Photosensitive resin composition, photosensitive element, cured product, method for producing cured product pattern, and method for producing conductor pattern

Abstract

To provide a photosensitive resin composition capable of giving a cured product pattern excellent in adhesion, and to provide a photosensitive element using such a photosensitive resin composition.SOLUTION: The photosensitive resin composition contains a binder polymer, a photopolymerizable compound, and a photopolymerization initiator. The photopolymerizable compound contains a polyfunctional monomer having two or more radical reactive groups and at least one selected from the group consisting of a carboxy group and a carboxylate group. A photosensitive element 10 includes a support 12 and a photosensitive layer 14 arranged on the support 12. The photosensitive layer 14 contains the photosensitive resin composition.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure relates to a photosensitive resin composition, a photosensitive element, a cured product, a method for producing a cured product pattern, a method for producing a conductor pattern, and the like. [Background technology]

[0002] In the manufacture of wiring boards and the like, a cured product pattern is formed as a resist pattern to obtain a desired conductor pattern (e.g., a wiring pattern). For example, the cured product pattern can be formed by forming a photosensitive layer (photosensitive resin layer) on a substrate using a photosensitive resin composition, and then exposing and developing the photosensitive layer. Various compositions have been investigated as photosensitive resin compositions. For example, Patent Document 1 below describes a photosensitive resin composition containing an anthracene derivative. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] International Publication No. 2007 / 004619 Summary of the Invention [Problem to be solved by the invention]

[0004] When a photosensitive resin composition is used to form a cured product pattern that can be used as a resist pattern, a linear cured product pattern having linear line portions and linear space portions adjacent to the line portions may be formed. When forming a linear cured product pattern in which the line width (width of the line portion) is equal to or smaller than the space width (width of the space portion), adhesion may be required as a property for favorably forming the line portions and space portions.

[0005] One aspect of the present disclosure is to provide a photosensitive resin composition that can provide a cured product pattern with excellent adhesion. Another aspect of the present disclosure is to provide a photosensitive element using such a photosensitive resin composition. Another aspect of the present disclosure is to provide a cured product of the above-mentioned photosensitive resin composition. Another aspect of the present disclosure is to provide a method for producing a cured product pattern using the above-mentioned photosensitive resin composition. Another aspect of the present disclosure is to provide a method for producing a conductor pattern using such a method for producing a cured product pattern. [Means for solving the problem]

[0006] [1] A photosensitive resin composition comprising a binder polymer, a photopolymerizable compound, and a photopolymerization initiator, wherein the photopolymerizable compound contains a polyfunctional monomer having two or more radical reactive groups and at least one selected from the group consisting of a carboxy group and a carboxylate salt group. [2] The photosensitive resin composition according to [1], wherein the acid value of the polyfunctional monomer is 60 mgKOH / g or less. [3] The photosensitive resin composition according to [1] or [2], wherein the polyfunctional monomer further has a bisphenol A skeleton. [4] The photosensitive resin composition according to any one of [1] to [3], wherein the polyfunctional monomer further has a tricyclodecane dimethanol skeleton. [5] The photosensitive resin composition according to any one of [1] to [4], wherein the binder polymer has a styrene compound as a monomer unit. [6] The photosensitive resin composition according to any one of [1] to [5], wherein the binder polymer has an aryl (meth)acrylate as a monomer unit. [7] The photosensitive resin composition according to any one of [1] to [6], wherein the binder polymer has a hydroxyalkyl (meth)acrylate as a monomer unit. [8] The photosensitive resin composition according to any one of [1] to [7], further comprising a sensitizer. [9] The photosensitive resin composition according to [8], wherein the sensitizer contains an anthracene compound.

[10] A photosensitive element comprising a support and a photosensitive layer disposed on the support, wherein the photosensitive layer contains the photosensitive resin composition according to any one of [1] to [9].

[11] A cured product of the photosensitive resin composition according to any one of [1] to [9].

[12] A method for producing a cured product pattern, comprising: a step of forming a photosensitive layer on a substrate using the photosensitive resin composition according to any one of [1] to [9]; a step of photocuring a portion of the photosensitive layer; and a step of removing at least a portion of an uncured portion of the photosensitive layer to form a cured product pattern.

[13] A method for producing a conductive pattern, comprising the step of forming a conductive pattern using, as a mask, the cured product pattern obtained by the method for producing a cured product pattern according to

[12] . [Effects of the Invention]

[0007] According to one aspect of the present disclosure, it is possible to provide a photosensitive resin composition that can produce a cured product pattern with excellent adhesion. According to another aspect of the present disclosure, it is possible to provide a photosensitive element using such a photosensitive resin composition. According to another aspect of the present disclosure, it is possible to provide a cured product of the above-mentioned photosensitive resin composition. According to another aspect of the present disclosure, it is possible to provide a method for producing a cured product pattern using the above-mentioned photosensitive resin composition. According to another aspect of the present disclosure, it is possible to provide a method for producing a conductor pattern using such a method for producing a cured product pattern. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a schematic cross-sectional view illustrating an example of a photosensitive element. [Figure 2] 5A to 5C are schematic cross-sectional views showing an example of a method for manufacturing a conductor pattern. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, embodiments of the present disclosure will be described in detail, but the present disclosure is not limited to the following embodiments.

[0010] In this specification, numerical ranges indicated with "to" indicate a range that includes the numerical values ​​before and after "to" as the minimum and maximum values, respectively. A numerical range "A or greater" means a range exceeding A and A. A numerical range "A or less" means a range less than A and A. In numerical ranges described in stages in this specification, the upper or lower limit of a numerical range in one stage can be arbitrarily combined with the upper or lower limit of a numerical range in another stage. In numerical ranges described in this specification, the upper or lower limit of the numerical range may be replaced with a value shown in the examples. "A or B" may include either A or B, or may include both. Unless otherwise specified, the materials exemplified in this specification can be used alone or in combination of two or more. When multiple substances corresponding to each component are present in the composition, the content of each component in the composition refers to the total amount of the multiple substances present in the composition, unless otherwise specified. The term "layer" encompasses structures that are formed over the entire surface as well as structures that are formed only partially when observed in a plan view. The term "process" includes not only independent processes but also processes that cannot be clearly distinguished from other processes, as long as the process achieves its intended function. "(Meth)acrylate" refers to at least one of acrylate and its corresponding methacrylate. The same applies to other similar expressions, such as "(meth)acrylic." The content of (meth)acrylic acid monomer units refers to the total amount of acrylic acid monomer units and methacrylic acid monomer units. The same applies to other similar contents, such as the content of alkyl (meth)acrylate monomer units. Unless otherwise specified, "alkyl groups" may be linear, branched, or cyclic. "Hydroxy groups" do not include OH groups contained in carboxy groups. The solid content of a photosensitive resin composition refers to the non-volatile content excluding volatile components (water, organic solvents, etc.) that can volatilize. In other words, the solid content refers to the components that remain without volatilization during drying of the photosensitive resin composition, including components that are liquid, syrup-like, waxy, etc. at room temperature (25°C). "EO-modified" means a compound having a (poly)oxyethylene group."(Poly)oxyethylene group" means an oxyethylene group or a polyoxyethylene group in which two or more ethylene groups are linked by ether bonds. "PO-modified" means a compound having a (poly)oxypropylene group. "(Poly)oxypropylene group" means an oxypropylene group or a polyoxypropylene group in which two or more propylene groups are linked by ether bonds.

[0011] The photosensitive resin composition according to this embodiment contains (A) a binder polymer (hereinafter sometimes referred to as "component (A)"), (B) a photopolymerizable compound (hereinafter sometimes referred to as "component (B)"), and (C) a photopolymerization initiator (hereinafter sometimes referred to as "component (C)"). In the photosensitive resin composition according to this embodiment, component (B) contains a polyfunctional monomer having two or more radical reactive groups and at least one selected from the group consisting of a carboxy group and a carboxylate salt group (hereinafter sometimes referred to as "component (b1)").

[0012] According to the photosensitive resin composition of this embodiment, when a linear cured product pattern having a line width equal to or smaller than the space width is formed using the photosensitive resin composition, the line and space portions are well formed, and a cured product pattern having excellent adhesion can be obtained. In the adhesion evaluation described in the Examples below, the photosensitive resin composition of this embodiment can obtain a resist pattern in which the space portions (unexposed portions) are removed without residue and the line portions (exposed portions) are formed without meandering or chipping, with a minimum line width of, for example, 6 μm or less (preferably, 5 μm or less, 4 μm or less, etc.).

[0013] In a photosensitive resin composition containing components (A) to (C), when component (B) contains component (b1), it is presumed that the carboxy group or carboxylate salt group of component (b1) acts to improve the flexibility of the cured product, optimize contact of the cured product with the substrate, etc., resulting in a cured product pattern with excellent adhesion. However, the factors that result in a cured product pattern with excellent adhesion are not limited to those described above.

[0014] When a photosensitive resin composition is used to form a linear cured product pattern in which the space width is equal to or smaller than the line width (the space width is equal to or smaller than the line width), resolution may be required as a property that allows for good formation of line and space portions. According to one aspect of the photosensitive resin composition of this embodiment, a cured product pattern with excellent resolution can be obtained. According to the photosensitive resin composition of this embodiment, in the resolution evaluation described in the examples below, the space portions (unexposed portions) are removed without residue, and the line portions (exposed portions) are formed without meandering or chipping, and the minimum space width in the resist pattern is, for example, 8 μm or less (preferably, 7 μm or less, 6 μm or less, 5 μm or less, etc.).

[0015] When a laminate in which a film is in contact with a photosensitive layer containing a photosensitive resin composition is stored for a long period of time, it may be necessary to prevent components contained in the photosensitive resin composition from bleeding out and diffusing into the film during storage, thereby preventing defects in the photosensitive layer. According to one aspect of the photosensitive resin composition of this embodiment, it is possible to prevent components contained in the photosensitive resin composition (e.g., component (B)) from bleeding out when the photosensitive resin composition is stored for a long period of time. According to one aspect of the photosensitive resin composition of this embodiment, in the evaluation of bleed-out properties described in the Examples below, it is possible to achieve a time until discoloration occurs that exceeds, for example, 168 hours.

[0016] A cured product can be obtained by photocuring the photosensitive resin composition according to this embodiment. The cured product according to this embodiment is a cured product of the photosensitive resin composition according to this embodiment. One aspect of the photosensitive resin composition according to this embodiment can be used as a negative photosensitive resin composition. One aspect of the photosensitive resin composition according to this embodiment can be used to produce a cured product pattern, a resist pattern, a conductor pattern, or a wiring board.

[0017] The photosensitive resin composition according to this embodiment contains a binder polymer as component (A). Component (A) can have a polymerizable monomer as a monomer unit (structural unit), and can be obtained, for example, by radical polymerization of the polymerizable monomer.

[0018] The component (A) may have a styrene compound as a monomer unit. Examples of the styrene compound include styrene and styrene derivatives. Examples of the styrene derivative include vinyltoluene and α-methylstyrene. The component (A) may have styrene as a monomer unit from the viewpoint of easily obtaining excellent adhesion or excellent resolution.

