Resin composition, cured product, laminate, method for producing laminate, and method for producing optical component

Abstract

To provide a resin composition with excellent formability of a resulting cured material and excellent coating properties, a cured product of the resin composition, a laminate having the cured product, as well as a method for producing a laminate and a method for producing optical components using the resin composition.SOLUTION: There is provided a resin composition that contains an aromatic polyfunctional epoxy resin A with a softening point of 70°C or higher and less than 120°C, a photo-cationic polymerization initiator B, and a solvent C, and does not contain a photo-cationic polymerization initiator B' having a fluoroalkyl group (excluding a resin composition containing a bisphenol A novolac epoxy resin with an epoxy equivalent of 195 to 230 g / eq and a softening point of 83°C, sulfonium hexafluoroantimonate-based photo-cationic polymerization initiator, propylene carbonate, cyclopentanone, a fluorine-based leveling agent, and 3-glycidoxypropyltrimethoxysilane).SELECTED DRAWING: None

Description

[Technical Field]

[0001] The present invention relates to a resin composition, a cured product, a laminate, a method for producing a laminate, and a method for producing an optical component. [Background technology]

[0002] In recent years, with the increase in the degree of integration of semiconductor integrated circuits, there has been a demand for complex and fine resist patterns. Imprinting and photolithography are known methods for forming resist patterns. In the imprinting method, a mold having a fine pattern on its surface is pressed against a resin applied to a substrate, followed by press molding and curing, thereby transferring the fine pattern of the mold to the resin, thereby forming a resist pattern.

[0003] As a resin composition used in such an imprinting method, Patent Document 1 discloses a curable composition that has low viscosity and is liquid at room temperature, and contains a bicyclodiepoxy compound and a photocationic polymerization initiator. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] International Publication No. 2014 / 112295 Summary of the Invention [Problem to be solved by the invention]

[0005] However, when forming a resist pattern using the curable composition of Patent Document 1, it was found that the curable composition tends to become uneven when applied to a substrate, making it difficult to apply the composition uniformly. It was also found that there was a problem in that the resist was prone to deformation when the mold was separated from the resist. An object of the present invention is to provide a resin composition that provides a cured product that has excellent moldability and coatability, a cured product of the resin composition, a laminate including the cured product, and a method for producing a laminate and an optical component using the resin composition. [Means for solving the problem]

[0006] The present invention has the following aspects. [1] A resin composition containing an aromatic polyfunctional epoxy resin A having a softening point of 70°C or higher but lower than 120°C, a photocationic polymerization initiator B, and a solvent C, but not containing a photocationic polymerization initiator B' having a fluoroalkyl group (excluding resin compositions containing a bisphenol A novolac epoxy resin having an epoxy equivalent of 195 to 230 g / eq and a softening point of 83°C, a sulfonium hexafluoroantimonate-based photocationic polymerization initiator, propylene carbonate, cyclopentanone, a fluorine-based leveling agent, and 3-glycidoxypropyltrimethoxysilane). [2] The resin composition according to [1], wherein the aromatic polyfunctional epoxy resin A has a weight average molecular weight of 1,000 to 5,000. [3] The resin composition according to [1] or [2], wherein the aromatic polyfunctional epoxy resin A has a viscosity of 1 to 500 Pa·s at a softening point of +20°C. [4] The resin composition according to any one of [1] to [3], wherein the aromatic polyfunctional epoxy resin A has either or both of a cresol novolac epoxy skeleton and a phenol novolac epoxy skeleton. [5] The resin composition according to any one of [1] to [4], wherein the photocationic polymerization initiator B is at least one selected from the group consisting of diazonium salts, iodonium salts, and sulfonium salts. [6] The photocationic polymerization initiator B is a salt, and the anion of the salt is PF6 - , B(C6F5)4 - , and Ga(C6F5)4 - The resin composition according to any one of [1] to [5], which is at least one selected from the group consisting of: [7] The resin composition according to any one of [1] to [6], wherein a mixture of 95 mass % of the aromatic polyfunctional epoxy resin A and 5 mass % of the photocationic polymerization initiator B has a viscosity of 1 to 500 Pa s at a softening point of the aromatic polyfunctional epoxy resin A + 20°C. [8] The resin composition according to any one of [1] to [7], wherein the solvent C has an octanol / water partition coefficient at 25° C. of 0 or more. [9] The resin composition according to any one of [1] to [8], wherein the solvent C is at least one selected from the group consisting of aromatic hydrocarbons, aliphatic hydrocarbons, ketones, alcohols, ethers, and esters.

[10] The resin composition according to any one of [1] to [9], wherein the solid content is 1 to 50% by mass.

[11] The resin composition according to any one of [1] to

[10] , which has a viscosity at 25°C of 0.1 mPa·s to 10 Pa·s.

[12] The resin composition according to any one of [1] to

[11] , which does not contain a compound having a fluoroalkyl group.

[13] The resin composition according to any one of [1] to

[12] , which is used in imprint molding.

[14] A resin composition used for imprint molding, comprising an aromatic polyfunctional epoxy resin A having a softening point of 70°C or higher but lower than 120°C, a photocationic polymerization initiator B1, and a solvent C (however, excluding resin compositions containing a bisphenol A novolac epoxy resin having an epoxy equivalent of 195 to 230 g / eq and a softening point of 83°C, a sulfonium hexafluoroantimonate-based photocationic polymerization initiator, propylene carbonate, cyclopentanone, a fluorine-based leveling agent, and 3-glycidoxypropyltrimethoxysilane).

[15] A cured product of the resin composition according to any one of [1] to

[14] .

[16] A laminate comprising a substrate and a thin film made of the cured product according to

[15] on one surface of the substrate, the thin film having a thickness of 10 to 500 nm.

[17] The laminate according to

[16] , wherein the thin film has a fine pattern on the surface.

[18] The laminate according to

[16] or

[17] , wherein the substrate has a base material and an inorganic oxide film on one surface of the base material, and the thin film is on the inorganic oxide film.

[19] The laminate according to

[18] , wherein the refractive index of the substrate at a wavelength of 589 nm is 1.75 to 2.3.

[20] The laminate according to

[18] or

[19] , wherein the absolute value of the difference in refractive index at a wavelength of 589 nm between the substrate and the inorganic oxide film is 0 to 0.5.

[21] The laminate according to any one of

[18] to

[20] , wherein the absolute value of the difference in refractive index between the substrate and the thin film at a wavelength of 589 nm is 0 to 1.

[22] The laminate according to any one of

[18] to

[21] , wherein the absolute value of the difference in refractive index between the inorganic oxide film and the thin film at a wavelength of 589 nm is 0 to 1.

