Flattening device, flattening method, and article manufacturing method

Abstract

To provide a flattening device that reduces the occurrence of a defective chip due to a flaw in a flattening member.SOLUTION: A flattening device brings a flattening member into contact with a flattening material on a substrate to form a flattened layer on the substrate. The flattening device has a driving unit that moves the flattening member and the substrate relatively to each other, and a control unit that controls the driving unit. The control unit controls a relative position of the flattening member to the substrate on the basis of information on a flaw in the flattening member and information on a permission area in which a flaw in the substrate is permitted.SELECTED DRAWING: Figure 6

Description

[Technical Field]

[0001] The present invention relates to a planarizing apparatus, a planarizing method, and a method for manufacturing an article. [Background technology]

[0002] There is a known technology for flattening the steps on a substrate by forming a coating film on the substrate using a coating device such as a spin coater (planarization technology), but this planarization technology using a coating device is insufficient for flattening the steps on the substrate at the nanoscale. Therefore, in recent years, imprint technology has been proposed for flattening the substrate.

[0003] Patent Document 1 describes a method for improving planarization accuracy by dropping a planarization material based on the step of a substrate and curing the dropped planarization material while a planarization member is in contact with the planarization material. Planarization using imprint technology can include a process of curing the planarization material by irradiating it with light while a planarization member, which is a pressing member, is in contact with the planarization material on the substrate. For this reason, a light-transmitting material such as quartz glass is used for the planarization member. Since planarization is the objective, the surface of the planarization member that comes into contact with the planarization material on the substrate is flat.

[0004] Patent Document 2 describes that defects occur in the planarizing member when the planarizing material on the substrate adheres to the planarizing member, and that the defects (adhesion) on the planarizing member grow as the planarizing process is repeated multiple times. In Patent Document 2, to prevent the defects on the planarizing member from growing, the relative positional relationship between the planarizing member and the substrate is changed every time the planarizing process is performed a predetermined number of times. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Special Publication No. 2011-529626 [Patent Document 2] JP 2019-145620 A (

[0029] , Figure 3) Summary of the Invention [Problem to be solved by the invention]

[0006] However, the planarization device shown in Patent Document 2 changes the relative positional relationship between the planarization member and the substrate every time the planarization process is performed a predetermined number of times, which means that defects in the planarization member may be transferred to any position on the substrate, potentially resulting in defective chips.

[0007] SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a planarizing apparatus that reduces the occurrence of defective chips due to defects in the planarizing member. [Means for solving the problem]

[0008] In order to achieve this object, a planarization apparatus according to one aspect of the present invention comprises: 1. A planarization apparatus for forming a planarization layer on a substrate by contacting a planarization member with a planarization material on the substrate, comprising: a drive unit that moves the planarizing member and the substrate relatively; a control unit that controls the drive unit, the control unit controls the relative position of the planarizing member with respect to the substrate based on information about the defect of the planarizing member and information about an allowable range in which the defect of the substrate is allowed. It is characterized by: [Effects of the Invention]

[0009] According to the present invention, it is possible to provide a planarizing apparatus that reduces the occurrence of defective chips due to defects in the planarizing member. [Brief explanation of the drawings]

[0010] [Figure 1] FIG. 1 is a diagram showing a planarization apparatus according to a first embodiment. [Figure 2] FIG. [Figure 3]FIG. 10 is a diagram showing measurement in a pre-alignment unit. [Figure 4] FIG. 10 is a diagram illustrating a flattening process. [Figure 5] 10A and 10B are diagrams illustrating the occurrence of defective chips due to defects in a planarizing member. [Figure 6] 10A and 10B are diagrams illustrating a method for controlling the relative position of a planarizing member with respect to a substrate. [Figure 7] 10 is a flowchart illustrating a method for controlling the relative position of a planarizing member with respect to a substrate. [Figure 8] FIG. 10 is a diagram showing a planarization apparatus according to a third embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0011] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will now be described with reference to the accompanying drawings. In the drawings, the same reference numerals are used to designate the same components, and redundant explanations will be omitted.