[0019] From the viewpoint of easily obtaining excellent adhesion or excellent resolution, the content of the monomer units of the styrene compound may be in the following ranges based on the total amount of monomer units constituting component (A). The content of the monomer units of the styrene compound may be 10% by mass or more, 15% by mass or more, 20% by mass or more, 25% by mass or more, 30% by mass or more, 35% by mass or more, 40% by mass or more, 45% by mass or more, or 50% by mass or more. The content of the monomer units of the styrene compound may be 80% by mass or less, 75% by mass or less, 70% by mass or less, 65% by mass or less, 60% by mass or less, 55% by mass or less, 53% by mass or less, 52% by mass or less, less than 52% by mass, 51% by mass or less, 50% by mass or less, or 45% by mass or less. From these viewpoints, the content of the monomer units of the styrene compound may be 10 to 80 mass%, 10 to 70 mass%, 10 to 60 mass%, 20 to 80 mass%, 20 to 70 mass%, 20 to 60 mass%, 40 to 80 mass%, 40 to 70 mass%, or 40 to 60 mass%.

[0020] The component (A) may have (meth)acrylic acid as a monomer unit, from the viewpoint of easily obtaining excellent adhesion.

[0021] From the viewpoint of easily obtaining excellent adhesion, the content of (meth)acrylic acid monomer units may be within the following ranges based on the total amount of monomer units constituting component (A). The content of (meth)acrylic acid monomer units may be 5% by mass or more, 10% by mass or more, 15% by mass or more, 20% by mass or more, or 25% by mass or more. The content of (meth)acrylic acid monomer units may be 50% by mass or less, 45% by mass or less, 40% by mass or less, 35% by mass or less, or 30% by mass or less. From these viewpoints, the content of (meth)acrylic acid monomer units may be 5 to 50% by mass, 5 to 40% by mass, 5 to 30% by mass, 10 to 50% by mass, 10 to 40% by mass, 10 to 30% by mass, 20 to 50% by mass, 20 to 40% by mass, or 20 to 30% by mass.

[0022] From the viewpoint of easily obtaining excellent adhesion or excellent resolution, component (A) may have an alkyl (meth)acrylate as a monomer unit. Examples of the alkyl group in the alkyl (meth)acrylate include methyl, ethyl, propyl, butyl, pentyl, hexyl, heptyl, octyl, nonyl, decyl, undecyl, and dodecyl groups. The alkyl group may be any of various structural isomers.

[0023] The alkyl (meth)acrylate may have an unsubstituted alkyl group or an alkyl group containing a substituent, such as a hydroxy group, a carboxy group, a carboxylate group, an aldehyde group, an alkoxy group, an ester group, a substituted or unsubstituted amino group, an amide group (excluding a hydroxyamide group), a hydroxyamide group, a nitro group, a cyano group, a mercapto group, or a halogeno group (such as a fluoro group, a chloro group, a bromo group, or an iodo group).

[0024] The number of carbon atoms in the alkyl group of the alkyl (meth)acrylate (including the number of carbon atoms in the substituent) may be 1 to 4, 1 to 3, or 1 to 2, from the viewpoint of easily obtaining excellent adhesion or easily obtaining excellent resolution.

[0025] From the viewpoint of easily obtaining excellent adhesion or excellent resolution, component (A) may have a hydroxyalkyl (meth)acrylate as a monomer unit. Examples of the hydroxyalkyl (meth)acrylate include hydroxymethyl (meth)acrylate, hydroxyethyl (meth)acrylate, hydroxypropyl (meth)acrylate, hydroxybutyl (meth)acrylate, hydroxypentyl (meth)acrylate, and hydroxyhexyl (meth)acrylate.

[0026] From the viewpoint of easily obtaining excellent adhesion or excellent resolution, the content of the alkyl (meth)acrylate monomer units or the hydroxyalkyl (meth)acrylate monomer units may be in the following ranges based on the total amount of monomer units constituting the component (A): The content of the alkyl (meth)acrylate monomer units or the hydroxyalkyl (meth)acrylate monomer units may be 0.5% by mass or more, 1.0% by mass or more, 1.5% by mass or more, 2.0% by mass or more, 2.5% by mass or more, 3.0% by mass or more, 3.5% by mass or more, 4.0% by mass or more, 4.5% by mass or more, or 5.0% by mass or more. The content of alkyl (meth)acrylate monomer units or hydroxyalkyl (meth)acrylate monomer units may be 20% by mass or less, 15% by mass or less, 10% by mass or less, 8.0% by mass or less, 6.0% by mass or less, 5.0% by mass or less, 4.5% by mass or less, 4.0% by mass or less, 3.5% by mass or less, or 3.0% by mass or less. From these viewpoints, the content of alkyl (meth)acrylate monomer units or hydroxyalkyl (meth)acrylate monomer units may be 0.5 to 20% by mass, 0.5 to 10% by mass, 0.5 to 5.0% by mass, 1.0 to 20% by mass, 1.0 to 10% by mass, 1.0 to 5.0% by mass, 2.0 to 20% by mass, 2.0 to 10% by mass, or 2.0 to 5.0% by mass.

[0027] From the viewpoint of easily obtaining excellent adhesion or excellent resolution, the component (A) may have an aryl (meth)acrylate as a monomer unit. Examples of the aryl (meth)acrylate include benzyl (meth)acrylate, phenyl (meth)acrylate, and naphthyl (meth)acrylate. From the viewpoint of easily obtaining excellent adhesion or excellent resolution, the component (A) may have benzyl (meth)acrylate as a monomer unit.

[0028] From the viewpoint of easily obtaining excellent adhesion or excellent resolution, the content of the aryl (meth)acrylate monomer units may be within the following ranges based on the total amount of monomer units constituting component (A). The content of the aryl (meth)acrylate monomer units may be 5% by mass or more, 10% by mass or more, 15% by mass or more, 18% by mass or more, 20% by mass or more, or 23% by mass or more. The content of the aryl (meth)acrylate monomer units may be 50% by mass or less, 45% by mass or less, 40% by mass or less, 35% by mass or less, 30% by mass or less, 25% by mass or less, 23% by mass or less, or 20% by mass or less. From these viewpoints, the content of the aryl (meth)acrylate monomer unit may be 5 to 50 mass%, 5 to 35 mass%, 5 to 25 mass%, 10 to 50 mass%, 10 to 35 mass%, 10 to 25 mass%, 15 to 50 mass%, 15 to 35 mass%, or 15 to 25 mass%.

[0029] From the viewpoint of easily obtaining excellent adhesion or excellent resolution, component (A) may have at least one monomer unit selected from the group consisting of a styrene compound, (meth)acrylic acid, an alkyl (meth)acrylate, and an aryl (meth)acrylate, or may have a styrene compound and an aryl (meth)acrylate as monomer units, a styrene compound, an alkyl (meth)acrylate, and an aryl (meth)acrylate as monomer units, or a styrene compound, a hydroxyalkyl (meth)acrylate, and an aryl (meth)acrylate as monomer units. In these cases, the content of at least one monomer selected from the group consisting of a styrene compound, a (meth)acrylic acid, a alkyl (meth)acrylate, and a aryl (meth)acrylate may be within the above-mentioned ranges.

[0030] Component (A) may contain, as a monomer unit, other monomers in addition to the above-mentioned monomers. Examples of other monomers include vinyl alcohol ethers (e.g., vinyl n-butyl ether), (meth)acrylonitrile, maleic acid, maleic anhydride, maleic acid monoesters (e.g., monomethyl maleate, monoethyl maleate, monoisopropyl maleate), fumaric acid, cinnamic acid, α-cyanocinnamic acid, itaconic acid, crotonic acid, and propiolic acid.

[0031] From the viewpoint of easily obtaining excellent adhesion, the acid value of component (A) may be in the following ranges: The acid value of component (A) may be 100 mgKOH / g or more, 120 mgKOH / g or more, 140 mgKOH / g or more, 150 mgKOH / g or more, 160 mgKOH / g or more, 170 mgKOH / g or more, or 175 mgKOH / g or more; The acid value of component (A) may be 250 mgKOH / g or less, 240 mgKOH / g or less, 230 mgKOH / g or less, 200 mgKOH / g or less, 190 mgKOH / g or less, or 180 mgKOH / g or less. From these viewpoints, the acid value of component (A) may be 100 to 250 mgKOH / g, 100 to 200 mgKOH / g, 100 to 180 mgKOH / g, 150 to 250 mgKOH / g, 150 to 200 mgKOH / g, 150 to 180 mgKOH / g, 170 to 250 mgKOH / g, 170 to 200 mgKOH / g, or 170 to 180 mgKOH / g. The acid value of component (A) can be adjusted by the content of monomer units (e.g., monomer units of (meth)acrylic acid) constituting component (A). The acid value can be measured by the method described in the Examples below.

[0032] The weight-average molecular weight (Mw) of component (A) may be within the following ranges from the viewpoints of easily obtaining excellent adhesion, easily obtaining excellent resolution, or easily suppressing bleed-out. The weight-average molecular weight of component (A) may be 10,000 or more, 15,000 or more, 20,000 or more, 25,000 or more, 30,000 or more, 35,000 or more, 40,000 or more, 45,000 or more, or 50,000 or more. The weight-average molecular weight of component (A) may be 100,000 or less, 80,000 or less, 70,000 or less, 60,000 or less, 55,000 or less, 50,000 or less, 45,000 or less, 40,000 or less, or 35,000 or less. From these viewpoints, the weight average molecular weight of the component (A) may be 10,000 to 100,000, 10,000 to 80,000, 10,000 to 50,000, 20,000 to 100,000, 20,000 to 80,000, 20,000 to 50,000, 30,000 to 100,000, 30,000 to 80,000, or 30,000 to 50,000.

[0033] The number average molecular weight (Mn) of component (A) may be within the following ranges from the viewpoints of easily obtaining excellent adhesion, easily obtaining excellent resolution, or easily suppressing bleed-out. The number average molecular weight of component (A) may be 5,000 or more, 10,000 or more, 12,000 or more, 15,000 or more, 16,000 or more, 18,000 or more, or 20,000 or more. The number average molecular weight of component (A) may be 50,000 or less, 45,000 or less, 40,000 or less, 35,000 or less, 30,000 or less, 25,000 or less, 22,000 or less, 21,000 or less, 20,000 or less, 18,000 or less, or 16,000 or less. From these viewpoints, the number average molecular weight of the component (A) may be 5,000 to 50,000, 5,000 to 40,000, 5,000 to 30,000, 10,000 to 50,000, 10,000 to 40,000, 10,000 to 30,000, 15,000 to 50,000, 15,000 to 40,000, or 15,000 to 30,000.

[0034] The dispersity (Mw / Mn) of component (A) may be within the following ranges from the viewpoints of easily obtaining excellent adhesion, easily obtaining excellent resolution, or easily suppressing bleed-out. The dispersity of component (A) may be 1.0 or more, 1.5 or more, 2.0 or more, 2.1 or more, 2.2 or more, or 2.3 or more. The dispersity of component (A) may be 3.0 or less, 2.8 or less, 2.6 or less, 2.5 or less, 2.4 or less, 2.3 or less, or 2.2 or less. From these viewpoints, the dispersity of component (A) may be 1.0 to 3.0, 1.0 to 2.8, 1.0 to 2.5, 1.5 to 3.0, 1.5 to 2.8, 1.5 to 2.5, 2.0 to 3.0, 2.0 to 2.8, or 2.0 to 2.5.

[0035] The weight average molecular weight (Mw), number average molecular weight (Mn), and dispersity (Mw / Mn) can be measured by gel permeation chromatography (GPC) using a calibration curve of standard polystyrene, and can be measured by the method described in the Examples below. For compounds with low molecular weights, if it is difficult to measure them using this method, the molecular weight may be measured by another method and the average may be calculated.

