Display device

Abstract

To provide an electronic book which can reduce the frequency that a driving circuit is broken when a flexible panel is handled, and to provide an electronic book with a simplified structure.SOLUTION: The display device includes: a plurality of flexible display panels having a display unit for performing display control by a scan line driving circuit and a signal line driving circuit; and a binding part for fixing the plurality of display panels, the signal line driving circuit being provided in the inside of the binding part and the scan line driving circuit being provided in an end of the display panel in a vertical direction to the binding part.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The technical field relates to electronic books. [Background technology]

[0002] In recent years, with the advancement of digital technology, textual information and image information from newspapers, magazines, etc. have been converted into electronic data. This type of electronic data is provided as a Generally, the content is viewed by displaying it on a display device such as a PC. It has the following characteristics.

[0003] As for the display devices for displaying the above-mentioned electronic data, in addition to stationary display devices, there are also portable display devices. There are. E-books are a typical example of portable display devices. E-books are usually stored on the body of the device. It has a display on the front, and you can switch to the next page by operating the page change keys on the outer periphery of the main body. The display unit is configured to display the current page and the data from the previous page.

[0004] However, e-books that adopt this structure are different from paper media such as newspapers and magazines. In particular, the act of switching pages by key operation is different from that of paper media. This is far removed from the traditional way of handling books. Due to differences in the quality of text, the efficiency of reading characters, understanding sentences, and recognizing images may decrease. There is a problem that...

[0005] To overcome the above-mentioned differences with paper media, e-books using double-sided display devices have been proposed. (See, for example, Patent Document 1 and Patent Document 2). [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Japanese Patent Application Laid-Open No. 2005-38608 [Patent Document 2] Japanese Patent Application Laid-Open No. 2003-58081 Summary of the Invention [Problem to be solved by the invention]

[0007] In one embodiment of the disclosed invention, the driving circuit is prevented from being broken when the flexible panel is handled. It is an object of the present invention to provide an electronic book that reduces the number of times a user can read the book. One of the purposes of the present invention is to provide an electronic book with a simplified structure. [Means for solving the problem]

[0008] One embodiment of the disclosed invention is a display device in which display control is performed by a scan line driver circuit and a signal line driver circuit. The display device has a plurality of flexible display panels each having a display section, and a binding section for fixing the plurality of display panels. The binding portion is provided with a signal line driving circuit, and the display panel is provided with an end portion in the vertical direction to the binding portion. The electronic book has a scanning line driving circuit.

[0009] In one embodiment of the disclosed invention, the scan line driver circuit and the signal line driver circuit include transistors. The transistors constituting the scanning line driver circuit and the transistors constituting the signal line driver circuit are Electronic books with different structures may also be used.

[0010] In one embodiment of the disclosed invention, a channel layer of a transistor included in a scanning line driver circuit The channel layer of the transistor that constitutes the signal line driver circuit is a single-crystal semiconductor. It may also be an electronic book that is a crystalline semiconductor.

[0011] In one embodiment of the disclosed invention, the non-single-crystal semiconductor is amorphous silicon, microcrystalline silicon, or the like. The electronic device may be made of silicon, polysilicon or oxide semiconductor.

[0012] In one embodiment of the disclosed invention, the display portion includes a transistor, and the transistor constituting the display portion The channel layers of the transistors that make up the transistors and the scanning line driving circuit are made of the same material. It can also be an e-book.

[0013] In one embodiment of the disclosed invention, the binding unit includes a signal line driving circuit, a battery, an amplifier, and the like. The electronic book may be an electronic book having one of a sensor, a CPU, and a memory.

[0014] In one embodiment of the disclosed invention, a scan line driver circuit includes a plurality of circuit portions. The electronic book may be provided separately from each other.

[0015] In one embodiment of the disclosed invention, an electronic book having a stress concentration area between a plurality of circuit portions is also good.

[0016] In one embodiment of the disclosed invention, the plurality of display panels include a first display having a first display portion. a first display panel, a second display panel having a second display portion, and a first display panel and a second display panel The display panel has a third display unit on a first surface and a second display unit on a second surface opposite to the first surface. and a third display panel having a fourth display portion, the third display panel being The electronic book may be more flexible than the first and second display panels.

[0017] In one aspect of the disclosed invention, the first display panel includes a first display unit and a third display unit. The second display panel has a first optical sensor that controls whether or not a display is made, and a second optical sensor for controlling whether or not the display of the fourth display unit is displayed, and a third display panel for controlling whether or not the display of the first display unit is displayed. The electronic book may have a light-shielding portion in an area overlapping the optical sensor and the second optical sensor.

[0018] In addition, in this specification, a semiconductor device is a device that can function by utilizing semiconductor characteristics. This refers generally to electro-optical devices, semiconductor circuits, and electronic devices, all of which are included in the semiconductor device category.

[0019] In addition, in this specification and the like, the term "display device" includes a light-emitting device and a liquid crystal display device. The light emitting element is a light emitting element that emits light by applying a current or a voltage. It includes elements whose intensity can be controlled, specifically inorganic EL (Electro L luminescence elements, organic EL elements, etc. [Effects of the Invention]

[0020] According to one aspect of the disclosed invention, a durable electronic book is provided by reducing the risk of damage to the drive circuit. It is possible.

[0021] According to one embodiment of the disclosed invention, the structure can be simplified and the cost of the electronic book can be reduced. . [Brief explanation of the drawings]

[0022] [Figure 1] FIG. 1 is a diagram illustrating one form of an electronic book. [Figure 2] FIG. 1 is a diagram illustrating one form of an electronic book. [Figure 3] FIG. 1 is a diagram illustrating one form of an electronic book. [Figure 4] FIG. 1 is a diagram illustrating one form of an electronic book. [Figure 5] FIG. 10 is a diagram illustrating one form of a circuit configured in a bound portion of an electronic book. [Figure 6]FIG. 1 is a diagram illustrating one form of an electronic book. [Figure 7] FIG. 1 is a diagram illustrating one form of an electronic book. [Figure 8] FIG. 1 is a diagram illustrating one form of an electronic book. [Figure 9] FIG. 1 is a diagram illustrating one form of an electronic book. [Figure 10] FIG. 1 is a diagram illustrating one form of an electronic book. [Figure 11] FIG. 1 is a diagram illustrating one form of an electronic book. [Figure 12] FIG. 1 is a diagram illustrating one form of an electronic book. [Figure 13] FIG. 1 is a diagram illustrating one form of an electronic book. [Figure 14] FIG. 1 is a diagram illustrating one form of an electronic book. [Figure 15] FIG. 1 is a diagram illustrating one form of an electronic book. [Figure 16] FIG. 1 is a block diagram illustrating one form of an electronic book. [Figure 17] 1A and 1B illustrate one mode of a display panel. [Figure 18] 1A and 1B illustrate one mode of a display panel. [Figure 19] 1A and 1B illustrate one mode of a display panel. [Figure 20] 1A and 1B illustrate one mode of a display panel. [Figure 21] 1A and 1B illustrate one mode of a transistor that can be used in an e-book reader. [Figure 22] 1A and 1B illustrate one mode of a display panel. DETAILED DESCRIPTION OF THE INVENTION

[0023] Hereinafter, the embodiments will be described in detail with reference to the drawings. The present invention is not limited to the description of the embodiments, and does not deviate from the spirit of the invention disclosed in this specification. It will be apparent to those skilled in the art that various changes in form and detail may be made without departing from the spirit and scope of the present invention. The configurations according to the embodiments can be implemented in appropriate combinations. In the configuration of the invention to be described, the same parts or parts having similar functions are designated by the same reference numerals. The repeated explanation will be omitted.

[0024] The size, thickness of layers, and regions of each component shown in the drawings of each embodiment are not clearly indicated. The figures may be exaggerated for clarity. It will not be done.

[0025] In addition, terms such as "first," "second," and "third" used in this specification do not mean a mixture of components. It should be noted that the numbers are added to avoid confusion and are not intended to limit the number.

[0026] (Embodiment 1) In this embodiment, an example of an electronic book will be described with reference to the drawings.

[0027] In the electronic book described in this embodiment mode, display control is performed by a scan line driver circuit and a signal line driver circuit. a plurality of display panels each having a display portion that can be attached to the display panel; and a binding portion that fixes the plurality of display panels. A signal line driving circuit is provided inside the bound portion, and a scanning line driving circuit is provided for each of the plurality of display panels. An operating circuit is provided.

[0028] FIG. 1 shows an example of an electronic book having two display panels (first display panel) A binding portion 4308 is provided at the end of the first display panel 4311 and the second display panel 4312 to form a book. Referring to FIG. 1, the following describes the case where the first display panel and the second display panel The following explains in detail the electronic book that is composed of the above. Fig. 1(B) shows the electronic book in a closed state, Fig. 1(C) shows the electronic book in a half-open state. Shown in the open position.

[0029] The electronic book shown in FIG. 1 includes a first display panel 4311 having a first display portion 4301 and a second display panel 4312. A second display panel 4312 having two display units 4307, and a first display panel 4311. A binding portion 4308 provided at one end of the second display panel 4312 and the first display portion 430 The scanning line driver circuits 4321a and 4321b for controlling the display of the first display portion 4307 and the The scanning line driver circuits 4322a and 4322b for controlling display, the first display portion 4301, and The display device 4302 includes a signal line driver circuit 4323 for controlling the display of the second display portion 4307 .

[0030] The scanning line driver circuits 4321a and 4321b are provided on the first display panel 4311. The driver circuits 4322a and 4322b are provided on the second display panel 4312, and the signal line driver circuit The path 4323 is provided inside the binding portion 4308 .

[0031] The first display panel 4311 can be made flexible. A pixel circuit constituting the first display portion 4301 on a flexible substrate such as a stick, and a scanning Line driver circuits 4321a and 4321b may be provided.

[0032] The second display panel 4312 is also flexible like the first display panel 4311. In this case, the second display unit can be formed on a flexible substrate such as plastic. It is sufficient to provide a pixel circuit constituting 4307 and scanning line driver circuits 4322a and 4322b. .

[0033] The binding portion 4308 includes at least a first display panel 4311 and a second display panel 4312. It is preferable to have a structure that is less likely to bend (higher rigidity). The housing constituting the display panel 8 is made thicker than the first display panel 4311 and the second display panel 4312. It can be made of plastic, metal, etc. In this case, the electronic book is The outer portion may be configured to bend (curve).

[0034] The location of the binding portion 4308 is not particularly limited. For example, the binding portion 4308 may be provided on the first display panel 43 A binding portion 4308 may be provided along one edge of the first and second display panels 4312. For example, as shown in FIG. 1, the first display panel 4311 and the second display panel 431 When the sheet 2 is rectangular, the binding portion 430 is bound along a predetermined side (to fix the side). 8 can be provided. The rectangular shape mentioned here includes cases where the corners are rounded. It shall be.

[0035] The signal line driver circuit 4323 is provided inside the binding portion 4308. For example, 8 is provided in a hollow columnar or cylindrical housing, and the hollow portion is provided with a signal line driver circuit 432 3 can be provided. The signal line driver circuit 4323 can be provided inside the binding portion 4308. This can prevent damage to the signal line driver circuit 4323 due to bending of the display panel.

[0036] As shown in FIG. 1, the scanning line driver circuits 4321a and 4321b are connected to the first display panel. 4311, it is preferable to provide it at the end in the direction approximately perpendicular to the binding portion 4308. In addition, the scanning line driver circuits 4322a and 4322b are connected to the second display panel 4312. It is preferable to provide the scanning line driving circuit at the end in the direction substantially perpendicular to the common portion 4308. In comparison with the case where the signal line driver circuit is provided in one place (for example, inside the binding portion 4308), This reduces the amount of wiring required and simplifies the structure.

[0037] In addition, the scanning line driver circuits 4321a and 4321b and the pixel circuit constituting the first display portion 4301 are By forming the wiring on a flexible substrate in the same process, the scanning line driving circuit 432 1a, 4321b can be bent, and costs can be reduced. The scanning line driver circuits 4322a and 4322b and the pixel circuits that constitute the second display portion 4307 are connected together. By forming the scanning line driver circuit 4322a on a flexible substrate in the same process, This allows bending of 4322b and reduces costs.

[0038] A pixel circuit constituting the first display portion 4301, a pixel circuit constituting the second display portion 4307, and The elements constituting the scanning line driving circuits 4321a, 4321b, 4322a, and 4322b are On the other hand, the signal line driver circuit 4323 etc. High-speed circuits are formed using semiconductor substrates such as silicon or SOI substrates. The IC is formed by binding the binding part 4. 308 。

[0039] In this way, ICs with circuits for high-speed operation such as signal line driving circuits are formed inside the binding section. The scanning line driver circuit and the pixel circuit that constitutes the display unit are mounted on a flexible substrate by thin film transistors. By forming the signal line driver circuit and the scanning line driver circuit with an IC, Compared with the case where the display panel is bent, the display panel can be easily bent and the bending of the display panel can be prevented. This prevents damage to the IC caused by the scanning line drive circuit, and further reduces costs. By providing the display panel at the edge in the direction perpendicular to the binding portion, the wiring can be reduced. The stop structure can be simplified.