[0012] In each figure of this embodiment, directions are shown in an XYZ coordinate system, with the direction parallel to the surface of the substrate being the XY plane. The directions parallel to the X-axis, Y-axis, and Z-axis in the XYZ coordinate system are the X-direction, Y-direction, and Z-direction, respectively, and rotation around the X-axis, rotation around the Y-axis, and rotation around the Z-axis are respectively referred to as θX, θY, and θZ. Control or drive along the X-axis, Y-axis, and Z-axis refers to control or drive along the direction parallel to the X-axis, Y-axis, and Z-axis, respectively.

[0013] First Embodiment 1 is a schematic diagram showing a planarization apparatus 100 according to a first embodiment. The planarization apparatus 100 can be used in the manufacturing process of an article such as a semiconductor device, and is used to form a planarization layer that flattens the surface of a substrate to prevent defects from occurring in the article. The planarization process performed by the planarization apparatus 100 can include at least the following steps. (a) A dispensing step of dispensing a curable composition, such as a planarizing material, onto a substrate. (b) a contacting step of bringing the planarizing material supplied onto the substrate into contact with the planarizing member; (c) A hardening step in which energy for hardening is applied to the planarizing material to harden the planarizing material. (d) A separation step of separating the planarizing member from the hardened planarizing material (planarizing layer) on the substrate.

[0014] By the planarization process, irregularities on the substrate are covered with a planarization layer, and the surface of the planarization layer is pressed by a planarization member to obtain a flat surface. The planarization material is a curable composition that hardens when hardening energy is applied. For example, heat or light such as ultraviolet light can be used as the hardening energy. Hereinafter, the irradiation of the planarization material with light that causes a hardening reaction is referred to as exposure.

[0015] In this embodiment, the planarization material is a photocurable composition that is cured by irradiation with light. The photocurable composition contains at least a plurality of polymerizable compounds and a photopolymerization initiator that generates a polymerization factor in response to a predetermined wavelength.

[0016] The planarization apparatus 100 shown in Figure 1 includes a substrate 1, a substrate holding unit 3, a substrate driving unit 5, a planarization member 2, a planarization member holding unit 4, a planarization member driving unit 6, a curing unit 7, a pressure adjusting unit 8, a supply unit 9, an alignment unit 10, and a control unit 11.

[0017] The substrate 1 may be, for example, a substrate used in device manufacturing, such as a patterned semiconductor wafer, MEMS wafer, power semiconductor wafer, glass substrate for display, or biodevice, and may have multiple layers on a base material. Examples of base materials that can be used include semiconductors, glass, ceramics, metals, and resins. If necessary, an adhesion layer may be provided on the substrate 1 to improve adhesion between the planarization material and the substrate 1.

[0018] It is preferable that the substrate 1 has a mark (reference mark) that can serve as a reference for measuring the rotation θZ about the Z axis of the substrate 1. The reference mark may be a mark formed on the substrate in a pre-processing step or a notch formed in the substrate in advance.

[0019] The planarizing member 2 is also known as a superstrate, and may have an outer shape equal to or larger than that of the substrate 1, and may be made of a material that transmits ultraviolet light, such as quartz. Specific examples of materials that can be used to make the planarizing member include glass, quartz, optically transparent resins such as PMMA (Polymethyl methacrylate) and polycarbonate resin, transparent metal deposition films, flexible films such as polydimethylsiloxane, photocured films, and metal films. The planarizing member 2 is preferably a circle with a diameter greater than 300 mm and less than 500 mm, but is not limited to this. The diameter of the planarizing member 2 is preferably 200 to 400 mm. The thickness of the planarizing member 2 is preferably greater than or equal to 0.25 mm and less than 2 mm, but is not limited to this.

[0020] The flattening member 2 preferably has a mark (reference mark) that can serve as a reference for measuring the rotation θZ around the Z axis of the flattening member 2. Possible reference marks include the T7 mark 12 of the SEMI standard shown in Fig. 2(a) and the notch 13 shown in Fig. 2(b).

[0021] The substrate holder 3 is configured to be able to hold the substrate 1, and holds the substrate 1 carried in by the transport hand 15 by vacuum suction force, electrostatic force, or the like.