[23] A method for producing a laminate having a substrate and a thin film having a fine pattern on one surface of the substrate, the method comprising sandwiching a resin composition according to any one of [1] to

[14] between a mold having a fine pattern on its surface and the substrate, curing the resin composition to form a thin film having a fine pattern on its surface, and separating the thin film from the mold.

[24] A method for manufacturing an optical component, comprising etching the surfaces of the thin film and the substrate based on the fine pattern of the thin film in the laminate manufactured by the method for manufacturing a laminate described in

[23] , forming a fine pattern on the substrate, and removing the thin film remaining on the substrate. [Effects of the Invention]

[0007] According to the present invention, it is possible to provide a resin composition that provides a cured product with excellent moldability and coatability, a cured product of the resin composition, a laminate including the cured product, and a method for manufacturing a laminate and an optical component using the resin composition. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a schematic cross-sectional view illustrating an example of a laminate according to an embodiment. [Figure 2]FIG. 1 is a schematic cross-sectional view illustrating an example of a laminate according to an embodiment. [Figure 3] FIG. 1 is a schematic cross-sectional view illustrating an example of a laminate according to an embodiment. [Figure 4] FIG. 1 is a schematic cross-sectional view illustrating an example of a laminate according to an embodiment. [Figure 5] 1A to 1C are schematic diagrams illustrating a method for manufacturing a laminate and a method for manufacturing an optical component according to an embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0009] The following describes in detail the embodiments of the present invention, but the following description is merely an example of the embodiment of the present invention, and the present invention is not limited to these details and can be modified and implemented within the scope of the gist. Figures 1 to 5 are schematic diagrams, and the dimensional ratios are different from the actual ones for convenience.

[0010] The meanings and definitions of terms used in the present invention are as follows. "Light" is a general term for ultraviolet light, visible light, infrared light, electron beams, and radioactive rays. The softening point of an epoxy resin can be measured in accordance with JIS K 7234: 1986 "Testing method for softening point of epoxy resins." The measurement method may be either the ring and ball method or the mercury displacement method, but the ring and ball method is preferred. The number average molecular weight (hereinafter also referred to as "Mn") and weight average molecular weight (hereinafter also referred to as "Mw") of the epoxy resin are polystyrene-equivalent molecular weights obtained by measurement by gel permeation chromatography (hereinafter also referred to as "GPC") using a calibration curve prepared using polystyrene as a standard sample. The epoxy equivalent of an epoxy resin can be measured in accordance with JIS K 7236:2001 "Determination of epoxy equivalent of epoxy resin." The viscosity was measured at 0.1 s at each temperature using a dynamic viscoelasticity measuring device. -1 It can be determined by measuring the dynamic viscoelasticity at a shear rate of 100 rpm. The solid content concentration is calculated by (solid content mass / sample mass) x 100, where the mass of the sample before heating is the sample mass and the mass of the sample after drying for 4 hours in a convection dryer at 120°C is the solid content mass. The octanol / water partition coefficient can be measured in accordance with JIS Z 7260-107:2000 "Measurement of partition coefficient (1-octanol / water) - Shake flask method." The refractive index can be measured with a refractive index measuring device. The symbol "to" indicating a range of values ​​means that the values ​​before and after it are included as the lower and upper limits.

[0011] ≪Resin composition≫ The resin composition of this embodiment contains an aromatic polyfunctional epoxy resin A (hereinafter also referred to as "epoxy resin A") having a softening point of 70°C or higher but lower than 120°C, a photocationic polymerization initiator B (hereinafter also referred to as "initiator B"), and a solvent C, but does not contain a photocationic polymerization initiator B' (hereinafter also referred to as "initiator B'") having a fluoroalkyl group. However, in the case of a resin composition used for imprint molding, which will be described later, initiator B' may be contained. In other words, in the case of a resin composition used for imprint molding, either one or both of initiator B and initiator B' may be contained. Hereinafter, initiator B and initiator B' are collectively referred to as initiator B1. Also excluded from the resin composition are resin compositions containing a bisphenol A novolac epoxy resin having an epoxy equivalent of 195 to 230 g / eq and a softening point of 83°C, a sulfonium hexafluoroantimonate-based cationic photopolymerization initiator, propylene carbonate, cyclopentanone, a fluorine-based leveling agent, and 3-glycidoxypropyltrimethoxysilane. The sulfonium hexafluoroantimonate-based cationic photopolymerization initiator refers to a salt consisting of a sulfonium cation and a hexafluoroantimonate anion. The fluorine-based leveling agent refers to a fluorine-containing surfactant. The resin composition may further contain components (optional components) other than the epoxy resin A, initiator B, initiator B1, and solvent C, as needed, within a range that does not impair the effects of the present invention.

[0012] <Epoxy resin A> The softening point of the epoxy resin A is 70°C or higher and lower than 120°C, preferably 70 to 105°C, more preferably 70 to 90°C, and even more preferably 75 to 90°C. When the softening point is equal to or higher than the lower limit of the above range, the coating property and formability onto a substrate are likely to be improved.When the softening point is lower than (or equal to or lower than) the upper limit of the above range, the temperature and pressure during imprinting can be reduced.

[0013] The Mw of the epoxy resin A is preferably from 1,000 to 5,000, more preferably from 1,200 to 4,000, still more preferably from 1,500 to 3,000, and particularly preferably from 1,800 to 2,500. When Mw is at least the lower limit of the above range, the coating properties and formability onto a substrate are likely to be improved, whereas when Mw is at most the upper limit of the above range, the temperature and pressure during imprinting can be reduced.

[0014] The Mn of the epoxy resin A is preferably from 500 to 3,000, more preferably from 600 to 2,000, further preferably from 700 to 1,500, and particularly preferably from 800 to 1,200. When Mn is at least the lower limit of the above range, the coating properties and formability onto a substrate are likely to be improved, and when Mn is at most the upper limit of the above range, the temperature and pressure during imprinting can be reduced.

[0015] The viscosity of the epoxy resin A at its softening point is preferably from 100 to 10,000 Pa·s, more preferably from 300 to 5,000 Pa·s, even more preferably from 500 to 3,000 Pa·s, and particularly preferably from 1,000 to 2,500 Pa·s. When the viscosity is equal to or greater than the lower limit of the above range, the coating property and formability onto a substrate are likely to be improved, whereas when the viscosity is equal to or less than the upper limit of the above range, the temperature and pressure during imprinting can be reduced.

[0016] The viscosity of the epoxy resin A at the softening point +20°C is preferably 1 to 500 Pa·s, more preferably 5 to 300 Pa·s, even more preferably 20 to 200 Pa·s, particularly preferably 50 to 100 Pa·s, and most preferably 60 to 90 Pa·s. When the viscosity is equal to or greater than the lower limit of the above range, the coating property and formability onto a substrate are likely to be improved, whereas when the viscosity is equal to or less than the upper limit of the above range, the temperature and pressure during imprinting can be reduced.

