Reinforced film

Abstract

To provide a reinforced film capable of expressing excellent transportation property when transporting an adherend, and capable of easily expressing removal by peeling in a reinforcement-unnecessary area, and retention of adhesion in a reinforcement-necessary area after transportation for example.SOLUTION: In a reinforced film according to an embodiment of the present invention, one or more adhesive films A including an adhesive layer A2 constituted by a substrate layer A1 and an adhesive a2, and one or more adhesive films B including an adhesive layer B2 constituted by a substrate layer B1 and an adhesive b2 are laminated by an arrangement with distance on a carrier film C including an adhesive layer C2 constituted by a substrate layer C1 and an adhesive layer c2, the substrate layer A1 and the substrate layer B1 are directly laminated on the adhesive layer C2, and the adhesive layer a2, the adhesive layer b2, and the adhesive layer c2 satisfy a specific condition.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to a reinforced film. [Background technology]

[0002] When joining an integrated circuit or a flexible printed circuit board to a substrate of a semiconductor element, thermocompression bonding is usually performed using an anisotropic conductive film. It is known that before such thermocompression bonding, a reinforcing film is attached to the back side of the substrate of the semiconductor element to reinforce it (for example, Patent Document 1).

[0003] Recently, it has become known that a reinforcing film is attached to the back side (the side opposite to the viewing side) of an optical component constituting an image display panel included in an image display device in order to prevent damage to the optical component during the manufacturing process (for example, Patent Document 2).

[0004] However, when a reinforcing film is attached to the back side of an optical component, there are problems such as a decrease in the accuracy of optical inspection performed through the reinforcing film, and an increase in the thickness of the product (e.g., an image display panel).

[0005] To avoid the above problems, it is conceivable to attach a reinforcing film to the optical component during transportation in the manufacturing process and then peel off the reinforcing film before optical inspection. However, depending on the type of optical component, there are some reinforcement areas where the reinforcing film should remain, such as areas where thermocompression bonding such as IC bonding is performed. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Patent No. 5600039 [Patent Document 2] Patent No. 6376271 Summary of the Invention [Problem to be solved by the invention]

[0007] The object of the present invention is to provide a reinforcing film that is used by being attached to an adherend such as an optical component, and that exhibits good transportability when the adherend is transported, and that, for example, after transport, can easily be peeled off and removed in areas where reinforcement is not required, while maintaining adhesion in areas where reinforcement is required. [Means for solving the problem]

[0008] [1] The reinforced film according to an embodiment of the present invention is A reinforcing film in which one or more adhesive films A and one or more adhesive films B are laminated on a carrier film C in a gap-like arrangement, The PSA film A includes a base layer A1 and a PSA layer A2 composed of a PSA a2, The PSA film B includes a base layer B1 and a PSA layer B2 composed of a PSA b2, The carrier film C includes a base layer C1 and a pressure-sensitive adhesive layer C2 composed of a pressure-sensitive adhesive c2, the base material layer A1 and the base material layer B1 are directly laminated on the pressure-sensitive adhesive layer C2, Meet one of the following conditions (1) to (4). (1) The adhesive strength of adhesive a2 is smaller than that of adhesive b2, and adhesive c2 is adhesive X whose adhesive strength increases upon irradiation with active energy rays. (2) The adhesive strength of adhesive a2 is smaller than that of adhesive b2, and adhesive c2 is adhesive Y whose adhesive strength decreases upon irradiation with active energy rays. (3) The adhesive strength of adhesive c2 is smaller than that of adhesive b2, and adhesive a2 is adhesive Y whose adhesive strength decreases upon irradiation with active energy rays. (4) The adhesive a2 is adhesive Y whose adhesive strength decreases when irradiated with active energy rays, and the adhesive b2 is adhesive X whose adhesive strength increases when irradiated with active energy rays. However, the above adhesive strength is measured against a glass plate at a peeling speed of 300 mm / min and a peeling angle of 180 degrees in an environment of a temperature of 23°C and a humidity of 50% RH. [2] In the reinforced film according to the above [1], the pressure-sensitive adhesive X may be formed from an acrylic pressure-sensitive adhesive composition x, and the acrylic pressure-sensitive adhesive composition x may contain an acrylic polymer P1, a crosslinking agent, a photocuring agent, and a photopolymerization initiator. [3] In the reinforcing film described in [1] or [2] above, the adhesive Y may be an adhesive Y1 formed from a urethane-based adhesive composition y1, and the urethane-based adhesive composition y1 may contain a urethane prepolymer P2 having a polymerizable unsaturated double bond, a crosslinking agent, a urethane (meth)acrylate, and a photopolymerization initiator. [4] In the reinforced film described in [1] or [2] above, the adhesive Y may be an adhesive Y2 formed from an acrylic adhesive composition y2, and the acrylic adhesive composition y2 may contain an acrylic polymer P3 having one polymerizable unsaturated double bond in a side chain, a crosslinking agent, and a photopolymerization initiator. [5] In the reinforcing film according to any one of the above items [1] to [4], the pressure-sensitive adhesive layer A2 and the pressure-sensitive adhesive layer B2 may be attached to an optical member. [Effects of the Invention]

[0009] According to the present invention, it is possible to provide a reinforcing film that is used by being attached to an adherend such as an optical component, and that exhibits good transportability when the adherend is transported, and that, for example, after transport, can easily be peeled off and removed in areas where reinforcement is not required, and can maintain adhesion in areas where reinforcement is required. [Brief explanation of the drawings]

[0010] [Figure 1] 1 is a schematic cross-sectional view of a reinforced film according to one embodiment of the present invention. [Figure 2] 1 is a schematic plan view of a reinforcing film according to one embodiment of the present invention. [Figure 3]FIG. 1 is a schematic explanatory view of a reinforcing film according to a first embodiment. [Figure 4] FIG. 10 is a schematic explanatory view of a reinforcing film according to a second embodiment. [Figure 5] FIG. 10 is a schematic explanatory view of a reinforcing film according to a third embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0011] When the expression "weight" appears in this specification, it may be read as "mass," which is a commonly used SI unit indicating weight.

[0012] In this specification, the term "(meth)acrylic" means "acrylic and / or methacrylic", the term "(meth)acrylate" means "acrylate and / or methacrylate", the term "(meth)allyl" means "allyl and / or methallyl", and the term "(meth)acrolein" means "acrolein and / or methacrolein".

[0013] The term "alkyl group" as used herein is a concept that also encompasses cycloalkyl groups (e.g., cyclopentyl and cyclohexyl groups). Furthermore, the term "alkyl group" as used herein may be a linear or branched alkyl group.

[0014] As used herein, the term "active energy rays" refers to energy rays having energy capable of inducing chemical reactions such as polymerization reactions, crosslinking reactions, and decomposition of initiators, and examples thereof include ultraviolet rays, visible light, infrared rays, α rays, β rays, γ rays, electron beams, neutron beams, and X-rays.

[0015] As used herein, the term "weight average molecular weight" refers to a value obtained by measurement using gel permeation chromatography (GPC), and can be calculated in terms of standard polystyrene using, for example, a GPC measurement device under the trade name "HLC-8220GPC" (manufactured by Tosoh Corporation).

[0016] <<A. Reinforcing film>> The reinforcing film according to the embodiment of the present invention has one or more adhesive films A and one or more adhesive films B laminated on a carrier film C in a gap-like arrangement.

[0017] The number of adhesive films A laminated on the carrier film C can be any appropriate number, as long as it is at least 1 and does not impair the effects of the present invention. The number of such adhesive films A is, for example, 1 to 10, or may be 1 to 5, or may be 1 to 3.

[0018] The number of adhesive films B laminated on the carrier film C may be any appropriate number at least one, as long as the effects of the present invention are not impaired. The number of such adhesive films B is, for example, 1 to 10, or may be 1 to 5, or may be 1 to 3.

[0019] The adhesive film A includes a base layer A1 and an adhesive layer A2 composed of an adhesive a2.

[0020] The adhesive film B includes a base layer B1 and an adhesive layer B2 composed of an adhesive b2.

[0021] The carrier film C includes a base layer C1 and an adhesive layer C2 composed of an adhesive c2. The base layer A1 and the base layer B1 are directly laminated on the adhesive layer C2.

[0022] A common release liner may be provided on the surface of the pressure-sensitive adhesive layer A2 of the pressure-sensitive adhesive film A and the surface of the pressure-sensitive adhesive layer B2 of the pressure-sensitive adhesive film B. When the reinforced film according to an embodiment of the present invention includes a release liner, the reinforced film according to an embodiment of the present invention can typically be attached to an adherend (e.g., an optical member) to which it is to be attached, with the exposed pressure-sensitive adhesive layer (pressure-sensitive adhesive layer A2 and pressure-sensitive adhesive layer B2) after peeling off the release liner.

[0023] A schematic cross-sectional view of a reinforced film according to one embodiment of the present invention is shown in Figure 1. Figure 1 shows an embodiment in which one adhesive film A and one adhesive film B are arranged with a gap between one release liner D and one carrier film C. In the reinforced film (1000) shown in Figure 1, adhesive films A (300A) and B (300B) are arranged with a gap L between one release liner D (100) and one carrier film C (200). Adhesive film A (300A) includes a base layer A1 (10A) and a pressure-sensitive adhesive layer A2 (20A). Adhesive film B (300B) includes a base layer B1 (10B) and a pressure-sensitive adhesive layer B2 (20B). Carrier film C (200) includes a base layer C1 (10C) and a pressure-sensitive adhesive layer C2 (20C). The base material layer A1 (10A) and the base material layer B1 (10B) are laminated directly on the pressure-sensitive adhesive layer C2 (20C).

[0024] The distance L may be any distance greater than 0 mm, and is preferably 0.1 mm to 5.0 mm, more preferably 0.2 mm to 3.0 mm, even more preferably 0.3 mm to 2.0 mm, particularly preferably 0.5 mm to 1.5 mm, and most preferably 0.7 mm to 1.5 mm.

[0025] The reinforcing film according to an embodiment of the present invention may be arranged in any appropriate manner as long as the effects of the present invention are not impaired, as long as one or more PSA films A and one or more PSA films B are laminated on a carrier film C in a gap-like arrangement. That is, one or more PSA films A and one or more PSA films B may be laminated in a gap-like arrangement corresponding to the arrangement of each part depending on the required properties of the part of the adherend (e.g., optical component) to be bonded.

[0026] The reinforcing film according to the embodiment of the present invention may have any appropriate other layer within a range that does not impair the effects of the present invention. The other layer may be one type only, or two or more types. Examples of the other layer include the release liner described above and the antistatic layer described below.

[0027] Figure 2 is a schematic plan view of one embodiment of the reinforced film of the present invention. More specifically, Figure 2 is a schematic plan view of an embodiment of the reinforced film in which one adhesive film A and one adhesive film B are laminated on one carrier film C in an arrangement with a gap therebetween, as viewed from the side of the adhesive film A and the adhesive film B. In the reinforced film (1000) shown in Figure 2, one adhesive film A (300A) and one adhesive film B (300B) are arranged on one carrier film C (200) with a gap L therebetween.

[0028] The area of ​​adhesive film A (or the total area if there are multiple adhesive films A) and the area of ​​adhesive film B (or the total area if there are multiple adhesive films B) can be appropriately set to correspond to the arrangement of each part, depending on the required characteristics of the part of the adherend (e.g., optical component) to be bonded.

[0029] The reinforced film according to the embodiment of the present invention is typically used by bonding the pressure-sensitive adhesive layer A2 and the pressure-sensitive adhesive layer B2 to an adherend (e.g., an optical member). When the reinforced film according to the embodiment of the present invention includes a release liner, the release liner is typically peeled off, and then the exposed pressure-sensitive adhesive layer A2 and the pressure-sensitive adhesive layer B2 are bonded to an adherend (e.g., an optical member).

[0030] The reinforced film according to the embodiment of the present invention can be used in various applications. The reinforced film according to the embodiment of the present invention can be attached to various adherends. Examples of such adherends include electronic devices, optical devices, and components thereof. A reinforced film according to one preferred embodiment of the present invention is a reinforced film for optical components.

[0031] The reinforced film according to an embodiment of the present invention satisfies any one of the following (1) to (4). By satisfying any one of these, the reinforced film according to an embodiment of the present invention can exhibit good transportability when transporting an adherend, and can, for example, easily peel and remove areas that do not require reinforcement after transport and maintain adhesion in areas that require reinforcement. (1) The adhesive strength of adhesive a2 is smaller than that of adhesive b2, and adhesive c2 is adhesive X whose adhesive strength increases upon irradiation with active energy rays. (2) The adhesive strength of adhesive a2 is smaller than that of adhesive b2, and adhesive c2 is adhesive Y whose adhesive strength decreases upon irradiation with active energy rays. (3) The adhesive strength of adhesive c2 is smaller than that of adhesive b2, and adhesive a2 is adhesive Y whose adhesive strength decreases upon irradiation with active energy rays. (4) The adhesive a2 is adhesive Y whose adhesive strength decreases when irradiated with active energy rays, and the adhesive b2 is adhesive X whose adhesive strength increases when irradiated with active energy rays.

[0032] The adhesive strength is measured against a glass plate at a peel speed of 300 mm / min and a peel angle of 180° in an environment of a temperature of 23° C. and a humidity of 50% RH. Details of the measurement method will be described later.

[0033] A-1. First Embodiment When the reinforcing film of the present invention is an embodiment (referred to as embodiment 1) that satisfies the above (1), the adhesive strength of adhesive a2 constituting adhesive layer A2 is less than the adhesive strength of adhesive b2 constituting adhesive layer B2, and adhesive c2 constituting adhesive layer C2 is adhesive X whose adhesive strength increases when irradiated with active energy rays.

[0034] Embodiment 1 will be described using Figure 3. (a) of Figure 3 is a schematic cross-sectional view of a laminate (2000) in which the reinforced film of the present invention in embodiment 1 is bonded to an adherend. In (a) of Figure 3, the reinforced film (1000) is a carrier film C (200) including a base layer C1 (10C) and a pressure-sensitive adhesive layer C2 (20C), and on this carrier film C (200), one pressure-sensitive adhesive film A (300A) including a base layer A1 (10A) and a pressure-sensitive adhesive layer A2 (20A) and one pressure-sensitive adhesive film B (300B) including a base layer B1 (10B) and a pressure-sensitive adhesive layer B2 (20B) are arranged with a gap L between them. The pressure-sensitive adhesive layer A2 (20A) and the pressure-sensitive adhesive layer B2 (20B) of the reinforced film (1000) are bonded to the adherend (3000).

[0035] In the laminate (2000) shown in Figure 3 (a), adhesive film A (300A) is maintained in adhesion to the adherend (3000) by adhesive layer A2 (20A), and adhesive film B (300B) is maintained in adhesion to the adherend (3000) by adhesive layer B2 (20B), and carrier film C (200) is maintained in adhesion to base layer A1 (10A) of adhesive film A (300A) and base layer B1 (10B) of adhesive film B (300B) by adhesive layer C2 (20C), so this laminate (2000) can exhibit good transportability as is.

[0036] Next, as shown in (b) of FIG. 3, active energy rays (5000) are irradiated from the side of the carrier film C(200) to the area where the adhesive film A(300A) is laminated, while preventing irradiation to the area where the adhesive film B(300B) is laminated by a shielding plate (4000) or the like. Then, the adhesive c2 constituting the adhesive layer C2(20C) is an adhesive X whose adhesive force increases by irradiation with active energy rays. Therefore, the adhesive force of the area (20Ca) where the adhesive film A(300A) of the adhesive layer C2(20C) is laminated increases by irradiation with active energy rays. As a result, as shown in (c) of FIG. 3, the carrier film C(200) and the adhesive film A(300A) can be integrally and favorably peeled off and removed from the laminate of the adherent (3000) and the adhesive film B(300B). On the other hand, the adhesive film B(300B) is adhesively maintained on the adherent (3000).

[0037] As described above, according to the reinforcing film of the present invention in Embodiment 1, good transportability can be exhibited during the transport of the adherent. For example, after transport, peeling and removal in an area where reinforcement is not required (in the example of FIG. 3, the area where the adhesive film A(300A) is laminated) and adhesive maintenance in an area where reinforcement is required (in the example of FIG. 3, the area where the adhesive film B(300B) is laminated) can be easily achieved.

[0038] In Embodiment 1, assuming that the adhesive force of the adhesive a2 is PA, the adhesive force of the adhesive b2 is PB, the adhesive force of the adhesive c2 (=adhesive X) before irradiation with active energy rays is PC1, and the adhesive force of the adhesive c2 (=adhesive X) after irradiation with active energy rays is PC2, then PC1 < PC2. In terms of making the above peeling and removal smoother, PA < PC2 may be satisfied, or PC1 < PB may be satisfied.

[0039] As a specific example of Embodiment 1, there is an embodiment in which the adhesive a2 is a lightly peeling acrylic adhesive Z1, the adhesive b2 is a heavily peeling acrylic adhesive Z2, and the adhesive c2 is an adhesive X whose adhesive force increases by irradiation with active energy rays.

[0040] A-2. Second Embodiment When the reinforcing film of the present invention is an embodiment (referred to as embodiment 2) that satisfies the above (2), the adhesive strength of adhesive a2 constituting adhesive layer A2 is less than the adhesive strength of adhesive b2 constituting adhesive layer B2, and adhesive c2 constituting adhesive layer C2 is adhesive Y whose adhesive strength decreases when irradiated with active energy rays.

[0041] Embodiment 2 will be described with reference to Figure 4. Figure 4(a) is a schematic cross-sectional view of a laminate (2000) in which the reinforced film of the present invention in embodiment 2 is bonded to an adherend. In Figure 4(a), the reinforced film (1000) is a carrier film C (200) including a base layer C1 (10C) and a pressure-sensitive adhesive layer C2 (20C), on which one pressure-sensitive adhesive film A (300A) including a base layer A1 (10A) and a pressure-sensitive adhesive layer A2 (20A) and one pressure-sensitive adhesive film B (300B) including a base layer B1 (10B) and a pressure-sensitive adhesive layer B2 (20B) are arranged with a gap L. The pressure-sensitive adhesive layer A2 (20A) and pressure-sensitive adhesive layer B2 (20B) of the reinforced film (1000) are bonded to the adherend (3000).

[0042] In the laminate (2000) shown in Figure 4 (a), adhesive film A (300A) is maintained in adhesion to the adherend (3000) by adhesive layer A2 (20A), and adhesive film B (300B) is maintained in adhesion to the adherend (3000) by adhesive layer B2 (20B), and carrier film C (200) is maintained in adhesion to base layer A1 (10A) of adhesive film A (300A) and base layer B1 (10B) of adhesive film B (300B) by adhesive layer C2 (20C), so this laminate (2000) can exhibit good transportability as is.

[0043] Next, as shown in (b) of FIG. 4, active energy rays (5000) are irradiated from the side of the carrier film C(200) to the area where the adhesive film B(300B) is laminated, while being shielded from the area where the adhesive film A(300A) is laminated by a shielding plate (4000) or the like. Then, since the adhesive c2 constituting the adhesive layer C2(20C) is the adhesive Y whose adhesive force decreases by irradiation with active energy rays, the area (20Cb) where the adhesive film B(300B) of the adhesive layer C2(20C) is laminated has its adhesive force decreased by irradiation with active energy rays. As a result, as shown in (c) of FIG. 4, the carrier film C(200) and the adhesive film A(300A) can be integrally and favorably peeled off and removed from the laminate of the adherent (3000) and the adhesive film B(300B), while the adhesive film B(300B) remains adhered to the adherent (3000).

[0044] As described above, according to the reinforcing film of the present invention in Embodiment 2, good transportability can be exhibited during the transport of the adherent. For example, after transport, peeling and removal in an area where reinforcement is not required (the area where the adhesive film A(300A) is laminated in the example of FIG. 4) and adhesion maintenance in an area where reinforcement is required (the area where the adhesive film B(300B) is laminated in the example of FIG. 4) can be easily achieved.

[0045] In Embodiment 2, when the adhesive force of the adhesive a2 is PA, the adhesive force of the adhesive b2 is PB, the adhesive force of the adhesive c2(=adhesive Y) before irradiation with active energy rays is PC1, and the adhesive force of the adhesive c2(=adhesive Y) after irradiation with active energy rays is PC2, then PC2 < PC1. In terms of making the above peeling and removal smoother, PA < PC1 may be satisfied, or PC2 < PB may be satisfied.

[0046] As a specific example of Embodiment 2, there is an embodiment in which the adhesive a2 is a lightly peeling acrylic adhesive Z1, the adhesive b2 is a heavily peeling acrylic adhesive Z2, and the adhesive c2 is an adhesive Y whose adhesive force decreases by irradiation with active energy rays.

[0047] A-3. Third Embodiment When the reinforcing film of the present invention is an embodiment (referred to as embodiment 3) that satisfies the above (3), the adhesive strength of adhesive c2 constituting adhesive layer C2 is less than the adhesive strength of adhesive b2 constituting adhesive layer B2, and adhesive a2 constituting adhesive layer A2 is adhesive Y whose adhesive strength decreases when irradiated with active energy rays.

[0048] Embodiment 3 will be described using Figure 5. Figure 5(a) is a schematic cross-sectional view of a laminate (2000) in which the reinforced film of the present invention in embodiment 3 is bonded to an adherend. In Figure 5(a), the reinforced film (1000) is a carrier film C (200) including a base layer C1 (10C) and a pressure-sensitive adhesive layer C2 (20C), on which one pressure-sensitive adhesive film A (300A) including a base layer A1 (10A) and a pressure-sensitive adhesive layer A2 (20A) and one pressure-sensitive adhesive film B (300B) including a base layer B1 (10B) and a pressure-sensitive adhesive layer B2 (20B) are arranged with a gap L. The pressure-sensitive adhesive layer A2 (20A) and pressure-sensitive adhesive layer B2 (20B) of the reinforced film (1000) are bonded to the adherend (3000).

[0049] In the laminate (2000) shown in Figure 5 (a), adhesive film A (300A) is maintained in adhesion to the adherend (3000) by adhesive layer A2 (20A), and adhesive film B (300B) is maintained in adhesion to the adherend (3000) by adhesive layer B2 (20B), and carrier film C (200) is maintained in adhesion to base layer A1 (10A) of adhesive film A (300A) and base layer B1 (10B) of adhesive film B (300B) by adhesive layer C2 (20C), so this laminate (2000) can exhibit good transportability as is.