[0036] The content of component (A) may be within the following ranges based on the total solid content of the photosensitive resin composition. From the viewpoint of excellent film formability, easy achievement of excellent adhesion, or easy prevention of bleed-out, the content of component (A) may be 20% by mass or more, 25% by mass or more, 30% by mass or more, 35% by mass or more, 40% by mass or more, 45% by mass or more, or 50% by mass or more. From the viewpoint of easy achievement of excellent adhesion or easy prevention of bleed-out, the content of component (A) may be 90% by mass or less, 85% by mass or less, 80% by mass or less, 75% by mass or less, 70% by mass or less, 65% by mass or less, or 60% by mass or less. From these viewpoints, the content of component (A) may be 20 to 90 mass%, 20 to 70 mass%, 20 to 60 mass%, 30 to 90 mass%, 30 to 70 mass%, 30 to 60 mass%, 40 to 90 mass%, 40 to 70 mass%, or 40 to 60 mass%.

[0037] The content of component (A) may be within the following ranges, relative to 100 parts by mass of the total of components (A) and (B). From the viewpoint of excellent film formability, ease of obtaining excellent adhesion, or ease of suppressing bleed-out, the content of component (A) may be 20 parts by mass or more, 25 parts by mass or more, 30 parts by mass or more, 35 parts by mass or more, 40 parts by mass or more, 45 parts by mass or more, 50 parts by mass or more, or 55 parts by mass or more. From the viewpoint of easy obtaining excellent adhesion or ease of suppressing bleed-out, the content of component (A) may be 90 parts by mass or less, 85 parts by mass or less, 80 parts by mass or less, 75 parts by mass or less, 70 parts by mass or less, 65 parts by mass or less, 60 parts by mass or less, 58 parts by mass or less, or 56 parts by mass or less. From these viewpoints, the content of component (A) may be 20 to 90 parts by mass, 20 to 70 parts by mass, 20 to 60 parts by mass, 30 to 90 parts by mass, 30 to 70 parts by mass, 30 to 60 parts by mass, 40 to 90 parts by mass, 40 to 70 parts by mass, or 40 to 60 parts by mass.

[0038] The photosensitive resin composition according to this embodiment contains a photopolymerizable compound as component (B). To obtain a cured product pattern with excellent adhesion, component (B) contains, as component (b1), a polyfunctional monomer having two or more radical reactive groups and at least one selected from the group consisting of a carboxy group and a carboxylate salt group. Examples of the carboxylate salt include alkali metal salts such as sodium salts and potassium salts.

[0039] The component (b1) has two or more radical reactive groups. The radical reactive group may be a group having an ethylenically unsaturated bond, such as a (meth)acryloyl group. In the component (b1), the number of radical reactive groups or the number of (meth)acryloyl groups (total of acryloyl groups and methacryloyl groups) may be 2 to 6, 2 to 5, 2 to 4, or 2 to 3, from the viewpoint of easily obtaining excellent adhesion, easily obtaining excellent resolution, or easily suppressing bleed-out.

[0040] Component (b1) has at least one selected from the group consisting of a carboxy group and a carboxylate group. In component (b1), the total number of carboxy groups and carboxylate groups may be 1 to 3, 1 to 2, or 2 to 3, from the viewpoint of easily obtaining excellent adhesion or easily suppressing bleed-out. In component (b1), from the viewpoint of easily obtaining excellent adhesion or easily suppressing bleed-out, component (b1) may have a branching point at which a molecular chain containing a radical-reactive group branches from a molecular chain containing at least one selected from the group consisting of a carboxy group and a carboxylate group.

[0041] From the viewpoint of easily obtaining excellent adhesion or easily suppressing bleed-out, the component (b1) may have a structure represented by the following general formula (1a) or may have a structure represented by the following general formula (1b).

[0042] [ka] [In formula (1a), R 11a represents a divalent organic group, and R 12a represents a hydrogen atom or a metal atom, and * represents a bond.]

[0043] [ka] [In formula (1b), R 1b represents a hydrogen atom or a metal atom, n is an integer of 1 or more, and * represents a bond.

[0044] R 11a The divalent organic group represented by the formula (R) may be an organic group containing carbon atoms and hydrogen atoms, or may be an organic group consisting of carbon atoms and hydrogen atoms. Examples of the divalent organic group include an alkyl group and an aryl group. 11a The divalent organic group represented by R may be an alkyl group from the viewpoint of easily obtaining excellent adhesion or easily suppressing bleed-out. 12a and R 1bExamples of the metal atom include alkali metals such as sodium and potassium. n may be 1 to 18, 1 to 10, 1 to 8, 1 to 6, 1 to 4, 1 to 3, 1 to 2, 2 to 18, 2 to 10, 2 to 8, 2 to 6, 2 to 4, or 2 to 3 from the viewpoint of easily obtaining excellent adhesion or easily suppressing bleed-out.

[0045] The component (b1) may have a structure derived from a dicarboxylic acid. Examples of dicarboxylic acids include aliphatic dicarboxylic acids (e.g., aliphatic dicarboxylic acids having 1 to 20 carbon atoms) such as malonic acid, succinic acid, glutaric acid, adipic acid, sebacic acid, and dodecanedicarboxylic acid; aromatic dicarboxylic acids such as terephthalic acid, isophthalic acid, and naphthalenedicarboxylic acid; and alicyclic dicarboxylic acids such as cyclohexanedicarboxylic acid. Examples of the structure derived from a dicarboxylic acid that can be used include a structure represented by the above general formula (1a) and a structure represented by the above general formula (1b).

[0046] From the viewpoint of easily obtaining excellent adhesion or easily suppressing bleed-out, the component (b1) may have the following number of oxyethylene groups (the total number of oxyethylene groups in the component (b1)). The number of oxyethylene groups may be 2 or more, or 4 or more. The number of oxyethylene groups may be 16 or less, 14 or less, 12 or less, 10 or less, or 8 or less. From these viewpoints, the number of oxyethylene groups may be 2 to 16, 2 to 14, 2 to 12, 2 to 10, 2 to 8, 4 to 16, 4 to 14, 4 to 12, 4 to 10, or 4 to 8. From the viewpoint of easily obtaining excellent adhesion, the component (b1) does not need to have oxypropylene groups.

[0047] The component (b1) may have at least one skeleton selected from the group consisting of a bisphenol A skeleton and a tricyclodecane dimethanol skeleton, from the viewpoint of easily obtaining excellent adhesion, excellent resolution, or easy suppression of bleed-out. The component (b1) may have a bisphenol A skeleton, from the viewpoint of easily obtaining excellent adhesion. The component (b1) may have a tricyclodecane dimethanol skeleton, from the viewpoint of easily obtaining excellent resolution.

[0048] The component (b1) may contain a (meth)acrylic acid compound having a bisphenol A skeleton as a polyfunctional monomer having a bisphenol A skeleton. The component (b1) may contain a (meth)acrylic acid compound having a tricyclodecane dimethanol skeleton as a polyfunctional monomer having a tricyclodecane dimethanol skeleton. From the viewpoint of easily obtaining excellent adhesion, easily obtaining excellent resolution, or easily suppressing bleed-out, the component (b1) may contain at least one selected from the group consisting of (meth)acrylic acid compounds having a bisphenol A skeleton and (meth)acrylic acid compounds having a tricyclodecane dimethanol skeleton.

[0049] From the viewpoint of easily obtaining excellent adhesion, easily obtaining excellent resolution, or easily suppressing bleed-out, the component (b1) may contain at least one compound selected from the group consisting of a compound represented by the following general formula (2a) and a compound represented by the following general formula (2b):

[0050] [ka] [In formula (2a), R 21a and R 22a each independently represents a hydrogen atom or a methyl group, and R 23a and R 24a each independently represents a divalent organic group, and R 23a and R 24a At least one of the groups contains at least one selected from the group consisting of a carboxy group and a carboxylate salt group.]

[0051] [ka] [In formula (2b), R 21b and R 22b each independently represents a hydrogen atom or a methyl group, and R 23b and R 24b each independently represents a divalent organic group, and R 23band R 24b At least one of the groups contains at least one selected from the group consisting of a carboxy group and a carboxylate salt group.]

[0052] In general formula (2a), R 23a and R 24a The divalent organic group in at least one of the general formula (2b) may be an organic group containing carbon atoms, hydrogen atoms, and oxygen atoms, or may be an organic group consisting of carbon atoms, hydrogen atoms, and oxygen atoms, from the viewpoint of easily obtaining excellent adhesion, easily obtaining excellent resolution, or easily suppressing bleed-out. 23b and R 24b The divalent organic group in at least one of the above may be an organic group containing carbon atoms, hydrogen atoms, and oxygen atoms, or may be an organic group consisting of carbon atoms, hydrogen atoms, and oxygen atoms, from the viewpoint of easily obtaining excellent adhesion, easily obtaining excellent resolution, or easily suppressing bleed-out.

[0053] From the viewpoint of easily obtaining excellent adhesion, easily obtaining excellent resolution, or easily suppressing bleed-out, the component (b1) may contain at least one compound selected from the group consisting of a compound represented by the following general formula (3a) and a compound represented by the following general formula (3b):

[0054] [ka] [In formula (3a), m1 and m2 each independently represent an integer of 1 or more, and R 31a and R 32a each independently represents a hydrogen atom or a methyl group, and R 33a and R 34a each independently represents a hydrogen atom or a group represented by the above general formula (1a), and R 33a and R 34a At least one of the groups is a group represented by the above general formula (1a).

[0055] [ka] [In formula (3b), R 31b and R 32b each independently represents a hydrogen atom or a methyl group, and R 33b and R 34b each independently represents a hydrogen atom or a group represented by the general formula (1a), and R 33b and R 34b At least one of the groups is a group represented by the above general formula (1a).

[0056] R 33a and R 34a At least one of R may be a group represented by the above general formula (1b), from the viewpoint of easily obtaining excellent adhesion, easily obtaining excellent resolution, or easily suppressing bleed-out. 33b and R 34b At least one of m1 and m2 may be a group represented by general formula (1b) above, from the viewpoint of easily obtaining excellent adhesion, excellent resolution, or easy suppression of bleed-out. The sum of m1 and m2 may be 2 to 16, 2 to 14, 2 to 12, 2 to 10, 2 to 8, 4 to 16, 4 to 14, 4 to 12, 4 to 10, or 4 to 8, from the viewpoint of easily obtaining excellent adhesion, excellent resolution, or easy suppression of bleed-out.

[0057] From the viewpoint of easily obtaining excellent adhesion, easily obtaining excellent resolution, or easily suppressing bleed-out, the acid value of the component (b1) may be in the following range: The acid value of the component (b1) may be 60.0 mgKOH / g or less, 50.0 mgKOH / g or less, 40.0 mgKOH / g or less, 35.0 mgKOH / g or less, 30.0 mgKOH / g or less, 25.0 mgKOH / g or less, 20.0 mgKOH / g or less, 18.0 mgKOH / g or less, or 16.0 mgKOH / g or less. The acid value of component (b1) may be 1.0 mgKOH / g or more, 5.0 mgKOH / g or more, 7.0 mgKOH / g or more, 10.0 mgKOH / g or more, 12.0 mgKOH / g or more, 15.0 mgKOH / g or more, 18.0 mgKOH / g or more, 20.0 mgKOH / g or more, 25.0 mgKOH / g or more, or 30.0 mgKOH / g or more. From these viewpoints, the acid value of the (b1) component may be 1.0 to 60.0 mgKOH / g, 1.0 to 40.0 mgKOH / g, 1.0 to 35.0 mgKOH / g, 1.0 to 25.0 mgKOH / g, 5.0 to 60.0 mgKOH / g, 5.0 to 40.0 mgKOH / g, 5.0 to 35.0 mgKOH / g, 5.0 to 25.0 mgKOH / g, 10.0 to 60.0 mgKOH / g, 10.0 to 40.0 mgKOH / g, 10.0 to 35.0 mgKOH / g, or 10.0 to 25.0 mgKOH / g. The acid value of the (b1) component can be measured by the method described in the Examples below.