[0017] The epoxy equivalent of the epoxy resin A is preferably 100 to 500 g / eq, more preferably 120 to 400 g / eq, further preferably 140 to 300 g / eq, particularly preferably 200 to 290 g / eq, and most preferably 200 to 250 g / eq. When the epoxy equivalent is at least the lower limit of the above range, the moldability of the resin is improved, and when the epoxy equivalent is at most the upper limit of the above range, the curability of the resin is improved.

[0018] The epoxy resin A is not particularly limited as long as it is an aromatic polyfunctional epoxy resin having a softening point of 70°C or higher and lower than 120°C. "Polyfunctional" means having multiple epoxy groups. Examples of epoxy resins include epoxy resins having a cresol novolac epoxy skeleton, epoxy resins having a phenol novolac epoxy skeleton, epoxy resins having a bisphenol A epoxy skeleton, epoxy resins having a bisphenol F epoxy skeleton, and epoxy resins having a polyfunctional bisphenol A novolac epoxy skeleton. Among these, from the viewpoint of easily adjusting the softening point to 70°C or higher and lower than 120°C, epoxy resins having a cresol novolac epoxy skeleton and epoxy resins having a phenol novolac epoxy skeleton are preferred, and epoxy resins consisting solely of a cresol novolac epoxy skeleton and epoxy resins consisting solely of a phenol novolac epoxy skeleton are more preferred. Examples of epoxy resins having a cresol novolac epoxy skeleton and epoxy resins having a phenol novolac epoxy skeleton include epoxy resins represented by the following formula 1.

[0019] [ka] formula 1 In the above formula 1, R is a hydrogen atom or a methyl group. The number of R methyl groups in one benzene ring is 1 to 5, and preferably 1. In multiple benzene rings, the number of R methyl groups may be the same or different. When one benzene ring has one R methyl group, it is preferable that R is bonded to the carbon atom in the ortho position of the carbon atom bonded to the etheric oxygen in the benzene ring. In this case, the structure becomes a cresol novolac epoxy skeleton. When all R are hydrogen atoms, the structure becomes a phenol novolac epoxy skeleton.

[0020] In the above formula 1, X is a divalent hydrocarbon group. Multiple Xs may be the same or different. n is an integer of 2 or more and is determined according to the above Mw and Mn. Examples of X include alkylene groups and alkenylene groups having 1 to 20 carbon atoms, cycloalkylene groups and cycloalkenylene groups having 5 to 20 carbon atoms, and arylene groups having 6 to 20 carbon atoms. The cycloalkylene groups, cycloalkenylene groups, and arylene groups may have a condensed ring structure. Among these, X is preferably a methylene group, ethylene group, trimethylene group, cyclohexylene group, phenylene group, dicyclopentadienyl group, or naphthylene group, and more preferably a methylene group or dicyclopentadienyl group.

[0021] Only one type of epoxy resin A may be used, or two or more types may be used in combination. When two or more types are used in combination, it is preferable that the softening points of all of the epoxy resins A are 70°C or higher and lower than 120°C.

[0022] Epoxy resin A can be produced by a conventionally known production method. For example, an epoxy resin consisting solely of a phenol novolac epoxy skeleton, in which all R in the above formula 1 are hydrogen atoms and X is a methylene group, can be produced by reacting phenol with formaldehyde to obtain phenol novolac, and then adding epichlorohydrin to the phenol novolac. Furthermore, an epoxy resin consisting solely of a cresol novolac epoxy skeleton, in which, in the above formula 1, one benzene ring has one R that is a methyl group, another R that is bonded to the carbon atom in the ortho position to the carbon atom bonded to the etheric oxygen in the benzene ring, and X is a methylene group, can be produced by reacting cresol with formaldehyde to obtain cresol novolac, and then adding epichlorohydrin to the cresol novolac.

[0023] Commercially available products may be used as the epoxy resin A. Examples of commercially available products include those manufactured by DIC Corporation under the product names "EPICLON N-655," "EPICLON N-673," "EPICLON N-680," "EPICLON N-695," "EPICLON HP-7200H," and "EPICLON N-775."

[0024] <Initiator B> The initiator B may be any compound that generates an acid upon irradiation with light (a photoacid generator). The initiator B does not contain a photocationic polymerization initiator B' having a fluoroalkyl group. The initiator B is preferably a nonionic initiator or a salt, and more preferably a diazonium salt, an iodonium salt, or a sulfonium salt.

[0025] The cation of the diazonium salt is N + Examples include cations in which an aryl group such as a phenyl group or an alkoxyphenyl group is bonded to N.

[0026] Examples of the cation of the iodonium salt include diaryliodoniums such as diphenyliodonium, 4-isopropyl-4'-methyldiphenyliodonium, 4-methyl-4'-methylpropyldiphenyliodonium, bis(4-tert-butylphenyl)iodonium, and 4-methoxyphenylphenyliodonium.

[0027] Examples of the cation of the sulfonium salt include triarylsulfonium such as triphenylsulfonium, diphenyl-4-methylphenylsulfonium, tris(4-methylphenyl)sulfonium, diphenyl-2,4,6-trimethylphenylsulfonium, (thiodi-4,1-phenylene)bisdiphenylsulfonium, diphenyl[4-(phenylthio)phenyl]sulfonium, [biphenyl]-4-yl[4-[[biphenyl]-4-ylthio]phenyl](phenyl)sulfonium, and (10-oxo-10H-dibenzo[b,e]thiopyran-2-yl)[4-[(10-oxo-10H-dibenzo[b,e]thiopyran-2-yl)thio]phenyl](phenyl)sulfonium.

[0028] The anion of the salt of initiator B is PF6 - , B(C6F5)4 - , Ga(C6F5)4 - is preferred.

[0029] The initiator B may be, for example, a cation of the diazonium salt, a cation of the iodonium salt, or a cation of the sulfonium salt, and PF6 - , B(C6F5)4 - , or Ga(C6F5)4 - Preferred are salts formed from a combination of the following: Furthermore, other photoacid generators include bis(phenylsulfonyl)diazomethane, bis(tert-butylsulfonyl)diazomethane, bis(cyclohexylsulfonyl)diazomethane, bis(p-toluenesulfonyl)diazomethane, and the like. The initiator B may be used alone or in combination of two or more.

[0030] <Initiator B'> Initiator B' is a photocationic polymerization initiator having a fluoroalkyl group. The resin composition does not contain initiator B'. On the other hand, as will be described later, when the resin composition is used for imprint molding, the resin composition may contain polymerization initiator B'.

[0031] Initiator B' is preferably a salt, and is preferably a diazonium salt, an iodonium salt, or a sulfonium salt. Preferred embodiments of the cation of the diazonium salt, the cation of the iodonium salt, and the cation of the sulfonium salt are the same as those of initiator B. That is, initiator B' preferably has a fluoroalkyl group in the anion.