[0050] Next, as shown in (b) of FIG. 5, active energy rays (5000) are irradiated from the side of the carrier film C (200). When this is done, the adhesive a2 that constitutes the adhesive layer A2 (20A) is the adhesive Y whose adhesive force decreases by being irradiated with active energy rays. Therefore, the adhesive force of the adhesive layer A2 (20A) decreases by being irradiated with active energy rays. As a result, as shown in (c) of FIG. 5, the carrier film C (200) and the adhesive film A (300A) are integrated, and can be peeled off and removed well from the laminate of the adherend (3000) and the adhesive film B (300B). On the other hand, the adhesive film B (300B) is adhesively maintained on the adherend (3000).

[0051] As described above, according to the reinforcing film of the present invention in Embodiment 3, good transportability can be exhibited during the transport of the adherend. For example, after transport, in an area where reinforcement is not required (the area where the adhesive film A (300A) is laminated in the example of FIG. 5), peeling and removal can be easily achieved, and in an area where reinforcement is required (the area where the adhesive film B (300B) is laminated in the example of FIG. 5), adhesive maintenance can be easily achieved.

[0052] In Embodiment 3, when the adhesive force of the adhesive a2 (=adhesive Y) before irradiation with active energy rays is PA1, the adhesive force of the adhesive a2 (=adhesive Y) after irradiation with active energy rays is PA2, the adhesive force of the adhesive b2 is PB, and the adhesive force of the adhesive c2 is PC, then PA2 < PA1, and in terms of making the above peeling and removal smoother, PA1 < PC may be satisfied, or PC < PB may be satisfied.

[0053] As a specific example of Embodiment 3, there is an embodiment in which the adhesive a2 is the adhesive Y whose adhesive force decreases by being irradiated with active energy rays, the adhesive b2 is the double-peelable acrylic adhesive Z2, and the adhesive c2 is the light-peelable acrylic adhesive Z1.

[0054] ≪A-4. Embodiment 4≫ When the reinforcing film of the present invention is an embodiment (referred to as embodiment 4) that satisfies the above (4), the adhesive a2 constituting the adhesive layer A2 is adhesive Y whose adhesive strength decreases when irradiated with active energy rays, and the adhesive b2 constituting the adhesive layer B2 is adhesive X whose adhesive strength increases when irradiated with active energy rays.

[0055] Embodiment 4 can be explained with reference to FIG. 5, which was used to explain Embodiment 3. To explain Embodiment 4, FIG. 5(a) is a schematic cross-sectional view of a laminate (2000) in which the reinforced film of the present invention in Embodiment 4 is bonded to an adherend. In FIG. 5(a), the reinforced film (1000) is a carrier film C (200) including a base layer C1 (10C) and a pressure-sensitive adhesive layer C2 (20C), on which one pressure-sensitive adhesive film A (300A) including a base layer A1 (10A) and a pressure-sensitive adhesive layer A2 (20A) and one pressure-sensitive adhesive film B (300B) including a base layer B1 (10B) and a pressure-sensitive adhesive layer B2 (20B) are arranged with a gap L. The pressure-sensitive adhesive layer A2 (20A) and the pressure-sensitive adhesive layer B2 (20B) of the reinforced film (1000) are bonded to the adherend (3000).

[0056] In the laminate (2000) shown in Figure 5 (a), adhesive film A (300A) is maintained in adhesion to the adherend (3000) by adhesive layer A2 (20A), and adhesive film B (300B) is maintained in adhesion to the adherend (3000) by adhesive layer B2 (20B), and carrier film C (200) is maintained in adhesion to base layer A1 (10A) of adhesive film A (300A) and base layer B1 (10B) of adhesive film B (300B) by adhesive layer C2 (20C), so this laminate (2000) can exhibit good transportability as is.

[0057] Next, as shown in (b) of FIG. 5, active energy rays are irradiated from the side of the carrier film C(200) (arrow in the figure). Then, since the adhesive a2 constituting the adhesive layer A2(20A) is an adhesive Y whose adhesive force decreases by irradiation with active energy rays, the adhesive force of the adhesive layer A2(20A) decreases by irradiation with active energy rays. Further, since the adhesive b2 constituting the adhesive layer B2(20B) is an adhesive X whose adhesive force increases by irradiation with active energy rays, the adhesive force of the adhesive layer B2(20B) increases by irradiation with active energy rays. As a result, as shown in (c) of FIG. 5, the carrier film C(200) and the adhesive film A(300A) can be integrally and favorably peeled off and removed from the laminate of the adherend(3000) and the adhesive film B(300B). On the other hand, the adhesive film B(300B) is adhesively maintained on the adherend(3000).

[0058] As described above, according to the reinforcing film of the present invention in Embodiment 4, good transportability can be exhibited during the transport of the adherend. For example, after transport, peeling and removal in an area where reinforcement is not required (the area where the adhesive film A(300A) is laminated in the example of FIG. 5) and adhesive maintenance in an area where reinforcement is required (the area where the adhesive film B(300B) is laminated in the example of FIG. 5) can be easily achieved.

[0059] In Embodiment 4, when the adhesive force of the adhesive a2(=adhesive Y) before irradiation with active energy rays is PA1, the adhesive force of the adhesive a2(=adhesive Y) after irradiation with active energy rays is PA2, the adhesive force of the adhesive b2(=adhesive X) before irradiation with active energy rays is PB1, the adhesive force of the adhesive b2(=adhesive X) after irradiation with active energy rays is PB2, and the adhesive force of the adhesive c2 is PC, then PA2 < PA1, PB1 < PB2, and in terms of making the above peeling and removal smoother, PA2 < PC may be satisfied, or PC < PB2 may be satisfied.

[0060] A specific example of embodiment 4 is an embodiment in which adhesive a2 is adhesive Y whose adhesive strength decreases when irradiated with active energy rays, adhesive b2 is adhesive X whose adhesive strength increases when irradiated with active energy rays, and adhesive c2 is light-release acrylic adhesive Z1.

[0061] <A-5. Adhesive X> The adhesive X is an adhesive whose adhesive strength increases upon irradiation with active energy rays. Any appropriate adhesive can be used as the adhesive X as long as the effects of the present invention are not impaired. Examples of such adhesive X include the adhesives described in Japanese Patent No. 6599039, such as an adhesive formed from an acrylic adhesive composition x, which contains an acrylic polymer P1, a crosslinking agent, a photocuring agent, and a photopolymerization initiator.

[0062] Any appropriate method can be adopted as the method for forming the pressure-sensitive adhesive X as long as it does not impair the effects of the present invention. Examples of methods for forming such pressure-sensitive adhesive X include a method (direct method) in which an acrylic pressure-sensitive adhesive composition x is applied to any appropriate substrate, heated or dried as necessary, and cured as necessary, to form a sheet of pressure-sensitive adhesive X on the substrate, and a method (transfer method) in which an acrylic pressure-sensitive adhesive composition x is applied to an appropriate substrate such as a release paper, heated or dried as necessary, and cured as necessary, to form a pressure-sensitive adhesive layer composed of pressure-sensitive adhesive X on the substrate, and then transferred the formed pressure-sensitive adhesive layer onto any appropriate substrate.

[0063] Any appropriate means can be used to apply the acrylic pressure-sensitive adhesive composition x as long as it does not impair the effects of the present invention. Examples of such application means include roll coating, gravure roll coating, kiss roll coating, and bar coating.

[0064] The heating and drying of the acrylic adhesive composition x can employ any appropriate means as long as the effects of the present invention are not impaired. Examples of such heating and drying means include heating to 60°C to 180°C, or performing an aging treatment at a temperature around room temperature, for example.

[0065] The curing of the acrylic adhesive composition x can employ any appropriate means as long as the effects of the present invention are not impaired. Examples of such curing means include heat, ultraviolet irradiation, laser beam irradiation, alpha-ray irradiation, beta-ray irradiation, gamma-ray irradiation, X-ray irradiation, and electron beam irradiation.

[0066] <A-5-1. Acrylic polymer P1> The content ratio of the acrylic polymer P1 in the acrylic adhesive composition x is preferably 50% to 99.999% by weight, more preferably 60% to 99.99% by weight, still more preferably 65% to 99.9% by weight, particularly preferably 70% to 99% by weight, and most preferably 72% to 95% by weight in terms of solid content. If the content ratio of the acrylic polymer P1 in the acrylic adhesive composition x is within the above range in terms of solid content, the effects of the present invention can be more effectively expressed.

[0067] As the acrylic polymer P1 in the acrylic adhesive composition x, any appropriate acrylic polymer can be employed as long as the effects of the present invention are not impaired. The acrylic polymer P1 may be only one kind or two or more kinds.

[0068] The weight average molecular weight of the acrylic polymer P1 can be any appropriate weight average molecular weight as long as the effects of the present invention are not impaired. In terms of more effectively expressing the effects of the present invention, it is preferably 300,000 to 2,500,000, more preferably 350,000 to 2,000,000, still more preferably 400,000 to 1,800,000, and particularly preferably 500,000 to 1,500,000.

[0069] The acrylic polymer P1 is preferably an acrylic polymer formed by polymerization from a composition (I) containing: (component a) a (meth)acrylic acid alkyl ester in which the alkyl group in the alkyl ester moiety has 4 to 12 carbon atoms; and (component b) at least one selected from the group consisting of a (meth)acrylic acid ester having a hydroxyl group and (meth)acrylic acid, in order to more effectively exhibit the effects of the present invention.

[0070] The component a and the component b may each independently be one type or two or more types.

[0071] As the (meth)acrylic acid alkyl ester (component a) in which the alkyl group in the alkyl ester moiety has 4 to 12 carbon atoms, n-butyl (meth)acrylate and 2-ethylhexyl (meth)acrylate are preferred, and n-butyl acrylate and 2-ethylhexyl acrylate are more preferred, in terms of being able to further exhibit the effects of the present invention.

[0072] As the at least one member (component b) selected from the group consisting of (meth)acrylic acid esters having a hydroxyl group and (meth)acrylic acid, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, and (meth)acrylic acid are preferred, and 2-hydroxyethyl acrylate, 4-hydroxybutyl acrylate, and acrylic acid are more preferred, in terms of being able to further exhibit the effects of the present invention.

[0073] The composition (I) may contain a copolymerizable monomer (component c) other than the components a and b. The copolymerizable monomer (component c) may be of one type only, or of two or more types. Examples of such copolymerizable monomers (component c) include (meth)acrylic acid alkyl esters in which the alkyl group in the alkyl ester moiety has 1 to 3 carbon atoms; (meth)acrylic acid alkyl esters in which the alkyl group in the alkyl ester moiety has 13 to 20 carbon atoms; carboxyl group-containing monomers such as itaconic acid, maleic acid, fumaric acid, crotonic acid, isocrotonic acid, and acid anhydrides thereof (excluding (meth)acrylic acid); amide group-containing monomers such as (meth)acrylamide, N,N-dimethyl(meth)acrylamide, N-methylol(meth)acrylamide, N-methoxymethyl(meth)acrylamide, N-butoxymethyl(meth)acrylamide, and N-hydroxyethyl(meth)acrylamide; amino group-containing monomers such as aminoethyl (meth)acrylate, dimethylaminoethyl (meth)acrylate, and t-butylaminoethyl (meth)acrylate; N-vinyl-2-pyrrolidone, (meth)acryloylmorpholine, N-vinylpiperidone, N-vinylpiperazine, and N-vinyl Heterocycle-containing monomers such as methylpyrrole, N-vinylimidazole, vinylpyridine, vinylpyrimidine, and vinyloxazole; aromatic ring-containing (meth)acrylates such as phenyl (meth)acrylate, phenoxyethyl (meth)acrylate, benzyl (meth)acrylate, phenoxybenzyl (meth)acrylate (e.g., m-phenoxybenzyl (meth)acrylate), thiophenoxybenzyl (meth)acrylate, and benzyl benzyl (meth)acrylate; 2-methoxyethyl ( (meth)acrylic acid alkoxyalkyl esters such as 2-(2-ethoxyethoxy)ethyl (meth)acrylate, 2-ethoxyethyl (meth)acrylate, 2-(2-ethoxyethoxy)ethyl (meth)acrylate, methoxytriethylene glycol (meth)acrylate, methoxypolyethylene glycol (meth)acrylate, 3-methoxypropyl (meth)acrylate, 3-methoxypropyl (meth)acrylate, 4-methoxybutyl (meth)acrylate, and 4-ethoxybutyl (meth)acrylate.

[0074] The content of component a in all monomers contained in composition (I) is, for example, 10% by weight or more, preferably 20% by weight or more, more preferably 30% by weight or more, even more preferably 50% to 99% by weight, and particularly preferably 60% to 98% by weight, in order to further exhibit the effects of the present invention. In one embodiment, the content of component a in all monomers contained in composition (I) is even more preferably 70% to 97% by weight, especially preferably 80% to 97% by weight, and most preferably 88% to 96% by weight. In another embodiment, the content of component a in all monomers contained in composition (I) is even more preferably 50% to 90% by weight, especially preferably 50% to 80% by weight, and most preferably 50% to 70% by weight.

[0075] The content of component b in all monomers contained in composition (I) is, for example, 0.1% by weight or more, preferably 0.3% by weight to 30% by weight, more preferably 0.5% by weight to 20% by weight, even more preferably 0.8% by weight to 17% by weight, and particularly preferably 1.0% by weight to 14% by weight, in order to further exhibit the effects of the present invention.

[0076] The content of component c in all monomers contained in composition (I) is, for example, 0% by weight to 80% by weight, preferably 0% by weight to 50% by weight, more preferably 0% by weight to 40% by weight, even more preferably 0% by weight to 30% by weight, particularly preferably 0% by weight to 20% by weight, and most preferably 0% by weight to 10% by weight, in order to further exhibit the effects of the present invention.

[0077] In one embodiment, composition (I) may contain, as component c, the aforementioned (meth)acrylic acid alkyl ester in which the alkyl group in the alkyl ester moiety has 1 to 3 carbon atoms. When composition (I) contains such a (meth)acrylic acid alkyl ester in which the alkyl group in the alkyl ester moiety has 1 to 3 carbon atoms, the content of such a (meth)acrylic acid alkyl ester in which the alkyl group in the alkyl ester moiety has 1 to 3 carbon atoms in all monomers contained in composition (I) is preferably 0.1% by weight or more, more preferably 0.1% by weight to 40% by weight, even more preferably 0.5% by weight to 30% by weight, and particularly preferably 1% by weight to 20% by weight.

[0078] In one embodiment, composition (I) may contain the heterocycle-containing monomer as component c. When composition (I) contains such a heterocycle-containing monomer, the content of such a heterocycle-containing monomer in all monomers contained in composition (I) is preferably 0.1 wt % or more, more preferably 0.1 wt % to 30 wt %, even more preferably 0.5 wt % to 25 wt %, and particularly preferably 1 wt % to 20 wt %.

[0079] Composition (I) may contain any appropriate other components as long as the effects of the present invention are not impaired. Examples of such other components include a polymerization initiator, a chain transfer agent, and a solvent. The content ratio of the other components in composition (I) may be any appropriate content ratio as long as the effects of the present invention are not impaired.

[0080] The polymerization initiator may be, for example, a thermal polymerization initiator or a photopolymerization initiator (photoinitiator), depending on the type of polymerization reaction. The polymerization initiator may be one type only, or two or more types.

[0081] The thermal polymerization initiator is preferably used when the acrylic polymer P1 is obtained by solution polymerization. The thermal polymerization initiator may be one kind or two or more kinds.

[0082] Any suitable thermal polymerization initiator may be used as the thermal polymerization initiator as long as it does not impair the effects of the present invention. Examples of such thermal polymerization initiators include azo polymerization initiators, peroxide polymerization initiators (e.g., dibenzoyl peroxide, tert-butyl permaleate), and redox polymerization initiators. Among these thermal polymerization initiators, the azo polymerization initiators disclosed in JP-A-2002-69411 are particularly preferred. Such azo polymerization initiators are preferred because decomposition products of the polymerization initiator are less likely to remain in the acrylic polymer as moieties that cause outgassing upon heating. Examples of azo polymerization initiators include 2,2'-azobisisobutyronitrile (hereinafter sometimes referred to as AIBN) and 2,2'-azobis-2-methylbutyronitrile (hereinafter sometimes referred to as AMBN).

[0083] The photopolymerization initiator is preferably used when the acrylic polymer P1 is obtained by active energy ray polymerization. The photopolymerization initiator may be used alone or in combination of two or more kinds.

[0084] As the photopolymerization initiator, any appropriate photopolymerization initiator can be used as long as it does not impair the effects of the present invention. Examples of such photopolymerization initiators include benzoin ether-based photopolymerization initiators, acetophenone-based photopolymerization initiators, α-ketol-based photopolymerization initiators, aromatic sulfonyl chloride-based photopolymerization initiators, photoactive oxime-based photopolymerization initiators, benzoin-based photopolymerization initiators, benzyl-based photopolymerization initiators, benzophenone-based photopolymerization initiators, ketal-based photopolymerization initiators, and thioxanthone-based photopolymerization initiators.

[0085] Examples of benzoin ether-based photopolymerization initiators include benzoin methyl ether, benzoin ethyl ether, benzoin propyl ether, benzoin isopropyl ether, benzoin isobutyl ether, 2,2-dimethoxy-1,2-diphenylethan-1-one, and anisole methyl ether. Examples of acetophenone-based photopolymerization initiators include 2,2-diethoxyacetophenone, 2,2-dimethoxy-2-phenylacetophenone (e.g., Omnirad 651, manufactured by IGM Resins BV), 1-hydroxycyclohexyl phenyl ketone (e.g., Omnirad 184, manufactured by IGM Resins BV), 4-phenoxydichloroacetophenone, and 4-(t-butyl)dichloroacetophenone. Examples of α-ketol-based photopolymerization initiators include 2-methyl-2-hydroxypropiophenone and 1-[4-(2-hydroxyethyl)phenyl]-2-methylpropan-1-one. Examples of aromatic sulfonyl chloride photopolymerization initiators include 2-naphthalenesulfonyl chloride. Examples of photoactive oxime photopolymerization initiators include 1-phenyl-1,1-propanedione-2-(o-ethoxycarbonyl)-oxime. Examples of benzoin photopolymerization initiators include benzoin. Examples of benzyl photopolymerization initiators include benzil. Examples of benzophenone photopolymerization initiators include benzophenone, benzoylbenzoic acid, 3,3'-dimethyl-4-methoxybenzophenone, polyvinylbenzophenone, and α-hydroxycyclohexylphenyl ketone. Examples of ketal photopolymerization initiators include benzil dimethyl ketal. Examples of the thioxanthone-based photopolymerization initiator include thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone, 2,4-dimethylthioxanthone, isopropylthioxanthone, 2,4-diisopropylthioxanthone, and dodecylthioxanthone.

[0086] As the chain transfer agent, known chain transfer agents can be used, and the chain transfer agent may be one kind or two or more kinds.

[0087] Any appropriate solvent can be used as the solvent as long as it does not impair the effects of the present invention. Examples of such solvents include organic solvents such as esters such as ethyl acetate and n-butyl acetate; aromatic hydrocarbons such as toluene and benzene; aliphatic hydrocarbons such as n-hexane and n-heptane; alicyclic hydrocarbons such as cyclohexane and methylcyclohexane; and ketones such as methyl ethyl ketone and methyl isobutyl ketone. Only one type of solvent may be used, or two or more types may be used.

[0088] The acrylic polymer P1 can be produced by any appropriate polymerization method as long as the effects of the present invention are not impaired. Polymerization methods that can be used to polymerize the acrylic polymer P1 include, for example, solution polymerization, emulsion polymerization, bulk polymerization, and active energy ray polymerization using ultraviolet or other radiation. Representative examples include solution polymerization and active energy ray polymerization, with solution polymerization being preferred. The monomer supply method used in solution polymerization can be appropriately selected from a batch feed method in which the entire amount of the monomer components is supplied at once, a continuous feed (dropping) method, a divided feed (dropping) method, and the like. The polymerization temperature can be appropriately selected depending on the types of monomers and solvents used, the type of polymerization initiator, and the like, and is preferably 20°C to 160°C, more preferably 30°C to 140°C, even more preferably 40°C to 120°C, and particularly preferably 50°C to 100°C. The polymerization time can be appropriately selected depending on the types of monomers and solvents used, the type of polymerization initiator, and the like, and is preferably 1 hour to 24 hours, more preferably 1 hour to 12 hours.

[0089] The amount of the polymerization initiator used may be any appropriate amount as long as it does not impair the effects of the present invention. The amount of such a polymerization initiator used is, for example, preferably 0.01 to 15% by weight based on the total amount of all monomers contained in composition (I).

[0090] The amount of the chain transfer agent used can be any appropriate amount as long as the effects of the present invention are not impaired. Such an amount is, for example, preferably 0.01% by weight to 15% by weight based on the total amount of all monomers contained in the composition (I).

[0091] <A-5-2. Crosslinking agent> The acrylic adhesive composition x typically contains a crosslinking agent. The crosslinking agent may be only one type or two or more types.

[0092] The content ratio of the crosslinking agent in the acrylic adhesive composition x can be any appropriate content ratio as long as the effects of the present invention are not impaired. Such a content ratio is preferably 0.005 parts by weight to 20 parts by weight, more preferably 0.01 parts by weight to 10 parts by weight, still more preferably 0.01 parts by weight to 5 parts by weight, particularly preferably 0.05 parts by weight to 4 parts by weight, and most preferably 0.08 parts by weight to 3 parts by weight, based on the solid content (100 parts by weight) of the acrylic polymer P1 in terms of more effectively expressing the effects of the present invention.

[0093] Examples of the crosslinking agent include polyfunctional isocyanate-based crosslinking agents, epoxy-based crosslinking agents, melamine-based crosslinking agents, peroxide-based crosslinking agents, as well as urea-based crosslinking agents, metal alkoxide-based crosslinking agents, metal chelate-based crosslinking agents, metal salt-based crosslinking agents, carbodiimide-based crosslinking agents, oxazoline-based crosslinking agents, aziridine-based crosslinking agents, and amine-based crosslinking agents. Among these, in terms of more effectively expressing the effects of the present invention, it is preferably at least one selected from the group consisting of polyfunctional isocyanate-based crosslinking agents and epoxy-based crosslinking agents.