[0040] In FIG. 1, the scanning line driver circuits are formed at both ends of the first display panel 4311. 4, only one end (the scanning line driver circuit 4321a and the scanning line driver circuit 4321b) is shown. Similarly, the scanning line driver circuit may be provided for the second display panel. Although the case where the electrodes are formed at both ends of the filter 4312 is shown, the electrodes may be formed at only one end. stomach.

[0041] This embodiment mode can be implemented by being appropriately combined with the configurations described in other embodiments. is.

[0042] (Embodiment 2) In this embodiment, the specific configuration of the electronic book shown in FIG. 1 will be described with reference to the drawings. The configuration shown in this embodiment is common to the first embodiment in many parts. Therefore, in the following, we will omit the explanation of the overlapping parts and will focus on the differences in detail. will be explained.

[0043] First, an example of a specific configuration of an electronic book will be described with reference to FIG. 2. Fig. 2(A) shows a plan view of the electronic book in a closed state, and Fig. 2(B) shows a cross-sectional view of Fig. 2(A) between A and B. FIG. 2(C) shows a detailed schematic diagram of the cross section.

[0044] The electronic book shown in FIG. 2 is formed by a housing having a hollow binding portion 4308. A signal line driver circuit 4323 is provided in the IC. The IC is formed of silicon or the like, and the IC is provided inside the binding portion 4308. It can be formed using a semiconductor substrate, an SOI substrate, or the like. Other circuits (eg, CPU, memory, etc.) can be provided on the IC.

[0045] In addition, in FIG. 2, the IC provided inside the binding portion 4308 is referred to as a TAB (Tape Auto) IC. FPC (Flexible Printed Circuit) is manufactured using the comat d Circuit).

[0046] More specifically, a signal line driver circuit 4323a for controlling the first display portion 4301 is 324a, a signal line driver circuit 4323b for controlling the second display portion 4307 is provided. A signal line driver circuit 4323a and a signal line driver circuit 4323b are provided on the PC 4324b. Electrically connected via a printed circuit board 4325. FPC 4324a is the first display. The panel 4311 and the printed circuit board 4325 are electrically connected, and the FPC 4324b is a second The display panel 4312 and the printed circuit board 4325 are electrically connected to each other.

[0047] In addition, in FIG. 2, the printed circuit board 4325 is installed in contact with the housing that constitutes the binding portion 4308. In this case, the first display panel 4311 and the second display panel 4312 It is fixed by the binding portion 4308.

[0048] As shown in FIG. 2, when a signal line driver circuit is provided on an FPC, the first display panel 4311 It is preferable to provide a stress concentration area 4326 on one or both of the first and second display panels 4312. By providing the stress concentration area 4326 on the display panel, when opening the electronic book (the When folding the first display panel 4311 and / or the second display panel 4312, This reduces the stress applied to C and prevents damage to the signal line drive circuit on the FPC. can.

[0049] The stress concentration area is the area where the deformation of the material due to the cut, etc., or the bending or extension due to the attachment of the material, etc. This refers to the area where stress is concentrated, which is formed due to the change in strength relative to the bending. , and a cut is made at the part of the first display panel 4311 or the second display panel 4312 that is to be folded. By providing recesses (concave portions, grooves), stress concentration areas 4326 can be formed.

[0050] For example, the first display panel 4311 is formed by using an element substrate 4331a and a sealing substrate 4332a. A cutout is provided in one or both of the element substrate 4331a and the sealing substrate 4332a. In FIG. 2, a cutout is provided in the sealing substrate 4332a. This shows a case where a stress concentration region 4326 is formed. The element substrate 4331a includes a pixel circuit for driving the first display portion 4301 and a scanning line driver circuit 4 321a and 4321b, and electrically connect these circuits to FPC 4324a. This can be done.

[0051] Similarly, the second display panel 4312 is formed using an element substrate 4331b and a sealing substrate 4332b. and a recessed portion is provided in one or both of the element substrate 4331b and the sealing substrate 4332b. The element substrate 4331b can have a structure in which the second display portion 4307 is driven. The pixel circuits and scanning line driving circuits 4322a and 4322b are formed, and these circuits and FPC 4324b can be electrically connected.

[0052] The stress concentration area 4326 is formed between the first display panel 4311 and the second display panel 4312. For example, in FIG. 2(A), the binding portion 430 8 along a direction substantially parallel to the first display panel 4311 and / or the second display panel 43 By providing a notch from the top to the bottom of 12, the direction in which the display panel is bent can be controlled. The display panel can be selectively folded in a direction perpendicular to the binding portion 4308. This also makes it possible to prevent damage to the signal line driving circuit provided on the FPC.

[0053] The stress concentration area 4326 can be provided inside or outside the binding portion 4308. For example, When the first display panel 4311 and the second display panel 4312 are closed, the binding portion 4308 is provided so as to be in contact with the first display panel 4311 or the second display panel 4312. In this case, stress is concentrated on the outside of the binding part 4308 (for example, between the binding part 4308 and the display part). A middle region 4326 is preferably provided.

[0054] In FIG. 2, a signal line driver circuit 4323a for controlling the first display portion 4301 and a signal line driver circuit 4323b for controlling the second display portion 4302 are provided. The signal line driver circuit 4323b that controls 307 is formed using a separate IC, and The signal line driver circuit 4323a and the signal line driver circuit 4323b are electrically connected via 4325. The signal line driver circuit 4323a and the signal line driver circuit 4323b are shown in FIG. 4323b may be integrated into a single IC.

[0055] Next, the configuration of the electronic book, which is different from that shown in FIG. 2, will be described with reference to FIG. 3. 3(B) shows a cross section between A and B in FIG. 3(A). ,Figure 3(C) shows a detailed schematic diagram of the cross section.

[0056] FIG. 3 shows the IC provided in the binding portion 4308 in a COG (Chip On Glass) manner. Using the formula, the case where the display is mounted on the first display panel 4311 and the second display panel 4312 is shown. is doing.

[0057] More specifically, a signal line driver circuit 4323a that controls the first display portion 4301 The second display unit 4311 is provided on an element substrate 4331a that constitutes the first display panel 4311. The signal line driver circuit 4323b controlling the second display panel 4312 A signal line driver circuit 4323a and a signal line driver circuit 4323b are provided on a substrate 4331b. Electrically connected via FPC4324a, 4324b and printed circuit board 4325 do.

[0058] As shown in FIG. 3, when a signal line driver circuit is provided on a display panel, the first The first display panel 4311 and / or the second display panel 4312 are provided with a stress concentration region 43 In this case, the stress concentration region 4326 is preferably provided in the area where the signal line driver circuit is provided. The signal line driver circuit is provided in a region different from the region where the signal line driver circuit is provided (region other than the region where the signal line driver circuit is provided). For example, by providing it on the sealing substrate side, when opening an electronic book (first display panel 431 When the first or second display panel 4312 is bent, the stress applied to the signal line driver circuit is reduced. This reduces the damage to the signal line driver circuit.

[0059] Next, the configuration of the electronic book, which is different from that of FIGS. 2 and 3, will be described with reference to FIG. 4. ) shows a plan view of the electronic book in a closed state, and FIG. 4(B) is a cross section between A and B in FIG. 4(A). 4(C) shows a detailed schematic diagram of the cross section.

[0060] The electronic book shown in FIG. 4 has an IC on which a signal line driver circuit and other circuits are formed, mounted on a printed circuit board. 1 shows a case where the printed circuit board and the display panel are connected using an FPC.

[0061] More specifically, a signal line driver circuit 4323a that controls the first display portion 4301 A signal line driver circuit provided on a printed circuit board 4327a and controlling the second display portion 4307 4323b is provided on a printed circuit board 4327b, and the signal line driver circuit 4323a and the signal line The drive circuit 4323b is electrically connected via the FPC 4329. is electrically connected to the printed circuit board 4327a and the printed circuit board 4327b, and FPC432 4a is electrically connected to the first display panel 4311 and the printed circuit board 4327a, and FP C4324b is electrically connected to the second display panel 4312 and the printed circuit board 4327b. It is being done.

[0062] In Figure 4, the display panel can be folded using FPC4324a and FPC4324b. To achieve this, stress concentration areas are provided on the first display panel 4311 and the second display panel 4312. It is possible to have a configuration in which this is not the case.

[0063] Next, an example of the structure of the binding unit 4308 and a circuit that can be provided in the binding unit 4308 will be described. This will be described with reference to FIG.

[0064] In FIG. 5, the display control unit 200 including the signal line driving circuit is built into the binding unit 4308. As mentioned above, these circuits are made of semiconductor substrates such as silicon or SOI substrates. It can be formed using an IC formed using a semiconductor device.

[0065] The display control unit 200 includes a CPU 201, a storage unit 203, a power supply unit 205, and a power supply circuit 207. , the video signal generating circuit 215, the signal line driving circuits 4323a and 4323b, the operation unit 219, etc. Each component can be connected via an interface, etc. Furthermore, the display control unit 200 controls the first display panel 4311 and the second display panel 4312. Here, the operation unit 219 is provided in the binding unit 4308. 2, the operation unit 219 is connected to the first display panel 4311 and / or the second display panel 4312. It can also be provided on the panel 4312.

[0066] The CPU 201 controls the overall operation of the electronic book.

[0067] The data input unit 211 receives data from an external device and displays it on the first display unit 4301 and / or the second display unit 4302. The information to be displayed is inputted in the data input section 211. For transmitting and receiving, the data input unit 211 may have an antenna 216. In this case, the data input unit 211 is , data received by the antenna 216 and data stored in a recording medium (external memory 213) to the internal memory 209.

[0068] The storage unit 203 includes an internal memory 209, a data input unit 211, and an external memory 213. The internal memory 209, the data input unit 211, and the external memory 213 The first display portion 4301 and the second display portion 4307 are used to display information and electronic books. It is possible to record programs that

[0069] The internal memory 209 generates a video signal based on signals from the power supply unit 205, the operation unit 219, etc. The CPU 201 processes the signal output to the circuit 215 and / or the power supply circuit 207. The program for the data input unit 211 and the data input unit 212 are stored in the storage unit 214. An example of the internal memory 209 is a DRAM (Dynamic Random Access Memory). ess Memory), SRAM (Static Random Access Me memory), Mask ROM (Read Only Memory), PROM (Prog It is composed of a hard disk drive (HDD), a rammable read-only memory (RAM), etc.

[0070] The external memory 213 may be a storage medium such as an IC card or a memory card.

[0071] The power supply unit 205 is composed of a secondary battery, a capacitor, etc. Lithium batteries, preferably lithium polymer batteries using gel electrolytes, lithium ion batteries Of course, any rechargeable battery will do, Nickel-metal hydride battery, nickel-cadmium battery, organic radical battery, lead-acid battery, secondary air battery, nickel The capacitor may be a rechargeable battery such as a zinc battery or a silver-zinc battery. Using electric double layer capacitors, lithium ion capacitors, and other large-capacity capacitors The capacitor does not deteriorate much even when it is charged and discharged many times, and has fast charging characteristics. The shape of the power supply part 205 may be a sheet, a column, a prism, or the like. The shape may be selected appropriately from a plate-like, coin-like, etc.

[0072] Furthermore, the power supply unit 205 may be configured to supply power wirelessly. Therefore, an antenna may be provided on the power supply unit 205.

[0073] The power supply circuit 207 is controlled by the CPU 201 to supply power to the first display panel 4311 and Controlling the power supply to the display element in order to turn on or off the display panel 4312 of the second display panel This is a circuit for

[0074] The operation unit 219 can be provided with a keyboard, operation buttons, etc. When the first display panel 4311 and / or the second display panel 4312 are provided with The first display unit 4301 and / or the second display unit 4307 are used as touch displays, The display unit can also function as an operation unit.

[0075] In FIG. 5, the display control unit 200 is built into the binding unit 4308. A so-called power device such as a switching power supply or a DC-DC converter may be provided.

[0076] In addition, in the electronic book shown in FIG. 5, the power supply and the display can be controlled by operating the operation unit 219. In addition, the first display portion 4301 and / or the second display portion 43 07 is used as a touch display, and a finger or a It may be configured so that it can be operated by touching it with an input pen or the like.

[0077] In this way, by incorporating the display control unit 200 into the binding unit 4308, The electronic book can be protected by a housing and can be made thinner.

[0078] In the first and second embodiments, the scanning line driving circuit 43 21a and 4321b are aligned in the vertical direction of the bound portion 4308 along the first display portion 4301. In the second display panel 4312, scanning line driver circuits 4322a and 4322b are provided. , the case where the second display portion 4307 is provided in the vertical direction of the binding portion 4308 and along the second display portion 4307 is shown. However, this is not limited to this.