[0058] From the viewpoint of easily obtaining excellent adhesion or easily suppressing bleed-out, the content of component (b1) may be within the following ranges based on the total amount of component (B): The content of component (b1) may be 1% by mass or more, 5% by mass or more, 10% by mass or more, 12% by mass or more, 15% by mass or more, 18% by mass or more, 20% by mass or more, 25% by mass or more, or 30% by mass or more The content of component (b1) may be 50% by mass or less, 45% by mass or less, 40% by mass or less, 35% by mass or less, 30% by mass or less, or 25% by mass or less. From these viewpoints, the content of the (b1) component may be 1 to 50 mass%, 1 to 40 mass%, 1 to 35 mass%, 1 to 30 mass%, 10 to 50 mass%, 10 to 40 mass%, 10 to 35 mass%, 10 to 30 mass%, 20 to 50 mass%, 20 to 40 mass%, 20 to 35 mass%, or 20 to 30 mass%.

[0059] From the viewpoint of easily obtaining excellent adhesion or easily suppressing bleed-out, the content of the component (b1) may be within the following ranges based on the total solid content of the photosensitive resin composition. The content of the component (b1) may be 1 mass% or more, 2 mass% or more, 3 mass% or more, 4 mass% or more, 5 mass% or more, 6 mass% or more, 7 mass% or more, 8 mass% or more, 9 mass% or more, 10 mass% or more, or 12 mass% or more. The content of the component (b1) may be 40 mass% or less, 35 mass% or less, 30 mass% or less, 25 mass% or less, 20 mass% or less, 15 mass% or less, 12 mass% or less, 10 mass% or less, or 9 mass% or less. From these viewpoints, the content of the (b1) component may be 1 to 40 mass%, 1 to 20 mass%, 1 to 15 mass%, 1 to 10 mass%, 3 to 40 mass%, 3 to 20 mass%, 3 to 15 mass%, 3 to 10 mass%, 5 to 40 mass%, 5 to 20 mass%, 5 to 15 mass%, or 5 to 10 mass%.

[0060] From the viewpoint of easily obtaining excellent adhesion or easily suppressing bleed-out, the content of component (b1) may be within the following ranges, relative to 100 parts by mass of the total of components (A) and (B): The content of component (b1) may be 1 part by mass or more, 2 parts by mass or more, 3 parts by mass or more, 4 parts by mass or more, 5 parts by mass or more, 6 parts by mass or more, 7 parts by mass or more, 8 parts by mass or more, 9 parts by mass or more, 10 parts by mass or more, 12 parts by mass or more, or 15 parts by mass or more. The content of component (b1) may be 50 parts by mass or less, 45 parts by mass or less, 40 parts by mass or less, 35 parts by mass or less, 30 parts by mass or less, 25 parts by mass or less, 20 parts by mass or less, 15 parts by mass or less, 12 parts by mass or less, 10 parts by mass or less, or 9 parts by mass or less. From these viewpoints, the content of the (b1) component may be 1 to 50 parts by mass, 1 to 30 parts by mass, 1 to 20 parts by mass, 3 to 50 parts by mass, 3 to 30 parts by mass, 3 to 20 parts by mass, 5 to 50 parts by mass, 5 to 30 parts by mass, or 5 to 20 parts by mass.

[0061] The component (B) may contain a photopolymerizable compound other than the component (b1). Examples of such photopolymerizable compounds include monofunctional monomers and polyfunctional monomers that do not have a carboxy group or a carboxylate salt group. The component (B) does not need to contain a monofunctional monomer, from the viewpoint of easily obtaining excellent adhesion or easily suppressing bleed-out.

[0062] From the viewpoint of easily obtaining excellent adhesion or easily suppressing bleed-out, the component (B) may include, as a polyfunctional monomer not having a carboxy group or a carboxylic acid salt group, a photopolymerizable compound b21 having at least one skeleton selected from the group consisting of a bisphenol A skeleton and a tricyclodecane dimethanol skeleton, a photopolymerizable compound b22 having two or more radical reactive groups and at least one skeleton selected from the group consisting of a bisphenol A skeleton and a tricyclodecane dimethanol skeleton, or a photopolymerizable compound b23 having two or more radical reactive groups, at least one skeleton selected from the group consisting of a bisphenol A skeleton and a tricyclodecane dimethanol skeleton, and an oxyethylene group.

[0063] From the viewpoint of easily obtaining excellent adhesion or easily suppressing bleed-out, the photopolymerizable compound b23 may have the following number of oxyethylene groups (the total number of oxyethylene groups in the photopolymerizable compound b23): The number of oxyethylene groups may be 8 or more, or 10 or more. The number of oxyethylene groups may be 16 or less, 14 or less, 12 or less, or 10 or less. From these viewpoints, the number of oxyethylene groups may be 8 to 16, 8 to 14, 8 to 12, 8 to 10, 10 to 16, 10 to 14, or 10 to 12. From the viewpoint of easily obtaining excellent adhesion, the photopolymerizable compound b23 does not need to have any oxypropylene groups.

[0064] The content (b2-1) of photopolymerizable compound b21, photopolymerizable compound b22, or photopolymerizable compound b23 may be within the following ranges based on the total amount of component (B), from the viewpoint of easily obtaining excellent adhesion or easily suppressing bleed-out. The content (b2-1) may be 50% by mass or more, 55% by mass or more, 60% by mass or more, 65% by mass or more, 70% by mass or more, or 75% by mass or more. The content (b2-1) may be 99% by mass or less, 95% by mass or less, 90% by mass or less, 88% by mass or less, 85% by mass or less, 80% by mass or less, 75% by mass or less, or 70% by mass or less. From these viewpoints, the content (b2-1) may be 50 to 99 mass%, 60 to 99 mass%, 70 to 99 mass%, 50 to 90 mass%, 60 to 90 mass%, 70 to 90 mass%, 50 to 80 mass%, 60 to 80 mass%, or 70 to 80 mass%.

[0065] The content (b2-2) of photopolymerizable compound b21, photopolymerizable compound b22, or photopolymerizable compound b23 may be within the following ranges based on the total solid content of the photosensitive resin composition, from the viewpoint of easily obtaining excellent adhesion or easily suppressing bleed-out. The content (b2-2) may be 1 mass% or more, 5 mass% or more, 10 mass% or more, 15 mass% or more, 20 mass% or more, 25 mass% or more, or 30 mass% or more. The content (b2-2) may be 50 mass% or less, 45 mass% or less, 40 mass% or less, 35 mass% or less, or 30 mass% or less. From these viewpoints, the content (b2-2) may be 1 to 50 mass%, 1 to 40 mass%, 1 to 35 mass%, 10 to 50 mass%, 10 to 40 mass%, 10 to 35 mass%, 20 to 50 mass%, 20 to 40 mass%, or 20 to 35 mass%.

[0066] The content (b2-3) of photopolymerizable compound b21, photopolymerizable compound b22, or photopolymerizable compound b23 may be within the following ranges relative to 100 parts by mass of the total of component (A) and component (B), from the viewpoint of easily obtaining excellent adhesion or easily suppressing bleed-out. The content (b2-3) may be 1 part by mass or more, 5 parts by mass or more, 10 parts by mass or more, 15 parts by mass or more, 20 parts by mass or more, 25 parts by mass or more, 30 parts by mass or more, or 35 parts by mass or more. The content (b2-3) may be 60 parts by mass or less, 55 parts by mass or less, 50 parts by mass or less, 45 parts by mass or less, 40 parts by mass or less, 35 parts by mass or less, or 30 parts by mass or less. From these viewpoints, the content (b2-3) may be 1 to 60 parts by mass, 1 to 50 parts by mass, 1 to 40 parts by mass, 10 to 60 parts by mass, 10 to 50 parts by mass, 10 to 40 parts by mass, 20 to 60 parts by mass, 20 to 50 parts by mass, or 20 to 40 parts by mass.

[0067] The ratio of the content of photopolymerizable compound b21, photopolymerizable compound b22, or photopolymerizable compound b23 to the content of component (b1) ([b21, b22, or b23] / (b1)) may be within the following ranges, from the viewpoint of easily obtaining excellent adhesion or easily suppressing bleed-out. The content ratio may be 1.0 or more, 1.5 or more, 1.8 or more, 2.0 or more, 2.5 or more, 3.0 or more, or 3.5 or more. The content ratio may be 8.0 or less, 7.5 or less, 7.0 or less, 6.5 or less, 6.0 or less, 5.5 or less, 5.0 or less, 4.5 or less, 4.0 or less, 3.5 or less, 3.0 or less, 2.5 or less, or 2.0 or less. From these viewpoints, the content ratio may be 1.0 to 8.0, 1.0 to 6.0, 1.0 to 5.0, 1.0 to 4.0, 1.8 to 8.0, 1.8 to 6.0, 1.8 to 5.0, 1.8 to 4.0, 2.0 to 8.0, 2.0 to 6.0, 2.0 to 5.0, 2.0 to 4.0, 3.0 to 8.0, 3.0 to 6.0, 3.0 to 5.0, or 3.0 to 4.0.

[0068] The content of the (B) component may be within the following ranges based on the total solid content of the photosensitive resin composition. From the viewpoint of easily obtaining excellent adhesion or easily suppressing bleed-out, the content of the (B) component may be 10% by mass or more, 15% by mass or more, 20% by mass or more, 25% by mass or more, 30% by mass or more, 35% by mass or more, or 40% by mass or more. From the viewpoint of easily obtaining excellent film formability, easily obtaining excellent adhesion, or easily suppressing bleed-out, the content of the (B) component may be 80% by mass or less, 75% by mass or less, 70% by mass or less, 65% by mass or less, 60% by mass or less, 55% by mass or less, 50% by mass or less, or 45% by mass or less. From these viewpoints, the content of component (B) may be 10 to 80 mass%, 10 to 60 mass%, 10 to 50 mass%, 20 to 80 mass%, 20 to 60 mass%, 20 to 50 mass%, 30 to 80 mass%, 30 to 60 mass%, or 30 to 50 mass%.

[0069] The content of the (B) component may be in the following ranges relative to 100 parts by mass of the total of the (A) and (B) components. From the viewpoint of easily obtaining excellent adhesion or easily suppressing bleed-out, the content of the (B) component may be 10 parts by mass or more, 15 parts by mass or more, 20 parts by mass or more, 25 parts by mass or more, 30 parts by mass or more, 35 parts by mass or more, 40 parts by mass or more, 42 parts by mass or more, or 44 parts by mass or more. From the viewpoint of easily obtaining excellent film formability, easily obtaining excellent adhesion, or easily suppressing bleed-out, the content of the (B) component may be 80 parts by mass or less, 75 parts by mass or less, 70 parts by mass or less, 65 parts by mass or less, 60 parts by mass or less, 55 parts by mass or less, 50 parts by mass or less, or 45 parts by mass or less. From these viewpoints, the content of the (B) component may be 10 to 80 parts by mass, 10 to 70 parts by mass, 10 to 60 parts by mass, 30 to 80 parts by mass, 30 to 70 parts by mass, 30 to 60 parts by mass, 40 to 80 parts by mass, 40 to 70 parts by mass, or 40 to 60 parts by mass.

[0070] The photosensitive resin composition according to this embodiment contains a photopolymerization initiator as component (C), which can be a photopolymerization initiator capable of polymerizing component (B).