[0094] As the polyfunctional isocyanate-based crosslinking agent, a compound having two or more isocyanate groups (including isocyanate-regenerating polar groups in which the isocyanate group is temporarily protected by a blocking agent or oligomerization, etc.) in one molecule can be used. Specific examples of the polyfunctional isocyanate crosslinking agent include lower aliphatic polyisocyanates such as butylene diisocyanate and hexamethylene diisocyanate; alicyclic isocyanates such as cyclopentylene diisocyanate, cyclohexylene diisocyanate and isophorone diisocyanate; aromatic diisocyanates such as 2,4-tolylene diisocyanate, 4,4'-diphenylmethane diisocyanate, xylylene diisocyanate and polymethylene polyphenyl isocyanate; trimethylolpropane / tolylene diisocyanate trimer adduct (for example, manufactured by Mitsui Chemicals, Inc., trade name: Takenate D101E), trimethylolpropane / hexamethylene diisocyanate trimer adduct (for example, manufactured by Tosoh Corporation, trade name: Coronate HL), and isocyanurates of hexamethylene diisocyanate (for example, Examples of suitable polyisocyanates include isocyanate adducts such as those manufactured by Tosoh Corporation under the trade name of Coronate HX; trimethylolpropane adducts of xylylene diisocyanate (for example, Mitsui Chemicals, Inc., trade name: Takenate D110N), trimethylolpropane adducts of xylylene diisocyanate (for example, Mitsui Chemicals, Inc., trade name: Takenate D120N), trimethylolpropane adducts of isophorone diisocyanate (for example, Mitsui Chemicals, Inc., trade name: Takenate D140N), and trimethylolpropane adducts of hexamethylene diisocyanate (for example, Mitsui Chemicals, Inc., trade name: Takenate D160N); polyether polyisocyanates, polyester polyisocyanates, and adducts of these with various polyols; and polyisocyanates multifunctionalized with isocyanurate bonds, biuret bonds, allophanate bonds, etc.

[0095] Examples of epoxy crosslinking agents (polyfunctional epoxy compounds) include N,N,N’,N’-tetraglycidyl-m-xylenediamine, diglycidylaniline, 1,3-bis(N,N-diglycidylaminomethyl)cyclohexane, 1,6-hexanediol diglycidyl ether, neopentyl glycol diglycidyl ether, ethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, polyethylene glycol diglycidyl ether, polypropylene glycol diglycidyl ether, sorbitol polyglycidyl ether, glycerol polyglycidyl ether, pentaerythritol polyglycidyl ether, polyglycerol polyglycidyl ether, sorbitan polyglycidyl ether, trimethylolpropane polyglycidyl ether, adipic acid diglycidyl ester, o-phthalic acid diglycidyl ester, triglycidyl-tris(2-hydroxyethyl)isocyanurate, resorcin diglycidyl ether, bisphenol-S-diglycidyl ether, and epoxy resins having two or more epoxy groups in the molecule. Commercially available products such as the product named "Tetrad C" (manufactured by Mitsubishi Gas Chemical Company, Inc.) can also be used as the epoxy crosslinking agent.

[0096] <A-5-3. Crosslinking Catalyst> The acrylic adhesive composition x may contain a crosslinking catalyst. The crosslinking catalyst may be only one type or two or more types.

[0097] The content ratio of the crosslinking catalyst in the acrylic adhesive composition x can be any appropriate content ratio as long as the effects of the present invention are not impaired. Such a content ratio is preferably 0.0001 parts by weight to 1 part by weight with respect to the solid content (100 parts by weight) of the acrylic polymer P1 in terms of more effectively expressing the effects of the present invention.

[0098] As the crosslinking catalyst, any appropriate crosslinking catalyst can be employed as long as the effects of the present invention are not impaired. Examples of the crosslinking catalyst include metal-based crosslinking catalysts such as tetra-n-butyl titanate, tetra-isopropyl titanate, zirconium tetraacetylacetonate, iron diacetylacetonate, iron trisacetylacetonate (ferric acetylacetonate), butyltin oxide, dioctyltin dilaurate, and the like.

[0099] <A-5-4. Photoinitiator> Typically, the acrylic adhesive composition x contains a photoinitiator. The photoinitiator may be only one kind or two or more kinds.

[0100] Examples of the photoinitiator include photocurable monomers and photocurable oligomers. As the photoinitiator, a compound having two or more ethylenically unsaturated bonds in one molecule is preferable.

[0101] The photoinitiator is preferably a compound that shows compatibility with the acrylic polymer P1. In this regard, a compound that is liquid at room temperature is preferable. Also, the compatibility between the acrylic polymer P1 and the photoinitiator depends on the molecular weight of the compound, and the smaller the molecular weight, the higher the tendency of compatibility with the acrylic polymer P1. Therefore, the molecular weight of the photoinitiator is preferably 1500 or less, more preferably 1000 or less.

[0102] The photocuring agent is preferably a polyfunctional (meth)acrylate. Examples of the polyfunctional (meth)acrylate include polyethylene glycol di(meth)acrylate, polypropylene glycol di(meth)acrylate, polytetramethylene glycol di(meth)acrylate, bisphenol A ethylene oxide modified di(meth)acrylate, bisphenol A propylene oxide modified di(meth)acrylate, alkanediol di(meth)acrylate, tricyclodecane dimethanol di(meth)acrylate, ethoxylated isocyanuric acid tri(meth)acrylate, pentaerythritol tri(meth)acrylate, and pentaerythritol di(meth)acrylate. acrylate, trimethylolpropane tri(meth)acrylate, ditrimethylolpropane tetra(meth)acrylate, ethoxylated pentaerythritol tetra(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol poly(meth)acrylate, dipentaerythritol hexa(meth)acrylate, neopentyl glycol di(meth)acrylate, glycerin di(meth)acrylate, urethane (meth)acrylate, epoxy (meth)acrylate, butadiene (meth)acrylate, isoprene (meth)acrylate.

[0103] The functional group equivalent (g / eq) of the photocuring agent is preferably 100-500, more preferably 120-450, still more preferably 140-450, and particularly preferably 150-450.

[0104] The content of the photocuring agent in the acrylic pressure-sensitive adhesive composition x may be any appropriate content ratio within a range that does not impair the effects of the present invention. In order to further exhibit the effects of the present invention, the content ratio is preferably 1 to 100 parts by weight, more preferably 3 to 70 parts by weight, even more preferably 5 to 50 parts by weight, particularly preferably 7 to 40 parts by weight, and most preferably 10 to 35 parts by weight, relative to the solid content (100 parts by weight) of the acrylic polymer P1.

[0105] <A-5-5. Photoinitiator> Typically, the acrylic adhesive composition x contains a photoinitiator. The photoinitiator may be only one kind or two or more kinds.

[0106] As the photoinitiator, any appropriate photoinitiator can be adopted as long as the effects of the present invention are not impaired. Examples of such photoinitiators include those exemplified in the section of <A-5-1. Acrylic polymer P1>.

[0107] The content ratio of the photoinitiator in the acrylic adhesive composition x can be any appropriate content ratio as long as the effects of the present invention are not impaired. Such a content ratio is preferably 0.02 parts by weight to 10 parts by weight, more preferably 0.05 parts by weight to 5 parts by weight, based on the solid content (100 parts by weight) of the acrylic polymer P1, in terms of more effectively expressing the effects of the present invention.

[0108] <A-5-6. Other components> The acrylic adhesive composition x may contain any appropriate other components as long as the effects of the present invention are not impaired. Examples of such other components include other polymer components, crosslinking retardants, silane coupling agents, tackifying resins (rosin derivatives, polyterpene resins, petroleum resins, oil-soluble phenols, etc.), fatty acid esters, silicone-based additives, anti-aging agents, inorganic fillers, organic fillers, metal powders, colorants (pigments, dyes, etc.), foil-like materials, ultraviolet absorbers, antioxidants, light stabilizers, plasticizers, softeners, surfactants, antistatic agents, conductive agents, stabilizers, surface lubricants, leveling agents, corrosion inhibitors, heat stabilizers, polymerization inhibitors, lubricants, and catalysts. The other components may be only one kind or two or more kinds.

[0109] The content ratio of the other components in the acrylic adhesive composition x is preferably 0 parts by weight to 40 parts by weight, more preferably 0 parts by weight to 30 parts by weight, and even more preferably 0 parts by weight to 20 parts by weight, based on the solid content (100 parts by weight) of the acrylic polymer P1.

[0110] <<A-6. Adhesive Y>> Adhesive Y is an adhesive whose adhesive force decreases upon irradiation with active energy rays. As Adhesive Y, any appropriate adhesive can be employed as long as it is an adhesive whose adhesive force decreases upon irradiation with active energy rays, without impairing the effects of the present invention.

[0111] As one embodiment of Adhesive Y, for example, there is Adhesive Y1 formed from a urethane-based adhesive composition y1, where the urethane-based adhesive composition y1 includes a urethane prepolymer P2 having a polymerizable unsaturated double bond, a crosslinking agent, urethane (meth)acrylate, and a photopolymerization initiator.

[0112] As another embodiment of Adhesive Y, there is an adhesive described in JP-A-2010-53346, which is Adhesive Y2 formed from an acrylic-based adhesive composition y2, where the acrylic-based adhesive composition y2 includes an acrylic polymer P3 having one polymerizable unsaturated double bond in its side chain, a crosslinking agent, and a photopolymerization initiator.

[0113] <A-6-1. Adhesive Y1>

[0114] As a method for forming Adhesive Y1, any appropriate method can be adopted without impairing the effects of the present invention. Such methods for forming Adhesive Y1 include, for example, a method (direct method) of applying the urethane-based adhesive composition y1 onto an arbitrary appropriate substrate, heating or drying as necessary, and curing as necessary to form Adhesive Y1 in sheet form on the substrate, and a method (transfer method) of applying the urethane-based adhesive composition y1 onto an appropriate substrate such as release paper, heating or drying as necessary, and curing as necessary to form an adhesive layer composed of Adhesive Y1 on the substrate, and then transferring the formed adhesive layer onto an arbitrary appropriate substrate.

[0115] With regard to the means for applying the urethane-based pressure-sensitive adhesive composition y1, the heating or drying of the urethane-based pressure-sensitive adhesive composition y1, and the curing of the urethane-based pressure-sensitive adhesive composition y1, the explanations for the means for applying the acrylic pressure-sensitive adhesive composition x, the heating or drying of the acrylic pressure-sensitive adhesive composition x, and the curing of the acrylic pressure-sensitive adhesive composition x in Section <A-5. Pressure-sensitive adhesive X> may be cited.

[0116] [A-6-1-a. Urethane prepolymer P2] The urethane prepolymer P2 corresponds to a polymer component generally called a base polymer as a component of the urethane-based pressure-sensitive adhesive composition y1. The urethane prepolymer P2 may be of only one type, or may be of two or more types.

[0117] The content of the urethane prepolymer P2 in the urethane pressure-sensitive adhesive composition y1 is preferably 50% by weight to 99.9% by weight, more preferably 55% by weight to 95% by weight, and even more preferably 60% by weight to 90% by weight, calculated as solids. When the content of the urethane prepolymer P2 in the urethane pressure-sensitive adhesive composition y1 is within the above range, calculated as solids, the effects of the present invention can be more effectively exhibited.

[0118] The urethane prepolymer P2 can typically react with a crosslinking agent (preferably a polyfunctional isocyanate compound) to form a urethane polymer. More specifically, a urethane polymer can be formed from a urethane pressure-sensitive adhesive composition y1 containing the urethane prepolymer P2 and a crosslinking agent, and more specifically, a urethane polymer can be formed by curing the urethane pressure-sensitive adhesive composition y1 containing the urethane prepolymer P2 and a crosslinking agent. As a method for forming a urethane polymer by curing the urethane pressure-sensitive adhesive composition y1 containing the urethane prepolymer P2 and a crosslinking agent, any appropriate method can be used as long as it does not impair the effects of the present invention, such as a urethanization reaction method using bulk polymerization or solution polymerization.

[0119] As is generally well known, there are two types of manufacturing methods for urethane polymers: the "one-shot method," in which a urethane polymer is manufactured by directly reacting a polyol with a crosslinking agent (preferably a polyfunctional isocyanate compound) without using a urethane prepolymer, and the "prepolymer method," in which a urethane polymer is manufactured by reacting a urethane prepolymer with a crosslinking agent (preferably a polyfunctional isocyanate compound). The urethane prepolymer P2 refers to the urethane prepolymer that is reacted with a crosslinking agent (preferably a polyfunctional isocyanate compound) in the "prepolymer method," and is distinguished from the polyol that is reacted with a polyfunctional isocyanate in the "one-shot method."

[0120] The number average molecular weight Mn of the urethane prepolymer P2 is preferably 3,000 to 1,000,000.

[0121] The urethane prepolymer P2 has a polymerizable unsaturated double bond, such as a vinyl group, a (meth)allyl group, or a (meth)acryloyl group.

[0122] The urethane prepolymer P2 is preferably a polyurethane polyol.

[0123] The urethane prepolymer P2 is preferably a polymer obtained by reacting a composition (II) containing a polyol, a compound having a polymerizable unsaturated double bond, and a crosslinking agent (preferably a polyfunctional isocyanate compound). This reaction may be carried out in the presence or absence of a catalyst. The "polyol" mentioned above is a polyol that does not contain a polymerizable unsaturated double bond. Therefore, a compound having a polymerizable unsaturated double bond and multiple hydroxyl groups is distinguished from the "polyol" referred to herein and is considered to fall under the category of a "compound having a polymerizable unsaturated double bond."

[0124] The polyol preferably contains at least one selected from the group consisting of polyester polyols (a1) and polyether polyols (a2). The polyester polyols (a1) may be of one type or two or more types. The polyether polyols (a2) may be of one type or two or more types.

[0125] The polyol content in the above composition (II) for preparing the urethane prepolymer P2 is preferably 50% by weight to 99% by weight, more preferably 60% by weight to 98% by weight, even more preferably 70% by weight to 97% by weight, particularly preferably 80% by weight to 96% by weight, and most preferably 85% by weight to 95% by weight, calculated on a solid content basis.

[0126] The content of at least one selected from the group consisting of polyester polyol (a1) and polyether polyol (a2) in the polyol is preferably 50% by weight to 100% by weight, more preferably 70% by weight to 100% by weight, even more preferably 80% by weight to 100% by weight, particularly preferably 90% by weight to 100% by weight, and most preferably 95% by weight to 100% by weight.

[0127] As the polyester polyol (a1), polyester polyols that can be normally used in the production of urethane prepolymers can be appropriately used.

[0128] The molecular weight of the polyester polyol (a1) may range from low to high. The number average molecular weight Mn of the polyester polyol (a1) is preferably 100 to 100,000, and more preferably 100 to 10,000.

[0129] As the polyether polyol (a2), any polyether polyol that can be normally used in the production of urethane prepolymers can be appropriately used.

[0130] The molecular weight of the polyether polyol (a2) may range from low to high. The number average molecular weight Mn of the polyether polyol (a2) is preferably 100 to 100,000, and more preferably 100 to 10,000.

[0131] As the polyether polyol (a2), only a bifunctional polyether polyol may be used, or a polyether polyol having a number average molecular weight Mn of 100 to 100,000 and at least three hydroxyl groups in one molecule may be used in part or in whole.

[0132] One embodiment of the polyol is embodiment (A) which includes both a polyester polyol (a1) and a polyether polyol (a2).

[0133] In embodiment (A), the content of polyester polyol (a1) in the polyol is preferably 0.1% by weight to 99.9% by weight, more preferably 0.1% by weight to 80% by weight, even more preferably 0.2% by weight to 60% by weight, still more preferably 0.2% by weight to 40% by weight, particularly preferably 0.3% by weight to 30% by weight, and most preferably 0.3% by weight to 20% by weight.

[0134] In embodiment (A), the content of the polyether polyol (a2) in the polyol is preferably 0.1% by weight to 99.9% by weight, more preferably 20% by weight to 99.9% by weight, even more preferably 40% by weight to 99.8% by weight, still more preferably 60% by weight to 99.8% by weight, particularly preferably 70% by weight to 99.7% by weight, and most preferably 80% by weight to 99.7% by weight.

[0135] Another embodiment of the polyol is embodiment (B) which does not contain polyester polyol (a1) but contains polyether polyol (a2). In embodiment (B), the polyol typically consists of polyether polyol (a2).

[0136] In embodiment (B), the content of the polyether polyol (a2) in the polyol is preferably 50% by weight to 100% by weight, more preferably 70% by weight to 100% by weight, even more preferably 90% by weight to 100% by weight, particularly preferably 95% by weight to 100% by weight, and most preferably 98% by weight to 100% by weight.

[0137] The content of the compound having a polymerizable unsaturated double bond in composition (II) is preferably 0.01 to 50 parts by weight, more preferably 0.1 to 30 parts by weight, relative to 100 parts by weight of polyol, in order to further exhibit the effects of the present invention.

[0138] As the crosslinking agent, any appropriate crosslinking agent can be used as long as it can be used in the production of a urethane prepolymer and does not impair the effects of the present invention. Such a crosslinking agent is preferably a polyfunctional isocyanate compound. The polyfunctional isocyanate compound may be used alone or in combination of two or more types.

[0139] Any appropriate polyfunctional isocyanate compound can be used as the polyfunctional isocyanate compound as long as it does not impair the effects of the present invention. Examples of such polyfunctional isocyanate compounds include polyfunctional aliphatic isocyanate compounds, polyfunctional alicyclic isocyanates, polyfunctional aromatic isocyanate compounds, and polyfunctional aromatic-aliphatic isocyanate compounds.

[0140] The amount of crosslinking agent that can be used to obtain urethane prepolymer P2 is preferably 0.001 to 50 parts by weight, more preferably 0.01 to 30 parts by weight, even more preferably 0.1 to 20 parts by weight, particularly preferably 1 to 15 parts by weight, and most preferably 4 to 12 parts by weight, relative to 100 parts by weight of polyol.

[0141] A catalyst may be used when preparing the urethane prepolymer P2. Any appropriate catalyst may be used when preparing the urethane prepolymer P2. Examples of such catalysts include tertiary amine compounds and organometallic compounds. Only one type of catalyst may be used, or two or more types may be used.

[0142] When a catalyst is used in preparing the urethane prepolymer P2, the amount of the catalyst used is preferably 0.0001 to 1.0% by weight, more preferably 0.001 to 1.0% by weight, even more preferably 0.003 to 1.0% by weight, and particularly preferably 0.005 to 1.0% by weight, based on the total amount of the polyol, the compound having a polymerizable unsaturated double bond, and the crosslinking agent.

[0143] When a catalyst is used in preparing the urethane prepolymer P2, the reaction temperature is preferably less than 100° C., and more preferably 60 to 90° C. If the temperature is 100° C. or higher, it may become difficult to control the reaction rate and crosslinked structure.

[0144] The urethane prepolymer P2 may be prepared without using a catalyst, in which case the reaction temperature may be preferably 100° C. or higher.

[0145] Examples of methods for preparing urethane prepolymer P2 include: 1) a method in which a polyol, a compound having a polymerizable unsaturated double bond, a crosslinking agent, and a catalyst are charged into a volumetric flask, and 2) a method in which a part or all of the polyol, a part or all of the compound having a polymerizable unsaturated double bond, and a catalyst are charged into a flask, and a part or all of the crosslinking agent is added. In method 2), after a part or all of the crosslinking agent has been added, the remainder of the polyol, the remainder of the compound having a polymerizable unsaturated double bond, and the remainder of the crosslinking agent may be additionally added.

[0146] Any suitable solvent may be used to prepare the urethane prepolymer P2. Examples of such solvents include methyl ethyl ketone, ethyl acetate, toluene, xylene, and acetone. Among these solvents, toluene is preferred.

[0147] When preparing the urethane prepolymer P2, any suitable other component may be used in any suitable amount as long as it does not impair the effects of the present invention. Examples of other components include antioxidants, UV absorbers, light stabilizers, resin components, tackifiers, crosslinking retarders, inorganic fillers, organic fillers, metal powders, pigments, foil-like materials, softeners, antioxidants, conductive agents, surface lubricants, leveling agents, corrosion inhibitors, heat stabilizers, polymerization inhibitors, and lubricants. The other components may be one type only, or two or more types. Among the other components, antioxidants, UV absorbers, and light stabilizers are preferred embodiments.

[0148] Any appropriate antioxidant may be used as long as it does not impair the effects of the present invention. Examples of such antioxidants include radical chain inhibitors and peroxide decomposers. Examples of radical chain inhibitors include phenolic antioxidants and amine antioxidants. Examples of peroxide decomposers include sulfur-based antioxidants and phosphorus-based antioxidants.

[0149] Any suitable ultraviolet absorber may be used as long as it does not impair the effects of the present invention. Examples of such ultraviolet absorbers include benzophenone-based ultraviolet absorbers, benzotriazole-based ultraviolet absorbers, salicylic acid-based ultraviolet absorbers, oxalic acid anilide-based ultraviolet absorbers, cyanoacrylate-based ultraviolet absorbers, and triazine-based ultraviolet absorbers.

[0150] Any appropriate light stabilizer can be used as long as it does not impair the effects of the present invention. Examples of such light stabilizers include hindered amine light stabilizers and ultraviolet stabilizers.

[0151] [A-6-1-b. Crosslinking agent] The urethane prepolymer P2 typically reacts with a crosslinking agent to form a urethane polymer. The crosslinking agent may be one type only, or two or more types.

[0152] As the crosslinking agent, any appropriate crosslinking agent can be used as long as it can be used in the production of a urethane polymer and does not impair the effects of the present invention. Such a crosslinking agent is preferably a polyfunctional isocyanate compound. The polyfunctional isocyanate compound may be used alone or in combination of two or more types.

[0153] The polyfunctional isocyanate compound may be any suitable polyfunctional isocyanate compound that can be used in a urethanization reaction. For example, the polyfunctional isocyanate compounds described above as polyfunctional isocyanate compounds that can be reacted with a polyol to obtain the urethane prepolymer P2 may be used. The polyfunctional isocyanate compound that reacts with the urethane prepolymer P2 to form a urethane polymer may be the same as or different from the polyfunctional isocyanate compound described above as polyfunctional isocyanate compounds that can be reacted with a polyol to obtain the urethane prepolymer P2.

[0154] The equivalent ratio of the NCO groups of the polyfunctional isocyanate compound to the OH groups of the urethane prepolymer P2, expressed as NCO groups / OH groups, is preferably 0.4 to 1.8, more preferably 0.5 to 1.6, even more preferably 0.5 to 1.5, and particularly preferably 0.5 to 1.4.

[0155] The content of the crosslinking agent in the urethane-based pressure-sensitive adhesive composition y1 may be any appropriate content ratio as long as the effects of the present invention are not impaired. The content ratio of such a crosslinking agent is preferably 0.4 to 13 parts by weight, more preferably 0.5 to 11 parts by weight, even more preferably 0.6 to 9.0 parts by weight, even more preferably 0.7 to 7.0 parts by weight, still more preferably 0.8 to 5.0 parts by weight, and particularly preferably 0.9 to 3.0 parts by weight, relative to the solid content (100 parts by weight) of the urethane prepolymer P2.

