

[0033] <Resin material supply device 100> The resin material supplying device 100 of the resin supplying module 2 will be specifically described below with reference to FIGS.

[0034] The resin material supplying device 100 shown in Figures 3 and 4 mainly comprises a stocker 110, a first oscillating section 120, a trough 130, a second oscillating section 140, a capacity sensor 150, a chute 160, a dust collection mechanism 170, a shutter 180, a table 190, and a weighing section 200.

[0035] 3, the powdered or granular resin R is indicated by hatching. Also, in FIG. 3, cross sections of each member are shown to show the interior of the resin material supplying device 100, but the hatching indicating the cross section of each member is omitted to distinguish it from the powdered or granular resin R. Also, for convenience, the stocker 110 and the storage amount sensor 150 are shown near the table 190 in FIG. 3, but in reality, the stocker 110 and the like are disposed at a position some distance horizontally from the table 190, as shown in FIG. 4. The shutter 180 is disposed near the chute 160.

[0036] The stocker 110 stores the powdered or granular resin R and supplies it to the trough 130. The stocker 110 is one embodiment of a resin storage unit according to the present invention. The stocker 110 mainly includes a storage unit 111, a supply unit 112, and an opening 113.

[0037] The storage section 111 is a box-shaped section that stores the powdered or granular resin R. The storage section 111 is formed to be hollow so that the powdered or granular resin R can be stored therein. An opening (not shown) is formed at the top of the storage section 111 for supplying the powdered or granular resin R to the inside. The storage section 111 is supplied (replenished) with the powdered or granular resin R at appropriate times.

[0038] The supply section 112 is a section that supplies the powdered or granular resin R stored in the storage section 111 to the opening 113. The supply section 112 is a section that extends horizontally (left and right in FIG. 3) from the storage section 111, and is formed hollow so that the powdered or granular resin R can move inside. For example, the supply section 112 is formed in a cylindrical shape with a rectangular cross section. The supply section 112 is formed so as to extend laterally (leftward in the illustrated example) from the lower part of one side of the storage section 111.

[0039] The opening 113 is a portion through which the powdered or granular resin R supplied via the supply unit 112 falls downward. The opening 113 is formed hollow so that the powdered or granular resin R can move inside. For example, the opening 113 is formed in a cylindrical shape with a rectangular cross section. The opening 113 is connected to the tip of the supply unit 112 extending from the storage unit 111, and opens downward.

[0040] The first oscillating unit 120 is for discharging the powdered or granular resin R from the stocker 110. The first oscillating unit 120 is provided below the stocker 110. Specifically, the first oscillating unit 120 is provided so as to be in contact with the bottom surface of the stocker 110. The first oscillating unit 120 can vibrate the stocker 110. By vibrating the stocker 110, the first oscillating unit 120 can move the powdered or granular resin R in the storage unit 111 to the supply unit 112 and drop (discharge) it downward from the opening 113.

[0041] The trough 130 stores powdered or granular resin R and supplies it to a release film F arranged on a table 190. The trough 130 is one embodiment of a resin supply unit according to the present invention. The trough 130 mainly includes a storage section 131, a supply section 132, and an opening 133.

[0042] The storage section 131 is a portion that stores the powdered or granular resin R. The storage section 131 is formed to be hollow so that the powdered or granular resin R can be stored therein. An opening 131a is formed at the top of the storage section 131 to supply the powdered or granular resin R therein. The storage section 131 is supplied (replenished) with the powdered or granular resin R from the stocker 110.

[0043] The supply section 132 is a section that supplies the powdered or granular resin R stored in the storage section 131 to the opening 133. The supply section 132 is a section that extends horizontally (left and right in FIG. 3) from the storage section 131, and is formed hollow so that the powdered or granular resin R can move inside. For example, the supply section 132 is formed in a cylindrical shape with a rectangular cross section. The supply section 132 is formed so as to extend laterally (leftward in the illustrated example) from the lower part of one side of the storage section 131.

[0044] The opening 133 is a portion through which the powdered or granular resin R supplied via the supply unit 132 falls downward. The opening 133 is formed hollow so that the powdered or granular resin R can move inside. For example, the opening 133 is formed in a cylindrical shape with a rectangular cross section. The opening 133 is connected to the tip of the supply unit 132 extending from the storage unit 131, and opens downward.