[0032] Examples of initiator B' include trifluoromethanesulfonate, nonafluorobutanesulfonate, tris(pentafluoroethyl)trifluorophosphate, tris(heptafluoropropyl)trifluorophosphate, tris(nonafluoroisobutyl)trifluorophosphate, and bis(nonafluoroisobutyl)tetrafluorophosphate. When the resin composition is used for imprint molding, the initiator B′ may be used alone or in combination of two or more.

[0033] The viscosity of a mixture of 95% by mass of epoxy resin A and 5% by mass of initiator B at the softening point of epoxy resin A + 20°C is preferably 1 to 500 Pa·s, more preferably 5 to 300 Pa·s, even more preferably 20 to 200 Pa·s, and particularly preferably 60 to 80 Pa·s. When the viscosity is at least the lower limit of the above range, the coatability and formability onto the substrate tend to be improved. When the viscosity is at most the upper limit of the above range, the temperature and pressure during imprinting can be reduced.

[0034] <Solvent C> The solvent C is not particularly limited as long as it can dissolve the epoxy resin A and the initiator B. Of these, solvents having an octanol / water partition coefficient (hereinafter also referred to as "Log Pow") of 0 or more at 25° C. are preferred. The Log Pow of the solvent is preferably 0-10, more preferably 0.3-7, and even more preferably 0.5-5. When the Log Pow is equal to or greater than the lower limit, water contamination during storage can be suppressed, and when the Log Pow is equal to or less than the upper limit, the storage stability of the resin composition is improved.

[0035] The boiling point of solvent C at normal pressure is preferably from 50 to 250°C, more preferably from 70 to 200°C, and even more preferably from 100 to 180°C. When the boiling point is equal to or higher than the lower limit, coating unevenness is unlikely to occur, and when the boiling point is equal to or lower than the upper limit, the baking time can be shortened.

[0036] As the solvent C, aromatic hydrocarbons, aliphatic hydrocarbons, ketones, alcohols, ethers, and esters are preferred, aromatic hydrocarbons, ketones, and ethers are more preferred, and aromatic hydrocarbons are even more preferred. Solvent C may be derived from plants or petroleum.

[0037] Examples of aromatic hydrocarbons include, but are not limited to, benzene, toluene, xylene, anisole, and tetramethylbenzene.

[0038] Examples of aliphatic hydrocarbons include, but are not limited to, pentane, hexane, heptane, octane, decane, and cyclohexane.

[0039] The ketones are not particularly limited, but examples thereof include cyclohexanone, 2-pentanone, cyclopentanone, γ-butyrolactone, and the like.

[0040] The alcohols are not particularly limited, but examples include 3-methoxy-3-methyl-1-butanol, benzyl alcohol, cyclohexanol, and the like.

[0041] The ethers are not particularly limited, but examples thereof include propylene glycol monomethyl ether, dipropylene glycol dimethyl ether, and dipropylene glycol diethyl ether.

[0042] The esters are not particularly limited, but examples thereof include butyl acetate, isobutyl acetate, and 3-methoxy-3-methyl-1-butyl acetate.

[0043] Only one solvent C may be used, or two or more solvents may be used in combination. When two or more solvents are used in combination, it is preferable that the mixture satisfies the above-mentioned ranges of Log Pow and boiling point.

[0044] (optional ingredient) The resin composition may contain optional components as needed. Examples of optional components include reactive epoxy monomers, reactive oxetane monomers, reactive acrylic monomers, sensitizers, coupling agents, ion catchers, inorganic fillers, antioxidants, surfactants, and the like. Examples of reactive epoxy monomers, sensitizers, coupling agents, ion catchers, and inorganic fillers include the components described in JP 2008-142940 A. Note that the resin composition of this embodiment has excellent coatability and excellent shape stability during molding, and therefore does not require the use of surfactants or mold release agents. Furthermore, the resin composition preferably does not substantially contain a compound having a fluoroalkyl group. "Substantially not containing a compound having a fluoroalkyl group" means that the content of the compound having a fluoroalkyl group relative to the total mass of the resin composition is 0.1 mass% or less, preferably 0.01 mass% or less, and particularly preferably 0 mass%.

[0045] <Composition and characteristics of resin composition> The solid content concentration of the resin composition is preferably 0.1 to 50 mass %, more preferably 0.5 to 40 mass %, further preferably 1 to 30 mass %, particularly preferably 2 to 20 mass %, and most preferably 5 to 15 mass %. When the solid content concentration is equal to or higher than the lower limit of the above range, the resin composition can be uniformly applied over the entire substrate, and when the solid content concentration is equal to or lower than the upper limit of the above range, in-plane variations in film thickness can be reduced.

[0046] The viscosity of the resin composition at 25° C. is preferably from 0.1 mPa·s to 10 Pa·s, more preferably from 0.5 mPa·s to 1 Pa·s, and even more preferably from 1 mPa·s to 0.5 Pa·s. When the viscosity is equal to or higher than the lower limit of the above range, a film can be uniformly applied to the entire substrate, and when the viscosity is equal to or lower than the upper limit of the above range, a uniform film can be formed by spin coating or the like.

[0047] The content of fluorine atoms relative to the total mass of the resin composition is preferably 7% by mass or less, more preferably 5% by mass or less, and even more preferably 3% by mass or less.

[0048] The content of the epoxy resin A relative to the total mass of the resin composition is preferably from 1 to 50 mass%, more preferably from 4 to 35 mass%, further preferably from 7 to 20 mass%, and particularly preferably from 8 to 15 mass%. When the content of epoxy resin A is at least the lower limit of the above range, the resin composition can be uniformly applied to the substrate. When the content of epoxy resin A is at most the upper limit of the above range, the in-plane film thickness uniformity is improved.

[0049] The content of initiator B relative to the total mass of the resin composition is preferably 0.01 to 20 mass%, more preferably 0.1 to 10 mass%, further preferably 0.5 to 5 mass%, and particularly preferably 1 to 3 mass%. In the case of a resin composition for imprint molding, the content of initiator B is interpreted as the total content of initiator B and initiator B' (i.e., the content of initiator B1). When the content of initiator B is at least the lower limit of the above range, the resin can be cured by UV irradiation. When the content of initiator B is at most the upper limit of the above range, the coatability of the resin composition is improved.

[0050] The content of the solvent C relative to the total mass of the resin composition is preferably from 30 to 99 mass %, more preferably from 50 to 95 mass %, and even more preferably from 70 to 90 mass %. When the content of solvent C is equal to or greater than the lower limit of the above range, the viscosity of the resin composition is reduced.When the content of solvent C is equal to or less than the upper limit of the above range, the resin composition can be formed into a uniform film.