[0156] [A-6-1-c. Urethane (meth)acrylate] The urethane-based pressure-sensitive adhesive composition y1 typically contains a urethane (meth)acrylate, and the urethane (meth)acrylate may be of one type only, or of two or more types.

[0157] The content of the urethane (meth)acrylate in the urethane-based pressure-sensitive adhesive composition y1 may be any appropriate content ratio as long as the effects of the present invention are not impaired. The content of such urethane (meth)acrylate is preferably 1 to 70 parts by weight, more preferably 5 to 60 parts by weight, even more preferably 10 to 50 parts by weight, and particularly preferably 15 to 45 parts by weight, relative to the solid content (100 parts by weight) of the urethane prepolymer P2.

[0158] The number of functional groups of the urethane (meth)acrylate is preferably 2 or more, more preferably 3 or more, even more preferably 3 to 20, particularly preferably 4 to 10, most preferably 4 to 8, and particularly preferably 6, in order to further exert the effects of the present invention.

[0159] The urethane (meth)acrylate preferably has a structure represented by the following general formula (1), in order to further exhibit the effects of the present invention. When the urethane (meth)acrylate has a structure represented by the following general formula (1), the anchoring strength of the pressure-sensitive adhesive layer (anchoring strength at the interface between the pressure-sensitive adhesive layer and the base layer) can be exhibited favorably, particularly even if the adhesive strength after UV irradiation becomes very low. Furthermore, when the urethane (meth)acrylate has a structure represented by the following general formula (1), the cutting properties during processing can be exhibited favorably. [ka]

[0160] The urethane (meth)acrylate preferably has a structure represented by the following general formula (1a), in order to further enhance the effects of the present invention. When the urethane (meth)acrylate has a structure represented by the following general formula (1a), the anchoring strength of the pressure-sensitive adhesive layer (anchoring strength at the interface between the pressure-sensitive adhesive layer and the base layer) can be more favorably exhibited, particularly even if the adhesive strength after UV irradiation becomes very low. Furthermore, when the urethane (meth)acrylate (C) has a structure represented by the following general formula (1a), the cutting ability during processing can be more favorably exhibited. [ka]

[0161] The urethane (meth)acrylate preferably has a structure represented by the following general formula (2), in order to further exhibit the effects of the present invention. When the urethane (meth)acrylate has a structure represented by the following general formula (2), the adhesive layer can exhibit good anchoring strength (anchoring strength at the interface between the adhesive layer and the base layer), particularly even if the adhesive strength after UV irradiation becomes very low. [ka]

[0162] In general formula (2), X is a divalent aromatic group or a divalent aliphatic group.

[0163] As the divalent aromatic group, any appropriate divalent aromatic group can be adopted as long as it does not impair the effects of the present invention.

[0164] As the divalent aliphatic group, any appropriate divalent aliphatic group can be used as long as it does not impair the effects of the present invention. Examples of the divalent aliphatic group include a divalent chain aliphatic group and a divalent cyclic structure-containing aliphatic group.

[0165] The divalent chain aliphatic group may be linear or branched.

[0166] Examples of the divalent cyclic structure-containing aliphatic group include divalent aliphatic groups having a cycloalkane ring structure (e.g., a cyclohexyl ring structure). Examples of the divalent cyclic structure-containing aliphatic group include groups represented by the following general formula (3). Note that the two bonds marked with * in general formula (3) are bonds that function as a divalent group. [ka]

[0167] The urethane (meth)acrylate preferably has a molecular weight of less than 1,000, in order to more effectively exhibit the effects of the present invention.

[0168] Examples of urethane (meth)acrylates include compounds having a structure represented by the following general formula (4). [ka]

[0169] In the general formula (4), X is as defined above.

[0170] [A-6-1-d. Photopolymerization initiator] The urethane-based pressure-sensitive adhesive composition y1 typically contains a photopolymerization initiator, and the photopolymerization initiator may be one kind or two or more kinds.

[0171] As the photoinitiator, any suitable photoinitiator can be employed as long as the effects of the present invention are not impaired. Examples of such photoinitiators include those exemplified in the section of <A-5-1. Acrylic polymer P1>.

[0172] The content ratio of the photoinitiator in the urethane-based adhesive composition y1 can be any suitable content ratio as long as the effects of the present invention are not impaired. In terms of more effectively expressing the effects of the present invention, based on the solid content (100 parts by weight) of the urethane prepolymer P2, it is preferably 0.001 part by weight to 20 parts by weight, more preferably 0.01 part by weight to 10 parts by weight, and still more preferably 0.1 part by weight to 5 parts by weight.

[0173] 〔A-6-1-e. Other components〕 The urethane-based adhesive composition y1 may contain any suitable other components as long as the effects of the present invention are not impaired. Examples of such other components include solvents, catalysts, crosslinking accelerators, silane coupling agents, antioxidants, ultraviolet absorbers, light stabilizers, resin components, tackifiers, crosslinking retarders, inorganic fillers, organic fillers, metal powders, colorants (such as pigments and dyes), chain transfer agents, plasticizers, softeners, anti-aging agents, conductive agents, foils, surface lubricants, leveling agents, corrosion inhibitors, heat stabilizers, polymerization inhibitors, and lubricants. The other components may be only one kind or two or more kinds.

[0174] The content ratio of the other components in the urethane-based adhesive composition y1 is preferably 0 part by weight to 40 parts by weight, more preferably 0 part by weight to 30 parts by weight, and still more preferably 0 part by weight to 20 parts by weight, based on the solid content (100 parts by weight) of the urethane prepolymer P2.

[0175] <A-6-2. Adhesive Y2> Any appropriate method can be adopted as the method for forming PSA Y2 as long as it does not impair the effects of the present invention. Examples of the method for forming PSA Y2 include a method (direct method) in which an acrylic PSA composition y2 is applied to any appropriate substrate, heated or dried as necessary, and cured as necessary to form PSA Y2 in a sheet form on the substrate, and a method (transfer method) in which an acrylic PSA composition y2 is applied to an appropriate substrate such as a release paper, heated or dried as necessary, and cured as necessary to form a PSA layer composed of PSA Y2 on the substrate, and then transferred the formed PSA layer onto any appropriate substrate.

[0176] For the means for applying the acrylic pressure-sensitive adhesive composition y2, the heating or drying of the acrylic pressure-sensitive adhesive composition y2, and the curing of the acrylic pressure-sensitive adhesive composition y2, the explanations for the means for applying the acrylic pressure-sensitive adhesive composition x, the heating or drying of the acrylic pressure-sensitive adhesive composition x, and the curing of the acrylic pressure-sensitive adhesive composition x in Section <A-5. Pressure-sensitive adhesive X> can be cited.

[0177] [A-6-2-a. Acrylic polymer P3 having one polymerizable unsaturated double bond in the side chain] The content of the acrylic polymer P3 in the acrylic pressure-sensitive adhesive composition y2 is preferably 50% by weight to 99.999% by weight, more preferably 60% by weight to 99.99% by weight, even more preferably 70% by weight to 99.9% by weight, particularly preferably 80% by weight to 99% by weight, and most preferably 85% by weight to 95% by weight. When the content of the acrylic polymer P3 in the acrylic pressure-sensitive adhesive composition y2 is within the above range, calculated as solid content, the effects of the present invention can be more effectively exhibited.

[0178] As the acrylic polymer P3 in the acrylic pressure-sensitive adhesive composition y2, any appropriate acrylic polymer can be used as long as it is an acrylic polymer having one polymerizable unsaturated double bond in its side chain, as long as the effects of the present invention are not impaired. The acrylic polymer P3 may be one type or two or more types.

[0179] The weight-average molecular weight of the acrylic polymer P3 may be any appropriate weight-average molecular weight within a range that does not impair the effects of the present invention. In order to further exhibit the effects of the present invention, the weight-average molecular weight is preferably 200,000 to 2,500,000, more preferably 200,000 to 2,000,000, even more preferably 250,000 to 1,800,000, and particularly preferably 250,000 to 1,500,000.

[0180] Examples of the acrylic polymer P3 include an acrylic polymer having one polymerizable unsaturated double bond in a side chain, which is obtained by polymerizing an acrylic polymer P3′ obtained by polymerizing a composition (III) containing a monomer having a reactive functional group a (excluding a polymerizable unsaturated double bond), and reacting the acrylic polymer P3′ with a compound having a reactive functional group b (excluding a polymerizable unsaturated double bond) that reacts with the reactive functional group a and one polymerizable unsaturated double bond, while maintaining the polymerizable unsaturated double bond.

[0181] Examples of the reactive functional group a include a hydroxyl group, a carboxyl group, an epoxy group, and an isocyanate group.

[0182] Examples of the reactive functional group b include an isocyanate group, a hydroxyl group, an epoxy group, and a carboxyl group.

[0183] Examples of combinations of reactive functional groups a and b (or combinations of reactive functional groups b and a) include a hydroxyl group and an isocyanate group, a carboxyl group and a hydroxyl group, and a carboxyl group and an epoxy group.

[0184] The side chain of the acrylic polymer P3 having one polymerizable unsaturated double bond preferably has 6 to 30 atoms, in order to further enhance the effects of the present invention. By having such a side chain, the acrylic polymer P3 does not become rigid when irradiated with active energy rays, and the contraction force can be reduced. If one side chain of the acrylic polymer P3 has two or more polymerizable unsaturated double bonds, an excessive three-dimensional network structure is formed by irradiating with active energy rays, and the acrylic polymer P3 becomes rigid after curing, which may increase the contraction force.

[0185] The acrylic polymer P3' is preferably an acrylic polymer formed by polymerization from a composition (III) containing (component a) a (meth)acrylic acid alkyl ester in which the alkyl group in the alkyl ester moiety has 1 to 18 carbon atoms (preferably 4 to 12 carbon atoms), and (component b) a monomer having a reactive functional group a, in terms of being able to more effectively exhibit the effects of the present invention.

[0186] The component a and the component b may each independently be one type or two or more types.

[0187] As the (meth)acrylic acid alkyl ester (component a) in which the alkyl group in the alkyl ester moiety has 1 to 18 carbon atoms, n-butyl (meth)acrylate and 2-ethylhexyl (meth)acrylate are preferred, and n-butyl acrylate and 2-ethylhexyl acrylate are more preferred, in terms of being able to further exhibit the effects of the present invention.

[0188] Examples of the monomer (component b) having a reactive functional group a include hydroxyl group-containing monomers, carboxyl group-containing monomers, epoxy group-containing monomers, aziridine group-containing monomers, and isocyanate group-containing monomers.

[0189] Examples of hydroxyl group-containing monomers include hydroxyl group-containing acrylic monomers such as 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, and 4-hydroxybutyl (meth)acrylate; and hydroxyl group-containing vinyl ether compounds such as 2-hydroxyethyl vinyl ether, 4-hydroxybutyl vinyl ether, and diethylene glycol monovinyl ether. Furthermore, although not a hydroxyl group-containing monomer itself, a vinyl ester compound such as vinyl acetate may be polymerized as a hydroxyl group-containing monomer precursor and then saponified.

[0190] Examples of the carboxyl group-containing monomer include carboxyl group-containing acrylic monomers such as (meth)acrylic acid; and carboxyl group-containing monomers other than (meth)acrylic acid, such as itaconic acid, maleic acid, fumaric acid, crotonic acid, isocrotonic acid, and acid anhydrides thereof (for example, acid anhydride group-containing monomers such as maleic anhydride and itaconic anhydride).

[0191] Examples of the epoxy group-containing monomer include epoxy group-containing acrylic monomers such as glycidyl (meth)acrylate and methylglycidyl (meth)acrylate.

[0192] Examples of the isocyanate group-containing monomer include isocyanate group-containing acrylic monomers such as (meth)acryloyl isocyanate and 2-(meth)acryloyloxyethyl isocyanate.

[0193] The composition (III) may contain a copolymerizable monomer (component c) other than components a and b. The copolymerizable monomer (component c) may be one type or two or more types. Examples of such copolymerizable monomers (component c) include amide group-containing monomers such as (meth)acrylamide, N,N-dimethyl(meth)acrylamide, N-methylol(meth)acrylamide, N-methoxymethyl(meth)acrylamide, N-butoxymethyl(meth)acrylamide, and N-hydroxyethyl(meth)acrylamide; amino group-containing monomers such as aminoethyl (meth)acrylate, dimethylaminoethyl (meth)acrylate, and t-butylaminoethyl (meth)acrylate; heterocycle-containing monomers such as N-vinyl-2-pyrrolidone, (meth)acryloylmorpholine, N-vinylpiperidone, N-vinylpiperazine, N-vinylpyrrole, N-vinylimidazole, vinylpyridine, vinylpyrimidine, and vinyloxazole; phenyl(meth)acrylate, phenoxyethyl(meth)acrylate, and the like. aromatic ring-containing (meth)acrylates such as m-phenoxybenzyl (meth)acrylate, benzyl (meth)acrylate, phenoxybenzyl (meth)acrylate (for example, m-phenoxybenzyl (meth)acrylate), thiophenoxybenzyl (meth)acrylate, and benzyl benzyl (meth)acrylate; (meth)acrylic acid alkoxyalkyl esters such as 2-methoxyethyl (meth)acrylate, 2-ethoxyethyl (meth)acrylate, 2-(2-ethoxyethoxy)ethyl (meth)acrylate, methoxytriethylene glycol (meth)acrylate, methoxypolyethylene glycol (meth)acrylate, 3-methoxypropyl (meth)acrylate, 3-methoxypropyl (meth)acrylate, 4-methoxybutyl (meth)acrylate, and 4-ethoxybutyl (meth)acrylate.

[0194] The content of component a in all monomers contained in composition (III) is, for example, 10% by weight or more, preferably 20% by weight or more, more preferably 30% by weight or more, even more preferably 50% by weight to 99% by weight, and particularly preferably 60% by weight to 98% by weight, in order to further exhibit the effects of the present invention.

[0195] The content ratio of component b in all the monomers contained in composition (III) is, in terms of being able to more manifest the effects of the present invention, for example, 0.1% by weight or more, preferably 0.3% to 50% by weight, more preferably 0.5% to 40% by weight, still more preferably 0.8% to 30% by weight, and particularly preferably 1.0% to 20% by weight.

[0196] The content ratio of component c in all the monomers contained in composition (III) is, in terms of being able to more manifest the effects of the present invention, for example, 0% to 80% by weight, preferably 0% to 50% by weight, more preferably 0% to 40% by weight, still more preferably 0% to 30% by weight, particularly preferably 0% to 20% by weight, and most preferably 0% to 10% by weight.

[0197] Composition (III) may contain any suitable other components as long as the effects of the present invention are not impaired. Examples of such other components include polymerization initiators, chain transfer agents, solvents, and the like. The content of these other components may adopt any suitable content as long as the effects of the present invention are not impaired. Regarding such other components, for example, the description in the section of <A-5-1. Acrylic polymer P1> can be cited.

[0198] Acrylic polymer P3' can be produced by any suitable polymerization method as long as the effects of the present invention are not impaired. Regarding such a polymerization method, for example, the description in the section of <A-5-1. Acrylic polymer P1> can be cited.

[0199] As described above, the acrylic polymer P3 is obtained, for example, by reacting an acrylic polymer P3' with a compound having a reactive functional group b that reacts with the reactive functional group a possessed by the acrylic polymer P3' and one polymerizable unsaturated double bond while maintaining the polymerizable unsaturated double bond. As the reaction method of the acrylic polymer P3', the reactive functional group a, and the compound having a reactive functional group b that reacts with the reactive functional group a and one polymerizable unsaturated double bond, any appropriate reaction method such as a known reaction method can be adopted according to the types of the reactive functional group a and the reactive functional group, etc.

[0200] As the compound having a reactive functional group b that reacts with the reactive functional group a possessed by the acrylic polymer P3' and one polymerizable unsaturated double bond, any appropriate compound can be adopted by selecting an appropriate reactive functional group b. Examples of such compounds include (meth)acryloyl isocyanate and 2-(meth)acryloyloxyethyl isocyanate when the reactive functional group a is a hydroxyl group, and glycidyl (meth)acrylate and methyl glycidyl (meth)acrylate when the reactive functional group a is a carboxyl group.

[0201] 〔A-6-2-b. Crosslinking Agent〕 Typically, the acrylic adhesive composition y2 contains a crosslinking agent. The crosslinking agent may be only one type or two or more types.

[0202] As the crosslinking agent, any appropriate crosslinking agent can be adopted as long as the effects of the present invention are not impaired. Examples of such crosslinking agents include those exemplified in the section of <A-5-2. Crosslinking Agent>.

[0203] The content ratio of the crosslinking agent in the acrylic adhesive composition y2 can adopt any appropriate content ratio as long as the effects of the present invention are not impaired. Such a content ratio, in terms of being able to more effectively exhibit the effects of the present invention, is preferably 0.005 parts by weight to 20 parts by weight, more preferably 0.01 parts by weight to 15 parts by weight, still more preferably 0.05 parts by weight to 10 parts by weight, particularly preferably 0.08 parts by weight to 7 parts by weight, and most preferably 1 part by weight to 5 parts by weight, based on the solid content (100 parts by weight) of the acrylic polymer P3.

[0204] 〔A-6-2-c. Photoinitiator〕 Typically, the acrylic adhesive composition y2 contains a photoinitiator. The photoinitiator may be only one type or two or more types.

[0205] As the photoinitiator, any appropriate photoinitiator can be adopted as long as the effects of the present invention are not impaired. Examples of such photoinitiators include those exemplified in the section <A-5-5. Photoinitiator>.

[0206] The content ratio of the photoinitiator in the acrylic adhesive composition y2 can adopt any appropriate content ratio as long as the effects of the present invention are not impaired. Such a content ratio, in terms of being able to more effectively exhibit the effects of the present invention, is preferably 0.02 parts by weight to 10 parts by weight, more preferably 0.05 parts by weight to 5 parts by weight, based on the solid content (100 parts by weight) of the acrylic polymer P3.

[0207] 〔A-6-2-d. Other Components〕 The acrylic pressure-sensitive adhesive composition y2 may contain any appropriate other components as long as the effects of the present invention are not impaired. Examples of such other components include other polymer components, crosslinking retarders, silane coupling agents, tackifying resins (rosin derivatives, polyterpene resins, petroleum resins, oil-soluble phenols, etc.), fatty acid esters, silicone additives, antioxidants, inorganic fillers, organic fillers, metal powders, colorants (pigments, dyes, etc.), foil-like materials, UV absorbers, antioxidants, light stabilizers, plasticizers, softeners, surfactants, antistatic agents, conductive agents, stabilizers, surface lubricants, leveling agents, corrosion inhibitors, heat stabilizers, polymerization inhibitors, lubricants, and catalysts. The other components may be used alone or in combination of two or more.

[0208] The content ratio of other components in the acrylic pressure-sensitive adhesive composition y2 is preferably 0 to 40 parts by weight, more preferably 0 to 30 parts by weight, and even more preferably 0 to 20 parts by weight, relative to the solid content (100 parts by weight) of the acrylic polymer P3.

[0209] <A-7. Acrylic adhesive Z1> Examples of the acrylic pressure-sensitive adhesive Z1 include pressure-sensitive adhesives described in Japanese Patent No. 6302233, such as a pressure-sensitive adhesive formed from an acrylic pressure-sensitive adhesive composition z1, which contains an acrylic polymer P4 and a surfactant.

[0210] Any appropriate method can be adopted as a method for forming the acrylic pressure-sensitive adhesive Z1 as long as it does not impair the effects of the present invention. Examples of the method for forming the acrylic pressure-sensitive adhesive Z1 include a method (direct method) in which the acrylic pressure-sensitive adhesive composition Z1 is applied to an appropriate substrate, heated or dried as necessary, and cured as necessary to form the acrylic pressure-sensitive adhesive Z1 in a sheet form on the substrate, and a method (transfer method) in which the acrylic pressure-sensitive adhesive composition Z1 is applied to an appropriate substrate such as a release paper, heated or dried as necessary, and cured as necessary to form a pressure-sensitive adhesive layer composed of the acrylic pressure-sensitive adhesive Z1 on the substrate, and then transferred the formed pressure-sensitive adhesive layer onto an appropriate substrate.

[0211] For the means of applying the acrylic adhesive composition Z1, heating and drying of the acrylic adhesive composition Z1, and curing of the acrylic adhesive composition Z1, the description regarding the means of applying the acrylic adhesive composition X, heating and drying of the acrylic adhesive composition X, and curing of the acrylic adhesive composition X in the section of <<A-5. Adhesive X>> can be cited.

[0212] <A-7-1. Acrylic Polymer P4> The content ratio of the acrylic polymer P4 in the acrylic adhesive composition Z1 is preferably 50% to 99.999% by weight, more preferably 60% to 99.99% by weight, still more preferably 70% to 99.9% by weight, particularly preferably 80% to 99% by weight, and most preferably 85% to 95% by weight in terms of solid content. If the content ratio of the acrylic polymer P4 in the acrylic adhesive composition Z1 is within the above range in terms of solid content, the effects of the present invention can be more effectively exhibited.

[0213] As the acrylic polymer P4 in the acrylic adhesive composition Z1, any suitable acrylic polymer can be adopted as long as the effects of the present invention are not impaired. The acrylic polymer P4 may be only one kind or two or more kinds.

[0214] The weight average molecular weight of the acrylic polymer P4 can be any suitable weight average molecular weight as long as the effects of the present invention are not impaired. Such a weight average molecular weight is preferably 100,000 to 5,000,000, more preferably 200,000 to 4,000,000, still more preferably 300,000 to 3,000,000, and particularly preferably 400,000 to 2,000,000 in terms of more effectively exhibiting the effects of the present invention.

[0215] As the acrylic polymer P4, in terms of being able to more effectively exhibit the effects of the present invention, preferably, it is an acrylic polymer formed by polymerization from a composition (IV) containing (component a) an alkyl (meth)acrylate in which the alkyl group of the alkyl ester moiety has 4 to 12 carbon atoms (preferably 6 to 14 carbon atoms, more preferably 7 to 13 carbon atoms), and (component b) a (meth)acrylate having a hydroxyl group.

[0216] Component a and component b may each independently be only one kind or two or more kinds.

[0217] Examples of the alkyl (meth)acrylate (component a) in which the alkyl group of the alkyl ester moiety has 4 to 12 carbon atoms include those exemplified as component a in the section <A-5-1. Acrylic polymer P1>.

[0218] Examples of the (meth)acrylate having a hydroxyl group include those exemplified as an example of component b in the section <A-5-1. Acrylic polymer P1>.

[0219] The composition (IV) may contain a copolymerizable monomer (component c) other than component a and component b. The copolymerizable monomer (component c) may be only one kind or two or more kinds. Examples of such a copolymerizable monomer (component c) include (meth)acrylic acid and those exemplified as component c in the section <A-5-1. Acrylic polymer P1>.