[0045] The second oscillating unit 140 is for discharging the powdered or granular resin R from the trough 130. The second oscillating unit 140 is one embodiment of an oscillating unit according to the present invention. The second oscillating unit 140 is provided on the upper part of the trough 130. More specifically, the second oscillating unit 140 is disposed at a position higher than the bottom of the trough 130. In this embodiment, the lower end of the opening 133 is the lowest position of the trough 130, and therefore the second oscillating unit 140 is disposed at a position higher than the bottom of the opening 133. Furthermore, the second oscillating unit 140 is preferably disposed at a position higher than the bottom surfaces of the storage unit 131 and the supply unit 132. In this embodiment, the second oscillating unit 140 is placed on the upper surface of the supply unit 132 and is disposed so as to be in contact with the upper surface of the supply unit 132. The second oscillating unit 140 can vibrate the trough 130. The second oscillating section 140 vibrates the trough 130 to move the powdered or granular resin R in the storage section 131 to the supply section 132 and cause it to drop (discharge) downward from the opening 133.

[0046] The storage amount sensor 150 is for measuring the amount of powdered or granular resin R stored in the trough 130. The storage amount sensor 150 is one embodiment of a storage amount measurement unit according to the present invention. As the storage amount sensor 150, it is preferable to use a sensor that can measure the amount of powdered or granular resin R stored in the trough 130 without coming into contact with the trough 130 or the powdered or granular resin R stored in the trough 130. In this embodiment, a distance measuring sensor that can measure the distance to an object without contact is used as the storage amount sensor 150. The storage amount sensor 150 is disposed near the opening 113 of the stocker 110. When the powdered or granular resin R is supplied from the stocker 110 to the trough 130, the storage amount sensor 150 measures the distance from above the storage section 131 to the upper surface of the powdered or granular resin R stored in the storage section 131. The amount of powdered or granular resin R contained in the trough 130 can be measured based on the distance from the contained amount sensor 150 to the upper surface of the powdered or granular resin R contained in the container 131.

[0047] The chute 160 guides the powdered or granular resin R from the trough 130 to the release film F placed on the table 190. The chute 160 is one embodiment of a guide unit according to the present invention. The chute 160 is formed in a cylindrical shape with both upper and lower ends open. An inlet 161 that opens upward is formed at the upper end of the chute 160. The inlet 161 is shaped so that the opening 133 of the trough 130 can be inserted therein. A supply port 162 that opens downward is formed at the lower end of the chute 160. The supply port 162 is shaped so that the powdered or granular resin R can be spread on the release film F (inside the frame 23), for example, with a rectangular cross section. An inclined surface is formed inside the chute 160 as necessary to smoothly guide the powdered or granular resin R from the inlet 161 formed at the upper end to the supply port 162 formed at the lower end.

[0048] The dust collection mechanism 170 is for collecting dust (fine powder) of the powdered or granular resin R via the chute 160. The dust collection mechanism 170 mainly includes a dust collection duct 171, a first gate valve 172, a second gate valve 173, and the like.

[0049] Dust collection duct 171 is a member that is connected to chute 160 and forms an air circulation path. Dust collection duct 171 is formed of a cylindrical member at least a portion of which is flexible. One end of dust collection duct 171 is connected to the middle of chute 160. The other end of dust collection duct 171 branches into first duct 171a and second duct 171b.

[0050] The first gate valve 172 and the second gate valve 173 are capable of blocking (blocking) the air flow path. The first gate valve 172 is provided in the middle of the first duct 171a. By opening and closing the first gate valve 172, it is possible to switch between allowing and not allowing the air to flow through the first duct 171a. The second gate valve 173 is provided in the middle of the second duct 171b. By opening and closing the second gate valve 173, it is possible to switch between allowing and not allowing the air to flow through the second duct 171b.

[0051] Although not shown, the first duct 171a and the second duct 171b are connected to a suction device capable of sucking air, a filter capable of collecting dust, etc. The amount of air sucked through the first duct 171a is set to be greater than the amount of air sucked through the second duct 171b.