[0022] The flattening member holding section 4 is configured to be able to hold the flattening member 2, and holds the flattening member 2 carried in by the transport hand 15 by vacuum suction force, electrostatic force, or the like.

[0023] The substrate driving unit 5 is configured to be able to move the substrate holding unit 3 in the X and Y directions. A linear motor or the like is used as the actuator. The substrate driving unit 5 is also preferably equipped with a length measuring device such as an encoder or laser interferometer for measuring position. By moving the substrate holding unit 3 with the substrate 1 mounted thereon in the X and Y directions, the substrate 1 can be positioned directly below the planarizing member 2 in the Z direction or directly below the supply unit 9 in the Z direction.

[0024] The planarizing member driving unit 6 is configured to be able to move the planarizing member 2 in the Z direction. For example, it includes an actuator such as a linear motor or an air cylinder. By controlling the distance between the substrate 1 and the planarizing member 2 with the planarizing member driving unit 6, the substrate 1 and the planarizing member 2 can be brought into contact with or separated from each other. Furthermore, the planarizing member driving unit 6 can be driven in the θX axis and the θY axis, and can also be used to adjust the parallelism between the substrate 1 and the planarizing member 2.

[0025] The curing unit 7 is configured to be able to irradiate the planarizing material with energy for curing (for example, light such as ultraviolet light), and has a light source that emits light (exposure light such as ultraviolet light) that cures the planarizing material. The curing unit 7 may also include an optical element that adjusts the light emitted from the light source to light appropriate for planarization. The light irradiated from the curing unit 7 passes through the planarizing member and exposes the planarizing material on the substrate 1.

[0026] In this embodiment, the substrate driving unit 5 and the flattening member driving unit 6 constitute a driving unit that realizes relative movement of the substrate and the flattening member, but this configuration is not limited to this, and the driving unit may be configured so that only one of the substrate driving unit 5 and the flattening member driving unit 6 is movable.

[0027] The pressure adjustment unit 8 is configured to adjust the pressure in the space on the surface of the planarizing member 2 that does not face the substrate 1 (the upper surface in the Z direction). For example, it may include an air regulator, a pressure pump, a vacuum pump, etc. By adjusting the pressure in this space, the planarizing member 2 can be curved in the Z direction. When the planarizing member 2 is pressed against the substrate 1, the planarizing member 2 is curved convexly toward the substrate 1. This is to ensure that the planarizing member 2 contacts the substrate 1 sequentially from the center toward the periphery, so that no air is trapped between the planarizing member 2 and the substrate 1. After the substrate 1 and the planarizing member 2 are completely in contact via the planarizing material, the pressure is released.

[0028] The supply unit 9 is configured to supply the planarizing material to the substrate 1 by an inkjet method. The supply unit 9 may include an inkjet tip, a tank for storing the planarizing material, and the like. By dropping the planarizing material by the supply unit 9 while moving the substrate 1 by the substrate driving unit 5, the planarizing material can be supplied to the substrate 1 with a desired distribution.

[0029] The alignment unit 10 is configured to be able to detect alignment marks formed on the substrate 1, and includes lighting, optical elements, a camera, etc. The alignment marks are detected while the substrate is held by the substrate holder 3. This improves the accuracy of the supply position of the planarizing material relative to the substrate 1.

[0030] The pre-alignment unit 20 has a camera 21 and measures the outer shape and notch of the substrate 1 mounted on the pre-alignment holder 23. From the measurement results of the outer shape of the substrate 1, the center coordinates (Xo1, Yo1) of the substrate 1 can be calculated as shown in FIG. 3(a). Furthermore, from the relationship between the center coordinates of the substrate 1 and the notch position, the rotation θZo1 of the substrate 1 about the Z axis shown in FIG. 3(a) can be calculated. Similarly, for the planarizing member 2, by measuring the outer shape and rotation position reference marks of the planarizing member 2 mounted on the pre-alignment holder 23, the center coordinates (Xo2, Yo2) of the planarizing member 2 and the rotation θZo2 about the Z axis can be determined as shown in FIG. 3(b). The pre-alignment unit 20 of the first embodiment further has a rotation drive unit 24, which can rotate the substrate 1 and the planarizing member 2 to a desired angle.