[0051] The total content of the epoxy resin A and the initiator B relative to the total mass of the resin composition is preferably from 1 to 50 mass%, more preferably from 4 to 35 mass%, and even more preferably from 7 to 20 mass%. When the total content of epoxy resin A and initiator B is equal to or greater than the lower limit of the above range, the resin composition can be easily coated without unevenness. When the total content of epoxy resin A and initiator B is equal to or less than the upper limit of the above range, uniform coating becomes possible.

[0052] The content of initiator B relative to 100 parts by mass of the epoxy resin is preferably 0.01 to 40 parts by mass, more preferably 0.1 to 20 parts by mass, further preferably 1 to 10 parts by mass, and particularly preferably 1 to 5 parts by mass. When the content of initiator B is equal to or greater than the above lower limit, the resin can be cured by UV irradiation. When the content of initiator B is equal to or less than the above upper limit, the coatability of the resin composition is improved.

[0053] When the resin composition contains the above optional components, the total content of the optional components relative to the total mass of the resin composition is preferably 0.01 to 50 mass%, more preferably 0.05 to 40 mass%, and even more preferably 0.1 to 30 mass%. When the resin composition contains the above optional components, the total content of the optional components relative to 100 parts by mass of the epoxy resin is preferably 0.1 to 50 parts by mass, more preferably 0.3 to 40 parts by mass, and even more preferably 0.5 to 30 parts by mass.

[0054] The use of the resin composition is not particularly limited, but examples thereof include imprint molding, 3D printers, and photoresists, with imprint molding being preferred. When the resin composition is used for imprint molding, the resin composition may contain a cationic photopolymerization initiator B' having a fluoroalkyl group.

[0055] <Laminate> The laminate of this embodiment has a thin film made of a cured product of the resin composition on one surface of a substrate. 1 is a schematic cross-sectional view showing an example of the laminate of this embodiment. The laminate 1A has a substrate 10 and a thin film 20 on one surface of the substrate 10. 2 is a schematic cross-sectional view showing another example of the laminate of this embodiment. The laminate 1B has a base material 11, a substrate 10 having an inorganic oxide film 12 on one surface of the base material 11, and a thin film 20 on the inorganic oxide film 12 of the substrate 10. 3 is a schematic cross-sectional view showing yet another example of the laminate of this embodiment. Laminate 1C has a base material 11, a substrate 10 having an inorganic oxide film 12 on one surface of base material 11, and a thin film 20 on inorganic oxide film 12 of substrate 10. Thin film 20 has a fine pattern 22 on its surface. 4 is a schematic cross-sectional view showing yet another example of the laminate of this embodiment. The laminate 1D has a base material 11, a substrate 10 having an inorganic oxide film 12 on one surface of the base material 11, and a thin film 20 on a portion of the inorganic oxide film 12 of the substrate 10. The inorganic oxide film 12 and the thin film 20 have a fine pattern 23 on their surfaces.

[0056] (base material) The substrate 11 may be a substrate made of an inorganic material or a substrate made of an organic material. Examples of inorganic materials include glass (including reinforced glass, crystallized glass, and quartz glass), silicon wafers, metals (aluminum, nickel, copper, etc.), metal oxides (sapphire, indium tin oxide (ITO), etc.), silicon nitride, aluminum nitride, lithium niobate, etc. Examples of organic materials include fluororesin, silicone resin, acrylic resin, polycarbonate, polyester (polyethylene terephthalate, etc.), polyamide, polyimide, polypropylene, polyethylene, nylon resin, polyphenylene sulfide, triacetyl cellulose, cyclic polyolefin, etc. Glass is preferred as the substrate 11 in terms of transparency, surface flatness, and optical isotropy, and a surface-treated substrate 11 may be used in terms of excellent adhesion to thin films and inorganic oxide films. Examples of surface treatments include UV ozone treatment and plasma etching treatment. The substrate 11 may be one layer or two layers. Only one type of substrate 11 may be used, or two or more types may be used in combination. The thickness of the substrate 11 is preferably 0.1 to 10 mm, more preferably 0.2 to 7 mm, and even more preferably 0.3 to 5 mm. The refractive index of the substrate 11 at a wavelength of 589 nm is preferably 1.75 to 2.3, more preferably 1.8 to 2.2, even more preferably 1.85 to 2.1, and particularly preferably 1.9 to 2.05. If the refractive index is within the above range, the substrate can be made thin.

[0057] (inorganic oxide film) Examples of inorganic oxides for the inorganic oxide film 12 include silica, titania, zirconia, hafnia, tantalum oxide, and niobium oxide, and composite oxides thereof are also acceptable. Among these, titania, zirconia, hafnia, and tantalum oxide are preferred from the viewpoint of high refractive index. The inorganic oxide film 12 may be a single layer or a double layer, and the inorganic oxide film 12 may be of one type or a combination of two or more types. The thickness of the inorganic oxide film 12 in FIGS. 1 to 3 and the thickness of the thickest part of the inorganic oxide film 12 in FIG. 4 is preferably 1 nm to 10 μm, more preferably 10 nm to 5 μm, and even more preferably 50 nm to 1 μm. The refractive index of the inorganic oxide film 12 at a wavelength of 589 nm is preferably 1.4 to 2.5, more preferably 1.6 to 2.4, and even more preferably 1.7 to 2.3. If the refractive index is within the above range, the difference in refractive index between the substrate and the oxide film can be reduced. The absolute value of the refractive index difference at a wavelength of 589 nm between the substrate 11 and the inorganic oxide film 12 is preferably 0 to 0.5, more preferably 0 to 0.3, and even more preferably 0 to 0.2. When the absolute value of the refractive index difference is within the above range, the optical performance of the light-guiding member is improved.

[0058] (thin film) The thin film is made of a cured product of the resin composition. The thickness of the thin film 20 in FIG. 1 or 2 and the thickness of the thickest part of the thin film 20 in FIG. 3 or 4 is preferably 10 to 500 nm, more preferably 20 to 400 nm, and even more preferably 30 to 300 nm. The refractive index of the thin film 20 at a wavelength of 589 nm is preferably 1.4 to 2.0, more preferably 1.5 to 2.0, and even more preferably 1.6 to 2.0. If the refractive index is within the above range, the optical performance of the light guide member is improved. The absolute value of the refractive index difference at a wavelength of 589 nm between the substrate 11 and the thin film 20 is preferably 0 to 1, more preferably 0 to 0.7, and even more preferably 0 to 0.5. When the absolute value of the refractive index difference is within the above range, the optical performance of the light guide member is improved. The absolute value of the refractive index difference at a wavelength of 589 nm between the inorganic oxide film 12 and the thin film 20 is preferably 0 to 1, more preferably 0 to 0.7, and even more preferably 0 to 0.5. When the absolute value of the refractive index difference is within the above range, the optical performance of the light guide member is improved.