[0052] With this configuration, when first gate valve 172 is opened and second gate valve 173 is closed, air inside chute 160 can be sucked with a relatively large (strong) suction force through first duct 171a. On the other hand, when second gate valve 173 is opened and first gate valve 172 is closed, air inside chute 160 can be sucked with a relatively small (weak) suction force through second duct 171b.

[0053] The trough 130, second oscillating section 140, and chute 160 described above can be moved together in the horizontal direction by a movement mechanism (not shown). Hereinafter, the trough 130, second oscillating section 140, and chute 160, which can move together, will be referred to as a movable unit UN. Note that a portion of the dust collection duct 171 is flexible, so that the dust collection duct 171 can bend when the movable unit UN moves. Therefore, the dust collection duct 171 does not hinder the movement of the movable unit UN.

[0054] Furthermore, the chute 160 can be raised and lowered relative to the trough 130 by a movement mechanism (not shown). By lowering the chute 160, the supply port 162 of the chute 160 can be lowered to a position lower than the upper end of the frame body 23, as shown in Fig. 3. By raising the chute 160, the supply port 162 of the chute 160 can be raised to a position higher than the upper end of the frame body 23, as shown in Fig. 4.

[0055] When supplying the powdered or granular resin R from the trough 130 to the release film F placed on the table 190, the movable unit UN is moved horizontally along a movement path that corresponds to the shape of the frame 23, thereby spreading the powdered or granular resin R over the entire area of ​​the frame 23. At this time, as shown in FIG. 3, by lowering the chute 160 to a position lower than the upper end of the frame 23, the powdered or granular resin R can be prevented from splashing up.

[0056] 4, when supplying powdered or granular resin R from stocker 110 to trough 130, movable unit UN moves so that storage section 131 of trough 130 is positioned below opening 113 of stocker 110. Hereinafter, this position of movable unit UN will be referred to as the replenishment position. When movable unit UN moves from above table 190 to the replenishment position, chute 160 can be raised to avoid interference between chute 160 and frame 23.

[0057] The shutter 180 shown in FIG. 4 reduces the flow path area of ​​air flowing through the supply port 162 of the chute 160. When the chute 160 rises, the shutter 180 moves to be positioned immediately below the supply port 162 of the chute 160. The shutter 180 can be moved using a drive mechanism such as a motor. The shutter 180 is formed, for example, in a flat plate shape that covers the supply port 162 when viewed from the bottom. The shutter 180 is positioned so as to form a small gap between it and the supply port 162. The flow path area of ​​air formed by this gap is set to be smaller than the opening area of ​​the supply port 162.

[0058] 3 supports the release film F and the frame 23. The table 190 can suck and hold the release film F by means of a suction mechanism (not shown).

[0059] The measuring unit 200 is used to measure the powdered or granular resin R on the release film F placed on the table 190. The measuring unit 200 is provided below the table 190 and can measure the weight of the table 190. More specifically, the measuring unit 200 is disposed at a position lower than the upper surface of the table 190 (the surface on which the release film F is placed). In this embodiment, the measuring unit 200 is provided on the lower surface of the table 190. Since the weights of the table 190 and the frame 23 and release film F placed on the table 190 are known, the weight of the powdered or granular resin R supplied onto the release film F can be measured by subtracting the weights of the table 190, frame 23, and release film F from the measurement value of the measuring unit 200.

[0060] The operation of the resin material supplying apparatus 100 configured as described above will be described below.

[0061] First, as shown in FIG. 3, the case where powdered or granular resin R is supplied to a release film F will be described.

[0062] When supplying powdered or granular resin R onto the release film F, the second oscillating unit 140 vibrates the trough 130 while the supply port 162 of the chute 160 is positioned above the release film F. As a result, the powdered or granular resin R stored in the storage unit 131 is supplied to the opening 133 via the supply unit 132. The powdered or granular resin R supplied to the opening 133 falls into the chute 160 via the inlet 161, is guided by the inner surface of the chute 160, and falls from the supply port 162. In this way, the powdered or granular resin R is supplied onto the release film F. By moving the movable unit UN horizontally along a supply trajectory calculated in advance while vibrating the trough 130, the powdered or granular resin R can be spread throughout the entire area within the frame 23.