[0031] The control unit 11 is configured to be able to control each unit of the planarization apparatus 100, and includes a memory, a CPU, control software, and the like.

[0032] Next, the planarization process will be described with reference to Figure 4. First, a supply unit 9 supplies a planarization material PM to a substrate 1 on which an underlying pattern 1a has been formed (supply step). Figure 4(a) shows the state after the planarization material PM has been placed on the substrate 1 but before the planarization member 2 is brought into contact with it. Since the planarization material is supplied by an inkjet method, droplets are placed on the substrate. The density distribution of the droplets is determined according to the unevenness of the underlying pattern 1a.

[0033] Next, the planarizing material PM on the substrate 1 is brought into contact with the planarizing member 2. As the planarizing member 2 comes into contact with the planarizing material PM, the planarizing material PM spreads over the entire surface of the substrate 1. Figure 4(b) shows a state in which the entire surface of the planarizing member 2 comes into contact with the planarizing material PM on the substrate 1, and the planarizing member 2 conforms to the surface shape of the substrate 1 (contact process). In this state, the planarizing material PM is exposed to light by the curing unit 7, which hardens the planarizing material PM (hardening process). After that, the planarizing member 2 is separated from the hardened planarizing material PM on the substrate 1 (separation process).

[0034] 4(c) shows the substrate 1 after the planarizing member 2 has been pulled away. A first planarizing layer with improved flatness is formed over the entire surface of the substrate 1. However, when the planarizing material PM is hardened, the planarizing material PM shrinks in the thickness direction due to hardening shrinkage, and may not become completely flat.

[0035] To form a flatter planarization layer, it is advisable to supply additional planarization material PM onto the formed first planarization layer using the supply unit 9. Figure 4(d) shows the state in which additional planarization material PM has been supplied onto the formed planarization layer. The supply amount and supply distribution of the planarization material PM are different from those when the first planarization layer is formed. It is sufficient to supply only an amount of planarization material sufficient to flatten the irregularities on the surface of the first planarization layer.

[0036] Next, the planarizing member 2 is pressed against the planarizing material PM. Figure 4(e) shows the state in which the planarizing member 2 is pressed against the planarizing material PM. In this state, the planarizing material PM is exposed to light to harden the planarizing material PM. After that, the planarizing member 2 is separated from the planarizing material PM.

[0037] 4(f) shows the substrate 1 with the planarizing member 2 separated from the substrate. A second planarizing layer is formed on the first planarizing layer. In this way, by repeating the process of supplying the planarizing material and pressing the planarizing member multiple times, it is possible to improve the flatness more than with the first planarizing layer alone.

[0038] Although a planarization layer can be formed on the substrate 1 in this manner, for some reason, foreign matter or scratches may be found on the surface of the planarization member 2. If foreign matter is found on the planarization member, the shape of the foreign matter is transferred to the planarization layer formed on the substrate 1, as shown in FIG. 5(a). If the planarization member is scratched, the shape of the scratch is transferred to the planarization layer formed on the substrate 1, as shown in FIG. 5(b). In both cases of FIG. 5(a) and FIG. 5(b), the flatness of the planarization layer is reduced. Such a planarization layer may have adverse effects in post-planarization processes, such as reducing resolution in the exposure process of an exposure device, potentially resulting in defective chips.

[0039] To avoid this, it is necessary to prepare a planarizing member 2 that is sufficiently flat, but it is difficult to completely prevent scratches and foreign matter from occurring during the manufacturing process. Furthermore, as the planarizing member 2 is used, new scratches may appear or foreign matter may adhere to it. Therefore, the planarizing apparatus 100 of this embodiment aims to reduce the occurrence of defective chips due to scratches on the planarizing member 2 or the adhesion of foreign matter, and controls the relative position of the planarizing member 2 with respect to the substrate 1 so as to reduce the occurrence of defective chips due to scratches on the planarizing member 2 or the adhesion of foreign matter. Next, a method for controlling the relative position of the planarizing member 2 with respect to the substrate 1 will be described. Hereinafter, irregularities such as scratches and foreign matter on the surface of the planarizing member 2 will be referred to as "defects."