[0071] Examples of the component (C) include hexaarylbiimidazole compounds; aromatic ketones such as benzophenone, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-1-butanone, 2-(dimethylamino)-2-[(4-methylphenyl)methyl]-1-[4-(4-morpholinyl)phenyl]-1-butanone, 4-(2-hydroxyethoxy)phenyl-2-(hydroxy-2-propyl)ketone, and 2-methyl-1-[4-(methylthio)phenyl]-2-morpholino-propanone-1; alkyl aryl ketones such as benzophenone, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-1-butanone, 2-(dimethylamino)-2-[(4-methylphenyl)methyl]-1-[4-(4-morpholinyl)phenyl]-1-butanone ...benzyl-2-dimethylamino-1-butanone, 2-benzyl-2-dimethylamino-1-butanone, 2-benzyl-2-dimethylamino-1-butanone, 2-benzyl-2-dimethylamino-1-butanone, 2-benzyl-2-dimethylamino-1-butanone, 2-benzyl-2-dimethylamino-1-butanone, 2-benzyl-2-dimethylamino-1-butanone, 2-benzyl-2-dimethylamino-1-butanone, 2 quinones such as trichloroquinone; benzoin ether compounds such as benzoin alkyl ether; benzoin compounds such as benzoin and alkylbenzoin; benzyl derivatives such as benzyl dimethyl ketal; and phosphine oxide compounds such as bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide, bis(2,6-dimethylbenzoyl)-2,4,4-trimethyl-pentylphosphine oxide, and (2,4,6-trimethylbenzoyl)ethoxyphenylphosphine oxide.

[0072] From the viewpoint of easily obtaining excellent sensitivity, excellent adhesion, or excellent resolution, component (C) may contain a hexaarylbiimidazole compound. The aryl group in the hexaarylbiimidazole compound may be a phenyl group or the like. The hydrogen atom bonded to the aryl group in the hexaarylbiimidazole compound may be substituted with a halogen atom (e.g., a chlorine atom).

[0073] The hexaarylbiimidazole compound may be a 2,4,5-triarylimidazole dimer. Examples of the 2,4,5-triarylimidazole dimer include 2-(o-chlorophenyl)-4,5-diphenylimidazole dimer, 2-(o-chlorophenyl)-4,5-bis-(m-methoxyphenyl)imidazole dimer, and 2-(p-methoxyphenyl)-4,5-diphenylimidazole dimer. From the viewpoint of easily obtaining excellent sensitivity, excellent adhesion, or excellent resolution, the hexaarylbiimidazole compound may include 2-(o-chlorophenyl)-4,5-diphenylimidazole dimer or 2,2'-bis(o-chlorophenyl)-4,4',5,5'-tetraphenyl-1,2'-biimidazole.

[0074] From the viewpoint of easily obtaining excellent sensitivity, excellent adhesion, or excellent resolution, the content of the hexaarylbiimidazole compound may be 90% by mass or more, 92% by mass or more, 93% by mass or more, 95% by mass or more, 97% by mass or more, or 99% by mass or more, based on the total amount of component (C).The content of the hexaarylbiimidazole compound may be 100% by mass or less, based on the total amount of component (C).

[0075] From the viewpoint of easily improving both sensitivity and resolution in a balanced manner or easily obtaining excellent adhesion, the content of component (C) may be within the following ranges based on the total solid content of the photosensitive resin composition. The content of component (C) may be 0.1 mass% or more, 0.5 mass% or more, 1.0 mass% or more, 2.0 mass% or more, 3.0 mass% or more, 4.0 mass% or more, 5.0 mass% or more, or 6.0 mass% or more. The content of component (C) may be 20 mass% or less, 15 mass% or less, 10 mass% or less, 8.0 mass% or less, or 7.0 mass% or less. From these viewpoints, the content of component (C) may be 0.1 to 20 mass%, 0.1 to 10 mass%, 0.1 to 8.0 mass%, 1.0 to 20 mass%, 1.0 to 10 mass%, 1.0 to 8.0 mass%, 3.0 to 20 mass%, 3.0 to 10 mass%, or 3.0 to 8.0 mass%.

[0076] From the viewpoint of easily achieving a balanced improvement in both sensitivity and resolution or easily obtaining excellent adhesion, the content of component (C) may be within the following ranges relative to 100 parts by mass of the total of components (A) and (B): The content of component (C) may be 0.1 parts by mass or more, 0.5 parts by mass or more, 1.0 parts by mass or more, 2.0 parts by mass or more, 3.0 parts by mass or more, 4.0 parts by mass or more, 5.0 parts by mass or more, or 6.0 parts by mass or more. The content of component (C) may be 20 parts by mass or less, 15 parts by mass or less, 10 parts by mass or less, 8.0 parts by mass or less, or 7.0 parts by mass or less. From these viewpoints, the content of component (C) may be 0.1 to 20 parts by mass, 0.1 to 10 parts by mass, 0.1 to 8.0 parts by mass, 1.0 to 20 parts by mass, 1.0 to 10 parts by mass, 1.0 to 8.0 parts by mass, 3.0 to 20 parts by mass, 3.0 to 10 parts by mass, or 3.0 to 8.0 parts by mass.

[0077] The photosensitive resin composition according to this embodiment may contain a sensitizer as component (D), which makes it easier to effectively utilize the absorption wavelength of the actinic rays used for exposure.

[0078] Examples of the component (D) include dialkylaminobenzophenone compounds, pyrazoline compounds, coumarin compounds, anthracene compounds, xanthone compounds, thioxanthone compounds, oxazole compounds, benzoxazole compounds, thiazole compounds, benzothiazole compounds, triazole compounds, stilbene compounds, triazine compounds, thiophene compounds, naphthalimide compounds, triarylamine compounds, and aminoacridine compounds.

[0079] Examples of the dialkylaminobenzophenone compound include 4,4'-bis(diethylamino)benzophenone and 4-methoxy-4'-dimethylaminobenzophenone.

[0080] Examples of the pyrazoline compound include 1-phenyl-3-(4-methoxystyryl)-5-(4-methoxyphenyl)pyrazoline, 1-phenyl-3-(4-tert-butylstyryl)-5-(4-tert-butylphenyl)pyrazoline, and 1-phenyl-3-biphenyl-5-(4-tert-butylphenyl)pyrazoline.

[0081] Examples of coumarin compounds include 3-benzoyl-7-diethylaminocoumarin, 7-diethylamino-4-methylcoumarin, 3,3'-carbonylbis(7-diethylaminocoumarin), 2,3,6,7-tetrahydro-9-methyl-1H,5H,11H-[1]benzopyrano[6,7,8-ij]quillidin-11-one, and the like.

[0082] Examples of the anthracene compound include 9,10-dimethoxyanthracene, 9,10-diethoxyanthracene, 9,10-dipropoxyanthracene, 9,10-dibutoxyanthracene, and 9,10-dipentoxyanthracene.

[0083] From the viewpoint of easily obtaining excellent adhesion or excellent resolution, the component (D) may include at least one selected from the group consisting of a dialkylaminobenzophenone compound and an anthracene compound, may include an anthracene compound, may include at least one selected from the group consisting of 9,10-diethoxyanthracene, 9,10-dipropoxyanthracene, and 9,10-dibutoxyanthracene, and may include 9,10-dibutoxyanthracene.

[0084] From the viewpoint of easily obtaining excellent sensitivity, excellent adhesion, or excellent resolution, the content of component (D) may be within the following ranges based on the total solid content of the photosensitive resin composition. The content of component (D) may be 0.001% by mass or more, 0.005% by mass or more, 0.01% by mass or more, 0.05% by mass or more, 0.1% by mass or more, 0.2% by mass or more, 0.3% by mass or more, 0.4% by mass or more, 0.5% by mass or more, or 0.6% by mass or more. The content of component (D) may be 5.0% by mass or less, 4.0% by mass or less, 3.0% by mass or less, 2.0% by mass or less, 1.0% by mass or less, 0.9% by mass or less, 0.8% by mass or less, or 0.7% by mass or less. From these viewpoints, the content of component (D) may be 0.001 to 5.0 mass%, 0.001 to 3.0 mass%, 0.001 to 1.0 mass%, 0.01 to 5.0 mass%, 0.01 to 3.0 mass%, 0.01 to 1.0 mass%, 0.1 to 5.0 mass%, 0.1 to 3.0 mass%, or 0.1 to 1.0 mass%.

[0085] From the viewpoint of easily achieving excellent sensitivity, excellent adhesion, or excellent resolution, the content of component (D) may be within the following ranges relative to 100 parts by mass of the total of components (A) and (B): The content of component (D) may be 0.001 parts by mass or more, 0.005 parts by mass or more, 0.01 parts by mass or more, 0.05 parts by mass or more, 0.1 parts by mass or more, 0.2 parts by mass or more, 0.3 parts by mass or more, 0.4 parts by mass or more, 0.5 parts by mass or more, or 0.6 parts by mass or more. The content of component (D) may be 5.0 parts by mass or less, 4.0 parts by mass or less, 3.0 parts by mass or less, 2.0 parts by mass or less, 1.0 parts by mass or less, 0.9 parts by mass or less, 0.8 parts by mass or less, or 0.7 parts by mass or less. From these viewpoints, the content of component (D) may be 0.001 to 5.0 parts by mass, 0.001 to 3.0 parts by mass, 0.001 to 1.0 parts by mass, 0.01 to 5.0 parts by mass, 0.01 to 3.0 parts by mass, 0.01 to 1.0 parts by mass, 0.1 to 5.0 parts by mass, 0.1 to 3.0 parts by mass, or 0.1 to 1.0 part by mass.

[0086] The photosensitive resin composition according to this embodiment may contain a polymerization inhibitor as component (E) to facilitate excellent adhesion or resolution. Examples of component (E) include 4-tert-butylcatechol, 4-hydroxy-2,2,6,6-tetramethylpiperidine-N-oxyl, p-methoxyphenol, diphenyl-p-benzoquinone, benzoquinone, hydroquinone, pyrogallol, phenothiazine, resorcinol, o-dinitrobenzene, p-dinitrobenzene, m-dinitrobenzene, phenanthraquinone, N-phenyl-2-naphthylamine, cupferron, 2,5-toluquinone, tannic acid, parabenzylaminophenol, tris(4-tert-butyl-3-hydroxy-2,6-dimethylbenzyl)isocyanuric acid, and nitrosamines. The component (E) may contain at least one selected from the group consisting of 4-tert-butylcatechol and 4-hydroxy-2,2,6,6-tetramethylpiperidine-N-oxyl, from the viewpoint of easily obtaining excellent adhesion or excellent resolution.

[0087] The content of the component (E) may be within the following ranges based on the total solid content of the photosensitive resin composition. From the viewpoint of easily obtaining excellent sensitivity or excellent resolution, the content of the component (E) may be 0.001% by mass or more, 0.005% by mass or more, 0.01% by mass or more, 0.02% by mass or more, 0.03% by mass or more, or 0.04% by mass or more. From the viewpoint of easily obtaining excellent sensitivity or excellent adhesion, the content of the component (E) may be 3.0% by mass or less, 2.0% by mass or less, 1.0% by mass or less, 0.5% by mass or less, 0.3% by mass or less, 0.1% by mass or less, 0.08% by mass or less, 0.06% by mass or less, or 0.05% by mass or less. From these viewpoints, the content of component (E) may be 0.001 to 3.0 mass%, 0.001 to 1.0 mass%, 0.001 to 0.1 mass%, 0.01 to 3.0 mass%, 0.01 to 1.0 mass%, 0.01 to 0.1 mass%, 0.03 to 3.0 mass%, 0.03 to 1.0 mass%, or 0.03 to 0.1 mass%.