[0063] While the powdered or granular resin R is being supplied onto the release film F, the suction device (not shown) of the dust collection mechanism 170 is operated. In this case, the second gate valve 173 is opened and the first gate valve 172 is closed. This allows the air inside the chute 160 to be sucked in with a relatively small suction force via the second duct 171b. By sucking the air inside the chute 160, dust (fine powder) that has been blown up from the release film F through the supply port 162 can be collected inside the chute 160. The dust collected inside the chute 160 is recovered by a filter (not shown) of the dust collection mechanism 170.

[0064] Furthermore, the weighing unit 200 can measure the weight of the powdered or granular resin R supplied onto the release film F. When a target supply amount of powdered or granular resin R has been supplied onto the release film F, the second oscillating unit 140 stops. This makes it possible to supply an appropriate amount of powdered or granular resin R onto the release film F. When the second oscillating unit 140 stops, the suction device (not shown) of the dust collection mechanism 170 also stops.

[0065] In this embodiment, the second oscillating unit 140 is provided above the trough 130. Furthermore, a weighing unit 200 for measuring the weight of the powdered or granular resin R supplied to the release film F is provided below the table 190, not in the trough 130. This makes it possible to reduce the vertical distance (height difference) between the trough 130 and the table 190. Furthermore, it is possible to reduce the vertical distance (height difference) between the inlet 161 and the supply port 162 of the chute 160. In this way, by reducing the height difference between the trough 130 and the table 190 (the inlet 161 and the supply port 162 of the chute 160), the falling distance of the powdered or granular resin R can be reduced, and the powdered or granular resin R that has fallen onto the release film F can be prevented from bouncing up. This prevents the powdered or granular resin R from scattering in undesirable locations (for example, the inner surface and upper surface of the frame 23, and the periphery of the frame 23), thereby improving the yield of resin molded products.

[0066] In this embodiment, the dust collection mechanism 170 sucks dust from the supply port 162 of the chute 160 into the interior of the chute 160. This generates an airflow from the outside to the inside of the chute 160, preventing dust from floating up outside the chute 160. This prevents the powdered or granular resin R from scattering to undesirable locations, improving the yield of resin molded products. Furthermore, in conventional devices such as those described in Patent Document 1, dust is not collected within the chute 160, making it impossible to prevent dust (resin) from adhering to the inner wall of the frame 23. As a result, resin adhering to the frame 23 may fall onto a location along the movement path of the resin material transfer tray, such as onto the mold M, where resin adhesion is undesirable. However, in this embodiment, dust is collected within the chute 160, preventing resin from adhering to the inner wall of the frame 23, preventing resin from falling onto the movement path of the resin material transfer tray.

[0067] Furthermore, in a configuration in which the dust collection mechanism 170 sucks air from inside the chute 160, as in this embodiment, the trough 130 may vibrate due to the influence of air currents generated inside the chute 160. However, in this embodiment, the weight of the powdered or granular resin R supplied to the release film F is measured not by the trough 130 but by the weighing unit 200 provided on the table 190. Therefore, even if the trough 130 vibrates, the weight of the powdered or granular resin R can be measured with high accuracy. Furthermore, in conventional devices such as those described in Patent Document 1, powdered or granular resin R adhering to the inside of the chute 160 and powdered or granular resin R that splashes after being discharged from the trough 130 and is not supplied onto the release film F are weighed as the supplied powdered or granular resin R. However, this does not happen in this embodiment, and the weight of the powdered or granular resin R can be measured with high accuracy.

[0068] Next, as shown in FIG. 4, a case where the powdered or granular resin R is replenished into the trough 130 will be described.

[0069] When the amount of powdered or granular resin R contained in the trough 130 decreases to a certain extent, the powdered or granular resin R is replenished from the stocker 110 to the trough 130. The remaining amount of powdered or granular resin R contained in the trough 130 can be calculated, for example, from the cumulative amount of powdered or granular resin R supplied measured by the measuring unit 200.

[0070] When replenishment of powdered or granular resin R from stocker 110 to trough 130 occurs, chute 160 first rises relative to trough 130, and supply port 162 is raised to a position higher than the upper end of frame 23. At the same time, shutter 180 moves to a position just below supply port 162 at the lower end of chute 160.

[0071] Next, the movable unit UN moves to a position (replenishment position) below the stocker 110. When the movable unit UN has moved to the replenishment position, the storage amount sensor 150 is located above the storage section 131 (opening 131a) of the trough .