[0040] The control unit 11 of the planarizing apparatus 100 stores information about defects in the planarizing member 2 as defect information. FIG. 6(a) is a schematic diagram illustrating an example of defect information about the planarizing member 2. FIG. 6(b) illustrates the state in which the planarizing member 2 and the substrate 1 shown in FIG. 4(b) are in contact with each other via the planarizing material. In FIG. 6(b), 31 indicates a scribe line, which is one of the allowable regions that allow defects in the substrate 1, and 32 indicates a chip region of the substrate 1. In FIG. 6(b), a defect in the planarizing member 2 is located in the chip region of the substrate 1, which may result in a defective chip. Therefore, in the first embodiment, the relative position of the planarizing member 2 with respect to the substrate 1 is controlled so that the defect in the planarizing member 2 is positioned opposite the scribe line of the substrate 1, as shown in FIG. 6(c) or 6(d), thereby reducing the occurrence of defective chips due to defects in the planarizing member 2.

[0041] Next, a method for controlling the relative position of the flattening member 2 with respect to the substrate 1 will be described in more detail with reference to the flowchart of FIG.

[0042] In the first step (S1), information about the defect tolerance area of ​​the substrate 1 shown in FIG. 6(b) is stored in the control unit 11 of the planarization apparatus 100. The information about the defect tolerance area is stored in the format shown in Equation 1, for example, with the center of the substrate 1 as the origin. ε in Equation 1 represents the width of the scribe line. The defect tolerance area of ​​the substrate 1 includes the scribe line of the substrate 1, areas without a pattern, thick areas of a pattern where defects are tolerable, the outside of the wafer, etc.

[0043]

number

[0044] In a second step (S2), information about defects in the planarizing member 2 shown in FIG. 6(a) is stored in the control unit 11 of the planarizing apparatus 100. The information about defects in the planarizing member 2 is stored, for example, in the format shown in equation 2, with the center of the planarizing member 2 as the origin. The information about the defects in the planarizing member 2 may be obtained based on the defect measurement results of a substrate that was previously planarized using the planarizing member 2 being used this time, or may be obtained using the measurement results measured by a defect inspection device that can measure defects in the planarizing member 2.

[0045]

number

[0046] In the third step (S3), the control unit 11 calculates the rotation angle ΔθZ using equations 1 and 2 so that as many defects as possible in the flattening member 2 coincide with the defect tolerance area of ​​the substrate 1, as shown in FIG. 6(c).

[0047] In the fourth step (S4), the control unit 11 calculates minute movement amounts ΔX and ΔY of the planarizing member 2 in the X- and Y-axis directions relative to the substrate 1, as shown in FIG. 6(d), if this movement can move more defects on the planarizing member 2 into the defect tolerance area of ​​the substrate 1. The magnitudes of the minute movement amounts ΔX and ΔY can be set, for example, within the wafer edge exclusion (WEE) range of the wafer. As shown in FIG. 6(e), if the outer shape of the planarizing member 2 is larger than that of the substrate 1, the magnitudes of the minute movement amounts ΔX and ΔY can be set to be equal to or larger than the WEE of the substrate 1.

[0048] In a fifth step (S5), the flattening member 2 is mounted on the pre-alignment unit 12.

[0049] In a sixth step (S6), the outer shape and notch of the flattening member 2 are measured, and the central coordinates (Xo2, Yo2) of the flattening member 2 and its rotation around the Z axis (θZo2) are determined, as shown in FIG. 3(b).

[0050] In a seventh step (S7), the flattening member 2 is rotated by the rotation mechanism 14 around the Z axis by ΔθZ-θZo2.

[0051] In an eighth step (S8), the flattening member 2 is mounted by the transport hand 15 onto the flattening member holder 4, offset by ΔX-Xo2 in the X-axis direction and ΔY-Yo2 in the Y-axis direction.

[0052] In a ninth step (S9), the substrate 1 is mounted on the pre-alignment unit 12.