[0079] For example, as shown in FIG. 6A, in the first display panel 4311, the scanning line driver circuit 4321a and 4321b are compared with the first display portion 4301 and are separated from the binding portion 4308. Generally, the scanning line driving circuits 4321a and 4321b are configured as follows. Since the elements constituting the pixel circuits are arranged more collectively than the elements constituting the pixel circuits, the first display panel 43 By not providing the scanning line driving circuits 4321a and 4321b at the bent portion of the This can prevent damage to the scanning line driving circuits 4321a and 4321b.

[0080] As shown in FIGS. 6B and 6C, the scanning line driving circuits 4321a and 4321b are Each of the circuits can be divided into a plurality of circuit sections, and the plurality of circuit sections can be spaced apart from one another. As a result, even when the first display panel 4311 is curved, the scanning line driving circuit 4 The stress applied to the scanning line driving circuits 321a and 4321b is reduced. FIG. 6B shows the scanning line driver circuits 4321a and 4321b. Each of the scanning line driver circuits 4321a and 4322b is divided into two circuit sections. 21b are divided into four circuit parts, The number of divisions is not limited to this.

[0081] Also, as shown in FIG. 6(D), in the first display panel 4311, only one end (Only one of the scanning line driver circuit 4321a and the scanning line driver circuit 4321b) is provided. This makes it possible to narrow the frame of the electronic book.

[0082] The structure shown in FIG. 6 can also be applied to the second display panel 4312.

[0083] This embodiment mode can be implemented by being appropriately combined with the configurations described in other embodiments. is.

[0084] (Embodiment 3) In this embodiment, an electronic book having a plurality of flexible display panels is opened and curved. 7 to 10 show an example of the effects of the above embodiment when used in this manner. Please refer to the following for explanation.

[0085] First, in FIG. 7(A), the front plane when the user uses the electronic book in a double-page spread position is shown. In FIG. 7(B), a top view of the electronic book when used by a user in a double-page spread is shown. This section shows and explains the following.

[0086] The electronic book shown in FIG. 7A includes a first display panel 4311, a second display panel 4312, The first display panel 4311 has a first display unit 4301. The first display portion 4301 includes a scanning line driver circuit 4 for supplying scanning signals to the first display portion 4301. 321, a signal line driver circuit 4323a that supplies image signals to the first display portion 4301, The second display panel 4312 controls the display. 07, and the second display portion 4307 has a scanning a signal line driver circuit 4322 for supplying image signals to the second display portion 4307; 7A, the display is controlled by the user's hand 435. 4350a and 4350b define the edges of the first display panel 4311 and the second display panel 4312. The front plan view shown in FIG. 7(A) also shows how the user grips the gripping portion. The line of sight when viewing the top plan view shown in FIG. 7(B) is also noted.

[0087] The top plan view shown in FIG. 7B shows a first display panel 4311 and a second display panel 4312. , showing the binding portion 4308. As shown in FIG. 7(B), when the user presses the When the electronic book is opened in 50b, the flexible display panel has a structure shown in C in the figure. The bent portion (hereinafter referred to as bent portion C) is within the range of the arrow indicated by the arrow in the figure, and the non-bent portion is within the range of the arrow indicated by the arrow D in the figure. (Hereinafter referred to as non-bending portion D) is formed.

[0088] In FIG. 7B, as an example, the first display panel 4311 and the second display panel 431 Regarding the folded portion C and the non-folded portion D of 2, the side close to the binding portion 4308 is the folded portion C, and the binding portion The side away from the portion 4308 is described as a non-bending portion D. The display panel is made of a material that is different from the material of the substrate that constitutes the display panel and the structure of the binding portion 4308. The first display panel 4311 and the second display panel 4312 are different in how they are curved. Regarding the folded portion C and the non-folded portion D of the sheet 4312, the side away from the binding portion 4308 is the folded portion C. The side adjacent to the bound portion 4308 may become the non-folded portion D.

[0089] In addition, since the electronic book has a structure in which the display panel is fixed by the binding part 4308, The first display panel 4308 extends in a direction perpendicular to the direction of the arrow 7002 in FIG. 7(B). The first display panel 4311 and the second display panel 4312 are formed with a bent portion C and a non-bent portion D. Therefore, the signal line driver circuit 4323a and the signal line driver circuit 4323b are connected to the binding unit 430. 8 can prevent damage caused by bending the display panel. 1. The scanning line driver circuit 4322 is provided at the vertical end of the display panel, Since it is possible to manufacture it in the same process, it is possible to reduce costs, and the binding portion 43 Compared to when the display is provided at the bent portion C, the wiring to the display can be reduced. The bent portions D may be formed in plural or may be formed alternately. A stress concentration region may be provided, and a bent portion C and a non-bent portion D may be artificially formed.

[0090] Next, in FIGS. 8A to 8C, the electronic book is used in a double-page spread, as in FIG. 7A. 43 shows a front plan view of the bent portion C and the non-bent portion D. The arrangement of the scanning line driver circuit 4322 will be described.

[0091] In FIG. 8A, the side close to the bound portion 4308 is the bent portion C, and the side away from the bound portion 4308 is the bent portion C. The side where the bent portion is formed is described as a non-bent portion D. The circuits 4322 are provided in the non-folding portion D on the side away from the binding portion 4308. The supply of scanning signals to the pixel TFTs 4352 in the display section is performed by the scanning line driving circuit 43. 21, by routing the wiring extending from the scanning line driving circuit 4322 to each scanning line of the display section. In addition, the scanning line driver circuit 4321 and the scanning line driver circuit 4322 are The supply of control signals such as clock signals is performed through a wiring extending from a video signal generating circuit in the binding section 4308. The wiring for electrical connection between circuits is made by microfabrication of metal films, etc. The semiconductor film of the transistor that constitutes the scanning line driver circuit is made of a silicon film or the like. Made of semiconductor material. Metal films have superior ductility compared to semiconductor materials, and are less susceptible to damage caused by bending. Therefore, the wiring connected to the scanning line driving circuit is arranged at the bent portion C. By disposing transistors constituting the scanning line driving circuit at the non-bending portion D, This reduces damage to the semiconductor film of the transistor caused by bending. As a result, by arranging the scanning line driver circuit 4321 and the scanning line driver circuit 4322 as shown in FIG. 8(A), When a user opens the electronic book with their hands 4350a and 4350b, Damage can be suppressed.

[0092] In FIG. 8B, the bent portion C and the non-bent portion B are arranged from the side close to the binding portion 4308 to the side away from the binding portion 4308. D are alternately provided. The arrangement of the line driving circuit 4322 is such that each driving circuit is divided into multiple parts in the non-bending portion D. , are provided at a distance from each other. The signal is supplied from a first scanning line driver circuit 4321 and a second scanning line driver circuit 4322. This can be achieved by routing wiring. The supply of control signals such as clock signals for driving the circuit 4322 is performed by the image pickup unit 4308. This is done through wiring extending from the image signal generating circuit. Signals propagating between pulse signal generating circuits such as flip-flops are supplied through wiring. The wiring for electrical connection between circuits is formed by microfabrication of metal films, etc. The semiconductor film of the transistor constituting the scanning line driver circuit is formed of a semiconductor material such as a silicon film. Metal films have superior ductility compared to semiconductor materials and are less susceptible to damage due to bending. Wiring connected to the scanning line driving circuit is arranged at the bent portion C, and wiring connected to the scanning line driving circuit is arranged at the non-bent portion D. By disposing the transistors that make up the scanning line driver circuit at the locations where the transistors are curved, In addition, in FIG. 8(B), the damage to the semiconductor film of the driving transistor can be reduced. The circuit is divided into multiple parts and is spaced apart from each other, so that when the display is bent, the scanning line driving circuit is not affected. As a result, the stress generated by the scanning line driving circuit 432 can be dispersed as shown in FIG. 1. The scanning line driving circuit 4322 is arranged so that the user can manually turn on the When the child book is used in a double-page spread, damage to the circuitry can be more effectively prevented.

[0093] In FIG. 8B, the scanning line driver circuit 4321 and the scanning line driver circuit 4322 are connected to the display unit. Above and below the scanning line driver circuit 4321a, the scanning line driver circuit 4321b, and the scanning line driver circuit 43 22a, and the scanning line driver circuit 4322b are arranged to be redundant, or the scanning signal is output. In FIG. 8(C), the configuration described in FIG. 8(B) may be configured to distribute the functions of inputting the information. The scanning signal supplied to the pixel TFT4352 is The scanning line driving circuit 4321a and the scanning line driving circuit 4321b are arranged vertically, and the scanning line driving circuit 43 22a and the scanning line driving circuit 4322b are arranged vertically, and the scanning line driving circuit This allows the reduction of pulse signal generation circuits such as flip-flops, When using the e-book with the hands 4350a and 4350b in a double-page spread, damage to the circuit is suppressed. It is possible.

[0094] 8B and 8C show a specific example, and the area where the bending portion C is located is shown. Regarding the advantages of arranging the scanning line driving circuit in the non-bending area D without arranging the scanning line driving circuit, This configuration distributes the stress applied to the scanning line driving circuit when the display is bent. The user can open the electronic book with their hands 4350a and 4350b and use it. In this case, damage to the circuit can be suppressed.

[0095] Next, as shown in Figures 8(B) and (C), the driving circuit is divided into a plurality of parts, which are set apart from each other. When the display panel is folded, stress concentration occurs to artificially form the bent portion C and the non-bent portion D. An example of providing the regions will be described with reference to FIGS.

[0096] In FIG. 9A, the first display panel 4311, the binding portion 4308, the first display portion 4301, the running The scanning line driver circuit 4321 and the signal line driver circuit 4323a are shown. 4321 is shown divided into two parts, which are spaced apart from each other via the wiring 920. The stress concentration region 921 is preferably formed so as to overlap with the wiring 920. 4B shows an example of a cross section perpendicular to the binding portion 4308. In the stress concentration region 921 overlapping with the element, a notch 922a is provided in the sealing substrate 923. The substrate 924 may be provided with a notch 922b. A reinforcing plate 925 is attached to the substrate 924 and the sealing substrate 923 on the scanning line driver circuit 4321. By doing so, the cutout portions 922a and 922b may be formed. The cutouts 922a and 922b are provided parallel to the longitudinal direction of the binding portion 4308. It may be provided in all areas, or only in some areas.

[0097] The stress concentration area refers to deformation of the material due to cuts, bending, stretching, etc. due to attachment of the material. The term refers to an area of ​​concentrated stress formed by a change in strength relative to the

[0098] The division of the scanning line driving circuit means that the circuit elements such as TFTs and wiring are mixed together to form a repeated layout. This refers to the state in which the out area is divided by the area allocated for wiring routing. cormorant.

[0099] 10A, similarly to FIG. 9A, the first display panel 4311 and the binding portion 430 8. First display portion 4301, scanning line driver circuit 4321, and signal line driver circuit 4323a The scanning line driver circuit 4321 is divided into four parts, and is separated from each other by wiring 920. The stress concentration region 921 is formed so as to overlap with the plurality of wirings 920. FIG. 10(B) shows an example of a cross section in a direction perpendicular to the bound portion. In the stress concentration region 921 overlapping the wiring 920, a plurality of cuts are made in the sealing substrate 923. A plurality of notched portions 922a may be provided in the element substrate 924, and a plurality of notched portions 922b may be provided in the element substrate 924. As shown in FIG. 10C, the scanning line driver circuit 4 of the element substrate 924 and the sealing substrate 923 By attaching a reinforcing plate 925 on the surface of the substrate 321, the plurality of cutouts 922a and the plurality of cutouts It is also possible to form a plurality of notched portions 922a and a plurality of notched portions 922b. The cutout portion 922b may be provided parallel to the longitudinal direction of the binding portion 4308, or may be provided only in a part of the binding portion 4308. It may be configured to provide

[0100] The number of divisions of the scanning line driving circuit shown in FIGS. 9 and 10 is an example for the purpose of explanation, and It may be divided into any number of parts.

[0101] As described above, the configuration of this embodiment allows the user to read the electronic book in a double-page spread. In addition, damage to the scanning line driving circuit can be more effectively prevented when the scanning line driving circuit is damaged. Therefore, by providing a stress concentration area in advance by making a cut in the display panel, it is possible to achieve a more effective Therefore, damage to the scanning line driving circuit can be suppressed.

[0102] This embodiment mode can be implemented by being appropriately combined with the configurations described in other embodiments. is.

[0103] (Fourth embodiment) In this embodiment, the electronic book structure having a plurality of display panels described in the first embodiment is In addition, a double-sided display panel is provided between the first display panel 4311 and the second display panel 4312. An example of a third panel is described below. 11(B) shows the electronic book in a closed state, and FIG. 11(C) shows the electronic book in a closed state. FIG.

[0104] The electronic book shown in FIGS. 11A and 11B has a first display panel having a first display portion 4301. a second display panel 4311 having an operation unit 4304 and a second display unit 4307; 12, and a third display panel 43 having a third display portion 4302 and a fourth display portion 4310. 13, a first display panel 4311, a second display panel 4312, and a third display panel The third display panel 4 has a binding portion 4308 provided at one end thereof and a binding portion 4313. 313 is inserted between the first display panel 4311 and the second display panel 4312. The electronic book in FIG. 11A and FIG. 11B includes a first display portion 4301, a second display portion 4307, and a third display portion 4308. The computer has four display screens: a third display unit 4302 and a fourth display unit 4310.