[0220] In terms of being able to more effectively exhibit the effects of the present invention, the content ratio of component a in all the monomers contained in the composition (IV) is, for example, 10% by weight or more, preferably 50% by weight or more, more preferably 70% by weight or more, still more preferably 80% to 99% by weight, and particularly preferably 85% to 98% by weight.

[0221] The content ratio of component b in all monomers contained in composition (IV) is, in terms of better expressing the effects of the present invention, for example, 0.1% by weight or more, preferably 0.5% to 30% by weight, more preferably 1.0% to 20% by weight, still more preferably 2.0% to 15% by weight, and particularly preferably 3.0% to 10% by weight.

[0222] The content of component c in all monomers contained in composition (IV) is, in terms of better expressing the effects of the present invention, for example, 0% to 80% by weight, preferably 0% to 50% by weight, more preferably 0% to 40% by weight, still more preferably 0% to 30% by weight, particularly preferably 0% to 20% by weight, and most preferably 0% to 10% by weight.

[0223] All monomers contained in composition (IV) may contain any appropriate other components as long as the effects of the present invention are not impaired. Examples of such other components include polymerization initiators, chain transfer agents, solvents, etc. The content of these other components can adopt any appropriate content as long as the effects of the present invention are not impaired. Regarding such other components, for example, the description in the section of <A-5-1. Acrylic polymer P1> can be cited.

[0224] Acrylic polymer P4 can be produced by any appropriate polymerization method as long as the effects of the present invention are not impaired. Regarding such a polymerization method, for example, the description in the section of <A-5-1. Acrylic polymer P1> can be cited.

[0225] <A-7-2. Surfactant> Acrylic adhesive composition z1 typically contains a surfactant. The surfactant may be only one kind or two or more kinds. By including a surfactant in acrylic adhesive composition z1, the effects of the present invention can be more expressed.

[0226] Examples of surfactants include nonionic surfactants, anionic surfactants, cationic surfactants, and amphoteric surfactants. Only one type of surfactant may be used, or two or more types may be used.

[0227] As the nonionic surfactant, any suitable nonionic surfactant can be used as long as it does not impair the effects of the present invention. Examples of such nonionic surfactants include polyoxyethylene lauryl ether, polyoxyethylene oleyl ether, polyoxyethylene nonylpropenyl phenyl ether, sorbitan fatty acid ester, and polyoxyethylene octyl phenyl ether. The nonionic surfactant may be one type or two or more types.

[0228] As the anionic surfactant, any suitable anionic surfactant can be used as long as it does not impair the effects of the present invention. Examples of such anionic surfactants include sodium dodecylbenzenesulfonate, sodium lauryl sulfate, sodium polyoxyethylene lauryl ether sulfate, ammonium polyoxyethylene lauryl ether sulfate, ammonium polyoxyethylene nonylphenyl ether sulfate, ammonium polyoxyethylene nonylpropenylphenyl ether sulfate, ammonium polyoxyethylene styrenated phenyl ether sulfate, and the sodium salt of a β-naphthalenesulfonic acid formalin condensate. The anionic surfactant may be used alone or in combination of two or more types.

[0229] As the cationic surfactant, any suitable cationic surfactant can be used as long as it does not impair the effects of the present invention. Examples of such cationic surfactants include stearylamine acetate, trimethyl palm ammonium chloride, trimethyl tallow ammonium chloride, dimethyl dioleyl ammonium chloride, methyl oleyl diethanol chloride, tetramethyl ammonium chloride, lauryl pyridinium chloride, lauryl pyridinium bromide, lauryl pyridinium disulfate, cetyl trimethyl ammonium chloride, cetyl pyridinium bromide, 4-alkyl mercaptopyridine, poly(vinylpyridine)-dodecyl bromide, and dodecyl benzyl triethyl ammonium chloride. The cationic surfactant may be used alone or in combination of two or more types.

[0230] As the amphoteric surfactant, any suitable amphoteric surfactant can be used as long as it does not impair the effects of the present invention. Such amphoteric surfactants include, for example, lauric acid amidopropyl betaine. The amphoteric surfactant may be one type or two or more types.

[0231] As the surfactant, a surfactant having an aromatic ring is preferred, and a surfactant having an aromatic ring and a polyether structure is more preferred.

[0232] Examples of surfactants having an aromatic ring include polyoxyalkylene alkyl aryl ether sulfates, polyoxyalkylene alkylpropenyl aryl ether sulfates, polyoxyalkylene styrenated aryl ether sulfates, and polyoxyalkylene alkylpropenyl aryl ethers. Specific examples include polyoxyethylene nonylphenyl ether ammonium sulfate, polyoxyethylene nonylpropenyl phenyl ether ammonium sulfate, polyoxyethylene styrenated phenyl ether ammonium sulfate, and polyoxyethylene nonylpropenyl phenyl ether.

[0233] As the surfactant having an aromatic ring, commercially available products may be used. Examples of such commercially available products include trade name "Hitenol N-08" (manufactured by Daiichi Kogyo Seiyaku Co., Ltd.), trade name "Hitenol NF-08" (manufactured by Daiichi Kogyo Seiyaku Co., Ltd.), trade name "Hitenol NF-13", trade name "Hitenol NF-17" (manufactured by Daiichi Kogyo Seiyaku Co., Ltd.), trade name "Aquaron BC-10" (manufactured by Daiichi Kogyo Seiyaku Co., Ltd.), trade name "Aquaron HS-10" (manufactured by Daiichi Kogyo Seiyaku Co., Ltd.), and trade name "Aquaron RN-20" (manufactured by Daiichi Kogyo Seiyaku Co., Ltd.).

[0234] The content ratio of the surfactant in the acrylic adhesive composition z1 is preferably 0.1 part by weight to 10 parts by weight, more preferably 0.1 part by weight to 8 parts by weight, still more preferably 0.1 part by weight to 6 parts by weight, and particularly preferably 0.1 part by weight to 5 parts by weight with respect to the solid content (100 parts by weight) of the acrylic polymer P4.

[0235] <A-7-3. Crosslinking agent> The acrylic adhesive composition z1 may contain a crosslinking agent. The crosslinking agent may be only one kind or two or more kinds.

[0236] The content ratio of the crosslinking agent in the acrylic adhesive composition z1 can adopt any appropriate content ratio within the range that does not impair the effects of the present invention. As such a content ratio, in terms of more effectively expressing the effects of the present invention, it is preferably 0.005 part by weight to 20 parts by weight, more preferably 0.01 part by weight to 15 parts by weight, still more preferably 0.01 part by weight to 10 parts by weight, particularly preferably 0.05 part by weight to 8 parts by weight, and most preferably 0.1 part by weight to 6 parts by weight with respect to the solid content (100 parts by weight) of the acrylic polymer P4.

[0237] Examples of the crosslinking agent include those exemplified in the section <A-5-2. Crosslinking agent>.

[0238] <A-7-4. Crosslinking catalyst> The acrylic adhesive composition Z1 may contain a crosslinking catalyst. The crosslinking catalyst may be only one type or two or more types.

[0239] The content ratio of the crosslinking catalyst in the acrylic adhesive composition Z1 can adopt any appropriate content ratio as long as the effects of the present invention are not impaired. Such a content ratio is preferably 0.0001 parts by weight to 1 part by weight, more preferably 0.001 parts by weight to 0.1 part by weight, based on the solid content (100 parts by weight) of the acrylic polymer P4, in terms of being able to more effectively exhibit the effects of the present invention.

[0240] Examples of the crosslinking catalyst include those exemplified in the section <A-5-3. Crosslinking catalyst>.

[0241] <A-7-5. Crosslinking retarder> The acrylic adhesive composition Z1 may contain a crosslinking retarder. The crosslinking retarder may be only one type or two or more types.

[0242] The content ratio of the crosslinking retarder in the acrylic adhesive composition Z1 can adopt any appropriate content ratio as long as the effects of the present invention are not impaired. Such a content ratio is preferably 0.1 parts by weight to 10 parts by weight, more preferably 1 part by weight to 5 parts by weight, based on the solid content (100 parts by weight) of the acrylic polymer P4, in terms of being able to more effectively exhibit the effects of the present invention.

[0243] Examples of the crosslinking retarder include β-keto esters such as methyl acetoacetate, ethyl acetoacetate, octyl acetoacetate, oleyl acetoacetate, lauryl acetoacetate, stearyl acetoacetate, and β-diketones such as acetylacetone, 2,4-hexanedione, benzoylacetone.

[0244] <A-7-6. Other components> The acrylic pressure-sensitive adhesive composition z1 may contain any appropriate other components as long as the effects of the present invention are not impaired. Examples of such other components include other polymer components, silane coupling agents, tackifying resins (rosin derivatives, polyterpene resins, petroleum resins, oil-soluble phenols, etc.), fatty acid esters, silicone additives, antioxidants, inorganic fillers, organic fillers, metal powders, colorants (pigments, dyes, etc.), foil-like materials, UV absorbers, antioxidants, light stabilizers, plasticizers, softeners, antistatic agents, conductive agents, stabilizers, surface lubricants, leveling agents, corrosion inhibitors, heat stabilizers, polymerization inhibitors, lubricants, and catalysts. The other components may be one type only, or two or more types may be used.

[0245] The content of other components in the acrylic pressure-sensitive adhesive composition z1 is preferably 0 to 40 parts by weight, more preferably 0 to 30 parts by weight, and even more preferably 0 to 20 parts by weight, relative to the solid content (100 parts by weight) of the acrylic polymer P4.

[0246] <A-8. Acrylic adhesive Z2> Examples of the acrylic pressure-sensitive adhesive Z2 include pressure-sensitive adhesives described in Japanese Patent No. 6366199, such as a pressure-sensitive adhesive formed from an acrylic pressure-sensitive adhesive composition z2, which contains an acrylic polymer P5 and a crosslinking agent.

[0247] Any appropriate method can be used to form the acrylic pressure-sensitive adhesive Z2 as long as it does not impair the effects of the present invention. Examples of methods for forming the acrylic pressure-sensitive adhesive Z2 include a method (direct method) in which the acrylic pressure-sensitive adhesive composition z2 is applied to an appropriate substrate, heated or dried as necessary, and cured as necessary to form the acrylic pressure-sensitive adhesive Z2 on the substrate in a sheet form, and a method (transfer method) in which the acrylic pressure-sensitive adhesive composition z2 is applied to an appropriate substrate such as a release paper, heated or dried as necessary, and cured as necessary to form a pressure-sensitive adhesive layer composed of the acrylic pressure-sensitive adhesive Z2 on the substrate, and then transferred the formed pressure-sensitive adhesive layer onto an appropriate substrate.

[0248] Regarding the means for applying the acrylic adhesive composition Z2, heating and drying of the acrylic adhesive composition Z2, and curing of the acrylic adhesive composition Z2, the description regarding the means for applying the acrylic adhesive composition X, heating and drying of the acrylic adhesive composition X, and curing of the acrylic adhesive composition X in the section of «A-5. Adhesive X» can be cited.

[0249] <A-8-1. Acrylic Polymer P5> The content ratio of the acrylic polymer P5 in the acrylic adhesive composition Z2 is preferably 50% by weight or more, more preferably 50% to 99.99% by weight, still more preferably 55% to 99% by weight, particularly preferably 60% to 95% by weight, and most preferably 70% to 90% by weight in terms of solid content. If the content ratio of the acrylic polymer P5 in the acrylic adhesive composition Z2 is within the above range in terms of solid content, the effects of the present invention can be more expressed.

[0250] As the acrylic polymer P5 in the acrylic adhesive composition Z2, any appropriate acrylic polymer can be adopted as long as the effects of the present invention are not impaired. The acrylic polymer P5 may be only one kind or two or more kinds.

[0251] The weight average molecular weight of the acrylic polymer P5 can be any appropriate weight average molecular weight as long as the effects of the present invention are not impaired. Such a weight average molecular weight is preferably 300,000 to 2,000,000, more preferably 400,000 to 1,500,000, still more preferably 500,000 to 1,000,000, and particularly preferably 600,000 to 800,000 in terms of more expressing the effects of the present invention.

[0252] The glass transition temperature of the acrylic polymer P5 is, for example, -10°C or lower, preferably -20°C or lower, and still more preferably -70°C to -35°C.

[0253] As the acrylic polymer P5, in terms of being able to more effectively exhibit the effects of the present invention, it is preferably an acrylic polymer formed by polymerization from a composition (V) containing (component a) an alkyl (meth)acrylate in which the alkyl group of the alkyl ester moiety has 4 to 12 carbon atoms and (component b) a carboxyl group-containing monomer.

[0254] Component a and component b may each independently be only one kind or two or more kinds.

[0255] Examples of the alkyl (meth)acrylate (component a) in which the alkyl group of the alkyl ester moiety has 4 to 12 carbon atoms include those exemplified in the section of <A-5-1. Acrylic polymer P1>.

[0256] Examples of the carboxyl group-containing monomer (component b) include (meth)acrylic acid, itaconic acid, maleic acid, fumaric acid, and crotonic acid. Also, acid anhydrides of these carboxyl group-containing monomers (for example, monomer containing an acid anhydride group such as maleic anhydride and itaconic anhydride) are also included as the carboxyl group-containing monomer.

[0257] The composition (V) may contain a copolymerizable monomer (component c) other than the components a and b. The copolymerizable monomer (component c) may be of one type only, or of two or more types.Examples of such copolymerizable monomers (component c) include (meth)acrylic acid alkyl esters in which the alkyl group in the alkyl ester moiety has 1 to 3 carbon atoms; (meth)acrylic acid alkyl esters in which the alkyl group in the alkyl ester moiety has 13 to 20 carbon atoms; (meth)acrylic acid esters having a hydroxyl group such as 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, and 4-hydroxybutyl (meth)acrylate; hydroxyl group-containing vinyl monomers such as 2-hydroxyethyl vinyl ether, 4-hydroxybutyl vinyl ether, and diethylene glycol monovinyl ether; amide group-containing monomers such as (meth)acrylamide, N,N-dimethyl(meth)acrylamide, N-methylol(meth)acrylamide, N-methoxymethyl(meth)acrylamide, N-butoxymethyl(meth)acrylamide, and N-hydroxyethyl(meth)acrylamide; amino group-containing monomers such as aminoethyl (meth)acrylate, dimethylaminoethyl (meth)acrylate, and t-butylaminoethyl (meth)acrylate; and N-vinyl-2-pyrrolyl Heterocyclic ring-containing monomers such as N-vinylpiperidine, (meth)acryloylmorpholine, N-vinylpiperidone, N-vinylpiperazine, N-vinylpyrrole, N-vinylimidazole, vinylpyridine, vinylpyrimidine, and vinyloxazole; aromatic ring-containing monomers such as phenyl (meth)acrylate, phenoxyethyl (meth)acrylate, benzyl (meth)acrylate, phenoxybenzyl (meth)acrylate (e.g., m-phenoxybenzyl (meth)acrylate), thiophenoxybenzyl (meth)acrylate, and benzyl benzyl (meth)acrylate. (meth)acrylates; (meth)acrylic acid alkoxyalkyl esters such as 2-methoxyethyl (meth)acrylate, 2-ethoxyethyl (meth)acrylate, 2-(2-ethoxyethoxy)ethyl (meth)acrylate, methoxytriethylene glycol (meth)acrylate, methoxypolyethylene glycol (meth)acrylate, 3-methoxypropyl (meth)acrylate, 3-methoxypropyl (meth)acrylate, 4-methoxybutyl (meth)acrylate, and 4-ethoxybutyl (meth)acrylate.

[0258] As the copolymerizable monomer (component c), a polyfunctional monomer can also be employed. Examples of the polyfunctional monomer include those exemplified in the section of <A-5-1. Acrylic polymer P1>.

[0259] The content ratio of component a in all the monomers contained in the composition (V) is, from the viewpoint of further expressing the effects of the present invention, for example, 50% by weight or more, preferably 50% to 99% by weight, more preferably 80% to 98% by weight, and still more preferably 90% to 97% by weight.

[0260] The content ratio of component b in all the monomers contained in the composition (V) is, from the viewpoint of further expressing the effects of the present invention, for example, 0.1% by weight or more, preferably 1% to 10% by weight, more preferably 3% to 10% by weight, and still more preferably 3% to 5% by weight.

[0261] The content of component c in all the monomers contained in the composition (V) is, from the viewpoint of further expressing the effects of the present invention, for example, 0% to 50% by weight, preferably 0% to 40% by weight, more preferably 0% to 30% by weight, still more preferably 0% to 20% by weight, and particularly preferably 0% to 10% by weight.

[0262] The composition (V) may contain any other appropriate components as long as the effects of the present invention are not impaired. Examples of such other components include polymerization initiators, chain transfer agents, solvents, and the like. The content of these other components can be any appropriate content as long as the effects of the present invention are not impaired. Regarding such other components, for example, the description in the section of <A-5-1. Acrylic polymer P1> can be incorporated.

[0263] The acrylic polymer P5 can be produced by any appropriate polymerization method as long as the effects of the present invention are not impaired. Regarding such a polymerization method, for example, the description in the section of <A-5-1. Acrylic polymer P1> can be incorporated.

[0264] <A-8-2. Oligomer Component> The acrylic adhesive composition z2 may contain an oligomer component.

[0265] As the oligomer component, preferably, the glass transition temperature when forming a homopolymer is 60°C to 190°C, and it is mainly composed of an ethylenically unsaturated monomer having a cyclic structure (sometimes referred to as "a cyclic-containing ethylenically unsaturated monomer with a Tg of 60°C to 190°C"), and it is an oligomer component obtained by polymerizing a monomer component containing 1 part by weight to 10 parts by weight of a carboxyl group-containing monomer with respect to 100 parts by weight of the total amount of the monomer components.

[0266] As the oligomer component, an oligomer component obtained by polymerizing an ethylenically unsaturated monomer having a cyclic structure and having a glass transition temperature of 60°C or more when forming a homopolymer is also included.

[0267] In the oligomer component, as the cyclic-containing ethylenically unsaturated monomer with a Tg of 60°C to 190°C, any appropriate monomer component can be adopted as long as the glass transition temperature (Tg) when forming a homopolymer is 60°C to 190°C and it is an ethylenically unsaturated monomer having a cyclic structure in the molecule. As the ring in such a cyclic-containing ethylenically unsaturated monomer with a Tg of 60°C to 190°C, it may be either an aromatic ring or a non-aromatic ring, and a non-aromatic ring is preferred. Examples of the aromatic ring include aromatic hydrocarbon rings (e.g., benzene ring, condensed carbon rings in naphthalene, etc.) and various aromatic heterocyclic rings. Examples of the non-aromatic ring include non-aromatic alicyclic rings (cycloalkane rings such as cyclopentane ring, cyclohexane ring, cycloheptane ring, cyclooctane ring; cycloalkene rings such as cyclohexene ring), non-aromatic bridged rings (e.g., bicyclic hydrocarbon rings in pinane, pinene, bornane, norbornane, norbornene; tricyclic hydrocarbon rings in adamantane; tetracyclic hydrocarbon rings; etc., bridged hydrocarbon rings).

[0268] Examples of ring-containing ethylenically unsaturated monomers having a Tg of 60°C to 190°C include (meth)acrylic acid cycloalkyl esters such as cyclohexyl (meth)acrylate, and non-aromatic ring-containing (meth)acrylic acid esters such as isobornyl (meth)acrylate; aromatic ring-containing (meth)acrylic acid esters such as aryl (meth)acrylate esters such as phenyl (meth)acrylate, aryloxyalkyl (meth)acrylate esters such as phenoxyethyl (meth)acrylate, and arylalkyl (meth)acrylate esters such as benzyl (meth)acrylate; and styrene-based monomers such as styrene and α-methylstyrene; and can be appropriately selected from ethylenically unsaturated monomers having a ring structure in the molecule, such that the glass transition temperature when a homopolymer is formed is 60°C to 190°C.

[0269] As the ring-containing ethylenically unsaturated monomer having a Tg of 60°C to 190°C, preferably, (meth)acrylic acid esters having a non-aromatic ring such as cyclohexyl methacrylate and isobornyl (meth)acrylate are used, and from the viewpoint of transparency, cyclohexyl methacrylate is more preferred.

[0270] The ring-containing ethylenically unsaturated monomer having a Tg of 60° C. to 190° C. may be of only one type, or of two or more types.

[0271] The content of the ring-containing ethylenically unsaturated monomer having a Tg of 60° C. to 190° C. is preferably 50% by weight or more, more preferably 80% by weight to 99% by weight, and even more preferably 90% by weight to 97% by weight, based on the total amount of the monomer components. When the content of the ring-containing ethylenically unsaturated monomer having a Tg of 60° C. to 190° C. is within the above range, the effects of the present invention can be more effectively exhibited.

[0272] The oligomer component may contain a carboxyl group-containing monomer as a monomer component. Examples of such carboxyl group-containing monomers include (meth)acrylic acid, itaconic acid, maleic acid, fumaric acid, and crotonic acid, similar to the carboxyl group-containing monomers that can constitute the acrylic polymer P5. Acid anhydrides of these carboxyl group-containing monomers (e.g., acid anhydride-containing monomers such as maleic anhydride and itanoic anhydride) are also included as carboxyl group-containing monomers.

[0273] The content of the carboxyl group-containing monomer that can constitute the oligomer component is preferably 1 to 10 parts by weight, more preferably 3 to 10 parts by weight, and even more preferably 3 to 5 parts by weight, relative to 100 parts by weight of the total amount of the monomer components.

[0274] The monomer components that can constitute the oligomer component may, as necessary, contain a monomer (copolymerizable monomer) that can copolymerize with a ring-containing ethylenically unsaturated monomer or a carboxyl group-containing monomer having a Tg of 60°C to 190°C. The content of such copolymerizable monomers is preferably less than 50% by weight based on 100 parts by weight of the total amount of the monomer components. In terms of being able to exhibit good adhesive properties, the content of such copolymerizable monomers is preferably such that the glass transition temperature of the oligomer component is set to be preferably 60°C or higher, more preferably 65°C to 180°C.

[0275] Examples of the copolymerizable monomer include (meth)acrylates such as methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, isopropyl (meth)acrylate, n-butyl (meth)acrylate, isobutyl (meth)acrylate, s-butyl (meth)acrylate, t-butyl (meth)acrylate, pentyl (meth)acrylate, hexyl (meth)acrylate, heptyl (meth)acrylate, octyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, isooctyl (meth)acrylate, nonyl (meth)acrylate, isononyl (meth)acrylate, decyl (meth)acrylate, and isodecyl (meth)acrylate. acid alkyl esters; epoxy group-containing acrylic monomers such as glycidyl (meth)acrylate and methyl glycidyl (meth)acrylate; vinyl ester monomers such as vinyl acetate and vinyl propionate; hydroxyl group-containing monomers such as hydroxyethyl (meth)acrylate, hydroxypropyl (meth)acrylate and hydroxybutyl (meth)acrylate; alkoxyalkyl (meth)acrylate monomers such as methoxyethyl (meth)acrylate and ethoxyethyl (meth)acrylate; olefin monomers such as ethylene, propylene, isoprene and butadiene; and vinyl ether monomers such as vinyl ether.