[0053] In a tenth step (S10), the outer shape and notch of the substrate 1 are measured, and the central coordinates (Xo1, Yo1) of the substrate 1 and its rotation around the Z axis (θZo1) are determined, as shown in FIG. 3(a).

[0054] In an eleventh step (S11), the substrate 1 is rotated by the rotation mechanism 14 around the Z axis by −θZo1.

[0055] In a twelfth step (S12), substrate 1 is mounted by transfer hand 15 onto substrate holder 4, offset by −Xo1 in the X-axis direction and −Yo2 in the Y-axis direction.

[0056] In a thirteenth step (S13), the planarization process shown in FIG. 4 is performed.

[0057] In a fourteenth step (S14), the substrate 1 is carried out from the planarization apparatus 100.

[0058] In the fifteenth step (S15), if there are a plurality of substrates 1 to be planarized, the ninth step (S9) to the fourteenth step (S14) are repeated.

[0059] According to the above flow, the planarization process of the substrate 1 can be performed so that defects in the planarization member 2 fall within the defect tolerance range of the substrate 1.

[0060] As described above, according to the first embodiment, by adjusting the relative position of the planarizing member with respect to the substrate so that at least one defect in the planarizing member faces the allowable area of ​​the substrate based on information about defects in the planarizing member and information about the allowable area for allowing defects in the substrate, it is possible to perform the planarization process for the substrate 1 so that defects in the planarizing member 2 fall within the defect allowable area of ​​the substrate 1, thereby reducing the occurrence of defective chips due to defects in the planarizing member 2. Furthermore, in the third step (S3), calculation conditions may be set for the defects in the planarizing member so that at least the defect with the largest area faces the defect allowable area of ​​the substrate.

[0061] Second Embodiment In the first embodiment, in the eighth step (S8), the planarizing member 2 is mounted on the planarizing member holding unit 4 taking into account the minute movement amounts ΔX and ΔY. The planarizing apparatus 100 of the first embodiment has a substrate driving unit 5 that can drive the substrate holding unit 3 carrying the substrate 1 in the X-axis and Y-axis directions. Therefore, in the second embodiment, the planarizing member 2 is mounted on the planarizing member holding unit 4 in the eighth step (S8) without taking into account the minute movement amounts ΔX and ΔY, and then, in the planarization process of the thirteenth step (S13), the substrate driving unit 5 is driven to move the substrate 1 by −ΔX and −ΔY from the normal planarization position to perform the planarization process.

[0062] Third Embodiment 8, the planarizing apparatus 100 shown in the third embodiment further includes a planarizing member horizontal drive unit 51 on the planarizing member holding unit 4 that drives the planarizing member 2 in the X-axis direction, the Y-axis direction, and around the Z-axis. In the first embodiment, in the seventh step (S7) and the eighth step (S8), the planarizing member 2 is mounted on the planarizing member holding unit 4 taking into consideration the rotation angle ΔθZ and the minute movement amounts ΔX and ΔY. In the seventh step (S7) and the eighth step (S8), the planarizing member 2 is mounted on the planarizing member holding unit 4 without considering the rotation angle ΔθZ and the minute movement amounts ΔX and ΔY. In the planarizing process of the thirteenth step (S13), the planarizing member horizontal drive unit 51 is driven to move the planarizing member 2 from the normal planarizing position by ΔθZ around the Z-axis, by ΔX in the X-axis direction, and by ΔY in the Y-axis direction to perform the planarizing process.

[0063] According to the embodiment described above, the occurrence of defective chips due to defects in the planarizing member 2 can be reduced.

[0064] <Embodiment of an article manufacturing method> Next, a method for manufacturing an article (such as a semiconductor IC element, a liquid crystal display element, a color filter, or an MEMS) using the planarization apparatus described above will be described. This manufacturing method includes a step of planarizing a composition disposed on a substrate (such as a wafer or glass substrate) using a film-forming apparatus as the planarization apparatus described above, and a step of curing the composition. This results in a planarization film being formed on the substrate. The substrate on which the planarization film has been formed is then processed, such as by forming a pattern using a lithography apparatus, and the processed substrate is then processed in other well-known processing steps to manufacture the article. These other well-known steps include patterning exposure and associated pre-processing, etching, resist stripping, dicing, bonding, packaging, and the like. This manufacturing method enables the manufacture of higher-quality articles than conventional methods.