[0072] Next, first oscillating unit 120 vibrates stocker 110. As a result, powdered or granular resin R stored in storage unit 111 is supplied to opening 113 via supply unit 112. The powdered or granular resin R supplied to opening 113 falls from opening 113 into storage unit 131 of trough 130. As a result, powdered or granular resin R is replenished in storage unit 131 of trough 130.

[0073] While the trough 130 is being replenished with the powdered or granular resin R, the suction device (not shown) of the dust collection mechanism 170 is activated. In this case, the first gate valve 172 is opened and the second gate valve 173 is closed. This allows the air inside the chute 160 to be sucked with a relatively strong suction force via the first duct 171a. By sucking the air inside the chute 160 with such a strong suction force, the powdered or granular resin R adhering to the inner surface of the chute 160 can be collected. This prevents the powdered or granular resin R adhering to the inside of the chute 160 from falling to unintended locations, which would reduce the yield.

[0074] In particular, in this embodiment, the flow path area of ​​the air flowing through the supply port 162 is reduced by the shutter 180. This increases the flow rate of the air sucked from the outside of the chute 160 to the inside of the chute 160 through the supply port 162, and allows the powdered or granular resin R adhering to the inner surface of the chute 160 to be collected effectively.

[0075] Although one embodiment of the present invention has been described above, the present invention is not limited to the above embodiment, and appropriate modifications are possible within the scope of the technical idea of ​​the invention described in the claims.

[0076] For example, the configuration (shape, arrangement, number, etc.) of each part of the resin molding apparatus 1 described in this embodiment is not particularly limited, and can be changed as desired.

[0077] Furthermore, in this embodiment, an example has been shown in which only the chute 160 moves up and down to position the shutter 180, but the present invention is not limited to this. For example, it is also possible to position the shutter 180 by moving the entire movable unit UN including the chute 160 up and down. This makes it possible to switch the position of the shutter 180 between a position facing the supply port 162 of the chute 160 and a position retracted from the supply port 162.

[0078] In addition, in this embodiment, the release film F and the frame 23 are exemplified as the transfer section for transporting the resin material (powdered or granular resin R), but the present invention is not limited to this. For example, a tray-like member on which the resin material can be placed can also be used as the transfer section.

[0079] Furthermore, in this embodiment, the first gate valve 172 and the second gate valve 173 are exemplified as configurations for switching the airflow rate of the dust collection mechanism 170, but the present invention is not limited to this, and the airflow rate can be switched using any configuration. For example, it is also possible to provide a flow control valve midway through one duct and switch the airflow rate by controlling the flow control valve.

[0080] Furthermore, in this embodiment, an example has been shown in which a distance measuring sensor is used as the storage amount sensor 150 for measuring the amount of powdered or granular resin R stored in the trough 130, but the present invention is not limited to this, and the amount of powdered or granular resin R can be measured by any method. For example, various other non-contact sensors, load cells, etc. can also be used. Furthermore, the amount (e.g., weight) of powdered or granular resin R stored in the stocker 110 can be measured, and the amount of powdered or granular resin R stored in the trough 130 can be measured (estimated) based on the amount of powdered or granular resin R stored in the stocker 110 that has decreased (the amount of powdered or granular resin R replenished to the trough 130).

[0081] In addition, in this embodiment, an example has been shown in which the powdered or granular resin R that has dropped from the trough 130 is guided to the release film F by the chute 160, but the present invention is not limited to this. For example, it is also possible to supply the powdered or granular resin R directly from the trough 130 to the release film F without using the chute 160.

[0082] In addition, in this embodiment, an example has been shown in which the powdered or granular resin R is supplied onto the release film F while moving the movable unit UN (trough 130, etc.), but the present invention is not limited to this. For example, it is also possible to adopt a configuration in which the table 190 is moved in addition to the movable unit UN, or a configuration in which only the table 190 is moved, etc.