[0088] The content of the component (E) may be in the following ranges, relative to 100 parts by mass of the total of the components (A) and (B). From the viewpoint of easily obtaining excellent sensitivity or excellent resolution, the content of the component (E) may be 0.001 parts by mass or more, 0.005 parts by mass or more, 0.01 parts by mass or more, 0.02 parts by mass or more, 0.03 parts by mass or more, 0.04 parts by mass or more, or 0.05 parts by mass or more. From the viewpoint of easily obtaining excellent sensitivity or excellent adhesion, the content of the component (E) may be 3.0 parts by mass or less, 2.0 parts by mass or less, 1.0 parts by mass or less, 0.5 parts by mass or less, 0.3 parts by mass or less, 0.1 parts by mass or less, 0.08 parts by mass or less, 0.06 parts by mass or less, or 0.05 parts by mass or less. From these viewpoints, the content of component (E) may be 0.001 to 3.0 parts by mass, 0.001 to 1.0 parts by mass, 0.001 to 0.1 parts by mass, 0.01 to 3.0 parts by mass, 0.01 to 1.0 parts by mass, 0.01 to 0.1 parts by mass, 0.03 to 3.0 parts by mass, 0.03 to 1.0 parts by mass, or 0.03 to 0.1 parts by mass.

[0089] The photosensitive resin composition according to this embodiment may contain an organic solvent, such as methanol, ethanol, acetone, methyl ethyl ketone, methyl cellosolve, ethyl cellosolve, toluene, N,N-dimethylformamide, or propylene glycol monomethyl ether, in order to facilitate viscosity adjustment.

[0090] The photosensitive resin composition according to this embodiment may contain components other than those described above. Examples of other components include hydrogen donors (such as bis[4-(dimethylamino)phenyl]methane, bis[4-(diethylamino)phenyl]methane, N-phenylglycine, and leucocrystal violet); dyes (such as malachite green); tribromophenyl sulfone; photocoloring agents; thermal color-developing inhibitors; plasticizers (such as p-toluenesulfonamide); pigments; fillers; antifoaming agents; flame retardants; stabilizers; a mixture of carboxybenzotriazole, 5-amino-1H-tetrazole, and methoxypropanol; leveling agents; release promoters; antioxidants; fragrances; imaging agents; and thermal crosslinkers. The content of each of these components may be 0.001 parts by weight or more, 0.005 parts by weight or more, or 0.01 parts by weight or more, or 20 parts by weight or less, 10 parts by weight or less, or 5 parts by weight or less, based on 100 parts by weight of the total of component (A) and component (B).

[0091] The photosensitive resin composition according to this embodiment may be in the form of a film. The thickness of the film-like photosensitive resin composition may be 1 μm or more, 5 μm or more, 10 μm or more, 12 μm or more, 14 μm or more, or 15 μm or more, from the viewpoint of easily improving productivity. The thickness of the film-like photosensitive resin composition may be 100 μm or less, 80 μm or less, 60 μm or less, 50 μm or less, 40 μm or less, 30 μm or less, 25 μm or less, 20 μm or less, or 15 μm or less, from the viewpoint of easily obtaining excellent adhesion or excellent resolution. From these viewpoints, the thickness of the film-like photosensitive resin composition may be 1 to 100 μm, 1 to 60 μm, 1 to 30 μm, 5 to 100 μm, 5 to 60 μm, 5 to 30 μm, 10 to 100 μm, 10 to 60 μm, or 10 to 30 μm.

[0092] The photosensitive element according to this embodiment includes a support and a photosensitive layer (photosensitive resin layer) disposed on the support, and the photosensitive layer contains the photosensitive resin composition according to this embodiment. The photosensitive element according to this embodiment may include a protective layer disposed on the photosensitive layer. FIG. 1 is a schematic cross-sectional view showing an example of a photosensitive element. The photosensitive element 10 in FIG. 1 includes a support 12, a photosensitive layer 14 disposed on the support 12, and a protective layer 16 disposed on the photosensitive layer 14. The protective layer 16 is disposed on the opposite side of the photosensitive layer 14 from the support 12.

[0093] The support may be a polymer film having heat resistance and solvent resistance, such as polyester films such as polyethylene terephthalate (PET), polybutylene terephthalate (PBT), and polyethylene-2,6-naphthalate (PEN); or polyolefin films such as polyethylene and polypropylene.

[0094] The thickness of the support may be 1 μm or more, 5 μm or more, 10 μm or more, or 15 μm or more, from the viewpoint of easily preventing damage to the support when peeling the support from the photosensitive layer. The thickness of the support may be 100 μm or less, 50 μm or less, 30 μm or less, or 20 μm or less, from the viewpoint of easily and suitably exposing when exposing through the support. From these viewpoints, the thickness of the support may be 1 to 100 μm.

[0095] The photosensitive layer may contain the photosensitive resin composition according to the present embodiment, and may be made of the photosensitive resin composition according to the present embodiment. The thickness of the photosensitive layer (the thickness after volatilizing the organic solvent in the case where the photosensitive resin composition contains an organic solvent) may be within the ranges described above for the thickness of the film-like photosensitive resin composition.

[0096] The protective layer can be a polymer film having heat resistance and solvent resistance, such as polyester films such as polyethylene terephthalate (PET), polybutylene terephthalate (PBT), and polyethylene-2,6-naphthalate (PEN); or polyolefin films such as polyethylene and polypropylene.

[0097] The thickness of the protective layer may be 1 μm or more, 5 μm or more, 10 μm or more, 15 μm or more, 20 μm or more, or 25 μm or more, from the viewpoint of easily preventing damage to the protective layer when the photosensitive layer and the support are laminated onto the substrate while peeling off the protective layer. The thickness of the protective layer may be 100 μm or less, 50 μm or less, 40 μm or less, or 30 μm or less, from the viewpoint of easily improving productivity. From these viewpoints, the thickness of the protective layer may be 1 to 100 μm.

[0098] The photosensitive element according to this embodiment may include a cushion layer, an adhesive layer, a light absorbing layer, a gas barrier layer, and the like.

[0099] The method for producing a cured product pattern according to this embodiment (e.g., a method for producing a resist pattern) includes the steps of forming a photosensitive layer on a substrate using the photosensitive resin composition according to this embodiment (photosensitive layer formation step), an exposure step of photocuring a portion of the photosensitive layer, and a development step of removing at least a portion (partial or all) of the uncured portion of the photosensitive layer to form a cured product pattern (e.g., a resist pattern). The resist pattern may also be referred to as a photocured product pattern, a relief pattern, or the like of the photosensitive resin composition. The photosensitive resin composition according to this embodiment may be the photosensitive resin composition used in the method for producing a cured product pattern according to this embodiment. The photosensitive resin composition according to this embodiment may have the properties to enhance the effect of improving the adhesion of the cured product pattern as described above, and may be used in an embodiment in which a heating step is not performed in the method for producing a cured product pattern described above.

[0100] The substrate may include a conductor layer, or may include an insulating layer and a conductor layer disposed on the insulating layer. Examples of the substrate include, but are not limited to, a circuit-forming substrate including an insulating layer and a conductor layer disposed on the insulating layer; a die pad (substrate for lead frame) such as an alloy substrate; and the like.

[0101] In the photosensitive layer forming step, a photosensitive layer is formed on a substrate using the photosensitive resin composition according to this embodiment. In the photosensitive layer forming step, a photosensitive layer (film-like photosensitive resin composition) may be formed on a substrate by laminating a film-like photosensitive resin composition on a substrate, or a photosensitive layer may be formed on a substrate by laminating a photosensitive layer in a photosensitive element according to this embodiment on a substrate. In the photosensitive layer forming step, the photosensitive layer and the support may be formed on the substrate by laminating the photosensitive layer of the photosensitive element according to this embodiment and the support on the substrate in a state where the photosensitive layer is located closer to the substrate than the support. When the photosensitive element according to this embodiment has a protective layer, the protective layer may be removed from the photosensitive element before laminating the photosensitive layer on the substrate. When the photosensitive layer of the photosensitive element according to this embodiment is laminated on a substrate, the photosensitive layer may be pressed onto the substrate while being heated. The heating temperature during pressing may be 70 to 130°C, and the pressure during pressing may be 0.1 to 1.0 MPa (1 to 10 kgf / cm). 2 These conditions can be appropriately selected as necessary. The photosensitive layer forming step may be carried out under reduced pressure.

[0102] In the exposure step, a portion of the photosensitive layer is photocured. In the exposure step, the photosensitive layer may be exposed to actinic rays to photocure a portion of the photosensitive layer, or the photosensitive layer may be exposed to actinic rays through a support. In the exposure step, the exposed portion irradiated with actinic rays may be photocured to form a photocured portion (latent image).

[0103] As the exposure method, known exposure methods can be applied, including a method of irradiating actinic rays in an imagewise manner through a negative or positive mask pattern called artwork (mask exposure method), an LDI (Laser Direct Imaging) exposure method, and a method of irradiating actinic rays projected from a photomask image through a lens in an imagewise manner (projection exposure method). Among these, the LDI exposure method or the projection exposure method can be used from the viewpoint of easily obtaining excellent resolution. The projection exposure method can also be said to be an exposure method using actinic rays with attenuated energy.

[0104] The light source for actinic rays is not particularly limited as long as it is a commonly used, well-known light source, and any light source that effectively emits ultraviolet light can be used. Examples of light sources that effectively emit ultraviolet light include carbon arc lamps, mercury vapor arc lamps, ultra-high pressure mercury lamps, high-pressure mercury lamps, xenon lamps, gas lasers (argon lasers, etc.), solid-state lasers (YAG lasers, etc.), and semiconductor lasers (gallium nitride blue-violet lasers, etc.). Among these, from the viewpoint of easily improving resolution and alignment in a well-balanced manner, a light source capable of emitting monochromatic i-line light with an exposure wavelength of 365 nm, a light source capable of emitting monochromatic h-line light with an exposure wavelength of 405 nm, or a light source capable of emitting actinic rays with exposure wavelengths of mixed I, H, and G may be used. A light source capable of emitting monochromatic i-line light with an exposure wavelength of 365 nm or monochromatic h-line light with an exposure wavelength of 405 nm may be used. An example of a light source capable of emitting monochromatic i-line light with an exposure wavelength of 365 nm is an ultra-high pressure mercury lamp. A light source capable of emitting monochromatic h-line light with an exposure wavelength of 405 nm includes a blue-violet laser diode with an exposure wavelength of 405 nm.

[0105] In the development step, at least a portion of the uncured portion of the photosensitive layer is removed to form a cured product pattern (photocured portion of the photosensitive layer). If a support is placed on the photosensitive layer in the exposure step or heating step, the support may be peeled off before the development step. The development method may be wet development or dry development.

[0106] In the case of wet development, development can be performed by a known wet development method using a developer suitable for the photosensitive resin composition. Examples of wet development methods include a dipping method, a puddle method, a high-pressure spray method, brushing, scrubbing, and a rocking immersion method. One type of wet development method may be used alone, or two or more types may be used in combination.

[0107] The developer can be appropriately selected depending on the composition of the photosensitive resin composition, and examples of the developer include an alkaline aqueous solution and an organic solvent developer.