[0065] That is, the following forms can be mentioned.

[0066] (Form 1) 1. A planarization apparatus for forming a planarization layer on a substrate by contacting a planarization member with a planarization material on the substrate, comprising: a drive unit that moves the planarizing member and the substrate relatively; a control unit that controls the drive unit, The control unit controls the relative position of the planarizing member with respect to the substrate based on information about defects in the planarizing member and information about an allowable range in which defects in the substrate are allowed.

[0067] (Form 2) 2. The planarizing apparatus according to claim 1, wherein the control unit controls a relative position of the planarizing member with respect to the substrate so that at least one defect of the planarizing member faces the allowable region of the substrate.

[0068] (Form 3) The planarization apparatus according to embodiment 2, wherein the control unit controls the relative position of the planarization member with respect to the substrate along the θ axis so that at least one defect of the planarization member faces the allowable region of the substrate.

[0069] (Form 4) The planarization apparatus according to embodiment 2 or 3, wherein the control unit controls the relative position of the planarization member with respect to the substrate in the θ-axis, X-axis, and Y-axis directions so that at least one defect of the planarization member faces the allowable region of the substrate.

[0070] (Form 5) 5. The planarization apparatus according to claim 2, wherein the control unit controls the relative position of the planarization member with respect to the substrate along the X-axis and the Y-axis so that at least one defect of the planarization member faces the allowable region of the substrate.

[0071] (Form 6) 6. The planarizing apparatus according to any one of embodiments 1 to 5, wherein the control unit further controls the relative position of the planarizing member with respect to the substrate based on information about the marks on the planarizing member.

[0072] (Form 7) The planarizing member has a T7 mark according to the SEMI standard, 7. The planarizing apparatus according to claim 6, wherein the control unit controls the relative position of the planarizing member with respect to the substrate with respect to the θZ axis by referring to a T7 mark of the SEMI standard.

[0073] (Form 8) the planarizing member having a notch; 8. The planarizing apparatus according to claim 6, wherein the control unit controls the relative position of the planarizing member with respect to the substrate along the θZ axis by referring to the notch.

[0074] (Form 9) The planarization apparatus according to any one of embodiments 2 to 8, wherein the control unit controls the relative position of the planarization member with respect to the substrate in the X-axis and Y-axis within a WEE range of the substrate so that at least one defect of the planarization member faces the allowable region of the substrate.

[0075] (Form 10) A planarization apparatus according to any one of embodiments 2 to 9, wherein the control unit controls the relative position of the planarization member with respect to the substrate so that the defect with the largest area on the planarization member faces the allowable area of ​​the substrate.

[0076] (Form 11) 11. The planarization apparatus according to any one of claims 1 to 10, wherein the information regarding defects of the planarization member is information obtained based on information regarding defects of the substrate planarized using the planarization member.

[0077] (Form 12) 12. The planarizing apparatus according to any one of aspects 1 to 11, wherein the information regarding the defects of the planarizing member is information regarding the defects of the planarizing member acquired by a defect inspection device.

[0078] (Form 13) 1. A planarization method for forming a planarization layer on a substrate by contacting a planarization member with a planarization material on the substrate, comprising: adjusting a relative position of the planarizing member with respect to the substrate based on information about the defects of the planarizing member and information about an allowable region that allows defects of the substrate, so that at least one defect of the planarizing member faces the allowable region of the substrate; A planarization method comprising:

[0079] (Form 14) forming a planarization layer on a substrate according to the planarization method of embodiment 13; a step of processing the substrate on which the planarization layer has been formed in the step; and manufacturing an article from the processed substrate.

[0080] (Form 15) forming a planarization layer on a substrate using the planarization apparatus according to any one of aspects 1 to 11; a step of processing the substrate on which the planarization layer has been formed in the step; and manufacturing an article from the processed substrate.