[0059] 3, the thin film 20 may have a fine pattern 22 on its surface, which has a plurality of convex portions and / or a plurality of concave portions. The fine pattern is a reverse pattern corresponding to the fine pattern of the mold described below. Examples of the convex portions include long ridges extending on the surface of the thin film 20 and protrusions scattered on the surface. Examples of the concave portions include long grooves extending on the surface of the thin film 20 and holes scattered on the surface.

[0060] The shape of the ridges or grooves may be straight, curved, bent, etc. A plurality of ridges or grooves may be parallel to each other or may be non-intersecting to form stripes. The cross-sectional shape of the ridges or grooves in the direction perpendicular to the longitudinal direction may be rectangular, trapezoidal, triangular, semicircular, or the like. Examples of the shape of the protrusions or holes include triangular prisms, square prisms, hexagonal prisms, cylinders, triangular pyramids, square pyramids, hexagonal pyramids, cones, hemispheres, and polyhedrons.

[0061] The width of the ridges or grooves is preferably 1 nm to 500 μm, more preferably 10 nm to 100 μm, and even more preferably 15 nm to 10 μm. The width of the ridges means the length of the bottom side in a cross section perpendicular to the longitudinal direction. The width of the grooves means the length of the top side in a cross section perpendicular to the longitudinal direction. The width of the protrusion or hole is preferably 1 nm to 500 μm, more preferably 10 nm to 100 μm, and even more preferably 15 nm to 10 μm. The width of the protrusion means the length of the bottom side in a cross section perpendicular to the longitudinal direction if the bottom surface is elongated, and otherwise means the maximum length of the bottom surface of the protrusion. The width of the hole means the length of the top side in a cross section perpendicular to the longitudinal direction if the opening is elongated, and otherwise means the maximum length of the opening of the hole.

[0062] The height of the convex portions is preferably 1 nm to 500 μm, more preferably 10 nm to 100 μm, and even more preferably 15 nm to 10 μm. The depth of the concave portions is preferably 1 nm to 500 μm, more preferably 10 nm to 100 μm, and even more preferably 15 nm to 10 μm. In an area where the fine patterns are densely packed, the pitch (center-to-center distance) between adjacent convex portions (or concave portions) is preferably 1 nm to 500 μm, more preferably 10 nm to 100 μm, and even more preferably 15 nm to 10 μm.

[0063] (Laminate manufacturing method, optical component manufacturing method) The method for producing a laminate and the method for producing an optical component according to this embodiment include, for example, the following steps 1 to 5. Step 1: As shown in S1 to S2 of Figure 5, a step of sandwiching a resin composition 21 between a mold 30 having a fine pattern 33 on its surface and a substrate 10 so that the fine pattern 33 of the mold 30 is in contact with the resin composition 21. Step 2: As shown in S2 of FIG. 5, a step of curing the resin composition 21 to form a thin film 20. Step 3: As shown in S3 of FIG. 5, the thin film 20 and the mold 30 are separated. Step 4: As shown in S4 to S5 of FIG. 5, a step of etching the thin film 20 and the surface of the substrate 10 (inorganic oxide film 12) based on the fine pattern of the thin film 20. Step 5: As shown in S6 of FIG. 5, the thin film 20 remaining on the substrate 10 is removed.

[0064] (mold) The mold 30 may have a fine pattern 33 on its surface. The fine pattern 33 is a reverse pattern corresponding to the fine pattern of the thin film 20. As the mold 30, a replica mold having a layer of a cured material on the surface of which a reverse pattern of a fine pattern 33 is transferred by an imprint method using a master mold having the fine pattern 33 on its surface may be used. The mold 30 may be a mold made of a non-transparent material or a mold made of a transparent material. Examples of the non-transparent material mold include silicon wafer, nickel, copper, stainless steel, titanium, SiC, and mica. Examples of the light-transmitting material mold include glass such as quartz glass, polydimethylsiloxane, cyclic polyolefin, polycarbonate, polyethylene terephthalate, transparent fluororesin, etc. The light-transmitting material mold may be made of a plurality of materials. At least one of the substrate 10 and the mold 30 is preferably made of a material that transmits 40% or more of light of wavelengths at which the initiators B and B' act.

[0065] (Process 1) Methods for disposing the resin composition 21 on the surface of the substrate 10 shown in S1 of Figure 1 include the inkjet method, potting method (dispense method), spin coating method, roll coating method, casting method, dip coating method, die coating method, Langmuller-Blodgett method, vacuum deposition method, etc. The resin composition 21 may be disposed on the entire surface of the substrate 10 or on a part of the surface of the substrate 10 .

[0066] After the resin composition 21 is placed on the surface of the substrate 10, it is preferably heated to evaporate the solvent C. The heating temperature is, for example, preferably 50 to 150° C., more preferably 70 to 130° C. The heating time is, for example, preferably 0.5 to 10 minutes, more preferably 1 to 5 minutes.

[0067] The pressure applied when pressing the mold 20 against the resin composition 21 is preferably more than 0 MPa and not more than 100 MPa, more preferably 0.01 to 80 MPa. The temperature at which the mold 30 is pressed against the resin composition 21 is preferably 40 to 120°C, more preferably 60 to 100°C. In step 1, the positions of the mold 30 and the substrate 10 may be adjusted using alignment marks.

[0068] (Process 2) The resin composition 21 is irradiated with light to cure the resin composition 21 and form a thin film 20 . Examples of methods for irradiating light include a method in which light is irradiated from the mold side using a mold made of a light-transmitting material, a method in which light is irradiated from the substrate side using a substrate made of a light-transmitting material, and a method in which light is irradiated from the gap between the mold 30 and the substrate 10. The wavelength of the light is preferably 200 to 500 nm. When irradiating light, the resin composition 21 may be heated to promote curing. The temperature during light irradiation is preferably 0 to 120°C, more preferably 20 to 100°C.

[0069] (Step 3) The temperature at which the thin film 20 and the mold 30 are separated is preferably 0 to 100° C., more preferably 20 to 80° C. The mold 30 may be separated by dissolving it, but from the viewpoint of reusing the mold 30, it is preferable to remove the mold 30 from the thin film 20.

[0070] (Step 4) The surfaces of the thin film 20 and the substrate 10 (inorganic oxide film 12) are etched based on the fine pattern of the thin film 20. That is, the thin film 20 having the fine pattern on its surface functions as a resist. As shown in S4 to S5 of Fig. 5, etching of the thin film and etching of the substrate 10 (inorganic oxide film 12) may be performed stepwise, or both may be performed at the same time. The etching may be performed by a method known in the art, such as dry etching, wet etching, or sandblasting, and is preferably performed by dry etching. Examples of gases used in dry etching include argon, tetrafluoromethane, trifluoromethane, hexafluoroethylene, and chlorine. The etching depth of the inorganic oxide layer 12 is, for example, preferably 5 to 3000 nm, more preferably 10 to 1000 nm, and even more preferably 20 to 500 nm.