[0108] From the viewpoints of safety, stability, and ease of use, an alkaline aqueous solution may be used as the developer. Examples of the base of the alkaline aqueous solution include alkali hydroxides such as lithium, sodium, or potassium hydroxide; alkali carbonates such as carbonates or bicarbonates of lithium, sodium, potassium, or ammonium; alkali metal phosphates such as potassium phosphate and sodium phosphate; alkali metal pyrophosphates such as sodium pyrophosphate and potassium pyrophosphate; sodium borate; sodium metasilicate; tetramethylammonium hydroxide; ethanolamine; ethylenediamine; diethylenetriamine; 2-amino-2-hydroxymethyl-1,3-propanediol; 1,3-diamino-2-propanol; and morpholine.

[0109] Examples of alkaline aqueous solutions include a dilute solution of 0.1 to 5% by mass sodium carbonate, a dilute solution of 0.1 to 5% by mass potassium carbonate, a dilute solution of 0.1 to 5% by mass sodium hydroxide, and a dilute solution of 0.1 to 5% by mass sodium tetraborate. The pH of the alkaline aqueous solution used for development may be in the range of 9 to 11. The temperature of the alkaline aqueous solution can be adjusted according to the developability of the photosensitive layer. The alkaline aqueous solution may contain a surfactant, an antifoaming agent, a small amount of an organic solvent to promote development, and the like.

[0110] Examples of organic solvents used in alkaline aqueous solutions include 3-acetone alcohol, acetone, ethyl acetate, alkoxyethanol having an alkoxy group having 1 to 4 carbon atoms, ethyl alcohol, isopropyl alcohol, butyl alcohol, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, and diethylene glycol monobutyl ether.

[0111] Examples of organic solvents used in the organic solvent developer include 1,1,1-trichloroethane, N-methyl-2-pyrrolidone, N,N-dimethylformamide, cyclohexanone, methyl isobutyl ketone, γ-butyrolactone, etc. From the viewpoint of preventing ignition, the content of the organic solvent may be adjusted to the range of 1 to 20 mass % by adding water to the organic solvent developer.

[0112] The method for producing a cured product pattern according to this embodiment may include a heating step of heating the photosensitive layer (post-exposure bake (PEB)) after the exposure step and before the development step. Examples of the heating device that may be used include a hot plate, a box-type dryer, a heating roll, and a conveyor-type heating furnace. The heating temperature in the heating step (for example, the heating temperature when a box-type dryer is used) may be within the following ranges. The heating temperature may be 50°C or higher, 60°C or higher, 70°C or higher, or 80°C or higher. The heating temperature may be 100°C or lower, 90°C or lower, or 80°C or lower. From these viewpoints, the heating temperature may be 50 to 100°C, 60 to 90°C, or 70 to 90°C. The heating time may be 10 seconds or longer, 20 seconds or longer, or 30 seconds or longer. The heating time may be 60 seconds or shorter, 50 seconds or shorter, 40 seconds or shorter, or 30 seconds or shorter. From these viewpoints, the heating time may be 10 to 60 seconds, 20 to 50 seconds, or 30 to 40 seconds. The temperature of the photosensitive layer immediately after the heating step may be 30°C or higher, 40°C or higher, 50°C or higher, 60°C or higher, or 70°C or higher. The temperature of the photosensitive layer immediately after the heating step may be 100°C or lower, 90°C or lower, 80°C or lower, or 70°C or lower. From these viewpoints, the temperature of the photosensitive layer immediately after the heating step may be 30 to 100°C, 40 to 90°C, 50 to 80°C, or 50 to 70°C.

[0113] In the method for producing a cured product pattern according to this embodiment, after removing at least a portion of the uncured portion in the development step, heating at 60 to 250°C or at 0.2 to 10 J / cm 2 The cured product pattern may be further cured by performing exposure in an amount of 1000 ppm or more.

[0114] The method for producing a conductor pattern according to this embodiment includes a step of forming a conductor pattern using, as a mask, a cured product pattern (resist pattern) obtained by the method for producing a cured product pattern according to this embodiment. In the method for producing a conductor pattern according to this embodiment, the conductor pattern may be formed by plating or etching using, as a mask, the cured product pattern (resist pattern) obtained by the method for producing a cured product pattern according to this embodiment. Alternatively, the conductor pattern may be formed by plating or etching a substrate on which a cured product pattern obtained by the method for producing a cured product pattern according to this embodiment has been formed. Examples of materials constituting the conductor pattern include copper, solder, nickel, and gold.

[0115] In the method for producing a conductive pattern according to the first embodiment, a conductive pattern is formed by plating at least a portion (partial or all) of a portion of a substrate where a cured product pattern is not formed, using the cured product pattern obtained by the method for producing a cured product pattern according to the present embodiment as a mask. In the method for producing a conductive pattern according to the first embodiment, the substrate may have a conductive layer, and with the cured product pattern obtained by the method for producing a cured product pattern according to the present embodiment formed on the conductive layer, the cured product pattern may be used as a mask to plate at least a portion (partial or all) of a portion of the conductive layer of the substrate where a cured product pattern is not formed, thereby forming a conductive pattern. The materials of the conductive layer of the substrate and the plated layer (conductor layer) formed by the plating process may be the same or different. When the materials of the conductive layer of the substrate and the plated layer (conductor layer) formed by the plating process are the same, the conductive layer and the plated layer may be integrated. The plating process may be electrolytic plating or electroless plating. Examples of plating processes include copper plating, solder plating, nickel plating, and gold plating.

[0116] In the method for producing a conductor pattern according to the second embodiment, a substrate is provided with a conductor layer, and in a state in which a cured product pattern obtained by the method for producing a cured product pattern according to this embodiment is formed on the conductor layer, the cured product pattern (resist pattern) is used as a mask to etch away at least a portion (partial or all) of the conductor layer that is not covered by the cured product pattern, thereby forming a conductor pattern covered by the cured product pattern. The etching method is appropriately selected depending on the conductor layer to be removed.

[0117] The method for producing a conductive pattern according to this embodiment may include a step of removing the cured pattern from the substrate after the plating or etching process described above. The cured pattern can be removed, for example, with an aqueous solution that is more alkaline than the aqueous solution used in the developing process.

[0118] In the method for producing a conductive pattern according to the first embodiment, when the substrate has a conductive layer, after removing the cured product pattern, the portion of the conductive layer of the substrate that was covered with the cured product pattern may be removed by etching (e.g., flash etching). The etching method is appropriately selected depending on the conductive layer to be removed.

[0119] One aspect of the method for producing a conductor pattern according to this embodiment is a method for producing a wiring board (e.g., a method for producing a printed wiring board), which includes a step of forming a wiring pattern (e.g., a circuit) as a conductor pattern using, as a mask, a cured product pattern obtained by the method for producing a cured product pattern according to this embodiment. The wiring board according to this embodiment can be obtained by the method for producing a wiring board according to this embodiment. The wiring board according to this embodiment may be a single-layer printed wiring board, a multilayer printed wiring board, or a printed wiring board having small-diameter through holes.

[0120] FIG. 2 is a schematic cross-sectional view showing an example of a method for producing a conductor pattern (semi-additive process). In FIG. 2(a), a substrate 20 is prepared. The substrate 20 includes an insulating layer 22 and a conductor layer 24 disposed on the insulating layer 22. The conductor layer 24 is, for example, a copper layer. In FIG. 2(b), the protective layer 16 of the photosensitive element 10 in FIG. 1 is peeled off, and then the photosensitive layer 14 of the photosensitive element 10 and the support 12 are laminated on the substrate 20 (photosensitive layer formation step). In FIG. 2(c), the photosensitive layer 14 is irradiated through the support 12 with actinic light L projected from a photomask image (exposure step using a projection exposure method), and then the photosensitive layer 14 is heated. In FIG. 2(d), portions of the photosensitive layer 14 other than the photocured portion are removed from the substrate 20, thereby forming a cured product pattern 14a (the photocured portion of the photosensitive layer 14) on the substrate 20 (development step). 2(e), a plating process is performed using the cured product pattern 14a as a mask to form a plating layer 30 on the conductor layer 24 that is not covered by the cured product pattern 14a in the substrate 20. In FIG. 2(f), the cured product pattern 14a is removed, and then the portion of the conductor layer 24 that was covered by the cured product pattern 14a is removed to form a conductor layer 24a. This forms a conductor pattern 40 composed of the conductor layer 24a and the plating layer 30. [Example]

[0121] The present disclosure will be explained in more detail below using examples, but the present disclosure is not limited to these examples.

[0122] <Preparation of binder polymer> (Binder Polymer A1) Solution (a) was prepared by mixing 27 parts by mass of methacrylic acid, 50 parts by mass of styrene, 20 parts by mass of benzyl methacrylate, 3 parts by mass of 2-hydroxyethyl methacrylate, and 0.9 parts by mass of azobisisobutyronitrile. Solution (b) was prepared by dissolving 0.5 parts by mass of azobisisobutyronitrile in 50 parts by mass of a mixture (x) of 30 parts by mass of 1-methoxy-2-propanol and 20 parts by mass of toluene.

[0123] A flask equipped with a stirrer, reflux condenser, thermometer, dropping funnel, and nitrogen gas inlet tube was charged with 500 parts by mass of a mixed solution (x1) containing 300 parts by mass of 1-methoxy-2-propanol and 200 parts by mass of toluene. Nitrogen gas was then blown into the flask, and the mixed solution (x1) was stirred while being heated to 80°C. Next, the above-described solution (a) was added dropwise to the mixed solution (x1) at a constant rate over 4 hours to obtain mixed solution (x2), which was then stirred at 80°C for 2 hours. Next, the above-described solution (b) was added dropwise to the mixed solution (x2) at a constant rate over 10 minutes to obtain mixed solution (x3), which was then stirred at 80°C for 3 hours. Next, while stirring, the mixed solution (x3) was heated to 95°C over 30 minutes, and then kept at 95°C for 2 hours. After stopping the stirring, the mixed solution (x3) was cooled to room temperature (25°C) to obtain a solution of binder polymer A1. The non-volatile content (solid content) of the binder polymer A1 solution was 49% by mass. The binder polymer A1 had a weight average molecular weight (Mw) of 35,000, a number average molecular weight (Mn) of 16,000, and an acid value of 176 mgKOH / g.

[0124] The weight average molecular weight and number average molecular weight were determined by measuring by gel permeation chromatography (GPC) under the following conditions and converting the results using a calibration curve of standard polystyrene. [GPC conditions] Pump: Hitachi L-6000 type (manufactured by Hitachi, Ltd., product name) Columns: Gelpack GL-R420, Gelpack GL-R430, Gelpack GL-R440 (all manufactured by Resonac Co., Ltd., product names) Eluent: tetrahydrofuran Measurement temperature: 40℃ Flow rate: 2.05mL / min Detector: Hitachi L-3300 RI (Hitachi, Ltd., product name)

[0125] The acid value was measured using the following procedure. First, 1 g of the binder polymer to be measured for acid value was precisely weighed. Next, 30 g of acetone was added to this binder polymer to uniformly dissolve the binder polymer, yielding a solution. Next, an appropriate amount of phenolphthalein, an indicator, was added to this solution, and titration was then performed using a 0.1 N aqueous potassium hydroxide (KOH) solution. The acid value was determined by calculating the mass (unit: mg) of potassium hydroxide required to neutralize the acetone solution of the binder polymer.

[0126] (Binder polymer A2) A solution of binder polymer A2 was obtained in the same manner as binder polymer A1, except that solution (a) was prepared by mixing 27 parts by weight of methacrylic acid, 45 parts by weight of styrene, 23 parts by weight of benzyl methacrylate, 5 parts by weight of methyl methacrylate, and 0.9 parts by weight of azobisisobutyronitrile. The non-volatile content (solid content) of the binder polymer A2 solution was 49% by weight. The weight average molecular weight (Mw) of binder polymer A2 was 50,000, the number average molecular weight (Mn) was 21,000, and the acid value was 176 mg KOH / g.