[0081] Although several preferred embodiments of the present invention have been described above, these embodiments of the present invention have been described by way of example only and do not limit the scope of the present invention. Possible embodiments can be implemented in various forms. Changes in size, position, content omission, substitution, or shape can be made within the spirit of the present invention. These changes are within the scope and spirit of the invention, and are also included in the scope of the invention described in the claims. [Explanation of symbols]

[0082] 1 board 1a Base pattern 2 Flattening member 3 Board holding part 4 Flattening member holder 5 Board drive unit 6 Flattening member drive unit 7 Hardened part 8 Pressure adjustment section 9 Supply section 10 Alignment section 11 Control section 12 SEMI standard T7 mark 13 notches 20 Pre-alignment section 21 Camera 22 Transport hand 23 Pre-alignment holder 24 Rotation drive unit 51 Flattening member horizontal drive unit 100 Flattening device PM planarization materials PL1 First Planarization Layer PL2 Second Planarization Layer

Claims

1. 1. A planarization apparatus for forming a planarization layer on a substrate by contacting a planarization member with a planarization material on the substrate, comprising: a drive unit that moves the planarizing member and the substrate relatively; a control unit that controls the drive unit, The control unit controls the relative position of the planarizing member with respect to the substrate based on information about defects in the planarizing member and information about an allowable range in which defects in the substrate are allowed.

2. The planarizing apparatus according to claim 1 , wherein the control unit controls the relative position of the planarizing member with respect to the substrate so that at least one defect of the planarizing member faces the allowable region of the substrate.

3. The planarizing apparatus according to claim 2 , wherein the control unit controls the relative position of the planarizing member with respect to the substrate along the θ axis so that at least one defect of the planarizing member faces the allowable region of the substrate.

4. 3. The planarization apparatus according to claim 2, wherein the control unit controls the relative position of the planarization member with respect to the substrate in the θ-axis, X-axis, and Y-axis directions so that at least one defect of the planarization member faces the allowable region of the substrate.

5. The planarizing apparatus according to claim 2 , wherein the control unit controls the relative position of the planarizing member with respect to the substrate along the X-axis and the Y-axis so that at least one defect of the planarizing member faces the allowable region of the substrate.

6. The planarizing apparatus according to claim 1 , wherein the control unit further controls the relative position of the planarizing member with respect to the substrate based on information of the mark on the planarizing member.

7. the flattening member has a T7 mark according to the SEMI standard; 7. The planarizing apparatus according to claim 6, wherein the control unit controls the relative position of the planarizing member with respect to the substrate along the θZ axis by referring to a T7 mark of the SEMI standard.

8. the planarizing member having a notch; The planarizing apparatus according to claim 6 , wherein the control unit controls the relative position of the planarizing member with respect to the substrate along the θZ axis by referring to the notch.

9. 3. The planarization apparatus according to claim 2, wherein the control unit controls a relative position of the planarization member with respect to the substrate in the X-axis and Y-axis directions within a WEE range of the substrate so that at least one defect of the planarization member faces the allowable region of the substrate.

10. The planarizing apparatus according to claim 2 , wherein the control unit controls the relative position of the planarizing member with respect to the substrate so that the defect with the largest area on the planarizing member faces the allowable region of the substrate.

11. 2. The planarizing apparatus according to claim 1, wherein the information about defects in the planarizing member is information obtained based on information about defects in the substrate planarized using the planarizing member.

12. 2. The planarizing apparatus according to claim 1, wherein the information about the defects of the planarizing member is information about the defects of the planarizing member obtained by a defect inspection device.

13. 1. A planarization method for forming a planarization layer on a substrate by contacting a planarization member with a planarization material on the substrate, comprising: adjusting a relative position of the planarizing member with respect to the substrate based on information about the defects of the planarizing member and information about an allowable region that allows the defects of the substrate so that at least one defect of the planarizing member faces the allowable region of the substrate; A planarization method comprising:

14. forming a planarization layer on a substrate according to the planarization method of claim 13; a step of processing the substrate on which the planarization layer has been formed in the step; and manufacturing an article from the processed substrate.

15. forming a planarization layer on a substrate using the planarization apparatus according to any one of claims 1 to 11; a step of processing the substrate on which the planarization layer has been formed in the step; and manufacturing an article from the processed substrate.

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