[0071] (Step 5) As shown in S6 of Fig. 5, the thin film 20 remaining on the substrate 10 is removed. Examples of the removal method include dry etching and wet etching. Examples of gas species used in dry etching include argon, tetrafluoromethane, trifluoromethane, hexafluoroethylene, and chlorine. Examples of etchants used in wet etching include piranha solution and organic solvents.

[0072] <Optical components> The optical component of this embodiment can be used as a light guide member for AR / VR, a diffuser plate, or other component. [Example]

[0073] The present invention will be described in detail below with reference to examples, but the present invention is not limited to these examples. Examples 1 to 6 are working examples, and Example 7 is a comparative example.

[0074] <Softening point> The softening point was measured in accordance with the ring and ball method of JIS K 7234:1986 "Testing method for softening point of epoxy resins."

[0075] <Mw、Mn> The measurement was carried out using the following equipment under the following conditions. GPC system: HLC-8220GPC (Tosoh Corporation), Columns: TSK guard Column Super MZ-L, TSK gel HZ4000, TSK gel HZ3000, TSK gel HZ2500, TSK gel HZ2000 (used in this order), Column oven temperature: 40°C, Solvent: tetrahydrofuran, flow rate: 0.35 mL / min, standard sample: polystyrene.

[0076] <Viscosity> The viscosity was measured at 0.1 s using a dynamic viscoelasticity measuring device (Physica MCR301, manufactured by Anton Paar). -1 Dynamic viscoelasticity was measured at a shear rate of 100°C. The viscosity of the epoxy resin was determined by measuring the dynamic viscoelasticity at 60°C, 80°C, 100°C, and 120°C, and interpolating the softening point temperature and the softening point + 20°C value of each resin into an approximate curve obtained by exponential approximation. The viscosity of the resin composition was determined by measuring the dynamic viscoelasticity at 25°C.

[0077] <Epoxy equivalent> The epoxy equivalent was measured in accordance with JIS K 7236:2001 "Determination of epoxy equivalent of epoxy resin."

[0078] <Partition coefficient> The octanol / water partition coefficient was measured in accordance with JIS Z 7260-107:2000 "Measurement of partition coefficient (1-octanol / water) - Shake flask method."

[0079] <Refractive index> Using a refractive index measuring device (Prism Coupler: 2010 / M, manufactured by Metricon, USA), the refractive indices of the cured product (thin film), substrate, and inorganic oxide film to be evaluated for light with wavelengths of 473 nm, 594 nm, and 658 nm were measured at a temperature of 25°C, and the refractive index for light with a wavelength of 589 nm was calculated using the Metricon Fit included with the device.

[0080] <Evaluation of Coatability> A tantalum oxide film (inorganic oxide film) was formed by sputtering on one surface of a 0.7 mm thick glass substrate (base material) to serve as a substrate. The thickness of the tantalum oxide film was 500 nm. The refractive index of the glass substrate at a wavelength of 589 nm was 2.0, and the refractive index of the tantalum oxide film at a wavelength of 589 nm was 2.1. In other words, the absolute value of the refractive index difference at a wavelength of 589 nm between the glass substrate and the tantalum oxide film was 0.1. The resin compositions of Examples 1 to 7 were applied to the surface of the tantalum oxide film of the substrate by spin coating. The coatability of the resin compositions was evaluated according to the following criteria. ⊚: The resin composition is applied to the entire surface of the substrate without unevenness. ◯: The resin composition is applied to the entire surface of the substrate, but there are coating irregularities. ×: There are parts of the substrate where the resin composition is not applied.

[0081] <Evaluation of formability> The resin composition on the substrate coated with the resin composition obtained in <Evaluation of Coatability> was heated at 100°C for 5 minutes to evaporate the solvent. A resin mold having a line-and-space pattern with 100 nm intervals and a depth of 100 nm was used as the mold, and the resin composition was sandwiched between the substrate and the mold so that the fine pattern of the mold was in contact with the resin composition, and pressed at 2 MPa and 70°C. Thereafter, ultraviolet light was irradiated from a high-pressure mercury lamp at an exposure dose of 1000 mJ / cm. 2The resin composition was cured to form a cured thin film. The mold was then separated from the thin film to obtain a laminate of the glass substrate, tantalum oxide film, and thin film having a fine pattern on the surface, as shown in Figure 3. The thickest part of the thin film was 170 nm thick, and the thinnest part was 70 nm thick. The surface of the thin film was observed with a scanning electron microscope, and the moldability was evaluated according to the following criteria. ⊚: The pattern shape is transferred exactly as it is on the mold. ○: There is a part missing from the pattern, but it has been transferred without falling over. ×: Missing or collapse occurred in the pattern.

[0082] <Raw materials, etc.> The raw materials used in Examples 1 to 7 are as follows. As the epoxy resin A, the following compound was used. Epoxy resin A-1: ​​Cresol novolac epoxy resin (manufactured by DIC, product name "EPICLON N-655") Epoxy resin A-2: Cresol novolac epoxy resin (manufactured by DIC, product name "EPICLON N-673") Epoxy resin A-3: Cresol novolac epoxy resin (manufactured by DIC, product name "EPICLON N-680") Epoxy resin A-4: Cresol novolac epoxy resin (manufactured by DIC, product name "EPICLON N-695") Epoxy resin A-5: High-performance epoxy resin (manufactured by DIC, product name "EPICLON HP-7200H") Epoxy resin A-6: Phenol novolac epoxy resin (manufactured by DIC, product name "EPICLON N-775") Epoxy resin a-1: Bisphenol A liquid epoxy resin (DIC, product name "EPICLON 850") Table 1 shows the softening point, Mw, Mn, viscosity at the softening point, viscosity at the softening point + 20°C, and epoxy equivalent of the epoxy resin. Note that epoxy resin a-1 is liquid at room temperature and does not have a softening point. The viscosity of epoxy resin a-1 (viscosity at the softening point) is the viscosity at 25°C. In Table 1, "-" indicates that no measurement was performed.

[0083] [Table 1]

[0084] As initiator B, the following compound was used. Initiator B-1: [biphenyl]-4-yl[4-[[biphenyl]-4-ylthio]phenyl](phenyl)sulfonium tetrakis(perfluorophenyl)borate (manufactured by San-Apro Co., Ltd., product name "CPI-310B")

[0085] As solvent C, the following compound was used. C-1: Anisole The octanol / water partition coefficient of anisole at 25°C was 2.1.