[0127] <Preparation of Photosensitive Resin Composition> The binder polymer (A) and the photopolymerizable compound (B) in Table 1 were mixed together with 6.5 parts by mass of a photopolymerization initiator (BCIM: 2,2'-bis(o-chlorophenyl)-4,4',5,5'-tetraphenyl-1,2'-biimidazole, manufactured by Hampford Chemicals), 0.65 parts by mass of a sensitizer (9,10-dibutoxyanthracene, manufactured by Air Water Performance Chemicals Inc., trade name "UVS-1331"), 0.02 parts by mass of 4-tert-butylcatechol (polymerization inhibitor, manufactured by DIC Corporation, trade name "DIC-TBC"), and 4-hydroxybenzophenone. A photosensitive resin composition was prepared by mixing 0.03 parts by weight of 2,2,6,6-tetramethylpiperidine-N-oxyl (polymerization inhibitor, manufactured by Adeka Corporation, product name "LA-7RD"), 0.4 parts by weight of leuco crystal violet (manufactured by Yamada Chemical Industry Co., Ltd.), 0.02 parts by weight of malachite green (manufactured by Osaka Organic Chemical Industry Co., Ltd.), and 0.5 parts by weight of an additive (a mixture of carboxybenzotriazole, 5-amino-1H-tetrazole, and methoxypropanol, manufactured by Sanwa Chemical Industry Co., Ltd., product name "SF-808H"). The binder polymer was supplied using the binder polymer solution described above. Table 1 shows the blending amounts of the binder polymer and photopolymerizable compound (mass of nonvolatile matter (solid content), unit: parts by weight).

[0128] As the photopolymerizable compounds in Table 1, the following components were used. B11: A compound represented by the above general formula (3a) (in the general formula (3a), the sum of m1 and m2 is about 6, and R 31a and R 32a is a methyl group, and R 33a and R 34a a compound in which at least one of the above has a structure represented by the above formula (1b) (n=2), manufactured by Shin-Nakamura Chemical Co., Ltd., acid value: 31.0 mg KOH / g) B12: A compound represented by the above general formula (3b) (in general formula (3b), R 31b and R 32b is a methyl group, and R 33b and R 34ba compound in which at least one of the above has a structure represented by the above formula (1b) (n=2), manufactured by Shin-Nakamura Chemical Co., Ltd., acid value: 15.6 mg KOH / g) B13: A compound represented by the above general formula (3b) (in general formula (3b), R 31b and R 32b is a methyl group, and R 33b and R 34b a compound in which at least one of the above has a structure represented by the above formula (1b) (n=2), manufactured by Shin-Nakamura Chemical Co., Ltd., acid value: 31.7 mg KOH / g) B2: EO-modified bisphenol A dimethacrylate (a compound not corresponding to component (b1), EO groups: 10 (total value), molecular weight: 804, manufactured by Resonac Inc., product name "FA-321M") B3: A compound represented by the following formula (X) (a compound not corresponding to component (b1), manufactured by Shin-Nakamura Chemical Co., Ltd.)

[0129] [ka]

[0130] <Preparation of Photosensitive Element> A polyethylene terephthalate film (manufactured by Toray Industries, Inc., trade name "FS-31," thickness: 16 μm) was prepared as a support. The above-mentioned photosensitive resin composition was applied to the support so as to have a uniform thickness, and then dried sequentially in a hot air convection dryer at 80°C and 120°C to form a photosensitive layer (film-like photosensitive resin composition, thickness after drying: 15 μm). A polyethylene film (manufactured by Tamapoly Corporation, trade name "NF-15A," thickness: 28 μm) was laminated to this photosensitive layer as a protective layer, thereby obtaining a photosensitive element having a support, photosensitive layer, and protective layer in that order.

[0131] <Preparation of laminate> A copper-clad laminate (manufactured by Resonac Corporation, product name "MCL-E67") with copper foil (thickness: 35 μm) arranged on both sides of a glass epoxy material was pickled, rinsed with water, and then dried with an air flow. The copper-clad laminate was then heated to 80°C, and the protective layer was peeled off. The photosensitive element described above was then laminated onto the copper-clad laminate so that the photosensitive layer was in contact with the copper foil, resulting in a laminate comprising, in order, the copper-clad laminate, the photosensitive layer, and the support. Lamination was performed using a 110°C heat roll at a pressure of 0.4 MPa and a roll speed of 1.0 m / min.

[0132] <Evaluation> (minimum development time) The laminate was cut into a square (5 cm x 5 cm) and the support was peeled off to obtain a test piece. Next, the unexposed photosensitive resin layer of the test piece was spray-developed at a pressure of 0.18 MPa using a 1% by mass aqueous sodium carbonate solution at 30°C. The minimum development time was determined as the shortest time required for visual confirmation of the removal of the unexposed photosensitive resin layer. A full-cone type nozzle was used. The distance between the test piece and the tip of the nozzle was 12 cm, and the test piece was positioned so that the center of the nozzle coincided with the center of the test piece.

[0133] (adhesion) A 41-step tablet (manufactured by Resonac Inc.) was placed on the support of the laminate, and then a direct imaging exposure machine (manufactured by Via Mechanics Co., Ltd., product name: DE-1UH) using a 405 nm blue-violet laser diode as a light source was used to expose (draw) the photosensitive layer through the support using a drawing pattern with a line width (L) / space width (S) (hereinafter referred to as "L / S") of x / 3x (x = 3-20, unit: μm, 1 μm intervals) at an exposure dose (irradiation energy amount) such that 15 steps remained after development of the 41-step tablet. After 2 minutes of exposure, the laminate was placed in a box dryer (manufactured by Etac Engineering Co., Ltd., product name "HT220S") at 80°C and heated for 30 seconds.

[0134] After heating, the support was peeled off from the laminate to expose the photosensitive layer, and the unexposed areas were removed by spraying a 1.0% by mass aqueous solution of sodium carbonate at 30°C for twice the minimum development time mentioned above. After development, the space areas (unexposed areas) were removed without residue, and the line areas (exposed areas) were formed without meandering or chipping. Adhesion was evaluated based on the minimum line width (x) (unit: μm) in the resist pattern. The results are shown in Table 1. The smaller this value, the better the adhesion.

[0135] (resolution) A 41-step tablet (manufactured by Resonac Co., Ltd.) was placed on the support of each of the above laminates (excluding the laminates of the comparative examples). Using a direct imaging exposure machine (manufactured by Via Mechanics Co., Ltd., product name: DE-1UH) with a 405 nm wavelength blue-violet laser diode as a light source, the photosensitive layer was exposed (drawn) through the support using a drawing pattern with an L / S of 3x / x (x = 3-20, unit: μm, 1 μm intervals) at an exposure dose (irradiation energy amount) such that the number of remaining steps after development of the 41-step tablet was 15. After 2 minutes of exposure, the laminate was placed in an 80°C box dryer (manufactured by Etac Engineering Co., Ltd., product name "HT220S") and heated for 30 seconds.

[0136] After heating, the support was peeled off from the laminate to expose the photosensitive layer, and the unexposed areas were removed by spraying a 1.0% by mass aqueous solution of sodium carbonate at 30°C for twice the minimum development time mentioned above. After development, the resolution was evaluated based on the minimum value (unit: μm) of the space width (x) in the resist pattern in which the space areas (unexposed areas) were removed without residue and the line areas (exposed areas) were formed without meandering or chipping. The results are shown in Table 1. The smaller this value, the better the resolution.

[0137] (bleed-out properties) The above-mentioned photosensitive element was cut into a rectangular test piece (7 cm x 5 cm), and then a parallel exposure machine (manufactured by Oak Manufacturing Co., Ltd., product name: EXM-1201) was used to expose the outer periphery of the test piece to 100 mJ / cm2 The specimens were exposed to light at 1000 K (exposure to prevent diffusion of the ingredients due to pressure). Five specimens and six oil blotting films were alternately laminated so that each exposed specimen was sandwiched between oil blotting films (manufactured by Kanebo Inc., product name "Beauty Works Oil Blotting Film") to obtain laminate A. Laminate B was obtained by sandwiching laminate A between two PET films to prevent excessive oozing, and then laminate B was sandwiched between two quartz glass plates (glass slides) to obtain laminate C. Laminate C was sandwiched between the pressure section of a small press, pressurized to 0.5 MPa using a hydraulic jack, and allowed to stand at a temperature of 23°C and a humidity of 50% RH. After 24 hours from the start of pressurization, the pressure was temporarily released, and the top specimen and the oil blotting film in contact with the protective layer of the top specimen were removed, and the color of the oil blotting film was confirmed. One test piece and one oil-blotting film were removed, and the remaining laminate was again pressed as described above and allowed to stand. The same procedure was then repeated, and 48, 72, 144, and 168 hours after the start of pressure application, the top test piece and one oil-blotting film in contact with the protective layer of the top test piece were removed and the color of the oil-blotting film was checked. If the surface of the oil-blotting film discolored, it was determined that bleed-out had occurred. If the time until discoloration exceeded 168 hours, it was rated "A," and if the time until discoloration was less than 168 hours, it was rated "B." The results are shown in Table 1.

[0138] [Table 1] [Explanation of symbols]

[0139] 10...photosensitive element, 12...support, 14...photosensitive layer, 14a...cured product pattern, 16...protective layer, 20...base material, 22...insulating layer, 24, 24a...conductor layer, 30...plating layer, 40...conductor pattern, L...actinic light.

Claims

1. Contains a binder polymer, a photopolymerizable compound, and a photopolymerization initiator, The photosensitive resin composition, wherein the photopolymerizable compound contains a polyfunctional monomer having two or more radical reactive groups and at least one selected from the group consisting of a carboxy group and a carboxylate salt group.

2. The photosensitive resin composition according to claim 1 , wherein the polyfunctional monomer has an acid value of 60 mg KOH / g or less.

3. The photosensitive resin composition according to claim 1 , wherein the polyfunctional monomer further has a bisphenol A skeleton.

4. The photosensitive resin composition according to claim 1 , wherein the polyfunctional monomer further has a tricyclodecane dimethanol skeleton.

5. The photosensitive resin composition according to claim 1 , wherein the binder polymer has a styrene compound as a monomer unit.

6. The photosensitive resin composition according to claim 1 , wherein the binder polymer has an aryl (meth)acrylate as a monomer unit.

7. 2. The photosensitive resin composition according to claim 1, wherein the binder polymer has a hydroxyalkyl (meth)acrylate as a monomer unit.

8. The photosensitive resin composition according to claim 1 , further comprising a sensitizer.

9. The photosensitive resin composition according to claim 8 , wherein the sensitizer comprises an anthracene compound.

10. A support and a photosensitive layer disposed on the support, A photosensitive element, wherein the photosensitive layer comprises the photosensitive resin composition according to any one of claims 1 to 9.

11. A cured product of the photosensitive resin composition according to any one of claims 1 to 9.

12. A step of forming a photosensitive layer on a substrate using the photosensitive resin composition according to any one of claims 1 to 9; photocuring a portion of the photosensitive layer; and removing at least a portion of the uncured portion of the photosensitive layer to form a cured product pattern.

13. A method for producing a conductor pattern, comprising the step of forming a conductor pattern using, as a mask, the cured product pattern obtained by the method for producing a cured product pattern according to claim 12.

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