[0105] A first display panel 4311, a second display panel 4312, and a third display panel 4313 The first display panel 4311 and the second display panel 4312 are flexible and easy to bend. The first display panel 4312 is made of a plastic substrate, and the second display panel 4313 is made of a thin film. In other words, an example of an electronic book can be made as shown in FIG. In a lateral cross section, the third display panel 4313 is a first display panel 4311 and a second display panel 4312. The electronic book reader can be more flexible than the second display panel 4312. By making the outer display panel harder than the display panel 4313, it feels like a book. This allows for easy handling and prevents the third display panel 4313 from being damaged.

[0106] The third display panel 4313 has both a third display portion 4302 and a fourth display portion 4310. The third display panel 4313 is a dual-emission type display panel. Alternatively, a single-side emission type display panel may be attached to the backlight. Alternatively, two liquid crystal display panels may be used, sandwiching a display panel (preferably a thin EL light-emitting panel).

[0107] 11A and 11B, the electronic book is a computer that controls the display of the first display unit 4301. A scanning line driver circuit (not shown) and a scanning line driver circuit 4 for controlling the display of the second display portion 4307. 322a, 4322b and the display of the third display unit 4302 and / or the fourth display unit 4310. A scanning line driver circuit (not shown) for controlling the display, a first display portion 4301, a second display portion 43 07, a signal for controlling the display of the third display unit 4302 and / or the fourth display unit 4310 The scanning line driver circuits 4321a and 4321b are the first The scanning line driver circuits 4322a and 4322b are provided on the second display panel 4311. The signal line driver circuit 4323 is provided inside the binding portion 4308. are.

[0108] In the electronic book shown in FIGS. 11A and 11B, the second display panel 4312 is It has a power input switch, a display changeover switch, and other functions associated with it. It is possible.

[0109] 11A and 11B, the input operation of the electronic book is performed by using the first display portion 4301 and the second display portion 4302. It is performed by touching the display unit 4307 with a finger or an input pen, or by operating the operation unit 4304. In FIG. 11A, the display button 4309 displayed on the second display portion 4307 is shown, and input can be made by touching it with a finger or the like.

[0110] In addition, how to use an electronic book with the third display panel 4313 inserted as shown in FIGS. 11(A) and 11(B) For example, a sentence is read on the first display unit 4301 and the fourth display unit 4310, and It is convenient to refer to the diagram on the display unit 4307 and the third display unit 4302. The display panel 4313 displays the third display section 4302 and the fourth display section 4310 simultaneously. Therefore, when you start turning the page, the display on the third display unit 4302 The display is switched to the fourth display unit 4310.

[0111] Also, by reading from the first display section 4301 to the third display section 4302, the next page, the third table When the display panel 4313 starts to be turned over, the fourth display unit 4310 and the second display unit 4311 are turned over at a certain angle. The fourth display unit 4310 and the second display unit 4311 display the next page. When you finish using 307 and start turning over the third display panel 4313, the third table The first display unit 4302 and the second display unit 4301 display the next page. This makes it possible to make the change invisible to the naked eye and reduce any visual discomfort.

[0112] Next, the first display panel 4311, the second display panel 4312, and the third display panel 4313 are As an example of a specific configuration of an electronic book having 313, similar to FIGS. 2(A) and (B), The following description will be made with reference to Figures 13(A) and 13(B). Note that Figure 13(A) shows the state in which the electronic book is closed. 13(B) shows a cross section taken along line AB in FIG. 13(A).

[0113] The electronic book shown in FIG. 13 has a binding portion 4308 formed of a hollow case. A signal line driver circuit 4323 is provided in the portion. The IC is formed of silicon or the like. The signal line driver circuit can be formed using a semiconductor substrate, an SOI substrate, or the like. Other circuits (for example, a CPU, memory, etc.) can be provided in the IC.

[0114] In addition, in FIG. 13, the IC provided inside the binding portion 4308 is referred to as a TAB (Tape Aluminum). FPC (Flexible Printed Circuit) using the integrated bonding method This shows the case where it is implemented in a synchronous circuit (synchronous rectifier).

[0115] More specifically, a signal line driver circuit 4323 for controlling the first display portion 4301 is formed. An IC is provided on the FPC 4324, and a signal line driver for controlling the second display unit 4307 is also provided. An IC on which a circuit 4323 is formed is provided on an FPC 4324, and the third display unit 4302 and and an IC on which a signal line driver circuit 4323 for controlling the fourth display portion 4310 is formed is mounted on the FPC 4. 324, and a signal line driver circuit 4323 is electrically connected to the printed circuit board 4325. The FPC 4324 is connected to the first display panel 4311 and the second display panel 431 2, and is electrically connected to the printed circuit board 4325.

[0116] In addition, in FIG. 13, the printed circuit board 4325 is bonded to the housing that constitutes the binding portion 4308. It can be set up so that

[0117] As shown in FIG. 13, when a signal line driver circuit is provided on an FPC, the same as that described in FIG. 2(C) above is used. As described above, stress is applied to one or both of the first display panel 4311 and the second display panel 4312. It is preferable to provide a stress concentration area 4326. The stress concentration area 4326 is provided on the display panel. By doing so, when opening an electronic book (first display panel 4311 and / or second display panel This reduces the stress applied to the FPC4324 when bending the FPC4312. This can prevent damage to the signal line driver circuit 4323 provided above. It is formed on a thin film on the panel 4313, and when using an e-book in a double-page spread, It has sufficient flexibility and can be handled like a book.

[0118] Next, a configuration of the electronic book that is different from that shown in FIG. 13 will be described with reference to FIG. 14. ) shows a plan view of the electronic book in a closed state, and FIG. 14(B) shows the area between A and B in FIG. 14(A). A cross section is shown.

[0119] The electronic book shown in FIG. 14 uses an IC provided in the binding portion 4308 as a COG (Chip On The first display panel 4311 and the second display panel 4312 are made of a glass. This shows the case where it is implemented.

[0120] More specifically, a signal line driver circuit 4323 for controlling the first display portion 4301 is formed. The IC is provided on an element substrate that constitutes the first display panel 4311, and similarly, An IC in which a signal line driver circuit 4323 for controlling the second display panel 431 is formed is provided. 2, and a third display unit 4302 and a fourth display unit 4310 are provided on the element substrate constituting the display device. The IC in which the signal line driver circuit 4323 for controlling the third display panel 4313 is formed constitutes the third display panel 4313. A signal line driver circuit 4323 is provided on the element substrate, and an FPC 4324 and a printed circuit board 4 325.

[0121] Next, a configuration of an electronic book that is different from those shown in FIGS. 13 and 14 will be described with reference to FIG. 15. 15(A) shows a plan view of the electronic book in a closed state, and FIG. 15(B) shows the A of FIG. -B section.

[0122] The electronic book shown in Figure 15 has an IC on which circuits such as a signal line driver circuit are formed, mounted on a printed circuit board. This shows a case where the printed circuit board and the display panel are connected using an FPC.

[0123] More specifically, a signal line driver circuit 4323 for controlling the first display portion 4301 is formed. An IC is provided on a printed circuit board 4325, and a signal for controlling the second display portion 4307 is also provided. An IC on which a line driver circuit 4323 is formed is provided on a printed circuit board, and the third display unit 430 The IC in which the signal line driver circuit 4323 for controlling the second and fourth display portions 4310 is formed is the third The signal line driver circuit 4323 is provided on an element substrate that constitutes the display panel 4313. Electrically connected via FPC4324. 325.

[0124] In Figure 15, the display panel can be bent using FPC4324. It is possible to adopt a configuration in which no part is provided.

[0125] Next, a double-sided display type second display panel is placed between the first display panel 4311 and the second display panel 4312. Explain the structure and functions of an e-book equipped with three panels using block diagrams, etc. In addition, the electronic book in this embodiment uses a self-displaying device as a display element for the display panel. This is particularly suitable for light-emitting elements, or liquid crystal elements that control the transmission of light such as backlights. It should be noted that the display element of the electronic book may be other display elements such as an electrophoretic element. It is noted that this is applicable.

[0126] FIG. 16 shows a block diagram of an electronic book described in this embodiment. , a first display panel 701, a second display panel 702, and a third display panel 703, The first display panel 701 has a fourth display panel 704 and a display control unit 705. The second display panel 702 has a scanning line driving circuit 706A and a first display section 707A. The third display panel 703 has a scanning line driving circuit 706B and a second display section 707B. The fourth display panel 704 has a scanning line driving circuit 706C and a third display section 707C. It has a scan line drive circuit 706D and a fourth display section 707D.

[0127] As described in the above embodiment, the first to fourth display panels 701 to 704 704 is a display control circuit including a signal line driver circuit described in the above embodiment mode, each of which has flexibility. The sheet is fixed by a binding portion having a portion 705 therein.

[0128] The third display panel 703 and the fourth display panel 704 are dual-emission display panels. By using the display unit, a third display unit 707C and a fourth display unit 707D are combined. 3 display panel 703, and it is possible to make the electronic book thinner and reduce the cost. come.

[0129] Each of the first to fourth display sections 707A to 707D has a plurality of pixels 708. Each of the plurality of pixels 708 has a pixel circuit 710 for controlling the display element. The pixel circuit 710 includes thin film transistors and the like, and forming them all at once reduces the cost. The first display unit 707A has an optical sensor 709A, and the second display unit 707B has a light sensor 709B, and the third display unit 707C has a light sensor 709C. The fourth display unit 707D includes an optical sensor 709D.

[0130] The scanning line driver circuits 706A to 706D are the pixel circuits in the pixel 708. Path 710 provides a scanning signal.

[0131] As described in the above embodiment, the optical sensors 709A to 709D are 701 and the third display panel 703, or the second display panel 702 and the fourth display panel 704. The function described in this embodiment can be realized by a tilt detection unit on the display panel or other open / close detection means. It is also possible to realize this function.

[0132] It should be noted that the optical sensor 709C and / or the optical sensor 709D are the same as the optical sensor 709A and / or the optical sensor 709C. Alternatively, it can be omitted by increasing the accuracy of the illuminance of the optical sensor 709B. Instead of the light sensor 709C and / or the light sensor 709D, a light blocking portion may be provided. This can improve the accuracy of the illuminance of the optical sensor 709A and / or the optical sensor 709B. Furthermore, even when a light-transmitting substrate is used, it can be detected by an optical sensor, which is preferable. do.

[0133] The optical sensors 709A to 709D are formed by thin film transistors included in the pixel circuit 710. On the substrate, a photo sensor such as a photodiode or phototransistor is installed. The photosensors 709A to 709D may be formed together with thin film transistors. This will help reduce the cost of e-books.

[0134] The display control unit 705 located in the binding unit 4308 includes a light intensity comparison circuit 711, a CPU 712, and a , internal memory 713, video signal generating circuit 714, power supply circuit 715, signal transmitting / receiving unit 71 6, power supply unit 717, operation unit 718, signal line driver circuits 714A to 714D The signal transmitting / receiving unit 716 is connected to each other via an interface or the like. The configuration includes an antenna unit 719 for transmitting and receiving data to and from an external device. Good too.

[0135] The light intensity comparison circuit 711 detects signals from the optical sensors 709A to 709D, The light intensity comparison circuit 711 is a circuit that compares the strength of the signal according to the illuminance. The signal corresponding to the intensity of the sensor is encoded and then displayed on the first display panel 701 and / or the second display panel 702. The optical sensor 709A and / or the optical sensor 709C of the third display panel 703, The optical sensor 709B of the first display panel 702 and / or the fourth display panel 704 and / or the optical sensor 709D, and a signal corresponding to the illuminance is compared. The signal resulting from the comparison is C The signal is sent to the PU 712, and the CPU 712 performs processing according to the signal. The PU 712 also performs processing in response to operations on the operation unit 718 .

[0136] The signal transmitting / receiving unit 716 receives data via the antenna unit 719 or transmits data stored in a recording medium. The internal memory 713 has a function to transfer the data stored in the internal memory 713. The data is stored in the internal memory 713 via the interface, etc. The data to be transferred includes the video signal to be displayed on the display panel, as well as the user ID, etc. It may also be something that stores information.

[0137] The internal memory 713 stores signals from the light intensity comparison circuit 711, the power supply unit 717, the operation unit 718, etc. The signal to be output to the video signal generating circuit 714 and / or the power supply circuit 715 based on Programs to be processed by the CPU 712 and data transferred from the signal transmission / reception unit 716 As an example, the internal memory 713 has a memory unit that stores ROM (Read Only Memory). Only Memory) and RAM (Random Access Memory) It is something that is accomplished.

[0138] The power supply unit 717 supplies power wirelessly or via a wire, or uses a storage battery, a capacitor, or the like. The operation unit 718 has a function of supplying power by a touch panel, a movable The user's operation based on the operation buttons or the like that can operate the unit is encoded and transferred to the CPU 712. It has the means to do so.