[0086] (Examples 1 to 7) Resin compositions were obtained by mixing epoxy resins, initiators, and solvents according to the formulations shown in Table 2. Blank spaces in Table 2 indicate that the corresponding component was not blended, and the blend amounts are in parts by mass. Using the resulting resin compositions, evaluations of coatability and moldability were carried out. The results are shown in Table 2. Table 2 also shows the viscosity of a mixture of 95% by mass of epoxy resin and 5% by mass of initiator at the softening point of the epoxy resin + 20°C (represented as "viscosity of composition (A+B) at the softening point of A + 20°C" in Table 2), and the viscosity of the resin composition at 25°C (represented as "viscosity (resin composition)" in Table 2). Furthermore, Table 2 also shows the refractive index at a wavelength of 589 nm of a thin film made of a cured epoxy resin (represented as "refractive index of thin film" in Table 2), the absolute value of the difference in refractive index at a wavelength of 589 nm between a substrate and a thin film made of a cured epoxy resin (represented as "refractive index difference between thin film and substrate" in Table 2), and the absolute value of the difference in refractive index at a wavelength of 589 nm between a thin film made of an inorganic oxide film and a cured epoxy resin (represented as "refractive index difference between thin film and inorganic oxide film" in Table 2).

[0087] [Table 2]

[0088] The resin compositions of Examples 1 to 6, which contained an aromatic polyfunctional epoxy resin A having a softening point of 70°C or higher but lower than 120°C, a photocationic polymerization initiator B, and a solvent C, were excellent in both coatability and moldability. The resin composition of Example 7, which contained a liquid aromatic polyfunctional epoxy resin having no softening point, a photocationic polymerization initiator B, and a solvent C, was poor in both coatability and moldability. [Explanation of symbols]

[0089] 1A, 1B, 1C, 1D... laminate, 10... substrate, 11... base material, 12... inorganic oxide film, 20... thin film, 21... resin composition, 22, 23... fine pattern, 30... mold, 33... fine pattern

Claims

1. A resin composition comprising an aromatic polyfunctional epoxy resin A having a softening point of 70°C or higher but lower than 120°C, a cationic photopolymerization initiator B, and a solvent C, but not a cationic photopolymerization initiator B' having a fluoroalkyl group (excluding resin compositions containing a bisphenol A novolac epoxy resin having an epoxy equivalent of 195 to 230 g / eq and a softening point of 83°C, a sulfonium hexafluoroantimonate-based cationic photopolymerization initiator, propylene carbonate, cyclopentanone, a fluorine-based leveling agent, and 3-glycidoxypropyltrimethoxysilane).

2. The resin composition according to claim 1, wherein the aromatic polyfunctional epoxy resin A has a weight average molecular weight of 1,000 to 5,000.

3. The resin composition according to claim 1, wherein the aromatic polyfunctional epoxy resin A has a viscosity of 1 to 500 Pa·s at a softening point of +20°C.

4. 2. The resin composition according to claim 1, wherein the aromatic polyfunctional epoxy resin A has either or both of a cresol novolac epoxy skeleton and a phenol novolac epoxy skeleton.

5. 2. The resin composition according to claim 1, wherein the photocationic polymerization initiator B is at least one selected from the group consisting of diazonium salts, iodonium salts, and sulfonium salts.

6. The photocationic polymerization initiator B is a salt, and the anion of the salt is PF ６ － , B(C ６ F ５ ) ４ － , and Ga(C ６ F ５ ) ４ － The resin composition according to claim 1, wherein the resin composition is at least one selected from the group consisting of:

7. 2. The resin composition according to claim 1, wherein a mixture of 95% by mass of the aromatic polyfunctional epoxy resin A and 5% by mass of the photocationic polymerization initiator B has a viscosity of 1 to 500 Pa s at a softening point of the aromatic polyfunctional epoxy resin A + 20°C.

8. The resin composition according to claim 1 , wherein the solvent C has an octanol / water partition coefficient at 25° C. of 0 or more.

9. 2. The resin composition according to claim 1, wherein the solvent C is at least one selected from the group consisting of aromatic hydrocarbons, aliphatic hydrocarbons, ketones, alcohols, ethers, and esters.

10. 2. The resin composition according to claim 1, wherein the solid content is 1 to 50% by mass.

11. 2. The resin composition according to claim 1, having a viscosity at 25°C of 0.1 mPa·s to 10 Pa·s.

12. The resin composition according to claim 1, which does not contain a compound having a fluoroalkyl group.

13. The resin composition according to claim 1, which is used in imprint molding.

14. A resin composition for use in imprint molding, comprising an aromatic polyfunctional epoxy resin A having a softening point of 70°C or higher but lower than 120°C, a photocationic polymerization initiator B1, and a solvent C (however, excluding resin compositions containing a bisphenol A novolac epoxy resin having an epoxy equivalent of 195 to 230 g / eq and a softening point of 83°C, a sulfonium hexafluoroantimonate-based photocationic polymerization initiator, propylene carbonate, cyclopentanone, a fluorine-based leveling agent, and 3-glycidoxypropyltrimethoxysilane).

15. A cured product of the resin composition according to any one of claims 1 to 14.

16. A laminate comprising a substrate and a thin film made of the cured product according to claim 15 on one surface of the substrate, the thin film having a thickness of 10 to 500 nm.

17. The laminate according to claim 16 , wherein the thin film has a fine pattern on the surface.

18. The laminate according to claim 16 , wherein the substrate comprises a base material, an inorganic oxide film on one surface of the base material, and the thin film on the inorganic oxide film.

19. The laminate according to claim 18, wherein the refractive index of the substrate at a wavelength of 589 nm is 1.75 to 2.

3.

20. 19. The laminate according to claim 18, wherein the absolute value of the difference in refractive index at a wavelength of 589 nm between the substrate and the inorganic oxide film is 0 to 0.

5.

21. 19. The laminate according to claim 18, wherein the absolute value of the difference in refractive index at a wavelength of 589 nm between the substrate and the thin film is 0 to 1.

22. 19. The laminate according to claim 18, wherein the absolute value of the refractive index difference between the inorganic oxide film and the thin film at a wavelength of 589 nm is 0 to 1.

23. A method for producing a laminate having a substrate and a thin film having a fine pattern on one surface of the substrate, the method comprising: A method for producing a laminate, comprising sandwiching the resin composition according to any one of claims 1 to 14 between a mold having a fine pattern on its surface and the substrate, curing the resin composition to form a thin film having a fine pattern on the surface, and separating the thin film from the mold.

24. A method for manufacturing an optical component, comprising etching the surfaces of the thin film and the substrate based on the fine pattern of the thin film in the laminate manufactured by the method for manufacturing a laminate described in claim 23, forming a fine pattern on the substrate, and removing the thin film remaining on the substrate.

Images