[0083] <Additional Notes> The resin material supplying device 100 according to the first aspect of the present disclosure includes: a table 190 capable of supporting a transfer unit (a release film F and a frame 23) capable of holding and transferring a resin material (a powdered or granular resin R); a resin containing section (stocker 110) for containing a resin material; a resin supply unit (trough 130) that supplies the resin material supplied from the resin storage unit to the transfer unit supported by the table 190; an oscillation unit (second oscillation unit 140) provided above the resin supply unit and vibrating the resin supply unit to supply the resin material from the resin supply unit to the transfer unit; a measuring unit 200 provided below the table 190 and capable of measuring the resin material to be supplied to the transfer unit; It is equipped with the following. According to the resin material supplying device 100 of the first aspect of the present disclosure, it is possible to suppress a decrease in the yield of resin molded products. That is, by providing the second oscillating unit 140 above the trough 130 and the measuring unit 200 below the table 190, it is not necessary to arrange the second oscillating unit 140 and the measuring unit 200 between the trough 130 and the table 190. This shortens the falling distance of the powdered or granular resin R supplied from the trough 130 to the release film F on the table 190, and suppresses the powdered or granular resin R that has fallen onto the release film F from bouncing up. This suppresses the powdered or granular resin R from scattering in undesirable locations, thereby improving the yield of resin molded products.

[0084] In the resin material supplying device 100 according to the first aspect of the present disclosure, The resin supply unit includes: a container 131 for containing the resin material supplied from the resin container; an opening 133 through which the resin material is dropped; a supply unit 132 that supplies a resin material from the container to the opening; Equipped with The oscillation section is provided on the upper surface of the supply section. According to the resin material supplying device 100 of the second aspect of the present disclosure, the falling distance of the powdered or granular resin R supplied from the trough 130 onto the release film F on the table 190 can be shortened.

[0085] A resin material supplying device 100 according to a third aspect of the second aspect of the present disclosure includes: The container further includes a storage amount measuring section (storage amount sensor 150) capable of measuring the amount of resin material stored in the storage section in a non-contact manner. According to the resin material supply device 100 of the third aspect of the present disclosure, there is no need to provide a weighing device in the trough 130 for weighing the powdered or granular resin R, so the falling distance of the powdered or granular resin R supplied from the trough 130 to the release film F on the table 190 can be shortened.

[0086] A resin material supplying device 100 according to a fourth aspect of the first to third aspects of the present disclosure includes: a guide section (chute 160) that guides the resin material from the resin supply section to the transfer section; a dust collection mechanism 170 for collecting dust at a midpoint of the guide portion; It further comprises: According to the resin material supplying device 100 of the fourth aspect of the present disclosure, it is possible to suppress a decrease in the yield of resin molded products. That is, when dust is collected by the dust collecting mechanism 170, an air current is generated toward the inside of the chute 160, which prevents dust of the powdered or granular resin R from flying up to the outside of the chute 160. This prevents the powdered or granular resin R from scattering to undesirable locations, thereby improving the yield of resin molded products.

[0087] In the resin material supplying device 100 of a fifth aspect according to the fourth aspect of the present disclosure, The dust collection mechanism 170 includes: When the resin material is being supplied from the resin supply unit to the transfer unit by the oscillation unit, dust collection is performed at a first airflow rate; When the resin material is being supplied from the resin storage section to the resin supply section, dust collection is performed at a second air volume that is larger than the first air volume. According to the resin material supplying device 100 of the fifth aspect of the present disclosure, when powdered or granular resin R is being supplied to the release film F, dust collection is performed with a relatively small first airflow, thereby preventing the table 190 and the trough 130 from being affected by the airflow. This allows the second oscillating unit 140 to supply the powdered or granular resin R and the measuring unit 200 to measure the powdered or granular resin R with high accuracy. Furthermore, when powdered or granular resin R is being replenished from the stocker 110 to the trough 130, dust collection is performed with a relatively large second airflow, thereby collecting the powdered or granular resin R adhering to the inside of the chute 160. In this case, the table 190 and the trough 130 are not adversely affected by the airflow.

[0088] In the resin material supplying device 100 of a sixth aspect according to the fifth aspect of the present disclosure, The guide section includes a supply port 162 for dropping the resin material into the transfer section, The dust collecting mechanism 170 further includes a shutter 180 that reduces the flow path area of ​​the air flowing through the supply port 162 when the dust collecting mechanism 170 collects dust at the second airflow rate. According to the resin material supplying device 100 of the sixth aspect of the present disclosure, when dust collection is performed at the second air volume, the flow rate of the air flowing through the supply port 162 can be increased. This makes it possible to effectively collect the powdered or granular resin R adhering to the inner surface of the chute 160.