[0276] Examples of copolymerizable monomers include polyfunctional monomers such as hexanediol di(meth)acrylate, (poly)ethylene glycol di(meth)acrylate, (poly)propylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, pentaerythritol di(meth)acrylate, glycerin di(meth)acrylate, trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol hexa(meth)acrylate, epoxy acrylate, polyester acrylate, urethane acrylate, divinylbenzene, butyl di(meth)acrylate, and hexyl di(meth)acrylate.

[0277] Examples of copolymerizable monomers include nitrogen atom-containing monomers (e.g., (meth)acrylate aminoalkyl monomers such as aminoethyl (meth)acrylate, N,N-dimethylaminoethyl (meth)acrylate, and t-butylaminoethyl (meth)acrylate; (meth)acrylamide, N,N-dimethyl(meth)acrylamide, N-butyl(meth)acrylamide, and N-hydroxy(meth)acrylamide (N-substituted) amide monomers; acrylonitrile, methacrylonitrile, and other cyanoacrylate monomers; and 2-methacryloyloxyethyl isocyanate and other isocyanate group-containing monomers). However, because such nitrogen atom-containing monomers can cause the adhesive to yellow under heat, it is preferable not to use them when unnecessary.

[0278] The oligomer component can be prepared by any appropriate polymerization method as long as the effects of the present invention are not impaired. Examples of such polymerization methods include solution polymerization, emulsion polymerization, bulk polymerization, and polymerization by ultraviolet irradiation. From the viewpoints of transparency, water resistance, cost, etc., solution polymerization is preferred.

[0279] In the solution polymerization method, various common solvents can be used. Examples of such solvents include organic solvents such as esters such as ethyl acetate and n-butyl acetate; aromatic hydrocarbons such as toluene and benzene; aliphatic hydrocarbons such as n-hexane and n-heptane; alicyclic hydrocarbons such as cyclohexane and methylcyclohexane; and ketones such as methyl ethyl ketone and methyl isobutyl ketone. The solvent may be one type only, or two or more types may be used.

[0280] Any appropriate polymerization initiator, chain transfer agent, etc. that can be used in the polymerization of the oligomer component can be adopted as long as the effects of the present invention are not impaired.

[0281] The amount of the polymerization initiator used can be any appropriate amount as long as the effects of the present invention are not impaired. Such an amount is preferably, for example, 0.1% by weight to 15% by weight based on the total amount of the monomer components.

[0282] The amount of the chain transfer agent used can be any appropriate amount as long as the effects of the present invention are not impaired. Such an amount is preferably, for example, 0.01% by weight to 15% by weight based on the total amount of the monomer components.

[0283] In terms of more effectively expressing the effects of the present invention, the weight average molecular weight of the oligomer component is preferably 3000 to 6000, more preferably 3300 to 5500, and even more preferably 3500 to 5000. The weight average molecular weight of the oligomer component can be controlled by, in addition to the types and amounts of the polymerization initiator and the chain transfer agent, the temperature and time during polymerization, the monomer concentration, the monomer dropping rate, and the like.

[0284] When the acrylic adhesive composition z2 contains the acrylic polymer P5 and the oligomer component, in terms of more effectively expressing the effects of the present invention, the content ratio of the acrylic polymer P5 and the oligomer component is preferably 10 parts by weight to 35 parts by weight, and more preferably 15 parts by weight to 30 parts by weight, based on the solid content (100 parts by weight) of the acrylic polymer P5.

[0285] <A-8-3. Crosslinking Agent> The acrylic adhesive composition z2 may contain a crosslinking agent. The crosslinking agent may be only one kind or two or more kinds.

[0286] The content ratio of the crosslinking agent in the acrylic adhesive composition Z2 can adopt any appropriate content ratio as long as the effects of the present invention are not impaired. Such content ratios, in terms of being able to more effectively exhibit the effects of the present invention, are preferably 0.005 parts by weight to 20 parts by weight, more preferably 0.01 parts by weight to 15 parts by weight, still more preferably 0.01 parts by weight to 10 parts by weight, particularly preferably 0.05 parts by weight to 8 parts by weight, and most preferably 0.1 parts by weight to 6 parts by weight, based on the solid content (100 parts by weight) of the acrylic polymer P5.

[0287] Examples of the crosslinking agent include those exemplified in the section <A-5-2. Crosslinking agent>.

[0288] <A-8-4. Tackifier> The acrylic adhesive composition Z2 may contain a tackifier. The tackifier may be only one type or two or more types.

[0289] Any appropriate tackifier can be adopted as the tackifier.

[0290] The content ratio of the tackifier can adopt any appropriate content ratio as long as the effects of the present invention are not impaired. Such content ratios, in terms of being able to more effectively exhibit the effects of the present invention, are preferably 1 part by weight to 80 parts by weight, more preferably 5 parts by weight to 70 parts by weight, still more preferably 10 parts by weight to 50 parts by weight, and particularly preferably 10 parts by weight to 40 parts by weight, based on the solid content (100 parts by weight) of the acrylic polymer P5. By adding the tackifier, the adhesive force can be enhanced.

[0291] <A-8-5. Other components> The acrylic pressure-sensitive adhesive composition z2 may contain any appropriate other component as long as the effects of the present invention are not impaired. Examples of such other components include other polymer components, silane coupling agents, fatty acid esters, silicone additives, antioxidants, inorganic fillers, organic fillers, metal powders, colorants (pigments, dyes, etc.), foil-like materials, UV absorbers, antioxidants, light stabilizers, plasticizers, softeners, antistatic agents, conductive agents, stabilizers, surface lubricants, leveling agents, corrosion inhibitors, heat stabilizers, polymerization inhibitors, lubricants, and catalysts. The other components may be one type only, or two or more types.

[0292] The content ratio of other components in the acrylic pressure-sensitive adhesive composition z2 is preferably 0 to 40 parts by weight, more preferably 0 to 30 parts by weight, and even more preferably 0 to 20 parts by weight, relative to the solid content (100 parts by weight) of the acrylic polymer P5.

[0293] <A-9. Carrier Film C> The carrier film C includes a base layer C1 and an adhesive layer C2 composed of an adhesive c2.

[0294] The base material layer C1 may be a single layer or may be two or more layers. The base material layer C1 is typically a single layer.

[0295] The pressure-sensitive adhesive layer C2 may be a single layer or may be two or more layers, and is typically a single layer.

[0296] The carrier film C may include any other appropriate layers as long as the effects of the present invention are not impaired, as long as the carrier film C includes the base layer C1 and the pressure-sensitive adhesive layer C2. For example, the carrier film C may be a laminate including the base layer C1 and the pressure-sensitive adhesive layer C2.

[0297] An antistatic layer containing any suitable antistatic agent such as a conductive polymer, carbon nanotube, or ion-conductive polymer can be provided on the surface of the base layer C1 on which the adhesive layer C2 is not attached, for the purpose of suppressing the generation of static electricity, etc.

[0298] The thickness of the base layer C1 is preferably 1 μm to 500 μm, more preferably 5 μm to 300 μm, even more preferably 10 μm to 100 μm, particularly preferably 15 μm to 90 μm, and most preferably 20 μm to 80 μm. When the thickness of the base layer C1 is within the above range, the effects of the present invention can be more effectively exhibited.

[0299] The thickness of the pressure-sensitive adhesive layer C2 is preferably 1 μm to 250 μm, more preferably 2 μm to 150 μm, even more preferably 3 μm to 100 μm, particularly preferably 5 μm to 50 μm, and most preferably 7 μm to 30 μm. When the thickness of the pressure-sensitive adhesive layer C2 is within the above range, the effects of the present invention can be more effectively exhibited.

[0300] The total thickness of the carrier film C is preferably 2 μm to 800 μm, more preferably 7 μm to 500 μm, even more preferably 13 μm to 250 μm, particularly preferably 20 μm to 200 μm, and most preferably 27 μm to 150 μm. When the thickness of the carrier film C is within the above range, the effects of the present invention can be more effectively exhibited.

[0301] The carrier film C can be produced by any appropriate method, such as a known method for producing a laminate including a base layer and a pressure-sensitive adhesive layer. Examples of such production methods include a method (direct method) in which a pressure-sensitive adhesive composition for forming the pressure-sensitive adhesive layer C2 is applied to a base layer C1, and if necessary, heated or dried, and if necessary, cured to form the pressure-sensitive adhesive layer C2 in a sheet form on the base layer C1, and a method (transfer method) in which a pressure-sensitive adhesive composition for forming the pressure-sensitive adhesive layer C2 is applied to an appropriate base such as a release paper, and if necessary, heated or dried, and if necessary, cured to form the pressure-sensitive adhesive layer C2 on the base, and the formed pressure-sensitive adhesive layer C2 is transferred onto the base layer C1.

[0302] Regarding the means for applying the adhesive composition, heating and drying of the adhesive composition, and curing of the adhesive composition, the description regarding the means for applying the acrylic adhesive composition x, heating and drying of the acrylic adhesive composition x, and curing of the acrylic adhesive composition x in the section of <<A-5. Adhesive X>> can be cited.

[0303] <A-9-1. Substrate layer C1> As the material of the substrate layer C1, any appropriate substrate layer can be adopted as long as the effects of the present invention are not impaired. Examples of such materials for the substrate layer include plastics, paper, metal films, and non-woven fabrics. Preferably, it is plastic. That is, the substrate layer C1 is preferably a plastic film. The substrate layer C1 may be composed of one kind of material or two or more kinds of materials. The substrate layer C1 may be composed of, for example, two or more kinds of plastics.

[0304] Examples of the plastic include polyester resins, polyolefin resins, cyclic polyolefin resins, cellulose resins, polyimide resins, polyamide resins, polyether ether ketone, polyether sulfone, polyarylate resins, and aramid resins. Examples of the polyester resin include polyethylene terephthalate (PET), polybutylene terephthalate (PBT), and polyethylene naphthalate (PEN). Examples of the polyolefin resin include homopolymers of olefin monomers and copolymers of olefin monomers. Specifically, for example, homopolypropylene; propylene copolymers such as block, random, and graft copolymers having an ethylene component as a copolymer component; reactor TPO; ethylene polymers such as low density, high density, linear low density, and ultra-low density; ethylene-propylene copolymers, ethylene-vinyl acetate copolymers, ethylene-methyl acrylate copolymers, ethylene-ethyl acrylate copolymers, ethylene-butyl acrylate copolymers, ethylene-methacrylic acid copolymers, ethylene-methyl methacrylate copolymers, and other ethylene copolymers; are included. Examples of the cyclic polyolefin resin include norbornene resins. Examples of the cellulose resin include triacetyl cellulose (TAC). Examples of the polyimide resin include polyimide (PI).

[0305] For the base material layer C1, a release treatment can be performed by adding a fatty acid amide, polyethyleneimine, a long-chain alkyl-based additive, etc., or a coating layer made of any appropriate release agent such as a silicone-based, long-chain alkyl-based, or fluorine-based release agent can be provided.

[0306] The base material layer C1 may contain any appropriate additive as needed. Examples of the additive that can be contained in the base material layer C1 include antioxidants, ultraviolet absorbers, light stabilizers, antistatic agents, fillers, and pigments. The type, number, and amount of the additive that can be contained in the base material layer C1 can be appropriately set according to the purpose.

[0307] <A-9-2. Adhesive Layer C2> As the adhesive layer C2, an appropriate adhesive layer can be adopted according to the foregoing embodiments.

[0308] In the case of Embodiment 1, the adhesive c2 constituting the adhesive layer C2 is an adhesive X whose adhesive force increases upon irradiation with active energy rays. That is, the adhesive layer C2 is composed of the adhesive X whose adhesive force increases upon irradiation with active energy rays.

[0309] In the case of Embodiment 2, the adhesive c2 constituting the adhesive layer C2 is an adhesive Y whose adhesive force decreases upon irradiation with active energy rays. That is, the adhesive layer C2 is composed of the adhesive Y whose adhesive force decreases upon irradiation with active energy rays.

[0310] In the case of Embodiments 3 and 4, as the adhesive c2 constituting the adhesive layer C2, any appropriate adhesive can be adopted as long as the effects of the present invention are not impaired. Examples of such an adhesive c2 include acrylic adhesives, urethane adhesives, silicone adhesives, and rubber adhesives, and typically, acrylic adhesives. In the case of Embodiment 3, when the adhesive force before irradiation with active energy rays of the adhesive a2 (=adhesive Y) is PA1, the adhesive force of the adhesive b2 is PB, and the adhesive force of the adhesive c2 is PC, for example, acrylic adhesives such that PA1 < PC, acrylic adhesives such that PC < PB, and acrylic adhesives such that PA1 < PC < PB can be mentioned. In the case of Embodiment 4, when the adhesive force after irradiation with active energy rays of the adhesive a2 (=adhesive Y) is PA2, the adhesive force after irradiation with active energy rays of the adhesive b2 (=adhesive X) is PB2, and the adhesive force of the adhesive c2 is PC, for example, acrylic adhesives such that PA2 < PC, acrylic adhesives such that PC < PB2, and acrylic adhesives such that PA2 < PC < PB2 can be mentioned.

[0311] In the case of Embodiments 3 and 4, examples of the adhesive c2 constituting the adhesive layer C2 include an acrylic adhesive Z1.

[0312] ≪A-10. Adhesive Film A≫ The adhesive film A includes a base layer A1 and an adhesive layer A2 composed of an adhesive a2.

[0313] The base material layer A1 may be a single layer or may be two or more layers, and is typically a single layer.

[0314] The pressure-sensitive adhesive layer A2 may be a single layer or may be two or more layers. The pressure-sensitive adhesive layer A2 is typically a single layer.

[0315] The PSA film A may include any other appropriate layer as long as it includes the base layer A1 and the pressure-sensitive adhesive layer A2, as long as the effects of the present invention are not impaired. For example, the PSA film A may be a laminate including the base layer A1 and the pressure-sensitive adhesive layer A2.

[0316] An antistatic layer containing any suitable antistatic agent such as a conductive polymer, carbon nanotube, or ion-conductive polymer may be provided on the surface of the base layer A1 on which the adhesive layer A2 is not attached, for the purpose of suppressing the generation of static electricity, etc.

[0317] The thickness of the base layer A1 is preferably 1 μm to 500 μm, more preferably 5 μm to 300 μm, even more preferably 10 μm to 100 μm, particularly preferably 15 μm to 90 μm, and most preferably 20 μm to 80 μm. When the thickness of the base layer A1 is within the above range, the effects of the present invention can be more effectively exhibited.

[0318] The thickness of the pressure-sensitive adhesive layer A2 is preferably 1 μm to 250 μm, more preferably 2 μm to 150 μm, even more preferably 3 μm to 100 μm, particularly preferably 5 μm to 50 μm, and most preferably 7 μm to 30 μm. When the thickness of the pressure-sensitive adhesive layer A2 is within the above range, the effects of the present invention can be more effectively exhibited.

[0319] The total thickness of the adhesive film A is preferably 2 μm to 800 μm, more preferably 7 μm to 500 μm, still more preferably 13 μm to 250 μm, particularly preferably 20 μm to 200 μm, and most preferably 27 μm to 150 μm. If the thickness of the adhesive film A is within the above range, the effects of the present invention can be more effectively exhibited.

[0320] The adhesive film A can be produced by any suitable method, such as a known method for producing a laminate including a base material layer and an adhesive layer. Examples of such production methods include a direct method in which an adhesive composition for forming the adhesive layer A2 is applied onto the base material layer A1, heated and dried as necessary, and cured as necessary to form the adhesive layer A2 in a sheet shape on the base material layer A1, and a transfer method in which an adhesive composition for forming the adhesive layer A2 is applied onto a suitable base material such as release paper, heated and dried as necessary, and cured as necessary to form the adhesive layer A2 on the base material, and then the formed adhesive layer A2 is transferred onto the base material layer A1.

[0321] Regarding the means for applying the adhesive composition, the heating and drying of the adhesive composition, and the curing of the adhesive composition, the descriptions of the means for applying the acrylic adhesive composition x, the heating and drying of the acrylic adhesive composition x, and the curing of the acrylic adhesive composition x in the section of ≪A-5. Adhesive X≫ can be cited.

[0322] <A-10-1. Base material layer A1> As the base material layer A1, any suitable base material layer can be adopted as long as the effects of the present invention are not impaired. For the description of such a base material layer, the description of the base material layer C1 described in the section of <A-9-1. Base material layer C1> can be cited. Note that the base material layer A1 may be the same as or different from the base material layer C1.

[0323] <A-10-2. Adhesive layer A2> As the adhesive layer A2, a suitable adhesive layer can be adopted according to the aforementioned embodiments.

[0324] In the cases of Embodiments 1 and 2, as the adhesive a2 constituting the adhesive layer A2, any appropriate adhesive can be adopted as long as the effects of the present invention are not impaired. Examples of such an adhesive c2 include acrylic adhesives, urethane adhesives, silicone adhesives, and rubber adhesives, and typically, an acrylic adhesive. As such an acrylic adhesive, in the case of Embodiment 1, when the adhesive force of the adhesive a2 is PA and the adhesive force of the adhesive c2 (=adhesive X) after active energy ray irradiation is PC2, for example, an acrylic adhesive such that PA < PC2 can be mentioned. In the case of Embodiment 2, when the adhesive force of the adhesive a2 is PA and the adhesive force of the adhesive c2 (=adhesive Y) before active energy ray irradiation is PC1, for example, an acrylic adhesive such that PA < PC1 can be mentioned.

[0325] In the cases of Embodiments 1 and 2, examples of the adhesive a2 constituting the adhesive layer A2 include an acrylic adhesive Z1.

[0326] In the cases of Embodiments 3 and 4, the adhesive a2 constituting the adhesive layer A2 is an adhesive Y whose adhesive force decreases by active energy ray irradiation. That is, the adhesive layer A2 is composed of the adhesive Y whose adhesive force decreases by active energy ray irradiation.

[0327] ≪A-11. Adhesive Film B≫ The adhesive film B includes a base material layer B1 and an adhesive layer B2 composed of an adhesive b2.

[0328] The base material layer B1 may be only one layer or two or more layers. Typically, the base material layer B1 is one layer.

[0329] The adhesive layer B2 may be only one layer or two or more layers. Typically, the adhesive layer B2 is one layer.

[0330] The PSA film B may include any other appropriate layer as long as it includes the base layer B1 and the pressure-sensitive adhesive layer B2, as long as the effects of the present invention are not impaired. The PSA film B may be, for example, a laminate including the base layer B1 and the pressure-sensitive adhesive layer B2.

[0331] An antistatic layer containing any suitable antistatic agent such as a conductive polymer, carbon nanotube, or ion-conductive polymer may be provided on the surface of the base material layer B1 on which the adhesive layer B2 is not attached, for the purpose of suppressing the generation of static electricity, etc.

[0332] The thickness of the base layer B1 is preferably 1 μm to 500 μm, more preferably 5 μm to 300 μm, even more preferably 10 μm to 100 μm, particularly preferably 15 μm to 90 μm, and most preferably 20 μm to 80 μm. When the thickness of the base layer B1 is within the above range, the effects of the present invention can be more effectively exhibited.

[0333] The thickness of the pressure-sensitive adhesive layer B2 is preferably 1 μm to 250 μm, more preferably 2 μm to 150 μm, even more preferably 3 μm to 100 μm, particularly preferably 5 μm to 50 μm, and most preferably 7 μm to 30 μm. When the thickness of the pressure-sensitive adhesive layer B2 is within the above range, the effects of the present invention can be more effectively exhibited.

[0334] The total thickness of the pressure-sensitive adhesive film B is preferably 2 μm to 800 μm, more preferably 7 μm to 500 μm, even more preferably 13 μm to 250 μm, particularly preferably 20 μm to 200 μm, and most preferably 27 μm to 150 μm. When the thickness of the pressure-sensitive adhesive film B is within the above range, the effects of the present invention can be more effectively exhibited.

[0335] The adhesive film B can be produced by any suitable method, such as a known method for producing a laminate including a base material layer and an adhesive layer. Such production methods include, for example, a method (direct method) of applying an adhesive composition for forming the adhesive layer B2 onto the base material layer B1, heating and drying as necessary, and curing as necessary to form the adhesive layer B2 in a sheet shape on the base material layer B1, and a method (transfer method) of applying an adhesive composition for forming the adhesive layer B2 onto a suitable base material such as release paper, heating and drying as necessary, and curing as necessary to form the adhesive layer B2 on the base material, and then transferring the formed adhesive layer B2 onto the base material layer B1.

[0336] Regarding the means for applying the adhesive composition, heating and drying of the adhesive composition, and curing of the adhesive composition, the description of the means for applying the acrylic adhesive composition x, heating and drying of the acrylic adhesive composition x, and curing of the acrylic adhesive composition x in the section of ≪A-5. Adhesive X≫ can be incorporated.

[0337] <A-11-1. Base material layer B1> As the base material layer B1, any suitable base material layer can be adopted as long as the effects of the present invention are not impaired. Regarding the description of such a base material layer, the description of the base material layer C1 described in the section of <A-9-1. Base material layer C1> can be incorporated. Note that the base material layer B1 may be the same as the base material layer C1 or different from the base material layer C1.

[0338] <A-11-2. Adhesive layer B2> As the adhesive layer B2, a suitable adhesive layer can be adopted according to the aforementioned embodiments.

[0339] In the case of Embodiments 1, 2, and 3, as the adhesive b2 constituting the adhesive layer B2, any suitable adhesive can be employed as long as the effects of the present invention are not impaired. Examples of such an adhesive b2 include acrylic adhesives, urethane adhesives, silicone adhesives, and rubber adhesives. Typically, it is an acrylic adhesive. As such an acrylic adhesive, in the case of Embodiment 1, when the adhesive force of the adhesive b2 is PB and the adhesive force of the adhesive c2 (=adhesive X) before active energy ray irradiation is PC1, for example, an acrylic adhesive such that PC1 < PB can be mentioned. In the case of Embodiment 2, when the adhesive force of the adhesive b2 is PB and the adhesive force of the adhesive c2 (=adhesive Y) after active energy ray irradiation is PC2, for example, an acrylic adhesive such that PC2 < PB can be mentioned. In the case of Embodiment 3, when the adhesive force of the adhesive b2 is PB and the adhesive force of the adhesive c2 is PC, for example, an acrylic adhesive such that PC < PB can be mentioned.