[0139] The video signal generating circuit 714 generates the first to fourth display panels 701 to 706 in response to the control of the CPU 712. A scanning line driver circuit for driving the fourth display panel 704 to turn on and off the display. A clock signal, a start pulse, etc. are supplied to each of the scanning line driving circuits 706A to 706 D, and a clock signal for driving a signal line driving circuit provided in the binding section. A start pulse, a video signal, etc. are supplied to each of the signal line driver circuits 714A to 714D. This is a circuit for supplying power.

[0140] The signal line driver circuits 714A to 714D are the pixel circuit An image signal is supplied to the line 710 via a signal line.

[0141] The power supply circuit 715 supplies the first to fourth display panels 701 to 704 under the control of the CPU 712. To control the power supply to the display element in order to turn on or off the display panel 704 For the sake of explanation, in FIG. 16, the first display unit 707A is provided in the power supply circuit 715. a power supply circuit 715A that supplies power to the first display unit 707B; a power supply circuit 715B for supplying power to the third display unit 707C; a power supply circuit 715C for supplying power to the fourth display unit 707C; A power supply circuit 715D that supplies power to the display unit 707D is shown.

[0142] The operation of the electronic book shown in FIG. 16 will be described using an example. First, the optical sensors 709A to The illuminance of the display surface of each display panel obtained by 709D is compared by a light intensity comparison circuit 711. The CPU 712 receives the result of the comparison by the light intensity comparison circuit 711 or the signal from the operation unit 718. The signal from the optical sensor determines which display panel the user is viewing. 709A and / or light sensor 709C, and the light sensor 709B and / or light sensor The illuminance of the optical sensor 709D is compared with the illuminance of the optical sensor 709A and / or the optical sensor 709C. is greater than the illuminance of light sensor 709B and / or light sensor 709D, the user The CPU determines that the user is viewing the first display unit 707A and / or the third display unit 707C. 712 determines which display panel the user is viewing, and the video signal generating circuit 7 14 supplies video signals and control signals to the first display panel 701 to the fourth display panel 704. A signal and / or power supply circuit 715 supplies the first to fourth display panels 701 to 704. Specifically, the power supply to the second display 704, which is not visually recognized by the user, is controlled. a second display panel 702 having a fourth display portion 707B and a fourth display portion 707D; By stopping the power supply to the panel 704, power consumption is reduced and the life of the display panel is extended. This can be achieved.

[0143] The electronic book shown in FIG. 16 detects the page the user is viewing using an optical sensor and a light intensity comparison circuit. By determining the difference, the supply of image signals to the display panel and the supply of power can be selectively switched. This allows us to offer e-books that consume less power and have a longer display panel life. It can be provided.

[0144] This embodiment mode can be implemented by being appropriately combined with the configurations described in other embodiments. is.

[0145] (Embodiment 5) In this embodiment, an example of a display panel provided in an electronic book is shown. A display panel having a pixel can be applied, and it can be either a passive matrix type or an active matrix type. It can also be a risk type.

[0146] Display panels include electronic paper and light-emitting display panels (EL (electroluminescence) ) panel), liquid crystal display panel, etc. can be used. The panel is in a sealed state, and a connector, such as FPC (Flexible Printed Circuit) TAB (Tape Automated Bond) ing) tape or TCP (Tape Carrier Package) is attached The signal line driver circuit is an IC that is electrically connected to an external circuit. Alternatively, the display panel may be directly mounted using a COG (Chip On Glass) method. .

[0147] The display panel can be a double-sided display type that displays on both sides or a single-sided display panel that displays on only one side. It may be used.

[0148] In the fourth embodiment, the third display panel 4313 includes the third display unit 4302 and the fourth display unit 4303. The third display panel 4313 is a dual-side display panel having a dual-side emission display unit 4310. A single-sided emission type display panel may be used, or a single-sided emission type display panel may be attached to the panel. Also, two LCD panels with a backlight (preferably a thin EL panel) sandwiched between them may also be used.

[0149] An example of a double-sided display panel is shown in FIGS. 17A to 17C using a third display panel 4313. 17(A) to 17(C), the arrows indicate the direction of light emission.

[0150] FIG. 17A shows a third display panel in which a display element 102 is sandwiched between a substrate 100 and a substrate 101. 4313, and the third display unit 4302 is on the substrate 100 side, and the fourth display unit 4303 is on the substrate 101 side. The display element 102 displays the third display portion 4302 and the fourth display portion 310. Since the display portion 4310 is used for display, the substrates 100 and 101 are translucent. It is preferable to use an EL element, which is a self-luminous light-emitting element, for the third display panel 102. When light incident on the panel 4313 is used, a liquid crystal display element or an electrophoretic display element is used as the display element 102. A moving display element may also be used.

[0151] FIG. 17B shows a single-sided display including a display element 114 sandwiched between a substrate 110 and a substrate 112. a single-sided display panel including a display element 115 sandwiched between a substrate 111 and a substrate 113; The third display panel 4313 is a laminate of the third display unit 4302 and the third display unit 4303 on the substrate 110 side. The fourth display unit 4310 is provided on the substrate 111 side. The display portion 4302 is displayed, and the fourth display portion 4310 is displayed by the display element 115. Therefore, the substrates 110 and 111 are transparent. The single-sided display panels do not need to have optical properties and may have reflective properties. The plate 112 and the substrate 113 may be bonded together by an adhesive layer. 2 and the substrate 113 may be used alone.

[0152] It is preferable to use EL elements for the display elements 114 and 115. When light incident on the panel 4313 is used, the display elements 114 and 115 are liquid crystal displays. A liquid crystal display element or an electrophoretic display element can also be used. Therefore, it is preferable to use a reflective display panel as the single-sided display panel.

[0153] A backlight may be provided between the translucent liquid crystal display panels to serve as a third display panel 4313. FIG. 17C shows a light-transmitting device including a display element 124 sandwiched between a substrate 120 and a substrate 122. A transparent liquid crystal display panel including a display element 125 sandwiched between a substrate 121 and a substrate 123. A third display panel is formed by stacking a light-emitting type liquid crystal display panel via a backlight 126 serving as a light source. The third display unit 4302 is on the substrate 120 side, and the fourth display unit 4303 is on the substrate 121 side. The third display element 4310 is illuminated by the light of the backlight 126 and the display element 124. The display unit 4302 is displayed, and the light from the backlight 126 and the display element 125 illuminates the fourth Since the display unit 4310 is displayed, the substrates 120, 121, 122, and 123 are It has translucency.

[0154] The single-sided display panel and the backlight may be bonded together using an adhesive layer. Alternatively, only one of the substrates 122 and 123 may be used. If a thin EL panel is used as the third display panel 4313, the third display panel 4313 can be made thin. This is preferable.

[0155] In the case of a single-sided display panel, a non-transparent or reflective housing is provided on the side where the display section is not provided. Providing such a film is preferable because it can improve the strength of the display panel.

[0156] One embodiment of the display panel will be described with reference to FIGS. 18 to 20. 18 to 20 and 22 correspond to the cross-sectional view at MN in FIG. 4(A). A first display portion 4301 having a pixel circuit and a first display portion 4322a having a scanning line driver circuit This is an example in which an FPC 4324 is attached to a panel 4311, and the FPC 4324 is installed on an element substrate 4331a. The first display portion 4301 and the scanning line driver circuit 4322a are covered with a sealant 4005. The semiconductor device is sealed with a sealing substrate 4332a.

[0157] As shown in FIGS. 18 to 20 and 22, the first display panel 4311 has a connection terminal electrode 4015 and terminal electrode 4016. 6 is electrically connected to the terminal of the FPC 4324 via the anisotropic conductive film 4019. There are.

[0158] The connection terminal electrode 4015 is formed from the same conductive film as the first electrode layer 4030. 016 is the same as the source electrode layer and drain electrode layer of the thin film transistors 4010 and 4011. The same conductive film is used.

[0159] As shown in FIG. 4, a single crystal semiconductor film or a polycrystalline semiconductor film is formed on a separately prepared substrate. The signal line driver circuit 4323a formed of a film is mounted by an FPC, and is The signal line driver circuit 4323a, the scanning line driver circuit 4322a, and the first table Various signals and potentials are supplied to the display unit 4301 from an FPC 4324 .

[0160] The connection method of the signal line driver circuit 4323a is not particularly limited, and may be a COG method. The method may be a soldering method, a wire bonding method, a TAB method, or the like.

[0161] The first display portion 4301 and the scanning line driver circuit 432 are provided on the element substrate 4331a. 1a has a plurality of thin film transistors, and in FIGS. 18 to 20, the first display unit 430 1 and a thin film transistor 4010 included in the scanning line driver circuit 4321a. The thin film transistors 4010 and 4011 are shown as examples. Layers 4020 and 4021 are provided. Note that the insulating film 4023 functions as a base film. It is an insulating film.

[0162] The thin film transistors 4010 and 4011 are not particularly limited and various thin film transistors can be used. 18 to 20, the thin film transistors 4010 and 4011 are An example using a bottom-gate inverted staggered thin film transistor is shown. 10 and 4011 show channel etch types, but the channel with a channel protection film on the semiconductor layer Alternatively, a panel-protected inversely staggered thin film transistor may be used.

[0163] The thin film transistor 4010 provided in the first display portion 4301 is electrically connected to the display element. The display element is not particularly limited as long as it can display an image, and various A display element can be used.

[0164] Electronic paper can be used as a display panel. The method of displaying the image is to use an electric field, a magnetic field, light, or heat. The change in the display medium is due to changes in shape or position. There are many methods using various combinations of the use of physical changes. For example, twist Ball type, electrophoretic type, powder type (also called toner display), liquid crystal type Examples include:

[0165] 18 and 22 show an active matrix type electronic page as the first display panel 4311. Here is an example using a paper. Electronic paper has the same readability as paper, but is lower than other display panels. It has the advantage of being able to consume less power and to have a thin and light shape.

[0166] 18(A)(B) and 22 show examples of active matrix type electronic display panels. Show paper.

[0167] The electronic paper in FIG. 18A is an example of a display device that uses a twisting ball display method. The twist ball display method uses electrodes that use spherical particles painted in black and white as display elements. By placing the electrodes between the layers and creating a potential difference between the layers, the orientation of the spherical particles can be controlled. This is a method for displaying.

[0168] The first electrode layer 4030 connected to the thin film transistor 4010 and the sealing substrate 4332a are A black area 4615a and a white area 4615b are formed between the second electrode layer 4031 and the black area 4615a. A spherical particle 4613 is provided, which has a cavity 4612 filled with liquid around it. The spherical particles 4613 are filled with a filler 4614 such as resin. The electrode layer 4031 corresponds to a common electrode (opposite electrode). It is electrically connected to the wire.

[0169] Also, instead of the twist ball, an electrophoretic element can be used. An example of using an electrophoretic element as a detector is shown in FIG. 18(B). negatively charged black particles 4715a as the first particle and positively charged white particles as the second particle. Microcapsules 4713 with a diameter of approximately 10 μm to 200 μm are used. There are.

[0170] Microcapsules 47 provided between the first electrode layer 4030 and the second electrode layer 4031 13, when an electric field is applied by the first electrode layer 4030 and the second electrode layer 4031, White particles 4715b and black particles 4715a move in opposite directions, displaying white or black. The display element that applies this principle is the electrophoretic display element. The display element has high reflectivity, so auxiliary lights are not required, and it consumes little power and is dim. The display can be recognized even in a location where power is not supplied to the display. Even if the image is displayed, it is possible to maintain the image once it has been displayed, so the display panel can be Even if the user moves away from the camera, the displayed image can be saved.

[0171] The first particles and the second particles contain a dye and do not move in the absence of an electric field. In addition, the first particles and the second particles are different in color (including colorless).

[0172] The microcapsules dispersed in a solvent are called electronic ink. The electronic ink can be printed on surfaces such as glass, plastic, fabric, and paper. Color display is also possible by using color filters or particles containing pigments.

[0173] The first particles and the second particles in the microcapsules may be made of a conductive material, an insulating material, Semiconductor materials, magnetic materials, liquid crystal materials, ferroelectric materials, electroluminescent materials, A material selected from magnetochromic materials, magnetophoretic materials, or a composite material thereof Just use it.

[0174] It is also possible to use electronic liquid powder (registered trademark) as a powder system. An example of using electronic liquid powder as a first electrode layer 4030 and a second electrode layer 403 1, and a space 4812 defined by the rib 4814 is filled with positively charged black powder 4815a. and negatively charged white powder 4815b. Space 4812 is filled with air.

[0175] When an electric field is applied by the first electrode layer 4030 and the second electrode layer 4031, the black powder particles The white powder 4815a and the white powder 4815b move in opposite directions, displaying white or black. As the powder, colored powder such as red, yellow, or blue may be used.

[0176] In addition, the display element is a light-emitting element (EL element) that uses electroluminescence. The light-emitting element using electroluminescence may be made of an organic compound. Generally, the former are organic EL elements, and the latter are inorganic compounds. are called inorganic EL elements.