[0089] In a seventh aspect of the resin material supplying device 100 according to the first to sixth aspects of the present disclosure, The resin supply unit is movable between a position where it can supply the resin material to the transfer unit and a position (replenishment position) where it can receive the resin material from the resin storage unit. According to the resin material supplying device 100 of the seventh aspect of the present disclosure, when it is necessary to replenish the trough 130 with the powdered or granular resin R, the trough 130 can be moved to the replenishment position by moving the trough 130. In this case, there is no need to move the table 190 on which the measuring unit 200 is provided, and therefore it is possible to prevent the measuring unit 200 from being subjected to a load due to the movement.

[0090] A resin molding apparatus 1 according to an eighth aspect of the present disclosure includes: The resin material supply device 100 is provided with any one of the first to seventh sides. According to the resin molding apparatus 1 of the eighth aspect of the present disclosure, it is possible to suppress a decrease in the yield of resin molded products.

[0091] A method for producing a resin molded product according to a ninth aspect of the present disclosure includes: A method for manufacturing a resin molded product using the resin molding apparatus 1 of the eighth aspect, supplying a resin material to the transfer section using the resin material supply device; a step of transporting a resin material to a molding die M using the transport unit; a step of clamping the forming mold M; It includes: According to the method for manufacturing a resin molded product according to the ninth aspect of the present disclosure, it is possible to suppress a decrease in the yield of resin molded products. [Explanation of symbols]

[0092] 23 Frame 100 Resin material supply device 110 Stocker 130 Trough 131 Storage unit 132 Supply section 133 Opening 140 Second Oscillator 150 Capacity Sensor 160 shots 162 Supply port 170 Dust collection mechanism 190 tables 200 Measuring section

Claims

1. a table capable of supporting a transfer unit capable of holding and transferring a resin material; a resin containing portion that contains a resin material; a resin supply unit that supplies the resin material supplied from the resin storage unit to the transfer unit supported on the table; an oscillation unit provided above the resin supply unit and configured to supply the resin material from the resin supply unit to the transfer unit by vibrating the resin supply unit; a measuring unit provided below the table and capable of measuring the resin material to be supplied to the transfer unit; A resin material supplying device comprising:

2. The resin supply unit includes: a container portion in which the resin material supplied from the resin container portion is contained; an opening for dropping the resin material; a supply unit that supplies a resin material from the storage unit to the opening; Equipped with The oscillation unit is provided on an upper surface of the supply unit. The resin material supplying device according to claim 1 .

3. Further, a storage amount measuring unit capable of measuring the amount of the resin material stored in the storage unit in a non-contact manner is provided. The resin material supplying device according to claim 2 .

4. a guide unit that guides the resin material from the resin supply unit to the transfer unit; a dust collection mechanism that collects dust at a midpoint of the guide portion; Further comprising: The resin material supplying device according to any one of claims 1 to 3.

5. The dust collection mechanism includes: When the resin material is being supplied from the resin supply unit to the transfer unit by the oscillation unit, dust collection is performed at a first airflow rate; When the resin material is being supplied from the resin storage section to the resin supply section, dust collection is performed at a second air volume greater than the first air volume. The resin material supplying device according to claim 4.

6. the guide section includes a supply port through which the resin material falls into the transfer section; The dust collecting mechanism may further include a shutter that reduces a flow path area of ​​air flowing through the supply port when the dust collecting mechanism collects dust at the second airflow rate. The resin material supplying device according to claim 5 .

7. the resin supply unit is movable to a position where it can supply the resin material to the transfer unit and to a position where it can receive the resin material from the resin storage unit. The resin material supplying device according to any one of claims 1 to 6.

8. A resin molding apparatus comprising the resin material supplying device according to any one of claims 1 to 7.

9. A method for manufacturing a resin molded product using the resin molding apparatus according to claim 8, supplying a resin material to the transfer section using the resin material supply device; conveying a resin material to a molding die using the conveying unit; a step of clamping the molding die; A method for producing a resin molded product comprising the steps of:

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