[0340] In the case of Embodiments 1, 2, and 3, examples of the adhesive b2 constituting the adhesive layer B2 include an acrylic adhesive Z2.

[0341] In the case of Embodiment 4, the adhesive b2 constituting the adhesive layer B2 is an adhesive X whose adhesive force increases by active energy ray irradiation. That is, the adhesive layer B2 is composed of an adhesive X whose adhesive force increases by active energy ray irradiation.

[0342] ≪A-12. Other Layers≫ The reinforcing film according to the embodiment of the present invention may have any suitable other layer as long as the effects of the present invention are not impaired. Such other layers may be only one type or two or more types. Examples of such other layers include a release liner and an antistatic layer.

[0343] <A-12-1. Release Liner> The thickness of the release liner is preferably 1 μm to 300 μm, more preferably 10 μm to 200 μm, even more preferably 20 μm to 150 μm, particularly preferably 35 μm to 100 μm, and most preferably 50 μm to 80 μm, in order to better exhibit the effects of the present invention.

[0344] The release liner typically comprises a resin substrate film.

[0345] Examples of the resin substrate film include plastic films made of polyester-based resins such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), and polybutylene terephthalate (PBT); plastic films made of olefin-based resins containing α-olefin as a monomer component, such as polyethylene (PE), polypropylene (PP), polymethylpentene (PMP), ethylene-propylene copolymer, and ethylene-vinyl acetate copolymer (EVA); plastic films made of polyvinyl chloride (PVC); plastic films made of vinyl acetate-based resins; plastic films made of polycarbonate (PC); and plastic films made of polyphenylene sulfide (PPS). plastic films made of amide-based resins such as polyamide (nylon) and wholly aromatic polyamide (aramid); plastic films made of polyimide-based resins; plastic films made of polyether ether ketone (PEEK); plastic films made of olefin-based resins such as polyethylene (PE) and polypropylene (PP); and plastic films made of fluorine-based resins such as polytetrafluoroethylene, polychlorotrifluoroethylene, polyvinyl fluoride, polyvinylidene fluoride, tetrafluoroethylene-hexafluoropropylene copolymer, and chlorofluoroethylene-vinylidene fluoride copolymer.

[0346] The resin substrate film may be composed of only one layer, or may be composed of two or more layers. The resin substrate film may be a stretched film.

[0347] The resin substrate film may be subjected to a surface treatment, such as corona treatment, plasma treatment, chromic acid treatment, ozone exposure, flame exposure, high-voltage shock exposure, ionizing radiation treatment, or coating with a primer.

[0348] The resin substrate film may contain any appropriate additives as long as the effects of the present invention are not impaired.

[0349] The release liner may have a release layer. When the release liner has a release layer, typically the release layer side is laminated directly onto the pressure-sensitive adhesive layer of the pressure-sensitive adhesive film.

[0350] Any suitable material can be used for forming the release layer as long as it does not impair the effects of the present invention. Examples of such materials include silicone-based release agents, fluorine-based release agents, long-chain alkyl-based release agents, and fatty acid amide-based release agents. Among these, silicone-based release agents are preferred. The release layer can be formed as a coating layer.

[0351] The thickness of the release layer may be any appropriate thickness depending on the purpose, as long as it does not impair the effects of the present invention. Such a thickness is preferably 10 nm to 2000 nm, more preferably 10 nm to 1500 nm, even more preferably 10 nm to 1000 nm, and particularly preferably 10 nm to 500 nm.

[0352] The release layer may be a single layer or two or more layers.

[0353] Examples of the silicone-based release layer include addition reaction type silicone resins. Specific examples of the addition reaction type silicone resins include, for example, KS-774, KS-775, KS-778, KS-779H, KS-847H, KS-847T manufactured by Shin-Etsu Chemical Co., Ltd.; TPR-6700, TPR-6710, TPR-6721 manufactured by Toshiba Silicone Co., Ltd.; SD7220, SD7226 manufactured by Toray Dow Corning Co., Ltd.; and the like. The coating amount (after drying) of the silicone-based release layer is preferably 0.01 g / m 2 ~2 g / m 2 and more preferably 0.01 g / m 2 ~1 g / m 2 and even more preferably 0.01 g / m 2 ~0.5 g / m 2 .

[0354] The release layer can be formed, for example, by applying the above-mentioned forming material onto an arbitrary appropriate layer by a conventionally known coating method such as reverse gravure coating, bar coating, die coating, etc., and then usually curing by heat treatment at about 120 to 200 °C. Further, if necessary, heat treatment and irradiation with active energy rays such as ultraviolet irradiation may be used in combination.

[0355] The release liner may have an antistatic layer.

[0356] Regarding the antistatic layer, the description in the section of <A-12-2. Antistatic layer> described later can be cited.

[0357] One embodiment of the release liner includes a resin base film and a release layer in this order. Typically, this embodiment consists of a resin base film and a release layer.

[0358] Another embodiment of the release liner includes a resin base film, an antistatic layer, and a release layer in this order. Typically, this embodiment consists of a resin base film, an antistatic layer, and a release layer.

[0359] Another embodiment of the release liner includes an antistatic layer, a resin base film, an antistatic layer, and a release layer in this order. Typically, this embodiment consists of an antistatic layer, a resin base film, an antistatic layer, and a release layer.

[0360] <A-12-2. Antistatic layer> The antistatic layer can be provided, for example, on the side opposite to the adhesive layer of the base material layer or between the base material layer and the adhesive layer.

[0361] As the thickness of the antistatic layer, any appropriate thickness can be adopted as long as the effects of the present invention are not impaired. Such a thickness is preferably 1 nm to 1000 nm, more preferably 5 nm to 900 nm, still more preferably 7.5 nm to 800 nm, and particularly preferably 10 nm to 700 nm.

[0362] The antistatic layer may be only one layer or two or more layers.

[0363] As the antistatic layer, any appropriate antistatic layer can be adopted as long as it can exhibit an antistatic effect and does not impair the effects of the present invention. Such an antistatic layer is preferably an antistatic layer formed by coating a conductive coating liquid containing a conductive polymer on any appropriate base material layer. Specifically, for example, it is an antistatic layer formed by coating a conductive coating liquid containing a conductive polymer on a resin base film. Specific coating methods include roll coating method, bar coating method, gravure coating method, etc.

[0364] Any suitable conductive polymer may be used as the conductive polymer as long as it does not impair the effects of the present invention. Examples of such conductive polymers include conductive polymers in which a π-conjugated conductive polymer is doped with a polyanion. Examples of π-conjugated conductive polymers include chain-like conductive polymers such as polythiophene, polypyrrole, polyaniline, and polyacetylene. Examples of polyanions include polystyrene sulfonic acid, polyisoprene sulfonic acid, polyvinyl sulfonic acid, polyallyl sulfonic acid, polyacrylate ethyl sulfonic acid, and polymethacrylic carboxylic acid. Only one type of conductive polymer may be used, or two or more types may be used.

[0365] <<B. Manufacturing of reinforcing film>> The reinforcing film according to the embodiment of the present invention can be produced by any appropriate method as long as the effects of the present invention are not impaired.

[0366] As a representative example of a method for manufacturing a reinforced film according to an embodiment of the present invention, we will explain a case where the reinforced film according to an embodiment of the present invention has a release liner, two adhesive films (one adhesive film A and one adhesive film B), and a carrier film C, in that order, and one adhesive film A and one adhesive film B are laminated in an arrangement with a gap between them.

[0367] In one embodiment of the method for producing a reinforcing film according to the present invention, a laminate (X) having two adhesive films on one release liner and a carrier film C are each produced, and then the surface of the base material layer of the laminate (X) and the surface of the adhesive layer of the carrier film C are attached to one carrier film C.

[0368] The laminate (X) can be produced, for example, by applying a pressure-sensitive adhesive composition that forms the pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer of the pressure-sensitive adhesive film onto a substrate layer, and optionally heating and drying the composition and optionally curing the composition to form the pressure-sensitive adhesive layer on the substrate layer. The laminate (X) can be produced by attaching one release liner (on the release layer side, if any) to the surface of the pressure-sensitive adhesive layers A2 and B2 of the two pressure-sensitive adhesive films A and B obtained in this way, opposite the substrate layers A1 and B1, so that the two pressure-sensitive adhesive films A and B are arranged with a gap between them.

[0369] The carrier film C is produced, for example, by applying an adhesive composition that forms the adhesive c2 that constitutes the adhesive layer C2 onto a base layer C1, heating and drying as necessary, and curing as necessary to form the adhesive layer C2 on the base layer C1.

[0370] Until the laminate (X) and the protective film are attached, any appropriate release liner may be attached to protect the exposed surface of the pressure-sensitive adhesive layer C2 of the carrier film C.

[0371] <<C. Uses of reinforcing film>> The reinforced film according to the embodiment of the present invention can be used for any suitable application. For example, the reinforced film according to the embodiment of the present invention is preferably used for reinforcing optical components and electronic components. Examples of optical components include LCDs, touch panels using LCDs, color filters used in LCDs, polarizing plates, and the like.

[0372] The optical and electronic components may be flexible devices such as bendable devices (devices that can be bent) having movable bending parts, foldable devices (devices that can be folded), or rollable devices (devices that can be rolled up). [Example]

[0373] The present invention will be specifically described below using examples, but the present invention is not limited to these examples. The test and evaluation methods used in the examples are as follows. The term "parts" means "parts by weight" unless otherwise specified, and the term "%" means "% by weight" unless otherwise specified.

[0374] <Measurement of adhesive strength to glass> (Measurement of adhesive strength to glass before UV irradiation) The carrier film with release liner and the PSA film with release liner were cut to 25 mm TD x 100 mm MD, and the release liner was peeled off. The samples were then applied to glass (Matsunami Glass, S2004U8) using a 2 kg roller in one stroke. The resulting evaluation samples were stored at room temperature for 30 minutes and then measured using a tensile tester. The tensile tester used was the Shimadzu Autograph AG-Xplus HS 6000 mm / min High-Speed ​​Model (AG-50NX plus). The evaluation samples were placed in the tensile tester and the tensile test was initiated. The test conditions were a peel angle of 180° and a peel speed (pulling rate) of 300 mm / min. The load measured when the evaluation samples were peeled from the glass was the average load used to determine the adhesive strength to glass before UV irradiation. (Measurement of adhesive strength to glass after UV irradiation) The carrier film with release liner and the adhesive film with release liner were cut to TD 25 mm x MD 100 mm, the release liner was peeled off, and the film was attached to glass (Matsunami Glass, S2004U8) with a 2 kg roller. The obtained evaluation samples were irradiated with an integrated light intensity of 4000 mJ / cm using an LED light source with a wavelength of 365 nm from the carrier film side or the adhesive film side. 2The adhesive layer was photocured by irradiating it with ultraviolet light. After storing it at room temperature for 30 minutes, it was measured using a tensile tester. The tensile tester used was an "Autograph AG-Xplus HS 6000mm / min high-speed model (AG-50NX plus)" manufactured by Shimadzu Corporation. After placing the evaluation sample in the tensile tester, the tensile test was started. The conditions for the tensile test were a peel angle of 180 degrees and a peel speed (pulling speed) of 300 mm / min. The load when peeling the evaluation sample from the glass was measured, and the average load at that time was taken as the adhesive strength to glass after ultraviolet irradiation.

[0375] <Removability evaluation> (Preparation of Adherend for Measurement) To simulate an OLED panel as an adherend, a 25 μm thick polyimide film (manufactured by UBE, product name "Upilex S") was attached to a glass plate (manufactured by Matsunami Glass Industrial Co., Ltd., blue plate with polished edges, 100 mm x 100 mm x 1.3 mm) via a 15 μm thick double-sided adhesive tape (manufactured by Nitto Denko, product name "No. 7") to prepare a polyimide film substrate for measurement. (ultraviolet irradiation) The release liner was peeled off from the reinforced film obtained in each of the Examples and Comparative Examples, and the exposed pressure-sensitive adhesive layer was attached to a polyimide film substrate as a measurement adherend to prepare a measurement sample. An LED light source with a wavelength of 365 nm was used to illuminate the carrier film side of the measurement sample with an integrated light intensity of 4000 mJ / cm. 2 3b and 4b, in the embodiments where there are areas where UV irradiation is not performed (typically, in the embodiments 1 and 2), aluminum foil was used as a shielding plate to cover the areas where UV irradiation is not performed and the adjacent gaps to block the UV rays. (evaluation) After UV irradiation, a 2 cm portion of a 5 cm adhesive tape (Nitto Denko Corporation, No. 31 tape) was attached to the carrier film side surface of the measurement sample, and the remaining 3 cm portion was peeled off by holding the edge. After peeling, the releasability of the large-area adhesive film was judged as good or bad based on whether the large-area adhesive film was peeled off together with the carrier film. In addition, the measurement sample after peeling was visually checked for any lifting or peeling of the small-area adhesive film from the measurement substrate, and the releasability of the small-area adhesive film was judged as good or bad. Large area adhesive film releasability ◯: The large area adhesive film was peeled off together with the carrier film. ×: The large area adhesive film could not be peeled off together with the carrier film. Removability of small area adhesive film 〇: No lifting or peeling of the small area adhesive film from the test substrate ×: A small area of ​​the adhesive film was observed to be lifted or peeled off from the test adherend.

[0376] [Production Example 1] Production of adhesive composition (x-1) <Preparation of acrylic polymer> A reaction vessel equipped with a thermometer, stirrer, reflux condenser, and nitrogen gas inlet tube was charged with 95 parts by weight of butyl acrylate (BA) and 5 parts by weight of acrylic acid (AA) as monomers, 0.2 parts by weight of azobisisobutyronitrile (AIBN) as a thermal polymerization initiator, and 233 parts by weight of ethyl acetate as a solvent. Nitrogen gas was introduced and the mixture was purged with nitrogen for approximately 1 hour while stirring. The mixture was then heated to 60°C and reacted for 7 hours to obtain a solution of an acrylic polymer with a weight-average molecular weight of 600,000. <Production of Pressure-Sensitive Adhesive Composition (x-1)> To the solution of the acrylic polymer obtained above, 0.5 parts by weight of a tetrafunctional epoxy compound (manufactured by Mitsubishi Gas Chemical Company, "Tetrad C") as a crosslinking agent, 30 parts by weight of "NK Ester A200" (polyethylene glycol #200 (n = 4) diacrylate, molecular weight 308, functional group equivalent 154 g / eq) as a polyfunctional acrylic monomer manufactured by Shin-Nakamura Chemical Co., Ltd., 0.1 parts by weight of a photopolymerization initiator (manufactured by BASF, "Irgacure 651"), and 0.2 parts by weight of an organometallic crosslinking accelerator (manufactured by Tokyo Chemical Industry Co., Ltd., "zirconium tetraacetylacetonate") were added relative to 100 parts by weight of the solid content of the acrylic polymer to produce a pressure-sensitive adhesive composition (x-1).

[0377] [Production Example 2] Production of adhesive composition (x-2) <Preparation of acrylic polymer> A reaction vessel equipped with a thermometer, stirrer, reflux condenser, and nitrogen gas inlet tube was charged with 63 parts by weight of 2-ethylhexyl acrylate (2EHA), 9 parts by weight of methyl methacrylate (MMA), 13 parts by weight of 2-hydroxyethyl acrylate (HEA), 15 parts by weight of N-vinylpyrrolidone (NVP), 0.2 parts by weight of azobisisobutyronitrile (AIBN) as a thermal polymerization initiator, and 233 parts by weight of ethyl acetate as a solvent. Nitrogen gas was introduced and the mixture was purged with nitrogen for approximately 1 hour while stirring. The mixture was then heated to 60°C and reacted for 7 hours to obtain a solution of an acrylic polymer with a weight-average molecular weight of 1.2 million. <Production of Pressure-Sensitive Adhesive Composition (x-2)> To the solution of the acrylic polymer obtained above, 2.5 parts by weight of a 75% ethyl acetate solution of trimethylolpropane adduct of xylylene diisocyanate (Mitsui Chemicals, "Takenate D110N") as a crosslinking agent in terms of solid content, 30 parts by weight of "NK Ester APG700" (polypropylene glycol #700 (n = 12) diacrylate, molecular weight 808, functional group equivalent weight 404 g / eq) manufactured by Shin-Nakamura Chemical Co., Ltd. as a polyfunctional acrylic monomer, 1 part by weight of photopolymerization initiator (BASF, "Irgacure 184"), 0.005 parts by weight of tris (acetylacetonate) iron (Nippon Chemical Industry, "Nacem Ferric") as an organometallic crosslinking accelerator were added to 100 parts by weight of the acrylic polymer solution, to produce a pressure-sensitive adhesive composition (x-2).

[0378] [Production Example 3] Production of adhesive composition (y1-1) <Preparation of urethane prepolymer> A polymerization experiment apparatus equipped with a 1 L round-bottom separable flask, a separable cover, a separatory funnel, a thermometer, a dry air inlet tube, a Liebig condenser, a vacuum seal, a stirring rod, and a stirring blade was charged with 328.5 g of polytetramethylene glycol (product name "PTMG3000" manufactured by Mitsubishi Chemical Corporation), 8.8 g of polyester polyol (product name "Kuraray Polyol P-2010" manufactured by Kuraray Co., Ltd.), 8.8 g of a compound having a polymerizable unsaturated double bond (product name "Blenmer GLM" manufactured by NOF Corporation), and 150 g of toluene (manufactured by Tosoh Corporation) as a solvent. 0.05 g of bismuth octoate (manufactured by Nippon Chemical Industry Co., Ltd.) was added as a catalyst with stirring, and the mixture was then purged with dry air at room temperature for 2 hours. Next, 26.9 g of hexamethylene diisocyanate (product name "HDI," manufactured by Tosoh Corporation) was added, and the solution temperature in the experimental apparatus was maintained at 70±2°C in a water bath under dry air inflow. The mixture was then maintained for 2 hours. 65.7 g of polypropylene glycol (product name "Sannix GP-1500," manufactured by Sanyo Chemical Industries, Ltd.) was then added, and the mixture was maintained for 2 hours. 12.0 g of hexamethylene diisocyanate (product name "HDI," manufactured by Tosoh Corporation) was then added, and the mixture was maintained for 3 hours under dry air inflow and stirring while maintaining the solution temperature in the experimental apparatus in a water bath at 70±2°C, yielding a solution of urethane prepolymer A. During the polymerization, toluene was added dropwise as needed to control the temperature and prevent a decrease in stirrability due to increased viscosity. The total amount of toluene added was 300 g. The solids concentration of the urethane prepolymer solution was 50 wt%. <Production of Pressure-Sensitive Adhesive Composition (y1-1)> A pressure-sensitive adhesive composition (y1-1) was produced by diluting 100 parts by weight of the urethane prepolymer obtained above, 1.2 parts by weight of an isocyanate compound (Coronate HX:C / HX, manufactured by Nippon Polyurethane Industries, Ltd.) as a crosslinking agent, 30 parts by weight of UA-1100H (manufactured by Shin-Nakamura Chemical Co., Ltd.) as a urethane (meth)acrylate, 1.0 part by weight of Irganox1010 (manufactured by BASF) as an antioxidant, 1.0 part by weight of Omnirad651 (manufactured by BASF) as a photopolymerization initiator, and 0.03 part by weight of Envirizer OL-1 (manufactured by Tokyo Fine Chemicals Co., Ltd.) as a catalyst with ethyl acetate to a total solids content of 50% by weight.

[0379] [Production Example 4] Production of adhesive composition (y1-2) A pressure-sensitive adhesive composition (y1-2) was produced in the same manner as in Production Example 3, except that 30 parts by weight of U-6LPA (manufactured by Shin-Nakamura Chemical Co., Ltd.) was used instead of 30 parts by weight of UA-1100H (manufactured by Shin-Nakamura Chemical Co., Ltd.) as the urethane (meth)acrylate.

[0380] [Production Example 5] Production of adhesive composition (y1-3) <Preparation of acrylic polymer> A reaction vessel equipped with a thermometer, stirrer, reflux condenser, and nitrogen gas inlet tube was charged with 100 parts by weight of 2-ethylhexyl acrylate (2EHA), 26 parts by weight of acryloylmorpholine (ACMO), 19 parts by weight of 2-hydroxyethyl acrylate (HEA), 0.3 parts by weight of Niper BW, and 263 parts by weight of toluene as a solvent. Nitrogen gas was then purged with nitrogen for approximately 1 hour while stirring. The mixture was then heated to 60°C and reacted for 7 hours to obtain an acrylic polymer precursor with a number-average molecular weight of 300,000. To 144 parts by weight of the resulting acrylic polymer precursor, 12 parts by weight of 2-methacryloyloxyethyl isocyanate and 0.06 parts by weight of dibutyltin dilaurate were added. The mixture was stirred under air for approximately 1 hour, and then reacted at 50°C for approximately 7 hours to introduce carbon-carbon double bonds into the inner chains of the polymer molecule, yielding an acrylic polymer. The side chain length at this time was 13 atoms. <Production of Pressure-Sensitive Adhesive Composition (y1-3)> To the acrylic polymer solution obtained above, 4 parts by weight of an isocyanate-based crosslinking agent (manufactured by Mitsui Chemicals, Inc., trade name "Takenate D-101A") as a crosslinking agent and 3 parts by weight of an acetophenone-based photopolymerization initiator (manufactured by IGM Resins BV, trade name "Omnirad651") as a photopolymerization initiator were added relative to 100 parts by weight of the solid content of the acrylic polymer, thereby producing a pressure-sensitive adhesive composition (y1-3).

[0381] [Production Example 6] Production of adhesive composition (z1) <Preparation of acrylic polymer> A reaction vessel equipped with a thermometer, stirrer, reflux condenser, and nitrogen gas inlet was charged with 200 parts by weight of 2-ethylhexyl acrylate (2EHA), 8 parts by weight of 2-hydroxyethyl acrylate (HEA), 0.4 parts by weight of azobisisobutyronitrile (AIBN) as a polymerization initiator, and 312 parts by weight of ethyl acetate as a solvent. Nitrogen gas was introduced while gently stirring, and the polymerization reaction was carried out for 6 hours while maintaining the liquid temperature in the flask at around 65°C, to prepare an acrylic polymer solution (40% by weight). The resulting acrylic polymer had a weight-average molecular weight of 540,000, a glass transition temperature (Tg) of -68°C, and an acid value of 0.0. <Production of Pressure-Sensitive Adhesive Composition (z1)> The acrylic polymer solution (40% by weight) obtained above was diluted to 20% by weight with ethyl acetate. To 100 parts by weight of the solids in this solution, 0.3 parts by weight of polyoxyethylene-1-(allyloxymethyl) alkyl ether ammonium sulfate (trade name "Aqualon KH-10", manufactured by Daiichi Kogyo Seiyaku Co., Ltd.) was added as a surfactant, 5 parts by weight of an isocyanurate of hexamethylene diisocyanate (trade name "Coronate HX", manufactured by Nippon Polyurethane Industry Co., Ltd.) as a crosslinking agent, and 0.03 parts by weight of dioctyltin dilaurate (trade name "OL-1", manufactured by Tokyo Fine Chemical Co., Ltd.) as a crosslinking catalyst. Furthermore, 3 parts by weight of acetylacetone was added as a crosslinking retarder relative to the total solvent amount. The mixture was then mixed and stirred to produce a pressure-sensitive adhesive composition (z1).