[0177] In an organic EL element, electrons and holes are released from a pair of electrodes by applying a voltage to the light-emitting element. are injected into the layers containing the light-emitting organic compounds, causing a current to flow. The recombination of the electrons and holes creates an excited state in the light-emitting organic compound. The excited state is then converted to the ground state, at which point light is emitted. Such a light-emitting element is called a current-excited light-emitting element.

[0178] Inorganic EL elements are divided into dispersion-type inorganic EL elements and thin-film-type inorganic EL elements depending on the element structure. Dispersion-type inorganic EL elements have a light-emitting layer in which particles of a light-emitting material are dispersed in a binder. The emission mechanism is a donor-acceptor interaction that utilizes the donor and acceptor levels. Thin-film inorganic EL devices sandwich the light-emitting layer between dielectric layers. Furthermore, this structure is sandwiched between electrodes, and the light emission mechanism utilizes the inner-shell electron transition of metal ions. In this example, the light-emitting element is an organic EL element. do.

[0179] The light emitting element only needs to have at least one of the pair of electrodes transparent in order to extract light. Then, a thin film transistor and a light emitting element are formed on the substrate, and light is emitted from the surface opposite to the substrate. Top emission, bottom emission, and both the substrate side and the opposite side of the substrate. There are light emitting elements with a double-sided emission structure that emits light from both sides, and light emitting elements with any emission structure can be used. It is possible.

[0180] FIG. 19 shows an example in which a light-emitting display panel (EL panel) is used as the first display panel 4311. The light-emitting element 4513 which is a display element is a thin film transistor provided in the display portion 4301. The light-emitting element 4513 is electrically connected to the first electrode layer 403. 0, an electroluminescent layer 4511, and a second electrode layer 4031. The direction of the light emitting element 4513 is adjusted according to the direction of the light extracted from the light emitting element 4513. The configuration can be changed as appropriate.

[0181] The partition wall 4510 is formed using an organic resin film, an inorganic insulating film, or organic polysiloxane. In particular, a photosensitive material is used to form an opening on the first electrode layer 4030, and the sidewall of the opening It is preferable to form the inclined surface so that the inclined surface has a continuous curvature.

[0182] The electroluminescent layer 4511 may be composed of a single layer or a plurality of layers stacked. It doesn't matter whether it's done or not.

[0183] The second electrode layer is formed to prevent oxygen, hydrogen, moisture, carbon dioxide, and the like from entering the light-emitting element 4513. A protective film may be formed on the insulating film 4031 and the partition wall 4510. The protective film may be a silicon nitride film, A silicon nitride oxide film, a DLC film, etc. can be formed. A filler 4514 is provided in the space sealed by the substrate 4332a and the sealant 4005. In this way, the container is airtight and has minimal gas release, preventing exposure to the outside air. Packaging with protective film (laminating film, UV curing resin film, etc.) or cover material It is preferable to encase the compound.

[0184] Filler 4514 can be an inert gas such as nitrogen or argon, or an ultraviolet curing resin or Thermosetting resin can be used, and PVC (polyvinyl chloride), acrylic, polyimide Mido, epoxy resin, silicone resin, PVB (Polyvinyl Butyral) or EVA (Elastomer) For example, nitrogen may be used as a filler. stomach.

[0185] If necessary, a polarizing plate or a circular polarizing plate (including an elliptical polarizing plate) may be provided on the light-emitting surface of the light-emitting element. Optical films such as retardation plates (λ / 4 plates, λ / 2 plates) and color filters may be provided as appropriate. In addition, an anti-reflection film may be provided on the polarizing plate or the circular polarizing plate. Anti-glare treatment can be applied to diffuse reflected light and reduce glare.

[0186] FIG. 20 shows an example in which a liquid crystal display panel is used as the first display panel 4311. The liquid crystal element 4013, which is a display element, has a first electrode layer 4030 and a second electrode layer 403 1 and a liquid crystal layer 4008. The liquid crystal layer 4008 is sandwiched between two layers that function as alignment films. The second electrode layer 4031 is provided with insulating films 4032 and 4033 that function as a sealing substrate 4. 332a side, and the first electrode layer 4030 and the second electrode layer 4031 are 8 are stacked together.

[0187] 4035 is a columnar spacer obtained by selectively etching the insulating film. It is provided to control the film thickness (cell gap) of the liquid crystal layer 4008. A pacer may be used.

[0188] Although not shown in the liquid crystal display device of FIG. 20, a color filter (colored layer), a black matrix Optical components (optical substrates) such as trix (light-shielding layer), polarizing components, phase difference components, and anti-reflection components For example, circular polarization may be achieved by a polarizing substrate and a retardation substrate. A backlight, a sidelight, or the like may be used as the light source. The use of an L panel is preferable because it allows for a thinner screen.

[0189] Alternatively, a liquid crystal that exhibits a blue phase without using an alignment film may be used. The blue phase is one of the liquid crystal phases. When the temperature of cholesteric liquid crystal is increased, the phase immediately transitions from the cholesteric phase to the isotropic phase. The blue phase appears only in a narrow temperature range, so the temperature range needs to be improved. In order to achieve this, a liquid crystal composition containing 5% by weight or more of a chiral agent is used for the liquid crystal layer 4008. The liquid crystal composition containing the liquid crystal exhibiting the blue phase and the chiral agent has a response speed of 10 μs to It is optically isotropic, requiring no alignment treatment, and has little viewing angle dependency. stomach.

[0190] Although FIG. 20 shows an example of a transmissive liquid crystal display panel, a semi-transmissive liquid crystal display panel can also be used in a reflective liquid crystal display panel. It can also be applied to LCD panels.

[0191] 18 to 20 and 22, the element substrate 4331a, the sealing substrate 4332 As the material a, a light-transmitting plastic or the like can be used. FRP (Fiberglass-Reinforced Plastics) boards, PVF (Polyvinyl fluoride) film, polyester film, polyester film Film or acrylic resin film can be used. Aluminum foil can also be used. A sheet sandwiched between VF films or polyester films can also be used.

[0192] The insulating layer 4020 functions as a protective film for the thin film transistor.

[0193] The protective film prevents the intrusion of polluting impurities such as organic matter, metals, and water vapor floating in the air. The protective film is a silicon oxide film formed by sputtering. , silicon nitride film, silicon oxynitride film, silicon nitride oxide film, aluminum oxide film, aluminum nitride film The film is formed of a single layer or a stack of aluminum oxide films, aluminum oxynitride films, or aluminum nitride oxide films. That's fine.

[0194] The insulating layer 4021 functioning as a planarizing insulating film is formed of a material selected from the group consisting of polyimide, acrylic, and benzosilane. Heat-resistant organic materials such as clobutene, polyamide, and epoxy can be used. In addition to the above organic materials, low-k materials, siloxane resins, and PS G (phosphorus glass), BPSG (boron phosphorus glass), etc. can be used. The insulating layer may be formed by stacking a plurality of insulating films made of these materials.

[0195] The method for forming the insulating layers 4020 and 4021 is not particularly limited. ttach method, SOG method, spin coating, dip coating, spray coating, droplet ejection method (ink jet (printing, screen printing, offset printing, etc.), doctor knife, roll coater, A machine such as a knife coater or a pen coater can be used. The insulating layer is formed using a material liquid. In this case, annealing the semiconductor layer (200℃ to 400℃) at the same time as the baking process By combining the insulating layer firing process with the annealing of the semiconductor layer, display panels can be manufactured efficiently. It becomes possible to do this.

[0196] The display panel transmits light from a light source or a display element to display an image. The substrate, other insulating films, conductive films and other thin films provided in the display section are all resistant to light in the visible light wavelength range. This makes it translucent.

[0197] A first electrode layer 4030 and a second electrode layer 4031 (pixel electrode layer) for applying a voltage to a display element In the case of a layer (also called a common electrode layer, counter electrode layer, etc.), the direction of the light to be extracted is determined by the electrode layer provided. The light transmission property or reflectivity can be selected depending on the location where the electrode layer is to be used and the pattern structure of the electrode layer.

[0198] The first electrode layer 4030 and the second electrode layer 4031 are made of an indium oxide containing tungsten oxide. oxide, indium zinc oxide with tungsten oxide, indium oxide with titanium oxide Indium tin oxide (hereinafter referred to as ITO) ), indium zinc oxide, indium tin oxide with silicon oxide added, etc. A conductive material that can be used can be used.

[0199] The first electrode layer 4030 and the second electrode layer 4031 are made of tungsten (W) and molybdenum. (Mo), zirconium (Zr), hafnium (Hf), vanadium (V), niobium (N b), Tantalum (Ta), Chromium (Cr), Cobalt (Co), Nickel (Ni), Titanium Metals such as titanium (Ti), platinum (Pt), aluminum (Al), copper (Cu), and silver (Ag), It can be formed by using one or more of the metals, alloys thereof, or metal nitrides thereof. Cut.

[0200] The first electrode layer 4030 and the second electrode layer 4031 are made of a conductive polymer (conductive polymer). The conductive polymer can be formed using a conductive composition containing a conductive polymer. For example, a so-called π-electron conjugated conductive polymer can be used. or its derivatives, polypyrrole or its derivatives, polythiophene or its derivatives, or and copolymers of two or more of these.

[0201] In addition, since thin film transistors are easily damaged by static electricity, etc., a protective layer is required to protect the drive circuit. It is preferable to provide a protection circuit. The protection circuit is preferably configured using a nonlinear element. .

[0202] This embodiment mode can be implemented by being appropriately combined with the configurations described in other embodiments. is.

[0203] (Embodiment 6) In this embodiment, examples of materials and element structures that constitute the electronic book will be described in detail.

[0204] Since the signal line driver circuit is provided in the binding portion, it does not need to be particularly flexible. A semiconductor that uses a semiconductor substrate (semiconductor wafer) capable of high-speed operation as a signal line driver circuit It is preferable to use an integrated circuit chip (IC). and polycrystalline semiconductor substrates such as silicon wafers and germanium wafers. semiconductor wafers, and compound semiconductor wafers such as gallium arsenide and indium phosphide. do.

[0205] In addition, a substrate having an SOI structure in which a single crystal semiconductor layer is provided on an insulating surface is used for the signal line driver circuit ( An SOI substrate may be used. It can be created using the IMplanted Oxygen method or the Smart-Cut method. The SIMOX method involves implanting oxygen ions into a single-crystal silicon substrate to a specified depth. After forming the oxygen-containing layer, a heat treatment is performed to form a buried insulating layer at a certain depth from the surface. The Smart-Cut method is a method of forming a single crystal silicon layer on a buried insulating layer. Hydrogen ions are implanted into the oxidized single crystal silicon substrate, and hydrogen is implanted at a desired depth. A silicon-containing layer is formed on another semiconductor substrate (a single crystal having a silicon oxide film on the surface for bonding). The hydrogen-containing layer is then bonded to a single crystal silicon substrate by heat treatment. The silicon substrate is divided, and a silicon oxide film and a single crystal silicon layer are laminated on the semiconductor substrate. This is a way to achieve this.

[0206] The semiconductor elements installed in the circuit section of an electronic book include not only field effect transistors but also semiconductors. It can also be used for memory (storage) elements that use conductor layers, and is required for a wide range of applications. A semiconductor integrated circuit that fulfills the functions described above can be provided.

[0207] There are no particular limitations on the method for providing the scanning line driving circuit and the display section on the flexible substrate of the display panel. The scanning line driver circuit and the display section may be formed directly on the flexible substrate, or may be formed by other fabrication methods. The element layer is fabricated on a substrate, and then transferred from the fabrication substrate to a flexible substrate by a peeling method. For example, the scanning line driver circuit and the display portion may be formed on a manufacturing substrate in the same process. The line driver circuit and the display portion can be provided by being transposed onto a flexible substrate of the display panel. In this case, the scanning line driver circuit and the display section are formed in the same process, so transistors of the same structure and material are used. Therefore, the scanning line driving circuit and the display unit are preferably made of a scanning element. The channel layers of the transistors are made of the same material.

[0208] In addition, the substrate is transferred from the substrate to a flexible support substrate, and the substrate is used as a substrate for the display panel together with the flexible support substrate. For example, a plurality of scanning line driving circuits may be formed on a fabrication substrate, and the wiring board may be attached to a flexible substrate. After the flexible support substrate is transferred to the support substrate, it is cut into individual scanning line drive circuits. The scanning line driving circuit is attached to a flexible support substrate as needed for the display panel. In this case, the scanning line driver circuit and the display portion are manufactured in separate steps. Transistors of various configurations and materials can be selected.

[0209] The above-mentioned transposition method and direct formation method may be combined. For example, a printing method may be used to The wiring that electrically connects the display section, scanning line driving circuit section, FPC, etc. is attached to the flexible substrate of the display panel. It may be formed directly on the plate.

[0210] The substrate for fabrication may be appropriately selected in accordance with the fabrication process of the element layer. The substrates include glass substrates, quartz substrates, sapphire substrates, ceramic substrates, and substrates with an insulating layer on the surface. A metal substrate having a heat resistance that can withstand the processing temperature can be used. A plastic substrate may also be used.

[0211] As flexible substrates, aramid resin, polyethylene naphthalate (PEN) resin, and polyethylene terephthalate (PEN) resin are used. Polyphenylene sulfide (PES) resin, polyphenylene sulfide (PPS) resin, polyimide In addition, a structure in which fibers are impregnated with organic resin can be used. Certain prepregs may also be used.

[0212] The method for transferring the element layer from the substrate to another substrate is not particularly limited, and various methods can be used. For example, a separation layer may be formed between the formation substrate and the element layer.

[0213] In this specification, the element layer refers to not only the semiconductor element layer provided on the element substrate side but also the opposing This also includes the counter electrode layer provided on the substrate side. In addition, in consideration of the simplicity of the process, the substrate is transferred to a flexible substrate. After that, the flexible substrate is temporarily attached to a glass substrate or the like in the manufacturing process, and the manufacturing process is continued. It is also possible.

[0214] The peeling layer is formed by sputtering, plasma CVD, coating, printing, etc. W, Molybdenum (Mo), Titanium (Ti), Tantalum (Ta), Niobium (Nb), Nickel (Ni), cobalt (Co), zirconium (Zr), zinc (Zn), ruthenium Ru (Ru), Rhodium (Rh), Palladium (Pd), Osmium (Os), Iridium (Ir), silicon (Si), or an alloy material mainly composed of the element, or A layer made of a compound material containing the above element as a main component is formed as a single layer or a stacked layer. The crystalline structure of the layer may be amorphous, microcrystalline, or polycrystalline. The fabrication method includes spin coating, droplet ejection, and dispensing.

[0215] When the release layer has a single layer structure, it is preferably a tungsten layer, a molybdenum layer, or a tungsten layer. A layer containing a mixture of tungsten and molybdenum is formed. Alternatively, a layer containing tungsten oxide or molybdenum oxide is formed. a layer containing a nitride, a layer containing an oxide or oxynitride of molybdenum, or a layer containing tungsten and A layer containing an oxide or oxynitride of a mixture of molybdenum is formed. The mixture of tungsten and molybdenum corresponds to, for example, an alloy of tungsten and molybdenum.

[0216] When the release layer has a laminated structure, the first layer is preferably a tungsten layer, a molybdenum layer, or a The first layer contains a mixture of tungsten and molybdenum, and the second layer contains tungsten, Oxides, nitrides, oxynitrides or nitrides of molybdenum or mixtures of tungsten and molybdenum Forms an oxide.

[0217] A layer containing tungsten and a layer containing tungsten oxide are stacked as a peeling layer. In this case, a layer containing tungsten is formed, and an insulating layer made of oxide is formed on the layer containing tungsten. By this, a layer containing tungsten oxide is formed at the interface between the tungsten layer and the insulating layer. Furthermore, the surface of the tungsten-containing layer may be subjected to a thermal oxidation treatment, Oxygen plasma treatment, treatment with a strong oxidizing solution such as ozone water, etc., is used to remove the tungsten acid. In addition, the plasma treatment or the heat treatment may be performed by using oxygen, nitrogen, or dioxide. The process may be carried out in an atmosphere of nitrogen alone or a mixture of the above gases with other gases. The same applies to the case of forming a layer containing tungsten nitride, oxynitride, or nitride oxide. After forming a layer containing tungsten, a silicon nitride layer, a silicon oxynitride layer, a silicon nitride layer, and a silicon nitride layer are formed on the layer. It is preferable to form a silicon dioxide layer.

[0218] In the transfer step to another substrate, a separation layer is formed between the substrate and the element layer. a metal oxide film is provided between the element layer and the metal oxide film is weakened by crystallization, and the element layer is peeled off. a method of providing an amorphous silicon film containing hydrogen between a substrate having high heat resistance and an element layer, The amorphous silicon film is removed by irradiation or etching, thereby peeling off the element layer. A method for manufacturing a semiconductor device, comprising: forming a separation layer between a substrate and an element layer; and providing a metal oxide film between the separation layer and the element layer. The metal oxide film is weakened by crystallization, and part of the peeling layer is dissolved in a solution of NF3, BrF3, Cl After removing the metal oxide film by etching with halogen fluoride gas such as F3, The method of peeling off the substrate on which the element layer is formed is to mechanically remove it or to remove it with a solution such as NF3 or BrF 3. The method of removing the metal by etching with halogen fluoride gas such as ClF3 can be appropriately used. In addition, a film containing nitrogen, oxygen, hydrogen, etc. (for example, an amorphous film containing hydrogen) can be used as the peeling layer. The peeling layer is irradiated with laser light. Nitrogen, oxygen, and hydrogen contained in the peeling layer are released as gas to promote peeling between the element layer and the substrate. The following method may also be used.

[0219] By combining the above peeling methods, the transposition process can be carried out more easily. irradiation of the laser beam, etching of the peeling layer with gas or solution, or etching with a sharp knife or scalpel Mechanical removal is performed to make it easier to separate the release layer and the element layer, and then physical force (mechanical Peeling can also be performed by mechanical means.

[0220] Alternatively, the element layer may be peeled off from the substrate by allowing a liquid to penetrate into the interface between the peeling layer and the element layer. Water or the like can be used as the body.

[0221] The transistors included in the electronic book disclosed in this specification are not particularly limited. Various structures and semiconductor materials can be used.

[0222] An example of the structure of a thin film transistor will be described with reference to FIG. 21. 40 is an example of a thin film transistor that can be used as the thin film transistor 4010 in the semiconductor device.

[0223] In FIGS. 21A to 21D, an insulating film 4023 is formed on an element substrate 4331a. Thin film transistors 4010a, 4010b, 4010c, and 4010d are formed on an insulating film 4023. Thin film transistors 4010a, 4010b, 4010c, and 4010d are provided. An insulating layer 4020 and an insulating layer 4021 are formed on the thin film transistors 4010a and 4010b. A first electrode layer 4030 is provided to electrically connect to the electrodes 4010b, 4010c, and 4010d. do.

[0224] The thin film transistor 4010a has the same structure as the thin film transistor 4010 in FIGS. In the semiconductor device, wiring layers 405a and 405b functioning as a source electrode layer and a drain electrode layer are The conductor layer 403 and + The structure is such that the two contact each other without any intervening layer.

[0225] The thin film transistor 4010a is an inverted staggered thin film transistor and has an insulating surface. On an element substrate 4331a, which is a substrate, and an insulating film 4023, a gate electrode layer 401 and a gate insulating film the layer 402, the semiconductor layer 403, the wiring layer 40 serving as a source electrode layer or a drain electrode layer, 5a, 405b. +The layers 404a and 404b are semiconductor layers having a lower resistance than the semiconductor layer 403. This is the body layer.

[0226] The thin film transistor 4010b is a bottom gate thin film transistor having an insulating surface. On an element substrate 4331a, which is a substrate to be used as a gate electrode, a gate electrode layer 401 and a gate insulating film 4023 are formed. The insulating layer 402, the wiring layers 405a and 405b functioning as source and drain electrode layers, and the wiring layers 405c and 405d functioning as source and drain electrode layers are b, n acting as a source or drain region + Layers 404a, 404b, and semiconductor The insulating layer 403 covers the thin film transistor 4010b and is in contact with the semiconductor layer 403. An edge layer 4020 is provided.

[0227] In addition, n + The layers 404a and 404b are formed between the gate insulating layer 402 and the wiring layers 405a and 405b. It may also be a structure in which the n + Layers 404a and 404b are gate insulating layers and wiring layers. A structure in which the insulating film is provided both between layers and between the wiring layer and the semiconductor layer may be used.

[0228] The thin film transistor 4010b has a gate electrode in the entire region including the thin film transistor 4010b. A device substrate is a substrate having a gate insulating layer 402 and an insulating surface. The gate electrode layer 401 is provided between the gate insulating layer 4331a and the gate insulating layer 402. Layers 405a, 405b, and n + Layers 404a and 404b are provided. The insulating layer 402, the wiring layers 405a, 405b, and + On the layers 404a and 404b, a semiconductor Although not shown, a wiring layer 403 is provided on the gate insulating layer 402. In addition to the semiconductor layers 405a and 405b, a wiring layer is provided, which extends outward from the outer periphery of the semiconductor layer 403. It exists.

[0229] The thin film transistor 4010c is the same as the thin film transistor 4010b except that the source electrode layer and The drain electrode layer and the semiconductor layer are + The structure is such that the two contact each other without any intervening layer.

[0230] The thin film transistor 4010c has a gate electrode in the entire region including the thin film transistor 4010c. A device substrate is a substrate having a gate insulating layer 402 and an insulating surface. The gate electrode layer 401 is provided between the gate insulating layer 4331a and the gate insulating layer 402. The gate insulating layer 402 and the wiring layer 405a are provided. , 405b, the semiconductor layer 403 is provided on the gate insulating layer 4 On the semiconductor layer 402, in addition to the wiring layers 405a and 405b, a wiring layer is provided. It extends outward from the outer periphery of the

[0231] The thin film transistor 4010d is a top-gate thin film transistor. The transistor 4010d is an example of a planar thin film transistor. An element substrate 4331a has a layer on an insulating film 4023, which functions as a source region or a drain region. to do + a semiconductor layer 403 including layers 404a and 404b; a gate insulating layer on the semiconductor layer 403; A gate insulating layer 402 is formed on the gate electrode layer 401. n + Wirings that are in contact with the layers 404a and 404b and function as source and drain electrode layers Layers 405a and 405b are formed. + The layers 404a and 404b are semiconductor layers 403 It is a semiconductor region with lower resistance.

[0232] A top-gate type forward staggered thin film transistor may be used as the thin film transistor.

[0233] In this embodiment, a single gate structure has been described, but a multi-gate structure such as a double gate structure may also be used. In this case, a gate electrode layer may be provided above and below the semiconductor layer. Alternatively, a structure in which a plurality of gate electrode layers are provided on only one side (upper or lower) of the semiconductor layer may be used.

[0234] The semiconductor material used for the semiconductor layer is not particularly limited. Examples of materials that can be used are described below.

[0235] The semiconductor layers of semiconductor elements are made of semiconductor materials such as silane and germane. Amorphous (hereinafter referred to as amorphous) is a material produced by vapor deposition or sputtering using a source gas. (Also called "AS") semiconductor, the amorphous semiconductor is Crystallized polycrystalline semiconductor or microcrystalline (semi-amorphous or microcrystalline) Also called "SAS" hereafter.) Semiconductors, etc. can be used. The layer can be deposited by sputtering, LPCVD, or plasma CVD. .

[0236] Considering the Gibbs free energy, the microcrystalline semiconductor film is a quasi-stable film intermediate between amorphous and single crystal. In other words, the third state is a stable state in terms of free energy. Conductive, with short-range order and lattice distortion. Columnar or needle-like crystals are formed on the substrate surface. Microcrystalline silicon, a typical example of a microcrystalline semiconductor, grows in the normal direction. The 520 cm spectrum indicates single-crystal silicon. -1It is shifted to the lower wavenumber side than That is, 520 cm, which indicates single crystal silicon. -1 and 480 cm, which indicates amorphous silicon -1 The Raman spectrum of microcrystalline silicon has a peak between these two. At least 1 atomic % or more of hydrogen or halogen is used to terminate the ring bond. It also contains rare gas elements such as helium, argon, krypton, and neon. By further promoting lattice distortion through the annealing, stability is increased and a good microcrystalline semiconductor film can be obtained. do.

[0237] This microcrystalline semiconductor film is formed by a high-frequency plasma CVD method with a frequency of several tens to several hundreds of MHz, or Alternatively, it can be formed by a microwave plasma CVD device with a frequency of 1 GHz or more. Representative examples include SiH4, Si2H6, SiH2Cl2, SiHCl3, SiCl4, and S It can be formed by diluting silicon hydride such as iF4 with hydrogen. In addition to hydrogen, one or more of helium, argon, krypton, and neon A microcrystalline semiconductor film can be formed by diluting the silicon hydride with a rare gas element. The flow rate ratio of hydrogen to nitrogen is 5 to 200 times, preferably 50 to 150 times, More preferably, it is 100 times.

[0238] Representative amorphous semiconductors include hydrogenated amorphous silicon and crystalline semiconductors. A typical example is polysilicon. Polysilicon (polycrystalline silicon) has the following features: , which uses polysilicon as the main material and is formed through a process temperature of 800°C or higher. The main materials are high-temperature polysilicon and polysilicon formed at process temperatures below 600°C. The so-called low-temperature polysilicon is used as a material for the crystallization of amorphous silicon. It contains polysilicon, which is made by crystallizing silicon. Of course, as mentioned above, A semiconductor or a semiconductor layer containing a crystalline phase in part can also be used.

[0239] In addition to elements such as silicon (Si) and germanium (Ge), semiconductor materials include Compound semiconductors such as GaAs, InP, SiC, ZnSe, GaN, and SiGe are also used. You can be there.