[0382] [Production Example 7] Production of adhesive composition (z2) <Preparation of acrylic polymer> A reaction vessel equipped with a thermometer, stirrer, reflux condenser, and nitrogen gas inlet tube was charged with 95 parts by weight of butyl acrylate (BA) and 5 parts by weight of acrylic acid (AA) as monomers, 0.2 parts by weight of azobisisobutyronitrile (AIBN) as a thermal polymerization initiator, and 233 parts by weight of ethyl acetate as a solvent. Nitrogen gas was introduced and the mixture was purged with nitrogen for approximately 1 hour while stirring. The mixture was then heated to 60°C and reacted for 7 hours to obtain a solution of an acrylic polymer with a weight-average molecular weight of 600,000. <Preparation of acrylic oligomer> A reaction vessel equipped with a thermometer, a stirrer, a reflux condenser, and a nitrogen gas inlet tube was charged with 95 parts by weight of cyclohexyl methacrylate (homopolymer (cyclohexyl methacrylate) glass transition temperature: 66 ° C.) as a monomer component, 5 parts by weight of acrylic acid (AA), 3 parts by weight of 2-mercaptoethanol as a chain transfer agent, 0.2 parts by weight of azobisisobutyronitrile (AIBN) as a polymerization initiator, and 103.2 parts by weight of toluene as a solvent, and the mixture was stirred for 1 hour while introducing nitrogen gas. After removing oxygen from the polymerization system in this way, the temperature was raised to 70 ° C. and the reaction was continued for 3 hours, and then for another 2 hours at 75 ° C. to obtain a solution (50 wt%) of an acrylic oligomer having a weight average molecular weight of 4000. <Production of Pressure-Sensitive Adhesive Composition (z2)> To the acrylic polymer solution obtained above, 0.075 parts by weight of a tetrafunctional epoxy compound (manufactured by Mitsubishi Gas Chemical Company, trade name "Tetrad C") as a crosslinking agent and 25 parts by weight (solids) of the above acrylic oligomer were added relative to 100 parts by weight of the solids of the acrylic polymer to produce a pressure-sensitive adhesive composition (z2).

[0383] [Example 1] <Preparation of carrier film C(1) with release liner> The pressure-sensitive adhesive composition (x-1) produced in Production Example 1 was applied to a 75 μm-thick polyethylene terephthalate film (manufactured by Toray Industries, "Lumirror S10") using a fountain roll so that the dried thickness would be 13 μm. After drying at 130°C for 1 minute to remove the solvent, the release-treated surface of a release liner (a 25 μm-thick polyethylene terephthalate film with one side treated with silicone release agent) was bonded to the coated surface of the formed pressure-sensitive adhesive layer. This was then subjected to an aging treatment for 4 days in an atmosphere at 25°C, followed by another aging treatment for 4 days in an atmosphere at 25°C to produce a carrier film C(1) with a release liner having a configuration of release liner (25 μm thick) / pressure-sensitive adhesive layer (13 μm thick) / base layer (75 μm thick). <Preparation of adhesive film A(1) with release liner> (Preparation of substrate with antistatic layer) A 25% aqueous solution of polyester resin (Toyobo Co., Ltd., trade name "Vylonal MD-1480") was used as the binder, and 100 parts by weight of solids, 20 parts by weight of conductive polymer, and 5 parts by weight of melamine-based crosslinker (Sumitomo Chemical Co., Ltd., trade name "Sumimar M-50W") were added to a water / ethanol (1 / 1 (by weight)) mixed solvent and stirred for approximately 20 minutes to thoroughly mix. In this way, a coating material (X) with a solids content of approximately 0.4% was prepared. The conductive polymer used was an aqueous solution (Bytron P, H.C. Stark) containing 0.5% poly(3,4-ethylenedioxythiophene) (PEDOT) and 0.8% polystyrene sulfonate (weight-average molecular weight 150,000) (PSS). The coating material (X) was applied to one side of a 75 μm-thick polyethylene terephthalate film substrate using a bar coater, and then heated at 130°C for 1 minute to dry, producing a substrate with an antistatic layer having a 30 nm-thick transparent antistatic layer on one side of the substrate. <Preparation of adhesive film A(1) with release liner> The adhesive composition (z1) produced in Production Example 6 was applied to the untreated surface (the surface on which the antistatic layer was not formed) of the above-mentioned substrate with an antistatic layer using a fountain roll, and heated at 130°C for 20 seconds to form an adhesive layer with a thickness of 13 μm. Next, a release liner (a 25 μm thick polyethylene terephthalate film with one side treated with silicone release agent) was bonded to the coated surface of the adhesive layer to produce an adhesive film A(1) with a release liner, which had a structure of release liner (25 μm thick) / adhesive layer (13 μm thick) / base layer with antistatic layer (approximately 75 μm thick). <Preparation of adhesive film B(1) with release liner> (Preparation of substrate with antistatic layer) A 25% aqueous solution of polyester resin (Toyobo Co., Ltd., trade name "Vylonal MD-1480") was used as the binder, and 100 parts by weight of solids, 20 parts by weight of conductive polymer, and 5 parts by weight of melamine-based crosslinker (Sumitomo Chemical Co., Ltd., trade name "Sumimar M-50W") were added to a water / ethanol (1 / 1 (by weight)) mixed solvent and stirred for approximately 20 minutes to thoroughly mix. In this way, a coating material (X) with a solids content of approximately 0.4% was prepared. The conductive polymer used was an aqueous solution (Bytron P, H.C. Stark) containing 0.5% poly(3,4-ethylenedioxythiophene) (PEDOT) and 0.8% polystyrene sulfonate (weight-average molecular weight 150,000) (PSS). The coating material (X) was applied to one side of a 75 μm-thick polyethylene terephthalate film substrate using a bar coater, and then heated at 130°C for 1 minute to dry, producing a substrate with an antistatic layer having a 30 nm-thick transparent antistatic layer on one side of the substrate. <Preparation of adhesive film B(1) with release liner> The adhesive composition (z2) produced in Production Example 7 was applied to the untreated surface (the surface on which the antistatic layer was not formed) of the above-mentioned substrate with an antistatic layer using a fountain roll, and heated at 130°C for 60 seconds to form an adhesive layer with a thickness of 13 μm. Next, a release liner (a 25 μm thick polyethylene terephthalate film with one side treated with silicone release agent) was bonded to the coated surface of the adhesive layer to produce adhesive film B(1) with release liner, which had a structure of release liner (25 μm thick) / adhesive layer (13 μm thick) / base layer with antistatic layer (approximately 75 μm thick). <Preparation of Reinforcement Film (1)> The above-mentioned adhesive film A(1) with release liner was cut into a size of 134 mm length x 70 mm width to prepare a large-area adhesive film. The above-mentioned adhesive film B(1) with release liner was cut into a size of 15 mm length x 70 mm width to prepare a small area adhesive film. The large-area adhesive film and the small-area adhesive film were bonded to a release liner (a 25 μm-thick polyethylene terephthalate film with one side treated with silicone release agent) measuring 150 mm long x 70 mm wide, with the adhesive layer of each adhesive film facing the release liner, so that their vertical and horizontal directions were parallel and there was a 1 mm gap between the horizontal sides of the large-area adhesive film and the small-area adhesive film. Note that the release liners of each adhesive film were peeled off before bonding. Next, the carrier film C(1) with release liner was cut to a size of 150 mm in length x 70 mm in width, the release liner was peeled off, and the film was attached to the base layer side of each adhesive film so that it exactly overlapped the release liner measuring 150 mm in length x 70 mm in width when viewed from the planar direction. As a result of the above, a reinforced film (1) was obtained, as shown in FIG. 1, in which two PSA films were arranged with a gap between one release liner and one carrier film. The reinforcing film (1) corresponds to embodiment 1, and when ultraviolet light is irradiated, the area that is not irradiated with ultraviolet light becomes the area of ​​the small area adhesive film, and aluminum foil is used as a shielding plate to cover the area of ​​the small area adhesive film and the gap portion adjacent to it, thereby blocking ultraviolet light. The results are shown in Table 1.

[0384] [Example 2] <Preparation of carrier film C(2) with release liner> The procedure was repeated in the same manner as in Example 1, except that the adhesive composition (x-2) produced in Production Example 2 was used instead of the adhesive composition (x-1) produced in Production Example 1, to produce a carrier film C(2) with a release liner having a structure of release liner (thickness 25 μm) / adhesive layer (thickness 13 μm) / base layer (thickness 75 μm). <Preparation of Reinforcement Film (2)> The same procedure as in Example 1 was carried out, except that the carrier film with release liner C(2) obtained above was used instead of the carrier film with release liner C(1), and a reinforced film (2) was obtained in which two adhesive films were arranged with a gap between one release liner and one carrier film, as shown in Figure 1. The reinforcing film (2) corresponds to embodiment 1, and when ultraviolet light is irradiated, the area that is not irradiated with ultraviolet light becomes the area of ​​the small area adhesive film, and aluminum foil is used as a shielding plate to cover the area of ​​the small area adhesive film and the gap portion adjacent to it, thereby blocking ultraviolet light. The results are shown in Table 1.

[0385] [Example 3] <Preparation of carrier film C(3) with release liner> The procedure of Example 1 was repeated, except that the adhesive composition (y1-1) produced in Production Example 3 was used instead of the adhesive composition (x-1) produced in Production Example 1, to produce a carrier film C(3) with a release liner having a structure of release liner (thickness 25 μm) / adhesive layer (thickness 13 μm) / base layer (thickness 75 μm). <Preparation of Reinforcement Film (3)> The same procedure as in Example 1 was carried out, except that the carrier film with release liner C(3) obtained above was used instead of the carrier film with release liner C(1), and a reinforced film (3) was obtained in which two adhesive films were arranged with a gap between one release liner and one carrier film, as shown in Figure 1. The reinforcing film (3) corresponds to embodiment 2, and when ultraviolet light is irradiated, the area that is not irradiated with ultraviolet light becomes the area of ​​the large-area adhesive film, and aluminum foil is used as a shielding plate to cover the area of ​​the large-area adhesive film and the gap portion adjacent to it, thereby blocking ultraviolet light. The results are shown in Table 1.

[0386] [Example 4] <Preparation of carrier film C(4) with release liner> The procedure of Example 1 was repeated, except that the adhesive composition (y1-2) produced in Production Example 4 was used instead of the adhesive composition (x-1) produced in Production Example 1, to produce a carrier film C(4) with a release liner having a structure of release liner (thickness 25 μm) / adhesive layer (thickness 13 μm) / base layer (thickness 75 μm). <Preparation of Reinforcing Film (4)> The same procedure as in Example 1 was carried out, except that the carrier film with release liner C(4) obtained above was used instead of the carrier film with release liner C(1), and a reinforced film (4) was obtained in which two adhesive films were arranged with a gap between one release liner and one carrier film, as shown in Figure 1. The reinforcing film (4) corresponds to embodiment 2, and when ultraviolet light is irradiated, the area that is not irradiated with ultraviolet light becomes the area of ​​the large-area adhesive film, and aluminum foil is used as a shielding plate to cover the area of ​​the large-area adhesive film and the gap portion adjacent to it, thereby blocking ultraviolet light. The results are shown in Table 1.

[0387] [Example 5] <Preparation of carrier film C(5) with release liner> The procedure of Example 1 was repeated, except that the adhesive composition (x-1) produced in Production Example 1 was replaced with the adhesive composition (y1-3) produced in Production Example 4, to produce a carrier film C(5) with a release liner having a structure of release liner (thickness 25 μm) / adhesive layer (thickness 13 μm) / base layer (thickness 75 μm). <Preparation of Reinforcing Film (5)> The same procedure as in Example 1 was carried out, except that the carrier film with release liner C(5) obtained above was used instead of the carrier film with release liner C(1), and a reinforced film (5) was obtained in which two adhesive films were arranged with a gap between one release liner and one carrier film, as shown in Figure 1. The reinforcing film (5) corresponds to embodiment 2, and when ultraviolet light is irradiated, the area that is not irradiated with ultraviolet light becomes the area of ​​the large-area adhesive film, and aluminum foil is used as a shielding plate to cover the area of ​​the large-area adhesive film and the gap portion adjacent to it, thereby blocking ultraviolet light. The results are shown in Table 1.

[0388] [Example 6] <Preparation of carrier film C(6) with release liner> The procedure of Example 1 was repeated, except that the adhesive composition (z1) produced in Production Example 6 was used instead of the adhesive composition (x-1) produced in Production Example 1, to produce a carrier film C(6) with a release liner having a structure of release liner (thickness 25 μm) / adhesive layer (thickness 13 μm) / base layer (thickness 75 μm). <Preparation of adhesive film A(6) with release liner> The same procedure as in Example 1 was carried out, except that the adhesive composition (y1-1) produced in Production Example 3 was used instead of the adhesive composition (z1) produced in Production Example 6, to produce an adhesive film A(6) with a release liner having a structure of release liner (thickness 25 μm) / adhesive layer (thickness 13 μm) / base layer with antistatic layer (thickness approximately 75 μm). <Preparation of Reinforcing Film (6)> The same procedure as in Example 1 was carried out, except that the carrier film C(6) with a release liner was used instead of the carrier film C(1) with a release liner, and the adhesive film A(6) with a release liner obtained above was used instead of the adhesive film A(1) with a release liner, to obtain a reinforced film (6) as shown in Figure 1, in which two adhesive films are arranged with a gap between one release liner and one carrier film. The reinforcing film (6) corresponds to the third embodiment, and the entire surface of the carrier film was irradiated with ultraviolet light. The results are shown in Table 1.

[0389] [Example 7] <Preparation of adhesive film A(7) with release liner> The same procedure as in Example 1 was carried out, except that the adhesive composition (y1-2) produced in Production Example 4 was used instead of the adhesive composition (z1) produced in Production Example 6, to produce an adhesive film A(7) with a release liner having a structure of release liner (thickness 25 μm) / adhesive layer (thickness 13 μm) / base layer with antistatic layer (thickness approximately 75 μm). <Preparation of reinforcing film (7)> The same procedure as in Example 6 was carried out, except that the adhesive film with release liner A (7) obtained above was used instead of the adhesive film with release liner A (6), to obtain a reinforced film (7) in which two adhesive films are arranged with a gap between one release liner and one carrier film, as shown in Figure 1. The reinforcing film (7) corresponds to the third embodiment, and the entire surface of the carrier film was irradiated with ultraviolet light. The results are shown in Table 1.

[0390] [Example 8] <Preparation of adhesive film B(8) with release liner> The same procedure as in Example 1 was carried out, except that the adhesive composition (x-1) obtained in Production Example 1 was used instead of the adhesive composition (z2) produced in Production Example 7, to produce an adhesive film B(8) with a release liner having a structure of release liner (thickness 25 μm) / adhesive layer (thickness 13 μm) / base layer with antistatic layer (thickness approximately 75 μm). <Preparation of reinforcing film (8)> The same procedure as in Example 6 was carried out, except that the adhesive film with release liner B(8) obtained above was used instead of the adhesive film with release liner B(1), to obtain a reinforced film (8) in which two adhesive films are arranged with a gap between one release liner and one carrier film, as shown in Figure 1. The reinforcing film (8) corresponds to the fourth embodiment, and the entire surface of the carrier film was irradiated with ultraviolet light. The results are shown in Table 1.

[0391] [Example 9] <Preparation of adhesive film B(9) with release liner> The same procedure as in Example 1 was carried out, except that the adhesive composition (x-2) obtained in Production Example 2 was used instead of the adhesive composition (z2) produced in Production Example 7, to produce an adhesive film B(9) with a release liner having a structure of release liner (thickness 25 μm) / adhesive layer (thickness 13 μm) / base layer with antistatic layer (thickness approximately 75 μm). <Preparation of reinforcing film (9)> The same procedure as in Example 8 was carried out, except that the adhesive film with release liner B (9) obtained above was used instead of the adhesive film with release liner B (8), and a reinforced film (9) was obtained in which two adhesive films were arranged with a gap between one release liner and one carrier film, as shown in Figure 1. The reinforcing film (9) corresponds to the fourth embodiment, and the entire surface of the carrier film was irradiated with ultraviolet light. The results are shown in Table 1.

[0392] [Example 10] <Preparation of Reinforcing Film (10)> The same procedure was followed as in Example 8, except that adhesive film A (7) with release liner was used instead of adhesive film A (6) with release liner, to obtain a reinforced film (10) in which two adhesive films are arranged with a gap between one release liner and one carrier film, as shown in Figure 1. The reinforcing film (10) corresponds to the fourth embodiment, and the entire surface of the carrier film was irradiated with ultraviolet light. The results are shown in Table 1.

[0393] [Example 11] <Preparation of Reinforcing Film (11)> The same procedure as in Example 9 was carried out except that adhesive film A (7) with release liner was used instead of adhesive film A (6) with release liner, and a reinforced film (11) was obtained in which two adhesive films were arranged with a gap between one release liner and one carrier film, as shown in Figure 1. The reinforcing film (11) corresponds to the fourth embodiment, and the entire surface of the carrier film was irradiated with ultraviolet light. The results are shown in Table 1.

[0394] [Comparative Example 1] <Preparation of Reinforcing Film (C1)> The same procedure as in Example 1 was carried out, except that carrier film C(6) with release liner was used instead of carrier film C(1) with release liner, and a reinforced film (C1) was obtained in which two adhesive films were arranged with a gap between one release liner and one carrier film, as shown in Figure 1. The reinforcing film (C1) did not correspond to any of the embodiments 1 to 4. The entire surface of the carrier film was irradiated with ultraviolet light. The results are shown in Table 1.

[0395] Comparative Example 2 <Preparation of carrier film C (C2) with release liner> The procedure of Example 1 was repeated, except that the adhesive composition (z2) produced in Production Example 7 was used instead of the adhesive composition (x-1) produced in Production Example 1, to produce a carrier film C (C2) with a release liner having a structure of release liner (thickness 25 μm) / adhesive layer (thickness 13 μm) / base layer (thickness 75 μm). <Preparation of Reinforcing Film (C2)> The same procedure as in Example 1 was carried out, except that the carrier film C (C2) with release liner obtained above was used instead of the carrier film C (1) with release liner, and a reinforced film (C2) was obtained in which two adhesive films were arranged with a gap between one release liner and one carrier film, as shown in Figure 1. The reinforcing film (C2) did not correspond to any of the embodiments 1 to 4. The entire surface of the carrier film was irradiated with ultraviolet light. The results are shown in Table 1.

[0396] [Table 1] [Industrial Applicability]

[0397] The reinforced film according to the embodiment of the present invention can be suitably used, for example, for reinforcing optical components, and can be particularly suitably employed in flexible devices such as bendable devices having movable bending portions, foldable devices, and rollable devices. [Explanation of symbols]

[0398] 4000 Shielding plate 3000 Adherent 2000 laminate 1000 Reinforcement Film 100 Release Liner D 200 Carrier Film C 300A Adhesive Film A 300B Adhesive Film B 10A Base material layer A1 10B Base material layer B1 10C Base material layer C1 20A Adhesive layer A2 20B Adhesive layer B2 20C Adhesive layer C2

Claims

1. A reinforcing film in which one or more adhesive films A and one or more adhesive films B are laminated on a carrier film C in a gap-like arrangement, The PSA film A includes a base layer A1 and a PSA layer A2 composed of a PSA a2, The PSA film B includes a base layer B1 and a PSA layer B2 composed of a PSA b2, The carrier film C includes a base layer C1 and a pressure-sensitive adhesive layer C2 composed of a pressure-sensitive adhesive c2, the base material layer A1 and the base material layer B1 are directly laminated on the pressure-sensitive adhesive layer C2, Meet any of the following conditions (1) to (4): Reinforcement film. (1) The adhesive strength of adhesive a2 is smaller than the adhesive strength of adhesive b2, and adhesive c2 is adhesive X whose adhesive strength increases upon irradiation with active energy rays. (2) The adhesive strength of adhesive a2 is smaller than that of adhesive b2, and adhesive c2 is adhesive Y whose adhesive strength decreases upon irradiation with active energy rays. (3) The adhesive strength of adhesive c2 is smaller than that of adhesive b2, and adhesive a2 is adhesive Y whose adhesive strength decreases upon irradiation with active energy rays. (4) The adhesive a2 is adhesive Y whose adhesive strength decreases when irradiated with active energy rays, and the adhesive b2 is adhesive X whose adhesive strength increases when irradiated with active energy rays. The adhesive strength is measured against a glass plate at a peeling speed of 300 mm / min and a peeling angle of 180 degrees in an environment of 23° C. and 50% RH.

2. The pressure-sensitive adhesive X is formed from an acrylic pressure-sensitive adhesive composition x, and the acrylic pressure-sensitive adhesive composition x contains an acrylic polymer P1, a crosslinking agent, a photocuring agent, and a photopolymerization initiator.

3. 2. The reinforcing film according to claim 1, wherein the pressure-sensitive adhesive Y is a pressure-sensitive adhesive Y1 formed from a urethane-based pressure-sensitive adhesive composition y1, and the urethane-based pressure-sensitive adhesive composition y1 contains a urethane prepolymer P2 having a polymerizable unsaturated double bond, a crosslinking agent, a urethane (meth)acrylate, and a photopolymerization initiator.

4. 2. The reinforced film according to claim 1, wherein the pressure-sensitive adhesive Y is a pressure-sensitive adhesive Y2 formed from an acrylic pressure-sensitive adhesive composition y2, and the acrylic pressure-sensitive adhesive composition y2 contains an acrylic polymer P3 having one polymerizable unsaturated double bond in a side chain, a crosslinking agent, and a photopolymerization initiator.

5. The reinforcing film according to claim 1 , wherein the pressure-sensitive adhesive layer A2 and the pressure-sensitive adhesive layer B2 are attached to an optical member.

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