[0240] When a crystalline semiconductor film is used as the semiconductor layer, the crystalline semiconductor film can be manufactured by various methods. Methods (laser crystallization, thermal crystallization, or using elements that promote crystallization such as nickel) In addition, the SAS microcrystalline semiconductor can be irradiated with laser to form a crystal. If no element that promotes crystallization is introduced, the material will be amorphous. Before irradiating the silicon film with laser light, it was heated at 500°C for 1 hour in a nitrogen atmosphere. The hydrogen concentration of the amorphous silicon film is 1×10 20 atoms / cm 3 Release to the following: This is because when a laser beam is irradiated onto an amorphous silicon film containing a large amount of hydrogen, the amorphous silicon film is destroyed. Because it will be put away.

[0241] As a method for introducing a metal element into an amorphous semiconductor film, the metal element is introduced into the surface of the amorphous semiconductor film. There are no particular limitations on the method as long as it can be used to make the surface or interior thereof. For example, sputtering, CVD, etc. method, plasma treatment method (including plasma CVD method), adsorption method, method of applying a metal salt solution Among these, the method using a solution is simple and easy to use, and the concentration of the metal element can be adjusted. In addition, the wettability of the surface of the amorphous semiconductor film is improved. In order to spread the aqueous solution over the entire surface of the amorphous semiconductor film, UV light was used in an oxygen atmosphere. by irradiation, thermal oxidation, treatment with ozone water containing hydroxyl radicals or hydrogen peroxide, etc. Therefore, it is desirable to form an oxide film.

[0242] In addition, in the crystallization process of crystallizing the amorphous semiconductor film to form a crystalline semiconductor film, The element that promotes crystallization (also referred to as a catalytic element or metal element) is added to the film, and the film is heat-treated (550 Crystallization may be carried out by heating at 500°C to 750°C for 3 minutes to 24 hours. The elements that can be used include iron (Fe), nickel (Ni), cobalt (Co), and ruthenium (Ru ), rhodium (Rh), palladium (Pd), osmium (Os), iridium (Ir) , platinum (Pt), copper (Cu) and gold (Au) can be done.

[0243] In order to remove or reduce the elements that promote crystallization from the crystalline semiconductor film, A semiconductor film containing an impurity element is formed in contact with the substrate, and functions as a gettering sink. As for pure elements, impurity elements that give n-type conductivity, impurity elements that give p-type conductivity, and rare gas elements For example, phosphorus (P), nitrogen (N), arsenic (As), antimony ( Sb), Bismuth (Bi), Boron (B), Helium (He), Neon (Ne), Argon One or more selected from Ar (Ar), Kr (krypton), and Xe (xenon) are used. A crystalline semiconductor film containing an element that promotes crystallization can be formed by adding a semiconductor containing a rare gas element. A conductive film is formed and heat treated (at 550°C to 750°C for 3 minutes to 24 hours). The elements contained in the film that promote crystallization move into the semiconductor film containing the rare gas element, and the crystallization The elements that promote crystallization in the semiconductor film are removed or reduced. The semiconductor film containing the rare gas element that has become a mask is then removed.

[0244] The crystallization of the amorphous semiconductor film may be performed by combining a heat treatment and crystallization by laser light irradiation. The heat treatment or the laser light irradiation may be performed individually or multiple times.

[0245] Alternatively, the crystalline semiconductor film may be formed directly on the substrate by a plasma method. A crystalline semiconductor film may be selectively formed on a substrate by using a method.

[0246] The semiconductor layer may also be made of an oxide semiconductor, such as zinc oxide (ZnO) or tin oxide. (SnO2) can also be used. When ZnO is used for the semiconductor layer, the gate insulating layer Y2O3, Al2O3, TiO2, and laminations of these materials are used to form gate electrode layers and source electrodes. The electrode layer and the drain electrode layer may be made of ITO, Au, Ti, or the like. In, Ga, etc. can also be added to ZnO.

[0247] InMO3(ZnO) as an oxide semiconductor m A thin film expressed as (m>0) can be used. M can be gallium (Ga), iron (Fe), nickel (Ni), manganese (M n) and cobalt (Co). M can be Ga, or it can be any of the above other than Ga, such as Ga and Ni or Ga and Fe. In some cases, a metal element is contained. In addition, in the above oxide semiconductor, the metal contained as M is In addition to the transition metal elements, Fe, Ni and other transition metal elements, or the oxides of these transition metals, may be present as impurity elements. For example, the oxide semiconductor layer is made of In-Ga-Zn-O. Non-single crystalline films can be used.

[0248] Oxide semiconductor layer (InMO3(ZnO) m (m>0) film) as In-Ga-Zn-O system Instead of a non-single crystal film, InMO3(ZnO) where M is another metal element m (m>0) membrane In addition to the above, In may be used as an oxide semiconductor for the oxide semiconductor layer. -Sn-Zn-O system, In-Al-Zn-O system, Sn-Ga-Zn-O system, Al-Ga- Zn-O series, Sn-Al-Zn-O series, In-Zn-O series, Sn-Zn-O series, Al-Z nO-based, In-O-based, Sn-O-based, and Zn-O-based oxide semiconductors can be used. .

[0249] This embodiment mode can be implemented by being appropriately combined with the configurations described in other embodiments. is. [Explanation of symbols]

[0250] 100 boards 101 Substrate 102 Display element 110 Substrate 111 Substrate 112 PCB 113 Substrate 114 Display element 115 Display element 120 boards 121 PCB 122 PCB 123 PCB 124 Display element 125 Display element 126 Backlight 200 Display control unit 201 CPU 203 Storage section 205 Power Supply Unit 207 Power supply circuit 209 Internal Memory 211 Data Entry Section 213 External Memory 215 Video signal generating circuit 216 Antenna 219 Operation section 401 Gate electrode layer 402 Gate insulating layer 403 Semiconductor layer 404a n + layer 405a wiring layer 407 Insulating Film 421 Thin-film transistor 701 First display panel 702 Second display panel 703 Third Display Panel 704 Fourth Display Panel 705 Display control unit 706A Scanning Line Driver Circuit 706B Scanning line driver circuit 706C Scanning line driver circuit 706D Scanning line driver circuit 707A First display 707B Second display 707C Third display 707D 4th display unit 708 pixels 709A Optical Sensor 709B Optical Sensor 709C Optical Sensor 709D Optical Sensor 710 pixel circuit 711 Light intensity comparison circuit 712 CPU 713 Internal Memory 714 Video signal generating circuit 714A Signal Line Driver Circuit 714B Signal line driver circuit 714C Signal line driver circuit 714D Signal line driver circuit 715 Power supply circuit 715A power supply circuit 715B Power supply circuit 715C power supply circuit 715D power supply circuit 716 Signal Transmitter / Receiver 717 Power Supply Unit 718 Operation section 719 Antenna part 920 Wiring 921 Stress concentration region 922a Notch 922b Notch 923 Sealing substrate 924 Element substrate 925 Reinforcement plate 4005 Sealing material 4008 Liquid crystal layer 4010 Thin Film Transistor 4011 Thin-film transistor 4013 Liquid crystal element 4015 Connection terminal electrode 4016 Terminal electrode 4019 Anisotropic conductive film 4020 Insulation layer 4021 Insulation layer 4023 Insulating film 4030 Electrode layer 4031 Electrode layer 4032 Insulating film 4301 First display unit 4302 Third display unit 4304 Operation unit 4307 Second display unit 4308 Binding section 4309 Display button 4310 Fourth display unit 4311 First display panel 4312 Second display panel 4313 Third display panel 4321 Scanning line driver circuit 4322 Scanning line driver circuit 4323 Signal line driver circuit 4324 FPC 4325 Printed Circuit Board 4326 Stress concentration region 4329 FPC 4352 pixel TFT 4507 Display section 4510 Bulkhead 4511 Electroluminescent layer 4513 Light-emitting element 4514 Filling material 4612 Cavity 4613 Spherical particles 4614 Filling material 4712 liquid 4713 Microcapsules 4812 Space 4814 Rib 7002 Arrow 4010a Thin Film Transistor 4010b thin film transistor 4010c thin film transistor 4010d thin film transistor 4321a Scanning line driver circuit 4321b Scanning line driver circuit 4322a Scanning line driver circuit 4322b Scanning line driver circuit 4323a Signal line driver circuit 4323b Signal line driver circuit 4324a FPC 4324b FPC 4327a Printed Circuit Board 4327b Printed Circuit Board 4331a Element substrate 4331b Element substrate 4332a Sealing substrate 4332b Sealing substrate 4350a Hand 4350b hand 4615a Black area 4615b White area 4715a Fine particles 4715b Fine particles 4815a Powder and granular materials 4815b Granular materials

Claims

1. a first substrate and a second substrate; an active matrix display unit disposed between the first substrate and the second substrate; a scanning line driving circuit disposed between the first substrate and the second substrate; a connection terminal electrode disposed on a surface of the first substrate facing the second substrate; a first plate and a second plate that are arranged on a surface of the first substrate opposite to the second substrate side and that support the first substrate; the first plate and the second plate are spaced apart from each other, the first substrate has a first region that is a region that overlaps with the connection terminal electrode and does not overlap with the second substrate; the first substrate has a second region that is an area overlapping the first plate, an area overlapping the second substrate, and an area overlapping the display unit; the first substrate has a third region that is an area overlapping the second substrate, an area overlapping the second substrate, and an area overlapping the display unit; the first substrate and the second substrate have a fourth region between the second region and the third region, the fourth region having a bending function; the first substrate has a fifth region between the first region and the second region, the fifth region having a bending function; the fourth region overlaps with the display unit, the fifth region does not overlap with the display unit, the scanning line driving circuit overlaps with the first plate via the first substrate and also overlaps with the second plate via the first substrate; Display device.

2. a first substrate and a second substrate; an active matrix display unit disposed between the first substrate and the second substrate; a scanning line driving circuit disposed between the first substrate and the second substrate; a connection terminal electrode disposed on a surface of the first substrate facing the second substrate; a first plate and a second plate disposed on a surface of the first substrate opposite to the second substrate side and supporting the first substrate; a signal line driver circuit having a function of supplying a signal to the display unit via the connection terminal electrodes, the first plate and the second plate are spaced apart from each other, the first substrate has a first region that is a region that overlaps with the connection terminal electrode and does not overlap with the second substrate; the first substrate has a second region that is an area overlapping the first plate, an area overlapping the second substrate, and an area overlapping the display unit; the first substrate has a third region that is an area overlapping the second substrate, an area overlapping the second substrate, and an area overlapping the display unit; the first substrate and the second substrate have a fourth region between the second region and the third region, the fourth region having a bending function; the first substrate has a fifth region between the first region and the second region, the fifth region having a bending function; the fourth region overlaps with the display unit, the fifth region does not overlap with the display unit, the scanning line driving circuit overlaps with the first plate via the first substrate and also overlaps with the second plate via the first substrate; Display device.

3. a first substrate and a second substrate; a display unit disposed between the first substrate and the second substrate and having a transistor and a light-emitting element; a scanning line driving circuit disposed between the first substrate and the second substrate; a connection terminal electrode disposed on a surface of the first substrate facing the second substrate; a first plate and a second plate that are arranged on a surface of the first substrate opposite to the second substrate side and that support the first substrate; the first plate and the second plate are spaced apart from each other, the first substrate has a first region that is a region that overlaps with the connection terminal electrode and does not overlap with the second substrate; the first substrate has a second region that is an area overlapping the first plate, an area overlapping the second substrate, and an area overlapping the display unit; the first substrate has a third region that is an area overlapping the second substrate, an area overlapping the second substrate, and an area overlapping the display unit; the first substrate and the second substrate have a fourth region between the second region and the third region, the fourth region having a bending function; the first substrate has a fifth region between the first region and the second region, the fifth region having a bending function; the fourth region overlaps with the display unit, the fifth region does not overlap with the display unit, the scanning line driving circuit overlaps with the first plate via the first substrate and also overlaps with the second plate via the first substrate; Display device.

4. a first substrate and a second substrate; a display unit disposed between the first substrate and the second substrate and having a transistor and a light-emitting element; a scanning line driving circuit disposed between the first substrate and the second substrate; a connection terminal electrode disposed on a surface of the first substrate facing the second substrate; a first plate and a second plate disposed on a surface of the first substrate opposite to the second substrate side and supporting the first substrate; a signal line driver circuit having a function of supplying a signal to the display unit via the connection terminal electrodes, the first plate and the second plate are spaced apart from each other, the first substrate has a first region that is a region that overlaps with the connection terminal electrode and does not overlap with the second substrate; the first substrate has a second region that is an area overlapping the first plate, an area overlapping the second substrate, and an area overlapping the display unit; the first substrate has a third region that is an area overlapping the second substrate, an area overlapping the second substrate, and an area overlapping the display unit; the first substrate and the second substrate have a fourth region between the second region and the third region, the fourth region having a bending function; the first substrate has a fifth region between the first region and the second region, the fifth region having a bending function; the fourth region overlaps with the display unit, the fifth region does not overlap with the display unit, the scanning line driving circuit overlaps with the first plate via the first substrate and also overlaps with the second plate via the first substrate; Display device.

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